CN112909202B - Display panel, preparation method thereof and display device - Google Patents
Display panel, preparation method thereof and display device Download PDFInfo
- Publication number
- CN112909202B CN112909202B CN202110097012.0A CN202110097012A CN112909202B CN 112909202 B CN112909202 B CN 112909202B CN 202110097012 A CN202110097012 A CN 202110097012A CN 112909202 B CN112909202 B CN 112909202B
- Authority
- CN
- China
- Prior art keywords
- layer
- magnetic
- retaining wall
- magnetic structure
- display panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The application discloses a display panel, a preparation method thereof and a display device, which are used for avoiding improving the packaging yield. The embodiment of the application provides a display panel, display panel includes: a substrate base plate; the display panel has: the display device comprises a display area and a peripheral area positioned outside the display area; the peripheral area includes: a retaining wall and a magnetic structure which are arranged on the substrate and surround the display area; the magnetic structure is positioned between the retaining wall and the display area; the display area includes: an electroluminescent device disposed over the substrate base, and an encapsulation layer sealing the electroluminescent device; the encapsulation layer includes: an organic encapsulation layer covering the magnetic structure and extending to the retaining wall; the organic encapsulation layer includes a magnetic component; the magnetic structure is used for: and generating magnetic force on the magnetic component in the organic packaging layer to prevent the organic packaging layer from crossing the retaining wall.
Description
Technical Field
The application relates to the technical field of display, in particular to a display panel, a preparation method of the display panel and a display device.
Background
The organic light emitting diode display device has a self-light emitting characteristic, and has received more and more attention due to its characteristics of low power consumption, high brightness, and fast response speed. In the display panel of the organic light emitting diode display device, a protective layer is required to protect the organic light emitting elements, so as to block external water and oxygen. In the related art, the protective layer generally includes: the organic film layer comprises a first inorganic layer film, an organic film layer arranged on the first inorganic layer film, and a second inorganic film layer arranged on the organic film layer. The organic film layer is used for absorbing the stress of the first inorganic film layer and the second film layer and wrapping and covering the micro foreign matters on the first inorganic film layer. The organic film layer is formed by adopting liquid organic materials according to an ink-jet printing mode. To prevent the liquid organic material from overflowing, a retaining wall is usually required to be disposed at the edge of the printing area of the display panel to block the liquid organic material from flowing out. However, the liquid organic material easily overflows beyond the retaining wall, and the liquid organic material has a property of adsorbing water and oxygen, and after the liquid organic material overflows, the second inorganic layer film cannot completely cover the organic layer film, so that the organic layer film is partially exposed in the air, and a condition is provided for water and oxygen invasion in the air, so that the encapsulation fails, the protection effect of the protection layer on the organic light emitting element is affected, and the service life of the organic light emitting diode display device is shortened.
Disclosure of Invention
The embodiment of the application provides a display panel, a preparation method thereof and a display device, which are used for avoiding packaging failure and improving packaging yield.
The embodiment of the application provides a display panel, display panel includes: a substrate base plate; the display panel has: the display device comprises a display area and a peripheral area positioned outside the display area;
the peripheral area includes: a retaining wall and a magnetic structure which are arranged on the substrate and surround the display area; the magnetic structure is positioned between the retaining wall and the display area;
the display area includes: an electroluminescent device disposed over the substrate base, and an encapsulation layer sealing the electroluminescent device; the encapsulation layer includes: an organic encapsulation layer covering the magnetic structure and extending to the retaining wall; the organic encapsulation layer includes a magnetic component;
the magnetic structure is used for: magnetic force is generated on the magnetic component in the organic packaging layer to prevent the organic packaging layer from crossing the retaining wall.
In some embodiments, the magnetic structure comprises: at least one turn of magnetic layer surrounds the display area.
In some embodiments, the display panel further comprises: each film layer of the pixel circuit is positioned between the substrate and the electroluminescent device;
the magnetic structure is located on each film layer of the pixel circuit.
In some embodiments, the encapsulation layer further comprises: the first inorganic packaging layer is positioned on one side, close to the electroluminescent device, of the organic packaging layer; the first inorganic packaging layer extends to the peripheral area to cover the magnetic structure and the retaining wall;
the magnetic structure is in contact with the first inorganic encapsulation layer.
In some embodiments, the retaining wall comprises: a first retaining wall and a second retaining wall; the first retaining wall is positioned between the second retaining wall and the magnetic structure.
