WO2019085932A1 - 一种基底预对准方法和装置以及一种光刻机 - Google Patents

一种基底预对准方法和装置以及一种光刻机 Download PDF

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Publication number
WO2019085932A1
WO2019085932A1 PCT/CN2018/112908 CN2018112908W WO2019085932A1 WO 2019085932 A1 WO2019085932 A1 WO 2019085932A1 CN 2018112908 W CN2018112908 W CN 2018112908W WO 2019085932 A1 WO2019085932 A1 WO 2019085932A1
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Prior art keywords
substrate
image
aligned
feature point
feature points
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PCT/CN2018/112908
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English (en)
French (fr)
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田翠侠
孙伟旺
杜荣
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上海微电子装备（集团）股份有限公司
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Priority to KR1020207015294A priority Critical patent/KR102378079B1/ko
Publication of WO2019085932A1 publication Critical patent/WO2019085932A1/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7007—Alignment other than original with workpiece
    • G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Definitions

  • the present invention relates to the field of integrated circuit manufacturing, and in particular, to a substrate pre-alignment method and apparatus, and a lithography machine.
  • the coordination of each subsystem is to accurately place the substrate on the exposure stage so that the circuit pattern on the reticle can be accurately exposed to a specified location on the surface of the substrate.
  • the orientation of the substrate during the transfer is random, it is inevitable to deviate from the specified substrate exposure position and exposure direction, and the substrate pre-alignment system can be adjusted in the lithography machine to adjust the deviation well.
  • the present invention provides a substrate pre-alignment method and apparatus and a lithography machine to overcome the above-mentioned technical deficiencies.
  • the present invention provides a substrate pre-alignment method for adjusting a to-be-pre-aligned substrate to a predetermined position and a predetermined orientation, comprising the steps of: acquiring a positioning device and having the predetermined An image of a reference substrate positioned in a predetermined orientation; acquiring an image of the substrate to be pre-aligned on the positioning device; registering an image of the substrate to be pre-aligned with an image of the reference substrate, Deriving an offset parameter of the image of the pre-aligned substrate relative to an image of the reference substrate; and adjusting a position and/or orientation of the substrate to be pre-aligned according to the offset parameter to complete a substrate pre-pair quasi.
  • the step of registering the image of the substrate to be pre-aligned with the image of the reference substrate comprises:
  • the set of registration feature points is registered to the set of reference feature points such that the set of registration feature points substantially coincides with the set of reference feature points.
  • the plurality of feature points comprise spots and/or corner points.
  • the set of registration feature points is registered to the set of reference feature points using an iterative closest point algorithm.
  • registering the set of registration feature points to the set of reference feature points by using an iterative closest point algorithm includes: selecting each of the reference feature points and the registration feature points in the set of registration feature points The nearest reference feature point; calculating a rigid body transformation having the smallest average distance between each registration feature point and the nearest reference feature point corresponding thereto and obtaining an offset parameter; using the bias for the registration feature point set The shift parameter yields a new set of transform points; and iteratively calculates until the average distance between the set of transform points and the set of reference feature points is less than a set threshold, completing the registration.
  • a K-D tree algorithm is used to calculate a plurality of reference feature points in the reference feature point set that are closest to each of the registration feature points.
  • the method further includes: using the random sample consistency algorithm in the recent reference The erroneous reference feature points are removed from the feature points, thereby selecting the reference feature points in the reference feature point set that are closest to each of the registration feature points.
  • the present invention also provides a substrate pre-alignment device, comprising: positioning means for adjusting the position and/or orientation of the substrate to be pre-aligned carried; image acquisition and analysis device, Acquiring respectively an image of a reference substrate on the positioning device having a predetermined position and a predetermined orientation and an image of the substrate to be pre-aligned on the positioning device, the image of the substrate to be pre-aligned and the image An image of the reference substrate is registered and an offset parameter of the image of the substrate to be pre-aligned relative to an image of the reference substrate is calculated; and a control device is coupled to the image acquisition and analysis device and the positioning device, respectively Adjusting the position and/or orientation of the substrate to be pre-aligned by the positioning device according to the offset parameter.
