WO2019176612A1 - Composition d'absorbeur électromagnétique, article moulé en trois dimensions formé à partir d'un absorbeur électromagnétique, composant électronique et dispositif électronique l'utilisant, et procédés de production de composant électronique et de dispositif électronique - Google Patents

Composition d'absorbeur électromagnétique, article moulé en trois dimensions formé à partir d'un absorbeur électromagnétique, composant électronique et dispositif électronique l'utilisant, et procédés de production de composant électronique et de dispositif électronique Download PDF

Info

Publication number
WO2019176612A1
WO2019176612A1 PCT/JP2019/008327 JP2019008327W WO2019176612A1 WO 2019176612 A1 WO2019176612 A1 WO 2019176612A1 JP 2019008327 W JP2019008327 W JP 2019008327W WO 2019176612 A1 WO2019176612 A1 WO 2019176612A1
Authority
WO
WIPO (PCT)
Prior art keywords
electromagnetic wave
wave absorber
dimensional structure
electronic component
composition
Prior art date
Application number
PCT/JP2019/008327
Other languages
English (en)
Japanese (ja)
Inventor
山田幸憲
廣井俊雄
藤田真男
Original Assignee
マクセルホールディングス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by マクセルホールディングス株式会社 filed Critical マクセルホールディングス株式会社
Priority to JP2020506409A priority Critical patent/JP7141444B2/ja
Publication of WO2019176612A1 publication Critical patent/WO2019176612A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G49/00—Compounds of iron
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
    • H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
    • H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
    • H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
    • H01F1/34—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites
    • H01F1/36—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles
    • H01F1/37—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials non-metallic substances, e.g. ferrites in the form of particles in a bonding agent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to an electromagnetic wave absorber that absorbs millimeter wave electromagnetic waves, and more particularly, an electromagnetic wave absorber composition, an electromagnetic wave absorber three-dimensional structure, an electronic component and an electronic device using the same, and the electronic component And an electronic device manufacturing method.
  • Non-Patent Document 1 In order to suppress high-frequency noise, an electromagnetic wave absorbing sheet that uses magnetic loss of a magnetic material that has been conventionally used is less effective, and a resonant electromagnetic wave absorbing sheet that uses a conductive material is required (Patent Document 1).
  • Patent Document 1 direct contact of a conductive material with a conductive circuit element or transmission path is not suitable because it causes a short circuit.
  • the conductive layer of the resonance type electromagnetic wave absorbing sheet is prevented from directly touching the circuit element or the transmission path by the adhesive to be applied to the circuit element or the transmission path, the sheet is cut and punched to a desired size. When used, the conductive layer is exposed on the cut surface, and there is a risk of short-circuiting the circuit by contacting this portion. Furthermore, the danger of a short circuit due to the loss of the conductive material cannot be eliminated.
  • the iron oxide magnetic material is a non-conductive material, and there is no danger of a short circuit.
  • epsilon-type iron oxide has an electromagnetic wave absorption ability in the millimeter wave band, and the absorption frequency can be controlled by the substitution element and the substitution amount (Patent Documents 2 and 3).
  • hexagonal ferrite also has an electromagnetic wave absorption ability in the millimeter wave band (Patent Document 4).
  • JP 2007-81119 A Patent No. 4881613
  • JP 2008-60484 A Patent No. 4787978
  • the shape of the electromagnetic wave absorber sheet is usually a circuit. Since the shape is difficult to follow the surface shape of the element or the transmission path, the sheet may be peeled off. Moreover, since the size of a circuit element or a transmission line is small, handling of an electromagnetic wave absorber sheet may be difficult. Furthermore, depending on the material and roughness of the surface of the circuit element, the adhesive may not stick, or the adhesive may come into contact with the circuit element or the transmission path.
  • the noise suppression effect correlates with the amount of electromagnetic wave absorbing material present in the traveling direction of the electromagnetic wave that becomes noise, and the greater the amount of electromagnetic wave absorbing material, the higher the noise suppressing effect. Therefore, the noise suppression effect is reduced by the thickness of the electromagnetic wave absorber and the uneven distribution of the electromagnetic wave absorbing material, and noise may leak.
  • the present invention solves the above-mentioned conventional problems, and can absorb an electromagnetic wave absorber securely to a noise source or to a circuit element or a transmission path to prevent the influence of noise without leaking the electromagnetic wave.
  • a three-dimensional modeled body is provided.
  • the electromagnetic wave absorber composition of the present invention is an electromagnetic wave absorber composition used for forming an electromagnetic wave absorber three-dimensional structure having an electromagnetic wave transmission attenuation amount of 10 dB or more in a millimeter wave band or higher frequency band. And an electromagnetic wave absorbing material and a binder resin, wherein the electromagnetic wave absorbing material is an iron oxide that magnetically resonates in a frequency band equal to or higher than a millimeter wave band, and the thickness of the electromagnetic wave absorber three-dimensional structure is d
  • V (%) a relational expression of d ⁇ V 1/3 > 0.4 is established.
  • the electromagnetic wave absorber three-dimensional structure of the present invention is an electromagnetic wave absorber three-dimensional structure formed using the electromagnetic wave absorber composition of the present invention, wherein the electromagnetic wave absorber three-dimensional structure is It is shaped into a thin-walled structure that can cover an electronic member, the thickness of the electromagnetic wave absorber three-dimensional structure is d (mm), and the volume content of the electromagnetic wave absorbing material contained in the electromagnetic wave absorber three-dimensional structure is Assuming V (%), a relational expression of d ⁇ V 1/3 > 0.4 is established, and the electromagnetic wave transmission attenuation in a frequency band equal to or higher than the millimeter wave band is 10 dB or higher.
