WO2019169754A1 - 显示面板及其制备方法、显示装置 - Google Patents

显示面板及其制备方法、显示装置 Download PDF

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Publication number
WO2019169754A1
WO2019169754A1 PCT/CN2018/089050 CN2018089050W WO2019169754A1 WO 2019169754 A1 WO2019169754 A1 WO 2019169754A1 CN 2018089050 W CN2018089050 W CN 2018089050W WO 2019169754 A1 WO2019169754 A1 WO 2019169754A1
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WIPO (PCT)
Prior art keywords
layer
sub
retaining wall
display panel
anode
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Ceased
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PCT/CN2018/089050
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English (en)
French (fr)
Inventor
刘长瑜
李鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Original Assignee
Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/125,196 priority Critical patent/US10622422B2/en
Publication of WO2019169754A1 publication Critical patent/WO2019169754A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/122—Pixel-defining structures or layers, e.g. banks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8051—Anodes
    • H10K59/80515—Anodes characterised by their shape

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a display panel, a method for fabricating the same, and a display device.
  • the Active Light-Emitting Diode In the current field of illumination and display, the Active Light-Emitting Diode (OLED) has fast response, high color gamut, high contrast, wide viewing angle, low power consumption, foldability, simple structure and self- Features such as luminescence, and more and more are widely used in the development of lighting products and panel industry, and are regarded as one of the most promising products.
  • OLED Active Light-Emitting Diode
  • PET polymer-based chemical vapor deposition
  • IJP Inkjet Printer
  • TFE thin film encapsulation
  • first retaining wall Dam
  • second retaining wall on the flat layer of the edge region of the display panel to control the diffusion range of the Ink, as shown in FIG.
  • the presence of the first retaining wall and the second retaining wall increases the width of the non-display area in the display panel, reducing the screen ratio of the display panel.
  • the invention also provides a display panel and a method for preparing the display panel.
  • the display panel of the present invention includes: a substrate and a flat layer, an anode layer, a pixel defining layer, a cathode layer and an encapsulation layer which are sequentially stacked on the substrate; and the pixel defining layer includes a setting outside the display area of the display panel a retaining wall group on the anode layer, the retaining wall group including a first side of the display area adjacent to the display panel, a second side remote from the display area of the display panel, and the first side and the second side A plurality of spaced sub-retaining walls between the sides, a plurality of spaced apart gaps of the sub-retaining walls forming a path, the length of the path being greater than a linear distance from the first side to the second side.
  • the sub-retaining wall is a protrusion disposed on the anode layer, and the height of the protrusion is 5 ⁇ m to 15 ⁇ m.
  • the anode layer is provided with a plurality of anode holes penetrating through the anode layer, and the sub-retaining wall is correspondingly disposed in the anode hole and protrudes from the anode layer, and the sub-block wall wears
  • the anode layer is passed through and the flat layer and the cathode layer are connected.
  • the sub-retaining wall includes a first sub-retaining wall and a second sub-retaining wall, and the first sub-retaining wall is arranged at intervals along an extending direction perpendicular to the first side to the second side, and each of the two
  • the spacing of the first sub-retaining wall is a first spacing
  • the spacing of the second sub-retaining wall is spaced along an extending direction perpendicular to the first side to the second side, and each of the two first sub-blocks
  • the spacing between the walls is correspondingly provided with one of the second sub-retaining walls, and the width of the second sub-retaining wall is greater than or equal to the width of the first spacing.
  • the sub-retaining wall further includes at least one third sub-retaining wall disposed adjacent to the second side, the third sub-retaining wall having a width greater than the first sub-retaining wall and the second sub-retaining wall The width.
  • the pixel defining layer includes an edge retaining wall on a side of the retaining wall group away from the display area of the display panel, and the edge retaining wall is spaced apart from the retaining wall group.
  • the pixel defining layer is laminated with a spacer layer, each of the sub-retaining walls comprising a first portion and a second portion stacked on the first portion, wherein the first portion is disposed in the same layer as the pixel defining layer, The second portion is disposed in the same layer as the spacer layer.
  • the method for preparing the display panel of the present invention for preparing the above display panel comprises:
  • the pixel defining layer outside the display area of the display panel includes a retaining wall group, and the retaining wall group includes a plurality of spaced sub-retaining walls, the block
  • the wall group includes a first side of the display area adjacent to the display panel and a second side away from the display area, and a plurality of spaced apart gaps of the sub-retaining wall form a path, the length of the path being greater than the first side to a straight line distance of the second side;
  • An encapsulation layer is formed on the cathode layer.
  • the step of forming an anode layer on the substrate and the flat layer comprises:
  • the pixel defining layer outside the display area of the display panel comprises a retaining wall group
  • the step of the retaining wall group comprising a plurality of spaced sub-retaining walls comprises:
  • the display device of the present invention includes the above display panel.
  • the display panel of the present invention forms staggered spaced sub-retaining walls on the flat layer in the edge region of the display panel, which increases the diffusion path of the organic layer material on the surface of the display panel, thereby controlling the diffusion rate and diffusion range of the organic layer material.
  • the number of the retaining walls at the edge of the display panel is reduced, the boundary area of the display panel is reduced, and the screen ratio of the display panel is improved.
  • FIG. 1 is a schematic plan view showing a structure outside a display area of a conventional display panel.
  • FIG. 2 is a cross-sectional view of the display panel of the present invention.
  • FIG. 3 is a schematic plan view showing the first embodiment of the display panel shown in FIG. 2.
  • FIG. 4 is a partial structural view of the display panel shown in FIG. 2.
  • FIG. 5 is a schematic view showing the distribution structure of the anode holes outside the display area of the display panel of FIG. 2.
  • FIG. 6 is a schematic plan view showing a second embodiment of the display panel shown in FIG. 2.
  • FIG. 6 is a schematic plan view showing a second embodiment of the display panel shown in FIG. 2.
  • FIG. 7 is a schematic plan view showing a third embodiment of the display panel shown in FIG. 2.
