WO2019124443A1 - Élément de pression et outil de maintien de substrat - Google Patents

Élément de pression et outil de maintien de substrat Download PDF

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Publication number
WO2019124443A1
WO2019124443A1 PCT/JP2018/046803 JP2018046803W WO2019124443A1 WO 2019124443 A1 WO2019124443 A1 WO 2019124443A1 JP 2018046803 W JP2018046803 W JP 2018046803W WO 2019124443 A1 WO2019124443 A1 WO 2019124443A1
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WO
WIPO (PCT)
Prior art keywords
slit
deformation
pressing member
center line
substrate
Prior art date
Application number
PCT/JP2018/046803
Other languages
English (en)
Japanese (ja)
Inventor
徹彌 井上
吉田　政生
田中　拓也
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to JP2019560535A priority Critical patent/JP6913764B2/ja
Publication of WO2019124443A1 publication Critical patent/WO2019124443A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F1/00—Springs
    • F16F1/02—Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant
    • F16F1/18—Leaf springs
    • F16F1/22—Leaf springs with means for modifying the spring characteristic
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F1/00—Springs
    • F16F1/36—Springs made of rubber or other material having high internal friction, e.g. thermoplastic elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to a pressing member and a substrate holder.
  • the size of a base on which the substrate is mounted is also increasing accordingly.
  • this base not only a large diameter substrate but also a small diameter substrate smaller in size than the large diameter substrate may be placed.
  • a substrate holder is used to hold such a small diameter substrate.
  • Patent Document 1 Japanese Patent Laid-Open No. 2011-97043 describes a substrate holder having a contact portion for positioning a substrate, and a plate spring which is a pressing member for pressing and holding the substrate against the contact portion. ing.
  • the pressing member used in the substrate holder is required to hold the substrate with an appropriate holding force even when the size of the substrate has variation within a prescribed tolerance.
  • the pressing member of the present disclosure is a pressing member that abuts on the side surface of the target substrate placed on the base, and presses and holds the target substrate along the first direction.
  • the pressing member has an abutting surface that abuts on the target substrate, and includes a deformation portion and two fixing portions.
  • the deformation portion has elasticity in the first direction.
  • the two fixing portions are spaced apart in a second direction orthogonal to the first direction, and are respectively connected to the deformation portions.
  • the deformation portion has a plurality of first regions along the first direction and a plurality of second regions along the second direction. The deformation portion is bent at a position where the first area and the second area intersect.
  • the total extension L1 in the first direction in the deformation portion is three or more times the height of the deformation portion.
  • the total extension L2 in the second direction in the deformation portion is 1.5 or more times the width of the deformation portion. Further, L2 is not less than one time and not more than three times L1.
  • the pressing member of the present disclosure is a pressing member that abuts on the side surface of the target substrate placed on the base and presses and holds the target substrate along the first direction.
  • the pressing member includes a deformation portion, a first fixing portion, and a second fixing portion.
  • the deformation portion has a first side surface abutting on the target substrate, and a second side surface opposite to the first side surface, and has elasticity in the first direction.
  • the first fixing portion and the second fixing portion are spaced apart in a second direction orthogonal to the first direction, and are respectively connected to the deformation portions.
  • the deformation portion has a plurality of first regions along the first direction and a plurality of second regions along the second direction.
  • the deformation portion is bent at a position where the first area and the second area intersect.
  • the deformation portion further includes a first slit to an eighth slit on the other side of a center line passing the center along the first direction.
  • the first slit is opened at the second side, extends in a third direction opposite to the first direction, and then bends and extends away from the center line.
  • the second slit is opened to the first side, extends in the first direction, and then bends and extends closer to the center line near the second side than the first slit.
  • the third slit is open toward the second side at a position farther from the center line than the second slit, and has a portion extending in the third direction.
  • the fourth slit is open toward the first side at a position farther from the center line than the third slit, and has a portion extending in the first direction. Further, the fifth slit to the eighth slit are located in line symmetry with the first slit to the fourth slit with respect to the center line on the other side of the center line as a boundary.
  • the pressing member of the present disclosure is a pressing member that abuts on the side surface of the target substrate placed on the base, and presses and holds the target substrate in the first direction.
  • the pressing member includes a deformation portion, a first fixing portion, and a second fixing portion.
