WO2019111710A1 - Carte de gestion de composants - Google Patents

Carte de gestion de composants Download PDF

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Publication number
WO2019111710A1
WO2019111710A1 PCT/JP2018/042970 JP2018042970W WO2019111710A1 WO 2019111710 A1 WO2019111710 A1 WO 2019111710A1 JP 2018042970 W JP2018042970 W JP 2018042970W WO 2019111710 A1 WO2019111710 A1 WO 2019111710A1
Authority
WO
WIPO (PCT)
Prior art keywords
tag
management card
waveguide element
component
component management
Prior art date
Application number
PCT/JP2018/042970
Other languages
English (en)
Japanese (ja)
Inventor
詩朗 杉村
Original Assignee
株式会社フェニックスソリューション
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社フェニックスソリューション filed Critical 株式会社フェニックスソリューション
Priority to JP2019558123A priority Critical patent/JP7133232B2/ja
Publication of WO2019111710A1 publication Critical patent/WO2019111710A1/fr

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30—Computing systems specially adapted for manufacturing

Definitions

  • the present invention relates to a part management card for managing parts used in manufacturing of an assembly, and more particularly to a part management card capable of accurately managing parts inventory in a manufacturing line of an assembly.
  • Patent Document 1 discloses an invention of a component management program, a component management method, and a component management apparatus capable of accurately managing a component stock in a manufacturing line.
  • manufacture is started based on the part configuration information of the part configuration information storage part and the manufacturing order of the manufacturing order DB for the withdrawal part of the parts management system. Identify the parts to be used for the assembled product, the number of uses, and the material supply box, and update the drawdown material supply box DB from the number of parts of the material supply box data corresponding to the specified material supply box. Further, the tracking unit detects entry / exit to / from the line of the material supply box based on the information of the UHF band RFID tag, and the state reflecting unit reflects the movement of the material supply box on the material supply box DB.
  • the extraction unit writes the updated log of the material supply box DB into the material supply box log storage unit, and the operation monitoring unit based on the update log of the material supply box log storage unit. Stay in the area, monitor the number of parts, etc. Also, the editing unit notifies the warehouse management system based on the update log of the material supply box log storage unit.
  • Patent Document 2 Japanese Patent Application Laid-Open No. 2009-51601
  • the manager for example, the lender
  • the storage and retrieval are repeatedly performed among a plurality of delivery bases of the user, etc., they are often lost during that time, and it is disclosed that the system is greatly affected.
  • the carrier 11 delivered from the management side to the user side writes the identification code by the data writer when the management side takes it out and attaches the wireless RF tag or printing To be individually managed by the identification code of the identification medium such as the management card 5 attached, and the user side data regarding the returned carrier should be deleted using the warehousing information file sent from the management side Is configured to be able to
  • Patent Document 3 Japanese Patent Application Laid-Open No. 2011-118572 discloses a card-type RFID card used in a parts arrangement system using an EDI system.
  • the orderer 100 In the card type RFID described in Patent Document 3, the orderer 100 generates the kanban data 12 and transmits the kanban data 12 to the EDI server computer 101.
  • the order receiver 200 receives the kanban data 12 from the EDI server computer 101 and supplies the data writer 14 with the kanban data 12.
  • the data writer 14 writes the kanban data 12 to the recycled erased kanban 24 and issues the kanban 16 and attaches it to the part 18 to be delivered.
  • the orderer 100 uses the antenna 72 to read the parts management card attached to the delivered part 18.
  • the kanban 16 is formed on a standard size RFID card, and is held by a holder 52 provided on the outer surface of the parts box 200 in which the parts 18 are stored at the time of delivery to the orderer 100.
  • the RFID tag is attached to the material supply box with the spacer interposed.
  • parts pick-up board is stuck on the material supply box. Therefore, it takes time and effort to install those RFID tags and cards. Furthermore, it is not possible to manage the parts contained in the metal parts box.
  • Patent Document 2 a management card with an IC tag is attached to a carrier, and the management card can not be easily removed from the carrier. Furthermore, also in Patent Document 2, it is not possible to manage the parts housed in the metal parts box.
  • Patent Document 3 discloses the use of a metal component box, in order to suppress reflection and absorption of radio waves by the metal box, sticking a radio wave absorbing sheet on the back of the kanban. Is required. Therefore, there is a disadvantage that the communication distance by the reader is short.
  • the component management card is a component management card which is removably held by a holding portion attached to the outer surface of the component box in which the components are accommodated, the component management card body made of an insulator, Component management card body or component with the RF tag embedded in the component management card body and the component tag side of the RF tag via the insulator layer of the component management card body on the component box side of the RF tag And a metal plate disposed on the outer surface of the management card body.
  • the card body is mainly made of one or more electrically insulating resins such as polypropylene, ABS, polyethylene terephthalate, polyimide, polyvinyl chloride, etc., materials having insulating properties such as hard paper board or hard glass, or materials of these It can form by shape
  • the RF tag includes at least an antenna and an IC chip that operates based on radio waves transmitted from the reader, and a waveguide plate provided on the RF tag and the metal plate electrically have a constant capacitance. Connected.
  • the metal plate can be used as a part of the antenna. Therefore, a large opening area can be provided, and the sensitivity of the RF tag can be improved. Therefore, when the component management card is held by the holding unit attached to the outer surface of the component box, it is possible to read an RF tag which is nondirectional and has a long communication distance.
  • the part management card according to the second aspect of the invention is a part management card which is removably held by a holder attached to the outer surface of the metal part box in which the parts are accommodated, and is a part made of an insulator.
  • the RF tag includes a management card body and an RF tag embedded in the component management card body, and the RF tag includes at least an antenna and an IC chip that operates based on radio waves transmitted from the reader. And a holding unit so as to electrostatically couple a waveguide plate provided in the RF tag and the component box.
  • the holding unit when the component management card is held by the holding unit attached to the outer surface of the metal component box, the holding unit is such that the waveguide plate provided on the RF tag of the card and the component box are electrostatically coupled.
  • the component box can be used as part of the antenna since it Therefore, a large opening area can be provided, and the sensitivity of the RF tag can be improved. Moreover, reading by the reader can be performed from the periphery of the component box.
  • a component management card according to a third aspect of the present invention is the component management card according to the aspect of the present invention, wherein the component box is made of metal and the waveguide plate provided on the RF tag electrostatically couples the component box May be held by the holder.
  • the part management card according to a fourth aspect of the present invention is the part management card according to the first aspect to the third aspect, wherein the waveguide plate may be an antenna.
  • the component management card according to a fifth aspect of the present invention is the card according to the first aspect to the third aspect, wherein the waveguide plate may be a waveguide element provided in the antenna.
