WO2019051702A1 - 显示模组及其形成方法 - Google Patents

显示模组及其形成方法 Download PDF

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Publication number
WO2019051702A1
WO2019051702A1 PCT/CN2017/101697 CN2017101697W WO2019051702A1 WO 2019051702 A1 WO2019051702 A1 WO 2019051702A1 CN 2017101697 W CN2017101697 W CN 2017101697W WO 2019051702 A1 WO2019051702 A1 WO 2019051702A1
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WO
WIPO (PCT)
Prior art keywords
layer
optical sensor
light
display module
panel
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PCT/CN2017/101697
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English (en)
French (fr)
Inventor
凌严
朱虹
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上海箩箕技术有限公司
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Priority to PCT/CN2017/101697 priority Critical patent/WO2019051702A1/zh
Publication of WO2019051702A1 publication Critical patent/WO2019051702A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition

Definitions

  • the present invention relates to the field of optical fingerprint recognition, and in particular, to a display module and a method for forming the same.
  • the fingerprint imaging recognition technology is a technique of acquiring a fingerprint image of a human body through a fingerprint sensor and then comparing it with existing fingerprint imaging information in the system to determine whether it is correct or not, thereby realizing the identity recognition technology. Due to its ease of use and the uniqueness of human fingerprints, fingerprint recognition technology has been widely used in various fields. For example, the public security bureau, customs and other security inspection areas, building access control systems, and consumer goods such as personal computers and mobile phones.
  • Fingerprint imaging recognition technology can be realized by various techniques such as optical imaging, capacitive imaging, and ultrasonic imaging. Relatively speaking, optical fingerprint imaging technology has relatively good imaging effect and relatively low equipment cost.
  • the self-luminous display panel is widely used in various electronic products due to its small size, light weight, low radiation and the like.
  • a reference has been made to combine a self-luminous display panel with an optical fingerprint imaging film layer, thereby enabling the display panel to integrate fingerprint recognition and image display functions.
  • the thickness of the display module having the fingerprint recognition function tends to be large, and the existing thinning process causes a high yield loss in the manufacturing process of the display module, and it is difficult to ensure the production yield of the display module. .
  • the problem to be solved by the present invention is to provide a display module and a method for forming the same, which can reduce the thickness of the display module under the premise of ensuring the yield of the display module.
  • the present invention provides a method for forming a display module, including:
  • the flexible plastic substrate has a thickness of less than or equal to 0.2 mm.
  • the material of the flexible plastic substrate is polyimide plastic or polyphthalic plastic.
  • the optical sensor is an optical sensor based on an amorphous silicon thin film transistor, an optical sensor based on a low temperature polysilicon thin film transistor, or an optical sensor based on an indium gallium zinc oxide thin film transistor.
  • the method further includes: providing a light collimating panel, the light collimating panel having a first opposite arrangement a surface and a second surface; the first surface is oppositely attached to a surface of the optical sensor; and the second surface is opposite to a surface of the self-luminous display panel.
  • the light collimating panel has a thickness of less than 0.5 mm.
  • the method further includes: forming a filter layer on the first surface; An adhesive layer is formed on the filter layer; a surface of the optical sensor is relatively attached to a surface of the adhesive layer.
  • the device layer before the first surface of the light collimating panel is relatively attached to the surface of the optical sensor, further comprising: forming a filter layer on the device layer; An adhesive layer is formed on the filter layer; a surface of the adhesive layer is opposite to the first surface.
  • the adhesion layer has a thickness of less than or equal to 50 ⁇ m.
  • the filter layer is an ink layer or a multilayer dielectric reflective layer.
  • the filter layer is an ink layer; the filter layer is formed by screen printing.
  • the filter layer is an ink layer; the filter layer has a thickness of less than 20 ⁇ m.
  • the filter layer is a multilayer dielectric reflective layer; the filter layer is formed by sputtering or evaporation.
  • the filter layer is a multilayer dielectric reflective layer; the filter layer has a thickness of less than 5 ⁇ m.
  • the present invention also provides a display module, including:
  • An optical sensor comprising: a flexible plastic substrate and a device layer on the flexible plastic substrate; a self-luminous display panel above the optical sensor; a protective cover over the self-illuminating panel; the protection The surface of the cover plate facing away from the self-luminous display panel is a sensing surface, and the light generated by the self-luminous display panel forms reflected light carrying fingerprint information on the sensing surface; the optical sensor is used for collecting Reflecting to obtain a fingerprint image.
  • the material of the flexible plastic substrate is polyimide plastic or polyphthalic plastic.
  • the flexible plastic substrate has a thickness of less than or equal to 0.2 mm.
  • the optical sensor is an optical sensor based on an amorphous silicon thin film transistor, an optical sensor based on a low temperature polysilicon thin film transistor, or an optical sensor based on an indium gallium zinc oxide thin film transistor.
  • the method further includes: a light collimating panel, the light collimating panel is located between the optical sensor and the self-illuminating display panel.
  • the light collimating panel has a first surface disposed opposite to each other and parallel to each other a second surface;
  • the light collimator panel includes: a plurality of light collimating units, the light collimating unit forming an angle with the first surface and the second surface at a first angle, The first angle is greater than or equal to 40° and less than or equal to 90°;
  • the light collimating unit comprises a core layer and a skin layer, the core layer being evenly distributed between the first surface and the second surface, the skin layer being filled Between adjacent core layers; the core layers are evenly spaced apart from one another, the skin layer surrounding the core layer.
  • the core layer material has an absorption rate of visible light of less than 20%.
  • the skin material absorbs more than 50% of visible light.
  • the core layer has an aspect ratio greater than 10.
  • the distance between adjacent core layers is less than 30 ⁇ m.
  • the light collimating panel and the optical sensor further include: an adhesive layer on the optical sensor; and a filter layer on the adhesive layer.
  • the light collimating panel and the optical sensor further include: a filter layer on the optical sensor; and an adhesive layer on the filter layer.
  • the material of the adhesive layer is a transparent optical adhesive.
  • the filter layer absorbs near-infrared light by more than 50%.
  • the filter layer has a transmittance of visible light greater than 50%.
  • the self-luminous display panel is an OLED display panel.
  • the self-luminous panel comprises a plurality of light emitting units, and the light emitting unit comprises a light transmissive area, and the light transmissive area has an area of 5% to 20% of the area of the light emitting unit.
  • the optical sensor comprises photosensitive pixels, and the photosensitive device in each of the photosensitive pixels is an amorphous silicon PIN photodiode.
  • the device layer and the flexible plastic substrate are used to form an optical sensor by directly forming a device layer on a flexible plastic substrate;
  • the self-luminous display panel and the protective layer are integrated on the device; the reflected light of the light generated by the self-luminous display panel on the sensing surface forms a fingerprint image.
  • the material of the flexible plastic substrate is often a high molecular polymer, it has high toughness, and is not easily damaged in the case of a small thickness; therefore, the adoption of the flexible plastic substrate can not only effectively reduce the optical
  • the thickness of the sensor reduces the thickness of the display module, and can also effectively reduce the yield loss during the formation of the optical sensor; therefore, the adoption of the flexible plastic substrate can achieve both high yield and small thickness. purpose.
  • the material of the flexible plastic substrate is polyimide plastic or polyterephthalic plastic.
  • Polyimide plastic or poly-p-dicarboxylic acid plastic has good mechanical properties and strong toughness, and can maintain a small breakage rate even when the thickness is less than or equal to 0.2 mm, so
  • the material of the flexible plastic substrate is set as polyimide plastic or poly-p-dicarboxylic acid plastic, which can effectively reduce the thickness of the optical sensor and maintain good manufacturing yield; furthermore, polyimide plastic or poly It also has good thermal stability performance for really dicarboxylic acid plastics, can withstand high temperature, can withstand various process conditions in the semiconductor manufacturing process, is beneficial to ensure the performance of the optical sensor, and is better for fingerprint recognition.
  • the base layer of the image display function is beneficial to the high-yield and small-thickness technical requirements; moreover, polyimide plastic or poly-p-dicarboxylic acid plastic has better isolation performance, which can effectively prevent water vapor from penetrating into the The inside of the display module facilitates the improvement of the stability of the formed display module.
  • the method further includes: providing a light collimating panel between the optical sensor and the self-luminous display panel.
  • the light collimating panel can collimate the light collected by the optical sensor, thereby effectively improving the fingerprint recognition function of the display module; and the thickness of the light collimating panel is less than 0.5 mm, thereby ensuring The thinning of the display module is advantageous for reducing the thickness of the display module.
  • a filter layer is disposed between the light collimating panel and the optical sensor, so as to effectively filter out ambient light, which is beneficial to improving the quality of the obtained fingerprint image;
  • An optical layer may be formed on the light collimating panel to prevent the optical sensor from being affected by the high temperature during the formation of the filter layer, which is beneficial to the dimension Holding the performance of the optical sensor; the filter layer may also be formed on the optical sensor, thereby reducing the scattering effect of the filter layer on the reflected light, and reducing the quality of the fingerprint layer on the fingerprint image. influences.
  • FIG. 5 are schematic cross-sectional structural views corresponding to respective steps of an embodiment of a method for forming a display module according to the present invention
  • FIG. 6 and FIG. 7 are schematic cross-sectional structural views corresponding to respective steps of another embodiment of the method for forming a display module of the present invention.
  • the existing display module with fingerprint recognition function tends to have a large thickness, and the existing thinning process causes high yield loss in the manufacturing process, and it is difficult to achieve manufacturing yield and module thinning. Take care of both.
  • the present invention provides a display module and a method for forming the same, by forming a device layer directly on a flexible plastic substrate to form an optical sensor; and integrating a self-luminous display panel and protection on the optical sensor.
  • Floor The use of the flexible plastic substrate enables a combination of high yield and small thickness.
  • FIG. 1 to FIG. 5 each embodiment of a method for forming a display module of the present invention is shown.
  • a flexible plastic substrate 110 is provided.
  • the flexible plastic substrate 110 is used to form the optical sensor to provide a process operation platform and foundation for subsequent formation of the device layer.
