WO2019047580A1 - 触控基板及其制备方法、显示面板 - Google Patents

触控基板及其制备方法、显示面板 Download PDF

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Publication number
WO2019047580A1
WO2019047580A1 PCT/CN2018/090604 CN2018090604W WO2019047580A1 WO 2019047580 A1 WO2019047580 A1 WO 2019047580A1 CN 2018090604 W CN2018090604 W CN 2018090604W WO 2019047580 A1 WO2019047580 A1 WO 2019047580A1
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WIPO (PCT)
Prior art keywords
substrate
sub
electrode
conductive
touch
Prior art date
Application number
PCT/CN2018/090604
Other languages
English (en)
French (fr)
Inventor
张贵玉
胡小娟
王静
谢晓冬
许邹明
张雷
Original Assignee
京东方科技集团股份有限公司
合肥鑫晟光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 京东方科技集团股份有限公司, 合肥鑫晟光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/339,447 priority Critical patent/US10705662B2/en
Priority to JP2019548456A priority patent/JP7214642B2/ja
Priority to EP18853025.7A priority patent/EP3680759B1/en
Publication of WO2019047580A1 publication Critical patent/WO2019047580A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate

Definitions

  • At least one embodiment of the present disclosure relates to a touch substrate, a method of fabricating the same, and a display panel.
  • At least one embodiment of the present disclosure provides a touch substrate including: a substrate including a touch area and a lead area around the touch area; and a plurality of first electrode strips disposed side by side in the touch area On the substrate, each of the first electrode strips includes a plurality of spaced apart first sub-electrodes; and a plurality of conductive bridges disposed on the substrate of the touch area, each of the first Any two adjacent first sub-electrodes of the electrode strip are electrically connected by one of the conductive bridges; wherein each of the conductive bridges includes a body portion and a branch portion directly connected to each other, at least the body portion At least two of the branches are provided at one end.
  • the touch substrate provided by at least one embodiment of the present disclosure further includes: a plurality of second electrode strips disposed side by side on the substrate of the touch area, each of the second electrode strips and each of the The first electrode strip is disposed in the same layer, and the extension line where the first electrode strip is located and the extension line where the second electrode strip is located cross each other, and each of the second electrode strips includes a plurality of second intervals a sub-electrode and a connection portion connecting the adjacent second sub-electrodes; wherein the connection portion overlaps at least a portion of the main body portion of the conductive bridge in a direction perpendicular to a surface of the substrate.
  • each of the conductive bridges and the branch portion are disposed in different layers in a direction perpendicular to a plane of the substrate
  • Each of the branch portions and the first sub-electrode partially overlapping the same are in direct contact with each other and electrically connected.
  • each of the branch portions contacts the corresponding first sub-electrode.
  • the touch substrate provided by at least one embodiment of the present disclosure further includes: an insulating layer disposed between the connecting portion of the plurality of second electrode strips and the plurality of conductive bridges, wherein the insulating layer a plurality of sub-insulating layers spaced apart from each other, the sub-insulating layers being disposed in one-to-one correspondence with the conductive bridge, and at least a portion of the orthographic projection of the main body portion on the substrate is located at the sub-insulating layer Within the orthographic projection on the substrate, the orthographic projection of the branch on the substrate is outside the orthographic projection of the sub-insulating layer on the substrate.
  • an edge of the sub-insulating layer that is in contact with the surface of the substrate and is away from the surface of the connecting portion and is in contact with the conductive bridge is curved.
  • the planar shape of the sub-insulating layer is circular or elliptical in a plane parallel to the surface of the substrate.
  • the main body portion and the branch portion of each of the conductive bridges are disposed in the same layer.
  • the touch substrate provided by at least one embodiment of the present disclosure further includes: an insulating layer disposed between the connecting portion of the plurality of second electrode strips and the plurality of conductive bridges, where the insulating layer is disposed There is a via, wherein the first sub-electrode and the conductive bridge are electrically connected through the via.
  • an edge of each of the branch portions is curved in a plane parallel to a surface of the substrate.
  • an angle between adjacent two of the branch portions is 30 degrees to 60 degrees at the same end of the main body portion.
  • At the same end of the main body portion at least two of the branch portions are symmetrically disposed about an axis of the extension of the main body portion.
  • the main body portion includes at least two conductive strips arranged in parallel, and one end of each of the conductive strips is provided with at least one of the branch portions.
  • the conductive bridge is disposed on a side of the first electrode strip adjacent to the substrate; or the conductive bridge is disposed on the first electrode The side of the strip that is remote from the substrate.
  • At least one embodiment of the present disclosure provides a display panel including the touch substrate in any of the above embodiments.
  • At least one embodiment of the present disclosure provides a method of fabricating a touch substrate, including: providing a substrate, the substrate including a touch area and a lead area around the touch area; Forming a plurality of first electrode strips arranged side by side on the substrate; and forming a plurality of conductive bridges on the substrate of the touch area; wherein each of the first electrode strips comprises a plurality of spaced apart regions a first sub-electrode, any two adjacent ones of the first electrode strips are electrically connected by one of the conductive bridges, and the conductive bridge includes a body portion and a minute directly connected to each other At least one end of the main body portion is provided with at least two of the branch portions.
  • the preparation method provided by at least one embodiment of the present disclosure further includes: forming a plurality of second electrode strips arranged side by side on the substrate of the touch area; wherein the second electrode strip and the The first electrode strips are in the same layer and are arranged to cross each other, each of the second electrode strips comprising a plurality of spaced apart second sub-electrodes and a connection connecting adjacent the second sub-electrodes, and perpendicular to the The connecting portion at least partially overlaps the body portion in a direction in which the substrate is located.
  • Forming a plurality of conductive bridges includes: depositing a thin film of insulating material on the substrate on which the first electrode strip and the second electrode strip are formed and patterning the same to form an insulating layer including a plurality of sub-insulating layers; Depositing a thin film of a conductive material on the substrate on which the insulating layer is formed and patterning the same to form the conductive bridge, the sub-insulating layer being disposed in one-to-one correspondence with the conductive bridge; wherein the conductive The corrosion resistance of the preparation material of the bridge is less than the corrosion resistance of the preparation material of the second electrode strip and the first electrode strip, and in the direction perpendicular to the plane of the substrate, the main body portion is in the An orthographic projection on the substrate is at least partially within an orthographic projection of the sub-insulating
  • Forming a plurality of conductive bridges includes: depositing a thin film of insulating material on the substrate on which the first electrode strip and the second electrode strip are formed and patterning the same to form an insulating layer including a plurality of sub-insulating layers; Providing a first mask through which a conductive material is deposited on the substrate to form a plurality of the conductive bridges, the sub-insulating layers being disposed in one-to-one correspondence with the conductive bridge; wherein, in a vertical An orthographic projection of the body portion on the substrate is at least partially within an orthographic projection of the sub-insulating layer on the substrate in a direction in which the substrate is located, the branch portion being An orthographic projection on the substrate is outside the orthographic projection of the sub-insulating layer on the substrate.
  • the main body portion and the branch portion of each of the conductive bridges are disposed in the same layer, and a plurality of conductive bridges are formed on the substrate of the touch control region.
  • the method includes: depositing a thin film of an insulating material on the substrate on which the first electrode strip is formed to form the insulating layer; and patterning the insulating layer to form a via hole in the insulating layer, a hole exposing a partial region of the first sub-electrode; and depositing a thin film of a conductive material on the insulating layer and patterning the same to form the conductive bridge, the branch portion of the conductive bridge passing through the via Electrically connected to the first sub-electrode.
  • the main body portion and the branch portion of each of the conductive bridges are disposed in the same layer, and a plurality of conductive bridges are formed on the substrate of the touch control region.
  • the method comprises: depositing a thin film of a conductive material on the substrate and patterning the same to form the conductive bridge; depositing a thin film of insulating material on the substrate on which the conductive bridge is formed to form an insulating layer;
  • the insulating layer performs a patterning process to form a via hole in the insulating layer, the via hole exposing a partial region of the conductive bridge, and forming a plurality of first rows arranged side by side on the substrate of the touch control region
  • the electrode strip includes: depositing a thin film of a conductive material on the insulating layer and patterning the same to form the plurality of first electrode strips, and any two adjacent first sub-electrodes passing through the via holes
  • the conductive bridge is electrically connected.
  • 1A is a plan view of a touch substrate according to an embodiment of the present disclosure
  • FIG. 1B is a partial structural view of a region A of the touch substrate shown in FIG. 1A;
  • FIG. 1C is a cross-sectional view of the touch substrate shown in FIG. 1B along M-N;
  • FIG. 1D is a schematic structural view of the conductive bridge shown in FIG. 1B;
  • FIG. 2A is another schematic structural diagram of a conductive bridge of a touch substrate according to an embodiment of the present disclosure
  • 2B is another schematic structural diagram of a conductive bridge of a touch substrate according to an embodiment of the present disclosure
  • 3A is a partial cross-sectional view of another touch substrate according to an embodiment of the present disclosure.
