CN109904349B - Display device, display panel and packaging method thereof - Google Patents
Display device, display panel and packaging method thereof Download PDFInfo
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- CN109904349B CN109904349B CN201910226787.6A CN201910226787A CN109904349B CN 109904349 B CN109904349 B CN 109904349B CN 201910226787 A CN201910226787 A CN 201910226787A CN 109904349 B CN109904349 B CN 109904349B
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Abstract
The disclosure provides a display device, a display panel and a packaging method of the display panel, and relates to the technical field of display. The display panel comprises an array substrate, a first inorganic layer, a buffer layer and an organic layer, wherein the first inorganic layer is arranged on the light emergent side of the array substrate; the buffer layer comprises a plurality of microspheres distributed on the surface of the first inorganic layer far away from the array substrate; the organic layer covers the buffer layer and fills gaps between the microspheres. The display panel of the present disclosure may reduce or eliminate the space occupied by the blocking dam so as to make the bezel narrower.
Description
Technical Field
The disclosure relates to the technical field of display, in particular to a display device, a display panel and a packaging method of the display panel.
Background
At present, the application of an OLED (Organic Light-Emitting Diode) display panel is becoming more and more widespread, wherein the package of the display panel directly relates to the performance of the display, and thin film packaging is a common packaging technology, and the package can be performed by forming a packaging layer on an array substrate including a Light-Emitting device, the existing packaging layer generally includes an Organic layer disposed on the Light-Emitting side of the array substrate and an inorganic layer covering the Organic layer, but in order to prevent the Organic layer from overflowing from the edge of the display panel, a blocking dam needs to be added on the display panel to block the Organic layer, which occupies a larger space and makes the frame of the display device wider.
It is to be noted that the information disclosed in the above background section is only for enhancement of understanding of the background of the present disclosure, and thus may include information that does not constitute prior art known to those of ordinary skill in the art.
Disclosure of Invention
An object of the present disclosure is to provide a display device, a display panel and a method for packaging the display panel, which can reduce or eliminate the space occupied by the blocking dam so as to make the frame narrower.
According to an aspect of the present disclosure, there is provided a display panel including:
the first inorganic layer is arranged on the light emergent side of an array substrate;
the buffer layer comprises a plurality of microspheres distributed on the surface of the first inorganic layer far away from the array substrate;
and the organic layer covers the buffer layer and fills gaps among the microspheres.
In an exemplary embodiment of the present disclosure, the microsphere includes a core and a shell covering the core, the core is made of a magnetic material, and the shell is made of an organic material.
In an exemplary embodiment of the present disclosure, the microsphere further comprises:
the surface active agent layer is coated outside the spherical shell and comprises a hydrophilic part and a hydrophobic part, and the hydrophilic part comprises a hydrophilic group and is in contact with the first inorganic layer; the hydrophobic portion comprises a hydrophobic group and is in contact with the organic layer.
In an exemplary embodiment of the present disclosure, the material of the ball core includes at least one of iron, cobalt, and nickel, and the material of the ball shell and the material of the organic layer each include an organic polymer material.
In one exemplary embodiment of the present disclosure, the core of the sphere has a diameter of 10nm to 20nm, and the microsphere has a diameter of 1 μm to 5 μm.
In an exemplary embodiment of the present disclosure, the microspheres are distributed along the first inorganic layer, and each of the microspheres is distributed in a monolayer such that the thickness of the buffer layer is the diameter of the microsphere; alternatively, the microspheres are distributed along the first inorganic layer, and the microspheres are distributed in multiple layers on part or all of the surface of the first inorganic layer.
According to an aspect of the present disclosure, there is provided a method of packaging a display panel, including:
forming a first inorganic layer on a light emergent side of an array substrate;
forming a buffer layer on the surface of the first inorganic layer far away from the array substrate, wherein the buffer layer comprises microspheres distributed on the surface of the first inorganic layer far away from the array substrate;
and forming an organic layer which covers the buffer layer and fills gaps among the microspheres.
In an exemplary embodiment of the present disclosure, forming a buffer layer on a surface of the first inorganic layer away from the array substrate includes:
forming microspheres, wherein each microsphere comprises a spherical core and a spherical shell coating the spherical core, the spherical core is made of a magnetic material, and the spherical shell is made of an organic material;
dispersing the microspheres in a first solvent;
forming the first solvent on the surface of the first inorganic layer far away from the array substrate;
and fixing the microspheres on the first inorganic layer through an external magnetic field, and evaporating to remove the first solvent to obtain the buffer layer.
