CN109904349A - Display device, display panel and its packaging method - Google Patents

Display device, display panel and its packaging method Download PDF

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Publication number
CN109904349A
CN109904349A CN201910226787.6A CN201910226787A CN109904349A CN 109904349 A CN109904349 A CN 109904349A CN 201910226787 A CN201910226787 A CN 201910226787A CN 109904349 A CN109904349 A CN 109904349A
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China
Prior art keywords
layer
microballoon
display panel
inorganic layer
ball
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CN201910226787.6A
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CN109904349B (en
Inventor
王小芬
孙中元
倪静凯
隋凯
刘晓云
靳倩
董超
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Abstract

The disclosure provides a kind of display device, the packaging method of display panel and display panel, is related to field of display technology.The display panel includes array substrate, the first inorganic layer, buffer layer and organic layer, and the first inorganic layer is set to the light emission side of array substrate;Buffer layer includes the multiple microballoons for being distributed in surface of first inorganic layer far from array substrate;Organic layer covering buffer layer simultaneously fills the gap between microballoon.The display panel of the disclosure, which can reduce or save, stops dam the space occupied, to keep frame narrower.

Description

Display device, display panel and its packaging method
Technical field
This disclosure relates to field of display technology, in particular to a kind of display device, display panel and display panel Packaging method.
Background technique
Currently, the application of OLED (Organic Light-Emitting Diode, Organic Light Emitting Diode) display panel It is more and more extensive, wherein the encapsulation of display panel is directly related to the performance of display, and thin-film package is a kind of common envelope Dress technology can be packaged, existing encapsulated layer one by forming encapsulated layer in the array substrate for including luminescent device As include set on array substrate light emission side organic layer and cover the inorganic layer of the organic layer, but in order to prevent organic layer from display The rim overflow of panel needs to stop dam to stop organic layer in adding for display panel, but this can occupy larger space, make to show The frame of showing device is wider.
It should be noted that information is only used for reinforcing the reason to the background of the disclosure disclosed in above-mentioned background technology part Solution, therefore may include the information not constituted to the prior art known to persons of ordinary skill in the art.
Summary of the invention
The disclosure is designed to provide a kind of display device, the packaging method of display panel and display panel, can reduce Or save and stop dam the space occupied, to keep frame narrower.
According to one aspect of the disclosure, a kind of display panel is provided, comprising:
First inorganic layer, set on the light emission side of array basal plate;
Buffer layer, the buffer layer include be distributed in the surface of first inorganic layer far from the array substrate multiple Microballoon;
Organic layer covers the buffer layer and fills the gap between the microballoon.
In a kind of exemplary embodiment of the disclosure, the microballoon includes the spherical shell outside ball and the cladding ball, The ball is magnetic material, and the spherical shell is organic material.
In a kind of exemplary embodiment of the disclosure, the microballoon further include:
Surfactant layer is coated on outside the spherical shell, and the surfactant layer includes hydrophilic portion and hydrophobic portion, described Hydrophilic portion includes hydrophilic radical, and is contacted with first inorganic layer;The hydrophobic portion include hydrophobic grouping, and with it is described organic Layer contact.
In a kind of exemplary embodiment of the disclosure, the material of the ball includes at least one of iron, cobalt and nickel, institute The material for stating spherical shell and the organic layer includes high-molecular organic material.
In a kind of exemplary embodiment of the disclosure, the diameter of the ball is 10nm-20nm, the diameter of the microballoon It is 1 μm -5 μm.
In a kind of exemplary embodiment of the disclosure, the microballoon of stating is distributed along first inorganic layer, and each institute Microballoon monolayer distribution is stated, so that the diameter with a thickness of the microballoon of the buffer layer;Alternatively, the microballoon is along first nothing The distribution of machine layer, and microballoon Multi-layers distributing on the partially or fully surface of first inorganic layer.
According to one aspect of the disclosure, a kind of packaging method of display panel is provided, comprising:
The first inorganic layer is formed in the light emission side of array basal plate;
Buffer layer is formed far from the surface of the array substrate in first inorganic layer, the buffer layer includes being distributed in The microballoon on the surface of first inorganic layer far from the array substrate;
Form the organic layer for covering the buffer layer and filling the gap between the microballoon.