  • FIG. 3B is a partial cross-sectional view of another touch substrate according to an embodiment of the present disclosure.
  • FIG. 4 is a partial schematic structural diagram of another touch substrate according to an embodiment of the present disclosure.
  • FIG. 5 is a partial schematic structural diagram of another touch substrate according to an embodiment of the present disclosure.
  • 6A-6B are process diagrams of a method for fabricating a touch substrate according to an embodiment of the present disclosure
  • FIG. 7 is another process diagram of a method for preparing a touch substrate according to an embodiment of the present disclosure.
  • 8A-8B are still further process diagrams of a method for preparing a touch substrate according to an embodiment of the present disclosure.
  • 9A-9B are still further process diagrams of a method for fabricating a touch substrate according to an embodiment of the present disclosure.
  • At least one embodiment of the present disclosure provides a touch substrate including: a substrate including a touch area and a lead area around the touch area; and a plurality of first electrode strips disposed side by side on the substrate of the touch area, Each of the first electrode strips includes a plurality of spaced apart first sub-electrodes; a plurality of conductive bridges are disposed on the substrate of the touch area, and two adjacent first sub-electrodes of each of the first electrode strips are electrically connected by the conductive bridge Connecting; wherein the conductive bridge includes a body portion and a branch portion, and at least one end of the body portion is provided with at least two branch portions. The two ends of the conductive bridge are designed to include at least two branches.
  • the branch portion can disperse the stress generated in the conductive bridge, thereby alleviating the local area of the conductive bridge due to stress concentration. Excessive stress reduces the risk of breakage of the conductive bridge and improves the yield of the touch substrate.
  • FIG. 1A is a plan view of a touch substrate according to an embodiment of the present disclosure
  • FIG. FIG. 1C is a cross-sectional view of the touch substrate shown in FIG. 1B along MN
  • FIG. 1D is a schematic structural view of the conductive bridge shown in FIG. 1B.
  • the touch substrate includes: a substrate 100 including a touch area 110 and a lead region 120 around the touch area 110; and a plurality of first electrode strips 200, juxtaposed
  • the first electrode strip 200 includes a plurality of spaced apart first sub-electrodes 210.
  • the plurality of conductive bridges 500 are disposed on the substrate 100 of the touch area 110, each of which is disposed on the substrate 100 of the touch area 110. Any two adjacent first sub-electrodes 210 of the first electrode strips 200 are electrically connected by one of the conductive bridges 500, each of the conductive bridges 500 includes a main body portion 510 and a branch portion 520, and at least one end of the main body portion 510 is provided with at least one end Two branch portions 520.
  • the branch portion 520 of the conductive bridge 500 is electrically connected to the first sub-electrode 210. In the case where the conductive bridge 500 is in a bent state, the branch portion 520 can disperse the stress generated in the conductive bridge 500, reducing the risk of the conductive bridge 500 being broken.
  • both ends of the body portion 510 of the conductive bridge 500 may be provided with a branch portion 520.
  • the branch portion 520 is in contact with the first sub-electrode 210.
  • the touch substrate is bent, the bending stress generated in the conductive bridge 500 can be transmitted to the branch portion 520 to disperse the stress generated in the conductive bridge 500, thereby avoiding the occurrence of the conductive bridge 500 due to stress concentration. fracture.
  • the touch substrate further includes a plurality of second electrodes disposed on the substrate 100 of the touch region 110.
  • the strip 300, the extension line where the second electrode strip 300 is located and the extension line where the first electrode strip 200 is located are disposed to cross each other, and each of the second electrode strips 300 includes a plurality of spaced second sub-electrodes 310 and connects adjacent second sub-bars.
  • the connection portion 320 of the electrode 300 overlaps at least a portion of the body portion 510 of the conductive bridge 500 in a direction perpendicular to the plane in which the substrate 100 is located.
  • the types of the first electrode strip and the second electrode strip are not limited.
  • one of the first electrode strip and the second electrode strip 300 may be a driving electrode, and the other may be a sensing electrode.
  • a capacitance may be formed between the first sub-electrode of the first electrode strip and the second sub-electrode of the second electrode strip adjacent thereto, and the foreign object is close to, for example, the location of the contact, which changes the first sub-electrode of the corresponding region and
  • the capacitance between the second sub-electrodes can be positioned by detecting the position of the corresponding capacitance whose capacitance changes.
  • the order of arrangement of the first electrode strip and the second electrode strip in a direction perpendicular to the plane of the substrate is not limited as long as the adjacent first and second sub-electrodes are made
  • a capacitor can be formed between the electrodes.
  • the first electrode strip 200 and the second electrode strip 300 may be disposed in the same layer.
  • the first electrode strip 200 and the second electrode strip 300 are prepared in the same material.
  • the first electrode strip 200 and the second electrode strip 300 can be synchronously prepared on the substrate 100, thereby simplifying the preparation process of the touch substrate and reducing the manufacturing process. cost.
  • the arrangement of the first electrode strips 200 and the arrangement of the second electrode strips 300 are not limited, and the first electrode strips 200 and the planar shape of the touch substrate may be according to actual needs.
  • the arrangement of the second electrode strips 300 is set as long as the extension line where each of the first electrode strips 200 is located and the extension line where each of the second electrode strips 300 is located may intersect each other.
  • each of the first electrode strips 200 is parallel and spaced apart from each other in a first direction parallel to the substrate 100; each second electrode strip 300 is along a second parallel to the substrate 100
  • the directions are parallel to each other and spaced apart, the first direction and the second direction intersect, the first electrode strip 200 is disconnected at the intersection with the second electrode strip 300, that is, the plurality of second electrode strips 300 will be each of the first electrode strips 200
  • the interval is a plurality of first sub-electrodes 210.
  • the first direction and the second direction are perpendicular to each other.
  • first direction and the second direction are perpendicular to each other, the first electrode strips are spaced apart along the first direction, and the second electrode strips are spaced apart along the second direction.
  • the technical solution in at least one embodiment of the present disclosure is performed. Description.
  • a three-dimensional coordinate system is established with reference to the substrate 100 in the touch substrate to directionalally design the components in the touch substrate.
  • the directions of the X-axis and the Y-axis are parallel to the direction in which the substrate 100 is located, and the direction of the X-axis is the same as the second direction, and the direction of the Y-axis is the same as the first direction, that is, the first electrode
  • the strips 200 are juxtaposed in the direction of the Y-axis, and the second electrode strips 300 are juxtaposed in the direction of the X-axis; the Z-axis is perpendicular to the direction in which the substrate 100 is located.
  • the structure of the conductive bridge is not limited as long as at least one end of the body portion of the conductive bridge is provided with at least two branches.
  • both ends of the body portion 510 of the conductive bridge 500 are respectively provided with at least two branch portions 520.
  • the body portion 510 at the same end of the body portion 510, there are at least two branches 520 about the extension line L of the body portion 510 (eg, a direction parallel to the Y-axis). Symmetrical settings. In this way, when the touch substrate is in a bent state, the stress difference between the branch portions 520 located at the same end of the main body portion 510 can be reduced, and the local stress of the conductive bridge 500 can be prevented from being excessive.
  • the angle between the adjacent two branch portions 520 may be about 30 degrees to 60 degrees, for example, further 35 degrees, 45 degrees, 50 degrees, etc.
  • the angle between the adjacent sub-portions 520 is not limited to the above range, and may be set according to actual needs.
  • the embodiment of the present disclosure is not limited herein as long as the branching portion 520 can be connected to the first sub-electrode 210.
  • FIG. 2A is another schematic structural diagram of a conductive bridge of a touch substrate according to an embodiment of the present disclosure.
  • the same end of the body portion 510 of the conductive bridge 500 may be provided with at least three branch portions 520.
  • the plurality of branch portions 520 are spaced apart from each other and may be respectively connected to the first sub-electrodes 210 of the first electrode strip 200.
  • a multi-point connection between the conductive bridge 500 and the first sub-electrode 210 may be achieved, and the conductive bridge 500 and the first
  • the plurality of branch portions 520 may be distributed in a fan shape to increase the distribution area of the branch portion 520 such that the branch portion The contact area between the 520 and the first sub-electrode 210 is increased, increasing the robustness of the connection between the branch portion 520 and the first sub-electrode 210.
  • the width of the plurality of branch portions 520 may be set to be larger than the width of the body portion 510, and thus, the cross-sectional area of the current transfer channel of the conductive bridge 500 provided with the branch portion 510 region may be increased to reduce the total resistance of the conductive bridge 500.
  • the edge of the branch portion 520 may have a rounded outline, for example, an arc or a circle, etc., so that the edge stress can be further improved, and the bending resistance is increased.
  • FIG. 2B is another schematic structural diagram of a conductive bridge of a touch substrate provided by an embodiment of the present disclosure.
