CN109065744B - OLED display panel and packaging method thereof - Google Patents

OLED display panel and packaging method thereof Download PDF

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CN109065744B
CN109065744B CN201810749501.8A CN201810749501A CN109065744B CN 109065744 B CN109065744 B CN 109065744B CN 201810749501 A CN201810749501 A CN 201810749501A CN 109065744 B CN109065744 B CN 109065744B
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methyl methacrylate
packaging layer
isopropyl acrylamide
inorganic
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CN109065744A (en
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李朝
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to PCT/CN2018/115794 priority patent/WO2020010772A1/en
Priority to US16/334,372 priority patent/US11145842B2/en
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
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Abstract

The invention provides an OLED display panel and an encapsulation method thereof, wherein the OLED display panel comprises: a substrate base plate; the thin film transistor layer is prepared on the substrate base plate; the OLED light-emitting layer is prepared on the thin film transistor layer; the thin film packaging layer is prepared on the OLED light-emitting layer and used for wrapping the OLED light-emitting layer; the thin film packaging layer comprises an inorganic packaging layer and an organic packaging layer which are stacked; the material for forming the organic packaging layer is methyl methacrylate-N-isopropyl acrylamide copolymer solution, and the methyl methacrylate-N-isopropyl acrylamide copolymer solution is spread on the surface of the inorganic packaging layer and is used for forming the organic packaging layer after being cured.