  • the structure of the RF tag can be simplified, and the radio waves of the reader can be efficiently received.
  • a component management card is the component management card according to the first aspect to the fifth aspect, wherein the antenna has a first main surface and a second main surface on the opposite side of the first main surface.
  • the first waveguide element provided on the first main surface, the second waveguide element provided on the second main surface, and the second waveguide element are provided on the side surface of the insulating base, and one end is electrically connected to the first waveguide element, and the other end is electrically connected to the second waveguide element.
  • a plate-like inverted F antenna configured to receive a radio wave transmitted from the reading device, the insulating base material, the first waveguide element, the second waveguide element, the feed section, and the short circuit section.
  • An inductor pattern formed of a first waveguide element, a short circuit part, a second waveguide element, and a feed part, and a first waveguide element and a second waveguide element And by a capacitor formed by the insulating substrate, the resonance circuit resonating at a radio frequency band may be configured.
  • the plate-like inverted F antenna can receive the radio wave transmitted from the reader with high sensitivity by the resonance circuit, the reading performance of the RF tag can be improved. Since the power supply voltage generated by the IC chip connected to the antenna can be increased, radio waves from the reading device can be efficiently received.
  • a component management card is the card according to the sixth aspect, wherein an outer peripheral distance of the waveguide element is ⁇ / 4, ⁇ with respect to a wavelength ⁇ of radio waves of the frequency of the RF tag. It may be designed to satisfy any one of / 2, 3 ⁇ / 4, 5 ⁇ / 8. In this case, the resonant frequency of the plate-like inverted F antenna can be easily set.
  • a component management card is the component management card according to the fifth aspect, wherein the antenna comprises a resonant circuit that resonates in a frequency band of radio waves by the inductor pattern and the internal capacitance of the IC chip. May be
  • the inlet portion and the antenna are formed by bonding, and a resonance circuit is formed by the capacitance inside the IC chip and the inductor pattern.
  • a resonance circuit is formed by the capacitance inside the IC chip and the inductor pattern.
  • a component management card is the component management card according to the eighth aspect, wherein the antenna peripheral distance is other than n ⁇ with respect to the wavelength ⁇ of the wave number of the UHF band RFID frequency (n is an integer) ), ⁇ / 4, ⁇ / 2, 3 ⁇ / 4, 5 ⁇ / 8 may be designed.
  • the peripheral distance of the antenna is designed to correspond to one of wavelengths other than n ⁇ (n is an integer), ⁇ / 4, ⁇ / 2, 3 ⁇ / 4, 5 ⁇ / 8 with respect to wavelength ⁇ .
  • a component management card according to a tenth aspect of the present invention is the component management card according to the eighth and ninth aspects, wherein at least the IC chip and the inductor pattern portion may be wrapped by a non-conductive material.
  • the parts management card main body according to an eleventh aspect of the present invention is the part management card according to the first aspect to the tenth aspect of the present invention, wherein the parts management card may be a hard disk used in the parts management system.
  • paper kanbans are created based on kanban information
  • paper kanbans are attached to parts to be delivered and delivered
  • the orderer receives parts and acceptance based on paper kanbans.
  • the receipt and acceptance are finished and the parts are consumed, the paper board is discarded as a loose board.
  • a large amount of paper is consumed every day because paper bags are used for each of the parts needed for daily production.
  • the movement of parts is managed using the UHF band RFID tag held by the holding part of the parts box, and the parts inventory in the line is managed by managing the number of parts for each parts box. It can be managed accurately.
  • a parts management apparatus is a parts management comprising: a metal parts box in which parts are stored; and a part management card removably held by a holding unit attached to an outer surface of the parts box.
  • the component management card has a component management card body made of insulator, and an RF tag embedded in the component management card body, and the RF tag includes at least an antenna, and a reader.
  • An IC chip that operates based on radio waves transmitted from the IC and electrostatically couples the waveguide plate provided in the RF tag and the component box when the component management card is held by the holding unit It is.
  • the waveguide plate provided on the RF tag of the card and the component box are electrostatically coupled.
  • the box can be used as part of an antenna. Therefore, a large opening area can be provided, and the sensitivity of the RF tag can be improved. Moreover, reading by the reader can be performed from the periphery of the component box. Therefore, as described in Patent Document 3, it is not necessary to attach the radio wave absorption sheet to the back surface of the card, and the manufacturing cost of the card can be reduced.
  • FIG. 7 is a schematic perspective view showing an example of a state in which the component management card according to the first embodiment is held by the holder of the component box. It is a typical perspective view after making a holding part hold a card. It is a typical principal part sectional view showing an example of the state where the part management card concerning a 1st embodiment was made to hold to a parts box. It is a schematic perspective view of the components box concerning other embodiment. It is typical principal part sectional drawing which shows an example of the state which hold
  • FIG. 14 is a schematic perspective view of a component management card in which the RF tag shown in FIG. 13 is embedded. It is a schematic perspective view which shows an example of the surface side of RF tag of other embodiment. It is a schematic perspective view which shows an example of the back surface side of RF tag shown in FIG. It is a schematic perspective view which shows an example of the antenna of RF tag shown in FIG. It is a typical expanded view of the antenna of RF tag shown in FIG. It is a schematic diagram which shows the result of the reading experiment of RF tag.
  • FIG. 1 is a schematic perspective view showing an example of a state in which the component management card 210 according to the present embodiment is held by the holding unit 230 of the component box 200.
  • FIG. 2 is a component management according to the present embodiment. It is a typical principal part sectional view showing an example in the state where card 210 was made to be held by holding part 230.
  • the component management card 210 according to the present embodiment is removably held by the holding portion 230 attached to the outer surface of the component box 200 in which the component is housed.
  • the component box 200 is a box formed to such an extent that one or a plurality of components are accommodated.
  • it may be a metal plate made of metal such as steel or aluminum, a metal mesh, a metal box manufactured by processing a metal pipe, or a resin box, a wood-based box, a cardboard box, etc. It may be.
  • it may be a box made of a composite member in which those materials are combined.
  • the surface of the component box 200 may be coated with a coating such as an anticorrosion treatment, an oxide layer, or a resin layer.
  • the part box 200 also includes a part plate, and also includes a box with a lid.
  • the component box 200 is formed of a metal box having an open upper surface having a bottom plate 202 and four side plates 204 as shown in FIGS. 1 and 2.
  • the holder 230 is attached to the outer surface of the side plate 204 of the component box 200.
  • the configuration of the holding unit 230 is not limited and may be any configuration as long as it can hold a component management card (hereinafter, also simply referred to as a card) 210.
  • the sheet can be formed into a bag shape to constitute the holding portion 230.