In an exemplary embodiment of the present disclosure, the encapsulation method further includes:
a second inorganic layer is formed overlying the organic layer.
According to an aspect of the present disclosure, there is provided a display device including the display panel substrate of any of the above.
The surface of the first inorganic layer, which is far away from the array substrate, is provided with a buffer layer, and the organic layer covers the buffer layer and fills gaps among the microspheres. The microballon of buffer layer can form unevenness's surface on first inorganic layer, can hinder organic layer to the edge flow to can reduce or even save and block the dam, avoid blocking the space that the dam occupy too big, be favorable to making the frame narrower. Meanwhile, the gap between the organic layer filling microspheres can increase the contact surface between the organic layer and the buffer layer, the bonding force between the organic layer and the first inorganic layer is increased, the risk of gaps between the organic layer and the first inorganic layer due to deformation of the display panel is reduced, the water and oxygen are prevented from invading the display panel, and the reliability of the display panel is improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure. It is to be understood that the drawings in the following description are merely exemplary of the disclosure, and that other drawings may be derived from those drawings by one of ordinary skill in the art without the exercise of inventive faculty.
Fig. 1 is a schematic diagram of a display region and an edge region of a display panel.
Fig. 2 is a schematic diagram of a display panel in the related art.
Fig. 3 is a schematic view of an array substrate of a display panel according to an embodiment of the disclosure.
Fig. 4 is a partial schematic view of a display panel in a display area according to an embodiment of the disclosure.
Fig. 5 is a partial schematic view of a display panel in an edge region according to an embodiment of the disclosure.
Fig. 6 is a partial schematic view of a buffer layer of a display panel according to an embodiment of the present disclosure.
Fig. 7 is a flowchart of an embodiment of the packaging method of the present disclosure.
Fig. 8 is a flowchart of step S120 of the packaging method according to the embodiment of the disclosure.
Fig. 9 is a flow chart of another embodiment of the packaging method of the present disclosure.
Fig. 10 is a schematic structural diagram after step S110 of the packaging method according to the embodiment of the disclosure is completed.
Fig. 11 is a schematic structural diagram after step S1230 of the packaging method according to the embodiment of the disclosure is completed.
Fig. 12 is a schematic structural diagram after step S1240 of the packaging method according to the embodiment of the disclosure is completed.
Fig. 13 is a schematic structural diagram after step S130 of the packaging method in the embodiment of the disclosure is completed.
In fig. 1: A. a display area; B. an edge region;
in fig. 2: 1a, an array substrate; 2a, an encapsulation layer; 21a, a first inorganic layer; 22a, an organic layer; 3a, blocking a dam;
in fig. 3-13: 100. an array substrate; 101. a substrate; 102. a first electrode layer; 103. a light emitting layer; 104. a pixel defining layer; 105. a second electrode layer; 1. a first inorganic layer; 2. a buffer layer; 21. microspheres; 211. a core; 212. a spherical shell; 213. a surfactant layer; 3. an organic layer; 4. a second inorganic layer.
Detailed Description
Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.
Although relative terms, such as "upper" and "lower," may be used in this specification to describe one element of an icon relative to another, these terms are used in this specification for convenience only, e.g., in accordance with the orientation of the examples described in the figures. It will be appreciated that if the device of the icon were turned upside down, the element described as "upper" would become the element "lower". When a structure is "on" another structure, it may mean that the structure is integrally formed with the other structure, or that the structure is "directly" disposed on the other structure, or that the structure is "indirectly" disposed on the other structure via another structure.
The terms "a," "an," "the," "said" are used to indicate the presence of one or more elements/components/etc.; the terms "comprising" and "having" are intended to be inclusive and mean that there may be additional elements/components/etc. other than the listed elements/components/etc.; the terms "first" and "second" are used merely as labels, and are not limiting on the number of their objects.
