WO2019104859A1 - Packaging structure for packaging oled device, and display device - Google Patents

Packaging structure for packaging oled device, and display device Download PDF

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Publication number
WO2019104859A1
WO2019104859A1 PCT/CN2018/074039 CN2018074039W WO2019104859A1 WO 2019104859 A1 WO2019104859 A1 WO 2019104859A1 CN 2018074039 W CN2018074039 W CN 2018074039W WO 2019104859 A1 WO2019104859 A1 WO 2019104859A1
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layer
package
sio
packaging
disposed
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PCT/CN2018/074039
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French (fr)
Chinese (zh)
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陈霞
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武汉华星光电半导体显示技术有限公司
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Publication of WO2019104859A1 publication Critical patent/WO2019104859A1/en

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Definitions

  • the present invention belongs to the field of organic light emitting display technologies, and in particular, to a package structure and a display device for packaging an OLED device.
  • OLED display devices have become very popular emerging flat display devices at home and abroad, because OLED display devices have self-luminous, wide viewing angle, short reaction time, high luminous efficiency, Wide color gamut, low operating voltage, thin thickness, large size and flexible panels and simple process, and low cost potential.
  • FIG. 1 is a schematic diagram of a conventional package structure for packaging an OLED device. As shown in FIG.
  • the package structure inorganic encapsulation layer 11, organic encapsulation layer 12, inorganic encapsulation layer 13 and barrier layer 14 are provided.
  • 2 is a graph of stress and strain of a film layer of the package structure shown in FIG. 1.
  • the abscissa is the stress strain Axial Strain
  • the ordinate is the distance z from the center layer.
  • the stress strain Axial Strain of the package structure shown in FIG. 1 ranges from -2.5 to 2.5, the maximum value reaches 2.5 and the minimum value reaches -2.5, and the stress strain Axial Strain has a position of 0.
  • the inorganic encapsulation layers 11, 13 in such a package structure are prone to cracking during the bending process, thereby losing the encapsulation effect.
  • the thickness of the barrier layer 14 is generally between several tens of micrometers and several hundred micrometers, which also increases the thickness of the entire OLED device.
  • a package structure for packaging an OLED device including a package unit, the package unit includes: an optical adhesive layer; and an inorganic encapsulation layer disposed on the optical adhesive layer An organic encapsulation layer disposed on the inorganic encapsulation layer.
  • the number of the packaging units is three, and three packaging units are stacked; in the two adjacent packaging units, the optical adhesive layer of the upper packaging unit is disposed in the organic packaging of the packaging unit located below On the floor.
  • a display device includes: a substrate; an OLED device disposed on the substrate; a package structure disposed on the OLED device to package the OLED device,
  • the package structure includes a package unit, and the package unit includes an optical adhesive layer disposed on the OLED device, an inorganic encapsulation layer disposed on the optical adhesive layer, and an organic encapsulation layer disposed on the inorganic encapsulation layer.
  • the number of the packaging units is three, three package units are stacked, and the optical glue layer of the lowermost package unit is disposed on the OLED device; in two adjacent package units, The optical adhesive layer of the upper package unit is disposed on the organic encapsulation layer of the package unit located below.
  • the OLED device includes a bottom electrode, a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, an electron injection layer, and a top electrode which are sequentially stacked on the substrate.
  • one of the bottom electrode and the top electrode is transparent or translucent, and the other of the bottom electrode and the top electrode is opaque and reflects light.
  • the inorganic encapsulating layer is made of Al 2 O 3 , TiO 2 , ZrO 2 , MgO, HfO 2 , Ta 2 O 5 , Si 3 N 4 , AlN, SiN, SiNO, SiO, SiO 2 , SiO x , SiC. It is formed by combining one or several of ITO.
  • the organic encapsulating layer is made of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyvinyl chloride, polystyrene, polymethyl methacrylate. , polybutylene terephthalate, polysulfone, polyparaphenylene sulfone, polyethylene, polypropylene, polysiloxane, polyamide, polyvinylidene fluoride, ethylene-vinyl acetate copolymer, ethylene A combination of one or more of a vinyl alcohol copolymer, a polyacrylonitrile, a polyvinyl acetate, a parylene, a polyurea, a polytetrafluoroethylene, and an epoxy resin.
  • the invention has the beneficial effects that the invention reduces the stress strain of the inorganic encapsulation layer during bending by introducing an optical adhesive layer into the package structure, thereby reducing the risk of cracking of the inorganic encapsulation layer.
  • the package structure of the present invention saves the outermost barrier layer, can reduce the thickness of the package structure, and is advantageous for thinning the device.
  • FIG. 1 is a schematic view of a conventional package structure for packaging an OLED device
  • FIG. 2 is a graph showing stress and strain of a film layer of the package structure shown in FIG. 1;
  • FIG. 3 is a schematic diagram of a package structure for packaging an OLED device in accordance with an embodiment of the present invention.
  • FIG. 4 is a stress-strain curve diagram of the package structure shown in FIG. 3;
  • FIG. 5 is a schematic structural diagram of a display device according to an embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a package structure for packaging an OLED device in accordance with another embodiment of the present invention.
  • FIG. 7 is a schematic structural view of a display device according to another embodiment of the present invention.
  • FIG. 3 is a schematic diagram of a package structure for packaging an OLED device, in accordance with an embodiment of the present invention.
  • a package structure for packaging an OLED device includes a package unit 100 including: an optical adhesive layer 110; an inorganic encapsulation layer 120 disposed on the optical adhesive layer 110; The encapsulation layer 130 is disposed on the inorganic encapsulation layer 120.
  • the inorganic encapsulation layer 120 may be an inorganic material that is Al 2 O 3 , TiO 2 , ZrO 2 , MgO, HfO 2 , Ta 2 O 5 , Si 3 N 4 , AlN, SiN, SiNO, A combination of one or more of SiO, SiO 2 , SiO x , SiC, and ITO is formed.
