CN111864104A - Display panel, preparation method thereof and display device - Google Patents

Display panel, preparation method thereof and display device Download PDF

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Publication number
CN111864104A
CN111864104A CN202010652181.1A CN202010652181A CN111864104A CN 111864104 A CN111864104 A CN 111864104A CN 202010652181 A CN202010652181 A CN 202010652181A CN 111864104 A CN111864104 A CN 111864104A
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China
Prior art keywords
layer
particles
display panel
inorganic
inorganic layer
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CN202010652181.1A
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Chinese (zh)
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CN111864104B (en
Inventor
王坤
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/549Organic PV cells

Abstract

The invention discloses a display panel, a preparation method thereof and a display device, wherein the display panel comprises a substrate and a packaging layer, wherein the packaging layer is a laminated film layer formed by stacking an inorganic layer and an organic layer; one surface of the inorganic layer facing the organic layer is uniformly distributed with a layer of coarse particles. The invention has the technical effects that a layer of rough particles is formed on the surface of the inorganic layer, so that the roughness of the surface of the inorganic layer is improved, the subsequent organic layer can be better spread and leveled, the thickness of the organic layer is reduced, and the thicknesses of the packaging layer and the display panel are further reduced.

Description

Display panel, preparation method thereof and display device
Technical Field
The invention relates to the field of display, in particular to a display panel, a preparation method thereof and a display device.
Background
The OLED (organic light emitting diode) device has the advantages of simple structure, high response speed, active light emission, low power consumption and the like, and has wide application in the display fields of mobile phones, flat panels, televisions and the like. With the development of product differentiation, flexible and foldable screens have become a trend. In the flexible OLED device, a display part, a driving IC and metal wiring for connecting the display part and the driving IC are arranged, wherein the driving IC is distributed on a lower frame of a panel. At present, more and more mobile phone manufacturers try to provide bendable mobile phones, and the screen bending frequency is required to reach the level of commercialization, so from the viewpoint of thin film packaging, the bending resistance of the packaging film layer is very important.
Disclosure of Invention
The invention aims to solve the technical problem that the conventional packaging structure of the display panel is poor in bending resistance.
To achieve the above object, the present invention provides a display panel including: a substrate; the packaging layer is arranged on the surface of one side of the substrate; the packaging layer is a laminated film layer formed by stacking an inorganic layer and an organic layer; one surface of the inorganic layer facing the organic layer is uniformly distributed with a layer of coarse particles.
Further, the particles are organic transparent particles and/or inorganic transparent particles.
Further, the transparency of the particles is 90-98%.
Further, the diameter of the particles is 1-5 microns.
Further, a plurality of the particles form capillary spaces among each other; the width of the capillary space is 10-50 microns.
Further, the display panel includes a display area and a non-display area surrounding the display area, and the particulate matter is located in the display area.
In order to achieve the above object, the present invention further provides a method for manufacturing a display panel, including the steps of: providing a substrate; preparing an encapsulation layer on the upper surface of the substrate; the method for preparing the packaging layer on the upper surface of the substrate comprises the following steps: preparing an inorganic layer on the upper surface of the substrate; uniformly forming a layer of coarse particles on the upper surface of the inorganic layer; and preparing an organic layer on the side of the inorganic layer provided with the particles.
Further, preparing a particle layer on an upper surface of the inorganic layer includes: and preparing a plurality of particles on the upper surface of the inorganic layer by a magnetron sputtering or spraying method, wherein the particles are uniformly distributed to form a particle layer.
Further, preparing an organic layer on a side of the inorganic layer having the particulate matter includes: and printing an organic solution on the upper surfaces of the particles and the inorganic layer in an ink-jet printing mode, so that the organic solution covers the particles and permeates into a capillary space formed between any two particles.
To achieve the above object, the present invention further provides a display device including the display panel as described above.
The invention has the technical effects that a layer of rough particles is formed on the surface of the inorganic layer, the particles can improve the roughness of the surface of the inorganic layer, so that the subsequent organic layer can be better spread and leveled, the thickness of the organic layer is reduced, the thickness of the packaging layer is further reduced, and the thickness of the display panel is further reduced.
Drawings
The technical solution and other advantages of the present invention will become apparent from the following detailed description of specific embodiments of the present invention, which is to be read in connection with the accompanying drawings.
FIG. 1 is a schematic cross-sectional view of a display panel according to an embodiment of the invention;
FIG. 2 is a top view of a display panel according to an embodiment of the present invention;
FIG. 3 is a flowchart illustrating a method for fabricating a display panel according to an embodiment of the present invention;
