WO2019061673A1 - 盖体及烹饪装置 - Google Patents

盖体及烹饪装置 Download PDF

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Publication number
WO2019061673A1
WO2019061673A1 PCT/CN2017/108984 CN2017108984W WO2019061673A1 WO 2019061673 A1 WO2019061673 A1 WO 2019061673A1 CN 2017108984 W CN2017108984 W CN 2017108984W WO 2019061673 A1 WO2019061673 A1 WO 2019061673A1
Authority
WO
WIPO (PCT)
Prior art keywords
cover
circuit board
mounting cavity
cavity
mounting
Prior art date
Application number
PCT/CN2017/108984
Other languages
English (en)
French (fr)
Inventor
彭锋
Original Assignee
佛山市顺德区美的电热电器制造有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201721276569.6U external-priority patent/CN208259537U/zh
Priority claimed from CN201721272683.1U external-priority patent/CN208339373U/zh
Application filed by 佛山市顺德区美的电热电器制造有限公司 filed Critical 佛山市顺德区美的电热电器制造有限公司
Priority to CA3077232A priority Critical patent/CA3077232C/en
Priority to EP17927029.3A priority patent/EP3669711B1/en
Publication of WO2019061673A1 publication Critical patent/WO2019061673A1/zh
Priority to US16/833,030 priority patent/US11684195B2/en

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Classifications

    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J27/00—Cooking-vessels
    • A47J27/08—Pressure-cookers; Lids or locking devices specially adapted therefor
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J27/00—Cooking-vessels
    • A47J27/08—Pressure-cookers; Lids or locking devices specially adapted therefor
    • A47J27/0802—Control mechanisms for pressure-cookers
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J31/00—Apparatus for making beverages
    • A47J31/44—Parts or details or accessories of beverage-making apparatus
    • A47J31/4403—Constructional details
    • A47J31/4407—Lids, covers or knobs
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47J—KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES
    • A47J36/00—Parts, details or accessories of cooking-vessels
    • A47J36/06—Lids or covers for cooking-vessels

Definitions

  • the present invention relates to the field of cooking devices, and more particularly to a cover body and a cooking apparatus having the above described cover body.
  • a circuit board is installed inside the cover body.
  • a cavity is arranged near the top of the cover body, and the circuit board is horizontally placed in the cavity body, and then A sealing ring is assembled at the opening position of the cavity, and finally a cover is designed to press the sealing ring, so that the circuit board is sealed in the cavity.
  • the sealing ring is easy to age under the condition of high temperature and high humidity.
  • the present invention is directed to solving at least one of the technical problems existing in the prior art.
  • Another object of the present invention is to provide a cooking apparatus having the above described cover.
  • an embodiment of the first aspect of the present invention provides a cover body, the cover body a cover wireless transmission module is disposed, the cover wireless transmission module includes a circuit board, and the cover body is provided with a mounting cavity for mounting the circuit board, and one side of the installation cavity is open, and the circuit board is Fixedly mounted within the mounting cavity, and the mounting cavity is potted by a potting compound and encloses the opening.
  • the circuit board is potted in the installation cavity by potting glue, so that the circuit board is completely isolated from the cavity in the cover body, thereby ensuring that the circuit board does not contact with the high temperature steam in the cover body, thereby preventing the circuit board from being exposed to high temperature. Steam contact causes the component to rise in temperature or the board is damaged.
  • the lower surface of the top wall of the cover body is provided with a receiving cavity with an opening facing downward, and the opening of the receiving cavity is lower than the lower surface of the top wall of the cover body.
  • the mounting cavity is integrally or partially inserted into the receiving cavity.
  • the lower surface of the top wall of the cover body is provided with a receiving cavity with an opening facing downward, the exhaust valve and the float on the cover body are installed outside the receiving cavity, and the mounting cavity on which the circuit board is mounted is at least partially inserted into the receiving cavity.
  • the exhaust valve and the float position leak, the high-temperature steam will rise upward and gather under the top wall of the cover.
  • the opening of the receiving cavity is lower than the lower surface of the top wall of the cover, the high-temperature steam cannot flow into the receiving cavity laterally, only
  • the air with a lower temperature at the bottom of the cover body can enter the inside of the accommodating cavity from the opening at the bottom of the accommodating cavity, and is in contact with the mounting cavity, thereby reducing the temperature rise of the mounting cavity, thereby reducing the temperature rise of the circuit board in the mounting cavity and preventing the circuit board from being lifted.
  • the temperature rise of components exceeded the standard.
  • the cover body comprises a lid and a cover
  • the cover includes a top wall of the cover and a side wall of the cover extending downward from a rim of the top wall of the cover,
  • the cover is disposed on the top cover, and the top wall of the cover is provided with a downwardly extending rib, and two sides of the rib are respectively connected with the side wall of the cover, so that The receiving cavity is formed between the retaining rib and the side wall of the cover.
  • the lower surface of the top wall of the cover is provided with a retaining rib, and both sides of the retaining rib are connected with the side wall of the cover to form a receiving cavity, and when the exhaust valve and the float position leak, the high-temperature steam gathers on the surface.
  • the high-temperature steam cannot flow into the accommodating cavity laterally. Only the air with a lower temperature at the bottom of the cover body can enter the inside of the accommodating cavity from the opening at the bottom of the accommodating cavity, and is in contact with the mounting cavity, thereby reducing the installation.
  • the temperature rise of the cavity reduces the temperature rise of the circuit board in the mounting cavity and prevents the temperature rise of components on the circuit board from exceeding the standard.
  • the cover further includes an inner cover, and the mounting cavity is disposed on the inner cover,
  • the lid includes a top wall of the lid and a side wall of the lid extending downward from a rim of the top wall of the lid, the inner lid is sleeved on an outer side of the side wall of the lid, the side wall of the lid is The inner cover is fixedly coupled, and the cover covers the lid and the inner cover.
  • the solution is provided with a mounting cavity on the inner cover, and the circuit board is sealed and installed in the inner cover mounting cavity, and the temperature of the mounting cavity is lowered by inserting the inner cover mounting cavity into the cover receiving cavity, thereby reducing the temperature rise of the circuit board in the mounting cavity. To prevent the temperature rise of components on the circuit board from exceeding the standard.
  • the cover further comprises a mounting box, the mounting box is provided with the mounting cavity, and the mounting box is fixedly mounted between the cover and the lid.
  • the solution is to design a separate component for the installation of the circuit board, that is, the installation box, and the circuit board is sealed and installed in the inner cover installation box, and the temperature of the installation cavity is lowered by inserting the installation box into the cover receiving cavity, thereby reducing the installation cavity.
