WO2019123922A1 - Matériau de polissage et procédé de fabrication de matériau de polissage - Google Patents

Matériau de polissage et procédé de fabrication de matériau de polissage Download PDF

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Publication number
WO2019123922A1
WO2019123922A1 PCT/JP2018/042368 JP2018042368W WO2019123922A1 WO 2019123922 A1 WO2019123922 A1 WO 2019123922A1 JP 2018042368 W JP2018042368 W JP 2018042368W WO 2019123922 A1 WO2019123922 A1 WO 2019123922A1
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Prior art keywords
polishing
abrasive
substrate
layer
fumed silica
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PCT/JP2018/042368
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English (en)
Japanese (ja)
Inventor
聡一郎 中根
友樹 岩永
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バンドー化学株式会社
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Application filed by バンドー化学株式会社 filed Critical バンドー化学株式会社
Priority to CN201880003034.2A priority Critical patent/CN110177653B/zh
Priority to JP2018560923A priority patent/JPWO2019123922A1/ja
Publication of WO2019123922A1 publication Critical patent/WO2019123922A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents

Definitions

  • the present invention relates to an abrasive and a method of manufacturing the abrasive.
  • an abrasive of fixed abrasive is generally used.
  • an abrasive composed of an abrasive layer containing abrasive grains and a binder laminated on the surface of a substrate is known.
  • the polishing layer is composed of a plurality of polishing parts.
  • the occupancy rate of the area in contact with the workpiece decreases, and the surface pressure at the time of polishing increases, so a high polishing rate can be expressed.
  • grinding dust can be removed by the grooves formed between the plurality of polishing portions, it is possible to suppress a decrease in the polishing rate due to clogging of the abrasive.
  • the abrasive layer is gradually worn away with the processing of the glass substrate, and therefore, in order to increase the life of the abrasive, it is required to thicken the abrasive portion.
  • the polishing layer is generally formed using a printing method. In the case of using the printing method, if the thickness of the polishing portion is increased, the aspect ratio is increased, so that the liquid tends to drip during printing, and it becomes difficult to form each polishing portion in a columnar shape. For this reason, in the conventional thick abrasive of the polishing portion, a pyramidal polishing portion or a polishing portion having a large top surface area is used (see, for example, JP-A-2014-18893).
  • the polishing portion when the polishing portion is formed in a pyramidal shape, the area of the top surface of the polishing portion increases as the polishing layer wears, so the surface pressure at the time of polishing may decrease and the polishing rate may decrease.
  • the area of the polishing portion when the area of the polishing portion is increased, it is necessary to widen the width of the groove between the polishing portions in order to reduce the area occupancy rate. When the width of the groove is increased, the workpiece tends to fall into the groove, and therefore, the workpiece may be wrinkled. For this reason, when the area of the polishing portion is increased, it is difficult to reduce the area occupancy rate, so the contact pressure at the time of polishing may be decreased, and the polishing rate may be decreased.
  • the present invention has been made in view of such problems, and it is an object of the present invention to provide an abrasive and a method of manufacturing the abrasive, which can thicken the polishing portion while suppressing a decrease in the polishing rate.
  • the fumed silica is contained in the polished portions to print the polished layer. It paid attention to the fact that the liquid dripping at the time of formation is suppressed, and it becomes easy to form each polished part in a column. In the case where the polishing portion contains fumed silica, the adhesion between the base and the polishing portion may be lowered and it may be easily peeled off.
  • the present inventors have found that the ease of peeling between the substrate and the polishing portion can be solved by using a substrate containing a heat resistant resin as a main component as the substrate, and completed the present invention.
  • the invention made in order to solve the above-mentioned subject is an abrasives provided with a substrate, and an abrasive layer laminated on the surface side of this substrate and containing an abrasive grain and a binder, and the above-mentioned abrasive layer is plural.
  • the polishing portion has fumed silica, and the base material contains a heat resistant resin as a main component.
