Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
  • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
  • G01D11/24—Housings ; Casings for instruments
  • G01D11/245—Housings for sensors
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
  • G01H1/00—Measuring characteristics of vibrations in solids by using direct conduction to the detector

Definitions

• the invention relates to a sensor unit for a vehicle according to the Gat device of the independent claim 1.
• vibration-sensitive acceleration and yaw rate sensors are used, which are installed as standard in separate sensor units in the vehicle.
• these vibration-sensitive sensors are arranged on a printed circuit board in a control unit of the braking system. This facilitates assembly in the vehicle and costs can be saved who the. There, however, the sensor is exposed to a vibration chain extending from the housing over the components of the control unit to the circuit board he stretches. In order to decouple the shrinkage sensitive sensors of the unwanted Re sonanzen in the system, this is usually arranged on a Dämp Fung printed circuit board, which is soldered to the control unit circuit board. The sensor position is given by the vibration behavior of the printed circuit board.
• vibration-sensitive sensors are placed on as low-vibration regions on the control unit circuit board and the measuring direction of the sensors from the position of the circuit board from pending.
• An enormous amount of effort is required to decouple the vibration-sensitive acceleration and rotation rate sensors from mechanical and electrical interference signals. This additionally creates a dependence on the respective printed circuit board layout.
• DE 10 2012 204 904 A1 discloses a sensor unit with a protective sleeve, in which at least one pressure measuring cell and a circuit substrate are arranged te with a perpendicular to the circuit board Schauplat te, which comprises an electronic circuit with at least one electronic and / or electrical component.
• the measuring cell has at least one connection point via which at least one electrical output signal of the measuring cell can be tapped off.
• the circuit carrier forms an internal interface, which picks up the at least one electrical output signal of the measuring cell and applies it to the electronic circuit. Via an external interface, an output signal of the electronic circuit is bar.
• the internal interface at a first end of the protective sleeve and the external interface at a second end of the protective sleeve are madebil det.
• the protective sleeve is joined at the first end to a sensor carrier, which has a mounting flange and a measuring connection, which is designed as a self-clinching connection.
• the mounting flange has a Flanschkan te on which the protective sleeve is supported and over which the Sensorein unit can be caulked with a fluid block.
• the fastening supply flange comprises a connection region on which the protective sleeve is pressed up.
• the measuring cell is placed on a tubular support of the Befest Trentsflan cal and welded to it.
• the measuring cell includes a measuring diaphragm, which deforms depending on the fluid pressure at the measuring connection.
• the sensor unit for a vehicle with the features of the independent Pa tent friess 1 has the advantage that a rigid connection between the mechanics and electronics is implemented and thereby natural oscillations of Sensorein unit can be avoided or at least reduced. Due to the short oscillation chain from the sensor carrier to the circuit board must be operated with mecanicsfor men the sensor unit according to the invention a much lower cost to decouple the sensor unit of mechanical and electrical noise, so that the useful signal of at least one Sen sorelements less noise is exposed. In this case, a better useful signal of the at least one sensor element can be used independently of the installation position and independently of the vibration chain of the composite sensor unit. be achieved. In addition, an independent optimization of the joining geometries of the sensor carrier without influencing other components is possible.
• Embodiments of the present invention provide a sensor unit for a vehicle, with a sensor carrier, which forms a mechanical interface for the sensor unit and carries a printed circuit board on which cher at least one vibration-sensitive sensor element is arranged.
• the sensor carrier has a mounting flange on which the Lei terplatte facing first surface, a first joining geometry is formed, which at least partially receives the circuit board and aligns at a pre-given angle to the first surface.
• a second joining geometry is formed on one of the first surface opposite the second surface of the mounting flange, via which the sensor carrier is positively and / or positively connected to a mechanical system connectable.
• the circuit board is aligned perpendicular to the first surface of the Sen sorliess.
• a mechanical system can in the present case be a fluid block or a basic housing of an electrical device, such as a pump or a control device, in particular a brake control device, who understood the, with which embodiments of the sensor unit according to the invention can be ge coupled.
• the mechanical system has a corresponding receiving geometry, which can be joined with the second joining geometry of the mounting flange.