  • the temperature rise of the circuit board prevents the temperature rise of the components on the circuit board from exceeding the standard.
  • the mounting cavity has a protrusion protruding toward a center of the lid, and the receiving cavity is provided with an opening corresponding to the protrusion.
  • the wiring board is vertically installed in the mounting cavity.
  • the circuit board is provided with a component with low temperature resistance and a component with high temperature resistance, and the component with higher temperature resistance is installed at the temperature resistance. Above the low components.
  • the circuit board is installed vertically in the installation cavity. Since the density of the hot air is lower than the density of the cold air, when there is steam leakage at the position of the exhaust valve and the position of the float, the high temperature steam will rise upward, so that it is in contact with the cavity wall of the top of the mounting cavity. The steam is more and the contact time is longer, which causes the temperature rise at the top of the circuit board to be higher than the bottom. Therefore, when the components are installed, the components with lower temperature resistance are installed near the bottom of the circuit board, and the components with higher temperature resistance are installed. Above the components with low temperature resistance, the temperature rise of components with low temperature resistance is reduced, and the temperature rise of components with low temperature resistance is prevented from exceeding the standard.
  • the top end of the mounting cavity is open. This design is convenient for potting work.
  • the circuit board is installed in the mounting cavity, and a maximum end surface of the circuit board has a minimum distance of 3 mm from an upper end surface of the mounting cavity.
  • the top end of the circuit board is at least 3 mm below the top of the mounting cavity, so that the mounting cavity opening position forms a potting layer of at least 3 mm thick, thereby effectively sealing the mounting cavity.
  • the mounting cavity is disposed at a side of the cover.
  • the hot air density is lower than the cold air density, and the steam valve position and the float position have steam leakage, the high temperature steam will rise upward, and the installation cavity is disposed at the side of the cover body, thereby reducing the amount of steam in contact with the installation cavity wall. And the contact time, thereby reducing the temperature rise of the circuit board in the installation cavity.
  • At least one guiding slot is disposed in the mounting cavity, and an edge of the circuit board is engaged with the guiding slot.
  • the circuit board When installing the circuit board, insert the edge of the circuit board into the guiding slot, and then push the circuit board along the guiding slot to slide the circuit board into the mounting cavity.
  • the guiding slot guides the circuit board to reduce the difficulty of installing the circuit board.
  • the guiding slot fixes the circuit board to prevent the circuit board from shifting during the potting process.
  • two guiding slots are disposed in the mounting cavity, and the two side edges of the circuit board are respectively matched with the two guiding slots, so that the guiding groove has a good guiding and fixing effect on the circuit board.
  • the potting compound comprises a two-liquid mixing hardening potting compound.
  • An embodiment of the second aspect of the present invention provides a cooking apparatus comprising a cover body as provided in any one of the first aspects of the present invention and a pot body for use with the cover body.
  • the cooking device provided by the embodiment of the second aspect of the present invention has the cover body provided by any one of the first aspects of the present invention, and therefore the cooking device has the full benefit of the cover body provided by any of the above embodiments, and is no longer Narration.
  • the cooking device comprises a split type electric pressure cooker or a split type pressure rice cooker or the like.
  • FIG. 1 is an exploded view of a cover body according to an embodiment of the present invention
  • Figure 2 is a top plan view of the cover body shown in Figure 1;
  • Figure 3 is a cross-sectional structural view of the cover A-A of Figure 2;
  • Figure 4 is a schematic enlarged view of the portion B of Figure 3;
  • Figure 5 is a cross-sectional structural view of the inner cover shown in Figure 1;
  • Figure 6 is a cross-sectional structural view showing the inner cover C-C of Figure 5;
  • FIG. 7 is a schematic structural view of a cover body according to another embodiment of the present invention.
  • Figure 8 is a cross-sectional structural view showing the cover D-D of Figure 7;
  • Figure 9 is a cross-sectional structural view showing the cover E-E of Figure 7;
  • Figure 10 is an enlarged schematic view showing the F portion shown in Figure 8.
  • Figure 11 is a schematic structural view of the face cover shown in Figure 7;
  • Figure 12 is a cross-sectional structural view showing the face cover G-G of Figure 11;
  • Figure 13 is a cross-sectional structural view of the face cover H-H shown in Figure 11;
  • Figure 14 is an exploded view of the cover shown in Figure 7.
  • the embodiment of the first aspect of the present invention provides a cover body, the cover body is provided with a cover wireless transmission module, the cover wireless transmission module comprises a circuit board, and the cover body is provided with a mounting cavity for mounting the circuit board, and the installation cavity One side is open, the circuit board is fixedly mounted on the mounting cavity, and the mounting cavity is potted by a potting glue and closes the opening.
  • the circuit board is potted in the installation cavity by potting glue, so that the circuit board is completely isolated from the cavity in the cover body, thereby ensuring that the circuit board does not contact with the high temperature steam in the cover body, thereby preventing the circuit board from being exposed to high temperature. Steam contact causes the component to rise in temperature or the board is damaged.
  • the cover body includes a lid 1 and a bottom cover 2
  • the lid 1 includes a top wall and a side wall
  • the top wall of the lid 1 is provided with an exhaust gas for installation a mounting hole of the valve and the float
  • the inner cover 2 is substantially annular, and is sleeved on the outer side of the side wall of the lid 1
  • the inner cover 2 is provided with a mounting cavity 21 for mounting the circuit board 3, so that the mounting cavity 21 is located on the side of the lid 1
  • the circuit board 3 is fixedly mounted in the mounting cavity 21, and the mounting cavity 21 is potted by potting glue to ensure that the circuit board 3 does not contact with the high temperature steam in the cover body, thereby preventing the circuit board 3 from being in contact with high temperature steam.
  • the problem that the temperature rise of the component exceeds the standard or the circuit board 3 is damaged occurs. Since the hot air density is lower than the cold air density, and there is steam leakage at the position of the exhaust valve and the position of the float, the high temperature steam will rise upward, and the mounting cavity 21 is disposed at the side of the lid 1, which can reduce the contact with the cavity wall of the mounting cavity 21. The amount of steam and the contact time reduce the temperature rise of the wiring board 3 in the mounting cavity 21.
  • the cover body further includes a cover
  • the cover also includes a top wall and a side wall
  • the bottom end of the side wall of the cover is fixedly connected with the inner cover 2, and the cover 1 is covered, so that the cover and the cover 1 are When a cavity is formed, and there is a steam leak at the position of the exhaust valve and the position of the float, high temperature steam collects on the top of the above cavity.