  • the positioning device comprises a rotating table and a centering mechanism disposed on one side of the rotating table, the rotating table is configured to fix a substrate to be pre-aligned and rotate the substrate to be pre-aligned, A centering mechanism is used to adjust the center of the substrate to be pre-aligned to coincide with the center of rotation of the turntable.
  • the centering mechanism includes a horizontal rail and a centering table disposed on the horizontal rail, and the centering table moves horizontally along the horizontal rail.
  • the positioning device further includes an lifting platform disposed at a bottom of the rotating table, the lifting platform is configured to drive the rotating table to move up and down to adjust a vertical direction of the substrate to be pre-aligned on the rotating table height.
  • the image acquisition and analysis device comprises a CCD camera for image acquisition and a calculation module.
  • the substrate pre-alignment device further includes a visual switching axis, the CCD camera is mounted on the visual switching axis, and the visual switching axis is used to move the CCD camera such that the to-be-pre-aligned The substrate enters the imaging area of the CCD camera.
  • the present invention also provides a lithography machine comprising the above substrate pre-alignment device
  • the present invention provides a substrate pre-alignment method and apparatus, and a lithography machine for matching an image of a substrate to be pre-aligned with an image of the reference substrate by using image registration technology. And calculating an offset parameter of the image to be pre-aligned in the registration process, and adjusting an angle of the substrate to be pre-aligned according to the offset parameter to complete substrate pre-alignment.
  • FIG. 1 is a schematic view of a substrate pre-alignment device according to an embodiment of the present invention
  • FIG. 2 is a flow chart of a method for pre-aligning a substrate according to an embodiment of the present invention
  • FIG. 3 is an image view of a reference substrate in an embodiment of the present invention.
  • FIG. 4 is a characteristic point coordinate diagram of a reference base imaging image according to an embodiment of the present invention.
  • FIG. 5 is a schematic diagram showing an initial relative position relationship between a reference feature point set and a registration feature point set according to an embodiment of the present invention
  • FIG. 6 is a diagram showing the effect of the reference feature point set and the registration feature point set registration in an embodiment of the present invention.
  • Figure 1 Shown in Figure 1: 1-to-be-aligned substrate, 2-rotating stage, 3-centering stage, 4-horizontal rail, 5-CCD camera.
  • Embodiments of the present invention provide a substrate pre-alignment method and apparatus, and a lithography machine.
  • the substrate pre-alignment apparatus includes a positioning device, an image acquisition and analysis device, a visual switching axis, and a control device.
  • the positioning device includes a rotating table 2, a centering mechanism disposed on one side of the rotating table 2, and a lifting platform disposed at the bottom of the rotating table 2;
  • the rotary table 2 moves up and down to adjust the vertical height of the substrate 1 to be pre-aligned thereon to cooperate with image acquisition of the image acquisition and analysis device;
  • the centering mechanism is used to center the substrate 1 to be pre-aligned Adjusted to coincide with the center of rotation of the rotating table 2, that is, for centering operation of the substrate 1 to be pre-aligned;
  • the rotating table 2 is used for fixing the substrate 1 to be pre-aligned and driving the substrate 1 to be pre-aligned The center of rotation rotates.
  • the rotary table 2 in this embodiment is preferably a vacuum pre-aligned substrate 1 to be pre-aligned thereon, but the present invention does not impose any limitation on the manner in which the rotary table 2 fixes the substrate 1 to be pre-aligned.
  • the rotary table 2 can fix the substrate by providing a receiving groove corresponding to the shape of the base, or can be fixed by a snapping manner.
  • the centering mechanism comprises a horizontal rail 4 and a centering table 3 disposed on the horizontal rail 4, the centering table 3 being horizontally movable along the horizontal rail 4 such that the substrate to be pre-aligned The center of 1 coincides with the center of rotation of the turntable 2.
  • the operation of the centering mechanism may include: adsorbing the substrate 1 to be pre-aligned by the centering table 3, while causing the rotating table 2 to release the adsorption of the substrate 1 to be pre-aligned, so that the centering table 3 can be driven
  • the alignment substrate 1 is moved relative to the rotary table 2 so that the center of the substrate 1 to be pre-aligned coincides with the center of rotation of the rotary table 2.
  • the image acquisition and analysis device includes a CCD camera 5 for image acquisition and a calculation module (not shown).