Description

OLED display panel and packaging method thereof
Technical Field
The invention relates to the technical field of display, in particular to an OLED display panel and an encapsulating method thereof.
Background
In recent years, the development of Organic Light Emitting Diode (OLED) display technology has been advanced, and OLED products have drawn more and more attention and applications due to their advantages of lightness, thinness, fast response, wide viewing angle, high contrast, flexibility, and the like, and are mainly applied to the display fields of mobile phones, flat panels, televisions, and the like.
The OLED display panel comprises a substrate layer, a thin film transistor layer, an OLED light emitting layer, a first inorganic packaging layer, an organic packaging layer, a second inorganic packaging layer and the like from bottom to top. Wherein the organic encapsulation layer mainly plays a role in planarization and blocking water and oxygen transmission. Generally, an organic encapsulation layer is prepared by an IJP (ink jet printing) method, that is, ink is dropped and printed on the first inorganic encapsulation layer, and the ink is cured after being leveled to form the organic encapsulation layer. PMMA (polymethyl methacrylate, also known as organic glass) is widely selected as the material of the organic encapsulation layer due to its high transparency and certain water absorption. However, since the first inorganic encapsulation layer is hydrophilic and the monomer MMA of the organic encapsulation layer PMMA is hydrophobic, when the organic encapsulation layer is prepared, the ink droplets are difficult to level on the first inorganic encapsulation layer and aggregate into a plurality of ink droplets, and the prepared organic encapsulation layer may form through holes, so that external impurities such as water and oxygen are easy to intrude into the OLED panel from the holes, and the OLED device is oxidized to cause performance reduction such as lifetime.
Therefore, it is necessary to provide an OLED display panel and a method for packaging the same to solve the problems of the prior art.
Disclosure of Invention
The invention provides an OLED display panel and an encapsulation method thereof, which can reduce the hollow holes in an organic encapsulation layer, enhance the water and oxygen blocking capability of the organic encapsulation layer, reduce the risk of oxidation of devices in the OLED display panel and prolong the service life of OLED devices.
In order to solve the above problems, the technical scheme provided by the invention is as follows:
the present invention provides an OLED display panel including:
a substrate base plate;
the thin film transistor layer is prepared on the substrate base plate;
the OLED light-emitting layer is prepared on the thin film transistor layer;
the thin film packaging layer is prepared on the OLED light-emitting layer and used for wrapping the OLED light-emitting layer;
the thin film packaging layer comprises an inorganic packaging layer and an organic packaging layer which are stacked;
the material for forming the organic packaging layer is methyl methacrylate-N-isopropyl acrylamide copolymer solution, and the methyl methacrylate-N-isopropyl acrylamide copolymer solution is spread on the surface of the inorganic packaging layer and is used for forming the organic packaging layer after being cured.
According to a preferred embodiment of the present invention, the methyl methacrylate-N-isopropylacrylamide copolymer solution is formed by irradiating a mixture of methyl methacrylate, N-isopropylacrylamide and a photopolymerization initiator with light.
According to a preferred embodiment of the present invention, the methyl methacrylate, the N-isopropylacrylamide and the photopolymerization initiator are mixed in a predetermined ratio to form the mixed solution, and the mass concentration of the N-isopropylacrylamide in the mixed solution is in a range of 0.05% to 20%.
According to a preferred embodiment of the present invention, the methyl methacrylate-N-isopropylacrylamide copolymer contained in the methyl methacrylate-N-isopropylacrylamide copolymer solution has a hydrophilic end and a hydrophobic end, and the methyl methacrylate-N-isopropylacrylamide copolymer is distributed such that the hydrophilic end is close to the inorganic encapsulation layer and the hydrophobic end is far away from the inorganic encapsulation layer.
According to a preferred embodiment of the present invention, the methyl methacrylate-N-isopropylacrylamide copolymer is a copolymer formed from polymethyl methacrylate and poly N-isopropylacrylamide.
According to a preferred embodiment of the present invention, the thickness of the organic encapsulation layer is uniform at different positions.
The invention also provides an encapsulation method of the OLED display panel, which comprises the following steps:
step S10, providing an OLED display panel to be packaged, and preparing an inorganic packaging layer on the OLED display panel;
step S20, forming a layer of mixed liquid containing methyl methacrylate, N-isopropyl acrylamide and a photopolymerization initiator on the surface of the inorganic packaging layer;
step S30, performing a curing process, namely firstly, irradiating the mixed solution to form a methyl methacrylate-N-isopropyl acrylamide copolymer solution, so that the methyl methacrylate-N-isopropyl acrylamide copolymer solution is spread on the surface of the inorganic packaging layer, and forming an organic packaging layer after curing;
and step S40, forming a layer of inorganic packaging layer on the surface of the organic packaging layer.
According to a preferred embodiment of the present invention, the step S20 specifically includes the following steps:
step S201, mixing the methyl methacrylate, the N-isopropylacrylamide and the photopolymerization initiator according to a preset ratio to form the mixed solution;