  • the deformation portion has a first side surface abutting on the target substrate, and a second side surface opposite to the first side surface, and has elasticity in the first direction.
  • the first fixing portion and the second fixing portion are spaced apart in a second direction orthogonal to the first direction, and are respectively connected to the deformation portions.
  • the deformation portion includes first to eighteenth parts bordering on a center line passing the center along the first direction.
  • the first portion comprises the first side.
  • the second portion extends from the first portion in the first direction.
  • the third portion extends from the second portion in a direction approaching the center line.
  • the fourth portion extends from the third portion in the first direction.
  • the fifth portion extends from the fourth portion in a direction away from the centerline.
  • the sixth portion extends from the fifth portion in a third direction opposite to the first direction.
  • a seventh portion extends from the sixth portion in a direction away from the centerline.
  • the eighth portion extends from the seventh portion in the first direction.
  • the ninth portion extends from the eighth portion in a direction away from the center line.
  • the tenth to eighteenth portions are located in line symmetry with the first to ninth portions with respect to the center line on the other side of the center line as a boundary.
  • the deformation portion further includes a grip portion extending in the first direction from the first portion and the tenth portion between the fourth portion and the thirteenth portion.
  • the substrate holder of the present disclosure includes the base having a substrate contact portion, and any one of the above-described pressing members located on the base.
  • (A) is a top view which shows an example of embodiment of the press member of this indication
  • (b) is the side view seen from the arrow A direction in (a). It is an explanatory view of each part of a pressing member of this indication.
  • (A) is a top view which shows an example of embodiment of the board
  • (b) is the side view seen from the arrow B direction in (a). It is a stress analysis result of the press member of this indication. It is explanatory drawing of the dimension of the press member of this indication. It is a top view of the press member of a comparative example.
  • FIG. 1 is a plan view showing an example of the embodiment of the pressing member of the present disclosure
  • FIG. 1 (b) is a side view seen from the direction of arrow A in (a).
  • FIG. 2A is an explanatory view for explaining the first slit to the eighth slit
  • FIG. 2B is an explanatory view for explaining the first portion to the eighteenth portion.
  • FIG. 3 is a plan view showing an example of the embodiment of the substrate holder of the present disclosure
  • FIG. 3 (b) is a side view seen from the arrow B direction in (a).
  • FIG. 5 is explanatory drawing of the dimension of the press member of this indication.
  • the pressing member 1 of the present disclosure is used to press and hold a small diameter substrate (a long chain line in FIG. 3) on a base 11 designed for a large diameter substrate.
  • the pressing member 1 is also called a leaf spring.
  • the substrate holder 10 of the present disclosure includes a base 11, a substrate contact portion 12, and a pressing member 1, as shown in FIG.
  • the base 11 is for mounting a substrate.
  • the substrate contact portion 12 is for contacting the side surface of the substrate to position the substrate.
  • the pressing member 1 is located on the base 11.
  • the thing of pin shape is shown as the board
  • the pressing member 1 includes a deformation portion 6 and two fixing portions 5.
  • the deformation portion 6 has an abutment surface 6d that abuts on the substrate, and has elasticity in a first direction (a direction from the bottom to the top in FIG. 1A).
  • the two fixing portions 5 are separated from each other in a second direction (left and right direction in FIG. 1A) orthogonal to the first direction, and are connected to the deformation portion 6 respectively.
  • the deformation portion 6 has a plurality of first regions 6a along the first direction and a plurality of second regions 6b along the second direction. In the deformation portion 6, the position at which the first area 6a and the second area 6b intersect is bent.
  • the total length L1 of the deformation portion 6 in the first direction 6a in the deformation portion 6 is three or more times the height of the deformation portion 6 (H in FIG. 5), and the deformation portion 6 in the pressing member 1 of the present disclosure
  • the total extension L2 in the second direction in the above is 1.5 times or more of the width (W in FIG. 5) of the deformation portion 6, and L2 is 1 or more and 3 times or less of L1.
  • the total extension L1 in the first direction of the deformation portion 6 and the total extension L2 in the second direction are respectively the first direction of the center line 6c of the deformation portion 6 when the pressing member 1 as shown in FIG. , And a total extension of the second direction.
  • the first region is indicated by a long chain line
  • the second region is indicated by a dotted line.
  • the total extension L1 in the first direction is the sum of the lengths of the long chain lines
  • the total extension L2 in the second direction is the sum of the lengths of the dotted lines.
  • first direction means extending at an angle of less than 45 ° with respect to a center line passing the center of the deformation portion 6 along the first direction.
