WO2019070296A1 - Radio-frequency absorption in electronic devices - Google Patents

Radio-frequency absorption in electronic devices Download PDF

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Publication number
WO2019070296A1
WO2019070296A1 PCT/US2017/055604 US2017055604W WO2019070296A1 WO 2019070296 A1 WO2019070296 A1 WO 2019070296A1 US 2017055604 W US2017055604 W US 2017055604W WO 2019070296 A1 WO2019070296 A1 WO 2019070296A1
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WO
WIPO (PCT)
Prior art keywords
coating
enclosure
thermally conductive
absorption
electronic device
Prior art date
Application number
PCT/US2017/055604
Other languages
French (fr)
Inventor
Kuan-Ting Wu
Weiming TSENG
Al-Tsung LI
Chi-Chih Huang
Original Assignee
Hewlett-Packard Development Company, L.P.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett-Packard Development Company, L.P. filed Critical Hewlett-Packard Development Company, L.P.
Priority to PCT/US2017/055604 priority Critical patent/WO2019070296A1/en
Publication of WO2019070296A1 publication Critical patent/WO2019070296A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites

Definitions

  • Electronic devices such as computers, tablets, and smartphones, are commonly used for a variety of purposes, including communication. Such electronic devices may communicate with other devices over a wireless connection. Wireless communication to and from the electronic devices may involve reception and transmission of radio-frequency signals.
  • FIG. 1 illustrates a sectional view of a surface of an enclosure, according to an example implementation of the present subject matter
  • FIG. 2 illustrates a sectional view of a surface of an enclosure, according to an example implementation of the present subject matter
  • FIG. 3 illustrates a sectional view of a surface of an enclosure, according to an example implementation of the present subject matter
  • FIG. 4 illustrates a sectional view of a surface of an enclosure, according to an example implementation of the present subject matter.
  • Fig, 5 illustrates an electronic device, according to an example implementation of the present subject matter.
  • Radio-frequency (RF) signals utilized for wireless communication may cause electromagnetic interference in electrical circuits of electronic devices.
  • RF signals in a frequency range of 10 4 to 10 1 1 Hz, may be generated internally in the electronic device, or emitted from an external source.
  • the electromagnetic interference due to RF signals may degrade or disrupt the performance of electrical circuits and therefore of the associated electronic devices.
  • the quality of displays on a display screen of an electronic device may degrade, and the processing speed of the central processing unit (CPU) of an electronic device may reduce, due to electromagnetic interference
  • Electronic devices may be provided with coatings that can absorb RF signals.
  • An RF absorption coating that is generally used has a Sow RF absorption capacity. Further, the RF signals absorbed by such a coating are converted into beat. Heating of the RF absorption coating degrades the RF absorption capacity of the RF absorption coating. Also, heat in the RF absorption coating may add up with the heat generated by other electrical circuits, such as a CPU, in the vicinity of the RF absorption coating to create heat spots inside the electronic device. Such heat spots may affect the performance of electrical circuits in the electronic devices.
  • the RF absorption coating is generally coated on an inner surface of an enclosure or a body panel of the electronic device. Excessive beating of the RF absorption coating due to absorption of RF signals and absorption of heat from electrical circuits may create heat spots on the outer surface of the enclosure. Heat spots on the outer surface may cause inconvenience to users,
  • the present subject matter relates to absorption of RF signals in electronic devices.
  • the present subject matter describes a combination of coatings on a surface of an enclosure, or a body panel, of an electronic device having high RF absorption capacity and heat dissipation characteristic, in accordance with the present subject matter, high RF absorption capacity facilitates in reducing electromagnetic interferences in the electronic device, and heat dissipation characteristic facilitates in reducing heat spots inside the enclosure of the electronic device.
  • a thermally conductive coating is disposed on a surface of an enclosure of an electronic device.
  • the thermally conductive coating absorbs heat from surrounding regions and allows the absorbed heat to flow through it.
  • an RF absorption coating is coated on the thermally conductive coating.
  • the RF absorption coating absorbs RF signals from the surrounding regions.
  • the surface on which the thermally conductive coating is coated may be an inner surface of the enclosure.
  • the RF absorption coating is made of a resin mixture including 5 to 30 weight% (wt%) of conductive polymers, and aerogels including at least one of 0.05 to 3 wt% of carbon nanotube aerogel and 0.05 to 3 wt% of grapbene aerogel.
  • the RF absorption coating with the chemical composition and concentrations of constituents, as described above, has high RF absorption capacity. For example, more than 90% of RF signals are absorbed by the RF absorption coating of the present subject matter.
  • the enclosure may include a heat insulation coating coated between the surfaoe of the enclosure and the thermally conductive coating.
