WO2019128152A1 - 有机发光器件 - Google Patents

有机发光器件 Download PDF

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Publication number
WO2019128152A1
WO2019128152A1 PCT/CN2018/092299 CN2018092299W WO2019128152A1 WO 2019128152 A1 WO2019128152 A1 WO 2019128152A1 CN 2018092299 W CN2018092299 W CN 2018092299W WO 2019128152 A1 WO2019128152 A1 WO 2019128152A1
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Prior art keywords
layer
organic light
stress relief
emitting device
light emitting
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English (en)
French (fr)
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万康
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Yungu Guan Technology Co Ltd
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Yungu Guan Technology Co Ltd
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Publication of WO2019128152A1 publication Critical patent/WO2019128152A1/zh
Priority to US16/600,603 priority Critical patent/US20200044184A1/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/82—Cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/805—Electrodes
    • H10K59/8052—Cathodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present application relates to the field of display technologies, and in particular, to an organic light emitting device.
  • OLED devices organic light-emitting devices
  • OLED devices are considered to be the most promising planar display devices, and are considered to be the most likely to be fabricated into flexible display devices.
  • the life of OLED devices has constrained the pace of industrialization.
  • FIG. 1a when the organic light-emitting device is bent, stress concentration in the bending region is caused, thereby causing the first film layer 001 to be broken.
  • FIG. 1b when the organic light-emitting device is bent, stress concentration in the bending region is caused, thereby causing defects such as peeling or bubbling between the first film layer 001 and the second film layer 002.
  • the adhesion between the cathode and the organic light-emitting layer of the existing organic light-emitting device is smaller than the adhesion between the package layer and the cathode, and therefore, when the organic light-emitting device is bent, the cathode electrode layer and the cathode electrode layer are easily caused.
  • the organic light-emitting layer is peeled off, resulting in display failure.
  • the embodiments of the present application provide an organic light emitting device that solves problems such as peeling, breaking, and bubbling between film layers due to bending of the flexible display screen.
  • a substrate a display driving layer, a display light emitting layer, and an encapsulation layer, which are sequentially stacked,
  • the display luminescent layer includes a plurality of functional film layers, and at least one of the functional film layers includes at least one uneven stress relief region.
  • the stress relief region is located in a pre-bending region of the organic light emitting device.
  • the stress relief regions are superposed.
  • the stress relief regions have the same cross-sectional shape.
  • the cross-sectional shape of the stress relief region is a combination of one or a combination of a concave arc shape, a convex arc shape, a wave shape, and a zigzag shape.
  • the display light-emitting layer includes a planarization layer, an anode electrode layer, an organic light-emitting layer, and a cathode electrode layer which are sequentially stacked.
  • At least one of the planarization layer, the anode electrode layer, the organic light-emitting layer, and the cathode electrode layer includes at least one of the stress relief regions.
  • the encapsulation layer comprises an inorganic layer and an organic layer stacked together, the inorganic layer being disposed between the display luminescent layer and the organic layer, the inorganic layer comprising at least one uneven stress relief region.
  • the stress relief region of the inorganic layer is superposed on the stress relief region of the functional film layer of the display driving layer.
  • the cross-sectional shape of the stress relief region of the inorganic layer is the same as the cross-sectional shape of the stress relief region of the display driving layer.
  • the display driving layer is a TFT backplane layer.
  • An organic light-emitting device provided by an embodiment of the present application has at least one uneven stress relief region disposed on at least one functional film layer of the organic light-emitting layer.
  • the uneven shape of the stress relief region can release the bending stress during the bending process of the organic light emitting device, thereby alleviating the bending stress of the at least one functional film layer, and can effectively prevent the at least one functional film layer from being broken due to the bending stress. Or defects such as peeling or bubbling occur with other functional film layers, thereby improving the reliability of the organic light emitting device.
  • FIG. 1a is a schematic view showing the bending failure between layers of a conventional organic light-emitting device.
  • FIG. 1b is a schematic view showing the bending failure between the layers of another conventional organic light-emitting device.
  • FIG. 2 is a schematic structural diagram of an organic light emitting device according to an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a display light emitting layer of an organic light emitting device according to an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of an organic light emitting device according to an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of an organic light emitting device according to an embodiment of the present application.
  • the organic light emitting device includes a substrate 4, a display driving layer 1, a display light emitting layer 2, and an encapsulation layer 3 which are sequentially stacked.