  • the optical sensor can be formed on the flexible plastic substrate 110. Effectively reducing the thickness of the formed optical sensor can also reduce the yield loss during the formation of the optical sensor, and is advantageous in achieving both manufacturing yield and thinning of the module.
  • the thickness of the flexible plastic substrate 110 is less than or equal to 0.2 mm.
  • the thickness of the flexible plastic substrate 110 is not too large. If the thickness of the flexible plastic substrate 110 is too large, the thickness of the formed optical sensor is too large, which may affect the thickness reduction of the formed display module, which is disadvantageous for thinning the module.
  • the material of the flexible plastic substrate 110 is Polyimide (PI) plastic or Polyethylene Terephthalate (PET) plastic.
  • Polyimide plastic or poly-p-dicarboxylic acid plastic has good mechanical properties and strong toughness, and can maintain a small breakage rate even when the thickness is less than or equal to 0.2 mm, so
  • the material of the flexible plastic substrate is set as polyimide plastic or poly-p-dicarboxylic acid plastic, which can effectively reduce the thickness of the optical sensor and maintain good manufacturing yield; in addition, polyimide plastic or Poly-p-type dicarboxylic acid plastics also have good thermal stability, can withstand high temperatures, can withstand various process conditions in the semiconductor manufacturing process, help to ensure the performance of the optical sensor, and help to achieve better fingerprints.
  • the integration of recognition and image display functions is beneficial to the high-yield and small-thickness technical requirements.
  • polyimide plastic or poly-p-dicarboxylic acid plastics have better isolation properties, which can effectively prevent water vapor from penetrating into the environment.
  • the inside of the display module facilitates the improvement of the stability of the formed display module.
  • the flexible plastic substrate 110 has an operation surface 112 and a back surface 111 disposed opposite to each other, and the operation surface 112 is subsequently used to form a device layer to constitute a structure.
  • Optical sensor a Bosch Sensortec senor
  • a device layer 120 is formed on the flexible plastic substrate 110, and the device layer 120 and the flexible plastic substrate 110 are used to form the optical sensor 100.
  • the flexible plastic substrate 110 is relatively thin, the rigidity is insufficient. The transfer or fixation of the flexible plastic substrate 110 is not facilitated during the fabrication of the device layer 120. Therefore, the flexible plastic substrate 110 is generally fixed on a rigid substrate, such as a glass plate or a stainless steel plate, and then the device layer 120 is fabricated. After the device layer 120 is completed, the flexible plastic substrate 110 is integrated with the device layer 120. Separated from a rigid substrate.
  • the device layer 120 is used together with the flexible plastic substrate 110 to constitute the optical sensor 100.
  • the device layer 120 has a photosensitive device for collecting the reflected light to obtain a fingerprint image.
  • the optical sensor 100 is an optical film based on an amorphous silicon thin film transistor (a-Si: H TFT). sensor.
  • the optical sensor may also be an optical sensor based on a Low Temperature Poly Si Thin Film Transistor (LTP-Si TFT) or an Indium Gallium Zinc Oxide Thin Film Transistor (Indium Gallium Zinc).
  • LTP-Si TFT Low Temperature Poly Si Thin Film Transistor
  • IGZO TFT Indium Gallium Zinc
  • the step of forming the device layer 120 includes: forming a photosensitive device 122 on the flexible plastic substrate 110; forming a protective layer 121 covering the photosensitive device 122 and at least a portion of the substrate 110.
  • the optical sensor 100 includes photosensitive pixels, and the photosensitive device 122 in each of the photosensitive pixels is an amorphous silicon PIN photodiode, that is, the photosensitive device 122 in the device layer 120 of each photosensitive pixel is Amorphous silicon PIN photodiode.
  • the flexible plastic substrate 110 is made of a plastic material
  • the The material of the protective layer 121 is one or both of amorphous silicon oxide and amorphous silicon nitride.
  • the protective layer 121 may be formed on the operation surface of the flexible plastic substrate 110 by sputtering or evaporation.
  • the forming method further includes: providing a light collimating panel 130 having first surfaces 131 and second disposed opposite to each other.
  • the surface 132 is opposite to the surface of the optical sensor 100; the second surface 132 is opposite to the surface of the self-luminous display panel 140.
  • the light collimating panel 130 is used for collimating the reflected light, and only allows light of a specific angular range (for example, in the range of 50° to 55°) to pass through the light collimating panel 130, and the light of other angles is absolutely large. Some are absorbed. Thereby, the stray light in the reflected light collected by the optical sensor 100 is reduced, which is advantageous for improving the quality of the obtained fingerprint image.
  • the light collimating panel 130 has a first surface 131 and a second surface 132 disposed opposite to each other and parallel to each other;
  • the light collimating panel 130 includes: a plurality of light collimating a unit (not shown), the light collimating unit and the first surface 131 and the second surface 132 form an angle between the first angle (not shown), the first clip The angle is greater than or equal to 40° and less than or equal to 90°;
  • the light collimating unit includes a core layer (not shown) and a skin layer (not shown), the core layer being evenly distributed in the first Between the surface and the second surface, the skin layer is filled between adjacent core layers; the core layers are evenly spaced apart from one another, the skin layer surrounding the core layer.
  • the light collimating panel 130 mainly uses the core layer of the light collimating unit to pass the light, and the cortex is used to absorb the light, and the core layer and the skin layer cooperate to achieve the above-mentioned light collimation and reduce stray light. The role.
  • the core layer material has an absorption rate of visible light of less than 20%. It can be seen from the action of the cortex that the higher the absorption rate of visible light by the cortex is, the better the absorption of visible light by the cortex is, so as to absorb light outside a certain angle. In order to ensure effective absorption of the corresponding light, in the embodiment, the skin material The absorption rate of visible light is greater than 50%. Therefore, after entering the light collimating panel 130, the light (visible light) is usually divided into only two cases: the first case is absorbed by the skin layer; the second case is passed through the light collimating panel 130 along the core layer.
  • the core layer has an aspect ratio greater than 10.
  • the aspect ratio of the core layer should not be too small. If the aspect ratio of the core layer is too small, the height of the core layer is too small and the width is too large, which is disadvantageous for ensuring the alignment effect of the core layer on light.
  • the distance between adjacent adjacent core layers is less than 30 ⁇ m.
  • the distance between adjacent core layers should not be too large. If the distance between the adjacent core layers is too large, the aspect ratio of the core layer is too small, which is disadvantageous for the alignment effect of the core layer on light.
  • the thickness of the light collimating panel 130 is less than 0.5 mm.
  • the thickness of the light collimating panel 130 is not too large. If the thickness of the light collimating panel 130 is too large, the thickness of the entire display module may be affected, which may cause the thickness of the formed display module to be too large. problem. Therefore, setting the thickness of the light collimating panel 130 to less than 0.5 mm can ensure the thinning of the display module and facilitate the control of the overall thickness of the display module.
  • the method further includes: A filter layer 170 is formed on the first surface 131; an adhesion layer 160 is formed on the filter layer 170; and a surface of the optical sensor 100 is oppositely bonded to a surface of the adhesion layer 160.
  • the filter layer 170 is used to filter out ambient light to improve the quality of the obtained fingerprint image.
  • the filter layer 170 can effectively remove ambient light, especially ambient light.
  • the infrared light in the medium can effectively ensure the transmission of visible light and ensure the acquisition of clear fingerprint images.
  • the filter layer 170 is an ink layer, and the filter layer 170 can be formed by screen printing.
  • the thickness of the filter layer 170 is less than 20 ⁇ m.
  • the thickness of the filter layer 170 is not too large. If the thickness of the filter layer 170 is too large, it may affect the overall thickness of the formed display module, which is disadvantageous for reducing the thickness of the formed display module.
  • the adhesive layer 160 is used to achieve a conforming connection between the light collimating panel 130 and the optical sensor 100.
  • the material of the adhesive layer 160 is a transparent optical adhesive, so that the influence of the filter layer 160 on the fingerprint image can be effectively reduced, which is advantageous for the collection of high-quality fingerprint images.
  • the thickness of the adhesion layer 160 is less than or equal to 50 ⁇ m.
  • the thickness of the adhesion layer 160 is not too large. If the thickness of the filter layer 170 is too large, it may affect the overall thickness of the formed display module, which is disadvantageous for reducing the thickness of the formed display module.
  • the optical sensor 100 can be prevented from being subjected to The effect of the filter layer 170 forming process, in particular, the optical sensor 100 can be prevented from being affected by the high temperature during the formation of the filter layer 170, which is advantageous for maintaining the performance of the optical sensor 100.
  • a protective cover 150 and a self-luminous display panel 140 on the surface of the protective cover 150 are provided.
  • the protective cover 150 covers the self-luminous display panel 140 and the optical sensor for protection; the self-luminous display panel 140 is used to implement an image display function.
  • the protective cover 150 is a cover of the self-luminous display panel 140. glass.
  • the self-luminous display panel 140 includes a first transparent substrate (not shown), a second transparent substrate (not shown), and a self-illuminating circuit layer (not shown).
  • the self-illuminating circuit layer is located between the first transparent substrate and the second transparent substrate.
  • the self-luminous display panel 140 includes a plurality of light emitting units (not shown). Each of the light emitting units includes a light transmitting region and a non-light transmitting region, so light can project the self-luminous display panel 140.
  • the area of the light transmissive area accounts for 5% to 20% of the area of the light emitting unit.
  • the ratio of the area of the light-transmitting area to the area of the light-emitting unit is not too high or too low. If the ratio of the area of the light-transmitting area to the area of the light-emitting unit is too low, the light transmission of the self-luminous display panel 140 may be affected, which may affect the acquisition of a clear fingerprint image; If the ratio of the area of the light emitting unit is too high, the self-luminous performance of the self-luminous display panel 140 may be affected, which is disadvantageous for the image display function of the display module.
  • the self-luminous display panel 140 may be an OLED display panel, so the display pixel unit of the self-luminous circuit layer may include an anode layer, a hole injection layer (HIL), an emission layer (EML), and an electron injection layer (
  • the structure such as the EIL) and the cathode layer may further have a hole transport layer (HTL) and an electron transport layer (ETL), and may also include a TFT for driving the OLED, a driving metal line, and a storage capacitor.
