WO2019109991A1 - 一种发光二极管灯 - Google Patents

一种发光二极管灯 Download PDF

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Publication number
WO2019109991A1
WO2019109991A1 PCT/CN2018/119665 CN2018119665W WO2019109991A1 WO 2019109991 A1 WO2019109991 A1 WO 2019109991A1 CN 2018119665 W CN2018119665 W CN 2018119665W WO 2019109991 A1 WO2019109991 A1 WO 2019109991A1
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WIPO (PCT)
Prior art keywords
heat
heat dissipation
lamp
led
heat sink
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Application number
PCT/CN2018/119665
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English (en)
French (fr)
Inventor
王名斌
江涛
熊爱明
周林
Original Assignee
嘉兴山蒲照明电器有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 嘉兴山蒲照明电器有限公司 filed Critical 嘉兴山蒲照明电器有限公司
Priority to CN201890001391.0U priority Critical patent/CN212461721U/zh
Publication of WO2019109991A1 publication Critical patent/WO2019109991A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
    • F21S8/06—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures by suspension
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a light-emitting diode (LED) lamp, in particular to a high-power LED lamp, belonging to the field of illumination.
  • LED light-emitting diode
  • LED lamps are widely used in many lighting fields because of their energy saving, high efficiency, environmental protection and long life.
  • LED lamp as an energy-saving green light source, the heat dissipation problem of high-power LED is paid more and more attention. Because the excessive temperature will cause the luminous efficiency to be attenuated, if the waste heat generated by high-power LED operation cannot be effectively dissipated, it will directly cause the life of the LED. The fatal impact, therefore, the resolution of high-power LED heat dissipation in recent years has become an important topic for research and development of many stakeholders.
  • the weight limit for the entire LED light there may be a weight limit for the entire LED light.
  • the maximum weight of the LED lamp is limited to a certain range. Therefore, after removing necessary components such as a power source, a lamp cover, and a lamp housing, the weight of the heat sink for cooling the LED lamps is limited to a limited range.
  • the power is 150W ⁇ 300W
  • the luminous flux can reach about 20,000 lumens to 45000 lumens, that is, the heat sink needs to dissipate the LED from 20,000 to 45000 lumens within its weight limit. The heat generated by the lamp.
  • the LED lamp in the prior art generally includes a light source, a heat sink, a power source, a lamp housing and a lamp cover.
  • the light source is fixed to the heat sink
  • the power source is disposed in the lamp housing
  • the lamp housing is connected to the heat sink
  • the lamp housing includes a lamp housing for connecting the lamp holder. Lamp head.
  • LED lamps of the prior art have the following disadvantages.
  • the design of the radiator is unreasonable: in the case of passive heat dissipation only, and the radiator is under certain weight restrictions, it cannot solve the heat dissipation problem of the LED of the high-power LED lamp, resulting in the heat of the LED working. Can not be dispersed in time, will affect the life of LED for a long time.
  • the heat sink includes heat dissipation fins, and the relative positional relationship between the heat dissipation fins and the LEDs is unreasonable, resulting in heat generated by the LED during operation, and the heat conduction path is too long when the heat is transmitted to the heat dissipation fins. The heat dissipation of the LED is not timely.
  • the convection design between the heat sink fins of the heat sink is unreasonable.
  • the fanless LED spotlight disclosed in the Chinese invention patent of CN 204717489 U has no fins for bottom-up convection. After the heat of the fins is radiated to the air, the heat of the air cannot be dissipated in time, so that the temperature of the air around the fins rises, and the important factor affecting the heat radiation efficiency of the fins is the temperature difference between the fins and the surrounding air. The rise in air temperature affects the subsequent thermal radiation of the fins.
  • the structural design of the heat sink fin of the heat sink is unreasonable.
  • the Chinese invention patent of the publication No. CN107345628A discloses an LED lamp whose heat dissipation fin has the same width in the height direction of the LED lamp, and the LED lamp has the same width.
  • the heat sink fins that are close to the LED in the height direction of the LED lamp mainly conduct heat generated by the LED to the heat sink fin, while the heat sink fins that are relatively far away from the LED need to pass heat radiation and convection to heat the heat.
  • the fins away from the LED are mainly radiated by heat radiation and convection, so that no excessive fin area is required, and the LED lamp disclosed in the above patent, the fin of the heat dissipation fin
  • the design will result in an increase in the overall weight of the LED lamp, but the heat dissipation efficiency cannot be increased accordingly.
  • the heat sink fins of the heat sink there are some structural problems in the heat sink fins of the heat sink, such as high-power LED lights, which are large in size, can be up to 150mm in width, and have a height of more than 180mm. Correspondingly, the fins are also larger.
  • the length and width of the heat sink fins if there is no corresponding support, the heat sink fins are prone to deflection when processing and forming; for example, the heat sink fins in the radial direction of the LED light are not designed properly, resulting in heat dissipation. It drops and does not fit well with the fixtures that work with it.
  • the setting of the power supply is unreasonable: for some high-power LED lights, if the power reaches 150W ⁇ 300W, the heat dissipation of the power supply is also important. If the LED light works, the heat generated by the power supply cannot be dissipated in time, which will affect The life of some electronic components (especially those with high heat sensitivity, such as capacitors) affects the life of the entire lamp. Generally, there is no effective thermal management between the heat sink and the power source in the prior art, which will cause mutual influence between the heat of the heat sink and the heat of the power source.
  • a dual-channel air convection lamp heat dissipation structure and a PAR lamp using the same the heat dissipation fin and the cavity for accommodating the power source (a part of the cavity is directly formed on the heat sink), the light source and the cavity for accommodating the power source
  • the heat dissipation fin and the cavity for accommodating the power source There is no effective thermal isolation between the heat sinks, and the heat generated by the heat sink fins and the light source directly enters the cavity through heat conduction, which affects the power supply in the cavity.
  • the layout of the electronic components of the power supply is unreasonable.
  • the arrangement of the heat-generating components (such as resistors, inductors, and transformers) is not conducive to the formation of temperature gradients between the heat-generating components and the surrounding air, thereby affecting the heat radiation of the heat-generating components.
  • the efficiency of the air it should be noted that when the external air is convected to the power source, if the design is not targeted, insects, dust, etc. are easily attached to the power source, thereby affecting the heat dissipation of the power source.
  • the assembly method of high-power LED lighting products mainly connects the components by means of screws.
  • the neck of the lamp above the radiator is usually made of plastic parts.
  • the most common structure is the outer casing and the base of the plastic parts. Threaded together, the lamp head is rotatably locked to the outer casing, and the rivet pinhole is used for positioning connection.
  • the use of screw connections not only requires a cumbersome process in the manufacturing process, but also costs a lot. Therefore, the combination of high-power LED lighting products is also one of the important directions for the research and development of this product.
  • the lamp cover of the LED lamp When the LED lamp is packaged and transported, the lamp cover of the LED lamp is protruded from the lamp plate.
  • the lamp cover of the LED lamp may contact and collide with the outside to become a force point.
  • the lampshade is generally made of a material such as glass or plastic, which has a problem of fragility. Therefore, in the packaging and transportation, the lampshade needs special protection to avoid damage due to collision, and the above operation will undoubtedly increase the cost of the packaging.
  • a solid-state lamp which includes a solid-state light source mounted on a circuit board, and a portion of the solid-state light source is disposed laterally, and is usually used in conjunction with a luminaire when in use.
  • the laterally disposed portion of the solid-state light source needs to be emitted to the lower side through the luminaire, and the light is emitted by the light, and there is a certain light loss during the reflection process, thereby affecting the light-emitting efficiency of the whole lamp.
  • the prior art states that the bias voltage of the general driving circuit is generated by taking a partial voltage on the bus bar.
  • the bias circuit in order to avoid excessive power waste, the bias circuit is usually designed with a large capacitor, which will cause HID-LED points.
  • the brightness is slower, and the general bias mode startup speed is about 1 second, which affects the experience.
  • the technical problem to be solved by the present invention is to provide an LED lamp to solve the above problems.
  • the invention provides an LED lamp, which comprises:
  • the passive heat dissipating component comprising a heat sink, the heat sink comprising a heat dissipating fin and a heat dissipating base, wherein the heat sink is connected to the lamp housing;
  • the power source being located within the lamp housing;
  • the light board connected to the heat sink, the light board includes an LED chip, and the power source is electrically connected to the LED chip;
  • a first heat dissipation channel is formed in the inner cavity of the lamp housing, the first heat dissipation channel has a first air inlet hole at one end of the lamp housing, and the opposite end of the lamp housing has a heat dissipation hole;
  • a second heat dissipation channel is formed in the heat dissipation fin and the heat dissipation base, and the second heat dissipation channel has a second air inlet hole, and after the air enters from the second air inlet hole, passes through the second heat dissipation channel. Finally, it flows out from the space between the fins.
  • the light board is opened with a third opening, and the third opening is respectively connected to the first heat dissipation channel and the second heat dissipation channel.
  • the third opening is disposed in a region of a center of the light panel, and the first air inlet and the second air inlet are respectively inhaled from the third opening.
  • the weight of the heat sink accounts for more than 50% of the weight of the LED lamp, and the volume of the heat sink accounts for more than 20% of the total volume of the LED lamp.
  • the heat sink has a volume of 20% to 60% of the total volume of the LED lamp.
  • the heat dissipation fin includes a first heat dissipation fin and a second heat dissipation fin, and the first heat dissipation fin and the second heat dissipation fin are at the bottom of the LED light axis and the bottom
  • the heat dissipation base is connected, the first heat dissipation fin and the second heat dissipation fin are spaced apart from each other, and the shape of the second heat dissipation fin is a Y shape divided into two.
  • the device further includes a light cover, the light cover includes a light output surface and an end surface, and the end surface is provided with a vent hole through which the air enters the first heat dissipation channel and the second heat dissipation channel,
  • the first air inlet hole is projected onto the area occupied by the end surface in the axial direction of the LED lamp to form a first portion, and the other area on the end surface forms a second portion, the vent hole on the first portion
  • the area is larger than the area of the venting hole on the second portion.
  • the beneficial effects of the present invention are: Compared with the prior art, the present invention includes any of the following effects or any combination thereof:
  • the heat in the first heat dissipation channel can be taken away (generated by the power supply, and the convection heat dissipation of the heat sink can be increased through the setting of the second heat dissipation channel, and the first
  • the arrangement of the heat dissipation channel and the second heat dissipation channel increases the natural convection efficiency of the whole lamp, so that the corresponding required heat dissipation area of the heat sink is reduced.
  • the third opening is respectively connected to the first heat dissipation channel and the second heat dissipation channel, and the third opening is disposed in a region of the center of the light panel, and the third opening is opened in a region of the center of the light panel to make the first air intake
  • the hole and the second intake hole can share an inlet of the intake air, thereby avoiding occupying an area where the lamp plate is excessive, thereby preventing the area of the area of the lamp board where the LED chip is disposed from being reduced by opening a plurality of holes.
  • the weight of the heat sink accounts for more than 50% of the weight of the LED lamp, and the volume of the heat sink accounts for more than 20% of the total volume of the LED lamp.
  • the thermal conductivity of the heat sink is the same, the volume occupied by the heat sink The larger the area, the larger the area that can be used for heat dissipation. Therefore, to some extent, when the volume of the heat sink accounts for more than 20% of the total volume of the LED lamp, the heat sink can have more available space to increase its heat dissipation area.
  • the heat sink 1 has more heat dissipating area in the case of occupying the same volume.
  • the area of the vent hole on the first portion is larger than the area of the vent hole on the second portion, which facilitates most of the air entering the first heat dissipation channel, thereby better dissipating heat from the power source and preventing the electronic components of the power source from being heated and accelerated. Ageing.
  • FIG. 1 is a front view showing the structure of an LED lamp in this embodiment
  • FIG. 2 is a cross-sectional structural view of the LED lamp of FIG. 1;
  • Figure 3 is an exploded perspective view of the LED lamp of Figure 1;
  • FIG. 4 is a cross-sectional structural view of an LED lamp, showing a first heat dissipation channel and a second heat dissipation channel;
  • Figure 5 is a perspective view of the three-dimensional structure of the LED lamp of Figure 1;
  • Figure 6 is a schematic view showing the structure of Figure 5 with the light output surface removed;
  • Figure 7 is a schematic view of light transmission of the embodiment
  • Figure 8 is a light pattern diagram of Figure 7;
  • Figure 9 is an exploded perspective view of the LED lamp in some embodiments, showing the light blocking ring
  • Figure 10 is a perspective view of an LED lamp in some embodiments.
  • Figure 11 is a schematic view of Figure 10 with the light output surface removed;
  • Figure 12 is a cross-sectional view of an LED lamp in some embodiments showing a flat light output surface
  • FIG. 13a to 13c are schematic views of the cooperation of the lamp board and the lamp cover in some embodiments.
  • Figure 14 is a schematic view of the cooperation of the lamp board and the lamp cover in some embodiments.
  • Figure 15 is a schematic view of the end face of the lampshade in the embodiment.
  • Figure 16 is a schematic illustration of an end face of a lampshade in some embodiments.
  • Figure 17 is a schematic view showing the other direction of the end surface of Figure 16;
  • 18a to 18j are schematic views of a lampshade in some embodiments.
  • Figure 19a is a cross-sectional schematic view of a heat sink in some embodiments.
  • Figure 19b is a schematic illustration of an LED lamp employing the heat sink of Figure 19a;
  • Figure 20 is a cross-sectional view showing the lamp cover of the LED lamp in some embodiments.
  • Figure 21 is a perspective view of the LED lamp of the embodiment.
  • Figure 22 is a cross-sectional view of the LED lamp in the embodiment.
  • Figure 23 is a plan view of the heat sink in the embodiment.
  • Figure 24 is an enlarged schematic view of the portion E in Figure 23;
  • 25 is a schematic view showing the formation of eddy currents at the second heat dissipation fins 112;
  • Figure 26 is a partial schematic view of a heat sink in some embodiments.
  • Figure 27 is a front elevational view of an LED lamp in some embodiments.
  • Figure 28 is a front elevational view of an LED lamp in some embodiments.
  • Figure 29 is a bottom plan view of the LED lamp of Figure 1 with the lamp cover removed;
  • Figure 30 is an enlarged schematic view of a portion A in Figure 29;
  • Figure 31 is a cross-sectional view of the LED lamp of the embodiment.
  • Figure 32 is an enlarged schematic view showing a portion C in Figure 31;
  • Figure 33 is a perspective view of the lampshade in the embodiment.
  • Figure 34 is a schematic view of the cooperation of the lampshade and the lamp panel in some embodiments.
  • Figure 35 is a bottom view of Figure 34;
  • 36a to 36n are schematic views of a heat sink in some embodiments.
  • Figure 37a is a schematic illustration of a heat sink in some embodiments.
  • Figure 37b is a schematic illustration of a heat sink in some embodiments.
  • Figure 37c is a schematic illustration of a heat sink in some embodiments.
  • Figure 37d is a schematic illustration of a heat sink in some embodiments.
  • 38a to 38j are top views of a heat sink in some embodiments.
  • Figure 39 is a plan view of the heat sink of the embodiment.
  • 40 is a schematic view showing the cooperation of the heat dissipation fin and the LED chip of the embodiment
  • 41 is a schematic diagram of cooperation between a heat sink fin and an LED chip in some embodiments.
  • Figure 42 is a schematic illustration of a light panel in some embodiments.
  • Figure 43 is a schematic view of a lamp panel in the embodiment.
  • 44a to 44f are schematic views of a light panel in some embodiments.
  • 45a to 45g are front elevational views of a light panel in some embodiments.
  • Figure 46a is a perspective view 1 of the power supply in the embodiment
  • Figure 46b is a perspective view 2 of the power supply in the embodiment.
  • Figure 46c is a perspective view 3 of the power supply in the embodiment.
  • Figure 46d is a front view of the power supply in the embodiment.
  • Figure 47 is a schematic illustration of a power supply in some embodiments.
  • Figure 48 is a front elevational view of the weight of Figure 47;
  • Figure 49 is a diagram of Figure 48
  • Figure 50 is a schematic view of a transformer
  • Figure 51 is a schematic illustration of a power supply in some embodiments.
  • Figure 52 is a schematic illustration of a power supply in some embodiments.
  • Figure 53a is a schematic illustration of a power strip in some embodiments.
  • Figure 53b is a schematic illustration of a power strip in some embodiments.
  • Figure 53c is a schematic illustration of a power strip in some embodiments.
  • Figure 54 is a cross-sectional view of the LED lamp in this embodiment.
  • Figure 55 is a cross-sectional view of the LED lamp in this embodiment.
  • Figure 56 is a schematic diagram of the cooperation of the power source and the inner sleeve in some embodiments.
  • Figure 57 is an enlarged view of B in Figure 2;
  • Figure 58 is a partial schematic view of an LED lamp
  • Figure 59a is a perspective view of the lamp neck of the embodiment.
  • Figure 59b is a perspective view 2 of the lamp neck of the embodiment.
  • Figure 59c is a perspective view of a lamp neck in some embodiments.
  • Figure 60 is a perspective view showing the inner sleeve of the embodiment.
  • Figure 61 is a cross-sectional view of an LED lamp in some embodiments.
  • FIG. 62 is a schematic view showing the arrangement of a convection passage in the LED lamp of FIG. 61;
  • Figure 63 is a front elevational view of the LED lamp with the heat sink removed in some embodiments.
  • Figure 64 is an exploded perspective view of Figure 63;
  • Figure 65a is an exploded perspective view of a lamp housing of an LED lamp in some embodiments.
  • Figure 65b is a schematic view of the assembly of Figure 65a;
  • Figure 65c is an exploded schematic view 1 of the LED lamp including the lamp housing of Figure 65a;
  • Figure 65d is an exploded view of the LED lamp including the lamp housing of Figure 65a.
  • Figure 65e is a cross-sectional view of the LED lamp including the lamp housing of Figure 65a;
  • Figure 66 is a front elevational view of the LED lamp in the embodiment.
  • Figure 67 is a schematic view showing the cooperation of the LED lamp and the lamp in the embodiment.
  • Figure 68 is a schematic illustration of an LED lamp in some embodiments.
  • Figure 69 is a front elevational view of the LED lamp in the embodiment.
  • Figure 70a is a schematic view showing the cooperation of the LED lamp and the lamp in the embodiment.
  • Figure 70b is a schematic view showing the cooperation of the LED lamp and the lamp in the embodiment.
  • Figure 70c is a schematic view showing the cooperation of the LED lamp and the lamp in the embodiment.
  • 71 is a first schematic diagram of a circuit layout of an LED module in some embodiments.
  • Figure 72 is an enlarged schematic view showing a portion D in Figure 71;
  • 73 is a second schematic diagram of a circuit layout of an LED module in some embodiments.
  • FIG. 74 is a schematic diagram of a power module according to an embodiment of the present application.
  • FIG. 76 is a schematic diagram of a rectifier circuit and a filter circuit according to an embodiment of the present application.
  • 77 is a schematic diagram of a power factor correction circuit according to an embodiment of the present application.
  • FIG. 78 is a schematic diagram of a power conversion circuit according to an embodiment of the present application.
  • Figure 79 is a schematic diagram of a bias generating circuit of a first embodiment of the present application.
  • Figure 80 is a schematic diagram of a bias generating circuit of a second embodiment of the present application.
  • FIG. 81 is a schematic diagram of a temperature detecting circuit according to an embodiment of the present application.
  • 82 is a schematic diagram of a temperature compensation circuit according to an embodiment of the present application.
  • vertical generally refers to an angle of 90 degrees with respect to the reference line, but in the present invention, vertical refers to a case including 80 degrees to 100 degrees.
  • use and use state of the LED lighting lamp in the present invention refer to the use situation of the LED lamp in the vertical hanging manner of the lamp cap, and other exceptions will be further described.
  • the LED lamp comprises: a heat sink 1 , a lamp housing 2 , a light board 3 , a lamp cover 4 and a power source 5 .
  • the lamp board 3 is attached to the heat sink 1 in a conforming manner to facilitate rapid conduction of heat generated when the lamp board 3 is in operation to the heat sink 1.
  • the light board 3 is riveted to the heat sink 1.
  • the light board 3 is connected to the heat sink by bolts.
  • the light board 3 is soldered and fixed to the heat sink 1. In some embodiments, the light board 3 is adhesively fixed to the heat sink 1.
  • the heat sink 1 is connected to the lamp housing 2, and the lamp cover 4 is disposed outside the lamp panel 3, so that the light generated by the light source of the lamp panel 3 is emitted through the lampshade 4, and the power source 5 is located in the inner cavity of the lamp housing 2.
  • the power source 5 is electrically connected to the LED chip 311 to supply power to the LED chip 311.
  • a cross-sectional view of the LED lamp in this embodiment is shown.
  • a first heat dissipation channel 7a is formed in the inner cavity of the lamp housing 2 in this embodiment, and the first heat dissipation channel 7a has a first air inlet hole 2201 at one end of the lamp housing 2, and the lamp housing The opposite end of the upper portion 2 has a heat dissipation hole 222 (specifically opened on the upper portion of the lamp neck 22).
  • the air enters from the first intake hole 2201 and is discharged from the heat dissipation hole 222, whereby the heat in the first heat dissipation passage 7a (mainly the heat generated when the power source 5 is operated) can be taken away.
  • the heat generated by the heat generating component in the power source 5 is first transferred to the air in the first heat dissipation channel 7a (air near the heat generating component) by heat radiation, and the outside air is convected.
  • heat dissipation can also be directly performed by providing a heat dissipation hole 222 in the lamp neck 22.
  • a second heat dissipation channel 7 b is formed in the heat dissipation fin 11 and the heat dissipation base 13 , and the second heat dissipation channel 7 b has a second air inlet hole 1301 , and the air enters from the second air inlet hole 1301 .
  • the second heat dissipation passage 7b finally flows out from the space between the heat dissipation fins 11. Thereby, the heat on the heat dissipation fins 11 can be taken away, and the heat dissipation of the heat dissipation fins 11 can be accelerated.
  • the heat generated by the LED chip 311 is thermally conducted to the heat sink 1.
  • the heat dissipation fins 11 of the heat sink 1 radiate heat to the surrounding air, and when the second heat dissipation channel 7b convects heat, the heat sink 1 is taken away. Cooling by air.
  • the heat sink 1 is provided with a third heat dissipation channel 7c, and the third heat dissipation channel 7c is formed between the two heat dissipation fins 11 or between the two sheets extending from the same heat dissipation fin 11.
  • the radially outer portion between the two heat dissipating fins 11 constitutes an entrance of the third heat dissipating passage 7c, and the air enters the third heat dissipating passage 7c from the radially outer region of the LED lamp, and takes away the radiating fins 11 to radiate to The heat of the air.
  • FIG. 5 is a schematic perspective structural view of the LED lamp in the embodiment, showing the combination of the heat sink 1 and the lamp cover 4.
  • FIG. 6 is a schematic structural view of FIG. 5 with the light output surface 43 removed.
  • the lamp cover 4 includes a light output surface 43 and an end surface 44.
  • the end surface 44 is provided with a venting hole 41 through which the air enters the first heat dissipation passage 7a and the second. Cooling channel 7b.
  • the light output surface 43 can be made of a light transmissive material in the prior art, such as glass, PC, or the like.
  • the term "LED chip” as used in all embodiments of the present invention generally refers to all light-emitting sources mainly composed of LEDs (light-emitting diodes), including but not limited to LED lamp beads, LED light bars or LED filaments, and the like, The LED chipset can also be equated with an LED bead set, an LED strip set or an LED filament set. As shown in FIG. 5, in the present embodiment, the ratio of the area of the light output surface 43 to the area of the end surface 44 is 1:4 to 7.
  • the area of the light output surface 43 (the area of the one side surface of the light output surface 43, that is, the area of the surface away from the side of the LED chip 311) and the end surface 44 (the area of the one side surface of the end surface 44, that is, one away from the LED chip 311)
  • the ratio of the area of the surface of the side surface, including the area of the vent hole 41, is 1:5 to 6.
  • the ratio of the area of the light output surface 43 to the area of the end surface 44 is 1:5.5.
  • the end face 44 is used for air to pass through to the first heat dissipation channel 7a and the second heat dissipation channel 7b, and the light output surface 43 is used to emit light from the light source, thereby achieving a balance between light emission and heat dissipation.
  • the ratio of the area of the globe 4 to the area of the end surface 44 is 5-8.
  • the ratio of the area of the globe 4 to the area of the end surface 44 is 6-7. In this way, a balance is achieved between the range of light output and the air required for heat dissipation.
  • the area of the light output surface 43 (the area of the one-side surface of the light output surface 43, that is, the area of the surface away from the LED chip 311 side) is more than three times the area of the surface of all the LED chips 31 in the light-emitting direction. And no more than 10 times, while providing sufficient light-emitting area, control its width size.
  • an inner reflection surface 4301 is disposed on the inner side of the light output surface 43 of the lamp cover 4 in the radial direction of the LED lamp, and the inner reflection surface 4301 is opposite to the LED chip 311 on the lamp panel 3.
  • the reflecting surface 4301 is located on the inner side of the LED lamp in a radial direction with respect to any one of the LED chips 311.
  • the light output surface 43 is provided with an outer reflective surface 4302 on the outer side in the radial direction of the LED lamp.
  • the outer reflective surface 4302 is opposite to the LED chip 311 on the light panel 3, and the outer reflective surface 4302 is opposite to any one of the LED chips 311.
  • the LED lamp is radially outward.
  • the arrangement of the inner reflective surface 4301 and the outer reflective surface 4302 is used to adjust the light-emitting range of the LED chip set 31 to make the light more concentrated, thereby improving the local brightness, that is, improving the LED light in the case of the same luminous flux. Illumination. Specifically, when the LED chip 311 in this embodiment is disposed, all of the LED chips 311 are disposed on the lower surface of the lamp board 3 (in the state of use), that is, the LED chip 311 does not have lateral light emission.
  • the LED chip 311 When working, the LED chip 311 The main light emitting surface is all downward, and at least 60% of the light of the LED chip 311 is directly emitted from the light output surface 43 without being reflected, and therefore, relative to the LED light having the main light emitting surface lateral light emitting (lateral direction) After the light is reflected by the lamp or the lamp cover and emitted downward, and the reflection has a certain proportion of light loss, the light output efficiency of the LED chip 311 of the embodiment is better, that is, in the case of the same lumen (light flux), The LED lamp of this embodiment has a higher illuminance.
  • the light emission can be more concentrated, and the illumination in an area can be improved, for example, an area between 120 degrees and 130 degrees below the LED light (120 degrees to 130 degrees below the LED light) The range of light angles).
  • the range of illumination of the LED lamp still satisfies the requirement at the light extraction angle, and a higher illumination can be achieved in this range.
  • Fig. 7 is a view showing light transmission of the present embodiment
  • Fig. 8 is a light pattern of Fig. 7. As shown in FIG. 6, FIG. 7, and FIG.
  • the LED lamp includes a reflective surface to reflect at least a portion of the light emitted by the LED chip 311 to the concentrating region m to increase the brightness of the concentrating region m.
  • the reflecting surface includes an inner reflecting surface 4301 and an outer reflecting surface 4302. The inner reflecting surface 4301 and the outer reflecting surface 4302 both reflect the light of the LED chip 311 at least partially to the collecting area m.
  • the luminous flux of the light source is reflected from the light output surface 43 after being reflected by the internal reflection surface 4301 and the external reflection surface 4302, and actually passes through the internal reflection surface 4301 and the external reflection surface 4302.
  • the total amount of light emitted from the light output surface after reflection is at least 1000 lumens.
  • the total amount of light emitted from the light output surface after reflection by the inner reflective surface 4301 and the outer reflective surface 4302 is at least 1500 lumens.
  • the total amount of light reflected by the outer reflecting surface 4302 is greater than the total amount of light reflected by the inner reflecting surface 4302.
  • the concentrating area m in this embodiment is an annular area, and the inner boundary thereof has a central angle of 20° with the axis of the LED lamp, and the outer boundary thereof has a central angle of 50° with the axis of the LED lamp.
  • the luminous flux of the LED lamp projected into the concentrating zone m is between 35% and 50% of the total luminous flux, so that the concentrating zone m has a better illumination effect.
  • the area M is used to increase the illuminance in the light projection area M.
  • the inner reflective surface 4301 is for reflecting a portion of the light emitted by the LED chip 311 of the innermost LED chip set 31, and the outer reflective surface 4302 is for emitting a portion of the light emitted by the LED chip 311 of the outermost LED chip set 31.
  • the number of LED chips 311 included in the outermost LED chip set 31 is greater than the number of LED chips 311 included in the innermost LED chip set 31.
  • the area of the outer reflective surface 4302 is larger than the area of the inner reflective surface 4301 because the outermost LED chip set 31 includes more LED chips 311, so more reflective area is needed to modulate the light.
  • the inner reflective surface has a first area A1
  • the outer reflective surface has a second area A2.
  • the number of LED chips 311 included in the outermost LED chip set 31 is N2, and the innermost LED chip set 31
  • the number of LED chips 311 included is N1; the following relationship is satisfied:
  • the ratio of the area of the inner emission surface 4301 corresponding to the single LED chip 311 in the innermost LED chip group 31 to the area of the outer emission surface 4302 corresponding to the single LED chip 311 in the outermost LED chip group 31 falls within the above
  • the LED chip 311 of the innermost LED chip set 31 and the LED chip 311 of the outermost LED chip set 31 each have a better light-emitting effect.
  • the inner reflection surface 4301 is adjacent to one end of the lamp panel 3 and abuts against the lamp panel 3, thereby preventing light from passing through the gap between the inner reflection surface 4301 and the lamp panel 3, thereby avoiding loss of part of the light.
  • the outer reflective surface 4302 is adjacent to one end of the light panel 3 and abuts against the light panel 3, thereby preventing light from passing through the gap between the outer reflective surface 4302 and the light panel 3, thereby avoiding loss of this portion of light.
  • an angle a is formed between the extension lines of the inner reflection surface 4301 and the outer reflection surface 4302, and the angle of the angle a is between 80 degrees and 150 degrees.
  • the angle The angle is between 90 and 135 degrees, and more preferably, the angle is between 100 and 120 degrees.
  • a reflector-like structure is formed between the inner reflective surface 4301 and the outer reflective surface 4302, thereby functioning to control the light-emitting range of the LED chip or to improve the local brightness.
  • the angle between the outer reflective surface 4302 and the light panel 2 is 30 to 60 degrees, and in some embodiments, the angle is 40 to 50 degrees.
  • the height of the inner reflection surface 4301 is lower than the height of the outer reflection surface 4302.
  • This height refers to the relative height of the two in the axial direction of the LED lamp.
  • the height of the inner reflection surface 4301 is lower than the height of the outer reflection surface 4302, it is possible to avoid reducing the light distribution in the region directly under the LED lamp and preventing the intermediate portion of the light distribution region of the LED lamp from forming a dark region.
  • the height of the outer reflection surface 4302 in the axial direction of the LED lamp does not exceed 20 mm.
  • the height of the outer reflection surface 4302 in the axial direction of the LED lamp does not exceed 15 mm.
  • the height of the outer reflective surface 4302 does not exceed 9% of the total LED light.
  • the height of the outer reflective surface 4302 does not exceed 6 of the total LED light. %, from the function of the outer reflecting surface 4302, it is necessary to ensure that the height of the outer reflecting surface 4302 accounts for 2% or more of the height of the LED full lamp.
  • the height of the outer reflecting surface 4302 accounts for 3% or more of the height of the LED full lamp. .
  • the height of the outer reflection surface 4302 is set to be between 2% and 9% of the height of the LED full lamp.
  • the height of the outer reflective surface 4302 is set to be between 3% and 6% of the height of the LED full lamp.
  • the cover 4 of the LED lamp in some embodiments may eliminate the arrangement of the internal reflection surface or the external reflection surface, for example, only the light blocking ring 47 is provided.
  • the light shielding ring 47 is disposed on the outer circumference of the lamp cover 4.
  • the inner surface of the light-blocking ring 47 has a reflecting effect (similar to the outer reflecting surface).
  • the light-blocking ring 47 is close to the periphery of the light-emitting plate 3, such as the light-blocking ring 47.
  • the peripheral diameter is equal to or slightly larger than the outer diameter of the lamp panel 3.
  • the LED chip 311 in order to prevent dust from being deposited on the surface of the LED chip 311 and reduce the light effect of the LED chip 311 or affect the heat dissipation of the LED chip 311, the LED chip 311 can be disposed in the closed space. Inside, the surface of the LED chip 311 is deposited to prevent dust from entering. For example, a closed cavity 9 is formed between the lamp cover 4 and the lamp plate 3. Specifically, a closed cavity is formed between the light output surface 43, the internal reflection surface 4301, the external reflection surface 4302 and the lamp plate 3. 9 (The seal here can mean no obvious holes, not including the inevitable gaps in the assembly process).
  • the arrangement of the inner reflection surface 4301 and the outer reflection surface 4302 may be omitted, and the cavity 9 is formed between the light board 3 and the light output surface 43, or the light board 3, the light output surface 43, and the heat dissipation. Between the devices 1.
  • Figure 10 is a perspective view of an LED lamp in some embodiments, which differs from the present embodiment in that a cavity is formed in the cavity 9.
  • Figure 11 is a schematic illustration of Figure 10 with the light output surface 43 removed.
  • a cavity 9 is formed between the lamp cover 4 and the lamp plate 3 , specifically, the light output surface 43 , the internal reflection surface 4301 , the external reflection surface 4302 , and the light board .
  • a cavity 9 is formed between the three, and the LED chip 311 of the lamp panel 3 is located in the cavity 9.
  • the cavity 9 has a first opening 91 and a second opening 92.
  • the first opening 91 is configured to communicate with the outside
  • the second opening 92 is configured to communicate with the first heat dissipation channel 7a and the second heat dissipation channel 7b.
  • gas convection can be formed at the cavity 9, so that the heat generated by part of the LED chip 311 can be taken away, and on the other hand, the outside air enters the interior of the LED lamp through the cavity 9. This can increase the convection effect and improve the heat dissipation efficiency for the first heat dissipation channel 7a and the second heat dissipation channel 7b.
  • the arrangement of the inner reflective surface 4301 and the outer reflective surface 4302 may be omitted, that is, a cavity 9 is formed between the light output surface 43 and the light panel 3.
  • a hole is formed in the light output surface 43 to form the first opening 91.
  • the first opening 91 is opened at an edge position radially outward of the light output surface 43. It does not affect the light transmission effect of the light output surface 43.
  • the light output surface 43 may be thermally deformed when heated by the LED lamp, and the first opening 91 is disposed such that the light output surface 43 has a deformable space at the first opening 91, preventing the light output surface 43 from being formed.
  • the heat sink is pressed by thermal deformation, causing damage to the light output surface 43.
  • the first opening 91 is provided in the circumferential direction of the light output surface 43 in a plurality. Thereby, on the one hand, the convection of the air can be increased, and on the other hand, the structural strength when the light output surface 43 is heated can be further improved.
  • the inner reflective surface 4301 is provided with a notch to form the second opening 92 described above.
  • the second opening 92 is provided in the circumferential direction of the inner reflection surface 4301.
  • the relationship between the number of the second openings 92 and the number of the first openings 91 is substantially such that the ratio of the number of the second openings 92 to the number of the first openings 91 is 1:1 to 2, preferably 1:1.5. In this way, a balance can be formed between the incoming and outgoing air.
  • the first opening 91 and the second opening 92 may also be formed on other components of the globe 4, such as the light panel 3 or the heat sink base 13 of the heat sink 1.
  • a cavity 9 is formed between the lamp cover 4 and the lamp plate 3 , specifically, the light output surface 43 , the inner reflection surface 4301 , the outer reflection surface 4302 , and the light plate 3 .
  • a cavity 9 is formed between the LED chip 311 and the cavity 9 has a pressure relief hole to prevent the temperature inside the cavity 9 from rising due to heat generated during operation of the LED chip 311. Thereby increasing the pressure.
  • the pressure relief hole may be a first opening 91 formed on the light output surface 43 or a second opening 92 disposed on the inner reflection surface 4301, or may be a corresponding cavity formed on the light board 3 or the heat sink 1.
  • the holes connected to the body 9 can be as long as the pressure release effect can be achieved.
  • the light output surface 43 is gradually increased in the radially outward direction of the LED lamp from the LED lamp panel 3, so that the light output surface 43 is concave.
  • the structural strength of the light output surface 43 is improved compared to the flat surface, and in addition, the light output surface 43 does not generate an angle by the smooth transition mode described above, and thus the light output surface 43
  • the thickness is relatively uniform and thus does not affect the light output.
  • the light panel 3 generates heat due to the light source when the LED lamp is in operation, and if the light output surface 43 is a flat surface and parallel to the horizontal plane (in the use state of the hanging installation), the light output When the surface is heated, it expands horizontally outward, and thus may be crushed by the heat sink 1 to be broken.
  • the light output surface 43 is concave, when the lamp cover 4 is thermally expanded, the direction of expansion thereof is changed (in the use state of the hanging installation, if the light output surface 43 is a flat surface, the light is heated, The output surface 43 is mainly expanded in the horizontal direction.
  • the expansion direction is decomposed into a horizontal portion and a downward portion), which will reduce the expansion of the lamp cover 4 in the horizontal outward direction, thereby preventing the lamp cover 4 from being affected by the cover 4
  • the radiator 1 is crushed and broken.
  • the light output surface 43 may also be disposed as a flat surface, but it is necessary to consider the thermal expansion coefficient of the material of the output surface 43, the distance between the light output surface 43 and the heat sink 1, and The resistance to deformation of the light output surface 43.
  • the light output surface 43 is a flat surface
  • the light output surface 43 and the heat sink 1 may be radially spaced apart to ensure that they are not pressed by the heat sink 1 due to the expansion of the light output surface 43.
  • the light output surface 43 is provided with an optical coating, such as a diffusion film 431 disposed on the light output surface 43, and the light generated by the LED chip 311 passes through the diffusion film 431 and exits the lamp cover 4.
  • the diffusion film 431 acts to diffuse the light emitted from the LED chip 311.
  • the diffusion film 431 can be arranged in various forms, for example, the diffusion film can be Coating or covering the inner surface of the light output surface 43 (as shown in Figure 13a), or a diffusion coating applied to the surface of the LED chip 311 (as shown in Figure 13b), or as a cover (or Covering the diffusion film outside the LED chip 311 (as shown in Figure 13c).
  • FIG. 14 is a schematic view of the cooperation of the lamp cover 4 and the lamp plate 3.
  • the light output surface 43 is provided with an anti-reflection coating 432 on the side close to the LED chip 311, that is, the inner side of the light output surface 43, which can reduce the light output of the LED chip 311.
  • the reflection of the surface 43 increases the light transmission rate at the light output surface 43.
  • the anti-reflective coating 432 in this embodiment has a refractive index between air and glass.
  • the anti-reflective coating 432 includes a metal oxide in an amount of from 1% to 99% of the anti-reflective coating 432 material and a reflectance of the anti-reflective coating 432 of less than 2%.
  • the metal oxide in this embodiment may be zirconia, tin oxide, tin oxide, aluminum oxide or the like.
  • the diffusion film 431 and the anti-reflective coating 432 described above may be used at the same time or alternatively. Specifically, it can be selected according to the actual light demand.
  • Figure 15 shows a schematic view of the end face 44 of the lampshade 4 in this embodiment.
  • the ratio of the total cross-sectional area of the vent hole 41 to the entire area of the end surface 44 is 0.01 to 0.7, preferably, the vent hole 41
  • the ratio of the total cross-sectional area to the entire area of the end surface 44 is 0.3 to 0.6, and more preferably, the ratio of the total cross-sectional area of the vent hole 41 to the entire area of the end surface 44 is 0.4 to 0.55, by the area of the vent hole 41 and the end surface 44.
  • the ratio of the area is limited to the above range, and on the one hand, the amount of intake of the vent hole 41 can be ensured, and on the other hand, the area of the vent hole 41 can be ensured to be adjusted while ensuring the structural strength of the end face 44.
  • the ratio of the area of the vent hole 41 to the area of the end surface 44 is 0.4 to 0.55, the amount of intake air of the vent hole 41 can be ensured to meet the heat dissipation requirement of the LED lamp, and the vent hole 41 is not affected to the end surface 44.
  • the structural strength prevents the end face 44 from being easily broken by collision or squeezing after the vent hole 41 is opened.
  • Figure 16 shows a schematic view of the end face 44 of the lampshade 4 in other embodiments.
  • Figure 17 shows a schematic view of the other direction of the end face 44 of Figure 16 .
  • the vent hole 41 has an increased thickness at the edge thereof to form the rib 411, and the air guiding port 412 is formed between the adjacent ribs 411 in the intake direction of the vent hole 41.
  • the vent hole 41 has an increased thickness at the edge of the vent hole 41.
  • the structural strength of the end surface 44 can be increased to prevent the reduction of the overall structural strength due to the opening of the vent hole 41, and on the other hand, the air guiding opening 412 formed therein has an air guiding effect.
  • the function is to have a certain directivity by the action of the air guiding port 412 when the air enters. Further, when the end surface 44 is formed, the influence of the strength of the end surface 44 due to the opening of the vent hole 41 is reduced by the presence of the rib portion 411, and therefore, the end surface 44 is not easily deformed by the presence of the vent hole 41. Can increase the yield of production.
  • the rib 411 is formed on the side of the end surface 44 close to the lamp panel 3.
  • the edge of the vent hole 41 is increased in thickness larger than the thickness at the remaining positions of the end face 44. Thereby, the strength at the vent hole 41 and the wind guiding effect can be further increased.
  • the vent hole 41 has a maximum inscribed circle diameter of less than 2 mm, preferably 1 to 1.9 mm. In this way, on the one hand, insects can be prevented from entering, and most of the dust can be prevented from passing. On the other hand, the venting holes 41 can maintain a good gas circulation efficiency.
  • the vent hole 41 may define a length direction and a width direction, that is, the vent hole has a length and a width, the length dimension is larger than the width dimension, and the width of the vent hole at the widest point is less than 2 mm, in an embodiment. The width at the widest point is 1mm to 1.9mm. Further, the width of the vent hole 41 at the maximum is larger than 1 mm, and if it is less than 1 mm, the air requires more pressure to enter the vent hole 41, and thus it is disadvantageous for air circulation.
  • Figures 18a through 18g show the shape of various venting holes 41 in some embodiments.
  • the vent hole 41 may have a shape of a combination of one or more of a circular shape, an elongated shape, an arc shape, a trapezoidal shape, and a rhombic shape.
  • a circular shape As shown in FIGS. 12a to 12g, in particular, the vent hole 41 may have a shape of a combination of one or more of a circular shape, an elongated shape, an arc shape, a trapezoidal shape, and a rhombic shape.
  • Fig. 18a if the vent hole 41 is circular, its diameter is less than 2 mm to prevent insects from entering, to prevent most of the dust from passing, and to maintain a good gas circulation efficiency.
  • Fig. 18b and Fig. 18c if the vent hole 41 is formed in an elongated shape or an arc shape, its width is less than 2 mm to achieve the above technical effect.
  • the vent hole 11d is trapezoidal, the lower bottom thereof is less than 2 mm to achieve the above technical effect.
  • the vent hole 41 is a rounded rectangle, the width is less than 2 mm to achieve the above technical effect.
  • the vent hole 41 may also be in the shape of a triangle or a teardrop, and its maximum inscribed circle is less than 2 mm.
  • the venting holes 41 are distributed over the end faces 44.
  • the venting holes 41 may be circumferentially distributed in a plurality of directions along the end surface 44, whereby a more uniform airflow may be entered.
  • the venting holes 41 may be distributed in the radial direction of the end surface 44.
  • the venting holes 41 can also be distributed in an asymmetrical manner.
  • the vent hole 41 in the axial direction of the LED lamp, may also be disposed to be inclined to the axial direction of the LED lamp, that is, the axis of the vent hole 41 may form a clip with the axial direction of the LED lamp. angle. As shown in Fig. 18h, at least a portion of the vent hole 41 has an axis inclined to the axis of the LED lamp, and the oblique direction of the portion of the vent hole 41 is toward the first air inlet hole 2201 of the first heat dissipation path 7a, and therefore, the air passes.
  • the first venting opening 2201 of the first heat dissipating passage 7a is convected to facilitate more air entering the first heat dissipating passage 7a and dissipating heat from the power source 6 therein. As shown in Fig.
  • vent hole 41 is inclined to the axis of the LED lamp, and the direction of inclination of the portion of the vent hole 41 is toward the second intake hole 1301 of the first heat dissipating passage 7b, so that air passes through
  • the vent hole 41 is partially convected toward the second air inlet hole 1301 of the second heat dissipation channel 7b, more air is allowed to enter the second heat dissipation channel 7b, thereby dissipating heat to the heat sink 1.
  • the end face 44 has two broken lines
  • the dotted line of the inner ring represents the position where the first air inlet hole 2201 is projected to the end surface 44
  • the area inside the dotted line of the inner ring is the first portion (the first opening)
  • the area between the outer ring and the inner ring is the second portion (the second opening area 434).
  • the first air inlet hole 2201 is projected onto the area occupied by the end surface 44 in the axial direction of the LED lamp.
  • a first portion (first opening region 433) is formed, and other regions on the end surface 44 form a second portion (second opening region 434), the area of the vent hole 41 on the first portion being larger than the area of the vent hole 41 in the second portion .
  • This arrangement facilitates the passage of most of the air into the first heat dissipation passage 7a, thereby better dissipating heat from the power source 5, preventing the electronic components of the power source 5 from being heated and accelerating aging.
  • the above features are equally applicable to the vent holes 41 in the other embodiments described above.
  • the first air intake hole 2201 is projected onto the area occupied by the end surface 44 in the axial direction of the LED lamp to form a first portion (first open area 433), and the other area on the end surface 44 forms a second portion (first The two open areas 434) have an area of the venting holes 41 on the first portion smaller than the area of the venting holes 41 in the second portion. Therefore, the heat dissipation fins 11 can be better dissipated to facilitate heat dissipation of the LED chips 311 and prevent local high temperature regions from being formed at the LED chips 311. Specifically, the area of the first part and the second part can be selected according to actual heat dissipation requirements.
  • the weight limit for the entire LED light there may be a weight limit for the entire LED light.
  • the maximum weight of the LED lamp is limited to 1.7 kg.
  • the weight of the heat sink is limited to within 1.2 kilograms.
  • the power is 150W ⁇ 300W, and the lumens can reach 20,000 lumens to 45000 lumens, that is, the heat sink needs to dissipate the LED from 20,000 to 45000 lumens within its weight limit. The heat generated by the lamp.
  • the power of 1W generally requires a heat dissipation area of more than 35 square centimeters.
  • the following embodiments are designed to reduce the heat dissipation area required for 1 W power while ensuring the installation space and heat dissipation effect of the power source 5, thereby achieving the best under the premise of the weight limit of the heat sink 1 and the limitation of the power source 5. heat radiation.
  • the LED includes or only a passive heat dissipating component, and the passive heat dissipating component uses only the main methods of natural convection and radiation to dissipate heat, and does not adopt an active heat dissipating component, such as a fan.
  • the passive heat dissipating component in this embodiment includes a heat sink 1 including a heat dissipating fin 11 and a heat dissipating base 13 .
  • the heat dissipating fins 11 are radially distributed uniformly along the circumferential direction of the heat dissipating base and connected to the heat dissipating base 13 .
  • the heat generated by the LED chip 311 conducts at least a portion of the heat to the heat sink 1 in a thermally conductive manner, and at least a portion of the heat of the heat sink 1 is dissipated into the outside air by heat radiation and convection.
  • the diameter of the outer contour of the radiator 1 in the radial direction is upward in the height direction, the diameter of the outer contour decreases or substantially decreases. This can be better matched with the luminaire.
  • the heat sink 1 in this embodiment dissipates heat, at least part of the heat is radiated by heat radiation to the surrounding air.
  • the important factor affecting thermal radiation is the emissivity or emissivity of the object itself.
  • the surface of the heat sink 1 in the embodiment is correspondingly processed.
  • a radiation heat dissipating paint or an electrophoretic coating is disposed on the surface of the heat sink 1 to improve the efficiency of radiating heat dissipation.
  • the heat of the heat sink 1 is quickly dissipated, or a nanostructured porous alumina layer is formed on the surface of the heat dissipation fin 11 by anodization in the electrolyte, so that a layer can be formed on the surface of the heat dissipation fin 11
  • the alumina nanopore enhances the heat dissipation capability of the heat sink without increasing the number of the heat dissipation fins 11.
  • the surface of the heat dissipation fin 11 is coated with a heat radiation resistant layer to reduce the heat dissipation fins 11 and the heat dissipation fins 11
  • the heat radiation between the heat sink fins 11 is more radiated into the air, and the heat radiation resistant layer can be painted or oxidized, and the paint can be made of ordinary paint or radiation heat sink.
  • the heat sink 1 of some embodiments includes the following components by mass: 0.5 to 0.7 parts of silicon, 0.5 to 0.6 parts of iron, 0.05 to 0.3 of copper, and 0.3 to 0.7 of manganese.
  • the heat sink 1 can be made of a material having a low thermal resistance/high thermal conductivity, such as an aluminum alloy.
  • other alloys, such as AL 1100, etc. may still be used.
  • a die cast alloy having thermal conductivity is used.
  • the heat sink 1 can include other metals such as copper.
  • Figure 19a is a schematic cross-sectional view of a heat sink 1 in some embodiments.
  • the heat sink 1 has a heat dissipating post 12 added to the heat sink 1 in the embodiment.
  • the heat sink 1 includes a heat dissipating post 12, a heat dissipating fin 11 and a heat dissipating base 13.
  • the heat dissipating post 12 is connected to the heat dissipating base 13 .
  • the heat dissipating fins 11 are disposed on the outer circumference of the heat dissipating post 12 and are radially evenly distributed.
  • the root of the heat dissipating fin 11 is connected to the heat dissipating base 13 on the outer circumference of the heat dissipating post 12 .
  • the arrangement of the heat dissipating post 12 supports the heat dissipating fins 11 to prevent the heat dissipating fins 11 from being deflected during processing.
  • the heat dissipation column 12 or the heat dissipation base 13 transmits the heat generated by the LED chip 311 to the heat dissipation fins 11 , and the heat dissipation column 12 has a hollow structure with openings at both ends, for example, the heat dissipation column 12 has a cylindrical structure;
  • the material of the column 12 is selected to be compatible with the heat sink 1, and is preferably made of a material having good thermal conductivity, for example, an aluminum alloy material, so that the heat sink 1 can achieve a light weight and a low cost.
  • the material of the heat dissipation column 12 may also be made of copper to enhance the heat conduction performance of the heat sink 1 and achieve the effect of heat transfer and heat dissipation.
  • the inner sidewall of the heat dissipation column 12 may be provided with a heat conducting layer having a thickness of 0.1 mm to 0.5 mm to further enhance the heat dissipation effect.
  • the specific surface area of the heat dissipation fins 11 is 4 to 10 times, preferably 6 to 8 times the specific surface area of the heat dissipation column 12.
  • Figure 19b is a top plan view of an LED lamp employing the heat sink of Figure 19a. As shown in FIG.
  • the bottom inner diameter r of the heat dissipation column 12 may be 10-15 mm, that is, the distance between the central axis XX of the heat dissipation column and the inner surface of the heat dissipation column may be 10-15 mm. Since the outer surface of the heat dissipation column has a radial distribution of the heat dissipation fins, the inner diameter R of the circumference of the heat dissipation fin may be greater than or equal to 15 to less than 20 mm, that is, the distance from the edge of the heat dissipation fin to the central axis of the heat sink is Greater than or equal to 15 to less than 20 mm.
  • the inner diameter defined by the fins may be the same or different from the bottom to the top of the heat sink. That is, the length (ie, Rr) of each of the fins extending toward the central axis XX of the heat sink may be fixed along the height direction of the heat sink 1, or may vary along the height direction of the heat sink 1.
  • the length of each of the heat dissipation fins 11 extending along the inner surface of the heat sink 1 may be the same or different, that is, the length of each of the heat dissipation fins 11 may be equal in length or unequal length.
  • Each of the heat dissipation fins 11 may extend in a direction parallel to the central axis of the heat sink 1 along the inner surface of the heat sink 1, or may spirally extend along the inner surface of the heat sink 1.
  • the heat dissipation base 13 of the heat sink 1 has a lower end surface 133, and the lower end surface 133 is located on the other side of the heat dissipation base 13 opposite to the heat dissipation fin 11, that is, the lower end surface 133 and The light panels 3 are located on the same side.
  • the lower end surface 133 extends beyond the lamp panel 3 in the axial direction of the LED lamp, that is, in the state of use, when the lamp panel 3 is disposed downward, the position of the lower end surface 133 is lower than the position of the lamp panel 3.
  • the heat dissipation base 13 has a recessed portion 132, and the light board 3 is placed in the recessed area 132.
  • the recessed area 132 is a cylindrical or substantially cylindrical structure, or a truncated cone structure, if It is a cylindrical structure, and the diameter of the cylinder is smaller than the diameter of the heat dissipation base 13.
  • the provision of the recessed area 132 in the heat dissipation base 13 helps to reduce the glare effect of the LED lamp and enhance the user's direct vision and comfort in using the product (the inner side wall of the recessed area 132 blocks at least a part of the LED).
  • the heat dissipation base 13 may not have a recessed area.
  • the surface of the heat dissipation base 13 is preferably a flat surface.
  • Figure 20 is a cross-sectional view of the LED lamp with the lamp cover removed in some embodiments.
  • the lower end surface 133 is disposed as an inclined surface (inclining relative to the horizontal plane when the LED lamp is vertically suspended), and is inclined when the inclined surface is inclined in a straight position in the radial direction of the LED lamp.
  • the angle between the face and the horizontal plane is 3 to 4 degrees, and in other embodiments, the included angle is greater than 0 degrees and less than or equal to 6 degrees.
  • the angle between the tangent plane of the curved surface and the horizontal plane is 3 to 4 degrees, and in other embodiments, the angle is greater than 0 degrees and less than or equal to 6 degrees.
  • the lower end surface 133 is inclined at a certain angle (for example, when the angle between the end surface 133 and the outer reflection surface 4302 is 120 degrees to 180 degrees), it can serve as an extension of the outer reflection surface 4302 to provide a certain reflection effect.