  • the substrate 4 may be a flexible substrate such as a PI (polyimide) substrate, or may be a rigid substrate such as a glass substrate or the like.
  • PI polyimide
  • the embodiment of the present application does not specifically limit the type of the substrate 4.
  • the fabrication of the display driving layer 1, the display light-emitting layer 2, and the encapsulation layer 3 can be facilitated by providing the substrate 4.
  • the display driving layer 1 is for driving the display light-emitting layer 2 to emit light.
  • the external driving circuit controls the display driving layer 1 to control when the light-emitting layer 2 emits light, what color of light is emitted, and the like.
  • the encapsulation layer 3 is mainly used to prevent moisture and oxygen from intruding into the organic light-emitting device, prevent aging of the organic light-emitting device, and thereby prolong the life of the organic light-emitting device.
  • the encapsulation layer 3 can be implemented by Thin Film Encapsulation (TFE).
  • the display light-emitting layer 2 may include a plurality of functional film layers 20, and the display light-emitting layer 2 may be caused to emit light by the interaction of the plurality of functional film layers 20.
  • the plurality of functional film layers 20 displaying the light-emitting layer 2 at least one of the functional film layers 20 includes at least one uneven stress relief region 201.
  • An organic light-emitting device provided by an embodiment of the present application is provided with at least one uneven stress relief region 201 on at least one functional film layer 20 of the organic light-emitting layer 2.
  • the uneven shape of the stress relief region 201 can release the bending stress during the bending of the organic light emitting device, thereby alleviating the bending stress of the at least one functional film layer 20. It is possible to effectively prevent breakage of the at least one functional film layer 20 or defects such as peeling or bubbling with other functional film layers 20, thereby improving the reliability of the organic light-emitting device.
  • the uneven shape of the stress relief region 201 may be located in an uneven surface region of the functional film layer 20.
  • the cross-sectional shape of the stress relief structure of the stress relief region 201 may be an arc that is convex toward the encapsulation layer 3, or may be an arc that is recessed toward the substrate 4, or may be wavy or zigzag.
  • the specific shape of the stress relief region 201 can be designed and adjusted depending on the bending mode to be achieved.
  • the shape of the stress relief area 201 is not specifically limited in the embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a display light emitting layer of an organic light emitting device according to an embodiment of the present application.
  • the display light-emitting layer 2 includes a planarization layer 211, an anode electrode layer 212, an organic light-emitting layer 213, and a cathode electrode layer 214 which are sequentially stacked.
  • the planarization layer 211 is generally made of an organic material, and the stretching and stretching properties of the organic material are relatively good, and it is convenient to form a flat surface on the display driving layer 1.
  • the anode electrode layer 212 is prepared on the planarization layer 211, and the flat surface formed by the planarization layer 211 can facilitate the preparation of the anode electrode layer 212.
  • the organic light emitting layer 213 is formed between the anode electrode layer 212 and the cathode electrode layer 214.
  • the holes output from the anode electrode layer 212 are combined with the electrons output from the organic light-emitting layer 213 and the cathode electrode layer 214, so that the organic light-emitting device can emit light, and the light emitted from the organic light-emitting device can pass through.
  • the anode electrode layer 212 or the cathode electrode layer 214 is emitted.
  • the structure of the display light-emitting layer 2 may be other than the specific structure, as long as the light-emitting requirement of the organic light-emitting device can be ensured.
  • the planarization layer 211 can include at least one uneven first stress relief region 2110 that can be completed by an exposure patterning process.
  • the length of the anode electrode layer 212 may be increased, thereby increasing the contact area of the anode electrode layer 212 and the planarization layer 211.
  • the uneven shape of the first stress relief region 2110 can release the bending stress during the bending of the organic light emitting device, thereby preventing the anode electrode layer 212 from being peeled off from the planarization layer 211.
  • the anode electrode layer 212 includes at least one uneven second stress relief region 2120, and the second stress relief region 2120 may be formed by a wet etching process (or forming an anode electrode layer when the planarization layer 211 is exposed)
  • the raised structure of 212) has a simple process preparation process.
  • the contact area of the anode electrode layer 212 and the planarization layer 211 may be increased.
  • the uneven shape of the second stress relief region 2120 can release the bending stress during the bending of the organic light emitting device, thereby preventing the anode electrode layer 212 from being peeled off.
