Classifications

• • H—ELECTRICITY
  • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
  • H02H3/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal electric working condition with or without subsequent reconnection ; integrated protection
• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04B—TRANSMISSION
  • H04B15/00—Suppression or limitation of noise or interference
  • H04B15/005—Reducing noise, e.g. humm, from the supply
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03F—AMPLIFIERS
  • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
  • H03F3/30—Single-ended push-pull [SEPP] amplifiers; Phase-splitters therefor
  • H03F3/3001—Single-ended push-pull [SEPP] amplifiers; Phase-splitters therefor with field-effect transistors
  • H03F3/3022—CMOS common source output SEPP amplifiers
  • H03F3/3028—CMOS common source output SEPP amplifiers with symmetrical driving of the end stage
  • H03F3/303—CMOS common source output SEPP amplifiers with symmetrical driving of the end stage using opamps as driving stages
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03F—AMPLIFIERS
  • H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
  • H03F3/45—Differential amplifiers
  • H03F3/45071—Differential amplifiers with semiconductor devices only
  • H03F3/45076—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier
  • H03F3/45475—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier using IC blocks as the active amplifying circuit
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03K—PULSE TECHNIQUE
  • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
  • H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
  • H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
  • H03K17/687—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices the devices being field-effect transistors
• • H—ELECTRICITY
  • H03—ELECTRONIC CIRCUITRY
  • H03K—PULSE TECHNIQUE
  • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
  • H03K2217/0063—High side switches, i.e. the higher potential [DC] or life wire [AC] being directly connected to the switch and not via the load
• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04B—TRANSMISSION
  • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
  • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
  • H04B1/40—Circuits

Definitions

• CIRCUIT PROVIDING REVERSE CURRENT PROTECTION FOR HIGH-SIDE DRIVER This relates generally to electronic circuits, and more particularly to a circuit providing reverse current protection for a high-side driver.
• PSI Peripheral Sensor Interface
• PSI5 is a current version, and is considered a replacement for Local Interconnect Network (LIN).
• LIN Local Interconnect Network
• An electronic control unit (ECU) in a PSI transceiver supplies power, e.g., a base voltage, and a synchronization (SYNC) pulse, to a sensor, with the SYNC pulse initiating data collection from the sensor.
• the sensor in turn responds with current-modulated data, which the ECU senses and converts to a digital waveform.
• power e.g., a base voltage
• SYNC synchronization
• the transceiver bus pin (OUTx) can get shorted to either ground or the battery and requires bidirectional current sensing for fault protection. Protection for a short to ground and a short to battery has traditionally used two different circuits, which leads to both increased area and increased power consumption for the chip, as will be explained below. A smaller footprint and lower power consumption for the protection circuit is desired.
• Described examples provide a single current sense path for both short to ground and short to battery protection, eliminating the use of two or more current sense loops to provide both protections. This in turn provides efficiency in both area required for the circuit and in power needed to operate the circuit.
• an electronic control unit (ECU) for a high-side driver comprises an amplifier circuit comprising a first switching transistor coupled in series with a second switching transistor between a first voltage rail that carries a first voltage and a second voltage rail that carries a second voltage that is less than the first voltage, the amplifier circuit being coupled to control respective gates of the first and second switching transistors; and a single current sense circuit coupled to protect a bus pin on the high-side driver from both a short to ground and a short to battery.
• the single current sense circuit comprises: an input node located between the first switching transistor and the second switching transistor; a switch circuit coupled to pass a current from the input node to the bus pin during normal operation; a forward current sensing circuit coupled to the input node and to the first voltage rail, the forward current sensing circuit being coupled to provide a first current on a first output node and a second current on a second output node, each of the first and second currents being proportional to an output current at the bus pin, wherein the first and second currents are substantially zero when a bus voltage on the bus pin is above a given value; a reverse current switching circuit coupled to receive the second current and further coupled to the gate of the second switching transistor, the reverse current switching circuit being coupled to turn the second switching transistor OFF when the second current output is zero; and a forward current protection circuit coupled to the forward current sensing circuit, to the first voltage rail and to a third voltage rail that provides a third voltage that is less than the second voltage, the forward current protection circuit being further coupled to turn OFF the switch circuit responsive to
• a transceiver chip comprises a plurality of decoders; and a plurality of transceivers, each of the plurality of transceivers being coupled to a respective decoder of the plurality of decoders via a respective channel, a transceiver of the plurality of transceivers comprising an electronic control unit (ECU) for a high-side driver.