  • the main body portion 510 of the conductive bridge 500 includes at least two conductive strips 511 arranged in parallel, and at least one end of each of the conductive strips 511 is provided with at least one branch portion 520, that is, the main body portion 510 of the conductive bridge 500 can be disposed. It is a gate structure.
  • the conductive strips 511 are spaced apart from each other, so the stress generated in each of the conductive strips 511 is not transmitted to each other, and the stress generated in the main body portion 510 can be dispersed in each of the conductive strips 511, thus, The local stress of the main body portion 510 can be prevented from being excessively increased, and the bending resistance of the conductive bridge 500 or even the touch substrate can be further improved. Further, the main body portion 510 having the above-described gate structure can improve the transmittance of light and enhance the display effect of the display image of an electronic display product (for example, the display panel in the following embodiment).
  • the touch substrate may further include a plurality of first signal lines 620 and a plurality of second signal lines 610 disposed on the substrate 100 of the lead region 120;
  • the first signal line 610 is connected to the first electrode strip 200 in one-to-one correspondence
  • the second signal line 620 is connected to the second electrode strip 300 in one-to-one correspondence.
  • the distribution of the first signal line 610 and the second signal line 620 on the substrate 100 is not limited, and may be designed according to actual process conditions.
  • the first signal line 610 and the second signal line 620 may be concentrated to the port area B so as to be electrically connected to an external control unit such as a drive chip or the like.
  • the touch substrate may further include an insulating layer 400 disposed between the conductive bridge 500 and the connection portion 320 of the second electrode strip 300 .
  • the insulating layer 400 is filled between the conductive bridge 500 and the second electrode strip 300 to prevent electrical connection between the conductive bridge 500 and the second electrode strip 300.
  • the arrangement of the insulating layer 400 needs to ensure electrical connection between the conductive bridge 500 and the first electrode strip 200 and to block electrical connection between the conductive bridge 500 and the second electrode strip 300, so according to the first electrode strip 200 and the second electrode strip 300 and the different positions of the conductive bridge 500 on the substrate 100, the manner in which the insulating layer 400 is disposed may include a plurality of types.
  • the body portion and the branch portion of the conductive bridge may be disposed in the same layer; in other embodiments of the present disclosure, at least a portion of the body portion of the conductive bridge and the branch portion are located in different layers. Since the insulating layer is spaced apart from the conductive bridge and the connecting portion, the positions of the main body portion and the branch portion of the conductive bridge are affected by the shape and the installation position of the insulating layer, and the different manners of the main body portion and the branch portion 0 will be described below.
  • each conductive bridge 500 and the branch portion 520 are disposed in different layers in a direction perpendicular to the substrate 100 in the direction of the Z-axis.
  • each of the branch portions 520 is in direct contact with and electrically connected to the first sub-electrode 210 partially overlapping.
  • a portion of the branch portion 520 that is not in the same layer as the main body portion 510 may be in contact with the first sub-electrode 210 in whole or in part, and does not overlap with the insulating layer 400, so the insulating layer 400 needs to be patterned.
  • the conductive bridge 500 is made to meet the structural requirements described above.
  • the insulating layer 400 includes a plurality of sub-insulating layers 410 spaced apart from each other, and the sub-insulating layers 410 are disposed in one-to-one correspondence with the conductive bridges 500, and are vertically In the direction of the face of the substrate 100 (eg, parallel to the Z-axis), the orthographic projection of the body portion 510 of the conductive bridge 500 on the substrate 100 is at least partially within the orthographic projection of the sub-insulating layer on the substrate 100.
  • the orthographic projection of branch 520 on substrate 100 is at least partially outside of the orthographic projection of sub-insulating layer 410 on substrate 100.
  • a portion of the branch portion 520 of the conductive bridge 500 that does not overlap with the sub-insulating layer 410 may be in contact with the first sub-electrode 210 of the first electrode strip 200, so that the conductive bridge 500 and the first The contact area between the sub-electrodes 210 reinforces the connection between the conductive bridge 500 and the first sub-electrode 210.
  • the distribution area of the branches in the conductive bridge is not limited.
  • the branch portion is not limited to the portion shown in FIG. 1C in contact with the first sub-electrode.
  • the entire branch portion may be in contact with the first sub-electrode, and thus, the branch portion and the first portion may be added. The robustness of the connection between the sub-electrodes.
  • the edge of the sub-insulating layer 410 that is parallel to the surface of the substrate 100 and away from the surface of the connecting portion 320 is in contact with the conductive bridge 500.
  • the edges of the insulating layer 400 are all curved.
  • a cross-sectional shape of a portion in contact with the conductive bridge 500 is curved or circular.
  • the cross-section of the stress between the sub-insulating layer 410 and the branch portion 520 is curved, so that the stress can be evenly distributed on the curved edge. As such, the risk of breakage of the conductive bridge 500 due to stress concentration is reduced.
  • the cross-sectional shape of the insulating layer 400 (for example, the cross-sectional shape parallel to the surface of the substrate 100) is curved or circular, which can further improve the edge stress and improve the resistance of the touch substrate. Bending performance.
  • the planar shape of the sub-insulating layer is not limited as long as the edge of the sub-insulating layer in contact with the branch portion is curved.
  • the planar shape of the sub-insulating layer 410 is a circular or elliptical shape.
  • each conductive bridge and the branch portion are disposed in different layers, and the main body portion and the branch portion of the conductive bridge are not all in the same layer.
  • the distribution of the body portion and the branch portion of the conductive bridge on the substrate is also not limited to that shown in FIG. 1C.
  • the body portions of the conductive bridges may all lie in the same layer, ie the orthographic projections of the body portions on the substrate may all lie within the orthographic projection of the sub-insulating layer on the substrate; and the branches may be distributed in different layers,
  • the branch portion may be partially disposed on a surface of the sub-insulating layer remote from the substrate, and partially disposed on a side surface of the sub-insulating layer perpendicular to the surface of the substrate, and partially disposed on the first sub-electrode.
  • FIG. 3A is a partial cross-sectional view of another touch substrate according to an embodiment of the present disclosure.
  • the body portion 510 and the branch portion 520 of each of the conductive bridges 500 may be disposed in the same layer.
  • the manner in which the main body portion 510 and the branch portion 520 are disposed in the same layer structure can increase the stability of the structure of the conductive bridge 500 itself, and the risk of breakage of the conductive bridge 500 can be reduced during the bending process.
  • the insulating layer 400 is configured to cover the substrate 100 in a direction perpendicular to the plane of the substrate 100 (eg, a direction parallel to the Z-axis).
  • the entire surface, and the insulating layer 400 is provided with a via 420, and the first sub-electrode 210 of the first electrode strip 200 is electrically connected to the branch portion 520 or the body portion 510 of the conductive bridge 500 through the via 420.
  • an electrical conductor may be disposed in the via 420 through which the branch portion 520 and the first sub-electrode 210 are electrically connected.
  • the electrical conductor is separately provided; it may be formed of the same material as the first sub-electrode 210 or the conductive bridge 500; or may be integrally formed with the first sub-electrode 210 or the conductive bridge 500.
  • the material for preparing the insulating layer is not limited.
  • the material for preparing the insulating layer is an insulating material, and further, for example, an insulating material having good elasticity.
  • the material for preparing the insulating layer may include an insulating material such as silicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride, or resin.
  • the arrangement relationship between the first electrode strip, the second electrode strip, and the conductive bridge in the Y-axis direction is not limited, and may be set according to actual needs.
  • the conductive bridge 500 is disposed away from the connecting portion 320 of the second electrode strip 300 (the second electrode strip 300 is disposed in the same layer as the first electrode strip 200, for example).
  • One side of the substrate 100 is shown in FIG. 3A.
  • FIG. 3B is a partial cross-sectional view of another touch substrate according to an embodiment of the present disclosure.
  • the conductive bridge 500 is disposed between the substrate 100 and the connection portion 320 of the second electrode strip 300 (the second electrode strip 300 is disposed, for example, in the same layer as the first electrode strip 200).
  • the materials for preparing the first electrode strip, the second electrode strip, and the conductive bridge are not limited.
  • the preparation material of the first electrode strip, the second electrode strip and the conductive bridge may be a translucent or transparent conductive material such as indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), oxidation.
  • the conductive bridge 500 may also use a conductive material having good ductility, such as a metal such as gold (Au), silver (Ag), copper (Au), or aluminum (Al), or an alloy thereof.
  • the first electrode strip, the second electrode strip 300, and the conductive bridge may be made of the same material, and the crystallization conditions (such as temperature, pressure, and the like) in the forming process are similar.
  • the preparation materials of the first electrode strip, the second electrode strip and the conductive bridge may all be indium tin oxide (ITO) or the like.
  • planar shape of the first electrode strip and the second electrode strip or the like is not limited, and may be set according to actual needs.
  • the second sub-electrode 310 and the first are viewed in a direction perpendicular to the plane in which the substrate 100 is located (for example, a direction parallel to the Z-axis).
  • the planar shape of the sub-electrode 210 is a diamond shape (only a part of the diamond shape is shown in FIG. 1B).