  • the first encapsulation layer may be an organic material, which is PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PC (polycarbonate), PI (polyimide), PVC (polyvinyl chloride), PS (polystyrene), PMMA (polymethyl methacrylate), PBT (polybutylene terephthalate), PSO (polysulfone) , PES (poly(p-phenylene sulfone), PE (polyethylene), PP (polypropylene), silicone (polysiloxane), PA (polyamide), PVDF (polyvinylidene fluoride), EVA (ethylene -vinyl acetate copolymer), EVAL (ethylene-vinyl alcohol copolymer), PAN (polypropylene cyanide), PVAc (polyvinyl acetate), Parylene (poly(phenylene)), Polyurea (polyurea),
  • FIG. 4 is a graph of stress and strain curves of the package structure shown in FIG.
  • the abscissa is the stress strain Axial Strain
  • the ordinate is the distance z from the center layer.
  • the stress strain Axial Strain of the package structure shown in FIG. 3 ranges from -1 to 1, the maximum value reaches 1 and the minimum value reaches -1, and the stress strain Axial Strain has three positions at zero. .
  • the range of the stress strain Axial Strain is reduced, and the absolute value of the maximum or minimum value of the stress strain Axial Strain is reduced, so that the inorganic encapsulation layer 120 in the package structure shown in FIG. 3 is less prone to cracking during the bending process ( Crack).
  • FIG. 5 is a schematic structural view of a display device according to an embodiment of the present invention.
  • a display device includes: a substrate 200; an OLED device 300 disposed on the substrate 200; and a package structure shown in FIG. 3, the package structure includes a package unit 100, and the package unit includes: The adhesive layer 110 is disposed on the OLED device 300; the inorganic encapsulation layer 120 is disposed on the optical adhesive layer 110; and the organic encapsulation layer 130 is disposed on the inorganic encapsulation layer 120.
  • the substrate 200 may be, for example, a flexible substrate, but the invention is not limited thereto.
  • the OLED device 300 includes a bottom electrode 310, a hole injection layer 320, a hole transport layer 330, an organic light-emitting layer 340, an electron transport layer 350, an electron injection layer 360, and a top electrode 370 which are sequentially stacked on a substrate 200.
  • the bottom electrode 310 is typically provided as an anode.
  • the bottom electrode 310 is also a mirror.
  • the bottom electrode 310 may be made of a reflective metal and should be thin enough to have a partial transmittance at the wavelength of the emitted light, which is said to be translucent, or bottom.
  • the electrode 310 may be made of a transparent metal oxide such as indium tin oxide or zinc tin oxide.
  • the bottom electrode 370 can be made of a reflective metal and should be thick enough to be substantially opaque and to be a full mirror.
  • the top electrode 370 is typically provided as a cathode.
  • the top electrode 370 is also a mirror.
  • the top electrode 370 may be made of a reflective metal and should be thin enough to have a partial transmittance at the wavelength of the emitted light, which is said to be translucent, or
  • the top electrode 370 may be made of a transparent metal oxide such as indium tin oxide or zinc tin oxide.
  • the top electrode 370 can be made of a reflective metal and should be thick enough to be substantially opaque and to be a full mirror.
  • a package structure for packaging an OLED device includes three package units 100, which are stacked.
  • Each package unit 100 includes an optical adhesive layer 110, an inorganic encapsulation layer 120 disposed on the optical adhesive layer 110, and an organic encapsulation layer 130 disposed on the inorganic encapsulation layer 120. After the three package units 100 are stacked, in the two adjacent package units 100, the optical adhesive layer 110 of the package unit 100 located above is disposed on the organic package layer 130 of the package unit 100 located below.
  • FIG. 7 is a schematic structural view of a display device according to another embodiment of the present invention.
  • a display device includes: a substrate 200; an OLED device 300 disposed on the substrate 200; and a package structure shown in FIG. 6 , the package structure includes three package units 100 , Each of the package units 100 includes an optical adhesive layer 110, an inorganic encapsulation layer 120 disposed on the optical adhesive layer 110, and an organic encapsulation layer 130 disposed on the inorganic encapsulation layer 120.
  • the optical adhesive layer 110 of the lowermost package unit 100 is disposed on the OLED device 300.
  • the substrate 200 may be, for example, a flexible substrate, but the invention is not limited thereto.
  • the OLED device 300 can refer to the structure of the OLED device in FIG. 5, and details are not described herein again.
  • the package structure for packaging the OLED device may include two, four or more package units 100 disposed in a stack, wherein in the adjacent two package units 100, located above The optical adhesive layer 110 of the package unit 100 is disposed on the organic encapsulation layer 130 of the package unit 100 located below.
  • the stress strain of the inorganic encapsulation layer during bending is reduced, thereby reducing the risk of cracking of the inorganic encapsulation layer.
  • the outermost barrier layer is saved, the thickness of the package structure can be reduced, and the device is thinned.

Abstract

Disclosed in the present invention is a packaging structure for packaging an OLED device. The packaging structure comprises a packaging unit. The packaging unit comprises: an optical adhesive layer; an inorganic packaging layer disposed on the optical adhesive layer; and an organic packaging layer disposed on the inorganic packaging layer. According to the present invention, the introduction of the optical adhesive layer into the packaging structure reduces the axial strain of the inorganic packaging layer during bending, thereby reducing the crack risk of the inorganic packaging layer. In addition, compared with the prior art, in the present packaging structure, a barrier layer on the outermost layer is omitted, so as to reduce the thickness of the packaging structure, thereby thinning the device.