  • the electronic component of the present invention includes an electronic member coated with the electromagnetic wave absorber three-dimensional structure of the present invention.
  • the electronic device of the present invention includes the electronic component of the present invention.
  • the method for producing an electronic component of the present invention includes a step of preparing the electromagnetic wave absorber composition of the present invention, a step of forming an electromagnetic wave absorber three-dimensional structure using the electromagnetic wave absorber composition, A step of bonding the electromagnetic wave absorber three-dimensional structure to an electronic member and covering it.
  • the electronic device manufacturing method of the present invention includes a step of incorporating the electronic component manufactured by the electronic component manufacturing method of the present invention into the electronic device.
  • an electromagnetic wave absorber three-dimensional structure having a thin structure is formed, and the thickness of the electromagnetic wave absorber three-dimensional structure,
  • an electromagnetic wave absorber that does not cause a short circuit and that does not leak noise can be provided.
  • FIG. 1 is a schematic cross-sectional view showing an example of a three-dimensional structure of an electromagnetic wave absorber according to the present embodiment.
  • FIG. 2 is a schematic cross-sectional view illustrating another example of the electromagnetic wave absorber three-dimensional structure according to the present embodiment.
  • FIG. 3 is a schematic cross-sectional view showing an example of a part of the electronic component of the present embodiment.
  • FIG. 4 is a schematic cross-sectional view showing another example of a part of the electronic component of the present embodiment.
  • FIG. 5 is a graph showing the electromagnetic wave transmission attenuation amount at a frequency of 76 GHz of the electromagnetic wave absorbers of Examples and Comparative Examples.
  • FIG. 6 is a diagram showing an electromagnetic wave absorption spectrum of the electromagnetic wave absorbers of Example 1 and Comparative Example 3.
  • the composition for an electromagnetic wave absorber disclosed in the present application is a composition for an electromagnetic wave absorber used for forming an electromagnetic wave absorber three-dimensional structure having an electromagnetic wave transmission attenuation amount of 10 dB or more in a frequency band of a millimeter wave band or higher.
  • V (%) a relational expression of d ⁇ V 1/3 > 0.4 is established.
  • an electromagnetic wave absorber three-dimensional structure having a thin-walled structure is formed, and the thickness of the electromagnetic wave absorber three-dimensional structure and the above-mentioned electromagnetic wave absorber three-dimensional structure
  • an electromagnetic wave absorber that does not cause a short circuit and that does not leak noise can be provided.
  • the electromagnetic wave absorbing material is preferably hexagonal ferrite containing at least one selected from the group consisting of Sr and Ba. Further, the electromagnetic wave absorbing material is hexagonal ferrite containing Sr, and it is more preferable that a part of Fe site of the hexagonal ferrite containing Sr is substituted with Al.
  • the hexagonal ferrite is a non-conductive iron oxide that magnetically resonates in a frequency band above the millimeter wave band.
  • the electromagnetic wave absorbing material is epsilon-type iron oxide, and a part of the Fe site of the epsilon-type iron oxide is preferably substituted with at least one selected from the group consisting of Al, Ga, and In. .
  • the epsilon-type iron oxide is a non-conductive iron oxide that magnetically resonates in a frequency band equal to or higher than the millimeter wave band, and a part of the Fe site is at least one selected from the group consisting of Al, Ga and In. This is because the magnetic resonance frequency responsible for electromagnetic wave absorption can be changed by substitution.
  • the binder resin preferably contains at least one selected from the group consisting of an active energy ray curable resin, a thermosetting resin, a thermoplastic resin, and a rubber-like resin. This is because by using the binder resin, an electromagnetic wave absorber three-dimensional structure having a thin-walled structure can be formed by various methods.
  • the electromagnetic wave absorber three-dimensional structure disclosed in the present application is an electromagnetic wave absorber three-dimensional structure formed using the electromagnetic wave absorber composition disclosed above, and the electromagnetic wave absorber three-dimensional structure Is formed into a thin-walled structure capable of covering an electronic member, the thickness of the electromagnetic wave absorber three-dimensional structure is d (mm), and the volume of the electromagnetic wave absorbing material contained in the electromagnetic wave absorber three-dimensional structure is included.
  • the rate is V (%)
  • a relational expression of d ⁇ V 1/3 > 0.4 is established, and the electromagnetic wave transmission attenuation amount in the frequency band of the millimeter wave band or higher is 10 dB or higher.
  • an electromagnetic wave absorber three-dimensional structure having a thin-walled structure is formed, and the thickness of the electromagnetic wave absorber three-dimensional structure and the above-mentioned electromagnetic wave absorber three-dimensional structure
  • the volume content of the electromagnetic wave absorbing material By controlling the volume content of the electromagnetic wave absorbing material to the above relationship, even when the thickness of the electromagnetic wave absorber three-dimensional structure changes during modeling, it is possible to ensure a certain level of electromagnetic wave absorption performance, noise.
  • An electromagnetic wave absorber without leakage can be provided.
  • the volume resistivity of the electromagnetic wave absorber three-dimensional structure is preferably 10 10 ⁇ cm or more. This is because the occurrence of a short circuit can be reliably prevented.
  • the electronic component disclosed in the present application is an electronic component including an electronic member covered with the electromagnetic wave absorber three-dimensional structure disclosed above.
  • EMC electromagnetic compatibility
  • the above-mentioned electronic components are resistant to the electromagnetic waves emitted from them from affecting other devices and systems, and to operate satisfactorily even when receiving electromagnetic waves from other devices and systems. Can be secured.
  • the electromagnetic wave absorber three-dimensional structure is preferably in contact with and followed the surface of the electronic member. This is because noise leakage can be prevented more reliably and the EMC (electromagnetic compatibility) of the electronic component can be further improved.