step S202, forming the mixed liquid on the surface of the inorganic packaging layer in an ink-jet printing mode.
According to a preferred embodiment of the present invention, the mass concentration of the N-isopropylacrylamide in the mixed solution is in a range of 0.05% to 20%.
According to a preferred embodiment of the present invention, the step S30 specifically includes the following steps:
step S301, the N-isopropylacrylamide in the mixed solution has hydrophilicity and moves to the surface of the inorganic packaging layer to be spread;
step S302, under the action of the photopolymerization initiator, polymerizing the methyl methacrylate and the N-isopropyl acrylamide in the mixed solution to generate a methyl methacrylate-N-isopropyl acrylamide copolymer with a hydrophilic end, wherein the methyl methacrylate-N-isopropyl acrylamide copolymer moves towards the surface of the inorganic packaging layer, and the side with the hydrophilic end is close to the inorganic packaging layer;
step S303, after the methyl methacrylate-N-isopropyl acrylamide copolymer solution is paved on the inorganic packaging layer, the organic packaging layer is formed by curing.
The invention has the beneficial effects that: compared with the existing general packaging technology and other improved packaging technologies, the organic packaging method of the OLED display panel and the packaging method of the OLED display panel reduce cavities in an organic packaging layer by introducing an amphiphilic methyl methacrylate-N-isopropyl acrylamide copolymer (PMMA-PNIPAm) organic layer on the basis of not changing the original manufacturing process, and in the preparation process, due to the introduction of hydrophilic poly-N-isopropyl acrylamide (PNIPAm), mixed liquid (ink) can be smoothly spread on the inorganic packaging layer, so that the cavities in the organic packaging layer are reduced, the water and oxygen blocking capability of the organic packaging layer is enhanced, the risk of oxidation of devices in the OLED display panel is reduced, and the service life of OLED devices is prolonged.
Drawings
In order to illustrate the embodiments or the technical solutions in the prior art more clearly, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the invention, and it is obvious for a person skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic cross-sectional view of an OLED display panel according to an embodiment of the present invention;
fig. 2 is a flowchart of an encapsulation method of an OLED display panel according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Aiming at the OLED display panel and the packaging structure thereof in the prior art, the organic packaging layer is easy to cause the cavity in the preparation process, so that the blocking capability of the organic packaging layer on water and oxygen is reduced, the risk of oxidizing devices in the OLED display panel is increased, and the service life of the OLED devices is further influenced.
Fig. 1 is a schematic cross-sectional view of an OLED display panel according to an embodiment of the present invention. The OLED display panel includes: a base substrate 10; a thin film transistor layer 11 prepared on the substrate 10; the OLED light-emitting layer 12 is prepared on the thin film transistor layer 11; a thin film encapsulation layer 13 prepared on the OLED light emitting layer 12 and used for wrapping the OLED light emitting layer 12; the thin film packaging layer 13 comprises a plurality of inorganic packaging layers and organic packaging layers which are stacked; the thin film encapsulation layer 13 is shown to include a first inorganic encapsulation layer 130, an organic encapsulation layer 131, and a second inorganic encapsulation layer 132. The preparation methods of the first inorganic encapsulation layer 130 and the second inorganic encapsulation layer 132 are similar to those of the prior art, and are not repeated here. The organic encapsulation layer 131 is made of a methyl methacrylate-N-isopropylacrylamide copolymer solution, and the methyl methacrylate-N-isopropylacrylamide copolymer solution is formed by mixing methyl methacrylate, N-isopropylacrylamide and a photopolymerization initiator in a preset ratio to form a mixed solution, and then irradiating the mixed solution with light. Wherein the mass concentration range of the N-isopropyl acrylamide in the mixed solution is 0.05-20%. Preferably, the mass concentration of the N-isopropylacrylamide in the mixed solution is in the range of 0.1% to 10%.
The organic encapsulation layer 131 contains a methyl methacrylate-N-isopropylacrylamide copolymer 133, that is, the methyl methacrylate-N-isopropylacrylamide copolymer solution contains the methyl methacrylate-N-isopropylacrylamide copolymer 133, and the methyl methacrylate-N-isopropylacrylamide copolymer 133 has a hydrophilic end and a hydrophobic end, and is distributed in such a way that the hydrophilic end is close to the first inorganic encapsulation layer 130 and the hydrophobic end is far from the first inorganic encapsulation layer 130. The methyl methacrylate-N-isopropylacrylamide copolymer 133 is a copolymer of polymethyl methacrylate and poly N-isopropylacrylamide.
The mixed solution is formed on the surface of the first inorganic encapsulating layer 130 by means of ink-jet printing, and the photopolymerization initiator acts under certain conditions to form the methyl methacrylate-N-isopropyl acrylamide copolymer solution and spread the methyl methacrylate-N-isopropyl acrylamide copolymer solution on the surface of the first inorganic encapsulating layer 130, and the methyl methacrylate-N-isopropyl acrylamide copolymer solution is cured to form the organic encapsulating layer 131 with a uniform film thickness. The organic encapsulation layer 131 has a smooth surface and does not generate voids.