  • FIG. 7 is a schematic plan view showing a third embodiment of the display panel shown in FIG. 2.
  • FIG. 8 is a schematic plan view showing a fourth embodiment of the display panel shown in FIG. 2.
  • FIG. 8 is a schematic plan view showing a fourth embodiment of the display panel shown in FIG. 2.
  • FIG. 9 is a flow chart of a method of fabricating the display panel of the present invention.
  • the present invention provides a display panel, which is specifically an active matrix/organic light emitting diode (AMOLED), and the display panel 100 includes a display.
  • the area 101 and the edge area 102 refer to an area outside the display area 102 of the display panel 100.
  • the display panel 100 includes a substrate 10 and a flat layer 20, an anode layer 31, a pixel defining layer 32, a cathode layer 33, and an encapsulation layer 40 which are sequentially stacked on the substrate 10.
  • the pixel defining layer 32 includes a retaining wall group disposed on the anode layer 31, the retaining wall group including a plurality of spaced sub-retaining walls 50, the retaining wall The group includes a first side 501 adjacent to the display area 101 of the display panel 100 and a second side 502 away from the display area 101 of the display panel 100, and a plurality of spaced apart gaps of the sub-retaining wall 50 form a path, the path of which The length is greater than the linear distance from the first side 501 to the second side 502 to extend the flow path of the organic material to the edge region 102 during packaging, thereby effectively controlling the diffusion rate and diffusion range of the organic material.
  • the substrate 10 includes a flexible substrate 11 made of polyimide (PI, Polyimide) and a thin film transistor layer 12 laminated on the flexible substrate 11.
  • the first side 501 and the second side 502 of the retaining wall group are opposite and parallel, and are perpendicular to the extending direction of the display area 101 to the edge area 102.
  • the path formed by the plurality of sub-retaining walls 50 does not include a linear distance from the first side 501 to the second side 502.
  • the display panel of the present invention forms a plurality of sub-retaining walls arranged in a staggered manner on a flat layer outside the display area, and a gap is formed at a gap between the plurality of sub-retaining walls.
  • the encapsulation layer When the display panel is packaged, the encapsulation layer When the organic material is diffused from the display region to the edge region, the organic material diffuses along a path formed by the gap of the sub-retaining wall, and the organic layer is diffused in a straight line in the conventional display panel, and the display panel of the present invention
  • the length of the flow path of the organic layer is increased, the diffusion rate and the diffusion range of the organic layer can be effectively controlled, the amount of the organic material diffused to the outermost side of the edge region can be reduced, and the number of the barrier wall blocking the organic material in the edge region can be reduced, thereby reducing
  • the area of the edge area of the small display panel increases the screen ratio of the display panel.
  • the encapsulation layer 40 is composed of a first inorganic layer 41, an organic layer 42 covering the first inorganic layer 41, and a second inorganic layer 43 on the organic layer 42.
  • the encapsulation layer is formed by alternately stacking an inorganic layer, an organic layer, and an inorganic layer, and may be 3 or 5 layers.
  • the inorganic layer is a combination of SiOx, SiNx or other inorganic materials which are uniformly coated between two inorganic layers by means of inkjet printing (IJP, Inject Printer) technology to block moisture
  • IJP, Inject Printer inkjet printing
  • the molten material (hereinafter referred to as Ink) is formed to flatten the surface of the display panel and increase the bending property of the display panel.
  • the encapsulation layer 40 is laminated on the cathode layer 33 for encapsulating the display panel to prevent the display panel from being attacked by moisture and oxygen.
  • the sub-retaining wall 50 is a protrusion disposed on the anode layer 31.
  • the height of the protrusion is 5 ⁇ m to 15 ⁇ m for controlling the diffusion rate and diffusion range of Ink.
  • the sub-retaining wall 50 includes a first sub-retaining wall 51 and a second sub-retaining wall 52.
  • the first sub-retaining wall 51 is spaced along the extending direction perpendicular to the first side 501 to the second side 502, and the interval between each of the two sub-retaining walls 51 is a first spacing 511.
  • the second sub-retaining wall 52 is arranged at intervals along an extending direction perpendicular to the first side 501 to the second side 502, and an interval between each of the two first sub-retaining walls 51 is correspondingly provided with one of the
  • the width of the second sub-retaining wall 52 is greater than or equal to the width of the first spacing 511.
  • the plurality of first sub-retaining walls 51 form a plurality of first sub-retaining wall groups
  • the plurality of the second sub-retaining walls Forming a plurality of second sub-retaining wall groups; a plurality of the first sub-retaining wall groups and a plurality of the second sub-retaining walls along an extending direction of the first side 501 to the second side 502 Group interval setting.
  • the anode layer 31 is provided with a plurality of anode holes 311 extending through the anode layer 31, and the sub-retaining wall 50 is correspondingly disposed in the anode hole 311 and protrudes from the anode hole 31.
  • An anode layer 31, the sub-retaining wall 50 passes through the anode layer 31 and connects the flat layer 20 and the cathode layer 33.
  • the anode hole 311 includes a first anode hole 312 and a second anode hole 313.
  • a plurality of the first anode holes 312 are arranged at intervals in the Y-axis direction of the drawing, and a gap 3121 between each of the two first anode holes 312 is correspondingly provided with one of the second anode holes 313, the second The width of the anode hole 313 is greater than or equal to the width of the gap 3122.
  • the width of the first anode hole 312 and the second anode hole 313 in the Y-axis direction is defined as X1, and the width of the interval between the first anode hole 312 and the second anode hole 313 is defined as X2;
  • the width of the first anode hole 312 is defined as Y1
  • the width of the interval between two adjacent first anode holes 312 is defined as Y2
  • the interval between two adjacent second anode holes 313 is defined.
  • the sub-retaining wall 50 has a one-to-one correspondence with the anode hole 311.
  • the first sub-retaining wall 51 is located in the first anode hole 312, and the second sub-retaining wall 52 is located in the second anode hole 313.