  • the first sub-electrode 210 and the second sub-electrode 310 of the above structure can increase the sensing area of the touch substrate and improve the sensitivity of the touch substrate.
  • FIG. 4 is a partial schematic structural diagram of another touch substrate according to an embodiment of the present disclosure.
  • the peripheral edges of the first sub-electrode 210 and the second sub-electrode 310 are at least partially arranged in a zigzag shape when viewed in a direction parallel to the Z-axis.
  • the touch substrate of the above structure has a good erasing effect, and can improve the display effect of the display image of the electronic display product (including the touch substrate in the embodiment of the present disclosure).
  • FIG. 5 is a partial schematic structural diagram of another touch substrate according to an embodiment of the present disclosure.
  • a filling electrode 700 may be disposed between the adjacent first sub-electrode 210 and the second sub-electrode 310, and the filling electrode 700 is spaced apart from the first sub-electrode 210 and the second sub-electrode 310.
  • FIG. 4 there is a large interval area between the first sub-electrode 210 and the second sub-electrode 310, so that the light transmittance at the interval area is high, which may cause uneven brightness distribution of the displayed image. The appearance of the effect of the display.
  • the filling electrode 700 can fill the interval region between the first sub-electrode 210 and the second sub-electrode 310, so that the uniformity of the distribution of the light transmittance of the touch substrate can be improved, and the display effect of the display image can be improved.
  • the filling electrode 700 can be formed in the same layer and the same material as the first sub-electrode 210 and the second sub-electrode 310, and the uniform distribution of the light transmittance of the touch substrate can be improved without increasing the preparation process of the touch substrate. degree.
  • the size of the first sub-electrode, the second sub-electrode, and the connecting portion thereof in the touch substrate is not limited.
  • the partial structure of the touch substrate in FIG. 5 may be a touch unit, and the touch unit may have a size of about 3 to 10 mm in a direction along the X axis or a direction in the Y axis.
  • the sizes of the structures of the first sub-electrode 210, the second sub-electrode 310, and the connecting portion 320 thereof may be adjusted in an equal proportion according to the size of the corresponding electronic product. Reduce wiring footprint and reduce costs.
  • At least one embodiment of the present disclosure provides a display panel, which may include the touch substrate in any of the foregoing embodiments.
  • the position where the touch substrate is disposed in the display panel is not limited.
  • the touch substrate may be disposed on one side of the display surface of the display panel; or may be embedded in the interior of the display panel.
  • the display panel may be a liquid crystal display panel, for example, the liquid crystal display panel may include an array substrate and an opposite substrate, which are opposite to each other to form a liquid crystal cell, and are filled in the liquid crystal cell. There are liquid crystal materials.
  • the counter substrate may be, for example, a color filter substrate.
  • the pixel electrode and the common electrode of each pixel unit of the array substrate are used to apply an electric field to control the degree of rotation of the liquid crystal material to perform a display operation.
  • the display panel may be an organic light emitting diode (OLED) display panel, wherein a stack of organic light emitting materials may be formed in a sub-pixel region of the display panel, each of the sub-pixel units
  • the pixel electrode serves as an anode or a cathode for driving the organic light-emitting material to emit light for a display operation.
  • the display panel may be an electronic paper display panel, wherein an electronic ink layer may be formed on the display substrate of the display panel, and the pixel electrode of each sub-pixel unit is used for application.
  • the display panel may also be any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, or the like, or may be active with other functional devices. Pens, passive pens, etc.
  • At least one embodiment of the present disclosure provides a method for fabricating a touch substrate, including: providing a substrate, the substrate includes a touch area and a lead area around the touch area; and forming a plurality of substrates on the touch area a first electrode strip arranged side by side; and a plurality of conductive bridges formed on the substrate of the touch area; wherein each of the first electrode strips comprises a plurality of spaced apart first sub-electrodes, each of the first electrode strips
  • the two adjacent first sub-electrodes are electrically connected by one of the conductive bridges, and the conductive bridge includes a body portion and a branch portion directly connected to each other, and at least one end of the body portion is provided with at least two branch portions.
  • the branch portion can disperse the stress generated in the conductive bridge, and the local region of the conductive bridge is prevented from being broken due to excessive stress when the touch substrate is in a bent state.
  • the method for fabricating a touch substrate may further include: forming a plurality of second electrode strips arranged side by side on the substrate of the touch area; wherein the second electrode strip and the first The electrode strips are disposed in the same layer and are arranged to cross each other, and each of the second electrode strips includes a plurality of spaced apart second sub-electrodes and a connecting portion connecting adjacent second sub-electrodes, and in a direction perpendicular to a plane of the substrate, The connecting portion partially overlaps the main body portion.
  • the first electrode strip and the second electrode strip are disposed to cross each other to form mutual capacitance at the intersection position. By detecting the capacitance change amount of each capacitor, the contact can be positioned, thereby implementing the touch function of the touch substrate.
  • the second electrode layer may be formed in the same layer as the first electrode layer and in the same layer.
  • the method for preparing the touch substrate may be different according to different design structures and actual process requirements of the touch substrate.
  • several methods of preparing a touch substrate will be described in several examples of at least one embodiment of the present disclosure.
  • forming a plurality of conductive bridges 500 on the substrate 100 of the touch area 110 includes: lining A thin film of insulating material is deposited on the bottom 100 and patterned to form an insulating layer 400 including a plurality of sub-insulating layers 410; a thin film of conductive material is deposited on the substrate 100 on which the plurality of sub-insulating layers 410 are formed and patterned The conductive bridge 500 is formed, and the formed sub-insulating layer 410 is disposed in one-to-one correspondence with the conductive bridge 500.
  • the corrosion-preventing property of the preparation material of the conductive bridge 500 is less than that of the preparation materials of the first electrode strip 200 and the second electrode strip 300. Sex.
  • the distribution of the main body portion 510 and the branch portion 520 of the conductive bridge 500 is not limited, for example, in a direction perpendicular to the plane of the substrate 100, the main body portion
  • the orthographic projection of 510 on substrate 100 is at least partially within the orthographic projection of sub-insulating layer 410 on substrate 100, and the orthographic projection of branch portion 520 on substrate 100 is located on sub-insulating layer 410 on substrate 100. Outside the projection.
  • the preparation material of the conductive bridge 500 is different from the preparation materials of the first electrode strip 200 and the second electrode strip 300.
  • the conductive bridge 500 can be corroded but not the first electrode strip 200 and the second electrode.
  • the strip 300 causes corrosion of the corrosive liquid; for example, the preparation materials of the first electrode strip 200 and the second electrode strip 300 are more resistant to corrosion by the etching solution in the patterning process than the preparation material of the conductive bridge 500 to the etching solution in the patterning process Corrosion resistance.
  • the preparation material of the etching solution in the patterning process may be indium tin oxide (ITO), the ITO needs to be corroded by, for example, aqua regia, and the corrosion resistance to other etching liquids is high, and the preparation material of the conductive bridge 500 is prepared.
  • ITO indium tin oxide
  • the preparation material of the conductive bridge 500 is prepared.
  • it may be copper (Cu), and the copper material may be etched by ferric chloride or the like.
  • forming a plurality of conductive bridges 500 on the substrate 100 of the touch area 110 includes: lining A thin film of insulating material is deposited on the bottom 100 and patterned to form an insulating layer 400 including a plurality of sub-insulating layers 410; a first mask is provided, through which a thin film of conductive material is deposited on the substrate 100 to form a plurality of The conductive bridges 500 are formed, and the sub-insulating layers 410 are formed in one-to-one correspondence with the conductive bridges 500.
  • the distribution of the main body portion 510 and the branch portion 520 of the conductive bridge 500 is not limited, for example, in a direction perpendicular to the plane of the substrate 100, the main body portion
  • the orthographic projection of 510 on substrate 100 is at least partially within the orthographic projection of sub-insulating layer 410 on substrate 100, and the orthographic projection of branch portion 520 on substrate 100 is located on sub-insulating layer 410 on substrate 100. Outside the projection.
  • the body portion and the branch portion of each of the conductive bridges are formed in the same layer.
  • forming a plurality of conductive bridges 500 on the substrate 100 of the touch region 110 includes: A first insulating strip 200 is deposited on the substrate 100 to form an insulating material 400 to form an insulating layer 400.
  • the insulating layer 400 may cover, for example, all of the touch regions.
  • the insulating layer 400 is patterned to form a plurality of vias 420 in the insulating layer 400.
  • the via 420 exposes a partial region of the first sub-electrode 210 of the first electrode strip 200; a thin film of a conductive material is deposited on the insulating layer 400 and patterned to form a plurality of conductive bridges 500, and the branch portion 520 of the conductive bridge 500
  • the first sub-electrode 210 is electrically connected through the via 420.
  • the body portion and the branch portion of each of the conductive bridges are formed in the same layer.