  • the said polishing material can form a polishing part in columnar shape, even if it is a thick grinding
  • the said base material has heat resistant resin as a main component, the said abrasives can suppress the fall of the adhesiveness of the base material and grinding
  • polishing part As content of the said fumed silica in the said grinding
  • the content of the fumed silica in the polishing portion in the above range, it is possible to stably form a columnar polishing portion while suppressing the decrease in adhesion due to the fumed silica content at the time of production of the abrasive. Therefore, a more stable polishing rate can be expressed.
  • polishing part 300 micrometers or more and 5000 micrometers or less are preferable.
  • the average thickness of the polishing portion in the above range, the effect of exhibiting a stable polishing rate by the inclusion of fumed silica in the polishing portion is easily exhibited.
  • the substrate may be polycarbonate or biaxially stretched polyethylene terephthalate.
  • polishing part can increase, and it can further make a base
  • Another invention made in order to solve the above-mentioned subject is a manufacturing method of an abrasives provided with a substrate and an abrasive layer laminated on the surface side of this substrate and containing an abrasive grain and a binder.
  • the polishing layer For forming the polishing layer by printing the composition for polishing, the polishing layer has a plurality of columnar polishing portions, the composition for polishing layer contains fumed silica, and the substrate is a heat resistant resin As the main component.
  • the fumed silica gives thixotropy to the composition for the abrasive layer and suppresses dripping. it can. For this reason, even if it is a thick grinding
  • the base material contains the heat resistant resin as a main component, and therefore, even if the composition for the abrasive layer contains fumed silica, the base and the abrasive part are hardly peeled off. Therefore, by using the method for producing the abrasive, it is possible to produce an abrasive having a thick polishing portion while suppressing a decrease in the polishing rate.
  • the "main component” means a component with the highest content, preferably a component with a content of 50% by mass or more, more preferably 90% by mass or more.
  • the thickness of the polishing portion can be increased while suppressing a decrease in the polishing rate. Therefore, the abrasives of the present invention and the abrasive produced by the method of producing an abrasive of the present invention can have a long life while exhibiting a stable polishing rate.
  • FIG. 3 is a schematic partial cross-sectional view showing an abrasive according to an embodiment different from FIG. 2;
  • the abrasive 1 shown in FIGS. 1 and 2 includes a base 10, an abrasive layer 20 laminated on the front side of the base 10, and an adhesive layer 30 laminated on the back side of the base 10.
  • the polishing layer 20 also has a plurality of polishing portions 20a and grooves 20b disposed between the polishing portions 20a.
  • the said abrasives 1 are used suitably, for example as a fixed abrasive abrasives for surface grinding
  • the substrate 10 is a plate-like or sheet-like member for supporting the polishing layer 20.
  • the base material 10 contains a heat resistant resin as a main component.
  • a heat resistant resin polycarbonate, biaxially stretched polyethylene terephthalate, polyimide, polyamide and the like can be mentioned. Among them, polycarbonate and biaxially stretched polyethylene terephthalate are preferable, and polycarbonate is more preferable.
  • the glass transition temperature of substrate 10 As a minimum of the glass transition temperature of substrate 10, 60 ° C is preferred, 80 ° C is more preferred, and 100 ° C is still more preferred.
  • the glass transition temperature of the substrate 10 is less than the above lower limit, the heat resistance is insufficient, and the substrate 10 is easily deformed by heat when forming the polishing portion 20 a. For this reason, there is a possibility that the adhesiveness of substrate 10 and polish part 20a may fall.
  • the upper limit of the glass transition temperature of the substrate 10 is not particularly limited.
  • the glass transition temperature of the substrate 10 is 500 ° C. or less.
  • the substrate 10 may have flexibility.
  • the said abrasives 1 track the surface shape of a to-be-cut body, and the contact area of a grinding surface and a to-be-cut body becomes large, a polishing rate can be raised. .
  • the process which improves adhesiveness such as a chemical treatment, a corona treatment, and a primer process, may be performed on the surface of the base material 10.
  • the shape and size of the substrate 10 are not particularly limited, and for example, a square shape having one side of 140 mm to 160 mm, a disk of 200 mm to 2022 mm in diameter, an outer diameter of 200 mm to 2022 mm, and an inner diameter of 100 mm to 658 mm It can be annular or the like.
  • the plurality of substrates 10 juxtaposed on a plane may be supported by a single support.