  • the holding portion 230 adheres the left and right edges and the lower edge of the transparent or translucent plastic sheet to the outer surface of the side plate 204 of the component box 200. It is formed in the shape of a bag whose upper side is open.
  • An opening 232 is formed above the holding portion 230 between the side plate 204 and the sheet of the holding portion 230, and the card 210 can be inserted into the holding portion 230 from the opening 232 and held.
  • the holding portions 230 are usually attached to the outside of the opposite side plates 204 of the component box 200, the holding portions 230 are provided on the outer surface of one, three or four side plates 204 of the component box 200. May be
  • the holding portion 230 is not limited to a bag, but may have various forms and any shape as long as it has a function of holding or temporarily fixing or fixing the card 210 on the outer surface of the side plate 204 of the component box 200. It may be.
  • FIG. 4 is a schematic perspective view of a component box 200 according to another embodiment
  • FIG. 5 shows a state in which the component management card 210 is held by the holding portion 230 of the component box 200 shown in FIG. It is a typical principal part sectional view showing an example of.
  • the holding portion 230 includes a pair of L-shaped locking members 240 and 240 fixed to the side plate 204 at predetermined intervals, and the side plates on the lower side of the locking member 240. You may comprise from the holding member 242 fixed to 204.
  • FIG. a space for holding the card 210 is formed by the pair of locking members 240 and 240 and the outer surface of the holding member 242 and the side plate 204.
  • Parts management card 210) 6 is a schematic perspective view of the component management card 210 shown in FIG. 1
  • FIG. 7 is a schematic cross-sectional view of a part of the component management card 210 shown in FIG.
  • the component management card 210 includes a resin component management card main body 220 and an RF embedded in the component management card main body 220 (hereinafter, also simply referred to as a card main body). And a tag 100.
  • the size and the shape of the component management card 210 are set so as to be removably held by the holding unit 230.
  • the card body 220 is formed of a substantially square resin plate.
  • the card body 220 of this embodiment is formed mainly by forming one or more kinds of electrically insulating resin such as polypropylene, ABS, polyethylene terephthalate, polyimide, polyvinyl chloride or the like into a plate. be able to.
  • the RF tag 100 can be embedded in the card body 220 by injection molding or the like.
  • the thickness of the card body 220 can be about 0.3 mm or more and 2.0 mm or less, and the preferable thickness is about 0.5 mm or more and 1.0 mm or less.
  • the embedded position of the RF tag 100 is not limited.
  • the RF tag 100 can be embedded at the central position in the thickness direction of the card body 220.
  • the distance (thickness of the resin layer) t between the outer surface of the RF tag 100 and the outer surface of the card 210 can be set in the range of 0.05 mm or more and 0.3 mm or less, more preferably 0.1 mm It is the range of 0.2 mm or less.
  • the RF tag 100 is disposed at the lower corner of the insulator card body (hereinafter simply referred to as a card body) 220, but the disposition position of the RF tag 100 in the card body 220 is It may be a corner, a center or any position of the card body 220.
  • a display 212 capable of printing card details printed by a thermal printer or the like can be formed.
  • the card description includes at least a part of information of the data of the card 210. For example, there are the orderer's name, the orderer's name, the place of delivery, and the part number of delivered parts.
  • the card 210 may record only the ID, and the above information may be recorded in the server.
  • the metal plate 250 may be attached to the back surface side of the card body 220 (the component box side when the card is held by the holding unit).
  • the metal plate 250 is formed in the same shape as the card body 220.
  • the metal plate 250 may be attached to the back side of the card body 220 using an adhesive, or when the card body 220 is formed. May be integrally formed.
  • a metal plate there are a steel plate, an aluminum plate, a copper plate, an arbitrary conductor, and the like.
  • the metal plate 250 may be embedded in the card body 220.
  • the metal plate 250 is embedded in the card body 220 on the component box 200 side of the RF tag 100 with the resin layer of the RF tag 100 and the card body 220 interposed therebetween. That is, the RF tag 100 and the metal plate 250 are electrically insulated by the resin layer.
  • the data of the component management card 210 stored in the RF tag 100 described above is read without contact from a position several meters away, for example, by radio waves (for example, radio waves in the UHF band) emitted from the antenna of the reader. Can.
  • radio waves for example, radio waves in the UHF band
  • Can The configuration of the RF tag 100 embedded in the card body 220 will be described in detail below.
  • FIG. 8 is a schematic perspective view showing an example of the RF tag 100 on the front side
  • FIG. 9 is a schematic perspective view showing an example of the RF tag 100 on the back side. It is a typical expanded view showing an example of 100.
  • the RF tag 100 includes at least an antenna 110 and an IC chip 80 that operates based on radio waves transmitted from a reader (not shown).
  • the antenna 110 includes a first waveguide element 20, a second waveguide element 30, an insulating base 140, a feeding portion 50 and a short circuit portion 60.
  • the base material of insulator (hereinafter referred to as insulating base material) 140 has an upper surface (first main surface) and a lower surface (second main surface) on the opposite side of the first main surface.
  • the insulating base 140 is formed, for example, in a substantially rectangular parallelepiped shape, but is not limited to such a shape. For example, it may be in the shape of a disk, or it may be curved in a circular arc.
  • the insulating base 140 has a shape corresponding to the surface shape of the component management card main body 220 at the position where the RF tag 100 is embedded.
  • the first waveguide element 20 is provided on the upper surface of the insulating base 140.
  • the second waveguide element 30 is provided on the lower surface of the insulating base 140.
  • Each of the first waveguide element 20 and the second waveguide element 30 has a rectangular shape, and is formed by etching or pattern printing of a metal thin film such as aluminum.
  • a notch 25 is formed in a part of the short side of the first waveguide element 20, and an IC chip 80 is disposed in the notch 25.
  • the IC chip 80 includes the first waveguide element 20 and the feeding portion 50. It is connected to be bridged between.
  • the feeding unit 50 is provided on the side surface and / or the upper surface (or the lower surface) of the insulating base 140, and one end of the feeding unit 50 is electrically connected to the second waveguide element 30.
  • the short circuit portion 60 is provided on the side surface of the insulating base 140, one end of which is electrically connected to the first waveguide element 20, and the other end of which is electrically connected to the second waveguide element 30. As shown in FIGS. 8 and 9, the feeding portion 50 and the shorting portion 60 are parallel to each other on the sheet 70 at intervals so as to be bridged between the first waveguide element 20 and the second waveguide element 30. It is a member provided.
  • the feed unit 50 and the short circuit unit 60 may not be provided in parallel to each other. Moreover, when forming the 1st waveguide element 20 and the 2nd waveguide element 30, you may form the feed part 50 and the short circuit part 60 integrally with them simultaneously. Alternatively, the end portions may be joined to the first waveguide element 20 and the second waveguide element 30 after the feed part 50 and the short circuit part 60 are separately formed.
