CN108389877B - Thin film packaging structure, manufacturing method thereof and display panel - Google Patents
Thin film packaging structure, manufacturing method thereof and display panel Download PDFInfo
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- CN108389877B CN108389877B CN201810135784.7A CN201810135784A CN108389877B CN 108389877 B CN108389877 B CN 108389877B CN 201810135784 A CN201810135784 A CN 201810135784A CN 108389877 B CN108389877 B CN 108389877B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/50—OLEDs integrated with light modulating elements, e.g. with electrochromic elements, photochromic elements or liquid crystal elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The invention discloses a film packaging structure, a manufacturing method thereof and a display panel. Through doping carbon element in first barrier layer, modify the surface of first barrier layer, make the micro-particle layer can form great contact angle on the surface of first barrier layer, avoided the micro-particle to spread on first barrier layer surface so that can't form the condition of three-dimensional granule in order to play optical device effect to the problem that can't improve light-emitting efficiency has been solved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a thin film packaging structure, a manufacturing method thereof and a display panel.
Background
In the field of flexible display applications, Thin Film Encapsulation (TFE) technology has great development prospects. In addition to the requirement for excellent water and oxygen resistance and good bending resistance, the film package structure must also have good light-emitting efficiency.
The thin film package structure generally includes a plurality of barrier layers, and related researches show that spraying small-sized micro-particles on the barrier layers can improve the light extraction efficiency of the whole thin film package structure. However, when the micro-particles are sprayed on the surface of the barrier layer, the contact angle between the micro-particles and the barrier layer is usually too small (< 5 °), so that the micro-particles are diffused on the surface of the barrier layer, and the micro-particles cannot form three-dimensional particles to play a role of an optical device, thereby failing to improve the light extraction efficiency and finally affecting the overall light extraction efficiency of the thin film package structure.
Disclosure of Invention
The invention mainly provides a thin film packaging structure, a manufacturing method thereof and a display panel, and aims to solve the problems that the contact angle between a barrier layer and micro-particles of the existing thin film packaging structure is too small, so that the micro-particles are diffused on the surface of the barrier layer, and stereo particles cannot be formed to play the role of an optical device, so that the light emitting efficiency cannot be improved.
In order to solve the technical problems, the invention adopts the technical scheme that: the thin film packaging structure comprises a first blocking layer, a micro particle layer formed on the first blocking layer and composed of a plurality of micro particles, a buffer layer formed on the micro particle layer, and a second blocking layer formed on the buffer layer, wherein the first blocking layer is doped with carbon elements.
In order to solve the technical problem, the invention adopts another technical scheme that: the utility model provides a display panel, includes the substrate base plate, forms in TFT layer on the substrate base plate, form in luminescent layer on the TFT layer, and form in film packaging structure on the luminescent layer, film packaging structure includes first barrier layer, forms in the micro-particle layer that comprises a plurality of microgranules on the first barrier layer, forms in buffer layer on the micro-particle layer, form in second barrier layer on the buffer layer, wherein, first barrier layer dopes carbon element.
In order to solve the above technical problems, the present invention adopts another technical solution: a method for manufacturing a thin film encapsulation structure is provided, the method comprising:
manufacturing a first barrier layer, wherein the first barrier layer is doped with carbon elements;
manufacturing a micro particle layer formed on the first barrier layer and composed of a plurality of micro particles;
manufacturing a buffer layer formed on the micro-particle layer; and
and manufacturing a second barrier layer formed on the buffer layer.
The invention has the beneficial effects that: carbon elements are doped in the first blocking layer of the film packaging structure, and the surface of the first blocking layer is modified, so that microparticles of the microparticle layer can form a large contact angle on the surface of the first blocking layer, the condition that the microparticles cannot form three-dimensional particles to play the role of an optical device due to diffusion on the surface of the first blocking layer is avoided, and the problem that the light emitting efficiency cannot be improved is solved.