  • HTL hole transport layer
  • ETL electron transport layer
  • the self-luminous display panel 140 and the optical sensor 100 are relatively attached.
  • the light collimating panel 130 is further attached to the optical sensor 100. Therefore, the surface of the spontaneous display panel 140 is in contact with the second surface 132 of the light collimating panel 130. Specifically, the bonding between the spontaneous display panel 140 and the light collimating panel 130 can be achieved by a transparent optical adhesive.
  • the optical sensing is formed. After the device 100, before the self-luminous display panel 140 and the optical sensor 100 are relatively attached, the forming method further includes: bonding the reinforcing plate 103 on the back surface 111 of the flexible plastic substrate 110.
  • the reinforcing plate 103 is used to provide additional mechanical support during the process.
  • the reinforcing plate 103 is made of stainless steel and can be attached to the back surface 111 of the flexible plastic substrate 110 by double-sided tape. Specifically, the thickness of the reinforcing plate 103 is less than or equal to 0.2 mm.
  • the forming method further includes removing the reinforcing plate 103.
  • the optical sensor 100 is connected to the signal readout chip 160 through the flexible circuit board 170.
  • the flexible circuit board 170 is connected to the flexible plastic substrate 110 through an anisotropic conductive film (ACF); the other end is connected to the signal readout chip 160.
  • ACF anisotropic conductive film
  • the surface of the protective cover 150 facing away from the self-luminous display panel 140 is a sensing surface 151, and the light generated by the self-luminous display panel 140 is formed on the sensing surface 151.
  • the reflected light of the fingerprint information; the optical sensor 100 is configured to collect the reflected light to obtain a fingerprint image.
  • the light generated by the self-luminous display panel 140 is reflected and refracted on the sensing surface 151; when the finger is pressed on the sensing surface 151, the reflected light is formed and carried. Reflected light of the fingerprint information; the reflected light is transmitted through the self-luminous display panel 140, collimated by the light collimating panel 130, and projected onto the optical sensor 100; the optical sensor 100 collects the reflected light, Get a fingerprint image.
  • FIG. 5 a cross-sectional structural diagram of an embodiment of the display module of the present invention is shown.
  • the display module includes:
  • the optical sensor 100 includes a flexible plastic substrate 110 and a device layer 120 on the flexible plastic substrate 110.
  • the self-luminous display panel 140 is located above the optical sensor 100.
  • the protective cover 150 is located at the optical sensor 100.
  • the surface of the protective cover 150 facing away from the self-luminous display panel 140 is a sensing surface 151.
  • the light generated by the self-luminous display panel 140 is formed on the sensing surface 151. Reflected light of fingerprint information; the optical sensor 100 is configured to acquire the reflection to obtain a fingerprint image.
  • the flexible plastic substrate 110 is used to form the optical sensor 100 to provide a process operation platform and foundation for the formation of the device layer 120.
  • the optical sensor can be formed on the flexible plastic substrate 110. Effectively reducing the thickness of the formed optical sensor can also reduce the yield loss during the formation of the optical sensor, and is advantageous in achieving both manufacturing yield and thinning of the module.
  • the thickness of the flexible plastic substrate 110 is less than or equal to 0.2 mm.
  • the thickness of the flexible plastic substrate 110 is not too large. If the thickness of the flexible plastic substrate 110 is too large, the thickness of the formed optical sensor is too large, which may affect the thickness reduction of the formed display module, which is disadvantageous for thinning the module.
  • the material of the flexible plastic substrate 110 is Polyimide (PI) plastic or Polyethylene Terephthalate (PET) plastic.
  • Polyimide plastic or polyterephthalic plastic has good mechanical properties and strong toughness, and can maintain a small breakage rate even when the thickness is less than or equal to 0.2 mm, so
  • the material of the flexible plastic substrate is set to polyimide plastic or poly
  • the thickness of the optical sensor can be effectively reduced, and the good manufacturing yield can be maintained; in addition, the polyimide plastic or the poly-p-dicarboxylic acid plastic has good heat stability.
  • Performance high temperature resistance, ability to withstand various process conditions in the semiconductor manufacturing process, help to ensure the performance of the optical sensor, and facilitate the integration of fingerprint recognition and image display functions, which is beneficial to both high yield and Small thickness technical requirements;
  • polyimide plastic or poly-p-dicarboxylic acid plastics have better isolation properties, which can effectively prevent moisture from penetrating into the interior of the display module, which is beneficial to the stability of the formed display module.
  • Sexual improvement is beneficial.
  • the flexible plastic substrate 110 has an operation surface 112 and a back surface 111 disposed opposite to each other, and the operation surface 112 is used to form the device layer 120 to constitute the optical sensor 100.
  • the device layer 120 is used together with the flexible plastic substrate 110 to constitute the optical sensor 100.
  • the device layer 120 has a photosensitive device for collecting the reflected light to obtain a fingerprint image.
  • the optical sensor 100 is an optical film based on an amorphous silicon thin film transistor (a-Si: H TFT). sensor.
  • the optical sensor may also be an optical sensor based on a Low Temperature Polysilicon Thin Film Transistor (LTP-Si TFT) or an Indium Gallium Zinc Oxide (Indium Gallium Zinc Oxide).
  • LTP-Si TFT Low Temperature Polysilicon Thin Film Transistor
  • IGZO TFT Indium Gallium Zinc Oxide
  • the device layer 120 includes: a photosensitive device 122 on the flexible plastic substrate 110; and a protective layer 121 covering the photosensitive device 122 and at least a portion of the substrate 110.
  • the optical sensor 100 includes photosensitive pixels, and the photosensitive device 122 in each of the photosensitive pixels is an amorphous silicon PIN photodiode, that is, the photosensitive device 122 in the device layer 120 of each photosensitive pixel is Amorphous silicon PIN photodiode.
  • the material of the protective layer 121 is one or two of amorphous silicon oxide and amorphous silicon nitride.
  • the display module further includes a light collimating panel 130 , and the light collimating panel 130 is located between the optical sensor 100 and the self-illuminating display panel 140 .
  • the light collimating panel 130 is used for collimating the reflected light, thereby reducing the incident angle of the reflected light collected by the optical sensor 100, which is beneficial to improving the quality of the obtained fingerprint image.
  • the light collimating panel 130 has a first surface 131 and a second surface 132 disposed opposite to each other and parallel to each other;
  • the light collimating panel 130 includes: a plurality of light collimating units (not shown in the figure)
  • the angle between the light collimating unit and the first surface 131 and the second surface 132 is a first angle (not shown), and the first angle is greater than or equal to 40°.
  • the light collimating unit includes a core layer (not shown) and a skin layer (not shown), the core layer being evenly distributed on the first surface and the second layer Between the surfaces, the skin layer is filled between adjacent core layers; the core layers are evenly spaced from one another, the skin layer surrounding the core layer.
  • the light collimating panel 130 mainly uses the core layer of the light collimating unit to pass the light, and the cortex is used to absorb the light, and the core layer and the skin layer cooperate to achieve the above-mentioned light collimation and reduce the stray light.
  • the core layer material has an absorption rate of visible light of less than 20%. It can be seen from the action of the cortex that the higher the absorption rate of visible light by the cortex is, the better the absorption of visible light by the cortex is, so as to absorb light outside a certain angle. In order to ensure effective absorption of the corresponding light, in the embodiment, the absorption rate of visible light by the skin material is greater than 50%. Therefore, after entering the light collimating panel 130, the light (visible light) is usually divided into only two cases: the first case is absorbed by the skin layer; the second case is passed through the light collimating panel 130 along the core layer.
  • the core layer has an aspect ratio greater than 10.
  • the aspect ratio of the core layer should not be too small. If the aspect ratio of the core layer is too small, the height of the core layer is too small and the width is too large, which is disadvantageous for ensuring the alignment effect of the core layer on light.
  • the distance between adjacent adjacent core layers is less than 30 ⁇ m.
  • the distance between adjacent core layers should not be too large. If the distance between the adjacent core layers is too large, the aspect ratio of the core layer is too small, which is disadvantageous for the alignment effect of the core layer on light.
  • the thickness of the light collimating panel 130 is less than 0.5 mm.
  • the thickness of the light collimating panel 130 is not too large. If the thickness of the light collimating panel 130 is too large, the thickness of the entire display module may be affected, which may cause the thickness of the formed display module to be too large. problem. Therefore, setting the thickness of the light collimating panel 130 to less than 0.5 mm can ensure the thinning of the display module and facilitate the control of the overall thickness of the display module.
  • the display module further includes: an adhesive layer 160 located on the optical sensor 100; a filter layer 170, located on the adhesion layer 160, that is, the adhesion layer 160 and the filter layer 170 are sequentially located between the optical sensor 100 and the light collimation panel 130.
  • the filter layer 170 is used to filter out ambient light to improve the quality of the obtained fingerprint image.
  • the filter layer 170 can effectively remove ambient light, especially infrared light in ambient light, and can effectively ensure the transmission of visible light, and ensure the acquisition of a clear fingerprint image.
  • the filter layer 170 is an ink layer.
  • the filter layer 170 has a thickness of less than 20 ⁇ m.
  • the thickness of the filter layer 170 is not too large. If the thickness of the filter layer 170 is too large, it may affect the overall thickness of the formed display module, which is disadvantageous for reducing the thickness of the formed display module.
  • the adhesive layer 160 is used to achieve a conforming connection between the light collimating panel 130 and the optical sensor 100.
  • the material of the adhesive layer 160 is a transparent optical adhesive, so that the influence of the filter layer 160 on the fingerprint image can be effectively reduced, which is advantageous for the collection of high-quality fingerprint images.
  • the thickness of the adhesion layer 160 is less than or equal to 50 ⁇ m.
  • the thickness of the adhesion layer 160 is not too large. If the thickness of the filter layer 170 is too large, it may affect the overall thickness of the formed display module, which is disadvantageous for reducing the thickness of the formed display module.