  • the first waveguide element 20, the second waveguide element 30, the feeding part 50 and the shorting part 60 are formed on the insulating sheet 70.
  • the sheet is attached to the outer surface of the insulating base 140 via the sheet 70 which is bent at the side of the insulating base 140.
  • the antenna 110 can be easily manufactured by bending the portion 60 together and attaching it to the front and back surfaces of the insulating base 140.
  • a flexible insulating material such as PET, polyimide, polyvinyl chloride or the like can be used.
  • the thickness of the sheet 70 is not particularly limited, but is generally about several tens of ⁇ m.
  • the surface of each of the first waveguide element 20 and the second waveguide element 30 may be subjected to an insulating film treatment.
  • the first waveguide element 20 and the second waveguide element 30 are formed on the sheet 70 (base material) in this manner, but it is not necessary to be necessarily formed on the sheet 70. Absent.
  • the first waveguide element 20 and the second waveguide element 30 may be formed alone.
  • the sheet 70 may be peeled off.
  • the insulating base material 140, the first waveguide element 20, the second waveguide element 30, the feeding portion 50 and the short circuit portion 60 constitute a plate-like inverted F antenna.
  • the plate-like inverted F antenna receives radio waves transmitted from a reader (not shown).
  • the second waveguide element 30 acts as a conductor ground plane (also referred to as a ground portion).
  • the first waveguide element 20 acts as a conductor ground plane. That is, the first waveguide element 20 and the second waveguide element 30 can perform both functions of the waveguide element (antenna) and the conductor ground plane (ground) according to the usage mode of the RF tag 100.
  • the inverted F antenna is described in the present embodiment, the present invention is not limited to this and can be applied to any other antenna.
  • the total length A of the side edges 20a to 20f around the first waveguide element 20 is either ⁇ / 4, ⁇ / 2, 3 ⁇ / 4, 5 ⁇ / 8. It is designed as.
  • ⁇ is the wavelength of the radio wave transmitted from the reader.
  • the wavelength ⁇ of the radio wave is not particularly limited as long as it can be used as the RF tag 100.
  • the second waveguide element 30 is designed such that the sum B of the lengths of the side edges 30 a to 30 d around the second waveguide element 30 is substantially equal to the sum A.
  • the sum A and B of the lengths of the sides around the first waveguide element 20 and the second waveguide element 30 is either ⁇ / 4, ⁇ / 2, 3 ⁇ / 4, 5 ⁇ / 8. Almost equal to Thus, the resonant frequency of the plate-like inverted F antenna can be easily set.
  • the first waveguide element 20 and the second waveguide element 30 are any of the above values, the first waveguide element 20 and the second waveguide element The planar shape of 30 is not limited to the rectangular shape.
  • the central portions of the first waveguide element 20 and the second waveguide element 30 may be cut into a square shape.
  • an insulator may be used as the insulating base 140.
  • an insulator may be used as the insulating base 140.
  • the insulating base 140 may be a dielectric.
  • a dielectric having a relative dielectric constant of 1 or more and 20 or less can be used.
  • the capacitance of the capacitor is increased, so the opening area of the first waveguide element 20 and the second waveguide element 30 is reduced, and the RF tag 100 is miniaturized.
  • the gain of the antenna 110 is reduced, the distance (communication distance) in which communication with the reading device is possible is shortened.
  • a dielectric having a small dielectric constant is used as the insulating substrate 140.
  • the relative dielectric constant is preferably 5 or less. An embodiment using foamed polystyrene having a small dielectric constant will be described later.
  • the antenna 110 configured as described above constitutes a resonant circuit that resonates in the frequency band of a radio wave transmitted from the reader and received by the plate-like inverted F antenna.
  • This resonant circuit is composed of an inductor pattern L and a capacitor (first capacitor) 93 (see FIG. 11).
  • the inductor pattern L includes the first waveguide element 20, the short circuit part 60, the second waveguide element 30, and the feeding part 50, and the capacitor 93 includes the first waveguide element 20 and the second waveguide element 30.
  • the insulating base 140 This resonant circuit enables the plate-like inverted F antenna to receive radio waves (carrier waves) transmitted from the reader with high sensitivity, so that the reading performance of the RF tag 100 can be improved. Furthermore, the power supply voltage generated by the IC chip 80 can be increased.
  • the IC chip 80 is provided between the first waveguide element 20 and the feeding unit 50 as shown in FIG.
  • the IC chip 80 is disposed on the upper surface side of the insulating base 140 (on the same plane as the first waveguide element 20).
  • the IC chip 80 may be disposed on the side surface of the insulating base 140 as long as it is within the range of functioning as a plate-like inverted F antenna.
  • an external power supply may be connected to the IC chip 80, and the IC chip 80 may be operated by the voltage supplied from the external power supply.
  • the IC chip 80 operates based on the radio wave of the reader received by the plate-like inverted F antenna of the antenna 110. Specifically, the IC chip 80 first rectifies a part of the carrier wave transmitted from the reader, and generates a power supply voltage necessary for the IC chip itself to operate. Then, the IC chip 80 operates the control logic circuit in the IC chip 80 by the generated power supply voltage. In addition, the IC chip 80 operates a communication circuit or the like for transmitting and receiving data to and from the reader. Furthermore, it is possible to operate a non-volatile memory in which unique information and the like of the component box 200 are stored.
  • Some IC chips 80 include a capacitor inside, and the IC chip 80 has stray capacitance. Therefore, when setting the resonant frequency of the resonant circuit, it is preferable to consider the equivalent capacitance inside the IC chip 80.
  • the resonant circuit preferably has a resonant frequency set in consideration of the inductance of the inductor pattern L, the capacitance of the capacitor 93, and the equivalent capacitance in the IC chip 80. Furthermore, the capacitance of the second capacitor is taken into account, as will be described later.
  • the RF tag 100 includes the antenna 110 and the IC chip 80.
  • the RF tag 100 receives the radio wave (carrier wave) transmitted from the reader at the antenna 110 of the RF tag 100. Then, the identification data etc. of the component box 200 recorded in the IC chip 80 are put on the reflected wave and returned to the reader. This allows the RF tag 100 to communicate with the reader without bringing the reader into contact with the RF tag 100.
  • FIG. 11 is a view showing an example of an equivalent circuit of the component management card 210 to which the metal plate 250 shown in FIGS. 6 and 7 is attached.
  • FIG. 12 is a view showing an example of the equivalent circuit in a state in which the component management card 210 is held by the holding portion 230 of the component box 200.
