WO2019132302A1 - Échangeur de chaleur servant à refroidir un semiconducteur de puissance d'un véhicule écologique - Google Patents

Échangeur de chaleur servant à refroidir un semiconducteur de puissance d'un véhicule écologique Download PDF

Info

Publication number
WO2019132302A1
WO2019132302A1 PCT/KR2018/015439 KR2018015439W WO2019132302A1 WO 2019132302 A1 WO2019132302 A1 WO 2019132302A1 KR 2018015439 W KR2018015439 W KR 2018015439W WO 2019132302 A1 WO2019132302 A1 WO 2019132302A1
Authority
WO
WIPO (PCT)
Prior art keywords
cooling
header assembly
cooling tube
heat exchanger
power semiconductor
Prior art date
Application number
PCT/KR2018/015439
Other languages
English (en)
Korean (ko)
Inventor
김영일
채관교
류재윤
곽준영
정의택
Original Assignee
주식회사 고산
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 고산 filed Critical 주식회사 고산
Priority to CN201880063831.XA priority Critical patent/CN111165082B/zh
Publication of WO2019132302A1 publication Critical patent/WO2019132302A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds

Definitions

  • the present invention relates to a heat exchanger for cooling a power semiconductor of an environmentally friendly vehicle, and more particularly, to a heat exchanger for cooling a power semiconductor of an environmentally friendly vehicle. More particularly, the present invention relates to a heat exchanger It is possible to make the assembly easily by simple brazing method by brazing method for all the parts by making it into a lamination type through the brazing method, and it is possible to manufacture the lamination type so as to cool many power semiconductors while minimizing the volume of the heat exchanger In addition, it is possible to maximize the cooling efficiency by applying the cooling tube having the two-stage flow path, and to easily adjust the interval between the cooling tubes corresponding to the thickness of the power semiconductor by employing the bellows- For the cooling of power semiconductor in an eco-friendly vehicle Heat exchanger.
  • a hybrid vehicle uses electricity generated from a battery together with gasoline or diesel fuel as a power source, and drives the motor by using such power source.
  • the motors of such hybrid cars and electric vehicles obtain desired voltage and frequency by an inverter or a PCU (Power Control Unit) for converting direct current (DC) to alternating current (AC) It plays a role of converting the voltage and frequency appropriately through the control circuit.
  • a PCU Power Control Unit
  • the temperature of the junction portion may exceed 125 ° C. in order to safely operate the power semiconductor device because the high-temperature heat is generated not only at the rated output (continuous) of the inverter but also at a short- It is necessary to keep the temperature at the highest efficiency because the normal loss and the switching loss become larger as the temperature increases.
  • inverter cooling methods are divided into air cooling type and water cooling type.
  • inverter cooling is divided into case cooling method and device cooling method.
  • the air-cooled cooling system using the natural convection of the heat-dissipating fins has low heat transfer efficiency due to the characteristics of the inverter, so that the cooling performance is lowered. .
  • This water-cooled cooling system circulates a pump using a cooling line for a separate electric device composed of an eco-friendly vehicle battery cooling device and a motor cooling device, and the hot cooling water is cooled through a radiator for an electric device.
  • the inverter case itself has a water-cooled flow path for cooling the power semiconductor element formed in the casting, which is advantageous in that it can be integrally manufactured because it is cooled by a method of mutual contact and bonding.
  • a water-cooled flow path for cooling the power semiconductor element formed in the casting which is advantageous in that it can be integrally manufactured because it is cooled by a method of mutual contact and bonding.
  • the device cooling method a heat exchanger is inserted into an inverter case to cool both sides of the device in a water-cooled manner.
  • the device has a relatively good cooling performance, is easy to manufacture in accordance with the shape of the device, and has a small cost.
  • inverters to which a power semiconductor device is applied in an electric vehicle or a hybrid vehicle employ the above-described water cooling type cooling method and device cooling method.
  • a water cooling type cooling method So that the power semiconductor is cooled through surface contact.
  • Conventional heat exchangers for cooling power semiconductors have a plurality of cooling tubes which are simply bended so as to be in surface contact with each other for heat exchange with a plurality of power semiconductors, .
  • the conventional heat exchanger for cooling a power semiconductor in which a cooling tube bending a plurality of times so as to be in surface contact with the power semiconductor for heat exchange, is applied, has a complicated fabrication due to a bending structure, There is a problem in that the cooling efficiency is comparatively low due to the application of the inner channel to the simple one-stage channel structure.
  • the conventional power semiconductor cooling heat exchanger which is coupled with only the rubber O-ring between the header and the header as described above, depends on the lifetime of the rubber O-ring and the gap between the cooling tube and the power semiconductor element There is a problem in productivity that the heat exchanger must be assembled with the power semiconductor element.
  • Patent Document 1 Korean Laid-Open Patent Application No. 2015-0034918, published on May 20, 2014.
  • Patent Document 2 Registered Korean Patent No. 1510056, 2015.04.01.
  • Patent Document 3 Korean Laid-Open Patent Application No. 2015-0030594 No. 2015.03.20.
  • Patent Document 4 Korean Laid-Open Patent Application No. 2016-0109167 Publication No. 2016.09.21.
  • Patent Document 5 Published Korean Patent Publication No. 2017-0079177, Jul.
  • Patent Document 6 Korean Laid-Open Patent Application No. 2017-0079191 issued Jul. 10, 2017.