  • the size of the anode hole 311 occurs
  • the size of the sub-retaining wall 50 changes correspondingly, the path formed by the gaps of the plurality of spaced sub-retaining walls 50 will be different, and the degree of control over the diffusion rate and diffusion range of the organic material will also be changed. different.
  • the first sub-retaining wall 51 and the second sub-retaining wall 52 are the same size, that is, the first anode hole 312 and the second anode hole.
  • the size of the 313 is the same.
  • Ink flows from the first spacing 511 of the two first sub-retaining walls 51 of the first set of sub-retaining wall groups to the two of the second sub-retaining wall group.
  • the gap of the second sub-retaining wall 52 flows to the first spacing 511 of the other set of first sub-retaining wall groups.
  • the diffusion path of Ink increases significantly, and as Ink moves from the first side 501 toward As the second side 502 continues to diffuse, the diffusion rate of Ink gradually decreases.
  • the pixel defining layer 32 includes an edge retaining wall 60 on the side of the retaining wall group away from the display area 101 of the display panel 100, the edge retaining wall 60 and the retaining wall
  • the group spacing arrangement limits the diffusion range of the Ink flowing out from the retaining wall group, reduces the number of retaining walls at the edge of the conventional display panel, thereby reducing the area of the edge region 102 and increasing the screen ratio.
  • the edge retaining wall 60 passes through the anode layer 31 and connects the flat layer 20 and the encapsulation layer 40.
  • a diffusion path of Ink in the Y-axis direction in the retaining wall group is shown by a broken line in FIG.
  • the difference from the first embodiment is that the size of the first sub-retaining wall 51 is smaller than the size of the second sub-retaining wall 52, that is, the first
  • the size of an anode aperture 312 is smaller than the size of the second anode aperture 313.
  • Ink flows in the path formed by the sub-retaining walls 50 which are disposed at intervals.
  • the diffusion path of Ink is significantly increased, and the diffusion rate of the organic layer 42 can be effectively controlled, in the display area 101 of the display panel 100.
  • edge defining wall 32 of the pixel defining layer 32 on the side of the retaining wall group away from the display area 101 of the display panel 100 limits the diffusion range of the Ink flowing out from the retaining wall group, and reduces the conventional display panel.
  • the number of retaining walls at the edges reduces the area of the edge regions 102 and increases the screen ratio of the display panel.
  • a diffusion path of Ink in the Y-axis direction in the retaining wall group is as shown by a broken line in FIG.
  • the difference from the above two embodiments is that the sub-retaining wall 50 includes at least one third sub-retaining wall 53, and the third sub-retaining wall 53 passes through the anode layer. 31 connecting the flat layer 20 and the cathode layer 33, perpendicular to the extending direction of the first side 501 to the second side, the width of the third sub-retaining wall 53 is larger than the first sub-retaining wall 51 And the width of the second sub-retaining wall 52. That is, the anode hole 311 includes at least one third anode hole, and the width of the third anode hole is larger than the widths of the first anode hole 312 and the second anode hole 313 in the X-axis direction as illustrated.
  • the sub-retaining wall 50 includes a third sub-retaining wall 53, which is a complete retaining wall, completely blocking the The Ink flowing out of the first sub-retaining wall 51 and the second sub-retaining wall 52 completely eliminates the edge retaining wall in the edge region of the conventional display panel, greatly reducing the area of the edge region 102, and the display screen occupies Better than further.
  • a diffusion path of Ink in the Y-axis direction in the retaining wall group is as shown by a broken line in FIG. 7 .
  • the sub-retaining wall 50 includes a plurality of third sub-retaining walls 53 extending along a direction perpendicular to the first side 501 to the second side. In the direction of 52, a plurality of the third sub-retaining walls 53 are spaced apart, and the width of each of the third sub-retaining walls 53 is equal to the width of three of the first sub-retaining walls 51 and two of the first intervals. The sum of the widths of 511.
  • the arrangement of the plurality of the third sub-retaining walls 53 further blocks the Ink flowing out from the first sub-retaining wall 51 and the second sub-retaining wall 52, so that the flow path of Ink is further increased, which is more advantageous for control
  • the diffusion rate and the diffusion range of the Ink, and the arrangement of the plurality of the third sub-retaining walls is advantageous for improving the display flexibility of the display panel and reducing the bending radius of the display panel.
  • each of the sub-retaining walls 50 in the set of retaining walls is formed in the same process as the pixel defining layer 32.
  • the pixel defining layer 32 is further laminated with a spacer layer, each of the sub-retaining walls including a first portion and a second portion stacked on the first portion, the first portion and the pixel definition Layer 32 is formed in the same process, and the second portion is formed in the same process as the spacer layer. Forming each of the sub-retaining walls while forming the pixel defining layer and/or the spacer layer saves the manufacturing cost of the display panel and improves the competitiveness of the product.
  • the present invention further provides a method for preparing a display panel, which is used for preparing the above display panel, and includes:
  • a flat layer 20 is formed on the substrate 10.
  • the substrate 10 includes a flexible substrate 11 made of polyimide (PI, Polyimide) and a thin film transistor layer 12 laminated on the flexible substrate 11.
  • an anode layer 31 is formed on the substrate 10 and the flat layer 20. Specifically, a metal layer is coated on the substrate 10 and the planar layer 20, the metal layer is patterned to form an anode layer 31, and is formed through the anode layer 31 and spaced apart outside the display region 101 of the display panel 100. Anode hole 311.
  • the patterning process includes techniques such as coating, photomasking, etching, and development.
  • a pixel defining layer 32 is formed on the anode layer 31 and the flat layer 20.
  • the pixel defining layer 32 outside the display area 101 of the display panel 100 includes a retaining wall group including a plurality of spaced sub-retaining walls 50 including a display area 101 adjacent to the display panel 100. a first side 501 and a second side 502 remote from the display area 101, a plurality of spaced apart gaps of the sub-retaining wall 50 forming a path, the length of the path being greater than the first side 501 to the second side The linear distance of 502.
