WO2019134208A1 - 5g通讯高频信号板镀金蚀刻工艺 - Google Patents

5g通讯高频信号板镀金蚀刻工艺 Download PDF

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Publication number
WO2019134208A1
WO2019134208A1 PCT/CN2018/074899 CN2018074899W WO2019134208A1 WO 2019134208 A1 WO2019134208 A1 WO 2019134208A1 CN 2018074899 W CN2018074899 W CN 2018074899W WO 2019134208 A1 WO2019134208 A1 WO 2019134208A1
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Prior art keywords
gold
plating
gold plating
frequency signal
etching
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PCT/CN2018/074899
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English (en)
French (fr)
Inventor
刘继挺
刘庆峰
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昆山首源电子科技有限公司
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Publication of WO2019134208A1 publication Critical patent/WO2019134208A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/38—Pretreatment of metallic surfaces to be electroplated of refractory metals or nickel
    • C25D5/40—Nickel; Chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/227—Drying of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/48—Electroplating: Baths therefor from solutions of gold
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Definitions

  • the invention relates to a manufacturing process of a high-frequency signal board, in particular to a manufacturing process of a 5G communication high-frequency signal board.
  • the fifth generation mobile phone mobile communication standard also known as the fifth generation mobile communication technology, foreign language abbreviation: 5G. It is also an extension after 4G. It is under study and the network speed can reach 5M/S-6M/S. 5G mainly covers mobile communications, Wi-Fi, high-speed wireless data transmission and other fields. From the user experience, 5G has a higher speed and wider bandwidth. It is expected that the 5G network speed will be 10 times higher than that of 4G. It takes only a few seconds to download a high-definition movie, which can satisfy consumers' virtual reality and super. Higher network experience requirements such as HD video.
  • 5G has higher reliability and lower time delay, which can meet the specific needs of industrial applications such as intelligent manufacturing and automatic driving, broaden the development space of the fusion industry, and support economic and social innovation and development. It can be seen that 5G requires a faster transmission rate, lower transmission delay and higher reliability than 4G. Therefore, the requirement for the 5G communication to the circuit board is that the transmission rate is fast, the transmission delay is low, and the reliability is good.
  • the speed of signal transmission is related to the material. Scientific practice has proved that among the common conductor materials of circuit boards, the materials with the best current transmission in metal materials are gold, aluminum and copper. Therefore, in order to meet the transmission requirements, the whole board of the circuit board The gold-plated etching process is the first choice for meeting 5G technology.
  • the gold plating process In the traditional gold plating process requirements, the gold plating process generally uses wire stripping, and the gold plating process end customer does not allow the use of gold plated wires in the production of the circuit board, thus bringing many technical problems to the production.
  • the etching etchant penetrates into the gold-copper junction along the gap between the gold and copper during etching, resulting in etching gaps and open circuits, which is a technical problem in the gold plating process.
  • the circuit is etched using acid after gold plating. Etching, also need to consider the cost of the outer laminate film, exposure, development, etching, but also affect the transmission rate and reliability of the 5G signal board.
  • the invention provides a gold plating etching process for a 5G communication high-frequency signal board. After gold plating, the alkaline etching process is directly carried out, the gold etching process is omitted, and the outer etching process is saved, thereby saving the cost of the outer lamination film, exposure and development, and improving the flow rate.
  • the requirement of the 5G communication to the circuit board is satisfied, that is, the 5G communication high-frequency signal board of the invention has a fast transmission rate, low transmission delay and good reliability.
  • a technical solution adopted by the present invention is to provide a gold plating etching process for a 5G communication high-frequency signal board, which is carried out according to the following steps:
  • Outer layer dry film use the required circuit and gold-plated area to open the window for gold plating, and open the whole window in the outer layer of the gold-plated area;
  • Gold plating of the plug Before the gold plating of the plug, the copper surface needs to be cleaned and dried, and the acidity is ensured that the copper surface is not oxidized. In the gold plating process, the nickel is first plated and then activated, and then gold plated. After gold plating, the gold surface is required to be shiny and not rough;
  • Film removal using sodium hydroxide to remove the film
  • Alkaline etching is an alkaline etching solution.