• the ECU comprises: an amplifier circuit comprising a first switching transistor coupled in series with a second switching transistor between a first voltage rail and a second voltage rail, the amplifier circuit being coupled to control respective gates of the first and second switching transistors; and a single current sense circuit coupled to protect a bus pin on the ECU from both a short to ground and a short to battery.
• the single current sense circuit comprises: an input node located between the first switching transistor and the second switching transistor; a switch circuit coupled to pass a current from the input node to the bus pin during normal operation; a forward current sensing circuit coupled to the input node and to the first voltage rail, the forward current sensing circuit being coupled to provide a first current on a first output node and a second current on a second output node, each of the first and second currents being proportional to an output current at the bus pin, wherein the first and second currents are substantially zero when a bus voltage on the bus pin is above a selected value; a reverse current switching circuit coupled to receive the second current and further coupled to the gate of the second switching transistor, the reverse current switching circuit being coupled to turn the second switching transistor OFF when the second current is zero; and a forward current protection circuit coupled to the forward current sensing circuit, to the first voltage rail and to a third voltage rail, the forward current protection circuit being further coupled to turn OFF the switch circuit responsive to a short to ground.
• a system-on-chip comprises a power supply module coupled to provide a first voltage rail that provides a first voltage, a second voltage rail that provides a second voltage that is less than the first voltage, and a third voltage rail that provides a third voltage that is less than the second voltage; a first plurality of transceiver coupled to receive the second and the third voltage rails; and a second plurality of transceivers coupled to receive the first, the second and the third voltage rails, each of the second plurality of transceivers being coupled to a respective decoder of a plurality of decoders via a respective channel, a transceiver of the second plurality of transceivers comprising an ECU for a high-side driver.
• the ECU comprises: an amplifier circuit comprising a first switching transistor coupled in series with a second switching transistor between the first voltage rail and the second voltage rail, the amplifier circuit being coupled to control respective gates of the first and second switching transistors; and a single sense circuit coupled to protect a bus pin on the ECU from both a short to ground and a short to battery.
• the single sense circuit comprises: an input node located between the first switching transistor and the second switching transistor; a switch circuit coupled to pass a current from the input node to the bus pin during normal operation; a forward current sensing circuit coupled to the input node and to the first voltage rail, the forward current sensing circuit being coupled to provide a first current and a second current, each of the first and second currents being proportional to an output current at the bus pin, wherein the first and second currents are substantially zero when a bus voltage on the bus pin is above a selected value; a reverse current switching circuit coupled to receive the second current and further coupled to the gate of the second switching transistor, the reverse current switching circuit being coupled to turn the second switching transistor OFF when the second current is zero; and a forward current protection circuit coupled to the forward current sensing circuit, to the first voltage rail and to the third voltage rail, the forward current protection circuit being further coupled to turn OFF the switch circuit responsive to a short to ground.
• FIG. 1 depicts a high-level schematic of an ECU for a high-side driver that can use a sensing circuit according to an embodiment of this description.
• FIG. 2 depicts a somewhat more detailed schematic of an ECU for a conventional high-side driver.
• FIG. 4 depicts an implementation of a portion of an ECU for a high-side driver according to an embodiment of this description.
• FIG. 5 depicts a high-level schematic of system containing a standalone PSI5 transceiver chip that can use the described protection circuit according to an embodiment of this description.
• FIG. 6 depicts a high-level schematic of a system containing an SOC that can use the described protection circuit according to an embodiment of this description.
• FIG. 1 depicts a high-level schematic of an automotive system 100 that includes an ECU 102 for a high-side driver and a sensor 104 that is coupled to the bus pin OUTx of the ECU through a bidirectional signal line 116. Although only one sensor is shown in this figure, typically a number of sensors are coupled to ECU 102.
• automotive system 100 is designed to operate using the PSI protocol, e.g., PSI5, although automotive system 100 can also operate under other automotive protocols.
• PSI5 protocol bidirectional signal line 116 is a two-wire connection that provides both power to the sensors and data transmission.
• ECU 102 includes low voltage logic circuit 106 that operates between the rails of VCC, which can be, for example, 5 V and a local ground.