  • the electromagnetic wave absorber three-dimensional structure may have a non-contact portion with respect to the surface of the electronic member. This is because, depending on the surface shape of the electronic member, it may be difficult to form the electromagnetic wave absorber three-dimensional structure into a shape in which the electromagnetic wave absorber is brought into contact with the surface of the electronic member.
  • Examples of the electronic member include a circuit element and a transmission line.
  • the electronic device disclosed in the present application is an electronic device including the electronic component disclosed above.
  • EMC electromagtic compatibility
  • the manufacturing method of the electronic component disclosed by this application forms the electromagnetic wave absorber three-dimensional structure using the process for preparing the electromagnetic wave absorber composition disclosed above and the electromagnetic wave absorber composition.
  • the electronic device manufacturing method disclosed in the present application includes a step of incorporating the electronic component manufactured by the electronic component manufacturing method disclosed above into the electronic device.
  • EMC electromagnetic compatibility
  • the electromagnetic wave absorber composition of the present embodiment is used to form an electromagnetic wave absorber three-dimensional structure having an electromagnetic wave transmission attenuation amount of 10 dB or more in a frequency band equal to or higher than a millimeter wave band, and an electromagnetic wave absorbing material and a binder.
  • the electromagnetic wave absorbing material is an iron oxide that magnetically resonates in a frequency band equal to or higher than a millimeter wave band, and the thickness of the electromagnetic wave absorber three-dimensional structure is formed as d (mm),
  • V (%) the volume content of the electromagnetic wave absorbing material in the electromagnetic wave absorber composition
  • V (%) the relational expression d ⁇ V 1/3 > 0.4 is established.
  • the electromagnetic wave absorbing material is an iron oxide that magnetically resonates in a frequency band greater than or equal to the millimeter wave band. Specifically, the following hexagonal ferrite or the following epsilon type iron oxide can be used.
  • the volume content V (%) of the electromagnetic wave absorbing material in the composition for electromagnetic wave absorber is d ⁇ V 1/3 > when the thickness of the electromagnetic wave absorber three-dimensional structure is formed as d (mm). Adjustment is made so that a relational expression of 0.4 is established.
  • hexagonal ferrite As the hexagonal ferrite, hexagonal ferrite containing at least one selected from the group consisting of Sr and Ba can be used. Further, it is more preferable that a part of the Fe site of the hexagonal ferrite containing Sr is substituted with Al.
  • the hexagonal ferrite has a magnetoblumbite type crystal structure and is represented by a general formula: AFe 12 O 19 , and A in the general formula represents at least one selected from the group consisting of Sr and Ba.
  • the hexagonal ferrite can change the magnetic resonance frequency responsible for electromagnetic wave absorption by substituting a part of Fe site with a trivalent Al metal element.
  • Patent Document 4 Japanese Patent Laid-Open No. 2007-250823.
  • Epsilon-type iron oxide As the epsilon-type iron oxide, epsilon-type iron oxide in which a part of the Fe site is substituted with at least one selected from the group consisting of Al, Ga and In can be used.
  • the epsilon-type iron oxide has an ⁇ -phase crystal structure, is represented by a general formula: ⁇ -Fe 2 O 3 , and part of the Fe site is at least one selected from the group consisting of Al, Ga, and In.
  • the magnetic resonance frequency responsible for electromagnetic wave absorption can be changed.
  • Patent Document 2 Japanese Patent Laid-Open No. 2008-60484
  • Patent Document 3 Japanese Patent Laid-Open No. 2008-277726
  • the binder resin is used as a matrix material when the electromagnetic wave absorbing material is dispersed and fixed to form an electromagnetic wave absorber three-dimensional structure, specifically, an active energy ray curable resin, At least one selected from the group consisting of thermosetting resins, thermoplastic resins and rubber-like resins can be used.
  • active energy ray curable resin examples include urethane acrylate, acrylic resin acrylate, and epoxy acrylate.
  • the active energy ray-curable resin is used as the binder resin, an electromagnetic wave absorber three-dimensional structure can be produced by an optical modeling method using a three-dimensional printer.
  • bifunctional or higher polyfunctional ethylenically unsaturated monomers can be used, for example, linear or branched alkylene glycol di (meth) acrylate having 10 to 25 carbon atoms, alkylene glycol tri (meth).
  • Acrylate for example, tripropylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, 3-methyl- 1,5-pentanediol di (meth) acrylate, 2-n-butyl-2-ethyl-1,3-propanediol di (meth) acrylate, pentaerythritol tri (meth) acrylate, etc.], having 10 to 30 carbon atoms Alicyclic ring-containing di (meth) acrylate [for example, dimethylol tricyclodeca Di (meth) acrylate, etc.] or the like can be used. These may be used alone or in combination of two or more.
  • thermosetting resin for example, phenol resin, urea resin, melamine resin, epoxy resin, unsaturated polyester resin, alkyd resin, silicon resin, polyurethane and the like can be used.
  • thermosetting resin is used as the binder resin, an electromagnetic wave absorber three-dimensional structure can be produced by a heat compression molding method.
  • thermoplastic resin examples include polyethylene, polypropylene, polystyrene, ABS resin, methyl methacrylate resin, polyvinyl chloride, polyamide, polyethylene terephthalate, polybutylene terephthalate, and polycarbonate.
  • thermoplastic resin is used as the binder resin, an electromagnetic wave absorber three-dimensional structure can be produced by an injection molding method.
  • Rubber resin for example, urethane rubber, silicone rubber, fluorine rubber or the like which is a thermosetting elastomer can be used.
  • the rubber-like resin is used as the binder resin, an electromagnetic wave absorber three-dimensional structure can be produced by a heat compression molding method.
  • a photopolymerization initiator is added to the electromagnetic wave absorber composition.
  • the photopolymerization initiator is for initiating a polymerization reaction or crosslinking reaction of a monomer by active energy rays
  • the electromagnetic wave absorber composition contains the photopolymerization initiator, for example, a three-dimensional printer.