  • the alkaline etching solution is an alkaline etching solution.
  • the line and the gold-plated area are protected by gold.
  • the stripping process will be a non-gold plating area. The dry film is peeled off, and the bare copper surface is leaked by the alkaline etching solution;
  • the alkaline etching solution comprises 50-250 g/L of copper chloride, 70-150 g/L of ammonium chloride and ammonia water, the pH is 9-10, and the etching temperature is 50-60 ° C;
  • the ratio of the ammonia water to the alkaline etching solution is (550-800): 1000.
  • the manufacturing process of the high-frequency signal board includes, for example, cutting, baking, inner layer wiring, electroplating, outer layer dry film, plug gold plating, film removal, alkaline etching, optical inspection, anti-welding, text, Paneling and electrical inspection.
  • the nickel plating solution used in the nickel plating process includes 250-300 g/L of nickel sulfate hexahydrate, 35-45 g/L of nickel chloride hexahydrate, and 35-45 g/L. Boric acid and a brightener, the ratio of the brightener to the nickel plating solution is (30-35): 1000.
  • the surface of the board is scanned by an optical inspection machine after the step of drying the outer layer and before the step of gold plating of the plug to detect line notches and pinholes.
  • the activation solution used in the activation treatment has a solution temperature of 50-55 ° C and a soaking time of 0.5-2 min during the activation treatment.
  • the gold plating solution used includes 2-2.5 g/L potassium cyanide and 0.6-0.8 g/L open-celling agent, and the gold plating temperature is 50-55 ° C, pH. The value is 3.2-3.5.
  • the concentration of the sodium hydroxide solution in the stripping step is 1.0%, and the stripping temperature is 38-42 °C.
  • the alkaline etching solution comprises 100-150 g/L of copper chloride, 90-120 g/L of ammonium chloride and ammonia water, and has a pH of 9.6-9.8.
  • the ratio of the ammonia water to the alkaline etching solution is (670-700): 1000.
  • the temperature at the time of etching is 52 to 58 °C.
  • the invention adopts alkaline etching instead of the traditional outer layer etching in the production process of the 5G communication high-frequency signal board, and directly goes to the alkaline etching process after gold plating, and the alkaline medicine has a weak ability to bite the gold surface, thereby making the gold surface protection
  • the circuit eliminates the gold plating and then goes through the outer etching process, saves the cost of the outer lamination film, exposure and development, and improves the flow rate.
  • the invention is brought about by the penetration of the acidic syrup into the gold and copper in the 5G communication high-frequency signal board.
  • the etching gap and the open circuit satisfy the requirement of the 5G communication to the circuit board, that is, the 5G communication high-frequency signal board of the invention has a fast transmission rate, low transmission delay and good reliability.
  • Embodiment A gold plating etching process for a 5G communication high-frequency signal board is performed as follows:
  • Outer layer dry film The required circuit and gold-plated area are windowed for gold plating. This process is equivalent to the outer film process.
  • the outer layer of the gold-plated area is opened as a whole, and the outer layer is dried and then scanned by an optical inspection machine. Surface to detect line gaps and pinholes;
  • Gold plating of the plug Before the gold plating of the plug, the copper surface needs to be cleaned and dried, and the acidity is ensured that the copper surface is not oxidized.
  • nickel is firstly plated to ensure a good bonding force between the nickel layer and the copper layer of the high frequency signal board.
  • the newly formulated solution uses a chemically pure reagent. In actual production, the pH is adjusted with 10% sulfuric acid or 10% sodium hydroxide, and electrolysis is performed with a small current of 1.0 A.
  • the formulation of the nickel plating solution is 250-300 g/L.
  • Nickel hexahydrate, 35-45g/L nickel chloride hexahydrate, 35-45g/L boric acid and brightener the ratio of brightener to nickel plating solution is (30-35): 1000, after nickel plating, Since nickel is easily passivated in air, it is activated within 1-3 min after nickel plating.
  • the activation solution is CP40, 120g/L, the solution temperature is controlled at 50-55 ° C, the soaking time is about 0.5-2 min; gold plating solution Including 2-2.5g / L of potassium cyanide, 0.6-0.8g / L of the opener B, the temperature is 50-55 ° C, the pH is 3.2-3.5, the current is selected as a small current of 1.0A / m2, After gold plating, the gold surface is required to be shiny and not rough;
  • Film removal use sodium hydroxide to remove the film.