• ECU 102 also includes a high-voltage SYNC pulse generation and current sensing circuit 108 that operates between rails VDD HV, which typically has a“high” voltage in the range of 14-40 V, and VDD_MV, which has a“medium” voltage that in one embodiment has a value of around 7 V.
• VDD HV typically has a“high” voltage in the range of 14-40 V
• VDD_MV typically has a“medium” voltage that in one embodiment has a value of around 7 V.
• Low voltage logic circuit 106 provides a signal 110 to SYNC pulse generation and current sensing circuit 108 that can indicate that a SYNC pulse should be provided to initiate data collection from associated sensors.
• SYNC pulse generation and current sensing circuit 108 provides a signal 112 on bus pin OUTx. Signal 112 will provide a base voltage of, for example, 7 V when automotive system 100 is active. Responsive to receiving a pulse on signal 110, SYNC pulse generation and current sensing circuit 108 provides a SYNC pulse, which in one embodiment is 12 V.
• the SYNC pulse triggers a response from sensor 104, which provides signal 114 using current modulation on bidirectional signal line 116, with a "low” level represented by the normal (quiescent) current consumption of the sensors and a "high” level generated by an increased current sink of the sensor.
• SYNC pulse generation and current sensing circuit 108 is configured to detect the changes in current and provide a digital signal.
• Bidirectional signal line 116 can run for meters through an automotive system.
• bus pin OUTx can be inadvertently shorted to either the battery or to ground, so ECU 102 must be protected when either of these conditions occurs.
• FIG. 2 depicts automotive system 200, which is a somewhat more detailed version of FIG. 1.
• ECU 202 contains low voltage logic circuit 204, amplifier circuit 206, which in this example is a floating amplifier, and two protection circuits: forward current sense circuit 208 and reverse current sense circuit 210.
• the use of two or more separate protection circuits is common, even though each of these circuits uses a large amount of real estate on a chip and requires a significant expenditure of power to run.
• Under the PSI5 protocol there are multiple channels per device, so that each channel requires both a forward current sense circuit and a reverse current sense circuit, each requiring a large area and each consuming current in the range of 200 mA.
• ECU 300 contains low voltage logic circuit 302, amplifier circuit 304, which again is a floating amplifier, forward current sense circuit 306 and reverse current sense circuit 308.
• Low voltage logic circuit 302 contains a voltage divider that includes resistors R5 and R6 coupled in series with N-type metal oxide silicon (NMOS) transistor Ma between the upper rail and the lower rail of the low-voltage section of the circuit.
• NMOS transistor Ma receives an enable signal when the circuit is active.
• a voltage taken between resistors R5 and R6 is coupled to the non-inverting input of amplifier 310 and the output of amplifier 310 is coupled to the inverting input of amplifier 310 and also to current source 312.
• Current source 312 is coupled to a node 316 through a switch Sl and current sink 314 is also coupled to node 316 through a second switch S2.
• a synchronization signal controls switches Sl, S2 so that the output of low voltage logic circuit 302 is either equal to the lower rail or a reference voltage Vref, while capacitor Cl is coupled between the output signal of low voltage logic circuit 302 and the lower rail to ensure that the signal has a sloped transition between the value of the lower rail and Vref.
• the signal produced by low voltage logic circuit 302 is provided to amplifier circuit 304, which in the embodiment shown is a floating amplifier circuit that receives a high-voltage rail, VDD HV, a medium voltage rail, VDD MV, and a low voltage rail, VDD LV.
• Voltage rails VDD HV, VDD MV and VDD LV can be referred to as first, second and third voltage rails respectively.
• high-voltage rail VDD HV carries a first voltage of approximately 14 V
• medium-voltage rail VDD MV carries a second voltage of approximately 7 V
• low-voltage rail VDD LV carries a third voltage of local ground, also referred to as a lower voltage rail.
• the need is to have a very controlled shape to the pulse produced by amplifier circuit 304 in order to avoid radio frequency (RF) interference. Because of this need, the received signal is received on the non-inverting input of pulse-shaping amplifier 318, which is coupled to each of high-voltage rail VDD HV, medium-voltage rail VDD MV and low-voltage rail VDD LV. Diode DHV provides protection from current moving upstream from the circuit shown.