  • the heat insulation coating prevents heat to be conducted from the thermally conductive coating to the surface of the enclosure, thereby avoiding formation of heat spots on the outer side of the surface of the enclosure,
  • Fig. 1 illustrates a sectional view of a surface 102 of an enclosure 100, according to an example implementation of the present subject matter.
  • the enclosure 100 may be a body panel of an electronic device (not shown).
  • the su rf ace 102 may be an inner surface of the body panel, which is not exposed to the external environment.
  • the electronic device may, for example, include a computer, a laptop, a tablet, a smartphone, and such.
  • the body panel may, for example, include a top cover panel a bottom cover panel, side cover panel, or other outer casing of the electronic device.
  • the enclosure 100 may be made of a plastic material,
  • the enclosure 100 has a thermally conductive coating 104 on the surface 102,
  • the thermally conductive coating 104 may be coated on a portion of the surface 102.
  • the thermally conductive coating 104 is made of one of nano-sized powder of aluminum, copper, silver, graphene, carbon nanotube, diamond, graphite, silicon carbide, boron nitride, and synthetic thermally conductive materials in polymeric resins.
  • the thermally conductive coating 104 may have a thickness in a range of 5 micrometer (prnj to 15 pm.
  • the thermaily conductive coating 104 may be spray coated on the surface 102, In an example implementation, the surface 102 may be cleaned before coating the thermally conductive coating 104.
  • the surface 102 may be heated at a temperature in a range of 80 degree Celsius (°C) to 8O °C for a time duration in a range of 15 minutes to 40 minutes for curing the thermaily conductive coating 104,
  • the enclosure 100 has an RF absorption coating 108 coated on the thermaily conductive coating 104.
  • the RF absorption coating 106 may be coated on a portion of or on the entire of the thermaily conductive coating 104,
  • the RF absorption coating 106 is made of a resin mixture including conductive polymers and aerogels.
  • the conductive polymers have a concentration of 5 to 30 by wt%.
  • the aerogels include at least one of carbon nanotube aerogel and graphene aerogel. The concentration of carbon nanotube aerogel and graphene aerogel is 0.05 to 3 by wt%.
  • the conductive polymers may include poly-3,4-ethylenedioxythiophene (PEDOT), polyacetylene, pofyphenylenevinylene, polythienyienevinyiene, polythiophene, poly-3- aikylthiophene, polypyrroie, polyansline, polyphenylene, polyphenylene sulfide, polyfuran and perfluoroaikyisulfonyi compounds, and a combination thereof.
  • the resin mixture also includes polyacrylic, polycarbonate, polyurethane, silicone, polyvinyl chloride, epoxy, polyester, polypropylene, ureihane-acrylate, and a combination thereof,
  • the RF absorption coating 108 may have a thickness in a range of 10 pm to 50 pm.
  • the RF absorption coating 108 may be spray coated on the thermaliy conductive coating 104, In an example implementation, after spray coating the RF absorption coating, the surface 102 may be heated at a temperature in a range of 50 °C to 60 °C for a time duration in a range of 5 minutes to 15 minutes for curing the RF absorption coating 108.
  • the RF absorption coating 108 is cured under ultraviolet (UV) radiations.
  • the RF absorption coating 106 may be exposed to UV radiation of an energy dose of 0.7 Joules/centimeter 2 ( J/cm 2 ) to 1.2 J/cm 2 for a time duration in a range of 10 seconds to 30 seconds.
  • the RF absorption coating 108 absorbs more than 90% of RF signals that may be generated from internal electrical circuits of the electronic device associated with the enclosure 100, or from an external source.
  • RF waves associated with the RF signals are trapped in the carbon nanotube aerogel or graphene aerogel in the RF absorption coating 106.
  • the trapped RF waves get absorbed by the conductive polymers in the RF absorption coating 106 and are converted into heat.
  • the heat from the RF absorption coating 106 gets transferred to the thermaliy conductive coating 104.
  • the transfer of heat from the RF absorption coating 106 to the thermally conductive coating 104 is continuous, which facilitates in maintaining the temperature of the RF absorption coating 108 for uniform absorption of RF signals.
  • Fig, 2 illustrates a sectional view of a surface 202 of an enclosure 200, according to an example implementation of the present subject matter.
  • the enclosure 200 may be a body panel of an electronic device (not shown), as described earlier.
  • the enclosure 200 has a heat insulation coating 204 coated on the surface 202.
  • the heat insulation coating 204 may be coated on a portion of the surface 202.
  • the heat insulation coating 204 is made of fiberglass, mineral wools, cellulose, calcium silicate, cellular glass, elastomeric foam, phenolic foam, vermicuSste, polyurethane foam, silica aerogel, polystyrene foam in polymeric resins, and a combination thereof.
