WO2019131093A1 - Feuille de cuivre pour dissipation de chaleur et élément de dissipation de chaleur - Google Patents

Feuille de cuivre pour dissipation de chaleur et élément de dissipation de chaleur Download PDF

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Publication number
WO2019131093A1
WO2019131093A1 PCT/JP2018/045344 JP2018045344W WO2019131093A1 WO 2019131093 A1 WO2019131093 A1 WO 2019131093A1 JP 2018045344 W JP2018045344 W JP 2018045344W WO 2019131093 A1 WO2019131093 A1 WO 2019131093A1
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Prior art keywords
copper foil
layer
heat dissipation
polymer film
thickness
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PCT/JP2018/045344
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English (en)
Japanese (ja)
Inventor
一将 笹尾
敦史 三木
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Ｊｘ金属株式会社
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Publication of WO2019131093A1 publication Critical patent/WO2019131093A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a copper foil for heat dissipation and a heat dissipation member.
  • Patent Document 1 Korean Patent Document 1 etc.
  • the mounting substrate of the electronic device usually has a component that generates heat due to use, but if the heat of the component can not be well released, there is a risk of failure.
  • embodiment of this invention makes it a subject to provide the copper foil for thermal radiation which has the outstanding thermal radiation characteristic, and a thermal radiation member.
  • the copper foil for heat dissipation in one embodiment, it has a copper foil base and a polymer film on at least one of the main surfaces of the copper foil base.
  • the thickness of the polymer film is 0.1 ⁇ m to 10 ⁇ m.
  • the thickness of the polymer film is 0.5 ⁇ m to 8 ⁇ m.
  • the thickness of the polymer film is 1 ⁇ m to 5 ⁇ m.
  • the polymer film contains a polymer having at least one hetero atom in the repeating unit.
  • the polymer contains at least one member selected from the group consisting of a carbonyl group, a carboxyl group, an ether group, an epoxy group, a hydroxyl group, and a halogen in the repeating unit Included in
  • the polymer is selected from the group consisting of polyester resin, polycarbonate resin, polyvinyl alcohol resin, cellulose resin, epoxy resin, nylon resin, polyether resin, and fluorine resin. At least one species.
  • the polymer is polyethylene terephthalate, polybutylene terephthalate, polytrimethylene terephthalate, acetyl cellulose, triacetyl cellulose, cellophane, bisphenol A epoxy resin, polycaproamide, poly At least one selected from the group consisting of dodecaneproamide, polyethylene oxide, polypropylene oxide, polytetrafluoroethylene, polyvinylidene fluoride, and polytetrafluoroethylene.
  • a plating treatment layer is provided on at least one of the main surfaces of the copper foil substrate, and the polymer film is provided on the plating treatment layer.
  • the surface roughness Ra of the plating treated surface of the plating treated layer is 0.30 to 1.50.
  • the surface roughness Rz of the plating treated surface of the plating treated layer is 2.50 to 9.50.
  • the plating treatment layer has a roughened particle layer.
  • the plating treatment layer has a coating layer on the roughening particle layer.
  • the covering layer contains at least one selected from the group consisting of Cu, Zn, Ni, Co, Cr, W, and Fe.
  • the covering layer contains Co and Ni.
  • the covering layer has a covering lower layer and a covering upper layer on the covering lower layer, and the covering lower layer contains Cu, Co, and Ni,
  • the coated upper layer contains Co and Ni.
  • the thickness of the covering layer is 0.001 ⁇ m to 1.0 ⁇ m.
  • the thickness of the covering layer is 0.002 ⁇ m to 0.5 ⁇ m.
  • the thickness of the covering layer is 0.005 ⁇ m to 0.3 ⁇ m.
  • the copper foil for thermal radiation mentioned above is provided.
  • thermographic display temperature in Examples 1-11 and Comparative Examples 1-3.
  • the heat-dissipating copper foil according to an embodiment of the present invention has a copper foil base and a polymer film on at least one of the main surfaces of the copper foil base. According to the present embodiment, by having the polymer film, it has excellent heat dissipation characteristics.
  • the copper foil base used in the present embodiment may be either an electrolytic copper foil or a rolled copper foil.
  • an electrolytic copper foil is manufactured by electrolytically depositing copper on a drum of titanium or stainless steel from a copper sulfate plating bath, and a rolled copper foil is manufactured by repeating plastic working and heat treatment by rolling rolls. Rolled copper foil is often applied to applications where flexibility is required.
  • a copper alloy foil base material shall also be included.