The invention also provides an encapsulating method of the OLED display panel, as shown in FIG. 2, the method comprises the following steps:
step S10, providing an OLED display panel to be packaged, and preparing an inorganic packaging layer on the OLED display panel;
wherein the inorganic packaging layer is hydrophilic, and the inorganic packaging layer is made of SiN and Si2Inorganic substances such as O; the preparation method of the inorganic packaging layer is similar to that in the prior art, and is not described in detail here.
Step S20, forming a layer of mixed liquid containing Methyl Methacrylate (MMA), N-isopropyl acrylamide (NIPAm) and a photopolymerization initiator on the surface of the inorganic packaging layer;
specifically, the step S20 includes the steps of:
step S201, mixing the methyl methacrylate, the N-isopropylacrylamide and the photopolymerization initiator according to a preset ratio to form the mixed solution;
wherein the mass concentration range of the N-isopropyl acrylamide in the mixed liquid is 0.05-20%, and preferably 0.1-10%. The mixed solution may further include other solvents such as a catalyst, which is not limited herein. The photopolymerization initiator may be of a conventional type, and is not limited thereto.
Step S202, forming the mixed liquid on the surface of the inorganic packaging layer in an ink-jet printing mode.
The N-isopropyl acrylamide is oil-water amphiphilic polar micromolecules and is easily combined on the surface of the hydrophilic inorganic packaging layer; the methyl methacrylate is a hydrophobic organic matter and is not easy to combine with the hydrophilic inorganic packaging layer; when the mixed solution (ink) containing the methyl methacrylate and the N-isopropylacrylamide is dropped on the surface of the inorganic encapsulating layer, the hydrophilic monomer in the drop, i.e., the N-isopropylacrylamide, is easily spread on the surface of the inorganic encapsulating layer.
Step S30, performing a curing process, namely firstly, irradiating the mixed solution to form a methyl methacrylate-N-isopropyl acrylamide copolymer solution, so that the methyl methacrylate-N-isopropyl acrylamide copolymer solution is spread on the surface of the inorganic packaging layer, and forming an organic packaging layer after curing;
specifically, the step S30 includes the steps of:
step S301, the N-isopropylacrylamide in the mixed solution has hydrophilicity and moves to the surface of the inorganic packaging layer to be spread;
step S302, under the action of the photopolymerization initiator, polymerizing the methyl methacrylate and the N-isopropylacrylamide in the mixed solution to generate a methyl methacrylate-N-isopropylacrylamide copolymer (PMMA-PNIPAm) with a hydrophilic end, wherein the methyl methacrylate-N-isopropylacrylamide copolymer moves towards the surface of the inorganic packaging layer, and one side with the hydrophilic end is close to the inorganic packaging layer;
wherein the photopolymerization initiator can perform polymerization reaction on the methyl methacrylate and the N-isopropylacrylamide; the methyl methacrylate is polymerized to generate polymethyl methacrylate (PMMA), the N-isopropylacrylamide is polymerized to generate poly-N-isopropylacrylamide (PNIPAm), the poly-N-isopropylacrylamide has hydrophilicity, and then the polymethyl methacrylate and the poly-N-isopropylacrylamide are polymerized to generate the methyl methacrylate-N-isopropylacrylamide copolymer under the further action of the photopolymerization initiator. Wherein, the part of the methyl methacrylate-N-isopropyl acrylamide copolymer molecule with the methyl methacrylate group is a hydrophobic end, and the part with the N-isopropyl acrylamide group is a hydrophilic end which is closer to the inorganic packaging layer. The polymethyl methacrylate (also called organic glass) is widely selected as an organic packaging layer material in the industry due to its high transparency and certain water absorption.
Step S303, after the methyl methacrylate-N-isopropyl acrylamide copolymer solution is paved on the inorganic packaging layer, the organic packaging layer is formed by curing.
The methyl methacrylate-N-isopropyl acrylamide copolymer solution contains hydrophilic N-isopropyl acrylamide molecules and groups, so that the methyl methacrylate-N-isopropyl acrylamide copolymer solution can be paved on the surface of the inorganic packaging layer, a cavity is prevented from being generated in the organic packaging layer, and the water and oxygen blocking capability of the organic packaging layer is improved.
And step S40, forming a layer of inorganic packaging layer on the surface of the organic packaging layer.
The organic packaging layer and the inorganic packaging layer can be sequentially stacked on the OLED display panel.
Compared with the existing general packaging technology and other improved packaging technologies, the organic packaging method of the OLED display panel and the packaging method of the OLED display panel reduce cavities in an organic packaging layer by introducing an amphiphilic methyl methacrylate-N-isopropyl acrylamide copolymer (PMMA-PNIPAm) organic layer on the basis of not changing the original manufacturing process, and in the preparation process, due to the introduction of hydrophilic poly-N-isopropyl acrylamide (PNIPAm), mixed liquid (ink) can be smoothly spread on the inorganic packaging layer, so that the cavities in the organic packaging layer are reduced, the water and oxygen blocking capability of the organic packaging layer is enhanced, the risk of oxidation of devices in the OLED display panel is reduced, and the service life of OLED devices is prolonged.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore, the scope of the present invention shall be determined by the appended claims.