  • the heat insulation coating 204 may have a thickness in a range of 5 pro to 20 pm.
  • the heat insulation coating 204 maybe spray coated on the surface 202, in an example implementation, the surface 202 may he cleaned before coating the heat insulation coating 204, Further, after spray coating the heat insulation coating, the surface 202 may be heated at a temperature in a range of 80 & C to 80 °G for a time duration in a range of 15 minutes to 40 minutes for curing the heat insulation coating 204,
  • the enclosure 200 has a thermally conductive coating 208 coated on the heat insulation coating 204, and has an RF absorption coating 208 coated on the thermally conductive coating 206.
  • the thermally conductive coating 206 may be coated on a portion of or on the entire of the heat insulation coating 204, and the RF absorption coating 208 may be coated on a portion of or on the entire of the Ihermaiiy conductive coating 206,
  • the thermally conductive coating 206 is the same as the thermally conductive coating 104 described through description of Fig. 1.
  • the RF absorption coating 208 is the same as the RF absorption coating 106 described through description of Fig. 1.
  • the heat insulation coating 204 prevents heat to be conducted from the thermally conductive coating 206 to the surface 202 of the enclosure 200. This facilitates in preventing heat spots of the outer surface of the enclosure 200.
  • Fig. 3 illustrates a sectional view of a surface 302 of an enclosure 300, according to an example implementation of the present subject matter.
  • the enclosure 300 may foe a body panel of an electronic device (not shown), as described earlier.
  • the enclosure 300 has a thermaliy conductive material 304 disposed on the surface 302 of the enclosure 300.
  • the thermally conductive material 304 may be disposed on a portion of the surface 302.
  • the thermally conductive material 304 may be prefabricated block or sheet.
  • the thermally conductive material 304 comprising one of a copper foil, an aluminum foil, a composite foil, a graphite fiim, graphene on a metal deposition film, and a graphene film.
  • the ihermaiiy conductive material 304 has a thickness in a range of 0,015 mm to 0.3 mm.
  • the thermally conductive material 304 may be pasted on the surface 302 using an adhesive.
  • the enclosure 300 has an RF absorption coating 308 coated on the thermally conductive material 304,
  • the RF absorption coating 306 may be coated on a portion of or on the entire of the thermally conductive material 304.
  • the RF absorption coating 306 is the same as the RF absorption coating 106 described trough description of Fig. 1.
  • the RF absorption coating 306 absorbs more than 90% of RF signals that may be generated from internal electrical circuits of the electronic device associated with the enclosure 100, or from an external source.
  • RF waves associated with the RF signals are trapped in the carbon nanotube aerogel or graphene aerogel in the RF absorption coating 300.
  • the trapped RF waves get absorbed by the conductive polymers in the RF absorption coating 306 and are converted into heat.
  • the heat from the RF absorption coating 306 get transferred to the thermally conductive material 304,
  • the transfer of heat from the RF absorption coating 306 to the thermally conductive material 304 is continuous, which facilitates in maintaining the temperature of the RF absorption coating 306 for uniform absorption of RF signals.
  • Fig. 4 illustrates a sectional view of a surface 402 of an enclosure 400, according to an example implementation of the present subject matter.
  • the enclosure 400 may foe a body panel of an electronic device (not shown), as described earlier.
  • the enclosure 400 has a heat insulation coating 404 coated on the surface 402 of the enclosure 400.
  • the heat insulation coating 404 may be coated on a portion of the surface 402,
  • the heat insulation coating 404 is the same as the heal insulation coating 204 described through the description of Fig. 2.
  • the enclosure 400 has a thermally conductive material 406 disposed on the heat insulation coating 404, and has an RF absorption coating 408 coated on the thermaliy conductive material 406,
  • the thermally conductive material 406 may be disposed on a portion of or on the entire of the heat insulation coating 404, and the RF absorption coating 408 may be coated on a portion of or on the entire of the thermally conductive material 406.
  • the thermally conductive material 406 is the same as the thermally conductive material 304 described through description of Fig. 3.
  • the RF absorption coating 408 is- the same as the RF absorption coating 106 described through description of Fig, 1.
  • Fig, 5 illustrates an electronic device 500, according to an example implementation of the present subject matter, it may be noted that although a laptop is shown in Fig, 5, the electronic device 500 may be any other electronic device, such as tablet, a smartphone, and the like,
  • the electronic device 500 includes a body panel 502,
  • the body panel 502 also referred to as an enclosure, includes a top cover panel, a bottom cover panel, side cover panel, or other outer casing of the electronic device 500.