  • second direction means extending at an angle of 45 ° or more with respect to the center line.
  • the origin of the lengths of the first region 6a and the second region 6b is the intersection of the center line 6c of the first region 6a and the center line 6c of the second region 6b, and this intersection is a bent portion To be present.
  • the length may be determined from an imaginary line connecting the center of the width at the start point of one first area 6a and the center of the width at the end point. .
  • the second region 6b The same applies to the second region 6b.
  • the pressing member 1 also includes a deformation portion 6, a first fixing portion 5a, and a second fixing portion 5b.
  • the deformation portion 6 has a first side surface (contact surface) 6 d and a second side surface 6 e opposite to the first side surface 6 d, and has elasticity in the first direction.
  • the first fixing portion 5 a and the second fixing portion 5 b are separated from each other in a second direction orthogonal to the first direction, and are connected to the deformation portion 6 respectively.
  • the deformation portion 6 includes a first slit 8a, a second slit 8b, a third slit 8c, and a fourth slit 8d.
  • the first slit 8a is opened in the second side face 6e with a center line passing the center along the first direction, and opens in the second side 6e and extends in a third direction opposite to the first direction. It bends in the direction away and extends.
  • the second slit 8b is opened on the side of the first side face 6d, extends in the first direction, and then bends and extends closer to the center line near the second side face 6e than the first slit 8a.
  • the third slit 8c is open toward the second side face 6e at a position farther from the center line than the second slit 8b, and has a portion extending in the third direction.
  • the fourth slit 8d is open on the side of the first side face 6d at a position farther from the center line than the third slit 8c, and has a portion extending in the first direction.
  • the deformation portion 6 is located fifth line 8e, sixth line 8f and seventh line 8g in line symmetry with the first slit 8a to the fourth slit 8d with respect to the center line on the other side of the center line. , 8th slit 8h.
  • the direction approaching the center line can be reworded as the direction toward the second fixed portion 5 b, and the direction away from the center line is the first It can be reworded as the direction toward the fixed part 5a.
  • the deformation portion 6 includes a first portion 9a, a second portion 9b, a third portion 9c, a fourth portion 9d, a fifth portion 9e, a sixth portion 9f, a seventh portion 9g, and a sixth portion.
  • An eighth portion 9h and a ninth portion 9i are provided.
  • the first portion 9a includes a first side surface 6d on the other side of the center line.
  • the second portion 9b extends in the first direction from the first portion 9a.
  • the third portion 9c extends from the second portion 9b in a direction approaching the center line.
  • the fourth portion 9d extends in the first direction from the third portion 9c.
  • the fifth portion 9 e extends away from the center line from the fourth portion 9 d.
  • the sixth portion 9 f extends from the fifth portion 9 e in a third direction opposite to the first direction.
  • the seventh portion 9g extends away from the central line from the sixth portion 9f.
  • the eighth portion 9h extends in the first direction from the seventh portion 9g.
  • the ninth portion 9i extends away from the central line from the eighth portion 9h.
  • the deformation portion 6 is a tenth portion 9j, an eleventh portion 9k, a twelfth portion 91, and a tenth portion 9j, which are located in line symmetry with the first portion 9a to the ninth portion 9i with respect to the centerline on the other side of the centerline. And 13th part 9m, 14th part 9n, 15th part 9o, 16th part 9p, 17th part 9q, 18th part 9r.
  • the deformation portion 6 further includes a gripping portion 7 extending in the first direction from the first portion 9a and the tenth portion 9j between the fourth portion 9d and the thirteenth portion 9m.
  • the pressing member 1 of the present disclosure has a small change in holding force due to dimensional variations of the substrate.
  • the pressing member 1 of the present disclosure has a sufficiently large holding force even with a small amount of deformation, and the holding force is not too large even with a large amount of deformation.
  • the substrate holder of the present disclosure includes the pressing member in which the change in holding power due to the dimensional variation of the substrate is small, the processing yield and the processing accuracy are improved.
  • the thickness of a substrate used in a semiconductor manufacturing apparatus or a semiconductor inspection apparatus is generally 1 mm or less. If the thickness of the pressing member 1 is 1 mm or less, the thickness of the substrate holder 10 can be made small and compact.
  • the maximum thickness of the substrate holder 10 (the thickness of the pressing member 1 or The maximum value of the sum of the thickness of the substrate contact portion 12 and the thickness of the substrate mounting surface of the substrate holder 10 is preferably equal to or less than the maximum thickness of the large diameter substrate mountable on the device design.
  • the thickness of is preferably 0.5 mm or less.
