Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
  • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
  • G01N21/47—Scattering, i.e. diffuse reflection
  • G01N21/4788—Diffraction
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
  • G01N21/84—Systems specially adapted for particular applications
  • G01N21/88—Investigating the presence of flaws or contamination
  • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
  • G01N21/9501—Semiconductor wafers
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
  • G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
  • G02B27/4233—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application
  • G02B27/4255—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect having a diffractive element [DOE] contributing to a non-imaging application for alignment or positioning purposes
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
  • G03F7/70605—Workpiece metrology
  • G03F7/70616—Monitoring the printed patterns
  • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
  • G03F7/70605—Workpiece metrology
  • G03F7/70616—Monitoring the printed patterns
  • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
  • G03F7/70605—Workpiece metrology
  • G03F7/70616—Monitoring the printed patterns
  • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/70—Microphotolithographic exposure; Apparatus therefor
  • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
  • G03F7/70605—Workpiece metrology
  • G03F7/70653—Metrology techniques
  • G03F7/70675—Latent image, i.e. measuring the image of the exposed resist prior to development
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
  • H01L22/10—Measuring as part of the manufacturing process
  • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
  • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
  • G01N21/84—Systems specially adapted for particular applications
  • G01N21/88—Investigating the presence of flaws or contamination
  • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
  • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques

Definitions

• the present invention relates generally to the field of scatterometry-based overlay metrology, and more particularly to the use of angularly resolved scatterometry for monitoring errors in overlay between stacked periodic structures, for instance metrology targets such as diffraction gratings printed on respective layers in a semiconductor wafer.
• a metrology target may take the form of a set of cells, for example a 2x2 array of rectangular or square cells, each comprising a diffraction grating, two for measuring overlay in the X direction and two for measuring overlay in the Y direction. Diffraction patterns obtained by illuminating the cells may be analysed to measure overlay.
• methods of obtaining an overlay value involve measuring multiple cells. For example, in some known overlay measurement methods, measuring the intensity difference between the + and - (also referred to herein as“ ⁇ ”) first diffraction orders leads to a determination of an overlay value.
• Some embodiments of the invention provide systems and methods for monitoring overlay errors between stacked periodic structures.
• a method according to an embodiment of the invention may comprise capturing an image of the stacked periodic structures including + and - order diffraction patterns, and comparing the ⁇ diffraction patterns to identify an overlay error between successive layers.
• the patterns themselves may be compared, for example by analysis in an analysing unit.
• the diffraction patterns maybe the first order diffraction patterns.
• the diffraction patterns may comprise interference fringes, and the comparison of the diffraction patterns may comprise comparing the fringe positions to identify any asymmetry between the + and - diffraction patterns.
• a method according to some embodiments of the invention may be performed in an existing metrology system, for example in an image analysis unit which may form part of such a system. Therefore an embodiment of the invention may comprise a computer readable medium, either transitory or non-transitory, comprising instructions which when implemented in a processor of a computing system such as an image analysis unit cause the system to analyze images according to any of the methods described herein.
• Figure 1 is a schematic cross-sectional view of a typical cell in an overlay target according to some embodiments of the invention.
• Figure 2 is a plan view of a typical cell in an overlay target according to some embodiments of the invention.
• Figure 3 depicts a captured image of zero and ⁇ first diffraction orders in a thin stack of layers according to some embodiments of the invention
• Figure 4 depicts zero a captured image of zero and ⁇ first diffraction orders in a thicker stack of layers according to some embodiments of the invention
• Figure 5 is a graph depicting the results of fast Fourier transformation“FFT” on images of both ⁇ first diffraction orders
• Figure 6 is a schematic diagram of a system according to some embodiments of the invention.
• Figure 7 is a flow diagram depicting a method according to some embodiments of the invention.
• FIG. 1 is a schematic representation of scatterometry-overlay (“SCOL”) measurement.
• SCOL scatterometry-overlay
• the illumination ray 12 may be pointed towards the stack and may then be directly reflected and also diffracted in directions represented by vectors 13-16.
• The“U” and“L” rays may represent diffractions from upper grating 22 and lower grating 24 respectively. As illustrated in figure 1 , the two diffraction gratings have the same period but different thicknesses. The gratings are shown to be misaligned and the overlay or degree of misalignment is indicated by reference numeral 20.