  • the body panel 502 may be made of a plastic material
  • the electronic device 500 includes a thermally conductor 506 disposed on a surface 504 of the body panel 502,
  • the thermaliy conductor 506 may be disposed on a portion of the surface 504.
  • the surface 504 is an inner surface of the body panel 502, which is not exposed to the external environment.
  • the thermaliy conductor 508 may be the same as the thermally conductive coating 104 as described through the description of Fig. 1 , or the same as the thermaliy conductive material 304 as described through the description of Fig. 3.
  • the electronic device 500 has an RF absorption coating 508 coated on the thermaily conductor 508.
  • the RF absorption coating 508 may be coated on a portion of or on the entire of the thermaily conductor 506.
  • the RF absorption coating 508 is the same as the RF absorption coating 108 described through description of Fig. 1.
  • region A is shown to be at the bottom cover panel, the thermaliy conductor 506 and the RF absorption coating 508 may be disposed at any other body panel, such as the top cover panel or the side cover panel.
  • the thermally conducior 508 and the RF absorption coating 508 are disposed on a portion of inner surface of the body panel,
  • the electronic device 500 may have a heat insulation coating (not shown in Fig. 5) between the surface 504 of the body panel 502 and the thermally conductor 508.
  • the heat insulation coating may the same as the heat insulation coating 204, as described through description of Fig. 2.
  • the heai insulation coating may be coated on a portion of the surface 504.
  • the thermaJiy conductor may be disposed on a portion of or on the entire of the heat insulation coating.
  • the RF absorption coating may be coated on a portion of or on the entire of the thermally conductor.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present subject matter relates to radio-frequency absorption in electronic devices. In an example implementation, a thermally conductive coating or material is disposed on a surface in an electronic device, and a radio-frequency absorption coating is coated on the thermally conductive coating or material.

Description

RADIO-FREQUENCY ABSORPTION IN ELECTRONIC DEVICES
BACKGROUND
[0001] Electronic devices, such as computers, tablets, and smartphones, are commonly used for a variety of purposes, including communication. Such electronic devices may communicate with other devices over a wireless connection. Wireless communication to and from the electronic devices may involve reception and transmission of radio-frequency signals.
BRIEF DESCRIPTION OF DRAWINGS
[0002] The following detailed description references the drawings, wherein:
[0003] Fig. 1 illustrates a sectional view of a surface of an enclosure, according to an example implementation of the present subject matter;
[0004] Fig. 2 illustrates a sectional view of a surface of an enclosure, according to an example implementation of the present subject matter;
[0005] Fig. 3 illustrates a sectional view of a surface of an enclosure, according to an example implementation of the present subject matter;
[0006] Fig. 4 illustrates a sectional view of a surface of an enclosure, according to an example implementation of the present subject matter; and
[0007] Fig, 5 illustrates an electronic device, according to an example implementation of the present subject matter.
DETAILED DESCRIPTION
[0008] Radio-frequency (RF) signals utilized for wireless communication may cause electromagnetic interference in electrical circuits of electronic devices. RF signals, in a frequency range of 104 to 101 1 Hz, may be generated internally in the electronic device, or emitted from an external source. The electromagnetic interference due to RF signals may degrade or disrupt the performance of electrical circuits and therefore of the associated electronic devices. In an example, the quality of displays on a display screen of an electronic device may degrade, and the processing speed of the central processing unit (CPU) of an electronic device may reduce, due to electromagnetic interference,
[0009] Electronic devices may be provided with coatings that can absorb RF signals. An RF absorption coating that is generally used has a Sow RF absorption capacity. Further, the RF signals absorbed by such a coating are converted into beat. Heating of the RF absorption coating degrades the RF absorption capacity of the RF absorption coating. Also, heat in the RF absorption coating may add up with the heat generated by other electrical circuits, such as a CPU, in the vicinity of the RF absorption coating to create heat spots inside the electronic device. Such heat spots may affect the performance of electrical circuits in the electronic devices.
[0010] Further, the RF absorption coating is generally coated on an inner surface of an enclosure or a body panel of the electronic device. Excessive beating of the RF absorption coating due to absorption of RF signals and absorption of heat from electrical circuits may create heat spots on the outer surface of the enclosure. Heat spots on the outer surface may cause inconvenience to users,
[0011] The present subject matter relates to absorption of RF signals in electronic devices. The present subject matter describes a combination of coatings on a surface of an enclosure, or a body panel, of an electronic device having high RF absorption capacity and heat dissipation characteristic, in accordance with the present subject matter, high RF absorption capacity facilitates in reducing electromagnetic interferences in the electronic device, and heat dissipation characteristic facilitates in reducing heat spots inside the enclosure of the electronic device.
