WO2019080642A1 - Dry ice cleaning method - Google Patents

Dry ice cleaning method

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Publication number
WO2019080642A1
WO2019080642A1 PCT/CN2018/103393 CN2018103393W WO2019080642A1 WO 2019080642 A1 WO2019080642 A1 WO 2019080642A1 CN 2018103393 W CN2018103393 W CN 2018103393W WO 2019080642 A1 WO2019080642 A1 WO 2019080642A1
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WO
WIPO (PCT)
Prior art keywords
mold
dry ice
cleaning
cleaned
dirt
Prior art date
Application number
PCT/CN2018/103393
Other languages
French (fr)
Chinese (zh)
Inventor
张青竹
Original Assignee
张青竹
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201710982871 priority Critical
Priority to CN201711002902.9A priority patent/CN107876513A/en
Priority to CN201711002902.9 priority
Application filed by 张青竹 filed Critical 张青竹
Publication of WO2019080642A1 publication Critical patent/WO2019080642A1/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass

Abstract

A dry ice cleaning method comprising the following steps: heating a mold to be cleaned; acquiring a corresponding amount of dry ice from a dry ice storage on the basis of the dirtiness of the surface of the mold to be cleaned; hand-holding a cold spray gun, pressing a button on the cold spray gun, aiming a nozzle at the dirty surface of the mold to be cleaned, and spraying dry ice particles, thus rapidly cooling the dirt on the surface to embrittlement and bursting. The dry ice cleaning method utilizes dry ice for a low-temperature impact condition to blow and peel away a dirt layer, thus removing dirt.