FIG. 4 is a flowchart illustrating steps for preparing the encapsulation layer according to an embodiment of the present invention;
fig. 5 is a schematic view of a display panel after the organic layer is prepared according to an embodiment of the present invention.
Some of the components are identified as follows:
1. a substrate; 2. a packaging layer; 3. retaining walls;
21. an inorganic layer; 22. (ii) particulate matter; 23. an organic layer;
220. a capillary zone;
31. a first retaining wall; 32. and a second retaining wall.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "top", "bottom", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the invention. To simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present invention provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or uses of other materials.
An embodiment of the invention provides a display device, which specifically includes a display panel as shown in fig. 1 to 2, where the display panel includes a substrate 1, an encapsulation layer 2, and a retaining wall 3.
The substrate 1 is an OLED substrate and plays a role in controlling the circuit switch of the display panel and emitting light, the substrate 1 comprises a base layer, a buffer layer, a TFT circuit film layer, a light-emitting functional layer, a public electrode and other film layers, the base layer can be a flexible base layer or a hard base layer, the TFT circuit film layer comprises an active layer, a grid insulating layer, a grid layer, a source drain electrode layer, a dielectric layer and other film layers, the light-emitting functional layer comprises a hole injection layer, a hole transmission layer, an organic light-emitting layer, an electron transmission layer, an electron injection layer and other film layers, and the public electrode comprises an anode and.
Packaging layer 2 locates the upper surface of base plate 1, and packaging layer 2 plays good encapsulation effect, and packaging layer 2 piles up the closed assembly rete that forms for inorganic layer and organic layer, inorganic layer orientation the one side evenly distributed on organic layer has the coarse particulate matter of one deck, includes three inorganic layers of group, particulate matter and organic layer at least.
In the present embodiment, the inorganic layer 21 is provided on the upper surface of the substrate 1, and the material of the inorganic layer 21 includes at least one of silicon nitride (SiNx), silicon oxynitride (SiOxNy), silicon oxide (SiOx), silicon carbonitride (SiCxNy), zinc oxide (ZnO), and aluminum oxide (AlOx). Due to the nature of the material of the inorganic layer 21, the surface thereof is dense, has high overall smoothness and very low roughness, and is not conducive to the deposition of organic layers.
The particles 22 are uniformly distributed on the upper surface of the inorganic layer 21, so that the roughness of the upper surface of the inorganic layer 21 is greatly improved, the particles 22 are organic transparent particles and/or inorganic transparent particles, the components of the particles 22 include, but are not limited to, high-transparency objects such as silicon dioxide, the transparency of the particles 22 is very high and can reach 90% -98%, and the diameter of the particles 22 is 1-5 micrometers.
Particles 22 are arranged on the upper surface of the inorganic layer 21, capillary spaces 220 are formed among the particles 22, the width of each capillary space 220 is 10-50 micrometers, and the rough surface of the inorganic layer 21 and the capillary spaces 220 are beneficial to deposition and leveling of the organic layer ink.
The organic layer 23 is disposed on the upper surfaces of the inorganic layer 21 and the particulate matters 22, and specifically, covers the upper surface of the inorganic layer 21 and completely fills the capillary spaces 220 between the particulate matters 22, and the organic layer 23 can be quickly spread and leveled in the rough inorganic layer 21 and the capillary spaces 220, so that the thickness of the organic layer 23 can be reduced, the thickness of the encapsulation layer and the display panel can be further reduced, and the pursuit of the existing user for the ultra-thin display device can be better met.
As shown in fig. 2, the display panel is divided into a display area and a non-display area surrounding the display area, the retaining wall 3 is disposed in the non-display area, the area surrounded by the retaining wall 3 is the display area, the retaining wall 3 includes a first retaining wall 31 and a second retaining wall 32 surrounding the first retaining wall 31, and the retaining wall 3 can block external water and oxygen from entering the display area, so as to achieve a good water and oxygen blocking effect. A number of particles 22 are uniformly distributed within the display area.
The particles 22 are added on the upper surface of the inorganic layer 21, and the particles 22 are uniformly distributed, so that the roughness of the surface of the inorganic layer 21 is greatly improved, in the subsequent preparation process of the organic layer 23, the organic layer ink is quickly spread and leveled in the capillary space 220 between the surface of the inorganic layer 21 and the particles 22, and the organic layer ink with the same quality can reduce the thickness of the organic layer 23 and further reduce the thickness of the encapsulation layer 2 due to good spreading property and leveling property in the embodiment. When the display device described in this embodiment is a flexible bendable display device, because the thickness of the encapsulation layer 2 is reduced, the bending resistance of the encapsulation layer 2 is improved in the bending process, the bendable times of the encapsulation layer 2 are increased, and the bending performance of the display panel can be further improved.
This embodiment display device's technical effect lies in, and the particulate matter improves the roughness on inorganic layer surface for organic layer has better spreadability and leveling, reduces the thickness on organic layer, further reduces the thickness of encapsulated layer, and then reduces the thickness of display panel, and simultaneously, when display panel buckles, the less encapsulated layer of thickness reduces its degree of difficulty of buckling, improves the bending resistance of encapsulated layer further improves display panel's bending performance.