  • the present invention is characterized in that the cooling tubes are arranged in a plurality of rows, and through a bellows-type gap adjusting member between mutually adjacent headers connected to both ends of the cooling tube, So that it can be easily assembled and fixed by means of a brazing method for all parts, thereby providing a heat exchanger for power semiconductor cooling of an environmentally friendly vehicle.
  • the cooling tubes are arranged in a plurality of rows, and a bellows-type gap adjusting hole is formed between mutually adjacent headers connected to both ends of the cooling tube, And to cool a plurality of power semiconductors while minimizing the volume of the power semiconductor.
  • bellows type spacing control gauge By adopting bellows type spacing control gauge, it is possible to easily control the gap between cooling tubes corresponding to the thickness of power semiconductor. Therefore, it is applied to cooling of power semiconductors of various thicknesses to improve the compatibility of heat exchanger And the like.
  • a heat exchanger for cooling a power semiconductor of an environmentally friendly vehicle is a heat exchanger for cooling a power semiconductor of an environmentally friendly vehicle in which a plurality of power semiconductors for power supply of an environmentally friendly vehicle are inserted and fixed, ;
  • one end of the cooling tube is opened at one end and the other end is connected at the other end to a cooling tube disposed at the upper end of the cooling tube and a communication hole is formed at a lower portion and a connection hole is formed at an upper portion,
  • An upper header assembly connected to the pipe or discharge pipe to guide the cooling fluid introduced from the inlet pipe to the discharge pipe through the cooling tube;
  • the spacing regulator is provided in a bellows type so as to be compressed and deformed by a predetermined length, and has a hollow cylindrical shape at an upper end and a lower end thereof.
  • the spacing regulator includes a communication hole of the upper header assembly, a communication hole of the lower header assembly, And a bellows portion interposed between the connection portions and having upper and lower ends connected to the connection portion integrally with the bellows type.
  • the bellows portion is connected to the pair of connection portions by a bellows type, and has a bellows type having at least one wrinkle shape so as to correspond to the thickness of the power semiconductor inserted between neighboring portions of the cooling tube, It is preferable that the connection is formed.
  • the cooling tubes have a plurality of flow paths at regular intervals in the width direction and two flow paths vertically in the thickness direction and have a plurality of flow paths at regular intervals with respect to the width direction.
  • the upper header assembly, the lower header assembly, and the central header assembly are protruded toward the center of the inner space, which is spaced inwardly from the opened side ends by a certain distance in the width direction, It is preferable that a pair of stopper projections are formed while fixing the insertion and fixing length of the cooling tube through the stopper protrusion when the cooling tube is inserted and fixed to the end portion of the cooling tube.
  • the upper header assembly may include upper header frames having bending pieces at two sides orthogonal to each other in the circumferential direction and bending pieces at two sides orthogonal to each other in the circumferential direction, And a lower header frame which is mutually fixed through bending of the bending pieces.
  • the lower header assembly includes an upper header frame having bending pieces at two sides orthogonal to each other in the circumferential direction and bending pieces at two sides orthogonal to each other in the circumferential direction, And a lower header frame mutually fixed via bending of the bending pieces.
  • the center header assembly includes an upper header frame having bending pieces at two sides orthogonal to each other in the circumferential direction and bending pieces at two sides orthogonal to each other in the circumferential direction, And a lower header frame which is mutually fixed through bending of the bending pieces.
  • connection holes of the upper header assembly, the communication holes of the lower header assembly, and the communication holes of the central header assembly are assembled together with the ends of the inlet pipe, the exhaust pipe, It is preferable that a ring-shaped fixed rib having a certain thickness from the periphery is protruded by a predetermined length so as to be processed.
  • the inlet pipe, the exhaust pipe, the cooling tube, the upper header assembly, the lower header assembly, the central header assembly, and the spacer are provided as aluminum parts and fixed through a brazing method.
  • the cooling tubes are arranged in a plurality of rows, and a bellows-type gap adjusting member is interposed between mutually adjacent headers connected to both ends of the cooling tube. So that it can be manufactured easily.
  • the cooling tubes are arranged in a plurality of rows, and a bellows-type gap adjusting member is interposed between the adjacent heads of the cooling tubes, so that the volume of the heat exchanger is minimized Thereby cooling a plurality of power semiconductors.
  • the cooling tubes are arranged in a plurality of rows, and the cooling tubes are stacked through brazing method through a bellows-type gap adjusting member between mutually adjacent headers connected to both ends of the cooling tube. Cooling with two- By applying tubes, the cooling efficiency can be maximized.
  • the cooling tubes are arranged in a plurality of rows, and a bellows-type gap adjusting member is interposed between mutually adjacent headers connected to both ends of the cooling tube.
  • the bellows type gap adjusting member is formed through a brazing method. It is possible to easily adjust the gap between the cooling tubes to correspond to the thickness of the power semiconductor. Accordingly, compatibility with the heat exchanger can be further improved by applying it to cooling the power semiconductors of various thicknesses.
  • FIG. 1 is a plan view showing a heat exchanger for cooling a power semiconductor of an eco-friendly vehicle according to the present invention.
  • FIG. 2 is a bottom view showing a heat exchanger for cooling a power semiconductor of an environment-friendly vehicle according to the present invention.