Description

用于封装OLED器件的封装结构、显示装置Package structure, display device for packaging OLED device 技术领域Technical field
本发明属于有机发光显示技术领域，具体地讲，涉及一种用于封装OLED器件的封装结构、显示装置。The present invention belongs to the field of organic light emitting display technologies, and in particular, to a package structure and a display device for packaging an OLED device.
背景技术Background technique
近年来，有机发光二极管(Organic Light-Emitting Diode，OLED)显示装置成为国内外非常热门的新兴平面显示装置产品，这是因为OLED显示装置具有自发光、广视角、短反应时间、高发光效率、广色域、低工作电压、薄厚度、可制作大尺寸与可挠曲的面板及制程简单等特性，而且它还具有低成本的潜力。In recent years, Organic Light-Emitting Diode (OLED) display devices have become very popular emerging flat display devices at home and abroad, because OLED display devices have self-luminous, wide viewing angle, short reaction time, high luminous efficiency, Wide color gamut, low operating voltage, thin thickness, large size and flexible panels and simple process, and low cost potential.
在OLED器件的制造过程中，金属电极和有机发光层对水汽和氧气非常敏感，氧气会对金属电极造成氧化，而水汽会造成有机发光层的氧化及结晶化，从而造成发光领域缩小的像素缩小(Pixel Shrinkage)现象和发光领域内暗点(dark spot)的产生。在现有的OLED器件的封装中，通常采用薄膜封装的方法来隔绝水汽和氧气，图1是现有的一种封装OLED器件的封装结构的示意图。如图1所示，封装结构无机封装层11、有机封装层12、无机封装层13和阻挡层14。图2是图1所示的封装结构的膜层应力应变的曲线图。在图2中，横坐标为应力应变Axial Strain，纵坐标为距离中心层的距离z。如图2所示，图1所示的封装结构的应力应变Axial Strain的范围在-2.5～2.5之间，最大值达到2.5且最小值达到-2.5，并且应力应变Axial Strain为0的位置只有一处，即中心层所在位置，这样的封装结构中的无机封装层11、13在弯折过程中很容易发生破裂(crack)，从而失去封装效果。另外阻挡层14的厚度一般在几十微米到几百微米之间，这样也增加了整个OLED器件的厚度。In the manufacturing process of OLED devices, the metal electrode and the organic light-emitting layer are very sensitive to water vapor and oxygen, and the oxygen will cause oxidation of the metal electrode, and the water vapor will cause oxidation and crystallization of the organic light-emitting layer, thereby causing the pixel reduction in the light-emitting field to shrink. (Pixel Shrinkage) phenomenon and the generation of dark spots in the field of illumination. In the packaging of existing OLED devices, a thin film encapsulation method is generally used to isolate water vapor and oxygen. FIG. 1 is a schematic diagram of a conventional package structure for packaging an OLED device. As shown in FIG. 1, the package structure inorganic encapsulation layer 11, organic encapsulation layer 12, inorganic encapsulation layer 13 and barrier layer 14 are provided. 2 is a graph of stress and strain of a film layer of the package structure shown in FIG. 1. In Fig. 2, the abscissa is the stress strain Axial Strain, and the ordinate is the distance z from the center layer. As shown in FIG. 2, the stress strain Axial Strain of the package structure shown in FIG. 1 ranges from -2.5 to 2.5, the maximum value reaches 2.5 and the minimum value reaches -2.5, and the stress strain Axial Strain has a position of 0. At the location where the center layer is located, the inorganic encapsulation layers 11, 13 in such a package structure are prone to cracking during the bending process, thereby losing the encapsulation effect. Further, the thickness of the barrier layer 14 is generally between several tens of micrometers and several hundred micrometers, which also increases the thickness of the entire OLED device.
发明内容Summary of the invention
为了解决上述现有技术存在的问题，本发明的目的在于提供一种降低无机 封装层破裂风险的一种用于封装OLED器件的封装结构、显示装置。In order to solve the above problems in the prior art, it is an object of the present invention to provide a package structure and display device for packaging an OLED device, which reduces the risk of cracking of the inorganic package layer.
根据本发明的一方面，提供了一种用于封装OLED器件的封装结构，所述封装结构包括封装单元，所述封装单元包括：光学胶层；无机封装层，设置于所述光学胶层上；有机封装层，设置于所述无机封装层上。According to an aspect of the present invention, a package structure for packaging an OLED device is provided, the package structure including a package unit, the package unit includes: an optical adhesive layer; and an inorganic encapsulation layer disposed on the optical adhesive layer An organic encapsulation layer disposed on the inorganic encapsulation layer.
进一步地，所述封装单元的数量为三个，三个封装单元叠层设置；在相邻的两个封装单元中，位于上方的封装单元的光学胶层设置于位于下方的封装单元的有机封装层上。Further, the number of the packaging units is three, and three packaging units are stacked; in the two adjacent packaging units, the optical adhesive layer of the upper packaging unit is disposed in the organic packaging of the packaging unit located below On the floor.
根据本发明的另一方面，还提供了一种显示装置，其包括：基板；设置于所述基板上的OLED器件；封装结构，设置于所述OLED器件上以封装所述OLED器件，所述封装结构包括封装单元，所述封装单元包括：光学胶层，设置于所述OLED器件上；无机封装层，设置于所述光学胶层上；有机封装层，设置于所述无机封装层上。According to another aspect of the present invention, a display device includes: a substrate; an OLED device disposed on the substrate; a package structure disposed on the OLED device to package the OLED device, The package structure includes a package unit, and the package unit includes an optical adhesive layer disposed on the OLED device, an inorganic encapsulation layer disposed on the optical adhesive layer, and an organic encapsulation layer disposed on the inorganic encapsulation layer.