As shown in fig. 3 and 4, the present embodiment further provides a method for manufacturing a display panel, including steps S1 to S2.
S1 provides a substrate, the substrate is an OLED substrate, which plays a role in controlling the switching of the display panel circuit and emitting light, the substrate 1 includes a base layer, a buffer layer, a TFT circuit film layer, a light emitting functional layer, and a common electrode, the base layer may be a flexible base layer or a hard base layer, the TFT circuit film layer includes an active layer, a gate insulating layer, a gate layer, a source drain layer, and a dielectric layer, the light emitting functional layer includes a hole injection layer, a hole transport layer, an organic light emitting layer, an electron transport layer, and an electron injection layer, and the common electrode includes an anode and a cathode.
S2, preparing an encapsulation layer on the upper surface of the substrate, specifically, referring to fig. 3, including steps S21 to S23.
S21, preparing an inorganic layer on the upper surface of the substrate, specifically, preparing an inorganic layer on the upper surface of the substrate by using processes such as Atomic Layer Deposition (ALD), pulsed laser beam deposition (PLD), sputtering (Sputter), Plasma Enhanced Chemical Vapor Deposition (PECVD), and the like, wherein the material of the inorganic layer includes at least one of silicon nitride (SiNx), silicon oxynitride (SiOxNy), silicon oxide (SiOx), silicon carbon nitride (SiCxNy), zinc oxide (ZnO), and aluminum oxide (AlOx). Due to the characteristics of the material of the inorganic layer, the surface of the inorganic layer is in a compact state, the overall smoothness is high, the roughness is very low, and the deposition of the organic layer is not facilitated.
S22, forming a layer of rough particles uniformly on the upper surface of the inorganic layer, specifically, forming a layer of rough particles uniformly on the upper surface of the inorganic layer by magnetron sputtering or spraying or other methods, where the particles are organic transparent particles and/or inorganic transparent particles, the components of the particles 22 include, but are not limited to, high-transparency substances such as silica, and the like, the transparency of the particles is very high, and can reach 90% to 98%, the diameter of the particles is 1 to 5 μm, and the particles are uniformly distributed on the upper surface of the inorganic layer, thereby greatly improving the roughness of the upper surface of the inorganic layer. The particles are arranged on the upper surface of the inorganic layer, capillary intervals are formed among the particles, the width of each capillary interval is 10-50 micrometers, and the rough surface of the inorganic layer and the capillary intervals are beneficial to deposition and leveling of ink of a subsequent organic layer.
S23, preparing an organic layer on the side of the inorganic layer having the particles, specifically, as shown in fig. 5, printing an organic solution on the upper surfaces of the inorganic layer 21 and the particles 22 by inkjet printing, so that the organic solution covers the particles 22 and permeates into the capillary space formed between any two particles 22 to form an organic layer 23. The organic layer 23 can be spread and leveled quickly in the rough inorganic layer 21 and in the capillary space, and the thickness of the organic layer 23 can be reduced.
Repeating the steps S21-S23 at least three times to form a stacked film layer formed by stacking the inorganic layer, the particles and the organic layer, namely the packaging layer, wherein the packaging layer plays a good role in packaging, and the thickness of the organic layer is reduced, so that the thickness of the packaging layer can be further reduced.
Before the encapsulation layer is prepared on the upper surface of the substrate, the preparation method of the display panel can further comprise a retaining wall preparation step, specifically, the retaining wall is prepared at the edge of the substrate, the display area is arranged in the retaining wall, and the retaining wall is arranged in the non-display area and plays a role in blocking external water and oxygen.
The particles are added on the upper surface of the inorganic layer and are uniformly distributed, so that the roughness of the surface of the inorganic layer is greatly improved, in the subsequent preparation process of the organic layer, the organic solution can be quickly spread and leveled on the upper surface of the inorganic layer and in a capillary interval between the particles under the action of the particles, and the organic solution with the same quality can be reduced. When the display device described in this embodiment is a flexible bendable display device, because the thickness of the encapsulation layer is reduced, the bending resistance of the encapsulation layer is improved, the number of times of bending of the bending layer is increased, and the bending performance of the display panel can be further improved in the bending process of the display panel.
The technical effect of the preparation method of the display device in the embodiment is that a layer of coarse particles is formed on the surface of the inorganic layer, the particles can improve the roughness of the surface of the inorganic layer, so that subsequent organic layers can be better spread and leveled, the thickness of the organic layers is reduced, the thickness of the packaging layer is further reduced, and further the thickness of the display panel is reduced.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The display panel, the manufacturing method thereof, and the display device provided in the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by applying specific examples, and the description of the above embodiments is only used to help understanding the technical solutions and the core ideas of the present invention; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (10)