  • the optical sensor 100 can be prevented from being subjected to The effect of the filter layer 170 forming process, in particular, the optical sensor 100 can be prevented from being affected by the high temperature during the formation of the filter layer 170, which is advantageous for maintaining the performance of the optical sensor 100.
  • the protective cover 150 covers the self-luminous display panel 140 and the optical sensor for protection; the self-luminous display panel 140 is used to implement an image display function.
  • the protective cover 150 is a cover glass of the self-luminous display panel 140.
  • the self-luminous display panel 140 includes a first transparent substrate (not shown), a second transparent substrate (not shown), and a self-illuminating circuit layer (not shown).
  • the self-illuminating circuit layer is located between the first transparent substrate and the second transparent substrate.
  • the self-luminous display panel 140 includes a plurality of light emitting units (not shown). Each of the light emitting units includes a light transmitting region and a non-light transmitting region, so light can project the self-luminous display panel 140.
  • the area of the light transmissive area accounts for 5% to 20% of the area of the light emitting unit.
  • the ratio of the area of the light-transmitting area to the area of the light-emitting unit is not too high or too low. If the ratio of the area of the light-transmitting area to the area of the light-emitting unit is too low, the light transmission of the self-luminous display panel 140 may be affected, which may affect the acquisition of a clear fingerprint image; If the ratio of the area of the light emitting unit is too high, the self-luminous performance of the self-luminous display panel 140 may be affected, which is disadvantageous for the image display function of the display module.
  • the self-luminous display panel 140 may be an OLED display panel, so the display pixel unit of the self-luminous circuit layer may include an anode layer, a hole injection layer (HIL), an emission layer (EML), and an electron injection layer (
  • the structure such as the EIL) and the cathode layer may further have a hole transport layer (HTL) and an electron transport layer (ETL), and may also include a TFT for driving the OLED, a driving metal line, and a storage capacitor.
  • HTL hole transport layer
  • ETL electron transport layer
  • the display module further includes: a signal readout chip 160, and the signal readout chip 160 is connected to the optical sensor 100 through the flexible circuit board 170.
  • the flexible circuit board 170 is connected to the flexible plastic substrate 110 through an anisotropic conductive film; the other end is connected to the signal readout chip 160.
  • the surface of the protective cover 150 facing away from the self-luminous display panel 140 is a sensing surface 151, and the light generated by the self-luminous display panel 140 is formed on the sensing surface 151.
  • the reflected light of the fingerprint information; the optical sensor 100 is configured to collect the reflected light to obtain a fingerprint image.
  • the light generated by the self-luminous display panel 140 is reflected and refracted on the sensing surface 151; when the finger is pressed on the sensing surface 151, the reflected light is formed and carried. Reflected light of the fingerprint information; the reflected light is transmitted through the self-luminous display panel 140, collimated by the light collimating panel 130, and projected onto the optical sensor 100; the optical sensor 100 collects the reflected light, Get a fingerprint image.
  • FIG. 6 and FIG. 7 a cross-sectional structural diagram corresponding to each step of another embodiment of the method for forming a display module of the present invention is shown.
  • This embodiment is identical to the foregoing embodiment of the method for forming a display module, and the present invention is not described herein again.
  • the difference between this embodiment and the foregoing embodiment is that, in the embodiment, after the device layer 220 is formed, before the first surface 231 of the light collimating panel 230 is relatively attached to the surface of the optical sensor 200.
  • the method further includes: forming a filter layer 270 on the device layer 220; forming an adhesion layer 260 on the filter layer 270; as shown in FIG. 7, the adhesion layer 260 is as shown in FIG.
  • the surface is in contact with the first surface 231.
  • the filter layer 270 is a multilayer dielectric reflective layer, and ambient light of a specific wavelength is filtered by the interference principle of light waves.
  • the filter layer 270 includes alternating layers of silicon oxide and titanium oxide.
  • reflection and transmission occur at the respective interfaces of the silicon oxide layer and the titanium oxide layer, and constructive interference may occur between the reflected light and the incident light. , thereby increasing the intensity of the reflected light, causing more energy to be reflected by the filter layer 270, thereby reducing the transmittance of the transmitted light; or, the reflected light and the incident light may also be cancelled.