In some embodiments, the material of the magnetic structure comprises one or a combination of: iron, cobalt, nickel.
In some embodiments, the material of the magnetic component comprises one or a combination of the following: magnetic nanoparticle materials, magnetic ionic materials.
The preparation method of the display panel provided by the embodiment of the application comprises the following steps:
providing a substrate, wherein the display panel comprises a display area and a peripheral area positioned outside the display area;
forming an electroluminescent device positioned in a display area, a retaining wall positioned in a peripheral area and a magnetic structure on a substrate; the magnetic structure is positioned between the retaining wall and the display area;
forming an organic packaging layer which covers the display area, covers the magnetic structure and extends to the retaining wall; wherein the organic encapsulation layer includes a magnetic component.
In some embodiments, before forming the electroluminescent device located in the display region over the substrate base plate, the method further comprises:
before forming the electroluminescent device located in the display area on the substrate, the method further comprises the following steps:
forming each film layer of the pixel circuit on the substrate;
forming the magnetic structure specifically includes:
depositing at least one circle of magnetic layer surrounding the display area on each film layer of the pixel circuit;
before forming the organic encapsulation layer, the method further comprises:
forming a first inorganic packaging layer covering the display area, the magnetic structure and the retaining wall; wherein the first inorganic encapsulation layer is in contact with the magnetic structure.
An embodiment of the present application provides a display device, display device includes: the embodiment of the application provides a display panel.
According to the display panel, the preparation method thereof and the display device, the magnetic structure is arranged between the retaining wall and the display area, and the organic packaging layer comprises the magnetic component, so that the magnetic structure can generate magnetic force on the magnetic component. Because the organic encapsulation layer is usually formed by adopting an ink-jet printing process, the magnetic part is added in ink-jet printing ink, and when the ink including the magnetic part flows to the position near the retaining wall, the magnetic structure generates magnetic force on the magnetic part, and the ink can be attracted by the magnetic structure, so that the organic encapsulation layer can be prevented from overflowing out of the retaining wall, the encapsulation failure can be avoided, the encapsulation yield is improved, and the service life of the display panel is further prolonged.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of another display panel provided in the embodiment of the present application;
fig. 3 is a schematic structural diagram of another display panel provided in the embodiment of the present application;
fig. 4 is a schematic structural diagram of another display panel provided in the embodiment of the present application;
fig. 5 is a schematic structural diagram of another display panel provided in the embodiment of the present application;
fig. 6 is a schematic view of a manufacturing method of a display panel according to an embodiment of the present disclosure.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be described clearly and completely in the following with reference to the drawings of the embodiments of the present application. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all embodiments. And the embodiments and features of the embodiments in the present application may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the application without any inventive step, are within the scope of protection of the application.
Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. As used in this application, the terms "first," "second," and the like do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect.
It should be noted that the sizes and shapes of the figures in the drawings are not to be considered true scale, but are merely intended to schematically illustrate the present disclosure. And the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.
An embodiment of the present application provides a display panel, as shown in fig. 1 and fig. 2, where fig. 2 is a cross-sectional view along AA' in fig. 1, the display panel includes: a base substrate 1; the display panel has: a display area 2, and a peripheral area 3 located outside the display area 2;
the peripheral section 3 includes: a retaining wall 4 and a magnetic structure 5 which are arranged above the substrate base plate 1 and surround the display area 2; the magnetic structure 5 is positioned between the retaining wall 4 and the display area 2;
the display area 2 includes: an electroluminescent device 6 provided over the base substrate 1, and an encapsulation layer 7 sealing the electroluminescent device 6; the encapsulating layer 7 includes: an organic encapsulation layer 8 covering the magnetic structure 5 and extending to the retaining wall 4; the organic encapsulation layer 8 includes a magnetic member (not shown);
the magnetic structure 5 is used for: magnetic force is generated to the magnetic component in the organic encapsulation layer 8 to block the organic encapsulation layer 8 from crossing the retaining wall 4.
According to the display panel provided by the embodiment of the application, the magnetic structure is arranged between the retaining wall and the display area, and the organic packaging layer comprises the magnetic component, so that the magnetic structure can generate magnetic force on the magnetic component. Because the organic encapsulation layer is usually formed by adopting an ink-jet printing process, the magnetic part is added in ink-jet printing ink, and when the ink including the magnetic part flows to the position near the retaining wall, the magnetic structure generates magnetic force on the magnetic part, and the ink can be attracted by the magnetic structure, so that the organic encapsulation layer can be prevented from overflowing out of the retaining wall, the encapsulation failure can be avoided, the encapsulation yield is improved, and the service life of the display panel is further prolonged.
