WO2019049219A1 - Dispositif de rotation de substrat et dispositif de traitement de substrat - Google Patents

Dispositif de rotation de substrat et dispositif de traitement de substrat Download PDF

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Publication number
WO2019049219A1
WO2019049219A1 PCT/JP2017/032008 JP2017032008W WO2019049219A1 WO 2019049219 A1 WO2019049219 A1 WO 2019049219A1 JP 2017032008 W JP2017032008 W JP 2017032008W WO 2019049219 A1 WO2019049219 A1 WO 2019049219A1
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WO
WIPO (PCT)
Prior art keywords
outer frame
inner frame
substrate
magnetic field
container
Prior art date
Application number
PCT/JP2017/032008
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English (en)
Japanese (ja)
Inventor
横田　博
英昭 樋川
Original Assignee
倉敷紡績株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 倉敷紡績株式会社 filed Critical 倉敷紡績株式会社
Priority to PCT/JP2017/032008 priority Critical patent/WO2019049219A1/fr
Publication of WO2019049219A1 publication Critical patent/WO2019049219A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H49/00—Other gearings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to a substrate rotation apparatus or substrate processing apparatus that can be used in a semiconductor manufacturing process or the like.
  • the semiconductor manufacturing process includes many processes of processing the wafer with a chemical solution or the like, such as application / development of a photoresist, etching, and cleaning.
  • a single-wafer type substrate rotating apparatus and an immersion apparatus for immersing the wafer in a treatment tank filled with a chemical solution are used, each having advantages and disadvantages.
  • the immersion method is advantageous in that no static electricity is generated and that the cleaning efficiency can be increased by the addition of ultrasonic vibration.
  • the rotation method has advantages such as a large number of control parameters of the processing conditions and an excellent uniformity of processing within the wafer surface.
  • the rotary plate housed in the closed vessel is magnetically levitated by the type II superconductor disposed below the outside of the vessel, and rotationally driven by the rotating magnetic field coil disposed around the vessel. A magnetic levitation and rotation processing apparatus is described.
  • Patent Document 1 has a problem that the equipment becomes large in order to cool the superconductor, and the container shape is complicated, and there is room for improvement in the workability of maintenance work such as cleaning. was there.
  • the present invention has been made in consideration of the above, and it is an object of the present invention to provide a substrate rotation apparatus which reduces the sources of contamination in the container and is easier to maintain.
  • the substrate rotating apparatus comprises an outer frame body provided with magnetic field generating means and capable of rotating the generated magnetic field around a central axis, a container disposed inside the outer frame body, and disposed in the container
  • An inner frame body including a substrate holding means and magnets or ferromagnetic members dispersed in the circumferential direction, the outer frame body and the inner frame body magnetically coupled to float the inner frame body;
  • a magnetic coupling means for rotating the inner frame following the rotational change of the magnetic field, keeping a constant distance between the outer frame and the inner frame, and making the inner frame concentric with the outer frame.
  • gap adjusting means for maintaining.
  • the central axis of the outer frame is a straight line passing through the center of the outer frame and perpendicular to the surface of the outer frame. Further, rotating the magnetic field about the central axis means changing the magnetic field as if the distribution of the magnetic flux density is rotating about the central axis.
  • the inner ring holding the substrate can be floated and rotated in the container, so that the rotating shaft and the like do not penetrate the container, and the contamination source in the container can be reduced.
  • the inner ring and the outer ring are disposed concentrically in the same plane, a simpler shape can be adopted as the container shape.
  • the magnetic field generation means is an electromagnet distributed in the circumferential direction of the outer frame so as to face the magnet or ferromagnetic material of the inner frame, and the rotation of the magnetic field is performed. Is realized by the rotational movement of the outer frame, and the magnetic coupling means is constituted by the magnet or ferromagnetic of the inner frame and the electromagnet of the outer frame.
  • the magnetic field generating means is an electromagnet aligned in the circumferential direction of the outer frame, and rotation of the magnetic field is realized by sequentially changing the polarity of the aligned electromagnets.
