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Definitions

• the invention relates to a plastic inorganic semiconductor material and a preparation method thereof, and belongs to the field of semiconductor materials.
• flexible semiconductor chips which are the core processing devices of flexible electronic products, are becoming more and more research hotspots of various research institutions and companies.
• flexible semiconductor chips have two technical routes. One is to use organic semiconductors as substrates. Because organic substances have certain deformability, chip components made by controlling N-type and P-type are also used. Can withstand a certain amount of deformation; but this route due to the lower mobility of organic semiconductors, the device performance is greatly limited; at the same time, organic semiconductor materials are also highly susceptible to oxygen and humidity, resulting in the reliability of semiconductor devices There are serious problems (Park S K, Jackson T N, Anthony J E, et al.
• an object of the present invention is to provide a material which can withstand a certain deformation like an organic material and which has excellent semiconductor properties with adjustable electrical properties, thereby realizing the preparation of an efficient flexible semiconductor device.
• the present invention provides an inorganic semiconductor material having electrical properties capable of plastic deformation, comprising a fluorite-based compound represented by the following formula (I):
• X is at least one of Cu, Au, Fe, Co, Ni, Zn, Ti, V;
• Y is at least one of N, P, As, Sb, Se, Te, O, Br, Cl, I, and F.
• the inorganic semiconductor material of the invention has very strong plastic deformation ability under compression, tensile and bending stress, in addition to the electrical properties of the semiconductor with adjustable electrical properties, and can meet the requirements of the flexible electronic device for the deformable semiconductor material. It can provide a new solution for a new generation of flexible semiconductor devices.
• the band gap of the inorganic semiconductor material can be adjusted in the range of 0.5 to 1.5 eV, and the conductivity can be from 0.001 to 250,000 Adjust within the S/m range.
• the inorganic semiconductor material can withstand tensile deformation of 3% or more, bending deformation of 13% or more, and compression deformation of 30% or more.
• 0 ⁇ ⁇ ⁇ 0.05, and 0 ⁇ ⁇ ⁇ 0.05 Preferably, 0 ⁇ ⁇ ⁇ 0.05, and 0 ⁇ ⁇ ⁇ 0.05.
• the semiconductor material can be a single crystal.
• the semiconductor material can also be polycrystalline.
• the crystallite size of the polycrystal may be between 1 ⁇ m and 5 mm, and the density may be above 95%.
• the present invention provides a method of preparing the above inorganic semiconductor material, comprising the steps of:
• the raw material Under inert gas or in a vacuum, the raw material is kept at a stoichiometric ratio of the formula (I) at 850 to 1200 ° C for 1 to 20 hours to form a uniformly mixed melt of the raw material, followed by cooling to obtain a bulk solid;
• the obtained bulk solid is obtained by a powder-sintering process to obtain a polycrystalline material or grown by a ruthenium dropping method to obtain a single crystal material.
• the invention has simple process, easy control and good industrialization prospect.
• the cooling further comprises an annealing step, preferably, the annealing temperature is 400 to 650 ° C, and the annealing time is 1 to 300 hours.
• the sintering is spark plasma sintering or hot press sintering, and preferably, the sintering temperature is 100 to 400 ° C, the pressure is 10 to 100 MPa, and the sintering time is 5 to 120 minutes.
• the method of reducing the flaw comprises:
• the crucible containing the bulk solid is placed in a constant temperature zone of the crystal falling furnace, and the temperature in the constant temperature zone is 830 ° C to 950 ° C;
• the crucible is lowered at a falling speed of 0.1 mm/h to 10 mm/h, and the temperature gradient is controlled to be 1 ° C/cm to 100 ° C/cm.
• the plastic semiconductor material of the present invention can withstand a certain deformation like an organic material, and also has excellent semiconductor properties with adjustable electrical properties, thereby realizing the preparation of an efficient flexible semiconductor device.
• Fig. 1 FESEM (field emission scanning electron microscopy) photograph of the fracture of Ag 2- ⁇ X ⁇ S 1- ⁇ Y ⁇ material obtained in Example 1, with a grain size of 5 to 10 ⁇ m.
• FIG. 2 Spectral data of the Ag 2- ⁇ X ⁇ S 1- ⁇ Y ⁇ material obtained in Examples 1-4.
• Figure 3 Conductivity of semiconductor materials in Examples 1 and 2 as a function of temperature. With the increase of temperature, the conductivity is obviously improved, showing typical semiconductor characteristics. With the increase of doping composition, the conductivity of Ag 1.8 Cu 0.2 S 0.9 Se 0.1 material is nearly two orders of magnitude higher than that of the substrate.