  • the organic light-emitting layer 213 may also include at least one uneven third stress relief region 2130, and the cathode electrode layer 214 may also include at least one uneven fourth.
  • the uneven shape of the stress relief region 2140, the third stress relief region 2130, or the fourth stress relief region 2140 may release bending stress during bending of the organic light emitting device, thereby preventing peeling of the anode electrode layer 212 or the cathode electrode layer 214.
  • the planarization layer 211 includes a first stress relief region 2110, or the anode electrode layer 212 includes a second stress relief region 2120, or the organic light emitting layer 213 may also include a third stress relief region 2130, or the cathode electrode layer 214 may also include The fourth stress relief region 2140.
  • the plurality of functional film layers 20 each include a stress relief region 201.
  • the embodiment of the present application does not specifically limit which functional film layer 20 or which functional film layers 20 are included in the light-emitting layer 2 including the stress relief region 201.
  • the respective functional film layers 20 of the display light-emitting layer 2 are provided with the stress release regions 201, the overall bending resistance of the organic light-emitting device can be better improved.
  • the first stress relief region 2110, the second stress relief region 2120, the third stress relief region 2130, and the fourth stress relief region 2140 are stacked. In this way, the plurality of stress relief regions 201 are superposed, so that the bending stress at the corresponding superimposed position can be well released. In one embodiment, the corresponding plurality of stress relief regions 201 can be prepared in the organic light emitting device. Pre-bent area.
  • the planarization layer 211 may be a flat structure, and the first stress relief region 2110 may not be disposed.
  • the second stress relief region 2120, the third stress relief region 2130, and the fourth stress relief region 2140 are stacked. In this way, the bending stress at the corresponding superimposed position can also be well released.
  • the plurality of stress relief regions 201 correspondingly superposed above may be prepared in a pre-bending region of the organic light emitting device.
  • any two functional film layers of the display light-emitting layer 2 may be displayed.
  • the stress relief area 201 of 20 or any of the functional film layers 20 is correspondingly superimposed, and the positions of the corresponding superpositions may be different.
  • the embodiment of the present application does not specifically limit the specific positions of the stress relief regions 201 of the functional film layer 20 and the specific positions of the corresponding superimposed layers.
  • the first stress relief region 2110, the second stress relief region 2120, the third stress relief region 2130, and the fourth stress relief region 2140 are superposed on the organic light emitting device in the same shape; or on the organic light emitting device.
  • the shapes of the second stress relief region 2120, the third stress relief region 2130, and the fourth stress relief region 2140 corresponding to the superposition are the same.
  • the shapes of the plurality of stress relief regions 201 corresponding to the superimposed arrangement are the same, after the lowermost stress relief region 201 is prepared, the other functional film layers 20 above are directly superposed and prepared, and can be "copied" at the corresponding position.
  • the shape of the stress relief region 201 below does not require a special patterning process to form the respective stress relief regions 201 of the upper functional film layer 20 thereof, thereby further simplifying the fabrication process.
  • the shape of any two or more stress relief regions 201 disposed in a superposition of the organic light emitting device may be the same.
  • the present application does not specifically limit the shape of the stress relief regions 201 corresponding to the superimposed arrangement.
  • the shapes of the plurality of stress relief regions 201 are the same in the embodiments of the present application and the drawings, and the organic light emitting devices are correspondingly superposed, the shapes of the plurality of stress relief regions 201 may be different or incomplete. Similarly, the plurality of stress relief regions 201 may not be disposed on the organic light emitting device. The shape of the plurality of stress relief regions 201 and the specific locations of the settings can be flexibly selected according to actual production needs.
  • FIG. 4 is a schematic structural diagram of an organic light emitting device according to an embodiment of the present application.
  • the encapsulation layer 3 may be a multi-layered stack structure of an inorganic layer 301 and an organic layer 302.
  • the inorganic layer 301 realizes the function of blocking water oxygen, and the organic layer 302 achieves the function of planarization.
  • the encapsulation layer 3 includes an inorganic layer 301 and an organic layer 302 stacked together, wherein the inorganic layer 301 is disposed between the display luminescent layer 2 and the organic layer 302.
  • the encapsulation layer 3 effectively blocks the display of the luminescent layer 2 by water and oxygen, and also ensures the planarization of the surface of the organic luminescence device.
  • the inorganic layer 301 includes at least one uneven fifth stress relief region 3010.