Description

一种干冰清洗方法Dry ice cleaning method 技术领域Technical field
本发明涉及属于模具清洗技术领域,特别涉及一种干冰清洗方法。The invention relates to the field of mold cleaning technology, in particular to a dry ice cleaning method.
背景技术Background technique
现有技术中,一般采用洗模条、清模条、润模条或洗模水对半导体封装模具、集成电路IC、LED、封装系统进行清洗。用洗模条、清模条或洗模水进行清洗时,需要先对模具加热,在模具的沟槽内压入洗模条,利用洗模条把模具表面的污垢粘上带出,为了清洗模具上一些难以清洗的角落,除了用洗模条、清模条、润模条或洗模水以外,再利用碱性化学药剂对模具清洗,用上述方法清洗模具时还需要对模具进行拆装,拆装一套模具不仅费时费工,而且模具在拆装过程中容易造成损伤,一套模具的成本动辄几十至几百万,损伤成本巨大。传统清洗方法采用的洗模条、清模条、润模条需要热熔和冷却,非常耗时,热熔及冷却洗模条、清模条所耗费的时间就要占到整个清洗过程时间的近百分之五十,生产效率极低。另外,洗模水和碱性化学药剂对金属表面也容易造成损伤,需要重新电镀,增加维护成本。另外,碱性化学药剂中的有毒物质对工人容易产生安全隐患,危害工人健康,碱性化学药剂的排放也会产生环境污染问题。因此需要一种安全、高效、环保、经济的清洗方法对半导体封装模具进行清洗。In the prior art, a semiconductor package mold, an integrated circuit IC, an LED, and a package system are generally cleaned by using a mold strip, a clear mold strip, a mold strip, or a mold wash water. When cleaning with a washing strip, a clearing strip or a washing water, it is necessary to heat the mold first, press the washing strip into the groove of the mold, and use the washing strip to stick the dirt on the surface of the mold for cleaning. In the corners of the mold that are difficult to clean, in addition to washing the mold strip, clearing the mold strip, moistening the mold strip or washing the mold water, the mold is cleaned with an alkaline chemical. When the mold is cleaned by the above method, the mold needs to be disassembled. Disassembly and assembly of a set of molds is not only time-consuming and labor-intensive, but also the mold is easy to cause damage during the disassembly process. The cost of a set of molds is tens to millions, and the damage cost is huge. The traditional cleaning method adopts the washing strip, the clearing strip and the running strip, which need hot melt and cooling, which is very time consuming, and the time taken for hot melting and cooling of the washing strip and the clearing strip takes up the entire cleaning process time. Nearly 50%, production efficiency is extremely low. In addition, the washing water and alkaline chemicals are also likely to cause damage to the metal surface, requiring re-plating and increasing maintenance costs. In addition, toxic substances in alkaline chemicals are prone to safety hazards to workers, endangering workers' health, and emissions of alkaline chemicals can also cause environmental pollution problems. Therefore, there is a need for a safe, efficient, environmentally friendly, and economical cleaning method for cleaning semiconductor package molds.
技术问题technical problem
针对现有技术的不足,本发明提供一种能够对半导体封装模具进行安全、高效、环保、经济清洗,节省洗涤时间,提高生产效率的干冰清洗方法。In view of the deficiencies of the prior art, the present invention provides a dry ice cleaning method capable of safely, efficiently, environmentally and economically cleaning a semiconductor package mold, saving washing time and improving production efficiency.
技术解决方案Technical solution
本发明的技术方案为: 提供一种干冰清洗方法,包括以下步骤:The technical solution of the present invention is: Providing a dry ice cleaning method, comprising the following steps:
步骤一:加热待清洗模具;Step 1: heating the mold to be cleaned;
步骤二:根据待清洗模具表面的污垢程度从储存干冰处获取相应数量的干冰;Step 2: Obtain a corresponding amount of dry ice from the stored dry ice according to the degree of dirt on the surface of the mold to be cleaned;
步骤三:手持冷喷枪,按动冷喷枪按钮,将喷嘴对准待清洗模具的污垢表面,喷射干冰颗粒,使其表面污垢急剧冷冻至脆化及爆裂。Step 3: Hold the cold spray gun, press the cold spray gun button, point the nozzle on the dirt surface of the mold to be cleaned, spray dry ice particles, and make the surface dirt freeze to embrittlement and burst.
优选地,所述待清洗模具为半导体封装模具、光电模具、微电子模具中的任一种。Preferably, the mold to be cleaned is any one of a semiconductor package mold, a photoelectric mold, and a microelectronic mold.
优选地,所述冷喷枪的枪管可根据待清洗模具的实际清洗需要做相应的加长处理。Preferably, the barrel of the cold spray gun can be correspondingly lengthened according to the actual cleaning needs of the mold to be cleaned.
优选地,所述冷喷枪的枪管靠近喷嘴的一端可弯折成不同角度以适应待清洗模具不同污垢位置的清洗。Preferably, the end of the barrel of the cold spray gun near the nozzle can be bent at different angles to accommodate the cleaning of different dirt locations of the mold to be cleaned.