进一步地，所述封装单元的数量为三个，三个封装单元叠层设置，位于最下方的封装单元的光学胶层设置于所述OLED器件上；在相邻的两个封装单元中，位于上方的封装单元的光学胶层设置于位于下方的封装单元的有机封装层上。Further, the number of the packaging units is three, three package units are stacked, and the optical glue layer of the lowermost package unit is disposed on the OLED device; in two adjacent package units, The optical adhesive layer of the upper package unit is disposed on the organic encapsulation layer of the package unit located below.
进一步地，所述OLED器件包括在所述基板上依序叠层设置的底电极、空穴注入层、空穴传输层、有机发光层、电子传输层、电子注入层以及顶电极。Further, the OLED device includes a bottom electrode, a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, an electron injection layer, and a top electrode which are sequentially stacked on the substrate.
进一步地，所述底电极和所述顶电极中的一个是透明的或半透明的，所述底电极和所述顶电极中的另一个是不透明且反射光的。Further, one of the bottom electrode and the top electrode is transparent or translucent, and the other of the bottom electrode and the top electrode is opaque and reflects light.
进一步地，所述无机封装层采用Al 2O 3、TiO 2、ZrO 2、MgO、HfO 2、Ta 2O 5、Si 3N 4、AlN、SiN、SiNO、SiO、SiO 2、SiO x、SiC和ITO中的一种或几种的组合制作形成。 Further, the inorganic encapsulating layer is made of Al 2 O 3 , TiO 2 , ZrO 2 , MgO, HfO 2 , Ta 2 O 5 , Si 3 N 4 , AlN, SiN, SiNO, SiO, SiO 2 , SiO x , SiC. It is formed by combining one or several of ITO.
进一步地，所述有机封装层采用聚对苯二甲酸乙二酯、聚萘二甲酸乙二醇酯、聚碳酸酯、聚酰亚胺、聚氯乙烯、聚苯乙烯、聚甲基丙烯酸甲酯、聚对苯二甲酸丁二醇酯、聚砜、聚对苯二乙基砜、聚乙烯、聚丙烯、聚硅氧烷、聚酰胺、聚偏二氟乙烯、乙烯-醋酸乙烯共聚物、乙烯-乙烯醇共聚物、聚丙烯氰、 聚乙酸乙烯酯、聚对二甲苯基、聚脲、聚四氟乙烯和环氧树脂中的一种或几种的组合制作形成。Further, the organic encapsulating layer is made of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyvinyl chloride, polystyrene, polymethyl methacrylate. , polybutylene terephthalate, polysulfone, polyparaphenylene sulfone, polyethylene, polypropylene, polysiloxane, polyamide, polyvinylidene fluoride, ethylene-vinyl acetate copolymer, ethylene A combination of one or more of a vinyl alcohol copolymer, a polyacrylonitrile, a polyvinyl acetate, a parylene, a polyurea, a polytetrafluoroethylene, and an epoxy resin.
本发明的有益效果：本发明通过在封装结构中引入光学胶层，减小无机封装层在弯折时的应力应变，从而降低了无机封装层的破裂风险。此外，与现有技术相比，本发明的封装结构节省了最外层的阻挡层，可以降低封装结构的厚度，有利于器件薄型化。The invention has the beneficial effects that the invention reduces the stress strain of the inorganic encapsulation layer during bending by introducing an optical adhesive layer into the package structure, thereby reducing the risk of cracking of the inorganic encapsulation layer. In addition, compared with the prior art, the package structure of the present invention saves the outermost barrier layer, can reduce the thickness of the package structure, and is advantageous for thinning the device.
附图说明DRAWINGS
通过结合附图进行的以下描述，本发明的实施例的上述和其它方面、特点和优点将变得更加清楚，附图中：The above and other aspects, features and advantages of the embodiments of the present invention will become more apparent from
图1是现有的一种封装OLED器件的封装结构的示意图；1 is a schematic view of a conventional package structure for packaging an OLED device;
图2是图1所示的封装结构的膜层应力应变的曲线图；2 is a graph showing stress and strain of a film layer of the package structure shown in FIG. 1;
图3是根据本发明的实施例的用于封装OLED器件的封装结构的示意图；3 is a schematic diagram of a package structure for packaging an OLED device in accordance with an embodiment of the present invention;
图4是图3所示的封装结构的应力应变曲线图；4 is a stress-strain curve diagram of the package structure shown in FIG. 3;
图5是根据本发明的实施例的显示装置的结构示意图；FIG. 5 is a schematic structural diagram of a display device according to an embodiment of the present invention; FIG.
图6是根据本发明的另一实施例的用于封装OLED器件的封装结构的示意图；6 is a schematic diagram of a package structure for packaging an OLED device in accordance with another embodiment of the present invention;
图7是根据本发明的另一实施例的显示装置的结构示意图。FIG. 7 is a schematic structural view of a display device according to another embodiment of the present invention.
具体实施方式Detailed ways
以下，将参照附图来详细描述本发明的实施例。然而，可以以许多不同的形式来实施本发明，并且本发明不应该被解释为限制于这里阐述的具体实施例。相反，提供这些实施例是为了解释本发明的原理及其实际应用，从而使本领域的其他技术人员能够理解本发明的各种实施例和适合于特定预期应用的各种修改。Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the invention may be embodied in many different forms and the invention should not be construed as being limited to the specific embodiments set forth herein. Rather, these embodiments are provided to explain the principles of the invention and the application of the invention, and the various embodiments of the invention can be understood.
在附图中，为了清楚起见，夸大了层和区域的厚度。相同的标号在整个说明书和附图中表示相同的元器件。In the drawings, the thickness of layers and regions are exaggerated for clarity. The same reference numerals are used throughout the drawings and the drawings.
图3是根据本发明的实施例的用于封装OLED器件的封装结构的示意图。3 is a schematic diagram of a package structure for packaging an OLED device, in accordance with an embodiment of the present invention.