  • the image of a reference substrate and the image of the substrate 1 to be pre-aligned are acquired by the CCD camera 5, and the The image to be pre-aligned substrate 1 is registered onto the reference substrate image, and an offset parameter of the image to be pre-aligned to the substrate 1 during registration of the image to be pre-aligned to the reference substrate image is calculated
  • the CCD camera 5 is mounted on a visual switching axis (not shown), and the CCD camera 5 is moved by the visual switching axis to cause the substrate 1 to be pre-aligned to enter the imaging area of the CCD camera 5.
  • the control device is respectively connected to the calculation module and the rotary table 2, and controls the rotation table 2 to rotate the corresponding angle according to the offset parameter calculated by the calculation module.
  • the present invention provides a substrate pre-alignment method comprising the following steps:
  • Step 1 Select a reference substrate to acquire an image of the reference substrate.
  • the first substrate is used as a reference substrate, and an image of the reference substrate is acquired by the CCD camera 5, and the obtained reference image is as shown in FIG.
  • the imaged drawings of the reference substrate shown in Fig. 3 are only for the purpose of illustrating the embodiments of the present invention and are not intended to limit the invention. Alignment marks are generally included in the imaged view of the reference substrate, but are not limited thereto, and may not include alignment marks, but include other easily identifiable features.
  • Step 2 Acquire an image of the substrate 1 to be pre-aligned. Specifically, the following steps are included:
  • Step A loading the substrate 1 to be pre-aligned onto the rotary table 2, and adjusting the center of the substrate 1 to be pre-aligned by the centering table 3 to coincide with the center of rotation of the rotary table 2;
  • Step B The visual switching axis drives the CCD camera 5 to move along the radial direction of the substrate 1 to be pre-aligned until the substrate 1 to be pre-aligned enters the imaging area of the CCD camera 5, and adjusts the substrate 1 to be pre-aligned by the lifting platform.
  • Vertical height ie, focus adjustment
  • Step C The rotary table 2 drives the substrate 1 to be pre-aligned for one rotation while the CCD camera 5 acquires an image of the substrate 1 to be pre-aligned.
  • Step 3 registering the image of the substrate to be pre-aligned with the image of the reference substrate to obtain an offset parameter of the image of the pre-aligned substrate that completes the registration. Specifically, the following steps are included:
  • the feature points of the reference base image are extracted as the reference feature point set by the image processing program on the calculation module, and the reference feature point set of the obtained reference base image is as shown in FIG. 4 .
  • 4 is a feature point coordinate diagram corresponding to the imaging image of the reference substrate shown in FIG. 3, wherein the abscissa and the ordinate are both pixel values.
  • the feature points of the image to be pre-aligned with the substrate 1 are extracted as a set of registration feature points.
  • the feature points may be selected as spots or corner points in the image, or the spots and corner points may be used together as the feature points. In the embodiment, the feature points preferably adopt the spots and corner points of the image.
  • the spot refers to a mark that is additionally etched, and the corner point refers to a mark point that is pre-aligned with the substrate 1.
  • the initial relative positional relationship between the reference feature point set and the registration feature point set obtained in this embodiment is as shown in FIG. 5; in FIG. 5, A represents a reference feature point set, and B represents a registration feature point set, and at this time, A and B There is a large deviation between them.
  • the image algorithm used in this embodiment is preferably an ICP (Iterative Closest Point) algorithm, which is used to register the set of registration feature points to the set of reference feature points.
  • the specific process of registration includes: calculating a reference feature point closest to each of the registration feature points in the reference feature point set; calculating each registration feature point and a nearest reference corresponding thereto Rigid Transformation with the smallest average distance between feature points and derives an offset parameter; using the offset parameter for the set of registration feature points to obtain a new set of transformed points; iteratively calculating until the transformed point
  • the registration is completed by the average distance between the set and the set of reference feature points being less than a set threshold.
  • a KD tree k-dimensional tree, a data structure for segmenting k-dimensional data space
  • Feature points can effectively improve calculation efficiency.
  • RANSAC Random Sample Consensus algorithm removes erroneous reference feature points from multiple recent reference feature points, effectively improving the matching accuracy.