• Figure 2 is a plan view of a stacked periodic structure.
• the structure comprises four rectangular cells labelled XI, X2, Yl, Y2, each comprising a diffraction grating, for example a grating as shown schematically in figure 1.
• the received signals at the pixels of an image capturing device in a first order scatterometry configuration may be a result of interference between first diffraction orders of the upper and bottom gratings within a stacked periodic structure that have the same pitch (groove spacing of the printed pattern).
• the diffracted EM field E from either grating may be given as:
• Au and A L represent amplitudes of the diffraction orders of individual gratings and phases Yu and T correspond to the topographic phases stemming from stack parameters (e.g. thicknesses of stack layers, optical constants, reflection and transmission at every interface within stack) common to the positive and negative diffraction orders.
• P represents the pitch, or period of the grating pattern.
• the intensity I of each of the diffraction orders may depend on both the diffraction efficiencies of the gratings and the topographic phase difference - (Yu— Y 1- ) . /o represents an intentional offset used in SCOL overlay targets.
• the overlay value may be extracted from EQ. 3.
• Figure 3 depicts a captured image of zero, first and second diffraction orders in a thin stack, e.g. a stack of thin layers.
• the image is typically formed at the pupil plane of an image capturing device in a system such as described further herein with reference to figure 6, using a pupil lens, not shown, also referred to as a“collection pupil”, or“pupil”.
• the x axis represents positions P along an axis perpendicular to the direction of the lines of the diffraction gratings.
• the intensity difference between two random angles of illumination e.g. pupil pixels
• Y (/ — Y I ) is mostly due to different topographic phase- (Y (/ — Y I ). Therefore, the optical path difference between angles of illumination will cause different intensity in the collection pupil.
• the variations of the topographic phase over the pupil plane is small and therefore the intensity may vary“slowly” and mono tonic ally.
• Figure 4 depicts a captured image of zero, first and second diffraction orders in a thick stack, e.g. a stack including thicker layers than those of figure 3.
• a thick stack e.g. a stack including thicker layers than those of figure 3.
• the fringe pattern in the ⁇ first diffraction order may hold important information regarding asymmetries in a stacked periodic structure. Overlay may be one of these asymmetries.
• the positive and negative or + and - diffraction patterns may be compared to identify an overlay between successive layers.
• Embodiments of the invention are not limited to stacks of particular thickness and may be used even for stacks of the kind shown in figure 3 as described further herein. [0028] In a hypothetical case where there is a perfect symmetric stacked periodic structure without any overlay, it may be expected that there will be mirror symmetry of the fringe pattern between the ⁇ diffraction orders relative to the pupil center.
• the phase of each illumination angle may be slightly altered.
• the interference fringes which may be generated, when rendered relative to the collection pupil, may no longer possess mirror symmetry. Therefore some embodiments of the invention may comprise comparing the + and - diffraction patterns to calculate the overlay between successive layers, for example by comparing interference fringe positions to identify any asymmetry between the ⁇ diffraction patterns.
• the fringes in one or both of the + and - diffraction patterns may be translated in the collection pupil thereby breaking the symmetry. The distance moved relative to the interference fringe length may be proportional to the overlay relative to the pitch of the grating.
• the distance may be determined relative to the axis of symmetry in the hypothetical pattern that would be present absent any cause of asymmetry, for example zero on the x axis shown in figure 3.
• the overlay error between successive layers may be may be calculated by analyzing and comparing the interference fringe positions relative to the pupil, or center axis, for example analyzing image intensity as a function of position in the image.
• the comparison of the ⁇ diffraction patterns may comprise determining a characteristic frequency of the + and - diffraction patterns, or fringes, for example in a manner described further herein.
• this characteristic frequency may not be a sharp frequency but rather a‘wider’ frequency, or frequency band, since the density of the interference fringes may change over the pupil.
• this frequency may be extracted by manipulating, e.g. via mathematical analysis, the intensity as a function of pupil position, for example analyzing the frequency as a function of pixel position in the pupil plane.
• the manipulation the intensity as a function of pupil position may be carried out via FFT.
• Figure 5 depicts the FFT result (magnitude) of a SCOL measurement according to some embodiments of the invention.
• the characteristic frequency is a peak in intensity and is different for the + and - first order diffraction patterns indicating an overlay.
• the Fourier transform term of EQ. 2 may be given in EQ.