  • the lower limit of the average thickness of the substrate 10 is preferably 70 ⁇ m, more preferably 300 ⁇ m, and still more preferably 500 ⁇ m.
  • an upper limit of average thickness of substrate 10 3000 micrometers is preferred and 2000 micrometers is more preferred. If the average thickness of the substrate 10 is less than the above lower limit, warpage of the substrate 10 may be easily generated when the polished portion 20 a is thick. Conversely, when the average thickness of the substrate 10 exceeds the above upper limit, the substrate 10 does not easily follow the surface shape of the workpiece, and the polishing rate may be reduced.
  • the polishing layer 20 includes abrasive grains 21, a binder 22 and fumed silica 23 in the polishing portion 20 a.
  • the polishing unit 20a includes a filler (not shown).
  • abrasive grains 21 examples include diamond abrasive grains, alumina abrasive grains, silica abrasive grains, ceria abrasive grains, silicon carbide abrasive grains and the like. Among them, diamond abrasives which are harder than other abrasives are preferable. By making the said abrasive grain 21 into a diamond abrasive grain, polishing power can be improved and a polishing rate can further be improved.
  • a diamond of a diamond abrasive grain a single crystal or a polycrystal may be sufficient, and the diamond by which Ni coating etc. were processed may be sufficient.
  • single crystal diamond and polycrystalline diamond are preferable.
  • Single crystal diamond is harder and more abrasive than other diamonds.
  • polycrystalline diamond is apt to be easily cleaved in a microcrystalline unit constituting a polycrystalline, and it is difficult for the eye to crush to progress, so that the reduction in polishing rate is small even if polishing is performed for a long time.
  • the average particle size of the abrasive grains 21 is appropriately selected from the viewpoint of the polishing rate and the surface roughness of the object after polishing.
  • the lower limit of the average particle size of the abrasive grains 21 is preferably 2 ⁇ m, more preferably 10 ⁇ m, and still more preferably 15 ⁇ m.
  • an upper limit of the average particle diameter of the abrasive grain 21 150 micrometers is preferable, 125 micrometers is more preferable, and 100 micrometers is more preferable. If the average particle diameter of the abrasive grains 21 is less than the above lower limit, the polishing force of the polishing material 1 may be insufficient, and the polishing rate may be reduced.
  • the average particle size of the abrasive grains 21 exceeds the above upper limit, the polishing accuracy may be reduced.
  • the "average particle size” refers to the 50% value (50% particle size, D50) of the volume-based cumulative particle size distribution curve measured by a laser diffraction method or the like.
  • the upper limit of the content of the abrasive grains 21 is preferably 55% by volume, more preferably 45% by volume, and still more preferably 35% by volume. If the content of the abrasive grains 21 is less than the lower limit, the polishing power of the polishing layer 20 may be insufficient. Conversely, when the content of the abrasive grains 21 exceeds the upper limit, the abrasive layer 20 may not be able to hold the abrasive grains 21.
  • binder Although it does not specifically limit as a main component of the binder 22, Resin or an inorganic substance is mentioned. Among them, resins are preferable from the viewpoint of adhesion to the substrate 10.
  • resin such as polyurethane, polyphenol, epoxy, polyester, cellulose, ethylene copolymer, polyvinyl acetal, polyacrylic acid and its salt, polyacrylic ester, polyvinyl alcohol, polyvinyl chloride, polyvinyl acetate, polyamide etc.
  • resin may be at least partially crosslinked.
  • silicates having high abrasive retention are preferred.
  • examples of such silicates include sodium silicate and potassium silicate.
  • the binder 22 may appropriately contain various assistants and additives such as a dispersant, a coupling agent, a surfactant, a lubricant, an antifoamer, and a colorant according to the purpose.
  • Fumed silica 23 is a kind of dry silica and is fine particles (powder).
  • the composition is amorphous silica or high purity glass.
  • the lower limit of the average primary particle size of the fumed silica 23 is preferably 5 nm, more preferably 7 nm.
  • the upper limit of the average primary particle diameter of fumed silica 23 is preferably 100 nm, more preferably 60 nm, and still more preferably 40 nm. If the average primary particle diameter of the fumed silica 23 is less than the above lower limit, it tends to fly, which may make it difficult to handle the abrasive 1 at the time of production.