  • the deformation portion 6 When the deformation portion 6 is deformed, the portions constituting the first region 6a and the second region 6b are respectively deformed, and the bent portion where the first region 6a and the second region 6b intersect is in the case of deformation. It becomes a support point for The deformation portion 6 is axisymmetrical along the center line, and when the first region 6a and the second region 6b are respectively connected substantially perpendicularly, the moment acting on the support point is stabilized, and the deformation of the adjacent portion is Since the influence on the pressure is reduced, the deformation of the pressing member 1 is stabilized.
  • the material of the pressing member 1 is metal, metal contamination of the substrate is concerned. Therefore, the material of the pressing member 1 is preferably resin.
  • polycarbonate resins are suitable also from the viewpoint of strength and elastic modulus.
  • deformation at the contact surface 6d of the pressing member 1 when holding the smallest substrate within the tolerance of the SEMI standard and when holding the largest substrate is determined by the tolerance of the outer diameter and the tolerance of the orientation flat, 1.33 mm for a 2 inch substrate, 2.26 mm for a 3 inch substrate, 1.85 mm for a 4 inch substrate, 1.89 mm for a 5 inch substrate, It is 1.26 mm with a 6 inch substrate.
  • the largest deformation amount difference required for the pressing member 1 is 2.26 mm of the 3-inch substrate.
  • the amount of deformation of the pressing member 1 when holding the smallest substrate within the tolerance in the substrate holder 10 is 0.5 mm
  • the amount of deformation of the pressing member 1 is between 0.5 mm and 2.8 mm. If the member 1 has an appropriate holding power, the pressing member 1 and the substrate are used even if the sizes of the substrates vary within tolerances in all the substrate holders 10 from the substrate for 2 inches to the substrate for 6 inches.
  • the holder 10 can hold the substrate with a suitable holding force.
  • the degree of stress concentration (the ratio of the stress value at the stress concentration point to the sum of the stress values at a plurality of analysis points) at the point (stress concentration point) where the largest stress is concentrated at the time of deformation is correlated with the holding force.
  • the degree of stress concentration falls within a predetermined range, the pressing member 1 can have an appropriate holding force with either a small amount of deformation or a large amount of deformation. From the analysis result to be described later, the stress concentration portion of the pressing member 1 is a portion near the seventh portion 9g on the third slit 8c side of the eighth portion 9h.
  • (L2 ⁇ 3 / I) corresponds to the deflection of the second region 6b
  • ((L1 + L2) / A) corresponds to the deformation of the first region 6a.
  • the value of (L 2 3 3 / I) / ((L 1 + L 2) / A) is more than 1700 and less than 2000, suitable holding power can be obtained with either a small amount of deformation or a large amount of deformation.
  • the cross section of the bending region is a cross section when the pressing member 1 is cut along the dotted lines shown in FIG. 2B, and the cross sectional area A of the bending portion where the first region 6a and the second region 6b intersect is plural Of the cross-sectional area of the inflection of the
  • FIG. 5 is an explanatory view of the dimensions of the pressing member.
  • Table 1 a total of 18 types (sample Nos. 1 to 18) of pressing members 1 in which the dimensions of H, W1, and W2 in FIG. 5 were changed were produced as an example.
  • Sample No. The thickness 1 to 16 is 0.5 mm, the height is 6.5 to 9.0 mm, the width is 44 mm, and the width W of the deformed portion is 34 mm.
  • Sample No. A shape 17 shown in FIG. 6 has a thickness of 0.5 mm, a height of 6.5 mm, a width of 34 mm, and a width W of the deformed portion of 24 mm.
  • Sample No. Sample No. 18 is a sample no. The point different from 1 is that the third slit 8c, the fourth slit 8d, the seventh slit 8g, and the eighth slit 8h are not provided.
  • Sample No. 1 to 16 are all L2 / W ⁇ 1.5, L1 / H33, and 1 ⁇ L1 / L233. Sample No. The points 17 and 18 satisfy the condition of L2 / W ⁇ ⁇ 1.5. Sample Nos. 1 to 16 are the same as Example 1 except that L1 / H ⁇ 3 and L1 / L2> 3 are points. It differs from 1 to 16.
  • sample no. Spring constants and stress distributions of 1 to 3, 6, 8, 9, 14 to 16 were analyzed.
  • Sample No. 1 when holding power is 1N.
  • the von Mises stress distribution of 1 is shown in FIG. In FIG. 4, the magnitude of the stress is represented by the color density.
  • the place where the stress is the largest is the place closer to the seventh portion 9g (the place 2 in FIG. 4) on the third slit 8c side of the eighth portion 9h.
  • the ratio of the stress value at point 2 to the sum of the stress values at points 1 to 7 is taken as a stress concentration and is shown in Table 1.
  • the degree of stress concentration is 24.2 or less, the holding power at a deformation of 2.8 mm is too large, and when it is 25.4 or more, the holding power at a deformation of 0.5 mm is insufficient.
  • sample no. Samples Nos. 17 and 18 had too low holding power. 1 to 16 were excellent in holding power. In particular, sample no. The holding power was suitable for 1-13.
  • sample No. Sample No. 17 had a large holding power. 1 to 16 were excellent in holding power.
  • sample no. 5, 7 to 12 and 14 were suitable for holding power. Sample No. It was found that No. 5 and No. 7 to 12 can have appropriate holding power even with a small amount of deformation or a large amount of deformation.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Springs (AREA)