  • this embodiment uses the RANSAC algorithm to obtain Optimal solution
  • the process of solving the RANSAC algorithm is the common knowledge in the art and will not be described in detail here.
  • a parameter to be pre-aligned with the image of the substrate 1 to be rotated is calculated as an offset parameter.
  • the effect of the reference feature point set and the registration feature point set registration in this embodiment is as shown in FIG. 6.
  • C denotes a reference feature point set
  • D denotes a registration feature point set after registration, in which case the deviation between C and D is small, and the two substantially coincide.
  • Step 4 Adjust a rotation angle of the substrate 1 to be pre-aligned according to the offset parameter to complete substrate pre-alignment.
  • the calculation module transmits the offset parameter to the control device, and the control device controls the rotation angle of the rotary table 2 according to the offset parameter to complete the substrate pre-alignment.
  • step 3 may further include a parameter to be pre-aligned with the image of the substrate 1 that needs to be translated.
  • step 4 may further comprise controlling the translation of the substrate 1 to be pre-aligned relative to the rotary table 2 by the centering table 3 according to the translational parameter.
  • the present invention also provides a lithography machine comprising the above substrate pre-alignment device.
  • the present invention provides a substrate pre-alignment method and apparatus and a lithography machine for registering an image of a substrate 1 to be pre-aligned onto an image of a reference substrate by using an ICP registration algorithm, while utilizing The KD number algorithm and the RANSAC algorithm improve the matching accuracy, calculate the offset parameters required for the pre-aligned substrate 1 to achieve registration, and adjust the position of the substrate 1 to be pre-aligned according to the offset parameters by the control device. It is realized that the pre-alignment processing operation on the substrate can be realized without performing specific marking on the substrate 1 to be pre-aligned, which is more versatile and improves production efficiency.