Claims (8)

1. An OLED display panel, comprising:
a substrate base plate;
the thin film transistor layer is prepared on the substrate base plate;
the OLED light-emitting layer is prepared on the thin film transistor layer;
the thin film packaging layer is prepared on the OLED light-emitting layer and used for wrapping the OLED light-emitting layer;
the thin film packaging layer comprises an inorganic packaging layer and an organic packaging layer which are stacked;
the material for forming the organic packaging layer is methyl methacrylate-N-isopropyl acrylamide copolymer solution, and the methyl methacrylate-N-isopropyl acrylamide copolymer solution is spread on the surface of the inorganic packaging layer and is used for forming the organic packaging layer after being cured;
the methyl methacrylate-N-isopropyl acrylamide copolymer contained in the methyl methacrylate-N-isopropyl acrylamide copolymer solution has a hydrophilic end and a hydrophobic end, and the methyl methacrylate-N-isopropyl acrylamide copolymer is distributed in such a way that the hydrophilic end is close to the inorganic encapsulation layer and the hydrophobic end is far away from the inorganic encapsulation layer.
2. The OLED display panel of claim 1, wherein the methyl methacrylate-N-isopropylacrylamide copolymer solution is formed by irradiating a mixture of methyl methacrylate, N-isopropylacrylamide and a photopolymerization initiator with light.
3. The OLED display panel according to claim 2, wherein the methyl methacrylate, the N-isopropylacrylamide and the photopolymerization initiator are mixed in a predetermined ratio to form the mixed solution, and a mass concentration of the N-isopropylacrylamide in the mixed solution is in a range of 0.05% to 20%.
4. The OLED display panel of claim 1, wherein the methyl methacrylate-N-isopropylacrylamide copolymer is a copolymer formed from polymethyl methacrylate and poly-N-isopropylacrylamide.
5. The OLED display panel of claim 1, wherein the organic encapsulation layer has a uniform thickness of the film layer at different positions.
6. An encapsulating method of an OLED display panel, the method comprising the steps of:
step S10, providing an OLED display panel to be packaged, and preparing an inorganic packaging layer on the OLED display panel;
step S20, mixing methyl methacrylate, N-isopropyl acrylamide and a photopolymerization initiator according to a preset proportion to form a mixed solution, and forming the mixed solution on the surface of the inorganic packaging layer in an ink-jet printing manner;
step S30, performing a curing process, namely firstly, irradiating the mixed solution to form a methyl methacrylate-N-isopropyl acrylamide copolymer solution, so that the methyl methacrylate-N-isopropyl acrylamide copolymer solution is spread on the surface of the inorganic packaging layer, and forming an organic packaging layer after curing;
and step S40, forming a layer of inorganic packaging layer on the surface of the organic packaging layer.
7. The encapsulation method according to claim 6, wherein the mass concentration of the N-isopropylacrylamide in the mixed solution is in the range of 0.05% to 20%.
8. The packaging method according to claim 6, wherein the step S30 specifically includes the steps of:
step S301, the N-isopropylacrylamide in the mixed solution has hydrophilicity and moves to the surface of the inorganic packaging layer to be spread;
step S302, under the action of the photopolymerization initiator, polymerizing the methyl methacrylate and the N-isopropyl acrylamide in the mixed solution to generate a methyl methacrylate-N-isopropyl acrylamide copolymer with a hydrophilic end, wherein the methyl methacrylate-N-isopropyl acrylamide copolymer moves towards the surface of the inorganic packaging layer, and the side with the hydrophilic end is close to the inorganic packaging layer;
step S303, after the methyl methacrylate-N-isopropyl acrylamide copolymer solution is paved on the inorganic packaging layer, the organic packaging layer is formed by curing.
CN201810749501.8A 2018-07-10 2018-07-10 OLED display panel and packaging method thereof Active CN109065744B (en)

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PCT/CN2018/115794 WO2020010772A1 (en) 2018-07-10 2018-11-16 Oled display panel and method for encapsulating same
US16/334,372 US11145842B2 (en) 2018-07-10 2018-11-16 Organic light emitting diode display panel comprising multi-layer encapsulation