  • the composition for electromagnetic wave absorber released using can be cured by irradiation with active energy rays.
  • the active energy ray irradiated to the photopolymerization initiator can be appropriately selected from, for example, ultraviolet rays, near ultraviolet rays, visible rays, infrared rays, far infrared rays and the like.
  • the photopolymerization initiator is not particularly limited as long as the polymerization can be initiated with low energy, and is a benzoin compound having 14 to 18 carbon atoms [for example, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isobutyl.
  • acetophenone compounds having 8 to 18 carbon atoms [for example, acetophenone, 2,2-diethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 2-hydroxy- 2-methyl-phenylpropan-1-one, diethoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropan-1-one, etc.], carbon number 4-19 anthraquinone compounds [eg, 2-ethylanthraquinone, 2-t-butylanthraquinone, 2-chloroanthraquinone, 2-amylanthraquinone, etc.], thioxanthone compounds having 13 to 17 carbon atoms [eg, 2,4-diethylthioxanthone , 2-isopropylthioxanth
  • the amount of the photopolymerization initiator added may be 3.0 to 15 parts by mass when the total mass of the electromagnetic wave absorber composition is 100 parts by mass. When two or more kinds of the photopolymerization initiators are used in combination, the addition amount is determined as the total addition amount of each photopolymerization initiator.
  • ⁇ Surface conditioner> When the active energy ray curable resin is used as the binder resin, a surface conditioner is added to the electromagnetic wave absorber composition. Thereby, the surface tension of the said composition for electromagnetic wave absorbers can be adjusted to an appropriate range. By adjusting the surface tension of the composition for electromagnetic wave absorbers to an appropriate range, an optically shaped article with good dimensional accuracy can be obtained. In order to obtain this effect, the amount of the surface conditioner added may be 0.005 to 3.0 parts by mass when the total mass of the electromagnetic wave absorber composition is 100 parts by mass.
  • a silicone compound or the like can be used, and examples of the silicone compound include a silicone compound having a polydimethylsiloxane structure. Specific examples include polyether-modified polydimethylsiloxane, polyester-modified polydimethylsiloxane, and polyaralkyl-modified polydimethylsiloxane. More specifically, the product names include BYK-300, BYK-302, BYK-306, BYK-307, BYK-310, BYK-315, BYK-320, BYK-322, BYK-323, manufactured by BYK Chemie.
  • Granol 100, Granol 115, Gu Nord 400, Granol 410, Granol 435, Granol 440, Granol 450, B-1484, a Polyflow ATF-2, KL-600, UCR-L72, UCR-L93 or the like can be used. These may be used alone or in combination of two or more. When two or more kinds of the surface conditioners are used in combination, the addition amount is determined as the total addition amount of each surface conditioner.
  • the following filler and dispersant can be further added to the electromagnetic wave absorber composition.
  • the electromagnetic wave absorption characteristics of the electromagnetic wave absorber can be improved.
  • the filler that can be used include metal particles, metal fibers, carbon, carbon nanotubes, and carbon nanocoils whose surfaces are covered with an insulator layer.
  • the above-described electromagnetic wave absorbing material can be uniformly arranged in the electromagnetic wave absorber without uneven distribution, so that the electromagnetic wave absorption characteristics of the electromagnetic wave absorber are improved.
  • the dispersant a polymer dispersant having an Mw of 1,000 or more is preferably used.
  • polymer dispersant examples include trade names such as DISPERBYK-101 and DISPERBYK-102 manufactured by BYK Chemie; EFKA4010 and EFKA4046 manufactured by Fuka Additive; Disperse Aid 6 and Disperse Aid 8 manufactured by Sannopco Various Solsperse dispersants such as SOLSPERS 3000 and 5000 manufactured by Noveon; Adeka Pluronic L31 and F38 manufactured by ADEKA; Ionette S-20 manufactured by Sanyo Chemical Industries; Disparon KS- manufactured by Enomoto Kasei Co., Ltd. 860, 873SN etc. are mentioned. These may be used alone or in combination of two or more.
  • the amount of the dispersant added is preferably 0.05 to 15 parts by mass when the total mass of the electromagnetic wave absorber composition is 100 parts by mass. When two or more kinds of the dispersants are used in combination, the addition amount is determined as the total addition amount of each dispersant.
  • the electromagnetic wave absorber composition can be prepared by uniformly dispersing and mixing the above components. By uniformly dispersing each of the above components, the electromagnetic wave absorbing material can be prevented from being unevenly distributed and an electromagnetic wave absorber free from noise leakage can be produced.
  • the said mixing method is not specifically limited, For example, the mixing method using a kneader, an extruder, a roll mill etc. is preferable.
  • the electromagnetic wave absorber three-dimensional structure of the present embodiment is an electromagnetic wave absorber three-dimensional structure formed using the electromagnetic wave absorber composition disclosed in the above-described embodiment, and is thin enough to cover an electronic member
  • d thickness of the electromagnetic wave absorber three-dimensional structure
  • V volume content of the electromagnetic wave absorbing material included in the electromagnetic wave absorber three-dimensional structure
  • the thickness of the electromagnetic wave absorber three-dimensional structure may vary. That is, a thin part and a thick part may occur in the electromagnetic wave absorber three-dimensional structure. In this case, the content of the electromagnetic wave absorbing material contained in the thin part is less than the content of the electromagnetic wave absorbing material contained in the thick part, and the electromagnetic wave absorption characteristics in the thin part are deteriorated. That is, when the electromagnetic wave passes through the thin portion, the electromagnetic wave absorbing effect is reduced because the thickness through which the electromagnetic wave passes is reduced. As a result, unnecessary electromagnetic waves leak from the inside of the device to the outside, which may adversely affect the external device.
  • the thickness of the electromagnetic wave absorber three-dimensional structure is d (mm) and the volume content of the electromagnetic wave absorbing material included in the electromagnetic wave absorber three-dimensional structure is V (%), d
  • the relational expression of ⁇ V 1/3 > 0.4 is satisfied, even if the thickness of the electromagnetic wave absorber three-dimensional structure changes during modeling, the entire area of the electromagnetic wave absorber three-dimensional structure is above a certain level. Therefore, an electromagnetic wave absorber with low noise leakage can be realized.