  • the upper limit of the content of fumed silica 23 is preferably 20% by volume, more preferably 10% by volume, and still more preferably 8% by volume.
  • the content of the fumed silica 23 is less than the above lower limit, the thixotropic property by the fumed silica 23 at the time of production of the abrasive 1 is insufficient, and there is a possibility that the polishing portion 20a can not be formed into a columnar shape.
  • filler examples include oxides such as alumina, silica, cerium oxide, magnesium oxide, zirconia, and titanium oxide, and composite oxides such as silica-alumina, silica-zirconia, and silica-magnesia. You may use these individually or in combination of 2 or more types as needed. Among them, alumina is preferable because high polishing power is obtained.
  • the average particle size of the filler depends on the average particle size of the abrasive grains 21, but the lower limit of the average particle size of the filler is preferably 0.01 ⁇ m, more preferably 2 ⁇ m.
  • the upper limit of the average particle size of the filler is preferably 40 ⁇ m, more preferably 20 ⁇ m, and still more preferably 15 ⁇ m. If the average particle diameter of the filler is less than the above lower limit, the polishing rate may be lowered due to the insufficient effect of the filler on the elastic modulus improvement of the binder 22. On the other hand, when the average particle diameter of the filler exceeds the upper limit, the filler may inhibit the polishing force of the abrasive grains 21.
  • the average particle size of the filler may be smaller than the average particle size of the abrasive grains 21.
  • the lower limit of the ratio of the average particle size of the filler to the average particle size of the abrasive grains 21 is preferably 0.01, more preferably 0.05, and still more preferably 0.1.
  • the upper limit of the ratio of the average particle size of the filler to the average particle size of the abrasive grains 21 is preferably 0.8, and more preferably 0.6. If the ratio of the average particle size of the filler to the average particle size of the abrasive grains 21 is less than the lower limit, the polishing rate may be reduced due to the insufficient effect of the filler on the elastic modulus of the binder 22. Conversely, if the ratio of the average particle size of the filler to the average particle size of the abrasive grains 21 exceeds the upper limit, the filler may inhibit the polishing force of the abrasive grains 21.
  • the content of the filler to the polishing portion 20a depends on the content of the abrasive grains 21, the lower limit of the content of the filler to the polishing portion 20a is preferably 15% by volume, and more preferably 30% by volume. preferable. On the other hand, as a maximum of content of the above-mentioned filler, 75 volume% is preferred, and 72 volume% is more preferred. If the content of the filler is less than the lower limit, the polishing rate may be reduced due to the insufficient effect of the filler on the elastic modulus improvement of the binder 22. Conversely, if the content of the filler exceeds the upper limit, the filler may inhibit the polishing force of the abrasive grains 21.
  • the polishing portion 20a is columnar. That is, the area of the bottom surface of the polishing portion 20a is 0.9 times to 1.5 times the area of the top surface of the polishing portion 20a, preferably 0.93 times to 1.2 times, more preferably 0.95. It is twice or more and 1.05 or less.
  • the plurality of polishing units 20 a have a block pattern that is regularly arranged in the same shape.
  • the shape of the top surface of the polishing portion 20a is not particularly limited, but may be square as shown in FIG. 1, circular, polygonal or the like.
  • the lower limit of the average area of the top surface of the polishing unit 20a preferably 1 mm 2, 2 mm 2 is more preferable. On the other hand, as a maximum of the average area of the top face of polish part 20a, 150 mm 2 is preferred and 130 mm 2 is more preferred. If the average area of the top surface of the polishing portion 20 a is less than the above lower limit, the polishing portion 20 a may be peeled off from the base material 10. On the other hand, if the average area of the top surface of the polishing portion 20a exceeds the above upper limit, the contact area of the polishing layer 20 to the cut object becomes large at the time of polishing, and the polishing rate may be reduced due to frictional resistance.
  • the lower limit of the area occupancy ratio of the plurality of polishing portions 20a to the entire polishing layer 20 is preferably 5%, and more preferably 10%.