  • the equivalent circuit of the RF tag 100 includes an inductor pattern L, a capacitor 93, and an IC chip 80.
  • the inductor pattern L, the capacitor 93 and the IC chip 80 constitute a resonant circuit that resonates in the frequency band of the radio wave transmitted from the reader.
  • the resonant frequency f [Hz] of this resonant circuit is given by equation (1).
  • the value of the resonance frequency f is set to be included in the frequency band of the radio wave transmitted from the reader.
  • Equation (1) La: inductance of inductor pattern L, Ca: capacitance of capacitor 93, Cb: equivalent capacitance inside IC chip 80.
  • the resonant circuit preferably has a resonant frequency f set in consideration of the inductance of the inductor pattern L, the capacitance of the capacitor 93, and the equivalent capacitance Cb inside the IC chip 80.
  • Cb for example, a capacitance value published as one of specification specifications of an IC chip to be used can be used.
  • the resonant frequency f of the resonant circuit can be accurately set in the frequency band of the radio wave.
  • the reading performance of the RF tag 100 can be further improved.
  • the power supply voltage generated by the IC chip 80 can be further increased.
  • the card is placed between the waveguide plate (second waveguide element 30) of the RF tag 100 embedded in the card body 220 and the metal plate 250.
  • a capacitor (second capacitor) 270 is formed, and a resonance circuit can be formed with the inductance of the RF tag 100.
  • the second capacitor 270 is connected in series to a capacitor 93 (first capacitor) formed of the first waveguide element 20, the second waveguide element 30, and the insulating base 140. Therefore, the combined capacitance of the first capacitor 93 and the second capacitor 270 may change, and the resonant frequency of the resonant circuit of the RF tag 100 may change significantly.
  • the capacitance of the capacitor 270 is much smaller than the capacitance of the capacitor 93, the combined capacitance is greatly reduced compared to the capacitance of the capacitor 93. This means that when the RF tag 100 is disposed on the metal plate 250 via the insulating layer, the resonant frequency of the resonant circuit of the RF tag 100 changes significantly, and the reading performance of the RF tag 100 is degraded.
  • the capacitance of the capacitor 270 can be made equal to or higher than the equivalent capacitance inside the IC chip 80. As a result, the combined capacitance of the capacitor 93 and the capacitor 270 can be prevented from being significantly reduced, and the performance degradation of the RF tag 100 can be suppressed.
  • the capacitance of the capacitor 270 is preferably twice or more the equivalent capacitance inside the IC chip 80. More preferably, it is 2 times or more and 10 times or less.
  • the radio wave from the reader is received by one of the waveguides (first waveguide element) 20 of the RF tag 100. Then, an IC chip circuit connected between the first waveguide element 20 of the RF tag 100 and the other second waveguide element (ground element) 30 of the RF tag 100 is passed through the card from the second waveguide element 30. It is discharged to the metal plate 250 through the insulating layer of the main body 220. That is, since the RF tag 100 and the metal plate 250 perform capacitive coupling via the insulating layer (dielectric), the metal plate 250 functions as an antenna.
  • the metal plate 250 can operate as an antenna.
  • the radio wave from the RF tag 100 can be sent to the reading device through the metal plate 250, and the radio wave from the reading device can be received by the RF tag 100 through the metal plate 250.
  • the RF tag 100 can be reliably driven, and reading of the RF tag 100 with a nondirectional property and a long communication distance can be performed.
  • the waveguide plate waveguide element of the RF tag 100 embedded in the card body 220
  • the component box 200 in addition to the formation of the electrical insulating layer of the card body 220, the metal plate 250 and the insulating layer of the coating formed on the outer surface of the component box 200.
  • a capacitor (third capacitor) 272 is formed between the component box 200 and the metal component box 200, so that a resonant circuit can be formed with the inductance of the RF tag 100.
  • the third capacitor 272 is connected in series to the first capacitor 93 and the second capacitor 270. Therefore, the combined capacitance of the first capacitor 93, the second capacitor 270, and the third capacitor 272 may change, and the resonant frequency of the resonant circuit of the RF tag 100 may change significantly.
  • the capacitance of the third capacitor 272 is much smaller than the capacitances of the second capacitor 270 and the first capacitor 93, the combined capacitance is smaller than the capacitances of the first capacitor 93 and the second capacitor 270. It falls sharply. This means that when the RF tag 100 is disposed in the component box 200 via the insulating layer, the coupling capacitance resonance frequency of the RF tag 100 changes significantly, and the reading performance of the RF tag 100 is degraded.
  • the capacitance of the third capacitor 272 can be equal to or higher than the capacitance of the second capacitor 270 and the equivalent capacitance inside the IC chip 80.
  • the combined capacitance of the first capacitor 93, the second capacitor 270, and the third capacitor 272 can be prevented from being significantly reduced, and the performance degradation of the RF tag 100 can be suppressed.
  • the capacitance of the second capacitor 270 and the capacitance of the third capacitor 272 are preferably at least twice the equivalent capacitance inside the IC chip 80.
  • the radio wave from the reader is received by one of the waveguide plates (first waveguide element 20) of the RF tag 100, and the first waveguide element 20 of the RF tag 100 and the other second waveguide of the RF tag 100 are received.
  • the IC chip circuit connected between the wave elements (ground elements) is discharged from the second waveguide element 20 to the metal component box 200 through the insulating layer of the component management card body 220. That is, since the RF tag 100 and the component box 200 perform capacitive coupling via the insulating layer (dielectric), the component box 200 functions as an antenna.
  • the component box 200 can operate as an antenna.
  • radio waves from the RF tag 100 can be sent to the reading device via the component box 200, and radio waves from the reading device can be received by the RF tag 100 via the component box 200.
  • the component management device of the present invention is configured in which the waveguide plate provided in the RF tag 100 and the component box 200 are electrostatically coupled.
  • the RF tag 100 can be reliably driven, and reading of the RF tag 100 with a nondirectional property and a long communication distance can be performed.
  • FIG. 13 is a schematic principal part perspective view showing an example of the RF tag 100 used for the component management card 210 according to still another embodiment
  • FIG. 14 is a schematic plan view of the RF tag 100 shown in FIG.
  • FIG. 15 is a schematic plan view of the antenna unit 300 of the RF tag 100 shown in FIG.
  • the RF tag 100 is formed by bonding the circuit member 400 to the antenna unit 300 via the insulating layer 420. Since the insulating layer 420 is interposed between the antenna unit 300 and the circuit member 400, a capacitor is formed therebetween.
  • the antenna unit 300 is made of a metal plate, and has a first area 310, a second area 320, and a third area 330 made of strip members.