• a sensor unit is understood to mean a structural unit which comprises at least one vibration-sensitive sensor element which directly or indirectly detects a physical variable or a change in a physical variable and preferably converts it into an electrical sensor signal. Possible, for example, sensor elements, each of which detects acceleration in a given spatial direction or a rotation rate about a PRE-enclosed spatial axis.
• the detected sensor signals can, for example, be processed and / or further processed and / or evaluated by an electronic circuit integrated in the sensor unit.
• an external electronic circuit can carry out the processing and / or further processing and / or evaluation of the sensor signals.
• the internal or external electronic circuit may comprise at least one electrical and / or electronic cal component and / or at least one conductor track and / or at least one contact point.
• arbitrary functions such as, for example, evaluating, processing, amplifying, filtering, etc., can be implemented for processing and outputting the sensor signals.
• an electronic circuit may also be understood to mean an integrated circuit, such as a so-called system ASIC (ASIC: application-specific integrated circuit), which processes and further processes or evaluates detected sensor signals.
• the electronic circuit may have at least one interface, which may be formed in hardware and / or software. For example, in a hardware implementation, the interfaces may be part of the system ASIC that includes and executes a variety of electronic circuit functions.
• the interfaces own integrated circuits or at least partially from discrete components hen best.
• the interfaces may be software modules which are present, for example, on a microcontroller in addition to other software modules.
• Another advantage is a computer program product with program code which is stored on a machine-readable carrier such as a semiconductor memory, a hard disk memory or an optical memory is stored and used to perform the evaluation when the program is executed by the electronic circuit.
• a plurality of vibration-sensitive sensor elements can form a so-called inertial sensor, which can sense a plurality of accelerations and / or rotation rates.
• the sensor carrier with the first joining geometry and the second joining geometry can be designed as a rotationally symmetrical rotary part.
• the sensor unit can be aligned as desired during joining with the mechanical system. Due to the rotationally symmetrical structure of the sensor carrier, the measuring direction or the measuring axis of at least one sensor element can be adapted to an installation position of the mechanical system. This means that the measuring direction or the measuring axis of the at least one sensor element can be aligned arbitrarily to the press-in axis.
• the first joining geometry can be performed as a support geometry with a U-shaped receiving groove whose width is adapted to a thickness of the printed circuit board.
• a first edge of the printed circuit board can be held positively and / or cohesively in the receiving groove. This means that the first edge of the circuit board can be pressed into the receiving groove. Additionally or alternatively, the first edge of the circuit board can be glued into the receiving groove.
• the second joining geometry can be performed as Seifclinchgeometrie or knurling geometry or as structuredge thread and recorded by a corresponding receiving geometry of the mechanical system.
• the sensor carrier advantageously on one side a receiving geometry for the circuit board and on the other hand, a connection geometry to the mechanical system available.
• the sensor carrier thus enables a simple and increased The connection between the mechanical system and the circuit board, which offers advantages in terms of natural resonances.
• Seifclinchgeometrie or knurl geometry the sensor carrier can be caulked, for example, in appropriate on drilling in the mechanical system to produce a positive and positive connection, or threaded through the external thread with a threaded hole in the mechanical system who the to produce a positive connection.
• the sensor unit can form a Kunststoffie purity an external electrical interface with at least one external Kon contact point for the at least one vibration-sensitive sensor element.
• the contacting unit may have a third joining geometry, which at least partially accommodates the printed circuit board.
• the circuit board can be at least partially inserted into a running as a receiving opening third Fügegeomet RIE of the contacting.
• the at least one ex-ternal contact point can be electrically connected to corresponding contact points of the electronic circuit on the circuit board.
• the electrical Ver bond between the at least one external contact point of Maisie purity and the corresponding contact point on the circuit board is preferably prepared by a soldering process.
• the sensor unit may be formed with a protective sleeve between the ers th surface of the mounting flange and the first joining geometry a fourth joining geometry for a non-positive and / or cohesive connec tion.
• the fourth joining geometry is performed, for example, as a step or paragraph whose outer contour is adapted to a nenkontur in the protective sleeve at the first end.