  • the uneven shape of the fifth stress relief region 3010 can release the organic light emitting device during bending.
  • the bending stress prevents the peeling of the inorganic layer 301 from the display light-emitting layer 2.
  • the fifth stress relief region 3010 is superposed with the stress relief region 201 of the functional film layer 20 on the surface of the display drive layer 1, which facilitates the preparation of the fifth stress relief region 3010, for example, the fifth stress relief region.
  • the 3010 can be prepared centrally in the pre-bending region of the organic light emitting device.
  • the fifth stress relief region 3010 has the same shape as the stress relief region 201 of the functional film layer 20 that displays the surface of the drive layer 1.
  • the upper inorganic layer 301 is directly superposed to prepare a functional film which can "copy" the surface of the display driving layer 1 at a corresponding position.
  • the shape of the stress relief region 201 of the layer 20 is formed by the special patterning process to form the stress relief region 201 of the inorganic layer 301, thereby further simplifying the fabrication process.
  • the embodiment of the present application does not specifically limit whether the fifth stress relief region 3010 and the stress relief region 201 of the functional film layer 20 on the surface of the display driving layer 1 are superimposed and arranged.
  • the display driving layer 1 may be a TFT (Thin Film Transistor) backplane layer, and the TFT backplane has the advantages of high responsivity, high contrast, lightness, thinness, and low power consumption. Therefore, it is widely used for the display driving layer 1 of an organic light emitting device for driving the light emission of the display light emitting layer 2.
  • TFT Thin Film Transistor
  • the specific structural form of the display driving layer 1 is not limited in the embodiment of the present application.

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Abstract

