WO2019078012A1 - Boîtier de logement de carte de base - Google Patents

Boîtier de logement de carte de base Download PDF

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Publication number
WO2019078012A1
WO2019078012A1 PCT/JP2018/037157 JP2018037157W WO2019078012A1 WO 2019078012 A1 WO2019078012 A1 WO 2019078012A1 JP 2018037157 W JP2018037157 W JP 2018037157W WO 2019078012 A1 WO2019078012 A1 WO 2019078012A1
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WO
WIPO (PCT)
Prior art keywords
base member
electronic circuit
case
circuit board
hole
Prior art date
Application number
PCT/JP2018/037157
Other languages
English (en)
Japanese (ja)
Inventor
匠大 江崎
河合　義夫
良育 根岸
裕二朗 金子
尭之 福沢
Original Assignee
日立オートモティブシステムズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立オートモティブシステムズ株式会社 filed Critical 日立オートモティブシステムズ株式会社
Publication of WO2019078012A1 publication Critical patent/WO2019078012A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/0052—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by joining features of the housing parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0047—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB
    • H05K5/006—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a two-part housing enclosing a PCB characterized by features for holding the PCB within the housing

Definitions

  • the present invention relates to a substrate housing case of an electronic control unit mounted on a vehicle such as an engine control unit and a control unit for an automatic transmission.
  • either one of the cover member or the base member is formed of a metal material, and tap processing is applied to a plurality of portions of the cover member or the base member formed of this metal material. Form a female screw. Then, at the corresponding position of the electronic circuit board, a through hole penetrating the electronic circuit board in the thickness direction is formed, and the through hole of the electronic circuit board is overlapped concentrically with the female screw portion of the cover member or the base member. In the state, it is common to fix with a screw.
  • Patent Document 1 female screw parts are formed at four places of a metal base member, and the electronic circuit board is used as a base member by screws in a state where through holes formed in the electronic circuit board are matched with the female screw parts.
  • a substrate storage case for fixing is disclosed.
  • metal scraps are generated when forming an internal thread on the base member by tapping, and if the metal scraps are not completely removed, they adhere to the electronic circuit board and cause a short circuit. There was a fear.
  • the size of the substrate storage case is increased.
  • the present invention has been made in view of the above problems, and has an object of appropriately fixing an electronic circuit board to a board housing case with a simple structure.
  • a substrate storage case including a base member and a case member fixed opposite to the base member and fixing an electronic circuit board between the base member and the case member, A through hole is provided in at least one of the base member and the case member, and the electronic circuit can be obtained by fitting the protrusion to the through hole provided in at least one of the base member and the case member.
  • the substrate, the base member, and the case member are fixed at the same place.
  • the electronic circuit board can be appropriately fixed to the board housing case with a simple structure.
  • the substrate storage case 1 according to the embodiment of the present invention will be described.
  • the case where the substrate storage case 1 is applied to a substrate storage case in which an electronic circuit board (Electronic Control Unit: ECU) for controlling a movable body such as a vehicle is fixed and stored will be described.
  • ECU Electronic Control Unit
  • FIG. 1 is a perspective view of a substrate storage case 1 according to the embodiment.
  • FIG. 2 is an exploded perspective view of the substrate storage case 1 according to the embodiment.
  • FIG. 3 is an enlarged perspective view of the fitting portion between the through hole and the projection, and is a view of the projection before fixing the substrate storage case from the base member side.
  • FIG. 4 is an enlarged perspective view of the fitting portion between the through hole and the projection, and is a view of the projection after fixing the substrate storage case as viewed from the base member side.
  • the substrate storage case 1 has a base member 10 and a case member 20.
  • the base storage case 10 is formed by engaging the base member 10 and the case member 20 in a state of facing each other.
  • the base member 10 is formed of a metal material.
  • the base member 10 has a rectangular basic shape, and each of the four corners of the base member 10 is provided with a through hole 11 penetrating the base member 10 in the thickness direction.
  • the base member 10 is provided with a recess 12 at a position corresponding to an electronic component 32 mounted on an electronic circuit substrate 30 described later, and the recess 12 avoids interference with the electronic component of the electronic circuit substrate 30.