  • Interference thereby reducing the intensity of the reflected light, allowing more energy to pass through the filter layer 270, thereby increasing the transmission of transmitted light.
  • the wavelength of the light, the thickness of the silicon oxide layer, and the thickness of the titanium oxide layer determine whether constructive interference or destructive interference occurs between the reflected light rays; therefore, the thickness of the silicon oxide layer and the thickness of the titanium oxide layer are set. , which makes the light reflectance in a specific wavelength range higher and the transmittance lower; the light transmittance in a specific wavelength range is higher, and the reflectance is lower; thereby enabling the filter layer to filter out a specific wavelength range Light.
  • the light is reflected at the interface between the silicon oxide layer and the titanium oxide layer, so the sum of the number of layers of the silicon oxide layer and the number of layers of the titanium oxide layer in the filter layer 270 is 5 to 60 Within the scope. If the sum of the number of layers of the silicon oxide layer and the number of layers of the titanium oxide layer in the filter layer 270 is too small, the filtering effect of the filter layer 270 on ambient light may be affected, which is disadvantageous. Providing the quality of the fingerprint image; if the sum of the number of layers of the silicon oxide layer and the number of layers of the titanium oxide layer in the filter layer 270 is too large, it is not conducive to the transmission of light, and may be detrimental to the quality of the fingerprint image. The increase, and the number of layers of the silicon oxide layer and the number of layers of the titanium oxide layer are too large, which increases the thickness of the filter layer, which is disadvantageous for the display mode Control of the overall thickness of the group.
  • the filter layer 270 has a thickness of less than 5 ⁇ m.
  • the overall thickness of the filter layer 270 is not too large. If the overall thickness of the filter layer 270 is too large (for example, greater than 10 um), the manufacturing time will increase and the cost will increase. In addition, the overall thickness is too large, and the overall film stress is too large, so that the film layer will crack and fall off.
  • the filter layer 270 is a multi-layer dielectric reflective layer in which a silicon oxide layer and a titanium oxide layer are alternately disposed; therefore, the filter layer 270 may form the filter layer by sputtering or evaporation. 270.
  • FIG. 7 a cross-sectional structural diagram of another embodiment of the display module of the present invention is shown.
  • the embodiment is the same as the foregoing display module embodiment, and the present invention is not described herein again.
  • the embodiment is different from the foregoing display module embodiment in that, in the embodiment, the light collimating panel 230 and the optical sensor 200 further include: a filter layer 270 located at the optical sensor 200.
  • the adhesion layer 260 is located on the filter layer 270, that is, the filter layer 270 and the adhesion layer 260 are sequentially located between the optical sensor 100 and the light collimation panel 130.

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Abstract

一种显示模组及其形成方法，形成方法包括：提供柔性塑料基板（110）；在柔性塑料基板（110）上形成器件层（120），器件层（120）和柔性塑料基板（110）用于形成光学传感器（100）；提供保护盖板（150）和位于保护盖板（150）表面的自发光显示面板（140）；将自发光显示面板（140）和光学传感器（100）相对贴合。通过在柔性塑料基板（110）上直接形成器件层（120）以构成光学传感器（100），从而达到兼顾高良率和小厚度的目的。

Description

显示模组及其形成方法 技术领域
本发明涉及光学指纹识别领域，尤其涉及一种显示模组及其形成方法。
背景技术
指纹成像识别技术，是通过指纹传感器采集到人体的指纹图像，然后与系统里的已有指纹成像信息进行比对，来判断正确与否，进而实现身份识别的技术。由于其使用的方便性，以及人体指纹的唯一性，指纹识别技术已经大量应用于各个领域。比如公安局、海关等安检领域，楼宇的门禁系统，以及个人电脑和手机等消费品领域等等。
指纹成像识别技术的实现方式有光学成像、电容成像、超声成像等多种技术。相对来说，光学指纹成像技术，其成像效果相对较好，设备成本相对较低。
另一方面，现有技术中，自发光显示面板以其体积小、重量轻，低辐射等优势被广泛应用于各种电子产品中。现有技术中，已有将自发光显示面板与光学指纹成像膜层进行结合的引用，从而使显示面板实现指纹识别和图像显示功能的集成。
但是具有指纹识别功能的显示模组的厚度往往较大，而现有薄化工艺又会在所述显示模组的制造过程中造成较高的良率损失，难以保证显示模组的制作良率。
发明内容
本发明解决的问题是提供一种显示模组及其形成方法，在保证显示模组良率的前提下，减小所述显示模组的厚度。
为解决上述问题，本发明提供一种显示模组的形成方法，包括：
提供柔性塑料基板；在所述柔性塑料基板上形成器件层，所述器件层和所述柔性塑料基板用于形成光学传感器；提供保护盖板和位于所述保护盖板表面的自发光显示面板；将所述自发光显示面板和所述光学传感器相对贴合；所述保护盖板背向所述自发光显示面板的表面为感测面，所述自发光显示面板所产生光线在所述感测面上形成携带有指纹信息的反射光；所述光学传感器用于采集所述反射光以获得指纹图像。
可选的，所述柔性塑料基板的厚度小于或等于0.2mm。
可选的，所述柔性塑料基板的材料为聚酰亚胺塑料或聚对苯二甲酸类塑料。
可选的，所述光学传感器为基于非晶硅薄膜晶体管的光学传感器、基于低温多晶硅薄膜晶体管的光学传感器或基于铟镓锌氧化物薄膜晶体管的光学传感器。
可选的，形成所述器件层之后，将所述自发光显示面板和所述光学传感器相对贴合之前，还包括：提供光准直面板，所述光准直面板具有相背设置的第一表面和第二表面；将所述第一表面与所述光学传感器的表面相对贴合；将所述第二表面与所述自发光显示面板的表面相对贴合。
可选的，所述光准直面板的厚度小于0.5mm。
可选的，提供光准直面板之后，将所述光准直面板的第一表面与所述光学传感器的表面相对贴合之前，还包括：在所述第一表面上形成滤光层；在所述滤光层上形成粘附层；将所述光学传感器的表面与所述粘附层的表面相对贴合。
可选的，形成所述器件层之后，将所述光准直面板的第一表面与所述光学传感器的表面相对贴合之前，还包括：在所述器件层上形成滤光层；在所述滤光层上形成粘附层；将所述粘附层的表面与所述第一面相对贴合。
可选的，所述粘附层的厚度小于或等于50μm。
可选的，所述滤光层为油墨层或多层介质反射层。
可选的，所述滤光层为油墨层；通过丝网印刷的方式形成所述滤光层。
可选的，所述滤光层为油墨层；所述滤光层厚度小于20μm。
可选的，所述滤光层为多层介质反射层；通过溅射或蒸镀的方式形成所述滤光层。
可选的，所述滤光层为多层介质反射层；所述滤光层厚度小于5μm。
相应的，本发明还提供一种显示模组，包括：
光学传感器，所述光学传感器包括柔性塑料基板和位于所述柔性塑料基板上的器件层；自发光显示面板，位于所述光学传感器上方；保护盖板，位于所述自发光面板上方；所述保护盖板背向所述自发光显示面板的表面为感测面，所述自发光显示面板所产生光线在所述感测面上形成携带有指纹信息的反射光；所述光学传感器用于采集所述反射以获得指纹图像。
可选的，所述柔性塑料基板的材料为聚酰亚胺塑料或聚对苯二甲酸类塑料。
可选的，所述柔性塑料基板的厚度小于或等于0.2mm。