  • FIGS. 3A, 3B and 3C are schematic views showing the upper header assembly, the center header assembly, and the lower header assembly, which are essential parts of the heat exchanger for cooling the power semiconductor of the environmentally friendly vehicle according to the present invention
  • FIG. 4 is a perspective view of a heat exchanger for cooling a power semiconductor of an environmentally friendly vehicle according to the present invention.
  • Fig. 5 is a sectional cross-sectional view taken along the line A-A of Fig. 4, showing a heat exchanger for cooling a power semiconductor of an eco-friendly vehicle according to the present invention.
  • FIG. 6 is a view illustrating an example of a usage state in which a power semiconductor of a heat exchanger for cooling a power semiconductor of an environmentally friendly vehicle according to the present invention is installed and used.
  • Fig. 7 is a front view illustrating a flow of fluid in a heat exchanger for cooling a power semiconductor of an environmentally friendly vehicle according to the present invention
  • FIG. 1 is a plan view of a heat exchanger for cooling a power semiconductor of an eco-friendly vehicle according to the present invention.
  • FIG. 2 is a view illustrating a heat exchanger for cooling a power semiconductor of an environmentally friendly vehicle according to the present invention
  • FIG. 5 is a bottom-view diagonal view showing a state in which some components are separated;
  • FIGS. 3A, 3B, and 3C are perspective views illustrating an upper header assembly, a center header assembly, and a lower header assembly, which are essential parts of a heat exchanger for cooling a power semiconductor of an eco-friendly vehicle according to the present invention.
  • FIG. 4 is a cross-sectional view illustrating a heat exchanger for cooling a power semiconductor of an eco-friendly vehicle according to the present invention
  • FIG. 5 is a cross-sectional view taken along line AA of FIG. 4, FIG.
  • FIG. 6 is an explanatory view showing a state of use in which a power semiconductor of a heat exchanger for cooling a power semiconductor of an environmentally friendly vehicle according to the present invention is installed and used.
  • FIG. 7 is a cross- Fig. 3 is a front view of the use state showing the fluid flow of the fluid.
  • a heat exchanger 100 for cooling a power semiconductor of an eco-friendly vehicle includes a power semiconductor 100 for supplying power to an environmentally friendly vehicle such as an electric car or a hybrid vehicle, (200) are inserted and fixed to cool the heat exchanger.
  • the power semiconductor cooling heat exchanger 100 of the eco-friendly vehicle is roughly divided into an inlet pipe 110, an exhaust pipe 120, a cooling tube 130, an upper header assembly 150, a lower header assembly 160, A central header assembly 170 and a spacing adjuster 190.
  • the inflow pipe 110 is a pipe through which the cooling fluid flows
  • the discharge pipe 120 is a pipe through which the cooling fluid introduced through the inflow pipe 110 passes through a predetermined section and is finally discharged.
  • the inlet pipe 110 and the discharge pipe 120 are formed in a hollow cylindrical shape at the upper end and a hollow hollow pipe Shape.
  • the inlet pipe 110 and the outlet pipe 120 may be inserted into the connection hole 151a of the upper header assembly 150 so as to be inserted into the connection hole 151a only at a predetermined length, It is more preferable that a fixed rib (not shown) is formed to protrude in a ring shape on an outer surface spaced upward a certain distance away.
  • inlet pipe 110 and the outlet pipe 120 are not shown in the drawings, the upper and lower ends may be provided in the same hollow cylindrical shape.
  • the plurality of cooling tubes 130 are arranged in a vertical direction and are provided in a flat tube type so that a plurality of channels are formed in the width direction in which the cooling fluid is moved.
  • the cooling tubes 130 have a plurality of flow paths with a certain distance in the width direction and have a plurality of flow paths with a predetermined distance in the width direction from the upper and lower ends in the thickness direction.
  • the cooling tube 130 having the two upper and lower flow paths, it is possible to maximize the cooling efficiency for the upper and lower surfaces of the power semiconductor 200.
  • the upper header assemblies 150 are provided as a pair, one end of the cooling tube 130 disposed at the uppermost one of the cooling tubes 130 is connected to the other end of the cooling tubes 130, And a connecting hole 151a is formed in the upper part of the connecting pipe 151.
  • the inlet pipe 110 and the outlet pipe 120 are connected to each other through the connecting hole 151a, So that the fluid is guided to the discharge pipe 120 through the cooling tube 130.
  • the upper header assembly 150 as described above includes in particular an upper header frame 151 and a lower header frame 155.
  • the upper header frame 151 is provided with bending pieces 152 at any two sides orthogonal to each other in the circumferential direction.
  • the lower header frame 155 is provided with bending pieces 156 at two sides orthogonal to each other in the circumferential direction and closely contact with the upper header frame 151 in the vertical direction to form the bending pieces 152 and 156 To be fixed to each other.
  • the lower header assemblies 160 are provided as a pair and one end of the cooling tube 130 disposed at the lowermost end of the cooling tubes 130 is connected to the other end of the cooling tubes 130, And the cooling fluid flowing from the inflow pipe 110 is guided to the discharge pipe 120 through the cooling tube 130.
  • the lower header assembly 160 may include an upper header frame 161 and a lower header frame 165.
  • the upper header frame 161 may be bent at any two sides in the circumferential direction, Piece 162 is provided.
  • the lower header frame 165 is provided with bending pieces 166 at two sides orthogonal to each other in the circumferential direction and closely contact with the upper header frame 161 in the vertical direction to form the bending pieces 162 and 166 To be fixed to each other.