  • the base member 10 is provided with a mounting portion 13 at an outer peripheral portion, and is mounted to a movable body (not shown) such as a vehicle by the mounting portion 13.
  • the case member 20 is a bottomed box-shaped member formed of a resin material. In plan view, the case member 20 has a rectangular basic shape. On the surface of the case member 20 on the side of the base member 10, a protrusion 21 formed integrally with the case member 20 is provided so as to protrude toward the base member 10.
  • the protrusions 21 are provided at positions corresponding to the through holes 11 of the base member 10 at the four corners of the case member 20, and the respective protrusions 21 are inserted into the corresponding through holes 11.
  • an electronic circuit board 30 is disposed between the base member 10 and the case member 20.
  • a printed wiring board or the like is used for the electronic circuit board 30, and at the four corners of the electronic circuit board 30, through holes 31 which penetrate the electronic circuit board 30 in the thickness direction are provided.
  • the through holes 31 are provided at positions corresponding to the through holes 11 of the base member 10, respectively.
  • a plurality of electronic components 32 and connectors 35 are mounted on the electronic circuit board 30.
  • a connection cable (not shown) for performing information communication with an external device and power supply to the electronic circuit board 30 is inserted.
  • the through hole 11 of the base member 10 when the case member 20 and the base member 10 are assembled from the upper and lower direction so as to sandwich the electronic circuit substrate 30, the through hole 11 of the base member 10, the through hole 31 of the electronic circuit substrate 30, and the case
  • the protrusions 21 of the member 20 are concentrically located, and the protrusions 21 are adapted to pass through the through holes 11 and 31 (see FIG. 3).
  • the protrusion 21 is set to a length longer than the total thickness of the board thickness of the electronic circuit board 30 and the board thickness of the base member 10. Accordingly, the protrusion 21 protrudes outward from the base member 10 in a state of being inserted into the through hole 11 of the base member 10 and the through hole 31 of the electronic circuit board 30.
  • the base member 10 and the case member 20 are fixed by pressing and deforming the protrusion 21 projecting outward from the base member 10 simultaneously with heating (crushing and caulking the tip) (FIG. 4). reference).
  • the electronic circuit board 30 is fixed in a state of being accommodated in the board accommodation case 1 formed by the base member 10 and the case member 20.
  • the heat conducting member 40 (see FIGS. 3 and 4) is disposed between the electronic circuit board 30 and the base member 10 formed of a metal material, and the heat generating component of the electronic circuit board 30 is The heat generated in (for example, the electronic component 32) is transmitted to the heat conducting member 40 and dissipated to the base member 10.
  • a metal base member 10 and a resin case member 20 fixed to face the base member 10 are fixed, and the electronic circuit board 30 is fixed between the base member 10 and the case member 20
  • the through hole 11 is provided in the base member 10, and the protrusion 21 provided in the case member 20 is fitted in the through hole 11 provided in the base member 10.
  • the electronic circuit board 30, the base member 10, and the case member 20 are fixed at the same place.
  • the board accommodating case can be miniaturized.
  • the number of steps for tapping the base member 10 and the number of steps for screwing the electronic circuit board 30 to the base member 10 become unnecessary, and it is not necessary to prepare a screw member. Therefore, the manufacturing cost and the assembly cost of the substrate storage case can be suppressed.
  • the base member 10 and the case member 20 are assembled by pressing (at the same time as heating) and deforming (caking) the resin-made protrusion 21 that protrudes to the metal base member 10 side. Accordingly, since the melted projection 21 is fixed in close contact with the base member 10, the liquid can be prevented from entering from the base member 10 side, and the waterproofness can be enhanced.
  • the electronic circuit board 30 has a through hole 31 (engagement portion) engaged with the projection 21 of the case member 20, and the projection 21 provided on the case member 20 is a part of the electronic circuit board 30.
  • the position with respect to the base member 10 of the electronic circuit board 30 is determined by inserting (engaging) the through hole 31.
  • the projection 21 of the case member 20 is inserted into the through hole 11 of the base member 10 and the through hole 31 of the electronic circuit board 30 to position the electronic circuit board 30 with respect to the base member 10. And securely fixed to the base member 10.
  • the case member 20 is formed of a resin material, and the protrusion 21 is integrally formed with the case member 20 formed of a resin material.