  • the installation cavity 21 is vertically disposed, and the circuit board 3 is vertically installed in the installation cavity 21. Since the top cavity wall of the installation cavity 21 contacts more steam and the contact time is longer, the temperature rise of the top of the circuit board 3 is higher than the bottom.
  • the component 31 having a lower temperature resistance is mounted near the bottom of the circuit board 3, and the component 32 having a higher temperature resistance is mounted above the component 31 having a lower temperature resistance, thereby lowering the temperature resistance.
  • the lower temperature rise of the component 31 prevents the temperature rise of the component 31 having a lower temperature resistance from exceeding the standard.
  • the top end of the mounting cavity 21 is open, so that the design is convenient for the potting operation to proceed.
  • At least one guiding groove 211 is disposed in the mounting cavity 21, and the guiding rib is vertically disposed.
  • the edge of the circuit board 3 is inserted into the guiding slot 211, and then the guiding line is pushed along the guiding slot 211.
  • the board 3 slides the circuit board 3 into the mounting cavity 21.
  • the guiding slot 211 guides the circuit board 3, reducing the difficulty of mounting the circuit board 3.
  • the guiding slot 211 is opposite to the circuit board. 3 plays a fixed role to prevent the circuit board 3 from shifting during the potting process.
  • two guiding grooves 211 are oppositely disposed in the mounting cavity 21, and both sides of the circuit board 3 The edges are respectively matched with the two guiding grooves 211, so that the guiding groove 211 is designed to have a good guiding and fixing effect on the circuit board 3.
  • the potting compound may be a two-liquid mixed hardening type electronic potting compound.
  • the wiring board 3 is mounted in the mounting cavity 21, and the highest end surface of the wiring board has a minimum distance of 3 mm from the upper end surface of the mounting cavity 21.
  • the top end of the circuit board 3 is lower than the top end of the mounting cavity 21 by at least 3 mm, so that the opening position of the mounting cavity 21 is at least 3
  • the millimeter-thick potting layer effectively seals the mounting cavity 21.
  • a cover body wireless transmission module is disposed on the cover body, and the cover wireless transmission module includes a circuit board 3, and the cover body is provided with a circuit for mounting
  • the mounting cavity 21 of the board 3, the circuit board 3 is sealingly mounted in the mounting cavity 21, and the lower surface of the top wall of the cover body is provided with a receiving cavity 41 with an opening facing downward, and the opening of the receiving cavity 41 is lower than the top wall of the cover body
  • the surface, the mounting cavity 21 is integrally or partially inserted into the accommodating cavity 41.
  • the lower surface of the top wall of the cover body is provided with a receiving cavity 41 with an opening facing downward, the exhaust valve and the float on the cover body are installed outside the receiving cavity 41, and the mounting cavity 21 on which the circuit board 3 is mounted is at least partially inserted and accommodated.
  • the cavity 41 when the exhaust valve and the float position leak, the high-temperature steam will rise upward and gather under the top wall of the cover body.
  • the opening of the receiving cavity 41 is lower than the lower surface of the top wall of the cover body, the high-temperature steam cannot be laterally Flowing into the accommodating chamber 41, only the air having a lower temperature at the bottom of the cover body can enter the inside of the accommodating chamber 41 from the opening at the bottom of the accommodating chamber 41, and is in contact with the mounting chamber 21, thereby reducing the temperature rise of the mounting chamber 21, thereby reducing the mounting cavity 21
  • the temperature rise of the inner circuit board 3 prevents the temperature rise of components on the circuit board 3 from exceeding the standard.
  • the cover body comprises a lid 1 and a cover 4, and the cover 4 includes a top wall of the cover 4 and a side wall of the cover 4 extending downward from the edge of the top wall of the cover 4, the cover 4
  • the cover 1 is disposed, and the top wall of the cover 4 is provided with a downwardly extending retaining rib 411.
  • the two sides of the retaining 411 are respectively connected with the side wall of the cover 4 to make the retaining 411 and the cover 4 accommodating chambers 41 are formed between the side walls.
  • the lower surface of the top wall of the cover 4 is provided with a retaining rib 411, and both sides of the retaining rib 411 are connected with the side wall of the cover 4 to form a receiving cavity 41.
  • the exhaust valve and the float are leaking, the temperature is high.
  • the steam will collect under the top wall of the cover 4, and the high temperature steam cannot flow into the accommodating chamber 41 laterally due to the blocking of the rib 411.
  • Only the air having a lower temperature at the bottom of the cover can enter from the opening at the bottom of the accommodating chamber 41.
  • the inside of the accommodating chamber 41 is in contact with the mounting cavity 21, which can reduce the temperature rise of the mounting cavity 21, thereby reducing the temperature rise of the circuit board 3 in the mounting cavity 21, and preventing the temperature rise of components on the circuit board 3 from exceeding the standard.
  • the cover further comprises an inner cover 2, and the installation cavity 21 is disposed on the inner cover 2, the cover 1 comprises a top wall of the cover 1 and a side wall of the cover 1 extending downward from a rim of the top wall of the cover 1,
  • the inner cover 2 is set on the outer side of the side wall of the lid 1, the side wall of the cover 4 is fixedly connected to the inner cover 2, and the cover 4 covers the lid 1 and the inner lid 2.
  • the present invention is provided with a mounting cavity 21 on the inner cover 2, and the circuit board 3 is sealingly mounted in the inner cavity 2 mounting cavity 21, and the temperature of the mounting cavity 21 is lowered by inserting the inner cover 2 mounting cavity 21 into the cover 4 receiving cavity 41. Thereby, the temperature rise of the circuit board 3 in the mounting cavity 21 is reduced, and the temperature rise of the components on the circuit board 3 is prevented from exceeding the standard.
  • the cover further comprises a mounting box, the mounting box is provided with a mounting cavity, and the mounting box is fixedly mounted between the cover and the lid.
  • the solution is to design a separate component for the installation of the circuit board, that is, the installation box, and the circuit board is sealed and installed in the inner cover installation box, and the temperature of the installation cavity is lowered by inserting the installation box into the cover receiving cavity, thereby reducing the installation cavity.
  • the temperature rise of the circuit board prevents the temperature rise of the components on the circuit board from exceeding the standard.
  • the mounting cavity 21 has a projection 22 that protrudes toward the center of the lid, and the receiving cavity 41 is provided with an opening corresponding to the projection 22.
  • the wiring board 3 is vertically mounted in the mounting cavity 21.
  • the circuit board 3 is mounted with a lower temperature resistant component 31 and a higher temperature resistant component 32, and the higher temperature resistant component 32 is mounted on a lower temperature resistant component. Above the 31.