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Abstract

公开了一种基底预对准方法和装置以及光刻机，其中，基底预对准方法包括选取基准基底，获取基准基底的图像；获取待预对准基底（1）的图像；将待预对准基底（1）的图像与基准基底的图像进行配准，得出完成配准的预对准基底的图像的偏移参数；根据偏移参数调整待预对准基底（1）的角度，完成基底预对准。基底预对准装置包括定位装置，图像采集分析装置以及控制装置。光刻机包括这种基底预对准装置。使用这种对准方法和装置，无需在基底上进行特定的标记便可实现对基底的预对准操作，通用性更强，有利于提高生产效率。还公开了一种包括基底预对准装置的光刻机。

Description

一种基底预对准方法和装置以及一种光刻机 技术领域
本发明涉及集成电路制造领域，尤其涉及一种基底预对准方法和装置以及一种光刻机。
背景技术
在复杂的光刻机中，各个分系统的协调工作都是为了将基底精确放置在曝光台上，以便掩模板上的电路图形能被精确曝光在基底表面指定的位置。但由于基底在传输的过程中方向是随机的，不可避免的与指定的基底曝光位置和曝光方向存在偏差，在光刻机中加入基底预对准系统能够很好的调节这种偏差。
现有的基底预对准系统主要通过在基底上设置定位标记，在将基底定心(使基底中心与指定点，例如承载基底的吸盘中心对准)后通过精确定位基底上的定位标记，将基底的朝向旋转到指定角度，从而实现调节上述偏差的目的。但对于TSV(硅通孔)工艺基底，由于TSV工艺较为复杂，且不同基底采用的标记类型也不一样，这就导致狭义的标记识别和定位方法无法适用于所有类型的基底，而广义的标记识别和定位方法又无法适用于TSV基底的部分工艺层。因此设计一种不依赖于基底标记信号探测的基底预对准方法已成为业界亟待解决的技术问题。
发明内容
本发明提供一种基底预对准方法和装置以及一种光刻机，以克服上述技术缺陷。
为解决上述技术问题，本发明的提供一种基底预对准方法，用于将一待预对准基底调整至一预定位置和预定朝向，包括如下步骤：获取位于定位装 置上且具有所述预定位置和预定朝向的一基准基底的图像；获取位于所述定位装置上的所述待预对准基底的图像；将所述待预对准基底的图像与所述基准基底的图像进行配准，得出所述预对准基底的图像相对于所述基准基底的图像的偏移参数；以及根据所述偏移参数调整所述待预对准基底的位置和/或朝向，以完成基底预对准。
可选地，将所述待预对准基底的图像与所述基准基底的图像进行配准的步骤包括：
提取所述基准基底图像中的多个特征点以构成参照特征点集；
提取所述待预对准基底图像中的多个特征点以构成配准特征点集；
将所述配准特征点集配准至所述参照特征点集以使所述配准特征点集与所述参照特征点集基本重合。
可选地，所述多个特征点包括斑点和/或角点。
可选地，利用迭代最近点算法将所述配准特征点集配准至所述参照特征点集。
可选地，利用迭代最近点算法将所述配准特征点集配准至所述参照特征点集包括：选出所述参照特征点集中与所述配准特征点集中的每个配准特征点最近的参照特征点；计算出每个配准特征点和与其对应的最近的参照特征点之间平均距离最小的刚体变换并得出偏移参数；对所述配准特征点集使用所述偏移参数得出新的变换点集；以及迭代计算直至所述变换点集和所述参照特征点集间的平均距离小于设定的阈值，完成配准。
可选地，采用K-D树算法计算所述参照特征点集中与所述配准特征点集中的每个配准特征点最近的多个参照特征点。
可选地，在计算所述参照特征点集中与所述配准特征点集中的每个配准特征点最近的多个参照特征点后还包括：利用随机抽样一致性算法在所述最近的参照特征点中去除错误的参照特征点，从而选出所述参照特征点集中与所述配准特征点集中的每个配准特征点最近的参照特征点。
为解决上述技术问题，本发明还提出一种基底预对准装置，包括：定位装置，用于对所承载的待预对准基底的位置和/或朝向进行调整；图像采集分析装置，用于分别采集位于所述定位装置上且具有预定位置和预定朝向的一基准基底的图像以及位于所述定位装置上的待预对准基底的图像，将所述待预对准基底的图像与所述基准基底的图像进行配准并计算所述待预对准基底的图像相对于所述基准基底的图像的偏移参数；以及控制装置，分别连接所述图像采集分析装置和所述定位装置，用于根据所述偏移参数通过所述定位装置来调整所述待预对准基底的位置和/或朝向。