As shown in fig. 1, the display panel has a display area a and an edge area B surrounding the display area a, and in the related art, as shown in fig. 2, the display panel includes an array substrate 1a and an encapsulation layer 2a, the encapsulation layer 2a is disposed on a light emitting side of the array substrate 1a, i.e., a side to which light emitted from the array substrate 1a is directed, the encapsulation layer 2a includes an inorganic layer 21a and an organic layer 22a, the inorganic layer 21a is disposed on the array substrate 1a, and the organic layer 22a is disposed on the inorganic layer 21 a. In order to prevent the organic layer 22a from overflowing from the edge region B of the display panel, the display panel further includes two blocking dams 3a disposed on the surface of the inorganic layer 21a and located at the edge region B, the blocking dams 3a may have a ring shape, the two blocking dams 3a have different diameters and are concentrically disposed around the organic layer 22a, so that the organic layer 22a can be blocked from overflowing to the edge.
Because the blocking dam 3a occupies a larger space, and the distance between the two circles of blocking dams 3a can reach 100-.
The present disclosure provides a display panel, as shown in fig. 4 and 5, including an array substrate 100, a first inorganic layer 1, a buffer layer 2, and an organic layer 3, wherein:
the array substrate 100 has a backlight side and a light-emitting side. The first inorganic layer 1 is disposed on the light-emitting side of the array substrate 100. The buffer layer 2 includes a plurality of microspheres 21 distributed on the surface of the first inorganic layer 1 away from the array substrate 100. The organic layer 3 covers the buffer layer 2 and fills the gaps between the microspheres 21.
In the display panel of the embodiment of the present disclosure, the microspheres 21 of the buffer layer 2 may form an uneven surface on the first inorganic layer 1, which may hinder the organic layer 3 from flowing to the edge region B, thereby reducing or even omitting the blocking dam, avoiding the space occupied by the blocking dam from being too large, and facilitating the frame to be narrower, and as can be seen from fig. 5 and 2, L in fig. 52Less than L in FIG. 21The space of the edge position is reduced due to the omission of the blocking dam. Meanwhile, the gap between the microspheres 21 is filled with the organic layer 3, so that the contact surface between the organic layer 3 and the buffer layer 2 can be increased, the bonding force between the organic layer 3 and the first inorganic layer 1 can be increased, the risk of gaps between the organic layer 3 and the first inorganic layer 1 caused by the deformation of the display panel is reduced, the intrusion of water and oxygen into the display panel is prevented, and the reliability of the display panel is improved.
The following describes each part of the display panel according to the embodiment of the present disclosure in detail:
as shown in fig. 3, the array substrate 100 may be used for displaying images, for example, the array substrate 100 may be an OLED array substrate, and the array substrate 100 may include a substrate 101 and a display device layer, wherein:
an array substrate 100.
The substrate 101 may be a rigid material such as glass, or may be a flexible material such as PI (polyimide), PET (polyethylene terephthalate), and the like, and is not particularly limited herein.
The display device layer may be provided on one side of the substrate 101, and may include a first electrode layer 102, a pixel defining layer 103, a light emitting layer 104, and a second electrode layer 105, wherein:
the first electrode layer 102 may be an anode, which may be disposed on the substrate 101 and includes a plurality of first electrodes distributed in an array;
the pixel defining layer 103 may be disposed on the surface of the substrate 101 where the first electrode layer 102 is disposed, and has a plurality of pixel regions, where the first electrodes are exposed in a one-to-one correspondence;
the light emitting Layer 104 is disposed in each of the pixel regions and connected to the first electrode Layer 102, and the light emitting Layer 104 may include a Hole Injection Layer (HIL), a Hole Transport Layer (HTL), a light emitting material Layer, an Electron Transport Layer (ETL), and an Electron Injection Layer (EIL), wherein the Hole injection Layer is disposed on the first electrode Layer 102, the Hole Transport Layer is disposed on the Hole injection Layer, the light emitting material Layer is disposed on the Hole Transport Layer, the Electron Transport Layer is disposed on the light emitting material Layer, and the Electron injection Layer is disposed on the Electron Transport Layer.
The second electrode layer 105 may be a cathode, which may cover the pixel defining layer 103 and the light emitting layer 104, and a side of the second electrode layer 105 away from the substrate 101 is a light emitting side of the array substrate 100. The light emitting layer 103 can emit light by applying a voltage between the first electrode layer 102 and the second electrode layer 105, so as to display an image, and the display principle of the OLED array substrate is not described in detail herein.
As shown in fig. 4 and 5, fig. 4 is used to illustrate the structure of the portion of the first inorganic layer 1, the buffer layer 2, and the organic layer 3 located in the display region a, and fig. 5 is used to illustrate the structure of the portion of the first inorganic layer 1, the buffer layer 2, and the organic layer 3 located in the edge region B.