  • the circuit board 3 is vertically installed in the mounting cavity 21. Since the hot air density is lower than the cold air density, and the steam valve position and the float position have steam leakage, the high temperature steam will rise upward, and thus the top of the mounting cavity 21 The cavity wall contacts more steam and the contact time is longer, which causes the temperature rise of the top of the circuit board 3 to be higher than the bottom. Therefore, when the components are mounted, the component 31 with lower temperature resistance is installed near the bottom of the circuit board 3, and the temperature is resistant. The higher component 32 is mounted above the lower temperature resistant component 31, thereby reducing the temperature rise of the component 31 having a lower temperature resistance, and avoiding the temperature rise of the component 31 having a lower temperature resistance exceeding the standard.
  • the mounting cavity 21 is provided at the side of the cover.
  • the hot air density is lower than the cold air density, and the steam valve position and the float position have a steam leak, the high temperature steam will rise upward, and the mounting cavity 21 is disposed at the side of the cover body, thereby reducing the contact with the cavity wall of the mounting cavity 21.
  • the amount of steam and the contact time reduce the temperature rise of the wiring board 3 in the mounting cavity 21.
  • At least one guiding groove is provided in the mounting cavity 21, and the edge of the circuit board 3 is engaged with the guiding groove.
  • the edge of the circuit board 3 is inserted into the guiding slot, and then the circuit board 3 is pushed along the guiding slot to slide the circuit board 3 into the mounting cavity 21.
  • the guiding slot guides the circuit board 3, reducing The installation difficulty of the circuit board 3, after the circuit board 3 is installed in place, the guiding groove fixes the circuit board 3 to prevent the circuit board 3 from moving in the installation cavity.
  • two guiding slots are disposed in the mounting cavity 21, and the two side edges of the circuit board 3 are respectively matched with the two guiding slots, so that the guiding groove has a good guiding and fixing effect on the circuit board 3.
  • An embodiment of the second aspect of the present invention provides a cooking apparatus comprising a lid body according to any of the embodiments of the present invention and a pot body for use with the lid body.
  • the cooking device provided by the embodiment of the second aspect of the present invention has the cover body provided by any one of the first aspects of the present invention, and therefore the cooking device has the full benefit of the cover body provided by any of the above embodiments, and is no longer Narration.
  • the cooking device includes a split type electric pressure cooker, a split type pressure rice cooker, and the like.
  • a cover body the cover body is provided with a cover wireless transmission module, and the cover wireless transmission module comprises a circuit board.
  • the cover body is provided with a mounting cavity for mounting the circuit board, one side of the mounting cavity is open, the circuit board is fixedly mounted in the mounting cavity, and the mounting cavity is potted by potting glue And closing the opening.
  • the circuit board is vertically mounted within the mounting cavity.
  • the circuit board is provided with components with low temperature resistance and high temperature resistant components, and the components with higher temperature resistance are installed above the components with low temperature resistance.
  • the top end of the mounting cavity is open.
  • the mounting cavity is disposed at a side of the cover.
  • At least one guiding slot is disposed in the mounting cavity, and an edge of the circuit board cooperates with the guiding slot.
  • the potting compound comprises a two-liquid mixed hardening potting compound.
  • the cover body includes a pot cover, an inner cover and a face cover, the inner cover is mounted on an outer side of the cover, the cover is mounted on an outer side of the inner cover, and the installation cavity is disposed on the inner cover on.
  • the circuit board is installed in the mounting cavity, and the highest end surface of the circuit board has a minimum distance of 3 mm from the upper end surface of the mounting cavity.
  • a cooking apparatus comprising the lid body according to any one of the items 1 to 9 and a pot body for use with the lid body.
  • a cover body the cover body is provided with a cover wireless transmission module, and the cover wireless transmission module comprises a circuit board.
  • the cover body is provided with a mounting cavity for mounting the circuit board, the circuit board is sealingly mounted in the mounting cavity, and a lower surface of the top wall of the cover body is provided with a receiving cavity with an opening facing downward, and The opening of the receiving cavity is lower than the lower surface of the top wall of the cover, and the mounting cavity is integrally or partially inserted into the receiving cavity.
  • the cover includes a lid and a cover, the cover includes a top wall of the cover and a side wall of the cover extending downward from a rim of the top wall of the cover, the cover covers the cover Internally, the top wall of the cover is provided with a downwardly extending rib, and two sides of the rib are respectively connected to the side wall of the cover so that the rib and the side wall of the cover The accommodation chamber is formed therebetween.
  • the cover further includes an inner cover, the mounting cavity is disposed on the inner cover, the cover includes a top wall of the cover and a side wall of the cover extending downward from a rim of the top wall of the cover,
  • the inner cover is disposed on an outer side of the side wall of the lid, the side wall of the cover is fixedly connected to the inner cover, and the cover covers the lid and the inner cover.
  • the cover further includes a mounting box, the mounting box is provided with the mounting cavity, and the mounting box is fixedly mounted between the cover and the lid.
  • the mounting cavity has a protrusion protruding toward a center of the lid, and the receiving cavity is provided with an opening corresponding to the protrusion.
  • the circuit board is vertically mounted within the mounting cavity.
  • the circuit board is provided with components with low temperature resistance and high temperature resistant components, and the components with higher temperature resistance are installed above the components with low temperature resistance.
  • the mounting cavity is disposed at a side of the cover.
  • At least one guiding slot is disposed in the mounting cavity, and an edge of the circuit board cooperates with the guiding slot.
  • a cooking apparatus comprising the cover body according to any one of the items 11 to 19 and a pot body for use with the cover body, wherein the pot body is provided with a communication with the cover body wireless transmission module The pot body wireless transmission module.
  • connection may be a fixed connection, a detachable connection, or an integral connection; They can be directly connected or indirectly connected through an intermediate medium.
  • connecting may be a fixed connection, a detachable connection, or an integral connection; They can be directly connected or indirectly connected through an intermediate medium.
  • the description of the terms “one embodiment”, “some embodiments”, “specific embodiments” and the like means that the specific features, structures, materials or characteristics described in connection with the embodiments or examples are included in the present invention. At least one embodiment or example.
  • the schematic representation of the above terms does not necessarily refer to the same embodiment or example.
  • the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.
  • the terms “connected”, “mounted”, “fixed”, etc. should be understood broadly. For example, “connected” may be a fixed connection, a detachable connection, or an integral connection; it may be directly connected or intermediate The media is indirectly connected.
  • the specific meanings of the above terms in the present invention can be understood on a case-by-case basis.