  • the magnetic coupling means is composed of the magnet or the ferromagnetic member of the inner frame and the electromagnet of the outer frame.
  • the outer frame is a non-rotating portion occupying the outer circumferential side of the outer frame and an inner circumferential side of the outer frame, and portions having different magnetic permeability are joined in the circumferential direction. It consists of the rotation part formed.
  • the non-rotational part includes electromagnets aligned in the circumferential direction as the magnetic field generating means, wherein rotation of the magnetic field is realized by rotational movement of the rotating part, and the magnetic coupling means is of the inner frame It comprises a magnet or a ferromagnetic body, an electromagnet of the rotating part and the non-rotating part.
  • the outer frame is further rotatable and tiltable around a straight line intersecting the central axis. According to this configuration, the substrate can be rotated while being inclined from the horizontal surface.
  • the outer frame is further translatable in the central axis direction. This makes it easier to mount and remove the substrate.
  • the container has a chemical solution supply unit and a drainage unit at the bottom, and can be processed by storing the chemical solution inside and immersing the substrate held by the inner frame.
  • the chemical solution contains pure water.
  • the substrate can be rotated in a state of being immersed in the chemical solution.
  • the substrate processing apparatus comprises a magnetic field generating means, an outer frame body capable of rotating the generated magnetic field around a central axis, and a container which is disposed inside the outer frame body and can accommodate the processing chemical solution inside.
  • an inner frame body disposed in the container and provided with the substrate holding means and magnets or ferromagnetic members distributed in the circumferential direction, and the outer frame body and the inner frame body are magnetically coupled, Magnetic coupling means for floating the inner frame and rotating the inner frame following the rotational change of the magnetic field, and keeping the distance between the outer frame and the inner frame constant, the inner frame And gap adjusting means for keeping the frame concentric with the outer frame.
  • the inner frame holding the substrate can be floated and rotated in the container, so that the rotary shaft and the like do not penetrate the container and the contamination source in the container can be reduced. It can be reduced.
  • the inner and outer frames are concentrically arranged in the same plane, a simpler container shape can be adopted.
  • FIG. 3 is a vertical cross-sectional view along line AA of FIG. 2; It is a figure which shows the example of the rotation mechanism of an outer ring. It is a figure which shows the structure of an inner ring. It is a figure for demonstrating the usage method of the board
  • a first embodiment of the present invention will be described based on FIGS. 1 to 6.
  • the substrate rotation apparatus of this embodiment can be rotated while immersing a circular substrate in a chemical solution.
  • the substrate rotation device 10 of the present embodiment includes an outer ring (outer frame) 20, a container 40 disposed inside the outer ring, and an inner ring (inner frame disposed in the container). Body) and 50). The substrate 60 is held by the inner ring.
  • the outer ring 20 is provided with a plurality of magnetic coupling electromagnets 23 and a plurality of holding claw driving electromagnets 24 between the outer ring upper member 21 and the outer ring lower member 22.
  • electromagnet simply refers to "magnetic coupling electromagnet 23".
  • the electromagnets 23 are distributed in the circumferential direction of the outer ring 20.
  • an air core solenoid, a solenoid having a permanent magnet or a ferromagnetic core, or the like can be used as the electromagnet 23.
  • a magnetic field is generated by the electromagnet 23.
  • the magnitude of the magnetic force of the electromagnet 23 is controlled by a control device (not shown).
  • the number of electromagnets 23 is three or more.
  • the upper limit of the number of electromagnets 23 is not particularly limited, but is preferably 7 or less, more preferably 3 so as not to complicate the structure.
  • the electromagnets 23 are arranged such that at least one of the triangles having the three electromagnets as apexes is an acute triangle.
  • the electromagnets 23 are preferably arranged to equally divide the circumference of the outer ring.
  • the holding claw driving electromagnet 24 is for driving a holding claw 54 of an inner ring 50 described later.