  • a pixel material layer is coated on the anode layer 31 and the flat layer 20, and the pixel material layer is patterned to form a pixel defining layer 32, wherein the pixel material outside the display area 101 of the display panel 100
  • the layer patterning forms a retaining wall group, and the sub-retaining wall 50 in the retaining wall group is correspondingly disposed in the anode hole 311 and protrudes from the anode layer 31.
  • a cathode layer 33 is formed on the pixel defining layer 32 and the retaining wall group. Specifically, a metal layer is coated on the surface of the pixel defining layer 32 and each of the sub-retaining walls 50 to form a cathode layer 33.
  • an encapsulation layer 40 is formed on the cathode layer 33.
  • the encapsulation layer 40 is composed of a first inorganic layer 41, an organic layer 42 covering the first inorganic layer 41, and a second inorganic layer 43 on the organic layer 42.
  • the encapsulation layer 40 is laminated on the cathode layer 33 for encapsulating the display panel to prevent the display panel from being attacked by moisture and oxygen.
  • the present invention further provides a method for fabricating a display panel, which is different from the method for fabricating the display panel described above, in the step of forming the pixel defining layer 32 on the anode layer 31 and the flat layer 20, specifically including: Coating the pixel material layer on the anode layer 31 and the flat layer 20, patterning the pixel material layer to form a pixel defining layer 32 and each of the sub-retaining walls 50 located in each of the anode holes 311 a first portion, further coating a barrier material layer on the pixel defining layer 32 and the first portion of each of the sub-retaining walls 50, patterning the barrier material layer to form a barrier layer and laminating the sub-retaining wall The second portion of each sub-retaining wall 50 on the first portion of 50.
  • the method forms each of the sub-retaining walls 50 while forming the pixel defining layer 31 and the barrier layer, without adding an additional process and without increasing the manufacturing cost.
  • the pixel material layer 32 and the barrier material layer are patterned to form a first portion and a second portion of each of the sub-retaining walls 50 in an etched manner.
  • the present invention also provides a display device including the above display panel.
  • the method for preparing the display panel of the present invention optimizes the size, position and density of the anode hole by opening an anode hole in the anode layer of the edge region, and forms a staggered sub-retaining wall on the anode hole to control the package.
