WO2019054764A1 - Dispositif de refroidissement - Google Patents

Dispositif de refroidissement Download PDF

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Publication number
WO2019054764A1
WO2019054764A1 PCT/KR2018/010729 KR2018010729W WO2019054764A1 WO 2019054764 A1 WO2019054764 A1 WO 2019054764A1 KR 2018010729 W KR2018010729 W KR 2018010729W WO 2019054764 A1 WO2019054764 A1 WO 2019054764A1
Authority
WO
WIPO (PCT)
Prior art keywords
working fluid
inlet
evaporator
outlet
discharged
Prior art date
Application number
PCT/KR2018/010729
Other languages
English (en)
Korean (ko)
Inventor
여지원
오동훈
이성제
Original Assignee
한온시스템 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한온시스템 주식회사 filed Critical 한온시스템 주식회사
Priority to CN201880059202.XA priority Critical patent/CN111096095B/zh
Publication of WO2019054764A1 publication Critical patent/WO2019054764A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20936—Liquid coolant with phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20318—Condensers

Definitions

  • an inverter in which a semiconductor module including a semiconductor device such as an IGBT and a diode is used is disclosed in Japanese Laid-Open Patent Application No. 2001-245478 (published on Sep. 10, 2001, entitled Cooling Device of Inverter)
  • a heat sink is disclosed in Japanese Patent Application Laid-Open No. 2008-294283 (published on December 4, 2008, entitled "Semiconductor Device"), which is disposed in contact with a lower surface of a semiconductor element and is formed so as to heat exchange with a fluid flowing therein.
  • the present invention has been made in order to solve the above problems, and it is an object of the present invention to prevent the construction of an engine room from being complicated by a piping line and a pump for transferring refrigerant to each electronic device.
  • the condensing unit 100 includes an upper tank in which a working fluid flows into the condensing unit 100 through the first inlet 110, an upper side communicating with the upper tank to pass a working fluid, And a lower tank communicating with a lower side of the plurality of tubes 102 to collect the working fluid and discharge the working fluid through the first discharging part 120.
  • the required installation space is minimized, and the internal space of the limited vehicle can be used more efficiently.
  • second inlet part 220 second outlet part
  • the working fluid introduced into the second inlet part 210 flows through the first inlet part 210, And is discharged to the second discharging unit 220.
  • the liquid pipe 300A connects the first discharge part 120 and the second inlet part 210 and the gas pipe 300B connects the second discharge part 220 and the first inlet part 110, Lt; / RTI >
  • the temperature of the working fluid rises and the mass flow rate of the working fluid moving through the gas pipe 300B increases.
  • the volume of the liquid pipe 300A is increased by the evaporator
  • the working fluid of the liquid pipe can be used even if the liquid state working fluid in the evaporator internal flow path 230 instantaneously boils.
  • the cooling device of the present invention and the cooling device module including the cooling device are made of aluminum except for the fan shroud, so that the device can be made lighter, and it is also advantageous in corrosion with a single metal. Also, since it is smaller and simpler than the construction cycle of ordinary household appliances, it is flexible to apply new refrigerants that have a low influence of refrigerant characteristics on cycles and have an ozone destruction index (OPD) of 0 and a global warming index (GWP) It can also respond to international refrigerant usage restrictions. Even if the evaporator 200 is horizontally disposed, it can operate with the same operation principle.
  • OPD ozone destruction index
  • GWP global warming index
  • the cooling device according to the present invention has an advantage that the internal space of the vehicle necessary for installing the cooling device is minimized and the additional power for circulating the working fluid is not consumed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne un dispositif de refroidissement utilisé dans un véhicule, et concerne un dispositif de refroidissement de chaleur générée localement de véhicule qui peut être installé à l'emplacement d'un composant nécessitant un refroidissement. Le dispositif de refroidissement selon la présente invention comprend : une partie de condensation ; une partie d'évaporation ; un conduit de liquide ; et un conduit de gaz.
PCT/KR2018/010729 2017-09-13 2018-09-13 Dispositif de refroidissement WO2019054764A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201880059202.XA CN111096095B (zh) 2017-09-13 2018-09-13 冷却装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020170117007A KR102393486B1 (ko) 2017-09-13 2017-09-13 냉각 장치
KR10-2017-0117007 2017-09-13

Publications (1)

Publication Number Publication Date
WO2019054764A1 true WO2019054764A1 (fr) 2019-03-21

Family

ID=65723773

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2018/010729 WO2019054764A1 (fr) 2017-09-13 2018-09-13 Dispositif de refroidissement

Country Status (3)

Country Link
KR (1) KR102393486B1 (fr)
CN (1) CN111096095B (fr)
WO (1) WO2019054764A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI807158B (zh) * 2020-01-20 2023-07-01 大陸商深圳興奇宏科技有限公司 熱虹吸散熱裝置之連通強化結構

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007093055A (ja) * 2005-09-27 2007-04-12 Sharp Corp 凝縮器およびそれを備えたループ型サーモサイフォン
JP2007198661A (ja) * 2006-01-25 2007-08-09 Twinbird Corp サーモサイフォン
JP2011243358A (ja) * 2010-05-17 2011-12-01 Denso Corp 電池パック
JP2017089991A (ja) * 2015-11-12 2017-05-25 日本フリーザー株式会社 並列分散型冷却システム
JP2017112189A (ja) * 2015-12-15 2017-06-22 富士電機株式会社 サーモサイフォン冷却装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100414860B1 (ko) * 2001-08-29 2004-01-13 (주)아이큐리랩 박판형 냉각장치
EP2568792A1 (fr) * 2011-09-06 2013-03-13 ABB Research Ltd. Appareil
JP2013247148A (ja) * 2012-05-23 2013-12-09 Toshiba Corp 自然循環型冷却装置
CN202902952U (zh) * 2012-10-31 2013-04-24 冠昊有限公司 循环式热虹吸散热装置
WO2016074682A1 (fr) * 2014-11-11 2016-05-19 Dantherm Cooling A/S Blocs de thermosiphon et systèmes de thermosiphons pour le transfert de chaleur
KR102351954B1 (ko) 2015-12-30 2022-01-18 한온시스템 주식회사 전기소자 냉각용 열교환기

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007093055A (ja) * 2005-09-27 2007-04-12 Sharp Corp 凝縮器およびそれを備えたループ型サーモサイフォン
JP2007198661A (ja) * 2006-01-25 2007-08-09 Twinbird Corp サーモサイフォン
JP2011243358A (ja) * 2010-05-17 2011-12-01 Denso Corp 電池パック
JP2017089991A (ja) * 2015-11-12 2017-05-25 日本フリーザー株式会社 並列分散型冷却システム
JP2017112189A (ja) * 2015-12-15 2017-06-22 富士電機株式会社 サーモサイフォン冷却装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI807158B (zh) * 2020-01-20 2023-07-01 大陸商深圳興奇宏科技有限公司 熱虹吸散熱裝置之連通強化結構

Also Published As

Publication number Publication date
KR102393486B1 (ko) 2022-05-04
CN111096095B (zh) 2021-11-05
KR20190029923A (ko) 2019-03-21
CN111096095A (zh) 2020-05-01

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