  • the protrusion 21 can be formed simultaneously with the resin molding of the case member 20, and the manufacturing cost for forming the protrusion 21 can be reduced.
  • the protrusions 21 themselves are formed of the same resin material as the case member 20, they are easily deformed by heating and pressing in a state where the protrusions 21 are inserted into the through holes 11 of the base member 10 Can be easily fixed to the base member 10.
  • the electronic circuit board 30 can be appropriately fixed to the substrate storage case 1 with a simple structure.
  • FIG. 5 is a perspective view of a substrate storage case 1A according to a second embodiment.
  • FIG. 6 is an exploded perspective view of a substrate storage case 1A according to the second embodiment.
  • the substrate storage case 1A according to the second embodiment is different from the above-described embodiment in that the base member 10A and the case member 20A are fixed by the caulking pins 50 of separate members.
  • symbol is attached
  • the substrate storage case 1A has a base member 10A and a case member 20A, and the base member 10A and the case member 20A are fixed by caulking pins 50.
  • the case member 20A is formed of a metal material in the same manner as the base member 10.
  • the case member 20A has a rectangular basic shape.
  • through holes 22 which penetrate the case member 20A in the thickness direction are provided.
  • Each of the through holes 22 is provided at a position corresponding to the through hole 11A of the base member 10A.
  • the through hole 22 of the case member 20A, the through hole 31 of the electronic circuit board 30, and the through hole 11A of the base member 10A are located concentrically.
  • the caulking pin 50 is provided with the head 51 at one end, and the projection 52 is formed at the other end.
  • the axial length of the projection 52 is longer than the total length of the through hole 11A of the base member 10A, the through hole 31 of the electronic circuit board 30, and the through hole 22 of the case member 20A. It is set to.
  • the protrusions 52 of the crimping pins 50 are inserted from the case member 20A side, and are protruded to the outside of the base member 10A through the through holes 31 of the electronic circuit board 30.
  • the projection 52 projecting to the outside of the base member 10A is simultaneously pressurized with the heating (crimping) to form the case member 20A, the electronic circuit board 30, and the base member 10A. Is fixed in the state where it is positioned.
  • the projection 52 of the crimp pin 50 is formed as a separate member different from any of the base member 10A and the case member 20A.
  • the crimp pin 50 can be formed of a material different from that of the base member 10A and the case member 20A (in the embodiment, a resin material). Therefore, for example, both the base member 10A and the case member 20A can be formed of a metal material, and the heat generated in the electronic circuit board 30 can be dissipated at one time to both the base member 10A side and the case member 20A side. Can. Therefore, the heat dissipation performance of the board accommodation case 1A can be improved while reliably positioning and fixing the base member 10A, the case member 20A, and the electronic circuit board 30 by the crimping pins 50.
  • the base member 10A and the case member 20A may be resin members.
  • the joint surface of the crimping pin 50 and the base member 10A is fused by heating, and the adhesion between the crimping pin 50 and the base member 10A is further enhanced.
  • the liquid can be reliably prevented from entering from the joint surface between the crimping pin 50 and the base member 10A, and the waterproofness can be further improved.
  • the peeling strength from the base member 10A of the crimp pin 50 due to vibration or the like can also be improved.
  • a part or all of at least one of the base member 10A and the case member 20A is formed of a metal material.
  • the heat generation component of the electronic circuit board 30 is brought into contact with at least one of the base member 10A or the case member 20A formed of the metal material directly or indirectly, whereby the heat from the heat generation component is made of the metal material.
  • the heat can be dissipated to at least one of the formed base member 10A and the case member 20A.
  • FIG. 7 is a cross-sectional view of the area around the protrusion 21B of the substrate storage case 1B according to the third embodiment.
  • the substrate accommodation case 1B according to the third embodiment is different from the above-described embodiment in that the through holes 11B of the base member 10B are tapered.
  • symbol is attached
  • the through holes 11B of the base member 10B are formed such that the diameter gradually increases as they are separated from the case member 20B (electronic circuit board 30) side. That is, in the cross-sectional view shown in FIG. 7, the through hole 11 has a tapered shape that spreads in a direction away from the central axis X of the through hole 11B as being away from the case member 20.