In some embodiments, as shown in fig. 1, 2, the magnetic structure 5 comprises: at least one turn of the magnetic layer 12 surrounds the display area.
In fig. 1 and 2, the magnetic structure 5 is illustrated as including only one magnetic layer 12 surrounding the display region, but in practical implementation, the magnetic structure may include a plurality of magnetic layers surrounding the display region. For example, as shown in FIG. 3, the magnetic structure includes two turns of magnetic layer surrounding the display area. Of course, the magnetic structure may also include more turns of the magnetic layer.
In some embodiments, as shown in fig. 1, 2 and 3, the retaining wall 4 includes: a first retaining wall 10 and a second retaining wall 11; the first retaining wall 10 is located between the second retaining wall 11 and the magnetic structure 5.
As shown in fig. 2, the organic encapsulation layer 8 extends to the first wall 10.
In the display panel provided by the embodiment of the application, the magnetic structure is located on one side of the first retaining wall close to the display area, so that the organic packaging layer can be prevented from crossing the first retaining wall and the second retaining wall. The packaging failure can be avoided, the packaging yield is improved, and the service life of the display panel is further prolonged.
In some embodiments, the display panel further comprises: each film layer of the pixel circuit is positioned between the substrate and the electroluminescent device;
the magnetic structure is located on each film layer of the pixel circuit.
In some embodiments, the layers of the pixel circuit include, for example, thin film transistors and capacitors. Taking a thin film transistor with a top gate structure as an example, each film layer of the pixel circuit comprises: the semiconductor device comprises an active layer, a gate insulating layer, a gate layer, an interlayer insulating layer, a first source drain electrode layer, a passivation protective layer and a second source drain electrode layer which are sequentially arranged on a substrate.
The active layer comprises a channel region and a source-drain contact region of the thin film transistor, the gate layer comprises a gate of the thin film transistor, the first source-drain electrode layer comprises a source and a drain of the thin film transistor, the second source-drain electrode layer comprises a connecting lead which enables the first source-drain electrode layer to be electrically connected with the electroluminescent device, and the second source-drain electrode layer further comprises a first signal line connected with the electroluminescent device in the peripheral region.
In one embodiment, the magnetic layer is located over the first signal line, for example.
In fig. 2, only the insulating layer 9 of each layer of the pixel circuit and the first signal line 21 of the second source/drain electrode layer are shown on the substrate 1. In a specific implementation, as shown in fig. 2, a planarization layer 13 is further included above the second source/drain electrode layer. The pattern 13 of the planarization layer exposes a portion of the first signal line 21 in the peripheral region.
In some embodiments, as shown in fig. 2, the electroluminescent device 6 comprises: an anode 14, a light-emitting functional layer 15, and a cathode 16 which are stacked on the planarization layer 13; the display panel further includes a pixel definition layer 27; the peripheral region 3 further includes a cathode contact layer 20 disposed on the same layer as the anode 14, wherein the cathode contact layer 20 is electrically connected to the first signal line 21 and electrically connected to the cathode 16 extending to the peripheral region, so that a signal can be supplied to the cathode 16 through the first signal line 21.
In some embodiments, the electroluminescent device is, for example, an organic light emitting diode or a quantum dot light emitting diode. The light emitting function layer includes an organic light emitting layer, and may further include an electron transport layer, a hole blocking layer, a hole injection layer, an electron blocking layer, and the like.
In some embodiments, as shown in fig. 2, the encapsulation layer 7 further comprises: a first inorganic encapsulating layer 17 on the side of the organic encapsulating layer 8 adjacent to the electroluminescent device 6, and a second inorganic encapsulating layer 18 on the side of the organic encapsulating layer 8 facing away from the first inorganic encapsulating layer 17; the first inorganic encapsulation layer 17 and the second inorganic encapsulation layer 18 extend to the peripheral region 3 to cover the magnetic structure 5 and the retaining wall 4; as shown in fig. 2, the first inorganic encapsulation layer 17 and the second inorganic encapsulation layer 18 extend to the peripheral region 3 to cover the magnetic structure 5, the first retaining wall 10 and the second retaining wall 11;
the magnetic structure 5 is in contact with the first inorganic encapsulation layer 17.