  • the outer ring 20 is rotatable about a central axis Z.
  • the rotation of the outer ring causes the magnetic field generated by the electromagnet 23 to rotate around the central axis Z.
  • the outer ring can be pivoted and inclined about a straight line intersecting the central axis Z.
  • Such an operation can be realized by the gimbal mechanism. As an example, it is as follows in FIG.
  • the first support frame 61 is horizontally supported by a support mechanism (not shown).
  • the second support frame 62 is supported by the first support frame so as to be rotatable around the X axis, and can be rotated and tilted around the X axis by the first motor 63 (T).
  • the outer ring 20 is disposed on a bearing 65 fixed to a support 64 extending from the second support frame, and is rotated about the Z axis (R) by a belt (68) drive or the like by the second motor 66. As a result, the outer ring can rotate and tilt around the X axis, and can rotate around the Z axis.
  • container 40 is disposed inside outer ring 20 and supported by a support mechanism (not shown).
  • the shape of the container should not interfere with the inclination and rotation of the outer ring and the inner ring.
  • the container shape of this embodiment is a spherical shape whose top and bottom are cut, and even if the outer ring is inclined and rotated, it does not interfere with the outer ring and the inner ring.
  • the container 40 comprises a side wall 41, a lid 42 and a bottom 43, and the side wall constitutes a spherical surface. Bottom portion 43 is joined to the lower end of the side wall portion in a fluid-tight manner.
  • the chemical solution supply pipe 44 and the drainage pipe 45 are connected to the bottom.
  • the lid 42 can also be joined fluid-tightly to the upper end of the side wall. This is because the container itself can be tilted in a state in which the drug solution is stored inside the container.
  • the material of the container 40 is a dielectric having a relative permeability close to 1, which is not corroded by a chemical solution to be used and does not become a contamination source of the substrate.
  • the material of the container is preferably quartz.
  • pure water, ammonia, ammonia / hydrogen peroxide mixed solution, hydrochloric acid, hydrochloric acid / hydrogen peroxide mixed solution, sulfuric acid, sulfuric acid / hydrogen peroxide mixed solution Hydrogen peroxide, ozone water, a mixed solution of hydrofluoric acid and ozone water, a mixture of sulfuric acid and ozone water, and the like are used.
  • isopropyl alcohol, ethanol, methanol or the like is used for the substrate drying process.
  • inner ring 50 is disposed within container 40.
  • the inner ring 50 is provided with a plurality of magnetic coupling permanent magnets 53 and a plurality of holding claws 54 for gripping the substrate between the inner ring upper member 51 and the inner ring lower member 52.
  • the term "permanent magnet” refers to the "magnetic coupling permanent magnet 53".
  • the material of the inner ring upper member 51 and the inner ring lower member 52 is one that does not corrode depending on the chemical solution used and does not become a contamination source of the substrate.
  • the material of the inner ring upper member and the inner ring lower member is preferably quartz.
  • the permanent magnets 53 are distributed in the circumferential direction of the inner ring 50.
  • the number of permanent magnets 53 is three or more.
  • the permanent magnet 53 is disposed to be able to face the electromagnet 23 of the outer ring 20 in a one-on-one manner.
  • the permanent magnet 53 is enclosed in a quartz tube. This structure can be realized, for example, by inserting a permanent magnet into a quartz tube, closing both ends of the quartz tube with a quartz plate, and welding the end face of the quartz tube and the peripheral edge of the quartz plate.
  • the holding claws 54 are distributed in the circumferential direction of the inner ring 50.
  • the holding claw has a through hole 55 perpendicular to the surface of the inner ring, and is rotatable around a pin 56 inserted in the through hole.
  • the pin is fixed to the inner ring upper member 51 and the inner ring lower member 52 by welding or the like.
  • the holding claw driving permanent magnet 58 is embedded in the base end portion 57 of the holding claw, and the entire holding claw is rotated around the pin 56 by suction or repulsion with the holding claw driving electromagnet 24 of the outer ring 20. Do.