  • the protrusion 21B of the case member 20B is inserted into the through hole 11B, the tip of the protrusion 21B is crushed while being heated (when crimped), the protrusion 21B has a tapered shape of the through hole 11B. Transform to fit.
  • the axial diameter of the protrusion 21B is expanded along the tapered shape of the through hole 11B, so the fixing (crimping) strength of the base member 10B and the case member 20B by the protrusion 21B becomes high, and the protrusion of the case member 20B The removal strength from the through hole 11B of the portion 21B is also enhanced.
  • the through hole 11 of the base member 10 is described as being tapered, but the through hole 31 of the electronic circuit board 30 may be similarly tapered.
  • the through holes of both the through holes 11 of the base member 10 and the through holes 31 of the electronic circuit board 30 become tapered, so the deformation region when the protrusion 21B is deformed by heating and pressing It is possible to increase the diameter of most of the protrusions 21B in Thus, the fixing strength between the base member 10 and the case member 20B by the protrusion 21B can be further enhanced.
  • the through holes 11B of the base member 10B are configured to be gradually increased in diameter along the thickness direction of the base member 10B.
  • the through hole 11B of the base member 10B has a tapered shape, so when the protrusion 21B inserted into the through hole 11B is heated and pressurized, the protrusion 21B has a tapered shape of the through hole 11B. Transform along. Therefore, the projection 21B also has a tapered shape, and the shaft diameter is increased, so that the strength for fixing the base member 10B and the case member 20B is increased.
  • the removal strength of the protrusion 21B from the through hole 11B can also be improved.
  • the liquid can be more reliably prevented from entering from the base member 10B side, and the waterproof performance of the substrate storage case 1B can be further enhanced. it can.
  • FIG. 8 is a cross-sectional view of the vicinity of the protrusion 21C of the substrate accommodation case 1C according to the fourth embodiment.
  • the substrate housing case 1C according to the fourth embodiment is different from the above-described embodiment in that the pedestal portion 15 is provided around the tapered through hole 11C of the base member 10C.
  • symbol is attached
  • the base member 10 ⁇ / b> C of the substrate storage case 1 ⁇ / b> C has a tapered through hole 11 ⁇ / b> C in a cross sectional view.
  • the base member 10C is provided with a pedestal portion 15 having a conical shape over the entire circumference of the through hole 11C in the circumferential direction.
  • the electronic circuit board 30 side of the pedestal portion 15 is a flat surface, and the electronic circuit board 30 is mounted on the flat surface, and the pedestal portion 15 stably supports the electronic circuit substrate 30.
  • the pedestal portion 15 is formed so as to protrude toward the electronic circuit board 30 side, and the diameter of the cone is reduced so as to approach the central axis X of the through hole 11C as the electronic circuit board 30 side is approached.
  • the pedestal portion 15 has a tapered shape that inclines in the central axis X direction as it approaches the electronic circuit board 30 from the base member 10C.
  • the slope of the taper of the pedestal portion 15 and the slope of the taper of the through hole 11C are the same slope, and the pedestal portion 15 is formed integrally with the base member 10C forming the through hole 11C.
  • the pedestal portion 15 is provided around the through hole 11C, and the tapered portion and the pedestal portion 15 of the through hole 11C.
  • the taper length of the through hole 11 ⁇ / b> C can be increased by continuing the tapered portion.
  • the protrusion 21C of the case member 20C is crushed while being heated while being inserted through the pedestal 15 and the through hole 11C, whereby the protrusion 21C is more along the tapered shape of the pedestal 15 and the through hole 11C. Transform in a wide range. Therefore, the axial diameter of the protrusion 21C can be increased in a wider range in the central axis X direction, and the fixing strength of the protrusion 21C can be further enhanced.
  • the pedestal portion 15 protruding in the direction of the electronic circuit board 30 is provided around the through hole 11C of the base member 10C.
  • the length of the tapered portion in which the projection 21C deforms can be increased by the thickness of the pedestal 15 in the central axis X direction, and the deformation of the projection 21C can be broadened by that amount.
  • the fixing strength of the protrusion 21C can be further enhanced.
  • the contact area between the protrusion 21C and the through hole 11C can be increased, and the removal strength of the protrusion 21C to the through hole 11C can be enhanced, and the entry of the liquid from the base member 10C side can be more reliably blocked.