可选的，所述光学传感器为基于非晶硅薄膜晶体管的光学传感器、基于低温多晶硅薄膜晶体管的光学传感器或基于铟镓锌氧化物薄膜晶体管的光学传感器。
可选的，还包括：光准直面板，所述光准直面板位于所述光学传感器和所述自发光显示面板之间。
可选的，所述光准直面板具有相背设置且相互平行的第一表面和 第二表面；所述光准直器面板包含：多个光准直单元，所述光准直单元与所述第一表面和所述第二表面所成夹角为第一夹角，所述第一夹角大于或等于40°且小于或等于90°；所述光准直单元包括芯层和皮层，所述芯层均匀分布于第一表面和第二表面之间，所述皮层填充于相邻芯层之间；所述芯层相互之间呈均匀间隔分布，所述皮层包围所述芯层。
可选的，所述芯层材料对可见光的吸收率小于20％。
可选的，所述皮层材料对可见光的吸收率大于50％。
可选的，所述芯层的高宽比大于10。
可选的，相邻芯层之间的距离小于30μm。
可选的，所述光准直面板和所述光学传感器之间，还包括：粘附层，位于所述光学传感器上；滤光层，位于所述粘附层上。
可选的，所述光准直面板和所述光学传感器之间，还包括：滤光层，位于所述光学传感器上；粘附层，位于所述滤光层上。
可选的，所述粘附层的材料为透明光学胶。
可选的，所述滤光层对近红外光的吸收率大于50％。
可选的，所述滤光层对可见光的透过率大于50％。
可选的，所述自发光显示面板为OLED显示面板。
可选的，所述自发光面板包括多个发光单元，所述发光单元包括透光区，所述透光区面积占所述发光单元面积的5％到20％。
可选的，所述光学传感器包括感光像素，每个所述感光像素中的感光器件是非晶硅PIN光电二极管。
与现有技术相比，本发明的技术方案具有以下优点：
本发明技术方案，通过在柔性塑料基板上直接形成器件层，所述器件层和所述柔性塑料基板用于形成光学传感器；再在所述光学传感 器上集成自发光显示面板和保护层；利用所述自发光显示面板所产生光线在所述感测面上的反射光，形成指纹图像。由于所述柔性塑料基板的材质往往是高分子聚合物，具有较高的韧性，在厚度较小的情况下也不易发生破损；因此所述柔性塑料基板的采用，不仅能够有效减小所述光学传感器的厚度，减小所述显示模组的厚度，而且还能够有效减小所述光学传感器形成过程中的良率损失；所以所述柔性塑料基板的采用，能够达到兼顾高良率和小厚度的目的。
本发明可选方案中，所述柔性塑料基板的材料为聚酰亚胺塑料或聚对苯二甲酸类塑料。聚酰亚胺塑料或聚对笨二甲酸类塑料具有较好的机械性能，较强的韧性，即使在厚度小于或等于0.2mm的情况下，也能够保持较小的破损率，所以将所述柔性塑料基板的材料设置为聚酰亚胺塑料或聚对笨二甲酸类塑料，能够有效减小所述光学传感器的厚度，还能够维持较好的制造良率；此外聚酰亚胺塑料或聚对笨二甲酸类塑料还具有较好的热稳定性能，能够耐高温，能够承受半导体制造工艺过程中的各种工艺条件，有利于保证所述光学传感器的性能，有利于更好的实现指纹识别和图像显示功能的基层，有利于兼顾高良率和小厚度的技术要求；而且，聚酰亚胺塑料或聚对笨二甲酸类塑料还有较好的隔离性能，能够有效防止水汽渗透进入所述显示模组内部，有利于所形成显示模组稳定性的提高。
本发明可选方案中，还包括：在所述光学传感器和所述自发光显示面板之间设置光准直面板。所述光准直面板能够对所述光学传感器所采集的光线进行准直，从而能够有效改善所述显示模组的指纹识别功能；而且所述光准直面板的厚度小于0.5mm，从而能够保证所述显示模组的薄化，有利于减小所述显示模组的厚度。
本发明可选方案中，包括：在所述光准直面板和所述光学传感器之间设置滤光层，从而能够有效滤除环境光，有利于改善所获得指纹图像的质量；而且所述滤光层可以形成于所述光准直面板上，从而避免所述光学传感器受到所述滤光层形成过程中的高温影响，有利于维 持所述光学传感器的性能；所述滤光层也可以形成于所述光学传感器上，从而降低所述滤光层对所述反射光的散射作用，降低所述滤光层对指纹图像质量的影响。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1至图5是本发明显示模组形成方法一实施例各个步骤对应的剖面结构示意图；
图6和图7是本发明显示模组形成方法另一实施例各个步骤对应的剖面结构示意图。
具体实施方式
由背景技术可知，现有具有指纹识别功能的显示模组往往厚度较大，而现有薄化工艺又会在制造过程中造成较高的良率损失，难以实现制造良率和模组薄化的兼顾。
为解决所述技术问题，本发明提供一种显示模组及其形成方法，通过在柔性塑料基板上直接形成器件层，以形成光学传感器；再在所述光学传感器上集成自发光显示面板和保护层。所述柔性塑料基板的采用能够实现高良率和小厚度的兼顾。
为使本发明的上述目的、特征和优点能够更为明显易懂，下面结合附图对本发明的具体实施例做详细的说明。
参考图1至图5，示出了本发明显示模组形成方法一实施例各个 步骤对应的剖面结构示意图。
参考图1，提供柔性塑料基板110。
所述柔性塑料基板110用于构成所述光学传感器，为后续所述器件层的形成提供工艺操作平台和基础。
由于所述柔性塑料基板110的材质往往是高分子聚合物，具有较高的韧性，在厚度较小的情况下也不易发生破损，因此在所述柔性塑料基板110上形成所述光学传感器，能够有效减小所形成光学传感器的厚度，还能够降低所述光学传感器形成过程中的良率损失，有利于实现制造良率和模组薄化的兼顾。
本实施例中，所述柔性塑料基板110的厚度小于或等于0.2mm。所述柔性塑料基板110的厚度不宜太大。所述柔性塑料基板110的厚度如果太大，则会造成所形成光学传感器厚度过大，会影响所形成显示模组的厚度减小，不利于模组薄化。
本实施例中，所述柔性塑料基板110的材料为聚酰亚胺(Polyimide，PI)塑料或聚对苯二甲酸类(Polyethylene Terephthalate，PET)塑料。
聚酰亚胺塑料或聚对笨二甲酸类塑料具有较好的机械性能，较强的韧性，即使在厚度小于或等于0.2mm的情况下，也能够保持较小的破损率，所以将所述柔性塑料基板的材料设置为聚酰亚胺塑料或聚对笨二甲酸类塑料，能够有效减小所述光学传感器的厚度，还能够维持较好的制造良率；此外，聚酰亚胺塑料或聚对笨二甲酸类塑料还具有较好的热稳定性能，能够耐高温，能够承受半导体制造工艺过程中的各种工艺条件，有利于保证所述光学传感器的性能，有利于更好的实现指纹识别和图像显示功能的集成，有利于兼顾高良率和小厚度的技术要求；而且，聚酰亚胺塑料或聚对笨二甲酸类塑料还有较好的隔离性能，能够有效防止水汽渗透进入所述显示模组内部，有利于所形成显示模组稳定性的提高。
需要说明的是，如图1所示，本实施例中，所述柔性塑料基板110具有相背设置的操作面112和背面111，所述操作面112上后续用于形成器件层，以构成所述光学传感器。
参考图2，在所述柔性塑料基板110上形成器件层120，所述器件层120和所述柔性塑料基板110用于形成光学传感器100。
需要说明的是，由于柔性塑料基板110比较薄，所以刚性不够。在器件层120的制作过程中不便于柔性塑料基板110的转移或固定。所以一般都会事先将柔性塑料基板110固定在一个刚性基板上，比如玻璃板或不锈钢板，然后进行器件层120的制作；待器件层120制作完成后，才将柔性塑料基板110连同器件层120整个从刚性基板上分离。
所述器件层120与所述柔性塑料基板110一起，用于构成所述光学传感器100。所述器件层120内具有感光器件，用于采集所述反射光以获得指纹图像。
需要说明的是，由于所述柔性塑料基板110为塑料材质，因此本实施例中，所述光学传感器100为基于非晶硅薄膜晶体管(Amorphous Silicon Thin Film Transistor，a-Si:H TFT)的光学传感器。但是本发明其他实施例中，所述光学传感器也可以是基于低温多晶硅薄膜晶体管(Low Temperature Poly Si Thin Film Transistor，LTP-Si TFT)的光学传感器或者基于铟镓锌氧化物薄膜晶体管(Indium Gallium Zinc Oxide Thin Film Transistor，IGZO TFT)的光学传感器。
具体的，形成所述器件层120的步骤包括：在所述柔性塑料基板110上形成感光器件122；形成覆盖所述感光器件122和至少部分所述基板110的保护层121。
本实施例中，所述光学传感器100包括感光像素，每个所述感光像素中的感光器件122是非晶硅PIN光电二极管，也就是说，每个感光像素的器件层120内的感光器件122为非晶硅PIN光电二极管。
本实施例中，由于所述柔性塑料基板110为塑料材质，因此所述 保护层121的材料为非晶态的氧化硅和非晶态的氮化硅中的一种或两种。所述保护层121可以通过溅射或者蒸镀等方式形成于所述柔性塑料基板110的操作面上。
需要说明的是，参考图3，形成所述器件层120之后，所述形成方法还包括：提供光准直面板130，所述光准直面板130具有相背设置的第一表面131和第二表面132；将所述第一表面131与所述光学传感器100的表面相对贴合；将所述第二表面132与所述自发光显示面板140的表面相对贴合。
所述光准直面板130用于对反射光进行准直，只允许特定角度范围(比如50°到55°范围内)的光线能够大部分透过光准直面板130，其他角度的光绝大部分都被吸收掉。从而减少所述光学传感器100所采集反射光中的杂散光，有利于改善所获得指纹图像的质量。
如图3所示，本实施例中，所述光准直面板130具有相背设置且相互平行的第一表面131和第二表面132；所述光准直面板130包含：多个光准直单元(图中未标示)，所述光准直单元与所述第一表面131和所述第二表面132所成夹角为第一夹角(图中未示出)，所述第一夹角大于或等于40°且小于或等于90°；所述光准直单元包括芯层(图中未示出)和皮层(图中未示出)，所述芯层均匀分布于所述第一表面和所述第二表面之间，所述皮层填充于相邻芯层之间；所述芯层相互之间呈均匀间隔分布，所述皮层包围所述芯层。
本实施例中，所述光准直面板130主要利用光准直单元的芯层来穿过光线，而皮层则用于吸收光线，芯层和皮层配合，从而达到上述光准直、减少杂散光的作用。
由芯层的作用可知，芯层对可见光的吸收率越低越好。为保证穿过的光线强度足够，本实施例中，所述芯层材料对可见光的吸收率小于20％。由皮层的作用可知，皮层对可见光的吸收率越高越好，或者说，皮层对可见光的吸收率则宜较高，以便对特定角度之外的光线进行吸收。为保证对相应光线进行有效吸收，本实施例中，所述皮层材 料对可见光的吸收率大于50％。所以，光线(可见光)进入光准直面板130后通常只分成两种情况：第一种情况，被皮层吸收；第二种情况，沿着芯层穿过光准直面板130。
本实施例中，所述芯层的高宽比大于10。所述芯层的高宽比不宜太小。所述芯层的高宽比如果太小，则所述芯层的高度过小，宽度过大，不利于保证所述芯层对光线的准直效果。
此外，相临相邻芯层之间的距离小于30μm。相临芯层之间的距离不宜太大。相临芯层之间距离如果太大，则会使所述芯层的高宽比过小，不利于所述芯层对光线的准直效果。
需要说明的是，本实施例中，所述光准直面板130的厚度小于0.5mm。所述光准直面板130的厚度不宜太大，所述光准直面板130的厚度如果太大，会影响整个所述显示模组厚度的控制，可能会造成所形成显示模组厚度过大的问题。所以将所述光准直面板130的厚度设置为小于0.5mm的做法，能够保证所述显示模组的薄化，有利于所述显示模组整体厚度的控制。
继续参考图3，本实施例中，提供光准直面板130之后，将所述光准直面板130的第一表面131与所述光学传感器100的表面相对贴合之前，还包括：在所述第一表面131上形成滤光层170；在所述滤光层170上形成粘附层160；将所述光学传感器100的表面与所述粘附层160的表面相对贴合。
滤光层170用于滤除环境光，以改善所获的指纹图像的质量。
由所述滤光层170的作用可知，所述滤光层170对红外光的吸收率越高越好。为保证对环境光较好的滤除作用，本实施例中，所述滤光层170对近红外光的吸收率大于50％。此外，由指纹图像获得的原理可知，所述滤光层170对可见光透过率越高越好。为了保证所述指纹图像的获得，本实施例中，所述滤光层170对可见光的透过率大于50％。所以，所述滤光层170即能够有效去除环境光，特别是环境光 中的红外光，又能够有效保证可见光的透射，保证清晰指纹图像的获得。
具体的，所述滤光层170为油墨层，可以通过丝网印刷的方式形成所述滤光层170。