  • the upper limit of the area occupancy of the polishing portion 20a is preferably 60%, and more preferably 55%. If the area occupancy rate of the polishing portion 20a is less than the above lower limit, the pressure applied at the time of polishing is too concentrated on the narrow polishing portion 20a, and the polishing portion 20a may be peeled off from the base material 10. On the contrary, when the area occupancy of the polishing portion 20a exceeds the upper limit, the contact area of the polishing layer 20 to the workpiece at the time of polishing becomes large, and the polishing rate may be reduced due to the frictional resistance.
  • polishing layer is the concept also including the area of the groove
  • average thickness of polish part 20a As a minimum of average thickness of polish part 20a, 300 micrometers is preferred and 500 micrometers is more preferred. On the other hand, as a maximum of average thickness of polish part 20a, 5000 micrometers is preferred and 3000 micrometers is more preferred. If the average thickness of the polishing portion 20a is less than the above lower limit, the life may be insufficient, or the shape stabilization effect of the polishing portion 20a at the time of production due to the inclusion of the fumed silica 23 of the polishing portion 20a may not be sufficiently expressed. There is. Conversely, if the average thickness of the polishing portion 20a exceeds the above upper limit, there is a possibility that the polishing portion 20a can not be formed into a columnar shape.
  • the bottom surface of the groove 20 b is constituted by the surface of the base material 10.
  • the average width of the grooves 20b is determined by the area and the area occupancy of the top surface of the polishing portion 20a, but the lower limit of the average width of the grooves 20b is preferably 0.3 mm and more preferably 0.5 mm.
  • the upper limit of the average width of the grooves 20b is preferably 10 mm, more preferably 8 mm. If the average width of the grooves 20b is less than the above-mentioned lower limit, there is a possibility that abrasive powder generated by polishing may clog the grooves 20b. Conversely, if the average width of the grooves 20b exceeds the above-described upper limit, the workpiece tends to fall into the grooves 20b at the time of polishing, and therefore, the workpiece may be damaged.
  • the adhesive layer 30 is a layer for supporting the abrasive 1 and fixing the abrasive 1 to a support for mounting the abrasive 1 on a polishing apparatus.
  • the adhesive used for the adhesive layer 30 is not particularly limited, and examples thereof include reactive adhesives, instant adhesives, hot melt adhesives, and adhesives that can be replaced.
  • an adhesive is preferable.
  • a pressure-sensitive adhesive as the adhesive used for the adhesive layer 30, the abrasive 1 can be peeled off and replaced from the support, and reuse of the abrasive 1 and the support becomes easy.
  • an adhesive is not particularly limited, but, for example, acrylic adhesive, acrylic-rubber adhesive, natural rubber adhesive, synthetic rubber adhesive such as butyl rubber, silicone adhesive, polyurethane adhesive Agents and the like.
  • the average thickness of the adhesive layer 30 is less than the above lower limit, the adhesive strength may be insufficient, and the abrasive 1 may be peeled off from the support. Conversely, if the average thickness of the adhesive layer 30 exceeds the above upper limit, there is a possibility that the workability may be deteriorated, for example, when the abrasive material 1 is cut into a desired shape due to the thickness of the adhesive layer 30 .
  • the polishing portion 20 a contains fumed silica 23
  • the polishing portion 20 a can be formed in a columnar shape even with a thick polishing portion 20 a. For this reason, since it is not necessary to make the said grinding
  • the said abrasives 1 can suppress the fall of the adhesiveness of the base material 10 and the grinding
  • polishing part 20a do not separate easily. Therefore, the said abrasives 1 can thicken the grinding
  • the method for producing an abrasive shown in FIG. 3 mainly includes a preparation step S1, a polishing layer forming step S2, and an adhesive layer sticking step S3.
  • a polishing provided with the base material 10 shown, for example in FIG.1 and FIG.2, and the grinding layer 20 which is laminated on the surface side of this base material 10, and contains abrasive grain 21 and binder 22.
  • the material 1 can be manufactured.
  • a composition for an abrasive layer containing abrasive grains 21, a binder 22, and fumed silica 23 is prepared.
  • a composition for an abrasive layer containing materials for forming the abrasive grains 21, the fumed silica 23, and the binder 22 is prepared as a coating liquid.