• Pulse-shaping amplifier 318 provides an inverting output, which is coupled to the gate of P-type metal oxide silicon (PMOS) transistor M4, and a non-inverting output, which is coupled to the gate of NMOS transistor M3.
• PMOS transistor M4 has a source coupled to high- voltage rail VDD HV and NMOS transistor M3 has a source coupled to low-voltage rail VDD LV.
• PMOS transistor M5 and NMOS transistor M6 are coupled in parallel between the drains of PMOS transistor M4 and NMOS transistor M3, with the gate of PMOS transistor M5 coupled to high-voltage rail VDD HV through current source Vbp and the gate of NMOS transistor M6 coupled to the low-voltage rail through current sink Vbn.
• PMOS transistor M2 is coupled in series with NMOS transistor Ml between VDD HV and VDD LV.
• the gate of PMOS transistor M2 is coupled to the drain of PMOS transistor M4 and the gate of NMOS transistor Ml is coupled to the drain of NMOS transistor M3.
• Node 320, which lies between the drains of PMOS transistor M2 and NMOS transistor Ml is coupled to drive the gates of NMOS transistor Mb and PMOS transistor Me and is also coupled to the inverting input of pulse- shaping amplifier 318 through a voltage divider that includes resistor R7 and R8 to provide a feedback loop.
• NMOS transistor Mb has a source coupled to VDD LV through current sink 322 and a drain coupled to VDD HV;
• PMOS transistor Me has a source coupled to VDD HV through current source 324 and a drain coupled to VDD LV.
• NMOS switching transistor Msr is coupled in series with PMOS switching transistor Msn between high-voltage rail VDD HV and medium-voltage rail VDD MV.
• the gate of NMOS switching transistor Msr is coupled to a node 326 between current source 324 and PMOS transistor Me and the gate of PMOS switching transistor Msn is coupled to a node 328 between NMOS transistor Mb and current sink 322.
• Node 330 which lies between the sources of NMOS switching transistor Msr and PMOS switching transistor Msn, provides a signal to both forward current sense circuit 306 and reverse current sense circuit 308.
• amplifier circuit 304 provides a base voltage that is equal to the value carried on medium-voltage rail VDD MV to power the sensors.
• amplifier circuit 304 receives a pulse on the input to pulse-shaping amplifier 318, amplifier circuit 304 provides a pulse that has a precise shape designed to minimize RF interference.
• NMOS transistors M7F and M7R are coupled in series between node 330 and bus pin OUTX.
• Current source 332 is coupled in series with resistor Rg between VDD HV and node 330; and node N2 between current source 332 and resistor Rg is coupled to the gates of NMOS transistors M7F and M7R.
• the coupling of the gates of NMOS transistors M7F and M7R to the stable voltage on node N2 ensures that the signal received on node 330 is passed to bus pin OUTx unless NMOS transistors M7F and M7R are specifically turned OFF during a short to ground.
• operational amplifier OA2 along with PMOS transistors M8, M10 and NMOS transistors M9, M16 perform current sensing and operational amplifier Opf, in combination with third and fourth resistors R3, R4, NMOS transistors Ml l, M12, diode D3 and current sink If ref provide protection against a short to ground.
• the non-inverting input of operational amplifier OA2 is coupled to node 330 to receive the outgoing signal and provides its output to the gate of NMOS transistor Ml 6.
• PMOS transistor M8, and NMOS transistors Ml 6, M9 are coupled in series between the high-voltage rail VDD HV and third node N3, which is coupled to the gates of NMOS transistors M7F, M7R through back-to-back diodes Dl, D2, which can be considered a first diode and second diode respectively.
• Node N4, which lies between the source of NMOS transistor Ml 6 and the drain of NMOS transistor M9 is coupled to the inverting input of operational amplifier OA2 and the gate of NMOS transistor M9 is coupled, in common with the gates of NMOS transistors M7F, M7R, to node N2.
• PMOS transistor M8 is diode coupled and the gate of PMOS transistor M8 is further coupled to the gate of PMOS transistor M10, which is coupled between VDD HV and node N7, which provides a current Ircv for further processing.
• resistor R3 is coupled in series with NMOS transistors M12 and Ml l between VDD HV and node N3 and resistor R4 is coupled in series with current sink If ref between VDD HV and VDD LV.