  • FIG. 21 is a perspective view of the LED lamp of the embodiment.
  • the heat dissipation base 13 of the heat sink 1 has a back surface 134 on the other side of the lower end surface 133, and one end of the heat dissipation fin 11 extends to abut the back surface 134. Therefore, the heat dissipation fins 11 are at least A portion extends beyond the LED panel 3 in the axial direction. In other words, in the axial direction of the LED lamp, the heat dissipating fin 11 forms an extension portion 1101 at a position between the back surface 134 of the heat dissipation base 13 and the lamp panel 3.
  • the heat dissipation area of the heat dissipation fins 11 can be increased, and the heat dissipation effect can be improved.
  • the arrangement of the extension portion 1101 does not additionally increase the overall height of the LED lamps, thereby facilitating control of the overall height of the LED lamps.
  • Figure 22 is a cross-sectional view of the LED lamp in the present embodiment.
  • the back surface 134 of the heat dissipation base 13 is inclined, that is, in the hanging state of the LED lamp, the back surface 134 is inclined upward in the radial inward direction of the LED lamp.
  • the distance from the back surface 134 to the lamp panel 3 in the axial direction of the LED lamp gradually increases in the direction toward the axis of the LED.
  • Such an arrangement facilitates the introduction of convective air along the back side 134 to remove heat from the back side 134, preventing the back side 134 from impeding the entry of air.
  • the lower end surface 133 defines an accommodating space (recessed area 132).
  • the lamp cover 4 is placed in the accommodating space, and the height of the lamp cover 4 does not exceed after the lamp cover is placed in the accommodating space.
  • the height of the LED lamp substantially includes the height of the lamp housing 2, the height of the heat sink 1, and the height of the lamp cover 4.
  • the position of the lamp cover 4 is not more than the lower end surface 133 of the heat sink 1, and the height of the whole lamp can be controlled. Therefore, the setting of the lampshade 4 does not additionally increase the height of the whole lamp.
  • the heat sink 1 additionally increases its heat dissipating portion (the portion where the lower end surface 133 is located opposite to the lamp plate 3) .
  • the cover 4 can also be partially extended beyond the lower end surface 133.
  • the end surface 44 is spaced apart from the lamp plate 3 to form a cavity 8 which is respectively associated with the first air inlet 2201 and the second heat dissipation hole of the first heat dissipation passage 7a.
  • the second intake hole 1301 of the passage 7b communicates, and the air enters the cavity 8 from the vent hole 41 of the end surface 44, and enters the first heat dissipation passage 7a and the second heat dissipation passage 7b.
  • the cavity 8 is arranged such that after the air enters, there is a process of mixing in the cavity, and then according to the negative pressure of the first heat dissipation passage 7a and the second heat dissipation passage 7b (the negative pressure due to the temperature difference). Distribution makes the distribution of airflow more reasonable.
  • the ratio of the power (watt) of the LED lamp to the heat dissipation area (square centimeter) of the heat sink 1 is between 1:20 and 30, that is, Each watt requires a heat dissipation area of 20 square centimeters to 30 square centimeters for heat dissipation.
  • the ratio of the power of the LED lamp to the heat dissipation area of the heat sink 1 is between 1:22 and 26. More preferably, the ratio of the power of the LED lamp to the heat dissipation area of the heat sink 1 is 25.
  • a first heat dissipation passage 7a is formed in the inner cavity of the lamp housing 2, and the first heat dissipation passage 7a has a first air inlet hole 2201 at one end of the lamp housing 2, and the opposite end of the lamp housing 2 has a heat dissipation hole 222. Air enters from the air intake hole 2201 and is discharged from the heat dissipation hole 222, whereby the heat in the first heat dissipation passage 7a can be taken away.
  • a heat dissipation fin 11 and a heat dissipation base 13 form a second heat dissipation passage 7b.
  • the second heat dissipation passage 7b has a second air inlet hole 1301.
  • the second heat dissipation passage 7b passes through the second heat dissipation passage 7b.
  • the space between the fins 11 flows out. Thereby, the heat radiated by the heat dissipation fins 11 to the surrounding air can be taken away, and the heat dissipation of the heat dissipation fins 11 can be accelerated.
  • the efficiency of natural convection is increased, so that the corresponding required heat dissipation area of the heat sink 1 is reduced, and the ratio of the power of the LED lamp to the heat dissipation area of the heat sink 1 is made. Between 20 and 30.
  • the LED chip 311 when the weight of the LED lamp is less than 1.7 kg, and the LED lamp is supplied with about 200 W (300 W or less, preferably, 250 W or less) of electric energy, the LED chip 311 is illuminated and emits at least 25000 lumens of luminous flux.
  • the weight of the heat sink 1 in this embodiment accounts for more than 50% of the weight of the LED lamp. In some embodiments, the weight of the heat sink 1 accounts for 55-65% of the weight of the LED lamp. The volume of the heat sink 1 accounts for more than 20% of the total volume of the LED lamp.
  • the heat conductivity of the heat sink 1 is the same (that is, the heat sink 1 is entirely made of the same material, or the two thermal conductivity coefficients tend to be the same) Different materials)
  • the larger the volume occupied by the heat sink 1 the larger the area that can be used as heat dissipation.
  • the heat sink 1 can have more available space to increase its heat dissipation area.
  • the volume of the heat sink 1 accounts for 20% to 60% of the total volume of the LED lamp. More preferably, the volume of the heat sink 1 occupies the LED.
  • the overall volume of the lamp is 25% to 50%. Therefore, when the overall size of the LED lamp is limited, and the installation space of the power source 5, the lamp cover 4 and the lamp housing 2 needs to be ensured, the volume of the heat sink 1 is maximized, which is more conducive to the LED.
  • Figure 23 is a plan view of the heat sink 1 in the present embodiment. As shown in FIG. 23, at least a part of the heat dissipation fins 11 protrudes from the radial direction of the LED lamp by at least two portions of the heat sink 1 under the limitation of the above volume, and the two sheets are spaced apart.
  • the heat dissipating fins 11 have a larger heat dissipating area in a fixed space, and in addition, the two extending bodies support the heat dissipating fins 11 to make the heat dissipating fins
  • the sheet 11 is more stably supported on the heat dissipation base 13 to prevent the heat dissipation fins 11 from being deflected.
  • the heat dissipation fins 11 include first heat dissipation fins 111 and second heat dissipation fins 112, and the first heat dissipation fins 111 and the second heat dissipation fins 112 are at the bottom of the LED light axis.
  • the first heat dissipation fins 111 and the second heat dissipation fins 112 are spaced apart from each other.
  • the shape of the second heat dissipation fin 112 is a Y shape divided into two, and the second heat dissipation fin 112 is configured to be divided into two, so that the heat sink 1 has more of the same volume. Cooling area.
  • the first heat dissipation fins 111 and the second heat dissipation fins 112 are spaced apart from each other, and the first heat dissipation fins 111 are evenly distributed on the circumference, and the second heat dissipation fins 112 are evenly distributed on the circumference, adjacent to each other.
  • the two second heat dissipation fins 112 are symmetrically disposed by a first heat dissipation fin 111.
  • the distance between the first heat dissipation fin 111 and the second heat dissipation fin 112 is 8 to 12 mm.
  • the air in the heat sink 1 is smoothly circulated, so that the heat sink 1 can maximize heat dissipation. The effect is that the spacing between the heat-dissipating fins is designed to be uniform.
  • Figure 27 is a front elevational view of an LED lamp in some embodiments.
  • the heat dissipation fin 11 is divided into two parts in the radial direction of the LED lamp, that is, the curvature of the first portion 111a is smaller than that of the second portion 111b, and the curvature of the first portion 111a is smaller than that of the second portion 111b (this The curvature at the point refers to its curvature in the outline of the LED light).
  • the first portion 111a has a curvature greater than or equal to the second portion 111b.
  • Figure 28 is a front elevational view of an LED lamp in some embodiments.
  • the heat dissipating strips 16 are disposed on two sides of the heat dissipating fins 11, wherein the heat dissipating strips 16 on one side are located between the adjacent two heat dissipating strips 16 on the other side, that is, the heat dissipating on both sides.
  • Strips 16 do not overlap in the lateral projection direction. In this embodiment, the distance between two adjacent heat dissipation strips 16 on one side is equal to the distance between two adjacent heat dissipation strips 16 on the other side.
  • the arrangement of the heat dissipation strips 16 can increase the surface area of the heat dissipation fins 11 as a whole, so that the heat dissipation fins 11 have more area for heat radiation, thereby improving the heat dissipation performance of the heat sink 1.
  • the surface of the heat dissipation fins 11 may be arranged in a wave shape.
  • At least one heat dissipating fin 11 is divided into two portions in the radial direction of the LED lamp, and the two portions are spaced apart, whereby a flow path can be formed at the interval so that air can be at the interval Convection.
  • the position of the interval corresponds to the area where the LED chip 311 is disposed on the lamp board 3, and thus the increased convection here can be The heat dissipation effect on the LED chip 311 is improved.
  • the heat dissipating fins 11 are arranged at intervals, the amount of the heat dissipating fins 11 is reduced, the overall weight of the heat sink 1 is reduced, and other components of the LED lamp are provided. space.
  • the heat dissipation fins 11 may not have the above-described spacing, that is, the heat dissipation fins 11 have an integral structure in the radial direction of the LED lamps.
  • FIG. 24 is an enlarged schematic view of the portion E in Figure 23.
  • the heat dissipation fin 11 includes a first heat dissipation fin 111 and a second heat dissipation fin 111 , and the first heat dissipation fin 111 is divided into two parts in the radial direction of the LED lamp, that is, The first portion 111a and the second portion 111b, and the two portions are spaced apart in the radial direction of the LED lamp, forming a spacer 111c at the interval.
  • the first portion 111a is located radially inside the second portion 111b.
  • the second heat dissipation fin 112 has a third portion 112a extending from the third portion 112a, and a fourth portion 112b changing in position in the circumferential direction from the third portion 112a, and the fourth portion 112b
  • the third portion 112a is located outside the radial direction of the heat sink 1 to improve space utilization, thereby having more heat-dissipating fins 11 area.
  • the third portion 112a and the fourth portion 112b are connected by a transition portion 113 having a buffer portion 113a and a guiding portion 113b, and the buffer portion 113a and the guiding portion 113b are both arc-shaped, and both form " S" or inverted "S" shape.
  • the buffer section 113a is disposed so as to avoid eddy current when the air convects radially outward on the surface of the second heat radiation fin 112 as shown in FIG. 25, thereby obstructing the convection, and the guiding section 113b guides the convection air to continue. It flows radially outward along the surface of the second heat radiation fin 112.
  • a second heat dissipation fin 112 includes a third portion 112a and two second portions 112b.
  • the two fourth portions 112b are symmetrically disposed with the third portion 112a as an axis of symmetry.
  • a second heat sink fin 112 may also include a third portion 112a and a plurality of fourth portions 112b, such as three or four fourth portions 112b (not shown), and the second heat sink fins.
  • the fourth portion 112b of the sheet 112 on both sides in the circumferential direction of the LED lamp is adjacent to the first heat radiation fin 111.
  • the direction in which any tangential line of the guiding segment 113b is directed is shifted from the spacing portion 111c to prevent convective air from being guided through the guiding portion 113b and entering the spacer portion 111c, so that the convection path becomes long and the heat dissipation efficiency is affected.
  • the direction in which any tangent of the guiding section 113b is directed is located outside the radial direction of the spacer 111c. In other embodiments, at least a portion of the tangent to the guide segment 113b is directed in a direction radially inward of the spacer 111c.
  • the direction in which at least a portion of the tangential line of the guiding segment 113b is directed falls into the spacing region 111c to make convection more sufficient, but correspondingly increases the convective path.
  • the heat dissipation fin 11 has a convex portion 1102 which is convex with respect to the surface of the heat dissipation fin 11, and the convex portion 1102 extends in the axial direction of the lamp and contacts the heat sink seat 13.
  • the surface of the raised portion 1102 may alternatively take the form of a circumferential surface or a regular or irregular polygonal cylinder.
  • the arrangement of the protrusions 1102 can increase the surface area of the heat dissipation fins 11 and increase the heat dissipation efficiency.
  • the protrusions 1102 also support the heat dissipation fins 11 to prevent the position of the heat dissipation fins 11 from being deflected during processing.
  • the same heat dissipation fin 11 is divided into two portions in the radial direction of the LED lamp, and each portion is provided with at least one corresponding protrusion portion 1102 to serve both portions. Supporting role.
  • the boss portion 1102 is disposed at an end portion of the heat dissipation fin 11 in the radial direction of the LED lamp, for example, at an end portion of the first portions 111a and 111b (near the end of the spacer portion 111c).
  • the protrusions 1102 may also be disposed on the surface of the heat dissipating fins 11 (not shown) to increase the fins 11 .
  • the surface area acts as a support for the heat dissipation fins 11 to prevent the position of the heat dissipation fins 11 from being deflected during processing.
  • Figure 29 is a bottom plan view of the LED lamp of Figure 1 with the lamp cover 4 removed.
  • Figure 30 is an enlarged view of A in Figure 29.
  • the heat sink 1 is sleeved on the outer periphery of the inner sleeve 21 in the radial direction, and the inner side wall of the heat dissipation fin 11 in the radial direction of the LED lamp is spaced from the inner sleeve 21 of the lamp housing 2, such that
  • the inner sleeve is thermally expanded and is damaged by the inner side wall of the heat dissipation fin 11 , and on the other hand, the inner side wall of the heat dissipation fin 11 is prevented from directly contacting the inner sleeve 21 to form heat conduction.
  • the heat of the heat dissipation fins 11 is conducted to the inside of the inner sleeve 21, thereby affecting the electronic components of the power source 5 in the lamp housing 2.
  • the inner side walls of the heat dissipation fins 11 in the radial direction of the LED lamp and the inner sleeve of the lamp housing 2 There is air in the space, and the air itself has an insulating effect, thereby further preventing the heat of the heat sink 1 from affecting the power source 5 in the inner casing 21.
  • a radial inner side wall of a part of the heat dissipating fins 11 may be disposed to contact and support the outer peripheral surface of the inner sleeve 21, and a part thereof.
  • the heat dissipating fins 11 are spaced from the inner sleeve 21, and the design can be applied to the LED lamp of FIG. As shown in FIG. 29, the lamp panel 3 includes a third opening 32 to expose the first intake aperture 2201 and the second intake aperture 1301.
  • the ratio of the cross-sectional area of the first air intake hole 2201 to the cross-sectional area of the second air intake hole 1301 is greater than 1 and less than or equal to 2. In some embodiments, in order to quickly discharge thermal energy generated by the LEDs of the light plate 3, the ratio of the cross-sectional area of the second air intake holes 1301 to the cross-sectional area of the first air intake holes 2201 is greater than 1 and less than or equal to 1.5.
  • the innermost position of the heat dissipation fin 11 in the radial direction of the LED lamp is located further outside the heat dissipation hole 222 in the radial direction of the LED lamp, that is, the heat dissipation fin 11 is at the LED.
  • the innermost portion of the lamp in the radial direction and the position of the heat dissipation hole 222 are spaced apart in the radial direction of the LED lamp.
  • the convection speed affecting the first heat dissipation passage 7a (the convection speed depends on the temperature difference between the two sides of the first heat dissipation passage 7a, and when the temperature near the heat dissipation hole 222 rises, the convection speed is correspondingly slowed down).
  • Figure 31 is a cross-sectional view of the LED lamp in the present embodiment.
  • Figure 32 is an enlarged view of the portion C in Figure 31.
  • the heat sink 1 includes a heat dissipation fin 11 and a heat dissipation base 13 having a convex portion 135.
  • the convex portion 135 is disposed downward in the axial direction of the LED lamp, and the convex portion 135 is at the LED.
  • the lamp axially exceeds the lamp plate 3, and the lowermost position (lower end surface 133) of the convex portion 135 substantially coincides with the height of the light output surface 43 of the globe 4 (in the axial direction of the LED lamp), or the convex portion 135
  • the lowermost portion slightly exceeds the light output surface 43 of the lampshade 4, for example, the lowermost portion of the convex portion 135 exceeds the light output surface 43 of the lamp cover 4 by about 1 to 10 mm, so that the heat sink 1 does not change in the overall height dimension of the LED lamp.
  • the volume is increased so that the heat dissipation fins 11 and the heat dissipation base 13 have a larger heat dissipation area.
  • the convex portion 135 in this embodiment is disposed in an annular shape, and together with the heat dissipation base 13 defines a concave structure.
  • the light source and the lamp cover 4 are disposed in the concave structure, and protect the light source and the lamp cover 4, and
  • the concave structure acts to prevent glare (the concave structure blocks the lateral light of the light source).
  • the heat dissipation base 13 has a first inner surface 136
  • the lamp cover 4 has an outer peripheral wall 45.
  • the first inner surface 136 corresponds to the outer peripheral wall 45 of the lamp cover 4 (the cover 4 diameter)
  • the outer side of the outer surface 136 is spaced apart from the outer peripheral wall 45 to prevent the lamp cover 4 from being thermally expanded due to heat generation when the LED lamp is in operation, thereby being crushed by the first inner surface 136.
  • a portion of the outer peripheral wall 45 of the globe 4 is in contact with the first inner surface 136 such that the first inner surface 136 supports the radial direction of the globe 4 and the outer peripheral wall of the globe 4 The other portion of 45 then maintains a gap with the first inner surface 136.
  • the first inner surface 136 is disposed as an inclined surface which is maintained at a certain angle with the lamp panel 3, and the angle may be an obtuse angle. Therefore, when the lamp cover 4 is thermally expanded, when the outer peripheral wall 45 abuts against the inclined surface, the pressing force of the first inner surface 136 to the radially outer side of the globe 4 is decomposed into a downward component and a horizontal component. It helps to reduce the pressing of the lampshade 4 in the horizontal direction (squeezing in the horizontal direction, which is the main cause of the breakage of the lampshade 4).
  • the circumferential surface of the peripheral wall 45 can be abutted on the first inner surface 136 (not shown), thereby supporting or limiting the lamp cover 4, and since the first inner surface 136 is inclined Therefore, the probability that the lamp cover 4 is broken due to the thermal expansion is reduced, and the end portion of the outer peripheral wall 45 can be abutted on the first inner surface 136, thereby reducing the overall outer peripheral wall 45 and the heat dissipation base. 13 contact area to avoid excessive heat transfer.
  • the heat dissipation base 13 further has a second inner surface 137.
  • the lamp cover 4 has an outer peripheral wall 45.
  • the outer peripheral wall 45 maintains a gap with the first inner surface 136, and the end of the outer peripheral wall 45 abuts the second inner surface 137.
  • the angle between the first inner surface 136 and the lamp plate 3 is smaller than the angle between the second inner surface 137 and the lamp plate 3, that is, the second inner surface 137 is flatter than the first inner surface 136, thus
  • the end of the outer peripheral wall 45 abuts against the second inner surface 137, and the globe 4 is thermally expanded, the second inner surface 137 is less horizontally pressed against the globe 4.
  • the angle between the second inner surface 137 and the lamp plate 3 is between 120° and 150°. If the angle is too large, the lamp cover 4 cannot be effectively supported in the radial direction of the LED lamp. If the angle is too small, the function of reducing the horizontal force of the lampshade 4 after the thermal expansion of the lampshade 4 cannot be reduced, and the lampshade 4 cannot be restrained and supported in the axial direction of the LED lamp. In the interval, it is well balanced.
  • the second inner surface 137 and the first inner surface 136 may be curved, and the distance between the second inner surface 137 and the first inner surface 136 relative to the axis of the LED lamp gradually increases as it goes downward, however, In general, the second inner surface 137 is more flat than the first inner surface 136.
  • the end portion of the outer peripheral wall 45 is provided with a convex wall 451 which is spaced apart in the circumferential direction of the outer peripheral wall 45, and the convex wall 451 is a portion where the end portion of the outer peripheral wall 45 actually contacts the second inner surface 137.
  • a gap is formed between the outer peripheral wall 45 of the lamp cover 4 and the heat dissipation base 13, and a hole is formed in the heat dissipation base 13, and one side of the hole communicates with the gap, and the other side corresponds to the heat dissipation fin 11. That is, air can enter from the gap and reach the heat dissipation fins 11 through the holes, thereby increasing the convection current, and the convection path is as shown by the arrow in FIG. 32, and the convection path can form the LED lamp of the embodiment.
  • the fourth heat dissipation passage 7d is formed between the outer peripheral wall 45 of the lamp cover 4 and the heat dissipation base 13, and a hole is formed in the heat dissipation base 13, and one side of the hole communicates with the gap, and the other side corresponds to the heat dissipation fin 11. That is, air can enter from the gap and reach the heat dissipation fins 11 through the holes, thereby increasing the convection current, and the con
  • the fourth heat dissipation channel 7d may be disposed at other positions, and only needs to communicate the area between the lower portion of the LED lamp and the heat dissipation fins 11.
  • a through hole 315 is disposed between adjacent LED chip sets 31 on the light board 3, and at this time, the lamp cover 4 can be disposed in a split type, that is, includes a plurality of portions to be respectively disposed on different LED chip sets. 31, and the through hole 315 is located between the two portions of the globe 4, so that the through hole 315 communicates with the underside of the LED lamp and communicates with the space between the fins 11 above.
  • the heat sink 1 in this embodiment has an integrated structure, and therefore, it is advantageous to reduce the thermal resistance between the heat dissipation fins 11 and the heat dissipation base 13.
  • the heat dissipation fins 11 and the heat dissipation base 13 may be designed to be detachable for the convenience of processing and molding.
  • the heat dissipating fins 11 have different temperatures at different positions.
  • the portion close to the LED chip 311 is 80 ° C, and the temperature above the heat dissipating fins 11 is slightly lowered.
  • the heat dissipation amount is reduced to a few percent of the uniform temperature of the heat dissipation fins 11.
  • the efficiency of the heat dissipation fins 11 is related to the heat transfer coefficient, thickness, width, and height of the heat dissipation fins 11.
  • the thickness of the heat dissipation fins 11 is set to 0.8 to 2 mm, preferably 1 to 1.5 mm.
  • the ratio of the thickness to the length of the heat dissipation fin 11 is not less than 1:80.
  • the ratio of the thickness of the heat dissipation fin 11 to the length is not less than 1:70, and more preferably, the ratio of the thickness of the heat dissipation fin 11 to the length is 1:60 ⁇ 80.
  • the heat dissipation effect of the heat dissipation fins 11 is balanced between the weight of the entire heat sink 1 and the heat dissipation area, so that the heat dissipation fins 11 have superior efficiency.
  • the length of the heat radiating fin 11 refers to the height in the axial direction of the LED lamp.
  • the ratio of the width to the length of the heat dissipation fin 11 is set to be greater than 1:1.5.
  • the ratio of the width to the length of the heat dissipation fin 11 is greater than 1:1.3, so that the heat transfer coefficient of the heat dissipation fin 11 is better.
  • the length of the heat radiating fin 11 refers to the height in the axial direction of the LED lamp
  • the width refers to the length of the heat radiating fin 11 in the radial direction of the LED lamp. If the heat dissipating fins 11 are not in a regular directional structure, the width of the heat dissipating fins 11 may be taken as an average value, or half of the maximum value of the width plus half of the minimum value, and the length may be taken as an average value, or the maximum value of the width. Half of the plus half of the minimum.
  • h represents the heat transfer coefficient of the heat sink fins, and the unit is [W/(m 2 ⁇ °C)];
  • V represents the flow rate of convective air
  • L represents the length of the fins in the convection direction
  • the heat transfer coefficient is greatly affected by the setting condition of the heat dissipating surface.
  • the thickness (cross-sectional area) of the heat-dissipating fin 11 during heat transfer is also an important factor. The temperature of the downstream air in the airflow direction will rise, and the cooling capacity will also decrease accordingly. Therefore, on the heat dissipating fins 11 of the same area, if the heat radiating fins 11 are arranged in a short length and a wide lateral direction in the airflow direction, The heat dissipation amount is increased.
  • the height of the heat dissipation fins 11 is controlled in this embodiment, so that the heat dissipation fins 11 have more areas close to the LED chips 311 to accelerate the LED chips 311 to the heat dissipation fins. 11 heat conduction.
  • the thickness of the heat dissipation fins 11 also affects the efficiency of the heat dissipation fins 11. The greater the thickness of the heat dissipation fins 11, the higher the efficiency, but the balance weight and the heat dissipation area are required.
  • the ratio of the thickness to the length of the heat dissipation fin 11 is set to not less than 1:80, and the ratio of the width to the length of the heat dissipation fin 11 is set to be greater than 1:1.5.
  • FIGs 36a-36m are schematic illustrations of various heat sinks 10 in some embodiments that can be applied to LED lamps to replace the heat sink 1 of the LED lamps shown in Figure 1.
  • a heat sink 10 is proposed in accordance with a first preferred embodiment of the present invention.
  • the heat sink includes a first heat dissipation fin 101 and a second heat dissipation fin 102.
  • the heat sink 1 defines a first circumference R1 and a second circumference R2 projected on the heat dissipation base 130, and the second circumference R2 is larger than the first circumference R1.
  • the first heat dissipation fins 101 extend in a columnar accommodating space (the portion for accommodating the inner sleeve 21, and the columnar accommodating spaces mentioned in other embodiments below are the same as the columnar accommodating spaces of this embodiment).
  • the outer circumference of the definition does not exceed the second circumference R2.
  • the first heat dissipation fin 101 extends from the outer circumference of the cylindrical accommodation space to the first circumference R1.
  • the second heat sink fin 102 extends over the first circumference R1 but does not extend beyond the second circumference R2, for example, just to the second circumference R2.
  • the first heat dissipation fins 101 and the second heat dissipation fins 102 are alternately arranged in the circumferential direction, and each of the second heat dissipation fins 102 is symmetrically disposed by a first heat dissipation fin 101.
  • the first heat dissipation fins 101 and the second heat dissipation fins 102 have a gap between each other to allow airflow to pass through, and extend a path of airflow between the first heat dissipation fins 101 and the second heat dissipation fins 102 to increase heat dissipation.
  • a heat sink 10 is proposed in accordance with a second preferred embodiment of the present invention.
  • the heat sink 1 of the second preferred embodiment differs from the first embodiment in that the heat sink 10 further includes spaced heat dissipation fins 108 extending from the outer circumference of the cylindrical accommodation space to the second circumference R2 on the heat dissipation base 130.
  • the fins 108 are symmetrically disposed, and are symmetrically disposed with each of the second heat dissipation fins 102 at an interval of the heat dissipation fins 108.
  • a heat sink 10 is proposed in accordance with a third preferred embodiment of the present invention.
  • the heat sink 10 of the third preferred embodiment differs from the second preferred embodiment in that the heat sink 10 further includes a third heat sink fin 103, and the heat sink 10 further defines a third projected on the heat sink base 103.
  • the circumference R3 is, and the third circumference R3 is larger than the second circumference R2.
  • the first heat dissipation fins 101 extend from the outer circumference of the columnar accommodation space to the first circumference R1
  • the second heat dissipation fins 102 extend from the first circumference R1 to the second circumference R2
  • the third heat dissipation fins 103 It extends from the second circumference R2 to the third circumference R3.
  • the second heat dissipation fins 102 and the third heat dissipation fins 103 are alternately arranged in the circumferential direction, and each of the two third heat dissipation fins 103 is symmetrically disposed by a second heat dissipation fin 102.
  • the heat dissipation fin of the third preferred embodiment may be further extended to the nth fin, and n is an integer greater than two. That is, the heat dissipation base 130 defines a first circumference R1 to an nth circumference from small to large.
  • the first heat dissipation fin 101 extends from the outer circumference of the columnar accommodation space to the first circumference R1, and the nth heat dissipation fin is made of the n-1th.
  • the circumference extends to the nth circumference. In the radial direction, the n-1th fin and the nth fin are alternately arranged in the circumferential direction, and each of the nth fins is symmetrically disposed by an n-1th fin.
  • the first heat dissipation fins 101 to the nth heat dissipation fins overlap the LED light board 3 on the heat dissipation base 130 (projection in the axial direction of the LED light) to ensure the LED light board 3 to the heat dissipation fins.
  • the nth heat sink fin and the n-1th heat sink fin are not alternately arranged in the circumferential direction, that is, as shown in FIG. 36c, the outer edge of the n-1th heat sink fin does not exceed The n-1th circumference, and the nth heat sink fin extends from the n-1th circumference.
  • the outer edge of the second heat dissipation fin 102 does not exceed the second circumference R2
  • the third heat dissipation fin 103 extends from the second circumference R2 and does not exceed the third circumference R3.
  • the nth heat dissipation fin and the n-1th heat dissipation fin may be arranged in a staggered manner in the circumferential direction. That is, as shown in Fig. 36d, the outer edge of the n-1th fin is over the n-1th circumference but does not reach the nth circumference, and the nth fin is extended from the n-1th circumference. For example, the outer edge of the second heat dissipation fin 12 exceeds the second circumference R2 but does not reach the third circumference R3, and the third heat dissipation fin 13 extends from the second circumference R2.
  • the outer edge of the heat dissipation fin 11 has a circular arc shape. In other embodiments, the outer edge of the heat dissipation fin may be wavy, or the outer edge of the heat dissipation fin may be straight or stepped.
  • the heat sink 10 is proposed in the fourth preferred embodiment.
  • the heat sink 10 of the fourth embodiment differs from that of FIG. 1 in that the heat dissipation fins of the heat sink 1 , such as the first heat dissipation fins 101 , have outer side edges perpendicular to the heat dissipation base 130 and thus are perpendicular to the axial direction.
  • the first heat dissipation fins 101 are observed, and the heat dissipation fins are in a rectangular shape (rectangular or square) instead of the outer edge having an upwardly tapered shape.
  • the rectangular first heat dissipation fins 101 can effectively increase the area of the first heat dissipation fins 101 and increase the heat exchange with the airflow under the same height and width restrictions.
  • the heat dissipation fins of the heat sink 1 include the first heat dissipation fins 101 to the nth heat dissipation fins, and the first heat dissipation fins 101 to the nth heat dissipation fins have holes. 101a, the hole 101a penetrates both sides of the heat dissipation fin.
  • the first heat radiation fin 101 shown in FIG. 36f has a hole 101a penetrating both sides. Through the face holes 101a on both sides of the heat dissipation fins, the flow of the airflow can be enhanced to accelerate the heat dissipation, and at the same time, the weight of the heat sink 1 can be reduced.
  • the heat dissipation fins of the heat sink 1 may be disposed in a two-stage drop.
  • the first stage 1011 extends over the heat sink base 130 and the second stage 1012 extends to the first stage 1011.
  • the length of the first stage 1011 in the radial direction of the LED lamp is greater than the length of the second stage 1012 in the radial direction of the LED lamp.
  • the height of the first stage 1011 in the axial direction of the LED lamp is lower than the second stage 1012 in the axial direction of the LED lamp. the height of.
  • the first heat radiation fins 101 are viewed in a direction from the direction perpendicular to the axial direction in a stepped shape.
  • This arrangement allows the heat sink 1 to ensure that the lower portion has sufficient fin area for conducting heat generated by the operation of the LED chip 311, and the upper portion is mainly by radiation and convection, so that the weight reduction angle can be appropriately Reduce the fin area.
  • a heat sink 10 according to a fifth preferred embodiment of the present invention is shown.
  • the heat sink 10 of the fifth preferred embodiment is further configured with a second heat dissipation fin 102.
  • the outer edge of the second heat dissipation fin 102 is perpendicular to the heat dissipation base 130, so that the second heat dissipation fin 102 is a rectangular shape (rectangular or square).
  • the height of the second heat dissipation fins 102 on the heat dissipation base 130 is smaller than the height of the first heat dissipation fins 101 , and the second heat dissipation fins 102 and the first heat dissipation fins 101 are alternately arranged.
  • the second heat dissipation fins 102 can increase the heat exchange area with the air flow, but the heat radiation exchange between the first heat dissipation fins 101 and the second heat dissipation fins 102 can be reduced due to the small height.
  • the design of the embodiment is more advantageous for the weight reduction of the heat sink 10 as a whole, and the heat radiation exchange between the first heat dissipation fin 11 and the second heat dissipation fin 102 can be reduced.
  • a heat sink 1 according to a sixth preferred embodiment of the present invention is shown.
  • the heat sink 10 of the sixth preferred embodiment is further configured with the outer support wall 106 and the inner support wall 105 based on the foregoing embodiments.
  • the outer support wall 106 is connected to the outer edge of the first heat dissipation fin 101
  • the inner support wall 105 is connected to the inner edge of the first heat dissipation fin 101, thereby preventing the deflection of the first heat dissipation fin 101.
  • the heat sink 10 is viewed from above, and the outer support wall 106 and the inner support wall 105 both assume a circular ring shape so that the first heat radiation fins 101 can be connected from the radial direction.
  • the outer support wall 106 and the inner support wall 105 may be connected to the heat dissipation base 130, and then extend perpendicularly to the upper surface of the heat dissipation base 130.
  • the outer support wall 106 and the inner support wall 105 may also be connected to only the first heat dissipation fins 101. A distance is maintained from the upper surface of the heat dissipation base 130.
  • the height of the outer support wall 106 and the inner support wall 105 is smaller than the height of the first heat dissipation fins 11, thereby maintaining the radial flow of the airflow.
  • the outer support wall 106 and the inner support wall 105 may have only one alternative configuration, and the outer support wall 106 and the inner support wall 105 are not necessarily disposed at the same time.
  • the outer support wall 106 and the inner support wall 105 may also be arranged in a segmental manner, that is, the outer support wall 106 may be arranged in a plurality of equally or unevenly arranged arcs on the same circumference.
  • the curved segment 1061 connects at least two sets of first heat dissipation fins 101, thereby further reducing the influence on convection.
  • the first heat radiation fin 101 includes a first portion 101a, a second portion 101b, and a connecting portion 101c.
  • the first portion 101a and the second portion 101b extend in the radial direction and are connected to each other by the connecting portion 101c.
  • the first portion 101a extends outwardly from the outer circumference of the cylindrical accommodating space, and the second portion 101b is connected to the first portion 101a through the connecting portion 101c to further extend outward.
  • the connecting portion 101c is not parallel to the radial direction.
  • the connecting portion 101c extends substantially circumferentially or perpendicular to the radial direction, so that the first portion 101a and the second portion 101b are staggered in the radial direction, without The same radial extension line.
  • the configuration of the connecting portion 101c can increase the area of the first heat dissipation fins 11, thereby increasing the amount of heat exchange between the airflow and the first heat dissipation fins 11.
  • the connection portion 101c is provided to support the first heat dissipation. The deflection of the fins 11.
  • a heat sink 1 according to an eighth preferred embodiment of the present invention is provided.
  • the heat sink 10 of the eighth preferred embodiment modifies the form of the first heat radiation fins 101 based on the foregoing embodiment.
  • a plurality of concentric circles having different radii are defined on the heat dissipation substrate 130.
  • the first heat dissipation fins 101 are respectively disposed on the heat dissipation substrate 130 and extend perpendicularly from the concentric circles to the heat dissipation substrate 130.
  • the first heat dissipation fins 101 on each concentric circle are in a continuous state, that is, the first heat dissipation fins 101 are in an annular shape, and each concentric circle is provided with a first heat dissipation fin. 101.
  • the first heat dissipation fins 101 on each concentric circle are in a discontinuous pattern, that is, the first heat dissipation fins 101 are in an arc shape, and each concentric circle is provided with a plurality of arcuate first shapes.
  • the fins 101 are fins, and on the same concentric circle, there is a gap between the adjacent first fins 101 for the airflow to flow in the radial direction.
  • the heat sink 1 has a central axis XX, and the plane AA and the central axis XX with the central axis XX as a normal line intersect an intersection point 91, and the intersection point 91 is located in the columnar accommodating space of the heat sink 1. .
  • the distance of the central axis XX along the plane A-A to the edge of the heat sink fin 11 is greater than zero, as shown in Figures 37a-37d.
  • the intersection point 91 is a center
  • the distance D1 is a radius
  • a virtual circle is formed on the plane AA (shown by a broken line in FIG.
  • the heat sink 1 has at least one heat dissipation fin 11,
  • the virtual circle and the fins 11 are staggered at the edges.
  • the edges of the plurality of heat dissipation fins 1 have the same distance D1 to the central axis of the heat sink 1 , and the virtual circle and the plurality of heat dissipation fins 11 The edges are staggered.
  • the heat sink 1 has a plurality of heat dissipation fins 11 , and the edge of at least two of the plurality of heat dissipation fins 1 has a distance D1 along a plane AA to a central axis XX of the heat sink.
  • the distance D1 is smaller than the distance D2, and the intersection point 91 is a center, the shorter distance D1 is a radius, and a virtual circle (shown by a broken line in FIG. 37b) is established on the plane AA, the virtual circle And the edges of the heat dissipation fins 11 of the distance D2 are not staggered, and an exemplary illustration of the present embodiment is shown in Fig. 37b.
  • the heat sink 1 has a plurality of heat dissipation fins 11 , and the distances from the edges of the plurality of heat dissipation fins 11 to the central axis XX of the heat sink 1 are D1, D2, D3, . . . , Dn (Fig. Only D1, D2, and D3 are shown to be unequal in 37c, the distance D1 is smaller than the distance D2, the distance D2 is smaller than the distance D3, the intersection point 91 is the center, and the shortest distance D1 is the radius, and a plane is established on the plane AA.
  • a virtual circle (shown in phantom in Figure 37c), the virtual circle 30 and other edges of the heat dissipation fins 11 that are larger than the shortest moment from D1 are not interlaced, and an exemplary illustration of this embodiment is shown in Figure 37c.
  • the heat sink 1 has a plurality of heat dissipation fins 11 , and the distances D1 , D2 and D3 of the edges of the plurality of heat dissipation fins 11 to the central axis XX of the heat sink 1 are not equal, and the distance D1 is smaller than The distance D2, the distance D2 is smaller than the distance D3, the intersection point 91 is the center of the circle, and the distances D1, D2, and D3 are the radius, and a plurality of virtual circles are formed on the plane AA (shown by a broken line in FIG. 37d).
  • the virtual circle and the portion of the portion of the heat dissipation fin 11 are not staggered, and a portion of the virtual circle penetrates a portion of the heat dissipation fin 11.
  • An exemplary illustration of the present embodiment is shown in FIG. 16, with a radius D1 on the plane AA.
  • the created virtual circle is not staggered with the heat dissipation fins 11 having a distance greater than D1; the virtual circle established on the plane AA with the radius D2 as a radius, the penetration fins having a penetration distance smaller than D2, and the distance greater than
  • the heat dissipating fins 11 of D2 are not staggered; the virtual circle established on the plane AA with a radius D3 has a penetration distance greater than that of the heat sink fins 11 of D3.
  • the heat sink 1 includes a heat dissipating unit and a heat dissipating base 13.
  • Each heat dissipating unit extends along the axial direction of the LED lamp to the heat dissipating base 13.
  • the heat dissipating unit is specifically configured as a heat dissipating fin 11 and dissipates heat.
  • the cells are radially distributed uniformly along the circumferential direction of the heat dissipation base 13.
  • the root of each heat dissipation unit is connected to the heat dissipation base 13.
  • the inner edge of the heat dissipating unit defines a columnar accommodating space 14 for arranging the inner sleeve 21.
  • the heat dissipation base 22 transfers the heat generated by the lamp panel 3 to the heat dissipation unit, and is further transmitted to the outside air by the heat dissipation unit to enhance heat dissipation.
  • the lamp housing 1 is connected to the heat sink 1 and is substantially connected to the upper edge of the heat dissipation unit.
  • the upper edge of the plurality of heat dissipating units is cut along the radial direction at least in a portion close to the axis of the LED lamp, and defines a flat connecting surface, and the upper edge of the lamp housing 2 and the heat dissipating unit can be provided with corresponding buckles, so that The lower end of the lamp housing 2 is connected to the connection surface and connected to the heat sink 1.
  • the aforementioned connecting surface defines a first section A1 along the radial direction of the LED lamp
  • the connecting surface of the heat sink 1 and the lamp board 3 defines a second section A2 along the radial direction of the LED lamp.
  • the amount of the heat dissipating unit projected in the axial direction of the LED lamp on the first section A1 is smaller than the amount in which the heat dissipating unit is projected in the second section in the axial direction of the LED lamp.
  • the heat dissipating unit in the axial direction, due to the upward convection of the air, the heat dissipating unit is prevented from being blocked by the lamp housing 2, so that the upper edge of most of the heat dissipating units can be openly exposed to the air and formed without being blocked by the lamp housing 2.
  • the heat dissipation channel enhances the convection effect of the heat sink unit.
  • the amount of the heat dissipation unit projected on the first section A1 in the axial direction of the LED lamp is smaller than the amount of the heat dissipation unit projected on the outside of the first section A1 in the axial direction of the LED lamp to achieve the above technical effect.
  • the area of the heat dissipating unit projected in the axial direction of the LED lamp in the axial direction of the first cross section A1 is smaller than the area in which the heat dissipating unit is projected on the outside of the first cross section A1 in the axial direction of the LED lamp.
  • the heat sink 1 defines a plurality of ring regions from the inside to the outside in the radial direction, and the ring region is defined as an area having the same number of heat radiating units in the circumferential direction, in other words, different number of heat radiating units in different ring regions.
  • the inner ring region has a number of heat radiating units smaller than the number of heat radiating units of the outer ring region, and the number or area of the ring regions overlapping the first cross-sectional A1 projection in the axial direction of the LED lamp. , less than the number or area of the ring regions that overlap the second section A2 projection in the axial direction of the LED lamp.
  • the heat dissipation unit may include a plurality of first heat dissipation units 15 and a plurality of second heat dissipation units 16 (here, the first heat dissipation unit 15 and the second heat dissipation unit 16 and FIG. 23 and The first heat dissipation fins 111 and the second heat dissipation fins 112 of FIG. 24 adopt different naming rules and adopt different classification methods.
  • the first heat dissipation unit 15 is a radially inner heat dissipation fin
  • the second The heat dissipation unit 16 is a radially outer fin.
  • the first heat dissipating unit 15 is mainly projected on the inner ring region
  • the second heat dissipating unit 16 is mainly projected on the outer ring region, and the outer edge of each of the first heat dissipating units 15 extends along the radial branch.
  • the second heat dissipating unit 16 and the second heat dissipating unit 16 may be connected or disconnected, that is, the first The heat dissipation unit 15 and the second heat dissipation unit 16 are radially spaced apart such that the number of the second heat dissipation units 16 is greater than the number of the first heat dissipation units 15 .
  • the first section A1 is projected onto the inner ring region, and the second section A2 is projected on the outer ring region, so that the first heat dissipating unit 111 is projected on the inner ring region in the axial direction of the LED lamp, and the second The heat dissipation unit 16 is projected on the outer ring region in the axial direction of the LED lamp. Therefore, the number or area of the first heat dissipating unit 15 projected on the first section A1 in the axial direction of the LED lamp is smaller than the number or area of the second heat dissipating unit 16 projected on the first section A1 in the axial direction of the LED lamp.
  • the pitch value of the first heat dissipation unit 15 close to the LED lamp axis is smaller than the distance.
  • the first heat dissipation unit 15 is longer than the circumference of any one of the first sections A1 (the sum of ⁇ X1) is equal to the second heat dissipation unit 16 in the second section.
  • the circumference of any circle of A2 is long (the sum of ⁇ X2).
  • the circumference of the circle refers to the total length of the arc of the first heat dissipation unit 15 or the second heat dissipation unit 16 which is centered on the LED axis (also the axis of the heat sink 2).
  • the first heat dissipation unit 15 or the second heat dissipation unit 16 is a heat dissipation fin, and the heat dissipation fins are radially distributed in the radial direction of the heat sink 1 .
  • the heat sink 1 is divided into a first ring zone C1 and a second ring zone C2 from the inside to the outside in the radial direction.
  • the heat sink 1 further includes a columnar accommodating area 14 located inside the first ring zone C1, and the columnar accommodating area 14 is mainly used. It accommodates part of the power board and provides a heat dissipation channel.
  • a virtual circle is established with the axis of the heat sink 1 as a center.
  • the total length of the arc that cuts through the heat sink fin is X1 (the sum of ⁇ X1), and when the virtual circle falls into the second ring region C2, the virtual circle is cut.
  • the total length of the arc of the heat sink fin is X2 (the sum of ⁇ X2), then X1 ⁇ X2, and the ratio of the total length of the arc of the virtual circle cut through the heat sink fin to the circumference of the virtual circle may be between 0.06 and 0.2, so that heat dissipation
  • the fins may have sufficient cross-sectional area for heat conduction, but the spacing between the fins may still be maintained to maintain the convection channel size and to ensure that the fins of the same weight have sufficient surface area for heat dissipation.
  • the LED chip 311 of the lamp panel 3 is projected to have a higher density in the first ring region C1 than projected in the second ring region C2.
  • Density the density here refers to the number of distributions of the LED chips 311 per unit area of the ring region
  • X1 and X2 respectively occupy the ratios Ra1 and Ra2 of the circumference of the virtual circle, and Ra1>Ra2 can be set at this time.
  • the heat dissipation fin has a larger cross-sectional area in the first ring region C1 for heat conduction, and in the second ring region C2, the spacing value between the heat dissipation fins can be maintained to maintain the convection channel. size.
  • the LED chip 311 of the lamp panel 3 is projected to have a higher density in the first loop region C1 than projected in the second loop region C2.
  • X1 and X2 respectively occupy the ratios Ra1 and Ra2 of the circumference of the virtual circle, and Ra1 ⁇ Ra2 or X1 ⁇ X2 may be set at this time, so that the heat dissipation fin has a larger cross-sectional area in the second ring region C2. Heat conduction is performed, and in the first loop region C1, the spacing value between the fins can be maintained to maintain the convection channel size.
  • the first heat dissipating unit 15 is projected on the first section A1 in the axial direction of the LED lamp, and is larger than the second heat dissipating unit 16 projected on the first section A1 in the axial direction of the LED lamp. Quantity or area.
  • the number or area of the ring regions in which the first heat dissipating unit 15 is projected on the inner side of the LED lamp is formed, which is larger than the axial direction of the second heat dissipating unit 16 in the LED lamp.
  • the number or area of the ring areas projected on the outside is formed, which is larger than the axial direction of the second heat dissipating unit 16 in the LED lamp.
  • the pitch value of the first heat dissipation unit 15 may be greater than the pitch value in the second heat dissipation unit 16.
  • the length of the first heat dissipating unit 15 at any circumference of the first cross section A1 is equal to any of the second heat dissipating unit 16 in the second cross section A2. The circumference of the circle is long.
  • the unit 16 is independently disposed, but presents a one-to-one correspondence configuration extending along the same radial line, such that the first heat dissipation unit 15 is projected in the axial direction of the LED lamp on the first section A1, which is equal to the second heat dissipation unit 16 The axial direction of the LED lamp is projected on the first section A1.
  • the heat sink 1 is divided into two ring regions from the inside to the outside in the radial direction, and the number or area of the ring regions of the first heat dissipating unit 15 projected on the inner side in the axial direction of the LED lamp is equal to the second heat dissipating unit 16 in the LED.
  • the first heat dissipating unit 15 is longer than the circumference of any one of the first cross sections A1 and equal to the circumference of any one of the second heat dissipating units 16 of the second cross section A2.
  • the ring region of the heat sink 1 can be expanded from two to more.
  • the heat sink 1 further includes a third ring region C3 located outside the second ring region C2 when the virtual circle falls.
  • the third loop region C3 cuts the total arc length X3 ( ⁇ X3) of the fins, and X1 ⁇ X2 ⁇ X3.
  • the heat sink fins can have sufficient cross-sectional area for heat conduction, but the distance between the heat sink fins can be maintained to maintain the size of the convection channel and ensure heat dissipation under the same weight.
  • the fins have sufficient surface area for heat dissipation.
  • a chip setting area (a region where the LED chip 311 is located) is defined on the lamp board 3, and the LED chip 311 is disposed in a chip setting area on the lamp board 3. At least part of the chip setting area falls into the projection of the second ring area C2 or the third ring area C3.
  • the chip setting area is overlapped on the heat sink 1 as far as possible in the outer ring area, so that the corresponding heat dissipation
  • the fins are located on the outer edge of the heat dissipation base 13 to have a better convection cooling effect, and can correspond to more heat dissipation units (the number of heat dissipation units on the outer side is more than the inner side Cooling unit).
  • At least 80% of the chip placement area falls into the projection of the second loop region C2 and/or the third loop region C3; preferably, the chip set regions all fall into the second loop region C2 and / or the projection of the third loop region C3, as shown in Figure 38j.
  • the number N1 of the fins cut when the virtual circle falls into the first loop region C1, and the virtual circle is cut when entering the second loop region C2 The number of heat dissipating fins is N2, and N1 ⁇ N2, in which case X1 ⁇ X2 can be substantially achieved.
  • the virtual circle falls through the third ring region C3 and cuts through the number N3 of heat radiating fins, and N1 ⁇ N2 ⁇ N3, and substantially achieves X1 ⁇ X2 ⁇ X3.
  • the chip placement area can still be configured as shown in Figure 38h.
  • FIG. 39 is a plan view of the heat sink 1 in the present embodiment.
  • the heat sink 1 includes a plurality of first heat dissipation units 15 and a plurality of second heat dissipation units 16 (here, the first heat dissipation unit 15 and the second heat dissipation unit 16 and the first heat dissipation of FIGS. 23 and 24
  • the fins 111 and the second heat dissipation fins 112 adopt different naming rules and adopt different classification methods.
  • the first heat dissipation unit 15 and the second heat dissipation unit 16 are both heat dissipation fins.
  • Each of the first heat dissipation units 15 includes a first heat dissipation fin 15a radially distributed in the radial direction of the heat sink 1 and a first radial passage 15b.
  • the first passage 15b is a gap between the two first heat dissipation units 15a. .
  • the heat sink 1 defines a plurality of loop regions from the inside to the outside in the radial direction, that is, the first loop region C1, the second loop region C2, and the third loop region C3, and the first passages 111b located in different loop regions have different widths.
  • the first passage 15b located on the outer side has a width larger than the width of the first passage 15b located on the inner side.
  • the first heat dissipation unit 15 can adopt different density configurations in different ring regions, and the first heat dissipation fins of the first heat dissipation unit 15 can actually extend between at least two ring regions, so that A heat dissipating unit 15 exhibits a staggered configuration such that the first channels 15b located in different ring regions have different widths.
  • the first fins extend between the at least two loop regions and are discontinuous at the junction of the two loop regions.
  • each of the second heat dissipating units 16 includes two second heat dissipating fins 16a and a second channel 16b formed between the two second heat dissipating fins, and the second channel 16b faces one of the central axes of the heat sink 1.
  • the sides are not open or closed.
  • the first heat dissipating unit 15 and the second heat dissipating unit 16 may be located in different ring regions, and the ring region where the second heat dissipating unit 16 is located is located outside the ring region where the first heat dissipating unit 15 is located.
  • the two second heat dissipation fins 16 may be extended to the outer edge of the first heat dissipation fin 15, and the second The closed end of the heat sink fin is on the same radial line as the outer edge of the first heat sink fin, but is not connected and has a gap to form an additional channel.
  • the thermal resistance The smaller the thermal resistance, the better the heat conduction.
  • the factors affecting the thermal resistance are roughly the length of the heat conduction path, the heat conduction area, and the thermal conductivity of the heat conductive material.
  • Thermal resistance heat transfer path length L / (heat transfer area S * thermal conductivity).
  • the light board 3 includes at least one LED chip set 31, and the LED chip set 31 includes an LED chip 311.
  • the lamp panel 3 is divided into an inner circumference ring, an intermediate ring and an outer circumference ring in the radial direction thereof, and the LED chip set 31 is correspondingly disposed in the inner circumference circle, the middle circle and the outer circumference ring, That is to say, the inner circumference circle, the middle circumference and the outer circumference are each provided with a corresponding LED chip set 31.
  • the light board 3 includes three LED chip sets 31, which are respectively disposed on the inner circumference, the middle ring and the outer circumference of the light board 3.
  • the LED chip sets 31 on the inner circumference, the middle circumference, and the outer circumference each include at least one LED chip 311. As shown in FIG.
  • the light panel 3 can also be divided into two turns, and the LED chip set 31 is correspondingly disposed in the two turns.
  • a plurality of LED chips 311 disposed on the same circumference or substantially on the same circumference constitute an LED chip set
  • the light board 3 is provided with a plurality of LED chip sets 31, in the same LED chip set 31
  • the center distance of the adjacent two LED chips 311 is L2
  • any one of the LED chips 311 of any one of the LED chip sets 31 has a center distance L3 from the closest one of the adjacent LED chipsets 31. It is in accordance with the following relationship: L2: L3 is 1:0.8 to 2, preferably L2: L3 is 1:1 to 1.5. Thereby, the distribution of the LED chips 311 is more uniform to achieve the purpose of uniform light emission.
  • FIG. 40 is a schematic diagram of the cooperation of the heat dissipation fin 11 and the LED chip 311 in the embodiment.
  • the projection of the heat dissipating fin 11 contacts at least the LED chip set 31.
  • At least one LED chip 311 Specifically, when at least one heat dissipating fin 11 is projected along the axial direction of the LED lamp to the plane of the LED chip set 31, the projection of the heat dissipating fin 11 contacts at least the inner peripheral ring, the middle ring or the outer circumference of the LED chip set 31. At least one LED chip 311. As shown in FIG.
  • the projection of the heat dissipation fin 11 contacts an LED chip 311, as indicated by the arrow in the figure, as the heat dissipation path of the LED chip 311 and the heat dissipation fin 11, as shown in FIG.
  • the projection of the heat dissipation fin 11 does not contact the LED chip 311 in the figure, as indicated by the arrow in the figure, the heat dissipation path of the LED chip 311 and the heat dissipation fin 11 is obvious, the heat dissipation path of the latter is higher than that of the former.
  • the heat conduction path of the LED chip 311 is shortened by causing the projection of the heat dissipation fin to at least contact at least one of the LED chipsets 311 of the inner circumference, the middle ring or the outer circumference, thereby making the heat conduction path of the LED chip 311 shorter.
  • the thermal resistance is reduced, which is more conducive to heat conduction.