  • a metal which comprises a metal plate you may use iron, copper, aluminum, silver, nickel, those alloys, etc. From the viewpoint of conductivity, processability and cost, the metal of the metal plate is preferably aluminum.
  • the thickness of the metal plate is 0.3 mm or more and 1 mm or less from the viewpoint of strength.
  • FIG. 16 is a schematic enlarged view of the circuit member 400 of the RF tag shown in FIG.
  • the circuit member 400 includes an IC chip 80 and a circuit 410 forming an inductor pattern L.
  • the circuit 410 has a shape having a cutout in which a part of the ring-shaped circuit portion 411 is cut out. Specifically, it consists of a C-shape of alphabet letters.
  • the circuit portion 411 includes a side 411a, a side 411b, a side 411c, a side 411d, and a side 411e. Note that although the circuit 410 has been described for the case where a part of the circuit portion 411 is cut out, the present invention is not limited to this, and an insulating portion may be used instead of the cutout portion.
  • the circuit 410 is made of a thin film of aluminum.
  • the thin film in the present embodiment is formed to have a thickness of 3 ⁇ m to 35 ⁇ m.
  • the circuit 410 is formed by a technique such as etching or pattern printing.
  • An IC chip 80 is provided to bridge the notch of the circuit 410 of the circuit member 400.
  • the impedance of the inductor pattern L can be made constant due to the internal area S of the circuit section 411.
  • the IC chip 80 operates based on the radio wave of the reading device received by the antenna unit 300 of the RF tag 100. Specifically, the IC chip 80 according to the present embodiment first rectifies a part of the carrier wave transmitted from the reader to generate a power supply voltage necessary for the IC chip 80 itself to operate. Then, the IC chip 80 operates the non-volatile memory in which the control logic circuit in the IC chip 80, the unique information of the component box 200, and the like are stored by the generated power supply voltage.
  • the IC chip 80 operates a communication circuit or the like for transmitting and receiving data to and from the reader.
  • the insulating layer can have the same configuration as the insulating base 140 shown in the first embodiment.
  • the width T1 of the first region 310 of the antenna unit 300 is formed to be 1 to 4 times the width T411 of the circuit unit 411 of the circuit member 400. It is desirable that the width T2 of the second region 320 of the antenna unit 300 be one or more and four or less times the width T412 of the circuit unit 411 of the circuit member 400.
  • the width T 413 of the circuit portion 411 of the circuit member 400 be one or more and four times or less the width T 412 of the circuit portion 411 of the circuit member 400. As a result, the circuit member 400 can be easily attached to the antenna unit 300.
  • FIG. 17 is a schematic perspective view of the component management card 210 in which the RF tag 100 shown in FIG. 13 is embedded. As shown in FIG. 17, the card 210 is configured by embedding the RF tag 100 having the above configuration in the card body 220. The equivalent circuit of this card 210 is the same as that of FIG.
  • the shapes of the feeding portion and the short circuit portion of the antenna 110 of the RF tag are different from those of the first embodiment and the second embodiment.
  • FIG. 18 is a schematic perspective view showing an example of the front surface side of the RF tag 100 according to still another embodiment
  • FIG. 19 is a schematic perspective view showing an example of the back surface side of the RF tag 100 shown in FIG. is there.
  • FIG. 20 is a schematic perspective view showing an example of the antenna 110 of the RF tag 100 shown in FIG. 18, and
  • FIG. 21 is a schematic developed view of the antenna 110 of the RF tag 100 shown in FIG.
  • the basic configuration of the antenna 110 of the third embodiment is the same as that of the first embodiment. That is, the antenna 110 includes an insulating base 140 having a first main surface and a second main surface on the opposite side of the first main surface, a first waveguide element 20 provided on the first main surface, and a second A second waveguide element 30 provided on the main surface, a feeding portion 50 provided on a side surface on the long side of the insulating base 140 and having one end electrically connected to the first waveguide element 20, an insulating group A short circuit portion 60 provided on the side surface of the short side of the material 140, having one end electrically connected to the first waveguide element 20 and the other end electrically connected to the second waveguide element 30; ing.
  • the insulating base material 140, the first waveguide element 20, the second waveguide element 30, the power feeding unit 50, and the short circuit unit 60 constitute a plate-like inverted F antenna 110 that receives radio waves transmitted from the reader.
  • an inductor pattern formed of the first waveguide element 20, the short circuit part 60, the second waveguide element 30, and the feeding part 50, and the first waveguide element 20, the second waveguide element 30, and the insulating base 140 A resonant circuit that resonates in a frequency band of radio waves is configured by the configured capacitor.
  • the first waveguide element 20 and the second waveguide element 30 are each formed in a rectangular shape having a long side and a short side.
  • the first waveguide element 20 and the second waveguide element 30 are connected by a short circuit portion 60 on the short side of the first waveguide element 20 and the second waveguide element 30.
  • the feeding portion 50 is continuously provided at a location near the short side of the first waveguide element 20 on the long side.
  • the feeding unit 50 has a first feeding unit 51 continuous from the main body of the first waveguide element 20 and a second feeding unit 52 continuous from the first feeding unit 51.
  • the first feeding portion 51 is formed of a relatively narrow conductor
  • the second feeding portion 52 is formed of a rectangular conductor elongated along the longitudinal direction of the first waveguide element 20.
  • a rectangular notch 32 is formed on the short side of the first waveguide element 20.
  • a connecting portion 34 is formed at the end on the short side of the first waveguide element 20 by the notch 32.
  • the feeding portion 50 is formed on a surface different from the shorting portion 60.
  • the area of the short circuit portion 60 can be increased. That is, the width LL of the short circuit portion 60 shown in FIG. 18 can be increased.
  • the resonance resistance is reduced, and the current flowing through the first waveguide element 20 and the second waveguide element 30 can be adjusted. As a result, it is possible to adjust the Q value determined from the bandwidth of the frequency.
  • the first waveguide element 20 and the second waveguide element 30 are bent in two at the location of the short circuit portion 60 and the bent first waveguide element 20 and the second waveguide element 30
  • An insulating base 140 is disposed therebetween.
  • the first waveguide element 20 is attached to the first main surface of the insulating base 140
  • the second waveguide element 30 is attached to the second main surface of the insulating base 140.
  • the short circuit part 60 is arrange
  • the feeding portion 50 is bent so as to overlap the second waveguide element 30 from the side surface on the long side of the insulating base 140, and the feeding portion 50 is a side surface on the long side of the insulating base 140 and the second waveguide It is attached to the element 30.
  • the IC chip 80 is disposed in the notch 32 formed in the first waveguide element 20, and the IC chip 80 is disposed between the connecting portion 34 of the first waveguide element 20 and the main body of the first waveguide element 20. It is connected to be bridged.