The display panel that this application embodiment provided, magnetic structure and the contact of first inorganic encapsulation layer, only interval one deck rete between magnetic structure and the organic encapsulation layer promptly, magnetic structure attracts the effect better to the magnetic part in the organic encapsulation layer, more is favorable to avoiding organic encapsulation layer overflow to go out the barricade, avoids the encapsulation inefficacy, improves the encapsulation yield, and then improves display panel life.
Specifically, as shown in fig. 2, the magnetic structure 5 is located on the first signal line 21 of the second source-drain electrode layer. It should be noted that, in fig. 2, the cathode contact layer 20 is only in contact with a part of the first signal line 21, and therefore, the magnetic structure 5 is disposed on the first signal line 21 which is not in contact with the cathode contact layer 20, and the subsequent magnetic structure 5 may be in contact with the first inorganic encapsulation layer 17.
Of course, in the implementation, the magnetic structure is specifically disposed on which film layer, and the arrangement needs to be performed according to the specific structure of each film layer in the peripheral region.
For example, as shown in fig. 4, in the peripheral region 3, the cathode contact layer 20 covers the first signal line 21, and in order to allow the magnetic structure 5 to contact the first inorganic encapsulation layer 17, in fig. 4, the magnetic structure 5 is located on the cathode contact layer 20.
For example, as shown in fig. 5, in the peripheral region 3, the cathode contact layer 20 covers the first signal line 21, so that the magnetic structure 5 can be in contact with the first inorganic encapsulation layer 17, and the cathode 16 covers a larger area of the cathode contact layer 20, the magnetic structure 5 can be disposed on the cathode 16.
In some embodiments, the display panel further includes a pixel defining layer, and a support layer over a portion of the pixel defining layer. As shown in fig. 2, 4 and 5, the first retaining wall 10 includes: first sub-retaining wall 22 and second sub-retaining wall 23, second retaining wall 11 includes: a third sub-retaining wall 24, a fourth sub-retaining wall 25, and a fifth sub-retaining wall 26; the third sub-retaining wall 24 and the planarization layer 13 are disposed on the same layer, the first sub-retaining wall 22 and the fourth sub-retaining wall 25 are disposed on the same layer as the pixel defining layer 27, and the second sub-retaining wall 23 and the fifth sub-retaining wall 26 are disposed on the same layer as the supporting layer.
In some embodiments, the material of the magnetic structure comprises one or a combination of: iron, cobalt and nickel.
In some embodiments, the magnetic structure has a thickness in a range of 0.5 microns to 2.5 microns in a direction perpendicular to the substrate base;
in the direction that first barricade points to the second barricade, the width scope of magnetic structure does: 5-20 microns.
For example, the thickness of the magnetic structure is 2 micrometers in the direction perpendicular to the substrate, and the width of the magnetic structure is 20 micrometers in the direction in which the first retaining wall points to the second retaining wall.
In some embodiments, the distance between the magnetic structure closest to the first retaining wall and the first retaining wall is in the range: 10 microns to 15 microns.
In some embodiments, the material of the magnetic component comprises one or a combination of the following: magnetic nanoparticle materials, magnetic ionic materials.
In some embodiments, the organic encapsulation layer includes magnetic components, such as magnetic nanoparticles.
In specific implementation, the magnetic nanoparticles and the ink-jet printing ink can be mixed, and then the organic packaging layer is formed through an ink-jet printing process.
In some embodiments, the magnetic nanoparticles have a particle size of less than 30 nanometers.
In some embodiments, the magnetic nanoparticles are present in the organic encapsulation layer in an amount less than 5%.
In some embodiments, the material of the magnetic nanoparticles comprises: gamma-iron sesquioxide (Fe) 2 O 3 ) And (3) nanoparticles.
Alternatively, in some embodiments, the organic encapsulation layer includes a magnetic component that includes a magnetic ionic material.
In specific implementation, the magnetic ionic liquid material and the inkjet printing ink can be mixed, and then the organic encapsulation layer is formed through an inkjet printing process.