As shown in fig. 4 and fig. 5, the first inorganic layer 1 is disposed on the light-emitting side of the array substrate 100, for example, the first inorganic layer 1 may cover the second electrode layer 105 of the array substrate 100. The material of the first inorganic layer 1 is a transparent material capable of blocking the action of water and oxygen, for example, the material of the first inorganic layer 1 may include SiNX、SiO2、SiC、Al2O3At least one of ZnS, ZnO and ZSM, wherein the ZSM at least comprises ZnO and Al2O3And MgO, although the first inorganic layer 1 may be other materials.
The first inorganic layer 1 may be formed on the array substrate 100 by Chemical Vapor Deposition (CVD), magnetron sputtering, Atomic Layer Deposition (ALD) or other processes, and the thickness of the first inorganic layer 1 may be 0.05 μm to 3.0 μm, but may be less than 0.05 μm or greater than 3.0 μm.
As shown in fig. 4 and fig. 5, the buffer layer 2 may be disposed on a surface of the first inorganic layer 1 away from the array substrate 100, and the buffer layer 2 may include a plurality of microspheres 21, and a diameter of the microspheres 21 may be 1 μm to 5 μm, and of course, may also be greater than 1 μm or less than 5 μm. The microspheres 21 may be distributed along the first inorganic layer 1, and each microsphere 21 may be distributed in a single layer such that the thickness of the buffer layer 2 is the diameter of the microsphere 21; alternatively, the microspheres 21 may be distributed in a plurality of layers on part or the whole surface of the first inorganic layer 1. For example, the second electrode layer 104 of the array substrate 100 is recessed in the pixel region of the pixel defining layer 103, such that the second electrode layer 104 has an uneven surface, and correspondingly, the first inorganic layer 1 also has an uneven structure, the microspheres 21 located in the recessed region can be stacked and distributed, and the microspheres 21 located outside the recessed region can be distributed in a single layer, such that the thickness of the buffer layer 2 is not uniform.
It should be noted that all of the microspheres 21 are included in the buffer layer 2, and fig. 4 and 5 only show that the microspheres 21 are labeled as 21, and do not represent that the buffer layer 2 only includes the microspheres labeled as 21.
In one embodiment, as shown in fig. 6, the microsphere 21 may comprise a core 211 and a shell 212, wherein:
the spherical core 211 may have a diameter of 10nm to 20nm, although it may be less than 10nm, or greater than 20 nm. In order to fix the microspheres 21, the material of the core 211 may be a magnetic material, so that the microspheres 21 can be fixed on the first inorganic layer 1 under the action of a magnetic field, for example, the material of the core 211 may be at least one of iron, cobalt, and nickel, or other magnetic materials.
The spherical shell 212 may be coated on the spherical core 211, and the material thereof may be a flexible transparent material, for example, the material of the spherical shell 212 may include at least one of Polydimethylsiloxane (PMDS) and Polystyrene (PS), and may also be other organic polymer materials having flexibility and transparency. Because the spherical shell 212 has flexibility, the microspheres 21 can absorb stress generated when the first inorganic layer 1 and the organic layer 3 are bent, so that water and oxygen are prevented from entering due to gaps, and the reliability of the display panel is further improved.
The microspheres 21 may be prepared by an emulsion polymerization method, and the specific steps are described in the following embodiments of the display panel, and will not be described in detail here. Of course, the microspheres 21 can also be formed by a chemical deposition method, a dispersion polymerization method, a microwave hydrothermal method, and the like, and are not particularly limited herein.
In other embodiments of the present disclosure, the microspheres 21 may be homogeneous spheres, or the core 211 may be a non-magnetic material, as long as the microspheres 21 can be laid on the surface of the first inorganic layer 1 away from the array substrate 100 to form an uneven surface, which can block the flow of the organic layer 3.