  • the insulating base 140 can be formed of expanded polystyrene. In this embodiment, rectangular polystyrene foam is used. As the expanded polystyrene, one having uniform closed cells internally can be used. The insulating base material 140 having such a configuration has an equal dielectric constant in the thickness direction.
  • the first waveguide element 20 (the antenna part and the second waveguide element 30 (ground part) is maintained at a predetermined distance, and both contacts are made
  • expanded polystyrene having 90% by volume or more of air, more preferably closed-cell expanded polystyrene having 95% by volume to 99% by volume of air.
  • the spatial distance between the first waveguide element 20 (also referred to as an antenna part) and the second waveguide element 30 (also referred to as a ground part) can be maintained at a predetermined distance.
  • interval 0.5 or more and 3.0 mm or less are preferable.
  • the relative dielectric constant of the insulating base 140 is preferably in the range of 1% to 20%. More preferably, it is 1.01% or more and 1.20% or less, most preferably 1.01% or more and 1.10% or less, and most preferably 1.02% or more and 1.08% or less.
  • the expanded ratio of expanded polystyrene is preferably 15 times or more and 60 times or less (in this case, the relative dielectric constant is 1.01% or more and 1.10% or less).
  • the opening area of the antenna portion and the ground portion is reduced, and the communication distance is reduced. It can be miniaturized.
  • a material having a dielectric constant of 1% or more and 5% or less particularly 1.01% or more and 1.20% or less
  • expanded polystyrene is used as the insulating base 140
  • the opening area of the antenna portion and the ground portion The communication distance can be extended from several meters to several tens of meters.
  • the thickness of the insulating base 140 made of expanded polystyrene is preferably in the range of 0.5 mm or more and 3 mm or less.
  • the insulating substrate 140 is made of expanded polystyrene, but is not limited to this, and may be an insulator, such as polyethylene, polyimide, thin foam (borer), etc. Other foams or materials may be used.
  • the RF tag antenna 110 uses expanded polystyrene as the insulating base material 140 of the RF tag antenna 110, so it is possible to secure an opening area of a certain size.
  • the sensitivity of the plate antenna can be improved.
  • the insulating substrate 140 may have a foam shape, may have one or more cavities, and may be made of a composite material in which different materials are mixed or laminated.
  • the same material as the insulating base material 140 may be provided inside the case, and in the present embodiment, expanded polystyrene may be provided inside the case. That is, the expanded polystyrene may be adhered to the surface of the RF tag 100 on which the IC chip 80 is mounted and the first main surface side, and may be stored in the case.
  • FIG. 22 is a schematic view showing the results of the reading experiment of the RF tag 100 described in FIG. 18 to FIG.
  • the reference numeral 100M in FIG. 22 indicates the relationship between the theoretical reading distance (m) (vertical axis) and the frequency (horizontal axis) in the reading experiment using the reading device from the surface side of the RF tag 100 according to the present embodiment.
  • the indicated curve, reference numeral 101M is a curve showing the relationship between the theoretical reading distance (m) and the frequency in the reading experiment using the reading device from the back side of the RF tag 100 according to the present embodiment.
  • Reference numeral 100N is a curve showing the relationship between the theoretical reading distance (m) and the frequency when reading experiments using the reader from the surface side of the applicant's inverted F antenna type RF tag (trade name 06), reference numeral 101N These are the curves which showed the relation of the theoretical reading distance (m) to the frequency at the time of reading experiment using a reading device from the back side of applicants' reverse F antenna type RF tag (brand name 06).
  • the RF tag 100 can be read at a distance of 13 m when the reader is used from the front side (solid line 100 M).
  • solid line 101M when the reader is used from the back side of the RF tag 100 (solid line 101M), it can be read at a distance of 7 m.
  • the RF tag 100 uses the reader from the front side (broken line 100N) and uses the reader from the back side. It was found that the performance was equal to or higher than that of the case (dotted line 101N).
  • Modification 1 of RF tag 100 an example using expanded polystyrene having different dielectric constants in the thickness direction as the insulating base 140
  • foamed polystyrene having different dielectric constants in the thickness direction of the insulating substrate 140 can also be used.
  • FIG. 23 is a schematic cross-sectional view of the RF tag 100.
  • the insulating base 140 is formed of a laminate in which a plate-shaped foam polystyrene material 145 and a plate-shaped resin material 146 are stacked. Although the foam polystyrene material 145 is laminated on the antenna unit 120 side, the resin material 146 may be laminated on the antenna unit 120 side.
  • the size lengths of both the expanded polystyrene material 145 and the resin material 146 are designed to be the same.
  • ABS can be used as a resin raw material, it is not limited to this, You may use polyethylene, a polypropylene, a polyvinyl chloride, a ceramic, paper etc. as a resin raw material.
  • the value ⁇ 1 of the antenna unit 120 is 333 mm, resonance occurs at 402 MHz, which is a longer wavelength of 333/149 ⁇ 2.23 times. That is, it looks the same as that in which the ground portion 130 of 744 mm is formed. As a result, it can be made to be the same as the state which attached RF tag 100 to metal plate 250, and can realize RF tag 100 which has sufficient communication distance corresponding to metal or non metal.
  • the insulating base 40 may be configured by laminating three or more layers of materials having different dielectric constants.
  • FIG. 24 is a schematic cross-sectional view showing still another example of the RF tag 100. As shown in FIG.
  • Insulating substrate 140 has a front surface 141 and a back surface 142.
  • One or more holes 143 having a diameter decreasing from the front surface 141 to the back surface 142 are formed.
  • the holes 143 are not limited to those whose diameter is continuously reduced but also include those whose diameter is reduced stepwise. According to such a configuration, it is possible to obtain the insulating base 140 having different relative dielectric constants in the thickness direction of the insulating base 140. In the embodiment shown in FIG. 24, the insulating base material 140 in which the relative dielectric constant gradually decreases toward the antenna unit 120 is obtained.
  • the stepped or conical hole 143 is described, but the shape of the hole is not limited to this. It may be a cylindrical, square cylindrical or elliptical cylindrical hole that does not penetrate from the front surface 141 to the back surface 142, or a conical cylindrical or pyramid cylindrical cylinder that does not penetrate from the front surface 141 to the back surface 142 Or, it may be an elliptical cone-shaped hole. Further, unlike the case where the shape of the hole 143 is a cylinder or a convex portion, a ring-shaped hole 143 forming a cylinder or a convex portion may be provided. That is, one or more cylinders or projections may be provided from between the second main surface and the first main surface.
  • the cross-sectional shape of the hollow portion of the hole may change from the front surface 141 to the back surface 142.