  • the tip 59 of the holding claw holds the substrate 60.
  • the number of holding claws 54 is three or more.
  • the upper limit of the number of holding claws is not particularly limited, but preferably 7 or less, more preferably 3 so as not to complicate the structure.
  • the holding claws are arranged such that at least one of the triangles whose apexes are three tips 59 is an acute triangle.
  • the holding claws are preferably arranged such that the tip 59 equally divides the outer periphery of the substrate 60.
  • the material of the holding claw 54 and the pin 56 is one that does not corrode by the chemical solution used and does not become a contamination source of the substrate.
  • the material of the holding claws and the pins is preferably quartz.
  • the electromagnets 23 distributed in the circumferential direction of the outer ring 20 and the permanent magnets 53 of the inner ring 50 face each other in a pair to form a magnetic coupling means.
  • the outer ring and the inner ring are magnetically coupled across the side wall of the container 40, and the inner ring is held floating in the container.
  • the larger the distance between the outer ring and the inner ring the more freedom in device design is preferred.
  • the feasible distance depends on the weight of the inner ring, the magnitude of the magnetic force of the electromagnet 23 and the permanent magnet 53, etc. According to the experimental results of the present inventors, the distance is increased to about 40 mm using a generally available material. be able to.
  • the distance between the outer ring 20 and the inner ring 50 is unstable only by the magnetic coupling means. Therefore, by detecting the distance between the outer ring and the inner ring by a sensor and adjusting the magnetic force of the electromagnet 23, the distance is kept constant. This keeps the inner ring concentric with the outer ring in the same plane.
  • the sensor detects the distance between the outer ring and the inner ring in at least three places. Preferably, detection at the position of the electromagnet 23 and the permanent magnet 53 facilitates control of the magnetic force of the electromagnet 23.
  • a sensor for example, a laser displacement sensor can be provided on the outer ring.
  • the lid of the container 40 is removed and opened upward, the substrate 60 is held by the robot arm 71 or the like and inserted into the container, and the substrate is lowered to a predetermined position (FIG. 6A).
  • the holding claws of the inner ring 50 grip the substrate.
  • the robot arm is pulled upward.
  • the lid 42 is attached to the container in a liquid-tight manner, and the outer ring 20 is tilted to tilt the inner ring and the substrate 60.
  • the chemical solution 46 (sulfuric acid / hydrogen peroxide mixed solution, etc.) is supplied from the chemical solution supply pipe 44 at the bottom of the container to fill the inside of the container (FIG. 6B).
  • the substrate 60 While the substrate 60 is immersed in the chemical solution, it is rotated about the central axis Z of the outer ring to process the substrate (FIG. 6C). After substrate processing, the container 40 and the outer ring 20 are tilted to further tilt the substrate, preferably to stand vertically (FIG. 6D). The chemical solution is drained from the drainage pipe 45 at the bottom of the container (FIG. 6E). The substrate 60 is returned to horizontal (FIG. 6F). Thereafter, the lid of the container is removed, and the substrate is taken out by a robot arm or the like.
  • a second embodiment of the present invention will be described based on FIG.
  • the present embodiment differs from the first embodiment in that the magnetic field is rotated using the principle of the linear motor.
  • the outer ring 25 in the substrate processing apparatus 11 of the present embodiment includes electromagnets 26 aligned in the circumferential direction as magnetic field generating means. Then, the outer ring itself does not rotate around the central axis, but with the outer ring stationary, the magnetic field is rotated by sequentially turning on and off the electromagnet 26 in the circumferential direction or reversing the polarity. Thereby, the inner ring 50 is rotated following the rotational change of the magnetic field by attraction and / or repulsion between the electromagnet 26 and the permanent magnet 53.