In a kind of exemplary embodiment of the disclosure, in surface shape of first inorganic layer far from the array substrate At buffer layer, comprising:
Microballoon is formed, each microballoon includes ball and coats the spherical shell outside the ball, and the ball is magnetic material Matter, the spherical shell are organic material;
The microballoon is dispersed in the first solvent;
First solvent is formed in the surface of first inorganic layer far from the array substrate;
The microballoon is fixed on first inorganic layer by externally-applied magnetic field, and the first solvent described in evaporative removal, To obtain the buffer layer.
In a kind of exemplary embodiment of the disclosure, the packaging method further include:
Form the second inorganic layer for covering the organic layer.
According to one aspect of the disclosure, a kind of display device is provided, the panel substrate including above-mentioned Arbitrary Term.
The packaging method of disclosure display device, display panel and display panel, the first inorganic layer is far from array substrate Surface is provided with buffer layer, and organic layer covers buffer layer, and fills the gap between microballoon.The microballoon of buffer layer can be in the first nothing Rough surface is formed on machine layer, and organic layer can be hindered to avoid to edge flowing so as to reduce or even save blocking dam Stop dam the space occupied excessive, is conducive to keep frame narrower.Meanwhile the gap between organic layer filling microballoon, it is possible to increase have The contact surface of machine layer and buffer layer is conducive to the binding force for increasing organic layer and the first inorganic interlayer, reduces because of display panel It deforms and organic layer and the first inorganic interlayer is made the risk in gap occur, be beneficial to prevent inside water oxygen intrusion display panel, mention The reliability of high display panel.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not The disclosure can be limited.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the disclosure Example, and together with specification for explaining the principles of this disclosure.It should be evident that the accompanying drawings in the following description is only the disclosure Some embodiments for those of ordinary skill in the art without creative efforts, can also basis These attached drawings obtain other attached drawings.
Fig. 1 is the viewing area of display panel and the schematic diagram of marginal zone.
Fig. 2 is the schematic diagram of display panel in the related technology.
Fig. 3 is the schematic diagram of the array substrate of disclosure embodiment display panel.
Fig. 4 is partial schematic diagram of the disclosure embodiment display panel in viewing area.
Fig. 5 is partial schematic diagram of the disclosure embodiment display panel in marginal zone.
Fig. 6 is the partial schematic diagram of the buffer layer of disclosure embodiment display panel.
Fig. 7 is the flow chart of one embodiment of disclosure packaging method.
Fig. 8 is the flow chart of the step S120 of disclosure embodiment packaging method.
Fig. 9 is the flow chart of another embodiment of disclosure packaging method.
Figure 10 is the structural schematic diagram after the step S110 for completing disclosure embodiment packaging method.
Figure 11 is the structural schematic diagram after the step S1230 for completing disclosure embodiment packaging method.
Figure 12 is the structural schematic diagram after the step S1240 for completing disclosure embodiment packaging method.
Figure 13 is the structural schematic diagram completed in disclosure embodiment after the step S130 of packaging method.
In Fig. 1: the viewing area A,;B, marginal zone;
In Fig. 2: 1a, array substrate;2a, encapsulated layer;21a, the first inorganic layer;22a, organic layer;3a, stop dam;
In Fig. 3-Figure 13: 100, array substrate;101, substrate;102, first electrode layer;103, luminescent layer;104, pixel is fixed Adopted layer;105, the second electrode lay;1, the first inorganic layer;2, buffer layer;21, microballoon;211, ball;212, spherical shell;213, surface Active agent layer;3, organic layer;4, the second inorganic layer.
Specific embodiment
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be with a variety of shapes Formula is implemented, and is not understood as limited to embodiment set forth herein;On the contrary, thesing embodiments are provided so that the disclosure will Fully and completely, and by the design of example embodiment comprehensively it is communicated to those skilled in the art.Identical attached drawing in figure Label indicates same or similar structure, thus the detailed description that will omit them.
Although the term of relativity, such as "upper" "lower" is used to describe a component of icon for another in this specification The relativeness of one component, but these terms are in this manual merely for convenient, for example, with reference to the accompanying drawings described in show The direction of example.It is appreciated that, if making it turn upside down the device overturning of icon, the component described in "upper" will As the component in "lower".When certain structure is at other structures "upper", it is possible to refer to that certain structural integrity is formed in other structures On, or refer to that certain structure is " direct " and be arranged in other structures, or refer to that certain structure is arranged by the way that another structure is " indirect " in other knots On structure.