  • the thickness of the copper foil substrate is preferably 1 ⁇ m or more so that, for example, wrinkles and the like do not enter at the time of production. However, in consideration of thin and compact specifications such as smartphones and tablet PCs, 20 ⁇ m or less is preferable.
  • the polymer film in order to improve heat radiation, preferably contains a polymer having at least one hetero atom in the repeating unit. It is believed that this is closely related to the heat radiation characteristics and the chemical structure of the resin in the coating film, and the emissivity of the polymer exhibiting many broad and strong infrared absorption peaks is high.
  • the polymer may contain at least one member selected from the group consisting of a carbonyl group, a carboxyl group, an ether group, an epoxy group, a hydroxyl group, and a halogen in a repeating unit as exhibiting many broad and strong infrared absorption peaks.
  • This polymer is not particularly limited as long as it is a polymer having a chemical structure exhibiting many broad and strong infrared absorption peaks, but, for example, polyester resin, polycarbonate resin, polyvinyl alcohol resin (PVA), cellulose resin, epoxy resin, nylon resin , Polyether resins, and fluorocarbon resins.
  • the polyester resin is not particularly limited, and examples thereof include polyethylene terephthalate, polybutylene terephthalate and polytrimethylene terephthalate.
  • the polycarbonate resin is not particularly limited, and examples thereof include those produced from 2,2-bis (4-hydroxyphenyl) propane (bisphenol A).
  • Polyvinyl alcohol resin refers to a saponified polyvinyl acetate.
  • the cellulose resin is not particularly limited, and examples thereof include acetyl cellulose, triacetyl cellulose, cellophane and the like. Although it does not specifically limit as an epoxy resin, For example, bisphenol-A epoxy resin etc. are mentioned.
  • the nylon resin is not particularly limited, and examples thereof include polycaproamide (nylon 6) and polydodecaneproamide (nylon 10).
  • the polyether resin is not particularly limited, and examples thereof include polyethylene oxide and polypropylene oxide.
  • the fluorine resin is not particularly limited, and examples thereof include polytetrafluoroethylene, polyvinylidene fluoride, polytetrafluoroethylene and the like.
  • the thickness of the polymer film is preferably 0.1 ⁇ m or more, more preferably 0.5 ⁇ m or more, still more preferably 1 ⁇ m or more, and still more preferably 2 ⁇ m or more, in order to improve heat radiation.
  • 10 ⁇ m or less is preferable, 8 ⁇ m or less is more preferable, 5 ⁇ m or less is more preferable, and 3 ⁇ m or less is still more preferable.
  • the thickness of the polymer film refers to the average thickness of the polymer film.
  • the thickness of the copper foil substrate is measured at three or more points by a gauge thickness measuring instrument, and the average value of the three or more points is calculated.
  • a copper foil for heat dissipation having a polymer film on the copper foil base is prepared.
  • the thickness of the heat-dissipating copper foil is measured at three or more points by a gauge thickness measuring instrument, and the average value of the three or more points is calculated.
  • the average value of the thickness of the copper foil substrate described above is subtracted from the average value of the thickness of the copper foil for heat dissipation to calculate the thickness (average thickness) of the polymer film.
  • the copper foil for thermal radiation has a roughening particle layer and a polymer film, or a roughening particle layer, a coating layer, and a polymer film on the main surface of a copper foil base material
  • a heat-dissipating copper foil having a roughened particle layer and a polymer film, or a roughened particle layer, a covering layer, and a polymer film is prepared on the main surface of the copper foil substrate.
  • the thickness of the heat-dissipating copper foil is measured at three or more points by a gauge thickness measuring instrument, and the average value of the three or more points is calculated.
  • the average value of the thickness of the copper foil described above is subtracted from the average value of the thickness of the copper foil for heat dissipation to calculate the thickness (average thickness) of the polymer film.
  • an anticorrosive layer may be formed on the copper foil base, and further, chromate treatment on the surface, silane Processing such as coupling processing may be performed.
  • silane Processing such as coupling processing may be performed.
  • a well-known thing can be used as a rustproof layer and a silane coupling process.
  • Platinum treatment layer In the present embodiment, it is preferable to further have a plated layer on at least one of the main surfaces of the copper foil base and to have a polymer film on the plated layer.
  • the surface roughness Ra of the plating treated surface of the plating treated layer is preferably 0.30 or more, more preferably 0.40 or more, and preferably 0.45 or more, in order to properly dissipate the heat from the heat generator. Is even more preferred. However, in order to make it difficult for the roughening particles to drop off due to external force, 1.50 or less is preferable, 1.30 or less is more preferable, and 1.20 or less is even more preferable.
