WO2019098279A1 - Dispositif électronique flexible - Google Patents

Dispositif électronique flexible Download PDF

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Publication number
WO2019098279A1
WO2019098279A1 PCT/JP2018/042301 JP2018042301W WO2019098279A1 WO 2019098279 A1 WO2019098279 A1 WO 2019098279A1 JP 2018042301 W JP2018042301 W JP 2018042301W WO 2019098279 A1 WO2019098279 A1 WO 2019098279A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive wiring
wiring layer
electronic device
conductive
thin film
Prior art date
Application number
PCT/JP2018/042301
Other languages
English (en)
Japanese (ja)
Inventor
俊宣 藤枝
祐磨 鉄
奈々 小久保
武岡　真司
丸山　剛
Original Assignee
学校法人早稲田大学
国立大学法人北海道大学
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 学校法人早稲田大学, 国立大学法人北海道大学 filed Critical 学校法人早稲田大学
Priority to JP2019554279A priority Critical patent/JPWO2019098279A1/ja
Publication of WO2019098279A1 publication Critical patent/WO2019098279A1/fr

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Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/20—Circuit arrangements or systems for wireless supply or distribution of electric power using microwaves or radio frequency waves
    • H02J50/27—Circuit arrangements or systems for wireless supply or distribution of electric power using microwaves or radio frequency waves characterised by the type of receiving antennas, e.g. rectennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits

Definitions

  • the conductive wiring has a multilayer structure formed by many types of conductive wiring layers. Therefore, there is an advantage that a conductive wiring having no electrical defect can be obtained, such as being hard to break as a whole of the conductive wiring.
  • the conductive polymer In the case where a conductive wiring layer composed of a laminate of conductive polymers is formed by printing and coating the same or different types of conductive polymers on the substrate multiple times, the conductive polymer In the case where the bonding force between the single layer films is not necessarily strong, by physically applying a strong force in the direction in which the upper and lower ends of the laminate are separated, it is possible to maintain the bonding between the films of each single layer film. Also, they are separated and exfoliated between the conductive polymer laminates. At this time, each layer functions as a conductive layer.
  • Materials such as a base material, conductive organic material, metal nanoparticles, polymer thin film, water-soluble support film, insulating protective layer and the like used in the production method of the present invention are the same as those in the above-mentioned "1. flexible electronic device" Can be used.
  • examples of the conductive wiring layer include a coil or an electrode.
  • the conductive wiring layer is a coil, it is preferably an antenna coil.

Abstract

La présente invention concerne un dispositif à couche mince biologiquement injectable qui a été mis au point par les inventeurs par stratification et impression d'une couche de câblage électroconductrice formée à partir d'une première substance électroconductrice et d'un second matériau électroconducteur choisi parmi des matériaux carbonés électroconducteurs, des polymères électroconducteurs et des nanoparticules métalliques sur la surface d'un substrat discrétionnaire tel qu'un substrat de verre ou un substrat de film polymère. L'épaisseur totale de la couche de câblage électroconductrice stratifiée et de la couche mince polymère dans le dispositif à film mince est inférieure à 100 µm. A l'aide de ce dispositif, il est possible de fournir un dispositif électronique pliable et flexible servant de très petite électrode ou de bobine d'antenne qui est flexible et qui peut passer à travers l'intérieur d'une aiguille de seringue.
PCT/JP2018/042301 2017-11-17 2018-11-15 Dispositif électronique flexible WO2019098279A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019554279A JPWO2019098279A1 (ja) 2017-11-17 2018-11-15 フレキシブル電子デバイス

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017221880 2017-11-17
JP2017-221880 2017-11-17

Publications (1)

Publication Number Publication Date
WO2019098279A1 true WO2019098279A1 (fr) 2019-05-23

Family

ID=66539677

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/042301 WO2019098279A1 (fr) 2017-11-17 2018-11-15 Dispositif électronique flexible

Country Status (3)

Country Link
JP (1) JPWO2019098279A1 (fr)
TW (1) TWI781250B (fr)
WO (1) WO2019098279A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005521489A (ja) * 2002-03-27 2005-07-21 シーブイアールエックス， インコーポレイテッド 連結電極による循環系反射制御用デバイスおよび方法
JP2013165190A (ja) * 2012-02-10 2013-08-22 Seiko Instruments Inc フレキシブルコイル及びこれを用いたワイヤレス受電装置
JP2015207445A (ja) * 2014-04-21 2015-11-19 コニカミノルタ株式会社 パターン形成方法
JP2016126954A (ja) * 2015-01-07 2016-07-11 コニカミノルタ株式会社 導電性フィルム及び導電性フィルムの製造方法
WO2017154726A1 (fr) * 2016-03-08 2017-09-14 東洋紡株式会社 Feuille conductrice étirable, feuille conductrice étirable présentant une adhésivité, et procédé pour former une ligne de câblage formée d'un conducteur étirable sur tissu

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU6667698A (en) * 1997-02-26 1998-09-18 Alfred E. Mann Foundation For Scientific Research Battery-powered patient implantable device
WO2005110718A1 (fr) * 2004-05-14 2005-11-24 Teijin Dupont Films Japan Limited Pellicule orientée polyester
US20100000441A1 (en) * 2008-07-01 2010-01-07 Jang Bor Z Nano graphene platelet-based conductive inks
KR101191865B1 (ko) * 2011-04-20 2012-10-16 한국기계연구원 금속 배선이 함몰된 유연 기판의 제조방법 및 이에 따라 제조되는 유연 기판
JP2015000135A (ja) * 2013-06-13 2015-01-05 パナソニック株式会社 体腔内照明装置
CN106550548B (zh) * 2016-10-31 2019-03-15 中国科学院理化技术研究所 一种柔性电路的激光打印成型方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005521489A (ja) * 2002-03-27 2005-07-21 シーブイアールエックス， インコーポレイテッド 連結電極による循環系反射制御用デバイスおよび方法
JP2013165190A (ja) * 2012-02-10 2013-08-22 Seiko Instruments Inc フレキシブルコイル及びこれを用いたワイヤレス受電装置
JP2015207445A (ja) * 2014-04-21 2015-11-19 コニカミノルタ株式会社 パターン形成方法
JP2016126954A (ja) * 2015-01-07 2016-07-11 コニカミノルタ株式会社 導電性フィルム及び導電性フィルムの製造方法
WO2017154726A1 (fr) * 2016-03-08 2017-09-14 東洋紡株式会社 Feuille conductrice étirable, feuille conductrice étirable présentant une adhésivité, et procédé pour former une ligne de câblage formée d'un conducteur étirable sur tissu

Also Published As

Publication number Publication date
TWI781250B (zh) 2022-10-21
JPWO2019098279A1 (ja) 2021-02-25
TW201934157A (zh) 2019-09-01

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