• the gate of NMOS transistor M12 is coupled to the output of operational amplifier OA2; the gate of NMOS transistor Ml 1 is coupled to node N2; and fifth node N5 between resistor R3 and the drain of NMOS transistor M12 is coupled to the non inverting input of operational amplifier Opf.
• Reverse current sense circuit 308 also contains two operational amplifiers OA1 and Opr. Additionally, reverse current sense circuit 308 includes resistor Rlr, which is coupled in series with NMOS transistor Ml 5 and PMOS transistor M14 between VDD_HV and VDD_MV, and resistor R2r, which is coupled in series with current sink Ir ref between VDD HV and VDD LV.
• the non-inverting input of operational amplifier OA1 is coupled to node 330, which provides the output signal to bus pin OUTx; the inverting input of operational amplifier OA1 is coupled to node 348, which lies between the respective sources of NMOS transistor Ml 5 and PMOS transistor M14; and the output of operational amplifier OA1 is coupled to the gate of NMOS transistor M15.
• Node 344, which lies between resistor Rlr and NMOS transistor M15 is coupled to the inverting node of operational amplifier Opr and node 346, which lies between resistor R2r and current sink Ir ref, is coupled to the non-inverting input of operational amplifier Ofr.
• operational amplifier Opr is coupled through diode D4 to node 328 in common with the gates of PMOS transistors M14 and Msn.
• the voltage on node 346 is less than the voltage on node 344, causing operational amplifier Opr to output a low signal, which does not change the low value on PMOS switching transistor Msn and maintains a current through PMOS switching transistor Msn.
• operational amplifier OA1 When a short to the battery causes a reverse current to flow, operational amplifier OA1 turns ON NMOS transistor Ml 5, which lowers the voltage on node 344, causing operational amplifier Opr to output a high signal, which acts to turn OFF PMOS switching transistor Msn, protecting current from flowing from bus pin OUTx to medium-voltage rail VDD MV.
• the circuit uses two separate sensing circuits to provide protection for a short to ground and a short to battery. These two sensing circuits are high- voltage and increase the area for the circuit, as well as increasing power consumption by at least 200mA for a single PSI5 channel. For a chip or SOC with multiple channels, the power consumption is even greater. Another issue that may arise is that during a rising edge of the SYNC pulse, the cross current from high-voltage rail VDD HV to medium-voltage rail VDD MV may be misinterpreted as a false reverse current, inadvertently triggering the reverse current protection.
• FIG. 4 depicts a portion of an ECU 400 for a high-side driver circuit that eliminates the use of a second sensing circuit to regulate a short to battery and uses a single current sense circuit to protect bus pin OUTx from both a short to ground and a short to battery, i.e., to ensure that a too high or too low bus voltage on bus pin OUTx does not cause harm to the chip.
• low voltage logic circuit 302 and the portions of amplifier circuit 304 to the left of line A-A' are not shown in this figure, as these circuits remain the same.
• amplifier circuit 304' The portion of amplifier circuit 304' that is shown has been modified from ECU 300 and contains eighth NMOS transistor M20 and fourth, fifth and sixth PMOS transistors M21, M22, M23, as well as second current sink Csi2 and second and third current sources Cso2 and Cso3.
• Eighth NMOS transistor M20 is coupled in series with PMOS transistor M21 and second current sink Csi2 between VDD HV and VDD LV.
• Second current source Cso2 is coupled in series with PMOS transistor M22 between VDD HV and VDD LV and third current source Cso3 is coupled in series with PMOS transistor M23.
• third current source Cso3 is coupled to VDD HV and the drain of PMOS transistor M23 coupled to the gate of PMOS switching transistor Msn, which is also referred to as a second switching transistor.
• the gates of PMOS transistors M21 and M23 are coupled together and to the drain of PMOS transistor M21 to form a current mirror.
• the gate of NMOS switching transistor Msr which is also referred to as a first switching transistor, is coupled to a point between second current source Cso2 and PMOS transistor M22.