  • surface roughness Ra shows the arithmetic mean roughness as described in JIS B 0601: 2013.
  • the surface roughness Rz of the surface to be plated is preferably 2.50 or more, more preferably 3.00 or more, in order to dissipate the heat from the heating element well.
  • the above is even more preferable.
  • it is preferably 9.50 or less, more preferably 8.00 or less, and still more preferably 7.74 or less.
  • surface roughness Rz shows the largest height roughness as described in JIS B 0601: 2013.
  • the surface area ratio B / A of the surface area B of the plated surface to the projected area A of the plated surface is not particularly limited when the plated surface of the plated layer is measured using a laser microscope.
  • the surface area ratio B / A is preferably 1.42 or more, more preferably 1.60 or more, still more preferably 1.81 or more, and further preferably 2.18 or more. More preferably, 2.35 or more is even more preferable.
  • the surface area ratio B / A is high, the roughened particles may be easily detached by an external force despite the fact that the plated layer is excellent in heat radiation, so that the surface area ratio B / A is 3. 42 or less is preferable, 3.25 or less is more preferable, 3.10 or less is more preferable, 2.98 or less is further more preferable, and 2.88 or less is further more preferable.
  • the plated layer preferably has a roughened particle layer in order to improve heat radiation. That is, in the present embodiment, the roughened particle layer and the polymer film are formed in this order on at least one of the main surfaces of the copper foil base material.
  • the roughening treatment can be performed, for example, by forming roughening particles with copper or a copper alloy. The roughening process may be fine.
  • the polymer film covers the surface of the roughened particles.
  • the surface area of the polymer film is increased, so that the heat radiation can be further improved.
  • the tip portion of the roughening particles may be broken or the roughening particles may peel off from the root, which may cause a problem generally referred to as a dusting phenomenon.
  • a dusting phenomenon In this powder dropping phenomenon, although the roughened plated roughened particle layer is excellent in heat radiation, the roughened particles are easily detached by an external force, and "scrub" at the time of production or use of the copper foil Peeling occurs. Therefore, in the present embodiment, the surface of the roughened particles is coated with a polymer film in order to suppress powdering. Then, the tip portion of the roughened particles is thickened by the polymer film, and the root of the roughened particles is thickened by the coating layer and the polymer film. As described above, by forming the polymer film on the roughened particle layer, the roughened particles are less likely to come off due to an external force, so powder removal can be suppressed.
  • the plated layer preferably has a roughened particle layer and a covering layer on the roughened particle layer. That is, in the present embodiment, the roughened particle layer, the covering layer, and the polymer film are formed in this order on at least one of the main surfaces of the copper foil substrate.
  • This covering layer covers the surface of the dendrite of roughening particles. Furthermore, a polymer film is formed on this covering layer. Therefore, in the present embodiment, since the polymer film is provided on the covering layer, the synergistic effect of the covering layer and the polymer film further improves the heat radiation property and also improves the dusting property.
  • the roughened particle layer after forming roughened particles with copper or copper alloy, further comprises Cu, Zn, Ni, Co, Cr, W, and Fe from the viewpoint of heat radiation, powdering, adhesion, etc.
  • a smooth plating process can also be performed to provide a coating layer containing at least one selected from the group.
  • the coated lower layer contains Cu, Co, and Ni
  • the coated upper layer contains Co and Ni. Is preferred.
  • these metals are contained in all or one part (for example, upper part) of a coating layer.
  • the thickness of the covering layer is preferably 0.001 ⁇ m or more, more preferably 0.002 ⁇ m or more, still more preferably 0.005 ⁇ m or more, and still more preferably 0.01 ⁇ m or more, in order to improve heat radiation. However, in consideration of thin and compact specifications such as smartphones and tablet PCs, it is preferably 1.0 ⁇ m or less, more preferably 0.5 ⁇ m or less, still more preferably 0.3 ⁇ m or less, and even more preferably 0.1 ⁇ m or less preferable.
  • the thickness of the covering layer refers to the average thickness of the covering layer.
  • the copper foil for heat dissipation in which the roughening particle layer and the coating layer were formed is prepared.
  • a 2 cm ⁇ 2 cm sample is taken from the heat-dissipating copper foil, and a solution in which the sample is dissolved in a 20% by volume aqueous nitric acid solution is obtained.