  • forming a plurality of conductive bridges 500 on the substrate 100 of the touch region 110 includes: A conductive material film is deposited on 100 and patterned to form a plurality of conductive bridges 500, and a thin film of insulating material is deposited on the substrate 100 on which the conductive bridge 500 is formed to form an insulating layer 400, which may cover, for example, the touch area.
  • the insulating layer 400 is patterned to form a plurality of vias 420 in the insulating layer 400, the vias 420 exposing a partial region of the conductive bridge 500 (eg, a partial region of the branch portion 520 of the conductive bridge 500);
  • a conductive material film is deposited on 400 and patterned to form a plurality of juxtaposed first electrode strips 200 (eg, a plurality of juxtaposed second electrode strips 300 may be formed simultaneously), and the first sub-electrode of the first electrode strip 200 210 is electrically connected to the conductive bridge 500 through the via 420.
  • FIGS. 6A-6B, FIG. 7, FIG. 8A to FIG. 8B, and FIG. 9A to FIG. 9B are provided in an embodiment of the present disclosure.
  • a process diagram of a method of preparing a touch substrate For example, as shown in FIG. 6A to FIG. 6B, FIG. 7 , FIG. 8A to FIG. 8B, and FIG. 9A to FIG. 9B, the touch substrate shown in FIG. 1C is taken as an example, and the touch substrate provided by at least one embodiment of the present disclosure is provided.
  • the preparation method may include a process in which at least a portion of the body portion 510 of each of the conductive bridges 500 and the branch portion 520 are disposed at different layers.
  • FIG. 6B is a cross-sectional view of the A region shown in FIG. 6A.
  • a substrate 100 is provided, and a thin film of a conductive material is deposited on the substrate 100 and patterned to form a plurality of juxtaposed
  • the first electrode strip 200 and the second electrode strip 300 are formed in the touch area of the substrate 100, and each of the first electrode strips 200 includes a plurality of spaced apart first sub-electrodes 210, each of the second electrode strips 300.
  • a plurality of spaced apart second sub-electrodes 310 and a connecting portion 320 connecting adjacent second sub-electrodes 310 are included.
  • the preparation material of the substrate may be a transparent or translucent flexible material.
  • the preparation material of the substrate may be a resin material including polyimide, polycarbonate, polyacrylate, polyetherimide, polyethersulfone, polyethylene terephthalate, and polynaphthalene.
  • ethylene glycol formate One or more of ethylene glycol formate and the like.
  • the patterning process can include dry or wet engraving.
  • the process of the patterning process may include: coating a photoresist layer on the structural layer to be patterned, exposing the photoresist layer using a mask, and developing the exposed photoresist layer to obtain a photoresist pattern, The structural layer is etched using the photoresist pattern as a mask, and then the photoresist pattern is optionally removed.
  • the first sub-electrode 210 and the second may be caused by a patterning process.
  • the edge of the sub-electrode 310 is formed in a zigzag shape as shown in FIG. 4 to obtain a shadowing effect.
  • a patterning process of the conductive material film is performed to obtain a first sub-electrode
  • the filling electrodes 700 shown in FIG. 5 can be synchronously obtained, thereby maintaining the uniformity of the transmittance of the touch substrate.
  • a first signal line 610 and a second signal line 620 are formed on the substrate 100 in the lead region 120, and the first signal line 610 is electrically connected to the first electrode strip 200, and the second signal line 620 is The second signal line 300 is electrically connected. It should be noted that the embodiment of the present disclosure does not limit the formation manner of the first signal line 610 and the second signal line 620 and the arrangement order in the entire preparation process step, as long as the signal line can correspond to the electrode strip. Just connect.
  • a patterning process may be performed on the conductive material film to simultaneously form the first electrode strip 200, the second electrode strip 300, the first signal line 610, and the second The signal line 620; for example, the first electrode line 610 and the second signal line 620 may be formed first, then the first electrode strip 200 and the second electrode strip 300 may be formed, or the first electrode strip 200 and the second electrode strip 300 may be formed first.
  • the first signal line 610 and the second signal line 620 are formed again.
  • the materials for preparing the first signal line 610 and the second signal line 620 are not limited.
  • the material of the first signal line 610 and the second signal line 620 may be a conductive material having good flexibility, such as a metal such as copper, aluminum, silver or gold, or a metal alloy.
  • FIG. 8B is a cross-sectional view of the A region shown in FIG. 8A, and as shown in FIGS. 8A and 8B, a thin film of an insulating material is deposited on the substrate 100 on which the first electrode strip 200 and the second electrode strip 300 are formed and subjected to A patterning process to form an insulating layer 400 including a plurality of sub-insulating layers 410 spaced apart from each other, the sub-insulating layer 410 being formed at a position where the first electrode strip 200 and the second electrode strip 300 cross each other, and in the direction of the Z-axis, The insulating layer 410 partially overlaps the connection portion 320. For example, in the direction along the Y-axis, the sub-insulating layer 410 covers all of the connection portion 320.
  • the structure of the sub-insulating layer 410 refer to the related description in the foregoing embodiment (for the embodiment of the touch substrate), and the embodiments of the present disclosure are not described herein.
  • FIG. 9B is a cross-sectional view of the A region shown in FIG. 9A, as shown in FIGS. 9A and 9B, a first mask 800 is provided, and then deposited on the substrate 100 on which the insulating layer 400 is formed through the first mask 800.
  • a conductive material forms a plurality of conductive bridges 500.
  • the conductive bridge 500 includes a body portion 510 and a branch portion 520, and at least one end of the body portion is provided with at least two branch portions 520.
  • the orthographic projection of the body portion 510 on the substrate 100 is at least partially within the orthographic projection of the sub-insulating layer 410 on the substrate 100, and the orthographic projection of the branch portion 520 on the substrate 100 is at least Portions are located outside of the orthographic projection of the sub-insulating layer 410 on the substrate 100.
  • the method of forming the conductive bridge 500 through the first mask 800 may include magnetron sputtering or the like.
  • the manner of forming the first signal line and the second signal line is not limited, and reference may be made to the foregoing embodiment (for example, as shown in FIG. 7 The related description in the embodiment of the method for preparing the touch substrate is not described herein.
  • At least one embodiment of the present disclosure provides a touch substrate, a method of fabricating the same, a display panel, and may have at least one of the following beneficial effects:
  • At least one embodiment of the present disclosure provides a touch substrate.
  • the conductive bridge in the touch substrate is configured as a branch structure including a plurality of branches. In the bent state, part of the stress in the conductive bridge is distributed to different points. The branch prevents the local stress of the conductive bridge from being excessively broken due to stress concentration.
  • the branch portion of the conductive bridge can increase the contact area between the conductive bridge and the first electrode strip, and increase the connection between the conductive bridge and the first electrode strip. Sex.
  • the branch portion of the conductive bridge can increase the cross-sectional area of the current transmission channel of the conductive bridge and reduce the resistance of the conductive bridge.
  • the edge of the insulating layer facing the conductive bridge that is in contact with the conductive bridge is curved, which can improve the stress distribution of the conductive bridge at the edge and prevent Excessive local stress causes the conductive bridge to break.