  • the diffusion rate and diffusion range of the organic layer material in the layer reduce the number of retaining walls in the edge region, thereby reducing the area of the edge region of the display panel and increasing the screen ratio of the display panel.

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Abstract

显示面板及其制备方法、显示装置，显示面板包括：基板以及依次层叠于该基板上的平坦层、阳极层、像素定义层、阴极层和封装层；在显示面板的边缘区域内，该像素定义层包括设置在该阳极层上的挡墙组，该挡墙组包括多个间隔设置的子挡墙，该挡墙组包括靠近显示区域的第一侧和远离显示区域的第二侧，间隔设置的多个该子挡墙的间隙处形成路径，该路径的长度大于该第一侧到该第二侧的直线距离。

Description

显示面板及其制备方法、显示装置
本发明要求2018年3月9日递交的发明名称为“显示面板及其制备方法、显示装置”的申请号2018101935762的在先申请优先权，上述在先申请的内容以引入的方式并入本文本中。
技术领域
本发明涉及显示技术领域，特别涉及一种显示面板及其制备方法、显示装置。
背景技术
在目前照明和显示领域中，由于有源矩阵有机发光二极管面板(Organic Light-Emitting Diode，OLED)具有快响应、高色域、高对比度、广视角、低功耗、可折叠、构造简单以及自发光等特点，越来越多的被广泛研究用于开发照明产品以及面板行业中，被视为最具前途的产品之一。
由于OLED器件为对水分和氧气极度敏感的元件，目前主要采用等离子体增强型化学气相沉积(PECVD，Plasma Enhanced Chemical Vapor Deposition)和喷墨打印(IJP，Inkjet Printer)两种封装技术使聚合物有机薄膜和无机薄膜交替沉积在OLED表面，形成有机层和无机层交替的多层薄膜封装(TFE，Thin Film Encapsulation)结构，来防止水分和氧气对OLED的氧化。然而，由于有机层材料在OLED表面的流动，往往需要在显示面板边缘区域的平坦层上设计第一挡墙(Dam)和第二挡墙来控制Ink的扩散范围，如图1所示。然而，第一挡墙和第二挡墙的存在增加了显示面板中非显示区的宽度，降低了显示面板的屏占比。
发明内容
本发明的目的在于提供一种显示面板，控制有机层的扩散速率和范围，减小显示面板的边界面积，提高屏占比。
本发明还提供一种显示面板和显示面板的制备方法。
本发明所述显示面板，包括：基板以及依次层叠于所述基板上的平坦层、阳极层、像素定义层、阴极层和封装层；在显示面板的显示区域外，所述像素定义层包括设置在所述阳极层上的挡墙组，所述挡墙组包括靠近显示面板的显示区域的第一侧、远离显示面板的显示区域的第二侧以及位于所述第一侧和所述第二侧之间的多个间隔设置的子挡墙，多个间隔设置的所述子挡墙的间隙处形成路径，所述路径的长度大于所述第一侧到所述第二侧的直线距离。
其中，所述子挡墙是设置在所述阳极层上的凸起，所述凸起的高度为5μm～15μm。
其中，所述阳极层上设有多个贯穿所述阳极层且间隔设置的阳极孔，所述子挡墙对应设置在所述阳极孔内并凸出所述阳极层，所述子挡墙穿过所述阳极层且连接所述平坦层和所述阴极层。
其中，所述子挡墙包括第一子挡墙和第二子挡墙，所述第一子挡墙沿垂直于所述第一侧到所述第二侧的延伸方向间隔排列，每两个所述第一子挡墙的间隔是第一间距，所述第二子挡墙沿垂直于所述第一侧到所述第二侧的延伸方向间隔排列，每两个所述第一子挡墙之间的间隔对应设置有一个所述第二子挡墙，所述第二子挡墙的宽度大于或等于所述第一间距的宽度。
其中，所述子挡墙还包括靠近所述第二侧设置的至少一个第三子挡墙，所述第三子挡墙的宽度大于所述第一子挡墙和所述第二子挡墙的宽度。
其中，所述像素定义层在所述挡墙组远离所述显示面板的显示区域的一侧包括边缘挡墙，所述边缘挡墙与所述挡墙组间隔设置。
其中，所述像素定义层上层叠有间隔层，每一所述子挡墙包括第一部分和层叠于所述第一部分上的第二部分，所述第一部分与所述像素定义层同层设置，所述第二部分与所述间隔层同层设置。
本发明所述显示面板的制备方法，用于制备上述显示面板，包括：
在基板上形成平坦层；
在所述基板和所述平坦层上形成阳极层；
在所述阳极层和所述平坦层上形成像素定义层，在显示面板的显示区域外的像素定义层包括挡墙组，所述挡墙组包括多个间隔设置的子挡墙，所述挡墙组包括靠近显示面板的显示区域的第一侧和远离显示区域的第二侧，多个间隔 设置的所述子挡墙的间隙处形成路径，所述路径的长度大于所述第一侧到所述第二侧的直线距离；
在所述像素定义层和所述挡墙组上形成阴极层；
在所述阴极层上形成封装层。
其中，在所述基板和所述平坦层上形成阳极层的步骤包括：
在所述基板和平坦层上涂布金属层，图案化所述金属层形成阳极层，并在显示面板的显示区域外形成贯穿所述阳极层且间隔设置的阳极孔；
在所述阳极层和所述平坦层上形成像素定义层，在显示面板的显示区域外的像素定义层包括挡墙组，所述挡墙组包括多个间隔设置的子挡墙的步骤包括：
在所述阳极层和平坦层上涂布像素材料层，图案化所述像素材料层形成像素定义层，其中，在显示面板的显示区域外的像素材料层图案化形成挡墙组，所述挡墙组中的子挡墙对应设置在所述阳极孔内并凸出所述阳极层。
本发明所述显示装置，包括上述显示面板。
本发明所述显示面板在显示面板的边缘区域内的平坦层上形成交错间隔排列的子挡墙，增加了有机层材料在显示面板表面的扩散路径，从而控制有机层材料的扩散速率和扩散范围，减少了显示面板边缘的挡墙数目，减少了显示面板的边界面积，提高了显示面板的屏占比。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是现有显示面板的显示区域外的平面结构示意图。
图2是本发明所述的显示面板的剖面图。
图3是图2所示显示面板第一种实施例的平面结构示意图。
图4是图2所示显示面板的部分结构示意图。