  • the waterproofness of the substrate storage case 1C can be enhanced.
  • the pedestal portion 15 protrudes to the electronic circuit substrate 30 side is described as an example, but the pedestal portion 15 provided around the through hole 11C is the electronic circuit substrate 30 It may be projected on the side opposite to the axial direction of the central axis X.
  • the protrusion 21C can be deformed in a wider range by the taper of the base 15 and the through hole 11C, and the fixing strength of the protrusion 21C can be increased as described above. it can.
  • the through holes for positioning and fixing the electronic circuit board 30 are provided in the vicinity of the electronic component 32 in addition to the four corners of the electric circuit board 30, as described above. This is a point different from the embodiment described above.
  • symbol is attached
  • the through holes 14 provided in the vicinity of the electronic component 32 of the electronic circuit board 30 are provided.
  • a protrusion (not shown) at a position corresponding to the through hole 14 in the vicinity of the electronic component. Is provided.
  • the electronic circuit board 30D by providing the through holes 33 in the vicinity of the electronic component 32 and at positions corresponding to the through holes 14 and the protrusions, the electronic component board 32D is provided in addition to the four corners of the electronic circuit board 30D.
  • the electronic circuit board 30D can be supported in the vicinity.
  • the electronic circuit board 30D is in the form of a thin plate, if it is fixed at the four corners of the board, distortion may occur.
  • the electronic circuit board 30D in the vicinity of the electronic component 32 in addition to the four corners of the electronic circuit substrate 30D, in particular, the electronic circuit board 30D in the vicinity of the electronic component 32 affecting the solder life. Distortion can be suppressed.
  • the clearance S between the electronic circuit board 30D and the base member 10D can be secured with high accuracy.
  • the heat generating component for example, the electronic component 32
  • the heat conduction member 40 can be disposed between the member 10D and the heat conduction of the electronic circuit board 30D can be performed more reliably.
  • a seal member 60 having a high thermal conductivity may be disposed between the heat generating component of the electronic circuit board 30D and the base member 10D.
  • the thermal conductivity of the seal member 60 is set to 0.5 W / mk or more, and the heat generated from the heat generating component (for example, the electronic component 32) of the electronic circuit board 30D is efficiently applied to the base member 10D. It can transfer heat.
  • the positions of the support portions other than the four corners of the electronic circuit board 30D are not limited to the vicinity of the electronic component 32 as long as distortion of the electronic circuit board 30D can be suppressed. It may be near the center other than the four corners. Further, in the substrate accommodation case 1D, in order to more reliably suppress distortion around the electronic component 32, the electronic component 32 may be supported at a plurality of locations around it.
  • the vicinity of the electronic component 32 of the electronic circuit board 30D is supported by the through hole 14 of the base member 10D and the projection of the case member 20D. The degree can be secured.
  • the package of the electronic component 32 is a component that is concerned about the solder life, such as a ball grid array (BGA) or a quad flat non-leaded package (QFN), the distortion of the mounting area due to the assembly of the electronic circuit board 30D. As a result, it is possible to prevent a decrease in life due to unexpected stress on the solder.
  • BGA ball grid array
  • QFN quad flat non-leaded package
  • the heat conducting member 40 (or the sealing member 60 having a high thermal conductivity) having an appropriate thickness between the heat generating component (for example, the electronic component 32) mounted on the electronic circuit board 30D and the base member 10D or the case member 20D. And the like can be provided, and heat dissipation of the heat-generating component can be appropriately performed.
  • the seal member 60 having a high thermal conductivity may be disposed between the heat generating component of the electronic circuit board 30 and the base member 10D or the case member 20D.
  • the thermal conductivity of the seal member 60 is set to be 0.5 W / mk or more.
  • the sealing member 60 can efficiently transfer the heat generated from the heat generating component (for example, the electronic component 32) of the electronic circuit board 30D and can dissipate the heat to the base member 10D and the case member 20D.
  • the heat generating component for example, the electronic component 32
  • FIG. 9 is an exploded perspective view of a substrate storage case 1D according to the sixth embodiment.
  • FIG. 10 is a cross-sectional view of the periphery of a protrusion 21D of a substrate accommodation case 1D according to a sixth embodiment.