As shown in fig. 4 and 5, the organic layer 3 may cover the buffer layer 2 and fill gaps between the microspheres 21, the organic layer 3 and the spherical shell 212 of the microspheres 21 may be made of the same organic polymer material, which is beneficial to improve the bonding force between the organic layer 3 and the microspheres 21, and the spherical shell 212 and the organic layer 3 may be made of the same organic polymer material or different organic polymer materials. For example, the organic layer 3 may be formed on the buffer layer 2 by inkjet printing, and during the preparation process, the liquid organic layer material may slowly flow and solidify under the obstruction of the microspheres 21 to form the organic layer 3, so as to prevent overflow due to the obstruction of the microspheres 21, thereby being beneficial to reducing or even omitting the barrier dam. Meanwhile, in the process of forming the organic layer 3, the organic layer can flow into gaps between the microspheres 21, and the bonding force between the buffer layer 2 and the organic layer 3 is improved. In addition, the surface of the organic layer 3 away from the buffer layer 2 may be planar to achieve planarization.
In one embodiment, as shown in fig. 6, the first inorganic layer 1 is a hydrophilic substance, and the organic layer 3 is a hydrophobic substance; the microsphere 21 may further include a surfactant layer 213, the surfactant layer 213 may be coated outside the spherical shell 212, and the surfactant layer 213 may include a hydrophilic portion and a hydrophobic portion, the hydrophilic portion including a hydrophilic group, and the hydrophobic portion including a hydrophobic group. For example, the hydrophilic group may include carboxylic acid, sulfonic acid, sulfuric acid, amino group or amino group and salts thereof, polar hydrophilic group such as hydroxyl group, amide group, ether bond, etc.; the hydrophobic group may comprise a non-polar hydrocarbon chain. Thus, the microspheres 21 can be made to have both hydrophilic and oleophilic functions, the hydrophilic portion can be oriented toward and in contact with the first inorganic layer 1, and the hydrophobic portion can be oriented toward and in contact with the organic layer 3.
The hydrophilic group of the surfactant layer 213 is more than that of the organic layer 3, so that the bonding force between the microspheres 21 and the first inorganic layer 1 is greater than that between the organic layer 3 and the first inorganic layer 1, the bonding force between the first inorganic layer 1 and the organic layer 3 can be increased by the microspheres 21, and under the condition of deformation of the display panel, a gap between the first inorganic layer 1 and the organic layer 3 is prevented, water and oxygen are prevented from entering, and the performance of the display panel is guaranteed.
As shown in fig. 4 and 5, the display panel of the present disclosure may further include a second inorganic layer 4 that may cover a surface of the organic layer 3 away from the buffer layer 2, the second inorganic layer 4 may be a single layer or a multi-layer structure, and a material thereof may be a transparent material capable of blocking water and oxygen, for example, the material of the second inorganic layer 4 may include SiNX、SiO2、SiC、Al2O3At least one of ZnS, ZnO and ZSM, wherein the ZSM at least comprises ZnO and Al2O3And MgO, although the second inorganic layer 4 may be other materials.
The second inorganic layer 4 may be formed on the surface of the organic layer 3 away from the buffer layer 2 by Chemical Vapor Deposition (CVD), magnetron sputtering, Atomic Layer Deposition (ALD) or other processes, wherein the Chemical Vapor Deposition (CVD) may be Plasma Enhanced Chemical Vapor Deposition (PECVD), High Density Plasma Chemical Vapor Deposition (HDPCVD), or Inductively Coupled Plasma Chemical Vapor Deposition (ICPCVD).
The present disclosure also provides a method for packaging a display panel, which may have the same structure as the display panel of any of the above embodiments, wherein, as shown in fig. 3, the structure of the array substrate 100 has been described in the above embodiments and is not described in detail herein, for example, the method for manufacturing the array substrate 100 includes:
The substrate 101 may be a rigid material, such as glass, or a flexible material, such as PI (polyimide), PET (polyethylene terephthalate), etc., and is not limited herein.
Forming the display device layers described above, i.e., step 200, may include:
step S210, forming a first electrode layer 102 on one side of the substrate 1, wherein the first electrode layer 102 may include a plurality of first electrodes.
For example, an electrode material layer may be formed on the substrate 1 by a magnetron sputtering process and patterned to obtain the first electrode layer 102.
Step S220, forming a pixel defining layer 103 on the surface of the first electrode layer 102 away from the substrate 1, where the pixel defining layer 103 has a plurality of pixel regions, and each first electrode is exposed in one-to-one correspondence to each pixel region.
In step S230, the light emitting layer 104 is formed in each pixel region, and the light emitting layer 104 is connected to the first electrode layer 102.