Term "one", " one ", "the", " described " to indicate there are one or more elements/component part/etc.;With Language " comprising " and " having " is to indicate the open meaning being included and refer to element/composition portion in addition to listing Also may be present except divide/waiting other element/component part/etc.;Term " first ", " second " only use as label, are not Quantity limitation to its object.
As shown in Figure 1, display panel has the viewing area A and marginal zone B around viewing area A, in the related technology, such as Fig. 2 Shown, display panel includes array substrate 1a and encapsulated layer 2a, and encapsulated layer 2a is set to the light emission side of array substrate 1a, i.e. array base The side for the light institute directive that plate 1a is issued, encapsulated layer 2a include inorganic layer 21a and organic layer 22a, and inorganic layer 21a is set to array On substrate 1a, organic layer 22a is set on inorganic layer 21a.Organic layer 22a is shown from the marginal zone B overflow of display panel in order to prevent Show that panel further includes the surface set on inorganic layer 21a and two blocking dam 3a for being located at marginal zone B, stopping dam 3a can be annular, Two blocking dam 3a diameters are different, and concentrically surround organic layer 22a setting, so as to stop organic layer 22a to rim overflow.
Due to stopping dam 3a that can occupy larger space, and two circles stop the spacing of dam 3a up to 100-150um, so that edge Area B wider keeps the frame for blocking marginal zone B in display device wider, simultaneously as between organic layer 22a and inorganic layer 21a Binding force is poor, in display panel when being squeezed or bending, is easy to appear crack therebetween, increases water oxygen invasion Risk.
Disclosure embodiment provides a kind of display panel, and as shown in Figure 4 and Figure 5, which includes array base Plate 100, the first inorganic layer 1, buffer layer 2 and organic layer 3, in which:
Array substrate 100 has backlight side and light emission side.First inorganic layer 1 is set to the light emission side of array substrate 100.Buffering Layer 2 includes the multiple microballoons 21 for being distributed in the first surface of the inorganic layer 1 far from array substrate 100.Organic layer 3 covers buffer layer 2 And fill the gap between microballoon 21.
The display panel of disclosure embodiment, the microballoon 21 of buffer layer 2 can form uneven on the first inorganic layer 1 Surface, can hinder organic layer 3 to marginal zone B flow, so as to reduce or even save blocking dam, avoid stop dam occupy sky Between it is excessive, be conducive to keep frame narrower, and the L in Fig. 5 it can be seen from Fig. 5 and Fig. 22Less than L in Fig. 21, stop due to eliminating Dam, so that the space of marginal position is reduced.Meanwhile organic layer 3 fills the gap between microballoon 21, it is possible to increase organic layer 3 With the contact surface of buffer layer 2, is conducive to increase the binding force between organic layer 3 and the first inorganic layer 1, reduces the change because of display panel Shape and make occur the risk in gap between organic layer 3 and the first inorganic layer 1, be beneficial to prevent water oxygen intrusion display panel inside, mention The reliability of high display panel.
Each section of disclosure embodiment display panel is described in detail below:
As shown in figure 3, array substrate 100 can be used for showing image, for example, array substrate 100 can be OLED array Substrate, array substrate 100 may include substrate 101 and display device layer, in which:
Array substrate 100.
Substrate 101 can be rigid material, such as glass, be also possible to flexible material, such as PI (polyimides) and PET (polyethylene terephthalate) etc., does not do particular determination herein.
Display device layer can be set to the side of substrate 101, may include first electrode layer 102, pixel defining layer 103, hair Photosphere 104 and the second electrode lay 105, in which:
First electrode layer 102 can be anode, can be set on substrate 101, and the first electrode including multiple array distributions;
Pixel defining layer 103 can be set to the surface that substrate 101 is equipped with first electrode layer 102, and have multiple pixel regions, respectively A pixel region exposes each first electrode correspondingly;
Luminescent layer 104 is set in each pixel region, and is connect with first electrode layer 102, and luminescent layer 104 may include Hole injection layer (Hole Inject Layer, HIL), hole transmission layer (Hole Transport Layer, HTL), shine material The bed of material, electron transfer layer (Electron Transport Layer, ETL) and electron injecting layer (Electron Inject Layer, EIL), wherein hole injection layer is set in first electrode layer 102, and hole transmission layer is set on hole injection layer, is shone Material layer is set on hole transmission layer, and electron transfer layer is set to luminous material layer, and electron injecting layer is set on electron transfer layer.