  • the projection of any one of the heat dissipation fins 11 contacts at least the LED chip. At least one LED chip 311 in the group 31.
  • the number of the heat dissipation fins 11 corresponding to the LED chip group 31 of the outer circumference is larger than the number of the heat dissipation fins 11 corresponding to the LED chip group 31 of the inner circumference.
  • the correspondence referred to herein refers to the axial direction projection relationship of the LED lamp.
  • the LED chip group 31 of the outer circumference corresponds to The heat sink fins 11 of the heat sink 1 on the opposite side are obtained.
  • the LED chip set 31 of the outer circumference of the present place has a larger number of LED chips 311, so that when heat is dissipated, more heat dissipation fins 11 (area) are required for heat dissipation.
  • the lamp panel 3 has an inner boundary 3002 and an outer boundary 3003.
  • the inner boundary 3002 and the outer boundary 3003 extend upward along the axial direction of the LED lamp to form an area, and the heat dissipation fins 11 are located.
  • the area within the area is larger than the area outside the area. In this way, most of the heat dissipation fins 11 of the heat sink 1 correspond to the light board 3 (the heat conduction path is short), thereby improving the utilization ratio of the heat dissipation fins 11 and increasing the effectiveness of the heat dissipation fins 11 for the LED chips 311.
  • Thermal conductivity area is a heat conductivity area.
  • a light reflecting area 3001 is disposed in an area between the inner circumference and the outer edge of the light board 3.
  • the light reflecting area 3001 can reflect the upward light to the light output surface 43. The loss of light in the direction opposite to the light exit direction in the axial direction of the LED lamp is reduced, and the overall light output intensity is increased.
  • the light board 3 defines a third opening 32 , and the third opening 32 communicates with the first heat dissipation channel 7 a and the second heat dissipation channel 7 b , that is, the third opening 32 simultaneously with the heat sink 1 .
  • the space between the heat dissipation fins 11 and the cavity of the lamp housing 2 communicate with each other, thereby forming a space convection path between the space between the heat dissipation fins 11 and the cavity of the lamp housing 2 and the outside of the LED lamp.
  • the third opening 32 is located on the inner side of the inner circumference in the radial direction of the LED lamp. Therefore, the space of the light reflection region 3001 is not occupied, and the reflection efficiency is affected.
  • the third opening 32 is disposed in a central portion of the lamp panel 3, and the first air inlet hole 2201 and the second air inlet hole 1301 respectively receive air from the same opening (the third opening 32), that is, convective air. After passing through the third opening 32, it enters the first intake hole 2201 and the second intake hole 1301.
  • the third opening 32 is opened in the center of the light board 3, so that the first air inlet 2201 and the second air inlet 1301 can share an inlet of the air inlet, thereby avoiding occupying an excessive area of the light board 3, thereby It is avoided that the area of the region of the lamp panel 3 where the LED chip 311 is disposed is reduced by opening a plurality of holes.
  • the inner sleeve 21 corresponds to the third opening 32, so that the convective air acts as a heat insulating effect at the time of intake, that is, the temperature inside and outside the inner sleeve 21 is prevented from interacting with each other.
  • the third opening 32 may be disposed to correspond to the first air inlet 2201 and the second air inlet 1301. Specifically, as shown in FIG. 42, the third opening 32 may be disposed between the middle portion of the lamp panel 3, the outer side, or the LED chip 311, thereby corresponding to the first air inlet hole 2201 and the second air inlet hole 1301.
  • the adjacent two LED chips 311 form a central angle A with the axis of the LED lamp, and the adjacent two LED chips 311 and the LED lamp in the middle ring
  • the axis forms a central angle B, and the angle of the central angle B is smaller than the angle of the central angle A.
  • the adjacent two LED chips 311 form a central angle C with the axis of the LED lamp, and the angle of the central angle C is smaller than the angle of the central angle B.
  • the outer ring thus has more LED chips 311 than the middle ring, so that the spacing of adjacent LED chips 311 in the outer ring is not much larger than the spacing of adjacent LED chips 311 in the middle ring.
  • the LED chip set 31 is provided with a plurality of groups, and each set is disposed on the light board 3 in a ring shape, and the adjacent two LED chips 311 and LEDs of the LED chip set 31 on the inner side are relatively
  • the angle formed by the central axis of the lamp is greater than the angle of the central angle formed by the adjacent two LED chips 311 of the LED chip set 31 of the opposite outer side and the axis of the LED lamp.
  • the outer LED chip set 311 has more LED chips 311 than the inner LED chip set 311, so that the spacing between the adjacent two LED chips 311 of the outer LED chip set 31 is The spacing of the adjacent two LED chips 311 of the relatively more inner LED chip set 31 is closer, and thus the arrangement of the LED chips 311 is more uniform, so that the light output is more uniform.
  • an insulating coating 34 is disposed on the upper surface of the lamp board 3.
  • the insulating coating 34 is configured to have high reflectivity, and a material having high reflectivity in the prior art, such as thermal grease.
  • the insulating coating 34 is applied to the edge of the lamp panel 3, and the distance between the radially outermost LED chip 311 of the lamp panel 3 to the edge of the lamp panel 3 is greater than 4 mm, and preferably, the lamp panel 3 is the most The distance between the outer LED chip 311 and the edge of the light panel 3 is greater than 6.5 mm and less than 35 mm.
  • the creepage distance between the outermost LED chip 311 and the heat sink 1 can be ensured, and the outermost LED chip 311 and the heat sink 1 can be prevented from being ignited and affecting personal safety.
  • the insulating coating 34 serves as a certain heat insulating function to prevent the temperature of the lamp cover 4 which is in contact with it from being excessively deformed.
  • Figure 43 is a schematic view of the lamp panel 3 in the present embodiment.
  • the LED chip set 31 is provided with at least two groups, at least two sets of LED chip sets 31 are sequentially arranged in the radial direction of the light board 3, and each set of LED chip sets 31 includes at least two groups.
  • the contact of the air with the LED chip 311 is more sufficient in the flow path due to the relationship of the air circulation path, so that the heat dissipation effect is better.
  • the arrangement of the LED chips 311 is more conducive to the uniformity of the light output.
  • an open area 312 is formed between two adjacent LED chips 311 in the same LED chip set 31 to allow air to flow between the LED chips 311, thereby taking away the heat generated when the LED chip 311 operates. .
  • the open areas 312 between adjacent LED chips 311 are staggered in the radial direction of the lamp panel 3 and are in communication with each other.
  • the light board 3 is adjacent to the two sets of LED chips 31 in the radial direction, one of the open area 312 between any two adjacent LED chips 311 of one set of LED chips sets 31 and any other set of LED chip sets 31
  • the open area 312 between the adjacent LED chips 311 is in the same direction in the radial direction of the lamp board 3, and the air flows directly along the radial direction of the lamp board, and the contact of the air with the LED chip 311 in the flow path The reduction is not conducive to the heat dissipation of the LED chip 311.
  • the LED chip set 31 is provided with three groups, and is arranged in the radial direction of the light board 3, and any open areas 312 of the corresponding three sets of LED chip sets are not in the same direction in the radial direction of the light board 3. .
  • the convection flow path of the surface of the lamp panel 3 is optimized to improve the heat dissipation efficiency.
  • the LED when the LED is illuminated, there is a light distribution area under the LED light that indicates the light intensity distribution of the light source in each space.
  • the light distribution area is concentrated in a certain area to improve the local brightness.
  • Figures 44a-44f are schematic illustrations of a light panel 3 in some embodiments.
  • the light panel 3 includes a first region 35 configured to provide the LED chip set 31, a second region 36 located further inside the first region 35 in the radial direction of the light panel 3, and a light.
  • a third region 37 which is located further outward of the first region 35 in the radial direction of the plate 3, defines a mounting region of the LED chip 31.
  • An insulating coating 34 having a reflectivity may be disposed on the first region 35, the second region 36, and the third region 37 of the lamp panel 3.
  • the third region 37 when the third region 37 is away from the first region 35 in the radial direction of the lamp panel 3, the distance between the third region 37 and the first region 35 is gradually increased in the axial direction, and therefore, the third region
  • the surface of the region 37 forms an external reflection region 371 located outside the LED chip group 31, thereby guiding at least part of the light generated when the LED chip set 31 operates to the light output surface 43, thereby concentrating light. Concentrate light into a certain area.
  • the second region 36 when the second region 36 is away from the first region 35 in the radial direction of the lamp panel 3, the distance between the second region 36 and the first region 35 is gradually increased in the axial direction, and therefore, the second region
  • the surface of 36 forms an inner reflection region 361 located inside the LED chip set 31, thereby guiding at least part of the light generated when the LED chip set 31 operates to the light output surface 43, thereby concentrating light. Light is concentrated in a certain area.
  • the inner reflection region 361, the outer reflection region 371, and the inner reflection surface 4301 and the outer reflection surface 4302 on the lamp cover 3 in the above embodiment can be arbitrarily matched to realize various optical effects.
  • only the outer reflecting surface 371 or 4302 may be provided, or only the inner reflecting surface 361 or 4301 may be provided, or one of the outer reflecting surfaces 371 or 4302 and one of the inner reflecting surfaces 361 or 4301 may be provided.
  • the inner reflection region 361 or the outer reflection region 371 is a flat surface and is at an angle to the first region 35, or is a circular arc surface.
  • the specific light-emitting direction can also be adjusted by adjusting the setting direction of the LED chip 311.
  • the structure of the light board 3 can be adjusted to have different light-emitting effects of the LED chip 311.
  • the light panel 3 includes a first region 35 configured to set the LED chip set 31, and a further inner side of the first region 35 in the radial direction of the light panel 3.
  • the second region 36 and the third region 37 located further outside the first region 35 in the radial direction of the lamp panel 3.
  • the lamp panel 3 has a plurality of LED chip sets 31, and a plurality of LED chip sets 31 are arranged in the radial direction of the lamp panel 3.
  • At least one of the LED chip sets 31 is disposed on the third region 37, and the third region 37 is at an angle with respect to the first region 36, and at least one set of LED chipsets 31 is disposed in the third region 37. After that, the angle of the light is changed, and different light-emitting effects can be exhibited, thereby changing the light intensity distribution.
  • At least one of the LED chip sets 31 is disposed on the second region 36, and the second region 36 is at an angle with respect to the first region 36. At least one set of LED chip sets 31 is disposed after the second region 36. The angle changes to give different light-emitting effects, which can change the light intensity distribution.
  • the LED chip set 31 is provided with three sets, and the outermost LED chip set 31 located in the radial direction of the light board 3 is disposed on the third area 37, and the light board 3 is in three groups in the radial direction.
  • the LED chip set 31 at the intermediate position of the LED chip set 31 is disposed on the first area 35, and the innermost LED chip set 31 located in the radial direction of the light board 3 is disposed on the second area 36.
  • the second region 36 and the third region 37 may be specific regions for arranging the LED chips 311, and each of the LED chips 311 corresponds to a second region 36 or a third region 37.
  • the second region 36 and the third region 37 may also be an entire region, and the LED chips 311 of the same group of LED chip sets 31 are all disposed in the second region 36 or the third region 37.
  • a silicon dioxide layer 313 may be disposed on the surface of the LED chip 311, and a separate silicon dioxide layer 313, a silicon dioxide layer 313, is disposed on each LED chip 311.
  • the surface away from the LED chip 311 is disposed as a convex curved surface, so that the silicone layer 313 acts like a lens, and the light emitted from the LED chip 311 acts as a condensing light, so that the light-emitting effect is better and the illumination is favorable. Improvement.
  • the arrangement of the silicone layer 313 can improve the efficiency of the heat radiation of the LED chip 311 (increasing the radiation area thereof) to facilitate heat dissipation of the LED chip 311.
  • the light source includes a light board 3, an LED chip 311, and a silicon dioxide layer 313.
  • the silicon dioxide layer 313 includes a first silicon dioxide layer 3131 disposed on the surface of the light board 3 and is disposed on the LED chip 311.
  • the first silicone layer 3131 is disposed such that the lamp panel 3 is not exposed, and the lamp panel 3 is isolated from the outside, thereby achieving insulation treatment of the lamp panel 3.
  • the second silicone layer 3132 has a convex curved surface, so that the second silicone layer 3132 functions as a lens, and the LED chip 311 is used for collecting light, so that the light-emitting effect is better and the illumination is improved.
  • the silicone layer 313 When the silicone layer 313 is disposed, the first silicone layer 3131 and the second silicone layer 3132 are integrally formed, thereby preventing dust from entering. In this case, the setting of the lamp cover 4 can be omitted, and the light effect is improved. (Setting the lampshade 4 inevitably reflects a part of the light, causing light loss).
  • LED package including chip, phosphor and silica gel, chip, phosphor and silica gel layer from the inside to the outside, as shown in Figure 44f, in some embodiments, can directly save the silicone when packaging, and directly A silica gel layer 313 is disposed outside the phosphor 314, that is, a phosphor 314 is disposed outside the chip 3111, and a silica gel layer 313 is directly disposed outside the phosphor 314.
  • the arrangement of the silicone layer 313 can increase the efficiency of the heat radiation of the LED chip 311 (increasing the radiation area thereof).
  • 45a to 45g are schematic views of the lamp panel 3 of some embodiments, showing different arrangements of the LED chips 311.
  • the LED chips 311 of the single LED chip set 31 are directly arranged on the substrate 33 at equal intervals, that is, the distance between any two adjacent LED chips 311 is the same, so that the entire LED lamp panel 3 is uniformly illuminated.
  • the LED chips 311 of the single LED chipset 31 are arranged in an array.
  • the array may be a rectangular array as shown in FIG. 45b, or may be a triangular array as shown in FIG. 41c, or may be concentric as described above.
  • the array arrangement can concentrate the LED chips 311 on a local area on the substrate 33 to form a concentrated illumination effect, and achieve uniform light emission in this partial area.
  • the LED chips 311 of the plurality of LED chipsets 31 are each formed into an array, that is, the plurality of LED chips 311 are arranged in a plurality of arrays, and an LED chip set 31 is displayed in a triangular dotted frame.
  • the spacing distance between the arrays is greater than the spacing distance of adjacent LED chips 311 in the array such that airflow channels are formed between the arrays to promote air convection along the surface of the light panel 3.
  • the LED chip 311 of the LED chipset 31 is rectangular with long sides and short sides. As shown in FIG. 45e, the LED chips 311 can be arranged along a circumference, and the long sides are arranged along the radial direction of the LED lamp board 3, so that the LED chips 311 are arranged in a radial arrangement, and therefore, on this circumference, more can be arranged.
  • the LED chip 311 and the LED chip 311 are concentrated in a small area; at the same time, the long side provides a radially longer flow guiding force, increasing the heat exchange between the air flow and the LED chip 311.
  • the LED chips 311 can also be arranged along a circumference, and the short sides are arranged in the radial direction of the LED lamp panel 3, so that the LED chips 311 can be spread over a large area, and the spacing between the LED chips 311 is shortened, so that the LED chip set 31 Like a luminous ring.
  • the foregoing two configurations may be implemented alternatively or simultaneously.
  • Figures 45f and 45g show partial schematic views of different styles of light panels 3 in some embodiments.
  • one or more reflectors 334 are disposed on the substrate 33 of the LED panel 3, and the opening of the reflector 334 faces away from the substrate 33.
  • An LED chip 311 is disposed on the inner bottom of each of the reflector cups 334.
  • the inner wall of the reflector 334 has a high reflectance material.
  • the specific embodiment includes coating the inner wall of the reflector 334, plating a high reflectance coating, or directly forming the reflector 334 with a high reflectance material and polishing the inner wall of the reflector 334. deal with.
  • the inner wall of the reflector cup 334 can reflect the laterally diverging light of the LED chip 311, so that the light output of the LED chip 311 is concentrated in the direction in which the LED chip 311 is pointed.
  • a plurality of LED chips 311 are disposed on the inner bottom of each of the reflectors 334. That is, at least one LED chip 311 is disposed on the inner bottom of each of the reflectors 334.
  • Fig. 46d is a front view of the power source 5 in the present embodiment.
  • the power source 5 is electrically connected to the LED chip 311 and used to supply power to the LED chip 311.
  • the power source 5 includes a power board 51 and electronic components, and the electronic components are disposed on the power board 51.
  • the transformer 54 in the electronic component includes a magnetic core 541 and a coil 542.
  • the magnetic core 541 has a cavity in which the coil is disposed, and the cavity is open on the upper side in the axial direction of the LED lamp.
  • the port is arranged such that the heat generated by the coil can be upward when working, and the direction of heat dissipation is consistent with the direction of the convection path of the first heat dissipation channel 7a to facilitate heat dissipation.
  • the cavity is open on both sides of the LED lamp in the axial direction, which further increases the heat dissipation effect on the coil.
  • the coil can maintain a gap with the inner wall of the cavity, so that air can flow through the gap, thereby further improving the heat dissipation effect of the coil.
  • the transformer 54 has a first surface 5401 and a second surface 5402.
  • the first surface 5401 and the second surface 5402 are both perpendicular to the power board, wherein the first surface 5401 is perpendicular to the axial direction of the lamp, the first side.
  • the area of the 5401 is smaller than the second surface 5402. Therefore, when the side having a small area is disposed as such, the obstruction of the convection of the first heat dissipation passage 7a can be reduced.
  • the electronic component includes at least one inductor 55.
  • the at least one inductor includes a toroidal core 551.
  • the coil is wound on the toroidal core 551 (not shown).
  • the axial direction of the toroidal core 551 is parallel. In the axial direction of the LED lamp, the coil can be in contact with convective air over a larger area, thereby increasing the heat dissipation to the inductor.
  • the annular core 551 is annular and corresponds to the convection path of the first heat dissipation passage 7a, the convective air can pass through the inside of the annular core 551, and the heat dissipation to the inductor 55 can be further increased.
  • the heat generating component in the electronic component includes an integrated circuit (IC) 56, a diode, a transistor, a transformer 54, an inductor 55, and a resistor, and the above-described heat generating components are respectively disposed on different surfaces of the power board 51.
  • IC integrated circuit
  • the heat source can be set separately to avoid the formation of local high temperature.
  • heat dissipating components may be respectively disposed on different surfaces of the power board 51 to dissipate heat for the heat generating components. At this time, the corresponding heat generating components are in thermal contact with the heat dissipating components.
  • At least one integrated circuit 56 and other heat generating components are disposed on different surfaces of the power board 51.
  • the heat source can be separately arranged to avoid the formation of local high temperature, and on the other hand, other heat generating components can be prevented from affecting the integrated circuit 56.
  • the above-described integrated circuit 56 does not overlap with any heat generating components, thereby avoiding heat superposition.
  • integrated circuit 56 and transformer 54 do not overlap.
  • the power supply board 51 is parallel to the axial direction of the LED lamp, and therefore, in the axial direction of the LED lamp, the power supply board 51 is divided into an upper half and a lower half, an upper half and a lower half.
  • the installation space of the electronic components is uniform or substantially uniform, which is advantageous for better arrangement of the electronic components.
  • the power supply board 51 is inclined with respect to the axial direction of the LED light, the air circulation is hindered to some extent, which is disadvantageous to the power supply. 5 heat dissipation.
  • the power board 51 divides the lamp housing 2 into a first portion 201 and a second portion 202.
  • the area of the corresponding heat dissipation hole 222 on the first portion 201 is larger than the area of the corresponding heat dissipation hole 222 on the second portion 202.
  • most or all of the electronic components may be disposed in the first portion 201, or components having a larger heat generation, such as an inductor, a resistor, a transformer, a rectifier bridge, or a transistor, may be disposed in the first portion 201. .
  • the power board 51 divides the inner cavity of the lamp housing 2 into a first portion 201 and a second portion 202.
  • the volume of the first portion 201 is larger than the volume of the second portion 202, and most or all of the electronic components are arranged.
  • the electronic component is disposed in the first portion 201, or a larger component such as a capacitor, an inductor, a resistor, a transformer, a rectifier bridge or a transistor is disposed in the first portion 201.
  • the area of the corresponding first air inlet hole 2201 on the first portion 201 is larger than the area of the corresponding first air inlet hole 2201 on the second portion 202, so that more air is entered into the first portion 201, thereby Electronic components dissipate heat.
  • the relationship between the first air intake hole 2201 and the first air inlet hole 2201 is specifically divided into two parts by the power supply board 51, that is, one part corresponds to the first part 201, and the other part corresponds to the second part 202. Thereby, more air is passed into the first portion 201 through the first intake hole 2201.
  • the electronic component includes a heat generating component 501, wherein at least one heat generating component 501 is adjacent to the lamp cap 23 and dissipated through the lamp cap 23 without occupying the heat dissipating resources of the first heat dissipating channel 7a.
  • the at least one heat generating component 501 adjacent to the lamp cap 23 is an inductor, a resistor, a rectifier bridge or a control circuit.
  • At least one of the heat generating components 501 transmits heat to the base 23 by heat conduction or heat radiation, and dissipates heat to the air through the base 23.
  • At least one heat generating component 501 is in thermal contact with the lamp cap 23.
  • at least one heat generating component 501 is located in the lamp cap 23, and the heat generating component 501 is in contact with the lamp cap through the heat conductive material 53, and the heat generating component 501 passes the above heat conduction.
  • the material 53 is fixed to the base 23. Therefore, by the arrangement of the heat conductive material 53, the heat conduction to the lamp cap can be achieved, and the heat generating component can be fixed to prevent the heat generating component 501 from loosening.
  • the "heat generating component 501 is located in the base 23", in particular, in a projection perpendicular to the axial direction of the LED lamp, the base 23 and the heat generating component 501 have overlapping regions.
  • the heat conductive material 53 is disposed in the lamp cap 23 by means of potting, thereby achieving connection of the lamp cap 23 to the heat generating component 501, and the heat conductive material 53 covers only the region of the end of the power source 5, and the heat conductive material 53 The position is higher than the position of the heat dissipation hole 22 to prevent an excessive increase in weight due to the heat conductive material 53.
  • the heat conductive material 53 is made of an insulating material to ensure safety and prevent the electronic component from coming into contact with the metal portion 231 of the base 23.
  • the heat conductive material 53 may also be a wire or the like (not shown) that connects the power source 5 and the conductive pins of the lamp cap 23.
  • the base 23 includes a metal portion 231, and the heat conductive material 53 thermally contacts the metal portion 231. That is, at least a part of the inner wall of the metal portion 231 constitutes a wall of the inner cavity of the lamp envelope 2, whereby the heat conductive material can be directly connected to the metal portion 231, and the metal portion 231 can be used for heat dissipation. A part of the metal portion 231 is radiated by air, and a part of the metal portion 231 is radiated by a socket connected to the metal portion 231.
  • the electronic components of the first air inlet 2201 closest to the first heat dissipation channel 7a are heat-resistant components, such as capacitors, especially electrolytic cells.
  • the capacitor 502 affects the performance of the heat-resistant component by preventing the temperature of the heat-resistant component from being too high by bringing the heat-resistant component closer to the first air-inlet hole 2201.
  • a reverse radiation layer or a heat insulating layer may be disposed on the surface of the electrolytic capacitor 502 to avoid the heat radiation of the heat generating component and affect the electrolytic capacitor 502.
  • the insulation layer of the locality can be selected from the plastic material of the prior art, and the anti-radiation layer can be selected from the prior art paint, silver plating layer, aluminum foil or other anti-heat radiation material.
  • At least a portion of the at least one electrolytic capacitor is not within the range defined by the power board 51, that is, at least a portion of the electrolytic capacitor exceeds the power board 51 in the axial direction of the LED lamp.
  • the length of the power board 51 can be reduced, and the material cost of the power board 51 can be reduced.
  • the electrolytic capacitor can be further brought close to the first air inlet 2201 to ensure that the electrolytic capacitor is in a relatively low temperature region.
  • the position of the at least one heat generating component 501 in the axial direction of the LED lamp is higher than the position of the heat dissipation hole 222, and most of the heat of the heat generating component 501 higher than the heat dissipation hole 222 is dissipated through the lamp cap 2 or other means. Therefore, most of the heat generated by it does not dissipate heat through the heat dissipation holes 222, and does not affect the convection speed of the first heat dissipation passage 7a.
  • the heat generating component 501 is a resistor, an inductor, an integrated circuit, a voltage transformer, or a rectifier bridge.
  • the power board 51 has an upper portion and a lower portion in the axial direction of the LED lamp, and the upper portion and the lower portion are each provided with a heat generating component, wherein at least one heat generating component of the upper heat generating component is located above the heat radiating hole 222, thereby The problem that the upper portion is located near the heat dissipation hole 222 can be reduced, so that the temperature difference in the vicinity of the lower and upper heat dissipation holes 222 is increased, thereby accelerating convection.
  • the power supply board 51 when the power supply board 51 is assembled to the lamp housing 2, it has a portion located inside the lamp neck 22 and a portion located inside the inner sleeve 21, and a portion of the power supply board 51 located inside the lamp neck 22
  • the portion of the power board 51 located in the inner sleeve is the second portion, and the second portion is closer to the first air inlet hole 2201 of the first heat dissipation passage 7a than the first portion, since it is closer to the first air inlet hole 2201,
  • the convective air first reaches the second part, that is, the second part has a better heat dissipation effect than the first part, so at least some of the heat-resistant components (such as electrolytic capacitors or components sensitive to high temperatures) ) is located in the second part.
  • all electrolytic capacitors are provided on the second portion.
  • the second portion of the power strip 51 has a larger area than the first portion, so the second portion of the power strip 51 has more space for the electronic components to be disposed, facilitating the placement of more heat-resistant components/heat-sensitive components on the second portion.
  • the heat-resistant components/heat-sensitive components may be respectively disposed on the front and back sides of the second portion.
  • electronic components with more heat generation may be disposed on the second portion (such as a transformer, an inductor, a resistor, an integrated circuit, or a transistor) to allow for faster heat dissipation.
  • FIG. 51 is a schematic illustration of a power supply 5 in some embodiments.
  • the power board 51 has a heat insulation board 513.
  • the power board 51 is separated by a heat insulation board 513 to separate two parts, and a part of the area is provided with a heat generating component (such as a transformer, a resistor, an inductor, etc., which is heated during operation).
  • a heat generating component such as a transformer, a resistor, an inductor, etc., which is heated during operation.
  • another part of the area is set with heat-resistant components / heat-sensitive components (such as electrolytic capacitors), that is, the heat shield separates the heat-generating components from the heat-resistant components / heat-sensitive components, thereby avoiding the generation of heat-generating components.
  • More heat radiation affects heat-resistant components/heat-sensitive components.
  • the power board 51 has a heat insulating board 513.
  • the power board 51 is separated by a heat insulating board 513 to separate two parts, and a part of the power board 51 is provided with a heat generating component (such as a transformer, a resistor, an inductor, etc.).
  • the other part also sets the heating components (such as transformers, resistors, inductors and other components that generate heat when working), that is, the heat insulation board separates the heating components from the heating components to avoid mutual heat radiation, so that the heat is superimposed.
  • the heat shield 513 is disposed along the axial direction of the LED lamp or in the convection direction of the first heat dissipation passage 7a so that the heat on both sides is not concentrated due to convection in the width direction of the power source board 51 during convection.
  • the heat insulating plate 513 is extended along the convection direction of the first heat radiating passage 7a, that is, the heat insulating plate 513 is disposed to extend in the axial direction of the LED lamp, and therefore, does not form an obstruction to the convective air.
  • the heat shield 513 may also be inclined so as to have a certain flow guiding effect on the air.
  • the heat shield 513 may be a circuit board, and therefore, an electronic component may be disposed on the heat shield 513 to increase the area of the configurable electronic component.
  • the function of the heat shield 513 can also be replaced by an electronic component.
  • the power board 51 has three electronic components 503, 504, 505, and the projections of the three electronic components 503, 504, 505 in the radial direction of the LED lamp (or in the width direction of the power board 51) at least partially overlap.
  • One of the electronic components 504 is interposed between the other two electronic components 503, 505, that is, one of the electronic components 504 is located between the other two electronic components 503, 505 to avoid heat radiation between the other two electronic components 503, 505, thereby facilitating heat generation.
  • a large temperature difference is formed between the component and the nearby air to facilitate heat radiation from the heat generating component to the air.
  • the other two electronic components 503, 505 mentioned above are respectively a heat generating component (such as a transformer, a resistor, an inductor or a transistor) and a heat-resistant component/heat sensitive component (such as an electrolytic capacitor), so that when the heat generating component generates heat, At least a portion of the heat is radiated to the intermediate electronic component 504, thereby reducing the radiation effect of the heat generated by the heat generating component on the heat resistant component/heat sensitive component.
  • a heat generating component such as a transformer, a resistor, an inductor or a transistor
  • a heat-resistant component/heat sensitive component such as an electrolytic capacitor
  • the power board 51 has three electronic components 503, 504, 505.
  • the three electronic components 503, 504, 505 are in the radial direction of the LED lamp (504 is located between the other two electronic components 503, 505 to avoid the other two.
  • the thermal components of the electronic components 503, 505 are mutually radiated, thereby facilitating a large temperature difference between the heat generating component and the nearby air to facilitate heat radiation of the heat generating component into the air.
  • the other two electronic components 503, 505 mentioned above are all defined above.
  • a heat generating component such as a transformer, a resistor, an inductor or a transistor
  • the two heat generating components 503, 505 generate heat, at least a portion of the heat is radiated to the intermediate electronic component 504, thereby reducing the heat buildup between the two heat generating components.
  • the temperature of the area of the power board 51 is too high to affect the operation quality of the LED lamp, and a large temperature difference is formed between the heat generating component and the nearby air to facilitate the heat radiation of the heat generating component to the air.
  • the electronic component 504 located in the middle selects an electronic component that does not generate heat or heat, such as a temperature sensor, a capacitor, or the like.
  • the power board 51 has three electronic components 506, 507, 508, and the three electronic components 506, 507, 508 are in the axial direction of the LED lamp (or the length direction of the power board 51, that is, along the first heat dissipation).
  • the projection of the channel 7a in the convection direction at least partially overlaps, wherein an electronic component 507 is interposed between the other two electronic components 506, 508, ie one of the electronic components 507 is located between the other two electronic components 506, 508 to avoid the other two electrons.
  • the components 506, 508 are thermally radiated to each other to facilitate a large temperature difference between the heat generating component and the nearby air to facilitate heat radiation from the heat generating component to the air.
  • the other two electronic components 506, 508 mentioned above are all heat generating components (such as transformers, resistors, inductors or transistors). Therefore, when the two heat generating components 506, 508 generate heat, at least a part of the heat is radiated to the intermediate electronic component 504, thereby The heat radiation between the two heat-generating components is reduced, the heat is superimposed, and a large temperature difference is formed between the heat-generating component and the nearby air, so that the heat of the heat-generating component is radiated into the air.
  • heat generating components 506, 508 are all heat generating components (such as transformers, resistors, inductors or transistors). Therefore, when the two heat generating components 506, 508 generate heat, at least a part of the heat is radiated to the intermediate electronic component 504, thereby The heat radiation between the two heat-generating components is reduced, the heat is superimposed, and a large temperature difference is formed between the heat-generating component and the nearby air, so that the heat of the heat-generating component is radiated into the air.
  • the electronic component 507 due to the arrangement of the electronic component 507, when the convective air is upward, it blocks the convective air within a certain range, that is, the heat of the electronic component 503 located below is dissipated with the convective air, and needs to be wound.
  • the intermediate electronic component 507 is passed through while avoiding convective air directly contacting the upper electronic component 508.
  • the intermediate electronic component 507 is a non-heating component (such as a capacitor or the like).
  • one of the other two electronic components 506, 508 is a heat generating component (such as a resistor, an inductor, a transformer, etc.), and the other is a heat resistant component (such as a capacitor or the like).
  • FIG. 52 is a schematic illustration of a power supply 5 in some embodiments.
  • a radiation layer 509 may be disposed on the surface of the heat generating component, and heat generated when the heat generating component operates may be thermally conducted to the radiation layer.
  • the radiating layer 509 radiates heat to the surrounding air to facilitate the removal of the hot air when the first heat dissipating passage 7a is convected.
  • the radiation efficiency of the radiation layer 509 is greater than the radiation efficiency of the heat generating component. Therefore, the heat dissipation efficiency of the heat generating component is greatly improved after the radiation layer 509 is disposed.
  • the radiant material 509 in this embodiment may be selected from the prior art black rubber to increase the effect of its heat radiation to the air.
  • the black glue can be covered on the surface of the power source 5, and the black glue can directly contact the lamp head 23, that is, the heat of the heat generating component of the power source 5 is partially radiated to the surrounding air, and the other part is directly
  • the black rubber is thermally conducted to the base 23 (not shown), and the base 23 is a metal base which can be dissipated to the outside through the base 23.
  • the black glue in this embodiment is a thin layered structure, which is disposed on the surface of the heat generating component, and does not hinder the convection to the first heat dissipation passage 7a, and the added weight is limited, and the influence on the overall weight of the LED lamp is small.
  • the black glue may also be selectively disposed, for example, a black rubber is disposed on a heat-generating component having a high heat generation, such as a transformer, an inductor, or a transistor.
  • the surface of the radiation material 509 may be set as a rough surface to increase the surface area of the radiation material 509.
  • Figure 47 is a schematic illustration of a power supply 5 in some embodiments that can be applied to the LED lamp of Figure 4 to replace the power supply 5 of the LED lamp of Figure 4.
  • the power board 51 divides the power board 51 into a first setting area 511 and a second setting area 512 with an axis X, a first setting area 511 and a second setting area 512.
  • the sum of the weights of the electronic components on the second set region 512 is greater than the sum of the weights of the electronic components on the first set region 511 by the axis X.
  • the first setting area 511 is provided with the weight 52, thereby balancing the weight on both sides of the power board 51, preventing the two sides of the power board 51 from being affected by the uneven weight of the electronic components, and preventing the LED light from hanging down due to the power board
  • the uneven weight on both sides of the 51 causes the LED lamp to tilt.
  • Figure 48 is a front elevational view of the weight in Figure 47.
  • Figure 49 is a bottom plan view of Figure 48.
  • the weight 52 is a heat dissipation component having a heat dissipation function, which is disposed on the power board 51.
  • the heat dissipating component has a heat sink 521 thereon to increase its heat dissipation area.
  • the weight 52 is made of a metal material having high thermal conductivity such as aluminum, copper, or the like.
  • the fins 521 are extended along the axial direction of the LED lamp, and the channels are formed between the fins 521 to provide an air channel, and in this way, the heat dissipation area of the weight 52 can be increased.
  • the weight 52 includes a long side and a short side, and the channel and the long side are also parallel to each other, and the long side arrangement is parallel to the axial direction of the LED lamp or substantially parallel to the flow direction of the air flow. Make the airflow more smooth.
  • the electronic component includes a heat generating component that has a relatively high heat generation temperature during operation, and at least one heat generating component is adjacent to the heat radiating component to dissipate a part of the heat through the heat radiating component.
  • the transformer, inductor, resistor, diode, transistor or integrated circuit (IC) in the heat generating component is adjacent to the heat sink assembly. More preferably, the transformer, inductor, resistor, diode, transistor or integrated circuit (IC) in the heat generating component is in direct thermal contact with the heat sink assembly.
  • the electronic component includes a heat generating component that has a higher heat generation temperature during operation, and at least one heat generating component is adjacent to the heat sink component 52 to distribute a portion through the heat sink component 52. hot.
  • the transformer, inductor, resistor, diode, transistor or integrated circuit (IC) in the heat generating component is adjacent to the heat sink assembly. More preferably, the transformer, inductor, resistor, diode, transistor or integrated circuit (IC) in the heat generating component is in direct thermal contact with the heat sink assembly.
  • the heat dissipation component 52 has a heat sink 521 thereon to increase the heat dissipation area thereof.
  • the heat dissipating component 52 is made of a metal material having high thermal conductivity, such as aluminum, copper, or the like.
  • the fins 521 are extended along the axial direction of the LED lamp, and the channels are formed between the fins 521 to provide an air channel, and in this way, the heat dissipation area of the weight 52 can be increased.
  • the heat dissipating component 52 includes a long side and a short side, and the channel and the long side are also parallel to each other, and the long side arrangement is parallel to the axial direction of the LED lamp or substantially parallel to the flow direction of the air flow, so that Airflow is smoother.
  • the heat dissipating component 52 may be disposed on the front and back sides of the power board 51. On the one hand, heat dissipation may be respectively performed on both sides of the power board 51, and on the other hand, the weights on both sides of the power board 51 may be balanced.
  • the power board 51 divides the power board 51 into a first setting area 511 and a second setting area 512 by an axis X, and the first setting area 511 and the second setting area 512
  • the axis X is bounded, and the number of electronic components on the second set region 512 is greater than the number of electronic components on the first set region 511 to make the airflow at the first set region 511 smoother, reducing the obstruction of the electronic components.
  • the first setting area 511 and the second setting area 512 each have a heat generating component to separate the heat sources.
  • the first heat dissipation channel 7a includes an inner channel 7a1 and an outer channel 7a2, and the outer channel 7a2 is formed in the electronic component at the edge of the power board 51 and the lamp housing 2.
  • the inner walls of the cavities are formed, and the inner channels 7a1 are formed in the gaps between the electronic components.
  • the transformer 54 of the electronic component includes a magnetic core 541 and a coil 542.
  • the magnetic core 541 has a cavity.
  • the coil 542 is disposed in the cavity, and the cavity is open on at least one side of the radial direction of the LED lamp.
  • the open side corresponds to the inner passage 7a1 or the outer passage 7a2, so that the heat generated by the coil 542 is quickly discharged by the convection of the inner passage 7a1 or the outer passage 7a2.
  • the cavity is open on both sides in the radial direction of the LED lamp, wherein one side opening corresponds to the inner channel 7a1 and the other side opening corresponds to the outer channel 7a2, thereby further increasing heat dissipation to the transformer .
  • the power board 51 includes a plurality of sub-boards 512, and the plurality of sub-boards 512 are electrically connected to each other.
  • a plurality of sub-boards 512 are connected by one or more electric wires 513, and when a plurality of electric wires 513 are used, a plurality of electric wires can be combined into a flexible electric wire.
  • the wire 513 By bending the wire 513, the relative positions can be changed between the plurality of sub-boards 512, for example, the two sub-boards 512 are parallel to each other and spaced apart, and different electronic component groups are respectively disposed.
  • a plurality of daughter boards 512 are connected by one or more electrical connectors 514.
  • the plurality of sub-boards 512 are coupled to each other by a connector 512, and are configured to be parallel or juxtaposed to each other.
  • the two sub-boards 512 are parallel to each other and spaced apart from each other, and different electronic component groups are respectively disposed. group.
  • the power board 51 includes a first area 51a and a second area 51b.
  • the width of the second region 51b is larger than that of the first region 51a for accommodating a large number of heat-resistant electronic components.
  • the second zone 51b is brought close to the air inlet 172 of the heat dissipation base 17, and the first zone 51a is close to the heat dissipation hole 222 of the lamp neck 22.
  • Figure 54 is a cross-sectional view of the LED lamp in the present embodiment.
  • the power board 51 divides the heat dissipation channel into the first channel S1 and the second channel S2 along the axial direction of the heat dissipation channel (the heat dissipation channel herein refers to the first heat dissipation channel 7a), and the first surface corresponds to the first channel.
  • the first channel S1 and the second surface correspond to the second channel S2.
  • the heat dissipation channel needs to have a large volume, so that after the volume of the heat dissipation channel is deducted from the total volume of the electronic component, there is sufficient channel space. Therefore, when the volume of the first channel S1 is smaller than the volume of the second channel S2, the volume of the electronic component on the first face (the sum of the volumes of all the electronic components on the first face) needs to be smaller than the volume of the electronic component located on the second face. (The sum of the volumes of all electronic components on the second side).
  • the ratio of the volume of the first channel S1 to the volume of the second channel S2 is set to R1, and the range of R1 may be 0.3-0.5; the volume of the electronic component located on the first side and the volume of the electronic component located on the second side
  • the ratio is set to R2, and R2 can range from 0.05 to 0.2. Comparing from the proportional relationship, the ratio R1 of the volume of the first channel S1 to the volume of the second channel S2 needs to be smaller than the ratio R2 of the volume of the electronic component located on the first face and the volume of the electronic component located on the second face. If the weight of the electronic component of the first side is smaller than the weight of the electronic component of the second side, a weight (not shown) may be disposed on the first side to balance the weight of both sides.
  • Figure 55 is a cross-sectional view of the LED lamp in the present embodiment.
  • the heat dissipation channel (where the heat dissipation channel refers to the first heat dissipation channel 7a) is also considered, that is, The relationship between air circulation areas (not covered with electronic components).
  • the first quadrant Q1, the second quadrant Q2, the third quadrant Q3, and the fourth quadrant Q4 are defined on the second side by the X-axis and the Y-axis, and the first quadrant Q1 and the second quadrant Q2 are defined.
  • the third quadrant Q3 and the fourth quadrant Q4 are connected to each other.
  • the first quadrant Q1 and the second quadrant Q2 correspond to the lamp housing, and the third quadrant Q3 and the fourth quadrant Q4 correspond to the heat sink 2, and the first quadrant Q1 and the third quadrant Q3 phase Neighbor, and the second quadrant Q2 is adjacent to the fourth quadrant Q4.
  • the X-axis described above falls on the upper edge of the heat sink 2, and the Y-axis is the center axis position shown.
  • the electronic component on one side (one side of the Y axis), for example, concentrated in the second quadrant Q2 and the fourth quadrant Q4, and the lower electronic component (same electronic component) is compared
  • the upper electronic components are small, so that high-heat or heat-resistant electronic components (such as transformers and electrolytic capacitors) are located at the lower part. Therefore, as shown, the volume of the electronic component located in the second quadrant Q2 is smaller than the volume of the electronic component in the first quadrant Q1 such that the air circulation area (uncovered electronic component) displayed by the second quadrant Q2 is larger than the first quadrant Q1, while maintaining an area where the airflow can pass quickly.
  • the ratio of the volume of the first channel S1 in the second quadrant Q2 to the volume of the electronic component in the second quadrant Q2 is greater than 3, so that the air circulation region in the second quadrant Q2 has sufficient size. It is of course also possible to make the ratio of the volume of the first channel S1 in the first quadrant Q1 to the volume of the electronic component in the second quadrant Q2 greater than three.
  • the volume of the electronic component located in the second quadrant Q2 is smaller than the volume of the electronic component in the first quadrant Q1, and may be set to a ratio of the volume of the electronic component in the second quadrant Q2 in a proportional relationship. A ratio smaller than the volume of the electronic component in the first quadrant Q1.
  • the volume of the electronic component in the fourth quadrant Q4 is smaller than the volume of the electronic component in the third quadrant Q3, so that the fourth quadrant Q4 to the first quadrant Q2 can maintain a sufficient airflow path. Also in a proportional relationship, the ratio of the volume of the electronic component in the fourth quadrant Q4 to the volume of the first channel S1 in the fourth quadrant Q4 is smaller than the volume of the electronic component in the third quadrant Q3 and the third quadrant Q3. The ratio of the volume of the first channel S1.
  • the ideal configuration of the heat generating component is located at the upper portion, that is, the first quadrant Q1 and the second quadrant Q2, so that the heat generating component is disposed in the first quadrant Q1 and the second quadrant Q2. That is, the heat generating component can contact the cooling airflow at the end of the heat dissipation channel to avoid heating the cooling airflow first and affecting the cooling of other electronic components.
  • the ratio of the number of the heat generating components of the first quadrant Q1 to the heat generating components of the second quadrant Q2 and the number of the heat generating components of the second quadrant Q2 is between 0 and 0.5, thereby reducing the heat generating components located on the same cross section.
  • the quantity is favorable for pulling the temperature gradient on the same section to facilitate the heat generating component to radiate heat to the surrounding air.
  • the heat generating component needs to radiate heat generated by the heat radiation to the air, and the temperature difference is one of the key factors of heat radiation. Therefore, it is necessary to avoid interference between the heat-generating components as much as possible to ensure the temperature difference between the heat-generating component and the air to ensure the efficiency of heat radiation.
  • the volume of the first channel S1 in the third quadrant Q3 and the fourth quadrant Q4 is larger than the volume of the first channel S1 in the first quadrant Q1 and the second quadrant Q2 to avoid the cooling airflow.
  • the high flow resistance is encountered at the starting end, which affects the flow of the cooling airflow.
  • the ratio of the cross-sectional area of the electronic component in the radial direction of the LED lamp to the cross-sectional area of the heat dissipation channel in the radial direction is preferably between 0 and 0.4, wherein the ratio 0 means that there is no electronic component in the cross section, and the ratio is 0.4. It means avoiding the cross-sectional area of the electronic component in the radial direction more than half of the heat dissipation channel.
  • the ratio of the cross-sectional area of the electronic component in the radial direction in the first channel S1 to the cross-sectional area in the radial direction of the first channel S1 is between 0 and 0.3, and vice versa.
  • the ratio of the cross-sectional area of the electronic component in the radial direction in the second channel S2 to the cross-sectional area of the second channel S2 in the radial direction is between 0 and 0.6. That is, the electronic components of the first side and the second side are arranged at different ratios so that one side has a better airflow.
  • the foregoing ratio can be processed through the off-axis arrangement of the power board 51.
  • the power board 51 and the axis of the heat dissipation channel have an off-axis distance G, the ratio of the off-axis distance G to the radius of the heat dissipation channel. Between 0.15 and 0.4.
  • the configuration of the off-axis distance G can also adjust the center of gravity so that the equivalent center of gravity of the power board 5 falls on the axis of the heat dissipation channel.
  • Figure 56 is a schematic illustration of the cooperation of the power source 5 and the inner sleeve 21 in some embodiments.
  • the configuration of the power supply board 51 can be inclined to the axis Y of the LED lamp, and the side with a large flow resistance, for example, the side having a large number of electronic components, can be disposed on the upper side of the tilt power supply board 51; the flow resistance is small.
  • the side having a small number of electronic components can be configured to tilt the lower side of the power supply board 51; so that the flow resistance is high and there is still sufficient airflow.
  • the weight 52 is disposed on the lower side of the tilting power supply plate 51 according to the inclined state to balance the weight on the axis Y to maintain the center of gravity of the LED lamp at the axis Y.
  • the lamp housing 2 includes a lamp cap 23, a lamp neck 22 and an inner sleeve 21; the lamp cap 23 is connected to the lamp neck 22, and the lamp neck 22 is connected to the inner sleeve 21.
  • the inner sleeve 21 is located inside the heat sink 1 (the axial direction of the LED lamp, all or most of the inner sleeve 21, for example, 80% or more of the inner sleeve height does not exceed the heat sink 1), and the lamp neck 22 is exposed to heat dissipation. The outside of the device 1.
  • the power supply composition is more complicated and the overall size is larger).
  • the lamp neck 22 and the lamp cap 23 each include a portion of the power source 5, and the sum of the heights of the lamp neck 22 and the lamp cap 23 is greater than the height of the heat sink 1, thereby providing more space for setting the power source 5, and the lamp neck 22 and The lamp cap 23 is separated from the heat sink 1 (the axial direction does not overlap, in contrast, the inner sleeve 21 is covered in the heat sink 1), so the lamp neck 22 and the power source 5 in the lamp cap 23 are subjected to the heat sink 1 The effect is small (the heat of the radiator 1 is not conducted radially to the neck 22 and the cap 23).
  • the height of the lamp neck 22 is provided to facilitate the chimney effect of the first heat dissipation passage 7a, and the convection efficiency in the first heat dissipation passage 7a can be ensured.
  • the height of the neck 22 is at least 80% of the height of the heat sink 1 to achieve the above-described effects.
  • the inner sleeve 21 is an insulating material for preventing the heat of the heat radiating fins from interacting with the heat of the power source.
  • the second air inlet hole 1301 is located on the lower side of the heat sink 1 and corresponds to the inner side or the inner side of the heat sink 1 in the radial direction, that is, the second air inlet hole 1301 corresponds to the inner side of the heat dissipation fin 11 or Internally, the inner side or the inner portion of the heat dissipating fin 11 corresponds to the outer wall of the inner sleeve 21 of the lamp housing 2 (the radially inner side of the heat dissipating fin 11 approaches or directly abuts the inner sleeve 21), so the convective air is from After the second air inlet hole 1301 enters, it convects along the outer wall of the inner sleeve 21 during the ascending process, and simultaneously radiates heat to the inner side or the inner portion of the heat dissipation fin 11 and the outer wall of the inner sleeve 21, thereby functioning as a heat insulator.
  • the second heat dissipation passage 7b can not only accelerate the heat dissipation of the heat dissipation fins 11, but also function as a heat insulation.
  • the second intake hole 1301 is closer to the inner side in the radial direction of the LED lamp than the LED chip 311 than the LED chip 311.
  • Figure 57 is an enlarged view of B in Figure 2.
  • the base 23 includes a metal portion 231 and an insulating portion 232 through which the wires of the power source 5 are connected to the external power supply unit.
  • the metal portion 231 is coupled to the bulb neck 22.
  • the inner surface of the metal portion 231 is provided with a thread, and the threaded portion is screwed to the bulb neck 22.
  • the metal portion 231 When the heat source 5 in the lamp housing 2 is dissipated by the metal portion 231 (as described in the foregoing embodiment, at least a portion of the inner wall of the metal portion 231 constitutes a wall of the inner cavity of the lamp housing 2, thereby allowing the heat conductive material to be directly
  • the metal portion 231 is connected and the metal portion 231 is used for heat dissipation.
  • the outer surface of the metal portion 231 is provided with a convex structure 2311 (as shown in FIG. 58) to increase the surface area of the outer surface of the metal portion 231, thereby causing the metal portion 231.
  • the heat dissipation area is larger, and the heat dissipation efficiency is improved.
  • the power source 5 From the power source 5, at least a portion of the power source 5 will be located within the base 23 and will be dissipated by at least a portion of the power source 5 by the base 23.
  • the inner wall of the metal portion 231 may also be provided with a convex structure to increase the surface area of the inner wall corresponding to the inner cavity of the lamp envelope 2.
  • the above-mentioned convex structure is formed to achieve the purpose of increasing the surface area.
  • Figure 59a is a perspective view of the lamp neck 22 of the present embodiment.
  • Figure 59b is a perspective view of the lamp neck 22 of the present embodiment.
  • Figure 60 is a perspective view of the inner sleeve 21 of the present embodiment.
  • the lamp neck 22 is connected to the inner sleeve 21 by a snap fit.
  • the inner sleeve 21 has a first positioning unit 211
  • the second neck unit 22 has a second positioning unit 221
  • the first positioning unit 211 is engaged with the second positioning unit 221 to make the inner sleeve 21 and the neck 22 connection.
  • the first positioning unit 211 is a fastening portion that is formed on the inner sleeve
  • the second positioning unit 221 is a buckle that is opened on the lamp neck, and the fastening portion is fastened to the buckle.
  • the first positioning unit 211 is a buckle that is formed on the inner sleeve
  • the second positioning unit 221 is a fastening portion that is formed on the lamp neck, and the fastening portion and the buckle buckle Connected.
  • the inner sleeve 21 has a connecting portion 212.
  • the connecting portion 212 includes at least two sets of sheet-like bodies 2121 in the circumferential direction of the LED lamp.
  • the first positioning unit 211 is formed on the sheet-like body 2121 when the lamp neck 22 is inside.
  • the second positioning unit 221 is buckled into the first positioning unit 211.
  • the second positioning unit 221 has a radial pressing force on the sheet body 2121, and the sheet body 2121 has a plurality of circumferential directions.
  • the fastening portion is a slot or a through hole formed in the sheet body 2121.
  • the lamp neck 22 has a third positioning unit 223 matched with the positioning groove 213.
  • the third positioning unit 223 is inserted into the positioning groove 213 to restrict the inner sleeve 21 from being opposite to the lamp neck in the circumferential direction. 22 and turn.
  • the connecting portion 212 is sleeved in the lamp neck 22, and the connecting portion 212 and the lamp neck 22 are mutually guided and supported by the socket, so that the connection is more convenient and the structural stability after the connection is achieved. better.
  • the lamp neck 22 and the inner sleeve 21 are of a unitary structure (not shown) to simplify the structure of the lamp housing 2.
  • the lamp neck 22 has a card slot 224 formed by two sheets 225.
  • the card slot 224 is formed between the two sheets 225, and the power board 51 can be snapped into the card slot 224 to be fixed.
  • the sheet body 225 is segmented in the axial direction of the LED lamp so that a gap is maintained between the sheets 225 in the axial direction of the LED lamp. After the power board 51 is inserted, both sides of the power board 51 can be Convection is performed through the gap.
  • the length L1 of the partial card slot 224 formed by the lowermost sheet body 225 located in the axial direction of the lamp neck 22 and the power board 51 are
  • the ratio of the length L2 is between 1:14 and 22, and when the ratio is attained, the power board 51 is inserted into a portion of the card slot 224 formed by the lowermost sheet body 225 of the lamp neck 22, and both sides of the power board 51 are received.
  • the card slot 224 is limited in that it does not cause a large deflection, making it difficult to align with the card slot 224 formed by the next set of sheets 224, thereby reducing assembly difficulty.
  • the two sheets 225 are composed of two mutually parallel ribs, and the corresponding two ribs are disposed on the inner wall of the lamp neck 22 and extend in the axial direction of the lamp neck 22. After the power board 51 is inserted into the card slot 224, the corresponding two ribs are parallel to the power board 51.
  • the two sheets 225 in this embodiment form a third positioning unit 223.
  • the opposite side surfaces of the two sheets 225 respectively correspond to the positioning grooves 213, and function as positioning guides.
  • Figure 59c is a perspective view of the lamp neck 22 in some embodiments.
  • the sheet body 225 extends in the axial direction of the LED lamp and is a unitary body (individual sheet body), the form of the sheet body 225, the formed card slot 224, The cooperation with the power board 51 is more stable.
  • the length of the sheet body 225 is between 15% and 45% of the length of the power board 51. This ensures that the card slot 224 supports the power board 51 more stably.
  • the card slot 224 may also be a slot (not shown) on the inner wall of the lamp neck 22. Therefore, it is not necessary to provide the sheet body 225, which is structurally simpler.
  • the lamp neck 22 has a first stopping portion 226.
  • the first stopping portion 226 is engaged with the power board 51, and the power board 51 is inserted and restricted by the first stopping portion 226. After the power board 51 is further inserted, the electronic component at the end of the power board 51 is pressed and damaged by the end of the lamp head 23.