Based on the same inventive concept, an embodiment of the present application further provides a method for manufacturing a display panel, as shown in fig. 6, including:
s101, providing a substrate, wherein the display panel comprises a display area and a peripheral area outside the display area;
s102, forming an electroluminescent device positioned in a display area, and forming a retaining wall and a magnetic structure positioned in a peripheral area on a substrate; the magnetic structure is positioned between the retaining wall and the display area;
s103, forming an organic packaging layer which covers the display area, covers the magnetic structure and extends to the retaining wall; wherein the organic encapsulation layer includes a magnetic component.
According to the preparation method of the display panel, the magnetic structure is arranged between the retaining wall and the display area, and the organic packaging layer comprises the magnetic component, so that the magnetic structure can generate magnetic force on the magnetic component. Because the organic encapsulation layer is usually formed by adopting an ink-jet printing process, the magnetic part is added in ink-jet printing ink, and when the ink including the magnetic part flows to the position near the retaining wall, the magnetic structure generates magnetic force on the magnetic part, and the ink can be attracted by the magnetic structure, so that the organic encapsulation layer can be prevented from overflowing out of the retaining wall, the encapsulation failure can be avoided, the encapsulation yield is improved, and the service life of the display panel is further prolonged.
In some embodiments, forming an organic encapsulation layer covering the display region, covering the magnetic structure, and extending to the retaining wall specifically includes:
providing an ink for ink jet printing, and a magnetic material, wherein the magnetic material comprises one or a combination of the following: magnetic nanoparticle materials, magnetic ionic materials;
uniformly mixing the ink-jet printing ink and the magnetic material to obtain a material to be printed;
and forming an organic packaging layer by using a material to be printed and adopting an ink-jet printing process.
In some embodiments, before forming the electroluminescent device located in the display region over the base substrate, further comprising:
before forming the electroluminescent device located in the display area on the substrate, the method further comprises the following steps:
forming each film layer of the pixel circuit on the substrate;
forming the magnetic structure specifically includes:
depositing at least one circle of magnetic layer surrounding the display area on each film layer of the pixel circuit;
before forming the organic encapsulation layer, the method further comprises:
forming a first inorganic packaging layer covering the display area, the magnetic structure and the retaining wall; wherein the first inorganic encapsulation layer is in contact with the magnetic structure.
In practice, the magnetic layer may be formed by a chemical vapor deposition process or a physical deposition process, for example.
In some embodiments, forming each film layer of the pixel circuit on the substrate specifically includes:
an active layer, a gate insulating layer, a gate electrode layer, an interlayer insulating layer, a first source drain electrode layer, a passivation protective layer and a second source drain electrode layer are sequentially formed on the substrate; the second source drain electrode layer comprises a first signal line positioned in the peripheral area.
In some embodiments, after forming the film layers of the pixel circuit, the method further includes:
forming a pattern of a planarization layer; wherein the pattern of the planarization layer exposes a portion of the first signal line.
In some embodiments, forming the electroluminescent device specifically comprises:
forming a pattern of an anode, a pattern of a cathode contact layer, and a pattern of a pixel defining layer on the planarization layer; the cathode contact layer is electrically connected with the first signal line in the peripheral area.
Forming a pattern of a light emitting layer over the anode;
and forming a pattern of a cathode over the light emitting layer, wherein the cathode is electrically connected to the cathode contact layer in the peripheral region.
In a specific implementation, a magnetic layer is deposited on each film layer of the pixel circuit, and when the magnetic layer is located on the first signal line, the magnetic layer may be deposited before the planarization layer is formed, or the magnetic layer may be deposited after the planarization layer is deposited. When the magnetic layer is located on the cathode contact layer, the magnetic layer may be formed after the cathode contact layer is formed and before the first inorganic light emitting layer is formed. When the magnetic layer is located on the cathode, it is necessary to form the magnetic layer after forming the cathode, and then form the first inorganic encapsulation layer.
An embodiment of the present application provides a display device, display device includes: the embodiment of the application provides a display panel.
The display device provided by the embodiment of the application is as follows: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. Other essential components of the display device are understood by those skilled in the art, and are not described herein or should not be construed as limiting the present application. The display device can be implemented by referring to the above embodiments of the display panel, and repeated descriptions are omitted.