• a robust self-correlation algorithm for imaging overlay (“OVL”) approach can be used. Namely, at the first step the center of symmetry of zero order pupil image can be found using self-correlation between zero order image with its flipped image. At the second step the position of maximum self-correlation between, for example, image of -1 DO and flipped image of +1 DO can be found.
• Regions of interest (“ROIs”) should be chosen within the areas where ⁇ 1 diffraction orders have non-zeros signals, as shown in figure 4. Note that the ROIs should be defined symmetrically with respect to zero order center of symmetry position. The flipping of +1 DO image can also be performed with respect to zero order center position found in the previous step.
• the overlay value in EQ. 5 may be detected by analyzing a single grab, or image capture, of a single cell. In such embodiments, no extra cells/grabs are needed for this metrology operation thereby saving on time and processing power.
• OVL value can be found using EQ. 6.
• S +1 and S 1 are signals corresponding to ⁇ 1 diffraction orders.
• aspects of a layered manufacturing process other than overlay such as sidewall angle and top tilt, also may be capable of destroying the symmetry of interference fringes.
• the phase contributions of such aspects may have the same effect as overlay errors, in that the interference fringes move relative to the pupil, the amplitude contributions may not cause any movement of the interference fringes but rather only alter their intensity. In such situations, there may be no amplification of the interference fringe asymmetry from amplitude contributions and thus the effect on the detection of overlay error is minor. Therefore systems and methods according to some embodiments of the invention may have an advantage in providing a measurement of overlay that is less affected by other causes of fringe asymmetry.
• the amplitude contribution may be isolated.
• an asymmetry factor may be determined for asymmetry in the + and - diffraction patterns not caused by overlay.
• One possible equation for determining an asymmetry factor is shown below by way of example in EQ. 7:
• the value of the asymmetry factor will be 1 (irrelevant of overlay). Any other value will indicate the direction and magnitude of the asymmetry.
• the asymmetry factor may be used to correct the overlay value from EQ. 5 and remove the asymmetry magnification, in other words the asymmetry factor may be applied to the overlay calculation, for example resulting in EQ. 8: EQ. 8
• Jm can represent the imaginary part of a complex expression or number.
• the FFT procedure may be most effective when at least two fringes are available in the collection pupil. For a typical semiconductor manufacturing process, this requires a stack of at least 4pm high. Therefore, in typical current processes the use of FFT would be most effective for thin stacks of layers as described above.
• the FFT procedure may be replaced by other techniques such as but not limited to fitting procedures or derivative procedures. Such alternative procedures may be suitable for a wide range of stack thickness but may be more suitable than FFT for thinner stacks.
• Some embodiments of the invention may lead to significant improvement over known processes for overlay measurement. Some known processes require analysis of signals from multiple cells, for example deriving an overlay value from EQ. 2, which can result in cumulative errors being included. Some such processes suffer from strong dependency on process variations which increase the metrology inaccuracy. By contrast, in some embodiments of the invention, signal analysis may be improved by single cell-single grab scatterometry measurement which may overcome a large portion of such inaccuracies.
• all available pupil pixels are viewed as collective data to analyze the pupil function behavior, which may act to improve the signal to noise ratio of the method. This is in contrast to analysis of intensity differences between pairs of pixels in corresponding diffraction patterns.
• Any asymmetries in the diffraction grating may contribute to both the phases and the amplitudes difference between ⁇ first diffraction orders. While analyzing the pupil intensity, the amplitudes differences are amplified and can substantially affect the resultant overlay. According to some embodiments of the invention the effects of such asymmetries may be mitigated.
• FIG. 6 is a schematic diagram of a system 100 according to some embodiments of the invention.
• System 100 comprises an imaging system 105, analysis unit 160 and controller 180.
• Imaging system 105 comprises an illumination source 110. This may be any suitable illumination source known to those skilled in the art.
• the image analysis unit 160 may comprise one or more processors, as is known in the art.
• the processors may implement instructions, for example in the form of a computer algorithm, that cause the system or the analysis unit to implement a method according to some embodiments of the invention.
• System 100 further comprises a pupil camera 130 such as a charge coupled device or“CCD” array arranged to receive diffracted radiation 99C and an analysis unit 160 arranged to analyze images generated by the pupil camera 130.