  • FIG. 11 is a cross-sectional view of the periphery of a protrusion 21D of a substrate accommodation case 1D according to a sixth embodiment.
  • the seal is made between the base member 10D and the case member 20D, between the base member 10D and the connector 35, and between the case member 20D and the connector 35.
  • a member 60 is provided.
  • the through holes 11D of the base member 10D and the protrusions 21D of the case member 20D are provided outside the seal member 60 (see FIG. 10), and the seal member 60 prevents the liquid from entering the electronic circuit board 30D.
  • the waterproofness of the substrate storage case 1D can be enhanced, and in particular, in a movable body such as a car, it is possible to prevent the entry of rain water or the like.
  • the sealing member 60 may be appropriately made of a liquid adhesive having fluidity before curing, or a waterproof member such as a resin-made O-ring such as rubber.
  • the heat conduction member 40 (or the seal member 60) is disposed between the electronic circuit board 30D and the base member 10D by being held between the electronic circuit board 30D and the base member 10D.
  • the electronic circuit board 30D is supported by the seal member 60. Therefore, distortion or the like of the electronic circuit board 30D due to assembly can be prevented more reliably, and a reduction in the solder life of the electronic component 32 can be prevented.
  • a seal member 60 is provided between the through hole 11D of the base member 10D and the projection 21D of the case member 20D, and between the through hole 31D and the projection 21D of the electronic circuit board 30D. It may be (filled).
  • the seal member 60 is at least between the through hole 31D (engagement portion) of the electronic circuit board 30D and the protrusion 21D of the case member 20D, and the through hole 11D of the base member 10D and the protrusion 21D of the case member 20D. And the configuration provided between
  • FIG. 12 is a cross-sectional view of the vicinity of a protrusion 21E of a substrate accommodation case 1E according to a seventh embodiment.
  • the through hole 11E of the base member 10E is formed in a tapered shape, and the waterproof property is further enhanced by the seal member 60 filled in the tapered portion. Is different from the embodiment described above. In addition, about the structure same as embodiment mentioned above, the same code
  • the through hole 11E of the base member 10E is formed so that the inner diameter gradually increases as it proceeds to the case member 20E side (the electronic circuit board 30 side). That is, in the cross sectional view, the through hole 11E has a tapered shape in which the through hole 11E gradually separates from the central axis X as it approaches the case member 20E.
  • a seal member 60 is provided (filled) between the through hole 11E of the tapered base member 10E and the through hole 31 of the electronic circuit board 30.
  • the thickness of the central axis X in the radial direction increases as the seal member 60 provided in the through hole 11E of the base member 10E approaches the case member 20E. Therefore, as a result of the adhesion area of seal member 60 and penetration hole 11E becoming large, waterproofness becomes higher.
  • the through holes 31 of the electronic circuit board 30 are set larger than the inner diameter of the through holes 11E on the electronic circuit board 30 side, and the through holes 11E of the base member 10E and the electronic circuit board 30 pass through A step 72 is provided between the hole 31 and the hole 31.
  • the seal member 60 of the step portion 72 can prevent the liquid from entering the electronic circuit board 30 from the base member 10E side, and the waterproofness can be further enhanced.
  • the through hole 11E has a tapered shape that inclines in the direction approaching the central axis X as separating from the case member 20E, the entrance of the liquid from the base member 10E side of the through hole 11E becomes narrow. There is. Therefore, it is difficult for liquid to penetrate into the through hole 11E, and the waterproofness can be further enhanced.
  • FIG. 13 is a cross-sectional view of the vicinity of the protrusion 21F of the substrate accommodation case 1F according to the eighth embodiment.
  • the pedestal portion 16 is provided around the through hole 11F of the base member 10F, and the sealing member 60 filled in the pedestal portion 16 further enhances the waterproofness. This is a point different from the embodiment described above.
  • symbol is attached
  • a pedestal portion 16 projecting in a direction away from the case member 20F is provided over the entire circumference in the circumferential direction around the central axis X of the through hole 11F. ing.
  • the through hole 11F in the pedestal portion 16 has a tapered shape which is inclined to be away from the central axis X as it approaches the case member 20F side (electronic circuit board 30 side) in a cross sectional view.