• the single current sense circuit includes four sections, each of which is enclosed by dotted lines: 1) switch circuit 402, which includes first current source Isg, second resistor R2, first and second diodes Dl and D2 second and third NMOS transistors M7F, M7R, which have a common source, 2) forward current sensing circuit 404, which includes first operational amplifier OA2, third diode D3, fourth NMOS transistor M16, fifth NMOS transistor M9, and first, second and third PMOS transistors M8, M10, Mrev, 3) forward current protection circuit 406, which includes second operational amplifier Opf, third and fourth resistors R3, R4, fourth and fifth diodes D4, D5, third current sink If ref, sixth NMOS transistor M12 and seventh NMOS transistor Ml l, and 4) reverse current switching circuit 408, which includes first current sink Csil, first NMOS transistor Mswitch and first resistor Rl and is coupled to the gate of PMOS switching transistor Msn.
• switch circuit 402 which includes first current source Isg, second
• switch circuit 402, forward current sensing circuit 404 and forward current protection circuit 406 contain the same devices as do their counterpart circuits in FIGS. 3A and 3B and operate in the same manner, except for the addition of third diode D3 to forward current sensing circuit 404 between fourth and fifth NMOS transistors M16 and M9 and the addition of fourth diode D4 to forward current protection circuit 406 between sixth and seventh NMOS transistors M12 and Ml l.
• Forward current sensing circuit 404 has also been modified to include the additional PMOS transistor Mrev, whose gate is coupled to the gates of PMOS transistors M8 and M10.
• PMOS transistor Mrev has a source coupled to VDD HV and a drain coupled to provide a current IMrev to reverse current switching circuit 408 via node N8.
• amplifier circuit 304' provides a base voltage at node 330 by turning ON PMOS transistor Msn, providing the voltage VDD MV.
• PMOS switching transistor Msn turns OFF and NMOS switching transistor Msr turns ON to provide voltage VDD HV.
• Both the amplifier circuit 304 shown in FIG. 3A and the modifications shown as amplifier circuit 304' in FIG. 4 provide a pulse that is shaped to meet specific needs of an automotive circuit, such as providing reduced noise. It will be understood, however, that other amplifier circuits can be used with the single sensing circuit described herein.
• the described single sensing circuit is shown being used with a floating amplifier circuit, but the described single sensing circuit can also be used with an amplifier circuit that is not floating.
• the output signal i.e., the base voltage and/or SYNC pulse
• node 330 which is also referred to as an input node
• the gates of second and third NMOS transistors M7F, M7R are coupled to a stable voltage provided at second node N2 that holds second and third NMOS transistors M7F, M7R fully ON unless the voltage on the gates of these transistors is brought below the threshold value for these transistors, as will be discussed below.
• the output signal is also provided to the non-inverting input of operational amplifier OA2, while the output of operational amplifier OA2 is provided to the gate of fourth NMOS transistor M16.
• a feedback value is supplied to the inverting input of operational amplifier OA2 using PMOS transistors M8 and fourth and fifth NMOS transistors Ml 6 and M9, with the feedback value taken from a fourth node N4 between fourth NMOS transistor Ml 6 and fifth NMOS transistor M9.
• Fifth NMOS transistor M9 and seventh NMOS transistor Ml l are sized proportionally to second NMOS transistor M7F, e.g., if second NMOS transistor M7F has a size 1000x1, fifth NMOS transistor M9 and seventh NMOS transistor Ml l can have values of 10x1 and will then source one hundredth the current of second NMOS transistor M7F.
• fourth NMOS transistor M16 and sixth NMOS transistor Ml 2 of forward current sensing circuit 404 detect the current through bus pin OUTx, including variations caused by data transmitted by the sensor, and forward current sensing circuit 404 provides a proportional current on both a first output node N7, which provides the proportional current Ircv, also known as a first current, to a processing circuit with a comparator to sense data sent from the sensor, and a second output node N8, which provides the proportional current IMrev, also known as a second current, to reverse current switching circuit 408.
• operational amplifier Opf regulates the current by limiting the voltage on the gate of second NMOS transistor M7F while NMOS transistor Mswitch remains ON.
• Reverse current switching circuit 408 receives the proportional current IMrev at first node N9, which is coupled to VDD LV through first current sink Csil, so that the provided current is sinked at a constant rate.
• First NMOS transistor Mswitch is coupled between the gate of PMOS switching transistor Msn and VDD LV; resistor Rl is coupled in parallel with first NMOS transistor Mswitch between the gate of PMOS switching transistor Msn and VDD_LV.
• the gate of first NMOS transistor Mswitch is coupled to a point between first node N9 and first current sink Csil.