The second electrode lay 105 can be cathode, can cover pixel defining layer 103 and luminescent layer 104, and second electrode 105 is remote Side from substrate 101 is the light emission side of array substrate 100.By being applied between first electrode layer 102 and the second electrode lay 105 Making alive can make luminescent layer 103 shine, to show image, this will not be detailed here for the displaying principle of OLED array.
As shown in Figure 4 and Figure 5, Fig. 4 is located in the A of viewing area for showing the first inorganic layer 1, buffer layer 2 and organic layer 3 Partial structure, the structure for the part that Fig. 5 is used to show that the first inorganic layer 1, buffer layer 2 and organic layer 3 are located in the B of marginal zone.
As shown in Figure 4 and Figure 5, the first inorganic layer 1 is set to the light emission side of array substrate 100, for example, the first inorganic layer 1 can It is covered on the second electrode lay 105 of array substrate 100.The material of first inorganic layer 1 be can obstruct water oxygen effect it is transparent Material, for example, the material of the first inorganic layer 1 may include SiNX、SiO2、SiC、Al2O3, at least one of ZnS, ZnO, ZSM, ZSM includes at least ZnO, Al2O3And MgO, certainly, the first inorganic layer 1 is also possible to other materials.
First inorganic layer 1 can be by chemical vapor deposition (CVD), magnetron sputtering, atomic layer deposition (ALD) or other technique shapes At in array substrate 100, and the thickness of the first inorganic layer 1 can be 0.05 μm -3.0 μm, and certainly, thickness is also smaller than 0.05 μm, or it is greater than 3.0 μm.
As shown in Figure 4 and Figure 5, buffer layer 2 can be set to the first surface of the inorganic layer 1 far from array substrate 100, and buffer layer 2 may include multiple microballoons 21, and the diameter of microballoon 21 can be 1 μm -5 μm, certainly, also greater than 1 μm, or less than 5 μm.Microballoon 21 can Along the first inorganic layer 1 be distributed, each microballoon 21 can monolayer distribution so that the diameter with a thickness of microballoon 21 of buffer layer 2;Alternatively, Microballoon 21 can also on the partially or fully surface of the first inorganic layer 1 Multi-layers distributing.For example, the second electrode of array substrate 100 Layer 104 is recessed in the pixel region of pixel defining layer 103, so that the second electrode lay 104 is rough surface, correspondingly, the One inorganic layer 1 is also rough structure, the stackable distribution of microballoon 21 in sunk area, and is located at other than depressed area Microballoon 21 can monolayer distribution so that in uneven thickness everywhere in buffer layer 2.
It should be noted that including all microballoons 21 in buffer layer 2, other microballoon 21 is only labeled as 21 in Fig. 4 and Fig. 5, Do not represent buffer layer 2 only include be marked as 21 microballoon.
In one embodiment, as shown in fig. 6, microballoon 21 may include ball 211 and spherical shell 212, in which:
The diameter of ball 211 can be 10nm-20nm, certainly, also be smaller than 10nm, or be greater than 20nm.For the ease of to micro- Ball 21 is fixed, and the material of ball 211 can be magnetic material, makes microballoon 21 that can be fixed on first under the influence of a magnetic field inorganic On layer 1, for example, the material of ball 211 can be at least one of iron, cobalt and nickel, it is also possible to other magnetic materials.
Spherical shell 212 can be coated on outside ball 211, and material can be transparent material flexible, for example, the material of spherical shell 212 It may include at least one of dimethyl silicone polymer (PMDS) and polystyrene (PS), be also possible to other with flexible and transparent High-molecular organic material.Since spherical shell 212 has flexibility, so that microballoon 21 can absorb the first inorganic layer 1 and organic layer 3 is bent When the stress that generates, prevent gap and invade water oxygen, further increase the reliability of display panel.
Microballoon 21 can be prepared by emulsion polymerization, and specific steps, which are shown below in the embodiment of panel, to be illustrated, This is no longer described in detail.Certainly, also microballoon 21 can be formed by the methods of chemical deposition, dispersion copolymerization method and microwave-hydrothermal method, This does not do particular determination.