  • concentration of sodium hydroxide solution is 1.0%, and the film removal temperature is 38-42 °C.
  • After removing the film check whether the edge of the line is not removed, so as to avoid the line side of the alkaline etching process. Residual copper or no burrs;
  • Alkaline etching is an alkaline etching solution.
  • the alkaline etching solution is an alkaline etching solution.
  • the line and the gold-plated area are protected by gold.
  • the stripping process will be a non-gold plating area. The dry film is peeled off, and the copper surface is barely leaked for etching liquid;
  • the alkaline etching solution comprises 100-150 g/L of CuCl 2 (copper chloride), 90-120 g/L of NH 4 Cl (ammonium chloride), and NH 3 ⁇ H 2 0 (ammonia water), wherein the ammonia water and the alkali
  • the ratio of the etching solution is (670-700): 1000, the pH of the alkaline etching solution is 9.6-9.8; the main chemical reaction equation of the alkaline etching is CuCl 2 + NH 3 ⁇ Cu(NH 3 ) 4 Cl 2
  • the copper on the surface of the high-frequency signal board is oxidized by ⁇ Cu(NH 3 ) 4 ⁇ 2+ complex ions, and the equation of the etching reaction is: Cu+Cu(NH 3 ) 4 Cl 2 ⁇ 2Cu(NH 3 ) 2 Cl, generated ⁇ Cu (NH 3) 2 ⁇ 1+ does not have the capability of etching, in the case of excess ammonia and chloride ions are present, can quickly
  • the manufacturing process of the high-frequency signal board includes in turn, baking, inner layer wiring, electroplating, outer layer dry film, plug gold plating, film removal, alkaline etching, optical inspection, anti-welding, text, paneling and electricity Visual inspection.
  • the gold surface is obviously brighter than the copper surface, and the gradation of the optical inspection machine needs to be adjusted.