  • the concentration of each metal contained in the coating layer in the sample is measured by performing quantitative analysis of the solution by atomic absorption spectrometry using an atomic absorption spectrophotometer, and the sample is measured using the concentration of each metal. Determine the weight of each metal in the overlayer.
  • the volume of the coating layer is calculated from the weight of each metal obtained and the density of the metal. Then, the thickness (average thickness) of the coating layer is calculated by dividing the volume of the obtained coating layer by the value obtained by multiplying the area of the sample (4 cm 2 ) by the measured surface area ratio.
  • an anticorrosive layer may be formed on the plating layer, and further, chromate treatment on the surface, silane coupling Processing such as processing may be performed.
  • silane coupling Processing such as processing may be performed.
  • a well-known thing can be used as a rustproof layer and a silane coupling process.
  • the roughened particle layer preferably forms roughened particles on the condition 1 of formation of the roughened particle layer (A-1) on any one main surface of the copper foil substrate . Moreover, in addition to the formation 1 of the (A-1) roughening particle layer, the roughening particles are further grown under the conditions of the formation 2 of the (A-2) roughening particle layer to form a roughening particle layer Is more preferable.
  • the treatment of formation 1 of the roughening particle layer is a treatment corresponding to roughening plating (rough plating).
  • Roughening plating is plating performed by setting the current density to a limit current density or more.
  • Liquid composition 10 to 20 g / L of copper, 50 to 100 g / L of sulfuric acid
  • Liquid temperature 25 to 50 ° C
  • Current density 20 to 58 A / dm 2 Time: 0.5 to 5 seconds
  • the treatment of formation 2 of the roughening particle layer is a treatment corresponding to roughening plating (rough plating).
  • Roughening plating is plating performed by setting the current density to less than the limiting current density.
  • Liquid composition 15 to 50 g / L of copper, 60 to 100 g / L of sulfuric acid
  • Liquid temperature 25 to 50 ° C
  • Current density 20 to 58 A / dm 2 Time: 1 to 10 seconds
  • the roughened particle layer may be formed by one or more treatments.
  • the coating layer is formed on the roughened particle layer under the conditions for formation of the coating lower layer (B-1), and then after formation of the coating lower layer on the condition for formation of the coating upper layer (B-2) It is preferable to form
  • the treatment of the formation of the coated lower layer and the coated upper layer is a treatment corresponding to smooth plating. Smooth plating is plating performed by setting the current density to less than the limiting current density.
  • the coating lower layer can be formed under the following conditions. In addition, the coating lower layer may not be formed.
  • (B-2) Conditions for Formation of Coated Upper Layer One example of the conditions for forming the coated upper layer is as follows. Liquid composition: 0.001 to 15 g / L of an element containing at least one selected from the group consisting of Cu 10 to 20 g / L, Zn, Ni, Co, Cr, W, and Fe pH: 2 to 3 Liquid temperature: 30 to 50 ° C Current density: 0.5 to 20 A / dm 2 Time: 0.1 to 300 seconds
  • the coated lower layer and the coated upper layer may be formed by one or more treatments.
  • an anticorrosion layer in particular, an anticorrosion layer of a chromate layer may be formed on the copper foil substrate, the roughening particle layer, or the covering layer.
  • a preferred rustproofing treatment is a coating treatment of chromium oxide alone or a mixture coating treatment of chromium oxide and zinc / zinc oxide.
  • a mixture film treatment of chromium oxide and zinc / zinc oxide is zinc consisting of zinc or zinc oxide and chromium oxide by electroplating using a plating bath containing zinc salt or zinc oxide and chromate. It is the process which coats the rustproof layer of the chromium base mixture.
  • At least one kind of dichromate such as K 2 Cr 2 O 7 , Na 2 Cr 2 O 7 or CrO 3 and the like, a water-soluble zinc salt such as ZnO, ZnSO 4 ⁇ 7H
  • Typical plating bath compositions and examples of electrolysis conditions are as follows. In the following, the conditions for electrolytic chromate treatment are shown, but immersion chromate treatment may be used.
  • Plating conditions for forming an anticorrosive layer Solution composition 1 to 10 g / L of potassium dichromate, 0 to 5 g / L of zinc pH: 3 to 4 Liquid temperature: 50 to 60 ° C Current density: 0 to 2 A / dm 2 (for electrolytic chromate treatment) Time: 1 to 10 seconds
  • a polymer film is formed on one of the main surfaces of a copper foil substrate. Furthermore, it is preferable to form a polymer film on the plating treatment layer or to form a polymer film on the rustproof layer.