In the other embodiment of the disclosure, microballoon 21 can also be the sphere of homogeneous, alternatively, ball 211 is also possible to Non-magnetic material is formed rough as long as microballoon 21 can be layed in the first surface of the inorganic layer 1 far from array substrate 100 Surface can hinder organic layer 3 to flow.
As shown in Figure 4 and Figure 5, organic layer 3 can cover buffer layer 2, and fill the gap between microballoon 21, and organic layer 3 can be with The spherical shell 212 of microballoon 21 is all high-molecular organic material, is conducive to the binding force for improving organic layer 3 and microballoon 21,212 He of spherical shell Organic layer 3 can be identical high-molecular organic material, can also be different.For example, can by way of inkjet printing Organic layer 3 is formed on buffer layer 2, during the preparation process, the organic layer material of liquid can slowly flow under the obstruction of microballoon 21 And it is formed by curing organic layer 3, to prevent overflow by the obstruction of microballoon 21, be conducive to reduce blocking dam or even save blocking Dam.Meanwhile during the formation of organic layer 3, the gap between microballoon 21 can be flowed into, buffer layer 2 and organic layer 3 are improved Binding force.In addition, surface of the organic layer 3 far from buffer layer 2 can be plane, to realize planarization.
In one embodiment, as shown in fig. 6, the first inorganic layer 1 is hydrophilic substance, organic layer 3 is hydrophobic substance;Microballoon 21 may also include surfactant layer 213, and surfactant layer 213 can be coated on outside spherical shell 212, and surfactant layer 213 can Including hydrophilic portion and hydrophobic portion, hydrophilic portion includes hydrophilic radical, and hydrophobic portion includes hydrophobic grouping.For example, hydrophilic radical can Including carboxylic acid, sulfonic acid, sulfuric acid, amino or amido and its salt, hydroxyl, amide groups, ehter bond isopolarity hydrophilic radical;Hydrophobic grouping can Including nonpolar hydrocarbon chain.It can make microballoon 21 as a result, while have the function of hydrophilic and oleophylic, hydrophilic portion can be towards and with the first nothing Machine layer 1 contacts, and hydrophobic portion can be contacted towards and with organic layer 3.
The hydrophilic radical of surfactant layer 213 is more than the hydrophilic radical in organic layer 3, so that microballoon 21 and first inorganic The binding force of layer 1 is greater than the binding force with organic layer 3 and the first inorganic layer 1, so as to increase the first inorganic layer 1 by microballoon 21 Prevent gap occur between the first inorganic layer 1 and organic layer 3 in the case where display panel deformation with the binding force of organic layer 3, It avoids water oxygen from invading, ensures the performance of display panel.
As shown in Figure 4 and Figure 5, the display panel of the disclosure may also include the second inorganic layer 4, and it is remote can to cover organic layer 3 Surface from buffer layer 2, the second inorganic layer 4 can be single layer or multiple layers of structure, and material is that can obstruct the transparent of water oxygen Material, for example, the material of the second inorganic layer 4 may include SiNX、SiO2、SiC、Al2O3, at least one of ZnS, ZnO, ZSM, ZSM includes at least ZnO, Al2O3And MgO, certainly, the second inorganic layer 4 is also possible to other materials.
Second inorganic layer 4 can be by chemical vapor deposition (CVD), magnetron sputtering, atomic layer deposition (ALD) or other technique shapes At on surface of the organic layer 3 far from buffer layer 2, wherein chemical vapor deposition (CVD) can be plasma enhanced chemical gas Mutually deposition (PECVD), high density plasma enhanced chemical vapor deposition (High Density Plasma CVD, HDPCVD) or induction coupling Conjunction plasma activated chemical vapour deposition (Inductively Coupled Plasma Chemical Vapor Deposition, ICPCVD) etc..
Disclosure embodiment also provides a kind of packaging method of display panel, the structure of display panel can with it is above-mentioned any The display panel of embodiment is identical, wherein as shown in figure 3, the structure of array substrate 100 carries out in the above-described embodiment Illustrate, this will not be detailed here, and for example, the manufacturing method of the array substrate 100 includes:
Step 100 provides a substrate 1;
Step 200 forms display device layer in the side of substrate 1.
Wherein, substrate 101 can be rigid material, such as glass, be also possible to flexible material, such as PI (polyimides) With PET (polyethylene terephthalate) etc., particular determination is not done herein.