  • the holding claw 54 is driven by an electromagnet (26A in FIG. 7) at a position facing the holding claw driving permanent magnet 58 among the electromagnets 26. Specifically, when opening and closing the holding claw 54 when the inner ring 50 is stopped, the polarity of the electromagnet 26A at a position facing the holding claw driving permanent magnet 58 is appropriately reversed. Then, during rotation of the inner ring, the polarity and the magnetic force of the electromagnet 26 are controlled so that the holding claw holds the substrate.
  • the configurations of the other parts of the outer ring 20, the container 40 and the inner ring 50 are the same as in the first embodiment.
  • the rotation mechanism and the like of the outer ring become unnecessary, and the device structure can be simplified.
  • a third embodiment of the present invention will be described based on FIG.
  • the present embodiment is different from the first embodiment in that the outer frame includes a non-rotating portion and a rotating portion.
  • the outer frame body 30 in the substrate processing apparatus 12 of the present embodiment includes a non-rotating portion 31 occupying the outer peripheral side and a rotating portion 33 occupying the inner peripheral side.
  • the rotating portion 33 is mechanically joined to the non-rotating portion via a support mechanism such as a bearing (not shown), and both are arranged concentrically in the same plane, and the relative positional relationship remains unchanged.
  • the non-rotating unit 31 includes electromagnets 32 aligned in the circumferential direction as magnetic field generating means.
  • the rotating portion 33 is formed by joining portions having different magnetic permeability along the circumferential direction.
  • the dark portion in FIG. 8 is a portion 34 with high permeability, and is made of, for example, a ferromagnetic material or a permanent magnet.
  • the light colored portion in FIG. 8 is a portion 35 with low permeability, and is made of, for example, various dielectrics.
  • the lines of magnetic force of the electromagnet 32 easily pass through the high permeability portion 34, so the magnetic flux density is high inside the high permeability portion 34 of the rotating portion 33. Conversely, the magnetic flux density is low inside the low magnetic permeability portion 35 of the rotating portion 33.
  • the high magnetic permeability portion 34 is disposed so as to be able to face the permanent magnet 53 distributed in the circumferential direction of the inner ring 50 and the permanent magnet 58 for driving a holding claw.
  • the electromagnet 32 of the non-rotating portion 31, the high magnetic permeability portion 34 of the rotating portion 33, and the permanent magnet 53 of the inner ring 50 are magnetically coupled, and the inner ring is held floating in the container 40. Further, when the non-rotating portion 31 is stationary, the rotating portion 33 rotationally moves around the central axis Z, whereby the magnetic field is rotated, and the inner ring is rotated following the rotational change of the magnetic field.
  • the driving method of the holding claw 54 is the same as that of the second embodiment. That is, when the holding claw 54 is opened and closed when the inner ring 50 is stopped, the polarity of the electromagnet 32A at the position facing the holding claw driving permanent magnet 58 is appropriately reversed.
  • the non-rotation portion 31 in which the electromagnet 32 is disposed does not rotate, wiring of the electromagnet 32 can be simplified.
  • the substrate rotation apparatus of the first to third embodiments has the advantages of the conventional immersion type substrate processing apparatus and the rotary type substrate processing apparatus.
  • the immersion method there is no problem of static electricity, and the addition of ultrasonic vibration makes it possible to improve the cleaning effect.
  • the uniformity of processing within the substrate surface is improved by rotating the substrate.
  • the substrate since the substrate is rotated in a state of being immersed in the chemical solution, it is possible to expect a lift-off effect in which dirt attached to the surface of the substrate is easily peeled off from the surface particularly in the cleaning step.
  • the shapes of the inner and outer frames are not limited to this, and may be, for example, a regular octagon or other polygons. .
  • the inner frame is provided with the magnetic coupling permanent magnet 53 and the holding claw driving permanent magnet 58, but a permanent magnet may be used instead of the permanent magnet.
  • the freedom of rotation of the outer frame in each of the above embodiments is 2, but the outer frame The degree of freedom of rotation may be three. That is, the outer frame may be rotatable about the central axis and may be pivotable and tiltable about two straight lines intersecting the central axis. This allows the substrate to be processed while moving more complexly.