• Figure 4 Stress-strain curves for the bending test of semiconductor materials in Examples 1 and 2.
• Figure 5 Stress-strain curves for compression testing of semiconductor materials in Examples 1 and 2.
• Figure 6 Tensile test stress-strain curves for semiconductor materials in Examples 1 and 2.
• Figure 7 Process flow diagram for preparing an embodiment of a polycrystalline plastic semiconductor material.
• Figure 8 Process flow diagram for preparing an embodiment of a single crystal plastic semiconductor material.
• Figure 9 Schematic diagram of the crystal growth tube with a pointed tip at the top.
• Fig. 10 is a photograph showing the physical ingot of the Ag 2 S semiconductor material obtained in Example 2.
• Figure 11 A plot of conductivity versus temperature for samples obtained in Examples 3 and 4.
• Figure 12 Stress-strain graph of the bending test of the samples obtained in Examples 3 and 4.
• the inventors of the present invention have developed an inorganic semiconductor material having plastic deformation ability and a preparation method thereof for the deficiency of the existing semiconductor materials, thereby improving the semiconductor material to resist deformation and brittleness. characteristic.
• the present disclosure provides a semiconductor material that is mainly composed of a pyrite semiconductor compound.
• the semiconductor material comprises a fluorite-based chemical formula represented by the following formula (I);
• X may be any one or a combination of Cu, Au, Fe, Co, Ni, Zn, Ti, and V.
• Y may be any one or a combination of N, P, As, Sb, Se, Te, O, Br, Cl, I, and F.
• the inventors of the present invention have found for the first time that Ag 2 S has plastic properties, and can obtain a variety of deformable semiconductor devices by utilizing its unique deformable plasticity and electrically adjustable properties over a wide range.
• X may be any one or a combination of Cu, Zn, Ni.
• Y may be any one or a combination of Se, Te, Cl, Br, I.
• 0 ⁇ ⁇ ⁇ 0.5 Preferably, 0 ⁇ ⁇ ⁇ 0.5. In a preferred example, 0 ⁇ ⁇ ⁇ 0.05. 5 ⁇ In another preferred example, 0.1 ⁇ ⁇ ⁇ 0.
• 0 ⁇ ⁇ ⁇ 0.5 In the formula, 0 ⁇ ⁇ ⁇ 0.5. Preferably, 0 ⁇ ⁇ ⁇ 0.5. In a preferred example, 0 ⁇ ⁇ ⁇ 0.05. In another preferred example, 0.1 ⁇ ⁇ ⁇ 0.5.
• 0.1 ⁇ ⁇ ⁇ 0.5, 0.1 ⁇ ⁇ ⁇ 0.5 In another preferred embodiment, 0.1 ⁇ ⁇ ⁇ 0.5, 0.1 ⁇ ⁇ ⁇ 0.5.
• the crystal structure of the semiconductor material exhibits a layer-like structure. That is to say, the doping atoms X and Y can be uniformly distributed at the corresponding lattice points, and the layered structure of the fluorite ore itself is not affected.
• the semiconductor material can be a single crystal material (or "single crystal").
• single crystal material means that the monolithic material is composed of a single crystal grain.
• the semiconductor material may also be a polycrystalline material (or "polycrystalline").
• polycrystalline material means that the whole object is composed of many small crystals arranged in disorder.
• the polycrystalline material may have a grain size between 1 ⁇ m and 5 mm.
• the polycrystalline material may have a density of more than 95%, or even more than 98%. Polycrystalline materials are easier to prepare while maintaining good plasticity and other properties.
• the semiconductor material may be an N-type doped semiconductor material or a P-type doped semiconductor material.
• the content of other impurities in the semiconductor material is below 1 at%.
• the band gap of the semiconductor material can be adjusted in the range of 0.5 to 1.5 eV, preferably in the range of 0.5 to 1.2 eV.
• the semiconductor material may have a conductivity of 0.001 to 250,000 Adjusted within the S/m range, preferably between 0.01 and 1000 The adjustment is in the range of S/m, more preferably in the range of 1 to 1000 S/m.
• the semiconductor material has good plasticity. For example, it can withstand 3% or more of tensile deformation; 13% or more and even 20% or more of bending deformation and 30% or more of compression deformation.
• the semiconductor materials disclosed herein are capable of withstanding certain deformations like organic materials, and also have excellent semiconductor electrical transmission properties, thereby realizing the preparation of highly efficient flexible semiconductor devices.
• Fig. 7 shows a process flow for preparing a plastic semiconductor polycrystalline material in the first embodiment.
• a raw material e.g., an ingot
• a solid phase reaction e.g., a solid phase reaction
• the raw material to be used may be a simple raw material of a constituent element of the formula (1) or a compound raw material between the elements.
• the raw material is preferably high purity, for example, having a purity of 99% or more.
• the form of the raw material is not particularly limited and may be in the form of a block, a powder or a sheet.
• the ratio of the raw materials can be in the stoichiometric ratio of the formula (1).
• the raw materials are mixed and melted to obtain a molten mixture.
• the raw materials are mixed and then heated to 850 to 1200 ° C to melt the raw materials. It can be kept at this temperature for 1 to 20 hours.
• the rate of temperature increase can be from 0.5 to 3 ° C / min.
• the material is encapsulated in a sealed container for melting.
• the sealed container can be a quartz tube.
• the sealed container can be either a common tubular shape or a crystal growth tube with a pointed tip at the top.
• a uniform carbon film may be applied to the inner wall of the quartz tube, or the raw material may be placed in a graphite crucible and then placed in a quartz tube for encapsulation.
• the atmosphere at the time of melting may be an inert atmosphere or a vacuum.
• the degree of vacuum may be from 0.1 to 40,000 Pa, preferably from 0.1 to 1,000 Pa.
• the resulting molten mixture was cooled to give a solid.
• the cooling method may be quenching or slow cooling using a quenching medium.
• the quenching medium can be air, water, saturated brine, oil, or liquid nitrogen.
• the bulk solid can also be annealed to make the doping of the components more uniform and to enhance the crystallinity of the material.
• the annealing temperature may be from 400 to 650 ° C, preferably from 550 to 650 ° C.
• the annealing time may be from 1 to 300 hours, preferably from 200 to 300 hours.
• the block solid is ground to a powder.
• the powder may have a particle size of from 1 to 100 microns.
• the powder is sintered to obtain a polycrystalline material.
• the sintering method may be pressure sintering, such as discharge plasma sintering or hot pressing sintering.
• the sintering temperature may be from 100 to 400 ° C, preferably from 200 to 300 ° C.
• the applied pressure may be from 10 to 100 MPa, preferably from 30 to 60 MPa.
• the sintering time may be from 5 to 120 minutes, preferably from 5 to 30 minutes.
• Fig. 8 shows a process flow for preparing a single crystal plastic semiconductor material in the second embodiment.
• a raw material e.g., an ingot
• This step can be the same as that of the first embodiment, and details are not described herein again.
• a single crystal material is prepared from the bulk solid.
• the single crystal semiconductor material is grown by a helium descent method.
• the resulting bulk solid was placed in a crystal growth tube with a pointed tip (see Figure 9).
• the crystal growth tube may be, for example, a quartz tube.
• a crystal growth tube having a tip end may be used as a sealed container in the preparation of the bulk solid (that is, a pointed crystal growth tube is used before the initial melting). This eliminates the need to remove the bulk solids and place them in the crystal growth tube.
• the crystal growth tube containing the bulk solid is placed in a constant temperature zone of the crystal reduction furnace.
• the temperature in the constant temperature zone can be from 830 ° C to 950 ° C.
• the temperature gradient under the constant temperature zone may be from 1 ° C/cm to 100 ° C/cm, preferably from 1 ° C/cm to 5 ° C/cm.
• the enthalpy falling speed may be from 0.1 mm/h to 10 mm/h, preferably from 0.1 mm/h to 1 mm/h.
• the obtained single crystal semiconductor material may have a diameter of 1 mm to a diameter of 50 mm and a height of 5 mm to 50 mm.
• the semiconductor materials of the present disclosure can be used to fabricate flexible semiconductor devices, such as flexible semiconductor chips and the like.
• the preparation method of the present disclosure is controllable and suitable for mass industrial production.
• the elemental raw materials Ag, Cu, S, Se were compounded in a glove box according to a molar ratio of 1.8:0.2:0.9:0.1, and the raw materials were sealed in a quartz tube on which an inner wall was vapor-deposited with a carbon film, and an argon plasma flame was taken while evacuating the vacuum.
• the quartz tube is filled with a small amount of Ar gas protection.
• the mixed raw materials were heated to 900 ° C at a rate of 3 ° C per minute for 12 hours. After the melting is completed, quenching is performed, and the quenching medium is brine.
• the quenched crystal rod was annealed together with a quartz tube at 500 ° C for 100 hours, and the block was ground into a fine powder and then subjected to spark plasma sintering at a sintering temperature of 400 ° C, a holding time of 2 minutes, and a pressure of 30 MPa.
• Fig. 1 shows a FESEM (field emission scanning electron microscope) photograph of the fracture of the Ag 2- ⁇ X ⁇ S 1- ⁇ Y ⁇ material obtained in Example 1, and it can be seen that the grain size is from 5 ⁇ m to 10 ⁇ m.
• the band gap was 0.73 eV as measured by spectral absorption method (see Figure 2).
• the room temperature conductivity was 20 S/m as measured by the four-probe method (see Figure 3).
• the bending stress-strain curve was tested by a three-point bending method.
• the sample size was 4 mm ⁇ 4 mm ⁇ 30 mm, and the maximum bending deformation was 15%.
• the room temperature compression deformation sample size was 20 mm in diameter ⁇ 20 mm in height, and the maximum compression deformation amount was 40%.
• the sample size was dumbbell-shaped with a neck size of 5 mm x 30 mm and a maximum elongation of 3.2% (see Figures 4-6).
• the elemental raw materials Ag and S were compounded in a glove box at a molar ratio of 2:1, and the raw material was sealed into a pointed quartz-shaped quartz crucible at the bottom. The vacuum was taken while encapsulating with an argon plasma flame, and the quartz tube was filled with a small amount of Ar gas. .
• the mixed raw materials were melted at 1000 ° C for 12 hours to cool.
• the quartz tube is placed in a crystal drop furnace.
• the temperature in the constant temperature zone is 830 ° C
• the temperature gradient is 2 ° C / cm
• the enthalpy drop rate is 1 mm / h.
• the crystal ingot of Ag 2 S semiconductor material is obtained. .
• the band gap was 0.90 eV (see Figure 2).
• the material obtained in Example 2 was tested to have a room temperature conductivity of 0.15 S/m.
• the test results of room temperature mechanical properties show that the material has good plasticity, the maximum bending deformation is 20%, the compression deformation is 50%, and the tensile elongation is 4.2% (see Figure 4-6).
• the elemental raw materials Ag, Zn, S, I were compounded in a glove box according to a molar ratio of 1.9:0.1:0.85:0.15, and the raw materials were sealed in a quartz tube on which an inner wall was vapor-deposited with a carbon film, and an argon plasma flame was taken while evacuating the vacuum.
• the quartz tube is filled with a small amount of Ar gas protection.
• the mixed raw materials were heated to 1000 ° C at a rate of 0.5 ° C per minute for 12 hours. After the melting is completed, quenching is performed, and the quenching medium is brine.
• the quenched ingot was annealed at 450 ° C for 200 hours together with the quartz tube, and the block was ground into a fine powder and then subjected to spark plasma sintering at a sintering temperature of 380 ° C, a holding time of 5 minutes, and a pressure of 40 MPa.
• the band gap was 0.78 eV as measured by spectral absorption method (see Figure 2).
• the drainage method showed that the density of Ag 1.9 Zn 0.1 S 0.85 I 0.15 reached 98.5%.
• the room temperature conductivity was 0.1 S/m as measured by the four-probe method (see Figure 11).
• the bending stress-strain curve was tested by a three-point bending method with a sample size of 4 mm x 4 mm x 30 mm and a maximum bending deformation of 13% (see Figure 12).
• the elemental raw materials Ag, Ni, S, Te were compounded in a glove box according to a molar ratio of 1.85:0.15:0.6:0.4, and the raw materials were sealed in a quartz tube on which an inner wall was vapor-deposited with a carbon film, and an argon plasma flame was taken while evacuating the vacuum.
• the quartz tube is filled with a small amount of Ar gas protection.
• the mixed raw materials were heated to 850 ° C at a rate of 3 ° C per minute for 20 hours. After the melting is completed, it is slowly cooled.
• the slowly obtained ingot is annealed at 550 ° C for 20 hours together with the quartz tube, and the block is ground into a fine powder and then subjected to hot press sintering at a sintering temperature of 300 ° C, a heating rate of 10 ° C per minute, and a holding time of 30 minutes.
• the pressure was 30 MPa, and Ag 1.85 Ni 0.15 S 0.6 Te 0.4 polycrystalline bulk material was obtained.
• the band gap was 0.65 eV as measured by spectral absorption method (see Figure 2). Tested by the drainage method, it shows that Ag 1.85 Ni 0.15 S 0.6 Te 0.4 has a density of 99.6%. It is tested by the four-probe method. The room temperature conductivity is 250 S/m, and the electrical conductivity at 200 °C reaches 201050 S/m (see Figure 11). ). The bending stress-strain curve was tested by a three-point bending method with a sample size of 4 mm x 4 mm x 30 mm and a maximum bending deformation of 17% (see Figure 12).

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