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  • Engineering & Computer Science (AREA)
  • Food Science & Technology (AREA)
  • Cookers (AREA)

Abstract

一种盖体及烹饪装置，所述盖体上设有盖体无线传输模块，所述盖体无线传输模块包括线路板（3），所述盖体上设有用于安装所述线路板（3）的安装腔（21），所述安装腔（21）的一侧开口，所述线路板（3）固定安装在所述安装腔（21）内，且所述安装腔（21）通过灌封胶灌封并封闭所述开口，线路板（3）通过灌封胶灌封在安装腔（21）内，使线路板（3）完全与盖体内的空腔隔离，从而保证线路板（3）不会与盖体内的高温蒸汽接触，以防止线路板（3）因与高温蒸汽接触而导致元器件温升超标或线路板（3）损坏的问题发生。

Description

盖体及烹饪装置
本申请要求于2017年9月29日提交中国专利局、申请号为201721276569.6、发明名称为“盖体及烹饪装置”、于2017年9月29日提交中国专利局、申请号为201721272683.1、发明名称为“盖体及烹饪装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及烹饪装置领域，更具体而言，涉及一种盖体，以及一种具有上述盖体的烹饪装置。
背景技术
压力烹饪装置在正常工作过程中，在排气阀芯和浮子处经常会有轻微漏气，漏气后高温蒸汽会灌入盖体内部，这会导致盖体内部空气温度和湿度较高。对于带有无线传输功能的分体式压力烹饪装置，在盖体内部需安装线路板，在现有产品结构方案中，盖体靠近顶部的位置设置一腔体，线路板水平置于腔体内，然后在腔体开口位置装配一密封圈，最后设计一盖子压住该密封圈，从而使得线路板密封在该腔体内。但密封圈在高温高湿的条件下易老化，密封圈老化后会导致装配线路板的腔体无法完全密封，当产品漏气时，高温高湿水蒸汽会灌入该腔体内，导致线路板温升超标或直接导致线路板损坏。所以现有产品结构方案存在较大改进空间。
发明内容
本发明旨在解决现有技术中存在的技术问题至少之一。
为此，本发明的一个目的在于，提供一种可防止线路板温升超标的盖体。
本发明的另一个目的在于，提供一种具有上述盖体的烹饪装置。
为实现上述目的，本发明第一方面的实施例提供了一种盖体，所述盖体 上设有盖体无线传输模块，所述盖体无线传输模块包括线路板，所述盖体上设有用于安装所述线路板的安装腔，所述安装腔的一侧开口，所述线路板固定安装在所述安装腔内，且所述安装腔通过灌封胶灌封并封闭所述开口。
本方案中，线路板通过灌封胶灌封在安装腔内，使线路板完全与盖体内的空腔隔离，从而保证线路板不会与盖体内的高温蒸汽接触，以防止线路板因与高温蒸汽接触而导致元器件温升超标或线路板损坏的问题发生。
在上述任一技术方案中，优选地，所述盖体的顶壁下表面上设有开口朝下的容纳腔，且所述容纳腔的开口低于所述盖体的顶壁下表面，所述安装腔整体或局部插入所述容纳腔内。
本方案中，盖体顶壁下表面上设有开口朝下的容纳腔，盖体上的排气阀和浮子安装在容纳腔以外，安装有线路板的安装腔至少局部插入容纳腔内，当排气阀和浮子位置漏气时，高温蒸汽会向上升，聚集在盖体顶壁下方，由于容纳腔的开口低于盖体顶壁的下表面，使得高温蒸汽无法横向流入容纳腔内，仅盖体底部温度较低的空气能够从容纳腔底部的开口进入容纳腔内部，与安装腔接触，这样可降低安装腔的温升，从而降低安装腔内线路板的温升，防止线路板上的元器件温升超标。
在上述任一技术方案中，优选地，所述盖体包括锅盖和面盖，所述面盖包括面盖顶壁和由所述面盖顶壁的边沿向下延伸的面盖侧壁，所述面盖将所述锅盖罩设在内，且所述面盖顶壁上设有向下延伸的挡筋，所述挡筋的两侧分别与所述面盖侧壁连接，以使所述挡筋和所述面盖侧壁间形成所述容纳腔。
本方案中，面盖顶壁的下表面上设有挡筋，挡筋的两侧与面盖侧壁连接，形成容纳腔，当排气阀和浮子位置漏气时，高温蒸汽会聚集在面盖顶壁下方，由于挡筋的阻挡，高温蒸汽无法横向流入容纳腔内，仅盖体底部温度较低的空气能够从容纳腔底部的开口进入容纳腔内部，与安装腔接触，这样可降低安装腔的温升，从而降低安装腔内线路板的温升，防止线路板上的元器件温升超标。
可选地，所述盖体还包括内盖，所述安装腔设置在所述内盖上，所述 锅盖包括锅盖顶壁和由所述锅盖顶壁的边沿向下延伸的锅盖侧壁，所述内盖套装在所述锅盖侧壁的外侧，所述面盖侧壁与所述内盖固定连接，且所述面盖将所述锅盖和所述内盖罩设在内。
本方案在内盖上设置安装腔，线路板密封安装在内盖安装腔内，通过将内盖安装腔插入面盖容纳腔的设计降低安装腔的温度，从而降低安装腔内线路板的温升，防止线路板上的元器件温升超标。
可选地，所述盖体还包括安装盒，所述安装盒内设有所述安装腔，所述安装盒固定安装在所述面盖和所述锅盖之间。
本方案为安装线路板而设计一个独立的零件，即安装盒，线路板密封安装在内盖安装盒内，通过将安装盒插入面盖容纳腔的设计降低安装腔的温度，从而降低安装腔内线路板的温升，防止线路板上的元器件温升超标。
在上述任一技术方案中，优选地，所述安装腔具有向锅盖中心凸出的凸出部，所述容纳腔对应所述凸出部设有开口。
在上述任一技术方案中，优选地，所述线路板竖直安装在所述安装腔内。
在上述任一技术方案中，优选地，所述线路板上安装有耐温较低的元器件和耐温较高的元器件，所述耐温较高的元器件安装在所述耐温较低的元器件的上方。
本方案中，线路板竖直安装在安装腔内，由于热空气密度比冷空气密度低，排气阀位置和浮子位置有蒸汽泄漏时，高温蒸汽会向上升，因此与安装腔顶部腔壁接触的蒸汽更多且接触时间更长，导致线路板顶部温升比底部高，因此在安装元器件时，将耐温较低的元器件靠近线路板底部安装，将耐温较高的元器件安装在耐温较低的元器件的上方，从而降低耐温较低的元器件的温升，避免耐温较低的元器件温升超标。
在上述任一技术方案中，优选地，所述安装腔的顶端开口。这样设计方便灌封工作进行。