  • the gradation range of the general copper panel is 130-170. Between the scanning of the entire plate gold plated gray scale needs to be adjusted to between 70-120.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)

Abstract

一种5G通讯高频信号板镀金蚀刻工艺，按下述步骤进行：外层干膜、插头镀金、去膜和碱性蚀刻，碱性蚀刻液包括氯化铜50-250g/L、氯化铵70-150g/L和氨水，pH值为9-10，蚀刻时温度为50-60℃；所述氨水与所述碱性蚀刻液的比例为(550-800)：1000。该5G通讯高频信号板镀金蚀刻工艺，镀金后直接走碱性蚀刻工艺，省去镀金后走外层蚀刻流程，节省外层压膜、曝光、显影的成本，提高了流速，满足了5G通讯对线路板的要求，即该5G通讯高频信号板传输速率快，传输延时低且可靠性好。

Description

5G通讯高频信号板镀金蚀刻工艺 技术领域
本发明涉及一种高频信号板的制作工艺，尤其涉及一种5G通讯高频信号板制造工艺。
背景技术
第五代移动电话行动通信标准，也称第五代移动通信技术，外语缩写：5G。也是4G之后的延伸，正在研究中，网速可达5M/S-6M/S。5G主要涵盖移动通信、Wi-Fi，高速无线数据传输等领域。从用户体验看，5G具有更高的速率、更宽的带宽，预计5G网速将比4G提高10倍左右，只需要几秒即可下载一部高清电影，能够满足消费者对虚拟现实、超高清视频等更高的网络体验需求。从行业应用看，5G具有更高的可靠性，更低的时延，能够满足智能制造、自动驾驶等行业应用的特定需求，拓宽融合产业的发展空间，支撑经济社会创新发展。可见，5G相对于4G则要求更快的传输速率，更低的传输延时和更高的可靠性，因此对5G通讯对线路板的要求就是传输速率快，传输延时低及可靠性要好。
信号传输的快慢与材料有关系，科学实践证明，在线路板常用导体材料中，电流在金属材料传输性能最好的材料依次为金、铝、铜，因此为满足传输要求，线路板的整板镀金蚀刻工艺对于满足5G技术为首选要求。
传统的镀金工艺要求中，镀金流程一般使用导线去镀，镀金工艺流程终端客户不允许在线路板生产中使用镀金导线生产，因此给生产带来许多技术难题。
在传统的镀金蚀刻工艺中，由于镀金区域比非镀金区域高，两者不在同一平面，采用传统的外层干膜蚀刻流程，在镀金区域与非镀金区域的连接处，因高低差干膜无法完全填满，蚀刻时蚀刻药水沿着金铜的缝隙渗入金铜相接处，从而导致的蚀刻缺口、断路，因此为镀金工艺上的技术难题；另外在传统工艺中，镀金后线路蚀刻使用酸性蚀刻，还需要考虑外层压膜、曝光、显 影、蚀刻的成本，也影响5G信号板的传输速率和可靠性。
发明内容
本发明提供了一种5G通讯高频信号板镀金蚀刻工艺，镀金后直接走碱性蚀刻工艺，省去镀金后走外层蚀刻流程，节省外层压膜、曝光、显影的成本，提高了流速，满足了5G通讯对线路板的要求，即本发明的5G通讯高频信号板传输速率快，传输延时低且可靠性好。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种5G通讯高频信号板镀金蚀刻工艺，按下述步骤进行：
外层干膜:将需要的线路及镀金区域开窗处理做镀金用,在镀金区域外层做整体开窗；
插头镀金：在插头镀金前，铜面需经过清洗烘干及酸性保证铜面不被氧化，镀金工艺中，先镀镍后进行活化处理，然后镀金，镀金后要求金面有光泽，不粗糙；
去膜：使用氢氧化钠去膜；
碱性蚀刻：碱性蚀刻使用的药水为碱性蚀刻液，在碱性蚀刻工艺中，镀金区域镀金后，线路及镀金区域有金的保护，在碱性蚀刻前，去膜流程将非镀金区域的干膜剥离，铜面裸漏供碱性蚀刻液咬蚀；
所述碱性蚀刻液包括50-250g/L的氯化铜、70-150g/L的氯化铵和氨水，pH值为9-10，蚀刻时温度为50-60℃；
所述氨水与所述碱性蚀刻液的比例为(550-800)：1000。
进一步地说，所述高频信号板的制作工艺依次包括开料、烘板、内层线路、电镀、外层干膜、插头镀金、去膜、碱性蚀刻、光学检验、防焊、文字、铣板和电测目检。