For example, the light-emitting layer 104 may include a hole injection layer, a hole transport layer, a light-emitting material layer, an electron transport layer, and an electron injection layer, wherein the hole injection layer is disposed on the first electrode layer 102, the hole transport layer is disposed on the hole injection layer, the light-emitting material layer is disposed on the hole transport layer, the electron transport layer is disposed on the light-emitting material layer, and the electron injection layer is disposed on the electron transport layer.
Step S240, a second electrode layer 105 covering the pixel defining layer 103 and the light emitting layer 104 is formed.
For example, the second electrode layer 105 may be formed on the definition layer 103 and the light emitting layer 104 by an evaporation process.
As shown in fig. 7, the packaging method of the embodiment of the present disclosure includes:
step S110 is to form a first inorganic layer on the light emitting side of an array substrate.
Step S120, forming a buffer layer on the surface of the first inorganic layer away from the array substrate, where the buffer layer includes microspheres distributed on the surface of the first inorganic layer away from the array substrate.
Step S130, forming an organic layer covering the buffer layer and filling gaps between the microspheres.
According to the packaging method of the embodiment, the microspheres of the buffer layer can form the uneven surface on the first inorganic layer, and the organic layer can be prevented from flowing towards the edge, so that the blocking dam can be reduced or even omitted, the occupied space of the blocking dam is prevented from being too large, and the frame is narrower. Meanwhile, the gap between the organic layer filling microspheres can increase the contact surface between the organic layer and the buffer layer, the bonding force between the organic layer and the first inorganic layer is increased, the risk of gaps between the organic layer and the first inorganic layer due to deformation of the display panel is reduced, the water and oxygen are prevented from invading the display panel, and the reliability of the display panel is improved.
The following describes the steps of the packaging method according to the embodiment of the present disclosure in detail:
in step S110, a first inorganic layer is formed on a light emitting side of an array substrate.
The structure of the array substrate can refer to the above description of the array substrate, and will not be described in detail here. As shown in fig. 10, the first inorganic layer 1 is disposed on the light-emitting side of the array substrate 100, for example, the first inorganic layer 1 may cover the second electrode layer 105 of the array substrate 1. The material of the first inorganic layer 1 is a transparent material capable of blocking the action of water and oxygen, for example, the material of the first inorganic layer 1 may include SiNX、SiO2、SiC、Al2O3At least one of ZnS, ZnO and ZSM, wherein the ZSM at least comprises ZnO and Al2O3And MgO, although the first inorganic layer 1 may be other materials.
For example, the first inorganic layer 1 may be formed on the array substrate 100 by Chemical Vapor Deposition (CVD), magnetron sputtering, atomic layer deposition or other processes, and the thickness of the first inorganic layer 1 may be 0.05 μm to 3.0 μm, but may be less than 0.05 μm or greater than 3.0 μm.
In step S120, a buffer layer is formed on the surface of the first inorganic layer away from the array substrate, where the buffer layer includes microspheres distributed on the surface of the first inorganic layer away from the array substrate, each of the microspheres includes a core and a shell covering the core, and the core is made of a magnetic material.
For example, as shown in fig. 8, the buffer layer 2 is formed on the surface of the first inorganic layer 1 away from the array substrate 100, i.e., the step S120 may include steps S1210 to S1240, wherein:
step S1210, forming microspheres, wherein each microsphere comprises a core and a spherical shell coating the core, and the core is made of a magnetic material.
As shown in fig. 6, the structure of the microsphere 21 can refer to the microsphere 21 in the display panel, and will not be described in detail here. In one embodiment, the microsphere 21 may include a core 211 and a shell 212 covering the core 211, wherein the material of the core 211 may be a magnetic material, such as at least one of iron, cobalt and nickel. The material of the spherical shell 212 may be a flexible transparent material, for example, the material of the spherical shell 212 may include at least one of polydimethylsiloxane and polystyrene, and may also be other organic polymer materials having flexibility and transparency. Accordingly, in one embodiment, the microspheres may be formed by an emulsion polymerization process, i.e., step S1210 may include steps S12110 through S12130, wherein:
step S12110, the spherical cores are dispersed in a second solvent.
The second solvent may be an aqueous solution of an emulsifier. After the core is added to the second solvent, sufficient stirring may be performed to sufficiently disperse the core 211 in the solvent, the core 211 being a magnetic material.