Form aforementioned display device part layer, i.e. step 200, it may include:
Step S210, first electrode layer 102 is formed in 1 side of substrate, first electrode layer 102 may include multiple first electricity Pole.
For example, electrode material layer can be formed on substrate 1 by magnetron sputtering technique and is patterned, obtain One electrode layer 102.
Step S220, pixel defining layer 103, pixel defining layer are formed far from the surface of substrate 1 in first electrode layer 102 103 have multiple pixel regions, and each pixel region exposes each first electrode correspondingly.
Step S230, luminescent layer 104 is formed in each pixel region, and luminescent layer 104 is connect with first electrode layer 102.
For example, luminescent layer 104 may include hole injection layer, hole transmission layer, luminous material layer, electron transfer layer and Electron injecting layer, wherein hole injection layer is set in first electrode layer 102, and hole transmission layer is set on hole injection layer, is shone Material layer is set on hole transmission layer, and electron transfer layer is set to luminous material layer, and electron injecting layer is set on electron transfer layer.
Step S240, the second electrode lay 105 of covering pixel defining layer 103 and luminescent layer 104 is formed.
For example, the second electrode lay 105 can be formed on definition layer 103 and luminescent layer 104 by evaporation process.
As shown in fig. 7, the packaging method of disclosure embodiment includes:
Step S110, the first inorganic layer is formed in the light emission side of array basal plate.
Step S120, buffer layer, the buffer layer are formed far from the surface of the array substrate in first inorganic layer Microballoon including being distributed in the surface of first inorganic layer far from the array substrate.
Step S130, the organic layer for covering the buffer layer and filling the gap between the microballoon is formed.
The microballoon of the packaging method of disclosure embodiment, buffer layer can form rough table on the first inorganic layer Face can hinder organic layer to edge flowing, so as to reduce or even save blocking dam, avoid stopping dam the space occupied excessive, Be conducive to keep frame narrower.Meanwhile the gap between organic layer filling microballoon, it is possible to increase the contact surface of organic layer and buffer layer, Be conducive to increase the binding force of organic layer and the first inorganic interlayer, reducing makes organic layer and the first nothing because of the deformation of display panel There is the risk in gap in machine interlayer, is beneficial to prevent inside water oxygen intrusion display panel, improves the reliability of display panel.
Each step of disclosure embodiment packaging method is described in detail below:
In step s 110, the first inorganic layer is formed in the light emission side of array basal plate.
The structure of array substrate can refer to the above explanation to array substrate, and this will not be detailed here.As shown in Figure 10, One inorganic layer 1 is set to the light emission side of array substrate 100, for example, the first inorganic layer 1 can be covered in the second electrode of array substrate 1 On layer 105.The material of first inorganic layer 1 is the transparent material that can obstruct water oxygen effect, for example, the material of the first inorganic layer 1 It may include SiNX、SiO2、SiC、Al2O3, at least one of ZnS, ZnO, ZSM, ZSM includes at least ZnO, Al2O3And MgO, when So, the first inorganic layer 1 is also possible to other materials.
It for example, can be by chemical vapor deposition (CVD), magnetron sputtering, atomic layer deposition or other techniques in array The first inorganic layer 1 is formed on substrate 100, and the thickness of the first inorganic layer 1 can be 0.05 μm -3.0 μm, certainly, thickness can also Less than 0.05 μm, or it is greater than 3.0 μm.
In the step s 120, buffer layer is formed far from the surface of the array substrate in first inorganic layer, it is described slow Rushing layer includes the microballoon for being distributed in the surface of first inorganic layer far from the array substrate, and each microballoon includes ball With the spherical shell outside the cladding ball, the ball is magnetic material.
For example, it as shown in figure 8, forming buffer layer 2 far from the surface of array substrate 100 in the first inorganic layer 1, that is, walks Rapid S120 may include step S1210- step S1240, in which:
Step S1210, microballoon is formed, each microballoon includes the spherical shell outside ball and the cladding ball, the ball Core is magnetic material.
As shown in fig. 6, the structure of microballoon 21 can refer to the microballoon 21 in above-mentioned display panel, this will not be detailed here.One In embodiment, microballoon 21 may include ball 211 and the spherical shell 212 that is coated on outside ball 211, wherein the material of ball 211 can For magnetic material, for example, at least one of iron, cobalt and nickel.The material of spherical shell 212 can be transparent material flexible, for example, spherical shell 212 material may include at least one of dimethyl silicone polymer and polystyrene, be also possible to other with flexible and transparent High-molecular organic material.Correspondingly, in one embodiment, microballoon can be formed by emulsion polymerization, i.e. step S1210 can Including step S12110- step S12130, in which:
Step S12110, it disperses ball in the second solvent.