进一步地说，所述的插头镀金步骤中，镀镍流程使用的镀镍溶液包括250-300g/L的六水硫酸镍、35-45g/L的六水氯化镍、35-45g/L的硼酸和光亮剂，所述光亮剂与所述镀镍溶液的比例为(30-35)：1000。
进一步地说，在所述的外层干膜的步骤后且在插头镀金的步骤前用光学 检验机扫描板面以检测线路缺口及针孔。
进一步地说，所述的活化处理采用的活化液在活化处理时，溶液温度为50-55℃，浸泡时间为0.5-2min。
进一步地说，进行完所述的碱性蚀刻后直接进行清洗及烘干。
进一步地说，所述的插头镀金流程中，所用的镀金溶液包括2-2.5g/L的氰化亚金钾和0.6-0.8g/L的开缸剂，镀金温度为50-55℃，pH值为3.2-3.5。
进一步地说，所述的去膜步骤中的氢氧化钠溶液的浓度为1.0％，去膜温度为38-42℃。
进一步地说，所述碱性蚀刻液包括100-150g/L的氯化铜、90-120g/L的氯化铵和氨水，pH值为9.6-9.8。
进一步地说，所述氨水与所述碱性蚀刻液的比例为(670-700)：1000。
进一步地说，蚀刻时温度为52-58℃。
本发明的有益效果是：
本发明在5G通讯高频信号板的制作流程中，使用碱性蚀刻代替传统的外层蚀刻，镀金后直接走碱性蚀刻工艺，碱性药水咬蚀金面能力较弱，从而使金面保护线路，省去镀金后走外层蚀刻流程，节省外层压膜、曝光、显影的成本，提高了流速，本发明在5G通讯高频信号板中因酸性药水渗入金铜相接处带来的蚀刻缺口、断路，满足了5G通讯对线路板的要求，即本发明的5G通讯高频信号板传输速率快，传输延时低且可靠性好。
本发明的上述说明仅是本发明技术方案的概述，为了能够更清楚了解本发明的技术手段，并可依照说明书的内容予以实施，以下以本发明的较佳实施例并详细说明如后。
具体实施方式
以下通过特定的具体实施例说明本发明的具体实施方式，本领域技术人员可由本说明书所揭示的内容轻易地了解本发明的优点及功效。本发明也可以其它不同的方式予以实施，即，在不背离本发明所揭示的范畴下，能予不同的修饰与改变。
实施例：一种5G通讯高频信号板镀金蚀刻工艺，按下述步骤进行：
外层干膜:将需要的线路及镀金区域开窗处理做镀金用,此工艺流程相当于外层正片流程，在镀金区域外层做整体开窗，外层干膜后用光学检验机扫描板面以检测线路缺口及针孔；
插头镀金：在插头镀金前，铜面需经过清洗烘干及酸性保证铜面不被氧化，镀金工艺中，先镀镍，为保证镍层与高频信号板板的铜层良好的结合力，新配的溶液使用化学纯试剂，在实际生产中用10％的硫酸或10％的氢氧化钠调节pH值，用1.0A的小电流电解，镀镍溶液的配方为：250-300g/L的六水硫酸镍、35-45g/L的六水氯化镍、35-45g/L的硼酸和光亮剂，光亮剂与与镀镍溶液的比例为(30-35)：1000，镀镍后，由于镍容易在空气中钝化，在镀镍后在1-3min之内进行活化处理，活化液为CP40,120g/L，溶液温度控制在50-55℃，浸泡时间0.5-2min左右；镀金溶液包括2-2.5g/L的氰化亚金钾，0.6-0.8g/L的开缸剂B，温度为50-55℃，pH值为3.2-3.5，电流选用1.0A/㎡的小电流，镀金后要求金面有光泽，不粗糙；
去膜：使用氢氧化钠去膜，氢氧化钠的溶液浓度为1.0％，去膜温度为38-42℃，去膜后检查线路边缘有无去膜不尽，以免碱性蚀刻流程有线路边残铜或无毛刺；
碱性蚀刻：碱性蚀刻使用的药水为碱性蚀刻液，在碱性蚀刻工艺中，镀金区域镀金后，线路及镀金区域有金的保护，在碱性蚀刻前，去膜流程将非镀金区域的干膜剥离，铜面裸漏供蚀刻液咬蚀；
所述碱性蚀刻液包括100-150g/L的CuCl 2(氯化铜)、90-120g/L的NH 4Cl(氯化铵)和NH 3·H 20(氨水)，其中氨水与碱性蚀刻液的比例为(670-700)：1000，碱性蚀刻液的pH值为9.6-9.8；碱性蚀刻的主要的化学反应方程式为CuCl 2+NH 3→Cu(NH 3) 4Cl 2，高频信号板表面的铜被〈Cu(NH 3) 4〉 2+络离子氧化，其蚀刻反应的方程式为：Cu+Cu(NH 3) 4Cl 2→2Cu(NH 3) 2Cl,所生成的{Cu(NH 3) 2} 1+不具备蚀刻能力，在过量的氨水和氯离子存在的情况下，能很快的被空气中的氧气氧化，生产具备蚀刻能力的{Cu(NH 3) 4} 2+络离子，其再生反应的方程式为：2Cu(NH 3) 2Cl+2NH 4Cl+2NH 3+1/2O 2→2Cu(NH 3) 4Cl+H 2O，反应时CuCl 2、NH 4Cl和NH 3·H 20的添加按照蚀刻比重来添加，蚀刻时温度为 52-58℃，蚀刻的时间及线速按照蚀刻的铜厚来设定，一般蚀刻后有剥锡段，剥锡液的主要成分为硝酸，硝酸为强酸，金面虽有抗腐蚀能力，但是在反应中金面会变薄，另外，外观也会变得粗糙，影响成品的金厚及外观，所以碱性蚀刻后不过剥锡段，走清洗烘干流程将高频信号板表面清洗干净。