在上述任一技术方案中，优选地，所述线路板安装在所述安装腔内，所述线路板最高端面距离所述安装腔上端面最小距离为3毫米。
若安装腔开口位置灌封胶过薄，会影响安装腔的密封性，为此本方案 令线路板的顶端低于安装腔顶端至少3毫米，使安装腔开口位置形成至少3毫米厚的灌封胶层，从而将安装腔有效密封。
在上述任一技术方案中，优选地，所述安装腔设置在所述盖体的侧部。
因热空气密度比冷空气密度低，排气阀位置和浮子位置有蒸汽泄漏时，高温蒸汽会向上升，将安装腔设置在盖体的侧部，可减少与安装腔腔壁接触的蒸汽量以及接触时间，从而降低安装腔内线路板的温升。
在上述任一技术方案中，优选地，所述安装腔内设有至少一条导向槽，所述线路板的边缘与所述导向槽配合。
安装线路板时，将线路板边缘插入导向槽，然后沿导向槽推动线路板，使线路板滑入安装腔内，安装过程中，导向槽对线路板起导向作用，降低线路板的安装难度，线路板安装到位后，导向槽对线路板起固定作用，防止线路板在灌封过程中移位。
其中，优选地，安装腔内相对设置两个导向槽，线路板的两侧边缘分别与两个导向槽配合，这样设计导向槽对线路板的导向、固定效果好。
在上述任一技术方案中，可选地，所述灌封胶包括两液混合硬化型灌封胶。
本发明第二方面的实施例提供了一种烹饪装置，包括如本发明第一方面任一实施例提供的盖体和与所述盖体配合使用的锅体。
本发明第二方面实施例提供的烹饪装置，具有本发明第一方面任一实施例提供的盖体，因此该烹饪装置具有上述任一实施例提供的盖体的全部有益效果，在此不再赘述。
在上述技术方案中，所述烹饪装置包括分体式电压力锅或分体式压力电饭煲等。
本发明的附加方面和优点将在下面的描述部分中变得明显，或通过本发明的实践了解到。
附图说明
本发明的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1是本发明的一个实施例提供的盖体的爆炸图；
图2是图1中所示盖体的俯视结构示意图；
图3是图2中盖体A-A向的剖视结构示意图；
图4是图3中B部的放大结构示意图；
图5是图1中所示内盖的剖视结构示意图；
图6是图5中所示内盖C-C向的剖视结构示意图；
图7是本发明的另一个实施例提供的盖体的结构示意图；
图8是图7中所示盖体D-D向的剖视结构示意图；
图9是图7中所示盖体E-E向的剖视结构示意图；
图10是图8中所示F部的放大结构示意图；
图11是图7中所示面盖的结构示意图；
图12是图11中所示面盖G-G向的剖视结构示意图；
图13是图11中所示面盖H-H向的剖视结构示意图；
图14是图7中所示盖体的爆炸图。
其中，图1至图14中的附图标记与部件名称之间的对应关系为：
1锅盖，2内盖，21安装腔，211导向槽，22凸出部，3线路板，31耐温较低的元器件，32耐温较高的元器件，4面盖，41容纳腔，411挡筋。
具体实施方式
为了能够更清楚地理解本发明的上述目的、特征和优点，下面结合附图和具体实施方式对本发明进行进一步的详细描述。需要说明的是，在不冲突的情况下，本申请的实施例及实施例中的特征可以相互组合。
在下面的描述中阐述了很多具体细节以便于充分理解本发明，但是，本发明还可以采用其他不同于在此描述的方式来实施，因此，本发明的保护范围并不受下面公开的具体实施例的限制。
本发明第一方面的实施例提供了一种盖体，盖体上设有盖体无线传输模块，盖体无线传输模块包括线路板，盖体上设有用于安装线路板的安装腔，安装腔的一侧开口，线路板固定安装在安装腔，且安装腔通过灌封胶灌封并封闭所述开口。
本方案中，线路板通过灌封胶灌封在安装腔内，使线路板完全与盖体内的空腔隔离，从而保证线路板不会与盖体内的高温蒸汽接触，以防止线路板因与高温蒸汽接触而导致元器件温升超标或线路板损坏的问题发生。
根据本发明的一个实施例，如图1至图6所示，盖体包括锅盖1和内盖2，锅盖1包括顶壁和侧壁，锅盖1顶壁上设有用于安装排气阀和浮子的安装孔，内盖2大致呈环形，套设在锅盖1侧壁的外侧，内盖2上设有用于安装线路板3的安装腔21，使安装腔21位于锅盖1侧部，线路板3固定安装在安装腔21内，安装腔21通过灌封胶灌封，以保证线路板3不会与盖体内的高温蒸汽接触，从而防止线路板3因与高温蒸汽接触而导致元器件温升超标或线路板3损坏的问题发生。因热空气密度比冷空气密度低，排气阀位置和浮子位置有蒸汽泄漏时，高温蒸汽会向上升，将安装腔21设置在锅盖1的侧部，可减少与安装腔21腔壁接触的蒸汽量以及接触时间，从而降低安装腔21内线路板3的温升。
通常，盖体还包括面盖，面盖也包括顶壁和侧壁，面盖侧壁的底端与内盖2固定连接，将锅盖1罩设在内，使面盖和锅盖1间形成空腔，排气阀位置和浮子位置有蒸汽泄漏时，高温蒸汽会聚集在上述空腔的顶部。本方案将安装腔21竖直设置，线路板3竖直安装在安装腔21内，由于安装腔21顶部腔壁接触的蒸汽更多且接触时间更长，导致线路板3顶部温升比底部高，因此在安装元器件时，将耐温较低的元器件31靠近线路板3底部安装，将耐温较高的元器件32安装在耐温较低的元器件31的上方，从而降低耐温较低的元器件31的温升，避免耐温较低的元器件31温升超标。
在上述实施例中，优选地，安装腔21的顶端开口，这样设计方便灌封工作进行。
在上述实施例中，优选地，安装腔21内设有至少一条导向槽211，导向筋竖直设置，安装线路板3时，将线路板3边缘插入导向槽211，然后沿导向槽211推动线路板3，使线路板3滑入安装腔21内，安装过程中，导向槽211对线路板3起导向作用，降低线路板3的安装难度，线路板3安装到位后，导向槽211对线路板3起固定作用，防止线路板3在灌封过程中移位。
其中，优选地，安装腔21内相对设置两个导向槽211，线路板3的两侧 边缘分别与两个导向槽211配合，这样设计导向槽211对线路板3的导向、固定效果好。
在上述实施例中，可选地，灌封胶可两液混合硬化型电子灌封胶。
在上述实施例中，优选地，线路板3安装在安装腔21内，线路板最高端面距离安装腔21上端面最小距离为3毫米。
