WO2019073853A1 - Dispositif et système optique - Google Patents
Dispositif et système optique Download PDFInfo
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- WO2019073853A1 WO2019073853A1 PCT/JP2018/036803 JP2018036803W WO2019073853A1 WO 2019073853 A1 WO2019073853 A1 WO 2019073853A1 JP 2018036803 W JP2018036803 W JP 2018036803W WO 2019073853 A1 WO2019073853 A1 WO 2019073853A1
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- 230000003287 optical effect Effects 0.000 title claims abstract description 279
- 239000000758 substrate Substances 0.000 claims description 66
- 230000007547 defect Effects 0.000 claims description 44
- 230000000149 penetrating effect Effects 0.000 claims description 18
- 230000002950 deficient Effects 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 description 274
- 230000004048 modification Effects 0.000 description 34
- 238000012986 modification Methods 0.000 description 34
- 239000000463 material Substances 0.000 description 30
- 239000004020 conductor Substances 0.000 description 16
- 239000000470 constituent Substances 0.000 description 16
- 239000010949 copper Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 239000011810 insulating material Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 229920001296 polysiloxane Polymers 0.000 description 12
- 239000010931 gold Substances 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 238000009713 electroplating Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 239000012466 permeate Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 230000001154 acute effect Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000035515 penetration Effects 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- OMOVVBIIQSXZSZ-UHFFFAOYSA-N [6-(4-acetyloxy-5,9a-dimethyl-2,7-dioxo-4,5a,6,9-tetrahydro-3h-pyrano[3,4-b]oxepin-5-yl)-5-formyloxy-3-(furan-3-yl)-3a-methyl-7-methylidene-1a,2,3,4,5,6-hexahydroindeno[1,7a-b]oxiren-4-yl] 2-hydroxy-3-methylpentanoate Chemical compound CC12C(OC(=O)C(O)C(C)CC)C(OC=O)C(C3(C)C(CC(=O)OC4(C)COC(=O)CC43)OC(C)=O)C(=C)C32OC3CC1C=1C=COC=1 OMOVVBIIQSXZSZ-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical group 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000010944 silver (metal) Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000002269 spontaneous effect Effects 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004954 Polyphthalamide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920006375 polyphtalamide Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
Abstract
La présente invention, selon un aspect, concerne un dispositif optique. Le présent dispositif optique est pourvu d'un corps de support et d'un élément optique. L'élément optique est disposé sur le corps de support et émet de la lumière. Le corps de support comprend au moins une unité de positionnement. L'au moins une unité de positionnement est apposée à une partie d'un élément qui affiche une plage cible d'exposition à un rayonnement, faisant l'objet d'un rayonnement de lumière provenant de l'élément optique, de façon à déterminer les positions, l'une par rapport à l'autre, de l'élément optique et de la plage cible d'exposition à un rayonnement.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017196900 | 2017-10-10 | ||
| JP2017-196900 | 2017-10-10 | ||
| JP2017-197793 | 2017-10-11 | ||
| JP2017197793A JP2021028918A (ja) | 2017-10-10 | 2017-10-11 | 光学装置、システム |
| JP2017-226431 | 2017-11-27 | ||
| JP2017226431A JP2021028919A (ja) | 2017-11-27 | 2017-11-27 | 半導体レーザ装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2019073853A1 true WO2019073853A1 (fr) | 2019-04-18 |
Family
ID=66100851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2018/036803 WO2019073853A1 (fr) | 2017-10-10 | 2018-10-02 | Dispositif et système optique |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2019073853A1 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7305909B2 (ja) | 2019-08-07 | 2023-07-11 | ローム株式会社 | 半導体発光装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003207694A (ja) * | 2002-01-15 | 2003-07-25 | Nec Corp | 光モジュール |
| JP2006302981A (ja) * | 2005-04-18 | 2006-11-02 | Fuji Xerox Co Ltd | マルチスポット型面発光レーザおよびその駆動方法 |
| JP2016127254A (ja) * | 2014-12-26 | 2016-07-11 | パナソニックＩｐマネジメント株式会社 | 発光装置及びその製造方法 |
-
2018
- 2018-10-02 WO PCT/JP2018/036803 patent/WO2019073853A1/fr active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003207694A (ja) * | 2002-01-15 | 2003-07-25 | Nec Corp | 光モジュール |
| JP2006302981A (ja) * | 2005-04-18 | 2006-11-02 | Fuji Xerox Co Ltd | マルチスポット型面発光レーザおよびその駆動方法 |
| JP2016127254A (ja) * | 2014-12-26 | 2016-07-11 | パナソニックＩｐマネジメント株式会社 | 発光装置及びその製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7305909B2 (ja) | 2019-08-07 | 2023-07-11 | ローム株式会社 | 半導体発光装置 |
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