TWM387454U - Copper foil substrate used in flexible PCB - Google Patents

Copper foil substrate used in flexible PCB

Info

Publication number
TWM387454U
TWM387454U TW98224319U TW98224319U TWM387454U TW M387454 U TWM387454 U TW M387454U TW 98224319 U TW98224319 U TW 98224319U TW 98224319 U TW98224319 U TW 98224319U TW M387454 U TWM387454 U TW M387454U
Authority
TW
Taiwan
Prior art keywords
copper foil
substrate used
flexible pcb
foil substrate
pcb
Prior art date
Application number
TW98224319U
Other languages
Chinese (zh)
Inventor
zhen-xiong Qiu
Zhi-Ming Lin
Shou-Rui Xiang
jian-hui Li
wen-xian Zhou
Original Assignee
Asia Electronic Material Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Electronic Material Co filed Critical Asia Electronic Material Co
Priority to TW98224319U priority Critical patent/TWM387454U/en
Publication of TWM387454U publication Critical patent/TWM387454U/en

Links

TW98224319U 2009-12-25 2009-12-25 Copper foil substrate used in flexible PCB TWM387454U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98224319U TWM387454U (en) 2009-12-25 2009-12-25 Copper foil substrate used in flexible PCB

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98224319U TWM387454U (en) 2009-12-25 2009-12-25 Copper foil substrate used in flexible PCB

Publications (1)

Publication Number Publication Date
TWM387454U true TWM387454U (en) 2010-08-21

Family

ID=50604138

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98224319U TWM387454U (en) 2009-12-25 2009-12-25 Copper foil substrate used in flexible PCB

Country Status (1)

Country Link
TW (1) TWM387454U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI688063B (en) * 2017-12-26 2020-03-11 日商Ｊｘ金屬股份有限公司 Copper foil and components for heat dissipation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI688063B (en) * 2017-12-26 2020-03-11 日商Ｊｘ金屬股份有限公司 Copper foil and components for heat dissipation

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Legal Events

Date Code Title Description
MK4K Expiration of patent term of a granted utility model