  • the center header assemblies 170 are provided in pairs. One end of the cooling tubes 130 is connected to the other end of the cooling tubes 130 disposed between the uppermost and lowermost ends of the cooling tubes 130, And communication holes 171a and 175a are formed in the upper and lower portions to guide the cooling fluid introduced from the inlet pipe 110 to the outlet pipe 120 through the cooling tube 130.
  • the central header assembly 170 as described above preferably includes an upper header frame 171 and a lower header frame 175.
  • the upper header frame 171 is provided with bending pieces 172 at any two sides orthogonal to each other in the circumferential direction.
  • the lower header frame 175 is provided with bending pieces 176 at two sides orthogonal to each other in the circumferential direction and closely contact with the upper header frame 171 in the vertical direction to form the bending pieces 172 and 176 To be fixed to each other through bending.
  • the gap adjuster 190 is interposed between the upper header assembly 150, the central header assembly 170 and the lower header assembly 160 so that the communication holes 155a, 161a, 171a, And is compressed and deformed by a predetermined length so as to adjust the distance between the cooling tubes 130 connected to the upper header assembly 150, the central header assembly 170 and the lower header assembly 160.
  • the interval adjusting member 190 is provided in a bellows type so as to be compressed and deformed by a predetermined length and includes a connecting portion 191 and a bellows portion 193.
  • connection portion 191 is provided at the upper and lower ends in a cylindrical shape and is connected to the communication hole 155a of the upper header assembly 150, the communication hole 161a of the lower header assembly 160, And is connected to one of the communication holes 171a and 175a of the central header assembly 170.
  • the bellows portion 193 is interposed between the connection portions 191 and is integrally formed with the connection portion 191 in a bellows type.
  • the bellows part 193 is connected to the upper header assembly 150, the center header assembly 170, the lower header assembly 170, and the lower header assembly 170.
  • the bellows part 193 is integrally connected to the pair of connection parts 191, It is preferable to be horizontal when compressing and deforming to adjust the distance between the cooling tubes 130 connected to the header assembly 160.
  • the bellows portion 193 is connected to a pair of the coupling portions 191 in a bellows type so that the space between the neighboring portions of the cooling tube 130
  • a bellows type having at least one corrugated shape may be formed so as to correspond to the thickness of the power semiconductor 200 to be inserted and installed and to be spaced apart.
  • the upper header assembly 150, the lower header assembly 160, and the central header assembly 170 are opened It is preferable that a pair of stopper protrusions 150a, 160a, and 170a are formed on the upper and lower sides spaced a certain distance inward from the side end portion at a predetermined interval in the width direction and protruded toward the center of the inner space opened by a predetermined area through press working Do.
  • the stopper protrusions 150a, 160a, and 170a are provided to fix the end of the cooling tube 130 to the interior of the cooling tube 130 through the stopper protrusions 150a, 160a, So that it can be inserted and fixed.
  • the lower header assembly 160, the central header assembly 170, and the spacing adjuster 190 are preferably provided as aluminum parts and fixed through a brazing process.
  • connection hole 151a and the communication hole 155a of the upper header assembly 150, The communication holes 161a of the header assembly 160 and the communication holes 171a and 175a of the central header assembly 170 are connected to the ends of the inlet pipe 110, It is important that they can be interlaced and brazed with a certain length of overlap.
  • connection holes 151a and the communication holes 155a of the upper header assembly 150 and the communication holes 161a of the lower header assembly 160 and the communication holes 171a, 175a preferably has a ring-shaped fixed rib (not shown) having a certain thickness from a periphery protruding by a predetermined length.
  • connection hole 151a and the communication hole 155a of the upper header assembly 150 and the communication hole 161a of the lower header assembly 160 are connected to each other through the ring type fixed rib (not shown) Assembled with the end portions of the inflow pipe 110, the discharge pipe 120, or the gap adjuster 190 in a predetermined length overlapping the communication holes 171a and 175a of the central header assembly 170 A stable brazing process can be performed.
  • the cooling tubes are arranged in a plurality of rows, and bellows-type spacing gauges are provided between mutually adjacent headers connected to both ends of the cooling tube. So that the entire assembly can be fastened and fixed by a brazing method for the entire parts, so that the manufacturing can be made easily.
  • cooling tubes are arranged in a plurality of rows, and a bellows-type gap adjusting member is interposed between mutually adjacent headers connected to both ends of the cooling tube, so that the volume of the heat exchanger is minimized Thereby cooling a plurality of power semiconductors.
  • cooling tubes are arranged in a plurality of rows, and the cooling tubes are stacked through brazing method through a bellows type gap adjusting member between mutually adjacent headers connected to both ends of the cooling tube, By applying tubes, the cooling efficiency can be maximized.
  • the cooling tubes are arranged in a plurality of rows, and a bellows-type gap adjusting hole is formed between mutually adjacent headers connected to both ends of the cooling tube. It is possible to easily adjust the gap between the cooling tubes corresponding to the thickness of the power semiconductor. Accordingly, the present invention can be applied to the cooling of power semiconductors of various thicknesses, thereby further improving the compatibility of the heat exchanger.
  • cooling tube 150 upper header assembly
  • stopper projection 151 upper header frame
  • connection hole 152, 156 bending piece

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un échangeur de chaleur servant à refroidir un semiconducteur de puissance d'un véhicule écologique. La présente invention : comprend des tubes de refroidissement agencés en une pluralité de rangées, et des pièces de réglage d'espace de type soufflet intercalées entre des collecteurs adjacents reliés aux deux extrémités du tube de refroidissement, de manière à produire ce dernier sous la forme d'un type d'empilement par l'intermédiaire d'un procédé de brasage de telle sorte que des parties entières peuvent être accouplées et fixées en une seule fois par le procédé de brasage, et ainsi la fabrication peut être réalisée de manière simple ; produit le même type d'empilement de manière à permettre à la pluralité de semiconducteurs de puissance d'être refroidis tout en réduisant au minimum le volume de l'échangeur de chaleur et applique les tubes de refroidissement ayant des trajets d'écoulement à deux étages de façon à permettre au rendement de refroidissement d'être maximisé ; et applique les pièces de réglage d'espace de type soufflet de façon à permettre un ajustement simple d'un espace entre les tubes de refroidissement en correspondance avec l'épaisseur du semiconducteur de puissance.
PCT/KR2018/015439 2017-12-28 2018-12-06 Échangeur de chaleur servant à refroidir un semiconducteur de puissance d'un véhicule écologique WO2019132302A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201880063831.XA CN111165082B (zh) 2017-12-28 2018-12-06 环保型车辆的电力半导体冷却用热交换器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170182609A KR102067208B1 (ko) 2017-12-28 2017-12-28 친환경 차량의 전력반도체 냉각용 열교환기
KR10-2017-0182609 2017-12-28

Publications (1)

Publication Number Publication Date
WO2019132302A1 true WO2019132302A1 (fr) 2019-07-04

Family

ID=67063900

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2018/015439 WO2019132302A1 (fr) 2017-12-28 2018-12-06 Échangeur de chaleur servant à refroidir un semiconducteur de puissance d'un véhicule écologique

Country Status (3)

Country Link
KR (1) KR102067208B1 (fr)
CN (1) CN111165082B (fr)
WO (1) WO2019132302A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102197055B1 (ko) * 2019-12-04 2020-12-31 주식회사 고산 차량의 전기소자 냉각용 열교환기
KR102488058B1 (ko) * 2020-11-24 2023-01-13 주식회사 원진 차량의 전기소자 냉각용 열교환기
WO2023219187A1 (fr) * 2022-05-12 2023-11-16 엘지마그나 이파워트레인 주식회사 Boîtier de semi-conducteur de puissance à double refroidissement latéral
KR20230171136A (ko) 2022-06-13 2023-12-20 추용호 전력반도체 모듈용 냉각장치 및 그 제조방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002026215A (ja) * 2000-06-30 2002-01-25 Denso Corp 冷却流体冷却型半導体装置
JP2006005014A (ja) * 2004-06-15 2006-01-05 Denso Corp 積層型冷却器
KR20130122741A (ko) * 2010-10-04 2013-11-08 다나 캐나다 코포레이션 배터리를 위한 순응형 유체-냉각된 열교환기
KR20160051311A (ko) * 2014-11-03 2016-05-11 현대모비스 주식회사 전력반도체 양면 냉각방식 냉각장치
KR20170079177A (ko) * 2015-12-30 2017-07-10 한온시스템 주식회사 전기소자 냉각용 열교환기