本申请实施例提供了一种有机发光器件，包括：依次叠加的衬底、显示驱动层、显示发光层以及封装层。其中，显示发光层包括多个功能膜层，多个功能膜层中的至少一层功能膜层包括至少一个不平坦的应力释放区。应力释放区的不平坦形状可以释放有机发光器件弯折过程中的弯曲应力，从而缓解了该至少一层功能膜层的弯曲应力，可以有效防止该至少一层功能膜层因为弯曲应力而发生断裂，或者与其他功能膜层之间发生剥离或鼓泡等缺陷，从而提高了有机发光器件的可靠性能。

Description

有机发光器件
交叉引用
本申请要求2017年12月29日提交的申请号为No.201721917719.7的中国申请的优先权，通过引用将其全部内容并入本文。
技术领域
本申请涉及显示屏技术领域，具体涉及一种有机发光器件。
发明背景
OLED器件(有机发光器件)被认为是最有发展潜力的平面显示器件，同时被认为是最有可能制作成柔性显示器件。但是，OLED器件的寿命问题制约了其产业化步伐。参考图1a，当有机发光器件发生弯折时，会导致弯折区应力集中，从而引起第一膜层001发生断裂。参考图1b，当有机发光器件发生弯折时，会导致弯折区应力集中，从而引起第一膜层001与第二膜层002之间发生剥离或鼓泡等缺陷。尤其是现有的有机发光器件的阴极和有机发光层之间的粘附力小于封装层和阴极之间的粘附力，因此，当有机发光器件发生弯折时，很容易引起阴极电极层和有机发光层剥离，从而导致显示失效。
发明内容
有鉴于此，本申请实施例提供了一种有机发光器件，解决了由于柔性显示屏的折弯引起的膜层之间的剥离、断裂以及鼓泡等问题。
本申请一实施例提供的一种有机发光器件包括：
依次叠加的衬底、显示驱动层、显示发光层以及封装层，
所述显示发光层包括多个功能膜层，所述功能膜层中的至少一层功能膜层包括至少一个不平坦的应力释放区。
其中，所述应力释放区位于所述有机发光器件的预弯折区域。
其中，当所述显示发光层包括多个所述应力释放区时，所述应力释放区叠加设置。
其中，当所述显示发光层包括多个所述应力释放区时，所述应力释放区的截面形状相同。
其中，所述应力释放区的截面形状为凹陷的弧形、凸起的弧形、波浪形以及锯齿形中的一种或几种的组合。
其中，作为所述功能层，所述显示发光层包括依次叠加的平坦化层、阳极电极层、有机发光层以及阴极电极层。
其中，所述平坦化层、所述阳极电极层、所述有机发光层以及所述阴极电极层中的至少一者包括至少一个所述应力释放区。
其中，所述封装层包括叠加在一起的无机层和有机层，所述无机层设置在所述显示发光层和所述有机层之间，所述无机层包括至少一个不平坦的应力释放区。
其中，所述无机层的应力释放区与所述显示驱动层的功能膜层的所述应力释放区叠加设置。
其中，所述无机层的应力释放区的截面形状与所述显示驱动层的应力释放区的截面形状相同。
其中，所述显示驱动层为TFT背板层。
本申请实施例提供的一种有机发光器件，在有机发光层的至少一层功能膜层上设置了至少一个不平坦的应力释放区。应力释放区的不平坦形状可以释放有机发光器件弯折过程中的弯曲应力，从而缓解了该至少一层功能膜层的弯曲应力，可以有效防止该至少一层功能膜层因为弯曲应力而发生断裂，或者与其他功能膜层之间发生剥离或鼓泡等缺陷，从而提高了有机发光器件的可靠性能。
附图简要说明
图1a所示为现有的一种有机发光器件的膜层间的弯折失效示意图。
图1b所示为现有的另一种有机发光器件的膜层间的弯折失效示意图。
图2所示为本申请一实施例提供的一种有机发光器件的结构示意图。
图3所示为本申请一实施例提供的一种有机发光器件的显示发光层的结构示意图。
图4所示为本申请一实施例提供的一种有机发光器件的结构示意图。
实施本发明的方式
图2所示为本申请一实施例提供的一种有机发光器件的结构示意图。
如图2所示，有机发光器件包括依次叠加在一起的衬底4、显示驱动层1、显示发光层2以及封装层3。
其中，衬底4可为柔性衬底，例如PI(聚酰亚胺)衬底，也可为刚性衬底，例如：玻璃衬底等。然而，本申请实施例对衬底4类型不作具体限定。通过设置衬底4可以便于显示驱动层1、显示发光层2以及封装层3的制作。
显示驱动层1用于驱动显示发光层2发光，例如，外部驱动电路通过显示驱动层1控制显示发光层2何时发光以及发什么颜色的光等。
封装层3主要用于可以防止水汽和氧气侵入有机发光器件，防止有机发光器件的老化，从而延长有机发光器件的寿命。在本申请一实施例中，封装层3可通过薄膜封装(Thin Film Encapsulation,TFE)来实现。
在本申请实施例中，显示发光层2可包括多个功能膜层20，通过多个功能膜层20的共同作用，可以使得显示发光层2发光。在显示发光层2的多个功能膜层20中，至少有一层功能膜层20包括至少一个不平坦的应力释放区201。
本申请实施例提供的一种有机发光器件，在有机发光层2的至少一层功能膜层20上设置了至少一个不平坦的应力释放区201。应力释放区201不平坦形状可以释放有机发光器件弯折过程中的弯曲应力，从而缓解了该至少一层功能膜层20的弯曲应力。可以有效防止该至少一层功能膜层20的断裂，或者与其他功能膜层20之间发生剥离或鼓泡等缺陷，从而提高了有机发光器件的可靠性能。