优选地,所述冷喷枪的枪把上设有防撞击的缓冲结构,所述缓冲结构所采用的材质为棉质布料、橡胶软垫或弹性塑胶中的任一一种或几种的组合。Preferably, the gun handle of the cold spray gun is provided with an impact-proof buffer structure, and the buffer structure is made of any one or a combination of cotton cloth, rubber cushion or elastic plastic.
有益效果Beneficial effect
1、替代了传统的利用洗模条、清模条、润模条或洗模水及碱性化学药剂清洗半导体模具的清洗方法,传统方法中热熔后的洗模条、清模条会产生有毒气体,不够环保,本发明避免了因使用洗模条、清模条或润模条或洗模水及碱性化学药剂清洗产生的环境污染问题。1. It replaces the traditional cleaning method of cleaning the semiconductor mold by using the washing strip, the clearing strip, the moulding strip or the washing water and the alkaline chemical. In the conventional method, the hot-melted washing strip and the clear strip will be produced. The toxic gas is not environmentally friendly, and the invention avoids the environmental pollution problem caused by the use of the washing strip, the clear mold strip or the mold strip or the washing water and the alkaline chemical cleaning.
2、干冰清洗是利用物理原理对模具进行清洗,清洗速度快,对模具不造成损伤,因此避免了因用传统洗模条、清模条或润模条或洗模水及碱性化学药剂的清洗方法带来的复次电镀的浪费,降低成本,且不会产生有害气体,不会造成二次污染,安全环保。2, dry ice cleaning is the use of physical principles to clean the mold, cleaning speed, no damage to the mold, thus avoiding the use of traditional washing strips, clear mold strips or mold strips or washing water and alkaline chemicals The cleaning method brings waste of multiple electroplating, reduces costs, does not generate harmful gases, does not cause secondary pollution, and is safe and environmentally friendly.
3、清洗过程中,无需对待清洗模具进行拆装,节省了模具的拆装时间和传统方法清洗时洗模条、清模条、润模条需经热熔再冷却的时间,将清洗时间由原来的2至3个小时节省至20分钟,快捷高效,大大提高了清洗效率,同时模具也避免因拆装造成损坏。3. During the cleaning process, it is not necessary to disassemble and clean the mold, which saves the time of disassembly and assembly of the mold and the time when the mold strip, the clear mold strip and the mold strip need to be hot melted and then cooled by the traditional method. The original 2 to 3 hours saved to 20 minutes, fast and efficient, greatly improving the cleaning efficiency, while the mold also avoids damage caused by disassembly.
4、可利用冷喷枪对模具的特定部位进行定点清洗,不需每次都整体清洗,非常经济方便。4. The cold spray gun can be used for fixed-point cleaning of specific parts of the mold, which does not need to be cleaned every time, which is very economical and convenient.
5、本方法适用于半导体封装模具、光电模具、微电子模具的清洗,对LED模具、集成电路IC模具有很好的清洗效果,市场前景广阔。5. The method is suitable for the cleaning of semiconductor packaging molds, photoelectric molds and micro-electronic molds. It has a good cleaning effect on LED molds and integrated circuit IC molds, and has a broad market prospect.
本发明的最佳实施方式BEST MODE FOR CARRYING OUT THE INVENTION
一种干冰清洗方法,包括以下步骤:A dry ice cleaning method comprising the following steps:
步骤一:加热待清洗模具;Step 1: heating the mold to be cleaned;
步骤二:根据待清洗模具表面的污垢程度从储存干冰处获取相应数量的干冰;Step 2: Obtain a corresponding amount of dry ice from the stored dry ice according to the degree of dirt on the surface of the mold to be cleaned;
步骤三:手持冷喷枪,按动冷喷枪按钮,将喷嘴对准待清洗模具的污垢表面,喷射干冰颗粒,使其表面污垢急剧冷冻至脆化及爆裂。Step 3: Hold the cold spray gun, press the cold spray gun button, point the nozzle on the dirt surface of the mold to be cleaned, spray dry ice particles, and make the surface dirt freeze to embrittlement and burst.
其中,所述待清洗模具为半导体封装模具、光电模具、微电子模具中的任一种。所述冷喷枪的枪管可根据待清洗模具的实际清洗需要做相应的加长处理,枪管的直管段长度为25cm-40cm,所述冷喷枪的枪管靠近喷嘴的一端可弯折成不同角度以适应待清洗模具不同污垢(模具在生产过程中产生的物料粘连)位置的清洗,喷嘴材质采用不锈钢或铝合金或尼龙复合材料或合金材料中的一种,喷嘴内径为0.6cm或0.8cm。The mold to be cleaned is any one of a semiconductor package mold, a photoelectric mold, and a microelectronic mold. The barrel of the cold spray gun can be lengthened according to the actual cleaning needs of the mold to be cleaned. The length of the straight pipe section of the barrel is 25cm-40cm, and the end of the barrel of the cold spray gun near the nozzle can be bent into different angles. The nozzle material is one of stainless steel or aluminum alloy or nylon composite material or alloy material, and the inner diameter of the nozzle is 0.6cm or 0.8cm, in order to meet the cleaning of the different dirt of the mold to be cleaned (the material is stuck in the production process).