Second solvent can be the aqueous solution of emulsifier.After the second solvent is added in ball, it can be sufficiently stirred, so that ball 211 are well-dispersed in solvent, and ball 211 is magnetic material.
Step S12120, the initiator of initiated polymerization is added, in second solvent to form cladding ball Spherical shell.
Initiator may include potassium peroxydisulfate, Ammonium Persulfate 98.5 etc., as long as energy initiated polymerization, forms outside ball 211 Spherical shell 212.The material of spherical shell 212 may include dimethyl silicone polymer, polystyrene etc..
Step S12130, surfactant is added in second solvent, it is living with the surface for forming the cladding spherical shell Property oxidant layer, the surfactant layer includes hydrophilic portion and hydrophobic portion, and the hydrophilic portion includes hydrophilic radical, and with described first Inorganic layer contact;The hydrophobic portion includes hydrophobic grouping, and is contacted with the organic layer.
The hydrophilic radical of surfactant layer 213 is more than the hydrophilic radical in organic layer 3, so that microballoon 21 and first inorganic The binding force of layer 1 is greater than the binding force with organic layer 3 and the first inorganic layer 1, so as to increase the first inorganic layer 1 by microballoon 21 Prevent gap occur between the first inorganic layer 1 and organic layer 3 in the case where display panel deformation with the binding force of organic layer 3, It avoids water oxygen from invading, ensures the performance of display panel.
In the other embodiment of the disclosure, if ball 211 be magnetic material, can also by chemical deposition, point The methods of polymerization and microwave-hydrothermal method are dissipated to prepare microballoon 21, and this will not be detailed here for detailed process.
In addition, the reunion of microballoon 21 in order to prevent, can also in the second solvent middle addition Dispersion on surface, surface dispersant It may include neopelex, at least one in lauryl sodium sulfate, it is of course also possible to be other surface dispersants.
Step S1220, the microballoon is dispersed in the first solvent.
First solvent can be methanol, ethyl alcohol or the ethyl acetate etc. that boiling point is lower than 80 DEG C, it is of course also possible to be other Solvent.It can disperse multiple microballoons 21 in the first solvent, and microballoon 21 will not be damaged.
Step S1230, first solvent is formed in the surface of first inorganic layer far from the array substrate.
As shown in figure 11, can by the methods of drop coating, coating or inkjet printing by include microballoon 21 the first solvent shape At on the first surface of the inorganic layer 1 far from array substrate 100.
Step S1240, the microballoon is fixed on first inorganic layer by externally-applied magnetic field, and described in evaporative removal First solvent, to obtain the buffer layer.
As shown in figure 12, externally-applied magnetic field can be set to side of the array substrate 100 far from the first inorganic layer 1, can be day Right magnet or electromagnet, do not carry out particular determination to its specific structure herein.The externally-applied magnetic field can be to the ball with magnetic material The microballoon 21 of core 211 generates suction, and so as to which microballoon 21 to be fixed on the first inorganic layer 1, the direction S is magnetic field side in Figure 12 To.
The first solvent 200 can be made to evaporate by heating, thus the first solvent 200 on the first inorganic layer 1 of removal, and retain Microballoon 21, to obtain buffer layer 2, as shown in figure 12.
It should be noted that by the thickness and microballoon 21 of the first solvent 200 on the first inorganic layer 1 of control the Concentration in one solvent 200 can control the quantity of the microballoon 21 on the first inorganic layer 1, to form single-layer or multi-layer microballoon 21.
Certainly, in the other embodiment of the disclosure, microballoon 21 can also be laid with directly on the first inorganic layer 1, with To buffer layer 2, and without the help of the first solvent.
In step s 130, the organic layer for covering the buffer layer and filling the gap between the microballoon is formed.
As shown in figure 13, the organic layer 3 that covering buffer layer 2 can be formed by inkjet printing or other means, in this process In, the slow levelling in rough surface that organic layer 3 is formed in microballoon 21, and stopped later admittedly by the microballoon of edge 21 Change, stops dam or from setting blocking dam so as to reduce.