应力释放区201的不平坦形状可位于功能膜层20的不平坦表面区域。在一个实施例中，应力释放区201的应力释放结构的截面形状可为朝向封装层3凸起的弧形，也可为朝向衬底4凹陷的弧形，也可为波浪形以及锯齿形中的一种或几种的组合。应力释放区201的具体形状可根据所要实现的弯曲方式而设计调整。然而，本申请实施例对应力释放区201的形状不作具体限定。
图3所示为本申请一实施例提供的一种有机发光器件的显示发光层的结构示意图。
参考图3，在一个实施例中，显示发光层2包括：依次叠加的平坦化层211、阳极电极层212、有机发光层213以及阴极电极层214。平坦化层211一般采用有机材料制成，有机材料的拉伸及延展性能比较好，便于在显示驱动层1上形成平整表面。阳极电极层212制备在平坦化层211上，平坦化层211形成的平整表面可以方便阳极电极层212的制备。有机发光层213形成在阳极电极层212和阴极电极层214之间。当对有机发光器件施加电压时，阳极电极层212输出的空穴在有机发光层213与阴极电极层214输出的电子相结合，这样就可以使得有机发光器件发光，有机发光器件发出的光可经阳极电极层212或阴极电极层214射出。然而，应当理解，显示发光层2也可以采用其他结构，只要能够保证满足有机发光器件的发光需求即可，本申请实施例对显示发光层2的结构不作具体限定。
在一个实施例中，平坦化层211可包括至少一个不平坦的第一应力释放区2110，第一应力释放区2110可以通过曝光图形化工艺完成。当平坦化层211包括第一应力释放区2110时，可以增加阳极电极层212的长度，从而增加阳极电极层212与平坦化层211的接触面积。第一应力释放区2110的不平坦形状可以释放有机发光器件弯折过程中的弯曲应力，从而避免阳极电极层212从平坦化层211上剥离。
在一个实施例中，阳极电极层212包括至少一个不平坦的第二应力释放区 2120，第二应力释放区2120可以通过湿法刻蚀工艺形成(或者在平坦化层211曝光时形成阳极电极层212的凸起结构)，工艺制备流程简单。当阳极电极层212包括第二应力释放区2120时，可以增加阳极电极层212与平坦化层211的接触面积。当有机发光器件发生弯折时，第二应力释放区2120的不平坦形状可以释放有机发光器件弯折过程中的弯曲应力，从而避免阳极电极层212发生剥离。
此外，在一个实施例中，为了释放膜层间的应力，有机发光层213也可包括至少一个不平坦的第三应力释放区2130，以及阴极电极层214也可包括至少一个不平坦的第四应力释放区2140，第三应力释放区2130或第四应力释放区2140的不平坦形状可以释放有机发光器件弯折过程中的弯曲应力，从而避免阳极电极层212或阴极电极层214发生剥离。
然而应当理解，在显示发光层2包括的作为功能膜层20的平坦化层211、阳极电极层212、有机发光层213以及阴极电极层214中，可以是仅仅其中的一层包括应力释放区201，例如平坦化层211包括第一应力释放区2110，或阳极电极层212包括第二应力释放区2120，或有机发光层213也可包括第三应力释放区2130，或阴极电极层214也可包括第四应力释放区2140。也可以是其中的多个功能膜层20分别包括应力释放区201。本申请实施例对显示发光层2的具体哪个功能膜层20或哪几层功能膜层20包括应力释放区201不作具体限定。当显示发光层2的各个功能膜层20均设置应力释放区201时，可以更好地提高有机发光器件整体的抗折弯性能。
在一个实施例中，第一应力释放区2110、第二应力释放区2120、第三应力释放区2130以及第四应力释放区2140叠加设置。这样，多个应力释放区201叠加设置，可以使得对应叠加位置处的弯折应力得到很好的释放，在一个实施例中，对应叠加的该多个应力释放区201可以制备在有机发光器件的预弯折区域。
在另一实施例中，平坦化层211可以为平整结构，可以不设置第一应力释放区2110。第二应力释放区2120、第三应力释放区2130以及第四应力释放区2140叠加设置。这样，同样可以使得对应叠加位置处的弯折应力得到很好的释放。在一个实施例中，上述对应叠加的该多个应力释放区201可以制备在有机发光器件的预弯折区域。
然而应当理解，在本申请实施例中，根据有机发光器件的预弯折区域的设计位置不同以及不同功能膜层20的耐弯折需求不同，可以将显示发光层2的任意两个功能膜层20或任意几个功能膜层20的应力释放区201对应叠加设置，且对应叠加的位置可各有不同。本申请实施例对显示发光层2的哪几个功能膜层20的应力释放区201叠加设置以及对应叠加设置的具体位置均不作具体限定。