• a pupil camera 130 such as a charge coupled device or“CCD” array arranged to receive diffracted radiation 99C and an analysis unit 160 arranged to analyze images generated by the pupil camera 130.
• image capturing operations may be performed by an image capturing device such as pupil camera 130.
• Diffracted radiation 99C is directed by the beam splitter 150 to camera 130 via focus lens 140 and field stop 145.
• Pupil camera 130 is arranged to form an image from the diffracted radiation 99C at pupil plane 131, as is known in the art.
• the illumination may comprise but is not limited to illumination with particle beams such as in ebeam systems or exposure to radiation such as x-rays and any other form of electromagnetic radiation.
• Controller 180 is configured to control the operation of imaging system 105 including stage 95.
• Stage 95 may be movable.
• controller 180 may control imaging system 105, and/or the position of the stage 95 supporting the wafer 80, to scan a target on wafer to capture pupil images at different locations on the target.
• the operation of controller 180 may be based in part on signals from the analysis unit 160.
• Figure 7 is a flowchart illustrating a method according to some embodiments of the invention. The operations shown in figure 7 may for example be carried out in an analysis unit in a system such as analysis unit 160.
• the series of operations shown in figure 7 begins with operation 710, illuminating stacked periodic structures with illumination to form + and - first order diffraction patterns from the periodic structures.
• the illumination may for example be generated by a pupil camera such as camera 130 shown in figure 7.
• Operation 710 may be followed by operation 720, capturing an image of the stacked periodic structures including + and - diffraction patterns.
• operations 710 and 720 are not included.
• operations 710 and 720 may be replaced by receiving the images of the stacked periodic structures, for example from an image capturing device.
• the + and - diffraction patterns in the image are compared to calculate the overlay between successive layers.
• the comparison may involve analysis of an image, for example using any of the methods described herein
• the amount of the overlay may be compared, according to some embodiments of the invention, with a predetermined threshold.
• the threshold may be set at a level of tolerance for a particular manufacturing process.
• An alert may be generated if the overlay exceeds the threshold.
• the alert may comprise any one or more of a visual indication on a viewing screen, an audible warning and any other form of alert known to those skilled in the art.
• calculation of an overlay above a certain threshold may trigger an automatic shut down or cessation of a manufacturing operation.
• a higher threshold may be used to trigger a cessation than one that leads to an alert.
• a system may be enabled to operate according to the invention through different software, implemented for example in a processor in controller 180, using a currently available metrology system.
• some embodiments of the invention provide a computer readable medium, transitory or non-transitory, comprising instructions which when implemented in a processor of a semiconductor metrology system cause the system to operate according to any of the methods described herein.
• These computer program instructions may also be stored in a computer readable medium that can direct a computer, other programmable data processing apparatus, or other devices to function in a particular manner, such that the instructions stored in the computer readable medium produce an article of manufacture including instructions which implement the function/act specified in the flowchart and/or portion diagram or portions thereof.
• the computer program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other devices to cause a series of operational steps to be performed on the computer, other programmable apparatus or other devices to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide processes for implementing the functions/acts specified in the flowchart and/or portion diagram or portions thereof.
• each portion in the flowchart or portion diagrams may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s).
• the functions noted in the portion may occur out of the order noted in the figures. For example, two portions shown in succession may, in fact, be executed substantially concurrently, or the portions may sometimes be executed in the reverse order, depending upon the functionality involved.
• each portion of the portion diagrams and/or flowchart illustration, and combinations of portions in the portion diagrams and/or flowchart illustration can be implemented by special purpose hardware -based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.
• an embodiment is an example or implementation of the invention.
• the various appearances of "one embodiment”, “an embodiment”, “certain embodiments” or “some embodiments” do not necessarily all refer to the same embodiments.
• various features of the invention may be described in the context of a single embodiment, the features may also be provided separately or in any suitable combination. Conversely, although the invention may be described herein in the context of separate embodiments for clarity, the invention may also be implemented in a single embodiment.
• Certain embodiments of the invention may include features from different embodiments disclosed above, and certain embodiments may incorporate elements from other embodiments disclosed above.
• the disclosure of elements of the invention in the context of a specific embodiment is not to be taken as limiting their use in the specific embodiment alone.
• the invention can be carried out or practiced in various ways and that the invention can be implemented in certain embodiments other than the ones outlined in the description above.

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