图5是图2所述显示面板显示区域外阳极孔的分布结构示意图。
图6是图2所示显示面板第二种实施例的平面结构示意图。
图7是图2所示显示面板第三种实施例的平面结构示意图。
图8是图2所示显示面板第四种实施例的平面结构示意图。
图9是本发明所述显示面板制备方法的流程图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图2和图3，本发明提供一种显示面板，所述显示面板具体为有源矩阵有机发光二极体面板(AMOLED，Active Matrix/Organic Light Emitting Diode)，所述显示面板100包括显示区域101和边缘区域102，所述边缘区域102是指显示面板100的显示区域102外的区域。所述显示面板100包括基板10以及依次层叠于所述基板10上的平坦层20、阳极层31、像素定义层32、阴极层33和封装层40。在显示面板100的显示区域101外，所述像素定义层32包括设置在所述阳极层31上的挡墙组，所述挡墙组包括多个间隔设置的子挡墙50，所述挡墙组包括靠近显示面板100显示区域101的第一侧501和远离显示面板100的显示区域101的第二侧502，多个间隔设置的所述子挡墙50的间隙处形成路径，所述路径的长度大于所述第一侧501到所述第二侧502的直线距离，以延长封装时有机材料流向边缘区域102的流通路径，从而有效控制有机材料的扩散速率和扩散范围。其中，所述基板10包括由聚酰亚胺(PI，Polyimide)制成的柔性基底11和层叠于所述柔性基底11上的薄膜晶体管层12。所述挡墙组的第一侧501和所述第二侧502相对且平行设置，且均垂直于所述显示区域101到所述边缘区域102的延伸方向。多个所述子挡墙50形成的路径不包括所述第一侧501到所述第二侧502的直线距离。
本发明所述显示面板在显示区域外的平坦层上形成多个间隔错开排列的子挡墙，多个所述子挡墙的间隙处形成路径，当对显示面板进行封装时，所述封装层中的有机材料从显示区域扩散到边缘区域时，所述有机材料沿所述子挡 墙的间隙形成的路径扩散，相比于传统显示面板中有机层沿直线扩散，本发明所述显示面板中有机层的流通路径的长度增加，能够有效控制有机层的扩散速率和扩散范围，减少扩散到边缘区域最外侧的有机材料的量，减小边缘区域内阻挡有机材料的挡墙的数量，从而减小显示面板边缘区域的面积，提高显示面板的屏占比。
本发明中，所述封装层40由第一无机层41、覆盖所述第一无机层41的有机层42和位于所述有机层42上的第二无机层43组成。通常，所述封装层由无机层、有机层和无机层交错堆叠形成，可以为3层或5层。其中，所述无机层是用SiOx、SiNx或者其它无机材料的组合，所述有机层是利用喷墨打印(IJP，Inject Printer)技术在两层无机层之间均匀涂布一种可以阻隔水气的溶融状材料(以下简称Ink)而形成，能够使显示面板的表面平坦化且增加显示面板的弯折性。所述封装层40层叠于所述阴极层33上，用于封装显示面板防止所述显示面板受到水分和氧气的侵蚀。
一并参阅图4，所述子挡墙50是设置在所述阳极层31上的凸起，所述凸起的高度为5μm～15μm，用于控制Ink的扩散速率和扩散范围。其中，所述子挡墙50包括第一子挡墙51和第二子挡墙52。所述第一子挡墙51沿垂直于所述第一侧501到所述第二侧502的延伸方向间隔排列，每两个所述第一子挡墙51的间隔是第一间距511，所述第二子挡墙52沿垂直于所述第一侧501到所述第二侧502的延伸方向间隔排列，每两个所述第一子挡墙51之间的间隔对应设置有一个所述第二子挡墙52，所述第二子挡墙52的宽度大于或等于所述第一间距511的宽度。具体的，沿垂直于所述第一侧501到所述第二侧502的方向上，多个第一子挡墙51形成多个第一子挡墙组，多个所述第二子挡墙52形成多个第二子挡墙组；沿所述第一侧501到所述第二侧502的延伸方向上，多个所述第一子挡墙组和多个所述第二子挡墙组间隔设置。
一并参阅图5，所述阳极层31上开设有多个贯穿所述阳极层31且间隔设置的阳极孔311，所述子挡墙50对应设置于所述阳极孔311内并凸出所述阳极层31，所述子挡墙50穿过所述阳极层31且连接所述平坦层20和所述阴极层33。在所述显示面板100的显示区域101外，所述阳极孔311包括第一阳极孔312和第二阳极孔313。多个所述第一阳极孔312沿图示Y轴方向上间隔排列，每两个所述第一阳极孔312之间的间隙3121对应设置有一个所述第二 阳极孔313，所述第二阳极孔313的宽度大于或等于所述间隙3122的宽度。本发明中，将沿图示Y轴方向上第一阳极孔312和第二阳极孔313的宽度定义为X1，第一阳极孔312和第二阳极孔313之间间隔的宽度定义为X2；将沿图示X轴方向上，第一阳极孔312的宽度定义为Y1，相邻两个第一阳极孔312之间间隔的宽度定义为Y2，相邻两个第二阳极孔313之间间隔的宽度定义为Y3，第二阳极孔313的宽度定义为Y4，第一阳极孔312与第二阳极孔313沿X轴方向的错位宽度定义为Y5，其中，Y2＝αY1，Y3＝βY4，Y5＝γY4，X2＝δX1，且α、β、γ、δ＝0.1～0.3，则有Y2＜Y4，Y3＜Y1，Y2+2Y1＝Y4+2(Y3+Y5)，可得Y4＝[(2β+2γ+1)/(α+2)]Y1，则可以确定本发明中所述阳极层31上阳极孔组311的两种孔密度系数值，分别为Y2/(Y1+Y2)和Y3/(Y4+Y3)。
具体的，子挡墙50与阳极孔311一一对应，第一子挡墙51位于第一阳极孔312内，第二子挡墙52位于第二阳极孔313内，当阳极孔311的尺寸发生变化时，子挡墙50的尺寸也会相应发生变化时，多个间隔设置的子挡墙50的间隙处形成的路径就会不同，对有机材料的扩散速率和扩散范围的控制程度也就会不同。复参图3，在本发明第一种实施例中，第一子挡墙51和第二子挡墙52的大小相同，也就是说，所述第一阳极孔312与所述第二阳极孔313的尺寸相同。从图3中可以看出，Ink从一组第一子挡墙组中两个所述第一子挡墙51的第一间距511中流向与一组第二子挡墙组中两个所述第二子挡墙52的间隙，再流向另外一组第一子挡墙组的第一间距511中，与图1相比，Ink的扩散路径明显增长，且随着Ink从第一侧501向第二侧502的不断扩散，Ink的扩散速率逐渐减小。在显示面板100的显示区域101外，所述像素定义层32在所述挡墙组远离显示面板100的显示区域101的一侧包括边缘挡墙60，所述边缘挡墙60与所述挡墙组间隔设置，限制从所述挡墙组流出的Ink的扩散范围，减少了传统显示面板边缘处挡墙的数目，进而减少了边缘区域102的面积，提高了屏占比。其中，所述边缘挡墙60穿过所述阳极层31且连接所述平坦层20和封装层40。本实施例中，Ink在挡墙组中沿Y轴方向的一种扩散路径如图3的虚线所示。