若安装腔21开口位置灌封胶过薄，会影响安装腔21的密封性，为此本方案令线路板3的顶端低于安装腔21顶端至少3毫米，使安装腔21开口位置形成至少3毫米厚的灌封胶层，从而将安装腔21有效密封。
如图7至图14所示，本发明第一方面的另一个实施例中，盖体上设有盖体无线传输模块，盖体无线传输模块包括线路板3，盖体上设有用于安装线路板3的安装腔21，线路板3密封安装在安装腔21内，盖体的顶壁下表面上设有开口朝下的容纳腔41，且容纳腔41的开口低于盖体的顶壁下表面，安装腔21整体或局部插入容纳腔41内。
本方案中，盖体顶壁下表面上设有开口朝下的容纳腔41，盖体上的排气阀和浮子安装在容纳腔41以外，安装有线路板3的安装腔21至少局部插入容纳腔41内，当排气阀和浮子位置漏气时，高温蒸汽会向上升，聚集在盖体顶壁下方，由于容纳腔41的开口低于盖体顶壁的下表面，使得高温蒸汽无法横向流入容纳腔41内，仅盖体底部温度较低的空气能够从容纳腔41底部的开口进入容纳腔41内部，与安装腔21接触，这样可降低安装腔21的温升，从而降低安装腔21内线路板3的温升，防止线路板3上的元器件温升超标。
在上述实施例中，优选地，盖体包括锅盖1和面盖4，面盖4包括面盖4顶壁和由面盖4顶壁的边沿向下延伸的面盖4侧壁，面盖4将锅盖1罩设在内，且面盖4顶壁上设有向下延伸的挡筋411，挡筋411的两侧分别与面盖4侧壁连接，以使挡筋411和面盖4侧壁间形成容纳腔41。
本方案中，面盖4顶壁的下表面上设有挡筋411，挡筋411的两侧与面盖4侧壁连接，形成容纳腔41，当排气阀和浮子位置漏气时，高温蒸汽会聚集在面盖4顶壁下方，由于挡筋411的阻挡，高温蒸汽无法横向流入容纳腔41内，仅盖体底部温度较低的空气能够从容纳腔41底部的开口进 入容纳腔41内部，与安装腔21接触，这样可降低安装腔21的温升，从而降低安装腔21内线路板3的温升，防止线路板3上的元器件温升超标。
可选地，盖体还包括内盖2，安装腔21设置在内盖2上，锅盖1包括锅盖1顶壁和由锅盖1顶壁的边沿向下延伸的锅盖1侧壁，内盖2套装在锅盖1侧壁的外侧，面盖4侧壁与内盖2固定连接，且面盖4将锅盖1和内盖2罩设在内。
本方案在内盖2上设置安装腔21，线路板3密封安装在内盖2安装腔21内，通过将内盖2安装腔21插入面盖4容纳腔41的设计降低安装腔21的温度，从而降低安装腔21内线路板3的温升，防止线路板3上的元器件温升超标。
可选地，盖体还包括安装盒，安装盒内设有安装腔，安装盒固定安装在面盖和锅盖之间。
本方案为安装线路板而设计一个独立的零件，即安装盒，线路板密封安装在内盖安装盒内，通过将安装盒插入面盖容纳腔的设计降低安装腔的温度，从而降低安装腔内线路板的温升，防止线路板上的元器件温升超标。
在上述实施例中，优选地，安装腔21具有向锅盖中心凸出的凸出部22，容纳腔41对应凸出部22设有开口。
在上述实施例中，优选地，线路板3竖直安装在安装腔21内。
在上述实施例中，优选地，线路板3上安装有耐温较低的元器件31和耐温较高的元器件32，耐温较高的元器件32安装在耐温较低的元器件31的上方。
本方案中，线路板3竖直安装在安装腔21内，由于热空气密度比冷空气密度低，排气阀位置和浮子位置有蒸汽泄漏时，高温蒸汽会向上升，因此与安装腔21顶部腔壁接触的蒸汽更多且接触时间更长，导致线路板3顶部温升比底部高，因此在安装元器件时，将耐温较低的元器件31靠近线路板3底部安装，将耐温较高的元器件32安装在耐温较低的元器件31的上方，从而降低耐温较低的元器件31的温升，避免耐温较低的元器件31温升超标。
在上述实施例中，优选地，安装腔21设置在盖体的侧部。
因热空气密度比冷空气密度低，排气阀位置和浮子位置有蒸汽泄漏时，高温蒸汽会向上升，将安装腔21设置在盖体的侧部，可减少与安装腔21腔壁接触的蒸汽量以及接触时间，从而降低安装腔21内线路板3的温升。
在上述实施例中，优选地，安装腔21内设有至少一条导向槽，线路板3的边缘与导向槽配合。
安装线路板3时，将线路板3边缘插入导向槽，然后沿导向槽推动线路板3，使线路板3滑入安装腔21内，安装过程中，导向槽对线路板3起导向作用，降低线路板3的安装难度，线路板3安装到位后，导向槽对线路板3起固定作用，防止线路板3在安装腔内活动。
其中，优选地，安装腔21内相对设置两个导向槽，线路板3的两侧边缘分别与两个导向槽配合，这样设计导向槽对线路板3的导向、固定效果好。
本发明第二方面的实施例提供了一种烹饪装置，包括如本发明任一实施例提供的盖体和与所述盖体配合使用的锅体。
本发明第二方面实施例提供的烹饪装置，具有本发明第一方面任一实施例提供的盖体，因此该烹饪装置具有上述任一实施例提供的盖体的全部有益效果，在此不再赘述。
具体地，所述烹饪装置包括分体式电压力锅、分体式压力电饭煲等。
尽管具有随附权利要求，但本发明也由以下条款限定：
1.一种盖体，所述盖体上设有盖体无线传输模块，所述盖体无线传输模块包括线路板，
所述盖体上设有用于安装所述线路板的安装腔，所述安装腔的一侧开口，所述线路板固定安装在所述安装腔内，且所述安装腔通过灌封胶灌封并封闭所述开口。
2.根据条例1所述的盖体，
所述线路板竖直安装在所述安装腔内。
3.根据条例2所述的盖体，
所述线路板上安装有耐温较低的元器件和耐温较高的元器件，所述耐温较高的元器件安装在所述耐温较低的元器件的上方。
4.根据条例1所述的盖体，
所述安装腔的顶端开口。
5.根据条例1所述的盖体，
所述安装腔设置在所述盖体的侧部。
6.根据条例1所述的盖体，
所述安装腔内设有至少一条导向槽，所述线路板的边缘与所述导向槽配合。
7.根据条例1所述的盖体，
所述灌封胶包括两液混合硬化型灌封胶。
8.根据条例1至7中任一项所述的盖体，
所述盖体包括锅盖、内盖和面盖，所述内盖安装在所述锅盖的外侧，所述面盖安装在所述内盖的外侧，所述安装腔设置在所述内盖上。
9.根据条例1至7中任一项所述的盖体，
所述线路板安装在所述安装腔内，所述线路板最高端面距离所述安装腔上端面最小距离为3毫米。