Drawings
FIGS. 1a and 1b are schematic structural views of a thin film encapsulation structure according to the present invention;
FIG. 2 is a schematic structural diagram of a display panel according to the present invention;
FIG. 3 is a flow chart illustrating a method for fabricating a thin film package structure according to the present invention.
Detailed Description
Please refer to fig. 1a and fig. 1b, which are schematic structural diagrams of the thin film package structure of the present invention. As shown in fig. 1a and 1b, the thin film encapsulation structure 1 of the present invention is used for encapsulating a light emitting layer 21 formed on a TFT layer 22. The light-emitting layer 21 is specifically an organic light-emitting layer. The package structure 1 includes a first barrier layer 11, a micro particle layer 12 formed on the first barrier layer 11 and composed of a plurality of micro particles, a buffer layer 13 formed on the micro particle layer 12, and a second barrier layer 14 formed on the buffer layer 13, wherein the first barrier layer 11 is doped with carbon element, and may also be doped with fluorine element together with carbon element.
The material of the first barrier layer 11 and the second barrier layer 12 is an inorganic material, and the material of the microparticle layer 12 is an organic material. The microparticles of the microparticle layer 12 are embodied as microlenses. The microparticles of the microparticle layer 12 are formed by adding an organic material in the form of ink to an inkjet printing apparatus (IJP apparatus), spraying the ink onto the surface of the first barrier layer 11 by an inkjet printing technique, and then rapidly drying and forming the ink by an ultraviolet curing technique to form transparent microparticles with improved light extraction efficiency. However, when the inorganic material of the first blocking layer 11 is not doped with carbon, after the organic ink is sprayed on the surface of the first blocking layer 11, since the surface of the first blocking layer 11 has oleophilicity and the contact angle is small (< 5 °), the organic ink can diffuse on the surface of the first blocking layer 11, and cannot form a three-dimensional shape with strong granular sensation, and cannot play a role of an optical device, and thus cannot play a role of improving the light extraction efficiency.
After the inorganic material of the first barrier layer 11 is doped with carbon, the carbon can modify the surface of the first barrier layer 11, so that the originally oleophilic surface becomes an oleophobic surface. In this case, after the organic ink is sprayed on the first barrier layer 11, the organic ink forms the three-dimensional microparticles having a contact angle greater than 40 ° on the surface thereof, so as to prevent the organic ink from diffusing into the first barrier layer due to an excessively small contact angle.
Carbon and fluorine are doped into the inorganic material of the first barrier layer 11 at the same time, so that the oleophobic property of the surface of the first barrier layer 11 can be further improved, the contact angle between the microparticles formed by the organic ink and the first barrier layer 11 becomes larger, and the effect of at least 60 degrees is achieved. At this time, the granular sensation of the microparticles will be more full, and the light extraction efficiency will be further improved. Therefore, under different conditions, the inorganic material of the first barrier layer 11 may be independently doped with carbon or simultaneously doped with carbon and fluorine according to actual requirements, or the doping ratio of carbon and fluorine may be adjusted according to different requirements. The second set of interlayer layers 14 may be doped with carbon and fluorine depending on the particular situation.
When adopting the inkjet printing technique to form the microparticle with organic ink spraying to first barrier layer 11's surface, can utilize the size of the effectual control microparticle of inkjet printing equipment, the volume, quantity, the shape etc. also because the surface of first barrier layer 11 has passed through the modification, can keep the size and the shape of microparticle, recycle ultraviolet curing technique, quick effectual size and the shape with the microparticle are stereotyped, fix the surface to first barrier layer 11, play microparticle optical device's effect, reach the purpose that improves light-emitting efficiency. The light extraction efficiency can be further quantitatively adjusted according to actual requirements through the types of organic materials used by the ink-jet printing equipment, the shapes and the volume sizes of the printed particles and the like. The shape that the ink jet printing equipment can spray includes at least one in sphere, ellipsoid, polygon, column, irregular shape, and the material of making microparticle is epoxy resin or polyester organic matter. The particle size of the microparticles is 5-50 μm.