本实施例中，所述滤光层170的厚度小于20μm。所述滤光层170的厚度不宜太大。所述滤光层170的厚度如果太大，可能影响所形成显示模组的整体厚度，不利于所形成显示模组厚度的减小。
所述粘附层160用于实现所述光准直面板130与所述光学传感器100之间的贴合连接。
本实施例中，所述粘附层160的材料为透明光学胶，从而能够有效降低所述滤光层160对指纹图像获得的影响，有利于高质量指纹图像的采集。
本实施例中，所述粘附层160的厚度小于或等于50μm。所述粘附层160的厚度不宜太大。所述滤光层170的厚度如果太大，可能影响所形成显示模组的整体厚度，不利于所形成显示模组厚度的减小。
在所述光准直面板130上形成所述滤光层170，并通过所述粘附层160实现与所述光学传感器100的贴合连接；这种做法，能够避免所述光学传感器100受到所述滤光层170形成工艺的影响，特别是能够避免所述光学传感器100受到所述滤光层170形成过程中的高温影响，有利于维持所述光学传感器100的性能。
参考图4，提供保护盖板150和位于所述保护盖板150表面的自发光显示面板140。
所述保护盖板150覆盖所述自发光显示面板140以及所述光学传感器，起到保护作用；所述自发光显示面板140用于实现图像显示功能。
本实施例中，所述保护盖板150为所述自发光显示面板140的盖板 玻璃。
本实施例中，所述自发光显示面板140包括第一透光基板(图中未标示)、第二透光基板(图中未标示)和自发光电路层(图中未标示)。自发光电路层位于第一透光基板和第二透光基板之间。
所述自发光显示面板140包括多个发光单元(图中未标示)。每个发光单元包括透光区和非透光区，所以光线能够投射所述自发光显示面板140。
需要说明的是，所述透光区面积占所述发光单元面积的5％到20％。所述透光区面积占所述发光单元面积的比例不宜太高也不宜太低。所述透光区面积占所述发光单元面积的比例如果太低，则可能会影响所述自发光显示面板140对光线的透射，可能会影响清晰指纹图像的获得；所述透光区面积占所述发光单元面积的比例如果太高，则可能会影响所述自发光显示面板140的自发光性能，不利于所述显示模组图像显示功能的实现。
具体的，所述自发光显示面板140可以为OLED显示面板，所以所述自发光电路层的显示像素单元可以包括阳极层、空穴注入层(HIL)、发光层(EML)、电子注入层(EIL)和阴极层等结构，还可以具有空穴传输层(HTL)和电子传输层(ETL)，还可以包括驱动OLED的TFT、驱动金属线和存储电容等结构。所述自发光显示面板140的具体技术方案与现有技术相同，本发明在此不再赘述。
结合参考图5，将所述自发光显示面板140和所述光学传感器100相对贴合。
本实施例中，所述光学传感器100上还贴合有所述光准直面板130，所以所述自发显示面板140的表面与所述光准直面板130的第二表面132相对贴合。具体的，可以通过透明光学胶实现所述自发显示面板140和所述光准直面板130之间的贴合。
需要说明的是，如图4所示，本实施例中，在形成所述光学传感 器100之后，在将所述自发光显示面板140和所述光学传感器100相对贴合之前，所述形成方法还包括：在所述柔性塑料基板110的背面111上贴合补强板103。
由于所述柔性塑料基板110容易发生形变，可能会存在机械支撑不足的问题，所以所述补强板103用于在工艺过程中提供额外的机械支撑。
本实施例中，所述补强板103的材料为不锈钢，可以通过双面胶贴合于所述柔性塑料基板110的背面111上。具体的，所述补强板103的厚度小于或等于0.2mm。
此外，为了有效控制所形成显示模组的整体厚度，尽量减小所形成显示模组的厚度，本实施例中，在将所述自发光显示面板140和所述光学传感器100相对贴合之后，所述形成方法还包括：去除所述补强板103。
需要说明的是，在将所述自发光显示面板140和所述光学传感器100相对贴合之后，还包括：通过柔性电路板170将所述光学传感器100与信号读出芯片160相连。具体的，所述柔性电路板170一端通过各向异性导电膜(Anisotropic Conductiveadhesive Film，ACF)与所述柔性塑料基板110相连；另一端与所述信号读出芯片160相连。
如图5所示，所述保护盖板150背向所述自发光显示面板140的表面为感测面151，所述自发光显示面板140所产生光线在所述感测面151上形成携带有指纹信息的反射光；所述光学传感器100用于采集所述反射光以获得指纹图像。
本实施例中，所述自发光显示面板140所产生的光线，在所述感测面151上发生反射和折射；在手指按压在所述感测面151上时，发生反射的光线形成携带有指纹信息的反射光；所述反射光透射所述自发光显示面板140，经所述光准直面板130准直，投射至所述光学传感器100上；所述光学传感器100采集所述反射光，以获得指纹图像。
相应的，参考图5，示出了本发明显示模组一实施例的剖面结构示意图。
所述显示模组包括：
光学传感器100，所述光学传感器100包括柔性塑料基板110和位于所述柔性塑料基板110上的器件层120；自发光显示面板140，位于所述光学传感器100上方；保护盖板150，位于所述自发光面板140上方；所述保护盖板150背向所述自发光显示面板140的表面为感测面151，所述自发光显示面板140所产生光线在所述感测面151上形成携带有指纹信息的反射光；所述光学传感器100用于采集所述反射以获得指纹图像。
所述柔性塑料基板110用于构成所述光学传感器100，为所述器件层120的形成提供工艺操作平台和基础。
由于所述柔性塑料基板110的材质往往是高分子聚合物，具有较高的韧性，在厚度较小的情况下也不易发生破损，因此在所述柔性塑料基板110上形成所述光学传感器，能够有效减小所形成光学传感器的厚度，还能够降低所述光学传感器形成过程中的良率损失，有利于实现制造良率和模组薄化的兼顾。
本实施例中，所述柔性塑料基板110的厚度小于或等于0.2mm。所述柔性塑料基板110的厚度不宜太大。所述柔性塑料基板110的厚度如果太大，则会造成所形成光学传感器厚度过大，会影响所形成显示模组的厚度减小，不利于模组薄化。
本实施例中，所述柔性塑料基板110的材料为聚酰亚胺(Polyimide，PI)塑料或聚对苯二甲酸类(Polyethylene Terephthalate，PET)塑料。
聚酰亚胺塑料或聚对苯二甲酸类塑料具有较好的机械性能，较强的韧性，即使在厚度小于或等于0.2mm的情况下，也能够保持较小的破损率，所以将所述柔性塑料基板的材料设置为聚酰亚胺塑料或聚 对笨二甲酸类塑料，能够有效减小所述光学传感器的厚度，还能够维持较好的制造良率；此外，聚酰亚胺塑料或聚对笨二甲酸类塑料还具有较好的热稳定性能，能够耐高温，能够承受半导体制造工艺过程中的各种工艺条件，有利于保证所述光学传感器的性能，有利于更好的实现指纹识别和图像显示功能的集成，有利于兼顾高良率和小厚度的技术要求；而且，聚酰亚胺塑料或聚对笨二甲酸类塑料还有较好的隔离性能，能够有效防止水汽渗透进入所述显示模组内部，有利于所形成显示模组稳定性的提高。
需要说明的是，本实施例中，所述柔性塑料基板110具有相背设置的操作面112和背面111，所述操作面112用于形成所述器件层120，以构成所述光学传感器100。
所述器件层120与所述柔性塑料基板110一起，用于构成所述光学传感器100。所述器件层120内具有感光器件，用于采集所述反射光以获得指纹图像。
需要说明的是，由于所述柔性塑料基板110为塑料材质，因此本实施例中，所述光学传感器100为基于非晶硅薄膜晶体管(Amorphous Silicon Thin Film Transistor，a-Si:H TFT)的光学传感器。但是本发明其他实施例中，所述光学传感器也可以是基于低温多晶硅薄膜晶体管(LowTemperature Poly Si Thin Film Transistor，LTP-Si TFT)的光学传感器或者基于铟镓锌氧化物薄膜晶体管(Indium Gallium Zinc Oxide Thin Film Transistor，IGZO TFT)的光学传感器。
所述器件层120包括：位于所述柔性塑料基板110上的感光器件122；以及，覆盖所述感光器件122和至少部分所述基板110的保护层121。
本实施例中，所述光学传感器100包括感光像素，每个所述感光像素中的感光器件122是非晶硅PIN光电二极管，也就是说，每个感光像素的器件层120内的感光器件122为非晶硅PIN光电二极管。
本实施例中，由于所述柔性塑料基板110为塑料材质，因此所述保护层121的材料为非晶态的氧化硅和非晶态的氮化硅中的一种或两种。
如图5所示，本实施例中，所述显示模组还包括：光准直面板130，所述光准直面板130位于所述光学传感器100和所述自发光显示面板140之间。
所述光准直面板130用于对反射光进行准直，从而减小所述光学传感器100所采集反射光的入射角，有利于改善所获得指纹图像的质量。
本实施例中，所述光准直面板130具有相背设置且相互平行的第一表面131和第二表面132；所述光准直面板130包含：多个光准直单元(图中未标示)，所述光准直单元与所述第一表面131和所述第二表面132所成夹角为第一夹角(图中未示出)，所述第一夹角大于或等于40°且小于或等于90°；所述光准直单元包括芯层(图中未示出)和皮层(图中未示出)，所述芯层均匀分布于所述第一表面和所述第二表面之间，所述皮层填充于相邻芯层之间；所述芯层相互之间呈均匀间隔分布，所述皮层包围所述芯层。
所述光准直面板130主要利用光准直单元的芯层来穿过光线，而皮层则用于吸收光线，芯层和皮层配合，从而达到上述光准直、减少杂散光的作用。
由芯层的作用可知，芯层对可见光的吸收率越低越好。为保证穿过的光线强度足够，本实施例中，所述芯层材料对可见光的吸收率小于20％。由皮层的作用可知，皮层对可见光的吸收率越高越好，或者说，皮层对可见光的吸收率则宜较高，以便对特定角度之外的光线进行吸收。为保证对相应光线进行有效吸收，本实施例中，所述皮层材料对可见光的吸收率大于50％。所以，光线(可见光)进入光准直面板130后通常只分成两种情况：第一种情况，被皮层吸收；第二种情况，沿着芯层穿过光准直面板130。
本实施例中，所述芯层的高宽比大于10。所述芯层的高宽比不宜太小。所述芯层的高宽比如果太小，则所述芯层的高度过小，宽度过大，不利于保证所述芯层对光线的准直效果。
此外，相临相邻芯层之间的距离小于30μm。相临芯层之间的距离不宜太大。相临芯层之间距离如果太大，则会使所述芯层的高宽比过小，不利于所述芯层对光线的准直效果。
本实施例中，所述光准直面板130的厚度小于0.5mm。所述光准直面板130的厚度不宜太大，所述光准直面板130的厚度如果太大，会影响整个所述显示模组厚度的控制，可能会造成所形成显示模组厚度过大的问题。所以将所述光准直面板130的厚度设置为小于0.5mm的做法，能够保证所述显示模组的薄化，有利于所述显示模组整体厚度的控制。
需要说明的是，本实施例中，所述光准直面板130和所述光学传感器100之间，所述显示模组还包括：粘附层160，位于所述光学传感器100上；滤光层170，位于所述粘附层160上，即所述粘附层160和所述滤光层170依次位于所述光学传感器100和所述光准直面板130之间。
滤光层170用于滤除环境光，以改善所获的指纹图像的质量。
由所述滤光层170的作用可知，所述滤光层170对红外光的吸收率越高越好。为保证对环境光较好的滤除作用，本实施例中，所述滤光层170对近红外光的吸收率大于50％。此外，由指纹图像获得的原理可知，所述滤光层170对可见光透过率越高越好。为了保证所述指纹图像的获得，本实施例中，所述滤光层170对可见光的透过率大于50％。所以，所述滤光层170即能够有效去除环境光，特别是环境光中的红外光，又能够有效保证可见光的透射，保证清晰指纹图像的获得。
具体的，本实施例中，所述滤光层170为油墨层。
所述滤光层170的厚度小于20μm。所述滤光层170的厚度不宜太大。所述滤光层170的厚度如果太大，可能影响所形成显示模组的整体厚度，不利于所形成显示模组厚度的减小。
所述粘附层160用于实现所述光准直面板130与所述光学传感器100之间的贴合连接。
本实施例中，所述粘附层160的材料为透明光学胶，从而能够有效降低所述滤光层160对指纹图像获得的影响，有利于高质量指纹图像的采集。
本实施例中，所述粘附层160的厚度小于或等于50μm。所述粘附层160的厚度不宜太大。所述滤光层170的厚度如果太大，可能影响所形成显示模组的整体厚度，不利于所形成显示模组厚度的减小。