如图6所示，在本发明第二种实施例中，与第一种实施例不同之处在于，第一子挡墙51的尺寸小于第二子挡墙52的尺寸，也就是说，第一阳极孔312的尺寸小于所述第二阳极孔313的尺寸。同样的，Ink在间隔设置的子挡墙50 形成的路径中流通，与图1相比，Ink的扩散路径明显增长，能够有效地控制有机层42的扩散速率，在显示面板100的显示区域101外，所述像素定义层32在所述挡墙组远离显示面板100的显示区域101的一侧的边缘挡墙60限制了从所述挡墙组流出的Ink的扩散范围，减少了传统显示面板边缘处挡墙的数目，从而减少了边缘区域102的面积，提高了显示面板的屏占比。本实施例中，Ink在挡墙组中沿Y轴方向的一种扩散路径如图6的虚线所示。
在本发明的其他实施例中，与上述两种实施例不同之处在于，所述子挡墙50包括至少一个第三子挡墙53，所述第三子挡墙53穿过所述阳极层31连接所述平坦层20和所述阴极层33，垂直于所述第一侧501到第二侧的延伸方向上，所述第三子挡墙53的宽度大于所述第一子挡墙51和第二子挡墙52的宽度。也就是说，所述阳极孔311包括至少一个第三阳极孔，沿图示X轴方向上，所述第三阳极孔的宽度大于所述第一阳极孔312和第二阳极孔313的宽度。
如图7所示，在本发明的第三种实施例中，所述子挡墙50包括一个第三子挡墙53，所述第三子挡墙53为一整条挡墙，完全挡住从所述第一子挡墙51和所述第二子挡墙52中流出的Ink，直接完全省去了传统显示面板边缘区域内的边缘挡墙，大大减少了边缘区域102的面积，显示屏占比进一步提高。本实施方式中，Ink在挡墙组中沿Y轴方向的一种扩散路径如图7的虚线所示。
如图8所示，在本发明的第四种实施例中，所述子挡墙50包括多个第三子挡墙53，沿垂直于所述第一侧501到所述第二侧的延伸52方向上，多个所述第三子挡墙53间隔排列，每一所述第三子挡墙53的宽度等于三个所述第一子挡墙51的宽度和两个所述第一间隔511的宽度之和。多个所述第三子挡墙53的设置进一步阻挡了从所述第一子挡墙51和所述第二子挡墙52中流出的Ink，使得Ink的流通路径进一步增加，更有利于控制Ink的扩散速率和扩散范围，且多个所述第三子挡墙的设置有利于提高显示面板的显示柔性，减小显示面板的弯曲半径。
具体的，所述挡墙组中的每一所述子挡墙50与所述像素定义层32同一工艺形成。可以理解的是，所述像素定义层32上还层叠有间隔层，每一所述子挡墙包括第一部分和层叠于所述第一部分上的第二部分，所述第一部分与所述像素定义层32同一工艺形成，所述第二部分与所述间隔层同一工艺形成。在 形成像素定义层和/或间隔层的同时形成每一所述子挡墙节省了显示面板的制造成本，提高了产品的竞争力。
如图7所示，本发明还提供一种显示面板的制备方法，用于制备上述显示面板，包括：
步骤S1，在基板10上形成平坦层20。所述基板10包括由聚酰亚胺(PI，Polyimide)制成的柔性基底11和层叠于所述柔性基底11上的薄膜晶体管层12。
步骤S2，在所述基板10和所述平坦层20上形成阳极层31。具体的，在所述基板10和平坦层20上涂布金属层，图案化所述金属层形成阳极层31，并在显示面板100的显示区域101外形成贯穿所述阳极层31且间隔设置的阳极孔311。所述图案化工艺包括涂布、光罩、蚀刻和显影等技术。
步骤S3，在所述阳极层31和所述平坦层20上形成像素定义层32。在显示面板100的显示区域101外的像素定义层32包括挡墙组，所述挡墙组包括多个间隔设置的子挡墙50，所述挡墙组包括靠近显示面板100的显示区域101的第一侧501和远离显示区域101的第二侧502，多个间隔设置的所述子挡墙50的间隙处形成路径，所述路径的长度大于所述第一侧501到所述第二侧502的直线距离。具体的，在所述阳极层31和所述平坦层20上涂布像素材料层，图案化所述像素材料层以形成像素定义层32，其中，在显示面板100的显示区域101外的像素材料层图案化形成挡墙组，所述挡墙组中的子挡墙50对应设置在所述阳极孔311内并凸出所述阳极层31。
步骤S4，在所述像素定义层32和所述挡墙组上形成阴极层33。具体的，在所述像素定义层32和每一所述子挡墙50的表面上涂布金属层以形成阴极层33。
步骤S5，在所述阴极层33上形成封装层40。本实施例中，所述封装层40由第一无机层41、覆盖所述第一无机层41的有机层42和位于所述有机层42上的第二无机层43组成。所述封装层40层叠于所述阴极层33上，用于封装所述显示面板防止所述显示面板受到水分和氧气的侵蚀。
本发明还提供一种显示面板的制备方法，与上述显示面板的制备方法不同之处在于，在所述阳极层31和所述平坦层20上形成像素定义层32的步骤中， 具体包括：在所述阳极层31和所述平坦层20上涂布像素材料层，图案化所述像素材料层以形成像素定义层32和位于每一所述阳极孔311内的每一所述子挡墙50的第一部分，再在所述像素定义层32和每一所述子挡墙50的第一部分上涂布阻隔材料层，图案化所述阻隔材料层以形成阻隔层和层叠于所述子挡墙50的第一部分上每一子挡墙50的第二部分。本方法通过形成像素定义层31和阻隔层的同时形成每一所述子挡墙50，不需要增加额外工艺，不增加制作成本。其中，图案化所述像素材料层32和阻隔材料层以形成每一所述子挡墙50的第一部分和第二部分采用蚀刻的方式。
本发明还提供一种显示装置，所述显示装置包括上述显示面板。
本发明所述显示面板的制备方法通过在边缘区域的阳极层上开设阳极孔，在阳极孔的大小、位置以及密度等方面进行优化，在阳极孔上形成交错排布的子挡墙来控制封装层中有机层材料的扩散速率和扩散范围，减少了边缘区域挡墙的数目，从而减少了显示面板边缘区域的面积，提高了显示面板的屏占比。
以上所揭露的仅为本发明较佳实施例而已，当然不能以此来限定本发明之权利范围，本领域普通技术人员可以理解实现上述实施例的全部或部分流程，并依本发明权利要求所作的等同变化，仍属于发明所涵盖的范围。

Claims (20)