  • the content of the abrasive grains 21 and the fumed silica 23 in the solid content is the content of the abrasive grains 21 and the fumed silica 23 of the polished portion 20a after production, respectively, so the content in the polished portion 20a is desired.
  • a diluent such as water or alcohol is added.
  • a part of the abrasive grains 21 contained in the polishing portion 20 a can be made to project from the surface of the binder 22. That is, by adding the diluent, when the composition for polishing layer is dried in the polishing layer forming step S2, the thickness of the binder 22 is reduced, and the protrusion amount of the abrasive grains 21 can be increased. Therefore, this dilution makes it possible to develop a high polishing rate from the beginning of polishing.
  • the polishing layer 20 is formed by printing of the composition for a polishing layer prepared in the preparation step S1.
  • the polishing layer forming step S2 includes a coating step and a drying step.
  • the composition for a polishing layer is coated on the surface of the substrate 10.
  • the base material 10 one having a heat resistant resin as a main component is used.
  • the polishing layer 20 having a plurality of polishing portions 20a and grooves 20b disposed between the polishing portions 20a by printing on the surface of the substrate 10 is formed.
  • a mask having a shape corresponding to the shape of the groove 20b is prepared, and the coating liquid is printed through the mask.
  • this printing method for example, screen printing, metal mask printing, etc. can be used.
  • the mask made from SUS or a fluorine resin is preferable. Since a mask made of SUS or a fluorine resin mask can be thickened, the polishing portion 20a having a large average thickness can be easily manufactured.
  • the thickness of the polishing portion 20a can be adjusted mainly by the thickness of the mask and the coating amount. Therefore, it is good to adjust the amount of application of the above-mentioned constituent for polish layers so that average thickness of polish part 20a may be 300 micrometers or more, more preferably 500 micrometers or more at this coating process.
  • the service life of the abrasive 1 can be improved by adjusting the coating amount so that the average thickness of the polishing portion 20a is equal to or more than the above lower limit.
  • the upper limit of the average thickness of the polishing portion 20a adjusted in the coating step is not particularly limited, but is preferably 5000 ⁇ m and more preferably 3000 ⁇ m from the viewpoint of the manufacturing cost.
  • the coating liquid (composition for polishing layer) after the coating step is dried by heating.
  • the coating liquid is cured by the heat drying to form the polishing layer 20.
  • This drying step is performed with the mask removed.
  • the fumed silica 23 gives thixotropy to the composition for abrasive layers. For this reason, the viscosity of the composition for polishing layers during heating can be appropriately controlled, and dripping can be suppressed. Therefore, even when the polishing portion 20a is thick, the columnar polishing portion 20a can be formed.
  • heating temperature in a drying process 80 ° C is preferred and 100 ° C is more preferred.
  • an upper limit of the above-mentioned heating temperature 300 ° C is preferred and 200 ° C is more preferred. If the heating temperature is less than the above lower limit, the composition for polishing layer may not be sufficiently cured, the amount of wear may be increased, and the life of the abrasive 1 may be shortened. Conversely, if the heating temperature exceeds the upper limit, the polished portion 20a may be degraded by heat.
  • the heating time in the drying step depends on the heating temperature, but the lower limit of the heating time is preferably 2 hours, more preferably 2.5 hours. On the other hand, as an upper limit of the said heating time, 40 hours are preferable, 32 hours are more preferable, and 20 hours are further more preferable. If the heating time is less than the above lower limit, the composition for polishing layer may not be sufficiently cured, the amount of wear may be increased, and the life of the abrasive 1 may be shortened. Conversely, if the heating time exceeds the upper limit, the manufacturing efficiency may be reduced.
  • adhesion layer sticking process S3 adhesion layer 30 is laminated on the back side of substrate 10. Specifically, for example, a tape-shaped adhesive layer 30 formed in advance is attached to the back surface of the substrate 10.