  • it may be a star-shaped hole, and the cross-sectional shape of the hole may be circular toward the back surface 142 side.
  • the diameter of the hole 143 may be the same, and may differ.
  • the ground portion 130 apparently appears to be longer than a predetermined one.
  • a sufficiently equipped RF tag 100 can be realized.
  • FIG. 25 is a schematic view showing another example of the RF tag 100.
  • the RF tag 100 comprises a plate-like antenna.
  • the RF tag 100 is preferably made of a metal conductor having a thickness of 5 mm or less, and more preferably made of a metal conductor having a thickness of 2 mm or less. Alternatively, they may be formed by metal deposition or the like.
  • a long rectangular long hole is formed along the short side at a position near the short side end of the rectangular antenna.
  • the band-shaped portion on the short side of the antenna formed by the elongated hole is cut out, and a communicating portion in which the elongated hole communicates with the outside is formed.
  • the inductance L is formed by the long hole, and the IC chip 80 is mounted on the communication portion of the strip portion.
  • the sum of length A + length B + length C + length D be 3/4 ⁇ of the center frequency from the central axis of the inductance L (broken line in the figure).
  • FIG. 26 is a schematic view showing an example of the relationship between the frequency band of the RF tag 100 of FIG. 25 and the communication distance.
  • the value of the inductance L when the equivalent capacitance of the IC chip 80 is 1.5 pF is around 21 nH.
  • the equivalent capacitance of the IC chip 80 is not limited to 1.5 pF, and may be 0.2 pF or more and 5 pF or less. For example, it may be 0.6 pF.
  • FIG. 27 is a schematic view showing another example of the RF tag 100 of FIG.
  • the RF tag 100 shown in FIG. 27 may form the RF tag 100 of FIG. 25 by sticking a part of the RF tag portion 100a including the inductance L and the IC chip 80 to a plate-like antenna. That is, the RF tag 100 shown in FIG. 25 may not be formed of one metal conductor, but may be formed by connecting a plurality of members. That is, the total length of the antenna is set to be outside an integral multiple of the frequency. For example, it is set to be less than 1 ⁇ or more than 1 ⁇ . In the case of 1 ⁇ , 2 ⁇ , n ⁇ (n is an integer), power can not be supplied.
  • FIGS. 28 and 29 are schematic views showing an example of the structure of the card 210.
  • FIG. 28 in the structure of the card 210, the rewrite sheet 201 is attached to one side of the RF tag 100 shown in FIGS. 25 and 27, and the protective material 203 is attached to the other side of the RF tag 100. It may be done.
  • a card 210 can be formed and used for the component box 200 described in FIGS. 1 to 5.
  • a non-conductor 205 be wrapped around the RF tag portion 100a (see FIG. 27) of at least a part of the RF tag 100.
  • the inductance L and the frequency characteristics of the IC chip 80 can be stabilized.
  • the metal plate 250 and / or the component box 200 can be used as an antenna and can have a large opening area, the sensitivity of the RF tag 100 can be improved.
  • the metal plate 250 and / or the component box 200 can be used as an antenna, non-directional reading by the reader becomes possible.
  • the component box 200 corresponds to a "component box”
  • the holding unit 230 corresponds to a “holding unit”
  • the component management card 210 and the card 210 correspond to a “component management card”
  • component management Card body 220 and card body 220 correspond to "component management card body”
  • metal plate 250 corresponds to "metal plate”
  • RF tag 100 corresponds to "RF tag”
  • antenna 110 is "antenna”
  • the IC chip 80 corresponds to an "IC chip”
  • the waveguide element, the first waveguide element 20, and the antenna unit 300 correspond to a "waveguide plate”.

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Abstract

La présente invention a pour objet de fournir une carte de gestion de composant grâce à laquelle des composants stockés dans un boîtier de composant peuvent être gérés, et une communication longue distance avec un dispositif de lecture peut être obtenue. À cet effet, l'invention porte sur une carte de gestion de composant (210) qui est maintenue de manière amovible par une section de maintien (230) fixée à la surface externe d'un boîtier de composant stockant des composants à l'intérieur de celle-ci. La carte de gestion de composant comprend : un corps principal de carte de gestion de composant (220) constitué d'une résine ; une étiquette RF (100) incorporée dans le corps principal de carte de gestion de composant (220); et une plaque métallique (250) qui est disposée dans le corps principal de carte de gestion de composant (220) ou sur la surface externe du corps principal de carte de gestion de composant (220) dans un état où une couche de résine du corps principal de carte de gestion de composant (220) se trouve entre l'étiquette RF (100) et la plaque métallique, ladite plaque métallique étant sur le côté boîte de composant (200) de l'étiquette RF (100). L'étiquette RF (100) comprend au moins une antenne (110) et une puce CI (80) qui fonctionne sur la base d'ondes radio émises à partir d'un dispositif de lecture, et une plaque de guide d'ondes, qui est disposée sur l'étiquette RF (100), et la plaque métallique (250) sont électriquement connectées l'une à l'autre par l'intermédiaire d'une capacité constante.
PCT/JP2018/042970 2017-12-05 2018-11-21 Carte de gestion de composants WO2019111710A1 (fr)

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JP2019558123A JP7133232B2 (ja) 2017-12-05 2018-11-21 部品管理用カードおよび部品管理装置

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JP2017-233655 2017-12-05

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011015099A (ja) * 2009-06-30 2011-01-20 Nitta Corp 無線通信改善シート体、無線通信用ｉｃタグ、情報伝達媒体および無線通信システム
JP2011118572A (ja) * 2009-12-02 2011-06-16 Kojima Press Industry Co Ltd Ｒｆｉｄかんばん及びこれを用いた部品手配システム
JP2014194597A (ja) * 2013-03-28 2014-10-09 Toyo Seikan Kaisha Ltd Ｒｆタグ
WO2016129542A1 (fr) * 2015-02-10 2016-08-18 株式会社 フェニックスソリューション Antenne à étiquette rf et son procédé de fabrication, et étiquette rf

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011015099A (ja) * 2009-06-30 2011-01-20 Nitta Corp 無線通信改善シート体、無線通信用ｉｃタグ、情報伝達媒体および無線通信システム
JP2011118572A (ja) * 2009-12-02 2011-06-16 Kojima Press Industry Co Ltd Ｒｆｉｄかんばん及びこれを用いた部品手配システム
JP2014194597A (ja) * 2013-03-28 2014-10-09 Toyo Seikan Kaisha Ltd Ｒｆタグ
WO2016129542A1 (fr) * 2015-02-10 2016-08-18 株式会社 フェニックスソリューション Antenne à étiquette rf et son procédé de fabrication, et étiquette rf

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