• the protective sleeve can be pressed onto the step or shoulder with the first end until the protective sleeve bears against the first surface.
• the protective sleeve can be glued to the sensor at the first end.
• the contacting unit can form a fifth joining geometry, which can be adapted to an inner contour of the protective sleeve so that the Kon taktierech centered in the protective sleeve is performed.
• the fifth jointing ometrie be performed, for example, as an outer contour, which is adapted to a In nenkontur the protective sleeve at the second end.
• the contacting unit can be pressed into the protective sleeve at the second end.
• the protective sleeve can be glued to the contacting unit at the second end.
• the protective sleeve can be made of metal or plastic and provide protection against mechanical stress.
• the interior of the protective sleeve can be at least partially filled with a vibration-damping medium via a through hole in the sensor carrier.
• the circuit board can be stiffened by the support geometries on the sensor carrier or acting as a support unit in the protective sleeve contacting and / or by the introduced vibration damping Me medium, so that the circuit board can be protected from unwanted vibrations and interference.
• the protective sleeve provides an additional interface for electrical protection measures, so that the properties of the sensor unit with respect to electromagnetic compatibility (EMC) and / or electrostatic discharge (electrostatic discharge: ESD) can be improved.
• EMC electromagnetic compatibility
• ESD electrostatic discharge
• Fig. 1 shows a schematic perspective view of an embodiment example of a sensor unit according to the invention without protective sleeve.
• Fig. 2 shows a schematic perspective view of a first Austre approximately example of a sensor carrier of the sensor unit according to the invention of FIG. 1.
• Fig. 3 shows a schematic perspective view of a second Austre approximately example of a sensor carrier for a sensor unit according to the invention.
• Fig. 4 shows a schematic perspective view of an embodiment example of a sensor unit according to the invention with protective sleeve.
• the illustrated embodiments of a sensor unit 1, 1A according to the invention for a vehicle each comprise a sensor carrier 10, which forms a mechanical interface 10A for the sensor unit 1, 1A and carries a printed circuit board 3 which at least one vibration-sensitive sensor element 5A is arranged.
• the sensor carrier 10 has a mounting flange 12, on whose the printed circuit board 3 facing first surface 13, a first joining geometry 14 is formed, which accommodates the circuit board 3 at least partially and aligns at a given angle to the first surface 13.
• a second joining geometry 16 is formed, via which the sensor carrier 10 is frictionally and / or positively connected to a not dargestell th mechanical system connectable.
• the illustrated embodiments of the invention sen sorritt 1, 1A, for example, with a fluid block or a basic housing of a pump or a controller can be connected.
• the mechanical system not shown, on a corresponding Aufgest megeometrie, which can be joined with the second joint geometry 16 of the mounting flange 12 and the sensor carrier 10.
• the at least one sensor element 5A which is sensitive to vibration, is integrated in an electronic circuit 5, which in the illustrated embodiment is designed as a system ASIC and forms an inertial sensor, which he summarizes several accelerations in predetermined spatial directions and / or several rotation rates about predetermined spatial axis.
• the sensor carrier 10 with the first joining geometry 14 and the second joining geometry 16 is designed as a rotationally symmetrical rotating part.
• the first joining geometry 14 in the exemplary embodiments illustrated is designed as a support geometry 14A with a U-shaped receiving groove 14.1 whose width is adapted to a thickness of the conductor plate 3.
• a first edge 3.1 of the circuit board 3 which corresponds to a lower edge in the representation of the circuit board 3, in Darge presented embodiment is pressed into the receiving groove 14.1 and held in a force-fitting manner in the receiving groove 14.1.
• the first edge 3.1 of the printed circuit board 3 can be glued into the receiving groove 14.1 with an adhesive and held firmly in the receiving groove 14.1.
• the printed circuit board 2 is aligned perpendicular to the first surface 13 of the mounting flange 12.
• Lei terplatte 3 if necessary, also obliquely to the first surface 13 of the mounting flange 12 are aligned.
• 14.2 is formed on both edges of the receiving groove 14.1 Ein slaughterschrä each ge.
• the second joining geometry 16 in the illustrated first exemplary embodiment of the sensor carrier 10 is designed as a self-clinch geometry 16A.
• the Seifclinchgeometrie 16A can be caulked with a korrespondie ing executed as a bore receiving geometry of the mechanical system sys and produce a frictional and positive connection.
• Knurl geometry 16B may be analogous to soap library geometry 16A are caulked with a corresponding executed as a boreracegeomet theory of the mechanical system and produce a frictional and positive connection.
• a contacting unit 20 forms an external electrical interface 20A with at least one external contact point