Step S12120, an initiator for initiating a polymerization reaction is added to the second solvent to form a spherical shell covering the spherical core.
The initiator may include potassium persulfate, ammonium persulfate, etc., as long as it can initiate polymerization reaction to form the spherical shell 212 outside the spherical core 211. The material of the spherical shell 212 may include polydimethylsiloxane, polystyrene, and the like.
Step S12130 of adding a surfactant to the second solvent to form a surfactant layer coating the spherical shell, the surfactant layer including a hydrophilic portion and a hydrophobic portion, the hydrophilic portion including a hydrophilic group and being in contact with the first inorganic layer; the hydrophobic portion comprises a hydrophobic group and is in contact with the organic layer.
The hydrophilic group of the surfactant layer 213 is more than that of the organic layer 3, so that the bonding force between the microspheres 21 and the first inorganic layer 1 is greater than that between the organic layer 3 and the first inorganic layer 1, the bonding force between the first inorganic layer 1 and the organic layer 3 can be increased by the microspheres 21, and under the condition of deformation of the display panel, a gap between the first inorganic layer 1 and the organic layer 3 is prevented, water and oxygen are prevented from entering, and the performance of the display panel is guaranteed.
In other embodiments of the present disclosure, if the core 211 is made of a magnetic material, the microspheres 21 can be prepared by a chemical deposition method, a dispersion polymerization method, a microwave hydrothermal method, and the like, and the specific process is not described in detail herein.
In addition, in order to prevent agglomeration of the microspheres 21, a surface dispersant may be added to the second solvent, and the surface dispersant may include at least one of sodium dodecylbenzenesulfonate and sodium dodecylsulfate, but may be other surface dispersants.
Step S1220, dispersing the microspheres in a first solvent.
The first solvent may be methanol, ethanol or ethyl acetate with a boiling point lower than 80 ℃, and may be other solvents. The plurality of microspheres 21 can be dispersed in the first solvent without causing damage to the microspheres 21.
Step S1230, forming the first solvent on the surface of the first inorganic layer away from the array substrate.
As shown in fig. 11, the first solvent containing the microspheres 21 may be formed on the surface of the first inorganic layer 1 away from the array substrate 100 by means of drop coating, or inkjet printing.
Step S1240, fixing the microspheres on the first inorganic layer by an external magnetic field, and evaporating to remove the first solvent, so as to obtain the buffer layer.
As shown in fig. 12, the applied magnetic field may be provided on a side of the array substrate 100 away from the first inorganic layer 1, and may be a natural magnet or an electromagnet, and a specific structure thereof is not particularly limited. The applied magnetic field generates an attractive force to the microsphere 21 having the magnetic core 211, so that the microsphere 21 can be fixed on the first inorganic layer 1, where the S direction in fig. 12 is a magnetic field direction.
The first solvent 200 may be evaporated by heating, thereby removing the first solvent 200 on the first inorganic layer 1 while leaving the microspheres 21, thereby obtaining the buffer layer 2, as shown in fig. 12.
It should be noted that by controlling the thickness of the first solvent 200 on the first inorganic layer 1 and the concentration of the microspheres 21 in the first solvent 200, the number of microspheres 21 on the first inorganic layer 1 can be controlled to form a single layer or multiple layers of microspheres 21.
Of course, in other embodiments of the present disclosure, the microspheres 21 may also be laid directly on the first inorganic layer 1 to obtain the buffer layer 2 without the aid of the first solvent.
In step S130, an organic layer covering the buffer layer and filling gaps between the microspheres is formed.
As shown in fig. 13, the organic layer 3 covering the buffer layer 2 may be formed by inkjet printing or other means, and in the process, the organic layer 3 is cured after being slowly leveled on the uneven surface formed by the microspheres 21 and blocked by the microspheres 21 at the edges, so that the blocking dam can be reduced or prevented from being provided.
As shown in fig. 9, the packaging method according to the embodiment of the present disclosure may further include:
step S140, forming a second inorganic layer covering the organic layer.
As shown in fig. 4 and 5, the second inorganic layer 4 may be formed on the surface of the organic layer 3 away from the buffer layer 2 by using chemical vapor deposition, magnetron sputtering, atomic layer deposition or other processes, wherein the chemical vapor deposition may be plasma enhanced chemical vapor deposition, high density plasma chemical vapor deposition or inductively coupled plasma chemical vapor deposition.