所述高频信号板的制作工艺依次包括开料、烘板、内层线路、电镀、外层干膜、插头镀金、去膜、碱性蚀刻、光学检验、防焊、文字、铣板和电测目检。
在光学检验中，由于金面的反光度与铜面的反光度不同，金面较铜面明显较亮，需要将光学检验机的灰度调整，一般的铜面板的灰度范围在130-170之间，扫描整板镀金板灰度需要调整到70-120之间。
在防焊过程中，由于客户产品为高频信号，对信号传输有很高的要求，在信号传输与接收中不能有杂音与串音，因此要求线路表面不能刷磨，外层前处理使用喷砂和酸洗流程清洗板面。
在电测目检过程中，按照IPC三级标准检验。
以上所述仅为本发明的实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书内容所作的等效结构，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (10)

  1. 一种5G通讯高频信号板镀金蚀刻工艺，其特征在于：按下述步骤进行：
    外层干膜:将需要的线路及镀金区域开窗处理做镀金用,在镀金区域外层做整体开窗；
    插头镀金：在插头镀金前，铜面需经过清洗烘干及酸性保证铜面不被氧化，镀金工艺中，先镀镍后进行活化处理，然后镀金，镀金后要求金面有光泽，不粗糙；
    去膜：使用氢氧化钠去膜；
    碱性蚀刻：碱性蚀刻使用的药水为碱性蚀刻液，在碱性蚀刻工艺中，镀金区域镀金后，线路及镀金区域有金的保护，在碱性蚀刻前，去膜流程将非镀金区域的干膜剥离，铜面裸漏供碱性蚀刻液咬蚀；
    所述碱性蚀刻液包括50-250g/L的氯化铜、70-150g/L的氯化铵和氨水，pH值为9-10，蚀刻时温度为50-60℃；
    所述氨水与所述碱性蚀刻液的比例为(550-800)：1000。
  2. 根据权利要求1所述5G通讯高频信号板镀金蚀刻工艺，其特征在于：所述高频信号板的制作工艺依次包括开料、烘板、内层线路、电镀、外层干膜、插头镀金、去膜、碱性蚀刻、光学检验、防焊、文字、铣板和电测目检。
  3. 根据权利要求1所述5G通讯高频信号板镀金蚀刻工艺，其特征在于：所述的插头镀金步骤中，镀镍流程使用的镀镍溶液包括250-300g/L的六水硫酸镍、35-45g/L的六水氯化镍、35-45g/L的硼酸和光亮剂，所述光亮剂与所述镀镍溶液的比例为(30-35)：1000。
  4. 根据权利要求1所述5G通讯高频信号板镀金蚀刻工艺，其特征在于：在所述的外层干膜的步骤后且在插头镀金的步骤前用光学检验机扫描板面以检测线路缺口及针孔。
  5. 根据权利要求1所述5G通讯高频信号板镀金蚀刻工艺，其特征在于：进行完所述的碱性蚀刻后直接进行清洗及烘干。
  6. 根据权利要求1所述5G通讯高频信号板镀金蚀刻工艺，其特征在于：所述的插头镀金流程中，所用的镀金溶液包括2-2.5g/L的氰化亚金钾和 0.6-0.8g/L的开缸剂，镀金温度为50-55℃，pH值为3.2-3.5。
  7. 根据权利要求1所述的5G通讯高频信号板镀金蚀刻工艺，其特征在于：所述的去膜步骤中的氢氧化钠溶液的浓度为1.0％，去膜温度为38-42℃。
  8. 根据权利要求1所述的5G通讯高频信号板镀金蚀刻工艺，其特征在于：所述碱性蚀刻液包括100-150g/L的氯化铜、90-120g/L的氯化铵和氨水，pH值为9.6-9.8。
  9. 根据权利要求1所述的5G通讯高频信号板镀金蚀刻工艺，其特征在于：所述氨水与所述碱性蚀刻液的比例为(670-700)：1000。
  10. 根据权利要求1所述的5G通讯高频信号板镀金蚀刻工艺，其特征在于：蚀刻时温度为52-58℃。
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