10.一种烹饪装置，包括如条例1至9中任一项所述的盖体和与所述盖体配合使用的锅体。
11.一种盖体，所述盖体上设有盖体无线传输模块，所述盖体无线传输模块包括线路板，
所述盖体上设有用于安装所述线路板的安装腔，所述线路板密封安装在所述安装腔内，所述盖体的顶壁下表面上设有开口朝下的容纳腔，且所述容纳腔的开口低于所述盖体的顶壁下表面，所述安装腔整体或局部插入所述容纳腔内。
12.根据条例11所述的盖体，
所述盖体包括锅盖和面盖，所述面盖包括面盖顶壁和由所述面盖顶壁的边沿向下延伸的面盖侧壁，所述面盖将所述锅盖罩设在内，且所述面盖顶壁上设有向下延伸的挡筋，所述挡筋的两侧分别与所述面盖侧壁连接，以使所述挡筋和所述面盖侧壁间形成所述容纳腔。
13.根据条例12所述的盖体，
所述盖体还包括内盖，所述安装腔设置在所述内盖上，所述锅盖包括锅盖顶壁和由所述锅盖顶壁的边沿向下延伸的锅盖侧壁，所述内盖套装在所述锅盖侧壁的外侧，所述面盖侧壁与所述内盖固定连接，且所述面盖将所述锅盖和所述内盖罩设在内。
14.根据条例12所述的盖体，
所述盖体还包括安装盒，所述安装盒内设有所述安装腔，所述安装盒固定安装在所述面盖和所述锅盖之间。
15.根据条例12所述的盖体，
所述安装腔具有向锅盖中心凸出的凸出部，所述容纳腔对应所述凸出部设有开口。
16.根据条例11至15中任一项所述的盖体，
所述线路板竖直安装在所述安装腔内。
17.根据条例16所述的盖体，
所述线路板上安装有耐温较低的元器件和耐温较高的元器件，所述耐温较高的元器件安装在所述耐温较低的元器件的上方。
18.根据条例11至15中任一项所述的盖体，
所述安装腔设置在所述盖体的侧部。
19.根据条例11至15中任一项所述的盖体，
所述安装腔内设有至少一条导向槽，所述线路板的边缘与所述导向槽配合。
20.一种烹饪装置，包括如条例11至19中任一项所示的盖体和与所述盖体配合使用的锅体，所述锅体上设有与所述盖体无线传输模块通讯的锅体无线传输模块。
在本发明的描述中，术语“上”、“下”、“顶”、“底”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
在本发明的描述中，术语“连接”、“安装”、“固定”等均应做广义理解，例如，“连接”可以是固定连接，也可以是可拆卸连接，或一体地连接； 可以是直接相连，也可以通过中间媒介间接相连。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
在本说明书的描述中，术语“一个实施例”、“一些实施例”、“具体实施例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或实例。而且，描述的具体特征、结构、材料或特点可以在任何的一个或多个实施例或示例中以合适的方式结合。术语“连接”、“安装”、“固定”等均应做广义理解，例如，“连接”可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是直接相连，也可以通过中间媒介间接相连。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (14)

  1. 一种盖体，所述盖体上设有盖体无线传输模块，所述盖体无线传输模块包括线路板，其特征在于，
    所述盖体上设有用于安装所述线路板的安装腔，所述安装腔的一侧开口，所述线路板固定安装在所述安装腔内，且所述安装腔通过灌封胶灌封并封闭所述开口。
  2. 根据权利要求1所述的盖体，其特征在于，
    所述盖体的顶壁下表面上设有开口朝下的容纳腔，且所述容纳腔的开口低于所述盖体的顶壁下表面，所述安装腔整体或局部插入所述容纳腔内。
  3. 根据权利要求2所述的盖体，其特征在于，
    所述盖体包括锅盖和面盖，所述面盖包括面盖顶壁和由所述面盖顶壁的边沿向下延伸的面盖侧壁，所述面盖将所述锅盖罩设在内，且所述面盖顶壁上设有向下延伸的挡筋，所述挡筋的两侧分别与所述面盖侧壁连接，以使所述挡筋和所述面盖侧壁间形成所述容纳腔。
  4. 根据权利要求3所述的盖体，其特征在于，
    所述盖体还包括内盖，所述安装腔设置在所述内盖上，所述锅盖包括锅盖顶壁和由所述锅盖顶壁的边沿向下延伸的锅盖侧壁，所述内盖套装在所述锅盖侧壁的外侧，所述面盖侧壁与所述内盖固定连接，且所述面盖将所述锅盖和所述内盖罩设在内。
  5. 根据权利要求3所述的盖体，其特征在于，
    所述盖体还包括安装盒，所述安装盒内设有所述安装腔，所述安装盒固定安装在所述面盖和所述锅盖之间。
  6. 根据权利要求3所述的盖体，其特征在于，
    所述安装腔具有向锅盖中心凸出的凸出部，所述容纳腔对应所述凸出部设有开口。
  7. 根据权利要求1至6中任一项所述的盖体，其特征在于，
    所述线路板竖直安装在所述安装腔内。
  8. 根据权利要求7所述的盖体，其特征在于，
    所述线路板上安装有耐温较低的元器件和耐温较高的元器件，所述耐温较高的元器件安装在所述耐温较低的元器件的上方。
  9. 根据权利要求1至8中任一项所述的盖体，其特征在于，
    所述安装腔的顶端开口。
  10. 根据权利要求9所述的盖体，其特征在于，
    所述线路板安装在所述安装腔内，所述线路板最高端面距离所述安装腔上端面最小距离为3毫米。
  11. 根据权利要求1至10中任一项所述的盖体，其特征在于，
    所述安装腔设置在所述盖体的侧部。
  12. 根据权利要求1至11中任一项所述的盖体，其特征在于，
    所述安装腔内设有至少一条导向槽，所述线路板的边缘与所述导向槽配合。
  13. 根据权利要求1至12中任一项所述的盖体，其特征在于，
    所述灌封胶包括两液混合硬化型灌封胶。
  14. 一种烹饪装置，其特征在于，包括如权利要求1至13中任一项所述的盖体和与所述盖体配合使用的锅体。
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