在所述光准直面板130上形成所述滤光层170，并通过所述粘附层160实现与所述光学传感器100的贴合连接；这种做法，能够避免所述光学传感器100受到所述滤光层170形成工艺的影响，特别是能够避免所述光学传感器100受到所述滤光层170形成过程中的高温影响，有利于维持所述光学传感器100的性能。
所述保护盖板150覆盖所述自发光显示面板140以及所述光学传感器，起到保护作用；所述自发光显示面板140用于实现图像显示功能。
本实施例中，所述保护盖板150为所述自发光显示面板140的盖板玻璃。
本实施例中，所述自发光显示面板140包括第一透光基板(图中未标示)、第二透光基板(图中未标示)和自发光电路层(图中未标示)。自发光电路层位于第一透光基板和第二透光基板之间。
所述自发光显示面板140包括多个发光单元(图中未标示)。每个发光单元包括透光区和非透光区，所以光线能够投射所述自发光显示面板140。
需要说明的是，所述透光区面积占所述发光单元面积的5％到20％。所述透光区面积占所述发光单元面积的比例不宜太高也不宜太低。所述透光区面积占所述发光单元面积的比例如果太低，则可能会影响所述自发光显示面板140对光线的透射，可能会影响清晰指纹图像的获得；所述透光区面积占所述发光单元面积的比例如果太高，则可能会影响所述自发光显示面板140的自发光性能，不利于所述显示模组图像显示功能的实现。
具体的，所述自发光显示面板140可以为OLED显示面板，所以所述自发光电路层的显示像素单元可以包括阳极层、空穴注入层(HIL)、发光层(EML)、电子注入层(EIL)和阴极层等结构，还可以具有空穴传输层(HTL)和电子传输层(ETL)，还可以包括驱动OLED的TFT、驱动金属线和存储电容等结构。所述自发光显示面板140的具体技术方案与现有技术相同，本发明在此不再赘述。
需要说明的是，本实施例中，所述显示模组还包括：信号读出芯片160，所述信号读出芯片160通过柔性电路板170与所述光学传感器100相连。具体的，所述柔性电路板170一端通过各向异性导电膜与所述柔性塑料基板110相连；另一端与所述信号读出芯片160相连。
如图5所示，所述保护盖板150背向所述自发光显示面板140的表面为感测面151，所述自发光显示面板140所产生光线在所述感测面151上形成携带有指纹信息的反射光；所述光学传感器100用于采集所述反射光以获得指纹图像。
本实施例中，所述自发光显示面板140所产生的光线，在所述感测面151上发生反射和折射；在手指按压在所述感测面151上时，发生反射的光线形成携带有指纹信息的反射光；所述反射光透射所述自发光显示面板140，经所述光准直面板130准直，投射至所述光学传感器100上；所述光学传感器100采集所述反射光，以获得指纹图像。
参考图6和图7，示出了本发明显示模组形成方法另一实施例各个步骤对应的剖面结构示意图。
本实施例与前述显示模组形成方法实施例相同之处，本发明在此不再赘述。本实施例与前述实施例不同之处在于，本实施例中，形成所述器件层220之后，将所述光准直面板230的第一表面231与所述光学传感器200的表面相对贴合之前，还包括：如图6所示，在所述器件层220上形成滤光层270；在所述滤光层270上形成粘附层260；如图7所示，将所述粘附层260的表面与所述第一面231相对贴合。
本实施例中，所述滤光层270为多层介质反射层，通过光波的干涉原理滤除特定波长的环境光。
所述滤光层270包括交替设置的氧化硅层和氧化钛层。光线在照射到所述滤光层270时，会在所述氧化硅层和所述氧化钛层的各个界面处发生反射和透射，所反射的光线和入射的光线之间可能会发生相长干涉，从而提高所反射光线的光强，使更多的能量被所述滤光层270反射，从而降低透射光线的透射率；或者，所反射的光线和入射的光线之间也可能会发生相消干涉，从而减小所反射光线的光强，使更多的能量透过所述滤光层270，从而提高透射光线的透射率。
光线的波长、氧化硅层的厚度和氧化钛层的厚度决定了所反射的光线之间是发生相长干涉还是相消干涉；所以通过所述氧化硅层的厚度和氧化钛层的厚度的设置，使特定波段范围内的光反射率较高，透射率较低；使特定波长范围内的光透射率较高，而反射率较低；从而使所述滤光层能够滤除特定波长范围内的光。
光线在所述氧化硅层和所述氧化钛层的界面处发生反射，所以所述滤光层270中所述氧化硅层的层数和所述氧化钛层的层数之和在5到60范围内。所述滤光层270中所述氧化硅层的层数和所述氧化钛层的层数之和如果过小，则可能会影响所述滤光层270对环境光的滤除效果，不利于提供指纹图像的质量；所述滤光层270中所述氧化硅层的层数和所述氧化钛层的层数之和如果过大，则不利于光线的透射，也可能不利于指纹图像质量的提高，而且所述氧化硅层的层数和所述氧化钛层的层数过多，会增大所述滤光层的厚度，不利于所述显示模 组整体厚度的控制。
此外，本实施例中，所述滤光层270厚度小于5μm。所述滤光层270的整体厚度不宜太大。所述滤光层270的整体厚度如果太大(比如大于10um)，则制作时间会增加，成本会增加。另外，总体厚度太大，总体的膜层应力太大，以至于膜层会破裂和脱落。
本实施例中，所述滤光层270为氧化硅层、氧化钛层交替设置的多层介质反射层；所以所述滤光层270可以通过溅射或蒸镀的方式形成所述滤光层270。
相应的，参考图7，示出了本发明显示模组另一实施例的剖面结构示意图。
本实施例与前述显示模组实施例相同之处，本发明在此不再赘述。本实施例与前述显示模组实施例不同之处在于，本实施例中，所述光准直面板230和所述光学传感器200之间，还包括：滤光层270，位于所述光学传感器200上；粘附层260，位于所述滤光层270上，即所述滤光层270和所述粘附层260依次位于所述光学传感器100和所述光准直面板130之间。
虽然本发明披露如上，但本发明并非限定于此。任何本领域技术人员，在不脱离本发明的精神和范围内，均可作各种更动与修改，因此本发明的保护范围应当以权利要求所限定的范围为准。

Claims (32)

  1. 一种显示模组的形成方法，其特征在于，包括：
    提供柔性塑料基板；
    在所述柔性塑料基板上形成器件层，所述器件层和所述柔性塑料基板用于形成光学传感器；
    提供保护盖板和位于所述保护盖板表面的自发光显示面板；
    将所述自发光显示面板和所述光学传感器相对贴合；
    所述保护盖板背向所述自发光显示面板的表面为感测面，所述自发光显示面板所产生光线在所述感测面上形成携带有指纹信息的反射光；
    所述光学传感器用于采集所述反射光以获得指纹图像。
  2. 如权利要求1所述的形成方法，其特征在于，所述柔性塑料基板的厚度小于或等于0.2mm。
  3. 如权利要求1或2所述的形成方法，其特征在于，所述柔性塑料基板的材料为聚酰亚胺塑料或聚对苯二甲酸类塑料。
  4. 如权利要求1所述的形成方法，其特征在于，所述光学传感器为基于非晶硅薄膜晶体管的光学传感器、基于低温多晶硅薄膜晶体管的光学传感器或基于铟镓锌氧化物薄膜晶体管的光学传感器。
  5. 如权利要求1所述的形成方法，其特征在于，形成所述器件层之后，将所述自发光显示面板和所述光学传感器相对贴合之前，还包括：
    提供光准直面板，所述光准直面板具有相背设置的第一表面和第 二表面；
    将所述第一表面与所述光学传感器的表面相对贴合；
    将所述第二表面与所述自发光显示面板的表面相对贴合。
  6. 如权利要求5所述的形成方法，其特征在于，所述光准直面板的厚度小于0.5mm。
  7. 如权利要求5所述的形成方法，其特征在于，提供光准直面板之后，将所述光准直面板的第一表面与所述光学传感器的表面相对贴合之前，还包括：
    在所述第一表面上形成滤光层；
    在所述滤光层上形成粘附层；
    将所述光学传感器的表面与所述粘附层的表面相对贴合。
  8. 如权利要求5所述的形成方法，其特征在于，形成所述器件层之后，将所述光准直面板的第一表面与所述光学传感器的表面相对贴合之前，还包括：
    在所述器件层上形成滤光层；
    在所述滤光层上形成粘附层；
    将所述粘附层的表面与所述第一面相对贴合。
  9. 如权利要求7或8所述的形成方法，其特征在于，所述粘附层的厚度小于或等于50μm。
  10. 如权利要求7或8所述的形成方法，其特征在于，所述滤光层为油墨层或多层介质反射层。
  11. 如权利要求10所述的形成方法，其特征在于，所述滤光层为油墨层；
    通过丝网印刷的方式形成所述滤光层。
  12. 如权利要求10所述的形成方法，其特征在于，所述滤光层为油墨层；
    所述滤光层厚度小于20μm。
  13. 如权利要求10所述的形成方法，其特征在于，所述滤光层为多层介质反射层；
    通过溅射或蒸镀的方式形成所述滤光层。
  14. 如权利要求10所述的形成方法，其特征在于，所述滤光层为多层介质反射层；
    所述滤光层厚度小于5μm。
  15. 一种显示模组，其特征在于，包括：
    光学传感器，所述光学传感器包括柔性塑料基板和位于所述柔性塑料基板上的器件层；
    自发光显示面板，位于所述光学传感器上方；
    保护盖板，位于所述自发光面板上方；
    所述保护盖板背向所述自发光显示面板的表面为感测面，所述自发光显示面板所产生光线在所述感测面上形成携带有指纹信息的反射光；
    所述光学传感器用于采集所述反射以获得指纹图像。
  16. 如权利要求15所述的显示模组，其特征在于，所述柔性塑料基板的材料为聚酰亚胺塑料或聚对苯二甲酸类塑料。
  17. 如权利要求15所述的显示模组，其特征在于，所述柔性塑料基板的厚度小于或等于0.2mm。
  18. 如权利要求15所述的显示模组，其特征在于，所述光学传感器为基于非晶硅薄膜晶体管的光学传感器、基于低温多晶硅薄膜晶体管的光学传感器或基于铟镓锌氧化物薄膜晶体管的光学传感器。
  19. 如权利要求15所述的显示模组，其特征在于，还包括：光准直面板，所述光准直面板位于所述光学传感器和所述自发光显示面板之间。
  20. 如权利要求19所述的显示模组，其特征在于，所述光准直面板具有相背设置且相互平行的第一表面和第二表面；
    所述光准直器面板包含：多个光准直单元，所述光准直单元与所述第一表面和所述第二表面所成夹角为第一夹角，所述第一夹角大于或等于40°且小于或等于90°；
    所述光准直单元包括芯层和皮层，所述芯层均匀分布于第一表面和第二表面之间，所述皮层填充于相邻芯层之间；
    所述芯层相互之间呈均匀间隔分布，所述皮层包围所述芯层。
  21. 如权利要求20所述的显示模组，其特征在于，所述芯层材料对可见光的吸收率小于20％。
  22. 如权利要求20所述的显示模组，其特征在于，所述皮层材 料对可见光的吸收率大于50％。
  23. 如权利要求20所述的显示模组，其特征在于，所述芯层的高宽比大于10。
  24. 如权利要求20所述的显示模组，其特征在于，相邻芯层之间的距离小于30μm。
  25. 如权利要求19所述的显示模组，其特征在于，所述光准直面板和所述光学传感器之间，还包括：
    粘附层，位于所述光学传感器上；
    滤光层，位于所述粘附层上。
  26. 如权利要求19所述的显示模组，其特征在于，所述光准直面板和所述光学传感器之间，还包括：
    滤光层，位于所述光学传感器上；
    粘附层，位于所述滤光层上。
  27. 如权利要求25或26所述的显示模组，其特征在于，所述粘附层的材料为透明光学胶。
  28. 如权利要求25或26所述的显示模组，其特征在于，所述滤光层对近红外光的吸收率大于50％。
  29. 如权利要求25或26所述的显示模组，其特征在于，所述滤光层对可见光的透过率大于50％。
  30. 如权利要求15所述的显示模组，其特征在于，所述自发光 显示面板为OLED显示面板。
  31. 如权利要求15所述的显示模组，其特征在于，所述自发光面板包括多个发光单元，所述发光单元包括透光区，所述透光区面积占所述发光单元面积的5％到20％。
  32. 如权利要求15所述的显示模组，其特征在于，所述光学传感器包括感光像素，每个所述感光像素中的感光器件是非晶硅PIN光电二极管。
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