在一个实施例中，在有机发光器件叠加设置的第一应力释放区2110、第二应力释放区2120、第三应力释放区2130以及第四应力释放区2140的形状相同；或 者在有机发光器件上对应叠加设置的第二应力释放区2120、第三应力释放区2130以及第四应力释放区2140的形状相同。当对应叠加设置的多个应力释放区201的形状相同时，在制备好最下方的应力释放区201后，上方的其他功能膜层20直接叠加制备即可在对应的位置“复制”下来该最下方的应力释放区201的形状，而不用通过特别的图形化工艺来形成上方他功能膜层20各自的应力释放区201，从而进一步简化了制备工艺。然而应当理解，在有机发光器件的叠加设置的任意两个或多个应力释放区201的形状可以相同。本申请对对应叠加设置的哪几个应力释放区201的形状相同不作具体限定。
应当理解，虽然在本申请实施例以及附图中，多个应力释放区201的形状相同，且在有机发光器件对应叠加设置的，然而多个应力释放区201的形状也可以不相同或不完全相同，多个应力释放区201在有机发光器件上也可以不是对应叠加设置。在可以根据实际生产需要灵活选择多个应力释放区201的形状以及设置的具体位置。
图4所示为本申请一实施例提供的一种有机发光器件的结构示意图。
参考图4，封装层3可以是无机层301和有机层302多层堆叠结构。其中无机层301实现阻隔水氧的作用，而有机层302实现平坦化的作用。在一个实施例中，封装层3包括叠加在一起的无机层301和有机层302，其中，无机层301设置在显示发光层2和有机层302之间设置。封装层3通过设置无机层301和有机层302，既有效的阻隔了水氧侵蚀显示发光层2，同时也保证了有机发光器件表面的平坦化。
在一个实施例中，无机层301包括至少一个不平坦的第五应力释放区3010，当有机发光器件发生弯折时，第五应力释放区3010的不平坦形状可以释放有机发光器件弯折过程中的弯曲应力，避免无机层301与显示发光层2的剥离。
在一个实施例中，第五应力释放区3010与显示驱动层1表面的功能膜层20的应力释放区201叠加设置，这样可以方便第五应力释放区3010的制备，例如，第五应力释放区3010可以在有机发光器件的预弯折区域内集中制备。
在一个实施例中，第五应力释放区3010与显示驱动层1表面的功能膜层20的应力释放区201的形状相同。此时，在制备好显示驱动层1表面的功能膜层20的应力释放区201后，上方的无机层301直接叠加制备即可在对应的位置“复制”下来该显示驱动层1表面的功能膜层20的应力释放区201的形状，而不用通过特别的图形化工艺来形成无机层301的应力释放区201，从而进一步简化了制备工艺。
然而应当理解，本申请实施例对第五应力释放区3010与显示驱动层1表面的功能膜层20的应力释放区201是否对应叠加设置以及是否形状相同并不作具体限定。
参考图4，在一个实施例中，显示驱动层1可为TFT(Thin Film Transistor：薄膜晶体管)背板层，TFT背板具有高响应度、高对比度、轻、薄以及低功耗等优点，因此被广泛用于有机发光器件的显示驱动层1，用于驱动显示发光层2的发光。然而应当理解，本申请实施例对显示驱动层1的具体结构形式不作限定。
以上所述仅为本申请的较佳实施例而已，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换等，均应包含在本申请的保护范围之内。

Claims (10)

  1. 一种有机发光器件，其中，所述有机发光器件包括：
    依次叠加的衬底、显示驱动层、显示发光层以及封装层，
    其中，所述显示发光层包括多个功能膜层，所述功能膜层中的至少一层功能膜层包括至少一个不平坦的应力释放区。
  2. 根据权利要求1所述的有机发光器件，其中，所述应力释放区位于所述有机发光器件的预弯折区域。
  3. 根据权利要求1或2所述的有机发光器件，其中，当所述显示发光层包括多个所述应力释放区时，所述应力释放区叠加设置。
  4. 根据权利要求1至3任一所述的有机发光器件，其中，当所述显示发光层包括多个所述应力释放区时，所述应力释放区的截面形状相同。
  5. 根据权利要求4所述的有机发光器件，其中，所述应力释放区的截面形状为凹陷的弧形、凸起的弧形、波浪形以及锯齿形中的一种或几种的组合。
  6. 根据权利要求1至5任一所述的有机发光器件，其中，作为所述功能层，所述显示发光层包括依次叠加的平坦化层、阳极电极层、有机发光层以及阴极电极层。
  7. 根据权利要求6所述的有机发光器件，其中，所述平坦化层、所述阳极电极层、所述有机发光层以及所述阴极电极层中的至少一者包括至少一个所述应力释放区。
  8. 根据权利要求1至7任一所述的有机发光器件，其中，所述封装层包括叠加在一起的无机层和有机层，所述无机层设置在所述显示发光层和所述有机层之间，所述无机层包括至少一个不平坦的应力释放区。
  9. 根据权利要求8所述的有机发光器件，其中，所述无机层的应力释放区与所述显示驱动层的功能膜层的所述应力释放区叠加设置。
  10. 根据权利要求8或9所述的有机发光器件，其中，所述无机层的应力释放区的截面形状与所述显示驱动层的应力释放区的截面形状相同。
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