• the current IMrev provided at first node N9 is greater than the current sinked by first current sink Csil and the gate of first NMOS transistor Mswitch is held ON.
• first NMOS transistor Mswitch ON the gate of PMOS switching transistor Msn is coupled to VDD LV, which works to hold PMOS switching transistor Msn ON.
• the second current IMrev at first node N9 becomes zero. This means that the voltage on first NMOS transistor Mswitch will drop as first current sink Csil sinks the current, allowing first NMOS transistor Mswitch to turn OFF.
• Ioffset which is coupled to the non-inverting input of operational amplifier OA2 through node N4.
• the offset current provided by this current sink allows the circuit to distinguish between a short to battery and a momentary cross current from high-voltage rail VDD HV to medium-voltage rail VDD MV, i.e., the current IMrev through node N8 is non zero for an open line and is zero for a short to battery.
• the current limit level for a short to battery can be adjusted using Ioffset value.
• FIG. 5 depicts a high-level schematic of system 500 containing a standalone PSI5 transceiver chip 502 that can use the described ECU for high-side driver circuit.
• PSI5 transceiver chip 502 receives three power supply inputs: VDD HV that provides the high voltage, VDD MV that provides a medium voltage and VDD LV that provides a low voltage such as local ground.
• the three power supply inputs are coupled to a set of PSI5 transceivers 504, which are coupled to respective channels and decoders.
• Output from each of the channels of PSI5 transceiver chip 502 is provided to data module 530, which provides software processing of the received data.
• PSI5 transceiver chip 502 has four PSI5 transceivers and four channels, but it will be understood that there can be any number of channels provided as needed by the particular system in which the chip is used.
• PSI5 transceiver 506 is coupled to a first channel 514, which in turn is coupled to first decoder 522, which is a Manchester decoder;
• PSI5 transceiver 508 is coupled to second channel 516, which is coupled to second decoder 524;
• PSI5 transceiver 510 is coupled to third channel 518, which is coupled to third decoder 526;
• PSI5 transceiver 512 is coupled to fourth channel 520, which is coupled to fourth decoder 528.
• FIG. 6 depicts a high-level schematic of a system 600 including SOC 602 that can use the described protection circuit according to an embodiment of this description.
• SOC 602 is coupled to an automotive battery 601 and when the ignition is turned ON, power supply module 604 provides the power supply lines with high-voltage rail VDD HV, medium-voltage rail VDD MV and low-voltage rail VDD LV.
• transceiver systems can be provided on SOC 602 and in the example shown, these include LIN transceivers 606, which receive VDD MV and VDD LV, Flex Ray (FR) transceivers 608, which also receive VDD MV and VDD_LV, Controller Area Network (CAN) transceivers 610 and PSI5 transceivers 612, both of which receive all three of VDD HV, VDD MV and VDD LV.
• PSI5 transceivers 612 includes four transceivers (not shown separately), each of which are coupled to a respective channel and decoder. The output of the decoders is provided to data software processing 622.
• an innovative circuit protects the bus pin of a high-side driver from both a short to ground and a short to battery.
• the described circuit uses less area on the chip and consumes less power, because the circuit eliminates the need for a separate sensing circuit.
• the described protection circuit can be used with a high-side drive for a PSI5 transceiver or with other high-side drivers. Both a stand-alone chip and an SOC that include the described circuit have also been shown. Using the described protection circuit, a short to battery can operate to pass less than 10 mA of current.

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• Emergency Protection Circuit Devices (AREA)
• Protection Of Static Devices (AREA)
• Charge And Discharge Circuits For Batteries Or The Like (AREA)
• Semiconductor Integrated Circuits (AREA)

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• 2018
  • 2018-03-06 US US15/913,465 patent/US10804691B2/en active Active
• 2019
  • 2019-03-05 EP EP19764475.0A patent/EP3763010B1/en active Active
  • 2019-03-05 WO PCT/US2019/020662 patent/WO2019173275A1/en not_active Ceased
  • 2019-03-05 JP JP2020546995A patent/JP7251015B2/ja active Active
  • 2019-03-05 KR KR1020207025253A patent/KR102759032B1/ko active Active
  • 2019-03-05 CN CN201980015935.8A patent/CN111788750B/zh active Active
• 2020
  • 2020-09-14 US US17/020,086 patent/US11368009B2/en active Active

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