1. A display panel, comprising:
a substrate; and
the packaging layer is arranged on the surface of one side of the substrate;
the packaging layer is a laminated film layer formed by stacking an inorganic layer and an organic layer;
one surface of the inorganic layer facing the organic layer is uniformly distributed with a layer of coarse particles.
2. The display panel of claim 1,
the particles are organic transparent particles and/or inorganic transparent particles.
3. The display panel of claim 1,
the transparency of the particles is 90-98%.
4. The display panel of claim 1,
the diameter of the particles is 1-5 microns.
5. The display panel of claim 1,
a plurality of particles form a capillary space;
the width of the capillary space is 10-50 microns.
6. The display panel of claim 1, wherein the display panel comprises a display area and a non-display area surrounding the display area, the particulate matter being located within the display area.
7. A preparation method of a display panel is characterized by comprising the following steps:
Providing a substrate; and
preparing an encapsulation layer on the upper surface of the substrate;
the method for preparing the packaging layer on the upper surface of the substrate comprises the following steps:
preparing an inorganic layer on the upper surface of the substrate;
uniformly forming a layer of coarse particles on the upper surface of the inorganic layer;
and preparing an organic layer on the side of the inorganic layer provided with the particles.
8. The method of manufacturing a display panel according to claim 7, wherein the manufacturing of the particle layer on the upper surface of the inorganic layer comprises:
and preparing a plurality of particles on the upper surface of the inorganic layer by a magnetron sputtering or spraying method, wherein the particles are uniformly distributed to form a particle layer.
9. The method of manufacturing a display panel according to claim 8, wherein the manufacturing of the organic layer on the side of the inorganic layer having the particulate matter comprises:
and printing an organic solution on the upper surfaces of the particles and the inorganic layer in an ink-jet printing mode, so that the organic solution covers the particles and permeates into a capillary space formed between any two particles.
10. A display device comprising the display panel according to any one of claims 1 to 6.
CN202010652181.1A 2020-07-08 2020-07-08 Display panel, preparation method thereof and display device Active CN111864104B (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106935633A (en) * 2017-05-23 2017-07-07 上海天马微电子有限公司 The manufacture method of display panel and display panel
CN108389877A (en) * 2018-02-09 2018-08-10 武汉华星光电半导体显示技术有限公司 Thin-film packing structure and preparation method thereof and display panel
CN109166978A (en) * 2018-08-01 2019-01-08 云谷(固安)科技有限公司 Display panel and preparation method thereof, display device
CN109904349A (en) * 2019-03-25 2019-06-18 京东方科技集团股份有限公司 Display device, display panel and its packaging method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106935633A (en) * 2017-05-23 2017-07-07 上海天马微电子有限公司 The manufacture method of display panel and display panel
CN108389877A (en) * 2018-02-09 2018-08-10 武汉华星光电半导体显示技术有限公司 Thin-film packing structure and preparation method thereof and display panel
CN109166978A (en) * 2018-08-01 2019-01-08 云谷(固安)科技有限公司 Display panel and preparation method thereof, display device
CN109904349A (en) * 2019-03-25 2019-06-18 京东方科技集团股份有限公司 Display device, display panel and its packaging method

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