The material of the second inorganic layer 4 may include SiNX、SiO2、SiC、Al2O3At least one of ZnS, ZnO and ZSM, wherein the ZSM at least comprises ZnO and Al2O3And MgO, but the second inorganic layer 4 may be other material having a water-oxygen barrier effect.
In one embodiment, as shown in fig. 1 and 5, the buffer layer 2 and the organic layer 3 both expose a portion of the first inorganic layer 1 in the edge region B, and the second inorganic layer 4 may cover the organic layer 3 and the buffer layer 2 and cover a portion of the first inorganic layer 1 in the edge region B, i.e., the second inorganic layer 4 is disposed to overlap the first inorganic layer 1 in the edge region B of the first inorganic layer 1.
The embodiments of the present disclosure provide a display device, which may include the display panel of the above embodiments, and the detailed structure of the display panel has been described in the above embodiments of the display panel and the packaging method, and is not described in detail here.
Other embodiments of the disclosure will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the disclosure following, in general, the principles of the disclosure and including such departures from the present disclosure as come within known or customary practice within the art to which the disclosure pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.
Claims (8)
1. A display panel, comprising:
an array substrate;
the first inorganic layer is arranged on the light emergent side of the array substrate;
the buffer layer comprises a plurality of microspheres distributed on the surface of the first inorganic layer far away from the array substrate; the microsphere comprises a spherical core and a spherical shell coating the spherical core, wherein the spherical core is made of a magnetic material, and the spherical shell is made of an organic material;
an organic layer covering the buffer layer and filling gaps between the microspheres;
the microsphere further comprises:
the surface active agent layer is coated outside the spherical shell and comprises a hydrophilic part and a hydrophobic part, and the hydrophilic part comprises a hydrophilic group and is in contact with the first inorganic layer; the hydrophobic portion comprises a hydrophobic group and is in contact with the organic layer.
2. The display panel according to claim 1, wherein the material of the spherical core comprises at least one of iron, cobalt, and nickel, and the material of the spherical shell and the material of the organic layer each comprise an organic polymer material.
3. The display panel according to claim 1, wherein the spherical core has a diameter of 10nm to 20nm and the microspheres have a diameter of 1 μm to 5 μm.
4. The display panel according to any of claims 1 to 3, wherein the microspheres are distributed along the first inorganic layer and each of the microspheres is distributed in a monolayer such that the thickness of the buffer layer is the diameter of the microsphere; or
The microspheres are distributed along the first inorganic layer, and the microspheres are distributed in multiple layers on part or all of the surface of the first inorganic layer.
5. A method for encapsulating a display panel, comprising:
forming a first inorganic layer on a light emergent side of an array substrate;
forming a buffer layer on the surface of the first inorganic layer far away from the array substrate, wherein the buffer layer comprises microspheres distributed on the surface of the first inorganic layer far away from the array substrate; the microsphere comprises a spherical core and a spherical shell coating the spherical core, wherein the spherical core is made of a magnetic material, and the spherical shell is made of an organic material;
forming an organic layer covering the buffer layer and filling gaps among the microspheres;
the microsphere further comprises:
the surface active agent layer is coated outside the spherical shell and comprises a hydrophilic part and a hydrophobic part, and the hydrophilic part comprises a hydrophilic group and is in contact with the first inorganic layer; the hydrophobic portion comprises a hydrophobic group and is in contact with the organic layer.
6. The method of claim 5, wherein forming a buffer layer on a surface of the first inorganic layer away from the array substrate comprises:
forming microspheres;
dispersing the microspheres in a first solvent;
forming the first solvent on the surface of the first inorganic layer far away from the array substrate;
and fixing the microspheres on the first inorganic layer through an external magnetic field, and evaporating to remove the first solvent to obtain the buffer layer.
7. The encapsulation method according to claim 5 or 6, further comprising:
a second inorganic layer is formed overlying the organic layer.
8. A display device characterized by comprising the display panel according to any one of claims 1 to 4.
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| CN111864104B (en) * | 2020-07-08 | 2022-07-12 | 武汉华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and display device |
| CN112909202B (en) * | 2021-01-25 | 2022-12-09 | 绵阳京东方光电科技有限公司 | Display panel, preparation method thereof and display device |
| CN114613818B (en) * | 2022-03-02 | 2023-10-17 | 深圳市华星光电半导体显示技术有限公司 | display device |
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