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Abstract

一种触控基板及其制备方法、显示面板。该触控基板包括：衬底(100)，包括触控区(110)和位于触控区(110)周围的引线区(120)；多个第一电极条(200)，并列设置于触控区(110)的衬底(100)上，各第一电极条(200)包括多个间隔设置的第一子电极(210)；多个导电桥(500)，设置于触控区(110)的衬底(100)上，每个第一电极条(200)中任意相邻的两个第一子电极(210)通过导电桥(500)之一电连接；其中，每个导电桥(500)包括彼此直接连接的主体部(510)和分支部(520)，主体部(510)的至少一端设置有至少两个分支部(520)。

Description

触控基板及其制备方法、显示面板
本申请要求于2017年9月5日递交的中国专利申请第201710791475.0号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开至少一个实施例涉及一种触控基板及其制备方法、显示面板。
背景技术
具有触控功能的电子显示产品愈来愈受到消费者的青睐，目前比较常见的技术包括电阻式、电容式以及光学式等，其中电容式触控板由于具有高准确率、多点触控、高耐用性以及高触控解析度等特点，已成为目前中高阶消费性电子产品使用的主流触控技术。
在柔性显示领域，多次弯折会使得电子显示产品中的元件造成损坏，影响电子显示产品的电学功能。
发明内容
本公开至少一个实施例提供一种触控基板，包括：衬底，包括触控区和位于所述触控区周围的引线区；多个第一电极条，并列设置于所述触控区的所述衬底上，各所述第一电极条包括多个间隔设置的第一子电极；以及多个导电桥，设置于所述触控区的所述衬底上，每个所述第一电极条中任意相邻的两个所述第一子电极通过所述导电桥之一电连接；其中，每个所述导电桥包括彼此直接连接的主体部和分支部，所述主体部的至少一端设置有至少两个所述分支部。
例如，本公开至少一个实施例提供的触控基板还包括：多个第二电极条，并列设置于所述触控区的所述衬底上，每个所述第二电极条和每个所述第一电极条同层设置，并且所述第一电极条所在的延伸线与所述第二电极条所在的延伸线彼此交叉，每个所述第二电极条包括多个间隔设置的第二子电极以及连接相邻所述第二子电极的连接部；其中，在垂直于所述衬 底所在面的方向上，所述连接部与所述导电桥的所述主体部的至少一部分重叠。
例如，在本公开至少一个实施例提供的触控基板中，每个所述导电桥的所述主体部的至少一部分和所述分支部设置在不同层中，在垂直于衬底所在面的方向上，每个所述分支部和与其部分重叠的所述第一子电极直接接触而电连接。
例如，在本公开至少一个实施例提供的触控基板中，每个所述分支部的整体接触对应的所述第一子电极。
例如，本公开至少一个实施例提供的触控基板还包括：绝缘层，设置在所述多个第二电极条的所述连接部和所述多个导电桥之间，其中，所述绝缘层包括多个彼此间隔的子绝缘层，所述子绝缘层与所述导电桥一一对应设置，并且所述主体部在所述衬底上的正投影的至少部分位于所述子绝缘层在所述衬底上的正投影之内，所述分支部在所述衬底上的正投影位于所述子绝缘层在所述衬底上的正投影之外。
例如，在本公开至少一个实施例提供的触控基板中，所述子绝缘层的与所述衬底所在面平行且远离所述连接部的表面的与所述导电桥接触的边缘为弧形。
例如，在本公开至少一个实施例提供的触控基板中，在平行于所述衬底所在面的平面中，所述子绝缘层的平面形状为圆形或者椭圆形。
例如，在本公开至少一个实施例提供的触控基板中，每个所述导电桥的所述主体部和所述分支部设置在同一层中。
例如，本公开至少一个实施例提供的触控基板还包括：绝缘层，设置在所述多个第二电极条的所述连接部和所述多个导电桥之间，所述绝缘层中设置有过孔，其中，所述第一子电极与所述导电桥通过所述过孔电连接。
例如，在本公开至少一个实施例提供的触控基板中，在平行于所述衬底所在面的平面中，每个所述分支部的边缘为弧形。
例如，在本公开至少一个实施例提供的触控基板中，在所述主体部的同一端，相邻两个所述分支部之间的夹角为30度～60度。
例如，在本公开至少一个实施例提供的触控基板中，在所述主体部的同一端，至少两个所述分支部关于所述主体部的延伸线轴对称设置。
例如，在本公开至少一个实施例提供的触控基板中，所述主体部包括 并列间隔设置的至少两个导电条，每个所述导电条的一端设置有至少一个所述分支部。
例如，在本公开至少一个实施例提供的触控基板中，所述导电桥设置于所述第一电极条的靠近所述衬底的一侧；或者所述导电桥设置于所述第一电极条的远离所述衬底的一侧。
本公开至少一个实施例提供一种显示面板，包括上述任一实施例中的触控基板。
本公开至少一个实施例提供一种触控基板的制备方法，包括：提供衬底，该衬底包括触控区和位于所述触控区周围的引线区；在所述触控区的所述衬底上形成多个并列排布的第一电极条；以及在所述触控区的所述衬底上形成多个导电桥；其中，每个所述第一电极条包括多个间隔设置的第一子电极，每个所述第一电极条中任意相邻的两个所述第一子电极通过所述导电桥之一电连接，并且所述导电桥包括彼此直接连接的主体部和分支部，所述主体部的至少一端设置有至少两个所述分支部。
例如，本公开至少一个实施例提供的制备方法还包括：在所述触控区的所述衬底上形成多个并列排布的第二电极条；其中，所述第二电极条和所述第一电极条同层且彼此交叉排布，每个所述第二电极条包括多个间隔设置的第二子电极以及连接相邻所述第二子电极的连接部，以及在垂直于所述衬底所在面的方向上，所述连接部与所述主体部至少部分重叠。
例如，在本公开至少一个实施例提供的制备方法中，每个所述导电桥的主体部的至少一部分和所述分支部设置在不同层中，在所述触控区的所述衬底上形成多个导电桥包括：在形成有所述第一电极条和所述第二电极条的所述衬底上沉积绝缘材料薄膜并对其进行构图工艺以形成包括多个子绝缘层的绝缘层；在形成有所述绝缘层的所述衬底上沉积导电材料薄膜并对其进行构图工艺以形成所述导电桥，所述子绝缘层与所述导电桥一一对应设置；其中，所述导电桥的制备材料的抗腐蚀性小于所述第二电极条和所述第一电极条的制备材料的抗腐蚀性，以及在垂直于所述衬底所在面的方向上，所述主体部在所述衬底上的正投影至少部分位于所述子绝缘层在所述衬底上的正投影之内，所述分支部在所述衬底上的正投影位于所述子绝缘层在所述衬底上的正投影之外。
例如，在本公开至少一个实施例提供的制备方法中，每个所述导电桥 的主体部的至少一部分和所述分支部设置在不同层中，在所述触控区的所述衬底上形成多个导电桥包括：在形成有所述第一电极条和所述第二电极条的所述衬底上沉积绝缘材料薄膜并对其进行构图工艺以形成包括多个子绝缘层的绝缘层；提供第一掩模板，通过所述第一掩模板在所述衬底上沉积导电材料以形成多个所述导电桥，所述子绝缘层与所述导电桥一一对应设置；其中，在垂直于所述衬底所在面的方向上，所述主体部在所述衬底上的正投影至少部分位于所述子绝缘层在所述衬底上的正投影之内，所述分支部在所述衬底上的正投影位于所述子绝缘层在所述衬底上的正投影之外。
例如，在本公开至少一个实施例提供的制备方法中，每个所述导电桥的主体部和分支部设置在同一层中，在所述触控区的所述衬底上形成多个导电桥包括：在形成有所述第一电极条的所述衬底上沉积绝缘材料薄膜以形成所述绝缘层；对所述绝缘层进行构图工艺以在所述绝缘层中形成过孔，所述过孔暴露所述第一子电极的部分区域；以及在所述绝缘层上沉积导电材料薄膜并对其进行构图工艺以形成所述导电桥，所述导电桥的所述分支部通过所述过孔与所述第一子电极电连接。
例如，在本公开至少一个实施例提供的制备方法中，每个所述导电桥的主体部和分支部设置在同一层中，在所述触控区的所述衬底上形成多个导电桥包括：在所述衬底上沉积导电材料薄膜并对其进行构图工艺以形成所述导电桥；在形成有所述导电桥的所述衬底上沉积绝缘材料薄膜以形成绝缘层；对所述绝缘层进行构图工艺以在所述绝缘层中形成过孔，所述过孔暴露所述导电桥的部分区域，在所述触控区的所述衬底上形成多个并列排布的第一电极条包括：在所述绝缘层上沉积导电材料薄膜并对其进行构图工艺以形成所述多个第一电极条，任意相邻的两个所述第一子电极通过所述过孔与所述导电桥电连接。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1A为本公开一个实施例提供的一种触控基板的平面图；
图1B为图1A所示触控基板的A区域的局部结构示意图；
图1C为图1B所示触控基板沿M-N的截面图；
图1D为图1B所示导电桥的一种结构示意图；
图2A为本公开一个实施例提供的触控基板的导电桥的另一种结构示意图；
图2B为本公开一个实施例提供的触控基板的导电桥的另一种结构示意图；
图3A为本公开一个实施例提供的另一种触控基板的局部截面图；
图3B为本公开一个实施例提供的另一种触控基板的局部截面图；
图4为本公开一个实施例提供的另一种触控基板的局部结构示意图；
图5为本公开一个实施例提供的另一种触控基板的局部结构示意图；以及
图6A～图6B为本公开一个实施例提供的一种触控基板的制备方法的过程图；
图7为本公开一个实施例提供的一种触控基板的制备方法的另一过程图；
图8A～图8B为为本公开一个实施例提供的一种触控基板的制备方法的再一过程图；以及
