CN110113882B - 新能源汽车印刷电路板的蚀刻生产线及蚀刻方法 - Google Patents
新能源汽车印刷电路板的蚀刻生产线及蚀刻方法 Download PDFInfo
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- CN110113882B CN110113882B CN201910375087.3A CN201910375087A CN110113882B CN 110113882 B CN110113882 B CN 110113882B CN 201910375087 A CN201910375087 A CN 201910375087A CN 110113882 B CN110113882 B CN 110113882B
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- Prior art keywords
- circuit board
- etching
- driven
- pipeline
- driving
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- 238000005530 etching Methods 0.000 title claims abstract description 86
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims description 9
- 239000007788 liquid Substances 0.000 claims abstract description 34
- 230000005540 biological transmission Effects 0.000 claims abstract description 10
- 238000007664 blowing Methods 0.000 claims abstract description 7
- 238000005507 spraying Methods 0.000 claims abstract description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 25
- 238000003860 storage Methods 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 15
- 239000011889 copper foil Substances 0.000 claims description 13
- 239000007921 spray Substances 0.000 claims description 4
- 238000000861 blow drying Methods 0.000 claims description 3
- 239000003651 drinking water Substances 0.000 claims 1
- 235000020188 drinking water Nutrition 0.000 claims 1
- 238000010408 sweeping Methods 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000005086 pumping Methods 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910375087.3A CN110113882B (zh) | 2019-05-07 | 2019-05-07 | 新能源汽车印刷电路板的蚀刻生产线及蚀刻方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910375087.3A CN110113882B (zh) | 2019-05-07 | 2019-05-07 | 新能源汽车印刷电路板的蚀刻生产线及蚀刻方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110113882A CN110113882A (zh) | 2019-08-09 |
CN110113882B true CN110113882B (zh) | 2020-11-24 |
Family
ID=67488535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910375087.3A Active CN110113882B (zh) | 2019-05-07 | 2019-05-07 | 新能源汽车印刷电路板的蚀刻生产线及蚀刻方法 |
Country Status (1)
Country | Link |
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CN (1) | CN110113882B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111556661B (zh) * | 2020-05-22 | 2021-04-23 | 广州冰钫商贸有限公司 | 一种pcb板蚀刻机 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203934125U (zh) * | 2014-04-30 | 2014-11-05 | 遂宁市维海电子科技有限公司 | 一种fpc蚀刻装置 |
CN204918774U (zh) * | 2015-09-10 | 2015-12-30 | 贵溪凌云铜业有限公司 | 一种蚀刻液可循环式蚀刻机 |
CN205718344U (zh) * | 2016-06-21 | 2016-11-23 | 盐城工学院 | 平板显示屏玻璃湿化学加工低风速吹扫残液的装置 |
CN108356009A (zh) * | 2017-12-28 | 2018-08-03 | 南京康翱峰自动化科技有限公司 | 一种新型自动清洗装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW417414B (en) * | 1999-03-20 | 2001-01-01 | Wus Printed Circuit Co Ltd | Device and method for developing and etching dry printed circuit board |
JP4048783B2 (ja) * | 2002-01-18 | 2008-02-20 | ソニー株式会社 | 電子装置の製造方法 |
JP2013021111A (ja) * | 2011-07-11 | 2013-01-31 | Dainippon Printing Co Ltd | 導電性バンプ付き基板シートの製造装置および製造方法 |
JP2016207882A (ja) * | 2015-04-24 | 2016-12-08 | 三菱電機株式会社 | ウエットエッチング装置、ウエットエッチング方法、およびこれらを用いた半導体装置の製造方法 |
CN207375761U (zh) * | 2017-09-14 | 2018-05-18 | 重庆瀚渝再生资源有限公司 | 蚀刻液回收碱式氯化铜的处理系统 |
CN108235591B (zh) * | 2018-01-08 | 2020-08-18 | 昆山首源电子科技有限公司 | 5g通讯高频信号板镀金蚀刻工艺 |
-
2019
- 2019-05-07 CN CN201910375087.3A patent/CN110113882B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203934125U (zh) * | 2014-04-30 | 2014-11-05 | 遂宁市维海电子科技有限公司 | 一种fpc蚀刻装置 |
CN204918774U (zh) * | 2015-09-10 | 2015-12-30 | 贵溪凌云铜业有限公司 | 一种蚀刻液可循环式蚀刻机 |
CN205718344U (zh) * | 2016-06-21 | 2016-11-23 | 盐城工学院 | 平板显示屏玻璃湿化学加工低风速吹扫残液的装置 |
CN108356009A (zh) * | 2017-12-28 | 2018-08-03 | 南京康翱峰自动化科技有限公司 | 一种新型自动清洗装置 |
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Publication number | Publication date |
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CN110113882A (zh) | 2019-08-09 |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Etching production line and etching method of printed circuit board for new energy vehicles Effective date of registration: 20230105 Granted publication date: 20201124 Pledgee: Suining Fengfa Financing Guarantee Group Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980029897 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20201124 Pledgee: Suining Fengfa Financing Guarantee Group Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2022980029897 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Etching production line and etching method for printed circuit boards of new energy vehicles Granted publication date: 20201124 Pledgee: Suining Fengfa Financing Guarantee Group Co.,Ltd. Pledgor: SICHUAN HAIYING ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2024980001767 |