所述冷喷枪枪体前端可直接通过螺纹连接不同型号规格及材质的喷嘴以适应不同规格模具的清洗,所述不同型号规格的喷嘴包括喷嘴管体呈不同弯折角度的圆形喷嘴或喷嘴管体呈不同弯折角度的矩形喷嘴,所述喷嘴材质采用尼龙复合材料或铝合金或不锈钢或合金材料中的一种,在清洗模具表面点凹面上的污垢时,一般选用安装了圆形喷嘴的冷喷枪,实现点对点清洗,清洗位置精确,在清洗污垢面积较大的模具表面时,一般选用安装了矩形喷嘴的冷喷枪,从矩形喷嘴中喷射出的干冰颗粒呈矩形条状一次性喷射到污垢表面,与模具表面接触面积增大,清洗力度增大,节省清洗时间。所述冷喷枪可以手持操作,也可通过安装在移动支架上,在移动支架带动下对待清洗模具污垢表面进行清洗。The front end of the cold spray gun body can be directly screwed to nozzles of different specifications and materials to suit the cleaning of different specifications of the mold, and the nozzles of different model specifications include a circular nozzle or a nozzle tube with different bending angles of the nozzle tube body. The rectangular nozzles with different bending angles are made of nylon composite material or aluminum alloy or stainless steel or alloy material. When cleaning the dirt on the concave surface of the mold surface, a circular nozzle is generally used. The cold spray gun realizes point-to-point cleaning and the cleaning position is accurate. When cleaning the surface of the mold with large dirt area, a cold spray gun with a rectangular nozzle is generally selected, and the dry ice particles sprayed from the rectangular nozzle are sprayed into the dirt in a rectangular strip. The surface, the contact area with the mold surface is increased, the cleaning force is increased, and the cleaning time is saved. The cold spray gun can be operated by hand, or can be cleaned by installing the moving bracket on the dirty surface of the cleaning mold driven by the moving bracket.
冷喷枪工作原理:利用压缩空气将干冰颗粒加速到超音速,喷射到待清洗模具表面。干冰清洗时喷射介质(干冰颗粒)经高压气流加速,通过喷嘴喷出,冲击到需要清洗的模具表面,有效地去除目标污垢。这是因为干冰颗粒温度极低,用于去污清理时,使得清洗表面污染层与粘附的基底层之间形成温度差,由于不同材料具有不同热膨胀系数,表面污染层与粘附的基底层之间的温度差会破坏两种材料间的物理结合,利用其收缩性不同使其粘附层产生裂纹并脆化。同时,在冲击瞬间,干冰破裂,进入裂缝同时在千分之几秒内体积膨胀近倍,造成“微型爆炸”,将污垢层吹扫剥离,清除污物。干冰的低温冲击条件下,清洗物表面的污染层龟裂,由于强烈的温差使得污染层龟裂加剧,污染层碎屑开始剥落,干冰在千分之几秒内升华,体积膨胀近600-800倍,造成“微型爆炸”,将污垢层吹扫剥离,清除污物。由于干冰颗粒是通过加速后喷射到待清洗模具表面的,喷射时产生的冲击力会对冷喷枪产生反向压力,人手持枪把时会出现拿不稳的情况,若不慎脱手,冷喷枪砸到模具上,会对高昂的模具造成损坏,砸到人身上,也会危及人身安全,本发明中的冷喷枪在枪把上设有缓冲结构,所述缓冲结构所采用的材质为棉质布料、橡胶软垫或弹性塑胶中的任一一种或几种的组合。Cold spray gun working principle: The dry ice particles are accelerated to supersonic speed by compressed air and sprayed onto the surface of the mold to be cleaned. When the dry ice is cleaned, the spray medium (dry ice particles) is accelerated by the high-pressure airflow, and is sprayed through the nozzle to impact the surface of the mold to be cleaned, effectively removing the target dirt. This is because the dry ice pellets have extremely low temperatures and are used for decontamination cleaning to create a temperature difference between the cleaning surface contamination layer and the adhered substrate layer. Since different materials have different coefficients of thermal expansion, the surface contamination layer and the adhered substrate layer The temperature difference between them will destroy the physical bond between the two materials, and the adhesion layer will be cracked and embrittled by the difference in shrinkage. At the same time, at the moment of impact, the dry ice ruptures and enters the crack at the same time, and the volume expands nearly twice in a few thousandths of a second, causing a “micro explosion”, which sweeps off the dirt layer and removes dirt. Under the low temperature impact condition of dry ice, the pollution layer on the surface of the cleaning material is cracked. Due to the strong temperature difference, the crack of the pollution layer is intensified, the debris of the pollution layer begins to peel off, the dry ice sublimes in a few thousandths of a second, and the volume expands nearly 600-800. Double, causing a "micro explosion", sweeping off the dirt layer and removing dirt. Since the dry ice particles are sprayed onto the surface of the mold to be cleaned by acceleration, the impact force generated during the injection will cause a reverse pressure on the cold spray gun, and the person may hold the gun when the handle is unstable. If the hand is accidentally released, the cold spray gun When it is hit on the mold, it will damage the high mold, and it will also endanger the personal safety. The cold spray gun of the present invention has a buffer structure on the handle, and the cushion structure is made of cotton. Any one or combination of cloth, rubber cushion or elastic plastic.
工业实用性Industrial applicability
以上所述仅为本发明的较佳实施例,凡依本发明权利要求范围所做的均等变化与修饰,皆应属本发明权利要求的涵盖范围。The above are only the preferred embodiments of the present invention, and all changes and modifications made within the scope of the claims of the present invention should be construed as the scope of the claims.