图9A～图9B为本公开一个实施例提供的一种触控基板的制备方法的又一过程图。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词 前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
本公开至少一个实施例提供一种触控基板，包括：衬底，包括触控区和位于触控区周围的引线区；多个第一电极条，并列设置于触控区的衬底上，各第一电极条包括多个间隔设置的第一子电极；多个导电桥，设置于触控区的衬底上，各第一电极条中相邻的两个第一子电极通过导电桥电连接；其中，导电桥包括主体部和分支部，主体部的至少一端设置有至少两个分支部。导电桥的两端设计为包括至少两个分支部的结构，在触控基板处于弯曲的状态下，分支部可以分散导电桥中产生的应力，减缓因应力集中而导致导电桥的局部区域受到的应力过大，从而降低导电桥发生断裂的风险，可以提高触控基板的良率。
下面，结合附图对根据本公开至少一个实施例提供的一种触控基板及其制备方法、显示面板进行说明。
本公开至少一个实施例提供一种触控基板，触控基板可以为柔性触控基板，图1A为本公开一个实施例提供的一种触控基板的平面图，图1B为图1A所示触控基板的A区域的局部结构示意图，图1C为图1B所示触控基板沿M-N的截面图，图1D为图1B所示导电桥的一种结构示意图。例如图1A、图1B、图1C和图1D所示，触控基板包括：衬底100，包括触控区110和位于触控区110周围的引线区120；多个第一电极条200，并列设置于触控区110的衬底100上，每个第一电极条200包括多个间隔设置的第一子电极210；多个导电桥500，设置于触控区110的衬底100上，每个第一电极条200中任意相邻的两个第一子电极210通过导电桥500之一电连接，每个导电桥500包括主体部510和分支部520，主体部510的至少一端设置有至少两个分支部520。例如，导电桥500的分支部520与第一子电极210电连接。在导电桥500处于弯曲状态的情况下，分支部520可以分散导电桥500中产生的应力，降低导电桥500发生断裂的风险。
例如，在本公开至少一个实施例中，如图1A、图1B、图1C和图1D所示，导电桥500的主体部510的两端都可以设置有分支部520。分支部 520与第一子电极210接触，当触控基板弯曲，导电桥500中产生的弯曲应力可以传递至分支部520，分散导电桥500中产生的应力，避免因应力集中导致导电桥500发生断裂。
例如，在本公开至少一个实施例中，如图1A、图1B、图1C和图1D所示，触控基板还包括并列设置于触控区110的衬底100上个的多个第二电极条300，第二电极条300所在的延伸线和第一电极条200所在的延伸线彼此交叉设置，各第二电极条300包括多个间隔设置的第二子电极310以及连接相邻第二子电极300的连接部320，在垂直于衬底100所在面的方向上，连接部320与导电桥500的主体部510的至少一部分重叠。
在本公开至少一个实施例中，对第一电极条和第二电极条的类型不做限制。例如，第一电极条和第二电极条300中的一方可以为驱动电极，另一方可以为感应电极。第一电极条中的第一子电极和与其相邻的第二电极条中的第二子电极之间可以形成电容，外物靠近例如触点所在处，会改变相应区域的第一子电极和第二子电极之间的电容量，通过检测电容量发生变化的相应电容的位置，可以定位触点。
在本公开至少一个实施例中，对第一电极条和第二电极条在垂直于衬底所在面的方向上的排布顺序不做限制，只要使得相邻的第一子电极和第二子电极之间可以形成电容即可。例如，在本公开至少一个实施例中，如图1C所示，第一电极条200和第二电极条300可以同层设置。例如，第一电极条200和第二电极条300的制备材料相同，如此，可以在衬底100上同步制备第一电极条200和第二电极条300，简化触控基板的制备工艺流程，降低成本。
在本公开至少一个实施例中，对各第一电极条200的排布及各第二电极条300的排布不做限制，可以根据实际需求例如触控基板的平面形状第一电极条200和第二电极条300的排布进行设置，只要每个第一电极条200所在的延伸线和每个第二电极条300所在的延伸线之间可以相互交叉即可。例如，在本公开至少一个实施例中，每个第一电极条200沿平行于衬底100的第一方向彼此平行且间隔排列；每个第二电极条300沿平行于衬底100的第二方向彼此平行且间隔排列，第一方向和第二方向交叉，第一电极条200在与第二电极条300的交叉处断开，即多个第二电极条300将每个第一电极条200间隔为多个第一子电极210。例如，第一方向和第二 方向彼此垂直。
下面，以第一方向和第二方向彼此垂直，第一电极条沿第一方向间隔设置且第二电极条沿第二方向间隔设置为例，对本公开下述至少一个实施例中的技术方案进行说明。
例如，如图1A、图1B、图1C和图1D所示，以触控基板中的衬底100为参考并建立三维坐标系，以对触控基板中的各部件进行方向性的指定。在上述三维坐标系中，X轴和Y轴的方向为平行于衬底100所在面的方向，并且X轴的方向与第二方向相同，Y轴的方向与第一方向相同，即第一电极条200沿Y轴的方向并列设置，第二电极条300沿X轴的方向并列设置；Z轴为垂直于衬底100所在面的方向。
在本公开至少一个实施例中，对导电桥的结构不做限制，只要导电桥的主体部的至少一端设置有至少两个分支部即可。
例如，在本公开至少一个实施例中，如图1A、图1B、图1C和图1D所示，导电桥500的主体部510的两端都分别设置有至少两个分支部520。
例如，在本公开至少一个实施例中，如图1D所示，在主体部510的同一端，至少有两个分支部520关于主体部510的延伸线L(例如平行于Y轴的方向)轴对称设置。如此，在触控基板处于弯曲状态下，可以降低位于主体部510同一端的各分支部520之间的应力差异，避免导电桥500局部应力过大。
例如，在本公开至少一个实施例中，如图1D所示，在主体部510的同一端，相邻两个分支部520之间的夹角可以为约30度～60度，例如进一步可以为35度、45度、50度等。相邻分支部520之间的夹角不限于上述范围，可以根据实际需求进行设置，本公开的实施例在此不做限制，只要分支部520可以与第一子电极210连接即可。
例如，在本公开至少一个实施例中，对导电桥500的主体部510的同一端设置的分支部520的数量不做限制，主体部510同一端的分支部520不限于如图1D所示的为两个。图2A为本公开一个实施例提供的触控基板的导电桥的另一种结构示意图。例如图2A所示，导电桥500的主体部510的同一端可以设置有至少三个分支部520。多个分支部520彼此间隔并且可以分别与第一电极条200的第一子电极210连接，如此，可以实现导电桥500和第一子电极210之间的多点连接，增加导电桥500和第一子电极 210之间连接的牢固性；此外，导电桥500中产生的部分应力可以由更多的分支部520分摊，进一步减轻应力集中的问题；并且，当其中的一个分支部520断开，其它的分支部520仍可以连通导电桥500和第一子电极210，降低了触控基板电路损坏的风险。
例如，在本公开至少一个实施例中，如图2A所示，在导电桥500的主体部510的同一端，多个分支部520可以呈扇形分布以增加分支部520的分布面积，使得分支部520和第一子电极210之间的接触面积增加，增加了分支部520和第一子电极210之间连接的牢固性。例如，多个分支部520的宽度可以设置为大于主体部510的宽度，如此，可以增加导电桥500的设置有分支部510区域的电流传输通道的截面积，降低导电桥500的总电阻。
例如，在平行于衬底100的截面中，分支部520的边缘可以具有修圆的轮廓，例如，为弧形或圆形等，从而可以进一步改善边缘应力，增加抗弯性能。
例如，在本公开至少一个实施例中，图2B为本公开一个实施例提供的触控基板的导电桥的另一种结构示意图。例如图2B所示，导电桥500的主体部510包括并列设置的至少两个导电条511，每个导电条511的至少一端设置有至少一个分支部520，即导电桥500的主体部510可以设置为栅结构。触控基板在处于弯曲状态下，各导电条511彼此间隔，所以每个导电条511中产生的应力不会彼此传递，主体部510中产生的应力可以分散在每个导电条511中，如此，可以避免主体部510的局部应力过大，进一步提升导电桥500乃至触控基板的抗弯曲能力。此外，具有上述栅结构的主体部510可以提高光的透过率，提升电子显示产品(例如下述实施例中的显示面板)的显示图像的显示效果。
例如，在本公开至少一个实施例中，如图1A所示，触控基板还可以包括设置在引线区120的衬底100上的多条第一信号线620和多条第二信号线610；其中，第一信号线610与第一电极条200一一对应连接，第二信号线620与第二电极条300一一对应连接。在本公开至少一个实施例中，对衬底100上的第一信号线610和第二信号线620的分布不做限制，可以根据实际工艺条件进行设计。例如，如图1A所示，第一信号线610和第二信号线620可以汇聚至端口区域B处，以便于与外界的控制单元例如驱 动芯片等电连接。