Abstract

La présente invention concerne un élément de pression qui a une surface de butée venant en butée contre un substrat d'objet et qui comporte : une partie de déformation qui est élastique dans une première direction; et deux parties fixes qui sont reliées à la partie de déformation. La partie de déformation comporte une pluralité de premières régions le long de la première direction, et une pluralité de secondes régions le long d'une seconde direction. La partie de déformation est pliée à des positions où les premières régions et les secondes régions se croisent respectivement. La longueur totale L1, dans la première direction, de la partie de déformation est supérieure de 3 fois ou plus à la hauteur de la partie de déformation, la longueur totale L2, dans la seconde direction, de la partie de déformation est plus grande de 1,5 fois ou plus que la largeur de la partie de déformation, et L2 est plus grand de 1 à 3 fois que L1.
PCT/JP2018/046803 2017-12-19 2018-12-19 Élément de pression et outil de maintien de substrat WO2019124443A1 (fr)

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JP2019560535A JP6913764B2 (ja) 2017-12-19 2018-12-19 押圧部材および基板保持具

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JP2017-242838 2017-12-19
JP2017242838 2017-12-19

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WO2019124443A1 true WO2019124443A1 (fr) 2019-06-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021065561A (ja) * 2019-10-28 2021-04-30 合同会社イニット 板バネ、携帯用調理具、及び携帯用収納具

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011097043A (ja) * 2009-09-30 2011-05-12 Kyocera Corp 吸着用部材およびこれを用いた吸着装置、並びに光照射装置および荷電粒子線装置
JP2011216538A (ja) * 2010-03-31 2011-10-27 Kyocera Corp 保持部材およびそれを用いたホルダ
JP2017089714A (ja) * 2015-11-06 2017-05-25 国立大学法人 鹿児島大学 耐震性向上用弾性部材、耐震性向上用構造体、及び耐震性向上用弾性部材の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011097043A (ja) * 2009-09-30 2011-05-12 Kyocera Corp 吸着用部材およびこれを用いた吸着装置、並びに光照射装置および荷電粒子線装置
JP2011216538A (ja) * 2010-03-31 2011-10-27 Kyocera Corp 保持部材およびそれを用いたホルダ
JP2017089714A (ja) * 2015-11-06 2017-05-25 国立大学法人 鹿児島大学 耐震性向上用弾性部材、耐震性向上用構造体、及び耐震性向上用弾性部材の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021065561A (ja) * 2019-10-28 2021-04-30 合同会社イニット 板バネ、携帯用調理具、及び携帯用収納具
JP7324503B2 (ja) 2019-10-28 2023-08-10 合同会社イニット 板バネ、携帯用調理具、及び携帯用収納具

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