  • the degree of freedom of rotation of the outer frame may be one. That is, although the outer frame is rotatable around the central axis, the outer frame may not be inclined, and the direction of the central axis may be fixed. This can simplify the device structure.
  • the shape of the container may be substantially cylindrical rather than spherical. Even if the container is cylindrical, it does not interfere with the rotation of the outer frame and the inner frame. In this case, preferably, by centering the central axis not vertically but obliquely, it is difficult for the chemical solution or the like to remain on the substrate when the chemical solution is discharged.
  • the outer frame may also be translatable in the direction of its central axis. This facilitates mounting and removal of the substrate.
  • the substrate rotation apparatus of the present invention can be used as a substitute for a conventional substrate rotation apparatus such as a spin coater without immersing the substrate in a chemical solution.
  • a conventional substrate rotation apparatus such as a spin coater
  • processing conditions closer to the optimum can be selected. Even if the degree of freedom of rotation is 1, the rotary shaft and the like do not penetrate the container, and the source of contamination in the container can be reduced.
  • the substrate rotation apparatus of the present invention can be used in a dry process that does not use a chemical solution. In that case, provide the container with the required airtightness.

Abstract

Le problème décrit par la présente invention est de pourvoir à un dispositif de rotation de substrat avec lequel une source de contamination dans un contenant puisse être réduite et qui soit plus facile à entretenir. La solution selon l'invention porte sur un dispositif de rotation de substrat 10 qui comprend : un corps de structure externe 20 qui est pourvu d'un moyen de génération de champ magnétique et qui peut faire tourner autour d'un axe central un champ magnétique généré ; un contenant 40 disposé à l'intérieur du corps de structure externe ; un corps de structure interne 50 qui est disposé dans le contenant et est pourvu d'un moyen de retenue de substrat 60 et d'aimants ou de matériaux ferromagnétiques répartis de manière circonférentielle ; un moyen de couplage magnétique qui couple magnétiquement le corps de structure externe au corps de structure interne pour faire flotter le corps de structure interne, et qui fait tourner le corps de structure interne de manière à suivre la variation rotative du champ magnétique ; et un moyen d'ajustement d'écartement qui maintient un intervalle constant entre le corps de structure externe et le corps de structure interne, et qui maintient le corps de structure interne concentrique avec le corps de structure externe.
PCT/JP2017/032008 2017-09-05 2017-09-05 Dispositif de rotation de substrat et dispositif de traitement de substrat WO2019049219A1 (fr)

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PCT/JP2017/032008 WO2019049219A1 (fr) 2017-09-05 2017-09-05 Dispositif de rotation de substrat et dispositif de traitement de substrat

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PCT/JP2017/032008 WO2019049219A1 (fr) 2017-09-05 2017-09-05 Dispositif de rotation de substrat et dispositif de traitement de substrat

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11179306A (ja) * 1997-12-24 1999-07-06 Dainippon Screen Mfg Co Ltd 枚葉式洗浄装置
JPH11354617A (ja) * 1998-06-10 1999-12-24 Sumiere Sez Kk 基板処理装置および基板処理方法
JP2006237084A (ja) * 2005-02-22 2006-09-07 Kokusai Electric Semiconductor Service Inc 熱処理装置及び熱処理方法
JP2013062417A (ja) * 2011-09-14 2013-04-04 Toshiba Corp 半導体基板の超臨界乾燥方法及び装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11179306A (ja) * 1997-12-24 1999-07-06 Dainippon Screen Mfg Co Ltd 枚葉式洗浄装置
JPH11354617A (ja) * 1998-06-10 1999-12-24 Sumiere Sez Kk 基板処理装置および基板処理方法
JP2006237084A (ja) * 2005-02-22 2006-09-07 Kokusai Electric Semiconductor Service Inc 熱処理装置及び熱処理方法
JP2013062417A (ja) * 2011-09-14 2013-04-04 Toshiba Corp 半導体基板の超臨界乾燥方法及び装置

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