WO2019137085A1 - 散热方法、散热装置及终端 - Google Patents

散热方法、散热装置及终端 Download PDF

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Publication number
WO2019137085A1
WO2019137085A1 PCT/CN2018/114698 CN2018114698W WO2019137085A1 WO 2019137085 A1 WO2019137085 A1 WO 2019137085A1 CN 2018114698 W CN2018114698 W CN 2018114698W WO 2019137085 A1 WO2019137085 A1 WO 2019137085A1
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Prior art keywords
heat
semiconductor
controller
temperature information
heat dissipation
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PCT/CN2018/114698
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English (en)
French (fr)
Inventor
杨鹏
马焦栋
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西安中兴新软件有限责任公司
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Publication of WO2019137085A1 publication Critical patent/WO2019137085A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Definitions

  • the present disclosure relates to the field of heat dissipation technologies for smart terminals, and in particular, to a heat dissipation method, a heat dissipation device, a heat dissipation device, and a terminal.
  • heating elements such as smart watches, smart bracelets, mobile phones, tablets, heating blocks, heat sinks, etc.
  • their own heat dissipation is not very good, and because of its internal structure or the equipment it is used with Due to the internal structure, it is not possible to increase the heat dissipation performance by increasing the internal heat dissipation structure, which is the main reason for the poor heat dissipation of these heating elements.
  • the heating element is a small-sized intelligent terminal product, its performance is more likely to be degraded due to its own heat dissipation.
  • the heat dissipation measures adopted by the current intelligent terminal products are mainly: using the metal casing of the main body of the intelligent terminal as a heat dissipation structural member, connecting the main board and the outer casing of the main body of the intelligent terminal together, and utilizing the rapid heat transfer property of the metal when the main board is heated.
  • the heat is conducted to the outer casing, and the heat is quickly dissipated to the outside by the outer casing, but when the outer casing is in contact with the human body, the heat dissipation of the contact portion is greatly reduced.
  • the main body has a small volume, and the inside of the main body has a more strict structural waterproof design to isolate the inside of the main body from the outside of the main body (and also to some extent isolate the internal heat from the outside. ), because the main body has the ability to perform display services, call services, data communication services, etc., the main body generates a large amount of heat when performing the above services (and performing wired charging and wireless charging), and the heat inside the main body can only pass through the main body.
  • the outer casing is conducted to the outside. When the heating element is worn, the outer casing is in contact with human skin, which reduces the heat dissipation efficiency of the outer casing. The undissipated heat accumulates inside the main body, resulting in a decrease in the performance of the main body. In severe cases, the main body may be unresponsive and hot. Shut down and other issues.
  • Embodiments of the present disclosure provide a heat dissipation method including: acquiring temperature information of a heat generating body; and controlling the semiconductor combination device to conduct heat of the heat generating body outward when the heat emitting start condition is satisfied.
  • An embodiment of the present disclosure further provides a heat dissipation device including: a semiconductor combination device configured to conduct heat of a heat generating body outward; and a second controller, the semiconductor combination device being electrically connected to the second controller, The second controller is configured to acquire temperature information of the heating element, and control the semiconductor combination device to conduct heat of the heating element outward when the temperature information satisfies a heat-dissipating starting condition, to achieve the The heating element is cooled and cooled.
  • the embodiment of the present disclosure further provides a heat dissipating device, comprising: a semiconductor assembly device having a cold end and a hot end after being energized, the cold end of which is disposed in contact with the contact portion of the heat generating body, and the hot end is disposed outside the contact portion a second controller that controls switching of the semiconductor combination device to be electrically connected to the semiconductor combination device, and the second controller has an interface for communicating with the heat generating body.
  • the embodiment of the present disclosure further provides a terminal, including the heat dissipation device of any of the above embodiments.
  • Embodiment 1 is a flow chart of a heat dissipation method in Embodiment 1;
  • FIG. 2 is a structural block diagram of a heat sink device in Embodiment 2;
  • FIG. 3 is a structural block diagram of another heat sink device in the second embodiment
  • FIG. 4 is a schematic structural view of a heat dissipating device assembled with a heating element in the third embodiment
  • FIG. 5 is a schematic circuit diagram showing the structure of the semiconductor combination device of FIG. 4 electrically connected to the second controller.
  • An embodiment of the present disclosure provides a heat dissipation method, as shown in FIG. 1 , including: acquiring temperature information of a heat generating body; and controlling the semiconductor composite device to heat the heat generating body when the heat emitting start condition is satisfied Conducted out.
  • the heating body can be the main body of the smart watch, the main body of the smart bracelet, the mobile phone, the flat plate, the heating block, the heat dissipation block and the like.
  • the temperature information of the heating element is obtained, and when the temperature information satisfies the heat-dissipating starting condition, the semiconductor combining device is controlled to conduct the heat of the heating element outward to improve the heat dissipation speed of the heating element, so that the heat of the heating element is rapidly reduced.
  • the heating element is a smart terminal
  • the heat dissipation is fast and the temperature is low, and the performance of the smart terminal body can be ensured, and the problem of slow response, thermal shutdown, and the like of the smart terminal body can be prevented.