可选地，所述定位装置包括旋转台和设置在所述旋转台一侧的定心机构，所述旋转台用于固定待预对准基底并带动所述待预对准基底旋转，所述定心机构用于将所述待预对准基底的中心调整至与所述旋转台的旋转中心重合。
可选地，所述定心机构包括水平导轨和设置在所述水平导轨上的定心台，所述定心台沿所述水平导轨做水平运动。
可选地，所述定位装置还包括设置在所述旋转台底部的升降台，所述升降台用于带动所述旋转台上下运动以调整所述旋转台上的待预对准基底的垂向高度。
可选地，所述图像采集分析装置包括用于图像采集的CCD相机以及计算模块。
可选地，所述基底预对准装置还包括视觉切换轴，所述CCD相机安装在所述视觉切换轴上，所述视觉切换轴用于移动所述CCD相机，使得所述待预对准基底进入所述CCD相机的成像区域内。
为解决上述技术问题，本发明还提出一种光刻机，包括上述的基底预对准装置
与现有技术相比，本发明提供的一种基底预对准方法和装置以及一种光刻机，利用图像配准技术，将待预对准基底的图像与所述基准基底的图像进行配准，并计算完成配准过程中所述待预对准基底图像的偏移参数，根据所 述偏移参数调整所述待预对准基底的角度，完成基底预对准。使用本发明提供的一种基底预对准方法和装置，无需在基底上进行特定的标记便可实现对基底的预对准操作，通用性更强，有利于提高生产效率。
附图说明
图1为本发明一具体实施方式中基底预对准装置示意图；
图2为本发明一具体实施方式中基底预对准方法流程图；
图3为本发明一具体实施方式中基准基底的成像图；
图4为本发明一具体实施方式中基准基底成像图的特征点坐标图；
图5为本发明一具体实施方式中参照特征点集和配准特征点集初始相对位置关系示意图；
图6为本发明一具体实施方式中参照特征点集和配准特征点集配准效果图。
图1中所示：1-待对准基底、2-旋转台、3-定心台、4-水平导轨、5-CCD相机。
具体实施方式
为使本发明的上述目的、特征和优点能够更加明显易懂，下面结合附图对本发明的具体实施方式做详细的说明。需说明的是，本发明附图均采用简化的形式且均使用非精准的比例，仅用以方便、明晰地辅助说明本发明实施例的目的。
本发明实施例提供一种基底预对准方法和装置以及一种光刻机，基底预对准装置包括定位装置、图像采集分析装置、视觉切换轴以及控制装置。
其中，如图1所示，所述定位装置包括旋转台2、设置在所述旋转台2一侧的定心机构以及设置在所述旋转台2底部的升降台；所述升降台用于带动所述旋转台2上下运动以调整其上的待预对准基底1的垂向高度以配合图像 采集分析装置的图像采集；所述定心机构用于将所述待预对准基底1的中心调整至与所述旋转台2的旋转中心重合，即用于对待预对准基底1进行定心操作；所述旋转台2用于固定待预对准基底1并带动待预对准基底1绕旋转中心旋转。本实施例中的旋转台2优选为通过真空吸附方式来固定放置在其上的待预对准基底1，然而本发明对旋转台2固定待预对准基底1的方式不作任何限制。在其他实施例中，旋转台2可通过设置对应基底形状的容置槽来固定基底，或者，也可通过卡合方式来固定基底。进一步地，所述定心机构包括水平导轨4和设置在所述水平导轨4上的定心台3，所述定心台3可沿所述水平导轨4做水平运动，使得待预对准基底1的中心与所述旋转台2的旋转中心重合。具体地，该定心机构的操作可包括：通过定心台3吸附待预对准基底1，同时使得旋转台2释放对待预对准基底1的吸附，以使得定心台3能够带动待预对准基底1相对于旋转台2移动，从而将待预对准基底1的中心与所述旋转台2的旋转中心重合。
所述图像采集分析装置包括用于图像采集的CCD相机5以及计算模块(未图示)，利用CCD相机5采集一基准基底的图像以及待预对准基底1的图像，通过计算模块将所述待预对准基底1图像配准到所述基准基底图像上，并计算将所述待预对准基底1图像配准到所述基准基底图像过程中待预对准基底1图像的偏移参数；所述CCD相机5安装在视觉切换轴(未图示)上，利用视觉切换轴移动CCD相机5，使所述待预对准基底1进入CCD相机5的成像区域内。
所述控制装置分别连接所述计算模块和旋转台2，并根据计算模块计算出的偏移参数控制所述旋转台2旋转相应的角度。
如图2所示，本发明提供一种基底预对准方法包括如下步骤：
步骤1，选取基准基底，获取所述基准基底的图像。本实施例中将首片基底作为基准基底，并利用CCD相机5采集基准基底的图像，获取的基准图像如图3所示。图3所示基准基底的成像图仅用于辅助说明本发明实施例的目 的，并不用于限制本发明。通常基准基底的成像图中包括对准标记，但并不限于此，也可不包括对准标记，而是包括其他易于识别的特征。