  • any of spray coating of a coating solution containing a polymer, coating with a coater, immersion, and flow casting may be used.
  • the thickness of the polymer film is adjusted to 0.1 to 10 ⁇ m by adjusting the solid content concentration and the coating amount. After this, if necessary, an annealing treatment may be applied for the purpose of improving the ductility of the copper foil.
  • the heat radiating member provided with the copper foil for heat radiation which concerns on this embodiment can be used in order to thermally radiate with respect to the heat generating member incorporated in mobile apparatuses, such as a smart phone and a tablet PC, for example.
  • Example 1 A polymer film was formed on one of the main surfaces of a 12 ⁇ m thick rolled copper foil (JX Metals Corporation, TPC foil) under the condition range shown below.
  • the application conditions are as follows.
  • Non-contact roughness measuring machine laser microscope, surface roughness Ra (arithmetic mean roughness) and surface roughness Rz (maximum height roughness) of the roughened particle layer side surface of the sample of each example and comparative example It measured using Olympus LEXT OLS 4000).
  • the laser wavelength of the measuring instrument is 405 nm, and the magnification of the built-in lens is 20 times.
  • Ra and Rz were arbitrarily measured at five places, and the average value of the five places of Ra and Rz was taken as the values of Ra and Rz.
  • Ra and Rz were measured similarly to the above-mentioned with respect to the surface of the side scheduled to be roughened of the copper foil base material before the roughening process used in each Example and comparative example.
  • the measurement of Ra and Rz was performed in the TD direction (the width direction, that is, the direction perpendicular to the rolling direction of the copper foil substrate).
  • the settings of the main items of the measurement conditions and the analysis conditions are as follows.
  • the surface area of the plated surface was measured using a non-contact roughness measuring machine (laser microscope, LEXT OLS 4000 manufactured by Olympus).
  • the surface area B of the plated surface with respect to the projected area A of the plated surface was used as the surface area ratio B / A.
  • the surface area of the plating process layer was measured before apply
  • the settings of the main items of the measurement conditions and the analysis conditions are as follows. ⁇ Measurement conditions> The same conditions as those for measuring the surface roughness Ra and Rz described above.
  • the projected area A of the plating treated surface is 16923 ⁇ m 2 by setting the measurement range to 130 ⁇ m in width ⁇ 130 ⁇ m in height.
  • Measurement environment temperature 23 to 25 ° C ⁇ Analysis condition>
  • the threshold setting the histogram, the threshold 1: 0%, and the threshold 2: 100% were used.
  • the thickness of the heat-dissipating copper foil obtained in Example 1 was measured with a gauge thickness measuring instrument (Dr. Ono, Digital Counter DG-1270), and the thickness of the rolled copper foil was determined from the average value of the three points. The thickness of the polymer film was calculated by subtracting (12 ⁇ m).
  • thermography Chino CPA- 0150J
  • a laminate comprising, from the bottom, a heat insulating material 10, a heater 20, an adhesive (Toagosei Co., Ltd., Aron Alpha (registered trademark)) 30, a SUS plate 40, grease 50 for heat dissipation, and copper foil 60 for heat dissipation.
  • a body 1 was made, and this laminate 1 was placed in an enclosure (not shown) made of a heat insulating member.
  • a black body tape 70 with an emissivity of 0.9 was disposed on the heat radiation copper foil 60 of the laminate so as to cover an area approximately half of the heat radiation copper foil 60.
  • the heater 20 is heated by applying a direct current (current: 0.3 A, voltage 4.0 V), and the display temperature of the area covered with the black body tape 70 of the laminate 1 by the infrared thermography 100 is 88.0 ° C. It was heated to become.
  • the display temperature of the portion of the copper foil 60 for heat dissipation of the laminate 1 was measured using the infrared thermography 100 with the area covered with the black body tape 70 as a reference (88.degree. C.).
  • the infrared thermography 100 detects infrared energy emitted from the sample surface, and uses it as a display temperature.
  • the copper for heat dissipation is compared by comparing the temperature for displaying thermography of the copper foil for heat dissipation obtained in Example 1 on the basis of the temperature for displaying the thermography of black body tape whose emissivity is known as described above.
  • the heat radiation of the foil was evaluated.
  • Table 1 the fact that the thermographic display temperature is close to 88.0 ° C. as a reference indicates that the emissivity is high. That is, it shows that the ability to emit infrared rays is excellent and the heat dissipation characteristics are good.