[0012] In an example implementation of the present subject matter, a thermally conductive coating is disposed on a surface of an enclosure of an electronic device. The thermally conductive coating absorbs heat from surrounding regions and allows the absorbed heat to flow through it. Further, an RF absorption coating is coated on the thermally conductive coating. The RF absorption coating absorbs RF signals from the surrounding regions, The surface on which the thermally conductive coating is coated may be an inner surface of the enclosure. With the thermally conductive coating coated on the surface of the enclosure and the RF absorption coating coated on the thermally conductive coatings, the heat generated within the RF absorption coating due to absorption of RF signals gets dissipated through the thermally conductive coating. Continuous dissipation of heat from the RF absorption coating helps in maintaining a substantially constant temperature of the RF absorption coating, which in turn facilitates in substantially uniform RF absorption by the RF absorption coating.
[0013] In an example implementation of the present subject mattery the RF absorption coating is made of a resin mixture including 5 to 30 weight% (wt%) of conductive polymers, and aerogels including at least one of 0.05 to 3 wt% of carbon nanotube aerogel and 0.05 to 3 wt% of grapbene aerogel. The RF absorption coating with the chemical composition and concentrations of constituents, as described above, has high RF absorption capacity. For example, more than 90% of RF signals are absorbed by the RF absorption coating of the present subject matter.
[0014] Further, in an example implementation of the present subject matter, the enclosure may include a heat insulation coating coated between the surfaoe of the enclosure and the thermally conductive coating. The heat insulation coating prevents heat to be conducted from the thermally conductive coating to the surface of the enclosure, thereby avoiding formation of heat spots on the outer side of the surface of the enclosure,
[00153 The following detailed description refers to the accompanying drawings. Wherever possible, the same reference numbers are used in the drawings and the following description to refer to the same or similar parts. While several examples are described in the description, modifications, adaptations, and other implementations are possible. Accordingly, the following detailed description does not limit the disclosed examples, instead, the proper scope of the disclosed examples may be defined by the appended claims.
[0018] Fig. 1 illustrates a sectional view of a surface 102 of an enclosure 100, according to an example implementation of the present subject matter. The enclosure 100 may be a body panel of an electronic device (not shown). The su rf ace 102 may be an inner surface of the body panel, which is not exposed to the external environment. The electronic device may, for example, include a computer, a laptop, a tablet, a smartphone, and such. The body panel may, for example, include a top cover panel a bottom cover panel, side cover panel, or other outer casing of the electronic device. Sn an example, the enclosure 100 may be made of a plastic material,
[0017] The enclosure 100 has a thermally conductive coating 104 on the surface 102, The thermally conductive coating 104 may be coated on a portion of the surface 102. in an example implementation, the thermally conductive coating 104 is made of one of nano-sized powder of aluminum, copper, silver, graphene, carbon nanotube, diamond, graphite, silicon carbide, boron nitride, and synthetic thermally conductive materials in polymeric resins. The thermally conductive coating 104 may have a thickness in a range of 5 micrometer (prnj to 15 pm. The thermaily conductive coating 104 may be spray coated on the surface 102, In an example implementation, the surface 102 may be cleaned before coating the thermally conductive coating 104. Further, after spray coating the thermally conductive coating, the surface 102 may be heated at a temperature in a range of 80 degree Celsius (°C) to 8O °C for a time duration in a range of 15 minutes to 40 minutes for curing the thermaily conductive coating 104,
[0018] Further, as shown in Fig. 1 the enclosure 100 has an RF absorption coating 108 coated on the thermaily conductive coating 104. The RF absorption coating 106 may be coated on a portion of or on the entire of the thermaily conductive coating 104, The RF absorption coating 106 is made of a resin mixture including conductive polymers and aerogels. The conductive polymers have a concentration of 5 to 30 by wt%. The aerogels include at least one of carbon nanotube aerogel and graphene aerogel. The concentration of carbon nanotube aerogel and graphene aerogel is 0.05 to 3 by wt%. Further, the conductive polymers may include poly-3,4-ethylenedioxythiophene (PEDOT), polyacetylene, pofyphenylenevinylene, polythienyienevinyiene, polythiophene, poly-3- aikylthiophene, polypyrroie, polyansline, polyphenylene, polyphenylene sulfide, polyfuran and perfluoroaikyisulfonyi compounds, and a combination thereof. In an example implementation, the resin mixture also includes polyacrylic, polycarbonate, polyurethane, silicone, polyvinyl chloride, epoxy, polyester, polypropylene, ureihane-acrylate, and a combination thereof,
[0019] Further, in an example implementation, the RF absorption coating 108 may have a thickness in a range of 10 pm to 50 pm. The RF absorption coating 108 may be spray coated on the thermaliy conductive coating 104, In an example implementation, after spray coating the RF absorption coating, the surface 102 may be heated at a temperature in a range of 50 °C to 60 °C for a time duration in a range of 5 minutes to 15 minutes for curing the RF absorption coating 108. After such a thermal curing, the RF absorption coating 108 is cured under ultraviolet (UV) radiations, The RF absorption coating 106 may be exposed to UV radiation of an energy dose of 0.7 Joules/centimeter2 ( J/cm2) to 1.2 J/cm2 for a time duration in a range of 10 seconds to 30 seconds.