步骤2，获取待预对准基底1的图像。具体包括如下步骤：
步骤A：将待预对准基底1加载至旋转台2上，利用定心台3将待预对准基底1的中心调整至与所述旋转台2的旋转中心重合；
步骤B：视觉切换轴带动CCD相机5沿待预对准基底1的径向移动，直至待预对准基底1进入CCD相机5的成像区域内，并利用升降台调节待预对准基底1的垂向高度(即实现调焦)以更好地配合CCD相机5的成像；
步骤C：旋转台2带动待预对准基底1旋转一周，同时CCD相机5获取待预对准基底1的图像。
步骤3，将所述待预对准基底1的图像与所述基准基底的图像进行配准，得出完成配准的预对准基底的图像的偏移参数。具体包括如下步骤：
利用计算模块上的图像处理程序提取所述基准基底图像的特征点作为参照特征点集，获得的基准基底图像的参照特征点集如图4所示。图4为与图3所示基准基底的成像图相对应的特征点坐标图，其横坐标及纵坐标均为像素值。同样地，提取所述待预对准基底1图像的特征点作为配准特征点集。特征点可以选取为图像中的斑点或角点，也可以是斑点和角点共同作为特征点，本实施例中特征点优选采用图像的斑点和角点。其中斑点指的是外加刻蚀的标记点，角点指的是预对准基底1自带的标记点。本实施例中获得的参照特征点集和配准特征点集初始相对位置关系如图5所示；图5中，A表示参照特征点集，B表示配准特征点集，此时A与B之间存在较大偏差。
利用图像算法将所述配准特征点集配准至所述参照特征点集，本实施例中采用的图像算法优选为ICP(Iterative Closest Point，迭代最近点)算法。配准的具体过程包括：计算所述参照特征点集中与所述配准特征点集中的每个配准特征点最近的参照特征点；计算出每个配准特征点和与其对应的最近的参照特征点之间平均距离最小的刚体变换(Rigid Transformation)并得出偏移 参数；对所述配准特征点集使用所述偏移参数得出新的变换点集；迭代计算直至所述变换点集和所述参照特征点集间的平均距离小于设定的阈值，完成配准。
较佳地，采用K-D树(k-dimensional树，一种分割k维数据空间的数据结构)算法计算所述参照特征点集中与所述配准特征点集中的每个配准特征点最近的参照特征点，能有效提高计算效率。在实际计算时，每个配准特征点对应的最近的参照特征点总会有多个，其中包含了很多无法匹配的错误的参照特征点，为解决这一问题，本实施例中采用RANSAC(Random Sample Consensus，随机抽样一致性)算法在多个最近的参照特征点中去除错误的参照特征点，有效提高匹配精确度。
例如，设定配准特征点集为P，则各配准特征点为
Figure PCTCN2018112908-appb-000001
参照特征点集为Q,则各参照特征点为
Figure PCTCN2018112908-appb-000002
j＝1，2，....M，M为自然数，两者的欧式距离为
Figure PCTCN2018112908-appb-000003
目标函数为
Figure PCTCN2018112908-appb-000004
对于
Figure PCTCN2018112908-appb-000005
i＝1,2,....N，N为自然数，其中，R为P的变化矩阵，T为Q的变化矩阵，完成配准就需要计算目标函数最小时的变化矩阵R和T。为提高匹配精确度，本实施例利用RANSAC算法求得
Figure PCTCN2018112908-appb-000006
的最优解，使得目标函数
Figure PCTCN2018112908-appb-000007
最小，RANSAC算法求解的过程为本领域公知常识，这里不做详述。从求得的变化矩阵R和T中计算得出待预对准基底1的图像需要旋转的参数作为偏移参数。本实施例中的参照特征点集和配准特征点集配准后的效果如图6所示。图6中，C表示参照特征点集，D表示配准后的配准特征点集，此时C与D之间偏差很小，两者基本重合。步骤4，根据所述偏 移参数调整所述待预对准基底1的旋转角度，完成基底预对准。具体地，计算模块将偏移参数传送给控制装置，控制装置根据所述偏移参数控制所述旋转台2的旋转角度，完成基底预对准。
需要说明的是，步骤3中偏移参数还可包含待预对准基底1的图像需要平移的参数。相应地，步骤4还可包含根据该平移参数通过定心台3控制待预对准基底1相对于所述旋转台2的平移。
最后判断待预对准基底1的位置是否满足条件，若满足，结束预对准，若不满足，重复上述步骤直至预对准成功。
本发明还提供一种光刻机，具备上述基底预对准装置。