  • the first implementation manner of this embodiment is: the temperature information is a temperature value, and the heat dissipation starting condition is that the temperature value is not less than a preset temperature threshold.
  • the temperature value may be the temperature value of the housing of the heating element, or may be the temperature value of the internal heating element (the heating element in this manner is the intelligent terminal body), and is controlled by comparing the temperature value with the preset temperature threshold.
  • the semiconductor combination device is powered on or off. That is, the judgment result is that the temperature value is not less than the preset temperature threshold, satisfies the heat-dissipation starting condition, and controls the semiconductor combination device to be energized to quickly conduct heat of the heating element to achieve rapid cooling of the heating element.
  • the second implementation manner of this embodiment is that the temperature information is a state of a heating element, and the heat dissipation starting condition is that the state is the same as a preset state.
  • the state of the heating element includes a solid state and a liquid state
  • the preset state is a liquid state
  • the semiconductor composite device is controlled to be energized or de-energized by judging whether the state of the heating element is the same as the preset state.
  • the semiconductor combination device is controlled to be energized to achieve rapid cooling of the heating element.
  • the third implementation manner of this embodiment is: the temperature information is a pulse signal (ie, “1” or “0”), and the heat dissipation starting condition is a pulse signal for controlling conduction of the semiconductor combination device, and the heating element
  • the internal temperature information is detected, a corresponding pulse signal is generated according to the temperature information, and the semiconductor combination device is controlled to be powered on or off according to the pulse signal. If the pulse signal is "1”, the semiconductor combination device is controlled to be energized. If the pulse signal is "0", the semiconductor combination device is controlled to be powered off, and there is no need to separately set the comparison module (the heating element can be the intelligent terminal body, the intelligent terminal body) It can be used as a power source for a semiconductor composite device. Of course, a semiconductor combination device can also be used alone with a power supply.
  • the heat generating body may be a smart terminal body; and acquiring temperature information of the heat generating body is: acquiring temperature information from a first control module inside the smart terminal body by a wired transmission manner or a wireless transmission manner, The first control module also supplies power to the semiconductor combination device by wired transmission.
  • the wired transmission mode is implemented by using a USB interface or the like, and the wireless transmission mode is implemented by using a WiFi interface, a Bluetooth interface, a ZigBee interface, or the like.
  • the semiconductor composite device may be a semiconductor composite device having a cold end and a hot end after being turned on;
  • the controlling semiconductor combining device conducting the heat of the heat generating body outward includes: controlling the semiconductor integrated device DC Conducting, so that the cold end of the semiconductor composite device absorbs the heat of the heating element to cool the heating element, and the hot end of the semiconductor composite device releases heat to the outside, and the heat of the hot end is quickly transmitted to the outside. In this way, the cooling of the heating element is continuously performed.
  • One embodiment of the present disclosure provides a heat sink device, as shown in FIG. 2, including: a semiconductor combining device configured to conduct heat of a heat generating body outward; and a second controller, the semiconductor combining device and the The second controller is electrically connected, the second controller is configured to acquire temperature information of the heating element, and control the semiconductor combination device to transmit heat of the heating element when the temperature information satisfies a heat-dissipating starting condition Derived to achieve heat dissipation and cooling of the heating element.
  • the heating body can be the main body of the smart watch, the main body of the smart bracelet, the mobile phone, the flat plate, the heating block, the heat dissipation block and the like.
  • the second controller obtains the temperature information of the heating element.
  • the second controller controls the semiconductor combination device to conduct the heat of the heating element outward to improve the heat dissipation speed of the heating element.
  • the heat of the heating element is rapidly lowered.
  • the heating element is a smart terminal, the heat dissipation is fast and the temperature is low, and the performance of the intelligent terminal body can be ensured, and problems such as unresponsiveness and thermal shutdown can be prevented.
  • the first implementation manner of this embodiment is: the temperature information is a temperature value, and the heat dissipation starting condition is that the temperature value is not less than a preset temperature threshold in the second control module, and the second controller is The semiconductor combination device is controlled to be energized, and the second controller controls the semiconductor combination device to be powered off when the temperature value is less than a preset temperature threshold.
  • the second implementation manner of this embodiment is: the temperature information is a state of a heating element, and the heat dissipation starting condition is that the state is the same as a preset state, and the second controller controls the semiconductor combination device. When the state is different from the preset state, the second controller controls the semiconductor combination device to be powered off.
  • the third implementation manner of this embodiment is: the temperature information is a pulse signal, the second controller acquires the pulse signal from the heating element, and controls the semiconductor combination device to be powered on or off by the pulse signal.
  • the heat-dissipating starting condition is a pulse signal for controlling energization of the semiconductor combination device.
  • the pulse signal includes “1” and “0”. If the pulse signal is “1”, the second controller controls the semiconductor combination device to be powered after receiving the pulse signal. If the pulse signal is “0”, the second controller receives the signal.
  • the second controller may be a semiconductor.
  • the semiconductor in contact with the heating element is turned on, so that the circuit in which the semiconductor combining device is placed is turned on to dissipate heat to the heating element.
  • the semiconductor in contact with the heating element is not turned on, and the circuit in which the semiconductor integrated device is placed is de-energized. At this time, the semiconductor composite device does not dissipate heat from the heating element.
  • the heating element may be a smart terminal body, and the inside of the smart terminal body is provided with a first control module; the second controller is connected to the second through a USB interface, a Bluetooth interface, a WIFI interface or a Zigbee interface.
  • a control module performs communication to obtain temperature information
  • the first control module further supplies power to the second controller through a USB interface
  • the second controller controls the semiconductor combination device to be powered on or off according to the temperature information. Electricity.
  • the interface includes a USB interface for powering on and communication; or the interface includes a USB interface for powering up, and a Bluetooth interface, a WIFI interface, or a Zigbee interface for communication;
  • the purpose of the present invention is not deviated from the design idea of the present disclosure, and will not be described herein. It should be within the protection scope of the present application. This solution does not need to provide a power source on the second controller, and the volume of the heat sink device can be made smaller.
  • the semiconductor combination device may be a semiconductor combination device having a cold end and a hot end after DC conduction, the second controller controlling the semiconductor combination device to be DC-conducted to make the semiconductor combination device cold
  • the heat is absorbed by the heat generating body to cool the heat generating body, and the heat absorbed by the cold end is transferred to the hot end, and the hot end of the semiconductor composite device radiates heat to the outside, and the heat of the hot end is quickly transmitted to the outside. In this way, the cooling of the heating element is continuously performed.
  • the second controller may include: a comparison module electrically connected to the second control module, configured to compare the heat dissipation starting condition and the temperature information; and the second control The module is further electrically connected to the semiconductor combination device, configured to receive the temperature information, and to control direct conduction of the semiconductor combination device when the comparison module obtains temperature information to satisfy a heat dissipation start condition.
  • the heating body can recognize the internal temperature and compare with the preset temperature threshold in the first control module to obtain a comparison result of “Yes” or “No”, and transmit the comparison result to the second control module.
  • the comparison module compares the comparison result with the preset heat-dissipation opening condition (only “yes” or only “no") in the second control module, when the comparison result is the same as the preset heat-dissipating starting condition (eg : "Yes” or "No", the second control module controls the semiconductor combination device to be energized, and the semiconductor combination device dissipates heat to the heating element.
  • the second control The module controls the semiconductor combination device to be powered off, and the semiconductor combination device does not dissipate heat from the heating element.
  • the heat dissipating device made in this way can be applied to different heating elements, which can improve the productivity and versatility of the heat dissipating device, such as a wristband of a smart watch or an annulus as a smart bracelet.
  • the heating body further includes a condition monitoring module and a comparison judgment module.
  • the state monitoring module is configured to detect the internal temperature of the heating element, and the comparison judgment module is set to compare the internal temperature of the heating element with the preset temperature threshold (preset in the first control module) Temperature threshold), the first control module is arranged to transmit a comparison structure ("Yes" or "No") to the second control module.
  • An embodiment of the present disclosure provides a heat dissipating device (shown in FIG. 4) including: a semiconductor combining device 1 having a cold end a and a hot end b after being energized, the cold end of which is disposed in contact with the contact portion of the heating element 2 a hot end disposed outside the contact portion; a second controller 3 that controls the semiconductor composite device 1 to be turned on and off, electrically connected to the semiconductor composite device 1 (as shown in FIG. 5), and the second The controller 3 has an interface for communicating with the heating element 2, and the second controller 3 controls the semiconductor combination device 1 to be energized or de-energized by acquiring temperature information of the heating element 2.
  • the second controller 3 controls the semiconductor combination device 1 to be energized, the cold end of the semiconductor composite device 1 absorbs heat from the heating element 2, cools the heating element 2, and the heat absorbed by the cold end is transferred to the hot end, and the hot end of the semiconductor composite device 1 The heat on it is quickly transmitted to the outside world.
  • the semiconductor composite device 1 may include a plurality of semiconductors connected, the plurality of semiconductors including at least an N-type semiconductor and a P-type semiconductor connected in series; the semiconductor combination device 1 is DC At the time of conduction, one end of the current flowing from the N-type semiconductor to the P-type semiconductor is a cold end, and one end of the P-type semiconductor flowing to the N-type semiconductor is a hot end.
  • the semiconductor includes a plurality of N-shaped semiconductors and a plurality of P-shaped semiconductors, and the plurality of N-type semiconductors and the plurality of P-type semiconductors are alternately connected in series.
  • the semiconductor composite device 1 can also be arranged in parallel or in series, and the heat dissipation performance of the heating element 2 can be improved.
  • the heat generation body 2 has a faster heat dissipation rate and better heat dissipation efficiency.