  • an electromagnetic wave absorber that secures an electromagnetic wave transmission attenuation of 10 dB or more can be realized. If the electromagnetic wave transmission attenuation is less than 10 dB, there is a high possibility that noise leakage will affect peripheral electronic devices.
  • the above relational expression is derived by the present inventors through experiments and the like.
  • the wall thickness d is constant, it means that the volume content V is set to a certain value or more.
  • the volume content V is constant, it means that the wall thickness d is set to a certain value or more.
  • the electromagnetic wave absorber three-dimensional structure can be formed in advance according to the surface shape of various electronic members and the casing of the electronic member, the electromagnetic wave absorber three-dimensional structure is an electronic member using the electromagnetic wave absorber three-dimensional structure. Can be installed at any time.
  • the volume resistivity of the electromagnetic wave absorber three-dimensional structure is increased. It can be 10 10 ⁇ cm or more. Thereby, the said electromagnetic wave absorber three-dimensional structure can be made into a nonelectroconductive material, and generation
  • the method for producing the electromagnetic wave absorber three-dimensional structure is not particularly limited, but can be selected from various production methods according to the type of binder resin used in the above-described electromagnetic wave absorber composition.
  • an electromagnetic wave absorber three-dimensional structure by an optical modeling method, an active energy ray curable resin, a photopolymerization initiator, a surface conditioner, and further, if necessary, a filler and a dispersant are used in appropriate combination. Can do.
  • an electromagnetic wave absorber three-dimensional structure can be easily formed with high modeling accuracy by an inkjet optical modeling method (MJM modeling method) using an inkjet printer as a three-dimensional printer. In this case, it is necessary to adjust the viscosity of the electromagnetic wave absorber composition to an appropriate discharge viscosity of the ink jet printer.
  • JM modeling method inkjet optical modeling method
  • thermosetting resin and rubber-like resin are used as the binder resin
  • an electromagnetic wave absorber three-dimensional structure can be produced by a heat compression molding method.
  • thermoplastic resin as said binder resin
  • an electromagnetic wave absorber three-dimensional molded item can be produced by the injection molding method.
  • FIGS. 2A and 2B are schematic cross-sectional views illustrating specific examples of the electromagnetic wave absorber three-dimensional structure according to the present embodiment manufactured according to the surface shape of a specific electronic member.
  • the manufacturing method of the electromagnetic wave absorber three-dimensional structure is not particularly limited, and depending on the type of binder resin used in the above-described electromagnetic wave absorber composition, an optical modeling method using a three-dimensional printer, a heat compression molding method The injection molding method can be appropriately selected.
  • the electromagnetic wave absorber three-dimensional structures 11 and 12 shown in FIGS. 1A and 1B have a thin-walled structure and are formed in a cup shape so as to cover an electronic member.
  • the thickness d of the electromagnetic wave absorber three-dimensional structures 11 and 12 shown in FIGS. 1A and 1B is formed substantially uniformly.
  • the electromagnetic wave absorber three-dimensional structure 21 and 22 shown in FIGS. 2A and 2B have a thin structure and are formed in a cup shape so as to cover the electronic member. 22 has thick portions 21a and 22a and thin portions 21b and 22b, respectively.
  • the electromagnetic wave absorber three-dimensional structures 11, 12, 21, and 22 shown in FIGS. 1A and 1B and FIGS. 2A and 2B have a thickness d (mm) and the electromagnetic wave absorber three-dimensional structures 11, 12, 21, and 22. Since the relational expression d ⁇ V 1/3 > 0.4 is established between the volume content V (%) of the electromagnetic wave absorbing material contained in the material, as shown in FIGS. Even if the thickness changes, the electromagnetic wave transmission attenuation amount of 10 dB or more in the frequency band of the millimeter wave band or higher can be ensured in the entire region of the electromagnetic wave absorber three-dimensional structure, and noise leakage can be ensured. There can be no electromagnetic wave absorber.
  • the electronic component of this embodiment includes an electronic member covered with the electromagnetic wave absorber three-dimensional structure disclosed in the above-described embodiment. Moreover, the electronic device of this embodiment is provided with the electronic component of this embodiment.
  • EMC electromagnettic compatibility
  • Examples of the electronic member covered with the electromagnetic wave absorber three-dimensional model include a circuit element and a transmission path.
  • the circuit element include a transistor, a diode, a resistor, a capacitor, an inductor, and a battery.
  • the transmission path include wiring, a printed circuit board, a connector, a socket, and the like.
  • the circuit board provided with the circuit element, the transmission line, etc. corresponds, for example.
  • a communication device for example, a communication device, a sensor, a medical device, a millimeter wave radar, or the like using wireless communication technology is applicable.
  • FIGS. 3A and 3B and FIGS. 4A and 4B are schematic cross-sectional views showing a part of an electronic component (for example, a circuit board) of this embodiment provided with a circuit element covered with an electromagnetic wave absorber three-dimensional structure.
  • the circuit element 13 has shown a part of electronic component coat
  • the circuit element 14 has shown a part of electronic component coat
  • 4A shows a part of an electronic component in which the circuit element 23 is covered with the electromagnetic wave absorber three-dimensional structure 21 shown in FIG. 2A.
  • 4B shows a part of an electronic component in which the circuit element 24 is covered with the electromagnetic wave absorber three-dimensional structure 22 shown in FIG. 2B. More specifically, FIGS. 3 and 4 show a part of a circuit board, for example.
  • the electromagnetic wave absorber three-dimensional structures 11 and 21 are in contact with and follow the surface of the circuit elements 13 and 23.
  • the electromagnetic wave absorber three-dimensional structures 12 and 22 have non-contact portions with respect to the surfaces of the circuit elements 14 and 24, respectively.