综上所述，本发明提供一种基底预对准方法和装置以及一种光刻机，利用ICP配准算法，将待预对准基底1的图像配准到基准基底的图像上，同时利用K-D数算法和RANSAC算法提高匹配精确度，计算出待预对准基底1实现配准所需的偏移参数，利用控制装置根据偏移参数调整待预对准基底1的位置。实现了无需在待预对准基底1上进行特定的标记便可实现对基底的预对准处理操作，通用性更强，提高生产效率。
显然，本领域的技术人员可以对发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包括这些改动和变型在内。

Claims (14)

  1. 一种基底预对准方法，用于将一待预对准基底调整至一预定位置和预定朝向，其特征在于，包括如下步骤：
    获取位于定位装置上且具有所述预定位置和预定朝向的一基准基底的图像；
    获取位于所述定位装置上的所述待预对准基底的图像；
    将所述待预对准基底的图像与所述基准基底的图像进行配准，得出所述预对准基底的图像相对于所述基准基底的图像的偏移参数；以及
    根据所述偏移参数调整所述待预对准基底的位置和/或朝向，以完成基底预对准。
  2. 根据权利要求1所述的基底预对准方法，其特征在于，将所述待预对准基底的图像与所述基准基底的图像进行配准的步骤包括：
    提取所述基准基底图像中的多个特征点以构成参照特征点集；
    提取所述待预对准基底图像中的多个特征点以构成配准特征点集；
    将所述配准特征点集配准至所述参照特征点集以使所述配准特征点集与所述参照特征点集基本重合。
  3. 根据权利要求2所述的基底预对准方法，其特征在于，所述多个特征点包括斑点和/或角点。
  4. 根据权利要求2所述的基底预对准方法，其特征在于，利用迭代最近点算法将所述配准特征点集配准至所述参照特征点集。
  5. 根据权利要求4所述的基底预对准方法，其特征在于，利用迭代最近点算法将所述配准特征点集配准至所述参照特征点集包括：
    选出所述参照特征点集中与所述配准特征点集中的每个配准特征点最近的参照特征点；
    计算出每个配准特征点和与其对应的最近的参照特征点之间平均距离最 小的刚体变换并得出偏移参数；
    对所述配准特征点集使用所述偏移参数得出新的变换点集；以及
    迭代计算直至所述变换点集和所述参照特征点集间的平均距离小于设定的阈值，完成配准。
  6. 根据权利要求5所述的基底预对准方法，其特征在于，采用K-D树算法计算所述参照特征点集中与所述配准特征点集中的每个配准特征点最近的多个参照特征点。
  7. 根据权利要求5所述的基底预对准方法，其特征在于，在计算所述参照特征点集中与所述配准特征点集中的每个配准特征点最近的多个参照特征点后还包括：利用随机抽样一致性算法在所述最近的参照特征点中去除错误的参照特征点，从而选出所述参照特征点集中与所述配准特征点集中的每个配准特征点最近的参照特征点。
  8. 一种基底预对准装置，其特征在于，包括：
    定位装置，用于对所承载的待预对准基底的位置和/或朝向进行调整；
    图像采集分析装置，用于分别采集位于所述定位装置上且具有预定位置和预定朝向的一基准基底的图像以及位于所述定位装置上的待预对准基底的图像，将所述待预对准基底的图像与所述基准基底的图像进行配准并计算所述待预对准基底的图像相对于所述基准基底的图像的偏移参数；以及
    控制装置，分别连接所述图像采集分析装置和所述定位装置，用于根据所述偏移参数通过所述定位装置来调整所述待预对准基底的位置和/或朝向。
  9. 根据权利要8所述的基底预对准装置，其特征在于，所述定位装置包括旋转台和设置在所述旋转台一侧的定心机构，所述旋转台用于固定待预对准基底并带动所述待预对准基底旋转，所述定心机构用于将所述待预对准基底的中心调整至与所述旋转台的旋转中心重合。
  10. 根据权利要求9所述的基底预对准装置，其特征在于，所述定心机构包括水平导轨和设置在所述水平导轨上的定心台，所述定心台可沿所述水 平导轨做水平运动。
  11. 根据权利要求9所述的基底预对准装置，其特征在于，所述定位装置还包括设置在所述旋转台底部的升降台，所述升降台用于带动所述旋转台上下运动以调整所述旋转台上的待预对准基底的垂向高度。
  12. 根据权利要求9所述的基底预对准装置，其特征在于，所述图像采集分析装置包括用于图像采集的CCD相机以及计算模块。
  13. 根据权利要求12所述的基底预对准装置，其特征在于，所述基底预对准装置还包括视觉切换轴，所述CCD相机安装在所述视觉切换轴上，所述视觉切换轴用于移动所述CCD相机，使得所述待预对准基底进入所述CCD相机的成像区域内。
  14. 一种光刻机，其特征在于，包括如权利要求8-13任一项所述的基底预对准装置。
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