  • Example 2 The solvent used to form the (A) polymer film is prepared in an aqueous solution of 8% by mass of PVA on one of the main surfaces of a 12 ⁇ m thick rolled copper foil (JX Metals Corporation, TPC foil), and the thickness of the polymer film is prepared A polymer film was formed in the same manner as in Example 1 except that the thickness was changed to 2.5 ⁇ m.
  • the thickness of the polymer film, the thermographic display temperature, and the powder removal were evaluated for the obtained heat-dissipating copper foil.
  • the results are shown in Table 1.
  • the surface roughness Ra and Rz of the surface to be plated and the surface area ratio are the values of the heat-dissipating copper foil of Example 1.
  • Example 3 The solvent used to form the (A) polymer film is prepared in an aqueous solution of 8% by mass of PVA on one of the main surfaces of a 12 ⁇ m thick rolled copper foil (JX Metals Corporation, TPC foil), and the thickness of the polymer film is prepared A polymer film was formed in the same manner as in Example 1 except that the thickness was changed to 3.5 ⁇ m.
  • the thickness of the polymer film, the thermographic display temperature, and the powder removal were evaluated for the obtained heat-dissipating copper foil.
  • the results are shown in Table 1.
  • the surface roughness Ra and Rz of the surface to be plated and the surface area ratio are the values of the heat-dissipating copper foil of Example 1.
  • Example 4 A solvent to be used to form the (A) polymer film is prepared as a 10% by mass aqueous solution of PVA on one of the main surfaces of a 12 ⁇ m thick rolled copper foil (JX Metals Corporation, TPC foil), and the thickness of the polymer film is prepared A polymer film was formed in the same manner as in Example 1 except that the thickness was changed to 5.0 ⁇ m.
  • the thickness of the polymer film, the thermographic display temperature, and the powder removal were evaluated for the obtained heat-dissipating copper foil.
  • the results are shown in Table 1.
  • the surface roughness Ra and Rz of the surface to be plated and the surface area ratio are the values of the heat-dissipating copper foil of Example 1.
  • Example 5 Roughened particle layer (Cu), coating layer (Cu-Ni-Co, Ni) on the main surface of one of the 12 ⁇ m thick rolled copper foils (JX Metals Corporation, TPC foil) under the conditions shown below And Co), and a polymer film (PVA) in this order.
  • the bath composition and plating conditions used and the formation conditions of the polymer film are as follows.
  • the thickness of the copper foil (roughened particle layer and covering layer) obtained before forming the polymer film and the copper foil for heat dissipation obtained in Example 5 were measured at three points with a gauge thickness measuring device. The average value of the three points was calculated respectively. Subsequently, the average value of the thickness of the said copper foil was deducted from the average value of the thickness of the said copper foil for thermal radiation, and the thickness (average thickness) of the polymer film was computed.
  • Example 6 A solvent used to form a (E) polymer film is prepared as a 10% by mass aqueous solution of PVA on one of the main surfaces of a 12 ⁇ m thick rolled copper foil (JX Metals Corporation, HA-V2 foil), and the polymer film is prepared.
  • the roughened particle layer (Cu), the coating layer (Cu-Ni-Co, Ni-Co), and the polymer film (PVA) are the same as in Example 5 except that the thickness of the layer is changed to 5.0 ⁇ m. It formed.
  • the thickness of the polymer film, the thermographic display temperature and the powder removal were evaluated for the obtained heat-dissipating copper foil.
  • the results are shown in Table 1.
  • the surface area ratio of the plated surface is the value of the heat-dissipating copper foil of Example 5.
  • Example 7 A roughened particle layer (Cu) and a covering layer (Cu-Ni-Co) on the main surface of one of the 12 ⁇ m thick rolled copper foils (JX Metals Corporation, HA-V2 foil) under the conditions shown below , Ni-Co), an anticorrosive layer, and a polymer film (PVA) in this order.
  • the bath composition and plating conditions used and the formation conditions of the polymer film are as follows.
  • the thickness of the copper foil (roughened particle layer, covering layer, and rustproof layer) obtained before forming the polymer film and the copper foil for heat dissipation obtained in Example 7 were measured using a gauge thickness measuring device. Three points were measured respectively, and the average value of the three points was calculated. Subsequently, the average value of the thickness of the said copper foil was deducted from the average value of the thickness of the said copper foil for thermal radiation, and the thickness (average thickness) of the polymer film was computed.
  • the surface roughness ratio Ra and Rz and the surface area ratio were evaluated for the plating treated surface of the coating layer. Further, the thickness of the polymer film, the thermographic display temperature and the powder removal were evaluated for the obtained heat-dissipating copper foil. The results are shown in Table 1.