In summary, in the display panel, the manufacturing method thereof and the display device provided in the embodiments of the present application, the magnetic structure is disposed between the retaining wall and the display area, and the organic encapsulation layer includes the magnetic component, so that the magnetic structure can generate a magnetic force on the magnetic component. Because the organic encapsulation layer is usually formed by adopting an ink-jet printing process, the magnetic part is added in ink-jet printing ink, and when the ink including the magnetic part flows to the position near the retaining wall, the magnetic structure generates magnetic force on the magnetic part, and the ink can be attracted by the magnetic structure, so that the organic encapsulation layer can be prevented from overflowing out of the retaining wall, the encapsulation failure can be avoided, the encapsulation yield is improved, and the service life of the display panel is further prolonged.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (10)
1. A display panel, comprising: a substrate base plate; the display panel has: the display device comprises a display area and a peripheral area positioned outside the display area;
the peripheral zone includes: the retaining wall and the magnetic structure are arranged on the substrate base plate and surround the display area; the magnetic structure is positioned between the retaining wall and the display area;
the display area includes: an electroluminescent device disposed over the substrate base plate, and an encapsulation layer sealing the electroluminescent device; the encapsulation layer includes: an organic encapsulation layer covering the magnetic structure and extending to the retaining wall; the organic encapsulation layer includes a magnetic component;
the magnetic structure is used for: and generating magnetic force on the magnetic component in the organic packaging layer to block the organic packaging layer from crossing the retaining wall.
2. The display panel of claim 1, wherein the magnetic structure comprises: at least one turn of magnetic layer surrounds the display area.
3. The display panel according to claim 1 or 2, characterized in that the display panel further comprises: each film layer of the pixel circuit is positioned between the substrate base plate and the electroluminescent device;
the magnetic structure is positioned on each film layer of the pixel circuit.
4. The display panel of claim 3, wherein the encapsulation layer further comprises: the first inorganic packaging layer is positioned on one side, close to the electroluminescent device, of the organic packaging layer; the first inorganic packaging layer extends to the peripheral area to cover the magnetic structure and the retaining wall;
the magnetic structure is in contact with the first inorganic encapsulation layer.
5. The display panel according to claim 1, wherein the dam comprises: a first retaining wall and a second retaining wall; the first retaining wall is located between the second retaining wall and the magnetic structure.
6. The display panel of claim 1, wherein the material of the magnetic structure comprises one or a combination of the following: iron, cobalt and nickel.
7. The display panel of claim 1, wherein the material of the magnetic component comprises one or a combination of the following: magnetic nanoparticle materials, magnetic ionic materials.
8. A method for manufacturing a display panel, the method comprising:
providing a substrate, wherein the display panel comprises a display area and a peripheral area positioned outside the display area;
forming an electroluminescent device positioned in the display area, a retaining wall positioned in the peripheral area and a magnetic structure on the substrate base plate; the retaining wall and the magnetic structure surround the display area, and the magnetic structure is located between the retaining wall and the display area;
forming an organic packaging layer which covers the display area, covers the magnetic structure and extends to the retaining wall; wherein the organic encapsulation layer includes a magnetic component that has an attractive force with the magnetic structure.
9. The method of claim 8, wherein prior to forming the electroluminescent device over the substrate base plate in the display region, the method further comprises:
forming each film layer of the pixel circuit on the substrate;
forming the magnetic structure specifically includes:
depositing at least one circle of magnetic layer surrounding the display area on each film layer of the pixel circuit;
before forming the organic encapsulation layer, the method further comprises:
forming a first inorganic packaging layer covering the display area, the magnetic structure and the retaining wall; wherein the first inorganic encapsulation layer is in contact with the magnetic structure.