  • the composition for the abrasive layer contains fumed silica 23. Therefore, when the abrasive layer 20 is formed by printing, the fumed silica 23 gives thixotropy to the composition for the abrasive layer, and the liquid is a liquid. Who can stop it. For this reason, even if it is the thick grinding
  • the base material 10 has heat resistant resin as a main component, even if it is a case where the composition for abrasive layers contains fumed silica 23, the base material 10 and the grinding
  • polishing part is not limited to a block pattern shape. That is, the plurality of polishing portions may have different shapes or may be irregularly arranged. However, from the viewpoint of reducing the anisotropy of polishing, the polishing portion is preferably in the form of a block pattern.
  • an adhesion layer is not an essential component and can be omitted.
  • the adhesive layer attaching step of the method of manufacturing the abrasive is omitted.
  • the abrasive 2 may be provided with a support 40 laminated via the adhesive layer 30 on the back surface side and a second adhesive layer 31 laminated on the back surface side of the support 40.
  • the abrasive 2 can be easily handled.
  • the main component of the support 40 examples include thermoplastic resins such as polypropylene, polyethylene, polytetrafluoroethylene and polyvinyl chloride, and engineering plastics such as polycarbonate, polyamide and polyethylene terephthalate.
  • thermoplastic resins such as polypropylene, polyethylene, polytetrafluoroethylene and polyvinyl chloride
  • engineering plastics such as polycarbonate, polyamide and polyethylene terephthalate.
  • the average thickness of the support 40 can be, for example, 0.5 mm or more and 3 mm or less. If the average thickness of the support 40 is less than the lower limit, the strength of the abrasive 2 may be insufficient. On the other hand, when the average thickness of the support 40 exceeds the upper limit, the support 40 may not be easily attached to the polishing apparatus, and the flexibility of the support 40 may be insufficient.
  • the same adhesive as the adhesive layer 30 can be used for the second adhesive layer 31. Further, the second adhesive layer 31 can have the same average thickness as the adhesive layer 30.
  • Example 1 Diamond abrasive grains ("SCMD-C12-22" from Sino Crystal Diamond, average particle size 16 ⁇ m), Alumina as filler (Al 2 O 3 , Pacific Random Co., Ltd. "LA 4000", average particle size 4 ⁇ m), fumes Desilica (“aerosil 200” by Aerosil Co., Ltd.) and epoxy resin (“JER 828” by Mitsubishi Chemical Corporation) as a binder are mixed, and the content of diamond abrasives in the solid content is 3% by volume, and the content of filler The amount was adjusted to 71% by volume and the content of fumed silica was 5% by volume to obtain a coating liquid.
  • SCMD-C12-22 from Sino Crystal Diamond, average particle size 16 ⁇ m
  • Alumina Al 2 O 3 , Pacific Random Co., Ltd. "LA 4000”, average particle size 4 ⁇ m
  • fumes Desilica aerosil 200” by Aerosil Co., Ltd.
  • epoxy resin JER 828
  • a substrate (average thickness: 300 ⁇ m) mainly comprising polycarbonate, which is a heat resistant resin, was prepared as a substrate, and was coated on the surface of the substrate by printing using the above-mentioned coating liquid.
  • a fluorine resin mask having an opening with a circular shape (average area of 28.27 mm 2 ) with a diameter of 6 mm in plan view with an area occupancy of 44% and an average thickness of 1000 ⁇ m was used.
  • the opening is in the form of a block pattern.
  • the coating amount was adjusted so that the average thickness of a grinding
  • the coating liquid was cured by drying in an oven at 120 ° C. for 16 hours.
  • a hard vinyl chloride resin plate having an average thickness of 1 mm is used as a support for supporting the substrate and fixing it to the polishing apparatus, between the back surface of the substrate and the front surface of the support, and the back surface of the support
  • a pressure-sensitive adhesive having an average thickness of 130 ⁇ m was attached to a surface plate of a polishing machine described later.
  • a double-sided tape (“# 5605 HGD" from Sekisui Chemical Co., Ltd.) was used as the pressure-sensitive adhesive.
  • Example 2 The abrasive of Example 2 was obtained in the same manner as in Example 1 except that the coating amount was adjusted so that the average thickness of the polishing portion was 300 ⁇ m.
  • Example 3 An abrasive of Example 3 was obtained in the same manner as in Example 1 except that a base material (average thickness: 75 ⁇ m) mainly comprising biaxially stretched polyethylene terephthalate, which is a heat resistant resin, was prepared as the base material.