  1. 一种显示面板，其特征在于，包括：基板以及依次层叠于所述基板上的平坦层、阳极层、像素定义层、阴极层和封装层；在显示面板的显示区域外，所述像素定义层包括设置在所述阳极层上的挡墙组，所述挡墙组包括多个间隔设置的子挡墙，所述挡墙组包括靠近显示面板的显示区域的第一侧和远离显示区域的第二侧，多个间隔设置的所述子挡墙的间隙处形成路径，所述路径的长度大于所述第一侧到所述第二侧的直线距离。
  2. 如权利要求1所述的显示面板，其特征在于，所述子挡墙是设置在所述阳极层上的凸起，所述凸起的高度为5μm～15μm。
  3. 如权利要求2所述的显示面板，其特征在于，所述阳极层上设有多个贯穿所述阳极层且间隔设置的阳极孔，所述子挡墙对应设置在所述阳极孔内并凸出所述阳极层，所述子挡墙穿过所述阳极层且连接所述平坦层和所述阴极层。
  4. 如权利要求1所述的显示面板，其特征在于，所述子挡墙包括第一子挡墙和第二子挡墙，所述第一子挡墙沿垂直于所述第一侧到所述第二侧的延伸方向间隔排列，每两个所述第一子挡墙的间隔是第一间距，所述第二子挡墙沿垂直于所述第一侧到所述第二侧的延伸方向间隔排列，每两个所述第一子挡墙之间的间隔对应设置有一个所述第二子挡墙，所述第二子挡墙的宽度大于或等于所述第一间距的宽度。
  5. 如权利要求4所述的显示面板，其特征在于，所述子挡墙还包括靠近所述第二侧设置的至少一个第三子挡墙，所述第三子挡墙的宽度大于所述第一子挡墙和所述第二子挡墙的宽度之和。
  6. 如权利要求4所述的显示面板，其特征在于，所述像素定义层在所述挡墙组远离所述显示面板的显示区域的一侧包括边缘挡墙，所述边缘挡墙与所述挡墙组间隔设置。
  7. 如权利要求1所述的显示面板，其特征在于，所述像素定义层上层叠有间隔层，每一所述子挡墙包括第一部分和层叠于所述第一部分上的第二部分，所述第一部分与所述像素定义层同层设置，所述第二部分与所述间隔层同 层设置。
  8. 如权利要求2所述的显示面板，其特征在于，所述像素定义层上层叠有间隔层，每一所述子挡墙包括第一部分和层叠于所述第一部分上的第二部分，所述第一部分与所述像素定义层同层设置，所述第二部分与所述间隔层同层设置。
  9. 如权利要求3所述的显示面板，其特征在于，所述像素定义层上层叠有间隔层，每一所述子挡墙包括第一部分和层叠于所述第一部分上的第二部分，所述第一部分与所述像素定义层同层设置，所述第二部分与所述间隔层同层设置。
  10. 如权利要求4所述的显示面板，其特征在于，所述像素定义层上层叠有间隔层，每一所述子挡墙包括第一部分和层叠于所述第一部分上的第二部分，所述第一部分与所述像素定义层同层设置，所述第二部分与所述间隔层同层设置。
  11. 如权利要求5所述的显示面板，其特征在于，所述像素定义层上层叠有间隔层，每一所述子挡墙包括第一部分和层叠于所述第一部分上的第二部分，所述第一部分与所述像素定义层同层设置，所述第二部分与所述间隔层同层设置。
  12. 如权利要求6所述的显示面板，其特征在于，所述像素定义层上层叠有间隔层，每一所述子挡墙包括第一部分和层叠于所述第一部分上的第二部分，所述第一部分与所述像素定义层同层设置，所述第二部分与所述间隔层同层设置。
  13. 一种显示面板的制备方法，其特征在于，包括：
    在基板上形成平坦层；
    在所述基板和所述平坦层上形成阳极层；
    在所述阳极层和所述平坦层上形成像素定义层，在显示面板的显示区域外的像素定义层包括挡墙组，所述挡墙组包括多个间隔设置的子挡墙，所述挡墙组包括靠近显示面板的显示区域的第一侧和远离显示区域的第二侧，多个间隔设置的所述子挡墙的间隙处形成路径，所述路径的长度大于所述第一侧到所述第二侧的直线距离；
    在所述像素定义层和所述挡墙组上形成阴极层；
    在所述阴极层上形成封装层。
  14. 如权利要求13所述的显示面板的制备方法，其特征在于，在所述基板和所述平坦层上形成阳极层的步骤包括：
    在所述基板和平坦层上涂布金属层，图案化所述金属层形成阳极层，并在显示面板的显示区域外形成贯穿所述阳极层且间隔设置的阳极孔；
    在所述阳极层和所述平坦层上形成像素定义层，在显示面板的显示区域外的像素定义层包括挡墙组，所述挡墙组包括多个间隔设置的子挡墙的步骤包括：
    在所述阳极层和所述平坦层上涂布像素材料层，图案化所述像素材料层形成像素定义层，其中，在显示面板的显示区域外的像素材料层图案化形成挡墙组，所述挡墙组的子挡墙对应设置在所述阳极孔内并凸出所述阳极层。
  15. 一种显示装置，其特征在于，包括如权利要求1所述的显示面板，所述显示面板包括基板以及依次层叠于所述基板上的平坦层、阳极层、像素定义层、阴极层和封装层；在显示面板的显示区域外，所述像素定义层包括设置在所述阳极层上的挡墙组，所述挡墙组包括多个间隔设置的子挡墙，所述挡墙组包括靠近显示面板的显示区域的第一侧和远离显示区域的第二侧，多个间隔设置的所述子挡墙的间隙处形成路径，所述路径的长度大于所述第一侧到所述第二侧的直线距离。
  16. 如权利要求15所述的显示装置，其特征在于，所述子挡墙是设置在所述阳极层上的凸起，所述凸起的高度为5μm～15μm。
  17. 如权利要求16所述的显示装置，其特征在于，所述阳极层上设有多个贯穿所述阳极层且间隔设置的阳极孔，所述子挡墙对应设置在所述阳极孔内并凸出所述阳极层，所述子挡墙穿过所述阳极层且连接所述平坦层和所述阴极层。
  18. 如权利要求15所述的显示装置，其特征在于，所述子挡墙包括第一子挡墙和第二子挡墙，所述第一子挡墙沿垂直于所述第一侧到所述第二侧的延伸方向间隔排列，每两个所述第一子挡墙的间隔是第一间距，所述第二子挡墙沿垂直于所述第一侧到所述第二侧的延伸方向间隔排列，每两个所述第一子挡 墙之间的间隔对应设置有一个所述第二子挡墙，所述第二子挡墙的宽度大于或等于所述第一间距的宽度。
  19. 如权利要求18所述的显示装置，其特征在于，所述子挡墙还包括靠近所述第二侧设置的至少一个第三子挡墙，所述第三子挡墙的宽度大于所述第一子挡墙和所述第二子挡墙的宽度之和。
  20. 如权利要求18所述的显示装置，其特征在于，所述像素定义层在所述挡墙组远离所述显示面板的显示区域的一侧包括边缘挡墙，所述边缘挡墙与所述挡墙组间隔设置。
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