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109103343B (en) * 2018-07-12 2020-06-16 武汉华星光电半导体显示技术有限公司 OLED display panel packaging component and OLED display device
CN109904349B (en) * 2019-03-25 2021-11-02 京东方科技集团股份有限公司 Display device, display panel and packaging method thereof
CN110416430B (en) * 2019-07-26 2022-07-19 云谷（固安）科技有限公司 Display panel and display device
KR20220106261A (en) * 2021-01-21 2022-07-29 삼성디스플레이 주식회사 Display apparatus and manufacturing the same
WO2024004146A1 (en) * 2022-06-30 2024-01-04 シャープディスプレイテクノロジー株式会社 Light-emitting element, display device, and light-emitting element manufacturing method
CN115581086A (en) * 2022-11-09 2023-01-06 惠科股份有限公司 Display panel, preparation method of display panel and electronic equipment

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101608021B (en) * 2009-07-09 2011-09-14 西南大学 Preparation method of N-isopropyl acrylamide polymer/polyvinyl alcohol composite hydrogel and product thereof
US8912252B2 (en) * 2010-07-20 2014-12-16 Silberline Manufacturing Company, Inc. Film-forming pigments and coating system including the same
KR102034253B1 (en) * 2013-04-12 2019-10-21 삼성디스플레이 주식회사 Organic light emitting display apparatus and the manufacturing method thereof
CN104371131B (en) * 2014-03-12 2017-09-15 南开大学 A kind of preparation method for the molecular blotting polymer microsphere for having a hydrophilic macromolecule brush
EP4258844A3 (en) * 2014-09-30 2023-11-15 LG Display Co., Ltd. Flexible organic light emitting display device
KR102328677B1 (en) * 2014-10-17 2021-11-19 삼성디스플레이 주식회사 Flexible display apparatus and manufacturing method thereof
CN104437124B (en) * 2014-11-25 2017-09-29 湖南澳维环保科技有限公司 A kind of self-cleaning type polyvinylidene fluoride microporous film and preparation method thereof
CN105047831B (en) * 2015-09-14 2017-06-13 上海天马有机发光显示技术有限公司 A kind of packaging film, display device and its method for packing
CN105789257A (en) 2016-03-23 2016-07-20 京东方科技集团股份有限公司 Thin-film packaging structure and display device
EP3436233B1 (en) * 2016-03-31 2020-02-19 Fundación Imdea Nanociencia Polymeric composites with functional surfaces
CN106025095A (en) * 2016-06-07 2016-10-12 武汉华星光电技术有限公司 Packaging structure of flexible OLED device and display device
KR20180046422A (en) * 2016-10-27 2018-05-09 삼성디스플레이 주식회사 Flexible display device and manufacturing method thereof
CN106684259B (en) * 2017-01-18 2018-08-14 深圳市华星光电技术有限公司 OLED encapsulation method and OLED encapsulating structures
CN107564992B (en) * 2017-08-18 2019-04-30 上海理工大学 A kind of heterojunction semiconductor ultraviolet light detector of quick response and preparation method thereof
CN107644946A (en) * 2017-09-15 2018-01-30 武汉华星光电半导体显示技术有限公司 The method for packing and encapsulating structure of OLED display panel
CN207265104U (en) * 2017-09-29 2018-04-20 京东方科技集团股份有限公司 Thin-film packing structure
CN107994131A (en) * 2017-11-28 2018-05-04 武汉华星光电半导体显示技术有限公司 For encapsulating encapsulating structure, the display device of OLED device
CN108461653A (en) * 2018-04-04 2018-08-28 武汉华星光电半导体显示技术有限公司 Flexible OLED screen curtain, flexible panel thin-film packing structure and packaging method
CN108832023A (en) * 2018-06-29 2018-11-16 京东方科技集团股份有限公司 Encapsulating structure, electronic device and packaging method
CN109103343B (en) * 2018-07-12 2020-06-16 武汉华星光电半导体显示技术有限公司 OLED display panel packaging component and OLED display device
KR102588082B1 (en) * 2018-09-06 2023-10-11 엘지디스플레이 주식회사 Organic light emitting display device and method for manufacturing thereof
KR20210024360A (en) * 2019-08-22 2021-03-05 삼성디스플레이 주식회사 Display apparatus and Method of manufacturing of the same
KR20210049245A (en) * 2019-10-24 2021-05-06 삼성디스플레이 주식회사 Display device

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