  • a sealing member 60 is provided (filled).
  • the thickness in the axial direction of the central axis X of the through hole 11F can be made larger than the thickness of the base member 10 in the absence of the pedestal portion 16 because the pedestal portion 16 is provided, as a result, The axial thickness of the central axis X of the through hole 11 can be increased.
  • the thickness in the axial direction of the central axis X of the seal member 60 provided in the through hole 11F of the base member 10F can be increased, and the contact area between the seal member 60 and the through hole 11F is As a result of becoming larger, the waterproofness in penetration hole 11F can be improved more.
  • the through holes 31 of the electronic circuit substrate 30 are set to be larger than the inner diameter of the through holes 11F on the electronic circuit substrate 30 side as in the above-described embodiment, and the base member 10F is penetrated A step portion 73 is provided between the hole 11F and the through hole 31 of the electronic circuit board 30.
  • the substrate accommodation case 1F can prevent the liquid from entering from the base member 10F side to the electronic circuit board 30 side by the seal member 60 of the step portion 73, and can further enhance the waterproofness.
  • FIG. 14 is a cross-sectional view of the periphery of a protrusion 21G of a substrate accommodation case 1G according to a ninth embodiment.
  • the stepped portion 74 is provided between the base member 10G and the case member 20G, and the sealing member 60 filled in the stepped portion 74 enables the substrate storage case 1G to be manufactured.
  • the point of improving the waterproofness is a point different from the embodiment described above.
  • symbol is attached
  • the through holes 31 of the electronic circuit board 30 and the through holes 11G of the base member 10G are set to different inner diameters, and in the embodiment, the electronic circuit board 30 is The inner diameter of the through hole 31 is larger than the inner diameter of the through hole 11G of the base member 10G.
  • the outer diameter of the projection 21G of the case member 20G has a small diameter at an intermediate position in the through hole 31 of the electronic circuit board 30, and the step 74 is formed at this position.
  • a gap 80 is formed between the surface 75 on the base member 10G side of the stepped portion 74 and the surface around the through hole 11G of the base member 10G.
  • a seal member 60 is provided (filled) in the gap 80, and the seal member 60 prevents the liquid from entering from the base member 10G side.
  • the contact surface 25 of the case member 20G with the electronic circuit board 30 and the surface (the surface 75 on the base member 10G side of the step portion 70) in contact with the seal member 60 are different planes. Therefore, the waterproofness can be further enhanced because the liquid can be prevented from entering on each of these surfaces.
  • the electronic circuit board 30 has the through hole 31 penetrating the electronic circuit board 30 in the thickness direction, and the inner diameter of the through hole 31 of the electronic circuit board 30 is larger than the inner diameter of the through hole 11G of the base member 10G.
  • a step 74 is formed by the through hole 31 of the electronic circuit board 30 and the through hole 11G of the base member 10G in a large size, and the surface of the step 74 on the side of the base member 10G is formed.
  • the seal member 60 is provided (filled) in the gap 80 surrounded by the surface 75 and the surface around the through hole 11G of the base member 10G.
  • the seal member 60 filled in the gap 80 can prevent the liquid from entering from the base member 10G side, and the waterproofness of the substrate storage case 1G can be further improved.
  • At least the surface on the base member side around the through hole may be roughened.
  • the adhesion between the projection after deformation and the surface around the through hole of the base member is improved, and the projection is caused by the temperature change of the surrounding environment in which the substrate storage case is used, vibration or the like. Peeling between the portion and the base member is less likely to occur, and the durability of the substrate storage case is improved.
  • At least the surface on the base member side around the through hole may be coated with a seal member or the like.
  • waterproofness between the protrusion after deformation and the surface around the through hole of the base member can be improved by simple surface treatment of the base member.
  • the present invention is not limited to the one provided with all the configurations of the above-described embodiment, and a part of the configuration of the above-described embodiment is replaced with the configuration of the other embodiments. Alternatively, the configuration of the above-described embodiment may be replaced with the configuration of another embodiment.
  • the case has been described by exemplifying the case where the base member side has the through hole and the case member side has the projection, but on the contrary, the base member side has the projection and the case It is good also as composition which has a penetration hole in the member side. Even with this configuration, similar effects can be obtained in each embodiment.