10. A display device, characterized in that the display device comprises: the display panel according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110097012.0A CN112909202B (en) | 2021-01-25 | 2021-01-25 | Display panel, preparation method thereof and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110097012.0A CN112909202B (en) | 2021-01-25 | 2021-01-25 | Display panel, preparation method thereof and display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112909202A CN112909202A (en) | 2021-06-04 |
| CN112909202B true CN112909202B (en) | 2022-12-09 |
Family
ID=76119235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110097012.0A Active CN112909202B (en) | 2021-01-25 | 2021-01-25 | Display panel, preparation method thereof and display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112909202B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117396022A (en) * | 2021-12-29 | 2024-01-12 | 湖北长江新型显示产业创新中心有限公司 | Display panel and display device |
| CN114335390B (en) * | 2021-12-30 | 2023-06-30 | 深圳市华星光电半导体显示技术有限公司 | Display panel |
| CN114824127B (en) * | 2022-04-06 | 2023-04-07 | 武汉华星光电半导体显示技术有限公司 | Display panel and manufacturing method thereof |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100682835B1 (en) * | 2004-12-03 | 2007-02-15 | 엘지전자 주식회사 | Organic electroluminescent device and method for manufacturing the same |
| KR101097317B1 (en) * | 2009-11-18 | 2011-12-21 | 삼성모바일디스플레이주식회사 | Organic light emitting display apparatus |
| KR101074805B1 (en) * | 2009-12-04 | 2011-10-19 | 삼성모바일디스플레이주식회사 | Organic light emitting display device and method for manufacturing the same |
| CN103909040B (en) * | 2014-03-28 | 2016-08-17 | 京东方科技集团股份有限公司 | Glue spreading apparatus and glue spreading method |
| CN106784360B (en) * | 2017-01-20 | 2019-05-03 | 京东方科技集团股份有限公司 | A kind of organic light emitting diode device and its packaging method, sealed in unit |
| CN107204404B (en) * | 2017-04-11 | 2018-12-14 | 上海天马微电子有限公司 | Organnic electroluminescent device |
| US11342534B2 (en) * | 2017-06-09 | 2022-05-24 | Lg Chem, Ltd. | Encapsulation film |
| CN107507931A (en) * | 2017-08-23 | 2017-12-22 | 京东方科技集团股份有限公司 | Method for packing, encapsulating structure and the display device of oled display substrate |
| CN108107625A (en) * | 2018-01-10 | 2018-06-01 | 深圳市华星光电技术有限公司 | The production method of color membrane substrates |
| KR102551790B1 (en) * | 2018-06-29 | 2023-07-07 | 삼성디스플레이 주식회사 | Organic light-emitting display apparatus |
| CN109880440B (en) * | 2019-03-15 | 2022-04-26 | 云谷（固安）科技有限公司 | Ink, ink-jet printing method, film packaging method and organic film |
| CN109904349B (en) * | 2019-03-25 | 2021-11-02 | 京东方科技集团股份有限公司 | Display device, display panel and packaging method thereof |
| CN110137381B (en) * | 2019-06-11 | 2020-08-11 | 武汉华星光电半导体显示技术有限公司 | OLED display panel |
| CN110518043A (en) * | 2019-08-29 | 2019-11-29 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof, display device |
-
2021
- 2021-01-25 CN CN202110097012.0A patent/CN112909202B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN112909202A (en) | 2021-06-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112909202B (en) | Display panel, preparation method thereof and display device | |
| US11038130B2 (en) | Stretchable display devices | |
| US20210257581A1 (en) | Array substrate and method for manufacturing the same, display panel and display device | |
| US9324772B2 (en) | Organic light emitting diode display device and method of fabricating the same | |
| US10347701B2 (en) | Organic light-emitting display panel, display device and organic light-emitting display motherboard thereof | |
| CN112018159B (en) | Touch display panel | |
| KR20090127220A (en) | Organic light emitting device, method of manufacturing the same, display unit, and electronic device | |
| US11164918B2 (en) | Organic light emitting diode display panel having connection portion connecting organic light emitting diode to peripheral circuit and manufacturing method thereof | |
| US11233217B2 (en) | Encapsulation structure, display panel and manufacturing method thereof each having edge encapsulation member on edge of encapsulation film | |
| CN108899346B (en) | Display panel and display device | |
| US7586258B2 (en) | Organic light emitting diode and organic electroluminescent device using the same | |
| KR20200133890A (en) | Display device and method for manufacturing the same | |
| US11444262B2 (en) | Display panel and display device having a non-planar substrate surface | |
| CN110854300A (en) | Display device, display panel and manufacturing method thereof | |
| CN113299862A (en) | Display panel, preparation method thereof and display device | |
| US20230422561A1 (en) | Flexible Display Device and Method of Manufacturing the Same | |
| US11889724B2 (en) | Display device including a sealing area overlapping transfer wirings | |
| US20200235337A1 (en) | Display panel, display device and method of manufacturing display panel | |
| CN215644561U (en) | Display panel and display device | |
| US20220102449A1 (en) | Organic light emitting display device | |
| CN115377117A (en) | Array substrate, preparation method thereof and display device | |
| CN112289948B (en) | Organic light emitting diode display panel and manufacturing method thereof | |
| CN114430014A (en) | Display substrate, preparation method thereof and display device | |
| KR20220078380A (en) | Display apparatus | |
| CN116602072A (en) | Display panel and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |