KR20050006558A - Encapsulated organic electron device and method for manufacturing the same - Google Patents

Abstract

PURPOSE: An encapsulated organic EL(Electro-Luminescence) element and a manufacturing method thereof are provided to reduce weight of the EL element by thinning the element. CONSTITUTION: An organic EL element(100) formed on a portion of a substrate, a housing(200), and a liquid state oil(9). The housing includes a first member(8) bonded on the substrate to enclose a side portion of the organic EL element and a second member(11) bonded on the first member to cover an upper portion of the organic EL element. The liquid state oil is concentrated in the housing. The first member is a laminate of an organic/non-organic hybrid layer or a non-organic layer and is bonded on the substrate via a first bonding sheet. The second member is a laminate of an organic/non-organic hybrid layer or a non-organic layer and is bonded on the first member via a second bonding sheet.

Description

Encapsulated organic electron device and method for manufacturing the same

The present invention relates to an encapsulation method of an organic electronic device such as an organic light emitting device or an organic transistor, and a structure thereof.

Generally, an organic light emitting device or a polymer light emitting device (hereinafter, referred to as an organic light emitting device) is formed on an anode formed on a substrate and on a hole transport layer and a hole transport layer formed on the anode to inject holes into the organic light emitting layer. It includes an organic light emitting layer formed, an electron injection layer formed on the organic light emitting layer to inject electrons into the organic light emitting layer, and a cathode connected to the electron injection layer.

The organic light emitting device configured as described above is used in various display apparatuses in which electrons and holes injected into the organic light emitting layer form a pair and emit light by radiating energy while they are separated.

The organic light emitting device has excellent characteristics such as a wide viewing angle, high speed response, high contrast, high luminous efficiency, and a separate light source.

However, the organic light emitting device has a shorter lifespan than a conventional liquid crystal display (LCD) and the lifespan of the devices representing red, green, and blue is different. The disadvantage is that it is not easy to match the color balance.

In addition, the organic light emitting device has a disadvantage that is very vulnerable to moisture and oxygen, the electrode material of the organic light emitting device has a disadvantage that the characteristics of the organic light emitting device is deteriorated due to oxidation, the life of the device is dramatically reduced.

Various attempts and techniques have been researched and developed in order to overcome such disadvantages and to secure stability and reliability of the organic light emitting device. As one of them, an encapsulation method using a glass lid or a metal lid has been proposed.

This method is widely used in the industry at present, and it is described as follows. First, after washing and drying the metal lid or the glass lid, a moisture absorbent (mainly calcium oxide or barium oxide, etc. is used) is attached to the inside of the lid.

Thereafter, the cap is attached to a substrate (usually a glass substrate) on which an organic light emitting device is formed, using an UV curable adhesive in an inert gas atmosphere, to encapsulate the organic light emitting device.

In the case of such an encapsulation method, the use of a glass lid or a metal lid has been a burden on the weight reduction of the device, and due to the weight of the lid, it is not suitable for encapsulating an organic light emitting device having a large area.

In addition, the encapsulation method required a relatively long process time (typically 90 minutes), and also had difficulty in thinning the device (difficult to fabricate a device thickness of 2 mm or less). In addition, since the organic light emitting device having the glass lid or the metal lid attached thereto could not be bent, its application was limited.

In order to compensate for the disadvantages of the encapsulation method using a metal lid or a glass lid, an encapsulation method using a plastic lid (Korean Patent Publication No. 1999-0088334), a physical vacuum deposition method or a chemical vacuum deposition method is used. Encapsulation method (Korea Patent Publication No. 1999-0031394, Korean Patent Publication No. 1999-0038057, US Patent Publication No. 5188901, 6268695, 6224948, 6207239, 6228436, 5902641, 6217947, 6203854, 5547508 and 5395644) This has been proposed.

However, these methods have the disadvantage of using expensive equipment (physical / chemical vacuum chamber, vacuum pump, etc.), and also have disadvantages that are not suitable for organic light emitting devices having a large area. This is because the above methods use vacuum equipment, and thus, it is inevitable that the size of the organic light emitting device cannot be increased by more than a certain amount in order to secure the vacuum and uniformity of the equipment.

In addition to the aforementioned methods, a method of encapsulating a siloxane-based polymer on an organic light emitting device by spin coating or molding (US Patent Publications 5855994 and 5734225, Korean Patent Publication No. 1999-0044520, Korean Patent Publication No. 2000) -0023573) has been proposed.

In particular, U.S. Patent No. 5855994 applies a light or heat after applying a siloxane monomer to the organic light emitting device by various methods such as spin coating or deep coating. As a method of forming an encapsulated thin film by polymerization using the method, this method has a problem of a complicated process and low productivity.

Disclosure of Invention The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an encapsulated organic electronic device and a method for manufacturing the same, which can block the penetration of moisture and oxygen into the organic electronic device in a simple manner and at a low cost. have.

1 is a cross-sectional view of an organic light emitting device to which an encapsulation method according to an embodiment of the present invention is applied;

2 is a cross-sectional view of an organic light emitting diode to which an encapsulation method according to another exemplary embodiment of the present invention is applied.

* Description of the symbols for the main parts of the drawings *

1: substrate 2: ITO

3: hole transport layer 4: organic light emitting layer

5: electron transport layer 6: metal electrode for cathode

7, 10: adhesive sheet 12: second member (silent layer)

8, 11: first member (laminated organic / inorganic composite layer or inorganic layer)

9: liquid oil

In order to achieve the above object, the present invention is to manufacture an organic electronic device such as an organic light emitting device or an organic transistor on a substrate, and then laminate an organic / inorganic composite layer or an inorganic layer and attach an adhesive sheet to the laminate. Next, an encapsulation and a method of forming a housing structure for sealing an organic electronic device by adhesive taping on a substrate, and filling a liquid oil having excellent barrier against moisture and oxygen as a barrier therein. It is about.

The encapsulation method according to the present invention can be encapsulated at low production cost without using expensive deposition equipment by using a method of simply taping a substrate with a laminate with an adhesive sheet, and a short process through a simple process. In addition to forming the encapsulation structure in a desired form in time, liquid oil can be used as a barrier to effectively block the penetration of moisture and oxygen that cause device deterioration.

In addition, the encapsulation method according to the present invention has the advantage that it is suitable for manufacturing an organic light emitting device having a large area and can be bent by using a light organic / inorganic composite layer or an inorganic layer as a housing.

Hereinafter, the most preferred embodiments of the present invention will be described with reference to the accompanying drawings so that those skilled in the art can easily implement the technical idea of the present invention.

1 is a cross-sectional view showing a cross section of an organic light emitting device according to a first embodiment of the present invention.

Referring to FIG. 1, an organic light emitting diode 100 is formed on a transparent glass or plastic substrate 1, and the organic light emitting diode is transparent, such as indium tin oxide (ITO), formed on the substrate 1. An anode 2 of the material, a hole transport layer 3 formed on the anode 2 to inject holes into the light emitting layer 4, a light emitting layer 4 formed on the hole transport layer 3, and the light emitting layer ( 4) It has a laminated structure in which the electron transport layer 5 formed on the electron transport layer 5 and the cathode metal electrode 6 formed on the electron transport layer 5 are sequentially stacked.

In addition, as an encapsulation structure for protecting the organic light emitting device 100 having the stacked structure, the first member 8 adhered to the substrate 1 to surround the side surface of the organic light emitting device 100, and The housing 200 is formed by the second member 11 attached to the first member 8 and covering the upper portion of the organic light emitting device 100, and the liquid oil 9 is filled in the housing 200. have.

The first member 8 is a laminate of an organic / inorganic composite layer or inorganic layer in which a plurality of thin films are laminated, and is formed by being bonded to the substrate 1 through the first adhesive sheet 7, and the second member 11 is A plurality of thin films are laminated on the organic / inorganic composite layer or the inorganic layer and bonded to the first member 8 through the second adhesive sheet 10.

The adhesive sheets 7 and 10 may be epoxy-based resins or acrylate-based resins. In addition, a moisture absorption layer (not shown in FIG. 1) interposed between the first and second members 8 and 11 and the adhesive sheets 7 and 10 to absorb moisture and oxygen in the air. It may be configured.

Alternatively, as an alternative method, an adhesive sheet to which a moisture absorbent is added may be used without separately forming the moisture absorbing layer. The moisture absorbing layer or the moisture absorbent may be calcium, silica gel, zeolite or alkali. It may comprise at least any one of (alkali) metal.

The first and second members 8 and 11 made of an organic / inorganic composite layer have a composition in which an organic film (polymer film) and an inorganic film are combined together. Such a composite structure includes an organic film / organic film / inorganic film / organic film, Organic film / inorganic film / organic film, organic film / inorganic film / organic film / inorganic film / organic film / organic film, organic film / inorganic film / organic film / inorganic film / organic film, organic film / organic film / inorganic film / Organic membrane / organic membrane structure and it may be composed of a repeating layer structure based on this.

In this case, the inorganic film used may be aluminum (Al), tin, zinc, silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, aluminum oxide (aluminum oxide), aluminum oxynitride (aluminum oxynitride), or may include at least one of aluminum nitride (aluminum nitride).

In addition, the organic film (polymer film) used at this time may be an olefin-based polyethylene such as low density polyethylene, ultra low density polyethylene (LLDPE), high density polyethylene, poly Polypropylene, amide nylon 6 (nylon 6), nylon 66 (nylon 66), nylon 6/9 (nylon 6/9), nylon 6/10 (nylon 6/10), nylon 6 / 12 (nylon 6/12), nylon 11, nylon 12, polystyrene, polyethylene terephthalate, polybutyl terephthalate, polyvinyl chloride, polyvinylidene chloride chloride, polycarbonate, cellulose acetate or poly (meth) acrylate, polyether sulfone, polyvinylidene fu O fluoride may be made to any one or a combination thereof selected from (polyvinylidene fluoride), polyimide (polyimide).

Thus, the organic / inorganic composite film is composed of at least one inorganic film and a multilayer film in which at least one organic film is laminated, and the organic film and the inorganic film are formed to have a thickness of at least 0.001 μm or more, preferably 0.001 μm to It has a thickness of 1 mm.

And in the case of the 1st and 2nd member comprised only with an inorganic film, it consists of at least any one of aluminum (Al), tin, zinc, glass, or sus.

Next, the liquid oil 9 will be described. Liquid oils include polyphenyl-methyl siloxanes, polydiphenyl siloxanes, polydimethyl siloxanes, silicone oils, paraffin oils, mineral oils, almond oils, corn oils and cottonseeds with excellent barriers to moisture and oxygen. Cottonseed oil, perfluoropolyether oil, linseed oil, tung oil, castor oil, cinnamin oil or coconut oil ( coconut oil) as a basic structure.

2 is a cross-sectional view illustrating a cross section of an encapsulated organic light emitting diode according to a second exemplary embodiment of the present invention.

Referring to FIG. 2, an organic light emitting diode 100 is formed on a transparent glass or plastic substrate 1, and the organic light emitting diode is transparent, such as indium tin oxide (ITO), formed on the substrate 1. Anode 2 of the material, a hole transport layer 3 formed on the anode 2 to inject holes into the light emitting layer 4, a light emitting layer 4 formed on the hole transport layer, and on the light emitting layer 4 It has a laminated structure in which an electron transport layer 5 formed on the upper surface and an electron transport layer 5 for injecting electrons and a metal electrode 6 for a cathode formed on the electron transport layer are sequentially stacked.

In addition, as an encapsulation structure for protecting the organic light emitting device 100 having the stacked structure, the first member 12 adhered to the substrate 1 to surround the side surface of the organic light emitting device 100, and The housing 250 is formed by the second member 11 attached to the first member 12 to cover the upper portion of the organic light emitting device 100, and the liquid oil 9 is filled in the housing 250. have.

The first member 12 is a seal layer of an epoxy-based adhesive or an acrylate-based adhesive, and the second member 11 is a laminate of an organic / inorganic composite layer or an inorganic layer in which a plurality of thin films are laminated. It is bonded to the seal layer that is the first member 12 is formed.

The organic / inorganic mixed film or the inorganic thin film, which is the liquid oil 9 and the first member 11, used in the second embodiment of the present invention is the same as the first embodiment of the present invention, and thus description thereof will be omitted.

Next, an encapsulation method of an organic light emitting device according to an embodiment of the present invention will be described with reference to FIGS. 1 to 2 again.

Referring to FIG. 1, the organic light emitting diode 100 is formed in a partial region on the substrate 1. Subsequently, the first laminate of the organic / inorganic composite layer or the inorganic layer to which the adhesive sheet 7 is attached, which corresponds to the first member 8, surrounds the side surface of the organic light emitting device 100. Adhesive taping onto the substrate. Subsequently, the liquid oil 9 is dropped to fill the liquid oil in the space surrounded by the first laminate. Finally, the second laminate of the organic / inorganic composite layer or the inorganic layer to which the adhesive sheet 10 is attached, which corresponds to the second member 11, is adhesively taped to the upper surface of the first laminate to complete the encapsulation structure. .

Referring to FIG. 2, the organic light emitting diode 100 is formed in a portion of the substrate 1. Subsequently, an adhesive (corresponding to reference numeral 12) is thickly formed on the substrate 1 to surround the side surface of the organic light emitting device 100 through a nozzle or the like. Subsequently, the liquid oil 9 is dropped to fill the liquid oil in the space surrounded by the adhesive 12. Finally, the second laminate of the organic / inorganic composite layer or the inorganic layer, which corresponds to the second member 11, is taped on the adhesive 12 to complete the encapsulation structure. The adhesive 12 is cured using light (UV) or heat.

The encapsulation method as described above can form barriers of desired shape in a short time at low production cost without using expensive equipment, and also permeate moisture and oxygen that cause device degradation. Can be effectively blocked. In addition, the encapsulation organic light emitting device according to the present invention can be bent and has an advantage of being easy to manufacture in large areas.

Meanwhile, the present invention can be applied to encapsulation for long life of pentacene used as an active layer of an organic transistor in addition to the organic light emitting diodes described in the first and second embodiments. Without being limited by the examples and the accompanying drawings, it will be apparent to those skilled in the art that various changes, modifications, and alterations can be made without departing from the spirit of the present invention. will be.

Applying the encapsulation method of the organic light emitting device according to the present invention has the following effects. First, it is possible to manufacture a device of a thin film compared with the conventional, and also can be obtained a device that is lighter than the conventional organic light emitting device because no metal is used.

Second, compared to the encapsulation process using vacuum deposition, there is no need for additional expensive equipment (physical / chemical vacuum chamber, vacuum pump, etc.), and by combining the organic / inorganic composite layer or inorganic layer with the adhesive sheet with the liquid oil, The encapsulation structure can be manufactured easily and inexpensively. This has an excellent effect in economics, fairness, operation reliability and the like compared to the conventional vacuum deposition method.

Third, the encapsulation structure according to the present invention is not only easy to manufacture an organic light emitting device having a large area but also applicable to a bendable display.

Fourth, when the organic / inorganic multilayer film is attached, a moisture absorbent (calcium, silica gel, zeolite, alkali metal, etc.) is added to the adhesive or a moisture absorbing layer is provided between the adhesive sheet and the barrier to provide an organic light emitting device. It can increase the lifespan.

Claims (10)

An organic electronic device formed in a portion of the substrate; A housing including a first member adhered to the substrate to surround a side surface of the organic electronic device, and a second member adhered to the first member to cover an upper portion of the organic electronic device; And Liquid oil filled in the housing An encapsulated organic electronic device comprising a. The method of claim 1, The first member is bonded to the substrate through a first adhesive sheet as a laminate of an organic / inorganic composite layer or inorganic layer in which a plurality of thin films are stacked, The second member is an encapsulated organic electronic device, characterized in that bonded to the first member through a second adhesive sheet as a laminate of an organic / inorganic composite layer or an inorganic layer in which a plurality of thin films are stacked. The method of claim 1, The first member is a seal layer of an epoxy-based adhesive or an acrylate-based adhesive, and the second member is a laminate of an organic / inorganic composite layer or an inorganic layer in which a plurality of thin films are laminated. Encapsulated Organic Electronic Device. The method according to any one of claims 1 to 3, The liquid oil, Polyphenyl-methyl siloxane, polydiphenyl siloxane, polydimethyl siloxane, silicone oil, paraffin oil, mineral oil, almond oil, corn oil, cottonseed oil, perfulufolius oil ( any one selected from the group consisting of perfluoropolyether oil, linseed oil, tung oil, castor oil, cinnamin oil and coconut oil An encapsulated organic electronic device, characterized in that a mixture of at least two materials selected from. The method according to claim 2 or 3 The organic material of the organic / inorganic composite layer, Olefin based polyethylene, low density polyethylene, ultra low density polyethylene, high density polyethylene, polypropylene, amide based nylon 6, nylon 66, nylon 6/9, nylon 6/10, nylon 6/12, nylon 11, nylon 12, polystyrene, Selected from the group consisting of polyethylene terephthalate, polybutyl terephthalate, polyvinyl chloride, polyvinylidene chloride, polycarbonate, cellulose acetate, poly (meth) acrylate, polyisulfone, polyvinylidene fluoride and polyimide Encapsulated organic electronic device, characterized in that any one or a mixture of at least two materials selected from the group. The method according to claim 2 or 3 The inorganic material or the inorganic layer of the organic / inorganic composite layer, Any one selected from the group consisting of aluminum, tin, zinc, silicon oxide, silicon nitride, silicon oxynitride, silicon carbide, aluminum oxide, aluminum oxynitride and aluminum nitride or a mixture of at least two materials selected from the group An encapsulated organic electronic device. The method according to any one of claims 1 to 3 The organic electronic device is an encapsulated organic electronic device, characterized in that the organic light emitting device or an organic transistor. Forming an organic electronic device in a partial region on the substrate; Adhesively taping the first laminate of the organic / inorganic composite layer or the inorganic layer to which the adhesive sheet is attached onto the substrate to surround the side surface of the organic electronic device; Filling a liquid oil into a space surrounded by the first laminate; And Adhesively taping the second laminate of the organic / inorganic composite layer or the inorganic layer to which the adhesive sheet is attached to the upper surface of the first laminate Encapsulation method of an organic electronic device comprising a. Forming an organic electronic device in a partial region on the substrate; Attaching and curing a seal layer to surround a side of the organic electronic device; Filling a liquid oil into a space surrounded by the seal layer; And Adhesively taping a laminate of an organic / inorganic composite layer or inorganic layer on the top surface of the seal layer to seal the oil Encapsulation method of an organic electronic device comprising a. The method of claim 9, The seal layer is an encapsulation method of an organic electronic device, characterized in that the epoxy-based adhesive or acrylate-based adhesive.