The inorganic material for forming the first barrier layer 11 and the second barrier layer 14 is silicon nitride or silicon oxynitride (SiN)y，SiONy) The buffer layer 13 is made of Hexamethyldisiloxane (HMDSO), and the first barrier layer 11, the second barrier layer 14 and the buffer layer 13 are made by using atomic layer deposition, chemical vapor deposition, physical vapor deposition and vacuum thermal evaporation techniques. The thickness of the first barrier layer 11 and the second barrier layer 14 is 1-2 μm. The thickness of the buffer layer is 4-15 μm.
As shown in fig. 1a, the light emitting layer 21 is completely covered by the first barrier layer 11, and the buffer layer 13 is disposed on the upper surface of the micro particle layer 12 without wrapping the first barrier layer 11, and functions to block water and oxygen. The buffer layer 13 wraps the microparticles of the microparticle layer 12 to flatten the surface of the microparticle layer 12 and further release the stress generated by the first barrier layer 11. The second barrier layer 14 completely covers the buffer layer 13, and further functions to prevent water and oxygen from entering the light emitting device of the light emitting layer 21 from the outside.
As shown in fig. 1b, it is different from fig. 1a in that a buffer layer 13 is disposed on the upper surface of the micro particle layer 12 and wraps the first barrier layer 11. In actual use, different packaging modes can be specifically selected according to requirements, such as different packaging parts.
Please refer to fig. 2, which is a schematic structural diagram of a display panel according to the present invention. As shown in fig. 2, the display panel of the present invention includes a substrate 23, a TFT layer 22 formed on the substrate 23, a light emitting layer 21 formed on the TFT layer 22, and a thin film package structure 1 formed on the light emitting layer 21, where the thin film package structure 1 includes a first barrier layer 11, a micro particle layer 12 formed on the first barrier layer 11 and composed of a plurality of micro particles, a buffer layer 13 formed on the micro particle layer, and a second barrier layer 14 formed on the buffer layer 12, where the first barrier layer is doped with carbon. Specifically, the substrate 23 is a PI layer, and the light-emitting layer 21 is an OLED layer. The method comprises the steps of manufacturing a PI layer on a glass substrate through PI spraying equipment, manufacturing a TFT layer on a PI base layer through array technology, and manufacturing an OLED layer on the TFT through vacuum evaporation technology. The first barrier layer 11 is deposited on the OLED layer by a chemical vapor deposition technique. When the first barrier layer 11 is manufactured, carbon element is doped to modify the surface of the first barrier layer 11, so that the originally oleophilic surface becomes an oleophobic surface. In this case, after the organic ink is sprayed on the first barrier layer 11, the organic ink forms the three-dimensional microparticles having a contact angle greater than 40 ° on the surface thereof, so as to prevent the organic ink from diffusing into the first barrier layer due to an excessively small contact angle.
Carbon and fluorine are doped into the inorganic material of the first barrier layer 11 at the same time, so that the oleophobic property of the surface of the first barrier layer 11 can be further improved, the contact angle between the microparticles and the first barrier layer 11 becomes larger, and the effect of being at least larger than 60 degrees is achieved. At this time, the granular sensation of the microparticles will be more full, and the light extraction efficiency will be further improved. Therefore, under different conditions, the inorganic material can be independently doped with carbon or simultaneously doped with carbon and fluorine according to actual requirements, and the doping ratio of the carbon and the fluorine can be adjusted according to different requirements.