  • Example 8 A solvent used to form a (G) polymer film is prepared as a 6% by mass aqueous solution of PVA on one of the main surfaces of a 12 ⁇ m thick rolled copper foil (JX Metals Corporation, HA-V2 foil), and the polymer film is prepared The roughened particle layer (Cu), the coating layer (Cu-Ni-Co, Ni-Co), the rustproof layer, and the polymer film (the same as in Example 7 except that the thickness of the coating was changed to 1.5 .mu.m) It formed in order of PVA).
  • the thickness of the polymer film, the thermographic display temperature, and the powder removal were evaluated for the obtained heat-dissipating copper foil. The results are shown in Table 1.
  • the surface roughness Ra and Rz of the plating treated surface and the surface area ratio are the values of the heat-dissipating copper foil of Example 7.
  • Example 9 A solvent used to form a (G) polymer film is prepared as an aqueous solution of 8% by mass of PVA on one of the main surfaces of a 12 ⁇ m thick rolled copper foil (JX Metals Corporation, HA-V2 foil), and the polymer film is prepared The roughened particle layer (Cu), the coating layer (Cu-Ni-Co, Ni-Co), the rustproof layer, and the polymer film (the same as in Example 7 except that the thickness of the coating was changed to 2.0 ⁇ m) It formed in order of PVA).
  • the thickness of the polymer film, the thermographic display temperature, and the powder removal were evaluated for the obtained heat-dissipating copper foil. The results are shown in Table 1.
  • the surface roughness Ra and Rz of the plating treated surface and the surface area ratio are the values of the heat-dissipating copper foil of Example 7.
  • Example 10 A solvent used to form a (G) polymer film is prepared as an aqueous solution of 8% by mass of PVA on one of the main surfaces of a 12 ⁇ m thick rolled copper foil (JX Metals Corporation, HA-V2 foil), and the polymer film is prepared The roughened particle layer (Cu), the coating layer (Cu-Ni-Co, Ni-Co), the rustproof layer, and the polymer film (the same as in Example 7 except that the thickness of the coating was changed to 2.5 ⁇ m) It formed in order of PVA).
  • the thickness of the polymer film, the thermographic display temperature, and the powder removal were evaluated for the obtained heat-dissipating copper foil. The results are shown in Table 1.
  • the surface roughness Ra and Rz of the plating treated surface and the surface area ratio are the values of the heat-dissipating copper foil of Example 7.
  • Example 11 A solvent used to form a (G) polymer film is prepared as a 10% by mass aqueous solution of PVA on one of the main surfaces of a 12 ⁇ m thick rolled copper foil (JX Metals Corporation, HA-V2 foil), and the polymer film is prepared The roughened particle layer (Cu), the coating layer (Cu-Ni-Co, Ni-Co), the rustproof layer, and the polymer film (the same as in Example 7 except that the thickness of the coating was changed to 3.0 ⁇ m) It formed in order of PVA).
  • the thickness of the polymer film, the thermographic display temperature, and the powder removal were evaluated for the obtained heat-dissipating copper foil. The results are shown in Table 1.
  • the surface roughness Ra and Rz of the plating treated surface and the surface area ratio are the values of the heat-dissipating copper foil of Example 7.
  • Comparative Example 1 The surface roughness Ra and Rz, the surface area ratio, the thermographic display temperature, and the powder removal were evaluated for the rolled copper foil (JX Metals Corporation, TPC foil) used in Example 1. The results are shown in Table 1.
  • Comparative Example 2 Roughened particle layer (Cu) and coating layer (Cu-Ni-Co, Ni) on the main surface of one of the 12 ⁇ m thick rolled copper foils (JX Metals Co., Ltd., TPC foil) under the conditions shown below Formed in the order of -Co).
  • the bath composition and plating conditions used are as follows.
  • thermographic display temperature The surface area ratio, the thermographic display temperature, and the powder loss were evaluated for the obtained heat-dissipating copper foil. The results are shown in Table 1.
  • Comparative Example 3 A roughened particle layer (Cu) and a covering layer (Cu-Ni-Co) on the main surface of one of the 12 ⁇ m thick rolled copper foils (JX Metals Corporation, HA-V2 foil) under the conditions shown below , Ni-Co), and an anticorrosion layer in this order.
  • the bath composition and plating conditions used are as follows.
  • thermographic display temperature evaluation of the thermographic display temperature and the powder removal was performed. The results are shown in Table 1.