Claims (5)

  1. 一种干冰清洗方法,其特征在于,包括以下步骤:A method for cleaning dry ice, comprising the steps of:
    步骤一:加热待清洗模具;Step 1: heating the mold to be cleaned;
    步骤二:根据待清洗模具表面的污垢程度从储存干冰处获取相应数量的干冰;Step 2: Obtain a corresponding amount of dry ice from the stored dry ice according to the degree of dirt on the surface of the mold to be cleaned;
    步骤三:手持冷喷枪,按动冷喷枪按钮,将喷嘴对准待清洗模具的污垢表面,喷射干冰颗粒,使其表面污垢急剧冷冻至脆化及爆裂。Step 3: Hold the cold spray gun, press the cold spray gun button, point the nozzle on the dirt surface of the mold to be cleaned, spray dry ice particles, and make the surface dirt freeze to embrittlement and burst.
  2. 根据权利要求1所述的干冰清洗方法,其特征在于,所述待清洗模具为半导体封装模具、光电模具、微电子模具中的任一种。The dry ice cleaning method according to claim 1, wherein the mold to be cleaned is any one of a semiconductor package mold, a photoelectric mold, and a microelectronic mold.
  3. 根据权利要求1所述的干冰清洗方法,其特征在于,所述冷喷枪的枪管可根据待清洗模具的实际清洗需要做相应的加长处理。The dry ice cleaning method according to claim 1, wherein the barrel of the cold spray gun can be subjected to a corresponding lengthening process according to the actual cleaning needs of the mold to be cleaned.
  4. 根据权利要求1所述的干冰清洗方法,其特征在于,所述冷喷枪的枪管靠近喷嘴的一端可弯折成不同角度以适应待清洗模具不同污垢位置的清洗。The dry ice cleaning method according to claim 1, wherein one end of the barrel of the cold spray gun near the nozzle is bendable at different angles to accommodate cleaning of different dirt positions of the mold to be cleaned.
  5. 根据权利要求1所述的干冰清洗方法,其特征在于,所述冷喷枪的枪把上设有防撞击的缓冲结构,所述缓冲结构所采用的材质为棉质布料、橡胶软垫或弹性塑胶中的任一一种或几种的组合。The dry ice cleaning method according to claim 1, wherein the gun handle of the cold spray gun is provided with an impact-proof buffer structure, and the buffer structure is made of cotton cloth, rubber cushion or elastic plastic. Any one or combination of several.
PCT/CN2018/103393 2017-10-20 2018-08-31 Dry ice cleaning method WO2019080642A1 (en)

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