  • the heat sink may further include: a heat sink 4 disposed on a hot end of the semiconductor composite device 1; a heat insulator 5, the semiconductor assembly device 1 disposed on the heat insulating member 5; and a decorative member 6 disposed on the semiconductor composite device 1 and the heat insulating member 5, the second controller 3 being disposed in the cold of the semiconductor composite device 1
  • the interface includes a USB interface for powering up and communicating; or; the interface includes a USB for powering on
  • the interface as well as the Bluetooth interface, the WIFI interface or the Zigbee interface for communication, can achieve the object of the present application, and the purpose of the application is not deviated from the design idea of the present disclosure, and is not described herein again, and should be within the protection scope of the present application.
  • the heat dissipating member 4 can be a heat-conducting medium made of aluminum, aluminum alloy or copper, so that the heat is dissipated to the outside air more quickly, and the material of the heat-insulating member 5 can be plastic, silicone, rubber, leather, etc.
  • the material can be metal, plastic, leather, silicone or rubber.
  • the semiconductor composite device 1 and the heat insulating member 5 are each in the form of an elongated sheet, and the second controller 3 is disposed on the first surface of the semiconductor composite device 1.
  • the heat generating body 2 is disposed in contact with the first surface of the semiconductor composite device 1, and the heat insulating member 5 is disposed on the other surface of the semiconductor composite device 1 to prevent the semiconductor composite device 1 from coming into contact with the human body.
  • the body member is burned, and the decorative member 6 is disposed on the exposed surface of the heat insulating member 5 of the first surface of the semiconductor composite device 1 for improving the aesthetics of the heat sink.
  • the heat sink can be a strap of a smart watch or an annulus of a smart bracelet.
  • the heat generating body 2 may be a smart terminal body, and the semiconductor combining device 1 and the second controller 3 are two sets symmetrically disposed in the longitudinal direction of the heat insulating member 5, two The adjacent cold junctions of the semiconductor composite device 1 are connected, the two second controllers 3 are spaced apart, and the heat generating body 2 is disposed to be mounted between two of the second controllers 3, and two The second controller 3 faces the heating element 2 toward the side of the heating element 2 and is connected to the USB interface.
  • the symmetric arrangement improves the aesthetics of the heat sink.
  • the heat sink can be a strap of a smart watch or a wristband of a smart wristband.
  • a sensor needs a sensor to sense human skin, and the semiconductor combination device 1 Both the through hole and the notch for detecting the sensor can be configured on the heat insulating member 5 for realizing functions such as heart rate detection.
  • One embodiment of the present disclosure provides a terminal, as shown in FIG. 4, including the heat sink device of any of the above embodiments.
  • the terminal provided by the present disclosure has all the advantages of the heat dissipation device described in any of the above embodiments, and details are not described herein again.
  • the terminal is a smart watch, the heat dissipation device is a watch band, and the watch band is mounted on the body of the smart watch.
  • the terminal is a smart bracelet, and the heat dissipating device is an endless belt, and the endless belt is mounted on the body of the smart bracelet.
  • the embodiments of the present disclosure have the following beneficial effects: the technical solution of the embodiment of the present disclosure acquires the temperature information of the heating element, and controls the semiconductor combination device to heat the heating element when the temperature information satisfies the heat-dissipating starting condition. Conducted externally to increase the heat dissipation rate of the heating element, so that the heat of the heating element is rapidly reduced.

Abstract

本申请提出一种散热方法、散热装置及终端。散热方法包括：获取发热体的温度信息；温度信息在满足散热启动条件时控制半导体组合器件将发热体的热量向外传导出，以提升发热体的散热速度，使得发热体的热量快速降低。

Description

散热方法、散热装置及终端 技术领域
本公开涉及智能终端散热技术领域，特别涉及一种散热方法、一种散热装置、一种散热装置及一种终端。
背景技术
对于一些发热体(如：智能手表、智能手环、手机、平板、发热块、散热块等等)，其自身的散热性并不是很好，而且由于其内部结构或其所配套使用的设备的内部结构所限，也并不能够通过增加内部散热结构的方式来提升其散热性能，这就是这些发热体散热性差的主要原因。特别是当发热体为小体积的智能终端产品时，其性能更容易因其自身散热不及时而下降。
当前智能终端产品所采用的散热措施主要是：利用智能终端主体的金属的外壳作为散热结构件，将智能终端主体内部的主板与外壳连接在一起，在主板发热时利用金属的快速传热性将热量传导到外壳、由外壳将热量向外界快速散出，但是在外壳与人体接触时，接触部位的散热性将大幅度降低。
以发热体为智能手表或智能手环为例，其主体的体积较小，且主体内部具有更加严格的结构防水设计来隔绝主体内部与主体外部(同时也在一定程度上隔绝内部热量向外传递)，因主体具备执行显示业务、通话业务、数据通讯业务等的能力，在执行上述业务(以及进行有线充电、无线充电)时主体的发热量较大，而主体内部的热量却仅能通过主体的外壳向外界传导出，佩戴发热体时外壳是与人体皮肤接触的，会降低外壳的散热效率，未散出的热量聚集在主体内部，导致主体性能下降，严重情况下主体会出现反应迟钝、热关机等问题。
发明内容
本公开实施例提供了一种散热方法，包括：获取发热体的温度信息；所述温度信息在满足散热启动条件时控制半导体组合器件将所述发热体的热量向外传导出。
本公开实施例还提供了一种散热装置，包括：半导体组合器件，设置为将发热体的热量向外传导出；和第二控制器，所述半导体组合器件与所述第二控制器电连接，所述第二控制器设置为获取所述发热体的温度信息，以及在所述温度信息满足散热启动条件时控制所述半导体组合器件将所述发热体的热量向外传导出，以实现对所述发热体进行散热降温。
本公开实施例还提供了一种散热装置，包括：通电后具有冷端和热端的半导体组合器件，其冷端设置为与发热体的接触部相接触，热端设置在所述接触部之外；控制所述半导体组合器件通断的第二控制器，与所述半导体组合器件电连接，且所述第二控制器具有与所述发热体通讯的接口。
本公开实施例还提供了一种终端，包括有上述任一实施例所述散热装置。
附图说明
图1为实施例一中的一种散热方法的流程图；
图2为实施例二中的一种散热装置的结构框图；
图3为实施例二中的另一种散热装置的结构框图；
图4为实施例三中的一种散热装置与发热体组装后的结构示意图；
图5为图4中的半导体组合器件与第二控制器进行电连接后的结构示意电路图。
具体实施方式
为使本公开的发明目的、技术方案和有益效果更加清楚明了，下面结合附图对本公开的实施例进行说明，需要说明的是，在不冲突的情况下，本申请中的实施例和实施例中的特征可以相互任意组合。
本公开的一个实施例提供了一种散热方法，如图1所示，包括：获取发热体的温度信息；所述温度信息在满足散热启动条件时控制半导体组合器件将所述发热体的热量向外传导出。
其中，所述发热体可以为智能手表的主体，智能手环的主体，手机，平板，发热块，散热块等。
该实施例，获取得到发热体的温度信息，在温度信息满足散热启动条件时，控制半导体组合器件将发热体的热量向外传导出，以提升发热体的散热速度，使得发热体的热量快速降低。在发热体为智能终端时，因其热量散失快、温度低，还能够确保智能终端主体的性能，防止智能终端主体出现反应迟钝、热关机等的问题。
本实施例的第一个实现方式为：所述温度信息为温度值，所述散热启动条件为所述温度值不小于预设温度阈值。温度值可以是发热体的壳体的温度值，也可以是发热体传输的其内部的温度值(此种方式的发热体为智能终端主体)，通过比较温度值与预设温度阈值、来控制半导体组合器件通电或断电。即：判断结果为温度值不小于预设温度阈值，满足散热启动条件，控制半导体组合器件通电来将发热体的热量快速传导出，以实现对发热体进行快速降温。
本实施例的第二个实现方式为：所述温度信息为发热体的状态，所述散热启动条件为所述状态与预设状态相同。如发热体的状态包括固态和液态，预设状态为液态，通过判断发热体的状态与预设状态是否相同、来控制半导体组合器件通电或断电。如在获取的发热体的状态为液态时，控制半导体组合器件通电，以实现对发热体进行快速降温。
本实施例的第三个实现方式为：所述温度信息为脉冲信号(即：“1”或“0”)，所述散热启动条件为控制所述半导体组合器件导通的脉冲信号，发热体检测其内部温度信息，根据该温度信息生成相应的脉冲信号、根据该脉冲信号来控制半导体组合器件通电或断电。如脉冲信号为“1”则控制半导体组合器件通电，如脉冲信号为“0”则控制半导体组合器件断电，无需再专门设置对比模块(此种方式发热体可以为智能终端主体，智能终端主体可以作为半导体组合器件的电源，当然半导体组合器件也可以单独配合电源)。
以上三种实现方式均可实现本申请的目的，其宗旨未脱离本公开的设计思想，在此不再 赘述，均应属于本申请的保护范围内。
示例性地，所述发热体可以为智能终端主体；获取所述发热体的温度信息为：通过有线传输方式或无线传输方式自所述智能终端主体内部的第一控制模块获取温度信息，所述第一控制模块还通过有线传输方式向所述半导体组合器件供电。
其中，有线传输方式如通过USB接口等的方式来实现，无线传输方式如通过WiFi接口、蓝牙接口、ZigBee接口等的方式来实现。
示例性地，所述半导体组合器件可以为直流导通后具有冷端和热端的半导体组合器件；所述控制半导体组合器件将所述发热体的热量向外传导出包括：控制所述半导体组合器件直流导通，以使所述半导体组合器件的冷端吸收所述发热体的热量、来对发热体进行降温，所述半导体组合器件的热端向外界放热，将热端的热量快速的传递至外界，如此实现连续对发热体降温。
本公开的一个实施例提供了一种散热装置，如图2所示，包括：半导体组合器件，设置为将发热体的热量向外传导出；和第二控制器，所述半导体组合器件与所述第二控制器电连接，所述第二控制器设置为获取所述发热体的温度信息，以及在所述温度信息满足散热启动条件时控制所述半导体组合器件将所述发热体的热量向外传导出，以实现对所述发热体进行散热降温。
其中，所述发热体可以为智能手表的主体，智能手环的主体，手机，平板，发热块，散热块等。
该实施例，第二控制器获取得到发热体的温度信息，在温度信息满足散热启动条件时，第二控制器控制半导体组合器件将发热体的热量向外传导出，以提升发热体的散热速度，使得发热体的热量快速降低。在发热体为智能终端时，因其热量散失快、温度低，还能够确保智能终端主体的性能，防止出现反应迟钝、热关机等的问题。
本实施例的第一个实现方式为：所述温度信息为温度值，所述散热启动条件为所述温度值不小于第二控制模块内的预设温度阈值、此时所述第二控制器控制所述半导体组合器件通电，所述温度值小于预设温度阈值时、所述第二控制器控制所述半导体组合器件断电。
本实施例的第二个实现方式为：所述温度信息为发热体的状态，所述散热启动条件为所述状态与预设状态相同、此时所述第二控制器控制所述半导体组合器件通电，所述状态与预设状态不相同时、所述第二控制器控制所述半导体组合器件断电。
本实施例的第三个实现方式为：所述温度信息为脉冲信号，所述第二控制器自所述发热体获取所述脉冲信号，通过所述脉冲信号控制所述半导体组合器件通电或断电，所述散热启动条件为控制所述半导体组合器件通电的脉冲信号。脉冲信号包括“1”和“0”，如脉冲信号为“1”则第二控制器接收到该脉冲信号后控制半导体组合器件通电，如脉冲信号为“0”则第二控制器接收到该脉冲信号后控制半导体组合器件断电，无需再专门设置对比模块(此种方式发热体可以为智能终端主体，而且智能终端主体可以作为半导体组合器件的电源，半导体组合器件也可以单独配合电源)。也可以是第二控制器为半导体，在发热体的温度到达设定温度时，与发热体接触的半导体会导通，使得半导体组合器件所在的电路导通而实现对 发热体散热，在温度未达到设定温度时，与发热体接触的半导体不导通，半导体组合器件所在的电路断电，此时半导体组合器件不对发热体进行散热。
示例性地，所述发热体可以为智能终端主体，所述智能终端主体的内部设置有第一控制模块；所述第二控制器通过USB接口、蓝牙接口、WIFI接口或Zigbee接口与所述第一控制模块进行通讯、以获取温度信息，所述第一控制模块还通过USB接口向所述第二控制器供电，所述第二控制器根据所述温度信息控制所述半导体组合器件通电或断电。如：所述接口包括用于通电和通讯的USB接口；或；所述接口包括用于通电的USB接口，以及用于通讯的蓝牙接口、WIFI接口或Zigbee接口等；均可实现本申请的目的，其宗旨未脱离本公开的设计思想，在此不再赘述，均应属于本申请的保护范围内，此方案无需在第二控制器上设置电源，散热装置的体积可制作的更小。
示例性地，所述半导体组合器件可以为直流导通后具有冷端和热端的半导体组合器件，所述第二控制器控制所述半导体组合器件直流导通，以使所述半导体组合器件的冷端吸收所述发热体的热量、来对所述发热体进行降温，冷端吸收的热量传递至热端，所述半导体组合器件的热端向外界放热，将热端的热量快速的传递至外界，如此实现连续对发热体降温。
示例性地，如图3所示，所述第二控制器可以包括：对比模块，与第二控制模块电连接，设置为对比所述散热启动条件和所述温度信息；和所述第二控制模块，还与所述半导体组合器件电连接，设置为接收所述温度信息，以及在所述对比模块对比得到温度信息满足散热启动条件时、控制所述半导体组合器件直流导通。
其中，还可以是：发热体识别其内部温度并与第一控制模块内的预设温度阈值进行对比后，得到“是”或“否”的对比结果，将该对比结果传输给第二控制模块，对比模块通过将该对比结果与第二控制模块内预设的散热开启条件(仅为“是”或仅为“否”)进行对比，在对比结果与预设的散热启动条件相同时(如：均为“是”或均为“否”)，第二控制模块控制半导体组合器件通电，半导体组合器件对发热体进行散热，在对比结果与预设的散热启动条件不相同时，第二控制模块控制半导体组合器件断电，半导体组合器件不对发热体进行散热。此种方式制成的散热装置可应用于不同的发热体，可提升散热装置的生产性和通用性，如作为智能手表的表带或作为智能手环的环带。发热体内部还包括状态监测模块和对比判断模块，状态监测模块设置为检测发热体的内部温度，对比判断模块设置为对比发热体的内部温度与预设温度阈值(第一控制模块内的预设温度阈值)，第一控制模块设置为向第二控制模块传输对比结构(“是”或“否”)。
本公开实施例提供了一种散热装置(参见图4所示)，包括：通电后具有冷端a和热端b的半导体组合器件1，其冷端设置为与发热体2的接触部相接触，热端设置在所述接触部之外；控制所述半导体组合器件1通断的第二控制器3，与所述半导体组合器件1电连接(如图5所示)，且所述第二控制器3具有与所述发热体2通讯的接口，第二控制器3通过获取发热体2的温度信息来控制半导体组合器件1通电或断电。第二控制器3控制半导体组合器件1通电，半导体组合器件1的冷端自发热体2吸收热量，对发热体2进行降温，冷端吸收的热量传递至热端，半导体组合器件1的热端将其上的热量快速的传递至外界。
示例性地，如图5所示，所述半导体组合器件1可以包括相连接的多个半导体，多个所述半导体至少包括串联连接的N型半导体和P型半导体；所述半导体组合器件1直流导通时，电流由N型半导体流向P型半导体的一端为冷端、由P型半导体流向N型半导体的一端为热端。
如图5所示，半导体包括多个N形半导体和多个P形半导体，多个N型半导体和多个P型半导体交替串联连接。半导体组合器件1也可以并联设置或串联设置多个，均可实现提升发热体2的散热性能的目的，发热体2的散热速度更快、散热效率更好。
示例性地，如图4所示，所述散热装置还可以包括：散热件4，所述散热件4设置在所述半导体组合器件1的热端上；隔热件5，所述半导体组合器件1设置在所述隔热件5上；和装饰件6，设置在所述半导体组合器件1和所述隔热件5上，所述第二控制器3设置在所述半导体组合器件1的冷端上，以同时对第二控制器3进行快速降温，确保第二控制器3的性能较好；所述接口包括用于通电和通讯的USB接口；或；所述接口包括用于通电的USB接口，以及用于通讯的蓝牙接口、WIFI接口或Zigbee接口；均可实现本申请的目的，其宗旨未脱离本公开的设计思想，在此不再赘述，均应属于本申请的保护范围内。散热件4可以为铝、铝合金或铜等制成的导热介质，使得热量更快速的散至外界空气中，隔热件5的材质可以是塑料、硅胶、橡胶、皮革等，装饰件6的材质可以是金属、塑料、皮革、硅胶或橡胶等。
本公开的一个实施例中，所述半导体组合器件1和所述隔热件5均呈长条形片状，所述第二控制器3设置在所述半导体组合器件1的第一表面上，所述发热体2设置为与所述半导体组合器件1的第一表面相接触，所述隔热件5设置在所述半导体组合器件1的另一表面上，防止半导体组合器件1与人体接触而烫伤人体，装饰件6设置在半导体组合器件1的第一表面的隔热件5的外露表面上用于提升散热装置的美观性。该散热装置可以为智能手表的表带或智能手环的环带。
示例性地，所述发热体2可以为智能终端主体，所述半导体组合器件1和所述第二控制器3为在所述隔热件5的长度方向上对称设置的两组，两个所述半导体组合器件1相邻近的冷端相连接，两个所述第二控制器3相间隔，所述发热体2设置为安装在两个所述第二控制器3之间，且两个所述第二控制器3朝向所述发热体2的侧面临近所述发热体2、且连接在USB接口上，对称设置的方式可提升散热装置的美观性。
而且，对于智能手表或智能手环，散热装置可以为智能手表的表带或智能手环的环带，在具备心率检测等功能时，智能终端主体上需要有传感器感应人体皮肤，半导体组合器件1和隔热件5上均可对应传感器开设检测用的通孔或缺口等结构，以用于实现心率检测等功能。
本公开的一个实施例提供了一种终端，如图4所示，包括有上述任一实施例所述散热装置。
本公开提供的终端，具备上述任一实施例所述的散热装置的全部优点，在此不再赘述。
其中，所述终端为智能手表，所述散热装置为表带，所述表带安装在所述智能手表的本体上。或者是，所述终端为智能手环，所述散热装置为环带，所述环带安装在所述智能手环 的本体上。
本公开实施例和相关技术相比，具有如下有益效果：本公开实施例的技术方案，获取得到发热体的温度信息，在温度信息满足散热启动条件时，控制半导体组合器件将发热体的热量向外传导出，提升发热体的散热速度，使得发热体的热量快速降低。