  • a base material average thickness: 75 ⁇ m
  • biaxially stretched polyethylene terephthalate which is a heat resistant resin
  • Comparative Example 1 Example except that the coating liquid of Example 1 was adjusted so that the content of the diamond abrasive grains in the solid content was 3% by volume and the content of the filler was 76% by volume without containing fumed silica
  • the abrasives of Comparative Example 1 were obtained in the same manner as in 1.
  • Comparative Example 2 An abrasive of Comparative Example 2 was obtained in the same manner as Comparative Example 1 except that a substrate (average thickness: 300 ⁇ m) mainly composed of biaxially stretched polyethylene terephthalate was prepared as the substrate.
  • Comparative Example 3 An abrasive of Comparative Example 3 was obtained in the same manner as Comparative Example 1 except that an aluminum plate (average thickness: 300 ⁇ m) was prepared as a substrate.
  • Comparative Example 4 An abrasive of Comparative Example 4 was obtained in the same manner as Example 1, except that an aluminum plate (average thickness: 300 ⁇ m) was prepared as a substrate.
  • the life of the abrasive is considered to be determined by the average thickness of the polishing portion. Therefore, the following judgment criteria were used.
  • PC of the substrate is polycarbonate
  • PET is biaxially oriented polyethylene terephthalate
  • Al is an aluminum plate.
  • the thickness of the polishing portion can be increased while suppressing a decrease in the polishing rate. Therefore, the abrasives of the present invention and the abrasive produced by the method of producing an abrasive of the present invention can have a long life while exhibiting a stable polishing rate.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

La présente invention concerne un matériau de polissage permettant d'augmenter l'épaisseur d'une partie de polissage sans réduire le taux de polissage, et un procédé de fabrication d'un matériau de polissage. Ledit matériau de polissage (1) comprend un substrat (10) et une couche de polissage (20) qui comprend des grains abrasifs (21) et un liant (22) et est disposée en couches sur le côté de surface du substrat (10), la couche de polissage (20) ayant une pluralité de parties de polissage en colonne (20a), les parties de polissage (20a) comprenant de la silice fumée, et le substrat (10) ayant une résine résistante à la chaleur comme composant principal.
PCT/JP2018/042368 2017-12-19 2018-11-15 Matériau de polissage et procédé de fabrication de matériau de polissage WO2019123922A1 (fr)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002337053A (ja) * 2001-05-11 2002-11-26 Dainippon Printing Co Ltd 研磨フィルム
JP2003534137A (ja) * 2000-04-28 2003-11-18 スリーエム イノベイティブ プロパティズ カンパニー 研磨物品およびガラスの研削方法
JP2005533670A (ja) * 2002-07-26 2005-11-10 スリーエム イノベイティブ プロパティズ カンパニー 研磨製品、その製造方法および使用方法、ならびにその製造のための装置
WO2016067857A1 (fr) * 2014-10-28 2016-05-06 バンドー化学株式会社 Matériau de polissage et procédé pour produire un matériau de polissage
JP2016536152A (ja) * 2013-11-12 2016-11-24 スリーエム イノベイティブ プロパティズ カンパニー 構造化研磨物品並びにその使用方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104139346B (zh) * 2014-07-23 2017-05-03 上虞市自远磨具有限公司 一种防堵研磨磨具及其制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003534137A (ja) * 2000-04-28 2003-11-18 スリーエム イノベイティブ プロパティズ カンパニー 研磨物品およびガラスの研削方法
JP2002337053A (ja) * 2001-05-11 2002-11-26 Dainippon Printing Co Ltd 研磨フィルム
JP2005533670A (ja) * 2002-07-26 2005-11-10 スリーエム イノベイティブ プロパティズ カンパニー 研磨製品、その製造方法および使用方法、ならびにその製造のための装置
JP2016536152A (ja) * 2013-11-12 2016-11-24 スリーエム イノベイティブ プロパティズ カンパニー 構造化研磨物品並びにその使用方法
WO2016067857A1 (fr) * 2014-10-28 2016-05-06 バンドー化学株式会社 Matériau de polissage et procédé pour produire un matériau de polissage

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