[0020] The RF absorption coating 108 absorbs more than 90% of RF signals that may be generated from internal electrical circuits of the electronic device associated with the enclosure 100, or from an external source. RF waves associated with the RF signals are trapped in the carbon nanotube aerogel or graphene aerogel in the RF absorption coating 106. The trapped RF waves get absorbed by the conductive polymers in the RF absorption coating 106 and are converted into heat. The heat from the RF absorption coating 106 gets transferred to the thermaliy conductive coating 104. The transfer of heat from the RF absorption coating 106 to the thermally conductive coating 104 is continuous, which facilitates in maintaining the temperature of the RF absorption coating 108 for uniform absorption of RF signals.
[0021] Fig, 2 illustrates a sectional view of a surface 202 of an enclosure 200, according to an example implementation of the present subject matter. The enclosure 200 may be a body panel of an electronic device (not shown), as described earlier. The enclosure 200 has a heat insulation coating 204 coated on the surface 202. The heat insulation coating 204 may be coated on a portion of the surface 202. in an example implementation, the heat insulation coating 204 is made of fiberglass, mineral wools, cellulose, calcium silicate, cellular glass, elastomeric foam, phenolic foam, vermicuSste, polyurethane foam, silica aerogel, polystyrene foam in polymeric resins, and a combination thereof. [0022] The heat insulation coating 204 may have a thickness in a range of 5 pro to 20 pm. The heat insulation coating 204 maybe spray coated on the surface 202, in an example implementation, the surface 202 may he cleaned before coating the heat insulation coating 204, Further, after spray coating the heat insulation coating, the surface 202 may be heated at a temperature in a range of 80 &C to 80 °G for a time duration in a range of 15 minutes to 40 minutes for curing the heat insulation coating 204,
[ΟΟ233 Further, as shown in Fig, 2, the enclosure 200 has a thermally conductive coating 208 coated on the heat insulation coating 204, and has an RF absorption coating 208 coated on the thermally conductive coating 206. The thermally conductive coating 206 may be coated on a portion of or on the entire of the heat insulation coating 204, and the RF absorption coating 208 may be coated on a portion of or on the entire of the Ihermaiiy conductive coating 206, The thermally conductive coating 206 is the same as the thermally conductive coating 104 described through description of Fig. 1. The RF absorption coating 208 is the same as the RF absorption coating 106 described through description of Fig. 1.
[0024] The heat insulation coating 204 prevents heat to be conducted from the thermally conductive coating 206 to the surface 202 of the enclosure 200. This facilitates in preventing heat spots of the outer surface of the enclosure 200.
[0025] Fig. 3 illustrates a sectional view of a surface 302 of an enclosure 300, according to an example implementation of the present subject matter. The enclosure 300 may foe a body panel of an electronic device (not shown), as described earlier. The enclosure 300 has a thermaliy conductive material 304 disposed on the surface 302 of the enclosure 300. The thermally conductive material 304 may be disposed on a portion of the surface 302. The thermally conductive material 304 may be prefabricated block or sheet. The thermally conductive material 304 comprising one of a copper foil, an aluminum foil, a composite foil, a graphite fiim, graphene on a metal deposition film, and a graphene film. The ihermaiiy conductive material 304 has a thickness in a range of 0,015 mm to 0.3 mm. In an example implementation, the thermally conductive material 304 may be pasted on the surface 302 using an adhesive. [0026] Further, as shown in Fig. 3, the enclosure 300 has an RF absorption coating 308 coated on the thermally conductive material 304, The RF absorption coating 306 may be coated on a portion of or on the entire of the thermally conductive material 304. The RF absorption coating 306 is the same as the RF absorption coating 106 described trough description of Fig. 1. The RF absorption coating 306 absorbs more than 90% of RF signals that may be generated from internal electrical circuits of the electronic device associated with the enclosure 100, or from an external source. RF waves associated with the RF signals are trapped in the carbon nanotube aerogel or graphene aerogel in the RF absorption coating 300. The trapped RF waves get absorbed by the conductive polymers in the RF absorption coating 306 and are converted into heat. The heat from the RF absorption coating 306 get transferred to the thermally conductive material 304, The transfer of heat from the RF absorption coating 306 to the thermally conductive material 304 is continuous, which facilitates in maintaining the temperature of the RF absorption coating 306 for uniform absorption of RF signals.