When adopting the inkjet printing technique to form the microparticle with organic ink spraying to first barrier layer 11's surface, can utilize the size and size of the effectual control microparticle of inkjet printing equipment, volume quantity, the shape etc. also because the surface of first barrier layer 11 has been modified, can keep the size and shape of microparticle, recycle ultraviolet curing technique, quick effectual size and shape with the microparticle are stereotyped, fix the surface to first barrier layer 11, play microparticle optical device's effect, reach the purpose that improves light-emitting efficiency. The light extraction efficiency can be further quantitatively adjusted according to actual requirements through the types of organic materials used by the ink-jet printing equipment, the shapes and the volume sizes of the printed particles and the like. The shape that the ink jet printing apparatus can spray includes at least one of a spherical shape, an ellipsoidal shape, a polygonal shape, a cylindrical shape, and an irregular shape.
Fig. 3 is a schematic flow chart illustrating a method for fabricating a thin film package structure according to the present invention. As shown in fig. 3, the manufacturing method of the thin film encapsulation structure of the present invention includes the following steps:
step S1: a first barrier layer 11 is formed, and the first barrier layer 11 is doped with carbon.
Step S2: a micro particle layer 12 composed of a plurality of micro particles formed on the first barrier layer 11 is fabricated.
Step S3: a buffer layer 13 formed on the microparticle layer 12 is produced.
Step S4: a second barrier layer 14 formed on the buffer layer 13 is fabricated.
When making first barrier layer 11, in the inorganic material of first barrier layer 11, behind the doping carbon element, carbon element can modify the surface of first barrier layer 11, makes the surface of oleophilic originally become oleophobic surface. In this case, the organic ink is sprayed onto the first barrier layer 11 by an inkjet printing technique to form fine particles, and then is prevented from diffusing in the first barrier layer due to an excessively small contact angle.
When the first barrier layer 11 is manufactured, carbon and fluorine are doped in the inorganic material of the first barrier layer 11 at the same time, so that the oleophobic property of the surface of the first barrier layer 11 can be further improved, the contact angle between the microparticles formed by the organic ink and the first barrier layer becomes larger, and the effect of being at least larger than 60 degrees is achieved. At this time, the granular sensation of the microparticles will be more full, and the light extraction efficiency will be further improved. Therefore, under different conditions, the inorganic material of the first barrier layer 11 may be independently doped with carbon or simultaneously doped with carbon and fluorine according to actual requirements, or the doping ratio of carbon and fluorine may be adjusted according to different requirements.
When adopting the inkjet printing technique to form the microparticle with microparticle spraying to first barrier layer 11's surface, can utilize the size and size of the effectual control microparticle of inkjet printing equipment, volume quantity, the shape etc. also because the surface of first barrier layer 11 has been modified, the size and shape that keep the microparticle that can be fine, recycle ultraviolet curing technique, quick effectual size and shape with the microparticle are stereotyped, fix the surface to first barrier layer 11, the effect of performance microparticle optical device, reach the purpose that improves light-emitting efficiency. The light extraction efficiency can be further quantitatively adjusted according to actual requirements through the types of organic materials used by the ink-jet printing equipment, the shapes and the volume sizes of the printed particles and the like. The shape that the ink jet printing apparatus can spray includes at least one of a spherical shape, an ellipsoidal shape, a polygonal shape, a cylindrical shape, and an irregular shape.
According to the invention, the carbon element is doped in the first blocking layer of the film packaging structure, and the surface of the first blocking layer is modified, so that microparticles of the microparticle layer can form a larger contact angle on the surface of the first blocking layer, and the condition that the microparticles cannot form three-dimensional particles to play the role of an optical device due to diffusion on the surface of the first blocking layer is avoided, thereby solving the problem that the light extraction efficiency cannot be improved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (6)
1. A thin film packaging structure is characterized by comprising a first barrier layer, a micro particle layer formed on the first barrier layer and composed of a plurality of micro particles, a buffer layer formed on the micro particle layer and a second barrier layer formed on the buffer layer, wherein the first barrier layer and the second barrier layer are made of inorganic materials, the micro particle layer is made of organic materials, and the buffer layer is made of hexamethyldisiloxane; wherein the first barrier layer is doped with carbon element or doped with carbon element and fluorine element; after the first barrier layer is doped with carbon elements, the contact angle between the microparticles of the microparticle layer and the first barrier layer is at least 40 degrees; after the first barrier layer is doped with carbon element and fluorine element, the contact angle between the microparticles of the microparticle layer and the first barrier layer is at least 60 degrees.