  • the manufacturing method of the electronic component of this embodiment forms an electromagnetic wave absorber three-dimensional structure using the step of preparing the electromagnetic wave absorber composition disclosed in the above embodiment and the electromagnetic wave absorber composition. And a step of bonding and covering the electromagnetic wave absorber three-dimensional structure to the electronic member.
  • an electronic component having high EMC electromagnettic compatibility
  • the said electromagnetic wave absorber three-dimensional structure can be produced in a process different from an electronic member, the influence of the heat
  • the electromagnetic wave absorber three-dimensional structure does not include a conductive layer and has a volume resistivity of 10 10 ⁇ cm or more, there is no possibility of short circuit even if it contacts a circuit element or a transmission line.
  • the electronic device manufacturing method of the present embodiment includes a step of incorporating the electronic component manufactured by the electronic component manufacturing method disclosed in the above embodiment into the electronic device.
  • EMC electromagnetic compatibility
  • Example 1 Preparation of composition for electromagnetic wave absorber> The following components were kneaded with a pressure batch kneader to prepare an electromagnetic wave absorber composition A of this example in which the volume content V of hexagonal ferrite magnetic powder as an electromagnetic wave absorbing material was 51%.
  • the hexagonal ferrite magnetic powder having the following composition formula has a magnetic resonance frequency responsible for electromagnetic wave absorption adjusted to 76 G (Hz).
  • Hexagonal ferrite magnetic powder composition formula: SrFe 10.56 Al 1.44 O 19
  • Silicone rubber (trade name “KE-541-U” manufactured by Shin-Etsu Chemical Co., Ltd.)
  • composition for electromagnetic wave absorber (Example 2) ⁇ Preparation of composition for electromagnetic wave absorber> The following components were kneaded with a pressure-type batch kneader to prepare an electromagnetic wave absorber composition B of this example in which the volume content V of epsilon-type iron oxide magnetic powder as an electromagnetic wave absorbing material was 40%.
  • the epsilon-type iron oxide magnetic powder having the following composition formula is prepared by adjusting the magnetic resonance frequency responsible for electromagnetic wave absorption to 76 G (Hz).
  • Epsilon-type iron oxide magnetic powder (composition formula: ⁇ -Ga 0.46 Fe 1.54 O 3 )
  • Silicone rubber (trade name “KE-541-U” manufactured by Shin-Etsu Chemical Co., Ltd.)
  • Example 3 Preparation of composition for electromagnetic wave absorber> The following components were kneaded with a heating extruder to prepare an electromagnetic wave absorber composition C of this example in which the volume content V of the hexagonal ferrite magnetic powder as an electromagnetic wave absorbing material was 47%.
  • the following hexagonal ferrite magnetic powder is the same as that used in Example 1.
  • Hexagonal ferrite magnetic powder composition formula: SrFe 10.56 Al 1.44 O 19
  • Polycarbonate trade name “Panlite” manufactured by Teijin Limited
  • ⁇ Production of electromagnetic wave absorber three-dimensional structure Using the electromagnetic wave absorber composition C produced above, a sheet-like electromagnetic wave absorber three-dimensional structure (electromagnetic wave absorber) having a length of 12 cm, a width of 12 cm, and a thickness of d: 1 mm is formed by injection molding. Produced. The value of d ⁇ V 1/3 of the electromagnetic wave absorber of this example is 0.78.
  • Example 1 An electromagnetic wave absorber three-dimensional structure was produced in the same manner as in Example 1 except that the thickness d of the electromagnetic wave absorber three-dimensional structure (electromagnetic wave absorber) was changed to 0.5 mm.
  • the value of d ⁇ V 1/3 in this comparative example is 0.40.
  • Example 2 An electromagnetic wave absorber three-dimensional structure (electromagnetic wave absorber) was produced in the same manner as in Example 2 except that the thickness d of the electromagnetic wave absorber three-dimensional structure was changed to 0.5 mm.
  • the value of d ⁇ V 1/3 in this comparative example is 0.37.
  • Example 3 An electromagnetic wave absorber three-dimensional structure (electromagnetic wave absorber) was produced in the same manner as in Example 3 except that the thickness d of the electromagnetic wave absorber three-dimensional structure was changed to 0.5 mm.
  • the value of d ⁇ V 1/3 in this comparative example is 0.39.
  • the electromagnetic wave transmission attenuation of the three-dimensional electromagnetic wave absorber (electromagnetic wave absorber) produced in Examples 1 to 3 and Comparative Examples 1 to 3 was measured using a free space method. Specifically, using an millimeter wave network analyzer “ME7838A” (product name) manufactured by Anritsu Corporation, an electromagnetic wave absorber is irradiated with an input wave (millimeter wave) of a predetermined frequency from a transmitting antenna via a dielectric lens. And the electromagnetic waves which permeate
  • ME7838A product name
  • the electromagnetic wave transmission attenuation at a frequency of 76 GHz is shown in Table 1 and FIG.
  • Table 1 in addition to the electromagnetic wave transmission attenuation, values of the electromagnetic wave absorbing material and the binder resin, the thickness d of the electromagnetic wave absorber, the volume content V of the electromagnetic wave absorbing material, and d ⁇ V 1/3 are also shown.
  • FIG. 6 shows the electromagnetic wave absorption spectra of Example 1 and Comparative Example 3.
  • the electromagnetic wave transmission attenuation amount of Examples 1 to 3 in which the value of d ⁇ V 1/3 exceeded 0.4 was as high as 10 dB or more, and the electromagnetic wave from the coated electronic member was not covered.
  • the electromagnetic wave transmission attenuation of 1 to 3 is as low as 9 dB or less, the electromagnetic wave from the coated electronic member affects the electronic member outside the coating, and the electromagnetic wave from the electronic member outside the coating penetrates and affects the coated electronic member.
  • the electromagnetic wave absorber composition and electromagnetic wave absorber three-dimensional structure disclosed in the present application absorb electromagnetic waves in a high frequency band above the millimeter wave band, provide no leakage of noise, and provide a non-conductive electromagnetic wave absorber. Therefore, it is useful for manufacturing an electronic component and an electronic device excellent in EMC.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Power Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Hard Magnetic Materials (AREA)
  • Compounds Of Iron (AREA)