[0027] Fig. 4 illustrates a sectional view of a surface 402 of an enclosure 400, according to an example implementation of the present subject matter. The enclosure 400 may foe a body panel of an electronic device (not shown), as described earlier. The enclosure 400 has a heat insulation coating 404 coated on the surface 402 of the enclosure 400. The heat insulation coating 404 may be coated on a portion of the surface 402, The heat insulation coating 404 is the same as the heal insulation coating 204 described through the description of Fig. 2.
[0028] Further, as shown in Fig, 4, the enclosure 400 has a thermally conductive material 406 disposed on the heat insulation coating 404, and has an RF absorption coating 408 coated on the thermaliy conductive material 406, The thermally conductive material 406 may be disposed on a portion of or on the entire of the heat insulation coating 404, and the RF absorption coating 408 may be coated on a portion of or on the entire of the thermally conductive material 406. The thermally conductive material 406 is the same as the thermally conductive material 304 described through description of Fig. 3. The RF absorption coating 408 is- the same as the RF absorption coating 106 described through description of Fig, 1. The heat insulation coating 404 prevents heat to be conducted from the thermally conductive material 406 to the surface 402 of the enclosure 400. This facilitates in preventing heat spots of the outer surface of the enclosure 400. 100293 Fig, 5 illustrates an electronic device 500, according to an example implementation of the present subject matter, it may be noted that although a laptop is shown in Fig, 5, the electronic device 500 may be any other electronic device, such as tablet, a smartphone, and the like, The electronic device 500 includes a body panel 502, The body panel 502, also referred to as an enclosure, includes a top cover panel, a bottom cover panel, side cover panel, or other outer casing of the electronic device 500. fn an example, the body panel 502 may be made of a plastic material
[0030] As illustrated in a magnified sectional view of region A of the electronic device 500, the electronic device 500 includes a thermally conductor 506 disposed on a surface 504 of the body panel 502, The thermaliy conductor 506 may be disposed on a portion of the surface 504. The surface 504 is an inner surface of the body panel 502, which is not exposed to the external environment. The thermaliy conductor 508 may be the same as the thermally conductive coating 104 as described through the description of Fig. 1 , or the same as the thermaliy conductive material 304 as described through the description of Fig. 3.
[0031] Further, as shown in Fig. 5, the electronic device 500 has an RF absorption coating 508 coated on the thermaily conductor 508. The RF absorption coating 508 may be coated on a portion of or on the entire of the thermaily conductor 506. The RF absorption coating 508 is the same as the RF absorption coating 108 described through description of Fig. 1.
[0032] It may be noted that region A is shown to be at the bottom cover panel, the thermaliy conductor 506 and the RF absorption coating 508 may be disposed at any other body panel, such as the top cover panel or the side cover panel. The thermally conducior 508 and the RF absorption coating 508 are disposed on a portion of inner surface of the body panel,
[00333 *n 8n example implementation, the electronic device 500 may have a heat insulation coating (not shown in Fig. 5) between the surface 504 of the body panel 502 and the thermally conductor 508. The heat insulation coating may the same as the heat insulation coating 204, as described through description of Fig. 2. The heai insulation coating may be coated on a portion of the surface 504. The thermaJiy conductor may be disposed on a portion of or on the entire of the heat insulation coating. The RF absorption coating may be coated on a portion of or on the entire of the thermally conductor.
[0034] Although examples for the present disclosure have been described in language specific to structural features, it is to be understood that the appended claims are not limited to the specific features described herein. Rather, the specific features are disclosed and explained as examples of the present disclosure.

Claims

We claim:
1. An enclosure of an electronic device, comprising:
a thermally conductive coating disposed on a surface of the enclosure; and a radio-frequency (RF) absorption coating on the thermally conductive coating.
2. The enclosure as claimed in claim 1 , wherein the RF absorption coating is made of a resin mixture comprising:
5 to 30 wt% of conductive polymers; and
aerogels including at least one of 0,05 to 3 wt% of carbon nanoiube aerogel and 0.05 to 3 wt% of graphene aerogel.