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102161487B1 (ko) 2013-09-12 2020-10-06 한온시스템 주식회사 전기소자 냉각용 열교환기
KR101988992B1 (ko) 2013-09-27 2019-06-13 한온시스템 주식회사 전기소자 냉각용 열교환기
KR101510056B1 (ko) 2014-05-14 2015-04-07 현대자동차주식회사 자동차의 하이브리드 전력제어장치
KR20150133035A (ko) * 2014-05-19 2015-11-27 한온시스템 주식회사 실외열교환기
KR102173312B1 (ko) 2015-03-10 2020-11-04 한온시스템 주식회사 전기소자 냉각용 열교환기
KR102471223B1 (ko) * 2015-11-13 2022-11-25 현대모비스 주식회사 전력반도체용 냉각장치
KR102413829B1 (ko) 2015-12-30 2022-06-29 한온시스템 주식회사 전기소자 냉각용 열교환기

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002026215A (ja) * 2000-06-30 2002-01-25 Denso Corp 冷却流体冷却型半導体装置
JP2006005014A (ja) * 2004-06-15 2006-01-05 Denso Corp 積層型冷却器
KR20130122741A (ko) * 2010-10-04 2013-11-08 다나 캐나다 코포레이션 배터리를 위한 순응형 유체-냉각된 열교환기
KR20160051311A (ko) * 2014-11-03 2016-05-11 현대모비스 주식회사 전력반도체 양면 냉각방식 냉각장치
KR20170079177A (ko) * 2015-12-30 2017-07-10 한온시스템 주식회사 전기소자 냉각용 열교환기

Also Published As

Publication number Publication date
KR20190080252A (ko) 2019-07-08
KR102067208B1 (ko) 2020-01-17
CN111165082B (zh) 2021-08-17
CN111165082A (zh) 2020-05-15

Similar Documents

Publication Publication Date Title
WO2019132302A1 (fr) Échangeur de chaleur servant à refroidir un semiconducteur de puissance d'un véhicule écologique
WO2017116128A1 (fr) Échangeur de chaleur pour refroidissement de dispositif électrique
WO2016144007A1 (fr) Échangeur de chaleur pour refroidir un élément électrique
WO2011034325A2 (fr) Module de batterie et bloc-batterie de moyennes ou grandes dimensions comprenant un organe dissipateur de chaleur de structure innovante
WO2010067944A1 (fr) Bloc-batterie de taille moyenne ou grande à nouvelle structure de refroidissement par air
WO2016043441A1 (fr) Module de batterie comprenant une structure de refroidissement à courbure minimale du canal de refroidissement
WO2015170880A1 (fr) Bloc-batterie et son procédé d'assemblage
JP4774581B2 (ja) 冷却流体冷却型半導体装置
WO2018174484A1 (fr) Convertisseur
WO2011034324A2 (fr) Module de batterie sur lequel est installe un capteur de temperature, et bloc-batterie moyen ou grand le comprenant
WO2017142290A1 (fr) Système de batterie
WO2013172603A1 (fr) Dispositif de chauffage pour véhicule
WO2018088655A1 (fr) Échangeur de chaleur de batterie et bloc-batterie comportant celui-ci
WO2010140833A2 (fr) Echangeur thermique et échangeur thermique intermédiaire à refroidissement d'eau pour véhicule l'utilisant
WO2010114317A2 (fr) Module de batterie à excellent rendement et milieu de rayonnement pour ensemble batterie de grande taille
WO2011030976A1 (fr) Refroidissement thermoélectrique et appareil de génération de puissance
WO2022177303A1 (fr) Collecteur de liquide de refroidissement de climatisation de véhicule, et module de stockage et de distribution de liquide de refroidissement intégré
KR20140037351A (ko) 차량용 배터리 냉각 장치
KR102001205B1 (ko) 친환경 차량의 전력반도체 냉각용 열교환기
WO2018038344A1 (fr) Radiateur intégré et son procédé d'assemblage
WO2015037824A1 (fr) Échangeur de chaleur permettant de refroidir un élément électrique
WO2018012937A1 (fr) Unité de moteur de ventilateur de refroidissement haute tension
WO2020171436A1 (fr) Échangeur de chaleur servant à refroidir des éléments électriques d'un véhicule
WO2018221959A1 (fr) Échangeur de chaleur permettant de refroidir un dispositif électrique
WO2019124853A1 (fr) Échangeur de chaleur

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18894146

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18894146

Country of ref document: EP

Kind code of ref document: A1