Abstract

La présente invention concerne un article moulé en trois dimensions formé à partir d'un absorbeur électromagnétique, qui est moulé à l'aide d'une composition d'absorbeur électromagnétique contenant une résine liante et de l'oxyde de fer qui est un matériau absorbant les ondes électromagnétiques qui résonne magnétiquement dans la gamme des ondes millimétriques et des bandes de fréquences supérieures. L'article moulé en trois dimensions est moulé en une structure à paroi mince susceptible de recouvrir un élément électronique et satisfait l'expression relationnelle d × V1/3 > 0,4, dans laquelle d (mm) représente l'épaisseur de paroi de l'article moulé en trois dimensions, et V (%) représente le pourcentage de teneur en volume du matériau absorbant les ondes électromagnétiques contenu dans l'article moulé en trois dimensions. De plus, l'atténuation de transmission des ondes électromagnétiques dans la gamme des ondes millimétriques et les bandes de fréquences supérieures est égale ou supérieure à 10 dB.
PCT/JP2019/008327 2018-03-12 2019-03-04 Composition d'absorbeur électromagnétique, article moulé en trois dimensions formé à partir d'un absorbeur électromagnétique, composant électronique et dispositif électronique l'utilisant, et procédés de production de composant électronique et de dispositif électronique WO2019176612A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020506409A JP7141444B2 (ja) 2018-03-12 2019-03-04 電磁波吸収体用組成物、電磁波吸収体三次元造形物、それを用いた電子部品及び電子機器、並びにその電子部品及び電子機器の製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-043987 2018-03-12
JP2018043987 2018-03-12