3. The enclosure as claimed in claim 2, wherein the resin mixture comprises potyacrylic, polycarbonate, poSyurethane, silicone, polyvinyl chloride, epoxy, polyester, polypropylene, urethane-acrylate, and a combination thereof,
4. The enclosure as claimed in claim 2, wherein the conductive polymers comprise poly-3,4-ethytenedioxythiophene (PEDOT), polyacetylene, potyphenylenevinylene, polythienySenevinyiene, polythiophene, poly~3- alkylthiophene, polypyrrole, polyaniline, polyphenylene, poSyphenylene sulfide, polyfuran and perfSuoroalkylsuifonyl compounds, and a combination thereof,
5. The enclosure as claimed in claim 1 , wherein the RF absorption coating has a thickness in a range of 10 pm to 50 pm.
8, The enclosure as claimed in claim 1 , wherein the thermally conductive coating is made of one of nano-sized powder of aluminum, copper, silver, graphene, carbon nanotube. diamond, graphite, silicon carbide, boron nitride, and synthetic thermally conductive materials in polymeric resins.
7. The enclosure as claimed in claim 1 , wherein the thermally conductive coating has a thickness in a range of 5 pm to 15 pm,
8. The enclosure as claimed in claim 1 , comprising a heat insulation coating between the surface of the enclosure and the thermally conductive coating,
9. The enclosure as claimed in claim 8, wherein the heat insolation coating has a thickness in a range of S pm to 20 prn, and is made of fiberglass, mineral wools, cellulose, calcium silicate, cellular glass, elastomeric foam, phenolic foam, vermiculite, polyurethane foam, silica aerogel, polystyrene foam in polymeric resins, and a combination thereof.
10. An enclosure of an electronic device, comprising:
a thermally conductive material disposed on a surface of the enclosure, the thermally conductive material comprising one of a copper foil, an aluminum foil, a composite foil, a graphite film, graphene on a metal deposition film, and a graphene film; and
a radio-frequency (RF) absorption coating on the thermally conductive material, the RF absorption coating being made of a resin mixture comprising:
5 to 30 wt% of conductive polymers; and
aerogels including at least one of 0.05 to 3 wt% of carbon nanotube aerogel and 0,05 to 3 wt% of graphene aerogel .
11. The enclosure as claimed in claim 10, wherein the RF absorption coating has a thickness in a range of 10 pm to 50 pm.
12. The enclosure as claimed in claim 10, wherein the thermally conductive material has a thickness in a range of 0.015 mm to 0,3 mm.
13. An electronic device comprising:
a body panel;
a thermal conductor disposed on a surface of the body panel; and a radio-frequency (RF) absorption coating on the thermal conductor, the RF absorption coating being made of a resin mixture comprising:
5 to 30 wt% of conductive polymers; and
aerogels including at least one of 0.05 to 3 wt% of carbon nanotube aerogel and 0,05 to 3 wt% of graphene aerogel.
14. The electronic device as claimed in claim 13, wherein
the resin mixture comprises polyacryiie, polycarbonate, polyurethane, silicone, polyvinyl chloride, epoxy, polyester, polypropylene, ureihane- acrySate, and a combination thereof; and
the conductive polymers comprise poly-3,4-ethylenedioxythiophene (REPOT), polyacetylene, polyphenylenevinylene, poSyfhienylenevinylene, poSythiophene, poly-3-alkySthiophene, polypyrrole, polyanilsne, polyphenylene, polyphenylene sulfide, polyfuran and perfluoroaikylsulfonyf compounds, and a combination thereof.
15. The electronic device as claimed in claim 13, comprising a heat insuiation coating between the surface of tbe body panel and the thermal conductor.
PCT/US2017/055604 2017-10-06 2017-10-06 Radio-frequency absorption in electronic devices WO2019070296A1 (en)

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PCT/US2017/055604 WO2019070296A1 (en) 2017-10-06 2017-10-06 Radio-frequency absorption in electronic devices

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CN115873288A (en) * 2022-11-21 2023-03-31 杭州皓丰生物技术有限公司 Temperature-sensitive PCR (polymerase chain reaction) thin-walled tube
US11827969B1 (en) * 2021-03-24 2023-11-28 Waymo Llc Durable, optically transparent, and superhydrophobic coating

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US6763576B2 (en) * 2001-05-10 2004-07-20 Parker-Hannifin Corporation Manufacture of electronics enclosure having a metallized shielding layer
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US5518758A (en) * 1993-11-18 1996-05-21 Emi-Tec Elektronische Materialien Gmbh Arrangement for the conduction away of heat and a process for the production thereof
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US11827969B1 (en) * 2021-03-24 2023-11-28 Waymo Llc Durable, optically transparent, and superhydrophobic coating
CN115873288A (en) * 2022-11-21 2023-03-31 杭州皓丰生物技术有限公司 Temperature-sensitive PCR (polymerase chain reaction) thin-walled tube
CN115873288B (en) * 2022-11-21 2023-05-12 杭州皓丰生物技术有限公司 Temperature-sensitive PCR thin-wall tube

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