  • the first stopping portion 226 is disposed to enable the power board 51 and the lamp head 23 end. The gap is maintained to ensure convection at the gap.
  • the inner sleeve 21 has a second stopping portion 215, and the second stopping portion 215 cooperates with the power board 51 to restrict the power board 51 from moving in the axial downward direction of the LED lamp, by setting the first The stopper portion 226 and the second stopper portion 215 restrict both sides of the power supply plate 51 in the axial direction, thereby fixing the power supply plate 51 in the axial direction.
  • the lamp housing 2 has a current limiting surface 214 extending outward in the radial direction of the LED lamp and radially away from the heat dissipation hole 222.
  • the current limiting surface 214 covers at least a portion of the heat dissipation fins 11 .
  • the heat dissipating fins 11 dissipate heat, the hot air emitted by the heat dissipating fins 11 covered by the current limiting surface 214 is blocked by the current limiting surface 214, and the direction of the hot gas flow is changed (along the current limiting surface 214).
  • the flow restricting surface 214 may be formed on the inner sleeve 21. As shown in FIG. 12, in other embodiments, the flow restricting surface 214 may also be formed on the bulb neck 22.
  • the upper side of the heat dissipating fin 11 in the axial direction of the LED lamp corresponds at least partially to the current limiting surface 214.
  • the lamp housing 2 is inserted into the heat sink 1, the lamp housing 2 is limited. Bit role.
  • the heat dissipation fins 11 are opposite to the current limiting surface 214.
  • the thermal conductivity of the material used for the inner sleeve 21 is smaller than the thermal conductivity of the material of the lamp neck 22, and the current limiting surface 214 is formed on the inner sleeve 21, and the height of the heat sink 1 in the axial direction.
  • the flow restricting surface 214 is not exceeded to reduce the contact area of the heat sink 1 with the lamp neck 22.
  • the material used for the inner sleeve 21 and the material of the lamp neck 22 may be the same material, for example, materials having a lower thermal conductivity, such as plastic.
  • the wall portion of the inner sleeve 21 and the wall portion of the lamp neck 22 together constitute the wall portion of the inner cavity of the lamp housing 2, and the height of the heat sink 1 in the axial direction does not exceed
  • the height of the sleeve 21 is such that the heat sink 1 corresponds to the inner sleeve 21 in the radial direction of the LED lamp, that is, the inner sleeve 21 functions as a heat insulator to prevent the heat of the heat sink 1 from being conducted into the inner sleeve 1, and The electronic components that affect the power source 5 within it.
  • the lamp neck 22 is entirely higher than the position of the heat sink 1, that is, in the radial direction of the LED lamp, the heat sink 1 and the lamp neck 22 do not overlap, and heat conduction between the heat sink 1 and the lamp neck 22 can be avoided as much as possible.
  • the heat sink 1 is prevented from conducting heat to the inside of the lamp neck 22 by heat conduction, thereby affecting the electronic components therein. Because of this, the present embodiment can set the heat transfer efficiency of the wall portion of the inner sleeve 21 to be lower than the heat transfer efficiency of the wall portion of the lamp neck 22, and the advantage of this arrangement is that the inner sleeve 21 can be passed on the one hand.
  • the heat transfer efficiency is set to reduce the heat conduction in the inner sleeve 21 of the heat sink 1 to prevent the heat sink 1 from affecting the electronic components inside the inner sleeve 21.
  • the heat transfer efficiency of the lamp neck 22 is improved, and the heat generated when the electronic components of the internal power source 5 are operated is dissipated through the lamp neck 22, thereby preventing the temperature of the power source 5 from being excessively high and affecting the life of the electronic component.
  • the inner sleeve 21 in order to set the heat transfer efficiency of the wall portion of the inner sleeve 21 to be lower than the heat transfer efficiency of the wall portion of the lamp neck 22, the inner sleeve 21 may be selected from a material having a low thermal conductivity, and the bulb neck 22 may be selected.
  • a heat dissipation hole 222 may be formed in the lamp neck 22, or a heat conducting portion (not shown) may be disposed on the lamp neck 22, such as setting a metal contour. Thermal conductivity material.
  • the lamp neck 22 has an upper portion and a lower portion, wherein the heat dissipation holes 222 are provided at the upper portion, and the cross-sectional area of the upper portion is smaller than that of the lower cross-section street, and the air velocity of the upper portion is faster than the flow rate of the lower portion of the air, thereby The initial velocity at which air is discharged from the louvers 222 is increased to prevent hot air from accumulating in the vent 222 attachment.
  • the cross-sectional area of the lamp neck 22 is decreased in the axial direction of the LED lamp to avoid obstruction of air flow.
  • the cross-sectional area of the inlet of the lower portion of the inner sleeve 21 is larger than the cross-sectional area of the upper portion of the lamp neck 22.
  • the heat dissipation holes 222 on the lamp neck 22 are strip-shaped and extend along the axial direction of the LED lamp. Due to the gravity of the LED lamp, the lamp neck 22 is axially pulled, and the heat dissipation hole 222 is used. Provided as a strip-shaped hole extending in the axial direction of the LED lamp can avoid the opening of the heat dissipation hole 222 and affect the strength of the lamp neck 22.
  • the maximum inscribed circle diameter of the heat dissipation holes 222 is less than 2 mm, preferably 1 to 1.9 mm. In this way, on the one hand, insects can be prevented from entering, and most of the dust can be prevented from passing.
  • venting holes 41 can maintain a good gas circulation efficiency.
  • the heat dissipation hole is designed to extend along the outer circumferential surface of the lamp neck 22, the lamp neck 22 may be pulled by the weight of the heat sink 1, so that the heat dissipation hole becomes large, so that the heat dissipation hole 222 cannot satisfy the maximum inner cut.
  • the diameter of the circle is less than 2mm.
  • the outlet of the heat dissipation hole 222 in the radial direction of the LED lamp extends beyond the outer surface of the metal portion 231 in the radial direction of the LED, that is, the outlet of the heat dissipation hole 222 is located outside the outer surface of the metal portion 231 in the radial direction of the LED lamp. .
  • the influence of the heat discharged from the outlet on the metal portion 231 is reduced, and heat is prevented from being conducted again to the inner cavity of the lamp housing 2 through the metal portion 231 to affect the electronic components of the power source.
  • Figure 61 is a cross-sectional view of an LED lamp in some embodiments.
  • Figure 62 is a schematic view showing the arrangement of the convection passage in the LED lamp of Figure 61.
  • the basic structure of the LED lamp is the same as the LED lamp shown in Figure 1.
  • the inner sleeve 21 has an upper portion and a lower portion, and the upper portion and the lower portion are connected by a flow guiding surface 216, and the flow guiding surface 216 is in an upward direction along the axial direction of the LED lamp (along the first heat dissipation passage 7a) In the convection direction, the radius of the section gradually increases, that is, the flow guiding surface 216 has a function of guiding the air of the second heat dissipation passage 7b toward the radially outer side of the radiator 1, thereby making the air and more The area of the fins 11 contacts, which in turn removes more heat from the fins 11.
  • the inner sleeve 21 includes a first portion and a second portion in the axial direction, the second portion is an inner sleeve 21 (including a portion of the flow guiding surface 216) of the portion below the flow guiding surface 216, and the first portion is the flow guiding surface 216 or more. a portion of the inner sleeve 21 (excluding the portion of the flow guiding surface 216).
  • the electronic components located in the second portion of the inner sleeve 21 include heat-resistant components, such as capacitors, particularly electrolytic capacitors, to The heat resistant component is operated at a lower temperature (near the first intake port 2201).
  • the high heat generating component may also be disposed in the second portion of the inner sleeve 21, such as a resistor, an inductor, a transformer, or the like.
  • the convective air when the convective air enters the second heat dissipation passage 7b, when the lower portion of the inner sleeve 21 is in the lower portion of the inner sleeve 21, the convective air will abut against the outer wall of the inner sleeve 21, thereby functioning as a heat insulator. That is, the heat of the heat dissipating fins 11 is prevented from being conducted into the inner sleeve 21, and the heat-resistant components therein are affected.
  • the convective air When the convective air continues upward, the convective air is convected by the flow guiding surface 216.
  • the air will flow along the radially outer side of the heat radiating fins 11, so that the convective air contacts the heat radiating fins 11 of a larger area to improve the heat dissipation of the surface of the heat radiating fins 11.
  • the inner cavity of the inner sleeve 21 is a wide and narrow channel structure, which greatly enhances the effect of the chimney effect and helps to promote the air flow inside the inner sleeve 21.
  • the heat dissipation hole 222 is provided at the top end of the lamp neck 22 at the farthest distance from the vent hole, thereby designing an effect of further enhancing the chimney effect.
  • Figure 63 is a front elevational view of the LED lamp with the heat sink 1 removed in some embodiments.
  • Figure 64 is an exploded view of Figure 63.
  • the features mentioned in this embodiment can be applied to the LED lamp of Fig. 1.
  • the outer peripheral wall of the inner sleeve 21 is provided with a flow passage 219 such that a portion of the convective air in the inner sleeve 21 can flow to the heat sink 1 through the flow passage 219.
  • the flow passage 219 may be a slit that is opened at a lower portion of the outer peripheral wall of the inner sleeve 21, or may be a hole that is opened at a lower portion of the outer peripheral wall of the inner sleeve 21.
  • a plurality of flow passages 219 are provided, and a plurality of flow passages 219 are distributed along the circumferential direction of the inner sleeve 21. At this time, the position of the bump 217 is adjusted accordingly.
  • the inner sleeve 21 has a crimping portion 210.
  • the pressing portion 210 is downwardly protruded from the lower end portion of the inner sleeve 21.
  • the crimping portion 210 defines a crimping groove 2101 for connecting the power source 5 and The wires of the lamp board 3 can be caught in the crimping groove 2101 to complete the fixing of the wires.
  • the inner sleeve 21 has a fourth positioning unit 2102, and the lamp cover 4 has a fifth positioning unit 46.
  • the fourth positioning unit 2102 cooperates with the fifth positioning unit 46 to restrict the rotation of the inner sleeve 21 relative to the lamp cover 4.
  • the specific positioning unit 2102 is a positioning hole
  • the fifth positioning unit 46 is a positioning post. The positioning post is inserted into the positioning hole to cooperate. It should be noted that the positioning post is not disposed in the axial direction of the inner sleeve 21. Preferred positioning posts and positioning holes are provided in groups.
  • the fourth positioning unit 2102 is a positioning post
  • the fifth positioning unit 46 is a positioning hole
  • the positioning post is inserted into the positioning hole to cooperate.
  • the outer contour of the LED lamp of the present embodiment is displayed, and a rectangular coordinate system is established, with the axial direction of the LED lamp as the y axis, the radial direction of the LED as the x axis, and the center of the bottom surface of the LED lamp as the origin.
  • the outer contour of the side of the LED lamp is rotated 360 degrees around the axis of the LED lamp to form an outer contour of the LED lamp (excluding the lamp head 23), and the outer contour line is arbitrary (the lamp head 23 is usually a standard lamp head, therefore, this
  • the lamp cap 23 is not included, and the outer contour formed by the heat sink 1 and the lamp neck 22 is in accordance with the following formula:
  • K is a constant
  • K ranges from 360 to 450
  • a ranges from 0.001 to 0.01
  • b ranges from 0.05 to 0.3
  • c ranges from 5 to 20, preferably from 10 to 18, and more preferably from 12 to 16.
  • the range of K is 360 to 450.
  • the LED lamp when any point of the contour line conforms to the above formula, the LED lamp can be better matched with the luminaire (especially the cone-shaped luminaire) (as shown in FIG. 67).
  • the LED lamp when any point of the contour line conforms to the above formula, the LED lamp is oriented upward from its bottom in the axial direction, and the width of the entire LED lamp is substantially decreasing.
  • the lower portion of the heat sink 1 mainly conducts the heat energy generated by the LED chip 311 during the operation of the LED lamp to the heat sink 1 for heat dissipation, and the upper portion mainly passes radiation and convection.
  • the heat sink 1 is dissipated.
  • the lower portion of the heat sink 1 is designed to have more area for heat conduction (the lower heat sink 1 has a larger width and a larger heat dissipation area).
  • the lamp neck 22 has a shape that is large and small, that is, when the cross-sectional area of the lamp neck 22 is in the axial direction of the LED, the cross-sectional area thereof is in a decreasing state, and when the lamp neck 22 supplies the power source 5
  • the convection mode dissipates heat, and the heat dissipation hole 222 is opened in the upper portion of the lamp neck 22.
  • the convection speed is increased due to the decreasing cross-sectional area of the lamp neck 22, so that the convected air is discharged when the vent hole 222 is discharged.
  • the initial speed which in turn causes the air to escape away from the heat dissipation holes 222, prevents hot air from collecting near the heat dissipation holes 222.
  • the outline is a continuous line.
  • the contour lines can be multi-segment lines (as shown in Figure 68).
  • the contour line is a smooth or substantially smooth curve to avoid the formation of an angle to cut the hand, and on the other hand, the convection of the convection air along the outside of the LED lamp can be made smoother.
  • the outline of the LED lamp in this embodiment is roughly an "S"-shaped curve including the curve on the lamp neck 22 and the curve on the heat sink 1.
  • the curve on the outer contour of the lamp neck 22 and the curve on the heat sink 1 together form an "S" shaped curve.
  • the junction of the lamp neck 22 and the heat sink 1 may form an angle to break the smoothness of the portion of the curve, but in general, the outline as a whole is smooth.
  • an LED lamp of the same width dimension has a contoured curve which has a larger outer contour surface than a straight line to provide more area for heat radiation.
  • the outer contour of the LED lamp in this embodiment is displayed, and a rectangular coordinate system is established, in which the axial direction of the LED lamp is the y-axis, the radial direction of the LED is the x-axis, and the center of the bottom surface of the LED lamp is taken as the origin.
  • the outer contour of the side of the LED lamp is rotated 360 degrees around the axis of the LED lamp with a contour to form the outer contour of the LED lamp (excluding the lamp cap 23).
  • the outline includes the outline of the lamp neck 22 and the outline of the heat sink 1.
  • the lamp neck 22 is for accommodating the power source 5, and mainly dissipates heat from the power source 5 in a convection manner.
  • the contour of the lamp neck 22 has a slope a, and a is constant.
  • a virtual straight line may be used to represent the approximate slope of the outline of the lamp neck 22.
  • the line L1 of the apex of the outline of the lamp neck 22 is taken to represent the outline of the lamp neck 22, or the line L2 of the center of the top of the lamp neck 22 is taken to represent the outline of the lamp neck 22.
  • the line L1 of the apex of the outline of the lamp neck 22 is taken to represent the outline of the lamp neck 22 for illustration.
  • the heat sink 1 is mainly used for heat dissipation of the LED chip 311 in a conductive manner.
  • the outline of the heat sink 1 has a slope b, and b is a constant.
  • a virtual straight line may be represented to represent the approximate slope of the outline of the heat sink 1.
  • the line L3 of the apex of the outline of the heat sink 1 is taken to represent the outline of the heat sink 1, or the line L4 of the center of the top of the heat sink 1 to represent the outline of the heat sink 1.
  • the line L3 of the apex of the outline of the heat sink 1 is taken to represent the outline of the heat sink 1 for illustration.
  • the slope a is greater than the slope b, or the absolute value of the slope a is greater than the absolute value of the slope b. Therefore, in general, the outline of the lamp neck 22 is steeper than the outline of the heat sink 1.
  • the lamp neck 22 in order to ensure the chimney effect during convection in the lamp neck 22 in the case where the space of the power source 5 is required to be uniform, the lamp neck 22 is required to maintain a certain height if the neck of the lamp neck 22 is flat ( The slope is small), the internal volume of the lamp neck 22 is increased while maintaining the same height, but there is no practical help for the actual space of the power supply.
  • the radiator 1 In order to ensure the heat dissipation effect, to control the height of the whole lamp, it is necessary to set the radiator 1 to be flatter (small slope) to control the overall height thereof, and the radiator 1 is further When the plane is small (slope is small), the lower portion of the heat sink 1 has more area for heat conduction of the LED chip 311 under the premise that the heat dissipation area is the same.
  • the value of the slope a is greater than 2, preferably 2.5 to 5, more preferably 3 to 4, and most preferably 3.2 to 3.8. In order to dissipate heat within the neck 22, there is a better chimney effect.
  • the value of the slope b is less than 3, preferably 1 to 2.5, more preferably 1.4 to 2, and most preferably 1.5 to 1.9. So that the lower portion of the heat sink 1 has more area for conduction.
  • the outline of the LED lamp is a continuous line, that is, the bottom of the outline of the lamp neck 22 is in contact with the top of the outline of the heat sink 1.
  • the contour line may be a multi-segment line (as shown in FIG. 68).
  • the bottom of the outline of the lamp neck 22 is spaced from the top of the contour of the heat sink 1, so that the outline is not overall. continuously.
  • the outline of the lamp neck 22 is a concave curve, that is, the line connecting the vertex and the bottom point of the outline of the lamp neck 22 is a virtual straight line, and the outline of the lamp neck 22 is all located on the straight line.
  • the inner side (the side close to the axis of the LED lamp), and the outline of the heat sink 1 is a convex curve, the virtual line of the line connecting the vertex of the heat sink 1 and the bottom point, the outline of the heat sink 1 All are located outside the line (the side away from the axis of the LED light).
  • the contour is a smooth or substantially smooth curve to avoid forming an angle and cutting the hand.
  • the convection air can be convected more smoothly along the outside of the LED lamp.
  • the outline of the LED lamp in this embodiment is roughly an "S" curve or an inverted “S” curve, which includes the curve on the lamp neck 22 and the curve on the heat sink 1.
  • the curve on the neck 22 and the curve on the heat sink 1 together form an "S" shape or an inverted "S" curve.
  • the junction of the lamp neck 22 and the heat sink 11 may form an angle to break the smoothness of the portion of the curve, but in general, the outline as a whole is smooth.
  • the lamp neck 22 and the heat sink 1 may also be separated (for example, the lamp neck 22 and the heat sink 1 are kept at a certain interval), that is, the curve on the lamp neck 22 and the curve on the heat sink 1 are disconnected.
  • the outline is still smooth overall.
  • the outer contour of the lamp neck 22 is a concave curve, so that the increase in the size of the lamp neck 22 is increased during the downward process, so that the bottom of the final lamp neck 22 has a larger size to be combined with the heat sink 1, also That is to say, the starting position of the upper portion of the heat sink 1 can be made larger.
  • the outer contour of the heat sink 1 is a convex curve, so the size reduction of the heat sink is increased in the upward process, and therefore, the size of the lower portion of the heat sink 1 is slowed down, so that the lower portion has more available for use.
  • the outer contour of the lamp neck 22 may be a straight line segment, and the outer contour of the heat sink 1 is a curve, and in addition, the straight line may be parallel to the LED lamp.
  • the outline of the lamp neck 22 and the outline of the heat sink 1 may both be straight line segments or a combination of multi-point straight line segments.
  • k1 is a constant and h is the height of the heat sink 1.
  • the value of k1 is 100 to 200.
  • the value of k2 is 100 to 200.
  • the value of k1 is 140 to 150, and the value of k2 is 170 to 200.
  • the height of the lamp neck 22 is greater than 80% of the height of the heat sink 1. Since the lamp neck 22 and the heat sink 1 are separated in the axial direction, the two are not overlapped, so the power source 5 in the lamp neck 22 is less affected by the heat sink 1, and therefore, when the height of the lamp neck 22 is larger than the heat sink 1 When the height is more than 80%, more space is available to set the power source 5, and this part of the power source is less affected by the heat sink 1. In addition, when the power source 5 in the lamp housing 2 reaches the heat dissipation effect by the convection method, the height of the lamp neck 22 can ensure the height of the lamp housing 2 to ensure the chimney effect during convection heat dissipation.
  • the outer contour of the LED lamp in this embodiment is displayed, and a rectangular coordinate system is established, with the axial direction of the LED lamp as the y-axis, the radial direction of the LED as the x-axis, and the center of the bottom surface of the LED lamp as the origin.
  • the outer contour of the side of the LED lamp is rotated 360 degrees around the axis of the LED lamp with a contour to form the outer contour of the LED lamp (excluding the lamp cap).
  • the outline includes the outline of the lamp neck 22 and the outline of the heat sink 1. As shown in FIG.
  • the outer contour of the LED lamp in this embodiment includes a first curved surface and a second curved surface, and the first curved surface and the second curved surface together form a curved surface of the outer contour of the LED lamp, and the first curved surface includes the lamp neck 22
  • the curved surface of the outer contour is either the outer contour of the neck 22 and the curved surface of the outer contour of the portion of the heat sink 1, and the second curved surface includes a curved surface of the outer contour of the heat sink 1 or a curved surface of the outer contour of the partial heat sink 1.
  • the outline of the lamp neck 22 in this embodiment is a curved or substantially curved line
  • the outline of the heat sink 1 is a curved or rough curve to avoid forming an angle and cutting the hand, and on the other hand, The convection air convects more smoothly along the outside of the LED lamp.
  • the radius of curvature of the outline of the lamp neck 22 in this embodiment is greater than the radius of curvature of the outline of the heat sink 1. It should be noted that the radius of curvature of the outline of the lamp neck 22 referred to herein is larger than the outline of the heat sink 1.
  • the radius of curvature of the line means that the radius of curvature of 60% of the outline of the lamp neck 22 is larger than the radius of curvature of more than 60% of the outline of the heat sink 1, and the radius of curvature of the outline of the lamp neck 22 is considered to be larger than The radius of curvature of the outline of the heat sink 1.
  • the contour of the neck of the lamp neck 22 in the present embodiment has a radius of curvature of 120 mm to 3000 mm, preferably 150 mm to 200 mm, more preferably 160 mm to 190 mm, and most preferably 170 mm to 185 mm.
  • the contour of the heat sink 1 has a radius of curvature of 30 mm to 150 mm, preferably 70 mm to 130 mm, more preferably 80 mm to 120 mm, and most preferably 90 mm to 110 mm.
  • the lamp neck 22 has a radius of curvature of 180 mm or more of a contour of 180 mm, and the radius of curvature of the lamp neck 22 is considered to be 180 mm.
  • the curve approximate to the contour line represents the curvature of the contour line, that is, the contour line itself may not be a curve.
  • the outline of the lamp neck 22 and the outline of the heat sink 1 are respectively related to the width of the LED full lamp, and the LED lamp width dimension (the widest part of the LED lamp)
  • the contour of the neck of the lamp neck 22 in this embodiment has a radius of curvature of 0.6 L to 15 L, preferably 0.75 L to L, more preferably 0.8 to 0.95 L, and most preferably 0.85 L to 0.925 L.
  • the contour of the heat sink 1 has a radius of curvature of 0.15 L to 0.75 L, preferably 0.35 L to 0.65 L, more preferably 0.4 L to 0.6 L, and most preferably 0.45 L to 0.55 L.
  • the curvature of the outline of the lamp neck 22 and the curvature of the outline of the heat sink 1 vary with the width of the entire lamp of the LED lamp.
  • the outer diameter of the lamp neck 22 is R
  • the radius of curvature of the contour of the heat sink 1 is greater than L/2-R/2 to ensure that the heat sink has a sufficient height to ensure the second. Chimney effect of the heat dissipation channel 7b.
  • the outline of the neck 22 of the lamp neck 22 is 10 to 50 degrees, preferably 20 to 35 degrees, more preferably 25 to 30 degrees. In this way, the lamp neck 22 is maintained at a certain height to ensure a turbulent chimney effect in the lamp neck 22.
  • the outline of the heat sink 1 occupies a central angle d of 40 to 120 degrees, preferably 55 to 90 degrees, more preferably 65 to 80 degrees, and most preferably 70 to 75 degrees. To control the overall height of the heat sink 1.
  • the outline of the lamp neck 22 is a concave curve, and the line connecting the vertex and the bottom point of the outline of the lamp neck 22 is a virtual straight line, and the outline of the lamp neck 22 is all located inside the straight line (close to The side of the axis of the LED lamp), and the outline of the heat sink is a convex curve, and the line connecting the vertex of the heat sink 1 and the bottom point is a virtual straight line, and the outline of the heat sink 1 is all located on the straight line. Outside (away from the side of the LED lamp axis).
  • the contour is a smooth or substantially smooth curve to avoid forming an angle and cutting the hand.
  • the convection air can be convected more smoothly along the outside of the LED lamp.
  • the outline of the LED lamp in this embodiment is roughly an "S" curve or an inverted “S” curve, which includes the curve on the lamp neck 22 and the curve on the heat sink 1.
  • the curve on the neck 22 and the curve on the heat sink 1 together form an "S" shape or an inverted “S” curve.
  • the junction of the lamp neck 22 and the heat sink 11 may form an angle to break the smoothness of the portion of the curve, but in general, the outline as a whole is smooth.
  • the lamp neck 22 and the heat sink 1 may also be separated (for example, the lamp neck 22 and the heat sink 1 are kept at a certain interval), that is, the curve on the lamp neck 22 and the curve on the heat sink 1 are disconnected.
  • the outline is still smooth overall.
  • the outer contour of the lamp neck 22 is a concave curve, so that the increase in the size of the lamp neck 22 is increased during the downward process, so that the bottom of the final lamp neck 22 has a larger size to be combined with the heat sink 1, also That is to say, the starting position of the upper portion of the heat sink 1 can be made larger.
  • the outer contour of the heat sink 1 is a convex curve, so the size reduction of the heat sink is increased in the upward process, and therefore, the size of the lower portion of the heat sink 1 is slowed down, so that the lower portion has more available for use.
  • FIG. 70a a schematic diagram of the cooperation between the LED lamp and the lamp 6 in this embodiment is shown.
  • the luminaire 6 in this embodiment has a accommodating cavity 61 in which the LED lamp is disposed.
  • the lower portion of the accommodating cavity 61 is open to facilitate the installation of the LED lamp from the lower portion of the luminaire 6 into the accommodating cavity 61, and the heat generated by the LED lamp during the operation is diffused into the accommodating cavity 61, and can be convected via air. The way it scatters from the open.
  • the LED lamp when the LED lamp dissipates heat, a part of the heat can be directly transmitted to the lamp 6 in the form of heat radiation, and the lamp 6 transmits heat to the outside of the lamp 6, and a part of the heat is transmitted to the lamp by conduction and convection.
  • the air in the space between the 6 and the LED lamp is transmitted to the outside of the lamp 6 by convection, conduction or radiation.
  • FIG. 70b a schematic diagram of the cooperation between the LED lamp and the lamp 6 in an embodiment is shown.
  • a convection hole 62 is defined, and the convection hole 62 is provided at an upper portion of the lamp. In this way, when the heat of the LED lamp is transmitted to the air of the accommodating chamber 61, it can be convected upward through the convection hole 62, thereby taking away the hot air.
  • FIG. 70c a schematic diagram of the cooperation of the LED lamp and the lamp 6 in an embodiment is shown.
  • the luminaire 6 in this embodiment has a closed accommodating cavity 61.
  • the LED lamp After being placed in the accommodating cavity 61, the LED lamp can be dust-proofed by being isolated from the outside, and dust can be prevented from accumulating outside or inside the LED lamp.
  • the air of the accommodating cavity 61 After the heat generated by the operation of the LED lamp is transmitted to the air of the accommodating cavity 61, the air circulates inside the accommodating cavity 61, and the heat is transmitted to the luminaire 6 in the form of heat conduction and heat radiation. The heat is transmitted from the luminaire 6 to the outside.
  • the lamp 6 can be made of metal or plastic. If the metal material is used, it will be more conducive to heat dissipation. If the material is made of plastic, the weight is lighter and the cost is lower. If the plastic material is used, the lamp 6 can be designed. It is light transmissive. In the case where the luminaire 6 is closed, the luminaire 6 is preferably made of a metal material in consideration of heat dissipation.
  • Figure 65a is an exploded schematic view of the lamp housing 20 of the LED lamp in some embodiments, showing the lamp housing 20 of a different style.
  • Figure 65b is a schematic view of the assembly of Figure 65a.
  • Figure 65c is an exploded perspective view of the LED lamp of Figure 65a.
  • Figure 65d is an exploded perspective view of the LED lamp of Figure 65a.
  • Figure 65e is a cross-sectional view of the LED lamp of Figure 65a. As shown in FIG. 65a, FIG. 65b and FIG.
  • the lamp housing 20 includes a lamp cap 230, a lamp neck 220 and an inner sleeve 210; the lamp cap 230 is screwed to the lamp neck 220, and the lamp neck 220 is connected to the inner sleeve 210.
  • the inner sleeve 210 is connected to the heat sink 10.
  • the side of the lamp neck 220 is provided with a groove 2230.
  • the rib 2110 of the inner sleeve 210 is aligned with the groove 2230, and the inner sleeve 210 is pushed toward the lamp neck 220, and then rotated.
  • the lamp neck 220 is engaged with the inner sleeve 210.
  • the heat sink 10 is provided with a positioning groove 1210, and the positioning groove 1210 is located on the inner side wall of the heat dissipation column 120.
  • the inner sleeve 210 is provided with a card slot 2140.
  • the power source 50 includes a power board 510, and the power board 510 is inserted into the card slot 2140 to fix the power source 50.
  • the number of the card slots 2140 is set according to the shape of the power board 510, such as a power source. When the plate 510 has a two-dimensional shape, the number of the card slots 2140 is two.
  • the card slot may be formed in the form of a rib, and the upper rib or the two mutually perpendicular ribs in the inner wall edge of the inner sleeve 210 fix the power board 510 in the inner sleeve 210.
  • the power source 50 may also include electronic components such as a transformer, a capacitor, a resistor, an inductor, a fuse, a MOS tube, etc., when the power board 510 is inserted into the inner sleeve 210, the power source 50 is more likely to generate heat, or when the LED lamp is operated, a temperature is generated.
  • Higher electronic components such as transformers, capacitors, or MOS tubes
  • transformers, capacitors, or MOS tubes are disposed adjacent the bottom end of the inner sleeve 210 in the arrangement of the power strip 510, that is, the airflow passage inlets that are closer to the heat sink 10 than other electronic components.
  • the electronic components with higher operating temperatures such as transformers, capacitors or MOS tubes
  • the path of the cold air flowing to the higher temperature electronic components is the shortest, which is a good pair.
  • the heat-generating electronic component dissipates heat, further reducing the temperature inside the cavity of the lamp housing 20, thereby improving the working stability of the LED lamp.
  • the positioning sleeve 2120 corresponding to the positioning slot 1210 of the heat sink 10 is disposed on the inner sleeve 210.
  • the positioning post 2120 is inserted into the positioning slot 1210, and the inner sleeve 210 is pushed toward the heat sink 10, so that the inner sleeve 210 and the heat sink 10 are engaged. .
  • the lamp cap 230 is screwed to the lamp neck 220, and the power board 510 is inserted into the card slot 2140 inside the inner sleeve 210, and then the lamp neck 220 is connected to the inner sleeve 210.
  • the positioning post 2120 outside the inner sleeve 210 is inserted into the positioning groove 1210 of the heat sink 10, so that the inner sleeve 210 is passed through the central cavity of the heat sink 1 to the bottom of the heat sink 1; finally, the light board 3 is fixed to the heat sink by, for example, riveting.
  • the lamp cover 40 is fastened to the heat sink 10.
  • the invention When assembling, the invention adopts a re-disassemblable buckle design, which is convenient for disassembly and assembly while ensuring the connection strength, does not damage any parts during the disassembly and assembly process, and the parts can be reused, which solves the problem that the screw connection in the technology takes a long time, The high labor cost and the disadvantage of high scrap rate in the repair and disassembly process of the lamp body structure parts.
  • the heat dissipation fins include a first heat dissipation fin 1110 and a second heat dissipation fin 1120.
  • the first heat dissipation fins 1110 and the second heat dissipation fins 1120 are spaced apart from each other, and the second heat dissipation fins 1120 are disposed on the second heat dissipation fins 1120.
  • the inner sleeve 210 is generally in the shape of a hollow cylinder, and the inner cavity of the inner sleeve 210 may be a narrower and narrower channel structure (the lower cross-sectional area of the lower portion of the inner sleeve 210 is smaller than the upper cross-sectional area).
  • the aspect ratio of the entire inner structure is greater than 2.5, and the chimney effect is more pronounced, preferably 2.5-10.
  • the overall height H of the inner sleeve 210 can be 40-80 mm. This lower width and narrower structure enhances the effect of the chimney effect and helps to promote air flow inside the inner sleeve 210.
  • the top end of the inner sleeve 210 is engaged with the top channel of the lamp neck 220. After the hot air inside the inner sleeve 210 is collected to the top end thereof, it can be transmitted to the heat dissipation hole 2220 of the lamp neck 220 via the top channel of the lamp neck 220, and then the lamp housing is discharged. 20 to achieve the purpose of heat dissipation.
  • the size of the inner sleeve 210 described above is only one of the modes of the implementation, and is not intended to limit the scope of the invention.
  • the heat dissipation method of the LED lamp includes heat dissipation of the LED chip 311 and heat dissipation of the power source, wherein
  • the heat dissipation for the LED chip 311 includes the following steps:
  • a light board 3 is disposed, and the LED chip 311 is mounted on the light board 3, so that at least part of the heat generated when the LED chip 311 is operated is transmitted to the light board 3 by heat conduction;
  • a heat sink 1 is disposed, and the light board 3 is disposed on the heat sink 1. at least part of the heat generated when the LED chip 311 is operated can be transferred to the heat sink 1 by heat conduction through the heat of the light board 3, and by The radiator 1 radiates heat to the surrounding air and convects the hot air in a convective manner.
  • step S102 specifically includes:
  • a heat dissipating fin 11 is disposed on the heat sink 1.
  • the heat sink 1b includes a second heat dissipating channel 7b, and the second heat dissipating channel 7b is disposed with a second air inlet hole 1301.
  • the convective air enters through the second air inlet hole 1301. a space between the heat dissipation fins 11 to take away heat radiated to the air by the heat dissipation fins 11, wherein the second air inlet hole 1301 is disposed in a lower portion of the heat sink 1;
  • the heat sink 1 is provided with a third heat dissipation channel 7c, and the third heat dissipation channel 7c is formed between the two heat dissipation fins 11 or between the two sheets extending from the same heat dissipation fin 11 between the two heat dissipation fins 11
  • the radially outer portion constitutes the inlet of the third heat dissipating passage 7c, and the air enters the third heat dissipating passage 7c from the radially outer portion of the LED lamp, and takes away heat radiated from the fins 11 to the air.
  • At least one heat dissipating fin 11 is divided into two parts in the radial direction of the LED lamp, and the two parts are spaced apart in the radial direction of the LED lamp, thereby forming a flow path at the above interval.
  • the heat sink 1 dissipates heat, the convective air can convect at intervals, thereby improving the efficiency of convection.
  • the weight of the heat sink 1 is configured to be more than 50% of the LED lamp, preferably 55% to 65%, and the volume of the heat sink 1 is used. It is disposed to account for 20% or more of the volume of the LED lamp, preferably 25% to 50%.
  • the heat dissipation fins 11 are projected in the height direction (axial direction) of the LED lamp (projected to the plane of the LED chip 311) to contact at least one LED chip 311, That is, in the height direction (axial direction) of the LED lamp, at least a part of the projection of the heat radiation fin 11 overlaps or partially overlaps with the at least one LED chip 311. Therefore, in the heat dissipation process, the heat conduction path of the LED chip 311 is shorter, the thermal resistance can be reduced, and heat conduction is facilitated.
  • the projection of any one of the heat dissipation fins 11 in the height direction (axial direction) of the LED lamp (projected to the plane of the LED chip 311) contacts at least one LED chip 311.
  • the lamp panel 3 has an inner boundary 3002 and an outer boundary 3003.
  • the inner boundary 3002 and the outer boundary 3003 extend along the axial direction of the LED lamp to form a
  • the heat dissipation fins 11 are disposed such that the area of the heat dissipation fins 11 located in the area is larger than the area of the heat dissipation fins 11 located outside the area, so that most of the heat dissipation fins 11 of the heat sink 1 correspond to each other.
  • the light board 3 can improve the utilization ratio of the heat dissipation fins 11 and increase the effective heat conduction area of the heat dissipation fins 11 to the LED chips 311.
  • a method for dissipating heat of a power source includes the following steps:
  • a lamp housing 2 having a first heat dissipation channel 7a is disposed, the power source 5 is disposed in the first heat dissipation channel 7a, wherein the first heat dissipation channel 7a has a first air inlet hole 2201 and a heat dissipation hole 222;
  • the convective air enters the first heat dissipation passage 7a from the first air inlet hole 2201, and the heat generated when the power source 5 operates is radiated to the surrounding air, and the convective air discharges the hot air from the heat dissipation hole 222 by convection. This can prevent the power supply 5 from operating in a high temperature environment, which affects the life and quality of the power supply.
  • At least one heat generating component 501 (resistance, inductance, integrated circuit, transformer or rectifier bridge, etc.) is disposed in the first heat dissipation channel 7a near the lamp head 23, and is projected perpendicular to the axial direction of the LED lamp. At least one heat generating component 501 transfers heat to the base 23 by heat conduction or heat radiation, and dissipates heat through the lamp head 23 to the air or to the socket connected thereto.
  • At least one heat generating component 501 is in thermal contact with the lamp cap 23, at least one heat generating component 501 is located in the lamp cap 23, and the heat generating component 501 is in contact with the lamp cap through the heat conductive material 53, and the heat generating component 501 passes through the heat conductive material 53 and the lamp cap. 23 fixed. Therefore, by the arrangement of the heat conductive material 53, the heat conduction to the lamp cap can be achieved, and the heat generating component can be fixed to prevent the heat generating component 501 from loosening.
  • the position of the at least one heat generating component 501 in the axial direction of the LED lamp is higher than the position of the heat dissipation hole 222, and the heat of the heat generating component 501 higher than the heat dissipation hole 222 passes through the lamp cap 2 or other means. Cooling.
  • At least one heat generating component and other heat generating components are disposed on different surfaces of the power board 51.
  • the heat is radiated to the surrounding air by convection along the two side surfaces.
  • an assembly method of an LED lamp includes the following steps:
  • a light board 3 is disposed, and an LED chip 311 is disposed on the light board 3;
  • the power source 5 is installed in the lamp housing 2;
  • the lamp housing 2 is mounted on the heat sink 1, and the power source 5 is electrically connected to the light board 3;
  • a lamp cover 4 is disposed, and the lamp cover 4 is fixed on the heat sink 1 and covered on the light board 3 so that the light generated by the LED chip 311 is transmitted through the light output surface 43 of the lamp cover 4.
  • the sequence of steps can be adjusted according to the actual assembly needs.
  • the light board 3 is connected to the heat sink 1 in a fitting manner, so that the light board 3 and the heat sink 1 are integrally formed.
  • step S304 when the lamp housing 2 is disposed, threads are provided on the lamp cap 23 and the lamp neck 22 so that the lamp cap 23 and the lamp neck 22 are directly connected by threads.
  • step S307 the inner sleeve 21 of the lamp housing 2 is first connected to the heat sink 11 in a detachable connection manner such as snapping, snapping, or the like.
  • the inner sleeve 21 is directly connected to the heat sink 11 together with the lamp housing 2, or the inner sleeve 21 is separately connected to the heat sink 1, and then the lamp housing 2 is connected.
  • the other components are fixed to the inner sleeve 21, that is, the connection of the lamp neck 22 and the inner sleeve 21 is fixed.
  • connection structure and method of the inner sleeve 21 and the heat sink 1 are specifically as follows: the heat sink 1 has a center hole, the inner sleeve 21 has a bump 217 on the surface thereof, and the bump 217 has a first limiting surface.
  • the outer circumferential surface of the inner sleeve 21 protrudes from the outer circumferential surface, and the heat dissipation fins 11 of the heat sink 1 have a larger pitch than the width of the bump 217 in the radial inner side, and the inner sleeve 21
  • the bump 217 is aligned with the heat radiating fins 11 and inserted into the heat sink 1 until the first limiting surface 2171 of the bump 217 is beyond the axial direction of the LED lamp.
  • the bottom surface of the heat dissipation fin 11 rotates the inner sleeve 21 to offset the first limiting surface 2171 and the bottom surface of the heat dissipation fin 11.
  • the inner sleeve 21 further has a second limiting surface 218.
  • the second limiting surface 218 abuts against the top surface of the heat dissipation fin 11 , thereby connecting the inner sleeve 21 and the heat sink 1 without External components such as bolts are more convenient to disassemble.
  • the inner sleeve 21 needs to be removed, the above steps can be reversed.
  • the third limiting surface 2172 is disposed on the inner sleeve, and the third limiting surface 2172 is located on one side of the protrusion 217 in the circumferential direction of the inner sleeve 21 to restrict the rotation of the heat dissipation fin 11 and is mounted to the inner sleeve 21 to
  • the bump 217 is aligned with the two heat dissipation fins 11 and inserted into the heat sink 1 until the first limiting surface 2171 of the bump 217 extends beyond the heat dissipation fin 11 in the axial direction of the LED lamp.
  • the bottom surface of the bottom cover 21 is rotated to prevent the first limiting surface 2171 from abutting against the bottom surface of the heat dissipation fin 11 until the side portion of the heat dissipation fin 11 is offset from the third limiting surface 2172 to prevent excessive rotation.
  • the first limiting surface 2171 is displaced from the heat dissipation fin 11 .
  • the inner casing 21 and the lamp neck of the lamp housing 2 are connected as follows: the inner sleeve 21 has a first positioning unit 211, and the lamp neck 22 has a second positioning unit 221, the first positioning unit.
  • the 211 is engaged with the second positioning unit 221 .
  • the first positioning unit 211 is a fastening portion that is formed on the inner sleeve
  • the second positioning unit 221 is a buckle that is opened on the lamp neck, and the fastening portion is directly connected to the buckle.
  • step S308 the specific connection method of the lamp cover 4 and the heat sink 1 is as follows: the lamp cover 4 is provided with a fastening portion 46, and the heat sink 1 is provided with a hole at a corresponding position, and the lamp cover 4 is provided. The fastening portion 46 is caught on the back surface 134 of the heat dissipation base 13 through the gap.
  • Figure 71 is a first schematic diagram of the circuit layout of the LED module in some embodiments.
  • Figure 72 is an enlarged schematic view of the portion D in Figure 71.
  • Figure 73 is a second schematic diagram of the circuit layout of the LED module in some embodiments. Both the LED module of FIG. 71 and the LED module of FIG. 72 can be applied to the LED lamp of FIG.
  • the LED module 70 includes at least one LED unit 710. There are two or more LED units 710, and the LED units are connected in parallel. Each LED unit 710 includes at least one LED 711. When one LED unit 710 includes a plurality of LEDs 711, the LEDs 711 of the same LED unit 710 are connected in series.
  • the positive end of the first LED 711 is coupled to the positive end of the LED unit 710, and the negative end of the first LED 711 is coupled.
  • Next or second LED 711 The positive terminal of the last LED 711 is coupled to the negative terminal of the previous LED 711, and the negative terminal of the last LED 711 is coupled to the negative terminal of the LED unit 710.
  • the LED module 70 includes five LED units 710. As shown in the figure, the LED modules 70 are distributed on two circumferences, namely an inner circumference and an outer circumference, wherein the inner circumference is set. There are two complete LED units 710, and two complete LED units 710 are disposed on the outer circumference, and in the fifth LED unit 710, most of the LEDs 611 are disposed on the outer circumference, and a small portion is disposed on the inner circumference. That is to say, the LED 711 on the inner circumference of the fifth LED unit 710 is smaller than the LED 711 located on the outer circumference.
  • the LED module 70 includes ten LED units 710. As shown in the figure, the LED modules 70 are distributed on three circumferences, that is, inner circumference, middle and outer circumference, wherein the inner circumference Two complete LED units 710 are disposed on the outer circumference, and four complete LED units 710 are disposed on the outer circumference, and three complete LED units 710 are disposed in the middle, and the tenth LED unit 710 is provided with most of the LEDs 711 On the inner circumference, a small portion is provided on the outer circumference, that is, the LED 711 on the inner circumference of the tenth LED unit 710 is more than the LED 711 on the outer circumference.
  • the number of LEDs 711 in the LED unit 710 is preferably 10 to 20, more preferably 12 to 16.
  • the LEDs 711 are substantially disposed along the circumferential direction of the lamp panel 3 on the lamp panel 3, and if the LEDs 711 of the same LED unit 710 are all located on the same circumference, the LEDs 711 are between It is connected by the first wire 712, in other words, the series connection between the LEDs 711 on the same circumference is realized by the first wire 712.
  • the LED of the same LED unit 710 is divided into two parts, one part is on one circumference and the other part is on a different circumference, the LEDs 711 on the same circumference of the same LED unit 710 are connected by the first wire 712, and the same The LEDs 711 on different circumferences of the LED unit 710 are connected by a second wire 713.
  • the width of the second wire 713 is smaller than that of the first wire 712, so that the arrangement of the LEDs 711 is better, if the width of the second wire 713 is too large.
  • the spacing of the associated LEDs 711 on the respective circumferences is affected such that the spacing is significantly greater than the spacing of the other LEDs 711.
  • the first wire 712 has a width which is at least larger than the width of the LED 711 (LED chip 311), and the first wire 712 is made of a metal material having good thermal conductivity.
  • the heat dissipation of the LED 711 (LED chip 311) is facilitated, and since the width of the first wire 712 is at least larger than the width of the LED 711 (LED chip 311), the mounting of the LED 711 is facilitated, making it easier to form an electrical connection with the first wire 712.
  • the LEDs 711 are distributed on different circumferences of the lamp panel 3, that is, the lamp panel 3 has at least two sets of circumferences for arranging the LEDs 711, which are substantially concentric. of.
  • the first wire 712 is used in series between the LEDs 711 located on the innermost or outermost circumference, and at least a portion of the first wires 712 are wider than the other first wires 712, and the LEDs 711 located on the innermost or outermost circumference
  • the first wire 712 is used in series connection between the first wire 712, and the first wire 712 is used when the LEDs 711 on the innermost or outermost circumference are connected in series because there is no other LED 711 disposed on the outer side or the inner side thereof.
  • the expanded portion 7121 is disposed on the inner side or the outer side of the radial direction to increase its width, thereby increasing the area of the first wire 712, which is more advantageous for heat dissipation. Taking a diagram of FIG. 73, it has three circumferences in which the LEDs 711 are disposed, wherein the width of the first wire 712 on the innermost and outermost circumferences is significantly larger than the width of the first wire 712 on the circumference of the intermediate side.
  • the lamp board 3 is provided with a hole 301 for mounting the lamp board 3.
  • the lamp board 3 is riveted or screwed to the heat sink base 13 through the hole position 301, because the hole position 301 occupies space. Therefore, the first wire 712 corresponding to the hole position 301 is closer to the inner side or the outer side than the first wire 712 on the same circumference, thereby avoiding the hole position 301.
  • the width of the first wire 712 having the expanded portion 7121 is smaller than the width of the first wire corresponding to the hole position 301, whereby the amplitude of the first wire 712 avoiding the hole position 301 can be reduced.
  • the area of the single LED 711 is M1
  • a single LED 711 is projected onto the lamp panel 3, and the area covered by it covers
  • the different LED units 710 are connected by a third wire 714, the third wire 714 connects the positive poles of the first LEDs 711 of the two different LED units 710, or the third wire 714 connects two different ones.
  • the third wire 714 has a smaller width than the first wire 712.
  • the LED module 70 includes two electrode terminals, as shown in the embodiment, a positive terminal 701 and a negative terminal 702, and the positive terminal 701 and the negative terminal 702 are compared with any one of the LEDs 711 and the first wire. 712, the second wire 713 or the third wire 714 is located on the inner side of the lamp plate 3 of the LED lamp.
  • the positive terminal 701 and the negative terminal 702 may be disposed to be located further outward than the radial direction of the LED lamp panel than any one of the LEDs 711, the first wire 712, the second wire 713, or the third wire 714.
  • the positive terminal 701 and the negative terminal 702 facilitate the connection with the power source 5.
  • the positive terminal 701 and the negative terminal 702 have different shapes to facilitate differentiation.
  • a power module for powering an LED lamp including: an input end (ACN, ACL) for receiving an AC drive signal; and a first rectifier circuit 100 for using the AC drive signal Converting to a rectified signal; a filter circuit 200 for converting the rectified signal into a filtered signal; and a power conversion circuit 400 for converting the filtered signal into a power signal capable of illuminating the LED light source 500;
  • the input terminal (ACN, ACL) and the power conversion circuit 400 are connected to a bias generating circuit 600.
  • the bias generating circuit 600 can step down the AC driving signal to form an operating voltage of the power converting circuit 400.
  • the power supply module provided by the embodiment provides a bias voltage generating circuit 600 to step down the AC drive signal to form an operating voltage of the power conversion circuit 400, and provides an operating voltage for the power conversion circuit 400 to cause the power conversion circuit 400 to operate.
  • the LED light source 500 is driven to light. It can be seen that the power module uses the bias generating circuit 600 to perform power conversion on the externally input AC driving signal through the active power conversion mode, so that the working voltage required by the power converting circuit 400 can be quickly formed, thereby effectively improving the starting speed of the LED lamp.
  • the startup speed of the HID-LED can be reduced to about 60 ms, which has a very high application value and a good use experience.
  • the power module can be applied to a high power LED lamp, wherein the power conversion circuit 400 can output more than 30W.
  • the input terminal can be two pins of the power module: a first pin ACL and a second pin ACN.
  • the AC drive signal is input through two pins.
  • the AC drive signal can be a 220V AC signal or an AC signal of other voltage values.
  • the input end (ACN, ACL) can also have multiple pins, for example, four pins, etc., only need to be able to input AC power, and the application is not limited.
  • the first rectifier circuit 100 may be a bridge rectifier circuit. As shown in FIG. 76, FIG. 76 is a schematic diagram of a rectifier circuit and a filter circuit according to an embodiment of the present application.
  • the first rectifier circuit 100 includes diodes D7, D8, D9, and D10.
  • the first rectifying circuit 100 can perform full-wave rectification on the AC driving signal (alternating current) to generate a DC driving signal (direct current).
  • an anode of the diodes D7 and D9 is electrically connected to the first end of the filter circuit 200, and cathodes of the diodes D7 and D9 are electrically connected to the anodes of the diodes D8 and D10, respectively, and the diodes D08 and D10 are respectively connected.
  • the cathode is electrically connected to the second end of the filter circuit 200.
  • the connection point of the diode D7 and the diode D8 is electrically connected to the first pin ACL.
  • the anodes of the diodes D7 and D9 are electrically connected to one end of the filter circuit 200, the cathode is electrically connected to the anodes of the diodes D8 and D10, and the cathode of the diode D8 is electrically connected to the cathode of the diode D10.
  • the connection points of the diodes D9 and D10 described above are electrically connected to the second pin ACN.
  • the first rectifying circuit 100 may be other types of full-wave rectifying circuits or half-wave rectifying circuits without affecting the functions to be achieved by the present invention.
  • the filter circuit 200 includes capacitors C1 and C2 and an inductor L1.
  • the first end of the capacitor C1 and the inductor L1 is electrically connected to the cathode of the diodes D8 and D10, and the second end of the inductor L1 is electrically connected to the first end of the capacitor C1, and the capacitors C1 and C2 are The two ends are electrically connected to the anodes of the diodes D7 and D9 at the first end of the filter circuit 200.
  • the filter circuit 200 receives the direct current (rectified signal) rectified by the first rectifier circuit 100, and filters out high frequency components in the direct current.
  • the DC power filtered by the filter circuit 200 has a smooth DC waveform.
  • the filtered signal is supplied to the subsequent stage circuit via terminals 301 and 302.
  • the filter circuit 200 may also only include the capacitor C1 to implement the filtering function without affecting the functions to be achieved by the present application.
  • an electromagnetic interference suppression circuit 900 (which may also be referred to as an EMI suppression circuit) as shown in FIG. 75 may be provided between the input terminal ACN, the ACL, and the rectifier circuit 100.
  • the influence of the disturbance magnetic field on the drive signal can be reduced by the electromagnetic interference suppression circuit 900.
  • the excitation coil LF2 is connected to the power supply line (busbar, trunk) connected to the two pins of the input terminals ACN and ACL, and the resistance branch connected to the trunk circuit (for example, the resistor R1 is located)
  • the branch circuit and the branches of the plurality of capacitor branches (such as capacitors CX2, CX1, and CX3) are electrically connected to the inductors Li1 and Li2 on the two main roads, respectively.
  • the electromagnetic interference suppression circuit 900 can employ an EMI filter circuit having a plurality of filter components.
  • the EMI filter circuit is provided with a differential mode capacitor, a common mode inductor, and a common mode capacitor.
  • the power conversion circuit 400 can convert the filtered signal into a power signal capable of illuminating the LED light source 500.
  • the power conversion circuit 400 can change the voltage value of the filtered signal to form a DC drive signal of the target voltage value.
  • the power conversion circuit 400 has an output to output a DC drive signal of a target voltage to the LED light source 500.
  • a fuse F1 may be connected in series on the dry circuit connected to the input terminal ACN and the ACL.
  • the fuse F1 can be a current fuse or a thermal fuse, and the embodiment is not limited.
  • the power conversion circuit 400 receives the signal supplied from the preceding stage circuit through the connection terminals 401 and 402, and supplies the generated power supply signal to the subsequent stage through the connection terminals 501 and 502, wherein the power conversion circuit
  • the 400 can use PWM (Pulse Width Modulation) circuit to achieve the output of the target signal by controlling the pulse width.
  • the power conversion circuit 400 can include a controller U2, a power switch Q2, a voltage transformer T2, and a diode D10.
  • the controller U2, the power switch Q2, the diode D10, and the energy storage coil (the voltage transformer T2 is connected in series with the power)
  • the coil between the switch Q2 and the connection terminal 502 cooperates with a power supply signal (DC drive signal) for outputting a desired voltage value and/or current value.
  • the conversion controller U2 is activated in response to the operating voltage VCC signal supplied from the bias generating circuit 600, thereby outputting a PWM control signal to control the switching of the power switch Q2, so that the energy storage coil is responsive to the switching of the power switch Q2.
  • the charge and discharge are repeatedly charged and continuously flowed through the diode D4 tube, thereby forming a desired power signal between the connection terminal 501 and the connection terminal 502.
  • the power switch Q2 can be a MOS switch tube.
  • the first end (power supply end) of the controller U2 is connected to the output end of the bias generating circuit 600, and the second end of the controller U2 is connected to one end of the induction coil of the voltage transformer T2.
  • the one end of the energy storage coil of the voltage transformer T2 is connected to the negative end of the DC output end (ie, the connection end 502), and the other end is connected to the anode of the diode D4.
  • the anode of diode D4 is connected to the positive terminal of the DC output (ie, terminal 501).
  • One end of the induction coil of the voltage transformer T2 to which the second end of the controller U2 is connected, and the other end of the induction coil is grounded.
  • the third end of the controller U2 is connected to the control end of the power switch Q2 through a resistor R9.
  • the first end of the power switch Q2 is connected to the connection point between the diode D4 and the voltage transformer T2, and the second end of the power switch Q2 is connected.
  • the power conversion circuit 400 can also be provided with a sampling circuit to sample its operational state and serve as a reference for the output signal of the controller U2.
  • the sampling circuit includes, for example, the inductors of the resistors R8 and R10, the capacitor C6, and the voltage transformer T2, wherein the controller U2 can sample the bus voltage from the resistor R8 and the capacitor C6 through the first terminal, and The induction coil samples the output current and samples the current flowing through the power switch Q2 from one end of the resistor R10 through the fourth terminal.
  • the setting of the sampling circuit is related to the control mode of the controller U2, and the disclosure is not limited thereto.
  • At least one end of the switch controller U3 is connected to the branch where the inductor L2 is located, and a filter component and/or a steady flow component may be disposed between the switch controller and the inductor, which is not limited in the application.
  • a power factor correction circuit 300 may also be disposed between the power conversion circuit 400 and the filter circuit 200.
  • the power factor correction circuit 300 is capable of boosting a power factor of the filtered signal by adjusting a signal characteristic (eg, phase, level, or frequency, etc.) of the filtered signal; the power factor correction circuit 300 and the bias voltage
  • the outputs of the generating circuit 600 are connected.
  • the power factor correction circuit is a PFC circuit, and the power factor correction circuit may be an active power factor correction circuit 300.
  • the power factor correction circuit 300 can receive signals from the filter circuit 300 through the connection terminals 301 and 302, and transmit the corrected signals to the power conversion circuit 400 of the subsequent stage through the connection terminals 401 and 402,
  • the power factor correction circuit 300 includes a controller U1, a power switch Q1 connected to the controller U1, a voltage transformer T1, and a diode D3.
  • the power switch Q1 can be a MOS switch tube.
  • a first end (power terminal) of the controller U1 is coupled to an output 607 of the bias generating circuit 600.
  • the second end of the controller U1 is connected to one end of the voltage transformer T1, one coil of the voltage transformer T1 is connected in series on the trunk, and the other end of the coil connected to the second end of the controller U1 is grounded.
  • the trunk is connected to the positive terminal of the DC output (also referred to as the third pin 501).
  • Diode D3 is connected in series on the dry path.
  • the anode of the diode D3 is connected to one end of the voltage transformer T1 and the filter circuit 200, and the cathode is connected to a connection end 401 for connecting the end power conversion circuit 400 and the third pin 501.
  • the third end of the controller U1 is connected to the power switch Q1, and one end of the power switch Q1 is connected to a fifth connection point between the diode D3 and the voltage transformer T1.
  • the controller U1 can also be connected with a sampling circuit (the connection point between the resistor R2 and the capacitor C3 is connected to the controller U1, the capacitor C3 is connected in parallel with the resistor R3), and other circuits, as shown in FIG. 5.
  • the PFC circuit has multiple implementation forms, and can be referred to in the present embodiment, and will not be described in detail herein.
  • FIG. 79 is a schematic diagram of a bias generating circuit of the first embodiment of the present application.
  • the bias generating circuit 600a may include a power taking unit 610, a switch controller U3, and an energy storage freewheeling unit 630.
  • the power taking unit 610 is connected to the input end (ACN, ACL) and the switch controller U3.
  • the switch controller U3 is connected to the energy storage freewheeling unit 630.
  • the energy storage freewheeling unit 630 has an output 607 for outputting an operating voltage.
  • the output terminal 607 is connected to the power conversion circuit 400 to supply an operating voltage (VCC) to the power conversion circuit 400.
  • VCC operating voltage
  • the switch controller U3 controls the switching frequency of the energy storage freewheeling unit 630 according to the power take-off signal of the power take-off unit 610 to form an operating voltage of the power conversion circuit 400, and uses the output terminal 607 to The power conversion circuit 400 outputs an operating voltage.
  • the switch controller U3 is activated in response to the power take-off signal of the power take-off unit 610, and is repeatedly charged and discharged by controlling the on-time of the energy storage freewheeling unit 630, and is repeatedly turned on and off, and utilizes a diode.
  • the D5-dimensional continuous flow, thereby forming the operating voltage of the power conversion circuit 400 is output to the power conversion circuit 400 by the output terminal 607.
  • the power take-off unit 610 can convert the AC drive signal into a DC power take-off signal equal to the voltage of the AC drive signal. As shown in Figure 75 and Figure 79.
  • the power take-off unit 610 can be implemented by a second rectifying circuit (hereinafter referred to as a second rectifying circuit 610).
  • the second rectifying circuit 610 includes a first diode D1 and a second diode D2 having opposite polarities in series (ie, the cathodes of the first diode D1 and the second diode D2 are connected together).
  • the second rectifier circuit 610 is provided with a power receiving end 601 between the first diode D1 and the second diode D2.
  • the power take-off end 601 is connected to the switch controller U3.
  • the AC drive signal is rectified by the first diode D1 and the second diode D2 having opposite polarities, and the DC drive signal is outputted at the power take-off end 601.
  • the power receiving end 501 is further connected to one end of the first capacitor C9, and the other end of the first capacitor C9 is connected to the ground end GND.
  • the switch controller U3 is connected to one end of the inductor L2, and the other end of the inductor L2 is connected to the output end 607.
  • the inductor L2 can function to store energy and release energy when the switch controller U3 performs switching.
  • the energy storage freewheeling unit 630 may include an inductor L2, a third diode D5, and a second capacitor C11.
  • the connection terminal 603 is connected to the cathode of the third diode D5, and the anode of the third diode D5 is connected to the ground terminal GND.
  • the second connection point 604 is connected to one end of the second capacitor C11, and the other end of the second capacitor C11 is connected to the ground end GND.
  • a third connection point (not shown in FIG. 75) is further disposed between the second connection point 604 and the output end 607.
  • the third connection point is connected to one end of the load resistor, and the other end of the load resistor is connected to the ground terminal GND.
  • the switch controller U3 may be a MOS switch, and specifically may be an IC chip integrated with a MOS switch. Of course, in some embodiments, the switch controller U3 may also be a switch tube such as a triode.
  • the switch controller U3 has a plurality of connection terminals and may also be referred to as a connection port. Wherein, a power take-off branch is formed between the power take-off end 601 and the ground end GND; the first capacitor C9 is connected in series on the power take-off branch.
  • At least one connection end of the switch controller U3 is connected to the power take-off end 601 through a power take-off branch, and the branch branch of the power take-off branch and the inductor C9 is connected to the power take-off end 601 through the fourth connection point 602.
  • the ground GND is connected to the ground line 640, and the third diode D5, the second capacitor C11, and the load resistor are all connected to the ground line 640.
  • the bias generating circuit 600 can also be provided with a sampling circuit to sample its operational state and serve as a reference for the output signal of the switch controller U3.
  • the sampling circuit can include a first sampling circuit 650 and a second sampling circuit 620.
  • the first sampling circuit 650 is connected to the power take-off end 601 (the connection point 605 is formed in FIG. 79) and the switch controller U3.
  • the second sampling circuit 620 is connected to the output terminal 607 and the switch controller U3.
  • the switch controller U3 controls the switching frequency according to the sampling signals of the first sampling circuit 650 and the second sampling circuit 620 to output a stable operating voltage.
  • the setting of the sampling circuit is related to the control mode of the switch controller U3, and the disclosure is not limited thereto.
  • Figure 7 is a schematic diagram of a bias generating circuit of a second embodiment of the present application;
  • the bias generating circuit can also be used to provide an operating voltage for the temperature detecting circuit 700.
  • FIG. 7 is a schematic diagram of a bias generating circuit of the second embodiment of the present application
  • FIG. 81 is a schematic diagram of the present application.
  • the temperature detecting circuit 700 may be provided with a temperature sensor which may be coupled to the bias generating circuit 600b such that the bias generating circuit 600b supplies the operating voltage to the temperature sensor.
  • the bias generating circuit 600b of the present embodiment further includes a transistor Q3, a diode D6, a resistor R12, and a capacitor C10, as compared with the foregoing embodiment of FIG.
  • the transistor Q3 can be exemplified by, for example, a triode (referred to as a triode Q3 underneath).
  • the temperature detecting circuit 700 is connected to the transistor Q3 of the bias generating circuit 600b.
  • the collector of the transistor Q3 is connected to the sixth connection point between the output end 607 and the sixth connection point.
  • the emitter of transistor Q3 is connected to the power input of the temperature sensor.
  • the base of the transistor Q3 is connected to a ground line having a ground GND.
  • the temperature detecting circuit 700 is activated in response to the operating voltage supplied from the connection terminals 701 and 702 by the bias generating circuit 600b, and feeds back temperature information (Vtemp) to the controller U2 of the power converting circuit 400.
  • Vtemp temperature information
  • the controller U2 of the power conversion circuit 400 can reduce the output power, thereby performing the temperature drop control to ensure the safe operation of the circuit.
  • the temperature detecting circuit 700 is further connected with a temperature compensation circuit 800, wherein FIG. 82 is a schematic diagram of a temperature compensation circuit according to an embodiment of the present application.
  • the temperature detecting circuit 700 is connected between the temperature compensation circuit 800 and the bias generating circuit 600b.
  • the temperature compensation circuit 800 is connected to the power conversion circuit 400.
  • the temperature compensation circuit 800 can make the reference temperature of the free end of the temperature sensor more reasonable.
  • the temperature compensation circuit 800 of the present embodiment can be implemented by the comparator CP, but is not limited thereto.
  • An input end of the comparator CP can receive the indicated temperature information generated by the temperature detecting circuit 700 through the connection end 801. Voltage, and comparing the voltage indicating the temperature information with a reference voltage Vref on the other input of the comparator CP, thereby determining whether the temperature detected by the temperature detecting circuit 700 exceeds a threshold, and at the comparator CP
  • a temperature detection signal Vtemp indicating whether the temperature exceeds a threshold is generated at the output.
  • the output of the temperature compensation circuit 800 is connected to the controller U2 of the power conversion circuit 400, so that the temperature detection signal Vtemp is fed back into the controller U2 of the power conversion circuit 400, so that the controller U2 can respond to the current
  • the system ambient temperature is used to regulate the output power.
  • the temperature compensation circuit 800 can also have a Zener diode and a thermistor. After the thermistor, it is connected to the amplifying circuit through an adjustable potentiometer, and the negative terminal of the amplifying circuit is connected to the output of the temperature compensating circuit 800.
  • the circuit diagram of the temperature compensation circuit 800 can be as shown in FIG. 82.
  • the present application is not limited to the circuit shown in FIG.
  • a high-power LED lamp is further provided in the embodiment of the present application, comprising: an LED light source 500; the power module of any of the above, which is connected to the LED light source 500.
  • the high-power LED lamp can be any type of LED lamp with output power above 30W, LED lamp with output power equivalent to 30W or more of xenon lamp or LED light source 500 using high-power lamp bead (for example, rated current is greater than 20mA lamp beads) LED lights.
  • any numerical value recited herein includes all values of the lower and upper values in increments of one unit from the lower limit to the upper limit, and at least two unit intervals between any lower value and any higher value. Just fine. For example, if the number of components or process variables (eg, temperature, pressure, time, etc.) is stated to be from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, the purpose is to illustrate Values such as 15 to 85, 22 to 68, 43 to 51, 30 to 32 are also explicitly recited in the specification. For values less than 1, one unit is appropriately considered to be 0.0001, 0.001, 0.01, 0.1. These are merely examples that are intended to be expressly stated, and all possible combinations of numerical values recited between the minimum and maximum values are considered to be explicitly described in this specification in a similar manner.

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Abstract

本发明公开了一种发光二极管灯，其特征在于，包括：灯壳；被动式散热组件，所述被动式散热组件包括散热器，所述散热器包括散热鳍片和散热底座，所述散热器与所述灯壳连接；电源，所述电源位于所述灯壳内；以及灯板，其连接在所述散热器上，所述灯板包括LED芯片，所述电源与所述LED芯片电连接；所述灯壳的内腔中形成第一散热通道，所述第一散热通道在所述灯壳的一端具有第一进气孔，而所述灯壳上相对的另一端具有散热孔；所述散热鳍片和所述散热底座中形成第二散热通道，所述第二散热通道具有第二进气孔，空气从所述第二进气孔进入后，通过所述第二散热通道，最后从所述散热鳍片之间的空间流出。

Description

一种发光二极管灯 技术领域
本发明涉及一种发光二极管(LED)灯，特别是高功率LED灯，属于照明领域。
背景技术
LED灯因为具有节能，高效，环保，寿命长等优点而被广泛采用诸多照明领域中。LED灯作为节能绿色光源，高功率LED的散热问题益发受到重视，由于过高的温度会导致发光效率衰减，高功率LED运作所产生的废热若无法有效散出，则会直接对LED的寿命造成致命性的影响，因此，近年来高功率LED散热问题的解决成为许多相关者的研发重要课题。
在某些应用中，对于整个LED灯可能存在重量限制。例如，当LED灯采用某些特定规格的灯头，并且LED灯以垂吊方式使用时，LED灯的最大重量限制到一定范围内。因此，除去电源、灯罩、灯壳等必要的部件后，LED灯用于散热的散热器的重量被限制在一个有限的范围内。而对于某些大功率的LED灯，例如功率为150W～300W，其光通量可达到20000流明至45000流明左右，也就是说，散热器在其重量限制内，需要消散来自产生20000至45000流明的LED灯所产生的热。
目前的LED灯的散热的部件大多采用风扇、热管、散热片、或其组合的设计，以透过热传导、对流及/或辐射的方式将LED灯所产生的热能散失。仅采用被动式散热的情况下(无风扇)，整体散热效果的好坏取决于散热器本身材料的导热系数和散热面积，在相同导热系数的条件下，无论是哪种散热器都是只能依靠对流和辐射两种方法来散发热量，而这两种方式的散热能力都和散热器本身的散热面积成正比，因此，在散热器存在重量限制的前提下，如何提高散热器的散热效率，是提高LED灯质量和降低整个LED灯的成本的途径。
现有技术中的LED灯一般包括光源、散热器、电源、灯壳和灯罩，光源与散热器固定，电源设于灯壳内，灯壳与散热器连接，灯壳包括用于连接灯座的灯头。现有技术中的LED灯具有以下缺点。
1、散热器的设计不合理：在仅采用被动式散热的情况下，且散热器在一定的重量限制条件下，其无法某些解决大功率LED灯的LED的散热问题，导致LED工作时的热量无法及时散去，长时间下会影响LED的寿命。具体的，例如，散热器包括散热鳍片，而散热鳍片与LED的相对位置关系设置不合理，导致LED在工作时产生的热，在热传导至散热鳍片时，其导热路径过长，造成对LED的散热不及时。
又如，散热器的散热鳍片之间的对流设计不合理，例如授权公告号为CN 204717489 U的中国发明专利中公开的无风扇LED射灯，其散热器的翅片无从下至上的对流，导致翅片的热量辐射至空气后，空气的热量无法及时散去，使得翅片周围的空气温度上升，而影响翅片热辐射效率的重要因素，便是翅片与周围空气的温差，因此，空气温度的上升，会影响翅片后续的热辐射。
再如，散热器的散热鳍片的结构设计不合理，例如公开号CN107345628A的中国发明专利，公开一种LED灯，其散热鳍片在LED灯高度方向上具有相同的宽度，而对LED灯的散热来讲，在LED灯高度方向上接近LED的散热鳍片主要是将LED产生的热量传导至散热鳍片，而相对远离LED的散热鳍片则是需要通过热辐射和对流，而将其热量散至周围环境的，也就是说，远离LED的散热鳍片主要是通过热辐射和对流散热的，因此不需要过多的鳍片面积，而上述专利所公开的LED灯，其散热鳍片的设计，会导致LED灯整体重量的增加，然而散热效率却无法相应提升。
另外，散热器的散热鳍片还会存在一些结构上的问题，比如大功率的LED灯，其尺寸较大，宽度可达到150mm以上，高度达到180mm以上，相应的，散热鳍片也具有较大的长度和宽度的尺寸，散热鳍片如果缺少相应的支撑，加工成型时，散热鳍片容易发生偏斜；又如，散热鳍片在LED灯径向上外轮廓的设计不合理，导致其散热效果下降，且无法很好的适配与之配合使用的灯具。
2、电源的设置不合理：对于某些大功率的LED灯，如功率达到150W～300W时，对电源的散热同样重要，如果LED灯工作时，电源产生的热量无法及时散去，则会影响一些电子组件(特别是热敏感度高的组件，如电容)的寿命，从而影响整灯的寿命。通常，现有技术中的散热器与电源之间无有效的热管理，将会导致散热器的热和电源的热之间相互影响，例如，授权公告号为CN 203190364 U的中国发明专利中，公开了一种双通道空气对流灯具散热结构及使用其的PAR灯，其散热鳍片与容纳电源的腔体(腔体的一部分直接形成于散热器上)之间，光源与容纳电源的腔体之间均无有效的热隔离，散热鳍片及光源产生的热容易通过热传导直接进入腔体，而影响腔体内的电源。
另外，电源的电子组件的排布规划不合理，例如将发热组件(如电阻、电感、变压器)排布在一起，则不利于发热组件与周围空气的温度梯度的形成，从而影响发热组件热辐射至空气的效率。另外需要注意的是，外部的空气对流到电源时，如未经过针对性的设计，则昆虫、灰尘等容易附着至电源上，从而影响电源的散热。
除了散热的问题之外，大功率LED照明产品本身净重较重，同时在工作时由于温度较高，因此需要考虑在高温条件下的高机械强度结构件需求。一般大功率LED照明产品装配方式主要以螺丝方式将各部件进行连接，考虑到绝缘爬电距离要求，散热器以上的灯颈部位通常采用塑料件，最常见的结构是塑料件的外壳和灯头螺纹在一起，灯头旋转锁附在外壳上，加铆压针孔实现定位连接。使用螺丝连接不仅在制造流程上需要较繁琐的工艺，同时成本也较高。因此大功率LED照明产品的机构结合方式也是该产品的研发重要方向之一。
涉及到LED灯的包装运输时，LED灯的灯罩凸设于灯板外，例如公开号为CN 107345628 A的中国发明专利申请中，LED灯的灯罩可能与外部接触、碰撞而成为受力点，且灯罩一般采用玻璃或塑料等材质，其存在易碎的问题。因而，在包装运输时，需要对灯罩进行特殊的保护，才能避免因碰撞而损坏，而上述操作无疑会增加包装的成本。
涉及到LED灯的出光效果时，通常，理想的情况下，希望将LED灯的光线投向LED灯下方的一定的区域内，以保证该区域的亮度。但是实际上，很大一部分光线可能射向两侧的区域，造成这部分光线的浪费，导致光的输出效率的降低。例如，公开号为CN 107345628 A的中国发明专利申请中，公开了固态灯，其包括安装在电路板上的固态光源，部分固态光源侧向设置，在使用时，通常会配合灯具使用。也就是说，固态光源侧向设置的部分，需要通过灯具发射至下方而出光，而通过发射而出光的方式，反射过程中，会有一定的光损，因此，影响整灯的出光效率。
另外，从电路部分来讲，现有技术叙明一般驱动电路的偏压都是通过在母线上取分压的方式产生。但在高功率LED灯(HID-LED，High intensity Discharge-LED)的应用下，一般偏压电路为了避免过多的功率浪费，偏压电路通常搭配大电容设计，如此便会造成HID-LED点亮速度较慢，一般偏压方式启动速度约为1秒，影响使用体验。
有鉴于上述问题,以下提出本发明及其实施例。
发明内容
本发明主要解决的技术问题是提供一种发光二极管灯，以解决上述问题。
本发明提供一种发光二极管灯，其特征在于，包括：
灯壳；
被动式散热组件，所述被动式散热组件包括散热器，所述散热器包括散热鳍片和散热底座，所述散热器与所述灯壳连接；
电源，所述电源位于所述灯壳内；以及
灯板，其连接在所述散热器上，所述灯板包括LED芯片，所述电源与所述LED芯片电连接；
所述灯壳的内腔中形成第一散热通道，所述第一散热通道在所述灯壳的一端具有第一进气孔，而所述灯壳上相对的另一端具有散热孔；
所述散热鳍片和所述散热底座中形成第二散热通道，所述第二散热通道具有第二进气孔，空气从所述第二进气孔进入后，通过所述第二散热通道，最后从所述散热鳍片之间的空间流出。
可选的，所述灯板开设有第三开口，所述第三开口分别与所述第一散热通道及所述第二散热通道连通。
可选的，所述第三开口设于所述灯板的中心的区域，且所述第一进气孔和所述第二进气孔分别从第三开口处进气。
可选的，所述散热器的重量占所述发光二极管灯的重量的50％以上，而所述散热器的体积占发光二极管灯总体的体积的20％以上。
可选的，所述散热器的体积占所述发光二极管灯总体的体积的20％～60％。
可选的，所述散热鳍片包括第一散热鳍片和第二散热鳍片，所述第一散热鳍片和所述第二散热鳍片在发光二极管灯轴向上的底部均与所述散热底座连接，所述第一散热鳍片与所述第二散热鳍片彼此间隔交互设置，所述第二散热鳍片的形状为一分为二的Y形。
可选的，还包括灯罩，所述灯罩包括光输出表面和端面，所述端面上设有透气孔，空气通过所述透气孔而进入到所述第一散热通道和所述第二散热通道，所述第一进气孔在发光二极管灯轴向上投影到所述端面所占的区域形成第一部分，而所述端面上的其他区域形成第二部分，所述第一部分上的所述透气孔的面积大于所述第二部分上的所述透气孔的面积。
本发明的有益效果是：与现有技术相比，本发明包括以下任一效果或其任意组合：
(1)通过第一散热通道的设置，可以此带走第一散热通道内的热量(电源工作时产生的，通过第二散热通道的设置，可增加对散热器的对流散热，而通过第一散热通道和第二散热通道的设置，增加了整灯自然对流的效率，使得散热器相应的所需的散热面积降低。
(2)第三开口分别与第一散热信道及第二散热信道连通，且第三开口设于灯板的中心的区域，而第三开口开设在灯板的中心的区域，使第一进气孔和第二进气孔可共享一个进气的入口，因此，可避免占用灯板过多的区域，从而避免灯板的设置LED芯片的区域的面积因开设多个孔而减少。
(3)散热器的重量占LED灯的重量的50％以上，而散热器的体积占LED灯总体的体积的20％以上，在散热器的导热系数相同的情况下，散热器所占的体积越大，其可用作散热的面积越大。因此，一定程度上，散热器的体积占LED灯总体的体积的20％以上时，散热器可具有更多可利用的空间，来增加其散热面积。
(4)通过将第二散热鳍片的形状为一分为二的Y形，使得散热器1在占用相同体积的情况下，拥有更多的散热面积。
(5)第一部分上的透气孔的面积大于第二部分上的透气孔的面积，利于使大部分空气进入第一散热通道，从而更好的对电源进行散热，防止电源的电子组件受热而加速老化。
附图说明
图1是本实施例中LED灯的主视结构示意图；
图2是图1的LED灯的剖视结构示意图；
图3是图1的LED灯的分解示意图；
图4是LED灯的剖视结构示意图，显示第一散热信道及第二散热信道；
图5是图1的LED灯的立体结构示意图一；
图6是是图5去掉光输出表面的结构示意图；
图7是本实施例的光透射示意图；
图8是图7的光型图；
图9是一些实施例中的LED灯的分解示意图，显示挡光环；
图10是一些实施例中的LED灯的立体示意图；
图11是图10去掉光输出表面的示意图；
图12是一些实施例中的LED灯的剖视图，显示平直的光输出表面；
图13a至图13c是一些实施例中的灯板与灯罩的配合示意图；
图14是一些实施例中的灯板与灯罩的配合示意图；
图15是本实施例中的灯罩的端面的示意图；
图16是一些实施例中的灯罩的端面的示意图；
图17是图16的端面的另一方向的示意图；
[根据细则91更正 16.01.2019]　
图18a至图18j是一些实施例中的灯罩的示意图；
图19a是一些实施例中的散热器的剖视示意图；
图19b是采用图19a的散热器的LED灯的示意图；
图20是一些实施例中的LED灯的去掉灯罩的剖视示意图；
图21是本实施例LED灯的立体图；
图22是本实施例中的LED灯的剖视图；
图23是本实施例中的散热器的俯视图；
图24是图23中E处的放大示意图；
图25是空气在第二散热鳍片112处形成涡流的示意图；
图26是一些实施例中的散热器的局部示意图；
图27是一些实施例中的LED灯的主视图；
图28是一些实施例中的LED灯的主视图；
图29是图1的LED灯去掉灯罩的仰视图；
图30是图29中A处的放大示意图；
图31是本实施例中LED灯的剖视图；
图32是图31中C处的放大示意图；
图33是本实施例中的灯罩的立体示意图；
图34是一些实施例中的灯罩与灯板的配合示意图；
图35是图34的仰视图；
图36a至图36n是一些实施例中的散热器的示意图；
图37a是一些实施例中的散热器的示意图；
图37b是一些实施例中的散热器的示意图；
图37c是一些实施例中的散热器的示意图；
图37d是一些实施例中的散热器的示意图；
图38a至38j是一些实施例中的散热器的俯视图；
图39是本实施例的散热器的俯视图；
图40是本实施例散热鳍片与LED芯片的配合示意图；
图41是一些实施例中散热鳍片与LED芯片的配合示意图；
图42是一些实施例中的灯板的示意图；
图43是本实施例中的灯板的示意图；
图44a至图44f是一些实施例中的灯板的示意图；
图45a至图45g是一些实施例中的灯板的正视图；
图46a是本实施例中电源的立体图一；
图46b是本实施例中电源的立体图二；
图46c是本实施例中电源的立体图三；
图46d是本实施例中电源的主视图；
图47是一些实施例中电源的示意图；
图48是图47中配重块的主视图；
图49是图48的演示图；
图50是变压器的示意图；
图51是一些实施例中电源的示意图；
图52是一些实施例中电源的示意图；
图53a是一些实施例中的电源板的示意图；
图53b是一些实施例中的电源板的示意图；
图53c是一些实施例中的电源板的示意图；
图54本实施例中LED灯的剖视图；
图55本实施例中LED灯的剖视图；
图56是一些实施例中电源与内套的配合示意图；
图57是图2中B处的放大图；
图58是LED灯的局部示意图；
图59a是本实施例中灯颈的立体示意图一；
图59b是本实施例中灯颈的立体示意图二；
图59c是一些实施例中灯颈的立体示意图；
图60是本实施例中内套的立体示意图；
图61是一些实施例中的LED灯的剖视图；
图62是图61的LED灯内的对流通道的设置示意图；
图63是一些实施例中的LED灯去掉散热器的主视图；
图64是图63的分解示意图；
图65a是一些实施例中LED灯的灯壳的分解示意图；
图65b是图65a的装配示意图；
图65c是包含图65a的灯壳的LED灯的分解示意图一；
图65d是包含图65a的灯壳的LED灯的分解示意图二
图65e是包含图65a的灯壳的LED灯的剖视图；
图66是本实施例中的LED灯的主视图；
图67是本实施例中的LED灯与灯具的配合示意图；
图68是一些实施例中的LED灯的示意图；
图69是本实施例中LED灯主视图；
图70a是本实施例中的LED灯与灯具的配合示意图；
图70b是本实施例中的LED灯与灯具的配合示意图；
图70c是本实施例中的LED灯与灯具的配合示意图；
图71是一些实施例中的LED模块的电路布局示意图一；
图72是图71中D处的放大示意图；
图73是一些实施例中LED模块的电路布局示意图二；
图74是本申请一实施例的一种电源模块示意图；
图75是本申请一实施例的电磁干扰抑制电路的示意图；
图76是本申请一实施例的整流电路和滤波电路的示意图；
图77是本申请一实施例的功率因数校正电路的示意图；
图78是本申请一实施例的电源转换电路的示意图；
图79是本申请第一实施例的偏压产生电路的示意图；
图80是本申请第二实施例的偏压产生电路的示意图；
图81是本申请一实施例的温度检测电路示意图；
图82是本申请一实施例的温度补偿电路示意图。
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳实施例。但是，本发明可以通过许多不同的形式来实现，并不限于下面所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容理解的更加透彻全面。下文中关于方向如“轴向方向”、“上方”、“下方”等均是为了更清楚的表明结构位置关系，并非对本发明的限制。在本发明中，所述“垂直”、“水平”、“平行”定义为：包括在标准定义的基础上±10％的情形。例如，垂直通常指相对基准线夹角为90度，但在本发明中，垂直指的是包括80度至100以内的情形。另外，本发明中所述LED照明灯的使用情况、使用状态，指的是LED灯以灯头竖直向上的垂吊方式的使用情境，如有其他例外情况将另做说明。
图1为本发明实施例中的LED灯的主视图。图2为图1的LED灯的剖视图。图3为图1 的分解示意图。如图1、图2和图3所示，所述LED灯，包括：散热器1、灯壳2、灯板3、灯罩4及电源5。本实施例中，灯板3以贴合的方式连接在散热器1上，以利于灯板3工作时产生的热量快速传导至散热器1。具体的，于一些实施例中，灯板3与散热器1铆接，于一些实施例中，灯板3与散热器通过螺栓连接，于一些实施例中，灯板3与散热器1焊接固定，于一些实施例中，灯板3与散热器1黏接固定。于本实施例中，散热器1连接于灯壳2，灯罩4罩设在灯板3外，以使灯板3的光源产生的光通过灯罩4而射出，电源5位于灯壳2的内腔中，且电源5与LED芯片311电连接，以对LED芯片311供电。
如图4所示，显示本实施例中的LED灯的剖视图。如图2和4所示，本实施例中的灯壳2的内腔中形成第一散热通道7a，且第一散热通道7a在灯壳2的一端具有第一进气孔2201，而灯壳2上相对的另一端具有散热孔222(具体开设于灯颈22上部)。空气从第一进气孔2201进入，并从散热孔222排出，以此，可带走第一散热通道7a内的热量(主要是电源5工作时所产生的热量)。具体从散热路径来讲，电源5中的发热组件工作时产生的热量，先以热辐射的方式将热量传递至第一散热通道7a中的空气中(发热组件附近的空气)，外部空气以对流的方式进入第一散热信道7a，从而带走内部的空气而进行散热。其他实施例中，也可通过在灯颈22上开设散热孔222而直接进行散热。
如图1、图2和图4所示，散热鳍片11、散热底座13中形成第二散热通道7b，第二散热通道7b具有第二进气孔1301，空气从第二进气孔1301进入后，通过第二散热通道7b，最后从散热鳍片11之间的空间流出。以此，可带走散热鳍片11上的热量，加速散热鳍片11的散热。具体从散热路径来讲，LED芯片311产生的热量热传导至散热器1，散热器1的散热鳍片11将热量辐射至周围空气，第二散热通道7b对流散热时，带走散热器1内的空气而进行散热。
如图1和图4所示，散热器1设置第三散热通道7c，第三散热通道7c形成于两散热鳍片11之间或同一散热鳍片11延伸出的两个片体之间的空间，两散热鳍片11之间的径向外侧部分构成第三散热通道7c的入口，空气从LED灯的径向外侧的区域而进入到第三散热通道7c中，并带走散热鳍片11辐射到空气的热量。
图5为本实施例中的LED灯的立体结构示意图，显示散热器1与灯罩4的结合。图6为图5去掉光输出表面43的结构示意图。如图5和图6所示，本实施例中，灯罩4包括光输出表面43和端面44，端面44上设有透气孔41，空气通过透气孔41而进入到第一散热通道7a和第二散热通道7b。LED芯片311(图6中所示)发光时，光线穿射过该光输出表面43，而从灯罩4射出。本实施例中，光输出表面43可选用现有技术中的透光材质，比如玻璃、PC 材质等。本发明所有实施例中所称的“LED芯片”，泛指所有以LED(发光二极管)为主体的发光源，包括但不限于LED灯珠、LED灯条或LED灯丝等，因此本说明书所指的LED芯片组亦可等同于LED灯珠组、LED灯条组或LED灯丝组等。如图5所示，本实施例中，光输出表面43的面积与端面44的面积的比值为1：4～7。优选的，光输出表面43的面积(光输出表面43单侧表面的面积，即远离LED芯片311一侧的表面的面积)与端面44(端面44单侧表面的面积，即远离LED芯片311一侧的表面的面积，包括透气孔41的面积)的面积的比值为1：5～6。最优选的，光输出表面43的面积与端面44的面积的比值为1：5.5。端面44用于供空气通过而进入到第一散热通道7a和第二散热通道7b，光输出表面43则用光源的出光，因此可使出光和散热之间达到平衡。本实施例中，为了满足第一散热通道7a和第二散热通道7b的进气需求，灯罩4的面积与端面44的面积的比值为5～8。优选的，灯罩4的面积与端面44的面积的比值为6～7。以此，使得光输出的范围与散热所需的空气之间达到平衡。
本实施例中，光输出表面43的面积(光输出表面43单侧表面的面积，即远离LED芯片311一侧的表面的面积)为所有LED芯片31在出光方向的表面的面积的3倍以上，且不超过10倍，在提供足够的出光区域的同时，控制其宽度尺寸。
如图5和图6所示，本实施例中，在灯罩4的光输出表面43在LED灯径向上的内侧设置内反射面4301，内反射面4301相对灯板3上的LED芯片311，内反射面4301相对任意一颗LED芯片311，其位于LED灯径向的更内侧。一实施例中，光输出表面43在LED灯径向上的外侧设置外反射面4302，外反射面4302相对灯板3上的LED芯片311，外反射面4302相对任意一颗LED芯片311，其位于LED灯径向的更外侧。内反射面4301和外反射面4302的设置，用于调整LED芯片组31的出光范围，使光线更加集中，从而提高局部的亮度的作用，也就是说，在相同光通量的情况下，提高LED灯的照度。具体来讲，本实施例中的LED芯片311设置时，全部设于灯板3下表面(使用状态时)，也就是说，LED芯片311不会有侧向的出光，工作时，LED芯片311的主发光面全部为向下，LED芯片311的光线至少60％以上是直接从光输出表面43射出，而无需经过反射，因此，相对于具有主发光面侧向发光的LED灯(侧向的光通过灯具或灯罩反射后而向下出光，而反射后具有一定比例的光损)，本实施例的LED芯片311的出光效率更好，也就是说，在相同的流明(光通量)情况下，本实施例的LED灯具有更高的照度。而通过内反射面4301和外反射面4302的设置，可使出光更加集中，提升一区域内的照度，比如说LED灯下方120度至130度之间的区域(LED灯下方120度至130度的出光角度范围)。而当LED灯设置的高度较高时，该出光角度下，LED灯的照射的范围依然满足需求，且在此范围内可以有更高的照度。图7是本实施例的光透射示 意图，图8是图7的光型图。如图6、图7和图8所示，从出光效果来讲，在LED灯的投射方向上，也就是LED灯的下方具有光投射区域M，光透射区域M内具有聚光区m，而LED灯包括反射面，以此将至少部分LED芯片311所射出的光线反射至聚光区m，以提高聚光区m的亮度。反射面包括内反射面4301和外反射面4302，内反射面4301和外反射面4302均将LED芯片311的光线至少部分反射至聚光区m。本实施例中，优选的，光源的光通量的至少5％经过内反射面4301和外反射面4302的反射后从光输出表面43射出，从实际来讲，经过内反射面4301和外反射面4302的反射后从光输出表面射出的光总量至少为1000流明，优选的，经过内反射面4301和外反射面4302的反射后从光输出表面射出的光总量至少为1500流明。而经过外反射面4302反射的光总量大于经过内反射面4302反射的光总量，由此可看出，关于眩光问题，对于高流明的LED灯，设置外发射面4302可反射相当一部分的侧向的光通量，对于减小眩光具有重要意义。本实施例中的聚光区m为一环状区域，其内侧边界与LED灯的轴线所成圆心角为20°，其外侧边界与LED灯的轴线所成圆心角为50°。本实施例中，LED灯投射到聚光区m的光通量占总的光通量的35％～50％之间，以此使聚光区m具有较佳的光照效果。另外，通过内反射面4301和外反射面4302的设置，一方面可减少不必要的侧向发光，以防止眩光的产生，另一方面还可将LED芯片311的光线的至少部分反射至光透射区域M，以此提高光投射区域M内的照度。
内反射面4301用以反射最内围的LED芯片组31的LED芯片311所射出的部分光线，外反射面4302用以发射最外围的LED芯片组31的LED芯片311所射出的部分光线。其中，最外围的LED芯片组31所包括的LED芯片311的数量大于最内围的LED芯片组31所包括的LED芯片311的数量。外反射面4302的面积大于内反射面4301的面积，因为最外围的LED芯片组31包括了更多的LED芯片311，因此需要更多的反光面积来调和出光。
本实施例中，内反射面具有第一面积A1，外反射面具有第二面积A2，最外围的LED芯片组31所包括的LED芯片311的数量为N2，最内围的LED芯片组31所包括的LED芯片311的数量为N1；符合以下关系：
(A1/N1)：(A2/N2)为0.4～1。
当最内围的LED芯片组31中单个LED芯片311所对应的内发射面4301的面积与最外围的LED芯片组31中单个LED芯片311所对应的外发射面4302的面积的比值落入上述的范围时，最内围的LED芯片组31的LED芯片311和最外围的LED芯片组31的LED芯片311均具有较佳的出光效果。
如图6所示，内反射面4301靠近灯板3的一端，与灯板3抵接，以此来防止光线从内反 射面4301和灯板3之间的间隙穿过，避免损失部分光线。同样的，外反射面4302靠近灯板3的一端，与灯板3抵接，以此来防止光线从外反射面4302和灯板3之间的间隙穿过，避免损失这部分光线。
如图2所示，本实施例中，内反射面4301和外反射面4302的延伸线之间形成一夹角a，该夹角a的角度为80度至150度之间，优选的，该角度为90度至135度之间，更优选的，该角度为100度至120度之间。内反射面4301和外反射面4302之间形成类似反光杯的结构，从而起到控制LED芯片出光范围或是提高局部的亮度的作用。本实施例中，外反射面4302与灯板2的夹角角度为30至60度，于一些实施例中，所述夹角为40至50度。
如图2所示，本实施例中，内反射面4301的高度低于外反射面4302的高度。该高度指的是LED灯轴向方向上两者的相对高度。通过将内反射面4301的高度设置为低于外反射面4302的高度，可避免减少LED灯正下方区域的光分布，防止LED灯的光分布区域的中间部分区域形成暗区。本实施中，外反射面4302的在LED灯轴向上的高度不超过20mm，优选的，外反射面4302的在LED灯轴向上的高度不超过15mm。从另一角度讲，为控制LED灯整体的高度尺寸，外反射面4302的高度占LED整灯的高度不超过9％，优选的，外反射面4302的高度占LED整灯的高度不超过6％，从外反射面4302的功能来讲，要保证外反射面4302的高度占LED整灯的高度的2％以上，优选的，外反射面4302的高度占LED整灯的高度的3％以上。也就是说，综合考虑到LED灯的高度尺寸的控制及反射、聚光、防眩光等功能，需要将外反射面4302的高度设置为占LED整灯的高度的2％～9％之间。优选的，外反射面4302的高度设置为占LED整灯的高度的3％～6％之间。
于一些实施例中的LED灯的灯罩4可取消了内反射面或外反射面的设置，例如仅设置挡光环47，具体的，如图9所示，灯罩4的外圆周上设置挡光环47，以提高灯的出光效率，挡光环47的内表面具有反射的作用(类似外反射面)，灯罩4扣在在散热器1上时，挡光环47靠近灯板3的外围，例如挡光环47的外围直径与灯板3的外围直径相等或略大于灯板3的外围直径。
如图2、图5和图6所示，本实施例中，为防止灰尘沉积到LED芯片311表面而降低LED芯片311的光效或影响LED芯片311散热，LED芯片311可以被设置于封闭空间内，以防止灰尘进入而沉积到LED芯片311表面。举例来讲，灯罩4与灯板3之间形成一密闭的腔体9，具体来讲，光输出表面43、内反射面4301、外反射面4302及灯板3之间形成一密闭的腔体9(此处的密闭可以指的是无明显孔洞，不包括装配过程中不可避免的缝隙)。于一些实施例中，可以省去内反射面4301和外反射面4302的设置，则腔体9是形成于灯板3、光输出表 面43之间，或灯板3、光输出表面43及散热器1之间。
图10为一些实施例中的LED灯的立体图，其与本实施例不同的是腔体9上开设孔洞。图11是图10去掉光输出表面43的示意图。如图10和图11所示，于一些实施例中，灯罩4与灯板3之间形成一腔体9，具体来讲，光输出表面43、内反射面4301、外反射面4302及灯板3之间形成一腔体9，灯板3的LED芯片311位于该腔体9内。该腔体9具有一第一开口91及一第二开口92，该第一开口91配置为与外部连通，而第二开口92则配置为与第一散热通道7a及第二散热通道7b连通。从散热角度来说，一方面可使腔体9处形成气体对流，以此可带走部分LED芯片311产生的热量，另一方面来说，外部空气通过腔体9而进入到LED灯内部，这对第一散热通道7a及第二散热通道7b来说，可起到增加对流的作用，提高散热效率。其他实施例中，还可以省去内反射面4301和外反射面4302的设置，也就是说，光输出表面43及灯板3之间形成一腔体9。
如图10所示，于一些实施例中，光输出表面43上开设孔洞，而形成上述的第一开口91，优选的，第一开口91开设与光输出表面43径向外侧的边缘位置，使其不会影响到光输出表面43的透光效果。从结构上来讲，光输出表面43在LED灯工作时受热可能产生热变形，而第一开口91的设置，使光输出表面43在第一开口91处具有可形变的空间，防止光输出表面43因热变形而挤压散热器，导致光输出表面43损坏。本实施例中，第一开口91在光输出表面43的周向上设置有若干个。以此，一方面可增加空气的对流，另一方面，可进一步提升当光输出表面43受热时的结构强度。
如图11所示，一些实施例中，内反射面4301上设置缺口，从而形成上述的第二开口92。本实施例中，第二开口92在内反射面4301的周向上设置有若干个。且第二开口92配置的数量与第一开口91配置的数量的关系，大致为，第二开口92的数量与第一开口91的数量的比值为1:1～2，优选为1:1.5。如此，可在进风和出风时形成一个平衡。其他实施例中，第一开口91和第二开口92也可以形成在灯罩4的其他部件上，如灯板3或散热器1的散热底座13上。
如图10和图11所示，一些实施例中，灯罩4与灯板3之间形成一腔体9，具体来讲，光输出表面43、内反射面4301、外反射面4302及灯板3之间形成一腔体9，LED芯片311位于该腔体9内，腔体9具有释压孔，以避免腔体9内，因LED芯片311工作时发热而导致腔体9内温度升高，从而使压力升高。释压孔可以是光输出表面43上开设的第一开口91，也可以是内反射面4301上设置的第二开口92，或者还可以是灯板3或散热器1上开设的相应的与腔体9连通的孔洞，只要能达到释压效果即可。
如图4所示，光输出表面43在LED灯径向向外的方向上，其与LED灯板3的距离逐渐递增，从而使光输出表面43呈内凹状。以此，相比平直的表面，这种光输出表面43的结构强度得到提升，另外，光输出表面43通过上述这种较为平滑的过渡方式，不会产生夹角，因此光输出表面43的厚度比较均匀，因而不会影响到出光效果。最后，从使用状态来讲，灯板3在LED灯工作时由于光源而产生发热，如果光输出表面43为一平整的面，且平行于水平面(垂吊安装的使用状态下)，则光输出表面受热时沿水平向外膨胀，因此可能受散热器1挤压而破损。本实施例中，当光输出表面43为内凹状，灯罩4受热膨胀时，其膨胀的方向发生改变(垂吊安装的使用状态下，如果光输出表面43为平整的面，则受热后，光输出表面43主要沿水平方向膨胀，如果光输出表面43为内凹状，则膨胀方向分解为水平方向部分和向下部分)，将减小灯罩4在水平向外方向的膨胀，避免灯罩4因受散热器1挤压而破损。
如图12所示，于一些实施例中，光输出表面43也可以设置为平直的面，但是需要考虑到输出表面43的材质的热膨胀系数、光输出表面43与散热器1的间距、及光输出表面43的抗形变能力。比如，当光输出表面43为平直的面时，则可将光输出表面43与散热器1在径向上设置一间距，确保不会因光输出表面43的膨胀而受散热器1挤压。
于一些实施例中，光输出表面43设置光学涂层，如在光输出表面43上设置扩散膜431，LED芯片311产生的光线通过扩散膜431而穿出灯罩4。扩散膜431对LED芯片311发出的光起到扩散的作用，因此，只要能使得光线透过扩散膜431后再穿出灯罩4，扩散膜431的布置可以有多种形式，例如：扩散膜可以涂覆或覆盖于光输出表面43的内表面上(如图13a所示)，或者涂覆于LED芯片311表面上的扩散涂层(如图13b所示)，或者作为一个外罩而罩(或遮盖)在LED芯片311外的扩散膜片(如图13c所示)。
图14为灯罩4与灯板3的配合示意图。如图14所示，于一些实施例中，光输出表面43在靠近LED芯片311的一侧，也就是光输出表面43的内侧设置抗反射涂层432，可减少LED芯片311的光线在光输出表面43的反射，以提高光输出表面43处的光线透过率。本实施例中的抗反射涂层432的折射率介于空气和玻璃之间。抗反射涂层432中包括金属氧化物，金属氧化物的含量占抗反射涂层432材料的1％～99％，而抗反射涂层432的反射率小于2％。本实施例中的金属氧化物可以是氧化锆、氧化锡、氧化锡、氧化铝等。
上述的扩散膜431和抗反射涂层432可同时使用，或择一使用。具体可根据实际出光需求而选用。
图15显示本实施例中灯罩4的端面44的示意图。如图15所示，透气孔41的截面面积总和与端面44的整体面积(端面44单侧的面积，如远离LED芯片311的一侧)的比值为 0.01～0.7，优选的，透气孔41的截面面积总和与端面44的整体面积的比值为0.3～0.6，更优选的，透气孔41的截面面积总和与端面44的整体面积的比值为0.4～0.55，通过将透气孔41的面积与端面44面积的比值限定在上述的范围内，一方面可保证透气孔41的进气量，另一方面，可确保透气孔41的面积大小是在保证端面44的结构强度的情况下进行调整的。当透气孔41的面积与端面44面积的比值为0.4～0.55时，既可确保透气孔41的进气量，以满足LED灯的散热需求，又可使得透气孔41不至于影响到端面44的结构强度，防止端面44在开设透气孔41后因碰撞或挤压而变得容易破损。
图16显示另一些实施例中的灯罩4的端面44的示意图。图17显示图16的端面44的另一方向的示意图。如图16和17所示，透气孔41的边缘处具有增加的厚度，从而形成肋部411，相邻的肋部411之间在透气孔41的进气方向上形成导风口412。透气孔41的边缘处具有增加的厚度，一方面可以增加端面44的结构强度，防止因开设透气孔41而导致整体结构强度的降低，另一方面，其形成的导风口412，具有导风的作用，使空气进入时受到导风口412的作用而具有一定的方向性。而且，在端面44成型时，因肋部411的存在，减小了端面44上因开设透气孔41而造成的端面44强度降低的影响，因此，端面44不易因为透气孔41的存在而发生变形，可提高生产的良率。本实施例中，肋部411形成在端面44靠近灯板3的一面。
如图17所示，透气孔41的边缘增加的厚度比端面44其余位置处的厚度大。以此，可进一步增加透气孔41处的强度，及导风作用。
如图15所示，透气孔41的最大内切圆直径小于2mm，优选为1至1.9mm。如此一来，一方面可防止昆虫进入，且可以阻止大部分灰尘通过，另一方面，透气孔41还能保持较好的气体流通效率。换句话说，也可以是，透气孔41定义一个长度方向和一个宽度方向，即，透气孔具有长度和宽度，长度尺寸大于宽度尺寸，而透气孔最宽处的宽度小于2mm，于一实施例中，最宽处的宽度为1mm至1.9mm。另外，透气孔41最大处的宽度大于1mm，如果小于1mm，则空气需要更大的压力才能进入透气孔41，因此将不利于空气流通。
图18a至图18g显示一些实施例中各种透气孔41的形状。如图12a至图12g所示，具体来说，透气孔41可选用圆形、长条形、弧形、梯形、菱形中的其中一组或多组的组合的形状。如图18a所示，如果透气孔41选用圆形，则其直径小于2mm，以达到防止昆虫进入，阻止大部分灰尘通过，且还能保持较好的气体流通效率的作用。如图18b和图18c所示，如果透气孔41选用长条形或弧形，则其宽度要小于2mm，以到达上述技术效果。如图18d所示，如果透气孔11d选用梯形，则其下底要小于2mm，以到达上述技术效果。如图18e所示，如 果透气孔41选用圆角长方形，则宽度要小于2mm，以到达上述技术效果。如图18f和18g所示，透气孔41还可以选用三角形或水滴形，且其最大内切圆要小于2mm。
一些实施例中，透气孔41在端面44上分布有若干个。如，透气孔41可以是沿端面44周向环形分布有若干个，以此，可以是气流更加均匀的进入。又如，透气孔41可以是在端面44的径向方向上分布有若干个。透气孔41也可以采用不对称的方式分布。
于一些实施例中，在LED灯的轴向方向上，还可将透气孔41设置为倾斜于LED灯的轴向，也就是说，透气孔41的轴线会与LED灯的轴向形成一夹角。如图18h所示，至少部分透气孔41的轴线倾斜于LED灯的轴线，且这部分透气孔41的倾斜的方向是朝向第一散热通道7a的第一进气孔2201的，因此，空气通过这部分透气孔41后，会朝向第一散热通道7a的第一进气孔2201而对流，以利于更多的空气进入到第一散热通道7a，而对其内的电源6散热。如图18j所示，至少部分透气孔41轴线倾斜于LED灯的轴线，且这部分透气孔41的倾斜的方向是朝向第而散热通道7b的第二进气孔1301的，因此，空气通过这部分透气孔41后，会朝向第二散热通道7b的第二进气孔1301而对流，以利于更多的空气进入到第二散热通道7b，从而对散热器1散热。
以图18a为例，图18a中，端面44上具有两条虚线，内圈的虚线代表第一进气孔2201投影到端面44的位置，内圈的虚线内的区域为第一部分(第一开口区433)，外圈与内圈之间的区域为第二部分(第二开口区434)，本实施例中，第一进气孔2201在LED灯轴向上投影到端面44所占的区域形成第一部分(第一开口区433)，而端面44上的其他区域形成第二部分(第二开口区434)，第一部分上的透气孔41的面积大于第二部分上的透气孔41的面积。这种设置方式，利于使大部分空气进入第一散热通道7a，从而更好的对电源5进行散热，防止电源5的电子组件受热而加速老化。上述特点同样适用于上述其他实施例中的透气孔41。
在其他实施例中，第一进气孔2201在LED灯轴向上投影到端面44所占的区域形成第一部分(第一开口区433)，而端面44上的其他区域形成第二部分(第二开口区434)，第一部分上的透气孔41的面积小于第二部分上的透气孔41的面积。以此，可更好的对散热鳍片11进行散热，以利于LED芯片311的散热，防止LED芯片311处形成局部的高温区域。具体的，第一部分和第二部分的面积，可根据实际散热需求进行选择。
在某些应用中，对于整个LED灯可能存在重量限制。例如，当LED灯采用E39灯头时，LED灯的最大重量限制到1.7千克以内。因此，除去电源、灯罩、灯壳等部件后，于一些实施例中，散热器的重量被限制在1.2千克以内。对于某些大功率的LED灯，其功率为150W～300W，其流明数可达到20000流明至45000流明左右，也就是说，散热器在其重量限制内， 需要消散来自产生20000至45000流明的LED灯所产生的热。在自然对流散热情况下，一般1W的功率需要35平方厘米以上的散热面积。而以下实施例，设计目的是在于在保证电源5的设置空间及散热效果的情况下，降低1W功率需要的散热面积的，进而在散热器1重量限制及电源5限制的前提下达到最佳的散热效果。
[根据细则91更正 16.01.2019]　
如图1和图2所示，本实施例中，LED包括或仅被动式散热组件，该被动式散热组件仅采用自然对流和辐射等主要方式进行散热，而没有采用主动式散热组件，例如风扇等。本实施例中的被动式散热组件包括散热器1，散热器1包括散热鳍片11及散热底座13，散热鳍片11呈放射状均匀的沿散热底座周向分布，且与散热底座13连接。当LED灯使用时，LED芯片311所产生的热量以热传导的方式将至少一部分热量传导至散热器1，散热器1的至少一部分热量通过热辐射和对流的方式散到外部空气中。散热器1的径向上的外轮廓，其直径在高度方向向上时，其外轮廓的直径递减或大致上呈递减的趋势。以此可更好的与灯具配合。本实施例中的散热器1在散热的时候，至少部分热是通过热辐射到周围的空气而进行散热的。而影响热辐射的重要因素则是物体本身的辐射率或辐射系数。为提升散热器1的辐射率或辐射系数，本实施例中的散热器1的表面进行相应处理，例如，在散热器1的表面设置辐射散热漆或电泳涂层，以提高辐射散热的效率，从而将散热器1的热量快速散去，或是通过在电解液中通过阳极氧化在散热鳍片11的表面形成纳米结构的多孔氧化铝层，如此即可在散热鳍片11的表面形成一层氧化铝纳米孔，在不增加散热鳍片11数量的同时增强散热片的散热能力，又如，散热鳍片11的表面涂覆抗热辐射层，以减少散热鳍片11与散热鳍片11之间的热辐射，使散热鳍片11的热量更多的辐射到空气中，抗热辐射层可采用漆或氧化涂层等，漆可以采用普通油漆或者是辐射散热漆。为了进一步增强散热器1的散热效果，例如，于一些实施例的散热器1包括如下质量百分比的各组分：硅0.5～0.7份、铁0.5～0.6份、铜0.05～0.3、锰0.3～0.7、镁2.1～2.9、铬0.18～0.28、锌5.1～6.1、钛0.2～0.3份；优选地，还包括铝，如少量或者微量的铝。通过采用上述质量百分比的锌和镁，可形成强化效果显着的MgZn2，使得散热器1的热处理效果远远胜出一锌二元合金，抗拉强度将会得到极大的提高，且抗应力腐蚀以及抗剥落腐蚀能力也会增加，热传导性能也较大，散热器1的散热性能较好。另外，散热器1可用低热阻/高导热率的材料制成，例如铝合金。在一些实施例中，散热器1可用导热率k＝167W/m.k.、热辐射系数e＝0.7的阳极化6061 T6铝合金制成。在其他实施例中，可使用其他材料，例如导热率k＝225W/m.k.、热辐射系数e＝0.9的6063 T6或1050铝合金。在其他实施例中，仍然可使用其他合金，例如AL 1100等。在另一些实施例中，使用具有热传导性的压铸合金。在其他实施例中，散热器1可包括诸如铜等的其他金属。图19a是一些实施例 中的散热器1的剖视示意图。图19a所示，于一些实施例中，散热器1相比本实施例中的散热器1增加了散热柱12，具体的，散热器1包括散热柱12、散热鳍片11及散热底座13，散热柱12连接散热底座13，散热鳍片11设置在散热柱12的外圆周上，呈放射状均匀分布，散热鳍片11的根部与散热柱12的外圆周上和散热底座13连接。散热柱12的设置，对散热鳍片11起到支撑作用，防止加工过程中，散热鳍片11偏斜。当LED灯使用时，散热柱12或散热底座13将LED芯片311产生的热量传递至散热鳍片11，散热柱12为两端具有开口的中空结构，例如散热柱12为圆筒状结构；散热柱12的材质选用可与散热器1一致，主要以热传导性良好的材质为优选，例如为铝合金材质，以使散热器1实现质轻及成本低的效果。在本发明其他具体实施例中，散热柱12的材质还可为铜材质，以增强散热器1的热传导性能，实现快递传热及散热的效果。在本发明其他具体实施例中，散热柱12的内侧壁可设置一层导热层，导热层的厚度为0.1mm～0.5mm，以进一步增强散热效果。散热鳍片11的比表面积为散热柱12的比表面积的4～10倍，优选为6～8倍。图19b是采用图19a的散热器的LED灯的俯视图。如图19b，当LED灯为大功率照明设备，散热柱12的底部内径r可以为10～15mm，即散热柱中轴线XX到散热柱内表面距离可以为10～15mm。由于散热柱的外表面有散热鳍片辐射状分布，以散热鳍片的边缘为圆周的内径R的范围可以为大于或等于15至小于20mm，即散热鳍片边缘到散热器中轴线的距离为大于或等于15至小于20mm。从散热器的底部到顶部，由散热鳍片所限定的内径可以相同也可以不同。也就是说，每片散热鳍片向散热器的中轴线XX延伸的长度(即R-r)可以是沿散热器1的高度方向固定不变的，也可以沿散热器1的高度方向而变化。各个散热鳍片11沿散热器1内表面延伸的长度可以相同也可以不同，即各个散热鳍片11的长度可以等长也可以不等长。各个散热鳍片11可以沿散热器1内表面以平行于散热器1中轴线的方向延伸，也可以沿散热器1的内表面呈螺旋状延伸。
如图2、图4和图5所示，散热器1的散热底座13上具有一下端面133，下端面133位于散热底座13相对散热鳍片11的另一侧，也就是说，下端面133与灯板3位于同一侧。本实施例中，下端面133在LED灯的轴向上超出灯板3，也就是说，在使用状态下，灯板3朝下设置时，下端面133的位置低于灯板3的位置。如此一来，下端面133的位置，可对LED灯板3起保护作用，当发生碰撞时，会先碰撞到下端面133，而不至于直接碰撞到灯板3。如图2和4所示，从另一角度讲，散热底座13具有凹陷区132，灯板3放置在凹陷区132内，凹陷区132为圆柱体或大致的圆柱体结构，或者圆台结构，如果是圆柱体结构，则圆柱体的直径小于散热底座13的直径。于散热底座13中设置凹陷区132的形式，有助于降低LED灯的眩光效应，提升使用者在使用该产品的直视感和舒适性(凹陷区132的内部的侧壁遮挡至 少一部分的LED芯片311的侧向的发光，从而降低眩光)。于一些体实施例中，散热底座13也可以不具有凹陷区，为使灯板3与散热器1具有最大接触面积，保证散热效果，优选散热底座13的表面为平整表面。
图20是一些实施例中LED灯去掉灯罩4的剖视示意图。如图20所示，于一些实施例中，下端面133设置为倾斜面(在LED灯竖直垂吊时相对水平面倾斜)，当倾斜面在LED灯的径向上位平直状倾斜时，倾斜面与水平面的夹角为3至4度，在其他实施例中，该夹角大于0度而小于等于6度。当倾斜面在LED灯的径向上为曲面状倾斜时，曲面的切平面与水平面的夹角为3至4度，在其他实施例中，该夹角大于0度而小于等于6度。当下端面133倾斜一定角度后(比如当端面133与外反射面4302的夹角为120度至180度时)，其可作为外反射面4302的延伸，而起到一定的反射作用。
图21是本实施例LED灯的立体图。如图2和图21所示，散热器1的散热底座13相对下端面133的另一侧具有一背面134，散热鳍片11一端延伸至与该背面134抵接，因此，散热鳍片11至少一部分在轴向上超出LED灯板3。换句话说，在LED灯的轴向方向上，散热鳍片11在散热底座13的背面134与灯板3之间的位置形成一延伸部1101。通过增加该延伸部1101，可增加散热鳍片11的散热面积，提高散热效果，另外，延伸部1101的设置，也没有额外增加LED灯的整体的高度，从而利于控制LED灯的整体高度。
图22是本实施例中的LED灯的剖视图。如图22所示，本实施例中，散热底座13的背面134为倾斜设置，也就是说，LED灯垂吊状态下，在LED灯的径向向内的方向上，背面134向上倾斜设置。从另一角度来说，在LED灯的径向方向上，在朝向LED的轴心的方向上，背面134至灯板3在LED灯的轴向上的距离逐渐递增。这样的设置方式，有利于对流的空气沿背面134导入而带走背面134的热量，防止背面134阻碍空气的进入。
如图2和图5所示，在使用状态下，灯板3朝下设置时，下端面133的位置低于灯罩4的端面44和光输出表面43的位置。如此一来，包装、运输或使用状态时，如果发生碰撞，则会碰撞到下端面133，以此可防止碰撞到灯罩3，而损坏端面44或光输出表面43。
如图2和图5所示，下端面133之间围成一容置空间(凹陷区132)，灯罩4置于该容置空间内，灯罩置于容置空间后，灯罩4的高度不超出下端面133。LED灯的高度大致包括灯壳2的高度、散热器1的高度和灯罩4的高度，本实施例中，将灯罩4设置的位置不超过散热器1的下端面133，可控制整灯的高度，使灯罩4的设置不会额外增加整灯的高度，从另一方面来讲，散热器1则额外增加了其可散热的部分(下端面133所在的相对灯板3而下凸的部分)。在其他实施例中，也可以使灯罩4部分超出下端面133。
如图2、图4和图5所示，端面44与灯板3保持间距，以此形成一空腔8，该空腔8分别与第一散热通道7a的第一进气孔2201及第二散热通道7b的第二进气孔1301连通，空气从端面44的透气孔41进入到空腔8后，在进入到第一散热通道7a及第二散热通道7b。空腔8的设置，使得空气进入后，有一个在空腔内混合的过程，然后再根据第一散热通道7a和第二散热通道7b的负压(因温差而产生的负压)情况而进行分配，使得气流的分配更加合理。
本实施例中，在采用被动式散热的情况下(无风扇)，LED灯的功率(瓦)与散热器1的散热面积(平方厘米)的比值为1：20～30之间，也就是说，每瓦需要20平方厘米至30平方厘米的散热面积做散热。优选的，LED灯的功率与散热器1的散热面积的比值为1:22～26之间。更优选的，LED灯的功率与散热器1的散热面积的比值为25。灯壳2的内腔中形成第一散热通道7a，且第一散热通道7a在灯壳2的一端具有第一进气孔2201，而灯壳2上相对的另一端具有散热孔222。空气从进气孔2201进入，并从散热孔222排出，以此，可带走第一散热通道7a内的热量。散热鳍片11、散热底座13中形成第二散热通道7b，第二散热通道7b具有第二进气孔1301，空气从第二进气孔1301进入后，通过第二散热通道7b，最后从散热鳍片11之间的空间流出。以此，可带走散热鳍片11辐射至周围空气的热量，加速散热鳍片11的散热。通过第一散热通道7a和第二散热通道7b的设置，从而增加了自然对流的效率，使得散热器1相应的所需的散热面积降低，使LED灯的功率与散热器1的散热面积的比值在20～30之间。本实施例中，LED灯整灯的重量小于1.7kg，给LED灯提供大约200W(300W以下，优选的，250W以下)的电能时，LED芯片311被点亮，且至少发出25000流明的光通量。
如图1所示，本实施例中散热器1的重量占LED灯的重量的50％以上，于一些实施例中，散热器1的重量占LED灯的重量的55～65％，而此时，散热器1的体积占LED灯总体的体积的20％以上，在散热器1的导热系数相同的情况下(也就是散热器1整体采用相同材质，或是使用两种导热系数趋于相同的相异材质)，散热器1所占的体积越大，其可用作散热的面积越大。因此，一定程度上，散热器1的体积占LED灯总体的体积的20％以上时，散热器1可具有更多可利用的空间，来增加其散热面积。在考虑到电源5、灯罩4和灯壳2的设置空间后，优选的，散热器1的体积占LED灯总体的体积的20％～60％，更为优选的，散热器1的体积占LED灯总体的体积的25％～50％，以此，在LED灯整体尺寸受限，且需要保证电源5、灯罩4和灯壳2的设置空间时，使散热器1体积最大化，更利于LED灯整体散热上的设计。
图23为本实施例中的散热器1的俯视图。如图23所示，在散热器1受上述的体积的限制下，散热鳍片11中的至少一部分，其在LED灯的径向方向往外延伸出至少两个片体，这 两个片体间隔设置，通过这种设置，使散热鳍片11在固定的空间内，具有更大的散热面积，另外，延伸出的两个片体，其对该散热鳍片11起到支撑作用，使散热鳍片11更稳固的支撑在散热底座13上，防止散热鳍片11发生偏转。
具体来讲，如图23所示，散热鳍片11包括第一散热鳍片111和第二散热鳍片112，第一散热鳍片111和第二散热鳍片112在LED灯轴向上的底部均与散热底座13连接，第一散热鳍片111与第二散热鳍片112彼此间隔交互设置。第二散热鳍片112的形状为一分为二的Y形，通过将第二散热鳍片112设置为一分为二的结构，使得散热器1在占用相同体积的情况下，拥有更多的散热面积。本实施例中，第一散热鳍片111与第二散热鳍片112彼此间隔设置，各第一散热鳍片111在圆周上均匀分布，各第二散热鳍片112在圆周上均匀分布，相邻两个第二散热鳍片112以一第一散热鳍片111对称设置。本实施例中，第一散热鳍片111与第二散热鳍片112之间的间距为8～12mm，总体而言，为使散热器1中的空气流通顺畅，进而使散热器1发挥最大散热效果，各散热鳍片间的间距设计应力求趋向均匀一致。
图27为一些实施例中的LED灯的主视图。如图27所示的LED灯中，将散热鳍片11在LED灯的径向上分为两部分，即第一部分111a的弧度小于第二部分111b，第一部分111a的弧度小于第二部分111b(此处的弧度指的是其在LED灯的轮廓上的弧度)。于其他实施例中，第一部分111a的弧度大于或等于第二部分111b。
图28为一些实施例中的LED灯的主视图。如图28所示，散热鳍片11的两侧面设有散热条16，其中一侧面上的散热条16位于另一侧面上相邻两散热条16之间，也就是说，两侧面上的散热条16横向投影方向上不重叠。本实施例中，其中一侧面上相邻两散热条16之间的距离与另一侧面上相邻两散热条16之间的距离相等。散热条16的设置，可增加散热鳍片11整体的表面积，使得散热鳍片11具有更多可用于热辐射的面积，从而提升散热器1的散热性能。于其他实施例中，为增加散热鳍片11的表面积，可将散热鳍片11表面设置为波浪形。
如图23所示，至少一散热鳍片11在LED灯的径向上分为两部分，且这两部分间隔设置，以此，可在上述间隔处形成流道，以使得空气可在上述间隔处进行对流。另外，上述的间隔处，在LED灯的轴向上投影到灯板3处时，上述间隔处的位置，对应于灯板3上设置LED芯片311的区域，因而，此处增加的对流，可提高对LED芯片311的散热效果。而从LED灯整体重量受限的观点来说，于部分的散热鮨片11进行间隔设置，减少了散热鮨片11的用量，降低了散热器1整体重量，提供LED灯其他零部件馀裕设计空间。于其他实施例中，如图27中的LED灯，散热鳍片11也可以不具有上述的间隔，也就是说，散热鳍片11在LED 灯径向上是以整体的结构。
图24为图23中的E处的放大示意图。如图23和图24所示，具体来讲，散热鳍片11包括第一散热鳍片111和第二散热鳍片112，第一散热鳍片111在LED灯的径向分为两部分，即第一部分111a和第二部分111b，且这两部分在LED灯的径向上间隔设置，在间隔处形成间隔区111c。第一部分111a径向上位于第二部分111b的内侧。第二散热鳍片112具有第三部分112a和第四部分112b，第四部分112b延伸自第三部分112a，第四部分112b相比第三部分112a在周向上的位置改变，且第四部分112b相对第三部分112a位于散热器1径向的外侧，以提高空间利用率，从而具有更多的可作散热的散热鳍片11的面积。如图24所示，第三部分112a和第四部分112b通过过渡段113连接，过渡段113具有缓冲段113a和引导段113b，缓冲段113a和引导段113b均为弧形状，且两者形成“S”字形或倒“S”字形。缓冲段113a的设置，避免如图25所示空气在第二散热鳍片112表面向径向外侧对流时，遇阻而形成涡流，进而阻碍对流的情况，而是引导段113b引导对流的空气继续沿第二散热鳍片112表面而向径向外侧流动。
如图24所示，一第二散热鳍片112包括一第三部分112a和二第四部分112b，两个第四部分112b以第三部分112a为对称轴而对称设置。其他实施例中，一第二散热鳍片112也可以是包括一第三部分112a和多个第四部分112b，如三个或四个第四部分112b(图未示)，而第二散热鳍片112在LED灯周向上的两侧的第四部分112b与第一散热鳍片111相邻。
如图24所示，引导段113b的任意切线所指向的方向与间隔区111c错开，避免对流的空气经引导段113b引导而进入间隔区111c，以使对流路径变长而影响散热效率。优选的，引导段113b的任意切线所指向的方向位于间隔区111c径向上的外侧。其他实施例中，引导段113b的至少一部分切线所指向的方向位于间隔区111c径向上的内侧。
如图26所示，其他实施例中，引导段113b的至少一部分切线所指向的方向落入到间隔区111c，以使得对流更加充分，但会相应的增加对流的路径。
如图21所示，散热鳍片11具有凸起部1102，凸起部1102相对散热鳍片11的表面而凸起，凸起部1102沿灯的轴向延伸设置，并接触散热器座13。除此之外，凸起部1102表面可选择性地采用圆周面的形态，或采用规则或不规则的多边形柱体。凸起部1102的设置，可增加散热鳍片11的表面积，增加散热效率，另外，凸起部1102也对散热鳍片11起到支撑作用，防止加工成型时，散热鳍片11位置发生偏转。于一些实施例中，同一散热鳍片11，在LED灯的径向上分为两个部分的，每个部分上均设置有至少一相应的凸起部1102，以对这两个部分均起到支撑作用。于本实施例中，凸起部1102设置于散热鳍片11在LED灯径向上的端部， 比如，设于第一部分111a和111b的端部(靠近间隔区111c的一端)。
一些实施例中，当散热鳍片11为一整体，也就是不具有前述间隔部分时，凸起部1102亦可设置于散热鮨片11的表面(图未示)，以增加散热鳍片11的表面积，且对散热鳍片11起到支撑作用，防止加工成型时，散热鳍片11位置发生偏转。
图29是图1的LED灯去掉灯罩4的仰视图。图30是图29中A处的放大图。如图29和图30所示，散热器1套设于内套21的径向的外围，散热鳍片11在LED灯的径向上的内侧壁与灯壳2的内套21保持间距，这样一来，一方面，防止工作时，内套受热膨胀，并受到散热鳍片11的内侧壁的挤压而破损，另一方面，防止散热鳍片11的内侧壁直接接触内套21而形成热传导，使散热鳍片11的热量传导到内套21内部，从而影响灯壳2内的电源5的电子组件，最后，散热鳍片11在LED灯的径向上的内侧壁与灯壳2的内套的间距中具有空气，空气本身具有隔热作用，因此进一步防止散热器1的热影响内套21中的电源5。于其他实施例中，为使散热鳍片11对内套21具有径向的支撑性，也可设置为一部分散热鳍片11的径向的内侧壁接触并支撑内套21的外周面，而一部分散热鳍片11则与内套21保持间距，该设计可应用于图29的LED灯中。如图29所示，灯板3包含第三开口32以使第一进气孔2201和第二进气孔1301露出。在一些实施例中，为了将电源5产生的热能快速排出，第一进气孔2201的截面积与第二进气孔1301的截面积的比值为大于1且小于或等于2。在一些实施例中，为了将灯版3的LED产生的热能快速排出，第二进气孔1301的截面积与第一进气孔2201的截面积的比值为大于1且小于或等于1.5。
如图21和图22所示，散热鳍片11在LED灯的径向上的最内侧的位置在LED灯的径向方向上位于散热孔222的更外侧，也就是说，散热鳍片11在LED灯的径向上的最内侧与散热孔222的位置在LED灯的径向方向上保持间距。如此一来，散热鳍片11散发的热量向上时，不会聚集到散热孔222处，从而会与散热孔222保持一定的间距，以避免了热气影响而使散热孔222附近的温度升高而影响第一散热通道7a的对流速度(对流速度取决于第一散热通道7a两侧的温差，当散热孔222附近温度升高时，则对流速度相应会减慢)。
图31是本实施例中LED灯的剖视图。图32是图31中C处的放大图。如图31和图32所示，散热器1包括散热鳍片11及散热底座13，散热底座13具有凸部135，凸部135在LED灯的轴向方向上向下设置，凸部135在LED灯的轴向上超过灯板3，且凸部135的最下方位置(下端面133)与灯罩4的光输出表面43的高度基本一致(在LED灯的轴向方向上)，或者凸部135的最下方略微超过灯罩4的光输出表面43，举例来讲，凸部135的最下方超过灯罩4的光输出表面43大约1至10毫米，以使散热器1在LED灯整体高度尺寸不变，或略微 变大的情况下，增加体积，以使散热鳍片11和散热底座13具有更大的散热面积。
本实施例中的凸部135设置为环状，且与散热底座13共同限定了一个内凹结构，光源及灯罩4设于该内凹结构中，并对光源和灯罩4起到保护作用，且该内凹结构可起到防眩光的作用(内凹结构挡住了光源的侧向的光线)。
如图32所示，散热底座13具有第一内表面136，灯罩4具有外周壁45，在灯罩4正确安装于LED灯后，第一内表面136对应于灯罩4的外周壁45(灯罩4径向的外侧)，且第一内表面136与外周壁45保持有间隙，以防止LED灯工作时，因发热而导致灯罩4受热膨胀，从而受第一内表面136挤压而破损。通过第一内表面136与外周壁45保持间隙，可减小上述的挤压或避免挤压的发生。于其他实施例中，也可以设置成，灯罩4的外周壁45的一部分与第一内表面136接触，以使第一内表面136对灯罩4的径向起到支撑，而灯罩4的外周壁45的其他部分则与第一内表面136保持间隙。
如图32所示，上述的第一内表面136设置为倾斜面，其与灯板3保持一定的夹角，该夹角可以是钝角。因而，当灯罩4受热膨胀时，其外周壁45抵在倾斜面上时，第一内表面136对灯罩4径向的外侧的挤压力分解为一个向下的分力及一个水平的分力，有助于减小水平方向上对灯罩4的挤压(水平方向的挤压，为灯罩4破损的主因)。其他实施例中，可将外周壁45的周面抵接在第一内表面136上(图未示)，藉此对灯罩4起到支撑或限位作用，且由于第一内表面136为倾斜面，因此可减小灯罩4因受热膨胀被挤压而破损的几率，也可将外周壁45的端部抵接在第一内表面136上，以此可减小外周壁45整体与散热底座13的接触面积，避免过多的热传导。
如图32所示，散热底座13还具有第二内表面137，灯罩4具有外周壁45，外周壁45与第一内表面136保持间隙，而外周壁45的端部抵接第二内表面137，第一内表面136与灯板3的夹角小于第二内表面137与灯板3的夹角，也就是说，第二内表面137相比第一内表面136来的更为平坦，因此在外周壁45的端部抵接第二内表面137，且灯罩4受热膨胀时，第二内表面137对灯罩4的水平挤压更小。本实施例中，第二内表面137与灯板3的夹角为120°至150°之间，如果夹角过大，则无法有效的在LED灯的径向上对灯罩4起到支撑，而如果夹角过小，一来无法起到灯罩4受热膨胀后对灯罩4减小水平施力的作用，二来无法在LED灯的轴向上对灯罩4起到限制和支撑作用，而在上述区间时，则能够很好的进行平衡。于其他实施例中，第二内表面137和第一内表面136可以是曲面的，第二内表面137和第一内表面136相对LED灯的轴线的距离，在向下时逐渐增加，但是，总体来说，第二内表面137相比第一内表面136更加平坦。
如图33所示，外周壁45的端部设置凸壁451，凸壁451在外周壁45的周向上间隔排布，凸壁451为外周壁45的端部实际接触第二内表面137的部分，通过凸壁451的设置，可减小灯罩4的外周壁45与散热底座13的接触面积，避免散热器1的热量传导到灯罩4上，使灯罩4温度过高。
如图31和图32所示，灯罩4的外周壁45与散热底座13之间具有间隙，而散热底座13上开设孔洞，该孔洞一侧与间隙连通，另一侧则对应于散热鳍片11，也就是说，空气可以从间隙进入，并通过孔洞而到达散热鳍片11，以此增加了对流，对流路径，则如图32中的箭头所显示，该对流路径可形成本实施例LED灯的第四散热通道7d。而此时，由于凸壁451在外周壁45的周向上间隔排布，空气可以从凸壁451之间的间隙通过，从而完成上述的对流。如图34和图35所示，其他实施例中，第四散热通道7d也可设置于其他位置，只需连通LED灯的下方与散热鳍片11之间的区域即可。例如，在灯板3上的相邻的LED芯片组31之间设置通孔315，而此时，灯罩4可设置为分体式，即包含多个部分，来分别罩设在不同的LED芯片组31上，而通孔315位于灯罩4两个部分之间的位置，以此使通孔315与LED灯下方连通，并在上方连通散热鳍片11之间的空间。
本实施例中的散热器1为一体式结构，因此，有利于减小散热鳍片11与散热底座13之间的热阻。其他实施例中，为方便加工和成型，也可将散热鳍片11与散热底座13设计为可拆卸式的。
本实施例中，散热鳍片11不同位置会有不同的温度，举例来讲，接近LED芯片311的部分是80℃，而散热鳍片11的上方的温度会略微下降。随着散热鳍片内部温度分布的不同，散热量会降低到散热鳍片11为均一温度的百分之几，我们称之为散热鳍片的效率，散热鳍片11的效率可通过热传导率及尺寸进行计算。散热鳍片11的效率跟散热鳍片11的传热系数、厚度、宽度和高度均有关。
本实施例中，为提升散热鳍片11的效率，将散热鳍片11的厚度设置为0.8～2mm，优选为1～1.5mm。散热鳍片11的厚度与长度的比值不小于1:80，优选的，散热鳍片11的厚度与长度的比值不小于1:70，更优选的，散热鳍片11的厚度与长度的比值为1:60～80。以此在散热鳍片11的散热效果，整个散热器1的重量及散热面积间达到平衡，以使散热鳍片11具有较优的效率。此处散热鳍片11的长度指的是在LED灯轴向上的高度。本实施例将散热鳍片11的宽度与长度的比值设置为大于1:1.5，优选的，散热鳍片11的宽度与长度的比值大于1:1.3，使散热鳍片11的传热系数更优，以提升散热鳍片11的效率。此处散热鳍片11的长度指的是在LED灯轴向上的高度，而宽度指的是LED灯径向上的散热鳍片11的长度。如果散热鳍片 11不是规则的方向结构，则散热鳍片11的宽度可以取其平均值，或者宽度的最大值的一半加最小值的一半，而长度可以取其平均值，或者宽度的最大值的一半加最小值的一半。
Figure PCTCN2018119665-appb-000001
h代表散热鳍片的传热系数，单位为[W/(m 2·℃)]；
V代表对流空气的流速；
L代表对流方向上散热鳍片的长度；
由上述公式可看出，考虑散热鳍片11的热至少一部分通过对流散热时，其传热系数受散热面设置状况的影响较大。另外，散热鳍片11在传热时，其厚度(截面积)也是重要因素。气流方向的下游空气温度会上升，而冷却能力也相应下降，所以，在相同面积的散热鳍片11上，如果在气流方向上以长度较短、而横向较宽的方式配置散热鳍片11，则散热量增加，另外，在相同的散热面积下，本实施例控制散热鳍片11的高度，以使散热鳍片11具有更多靠近LED芯片311的面积，以加速LED芯片311到散热鳍片11的热传导。而散热鳍片11的厚度，也会影响散热鳍片11的效率，散热鳍片11的厚度越大，则效率越高，但是又需要平衡重量和散热面积。综上考虑，将散热鳍片11的厚度与长度的比值设定为不小于1:80，而将散热鳍片11的宽度与长度的比值设置为大于1:1.5。
图36a～36m为一些实施例中各种散热器10的示意图，可应用于LED灯，以替换如图1所示的LED灯的散热器1。
如图36a所示，是本发明第一较佳实施例所提出的一种散热器10。所述散热器包括第一散热鳍片101和第二散热鳍片102。散热器1上定义一投影于散热底座130的第一圆周R1与第二圆周R2，且第二圆周R2大于第一圆周R1。于散热底座130上，第一散热鳍片101延伸于柱状容置空间(用于容纳内套21的部分，以下其他实施例所提到的柱状容置空间均同此实施例的柱状容置空间的定义)的外周，并且不超过第二圆周R2，例如第一散热鳍片101由柱状容置空间的外周恰好延伸至第一圆周R1。第二散热鳍片102延伸于第一圆周R1，但不超过第二圆周R2，例如恰好延伸至第二圆周R2。于径向上，第一散热鳍片101以及第二散热鳍片102交错地在周向配置，并且每两第二散热鳍片102以一个第一散热鳍片101对称设置。第一散热鳍片101与第二散热鳍片102彼此之间具有间隙，使气流可以通过，并且延长气流在第一散热鳍片101与第二散热鳍片102之间流动的路径，以增加散热鳍片101，102与气流 之间的热交换量。
如图36b所示，为本发明第二较佳实施例所提出的散热器10。第二较佳实施例提出的散热器1与第一实施例的差异在于，散热器10还包括间隔散热鳍片108，在散热底座130上由柱状容置空间的外周延伸至第二圆周R2，在周向与第一散热鳍片101交错配置，并且在第一圆周R1与第二圆周R2之间与第二散热鳍片102交错配置，从而形成每两第一散热鳍片101以一个间隔散热鳍片108对称设置，与每两第二散热鳍片102以一个间隔散热鳍片108对称设置。
如图36c所示，为本发明第三较佳实施例所提出的散热器10。第三较佳实施例提出的散热器10与第二较佳实施例的差异在于，散热器10还包括第三散热鳍片103，并且散热器10进一步上定义一投影于散热底座103的第三圆周R3，且第三圆周R3大于第二圆周R2。于散热底座103上，第一散热鳍片101由柱状容置空间的外周延伸至第一圆周R1，第二散热鳍片102由第一圆周R1延伸至第二圆周R2，第三散热鳍片103由第二圆周R2延伸至第三圆周R3。于径向上，第二散热鳍片102以及第三散热鳍片103交错地在周向配置，并且每两第三散热鳍片103以一个第二散热鳍片102对称设置。
第三较佳实施例的散热鳍片可以进一步拓展至第n鳍片，n为大于二的整数。也就是散热底座130上由小至大定义第一圆周R1至第n圆周，第一散热鳍片101由柱状容置空间的外周延伸至第一圆周R1，第n散热鳍片由第n-1圆周延伸至第n圆周。于径向上，第n-1散热鳍片以及第n散热鳍片交错地在周向配置，并且每两第n散热鳍片以一个第n-1散热鳍片对称设置。此外，第一散热鳍片101至第n散热鳍片中，至少有一部分在散热底座130上与LED灯板3重叠(LED灯轴向上的投影)，以确保LED灯板3至散热鳍片有直接的热传导路径。
如图36c所示，第n散热鳍片与第n-1散热鳍片之间，于周向上不交错重叠配置，也就是如图36c所示，第n-1散热鳍片的外侧缘不超过第n-1圆周，而第n散热鳍片由第n-1圆周开始延伸。例如第二散热鳍片102的外侧缘不超过第二圆周R2，而第三散热鳍片103由第二圆周R2开始延伸且不超过第三圆周R3。
如图36d所示，第三较佳实施例的散热鳍片中，第n散热鳍片与第n-1散热鳍片之间，于周向上也可以是交错重叠配置。也就是如图36d所示，第n-1散热鳍片的外侧缘超过第n-1圆周但没有到达第n圆周，而第n散热鳍片由第n-1圆周开始延伸。例如第二散热鳍片12的外侧缘超过第二圆周R2但没有到达第三圆周R3，而第三散热鳍片13由第二圆周R2开始延伸。
在图1至图2的实施例中，散热鳍片11的外侧边缘呈圆弧形。在其它实施例中，散热鳍片的外侧边缘可呈波浪形，或者散热鳍片的外侧边缘可呈直线或是阶梯状。
如图36e所示，为第四较佳实施例所提出的散热器10。第四实施例提出的散热器10与图1的差异在于，散热器1的散热鳍片，例如第一散热鳍片101，其外侧边缘垂直于散热底座130，因此，从垂直于轴向的方向上观察第一散热鳍片101，散热鳍片是呈现矩型(长方形或正方形)，而不是外侧边缘有向上渐缩曲线的形状。矩型的第一散热鳍片101，在相同的高度和宽度限制下，可有效地增加第一散热鳍片101的面积，增加与气流的热交换。
如图36f所示，于一具体实施例中，散热器1的散热鳍片，包括第一散热鳍片101至第n散热鳍片，第一散热鳍片101至第n散热鳍片均具有孔洞101a，孔洞101a贯穿散热鳍片的两侧面。例如，图36f所示的第一散热鳍片101具有贯穿两面的孔洞101a。贯穿散热鳍片的两侧面孔洞101a，可以增进气流的流动而加速散热，同时，减少散热器1的重量。
如图36g所示，于一具体实施例中，散热器1的散热鳍片，包括第一散热鳍片101至第n散热鳍片，可以设置为两阶段落差。第一阶段1011延伸于散热底座130上，第二阶段1012延伸于第一阶段1011。第一阶段1011在LED灯径向上的长度，大于第二阶段1012在LED灯径向上的长度，第一阶段1011在LED灯轴向上的高度，低于第二阶段1012在LED灯轴向上的高度。因此，从垂直于轴向的方向上观察第一散热鳍片101是呈现阶梯形状。这种设置方式，使得散热器1可保证下部具有足够的用于传导LED芯片311工作所产生的热量的鳍片面积，而上部则主要通过辐射和对流的方式，因而从减重角度，可适当减少鳍片面积。
如图36h所示，为本发明第五较佳实施例所提出的散热器10。第五较佳实施例的散热器10是基于第四较佳实施例，进一步配置有第二散热鳍片102，第二散热鳍片102的外侧边缘垂直于散热底座130，使得第二散热鳍片102是呈现矩型(长方形或正方形)。同时，第二散热鳍片102在散热底座130上的高度小于第一散热鳍片101的高度，并且第二散热鳍片102与第一散热鳍片101是交错地配置。因此，第二散热鳍片102可以增加与气流热交换面积，但是由于高度较小，可以减少第一散热鳍片101与第二散热鳍片102之间的热辐射交换。本实施例中，如果第一散热鳍片101和第二散热鳍片102的总数量与第四较佳实施例中的散热鳍片的数量相同(也就是在鳍片数量相同的情况下)，则本实施例的设计，则更有利于散热器10整体的减重，并且可以减少第一散热鳍片11与第二散热鳍片102之间的热辐射交换。
如图36j所示，为本发明第六较佳实施例所提出的散热器1。第六较佳实施例的散热器10是基于前述的实施例，进一步配置外支撑壁106与内支撑壁105。所述外支撑壁106连接第一散热鳍片101的外侧边缘，所述内支撑壁105连接第一散热鳍片101的内侧边缘，从而 防止第一散热鳍片101的偏斜。如图36j所呈现的，从上方向下观察散热器10，外支撑壁106与内支撑壁105都是呈现圆环形状，使得第一散热鳍片101可以从径向连接。外支撑壁106与内支撑壁105可以连接于散热底座130，也就时垂直地延伸于散热底座130的上表面，外支撑壁106与内支撑壁105也可以只连接第一散热鳍片101，与散热底座130的上表面保持间隔距离。在轴向上，外支撑壁106与内支撑壁105的高度小于第一散热鳍片11的高度，从而维持气流在径向上的畅通。外支撑壁106与内支撑壁105可以仅有择一配置，不必然同时配置有外支撑壁106与内支撑壁105。如图36k所示，外支撑壁106与内支撑壁105也可以是分段式设置，即，以外支撑壁106举例，可在同一圆周上设置为多个等间距或不等间距排列的弧形段1061，弧形段1061至少连接两组第一散热鳍片101，以此可进一步减少对对流的影响。
如图36l所示，为本发明第七较佳实施例所提出的散热器10。第七较佳实施例的散热器10是基于第前述的实施例，修改第一散热鳍片101的形态。在第七较佳实施例中，第一散热鳍片101包括第一部分101a、第二部分101b与连接部分101c。第一部分101a与第二部分101b延伸于径向，并且通过连接部分101c互相连接。其中，第一部分101a由柱状容置空间的外周向外延伸，第二部分101b通过连接部分101c连接第一部分101a，而进一步向外延伸。连接部分101c不平行于径向，于一具体实施例中，连接部分101c大致沿着周向延伸或是垂直于径向，而使得第一部分101a和第二部分101b在径向上交错配置，而不在同一条径向延伸线上。连接部分101c的配置，可以增加第一散热鳍片11的面积，从而提升气流与第一散热鳍片11的热交换量，另外，连接部分101c的设置，起到支撑作用，可防止第一散热鳍片11的偏斜。
如图36m与图36n所示，为本发明第八较佳实施例所提出的散热器1，。第八较佳实施例的散热器10是基于前述的实施例，修改第一散热鳍片101的形态。在第八较佳实施例中，散热底板130上定义多个具有不同半径的同心圆，第一散热鳍片101分别在散热底板130上，由各同心圆垂直地延伸于散热底板130。
在图36m中，每一同心圆上的第一散热鳍片101是连续型态，也就是第一散热鳍片101呈现环状型态，且每一同心圆上配置有一个第一散热鳍片101。
在图36n中，每一同心圆上的第一散热鳍片101是不连续型态，也就是第一散热鳍片101呈现弧状型态，且每一同心圆上配置有多个弧状的第一散热鳍片101，并且在同一同心圆上，相临的第一散热鳍片101之间具有间隙，以供气流在径向上流通。
于一些实施例中，所述散热器1具有一条中轴线XX，以所述中轴线XX为法线的平面 A-A和中轴线XX交于一个交点91，交点91位于散热器1的柱状容置空间。于一些实施例中，所述中轴线XX沿平面A-A到散热鳍片11的边缘的距离大于零，如图37a至图37d所示。在图37a的示例中，以所述交点91为圆心，距离D1为半径，在所述平面A-A上建立一个虚拟圆(如图37a虚线所示)，散热器1具有至少一个散热鳍片11，所述虚拟圆和散热鳍片11边缘交错。所述散热器1具有多个散热鳍片11时，所述多个散热鳍片1的边缘到散热器1的中轴线具有相同的距离D1，所述虚拟圆和所述多个散热鳍片11边缘都交错。于一些实施例中，所述散热器1具有多个散热鳍片11，所述多个散热鳍片1中的至少两个散热鳍片的边缘沿平面A-A到散热器的中轴线XX的距离D1和D2不相等，距离D1小于距离D2，以所述交点91为圆心，该较短距离D1为半径，在所述平面A-A上建立一个虚拟圆(如图37b虚线所示)，所述虚拟圆和距离为D2的散热鳍片11边缘不交错，本实施方案的示例性图示请见图37b。
于一些实施方案中，所述散热器1具有多个散热鳍片11，所述多个散热鳍11片的边缘到散热器1的中轴线XX的距离D1、D2、D3、…、Dn(图37c中仅示出D1、D2和D3)均不相等，距离D1小于距离D2，距离D2小于距离D3，以所述交点91为圆心，以最短距离D1为半径，在所述平面A-A上建立一个虚拟圆(如图37c虚线所示)，所述虚拟圆30和其它大于最短矩离D1的散热鳍片11边缘不交错，本实施方案的示例性图示请见图37c。
于一些实施例中，所述散热器1具有多个散热鳍片11，所述多个散热鳍11片的边缘到散热器1的中轴线XX的距离D1、D2和D3不相等，距离D1小于距离D2，距离D2小于距离D3，以所述交点91为圆心，以所述距离D1、D2和D3为半径，在所述平面A-A上建立多个虚拟圆(如图37d虚线所示)，部分虚拟圆和所述部分散热鳍片11边缘不交错，部分虚拟圆穿透部分散热鳍片11，本实施方案的示例性图示请见图16，以距离D1为半径，在所述平面A-A上所建立的虚拟圆，和距离大于D1的散热鳍片11不交错；以距离D2为半径，在所述平面A-A上所建立的虚拟圆，穿透距离小于D2的散热鳍片11，与距离大于D2的散热鳍11不交错；以距离D3为半径，在所述平面A-A上所建立的虚拟圆，穿透距离大于D3的散热鳍片11。
图38a～38j是一些实施例中的散热器1的俯视图，为方便说明而代替图1中的散热器1。如图1和图38a所示，散热器1包括散热单元与散热底座13，每一散热单元沿着LED灯的轴向延伸于散热底座13，散热单元的具体实施是散热鳍片11，并且散热单元是呈放射状均匀地沿散热底座13周向分布。每一散热单元的根部与散热底座13连接。散热单元的内侧边缘定义了一柱状容置空间14，容置空间14用于设置内套21。当LED灯使用时，散热底座22将 灯板3产生的热量传递至散热单元，并进一步由散热单元传递到外部空气中，以增强散热。灯壳1连接于散热器1，并且大致上是连接于散热单元的上缘。多个散热单元的上缘至少在靠近LED灯轴线的部分是沿着径向切平，而定义一个平坦的连接面，并且灯壳2与散热单元的上缘可以设置对应的扣具，以让灯壳2的下端连接于连接面而连接于散热器1。
如图1、图2与图38a所示，前述的连接面沿所述LED灯径向定义一第一截面A1，散热器1与灯板3连接面沿LED灯径向定义一第二截面A2。在一实施例中，散热单元于LED灯的轴向投影于第一截面A1的数量，小于散热单元于LED灯的轴向投影于第二截面的数量。也就是说，在轴向上，由于空气向上对流，散热单元尽量避免被灯壳2遮挡，使得大多数的散热单元的上缘可以开放地暴露于空气中，而形成不受到灯壳2遮挡的散热通道，从而加强散热单元的对流效应。其他角度来讲，散热单元于LED灯的轴向投影于第一截面A1的数量，小于散热单元于LED灯的轴向投影于第一截面A1外部的数量，以达到上述技术效果。从散热单元的轴向投影的面积来讲，散热单元于LED灯的轴向投影于第一截面A1的面积，小于散热单元于LED灯的轴向投影于第一截面A1外部的面积，以达到上述技术效果。
如图38a所示，散热器1在径向上由内向外定义多个环区，环区定义为周向上拥有相同散热单元数量的区域，换句话说，不同的环区内具有不同数量的散热单元，举例来说，位于内侧的环区具有的散热单元的数量，小于外侧的环区具有的散热单元的数量，并且在LED灯轴向上与第一截面A1投影重叠的环区的数量或面积，小于在LED灯轴向上与第二截面A2投影重叠的环区的数量或面积。
更具体的说，如图38b所示，散热单元可以包括有多个第一散热单元15和多个第二散热单元16(此处的第一散热单元15和第二散热单元16与图23和图24的第一散热鳍片111和第二散热鳍片112采用不同的命名规则且采用不同的分类方式)，在图38b中，第一散热单元15为径向内侧的散热鳍片，第二散热单元16为径向外侧的散热鳍片。其中，第一散热单元15主要投影于位于内侧的环区，而第二散热单元16主要投影于位于外侧的环区，并且每一第一散热单元15的外侧边缘沿着径向分岔延伸出两的第二散热单元16(第一散热单元15外侧边缘延伸出第二散热单元16时，第一散热单元15与第二散热单元16可以是连接的，也可以是断开的，即第一散热单元15与第二散热单元16径向上保持间距)，使得第二散热单元16的数量大于第一散热单元15的数量。同时，第一截面A1又是投影于位于内侧的环区，而第二截面A2投影于位于外侧的环区，使得第一散热单元111于LED灯的轴向投影于内侧的环区，第二散热单元16于LED灯的轴向投影于外侧的环区。因此，第一散热单元15于LED灯的轴向投影于第一截面A1的数量或面积，小于第二散热单元16于LED灯的轴向投影于 第一截面A1的数量或面积。
如图38c与图38d所示，若第一散热单元15中的厚度值大于第二散热单元16的厚度值，因为是放射状排列，接近LED灯轴线的第一散热单元15的间距值，小于远离LED灯轴线的第二散热单元16中的间距值。在第一散热单元15与第二散热单元16的厚度值适当的配置下，第一散热单元15于第一截面A1的任一圆周边长(ΔX1总和)等于第二散热单元16于第二截面A2的任一圆周边长(ΔX2总和)。圆周边长是指以LED轴线(也是散热器2的轴线)为圆心，任一虚拟圆切过第一散热单元15或第二散热单元16的弧总长度。
更具体来说，第一散热单元15或第二散热单元16都是散热鳍片，散热鳍片在散热器1径向上放射状分布。散热器1在径向上由内向外分为第一环区C1和第二环区C2，散热器1还包括柱状容置区域14，位于第一环区C1的内侧，柱状容置区域14主要用于容置部分的电源板，并提供一散热通道。以散热器1的轴线为圆心建立虚拟圆，当虚拟圆落入第一环区C1时切过散热鳍片的弧总长度为X1(ΔX1总和)，虚拟圆落入第二环区C2时切过散热鳍片的弧总长度为X2(ΔX2总和)，则X1＜X2，而虚拟圆切过散热鳍片的弧总长度与虚拟圆的周长的比值，可介于0.06～0.2，使得散热鳍片可以有足够的截面积以进行热传导，但仍可以维持散热鳍片之间的间距值，以维持对流通道大小，并保证相同重量下的散热鳍片具有足够的表面积来做散热。
进一步来说，如果散热鳍片在第一环区C1需要较大的截面积以进行热传导，例如灯板3的LED芯片311投影在第一环区C1的密度大于投影于第二环区C2的密度(此处的密度指的是环区的单位面积内的LED芯片311的分布数量)，而X1和X2分别占所在虚拟圆的周长的比值Ra1和Ra2，此时可设定Ra1>Ra2，或者X1＞X2，使得散热鳍片在第一环区C1有较大的截面积以进行热传导，而在第二环区C2又可以维持散热鳍片之间的间距值，以维持对流通道大小。
相反地，如果散热鳍片在第二环区C2需要较大的截面积以进行热传导，例如灯板3的LED芯片311投影在第一环区C1的密度大于投影于第二环区C2的密度，而X1和X2分别占所在虚拟圆的周长的比值Ra1和Ra2，此时可设定Ra1<Ra2，或者X1＜X2，使得散热鳍片在第二环区C2有较大的截面积以进行热传导，而在第一环区C1又可以维持散热鳍片之间的间距值，以维持对流通道大小。
如果灯板3的LED芯片311投影在第一环区C1的密度等于投影于第二环区C2的密度，则可设定Ra1＝Ra2，或者X1＝X2，使得散热鳍片在第一环区C1与第二环区C2有近似的热传导效率，避免灯板3上出现太大的温度差。
如图38e所示，于一些实施例中，只有部分的第一散热单元15的外侧边缘沿着径向分岔延伸出两的第二散热单元16，或者第一散热单元15与第二散热单元16是各自独立设置而有不同的排列密度。在图38f的散热器1中，第一散热单元15于LED灯的轴向投影于第一截面A1的数量或面积，大于第二散热单元16于LED灯的轴向投影于第一截面A1的数量或面积。同样地以多个环区的投影状况来看，就会形成第一散热单元15于LED灯的轴向投影于内侧的环区的数量或面积，大于第二散热单元16于LED灯的轴向投影于外侧的环区的数量或面积。
同样地，在图38f中，若第一散热单元15中的厚度值小于第二散热单元16的厚度值，第一散热单元15的间距值可大于第二散热单元16中的间距值。在第一散热单元15与第二散热单元16的厚度值适当的配置下，第一散热单元15于第一截面A1的任一圆周边长等于第二散热单元16于第二截面A2的任一圆周边长。
如图38f所示，于一具体实施例中，只有部分的第一散热单元15的外侧边缘沿着径向分岔延伸出两个第二散热单元16，或者第一散热单元15与第二散热单元16是各自独立设置，但呈现沿同一径向线延伸的一对一对应配置，使得第一散热单元15于LED灯的轴向投影于第一截面A1的数量，等于第二散热单元16于LED灯的轴向投影于第一截面A1的数量。同样将散热器1在径向上由内向外分为二个以环区，第一散热单元15于LED灯的轴向投影于内侧的环区的数量或面积，会等于第二散热单元16于LED灯的轴向投影于外侧的环区的数量或面积。
如图38f所示，更具体来说，若第一散热单元15的厚度值等于第二散热单元16的厚度值，且第一散热单元15的间距值等于第二散热单元16中的间距值，则第一散热单元15于第一截面A1的任一圆周边长等于第二散热单元16于第二截面A2的任一圆周边长。
如图38a与图38g所示，散热器1的环区可以由二个扩展为更多，例如散热器1还包括第三环区C3，位于第二环区C2的外侧，当虚拟圆落入第三环区C3时切过散热鳍片的弧总长度X3(ΔX3)，且X1<X2<X3。若X1、X2与X3分别占所在虚拟圆的周长的比值Ra1、Ra2和R3，则Ra1＝0.06～0.13，Ra2＝0.1～0.18，Ra3＝0.12～0.16，且Ra1、Ra2和Ra3的值均落入0.06～0.2的区间内，使得散热鳍片可以有足够的截面积以进行热传导，但仍可以维持散热鳍片之间的间距值，以维持对流通道大小，并保证相同重量下的散热鳍片具有足够的表面积来做散热。
如图11、图38h与图38j所示，灯板3上定义有芯片设置区域(大致为LED芯片311所在的区域)，LED芯片311设置在灯板3上的芯片设置区域。芯片设置区域至少有部分的落 入第二环区C2或第三环区C3的投影中，具体来说，芯片设置区域系尽可能重叠于散热器1上位于外侧环区，从而使得对应的散热鳍片(第一散热单元111或第二散热单元112)，位于散热底座13的外侧缘而有较佳的对流冷却效果，且可以对应更多的散热单元(外侧的散热单元数量多于内侧的散热单元)。在一具体实施例中，芯片设置区域至少有80％的落入第二环区C2及/或第三环区C3的投影中；较佳地，芯片设置区域全部落入第二环区C2及/或第三环区C3的投影中，如图38j所示。
若散热鳍片在散热器1径向上放射状分布，并且厚度均匀，当虚拟圆落入第一环区C1时切过的散热鳍片的数量N1，虚拟圆落入第二环区C2时切过散热鳍片的数量N2，且N1＜N2，此时就可以实质达成X1<X2。同样地在考虑第三环区C3位于第二环区C2的外侧，虚拟圆落入第三环区C3时切过散热鳍片的的数量N3，且N1<N2<N3，而实质达成X1<X2<X3。在这种配置下，芯片设置区域仍可采用如图38h所示的配置方式。
图39为本实施例中的散热器1的俯视图。如图39所示，散热器1包含多个第一散热单元15与多个第二散热单元16(此处的第一散热单元15和第二散热单元16与图23和图24的第一散热鳍片111和第二散热鳍片112采用不同的命名规则且采用不同的分类方式)。第一散热单元15与第二散热单元16都是散热鳍片。每一第一散热单元15包括在散热器1径向上放射状分布的第一散热鳍片15a和一径向上的第一通道15b，第一通道15b是位于二个第一散热单元15a之件的间隙。散热器1在径向上由内向外定义多个环区，即第一环区C1，第二环区C2及第三环区C3，并且位于不同环区的第一通道111b具有不同宽度。同一环区中，位于外侧的第一通道15b，其宽度大于位于内侧的第一通道15b的宽度。
在图39中，第一散热单元15在不同的环区可以采取不同的密度配置，并且第一散热单元15的第一散热鳍片实际上是可以延伸于至少二个环区之间，使得第一散热单元15呈现交错穿插的配置，从而使得位于不同环区的第一通道15b具有不同宽度。或是，第一散热鳍片延伸于至少二个环区之间，并且于二个环区的交界处不连续。
如图39所示，每一第二散热单元16包括两第二散热鳍片16a及形成于两第二散热鳍片之间的第二通道16b，第二通道16b朝散热器1中轴的一侧是不相连开放或是封闭。其中，第一散热单元15与第二散热单元16可以是位于不同的环区，并且第二散热单元16所在的环区，位于第一散热单元15所在的环区的外侧。
如图39所示，在第二通道16b朝散热器1中轴的一侧是封闭的情况下，两个第二散热鳍片16可以是延伸于第一散热鳍片15的外缘，第二散热鳍片的封闭端与第一散热鳍片的外缘位于同一径向线上，但是不相连而有一间隙，形成额外的通道。
LED在发光时，会产生热量。在LED的热传导设计时，关键的参数之一是热阻，热阻越小，则代表热传导越好。热阻的影响因素大致有导热路径的长度、导热面积及导热材料的导热系数。用公式表示如下：
热阻＝导热路径长度L/(导热面积S*导热系数)。
也就是说，导热路径越小、导热面积越大、导热系数越高，则热阻越低。
如图29所示，本实施例中，灯板3包括至少一LED芯片组31，LED芯片组31包括LED芯片311。
如图29所示，本实施例中，灯板3在其径向上被分为内周圈、中间圈和外周圈，而LED芯片组31相应的设于内周圈、中间圈和外周圈，也就是说，内周圈、中间圈和外周圈均设置有相应的LED芯片组31。另一角度来讲，灯板3包括三个LED芯片组31，这三个LED芯片组31分别设于灯板3的内周圈、中间圈和外周圈。内周圈、中间圈和外周圈上的LED芯片组31均包括至少一个LED芯片311。如图29所示，限定4条虚线，最外侧两条虚线间限定的范围为外周圈的范围，最内侧两条虚线间限定的范围为内周圈的范围，而中间两条虚线间限定的范围为中间圈的范围。其他实施例中，也可将灯板3分为两圈，而LED芯片组31相应的设于这两圈中。
如图29所示，设于同一圆周或大致上位于同一圆周上的若干LED芯片311组成一LED芯片组，而灯板3上设有若干组LED芯片组31，同一LED芯片组31中，相邻两个LED芯片311的中心距为L2，任一组LED芯片组31的任一颗LED芯片311，其与相邻的LED芯片组31中最接近的一个LED芯片311的中心距为L3，其符合以下关系：L2：L3为1:0.8～2，优选为L2：L3为1:1～1.5。以此使得LED芯片311的分布更加均匀，以达到出光均匀的目的。
图40为本实施例中散热鳍片11与LED芯片311的配合示意图。如图29和图40所示，本实施例中，至少一散热鳍片11沿LED灯的轴向投影至LED芯片组31所在平面时，该散热鳍片11的投影至少接触LED芯片组31中的至少一个LED芯片311。具体的，至少一散热鳍片11沿LED灯的轴向投影至LED芯片组31所在平面时，该散热鳍片11的投影至少接触内周圈、中间圈或外周圈的LED芯片组31中的至少一个LED芯片311。如图40所示，图中散热鳍片11的投影接触一LED芯片311，如图中箭头所指，为该LED芯片311与该散热鳍片11的散热路径，如图41所示，图中散热鳍片11的投影不接触图示中的LED芯片311，如图中箭头所指，为该LED芯片311与该散热鳍片11的散热路径，可明显看出，后者的散热路径较前者更远，因而，通过使散热鳍片的投影至少接触内周圈、中间圈或外周圈的LED芯片组31中的至少一个LED芯片311，使该LED芯片311的导热路径变短，以此使得热阻降 低，更利于热传导。优选的，散热鳍片11沿LED灯的轴向投影至LED芯片组31所在平面时，任意一散热鳍片11(第一散热鳍片111或第二散热鳍片112)的投影至少接触LED芯片组31中的至少一个LED芯片311。
本实施例中，外周圈的LED芯片组31对应到的散热鳍片11的数量大于内周圈的LED芯片组31所对应的散热鳍片11数量。此处所指的对应，指的是LED灯轴向方向投影关系，比如外周圈的LED芯片组31在LED灯的轴向投影到散热鳍片11处时，外周圈的LED芯片组31所对应到的是相对外侧的散热器1的散热鳍片11。本处的外周圈的LED芯片组31具有更多数量的LED芯片311，因此对其散热时，需要更多的散热鳍片11(面积)来做散热。
如图1和图29所示，灯板3具有一内侧边界3002及一外侧边界3003，内侧边界3002及外侧边界3003沿LED灯轴向上向上延伸后，形成一个区域，散热鳍片11位于该区域内的面积大于位于该区域外的面积。如此一来，使散热器1的散热鳍片11大部分都对应于灯板3(导热路径短)，以此可提高散热鳍片11的利用率，增加散热鳍片11对LED芯片311的有效导热面积。
如图3、图5和图29所示，内周圈至灯板3外缘之间的区域设置光反射区域3001，光反射区域3001可反射向上的光线至光输出表面43，以此，可减少光线在LED灯轴向上的与出光方向相反的方向上的损耗，增加整体的出光强度。
如图4和图9所示，灯板3开设第三开口32，第三开口32分别与第一散热通道7a及第二散热通道7b连通，也就是说，第三开口32同时与散热器1的散热鳍片11之间的空间及灯壳2的腔体连通，从而使散热鳍片11之间的空间和灯壳2的腔体与LED灯外部形成空气对流路径。第三开口32在LED灯的径向上位于内周圈的更内侧。因此，不会占用光反射区域3001的空间，而影响反射效率。具体的，第三开口32设于灯板3的中心的区域，且第一进气孔2201和第二进气孔1301分别从同一开口(第三开口32)处进气，也就是对流的空气通过第三开口32后，在进入到第一进气孔2201和第二进气孔1301。第三开口32开设在灯板3的中心的区域，使第一进气孔2201和第二进气孔1301可共享一个进气的入口，因此，可避免占用灯板3过多的区域，从而避免灯板3的设置LED芯片311的区域的面积因开设多个孔而减少。另一方面，内套21对应到第三开口32，因此进气时，对流的空气起到隔热作用，即防止内套21内外的温度相互影响。于其他实施例中，如果第一进气孔2201和第二进气孔1301位于不同的位置，则第三开口32可设置多个，来对应第一进气孔2201和第二进气孔1301，具体的，如图42所示，第三开口32可设置与灯板3中部、外侧或LED芯片311之间等区域，以此来对应第一进气孔2201和第二进气孔1301。
如图29所示，一实施例中，内圈中，相邻的两个LED芯片311与LED灯的轴心形成中心角A，中间圈中，相邻的两个LED芯片311与LED灯的轴心形成中心角B，中心角B的角度小于中心角A的角度。外圈中，相邻的两个LED芯片311与LED灯的轴心形成中心角C，中心角C的角度小于中心角B的角度。举例来说，外圈因此而具有比中间圈更多的LED芯片311，因此，外圈中相邻的LED芯片311的间距不至于比中间圈中相邻的LED芯片311的间距大太多，甚至，两者间距可以接近或相等，因而，LED芯片311的排布会更加均匀，使得出光得以更加均匀。换句话说，LED芯片组31设有若干组，且每一组都是以环状的形式设于灯板3上，相对更内侧的LED芯片组31的相邻的两个LED芯片311与LED灯的轴心所形成中心角的角度大于相对更外侧的LED芯片组31的相邻的两个LED芯片311与LED灯的轴心所形成中心角的角度。也就是说，更外侧的LED芯片组311相比更内侧的LED芯片组311具有更多的LED芯片311，以此使更外侧的LED芯片组31的相邻的两个LED芯片311的间距与相对更内侧的LED芯片组31的相邻的两个LED芯片311间距更加接近，因而，LED芯片311的排布会更加均匀，使得出光得以更加均匀。
如图40所示，灯板3上表面设置绝缘涂层34，该绝缘涂层34配置为具有高反射率，可采用现有技术中的具有高反射率的材质，如导热硅脂。在设置绝缘涂层34时，绝缘涂层34涂至灯板3的边缘，而灯板3径向上最外侧的LED芯片311至灯板3边缘的距离大于4mm，优选的，灯板3上最外侧的LED芯片311至灯板3边缘的距离大于6.5mm而小于35mm。以此，可保证最外侧LED芯片311与散热器1的爬电距离，防止最外侧LED芯片311与散热器1打火而影响人身安全。另外，绝缘涂层34起到一定的隔热作用，避免使与之接触的灯罩4的温度过高而变形。
图43是本实施例中的灯板3的示意图。如图43所示，本实施例中，LED芯片组31设置有至少两组，至少两组LED芯片组31在灯板3的径向方向上依次排布，每一组LED芯片组31包括至少一个LED芯片311，灯板3径向上的其中一组LED芯片组31中的任一一个LED芯片311与灯板径向上相邻的另一组LED芯片组31的任一一个LED芯片311在灯板3的径向上交错设置，也就是说，不同的LED芯片组31的LED芯片311之间，在LED灯的径向上位于不同的方向，即，任意一起始于LED灯轴线并延伸于LED灯径向的线，如切到两颗或以上的LED芯片311，则会切到这两颗或以上的LED芯片311的不同位置，即，不会切到两颗或以上的LED芯片311的同一位置。如此一来，假设灯板3表面具有对流，空气在灯板3的径向上对流时，由于空气流通路径的关系，在流通路径上，空气与LED芯片311的接触更加充分，使得散热效果更好。另外，从发光效果来讲，这种LED芯片311的排布方式， 更利于出光的均匀性。
本实施例中，同一LED芯片组31中相邻的两颗LED芯片311之间具有开放区域312，以允许空气在LED芯片311之间流动，以此带走LED芯片311工作时所产生的热。而灯板3径向上相邻的两组LED芯片组31，其中一组LED芯片组31中任意两颗相邻的LED芯片311之间的开放区域312与另一组LED芯片组31中任意两颗相邻的LED芯片311之间的开放区域312在灯板3的径向上是交错的，且相互连通的。如此一来，假设空气在灯板3的径向上对流，由于空气流通路径的关系，在流通路径上，空气与LED芯片311的接触更加充分，使得散热效果更好。如果灯板3径向上相邻的两组LED芯片组31，其中一组LED芯片组31中任意两颗相邻的LED芯片311之间的开放区域312与另一组LED芯片组31中任意两颗相邻的LED芯片311之间的开放区域312在灯板3的径向上是在同一方向上的，则空气便直接沿灯板径向流动，在流通路径上，空气与LED芯片311的接触减少，不利于LED芯片311散热。
举例来讲，LED芯片组31设置有三组，且沿灯板3的径向依次设置，相应的这三组LED芯片组中任意的开放区域312在灯板3的径向方向上不在同一方向上。以此优化灯板3表面的对流的流通路径，提升散热效率。
在某些应用中，LED在发光时，在LED灯下方会有一个光分布区域，其表示光源在各个空间的光强分布。在LED灯的光源设计时，希望光分布区域集中于某一区域，以提高局部的亮度。
图44a～44f是一些实施例中的灯板3的示意图。如图44a和44b所示，灯板3包括配置为用于设置LED芯片组31的第一区域35、在灯板3径向方向上位于第一区域35更内侧的第二区域36及在灯板3径向方向上位于第一区域35更外侧的第三区域37，第一区域31限定LED芯片31的安装区域。灯板3的第一区域35、第二区域36及第三区域37上可设置具有反射率的绝缘涂层34。
如图44a和44b所示，第三区域37在灯板3的径向方向上远离第一区域35时，第三区域37在轴向上与第一区域35的间距逐渐递增，因此，第三区域37的表面形成一位于LED芯片组31外侧的外反射区域371，从而将LED芯片组31工作时所产生的至少部分光线引导至光输出表面43，以此，可起到聚光的作用，使光线向某一区域集中。
如图44b所示，，第二区域36在灯板3的径向方向上远离第一区域35时，第二区域36在轴向上与第一区域35的间距逐渐递增，因此，第二区域36的表面形成一位于LED芯片组31内侧的内反射区域361，从而将LED芯片组31工作时所产生的至少部分光线引导至光输 出表面43，以此，可起到聚光的作用，使光线向某一区域集中。
上述实施例中的灯板3上的内反射区域361、外反射区域371和灯罩4上的内反射面4301、外反射面4302可以任意搭配，而实现各种光学效果。例如可以仅设置外反射面371或4302，或者仅设置内反射面361或4301，又或者设置外反射面371或4302之一及内反射面361或4301之一。
如图44a和图44b所示，内反射区域361或外反射区域371为平直的表面并与第一区域35成一定角度，或者为圆弧面。
于一些实施例中，还可通过调整LED芯片311的设置方向，来调整其具体的出光方向。具体来说，可以调整灯板3的结构，来使LED芯片311具有不同的出光效果。举例来说，如图44c所示，于一些实施例中，灯板3包括配置为用于设置LED芯片组31的第一区域35、在灯板3径向方向上位于第一区域35更内侧的第二区域36及在灯板3径向方向上位于第一区域35更外侧的第三区域37。灯板3上具有若干LED芯片组31，若干LED芯片组31在灯板3的径向上配置。在本实施例中，至少其中一组LED芯片组31设于第三区域37上，而第三区域37相对第一区域36呈一夹角，至少一组LED芯片组31设于第三区域37后，出光角度发生改变，可呈现不同的出光效果，以此，可改变光强分布。
同理，至少其中一组LED芯片组31设于第二区域36上，而第二区域36相对第一区域36呈一夹角，至少一组LED芯片组31设于第二区域36后，出光角度发生改变，可呈现不同的出光效果，以此，可改变光强分布。
以图44c所示的灯板3为例，LED芯片组31设有三组，位于灯板3径向上的最外侧的LED芯片组31设于第三区域37上，灯板3径向上处于三组LED芯片组31的中间位置的LED芯片组31设于第一区域35上，而位于灯板3径向上的最内侧的LED芯片组31设于第二区域36上。
上述实施例中，第二区域36和第三区域37可以是特定的用于设置LED芯片311的区域，每个LED芯片311对应一个第二区域36或第三区域37。第二区域36和第三区域37也可以是一整个区域，同一组的LED芯片组31的LED芯片311全部设于第二区域36或第三区域37。
如图44d所示，于一些实施例中，为了提高LED芯片311的光效，可在LED芯片311的表面设置硅胶层313，每一LED芯片311上均设置单独的硅胶层313，硅胶层313远离LED芯片311的表面设置为外凸的弧形面，以使硅胶层313起到类似透镜的作用，对从LED芯片311发出的光起到聚光的作用，使得出光效果更好，利于照度的提升。另外，硅胶层313的 设置，可提升LED芯片311的热辐射的效率(增加其辐射面积)，以利于LED芯片311散热。
如图44e所示，于一些实施例中，光源包括灯板3、LED芯片311和硅胶层313，所述硅胶层313包括设于灯板3表面的第一硅胶层3131及设于LED芯片311表面的第二硅胶层3132。其中第一硅胶层3131的设置，使灯板3不外露，并将灯板3与外界隔离，从而实现灯板3的绝缘处理。第二硅胶层3132具有一外凸的弧形面，以使第二硅胶层3132起到类似透镜的作用，对LED芯片311起到聚光的作用，使得出光效果更好，利于照度的提升。在硅胶层313设置的时候，第一硅胶层3131与第二硅胶层3132为一体式结构构成，以此可杜绝灰尘进入，此时，可省去灯罩4的设置，同时有利于光效的提升(设置灯罩4不可避免的会反射一部分光线，造成光损)。LED封装时，包括芯片、荧光粉和硅胶，芯片、荧光粉和硅胶层从内到外以此设置，如图44f所示，于一些实施例中，可直接省去封装时的硅胶，而直接在荧光粉314外设置硅胶层313，也就是说芯片3111外设置荧光粉314，而在荧光粉314外直接设置硅胶层313。另外，硅胶层313的设置，可提升LED芯片311的热辐射的效率(增加其辐射面积)。
图45a～45g为一些实施例的灯板3的示意图，显示LED芯片311的不同的排布方式。在图45a中，单一LED芯片组31的LED芯片311直接在基板33上等间距配置，亦即任何两个相邻LED芯片311之间的距离相同，使得整个LED灯板3都均匀发光。图45b与图45c中，单一LED芯片组31的LED芯片311呈现阵列排列，此一阵列可以是如图45b的矩型阵列，也可以是如图41c的三角形阵列，甚至也可以是如前述同心圆排列的圆形阵列。阵列排列可以将LED芯片311集中于基板33上局部区域，而形成集中照明效果，而又可在此一局部区域中达到均匀出光。
而图45d则是多个LED芯片组31的LED芯片311都各自形成一个阵列，也就是将多个LED芯片311配置成多个阵列，三角形的虚线框内显示一LED芯片组31。阵列之间保留的间隔距离，大于阵列中相邻LED芯片311的间隔距离，使得阵列之间形成气流通道，以促使空气沿灯板3表面对流。
如图45e所示，于一些实施例中，LED芯片组31的LED芯片311是长方形，具有长边以及短边。如图45e所示，LED芯片311可沿着一圆周配置，并且长边沿所述LED灯板3的径向设置，使得LED芯片311呈现放射状排列，因此，在这个圆周上，可以排布更多LED芯片311，并且将LED芯片311集中在一个小区域；同时，长边提供径向上更长的导流路劲，增加气流与LED芯片311的热交换。LED芯片311也可沿着一圆周配置，并且短边沿所述LED灯板3的径向设置，使得LED芯片311可以散布在大区域，并且缩短LED芯片311之 间的间距，使得LED芯片组31如同一个发光环。前述两种配置方式，可以择一实施，也可以同时实施。
图45f和45g显示一些实施例中的不同样式的灯板3的局部示意图。如图45f与图45g所示，于一些实施例中，LED灯板3的基板33上配置一或多个反光杯334，反光杯334的开口朝向远离基板33的方向。每一反光杯334的内侧底部上配置一个LED芯片311。反光杯334内壁具有高反射系数材料，具体实施方式包含在反光杯334内壁涂布、电镀高反射系数涂层，或是直接以高反射系数材料制作反光杯334并且对反光杯334的内壁进行抛光处理。反光杯334内壁可以反射LED芯片311的侧向发散的出光，而使得LED芯片311的出光集中于LED芯片311指向的方向。如图25是图24的变化，每一反光杯334的内侧底部上配置多个LED芯片311。也就是说，每一反光杯334的内侧底部上配置至少一个LED芯片311。
图46a～图46c为本实施例中的电源5的各个方向的立体图，图46d为本实施例中电源5的主视图。电源5与LED芯片311电连接，并用于对LED芯片311供电。如图46a～图46c所示，电源5包括电源板51和电子组件，电子组件设于电源板51上。
如图46c所示，电子组件中的变压器54，其包括磁芯541和线圈542，磁芯541具有一腔体，线圈设于该腔体内，腔体在LED灯的轴向上的上侧敞口设置，以使工作时，线圈产生的热可以向上，且其散热的方向与第一散热通道7a的对流路径的方向一致，以利于散热。
如图46b和46c所示，腔体在LED灯的轴向上的两侧均敞口设置，可进一步增加对线圈的散热效果。另外，线圈安装在腔体内后，线圈可与腔体的内壁保持间隙，以使空气可从间隙流过，以此便可进一步提升线圈的散热效果。
如图46b所示，变压器54具有第一面5401和第二面5402，第一面5401和第二面5402均垂直于电源板，其中，第一面5401垂直于灯的轴向，第一面5401的面积小于第二面5402，因此，将面积小的一面如此设置后，可降低对第一散热通道7a的对流的阻碍。
如图46c所示，电子组件中包括至少一电感55，至少一电感包括环状磁芯551，线圈绕制在环状磁芯551上(图未示)，环状磁芯551的轴向平行于LED灯的轴向，以使线圈可以更大面积的与对流的空气接触，从而增加对电感的散热。另外，由于环状磁芯551为环状，且与第一散热通道7a的对流路径相对应，因而，对流的空气可以通过环状磁芯551内部，可进一步增加对电感55的散热。
如图46a和图46b所示，电子组件中的发热组件包括集成电路(IC)56、二极管、晶体管、变压器54、电感55和电阻，上述的发热组件被分别设置在电源板51的不同的表面，以此，可将热源分开设置，避免局部高温的形成。另外，可在电源板51不同的表面分别设置散 热组件，以针对上述发热组件进行散热，此时，相应的发热组件热接触散热组件。
如图46a和图46b所示，至少一集成电路56与其他发热组件设置在电源板51的不同表面上。以此，一方面可将热源分开设置，避免局部高温的形成，另一方面，可避免其他发热组件对该集成电路56造成影响。
如图46a和图46b所示，在垂直于电源板51的方向上(即垂直于电源板51方向上的投影关系)，上述的集成电路56不与任何发热组件重叠，以此避免热量叠加。优选的，集成电路56与变压器54不重叠。
如图22所示，电源板51平行于LED灯的轴向，因此，在LED灯的轴向方向上，将电源板51分为上半部分和下半部分，上半部分和下半部分的电子组件的设置空间是一致或大致一致的，有利于电子组件更好的排布，另外，如果电源板51相对与LED灯轴向而倾斜，则一定程度上会阻碍空气的流通，不利于电源5的散热。
如图22所示，电源板51将灯壳2分为第一部分201和第二部分202，第一部分201上对应的散热孔222的面积大于第二部分202上对应的散热孔222的面积，因此，电子组件布置时，可将大部分或全部的电子组件设于第一部分201内，或者将发热量较大的组件，如电感、电阻、变压器、整流桥或晶体管等，设于第一部分201内。
如图25所示，电源板51将灯壳2的内腔分隔为第一部分201和第二部分202，第一部分201的体积大于第二部分202的体积，电子组件布置时，将大部分或全部的电子组件设于第一部分201内，或者将体积较大的组件、如电容、电感、电阻、变压器、整流桥或晶体管等，设于第一部分201内。
进一步的，第一部分201上对应的第一进气孔2201的面积大于第二部分202上对应的第一进气孔2201的面积，因此，使更多的空气进入到第一部分201中，从而对电子组件进行散热。此处指的与第一进气孔2201的关系，具体指的是，第一进气孔2201被电源板51大致分隔为两部分，即，一部分对应第一部分201，另一部分对应第二部分202，从而使更多的空气通过第一进气孔2201而进入到第一部分201中。
如图22所示，电子组件中包括发热组件501，其中，至少一个发热组件501靠近灯头23，并通过灯头23散热，而不会占用第一散热通道7a的散热资源。上述至少一个靠近灯头23的发热组件501为电感、电阻、整流桥或控制电路。
如图22所示，至少一个发热组件501是通过热传导或热辐射的形式，将热量传至灯头23上，并通过灯头23将热量散到空气中。
如图22所示，至少一个发热组件501热接触灯头23，具体的，至少一个发热组件501 位于灯头23中，且该发热组件501通过导热材料53与灯头接触，且该发热组件501通过上述导热材料53与灯头23固定。以此，通过导热材料53的设置，既可以达到向灯头热传导的作用，也可以起到固定发热组件的作用，避免该发热组件501松动。此处所述“发热组件501位于灯头23中”，具体态样为，在垂直于LED灯轴向方向的投影，灯头23和发热组件501具有重叠区域。
如图22所示，导热材料53通过灌胶的方式设置在灯头23内，以此实现灯头23与发热组件501的连接，导热材料53仅覆盖电源5的端部的区域，且导热材料53的位置高于散热孔22的位置，以防止因导热材料53而过度增加重量。另外，导热材料53选用绝缘材料，以确保安全，防止电子组件与灯头23的金属部231接触。其他实施例中，导热材料53也可以是连接电源5和灯头23的导电针的导线等(图未示)。
如图22所示，灯头23包括金属部231，导热材料53热接触金属部231。也就是说，金属部231的内壁至少一部分会构成灯壳2的内腔的壁，以此，可使导热材料直接连接金属部231，并利用金属部231来进行散热。金属部231一部分会通过空气进行散热，一部分则会通过与金属部231连接的灯座来进行散热。
如图2图46a所示，本实施例中，电源5中的电子组件中，最接近第一散热通道7a的第一进气孔2201的电子组件为不耐热组件，如电容，特别是电解电容502，通过将不耐热组件靠近第一进气孔2201，以避免使不耐热组件的温度过高，而影响其性能。
另外，为了减少电解电容502受发热组件的影响，可在电解电容502表面设置反辐射层或隔热层(图未示)，以此避免发热组件热辐射而影响电解电容502。本处的隔热层可选用现有技术中的塑料材质，而反辐射层可选用现有技术中的漆、镀银层、铝箔或其他反热辐射的材料。
如图46a所示，本实施例中，至少一电解电容的至少一部分没有在电源板51所限定的范围内，即，电解电容的至少一部分在LED灯的轴向上超过电源板51，在承载相同数量的电子组件时，可降低电源板51的长度，降低电源板51的材料成本。另外，可进一步使电解电容靠近第一进气孔2201，确保该电解电容处于相对的低温区。
如图22所示，至少一发热组件501在LED灯的轴向上的位置高于散热孔222的位置，该高于散热孔222的发热组件501的大部分热通过灯头2或其他途径散热。因此，其产生的大部分热并不通过散热孔222散热，不会影响到第一散热通道7a的对流速度。该发热组件501为电阻、电感、集成电路、电压器或整流桥。
如图22所示，电源板51在LED灯的轴向上具有上部和下部，上部和下部均设置有发热 组件，其中，上部的发热组件中，至少一个发热组件位于散热孔222的上方，从而可降低上部位于散热孔222附近的问题，使得下部和上部的散热孔222附近的温差增大，从而加速对流。
如图2、3和图46a所示，电源板51在装配到灯壳2时，其具有位于灯颈22内的部分和位于内套21内的部分，电源板51位于灯颈22内的部分为第一部分，电源板51位于内套内的部分为第二部分，第二部分相比第一部分更靠近第一散热通道7a的第一进气孔2201，由于更靠近第一进气孔2201，对流的空气首先会到达第二部分，也就是说，第二部分相比第一部分会有更好的散热效果，因此，将至少部分不耐热组件(如电解电容，或对高温较为敏感的组件)设于第二部分上。优选的，将所有电解电容设于第二部分上。第二部分的电源板51面积大于第一部分，因此电源板51第二部分具有更多可设置电子组件的空间，有利于将更多的不耐热组件/热敏感组件设置于第二部分上。本实施例中，不耐热组件/热敏感组件可分别设于第二部分的正面和反面。其他实施例中，也可将发热较多的电子组件设于第二部分上(如变压器、电感、电阻、集成电路或晶体管等)，以使更快的对其进行散热。
图51为一些实施例中电源5的示意图。如图51所示，电源板51上具有隔热板513，电源板51以隔热板513而分隔出两部分区域，其中一部分区域设置发热组件(如变压器、电阻、电感等工作时发热的组件)，另一部分区域设置不耐热组件/热敏感组件(如电解电容)，也就是说，隔热板将发热组件和不耐热组件/热敏感组件隔开，以此避免由于发热组件产生过多的热辐射，而影响到不耐热组件/热敏感组件。其他实施例中，电源板51上具有隔热板513，电源板51以隔热板513而分隔出两部分区域，其中一部分设置发热组件(如变压器、电阻、电感等工作时发热的组件)，另一部分也设置发热组件(如变压器、电阻、电感等工作时发热的组件)，也就是说，隔热板将发热组件和发热组件之间隔开，以此避免相互的热辐射，使得热量叠加，另一方面，温度是热辐射的重要影响因素，因此避免发热组件与发热组件之间相互辐射，可提高发热组件与附近空气之间的温差，以此可提高热辐射效率。优选的，隔热板513沿LED灯的轴向设置或者沿第一散热通道7a的对流方向设置，以使对流时，两边的热量不会因在电源板51的宽度方向上对流而聚集。隔热板513是沿第一散热通道7a的对流方向延伸设置，也就是说，隔热板513是沿LED灯的轴向延伸设置的，因此，不会对对流的空气形成阻碍。其他实施例中，隔热板513也可是有一定的倾斜的，以使其对空气具有一定的导流作用。
进一步的，隔热板513可以是电路板，因此，可在隔热板513上设置电子组件，以增加可设置电子组件的面积。
隔热板513的功能也可以用电子组件来代替。如图46d所示，电源板51上具有三个电子组件503，504,505，这三个电子组件503，504,505在LED灯的径向方向上(或者电源板51的宽度方向上)的投影至少部分重叠，其中一电子组件504隔在另两个电子组件503,505之间，即其中一电子组件504位于另两个电子组件503,505中间，以避免另两个电子组件503,505相互之间的热辐射，从而利于发热组件与附近空气之间形成较大温差，以利于发热组件的热辐射到空气中。上述提到的另两个电子组件503,505分别为一个发热组件(如变压器、电阻、电感或电晶体)和一个不耐热组件/热敏感组件(如电解电容)，因此，在发热组件产生热量时，至少一部分会热辐射到中间的电子组件504，从而减少发热组件产生热量对不耐热组件/热敏感组件的辐射影响。
在其他实施例中，电源板51上具有三个电子组件503，504,505，这三个电子组件503，504,505在LED灯的径向方向上(504位于另两个电子组件503,505中间，以避免另两个电子组件503,505相互之间的热辐射，从而利于发热组件与附近空气之间形成较大温差，以利于发热组件的热辐射到空气中。上述提到的另两个电子组件503,505均为前述定义的发热组件(如变压器、电阻、电感或电晶体)，因此，在两个发热组件503,505发热时，至少一部分会热辐射到中间的电子组件504，从而减少两个发热组件之间产生的热量叠加，造成电源板51区域的温度过高而影响LED灯的运作品质，且利于发热组件与附近空气之间形成较大温差，以利于发热组件的热辐射到空气中。
优选的，位于中间的电子组件504选用不发热或耐热的电子组件，如温度传感器、电容等。
如图46d所示，电源板51上具有三个电子组件506，507,508，这三个电子组件506，507,508在LED灯的轴向方向上(或者电源板51的长度方向上，即沿第一散热通道7a的对流方向上)的投影至少部分重叠，其中一电子组件507隔在另两个电子组件506,508之间，即其中一电子组件507位于另两个电子组件506,508中间，以避免另两个电子组件506,508相互之间的热辐射，从而利于发热组件与附近空气之间形成较大温差，以利于发热组件的热辐射到空气中。上述提到的另两个电子组件506,508均为发热组件(如变压器、电阻、电感或电晶体)，因此，在两个发热组件506,508发热时，至少一部分会热辐射到中间的电子组件504，从而减少两个发热组件之间的热辐射，避免热量叠加，且利于发热组件与附近空气之间形成较大温差，以利于发热组件的热辐射到空气中。本实施例中，由于电子组件507的设置，对流的空气向上时，其在一定的范围内阻碍对流的空气，也就是说，位于下方的电子组件503的热量随对流的空气散热后，需要绕过中间的电子组件507，而避免对流的空气直接接触上面的电子组件 508。本实施例中，中间的电子组件507为不发热组件(如电容等)。其他实施例中，另两个电子组件506,508中，其中之一为发热组件(如电阻、电感、变压器等)，另一个为不耐热组件(如电容等)。
图52是一些实施例中的电源5的示意图。如图52所示，于一些实施例中，为了增加电源5的发热组件的辐射效率，可在发热组件表面设置辐射层509，发热组件工作时产生的热量，可以以热传导的方式传导至辐射层509上，辐射层509再将热量辐射至周围的空气，以便于第一散热通道7a对流时，将热的空气带走。辐射层509的辐射效率大于发热组件的辐射效率，因而，设置辐射层509后发热组件的散热效率大大提升。本实施例中的辐射材料509可选用现有技术中的黑胶，以增加其热辐射到空气的效果。设置黑胶时，可将黑胶覆盖于电源5的表面，且黑胶可以直接与灯头23热接触，也就是说，电源5的发热组件的热量，一部分辐射至周围空气，而另一部分，直接通过黑胶热传导至灯头23(图未示)，灯头23为金属灯头，可再通过灯头23而散至外部。本实施例中的黑胶为薄的层状结构，设于发热组件表面，并不会阻碍到第一散热通道7a的对流，且增加的重量有限，对LED灯的整体的重量的影响较小。其他实施例中，也可选择性的设置黑胶，比如，在发热较高的发热组件上设置黑胶，比如在变压器、电感、晶体管上。
另外，上述实施例中，为进一步提升辐射材料509的辐射效率，可将辐射材料509的表面设置为粗糙表面，以增加辐射材料509的表面积。
图47为一些实施例中的电源5的示意图，可应用至图4的LED灯以替换图4的LED灯的电源5。如图47所示，于一些实施例中，电源板51在以一轴线X而将电源板51分为第一设置区域511和第二设置区域512，第一设置区域511和第二设置区域512以轴线X为界，第二设置区域512上的电子组件的重量之和大于第一设置区域511上的电子组件的重量之和。第一设置区域511设置配重块52，从而平衡电源板51两侧的重量，防止电源板51两侧因电子组件的重量不均而造成影响，且防止LED灯垂吊状态下，因电源板51两侧的重量不均而导致LED灯发生倾斜。
图48为图47中的配重块的主视图。图49为图48的仰视图。如图48和图49所示，于一些实施例中，配重块52为具有散热功能的散热组件，其设置于电源板51上。于一些实施例中，散热组件上具有散热片521，而增加其散热面积。配重块52为具有高导热性的金属材质制成，如铝、铜等。本实施例中，散热片521沿LED灯的轴向方向延伸设置，而散热片521之间形成通道，而可供空气信道，且这种方式，可增加配重块52的散热面积。除此之外，配重块52包括一长边和短边，通道与长边亦为相互平行状态，同时将长边配置与LED灯轴 向方向平行，或是与气流流动方向大致平行，以使气流流通更为顺畅。
[根据细则91更正 16.01.2019]　
如图47所示，电子组件中包括工作时会发热温度较高的发热组件，至少一个发热组件靠近散热组件，以通过散热组件来散发一部分的热。优选的，发热组件中的变压器、电感、电阻、二极管、晶体管或集成电路(IC)靠近散热组件。更优选的，发热组件中的变压器、电感、电阻、二极管、晶体管或集成电路(IC)直接热接触散热组件。
[根据细则91更正 16.01.2019]　
如图47、图48和图49所示，于一些实施例中，电子组件中包括工作时会发热温度较高的发热组件，至少一个发热组件靠近散热组件52，以通过散热组件52来散发一部分的热。优选的，发热组件中的变压器、电感、电阻、二极管、晶体管或集成电路(IC)靠近散热组件。更优选的，发热组件中的变压器、电感、电阻、二极管、晶体管或集成电路(IC)直接热接触散热组件。优选的，散热组件52上具有散热片521，而增加其散热面积。散热组件52为具有高导热性的金属材质制成，如铝、铜等。本实施例中，散热片521沿LED灯的轴向方向延伸设置，而散热片521之间形成通道，而可供空气信道，且这种方式，可增加配重块52的散热面积。除此之外，散热组件52包括一长边和短边，通道与长边亦为相互平行状态，同时将长边配置与LED灯轴向方向平行，或是与气流流动方向大致平行，以使气流流通更为顺畅。于一些实施例中，可在电源板51的正反面均设置散热组件52，一方面可对电源板51两侧分别进行散热，另一方面，可对电源板51的两侧的重量进行平衡。
如图47所示，一些实施例中，电源板51在以一轴线X而将电源板51分为第一设置区域511和第二设置区域512，第一设置区域511和第二设置区域512以轴线X为界，第二设置区域512上的电子组件的数量多于第一设置区域511上的电子组件的数量，以使第一设置区域511处的气流更顺畅，减少电子组件的阻碍。本实施例中，第一设置区域511和第二设置区域512均具有发热组件，以使热源分开。
如图4、图47和图50所示，于一些实施例中，第一散热信道7a包括内信道7a1和外通道7a2，外通道7a2形成于电源板51边缘的电子组件与灯壳2的内腔的内壁之间，而内通道7a1形成于电子组件之间的间隙中。以此使得电源5的散热效果得到提升。具体来说，将图47中的电源板51分为两部分(左右两部分，不一定对称)，即第一部分和第二部分，第一部分及第二部分上均具有电子组件，第一部分及第二部分上的电子组件分别与灯壳2内壁形成外通道7a2，第一部分的电子组件和第二部分的电子组件之间形成内通道7a1。本实施例中，电子组件的变压器54，其包括磁芯541和线圈542，磁芯541具有一腔体，线圈542设于该腔体内，腔体在LED灯的径向上的至少一侧敞口设置，以使线圈暴露，该敞口侧对应内通道7a1或外通道7a2，以使线圈542产生的热通过内通道7a1或外通道7a2的对流而迅速排出。 优选的，腔体在LED灯的径向上的两侧均敞口设置，其中一侧敞口对应于内通道7a1，另一侧敞口对应于外通道7a2，以此，进一步增加对变压器的散热。
图53a～图53c为各种不同样式的电源板51的示意图。如图53a所示所述电源板51包含多个子板512，并且多个子板512之间互相电性连接。如图53a所示，多个子板512之间以一或多个电线513连接，在使用多个电线513时，可以将多个电线结合为软式排线。通过电线513的弯折，多个子板512之间可以改变相对位置，例如让两个子板512互相平行并且保持间隔距离，而分别配置不同的电子组件群组。如图53b所示，多个子板512之间以一或多个电连接器514连接。通过电连接器514连结多个子板512之间结合成固定结构，并且被配置成互相平行或是并列的状态，例如让两个子板512互相平行并且保持间隔距离，而分别配置不同的电子组件群组。如图53c所示，所述电源板51包含有第一区51a与第二区51b。第二区51b的宽度大于第一区51a，用于容置较多的不耐热电子组件。在配置时，则是将第二区51b接近散热底座17的进气口172，而第一区51a接近灯颈22的散热孔222。
图54是本实施例中LED灯的剖视图。如图54所示，电源板51沿着散热通道(此处的散热通道指的是第一散热通道7a)的轴向将散热通道分隔为第一通道S1与第二通道S2，第一面对应于第一通道S1，并且第二面对应于第二通道S2。
当电子组件的体积较大时，所在的散热通道需要有较大的体积，使得散热通道的体积扣除电子组件的总体积后，还有足够的通道空间。因此，当第一通道S1的体积小于第二通道S2的体积时，位于第一面的电子组件的体积(第一面所有电子组件的体积之和)需要小于位于第二面的电子组件的体积(第二面所有电子组件的体积之和)。前述第一通道S1的体积与第二通道S2的体积的比值设定为R1，R1的范围可为0.3～0.5；前述位于第一面的电子组件的体积与位于第二面的电子组件的体积的比值设定为R2，R2的范围可为0.05～0.2。从比例关系来比较，第一通道S1的体积与第二通道S2的体积的比值R1，需要小于位于第一面的电子组件的体积与位于第二面的电子组件的体积的比值R2。如果第一面的电子组件的重量小于第二面的电子组件的重量，则还可以在第一面设置配重块(图未示)，以平衡两面的重量。
图55是本实施例中LED灯的剖视图。如图55所示，如果进一步区隔上下关系，在同一面(第一面或第二面)上，也要考虑散热通道(此处的散热通道指的是第一散热通道7a)，也就是空气流通区域(未覆盖电子组件)的关系。以第二面为例，以X轴和Y轴，于第二面定义第一象限Q1、第二象限Q2、第三象限Q3和第四象限Q4，第一象限Q1、第二象限Q2、第三象限Q3和第四象限Q4互相连通，第一象限Q1与第二象限Q2对应于灯壳，第三象限Q3和第四象限Q4对应于散热器2，第一象限Q1与第三象限Q3相邻，并且第二象限Q2与 第四象限Q4相邻。上述的X轴落于散热器2的上边缘，Y轴为图示的中轴位置。
如图55所示，较为理想的方式就是让电子组件位于单侧(Y轴的一侧)，例如集中于第二象限Q2及第四象限Q4，并且下部的电子组件(同电子组件)要比上部电子组件少，让发高热或不耐热的电子组件(如变压器、电解电容)位于下部。因此如图所示，位于第二象限Q2中的电子组件的体积，小于第一象限Q1中的电子组件的体积，使得第二象限Q2显示的空气流通区域(未覆盖电子组件)大于第一象限Q1，而保有一个可以让气流快速通过的区域。因此，以第二面为例，第二象限Q2中的第一通道S1的体积与第二象限Q2中的电子组件的体积的比值大于3，以使第二象限Q2中的空气流通区域具有足够大小。当然也可以反过来使第一象限Q1中的第一通道S1的体积与第二象限Q2中的电子组件的体积的比值大于3。
前述位于第二象限Q2中的电子组件的体积，小于第一象限Q1中的电子组件的体积，若以比例关系来看，可以设定为于第二象限Q2中的电子组件的体积的比值，小于第一象限Q1中的电子组件的体积的比值。
进一步比较下部的配置，位于第四象限Q4中的电子组件的体积，小于第三象限Q3中的电子组件的体积，因此第四象限Q4至第一象限Q2可以维持足够的气流通道。同样以比例关系来看，第四象限Q4中的电子组件的体积与第四象限Q4中的第一通道S1的体积的比值，小于第三象限Q3中的电子组件的体积与第三象限Q3中的第一通道S1的体积的比值。
如果将多个个电子组件分类为包含发热组件，发热组件理想的配置是位于上部，也就是第一象限Q1和第二象限Q2，因此配置上发热组件是位于第一象限Q1与第二象限Q2，也就是说，发热组件可以在散热通道的末端在接触冷却气流，以避免先对冷却气流加热而影响其他电子组件的冷却。第一象限Q1的发热组件在径向上与第二象限Q2的发热组件的互相对应的数量，与第二象限Q2的发热组件的数量比值介于0～0.5，藉以降低位于同一截面上的发热组件数量，利于在同一截面上拉开温度梯度，以利于发热组件将热量辐射至周围空气，具体来说，发热组件需通过热辐射将产生的热量辐射至空气，而温差是热辐射关键因素之一，因此需要尽量避免发热组件之间的干扰，以此保证发热组件与空气的温差，来确保热辐射的效率。
同样考虑冷却气流上下流动关系，第三象限Q3与第四象限Q4中的第一通道S1的体积，大于第一象限Q1与第二象限Q2中的第一通道S1的体积，以避免冷却气流在起点端就碰到高流阻，影响冷却气流流动。
因此，整体而言，电子组件于LED灯径向的截面积，与散热通道于径向的截面积的比值介于0～0.4为最佳，其中比值0是指截面上没有电子组件，比值0.4是指避免电子组件于径 向的截面积超过一半散热通道。
就以单面，如第一面，于第一通道S1中电子组件于径向的截面积，与第一通道S1于径向的截面积的比值介于0～0.3，反之在第二面中，于第二通道S2中电子组件于径向的截面积，与第二通道S2于径向的截面积的比值介于0～0.6。亦即第一面与第二面的电子组件采用不同配置比例，以使一面具有较佳的气流流动。
如图54所示，前述的比例，可以透过电源板51的偏轴配置处理，电源板51与散热通道的轴线之间具有一偏轴距离G，偏轴距离G与散热通道的半径的比值介于0.15～0.4。偏轴距离G的配置，同时也可以调整重心，使得电源板5的等效重心落在散热通道的轴线上。
图56是一些实施例中的电源5与内套21的配合示意图。如图56所示，电源板51的配置可以倾斜于LED灯的轴线Y，流阻大的一面，例如电子组件数量多的一面，可以配置为倾斜电源板51在上的一面；流阻小的一面，例如电子组件数量少的一面，可以配置为倾斜电源板51在下的一面；从而使得流阻高的一面仍有足够的气流通过。而配重块52则依据倾斜状态配置倾斜电源板51在下的一面，以平衡在轴线Y上的重量，使LED灯的重心维持在轴线Y。
如图1、图2、图3和图4所示，灯壳2包括灯头23、灯颈22与内套21；灯头23与灯颈22连接，灯颈22连接内套21。其中，内套21位于散热器1的内部(LED灯轴向上，内套21全部或大部分，比如内套高度上的80％以上不超过散热器1)，灯颈22则是露于散热器1的外部。通过内套21、灯颈22的设置，以此提供足够的空间来容纳电源5，并进行散热，特别是大功率的LED灯的电源5(大功率的LED灯的电源相对小功率的LED灯，其电源组成更复杂，总体尺寸更大)。灯颈22和灯头23中均包括有电源5的部分，灯颈22和灯头23的高度之和大于散热器1的高度，以此以提供更多的设置电源5的空间，且灯颈22和灯头23与散热器1是分离的(轴向上不重叠，相比而言，内套21被包覆在散热器1内)，因此灯颈22和灯头23内的电源5受散热器1的影响较小(散热器1的热不会沿径向传导至灯颈22和灯头23内)。另外，灯颈22的高度设置，利于第一散热通道7a的烟囱效应，可保证第一散热通道7a内的对流效率。在其他实施例中，灯颈22的高度至少为散热器1高度的80％以上，以达到上述的功效。内套21为隔热材料，用于防止散热鳍片的热与电源的热相互影响。
如图2所示，第二进气孔1301位于散热器1的下侧且径向上对应于散热器1的内侧或内部，也就是说第二进气孔1301对应于散热鳍片11的内侧或内部，而散热鳍片11的内侧或内部则是对应于灯壳2的内套21的外壁(散热鳍片11径向的内侧靠近或直接抵接在内套21上)，因此对流的空气从第二进气孔1301进入后，在上升过程中沿内套21外壁而对流，同时对散 热鳍片11的内侧或内部和内套21的外壁径向散热，从而起到隔热的作用，也就是说，可防止散热器1的热量通过内套21的外壁而传导至内套21的内部，进而影响电源5。由上可知，第二散热通道7b不仅可以加速散热鳍片11的散热，还起到隔热的作用。第二进气孔1301相比LED芯片311来说，第二进气孔1301相比任意一LED芯片311而更靠近LED灯径向的内侧。
图57是图2中B处的放大图。如图57所示，灯头23包括金属部231和绝缘部232，电源5的导线穿过绝缘部232而与外部供电单元连接。金属部231与灯颈22连接，具体的，如图58所示，金属部231的内表面设置有螺纹，而通过螺纹与灯颈22实现螺纹连接。当通过金属部231而对灯壳2内的电源5散热时(如前述实施例所记载，金属部231的内壁至少一部分会构成灯壳2的内腔的壁，以此，可使导热材料直接连接金属部231，并利用金属部231来进行散热)，金属部231外表面设置凸起结构2311(如图58所示)，以使金属部231的外表面的表面积增加，从而使金属部231的散热面积更大，提高其散热效率。从电源5来讲，电源5的至少一部分会位于灯头23内，并借由灯头23而做电源5的至少一部分的散热。金属部231的内壁可同样设置凸起结构来增加内壁对应灯壳2的内腔的表面积。在本实施例中，通过在灯头23的金属部231的内表面设置螺纹，而形成上述的凸起结构，达到增加表面积的目的。
图59a为本实施例中灯颈22的立体示意图一。图59b为本实施例灯颈22的立体示意图二。图60为本实施例内套21的立体示意图。如图2、图59a、图59b和图60所示，灯颈22通过扣合的形式与内套21连接。具体来讲，内套21上具有第一定位单元211，而灯颈22上具有第二定位单元221，第一定位单元211与第二定位单元221扣合，以使内套21与灯颈22连接。
本实施例，第一定位单元211为开设在内套上的扣合部，而第二定位单元221为开设在灯颈上的卡扣，而扣合部与卡扣扣合连接。在其他实施例中，也可以是，第一定位单元211为开设在内套上的卡扣，而第二定位单元221为开设在灯颈上的扣合部，而扣合部与卡扣扣合连接。
本实施例中，内套21具有连接部212，连接部212在LED灯的周向上包括至少两组片状体2121，第一定位单元211形成于片状体2121上，当灯颈22与内套21配合时，第二定位单元221扣入第一定位单元211，扣入时，第二定位单元221对片状体2121具有径向上的挤压，当片状体2121在周向上具有多个时，则弱化了其径向方向上的结构强度，使得扣入的动作更加省力，且连接部212整体上在LED灯的径向上更具有形变空间。本实施例中，扣合 部为开设于片状体2121上的槽或通孔。
本实施例中，两组片状体2121之间具有间隙，而该间隙形成定位槽213。而灯颈22上具有与定位槽213匹配的第三定位单元223，在内套21与灯颈22配合时，第三定位单元223插入定位槽213，以限制内套21在周向上相对灯颈22而转动。
本实施例中，连接部212套设于灯颈22内，通过套接的方式，连接部212与灯颈22存在互为导向、支撑的作用，使连接更加方便，且连接后的结构稳定性更好。
其他实施例中，灯颈22与内套21为一体式结构(图未示)，以简化灯壳2的结构。
如图59b所示，灯颈22具有由两个片体225构成的卡槽224，具体的，两个片体225之间形成所述卡槽224，电源板51可卡入卡槽224而固定。本实施例中，片体225在LED灯的轴向上分段设置，以使在LED灯的轴向上，片体225之间保持间隙，电源板51插入后，电源板51的两侧可通过间隙而进行对流。本实施例中，当片体225在LED灯的轴向上分段设置时，位于灯颈22的轴向的最下方的片体225所形成的部分卡槽224的长度L1与电源板51的长度L2的比值为1:14～22之间，当处于该比值时，电源板51插入灯颈22的轴向的最下方的片体225所形成的部分卡槽224，电源板51两侧受到卡槽224限制，其不会产生大的偏转，而使其难以与下一组片体224所形成的卡槽224对准，从而降低了装配难度。
本实施例中，两个片体225为两个相互平行的肋条组成，相对应的两肋条设于灯颈22的内壁，并沿灯颈22的轴向延伸。电源板51插入卡槽224后，相应的两个肋条平行于电源板51.
本实施例中的两个片体225形成第三定位单元223，两个片体225相对的两侧表面分别对应于定位槽213中，而起到定位导向的作用。
图59c为一些实施例中的灯颈22的立体图。如图59c所示，于一些实施例中，片体225在LED灯的轴向上延伸且为一整体(单独的片体)，这种形式的片体225，所形成的的卡槽224，与电源板51的配合更加稳定。本实施例中，片体225的长度为电源板51的长度的15％～45％之间。以此保证卡槽224更稳定的支持电源板51。
于其他实施例中，卡槽224也可以是在灯颈22的内壁上的开槽(图未示)。从而无需设置片体225，结构上更加简单。
如图59b和图31所示，本实施例中灯颈22内具有第一止挡部226，第一止挡部226与电源板51配合，电源板51插入后受第一止挡部226限制而避免电源板51进一步插入后，使电源板51端部的电子组件被灯头23端部挤压而损坏，另一方面，第一止挡部226的设置，可使电源板51与灯头23端部保持间隙，以保证间隙处的对流。
如图31所示，内套21上具有第二止挡部215，第二止挡部215与电源板51配合，以限制电源板51在LED灯的轴向向下方向活动，通过设置第一止挡部226和第二止挡部215，使电源板51轴向上的两侧均受限位，从而使电源板51在轴向上得到固定。
如图1和图31所示，灯壳2具有一限流面214，其在LED灯的径向上向外延伸设置并在径向上远离散热孔222，限流面214覆盖至少部分散热鳍片11。当散热鳍片11散热时，被限流面214覆盖部分的散热鳍片11所散发的热气上升的过程中，被限流面214所阻挡，而改变热气流动的方向(沿限流面214往外)，从而使热气上升时，远离散热孔222，避免在散热孔222附近聚集形成高温，而影响第一散热通道7a本身的对流速度，且可以避免热气上升时，通过散热孔222而进入灯壳2的内腔中，从而影响电源5，最后，避免热气上升而接触灯头23的金属部231，影响金属部231散热，甚至热气直接通过金属部231而传导进灯壳2的内腔。限流面214可形成于内套21上。如图12所示，其他实施例中，限流面214也可形成于灯颈22上。
如图31所示，本实施例中，散热鳍片11在LED灯的轴向上的上侧至少部分与限流面214对应，在灯壳2插入散热器1时，对灯壳2起限位作用。本实施例中，散热鳍片11与限流面214相抵。
如图31所示，本实施例中，内套21所采用的材料的导热系数小于灯颈22的材料的导热系数，限流面214形成于内套21上，散热器1轴向上的高度不超过限流面214，以减少散热器1与灯颈22的接触面积。从内套21来讲，其材料导热系数越低，则散热器1传导到内套21内部的热越少，对电源5的影响越小，而从灯颈22来讲，灯颈22与散热器1的接触面积越小，则热传导越低，而灯颈22本身材料的导热系数高于内套21的材料，灯颈22本身便可以将内部的电源5所产生的至少一部分热通过灯颈22而发散。其他实施例中，内套21所采用的材料与灯颈22的材料可以是相同的材料，比如，均采用导热系数较低的材料，如塑料。
如图31所示，本实施例中，内套21的壁部和灯颈22的壁部，共同组成了灯壳2的内腔的壁部，散热器1在轴向上的高度不超过内套21的高度，以使得散热器1在LED灯的径向上对应于内套21，也就是说，内套21起到隔热的作用，避免散热器1的热量传导至内套1中，而影响其内的电源5的电子组件。而灯颈22整体上全部高于散热器1的位置，也就是说，在LED灯的径向上，散热器1与灯颈22不重叠，可尽量避免散热器1与灯颈22之间的热传导，防止散热器1通过热传导而将热量传导至灯颈22内部，从而影响其内的电子组件。正因为如此，本实施例可将内套21的壁部的传热效率设置为低于灯颈22的壁部的传热效率，这种设置方式的好处是，一方面可通过将内套21设置为低传热效率，而减少散热器1对内套 21内的热传导，避免散热器1影响内套21内部的电子组件，另一方面，由于无需考虑散热器1对灯颈22的热传导，因此，提高灯颈22的传热效率，有助于内部电源5的电子组件工作时产生的热量，通过灯颈22而散发，避免电源5的温度过高而影响电子组件的寿命。本实施例中，为使内套21的壁部的传热效率设置为低于灯颈22的壁部的传热效率，可将内套21选用低导热系数的材料，而将灯颈22选用相对较高的导热系数的材料，为了提高灯颈22的导热系数，也可以在灯颈22上开设散热孔222，或者在灯颈22上设置导热部(图未示)，如设置金属等高导热系数材料。
如图31所示，灯颈22具有上部和下部，其中的散热孔222设于上部，上部的横截面积小于下部的横截面街，上部的空气流速会快于下部的空气的流速，从而使得空气从散热孔222排出时的初始速度增加，避免热空气堆积在散热孔222附件。本实施例中，灯颈22的横截面积在LED灯轴向向上的方向递减，避免对空气流动形成阻碍。本实施例中，内套21的下部的入口的横截面积大于灯颈22的上部的横截面积。
如图1所示，灯颈22上的散热孔222为条状，且沿LED灯的轴向延伸，由于LED灯的自身重力，灯颈22会在轴向上受拉力，而将散热孔222设置为沿LED灯轴向延伸的条状孔，可避免开设散热孔222而对灯颈22的强度造成影响。散热孔222的最大内切圆直径小于2mm，优选为1至1.9mm。如此一来，一方面可防止昆虫进入，且可以阻止大部分灰尘通过，另一方面，透气孔41还能保持较好的气体流通效率。另一方面，如果将散热孔设计为沿灯颈22的外周面而延伸，则灯颈22可能因散热器1的重量而受拉力，使得散热孔变大，使散热孔222无法满足最大内切圆直径小于2mm的要求。
如图21所示，散热孔222在LED灯径向上的出口，在LED径向上超出金属部231的外表面，即散热孔222的出口在LED灯的径向上位于金属部231的外表面的外侧。减少出口排出的热量向上时对金属部231的影响，避免热量通过金属部231再次传导至灯壳2的内腔而影响电源的电子组件。
图61是一些实施例中的LED灯的剖视图。图62是图61的LED灯内的对流通道的设置示意图。如图61和图62所示，于一些实施例中，LED灯的基本结构同图1所示的LED灯。于一些实施例中，内套21具有上部和下部，上部和下部之间通过一导流面216连接，导流面216在沿LED灯的轴向向上的方向上(沿第一散热通道7a的对流方向上)，其截面的半径逐渐增加，也就是说，导流面216具有将第二散热通道7b的空气往散热器1的径向的外侧的方向引导的作用，从而使空气与更多面积的散热鳍片11接触，进而带走散热鳍片11上更多的热量。内套21在轴向上包括第一部分和第二部分，第二部分为导流面216以下的部分的内套 21(包括导流面216的部分)，而第一部分则是导流面216以上部分的内套21(不包括导流面216部分)，电源5的电子组件中，位于内套21的第二部分中的电子组件中包括不耐热组件，如电容，特别是电解电容，以使不耐热组件在较低温度下工作(靠近第一进气孔2201)。其他实施例中，也可将高发热组件设于内套21的第二部分，如电阻、电感、变压器等。对应到第二散热通道7b来讲，对流的空气进入第二散热通道7b时，在内套21的下部时，对流的空气会贴着内套21的外壁而向上，从而起到隔热作用，也就是防止散热鳍片11的热量传导至内套21的内，而影响其内的不耐热组件，而对流的空气继续往上时，对流的空气在导流面216的作用下，对流的空气将会沿散热鳍片11的径向外侧而流动，以此使对流的空气接触更多面积的散热鳍片11，以提高散热鳍片11表面的散热性。于本实施例中，内套21的内腔为上宽下窄的通道结构，极大加强了烟囱效应的效果，有助于推动内套21内部的空气流动。此外，散热孔222设置在灯颈22的顶端，与透气孔的距离最远，藉此设计进一步加强烟囱效应的效果。
图63是一些实施例中的LED灯去掉散热器1的主视图。图64是图63的分解图。本实施例中的所提到的特征可应用于图1的LED灯中。如图63所示，于一些实施例中，内套21的外周壁上设置流道219，以使内套21中的部分的对流空气可以通过流道219而流通至散热器1。于本实施例中，流道219可以是开设在内套21外周壁的下部的缝隙，也可以是开设在内套21外周壁的下部的孔洞。流道219设置有多个，多个流道219沿内套21的环向而分布。此时，凸块217的位置相应调整。
如图64所示，内套21上具有压线部210，压线部210相比内套21的下端部而向下凸设，压线部210上开设压线槽2101，以使连接电源5和灯板3的导线可卡入压线槽2101内，以完成对导线的固定。
如图64所示，内套21上具有第四定位单元2102，而灯罩4具有第五定位单元46，第四定位单元2102与第五定位单元46配合，以限制内套21相对灯罩4的转动。具体的第四定位单元2102为一定位孔，而第五定位单元46为一定位柱，定位柱插入定位孔而配合，需要注意的是，定位柱不是设于内套21的轴向方向上。优选的定位柱和定位孔设有多组。其他实施例中，第四定位单元2102为一定位柱，而第五定位单元46为一定位孔，定位柱插入定位孔而配合。
如图1所示，显示本实施例LED灯的外轮廓，建立直角坐标系，以LED灯的轴向为y轴，以LED的径向为x轴，以LED灯底面中心为原点。LED灯的侧面的外轮廓以一轮廓线绕LED灯的轴线360度回转而形成LED灯的外轮廓(不包含灯头23)，外轮廓线任意点(灯 头23通常为标准的灯头，因此，此处不包含灯头23，具体为散热器1和灯颈22所构成的外轮廓)符合以下公式：
y＝-ax 3+bx 2-cx+K
其中K为常数，K的范围为360～450，a的范围为0.001～0.01，b的范围为0.05～0.3，c的范围为5～20，优选为10～18，更优选为12～16。
以下，a，b，c分别取以下值为例：
y＝-0.0012x 3+0.2235x 2-14.608x+K
而K的范围为360～450。
上述公式内容亦可理解为，轮廓线上的任意点落入y＝-0.0012x 3+0.2235x 2-14.608x+360,及y＝-0.0012x 3+0.2235x 2-14.608x+450，这两条线之间的范围内。
总体而言，综合考虑散热效果、热力学原理、流体力学等因素，符合该公式的关系可达到良好的散热效果。
具体来讲，一方面，当轮廓线任意点符合上述公式时，使LED灯可更好的与灯具(特别是锥形状的灯具)匹配(如图67所示)。另一方面，轮廓线任意点符合上述公式时，使得LED灯由其底部沿其轴向向上方向，LED灯整体的宽度大致为递减状。对散热器1来说，散热器1的下部主要靠传导的方式使LED芯片311在LED灯运作过程中所产生的热能迅速传导至散热器1上进行散热，而上部主要通过辐射和对流等方式对散热器1进行散热。因此，散热器1的下部设计有更多的面积进行热传导(下部的散热器1宽度大，具有更大散热面积)。对灯颈22来说，灯颈22为下大上小的形状，也就是说，灯颈22的截面积在LED轴向向上时，其截面积呈递减状态，当灯颈22提供电源5通过对流方式进行散热，且散热孔222开设于灯颈22上部，则对流的空气向上时，因灯颈22截面积递减促使其对流速度增加，以使对流的空气排出散热孔222时，具有较大的初始速度，进而使空气排出时远离散热孔222，防止热气聚集在散热孔222附近。
本实施例中，轮廓线为连续的线条。其他实施例中，轮廓线可以是多段式的线条(如图68所示)。
本实施例中，轮廓线为平滑或大致平滑的曲线，以避免形成夹角而割手，另一方面来讲，可使对流的空气沿LED灯的外部的对流更加顺畅。本实施例中的LED灯的轮廓线大致为一“S”形曲线，该“S”形的曲线包括灯颈22上的曲线和散热器1上的曲线。灯颈22外部轮廓上的曲线和散热器1上的曲线共同形成“S”形曲线。需要说明的是，灯颈22和散热器1的结合处，可能会形成夹角，以破坏曲线的部分的平滑性，然总体而言，轮廓线整体还是呈平滑状的。 另外，同等的宽度尺寸下的LED灯，其轮廓线为曲线的话，相比直线，其具有更大面积的外轮廓面，以提供更多的可用于热辐射的面积。
如图66所示，显示本实施例中LED灯的外轮廓，建立直角坐标系，以LED灯的轴向为y轴，以LED的径向为x轴，以LED灯底面中心为原点。LED灯的侧面的外轮廓以一轮廓线绕LED灯的轴线360度回转而形成LED灯的外轮廓(不包含灯头23)。轮廓线包括灯颈22的轮廓线和散热器1的轮廓线。
其中，灯颈22用于容纳电源5，主要以对流方式对其内的电源5进行散热，灯颈22的轮廓线具有一斜率a，a为常数。如图66所示，当灯颈22的轮廓线为曲线时，可以虚拟一直线来代表灯颈22的轮廓线的大致的斜率。比如，取灯颈22轮廓线的顶点到底点的连线L1来代表灯颈22轮廓线，或者取灯颈22的顶部的中心到底点的连线L2来代表灯颈22轮廓线。本实施例中将取灯颈22轮廓线的顶点到底点的连线L1来代表灯颈22轮廓线，以作说明。
其中，散热器1主要用于以传导方式对LED芯片311进行散热，散热器1的轮廓线具有一斜率b，b为常数。如图66所示，当散热器1的轮廓线为曲线时，可以虚拟一直线来代表散热器1的轮廓线的大致的斜率。比如，取散热器1的轮廓线的顶点到底点的连线L3来代表散热器1轮廓线，或者散热器1的顶部的中心到底点的连线L4来代表散热器1轮廓线。本实施例中取散热器1的轮廓线的顶点到底点的连线L3来代表散热器1轮廓线，以作说明。
本实施例中，斜率a大于斜率b，或者斜率a的绝对值大于斜率b的绝对值。因此，总体上来看，灯颈22的轮廓线比散热器1的轮廓线更陡。对灯颈22来说，在所需设置电源5的空间一致的情况下，为保证灯颈22内对流时的烟囱效应，需要灯颈22保持一定的高度，如果灯颈22的轮廓更平(斜率小)，在保持相同的高度情况下，灯颈22的内部体积会增加，然而对于电源实际空间并无实际的帮助。对散热器1来说，为了保证散热效果的情况下，来控制整灯的高度，因此，需要将散热器1设置的更平(斜率小)，以控制其整体的高度，另外散热器1更平(斜率小)时，当散热面积相同的前提下，散热器1的下部会具有更多的用于LED芯片311散热传导的面积。
本实施例中，斜率a的值大于2，优选为2.5～5，更优选为3～4，最优选为3.2～3.8。以使灯颈22内对流散热时具有更好的烟囱效应。
本实施例中，斜率b的值为小于3，优选为1～2.5，更优选为1.4～2，最优选为1.5～1.9。以使散热器1的下部具有更多的面积用于传导。
本实施例中，LED灯的轮廓线为连续的线条，即灯颈22的轮廓线的底部与散热器1的轮廓线的顶部是相接的。其他实施例中，轮廓线可以是多段式的线条(如图68所示)，比如， 灯颈22的轮廓线的底部与散热器1的轮廓线的顶部具有间隔，因此轮廓线整体上是不连续的。本实施例中，灯颈22的轮廓线为内凹的曲线，也就是说，将灯颈22的轮廓线的顶点和底点的连线虚拟一直线，灯颈22的轮廓线全部位于该直线的内侧(靠近LED灯轴线的一侧)，而散热器1的轮廓线为外凸的曲线，将散热器1的轮廓线的顶点和底点的连线虚拟一直线，散热器1的轮廓线全部位于该直线的外侧(远离LED灯轴线的一侧)。而轮廓线为平滑或大致平滑的曲线，以避免形成夹角而割手，另一方面来讲，可使对流的空气沿LED灯的外部的对流更加顺畅。本实施例中的LED灯的轮廓线大致为一“S”形曲线或倒“S”形曲线，该曲线包括灯颈22上的曲线和散热器1上的曲线。灯颈22上的曲线和散热器1上的曲线共同形成“S”形或倒“S”曲线。需要说明的是，灯颈22和散热器11的结合处，可能会形成夹角，以破坏曲线的部分的平滑性，但是大致上来看，轮廓线整体还是呈平滑状的。另外，灯颈22与散热器1也有可能是分离的(比如灯颈22与散热器1保持一定的间隔)，也就是说，灯颈22上的曲线和散热器1上的曲线是断开的，但是大致上来看，轮廓线整体还是呈平滑状的。灯颈22的外轮廓为内凹的曲线，因此在向下过程中，灯颈22的尺寸的增加幅度增加，以使得最终灯颈22的底部具有较大的尺寸了与散热器1结合，也就是说，散热器1的上部的起始位置可获得较大的尺寸。散热器1的外轮廓为外凸的曲线，因此在向上过程中，散热器的尺寸的减小幅度递增，因此，散热器1的下部的尺寸衰减较慢，因此，下部具有更多的可用于散热的散热鳍片11的面积。其他实施例中，灯颈22的外轮廓可以是直线段，而散热器1的外轮廓为曲线，另外，该直线可以与LED灯平行。其他实施例中，灯颈22的轮廓线和散热器1的轮廓线可以均为直线段或多点直线段的组合。
本实施例中灯颈22的轮廓线的任意点符合以下公式：
y＝-ax+k1+h，
其中k1为常数，h为散热器1的高度。
散热器1的轮廓线的任意点符合以下公式：
y＝-bx+k2，
其中，k2为常数。
本实施例中，当LED灯的整体的宽度尺寸控制在100mm至220mm时，k1的值为100至200。k2的值为100至200。举例来讲，当LED灯的宽度尺寸最大为200mm时，k1的值为140～150，k2的值为170～200。
本实施例中，灯颈22的高度大于散热器1的高度的80％以上。由于灯颈22与散热器1在轴向上时分离的，两者无重合，因此灯颈22内的电源5受散热器1的影响较小，因此，当灯 颈22的高度大于散热器1的高度的80％以上时，可获得更多的空间来设置电源5，而这部分电源受散热器1影响较小。另外，当灯壳2内的电源5通过对流方式达到散热效果时，灯颈22高度的设置，可保证灯壳2的高度，以保证对流散热时的烟囱效应。
如图69所示，显示本实施例中LED灯的外轮廓，建立直角坐标系，以LED灯的轴向为y轴，以LED的径向为x轴，以LED灯底面中心为原点。LED灯的侧面的外轮廓以一轮廓线绕LED灯的轴线360度回转而形成LED灯的外轮廓(不包含灯头)。轮廓线包括灯颈22的轮廓线和散热器1的轮廓线。如图69所示，本实施例中的LED灯的外轮廓的包括第一曲面和第二曲面，第一曲面和第二曲面共同组成LED灯的外轮廓的曲面，第一曲面包括灯颈22的外轮廓的曲面或是灯颈22的外轮廓及部分的散热器1的外轮廓的曲面，第二曲面包括散热器1的外轮廓的曲面或部分散热器1的外轮廓的曲面。
本实施例中的灯颈22的轮廓线为一曲线或大致的曲线，散热器1的轮廓线为一曲线或大致的曲线，以避免形成夹角而割手，另一方面来讲，可使对流的空气沿LED灯的外部的对流更加顺畅。本实施例中的灯颈22的轮廓线的曲率半径大于散热器1的轮廓线的曲率半径，需要说明的是，本处所指的灯颈22的轮廓线的曲率半径大于散热器1的轮廓线的曲率半径，指的是，灯颈22的轮廓线的60％的曲率半径大于的散热器1的轮廓线的60％以上的曲率半径，即可认为灯颈22的轮廓线的曲率半径大于散热器1的轮廓线的曲率半径。
如图69所示，本实施例中的灯颈22的轮廓线的曲率半径为120mm～3000mm，优选为150mm～200mm，更优选为160mm～190mm，最优选为170mm～185mm。散热器1的轮廓线的曲率半径为30mm～150mm，优选为70mm～130mm，更优选为80mm～120mm，最优选为90mm～110mm。基于上述的表述，如果有60％以上的曲率半径在此范围或者与轮廓线最吻合的曲线的曲率，即视为灯颈22或散热器1的轮廓线的曲率半径。比如灯颈22，其轮廓线的60％以上的曲率半径为180mm，则认为灯颈22的曲率半径为180mm。基于上述的表述，还可以理解为，与轮廓线相近似的曲线，来代表轮廓线的曲率，也就是说，轮廓线本身可以不是曲线。一些实施例中，在考虑LED灯整体的宽度尺寸的情况下，灯颈22的轮廓线及散热器1的轮廓线分别与LED整灯的宽度相关，LED灯宽度尺寸(LED灯最宽处的尺寸)为L，则该实施例中的灯颈22的轮廓线的曲率半径为0.6L～15L，优选为0.75L～L，更优选为0.8～0.95L，最优选为0.85L～0.925L。散热器1的轮廓线的曲率半径为0.15L～0.75L，优选为0.35L～0.65L，更优选为0.4L～0.6L，最优选为0.45L～0.55L。也就是说，灯颈22的轮廓线的曲率及散热器1的轮廓线的曲率，随LED灯整灯的宽度变化而变化。于一些实施例中，灯颈22最大处的外径为R，则散热器1的轮廓线的曲率半径要大于L/2-R/2，以保证散热器具有足 够的高度，来保证第二散热通道7b的烟囱效应。
本实施例中，灯颈22的轮廓线所占圆心角c为10～50度，优选为20度至35度，更优选为25至30度。以此保持灯颈22在一定的高度，以保证灯颈22内的对流的烟囱效应。
本实施例中，散热器1的轮廓线所占圆心角d为40至120度，优选为55度至90度，更优选为65至80度，最优选为70到75度。以控制散热器1的整体的高度。
本实施例中，灯颈22的轮廓线为内凹的曲线，将灯颈22的轮廓线的顶点和底点的连线虚拟一直线，灯颈22的轮廓线全部位于该直线的内侧(靠近LED灯轴线的一侧)，而散热器的轮廓线为外凸的曲线，将散热器1的轮廓线的顶点和底点的连线虚拟一直线，散热器1的轮廓线全部位于该直线的外侧(远离LED灯轴线的一侧)。而轮廓线为平滑或大致平滑的曲线，以避免形成夹角而割手，另一方面来讲，可使对流的空气沿LED灯的外部的对流更加顺畅。本实施例中的LED灯的轮廓线大致为一“S”形曲线或倒“S”形曲线，该曲线包括灯颈22上的曲线和散热器1上的曲线。灯颈22上的曲线和散热器1上的曲线共同形成“S”形或倒“S”曲线。需要说明的是，灯颈22和散热器11的结合处，可能会形成夹角，以破坏曲线的部分的平滑性，但是大致上来看，轮廓线整体还是呈平滑状的。另外，灯颈22与散热器1也有可能是分离的(比如灯颈22与散热器1保持一定的间隔)，也就是说，灯颈22上的曲线和散热器1上的曲线是断开的，但是大致上来看，轮廓线整体还是呈平滑状的。灯颈22的外轮廓为内凹的曲线，因此在向下过程中，灯颈22的尺寸的增加幅度增加，以使得最终灯颈22的底部具有较大的尺寸了与散热器1结合，也就是说，散热器1的上部的起始位置可获得较大的尺寸。散热器1的外轮廓为外凸的曲线，因此在向上过程中，散热器的尺寸的减小幅度递增，因此，散热器1的下部的尺寸衰减较慢，因此，下部具有更多的可用于散热的散热鳍片11的面积。
如图70a所示，显示本实施例中LED灯与灯具6的配合示意图。本实施例中的灯具6具有一容置腔61，LED灯设于该容置腔61内。容置腔61的下部敞口设置，以利于LED灯从灯具6的下部装入容置腔61，且LED灯在工作过程中所产生的热扩散到容置腔61内后，可经由空气对流的方式从敞口处向外散出。本实施例中，LED灯散热时，一部分热可直接以热辐射的形式传递至灯具6上，灯具6再将热量传递至灯具6外部，还有一部分热以传导和对流的方式，传递到灯具6和LED灯之间的空间的空气中，再通过对流、传导或辐射等方式，传递到灯具6外部。
如图70b所示，显示一实施例中LED灯与灯具6的配合示意图。本实施例中的灯具6上开设对流孔62，对流孔62设于灯具的上部。这样一来，LED灯的热量传递至容置腔61的空 气时，可通过对流孔62而向上对流，从而将较热的空气带走。
如图70c所示，显示一实施例中LED灯与灯具6的配合示意图。本实施例中的灯具6具有一封闭的容置腔61。LED灯在装入容置腔61后，由于与外部隔离，因而可以起到防尘的作用，避免灰尘在LED灯的外部或内部堆积。此时，LED灯工作时所产生的热，在传递至容置腔61的空气中后，空气在容置腔61的内部循环，并通过热传导、热辐射的形式将热传递至灯具6上，再由灯具6将热传至外部。
上述实施例中，灯具6可以采用金属材质或塑料材质，采用金属材质的话，会更利于散热，而采用塑料材质的话，重量更轻，且成本降低，且采用塑料材质的话，可将灯具6设计为具有透光性。在灯具6封闭的情况下，处于散热考虑，则灯具6优选采用金属材质。
图65a为一些实施例中的LED灯的灯壳20的分解示意图，显示不同样式的灯壳20。图65b为图65a的装配示意图。图65c为图65a中的LED灯的分解示意图一。图65d为图65a中的LED灯的分解示意图二。图65e为图65a中的LED灯的剖视图。如图65a、图65b及图65c所示，于一些实施例中，灯壳20包括灯头230、灯颈220与内套210；灯头230与灯颈220螺纹连接，灯颈220连接内套210，内套210连接散热器10，具体地，灯颈220周围侧边设有凹槽2230，内套210上的凸条2110对准凹槽2230，内套210向灯颈220方向推进，再以旋转方式将灯颈220与内套210卡接；散热器10上设有定位槽1210，定位槽1210位于散热柱120的内侧壁上。内套210内设有卡槽2140，电源50包括电源板510，将电源板510卡入卡槽2140内，从而实现电源50的固定，卡槽2140的数量根据电源板510的形状设置，例如电源板510为二维形状时，卡槽2140的数量为2条。除此之外，在其他的实施例中，卡槽的形式可以设置为肋条状，在内套210内壁边缘以上下肋条或两相互垂直的肋条形式，将电源板510固定于内套210中，然而本发明不以此为限。电源50还可能包括电子组件，例如变压器、电容、电阻、电感、保险丝、MOS管等，当电源板510插入内套210中时，电源50中较容易发热，或是当LED灯工作时产生温度较高的电子组件，例如变压器、电容或MOS管，在电源板510的排布设计上设置于靠近内套210的底端，也就是相较于其他电子组件较靠近散热器10的气流通道入口处。因为当该些工作温度较高的电子组件，例如变压器、电容或MOS管，靠近内套210的底端时，冷空气流通至该些温度较高的电子组件的路径最短，能很好的对发热严重的电子组件进行散热，进一步降低灯壳20的腔内温度，进而提升LED灯的工作稳定性。内套210上设有与散热器10的定位槽1210对应的定位柱2120，定位柱2120插入定位槽1210中，将内套210向散热器10方向推，实现内套210与散热器10扣合。
如图65a～65e所示，LED灯组装时，先将灯头230与灯颈220螺纹连接，再将电源板510 卡入内套210内侧的卡槽2140中，然后将灯颈220连接内套210，内套210外侧的定位柱2120插入散热器10的定位槽1210中，使内套210由散热器1中央腔体穿至散热器1的底部；最后灯板3以例如是铆接方式固定在散热器1上后将灯罩40扣合在散热器10上。本发明在组装时，采用可重复拆装的卡扣设计，在保证连接强度的同时方便拆装，拆装过程中不破坏任何零件，零件可重复使用，解决了技术中采用螺丝连接耗时长、人工成本高以及灯体结构零部件在维修拆卸过程中报废率高的缺点。
如图65c所示，散热鳍片包括第一散热鳍片1110和第二散热鳍片1120，第一散热鳍片1110与第二散热鳍片1120彼此间隔交互设置，第二散热鳍片1120上设有卡位槽150，卡位槽150与内套210外侧的卡位条2130对应设置，加强内套210与散热器10的连接强度。
如图65c和65b所示，内套210的形状大致呈现中空柱型，内套210的内腔可以为下宽上窄的通道结构(内套210下部的横截面积小于上部的横截面积)，整个内套结构体的高宽比大于2.5，烟囱效应会更加的明显，优选为2.5～10。按照市面上最常见的A19、A20与A67球泡灯的标准，内套210的整体高度H可以为40～80mm。此下宽上窄的结构可加强烟囱效应的效果，有助于推动内套210内部的空气流动。内套210的顶端与灯颈220顶部疏通道衔接，当内套210内部的热气汇集到其顶端之后，即可经由灯颈220顶部疏通道传送到灯颈220的散热孔2220，然后排出灯壳20而达到散热的目的。以上所述的内套210规格大小仅表示此实施应用中的一种方式，不能作为限定欲主张的范围。
LED灯的散热方法：
本实施例中，LED灯的散热方法包括对LED芯片311的散热及对电源的散热，其中
如图1、图4和图6所示，针对LED芯片311的散热(LED芯片311工作时产生的热量)，包括以下步骤：
S101，设置一灯板3，将LED芯片311安装于灯板3上，以将LED芯片311工作时产生的至少部分热量以热传导的方式传至灯板3上；
S102，设置一散热器1，将灯板3设于散热器1上，LED芯片311工作时产生的至少部分热量经由灯板3的热量可以以热传导的方式传至散热器1上，并藉由散热器1热辐射至周围空气，并以对流方式而将热的空气对流出去。
上述步骤S102中，具体包括：
a.在散热器1上设置散热鳍片11，散热器1b包括一第二散热通道7b，第二散热信道7b配置第二进气孔1301，对流的空气经第二进气孔1301而进入到散热鳍片11之间的空间，以带走散热鳍片11辐射至空气的热，其中第二进气孔1301设置于散热器1的下部区域；
b.散热器1设置第三散热通道7c，第三散热通道7c形成于两散热鳍片11之间或同一散热鳍片11延伸出的两个片体之间的空间，两散热鳍片11之间的径向外侧部分构成第三散热通道7c的入口，空气从LED灯的径向外侧的区域而进入到第三散热通道7c中，并带走散热鳍片11辐射到空气的热量。
如图21所示，本实施例中，至少一散热鳍片11在LED灯的径向上分为两部分，且在这两部分在LED灯的径向上间隔设置，从而在上述间隔处形成流道，在散热器1进行散热时，对流的空气可在间隔处对流，从而提升对流的效率。
在对LED芯片311进行散热时，优选的，对LED灯每瓦的功率配置20至30平方厘米的散热器1的散热面积，以使得LED芯片311的散热效果、散热器1的体积和重量具有较好的平衡，可保证散热效果的情况下，控制散热器1的体积和重量。本实施例中，为使LED灯具有更多的可散热的面积，因此将散热器1的重量配置为占LED灯的50％以上，优选为55％～65％，而将散热器1的体积配置为占LED灯的体积的20％以上，优选为25％～50％。
如图40所示，在针对LED芯片311进行散热时，至少一部分散热鳍片11在LED灯的高度方向(轴向方向)的投影(投影至LED芯片311所在平面)至少接触一个LED芯片311，也就是说，在LED灯的高度方向(轴向方向)，至少一部分散热鳍片11的投影与至少一个LED芯片311重叠或部分重叠。因此，在进行散热过程，LED芯片311的导热路径更短，可降低热阻，利于热传导。优选的，任意一散热鳍片11在LED灯的高度方向(轴向方向)的投影(投影至LED芯片311所在平面)至少接触一个LED芯片311。
如图1和图29所示，在针对LED芯片311进行散热时，灯板3具有一内侧边界3002及一外侧边界3003，内侧边界3002及外侧边界3003沿LED灯轴向上延伸后，形成一个区域，将散热鳍片11配置为位于该区域内的散热鳍片11的面积大于位于该区域外的散热鳍片11的面积，如此一来，使散热器1的散热鳍片11大部分都对应于灯板3，以此可提高散热鳍片11的利用率，增加散热鳍片11对LED芯片311的有效导热面积。
如图4所示，一实施例中，针对电源的散热(LED灯工作时电源所产生的热量)方法，包括以下步骤：
S201，设置一具有第一散热通道7a的灯壳2，将电源5设于第一散热通道7a内，其中第一散热通道7a具有第一进气孔2201及散热孔222；
S202，对流的空气从第一进气孔2201进入到第一散热通道7a，电源5工作时产生的热量辐射到周围空气，而对流的空气通过对流的方式将热的空气从散热孔222排出。如此即可避免电源5在高温环境下工作，而影响了电源的寿命及工作品质。
如图22所示，将至少一发热组件501(电阻、电感、集成电路、变压器或整流桥等)设于第一散热通道7a中靠近灯头23的位置，在垂直于LED灯轴向方向的投影，至少一个发热组件501时通过热传导或热辐射的形式，将热量传至灯头23上，并通过灯头23将热量散到空气中或与之连接的灯座上。
其他实施例中，至少一个发热组件501热接触灯头23，至少一个发热组件501位于灯头23中，且该发热组件501通过导热材料53与灯头接触，且该发热组件501通过上述导热材料53与灯头23固定。以此，通过导热材料53的设置，既可以达到向灯头热传导的作用，也可以起到固定发热组件的作用，避免该发热组件501松动。
在电源5的散热设计时，至少一发热组件501在LED灯的轴向上的位置高于散热孔222的位置，该高于散热孔222的发热组件501的大部分热通过灯头2或其他途径散热。
在电源5散热设计时，将至少一发热组件与其他发热组件设置在电源板51的不同表面上，空气对流时，分别沿这两侧表面对流而带走发热组件辐射至周围空气的热量。
LED灯的组装方法：
如图2所示，一实施例中，LED灯的组装方法包括以下步骤：
S301，配置一灯板3，于灯板3上设置LED芯片311；
S302，配置散热器1；
S303，配置电源5；
S304，配置灯壳2；
上述步骤S301～S304中的顺序可以任意设置，
S305，将电源5装在灯壳2内；
S306，将灯壳2装在散热器1上，并实现电源5与灯板3电连接；
S307，配置一灯罩4，将灯罩4通过固定在散热器1上而罩设于灯板3处，以使LED芯片311所产生的光线透过灯罩4的光输出表面43而射出。
上述步骤中，可以依据实际的装配需要来调整步骤顺序。上述步骤中，可在步骤304之后，将灯板3以贴合的方式与散热器1连接，以使灯板3与散热器1形成一整体。
在步骤S304中，配置灯壳2时，在灯头23和灯颈22上相应设置螺纹，以使灯头23和灯颈22直接通过螺纹而实现连接。
在步骤S307中，先将灯壳2的内套21以卡合、扣合等可拆卸的连接方式连接到散热器11上。此处，可将灯壳2完成安装后，将内套21连同灯壳2整体而直接与散热器11连接，也可以是，将内套21单独与散热器1连接后，再将灯壳2的其他部件与内套21完成固定， 也就是灯颈22与内套21的连接固定。
如图31和图60所示，内套21和散热器1的连接结构和方法具体如下：散热器1具有中心孔，内套21表面具有凸块217，凸块217上具有第一限位面2171，其相对内套21的外周表面而凸设于该外周表面，而散热器1的散热鳍片11之间，在径向的内侧而言，其间距大于凸块217的宽度，内套21插入散热器1的中心孔时，将凸块217对准与两散热鳍片11之间而插入到散热器1中，直至凸块217的第一限位面2171在LED灯的轴向上超出散热鳍片11的底面，此时转动内套21，使第一限位面2171与散热鳍片11的底面相抵，除此之外，内套21还具有第二限位面218，当第一限位面2171与散热鳍片11的底面相抵时，第二限位面218抵于散热鳍片11的顶面上，以此，便将内套21与散热器1实现了连接，且无需借助螺栓等外部构件，拆装更加方便。需拆卸内套21时，将上述步骤相反操作即可。
优选的，内套上设置第三限位面2172，第三限位面2172在内套21的周向上位于凸块217的一侧，以限制散热鳍片11的转动，在内套21安装至散热器1时，将凸块217对准与两散热鳍片11之间而插入到散热器1中，直至凸块217的第一限位面2171在LED灯的轴向上超出散热鳍片11的底面，此时转动内套21，使第一限位面2171与散热鳍片11的底面相抵，直至转动到散热鳍片11的侧部与第三限位面2172相抵为止，以防止过度转动而使第一限位面2171与散热鳍片11错位。
如图59a～59b所示，内套21和灯壳2的灯颈的连接方法如下：内套21上具有第一定位单元211，而灯颈22上具有第二定位单元221，第一定位单元211与第二定位单元221扣合。具体的，第一定位单元211为开设在内套上的扣合部，而第二定位单元221为开设在灯颈上的卡扣，而扣合部与卡扣直接扣合连接。
如图31～图33所示，在步骤S308中，灯罩4与散热器1的具体的连接方法如下：灯罩4设置一扣接部46，而散热器1上相应处设置孔洞，将灯罩4的扣接部46穿过上述间隙而卡在散热底座13的背面134。
图71是一些实施例中的LED模块的电路布局示意图一。图72是图71中D处的放大示意图。图73是一些实施例中LED模块的电路布局示意图二。图71中的LED模块和图72中的LED模块均可应用于图1的LED灯中。如图71、图72和图73所示，LED模块70包括至少一个LED单元710。LED单元710为两个以上，且LED单元之间并联连接。每一个LED单元710包括至少一个LED711。当一个LED单元710包括多个LED711时，同一个LED单元710的LED711串联连接，第一个LED 711的正端耦接所述LED单元710的正端，第一个LED 711的负端耦接下一个或第二个LED 711。而最后一个LED711的正端耦接前一个LED  711的负端，最后一个LED 711的负端耦接所述LED单元710的负端。
如图71所示，于一些实施例中，LED模块70包括五个LED单元710，以图中显示来讲，LED模块70分布于两个圆周上，即内周和外周，其中内周上设置有两个完整的LED单元710，而外周上设置有两个完整的LED单元710，而第五个LED单元710来讲，其大部分LED611设于外周上，而少部分设于内周上，也就是说，第五个LED单元710位于内周上的LED711少于位于外周上的LED711。
如图73所示，于一些实施例中，LED模块70包括10个LED单元710，以图中显示来讲，LED模块70分布于三个圆周上，即内周、中间和外周，其中内周上设置有两个完整的LED单元710，而外周上设置有四个完整的LED单元710，中间则设置三个完整的LED单元710，而第十个LED单元710来讲，其大部分LED711设于内周上，而少部分设于外周上，也就是说，第十个LED单元710位于内周上的LED711多于位于外周上的LED711。
LED单元710中的LED711的数量，较佳的为10至20个，更佳的为12至16个。
如图71、图72和图73所示，LED711在灯板3上基本上是沿着灯板3的周向设置的，同一LED单元710的LED711如果均位于同一圆周上，则LED711之间均是通过第一导线712连接，换句话说，同一圆周上的LED711之间的串联是通过第一导线712实现的。同一LED单元710的LED如果分为两部分，其中一部分位于一圆周上，而另一部分位于不同的圆周上，则同一LED单元710的同一圆周上的LED711之间通过第一导线712连接，而同一LED单元710的不同圆周上的LED711之间通过第二导线713连接，第二导线713的宽度小于第一导线712，以便于更好的进行LED711的排布，如果第二导线713的宽度过大，则会影响相应圆周上的相关的LED711的间距，使该间距明显大于其他LED711的间距。
如图71、图72和图73所示，第一导线712具有一宽度，其宽度至少大于LED711(LED芯片311)的宽度，而第一导线712采用的金属材质，其具有良好的导热性能，有利于LED711(LED芯片311)的散热，且由于第一导线712的宽度至少大于LED711(LED芯片311)的宽度，更利于LED711的安装，使其更易与第一导线712形成电连接。
如图71、图72和图73所示，LED711分布于灯板3上的不同的圆周上，也就说，灯板3上至少具有两组圆周来设置LED711，这两组圆周大致上是同心的。位于最内侧或最外侧的圆周上的LED711之间串联时采用的第一导线712，其中的至少部分第一导线712其宽度大于其他第一导线712，位于最内侧或最外侧的圆周上的LED711之间串联时采用的第一导线712，由于在其外侧或内侧无其他LED711的设置，使其宽度没有限制，因此最内侧或最外侧的圆周上的LED711之间串联时采用的第一导线712在径向的内侧或外侧设置拓展部分7121， 使其宽度增加，从而增加了第一导线712的面积，更利于散热。拿图73举例，其具有三个设置LED711的圆周，其中最内侧和最外侧的圆周上的第一导线712的宽度明显大于中间侧的圆周上的第一导线712的宽度。
如图71和72所示，灯板3上设置用于安装灯板3的孔位301，灯板3通过上述孔位301而铆接或螺纹连接于散热底座13上，由于孔位301占用了空间，因此，孔位301所对应的第一导线712相比同一圆周上的第一导线712而更靠近内侧或外侧，以此来避让孔位301。且与孔位301所对应的第一导线的宽度相比具有拓展部分7121的第一导线712的宽度要小，以此，可减少第一导线712避让孔位301的幅度。
如图71和图72所示，垂直于灯板3的方向上，单个LED711的面积为M1，在垂直于灯板3的方向上，单个LED711投影到灯板3上，其覆盖的区域包含的第一导线712的面积为M2，其符合以下关系：M2：M1＝1：(0.85～0.96)，优选为M2：M1＝1：(0.9～0.96)。以使LED611可对应到更多可用于散热的第一导线711的面积。
如图71和图72所示，不同LED单元710之间通过第三导线714连接，第三导线714连接两个不同LED单元710的第一个LED711的正极，或者第三导线714连接两个不同LED单元710的最后一个LED711的负极。第三导线714的宽度小于第一导线712。
如图71和图72所示，LED模块70包括两电极端子，如本实施例所示为正极端子701和负极端子702，正极端子701和负极端子702相比任一一个LED711、第一导线712、第二导线713或第三导线714位于LED灯的灯板3径向的更内侧。其他实施例中，也可以将正极端子701和负极端子702设置为相比任一一个LED711、第一导线712、第二导线713或第三导线714位于LED灯板径向的更外侧。从而使正极端子701和负极端子702利于与电源5完成连接。另外，正极端子701和负极端子702具有不同的形状，以利于做出区分。
请参考图74-图82。本申请实施方式中提供一种用于为LED灯供电的电源模块，包括：用于接收交流驱动信号的输入端(ACN、ACL)；第一整流电路100，其用于将所述交流驱动信号转换为整流后信号；滤波电路200，其用于将所述整流后信号转换为滤波后信号；电源转换电路400，其用于将滤波后信号转换为能够点亮LED光源500的电源信号；与所述输入端(ACN、ACL)、电源转换电路400相连接的偏压产生电路600；所述偏压产生电路600能将所述交流驱动信号降压形成所述电源转换电路400的工作电压。
本实施方式所提供的电源模块，通过设置偏压产生电路600将交流驱动信号降压形成所述电源转换电路400的工作电压，为电源转换电路400提供工作电压以使得电源转换电路400运行，将LED光源500驱动点亮。可见，该电源模块利用偏压产生电路600通过主动式的电 源转换方式对外部输入的交流驱动信号进行电源转换，可以快速形成电源转换电路400所需的工作电压，进而有效提升LED灯启动速度。
在利用图75-图82所示实施例中的电源模块时，可以将HID-LED的启动速度降至约60ms，具有非常高的应用价值和良好的使用体验。
该电源模块可以适用于高功率LED灯中，其中，电源转换电路400的输出功率可以在30W以上。如图2所示，输入端可以为电源模块的两个接脚：第一接脚ACL、第二接脚ACN。通过两个接脚输入交流驱动信号。交流驱动信号可以为220V交流信号，也可以为其他电压值的交流信号。当然，输入端(ACN、ACL)也可以具有多个接脚，比如，四个接脚等等，只需能够输入交流电即可，本申请并不作限制。
在本申请实施方式中，第一整流电路100可以为一桥式整流电路。如图76所示，图76是本申请一实施例的整流电路和滤波电路的示意图。第一整流电路100包括二极管D7、D8、D9、D10。第一整流电路100可以对交流驱动信号(交流电)进行全波整流，以产生直流驱动信号(直流电)。
具体地如图76所示，二极管D7、D9的一阳极电性连接该滤波电路200的第一端，二极管D7、D9的阴极分别电性连接二极管D8、D10的阳极，而该二极管D08、D10的阴极电性连接该滤波电路200的第二端。上述的二极管D7及二极管D8的连接点电性连接第一接脚ACL。二极管D7、D9的阳极电性连接该滤波电路200的一端，阴极电性连接二极管D8、D10的阳极，而二极管D8的阴极电性连接二极管D10的阴极。上述的二极管D9及D10的连接点电性连接该第二接脚ACN。
另外，第一整流电路100也可以是其他种类的全波整流电路或半波整流电路，而不影响本发明方案欲达到的功能。
在本实施例中，该滤波电路200包含电容C1和C2以及电感L1。电容C1和电感L1的第一端作为滤波电路200的第二端电性连接二极管D8和D10的阴极，电感L1的第二端电性连接电容C1的第一端，并且电容C1和C2的第二端作为滤波电路200的第一端电性连接二极管D7和D9的阳极。该滤波电路200接收经第一整流电路100整流后的直流电(整流后信号)，并滤除直流电中的高频成分。经滤波电路200滤波后的直流电，其波形为一平滑的直流波形。经滤波后的信号会通过连接端301和302给到后级电路。
在一些实施例中，该滤波电路200也可以仅包含电容C1来实现滤波功能，而不影响本申请欲达到的功能。
在本申请实施方式中，输入端ACN、ACL与整流电路100之间还可以设有如图75所示 的电磁干扰抑制电路900(也可以称为EMI抑制电路)。通过电磁干扰抑制电路900可以降低干扰磁场对于驱动信号带来的影响。在该电磁干扰抑制电路900中，输入端ACN、ACL的两个接脚所连接的电源线(母线、干路)上连接有励磁线圈LF2，将干路连接的电阻支路(比如电阻R1所在支路)和多个电容支路(比如电容CX2、CX1、CX3)所在支路，以及分别和在两个干路上的电感Li1、Li2电性连接。
当然，电磁干扰抑制电路900可以采用EMI滤波器电路，该电路上设有多个滤波组件，具体的，该EMI滤波器电路设有差模电容、共模电感、以及共模电容。
在本申请实施方式中，电源转换电路400能将滤波后信号转换为能够点亮LED光源500的电源信号。电源转换电路400可以对滤波后信号进行电压值的改变，形成目标电压值的直流驱动信号。电源转换电路400具有输出端，以向LED光源500输出目标电压的直流驱动信号。
另外，输入端ACN、ACL所连接的干路上还可以串联有保险丝F1。该保险丝F1可以为电流保险丝，也可以为温度保险丝，本实施方式并不作限制。
图78是本申请一实施例的电源转换电路的示意图。如图74、图78所示，电源转换电路400通过连接端401和402接收前级电路提供的信号，并且通过连接端501和502将产生的电源信号提供至后级，其中所述电源转换电路400可以采用PWM(Pulse Width Modulation)电路，通过控制脉冲宽度实现目标信号的输出。具体的，电源转换电路400可以包括控制器U2、功率开关Q2、电压互感器T2以及二极管D10，通过控制器U2、功率开关Q2、二极管D10与储能线圈(电压互感器T2中串接在功率开关Q2和连接端502之间的线圈)相配合输出所需电压值及/或电流值的电源信号(直流驱动信号)。其中，转换控制器U2响应于偏压产生电路600所供应的工作电压VCC信号而启动，从而输出PWM控制信号来控制功率开关Q2的切换，使所述储能线圈响应于功率开关Q2的切换而反复地充能和释能，并且通过二极D4管维持续流，进而在连接端501和连接端502间形成所需的电源信号。
其中，功率开关Q2可以为MOS开关管。控制器U2的第一端(电源端)连接所述偏压产生电路600的输出端，控制器U2的第二端连接所述电压互感器T2的感应线圈的一端。其中，所述电压互感器T2的储能线圈的一端连接直流输出端的负极端(即，连接端502)，另一端连接二极管D4的阳极。二极管D4的阳极连接直流输出端的正极端(即，连接端501)。控制器U2的第二端所连接的电压互感器T2的感应线圈的一端，该感应线圈的另一端接地。控制器U2的第三端通过电阻R9连接所述功率开关Q2的控制端，功率开关Q2的第一端连接二极管D4和电压互感器T2之间的连接点，并且功率开关Q2的第二端连接控制器U2的 第四端。电源转换电路400还可设有采样电路来采样其工作状态，并且作为控制器U2输出信号的参考。
举例来说，所述采样电路例如包含电阻R8和R10、电容C6和电压互感器T2的感应线圈，其中控制器U2可以通过第一端从电阻R8和电容C6采样母线电压、通过第二端从所述感应线圈采样输出电流、并且通过第四端从电阻R10的一端采样流经功率开关Q2的电流。采样电路的设置与控制器U2的控制方式有关，本揭露不仅限于此。
在本实施例中，开关控制器U3的至少一端与电感L2所在的支路相连接，开关控制器和电感之间可以设有滤波组件和/或稳流组件，本申请并不作限制。
为减轻谐波对电路特性的影响，降低转换损耗。所述电源转换电路400和所述滤波电路200之间还可设有功率因数校正电路300。所述功率因数校正电路300能够通过调整所述滤波后信号的信号特性(例如相位、电平或频率等)提升所述滤波后信号的功率因数；所述功率因数校正电路300与所述偏压产生电路600的输出端相连接。具体的，该功率因数校正电路为PFC电路，该功率因数校正电路可以为有源功率因数校正电路300。
图77是本申请一实施例的功率因数校正电路的示意图。如图77所示，该功率因数校正电路300可通过连接端301和302从滤波电路300接收信号，并且通过连接端401和402将经校正的信号传送给后级的电源转换电路400，所述功率因数校正电路300包含控制器U1、与控制器U1相连接的功率开关Q1、电压互感器T1、以及二极管D3。功率开关Q1可以为MOS开关管。控制器U1的第一端(电源端)连接所述偏压产生电路600的输出端607。控制器U1的第二端连接所述电压互感器T1的一端，电压互感器T1的一个线圈串联在干路上，控制器U1的第二端所连接的线圈的另一端接地。该干路连接直流输出端的正极端(也可以称为第三接脚501)。二极管D3串联在干路上。二极管D3的阳极连接所述电压互感器T1的一端以及滤波电路200，阴极连接一连接端401，以连接所述端部电源转换电路400、第三接脚501。控制器U1的第三端连接所述功率开关Q1，功率开关Q1的一端连接二极管D3和电压互感器T1之间的第五连接点。控制器U1还可以连接有采样电路(电阻R2和电容C3之间的连接点与控制器U1相连接，电容C3并联有电阻R3)、以及其他电路，具体可以参考图5所示。
当然，考虑到PFC电路具有多种实现形式，且均能引用在本实施方式中，此处不再详细描述。
图79是本申请第一实施例的偏压产生电路的示意图。请参阅图75、图79，所述偏压产生电路600a可以包括取电单元610、开关控制器U3和储能续流单元630。所述取电单元610 连接所述输入端(ACN、ACL)、所述开关控制器U3。所述开关控制器U3连接所述储能续流单元630。所述储能续流单元630具有用于输出工作电压的输出端607。所述输出端607连接所述电源转换电路400，以向所述电源转换电路400供应工作电压(VCC)。
其中，所述开关控制器U3根据所述取电单元610的取电信号控制储能续流单元630的开关频率以形成所述电源转换电路400的工作电压，并利用所述输出端607向所述电源转换电路400输出工作电压。其中，开关控制器U3响应于取电单元610的取电信号而启动，并通过控制储能续流单元630的导通时间，不断地导通截止而反复地充能和释能，并且利用二极管D5维持续流，借此形成所述电源转换电路400的工作电压，再利用所述输出端607向所述电源转换电路400输出。
在具体的实施例中，所述取电单元610能够将所述交流驱动信号转变成与交流驱动信号的电压相等的直流取电信号。如图75、图79所示。所述取电单元610可以通过第二整流电路来实施(底下称为第二整流电路610)。所述第二整流电路610包括相串联极性相反的第一二极管D1、第二二极管D2(即，第一二极管D1和第二二极管D2的阴极连接在一起)。所述第二整流电路610在所述第一二极管D1、第二二极管D2之间设有取电端601。所述取电端601连接所述开关控制器U3。通过极性相反的第一二极管D1、第二二极管D2将交流驱动信号整流，进而在取电端601输出直流驱动信号。
具体的，所述取电端501还连接第一电容C9的一端，所述第一电容C9的另一端连接接地端GND。所述开关控制器U3连接电感L2的一端，所述电感L2的另一端连接所述输出端607。其中，电感L2可以在开关控制器U3进行开关时起到储能和释能续流的作用。
在本实施例中，所述储能续流单元630可以包括电感L2、第三二极管D5以及第二电容C11。所述开关控制器U3和电感L2之间具有连接端603。该连接端603连接第三二极管D5的阴极，第三二极管D5的阳极连接所述接地端GND。所述电感L2和所述输出端607之间具有第二连接点604。该第二连接点604连接第二电容C11的一端，所述第二电容C11的另一端连接所述接地端GND。第二连接点604和输出端607之间还设有第三连接点(图75未示出)，该第三连接点连接负载电阻的一端，负载电阻的另一端连接所述接地端GND。
进一步地，开关控制器U3可以为MOS开关，具体可以为集成有MOS开关的IC芯片。当然，在有的实施例中，开关控制器U3也可以为三极管等开关管。开关控制器U3具有多个连接端也可以称为连接端口。其中，取电端601与接地端GND之间形成取电支路；第一电容C9串联在该取电支路上。开关控制器U3的至少一个连接端通过取电支路连接所述取电端 601，取电支路和电感C9所在支路通过第四连接点602与取电端601相连接。接地端GND连接在接地线路640上，第三二极管D5、第二电容C11、以及负载电阻均连接接地线路640。
偏压产生电路600还可设有采样电路来采样其工作状态，并且作为开关控制器U3输出信号的参考。
举例来说，采样电路可以包括第一采样电路650、以及第二采样电路620。所述第一采样电路650连接所述取电端601(图79中形成连接点605)、所述开关控制器U3。所述第二采样电路620连接所述输出端607、所述开关控制器U3。所述开关控制器U3根据所述第一采样电路650和所述第二采样电路620的采样信号控制开关频率以输出稳定的工作电压。采样电路的设置与开关控制器U3的控制方式有关，本揭露不仅限于此。图7是本申请第二实施例的偏压产生电路的示意图；
在进一步地实施例中，所述偏压产生电路还可以用于为温度检测电路700提供工作电压，其中图7是本申请第二实施例的偏压产生电路的示意图，图81是本申请一实施例的温度检测电路示意图。如图80、图81所示，所述温度检测电路700与所述电源转换电路400相连接，以将温度检测信号发送至所述电源转换电路400。温度检测电路700可以设有温度传感器，该温度传感器可以与偏压产生电路600b相连接，从而，偏压产生电路600b向温度传感器提供工作电压。
在该实施例中，相较于前述图79实施例，本实施例的偏压产生电路600b更包含晶体管Q3、二极管D6、电阻R12以及电容C10。所述晶体管Q3可例如以三极管为例(底下以三极管Q3称之)。温度检测电路700与偏压产生电路600b的三极管Q3相连接。其中，三极管Q3的集电极连接所述输出端607和所述第六连接点之间的第六连接点。三极管Q3的发射极连接温度传感器的电源输入端。三极管Q3的基极连接有接地线，该接地线具有接地端GND。
其中，温度检测电路700响应于偏压产生电路600b从连接端701和702提供的工作电压而启动，并且向电源转换电路400的控制器U2反馈温度信息(Vtemp)。在温度超过阈值(即，温度过高)时，电源转换电路400的控制器U2可以降低输出功率，从而进行降温控制，保证电路的运行安全。
进一步地，如图82所示，所述温度检测电路700还连接有温度补偿电路800，其中图82是本申请一实施例的温度补偿电路示意图。所述温度检测电路700连接于所述温度补偿电路800和所述偏压产生电路600b之间。所述温度补偿电路800与所述电源转换电路400相连接。
该温度补偿电路800可以使得温度传感器的自由端的参考温度更合理。其中，本实施例的温度补偿电路800可利用比较器CP来实现(但不仅限于此)，所述比较器CP的一输入端 可通过连接端801接收温度检测电路700所产生的指示温度信息的电压，并且将指示温度信息的电压与所述比较器CP的另一输入端上的一参考电压Vref进行比较，藉以判断温度检测电路700所检测到的温度是否超过阈值，并且在比较器CP的输出端上产生指示温度是否超过阈值的一温度检测信号Vtemp。温度补偿电路800的输出端会连接到电源转换电路400的控制器U2上，使所述温度检测信号Vtemp被反馈至电源转换电路400的控制器U2中，从而使控制器U2可响应于当前的系统环境温度来调节输出功率。
在其他实施例中，该温度补偿电路800上也可以具有稳压二极管以及热敏电阻。在热敏电阻之后，通过一个可调电位器连接到放大电路，由该放大电路负端与温度补偿电路800的输出端相连。
具体的，所述温度补偿电路800的电路图可以如图82所示，当然，考虑到该温度补偿电路的实现形式具有多种，本申请并不以图82所示电路为限制。
本申请实施方式中还提供一种高功率LED灯，包括：LED光源500；如上任一所述的电源模块，其与所述LED光源500相连接。该高功率LED灯可以是指输出功率在30W以上的任一类型LED灯、具有等效为氙气灯30W以上的输出功率的LED灯或者是LED光源500是采用大功率灯珠(例如额定电流大于20mA的灯珠)的LED灯。
本文引用的任何数字值都包括从下限值到上限值之间以一个单位递增的下值和上值的所有值，在任何下值和任何更高值之间存在至少两个单位的间隔即可。举例来说，如果阐述了一个部件的数量或过程变量(例如温度、压力、时间等)的值是从1到90，优选从20到80，更优选从30到70，则目的是为了说明该说明书中也明确地列举了诸如15到85、22到68、43到51、30到32等值。对于小于1的值，适当地认为一个单位是0.0001、0.001、0.01、0.1。这些仅仅是想要明确表达的示例，可以认为在最低值和最高值之间列举的数值的所有可能组合都是以类似方式在该说明书明确地阐述了的。
除非另有说明，所有范围都包括端点以及端点之间的所有数字。与范围一起使用的“大约”或“近似”适合于该范围的两个端点。因而，“大约20到30”旨在覆盖“大约20到大约30”，至少包括指明的端点。
披露的所有文章和参考资料，包括专利申请和出版物，出于各种目的通过援引结合于此。描述组合的术语“基本由…构成”应该包括所确定的组件、成分、部件或步骤以及实质上没有影响该组合的基本新颖特征的其他组件、成分、部件或步骤。使用术语“包含”或“包括”来描述这里的组件、成分、部件或步骤的组合也想到了基本由这些组件、成分、部件或步骤构成的实施方式。这里通过使用术语“可以”，旨在说明“可以”包括的所描述的任何属性都 是可选的。
多个组件、成分、部件或步骤能够由单个集成组件、成分、部件或步骤来提供。另选地，单个集成组件、成分、部件或步骤可以被分成分离的多个组件、成分、部件或步骤。用来描述组件、成分、部件或步骤的公开“一”或“一个”并不说为了排除其他的组件、成分、部件或步骤。
应该理解，以上描述是为了进行图示说明而不是为了进行限制。通过阅读上述描述，在所提供的示例之外的许多实施方式和许多应用对本领域技术人员来说都将是显而易见的。因此，本教导的范围不应该参照上述描述来确定，而是应该参照所附权利要求以及这些权利要求所拥有的等价物的全部范围来确定。出于全面之目的，所有文章和参考包括专利申请和公告的公开都通过参考结合在本文中。在前述权利要求中省略这里公开的主题的任何方面并不是为了放弃该主体内容，也不应该认为发明人没有将该主题考虑为所公开的发明主题的一部分。

Claims (7)

  1. [根据细则91更正 16.01.2019]
    一种发光二极管灯，其特征在于，包括：
    灯壳；
    被动式散热组件，所述被动式散热组件包括散热器，所述散热器包括散热鳍片和散热底座，所述散热器与所述灯壳连接；
    电源，所述电源位于所述灯壳内；以及
    灯板，其连接在所述散热器上，所述灯板包括LED芯片，所述电源与所述LED芯片电连接；
    所述灯壳的内腔中形成第一散热通道，所述第一散热通道在所述灯壳的一端具有第一进气孔，而所述灯壳上相对的另一端具有散热孔；
    所述散热鳍片和所述散热底座中形成第二散热通道，所述第二散热通道具有第二进气孔，空气从所述第二进气孔进入后，通过所述第二散热通道，最后从所述散热鳍片之间的空间流出。
  2. [根据细则91更正 16.01.2019]　
    如权利要求1所述的发光二极管灯，其特征在于，所述灯板开设有第三开口，所述第三开口分别与所述第一散热通道及所述第二散热通道连通。
  3. [根据细则91更正 16.01.2019]　
    如权利要求2所述的发光二极管灯，其特征在于，所述第三开口设于所述灯板的中心的区域，且所述第一进气孔和所述第二进气孔分别从第三开口处进气。
  4. [根据细则91更正 16.01.2019]　
    如权利要求1所述的发光二极管灯，其特征在于，所述散热器的重量占所述发光二极管灯的重量的50％以上，而所述散热器的体积占发光二极管灯总体的体积的20％以上。
  5. [根据细则91更正 16.01.2019]　
    如权利要求4所述的发光二极管灯，其特征在于，所述散热器的体积占所述发光二极管灯总体的体积的20％～60％。
  6. [根据细则91更正 16.01.2019]　
    如权利要求4所述的发光二极管灯，其特征在于，所述散热鳍片包括第一散热鳍片和第二散热鳍片，所述第一散热鳍片和所述第二散热鳍片在发光二极管灯轴向上的底部均与所述散热底座连接，所述第一散热鳍片与所述第二散热鳍片彼此间隔交互设置，所述第二散热鳍片的形状为一分为二的Y形。
  7. [根据细则91更正 16.01.2019]　
    如权利要求1所述的发光二极管灯，其特征在于，还包括灯罩，所述灯罩包括光输出表面和端面，所述端面上设有透气孔，空气通过所述透气孔而进入到所述第一散热通道和所述第二散热通道，所述第一进气孔在发光二极管灯轴向上投影到所述端面所占的区域形成第一部分，而所述端面上的其他区域形成第二部分，所述 第一部分上的所述透气孔的面积大于所述第二部分上的所述透气孔的面积。
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