Publications (1)

Publication Number Publication Date
WO2019176612A1 true WO2019176612A1 (fr) 2019-09-19

Family

ID=67908180

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2019/008327 WO2019176612A1 (fr) 2018-03-12 2019-03-04 Composition d'absorbeur électromagnétique, article moulé en trois dimensions formé à partir d'un absorbeur électromagnétique, composant électronique et dispositif électronique l'utilisant, et procédés de production de composant électronique et de dispositif électronique

Country Status (2)

Country Link
JP (1) JP7141444B2 (fr)
WO (1) WO2019176612A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000328006A (ja) * 1999-05-17 2000-11-28 Sony Corp Ｅｍｃモジュール及びその製造方法
JP2001297905A (ja) * 2000-04-17 2001-10-26 Tokin Corp 高周波電流抑制体
JP2010077198A (ja) * 2008-09-24 2010-04-08 Asahi Kasei E-Materials Corp 樹脂組成物
JP2016111341A (ja) * 2014-12-03 2016-06-20 国立大学法人 東京大学 電磁波吸収体及び膜形成用ペースト
JP2017045946A (ja) * 2015-08-28 2017-03-02 住友ベークライト株式会社 電磁波シールド用フィルム、および電子部品搭載基板
WO2017221992A1 (fr) * 2016-06-22 2017-12-28 日立マクセル株式会社 Feuille d'absorption d'ondes électriques

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000328006A (ja) * 1999-05-17 2000-11-28 Sony Corp Ｅｍｃモジュール及びその製造方法
JP2001297905A (ja) * 2000-04-17 2001-10-26 Tokin Corp 高周波電流抑制体
JP2010077198A (ja) * 2008-09-24 2010-04-08 Asahi Kasei E-Materials Corp 樹脂組成物
JP2016111341A (ja) * 2014-12-03 2016-06-20 国立大学法人 東京大学 電磁波吸収体及び膜形成用ペースト
JP2017045946A (ja) * 2015-08-28 2017-03-02 住友ベークライト株式会社 電磁波シールド用フィルム、および電子部品搭載基板
WO2017221992A1 (fr) * 2016-06-22 2017-12-28 日立マクセル株式会社 Feuille d'absorption d'ondes électriques

Also Published As

Publication number Publication date
JP7141444B2 (ja) 2022-09-22
JPWO2019176612A1 (ja) 2021-03-25
TW201938662A (zh) 2019-10-01

Similar Documents

Publication Publication Date Title
EP3460813B1 (fr) Appareil d'émission d'énergie sans fil pour véhicule
JP6445741B2 (ja) 電磁波吸収シート
CN112004396B (zh) 电磁波吸收片
KR101661583B1 (ko) 전자파 차폐 흡수재 및 그 제조방법
JPWO2008126690A1 (ja) 電磁波シールドシート及びｒｆｉｄプレート
KR101544587B1 (ko) 열전도성 접착층을 포함하는 전자파 차단 필름 및 그 제조 방법.
JP2006032929A5 (fr)
EP2723154A1 (fr) Dispositif de suppression d'interférence d'onde électromagnétique
JP2007129179A (ja) 導電・磁性フィラー、電磁波干渉抑制用シート、高周波信号用フラットケーブル、フレキシブルプリント基板及び電磁波干渉抑制シートの製造方法
EP2136613B1 (fr) Feuille pour la prevention des interferences electromagnetiques, cable plat pour signal haute frequence, substrat souple pour impression et procede de fabrication de ladite feuille
JP5043082B2 (ja) 電磁波吸収材料
JP2010077198A (ja) 樹脂組成物
JP2005159337A (ja) 電磁干渉抑制体およびこれを用いる電磁障害抑制方法
WO2019176612A1 (fr) Composition d'absorbeur électromagnétique, article moulé en trois dimensions formé à partir d'un absorbeur électromagnétique, composant électronique et dispositif électronique l'utilisant, et procédés de production de composant électronique et de dispositif électronique
KR20150073622A (ko) 열전도성 접착층을 이용하며, 흑연층을 포함하는 방열기능이 향상된 복합 필름 및 그 제조 방법.
KR20040055678A (ko) 전자파 흡수성 열전도성 시트
JP2007281074A (ja) ノイズ抑制シート
TWI843719B (zh) 電磁波吸收體用組成物、電磁波吸收體三維造形物、使用其的電子部件及電子機器、以及其電子部件及電子機器的製造方法
EP2045285A1 (fr) Feuille composite de type rouleau disposant de propriétés améliorées de déclenchement thermique, d'absorption d'ondes électromagnétiques, et d'absorption d'impacts, et son procédé de fabrication
KR101530624B1 (ko) 복합 기능성 일체형 근거리무선통신 안테나 및 그 제조 방법
JP5720358B2 (ja) 電波抑制シートとこのシートを具備した電子機器及び電波抑制用部品
KR100874690B1 (ko) 전자파 차폐 및 흡수 특성과 방열 특성이 향상된 롤 타입의복합 시트 및 그 제조 방법
JP2012186384A (ja) 電磁ノイズ抑制部材
JP2000244167A (ja) 電磁波障害防止材
KR20060107182A (ko) 전자파 차폐체

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19767863

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2020506409

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19767863

Country of ref document: EP

Kind code of ref document: A1