  • the case has been described by exemplifying the case where the base member side has the through hole and the case member side has the protrusion, but both the base member side and the case member side are the through holes, After the projection member of another member is inserted into the through hole, the distal end portion on the insertion side may be deformed by heat and pressure (crimping). Even with this configuration, similar effects can be obtained in each embodiment.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Connection Or Junction Boxes (AREA)

Abstract

La présente invention vise à fixer de manière appropriée et au moyen d'une structure simple une carte de circuit électronique dans un boîtier de logement de carte de base. Ce boîtier de logement de carte de base (1) comporte un élément de base métallique (10) et un élément de boîtier en résine (20) fixé à l'élément de base (10) de façon à être en regard de ce dernier, et sert à fixer une carte de circuit électronique (30) entre l'élément de base (10) et l'élément de boîtier (20). L'invention fait appel à une configuration selon laquelle un trou traversant (11) est ménagé dans l'élément de base (10), et une partie saillante (21) située sur l'élément de boîtier (20) est insérée dans le trou traversant (11) ménagé dans l'élément de base (10), ce qui permet de fixer la carte de circuit électronique (30), l'élément de base (10) et l'élément de boîtier (20) ensemble à un seul emplacement.
PCT/JP2018/037157 2017-10-19 2018-10-04 Boîtier de logement de carte de base WO2019078012A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-202476 2017-10-19
JP2017202476A JP2021015817A (ja) 2017-10-19 2017-10-19 基板収容ケース

Publications (1)

Publication Number Publication Date
WO2019078012A1 true WO2019078012A1 (fr) 2019-04-25

Family

ID=66173602

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/037157 WO2019078012A1 (fr) 2017-10-19 2018-10-04 Boîtier de logement de carte de base

Country Status (2)

Country Link
JP (1) JP2021015817A (fr)
WO (1) WO2019078012A1 (fr)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6262478U (fr) * 1985-10-08 1987-04-17
JPH0365287U (fr) * 1989-10-30 1991-06-25
JPH0714687U (ja) * 1993-07-30 1995-03-10 株式会社電子技研 電子部品収納ケース
JPH08156101A (ja) * 1994-12-12 1996-06-18 Rohm Co Ltd 回路基板に対する合成樹脂製部品の取付け装置
JPH09239121A (ja) * 1996-03-02 1997-09-16 Taiyo Elec Kk 不正防止遊技機及びその検査装置
JPH09321463A (ja) * 1996-05-24 1997-12-12 Kokusai Electric Co Ltd 電子機器の筐体構造
JP2006074921A (ja) * 2004-09-02 2006-03-16 Auto Network Gijutsu Kenkyusho:Kk 電気接続箱
WO2011013509A1 (fr) * 2009-07-31 2011-02-03 ボッシュ株式会社 Dispositif électronique
WO2016114222A1 (fr) * 2015-01-14 2016-07-21 日立オートモティブシステムズ株式会社 Dispositif de commande électronique
JP2018137260A (ja) * 2017-02-20 2018-08-30 株式会社デンソー 電子装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6262478U (fr) * 1985-10-08 1987-04-17
JPH0365287U (fr) * 1989-10-30 1991-06-25
JPH0714687U (ja) * 1993-07-30 1995-03-10 株式会社電子技研 電子部品収納ケース
JPH08156101A (ja) * 1994-12-12 1996-06-18 Rohm Co Ltd 回路基板に対する合成樹脂製部品の取付け装置
JPH09239121A (ja) * 1996-03-02 1997-09-16 Taiyo Elec Kk 不正防止遊技機及びその検査装置
JPH09321463A (ja) * 1996-05-24 1997-12-12 Kokusai Electric Co Ltd 電子機器の筐体構造
JP2006074921A (ja) * 2004-09-02 2006-03-16 Auto Network Gijutsu Kenkyusho:Kk 電気接続箱
WO2011013509A1 (fr) * 2009-07-31 2011-02-03 ボッシュ株式会社 Dispositif électronique
WO2016114222A1 (fr) * 2015-01-14 2016-07-21 日立オートモティブシステムズ株式会社 Dispositif de commande électronique
JP2018137260A (ja) * 2017-02-20 2018-08-30 株式会社デンソー 電子装置

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