  • the surface roughness Ra and Rz of the plating treated surface and the surface area ratio are the values of the heat-dissipating copper foil of Example 7.
  • Example 1 to 11 it was confirmed that the heat from the heating element was dissipated favorably by having the polymer film. Further, in Examples 2 to 4, 6 and 9 to 11, it was confirmed that the heat from the heating element was dissipated more favorably because the thickness of the polymer film was 2.0 ⁇ m or more. Furthermore, in Examples 5 to 11, by having the polymer film on the coating layer made of Ni—Co, it was confirmed that the heat from the heat generating body was dissipated more favorably, and the evaluation of powder removal was also satisfactory .
  • the heat dissipating member using the heat dissipating copper foil according to the embodiment of the present invention is excellent in heat dissipating characteristics. As a result, as the development of electronic devices progresses, there is provided a useful technology that does not cause a defect or the like due to the heat generation of the electronic component to be used according to the requirements such as miniaturization and high functionality.

Abstract

L'invention concerne une feuille de cuivre pour dissipation de chaleur, qui présente d'excellentes caractéristiques de dissipation de chaleur. Une feuille de cuivre pour dissipation thermique, qui comprend un matériau de base en feuille de cuivre et un film polymère qui est disposé sur au moins une surface principale du matériau de base en feuille de cuivre.
PCT/JP2018/045344 2017-12-26 2018-12-10 Feuille de cuivre pour dissipation de chaleur et élément de dissipation de chaleur WO2019131093A1 (fr)

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WO2013105266A1 (fr) * 2012-01-13 2013-07-18 Jx日鉱日石金属株式会社 Composite de feuille de cuivre, corps moulé, et procédé de production associé
WO2013157574A1 (fr) * 2012-04-19 2013-10-24 日本パーカライジング株式会社 Agent de traitement de surface du type à dépôt automatique pour du cuivre et procédé de fabrication d'un substrat contenant du cuivre pourvu d'un film de revêtement résineux
WO2014080958A1 (fr) * 2012-11-20 2014-05-30 Jx日鉱日石金属株式会社 Feuille de cuivre comportant un support, procédé de production d'une feuille de cuivre comportant un support, plaque de câblage imprimé, carte de circuit imprimé, stratifié cuivré et procédé de production d'une plaque de câblage imprimé
JP2017126775A (ja) * 2017-03-16 2017-07-20 Dic株式会社 導電性薄型粘着シート
WO2017150043A1 (fr) * 2016-03-03 2017-09-08 三井金属鉱業株式会社 Procédé de production pour plaque stratifiée cuivrée
WO2018225409A1 (fr) * 2017-06-09 2018-12-13 Ｊｘ金属株式会社 Feuille de cuivre traitée en surface, son procédé de production, et stratifié cuivré

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TWM387454U (en) * 2009-12-25 2010-08-21 Asia Electronic Material Co Copper foil substrate used in flexible PCB
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Publication number Priority date Publication date Assignee Title
JPH1034819A (ja) * 1996-07-18 1998-02-10 Mitsui Petrochem Ind Ltd 接着剤付き銅基材
JP2007168085A (ja) * 2005-12-19 2007-07-05 Toppan Printing Co Ltd 高ガスバリア性を有する積層体
WO2013105266A1 (fr) * 2012-01-13 2013-07-18 Jx日鉱日石金属株式会社 Composite de feuille de cuivre, corps moulé, et procédé de production associé
WO2013157574A1 (fr) * 2012-04-19 2013-10-24 日本パーカライジング株式会社 Agent de traitement de surface du type à dépôt automatique pour du cuivre et procédé de fabrication d'un substrat contenant du cuivre pourvu d'un film de revêtement résineux
WO2014080958A1 (fr) * 2012-11-20 2014-05-30 Jx日鉱日石金属株式会社 Feuille de cuivre comportant un support, procédé de production d'une feuille de cuivre comportant un support, plaque de câblage imprimé, carte de circuit imprimé, stratifié cuivré et procédé de production d'une plaque de câblage imprimé
WO2017150043A1 (fr) * 2016-03-03 2017-09-08 三井金属鉱業株式会社 Procédé de production pour plaque stratifiée cuivrée
JP2017126775A (ja) * 2017-03-16 2017-07-20 Dic株式会社 導電性薄型粘着シート
WO2018225409A1 (fr) * 2017-06-09 2018-12-13 Ｊｘ金属株式会社 Feuille de cuivre traitée en surface, son procédé de production, et stratifié cuivré

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