• a base body 22 of the contacting unit 20 has a cylindrical shape and, in the exemplary embodiment shown, comprises two half shells 22.1, 22.2, which each have at least one external contact point 24 of the external electrical interface 20A.
• the Kontak ting unit 20 has a third joining geometry 26, which accommodates the circuit board 3 at least partially.
• the base body 22 of the support unit 30 has a receiving opening designed as third joining geometry 26, which is adapted to an outer contour of the circuit board 10 and the circuit board 10 at a second edge 3.2, which here corresponds to an upper edge of the circuit board 3, at least partially absorbs.
• the at least one electrical connection between the at least one external contact point 24 of the external electrical interface 20A and the at least one corresponding internal contact point25 of the printed circuit board 3 is provided via at least one through-connection formed in the main body 22, which has at least one associated contact point in the main body 22 is electrically connected, which in turn via at least one Lötverbin tion electrically and mechanically with the at least one internal contact point
• the support unit 30 four external contact points 34, wherein on each half-shell 22.1, 22.2 two external contact points 24 are arranged.
• the illustrated second embodiment for example, the sensor unit 1A to protect the sensor components against me chanical loads a protective sleeve 7.
• a fourth joining geometry 18 for a non-positive and / or material-locking connection with the protective sleeve 7 is formed between the first surface 13 of the fastening flange 12 and the first joining geometry 14.
• the fourth joint geometry 18 as a step leads out, the outer contour of an inner contour of the protective sleeve 7 at the ers TEM end 7.1, which here corresponds to the lower end of the protective sleeve is fit.
• the protective sleeve 7 can be pressed with the first end 7.1 to the stage until the protective sleeve 7 abuts against the first surface 13 of the fastening supply flange 12.
• the protective sleeve 7 can be glued to the sensor carrier 10 at the first end 7.1 or fixed by welding points or soldering points.
• the contacting unit 20 forms a fifth joining geometry 27, which is adapted to an inner contour of the protective sleeve 7 at its second end 7.1 such that the contacting unit 20 is guided centered in the protective sleeve 7.
• an outer contour of the contacting unit 20 forms the fifth joining geometry 27, so that the contacting unit 20 can be pressed into the protective sleeve 7 at the second end 7.1.
• the protective sleeve 7 can be glued to the two ten th end 7.2 with the contacting unit 20.
• a fe derelastisches contact element 28 is arranged so that in the assembled state on an outer contour of the base body 22 two opposing resilient contact elements 28th are arranged, which facilitate the centering tion of the contacting unit 20 in the protective sleeve 7.
• the protective sleeve 7 can be made of metal or plastic and has an electrically conductive inner coating in the illustrated embodiment. Since an electrically conductive connection between the printed circuit board 3 and the protective sleeve 7 can be produced via the spring-elastic contact elements 28, the protective sleeve 7 offers an additional interface for electrical protective measures, so that the properties of the sensor unit 1 with regard to electromagnetic compatibility (EMC) and / or electrostatic discharge (ESD) can be improved.
• EMC electromagnetic compatibility
• ESD electrostatic discharge
• the sensor carrier 10 in the dargestell th embodiments a through hole 17, via which the nere in the protective sleeve 7 can be at least partially filled with a vibration-damping medium.
• a through hole 17 via which the nere in the protective sleeve 7 can be at least partially filled with a vibration-damping medium.
• Embodiments of the present invention provide a sensor unit for a vehicle, in which the printed circuit board can be stiffened by the support geometry on the sensor carrier or by the contact unit acting as a support unit in the protective sleeve, so that the printed circuit board with the at least one vibration-sensitive sensor element against unwanted Vibration and interference can be protected.
• a stiff or hard and störunan réellee connection between the mechanics and electronics is possible by the short vibration chain from the sensor carrier to the circuit board, which is beneficial to the natural vibration behavior of the sensor unit acts.
• the Eigenreso nance can be adjusted by the introduced vibration damping medium.

Landscapes

• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Measuring Fluid Pressure (AREA)
• Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)

Priority Applications (2)

Applications Claiming Priority (2)

Publications (1)

Family

ID=63667924

Family Applications (1)

Country Status (4)

Families Citing this family (1)

Citations (5)

Family Cites Families (7)

• 2017
  • 2017-11-23 DE DE102017220905.4A patent/DE102017220905A1/de active Pending
• 2018
  • 2018-09-20 WO PCT/EP2018/075421 patent/WO2019101390A1/de active Application Filing
  • 2018-09-20 KR KR1020207014627A patent/KR102644396B1/ko active IP Right Grant
  • 2018-09-20 CN CN201880075538.5A patent/CN111373268A/zh active Pending

Patent Citations (5)

Also Published As

Similar Documents

Legal Events