参照图3，根据本发明的实施例的用于封装OLED器件的封装结构包括一个封装单元100，该封装单元100包括：光学胶层110；无机封装层120，设置于光学胶层110上；有机封装层130，设置于无机封装层120上。Referring to FIG. 3, a package structure for packaging an OLED device according to an embodiment of the present invention includes a package unit 100 including: an optical adhesive layer 110; an inorganic encapsulation layer 120 disposed on the optical adhesive layer 110; The encapsulation layer 130 is disposed on the inorganic encapsulation layer 120.
在一些示例中，无机封装层120可以采用无机材料，该无机材料为Al 2O 3、TiO 2、ZrO 2、MgO、HfO 2、Ta 2O 5、Si 3N 4、AlN、SiN、SiNO、SiO、SiO 2、SiO x、SiC和ITO中的一种或几种的组合制作形成。 In some examples, the inorganic encapsulation layer 120 may be an inorganic material that is Al 2 O 3 , TiO 2 , ZrO 2 , MgO, HfO 2 , Ta 2 O 5 , Si 3 N 4 , AlN, SiN, SiNO, A combination of one or more of SiO, SiO 2 , SiO x , SiC, and ITO is formed.
在一些示例中，该第一封装层可以采用有机材料，该有机材料为PET(聚对苯二甲酸乙二酯)、PEN(聚萘二甲酸乙二醇酯)、PC(聚碳酸酯)、PI(聚酰亚胺)、PVC(聚氯乙烯)、PS(聚苯乙烯)、PMMA(聚甲基丙烯酸甲酯)、PBT(聚对苯二甲酸丁二醇酯)、PSO(聚砜)、PES(聚对苯二乙基砜)、PE(聚乙烯)、PP(聚丙烯)、silicone(聚硅氧烷)、PA(聚酰胺)、PVDF(聚偏二氟乙烯)、EVA(乙烯-醋酸乙烯共聚物)、EVAL(乙烯-乙烯醇共聚物)、PAN(聚丙烯氰)、PVAc(聚乙酸乙烯酯)、Parylene(聚对二甲苯基)、Polyurea(聚脲)、PTFE(聚四氟乙烯)和epoxy resin(环氧树脂)中的一种或几种的组合。In some examples, the first encapsulation layer may be an organic material, which is PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PC (polycarbonate), PI (polyimide), PVC (polyvinyl chloride), PS (polystyrene), PMMA (polymethyl methacrylate), PBT (polybutylene terephthalate), PSO (polysulfone) , PES (poly(p-phenylene sulfone), PE (polyethylene), PP (polypropylene), silicone (polysiloxane), PA (polyamide), PVDF (polyvinylidene fluoride), EVA (ethylene -vinyl acetate copolymer), EVAL (ethylene-vinyl alcohol copolymer), PAN (polypropylene cyanide), PVAc (polyvinyl acetate), Parylene (poly(phenylene)), Polyurea (polyurea), PTFE (poly A combination of one or more of tetrafluoroethylene) and epoxy resin.
图4是图3所示的封装结构的应力应变曲线图。在图4中，横坐标为应力应变Axial Strain，纵坐标为距离中心层的距离z。4 is a graph of stress and strain curves of the package structure shown in FIG. In Fig. 4, the abscissa is the stress strain Axial Strain, and the ordinate is the distance z from the center layer.
如图4所示，图3所示的封装结构的应力应变Axial Strain的范围在-1～1之间，最大值达到1且最小值达到-1，并且应力应变Axial Strain为0的位置有三处。应力应变Axial Strain的范围被缩小，应力应变Axial Strain的最大值或者最小值的绝对值被减小，从而图3所示的封装结构中的无机封装层120在弯折过程中不容易发生破裂(crack)。As shown in FIG. 4, the stress strain Axial Strain of the package structure shown in FIG. 3 ranges from -1 to 1, the maximum value reaches 1 and the minimum value reaches -1, and the stress strain Axial Strain has three positions at zero. . The range of the stress strain Axial Strain is reduced, and the absolute value of the maximum or minimum value of the stress strain Axial Strain is reduced, so that the inorganic encapsulation layer 120 in the package structure shown in FIG. 3 is less prone to cracking during the bending process ( Crack).
图5是根据本发明的实施例的显示装置的结构示意图。FIG. 5 is a schematic structural view of a display device according to an embodiment of the present invention.
参照图5，根据本发明的实施例的显示装置包括：基板200；OLED器件300，设置于基板200上；图3所示的封装结构，该封装结构包括封装单元100，该封装单元包括：光学胶层110，设置于OLED器件300上；无机封装层120，设置于光学胶层110上；有机封装层130，设置于无机封装层120上。Referring to FIG. 5, a display device according to an embodiment of the present invention includes: a substrate 200; an OLED device 300 disposed on the substrate 200; and a package structure shown in FIG. 3, the package structure includes a package unit 100, and the package unit includes: The adhesive layer 110 is disposed on the OLED device 300; the inorganic encapsulation layer 120 is disposed on the optical adhesive layer 110; and the organic encapsulation layer 130 is disposed on the inorganic encapsulation layer 120.
基板200可例如是柔性基板，但本发明并不限制于此。OLED器件300包括在基板200上依序叠层设置的底电极310、空穴注入层320、空穴传输层330、有机发光层340、电子传输层350、电子注入层360以及顶电极370。The substrate 200 may be, for example, a flexible substrate, but the invention is not limited thereto. The OLED device 300 includes a bottom electrode 310, a hole injection layer 320, a hole transport layer 330, an organic light-emitting layer 340, an electron transport layer 350, an electron injection layer 360, and a top electrode 370 which are sequentially stacked on a substrate 200.
底电极310通常被设置为阳极。底电极310也是反光镜。当通过基板200观察OLED器件300发光时，底电极310可以由反射性金属制成，并且应该足够薄以便在发射光的波长下具有部分透光率，这被称为是半透明的，或者底电极310可以由透明的金属氧化物制成，诸如氧化铟锡或氧化锌锡等。当通过顶电极370观察OLED器件300发光时，底电极370可以由反射性金属制成，并且应该足够厚，以使其基本上是不透光的且是全反光镜。The bottom electrode 310 is typically provided as an anode. The bottom electrode 310 is also a mirror. When the OLED device 300 is illuminated by the substrate 200, the bottom electrode 310 may be made of a reflective metal and should be thin enough to have a partial transmittance at the wavelength of the emitted light, which is said to be translucent, or bottom. The electrode 310 may be made of a transparent metal oxide such as indium tin oxide or zinc tin oxide. When the OLED device 300 is illuminated by the top electrode 370, the bottom electrode 370 can be made of a reflective metal and should be thick enough to be substantially opaque and to be a full mirror.
顶电极370通常被设置为阴极。顶电极370也是反光镜。当通过顶电极370观察OLED器件300发光时，顶电极370可以由反射性金属制成，并且应该足够薄以便在发射光的波长下具有部分透光率，这被称为是半透明的，或者顶电极370可以由透明的金属氧化物制成，诸如氧化铟锡或氧化锌锡等。当通过基板310观察OLED器件300发光时，顶电极370可以由反射性金属制成，并且应该足够厚，以使其基本上是不透光的且是全反光镜。The top electrode 370 is typically provided as a cathode. The top electrode 370 is also a mirror. When the OLED device 300 is illuminated by the top electrode 370, the top electrode 370 may be made of a reflective metal and should be thin enough to have a partial transmittance at the wavelength of the emitted light, which is said to be translucent, or The top electrode 370 may be made of a transparent metal oxide such as indium tin oxide or zinc tin oxide. When the OLED device 300 is illuminated by the substrate 310, the top electrode 370 can be made of a reflective metal and should be thick enough to be substantially opaque and to be a full mirror.
图6是根据本发明的另一实施例的用于封装OLED器件的封装结构的示意图。参照图6，根据本发明的另一实施例的用于封装OLED器件的封装结构包括三个封装单元100，这三个封装单元100叠层设置。6 is a schematic diagram of a package structure for packaging an OLED device in accordance with another embodiment of the present invention. Referring to FIG. 6, a package structure for packaging an OLED device according to another embodiment of the present invention includes three package units 100, which are stacked.
每个封装单元100包括：光学胶层110；无机封装层120，设置于光学胶层110上；有机封装层130，设置于无机封装层120上。当三个封装单元100叠层设置之后，在相邻的两个封装单元100中，位于上方的封装单元100的光学胶层110设置于位于下方的封装单元100的有机封装层130上。Each package unit 100 includes an optical adhesive layer 110, an inorganic encapsulation layer 120 disposed on the optical adhesive layer 110, and an organic encapsulation layer 130 disposed on the inorganic encapsulation layer 120. After the three package units 100 are stacked, in the two adjacent package units 100, the optical adhesive layer 110 of the package unit 100 located above is disposed on the organic package layer 130 of the package unit 100 located below.
图7是根据本发明的另一实施例的显示装置的结构示意图。FIG. 7 is a schematic structural view of a display device according to another embodiment of the present invention.
参照图7，根据本发明的另一实施例的显示装置包括：基板200；OLED器件300，设置于基板200上；图6所示的封装结构，该封装结构包括三个封装单元100，这三个封装单元100叠层设置，每个封装单元100包括：光学胶层110，无机封装层120，设置于光学胶层110上；有机封装层130，设置于无机封装层120上。其中，最下方的封装单元100的光学胶层110设置于OLED 器件300上。Referring to FIG. 7 , a display device according to another embodiment of the present invention includes: a substrate 200; an OLED device 300 disposed on the substrate 200; and a package structure shown in FIG. 6 , the package structure includes three package units 100 , Each of the package units 100 includes an optical adhesive layer 110, an inorganic encapsulation layer 120 disposed on the optical adhesive layer 110, and an organic encapsulation layer 130 disposed on the inorganic encapsulation layer 120. The optical adhesive layer 110 of the lowermost package unit 100 is disposed on the OLED device 300.
基板200可例如是柔性基板，但本发明并不限制于此。OLED器件300可以参照图5中的OLED器件的结构，在此不再赘述。The substrate 200 may be, for example, a flexible substrate, but the invention is not limited thereto. The OLED device 300 can refer to the structure of the OLED device in FIG. 5, and details are not described herein again.
此外，作为其他的实施例，用于封装OLED器件的封装结构可以包括叠层设置的两个、四个或者更多个封装单元100，其中在相邻的两个封装单元100中，位于上方的封装单元100的光学胶层110设置于位于下方的封装单元100的有机封装层130上。Moreover, as other embodiments, the package structure for packaging the OLED device may include two, four or more package units 100 disposed in a stack, wherein in the adjacent two package units 100, located above The optical adhesive layer 110 of the package unit 100 is disposed on the organic encapsulation layer 130 of the package unit 100 located below.
综上所述，通过在封装结构中引入光学胶层，减小无机封装层在弯折时的应力应变，从而降低了无机封装层的破裂风险。此外，与现有技术相比，节省了最外层的阻挡层，可以降低封装结构的厚度，有利于器件薄型化。In summary, by introducing an optical adhesive layer into the package structure, the stress strain of the inorganic encapsulation layer during bending is reduced, thereby reducing the risk of cracking of the inorganic encapsulation layer. In addition, compared with the prior art, the outermost barrier layer is saved, the thickness of the package structure can be reduced, and the device is thinned.
虽然已经参照特定实施例示出并描述了本发明，但是本领域的技术人员将理解：在不脱离由权利要求及其等同物限定的本发明的精神和范围的情况下，可在此进行形式和细节上的各种变化。While the invention has been shown and described with respect to the specific embodiments the embodiments of the invention Various changes in details.

Claims (16)

  1. 一种用于封装OLED器件的封装结构，其中，所述封装结构包括封装单元，所述封装单元包括：光学胶层；无机封装层，设置于所述光学胶层上；有机封装层，设置于所述无机封装层上。A package structure for packaging an OLED device, wherein the package structure includes a package unit, the package unit includes: an optical adhesive layer; an inorganic encapsulation layer disposed on the optical adhesive layer; and an organic encapsulation layer disposed on On the inorganic encapsulation layer.
  2. 根据权利要求1所述的封装结构，其中，所述封装单元的数量为三个，三个封装单元叠层设置；在相邻的两个封装单元中，位于上方的封装单元的光学胶层设置于位于下方的封装单元的有机封装层上。The package structure according to claim 1, wherein the number of the package units is three, and the three package units are stacked; in the adjacent two package units, the optical layer of the package unit located above On the organic encapsulation layer of the package unit located below.
  3. 根据权利要求1所述的封装结构，其中，所述无机封装层采用Al 2O 3、TiO 2、ZrO 2、MgO、HfO 2、Ta 2O 5、Si 3N 4、AlN、SiN、SiNO、SiO、SiO 2、SiO x、SiC和ITO中的一种或几种的组合制作形成。 The package structure according to claim 1, wherein the inorganic encapsulation layer is made of Al 2 O 3 , TiO 2 , ZrO 2 , MgO, HfO 2 , Ta 2 O 5 , Si 3 N 4 , AlN, SiN, SiNO, A combination of one or more of SiO, SiO 2 , SiO x , SiC, and ITO is formed.
  4. 根据权利要求2所述的封装结构，其中，所述无机封装层采用Al 2O 3、TiO 2、ZrO 2、MgO、HfO 2、Ta 2O 5、Si 3N 4、AlN、SiN、SiNO、SiO、SiO 2、SiO x、SiC和ITO中的一种或几种的组合制作形成。 The package structure according to claim 2, wherein the inorganic encapsulation layer is made of Al 2 O 3 , TiO 2 , ZrO 2 , MgO, HfO 2 , Ta 2 O 5 , Si 3 N 4 , AlN, SiN, SiNO, A combination of one or more of SiO, SiO 2 , SiO x , SiC, and ITO is formed.
  5. 根据权利要求1所述的封装结构，其中，所述有机封装层采用聚对苯二甲酸乙二酯、聚萘二甲酸乙二醇酯、聚碳酸酯、聚酰亚胺、聚氯乙烯、聚苯乙烯、聚甲基丙烯酸甲酯、聚对苯二甲酸丁二醇酯、聚砜、聚对苯二乙基砜、聚乙烯、聚丙烯、聚硅氧烷、聚酰胺、聚偏二氟乙烯、乙烯-醋酸乙烯共聚物、乙烯-乙烯醇共聚物、聚丙烯氰、聚乙酸乙烯酯、聚对二甲苯基、聚脲、聚四氟乙烯和环氧树脂中的一种或几种的组合制作形成。The package structure according to claim 1, wherein the organic encapsulation layer comprises polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyvinyl chloride, poly Styrene, polymethyl methacrylate, polybutylene terephthalate, polysulfone, polyparaphenylene sulfone, polyethylene, polypropylene, polysiloxane, polyamide, polyvinylidene fluoride , a combination of ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, polyacrylonitrile, polyvinyl acetate, parylene, polyurea, polytetrafluoroethylene and epoxy resin Production formation.
  6. 根据权利要求2所述的封装结构，其中，所述有机封装层采用聚对苯二甲酸乙二酯、聚萘二甲酸乙二醇酯、聚碳酸酯、聚酰亚胺、聚氯乙烯、聚苯乙烯、聚甲基丙烯酸甲酯、聚对苯二甲酸丁二醇酯、聚砜、聚对苯二乙基砜、聚乙烯、聚丙烯、聚硅氧烷、聚酰胺、聚偏二氟乙烯、乙烯-醋酸乙烯共聚物、乙烯-乙烯醇共聚物、聚丙烯氰、聚乙酸乙烯酯、聚对二甲苯基、聚脲、聚四氟乙烯和环氧树脂中的一种或几种的组合制作形成。The package structure according to claim 2, wherein the organic encapsulation layer comprises polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyvinyl chloride, poly Styrene, polymethyl methacrylate, polybutylene terephthalate, polysulfone, polyparaphenylene sulfone, polyethylene, polypropylene, polysiloxane, polyamide, polyvinylidene fluoride , a combination of ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, polyacrylonitrile, polyvinyl acetate, parylene, polyurea, polytetrafluoroethylene and epoxy resin Production formation.
  7. 一种显示装置，其中，包括：A display device, comprising:
    基板；Substrate
    设置于所述基板上的OLED器件；An OLED device disposed on the substrate;
    封装结构，设置于所述OLED器件上以封装所述OLED器件，所述封装结构包括封装单元，所述封装单元包括：光学胶层，设置于所述OLED器件上；无机封装层，设置于所述光学胶层上；有机封装层，设置于所述无机封装层上。a package structure is disposed on the OLED device to package the OLED device, the package structure includes a package unit, the package unit includes: an optical adhesive layer disposed on the OLED device; and an inorganic encapsulation layer disposed at the On the optical adhesive layer; an organic encapsulation layer is disposed on the inorganic encapsulation layer.
  8. 根据权利要求7所述的显示装置，其中，所述封装单元的数量为三个，三个封装单元叠层设置，位于最下方的封装单元的光学胶层设置于所述OLED器件上；在相邻的两个封装单元中，位于上方的封装单元的光学胶层设置于位于下方的封装单元的有机封装层上。The display device according to claim 7, wherein the number of the packaging units is three, three packaging unit stacks are disposed, and an optical adhesive layer of the lowermost packaging unit is disposed on the OLED device; In the two adjacent package units, the optical adhesive layer of the upper package unit is disposed on the organic package layer of the package unit located below.
  9. 根据权利要求7所述的显示装置，其中，所述OLED器件包括在所述基板上依序叠层设置的底电极、空穴注入层、空穴传输层、有机发光层、电子传输层、电子注入层以及顶电极。The display device according to claim 7, wherein the OLED device comprises a bottom electrode, a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, and an electron layer which are sequentially laminated on the substrate. The injection layer and the top electrode.
  10. 根据权利要求8所述的显示装置，其中，所述OLED器件包括在所述基板上依序叠层设置的底电极、空穴注入层、空穴传输层、有机发光层、电子传输层、电子注入层以及顶电极。The display device according to claim 8, wherein the OLED device comprises a bottom electrode, a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, and an electron layer which are sequentially laminated on the substrate The injection layer and the top electrode.
  11. 根据权利要求9所述的显示装置，其中，所述底电极和所述顶电极中的一个是透明的或半透明的，所述底电极和所述顶电极中的另一个是不透明且反射光的。The display device according to claim 9, wherein one of the bottom electrode and the top electrode is transparent or translucent, and the other of the bottom electrode and the top electrode is opaque and reflects light of.
  12. 根据权利要求10所述的显示装置，其中，所述底电极和所述顶电极中的一个是透明的或半透明的，所述底电极和所述顶电极中的另一个是不透明且反射光的。The display device according to claim 10, wherein one of said bottom electrode and said top electrode is transparent or translucent, and the other of said bottom electrode and said top electrode is opaque and reflects light of.
  13. 根据权利要求7所述的显示装置，其中，所述无机封装层采用Al 2O 3、TiO 2、ZrO 2、MgO、HfO 2、Ta 2O 5、Si 3N 4、AlN、SiN、SiNO、SiO、SiO 2、SiO x、SiC和ITO中的一种或几种的组合制作形成。 The display device according to claim 7, wherein the inorganic encapsulating layer is made of Al 2 O 3 , TiO 2 , ZrO 2 , MgO, HfO 2 , Ta 2 O 5 , Si 3 N 4 , AlN, SiN, SiNO, A combination of one or more of SiO, SiO 2 , SiO x , SiC, and ITO is formed.
  14. 根据权利要求8所述的显示装置，其中，所述无机封装层采用Al 2O 3、TiO 2、ZrO 2、MgO、HfO 2、Ta 2O 5、Si 3N 4、AlN、SiN、SiNO、SiO、SiO 2、SiO x、 SiC和ITO中的一种或几种的组合制作形成。 The display device according to claim 8, wherein the inorganic encapsulating layer is made of Al 2 O 3 , TiO 2 , ZrO 2 , MgO, HfO 2 , Ta 2 O 5 , Si 3 N 4 , AlN, SiN, SiNO, A combination of one or more of SiO, SiO 2 , SiO x , SiC, and ITO is formed.
  15. 根据权利要求7所述的显示装置，其中，所述有机封装层采用聚对苯二甲酸乙二酯、聚萘二甲酸乙二醇酯、聚碳酸酯、聚酰亚胺、聚氯乙烯、聚苯乙烯、聚甲基丙烯酸甲酯、聚对苯二甲酸丁二醇酯、聚砜、聚对苯二乙基砜、聚乙烯、聚丙烯、聚硅氧烷、聚酰胺、聚偏二氟乙烯、乙烯-醋酸乙烯共聚物、乙烯-乙烯醇共聚物、聚丙烯氰、聚乙酸乙烯酯、聚对二甲苯基、聚脲、聚四氟乙烯和环氧树脂中的一种或几种的组合制作形成。The display device according to claim 7, wherein the organic encapsulating layer is made of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyvinyl chloride, poly Styrene, polymethyl methacrylate, polybutylene terephthalate, polysulfone, polyparaphenylene sulfone, polyethylene, polypropylene, polysiloxane, polyamide, polyvinylidene fluoride , a combination of ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, polyacrylonitrile, polyvinyl acetate, parylene, polyurea, polytetrafluoroethylene and epoxy resin Production formation.
  16. 根据权利要求8所述的显示装置，其中，所述有机封装层采用聚对苯二甲酸乙二酯、聚萘二甲酸乙二醇酯、聚碳酸酯、聚酰亚胺、聚氯乙烯、聚苯乙烯、聚甲基丙烯酸甲酯、聚对苯二甲酸丁二醇酯、聚砜、聚对苯二乙基砜、聚乙烯、聚丙烯、聚硅氧烷、聚酰胺、聚偏二氟乙烯、乙烯-醋酸乙烯共聚物、乙烯-乙烯醇共聚物、聚丙烯氰、聚乙酸乙烯酯、聚对二甲苯基、聚脲、聚四氟乙烯和环氧树脂中的一种或几种的组合制作形成。The display device according to claim 8, wherein the organic encapsulating layer is made of polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyvinyl chloride, poly Styrene, polymethyl methacrylate, polybutylene terephthalate, polysulfone, polyparaphenylene sulfone, polyethylene, polypropylene, polysiloxane, polyamide, polyvinylidene fluoride , a combination of ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, polyacrylonitrile, polyvinyl acetate, parylene, polyurea, polytetrafluoroethylene and epoxy resin Production formation.
PCT/CN2018/074039 2017-11-28 2018-01-24 Packaging structure for packaging oled device, and display device WO2019104859A1 (en)

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