2. The thin film encapsulation structure of claim 1, wherein the microparticles comprise at least one of a spherical shape, an ellipsoidal shape, a polygonal shape, a cylindrical shape, and an irregular shape; the particle diameter of the microparticles is 5-50 μm.
3. The film package structure of claim 1, wherein the material of the micro particle layer is epoxy resin or polyester organic; the buffer layer is made of hexamethyldisiloxane.
4. A display panel is characterized by comprising a substrate, a TFT layer formed on the substrate, a light emitting layer formed on the TFT layer, and a thin film packaging structure formed on the light emitting layer, wherein the thin film packaging structure comprises a first blocking layer, a micro particle layer formed on the first blocking layer and composed of a plurality of micro particles, a buffer layer formed on the micro particle layer, and a second blocking layer formed on the buffer layer, the first blocking layer and the second blocking layer are made of inorganic materials, the micro particle layer is made of organic materials, and the buffer layer is made of hexamethyldisiloxane; wherein the first barrier layer is doped with carbon element or doped with carbon element and fluorine element; after the first barrier layer is doped with carbon elements, the contact angle between the microparticles of the microparticle layer and the first barrier layer is at least 40 degrees; after the first barrier layer is doped with carbon element and fluorine element, the contact angle between the microparticles of the microparticle layer and the first barrier layer is at least 60 degrees.
5. A method for manufacturing a thin film encapsulation structure is characterized by comprising the following steps:
manufacturing a first barrier layer, wherein the first barrier layer is doped with carbon elements or doped with carbon elements and fluorine elements;
manufacturing a micro particle layer formed on the first barrier layer and composed of a plurality of micro particles;
manufacturing a buffer layer formed on the micro-particle layer; and
manufacturing a second barrier layer formed on the buffer layer;
the material of the first barrier layer and the material of the second barrier layer are inorganic materials, the material of the micro particle layer is an organic material, and the material of the buffer layer is hexamethyldisiloxane;
after the first barrier layer is doped with carbon elements, the contact angle between the microparticles of the microparticle layer and the first barrier layer is at least 40 degrees; after the first barrier layer is doped with carbon element and fluorine element, the contact angle between the microparticles of the microparticle layer and the first barrier layer is at least 60 degrees.
6. The method for manufacturing a thin film encapsulation structure according to claim 5, wherein the first barrier layer, and/or the buffer layer, and/or the second barrier layer is manufactured by using atomic layer deposition, and/or chemical vapor deposition, and/or physical vapor deposition, and/or vacuum thermal evaporation technology; and curing the microparticles by using an ultraviolet curing technology.
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| CN109904349B (en) * | 2019-03-25 | 2021-11-02 | 京东方科技集团股份有限公司 | Display device, display panel and packaging method thereof |
| CN110048023A (en) * | 2019-04-23 | 2019-07-23 | 武汉华星光电半导体显示技术有限公司 | Thin-film packing structure and preparation method thereof |
| CN110231727B (en) * | 2019-05-14 | 2020-11-24 | 深圳市华星光电半导体显示技术有限公司 | Membrane structure and method of making same |
| CN111864104B (en) * | 2020-07-08 | 2022-07-12 | 武汉华星光电半导体显示技术有限公司 | Display panel, preparation method thereof and display device |
| CN113629212A (en) * | 2021-07-29 | 2021-11-09 | 深圳市华星光电半导体显示技术有限公司 | Flexible display and method of manufacturing the same |
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