As shown in figure 9, the packaging method of disclosure embodiment may also include that
Step S140, the second inorganic layer for covering the organic layer is formed.
As shown in Figure 4 and Figure 5, can had using chemical vapor deposition, magnetron sputtering, atomic layer deposition or other techniques Machine layer 3 forms the second inorganic layer 4 on the surface far from buffer layer 2, wherein chemical vapor deposition can be plasma enhancing Learn vapor deposition, high density plasma enhanced chemical vapor deposition or inductively coupled plasma chemical vapor deposition etc..
The material of second inorganic layer 4 may include SiNX、SiO2、SiC、Al2O3, at least one of ZnS, ZnO, ZSM, ZSM Including at least ZnO, Al2O3And MgO, certainly, the second inorganic layer 4 is also possible to other materials with barrier water oxygen effect.
In one embodiment, as shown in Figure 1 and Figure 5, buffer layer 2 and organic layer 3 are all exposed the first inorganic layer 1 and are located at side Part in edge area B, the second inorganic layer 4 can coat organic layer 3 and buffer layer 2, and cover the first inorganic layer 1 and be located at marginal zone B Part, i.e. the second inorganic layer 4 overlaps in the marginal zone B of the first inorganic layer 1 with the first inorganic layer 1.
Disclosure embodiment provides a kind of display device, which may include the display surface of above embodiment Plate, the detailed construction of display panel are illustrated in the embodiment that panel and packaging method is shown above, herein not It is described in detail again.
Those skilled in the art after considering the specification and implementing the invention disclosed here, will readily occur to its of the disclosure Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or Person's adaptive change follows the general principles of this disclosure and including the undocumented common knowledge in the art of the disclosure Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by appended Claim is pointed out.

Claims (10)

1. a kind of display panel characterized by comprising
Array substrate;
First inorganic layer, set on the light emission side of the array substrate;
Buffer layer, the buffer layer include be distributed in the surface of first inorganic layer far from the array substrate multiple micro- Ball;
Organic layer covers the buffer layer and fills the gap between the microballoon.
2. display panel according to claim 1, which is characterized in that the microballoon includes ball and coats outside the ball Spherical shell, the ball be magnetic material, the spherical shell be organic material.
3. display panel according to claim 2, which is characterized in that the microballoon further include:
Surfactant layer is coated on outside the spherical shell, and the surfactant layer includes hydrophilic portion and hydrophobic portion, described hydrophilic Portion includes hydrophilic radical, and is contacted with first inorganic layer;The hydrophobic portion includes hydrophobic grouping, and is connect with the organic layer Touching.
4. display panel according to claim 2, which is characterized in that the material of the ball include in iron, cobalt and nickel extremely The material of few one kind, the spherical shell and the organic layer includes high-molecular organic material.
5. display panel according to claim 2, which is characterized in that the diameter of the ball is 10nm-20nm, described micro- The diameter of ball is 1 μm -5 μm.
6. display panel according to claim 1-5, which is characterized in that the microballoon is along first inorganic layer Distribution, and each microballoon monolayer distribution, so that the diameter with a thickness of the microballoon of the buffer layer;Or
The microballoon is distributed along first inorganic layer, and the microballoon is on the partially or fully surface of first inorganic layer Multi-layers distributing.
7. a kind of packaging method of display panel characterized by comprising
The first inorganic layer is formed in the light emission side of array basal plate;
Buffer layer is formed far from the surface of the array substrate in first inorganic layer, the buffer layer is described including being distributed in The microballoon on surface of first inorganic layer far from the array substrate;
Form the organic layer for covering the buffer layer and filling the gap between the microballoon.
8. packaging method according to claim 7, which is characterized in that in first inorganic layer far from the array substrate Surface formed buffer layer, comprising:
Microballoon is formed, each microballoon includes ball and coats the spherical shell outside the ball, and the ball is magnetic material, institute Stating spherical shell is organic material;
The microballoon is dispersed in the first solvent;
First solvent is formed in the surface of first inorganic layer far from the array substrate;
The microballoon is fixed on first inorganic layer by externally-applied magnetic field, and the first solvent described in evaporative removal, with To the buffer layer.
9. packaging method according to claim 7 or 8, which is characterized in that the packaging method further include:
Form the second inorganic layer for covering the organic layer.
10. a kind of display device, which is characterized in that including display panel described in any one of claims 1-6.
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