虽然本公开所揭示的实施方式如上，但其内容只是为了便于理解本公开的技术方案而采用的实施方式，并非设置为限定本公开。任何本公开所属技术领域内的技术人员，在不脱离本公开所揭示的核心技术方案的前提下，可以在实施的形式和细节上做任何修改与变化，但本公开所限定的保护范围，仍须以所附的权利要求书限定的范围为准。

Claims (20)

  1. 一种散热方法，包括：
    获取发热体的温度信息；
    所述温度信息在满足散热启动条件时控制半导体组合器件将所述发热体的热量向外传导出。
  2. 根据权利要求1所述的散热方法，其中，
    所述温度信息为温度值，所述散热启动条件为所述温度值不小于预设温度阈值；或
    所述温度信息为发热体的状态，所述散热启动条件为所述状态与预设状态相同；或
    所述温度信息为脉冲信号，所述散热启动条件为控制所述半导体组合器件导通的脉冲信号。
  3. 根据权利要求1所述的散热方法，其中，所述发热体为智能终端主体；获取所述发热体的温度信息为：通过有线传输方式或无线传输方式自所述智能终端主体内部的第一控制模块获取温度信息，所述第一控制模块还通过有线传输方式向所述半导体组合器件供电。
  4. 根据权利要求1所述的散热方法，其中，所述半导体组合器件为直流导通后具有冷端和热端的半导体组合器件；所述控制包括：控制所述半导体组合器件直流导通，以使所述半导体组合器件的冷端吸收所述发热体的热量，所述半导体组合器件的热端向外界放热。
  5. 一种散热装置，包括：
    半导体组合器件，设置为将发热体的热量向外传导出；和
    第二控制器，所述半导体组合器件与所述第二控制器电连接，所述第二控制器设置为获取所述发热体的温度信息，以及在所述温度信息满足散热启动条件时控制所述半导体组合器件将所述发热体的热量向外传导出，以实现对所述发热体进行散热降温。
  6. 根据权利要求5所述的散热装置，其中，
    所述温度信息为温度值，所述散热启动条件为所述温度值不小于预设温度阈值、此时所述第二控制器控制所述半导体组合器件通电，所述温度值小于预设温度阈值时、所述第二控制器控制所述半导体组合器件断电；或
    所述温度信息为发热体的状态，所述散热启动条件为所述状态与预设状态相同、此时所述第二控制器控制所述半导体组合器件通电，所述状态与预设状态不相同时、所述第二控制器控制所述半导体组合器件断电；或
    所述温度信息为脉冲信号，所述第二控制器通过所述脉冲信号控制所述半导体组合器件通电或断电，所述散热启动条件为控制所述半导体组合器件通电的脉冲信号。
  7. 根据权利要求5所述的散热装置，其中，所述发热体为智能终端主体，所述智能终端主体的内部设置有第一控制模块；所述第二控制器通过USB接口、蓝牙接口、WIFI接口或Zigbee接口与所述第一控制模块进行通讯、以获取温度信息，所述第一控制模块 还通过USB接口向所述第二控制器供电，所述第二控制器控制所述半导体组合器件通电或断电。
  8. 根据权利要求5所述的散热装置，其中，所述半导体组合器件为直流导通后具有冷端和热端的半导体组合器件，所述第二控制器控制所述半导体组合器件直流导通，以使所述半导体组合器件的冷端吸收所述发热体的热量，所述半导体组合器件的热端向外界放热。
  9. 根据权利要求7或8所述的散热装置，其中，所述第二控制器包括：
    对比模块，与第二控制模块电连接，设置为对比所述散热启动条件和所述温度信息；和
    所述第二控制模块，还与所述半导体组合器件电连接，设置为接收所述温度信息，以及在所述对比模块对比得到温度信息满足散热启动条件时、控制所述半导体组合器件直流导通。
  10. 一种散热装置，包括：
    通电后具有冷端和热端的半导体组合器件，其冷端设置为与发热体的接触部相接触，热端设置在所述接触部之外；
    控制所述半导体组合器件通断的第二控制器，与所述半导体组合器件电连接，且所述第二控制器具有与所述发热体通讯的接口。
  11. 根据权利要求10所述的散热装置，其中，所述半导体组合器件包括相连接的多个半导体，多个所述半导体至少包括串联连接的N型半导体和P型半导体；
    其中，所述半导体组合器件直流导通时，电流由N型半导体流向P型半导体的一端为冷端、由P型半导体流向N型半导体的一端为热端。
  12. 根据权利要求10或11所述的散热装置，其中，还包括：
    散热件，所述散热件设置在所述半导体组合器件的热端上。
  13. 根据权利要求10或11所述的散热装置，其中，还包括
    隔热件，所述半导体组合器件设置在所述隔热件上。
  14. 根据权利要求10或11所述的散热装置，其中，还包括
    装饰件，设置在所述半导体组合器件上。
  15. 根据权利要求10或11所述的散热装置，其中，
    所述第二控制器设置在所述半导体组合器件的冷端上；
    所述接口包括用于通电和通讯的USB接口，或，所述接口包括用于通电的USB接口，以及用于通讯的蓝牙接口、WIFI接口或Zigbee接口。
  16. 根据权利要求13所述的散热装置，其中，所述半导体组合器件和所述隔热件均呈长条形片状，所述第二控制器设置在所述半导体组合器件的第一表面上，所述发热体设置为与所述半导体组合器件的第一表面相接触，所述隔热件设置在所述半导体组合器件的另一表面上。
  17. 根据权利要求16所述的散热装置，其中，所述发热体为智能终端主体，所述半导体组合器件和所述第二控制器为在所述隔热件的长度方向上对称设置的两组，两个所述半导体组合器件相邻近的冷端相连接，两个所述第二控制器相间隔，所述发热体设置为安装在两个所述第二控制器之间，且两个所述第二控制器朝向所述发热体的侧面临近所述发热体。
  18. 一种终端，其中，包括有如权利要求10至17中任一项所述散热装置。
  19. 根据权利要求18所述的终端，其中，所述散热装置为表带。
  20. 根据权利要求18所述的终端，其中，所述终端为智能手表或智能手环。
PCT/CN2018/114698 2018-01-15 2018-11-09 散热方法、散热装置及终端 WO2019137085A1 (zh)

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