例如，在本公开至少一个实施例中，如图1A～图1D所示，触控基板还可以包括设置在导电桥500和第二电极条300的连接部320之间的绝缘层400。绝缘层400填充在导电桥500和第二电极条300之间以防止导电桥500和第二电极条300之间产生电连接。绝缘层400的设置需要保证导电桥500和第一电极条200之间的电连接并且阻隔导电桥500和第二电极条300之间的电连接，所以根据第一电极条200、第二电极条300和导电桥500在衬底100上的不同设置位置，绝缘层400的设置方式可以包括多种。
在本公开的一些实施例中，导电桥的主体部和分支部可以设置在同一层中；在本公开的另一些实施例中，导电桥的主体部的至少一部分和分支部位于不同层中。绝缘层间隔导电桥和连接部，所以，导电桥的主体部和分支部的位置受到绝缘层的形状及设置位置的影响，下面，对上述主体部和分支部0的不同设置方式分别进行说明。
在本公开至少一个实施例中，如图1C所示，在Z轴的方向上，每个导电桥500的主体部510的至少一部分和分支部520设置在不同层中，在垂直于衬底100所在面的方向上，每个分支部520和与其部分重叠的第一子电极210直接接触而电连接。在Z轴的方向上，分支部520的未与主体部510同层的部分可以与第一子电极210全部或部分接触，并且未与绝缘层400重叠，所以，绝缘层400需要图案化处理以使得导电桥500满足上述的结构要求。
例如，在本公开至少一个实施例中，如图1A～图1D所示，绝缘层400包括多个彼此间隔的子绝缘层410，子绝缘层410与导电桥500一一对应设置，并且在垂直于衬底100所在面的方向(例如平行于Z轴的方向)上，导电桥500的主体部510在衬底100上的正投影至少部分位于子绝缘层在衬底100上的正投影之内，分支部520在衬底100上的正投影至少部分位于子绝缘层410在衬底100上的正投影之外。在上述结构的触控基板中，导电桥500的分支部520的未与子绝缘层410重叠的部分可以与第一电极条200的第一子电极210接触，如此，可以提高导电桥500和第一子电极210之间的接触面积，加固导电桥500和第一子电极210之间的连接。
在本公开至少一个实施例中，对导电桥中的分支部的分布区域不做限 定。分支部不限于图1C所示的部分与第一子电极接触，例如，在本公开至少一个实施例中，分支部的整体都可以与第一子电极接触，如此，可以增加分支部和第一子电极之间连接的牢固性。
例如，在本公开至少一个实施例中，如图1A～图1D所示，子绝缘层410的与衬底100所在面平行且远离连接部320的表面的与导电桥500接触的边缘为弧形。例如，在绝缘层400的平行于衬底100的截面中，绝缘层400的边缘均为弧形。例如，在平行于衬底100的截面中，与导电桥500接触的部分的截面形状为弧形或圆形。触控基板处于弯曲状态下，在子绝缘层410的弧形边缘处，子绝缘层410和分支部520之间相互施加应力的截面为弧形，使得应力可以在该弧形边缘上均匀分布，如此，降低了导电桥500因应力集中而发生断裂的风险。
例如，在本公开的至少一个实施例中，绝缘层400的截面形状(例如平行于衬底100所在面的截面形状)为弧形或圆形，可以进一步改善边缘应力，提高触控基板的抗弯折性能。
在本公开至少一个实施例中，对子绝缘层的平面形状不做限制，只要子绝缘层的与分支部接触的边缘为弧形即可。例如，在本公开至少一个实施例中，如图1A～图1D所示，在平行于衬底100所在面的平面中，子绝缘层410的平面形状为圆形或者椭圆形等形状。
需要说明的是，在本公开至少一个实施例中，每个导电桥的主体部的至少一部分和分支部设置在不同层，代表导电桥的主体部和分支部未全部在同一层的情况，而导电桥的主体部和分支部在衬底上的分布也不限于如图1C所示。例如，导电桥的主体部可以全部位于同一层中，即主体部在衬底上的正投影可以全部位于子绝缘层在衬底上的正投影之内；并且分支部可以在不同层中分布，例如分支部可以部分设置在子绝缘层的远离衬底的表面上，并且部分设置在子绝缘层的与衬底所在面垂直的侧表面上，并且部分设置在第一子电极上。
在本公开至少一个实施例中，图3A为本公开一个实施例提供的另一种触控基板的局部截面图。如图3A所示，每个导电桥500的主体部510和分支部520可以设置在同一层中。主体部510和分支部520同层结构的设置方式可以增加导电桥500自身结构的稳固性，在弯折过程中，可以降低导电桥500发生断裂的风险。
例如，在本公开至少一个实施例中，如图3A和图3B所示，在垂直于衬底100所在面的方向(例如平行于Z轴的方向)上，绝缘层400配置为覆盖衬底100的整个表面，并且绝缘层400中设置有过孔420，第一电极条200的第一子电极210与导电桥500的分支部520或者主体部510通过过孔420电连接。例如，可以在过孔420中设置导电体，分支部520和第一子电极210通过该导电体电连接。例如，该导电体单独设置；也可以与第一子电极210或者导电桥500由同种材料形成；或者可以与第一子电极210或者导电桥500一体形成。
在本公开至少一个实施例中，对绝缘层的制备材料不做限制，例如，绝缘层的制备材料为绝缘材料，进一步例如为弹性良好的绝缘材料。例如，绝缘层的制备材料可以包括硅的氧化物(SiOx)、硅的氮化物(SiNx)、氮氧化硅、树脂类等绝缘材料。
在本公开至少一个实施例提供的触控基板中，对第一电极条、第二电极条和导电桥在Y轴方向上的排布关系不做限制，可以根据实际需求进行设置。
例如，在本公开至少一个实施例中，如图3A所示，导电桥500设置于第二电极条300的连接部320(第二电极条300例如与第一电极条200同层设置)的远离衬底100的一侧。
例如，在本公开至少一个实施例中，图3B为本公开一个实施例提供的另一种触控基板的局部截面图。例如图3B所示，导电桥500设置于衬底100和第二电极条300的连接部320(第二电极条300例如与第一电极条200同层设置)之间。
在本公开至少一个实施例中，对第一电极条、第二电极条和导电桥的制备材料不做限制。例如，第一电极条、第二电极条和导电桥的制备材料可以为半透明或者透明的导电材料，例如氧化铟锡(ITO)、氧化铟锌(IZO)、氧化铟镓(IGO)、氧化镓锌(GZO)氧化锌(ZnO)、氧化铟(In 2O 3)、氧化铝锌(AZO)和碳纳米管等。例如，导电桥500也可以使用延展性良好的导电材料，例如金(Au)、银(Ag)、铜(Au)、铝(Al)等金属及其合金。
同种材料之间在结晶时容易连接(两者之间连接的牢固性较强)。例如，在本公开至少一个实施例中，例如第一电极条、第二电极条300和导 电桥的可以由同一种材料制备，并且形成过程中的结晶条件(例如温度、压力等参数)相近，以便于提高第一电极条、第二电极条和导电桥之间连接的牢固性。示例性的，第一电极条、第二电极条和导电桥的制备材料都可以为氧化铟锡(ITO)等。
在本公开至少一个实施例中，对第一电极条和第二电极条等的平面形状不做限制，可以根据实际需要进行设置。
例如，在本公开至少一个实施例中，如图1A和图1B所示，在垂直于衬底100所在面的方向(例如平行于Z轴的方向)上看，第二子电极310和第一子电极210的平面形状为菱形(图1B中只示出菱形的一部分)。上述结构的第一子电极210和第二子电极310可以增加触控基板的感应区域，提高触控基板的灵敏度。
例如，在本公开至少一个实施例中，图4为本公开一个实施例提供的另一种触控基板的局部结构示意图。例如图4所示，在平行于Z轴的方向上看，第一子电极210和第二子电极310的外围边缘至少部分设置为锯齿形。上述结构的触控基板具有良好的消影效果，可以提高电子显示产品(包括本公开实施例中的触控基板)的显示图像的显示效果。
例如，在本公开至少一个实施例中，图5为本公开一个实施例提供的另一种触控基板的局部结构示意图。例如图5所示，相邻第一子电极210和第二子电极310之间还可以设置有填充电极700，并且填充电极700与第一子电极210和第二子电极310间隔设置。如图4所示的第一子电极210和第二子电极310之间因存在较大的间隔区域，使得该间隔区域处的光透过率高，如此会造成显示图像的亮度分布不均等情况的出现，影响显示效果。填充电极700可以填充第一子电极210和第二子电极310之间的间隔区域，从而可以提高触控基板的透光率的分布的均匀度，提高显示图像的显示效果。例如，填充电极700可以与第一子电极210和第二子电极310同层且同材料制备，在不增加触控基板的制备工艺的同时，提高触控基板的光透过率的分布的均匀度。
在本公开至少一个实施例中，对触控基板中的第一子电极、第二子电极及其连接部等的尺寸不做限制。例如，图5中的触控基板的局部结构可以为一个触控单元，该触控单元在沿X轴的方向或者Y轴的方向的尺寸可以约为3～10毫米。例如，当触控基板应用于不同尺寸的电子显示产品中， 根据相应电子产品的尺寸，第一子电极210、第二子电极310及其连接部320等结构的尺寸可以等比例进行调整，可以降低布线占用空间，降低成本。
本公开至少一个实施例提供一种显示面板，该显示面板可以包括前述任一实施例中的触控基板。
在本公开至少一个实施例中，对触控基板在显示面板中的设置位置不做限定。例如，触控基板可以设置在显示面板的显示面的一侧；也可以嵌入式设置在显示面板的内部。
例如，在本公开实施例的一个示例中，该显示面板可以为液晶显示面板，例如该液晶显示面板可以包括阵列基板和对置基板，二者彼此对置以形成液晶盒，在液晶盒中填充有液晶材料。该对置基板例如可以为彩膜基板。阵列基板的每个像素单元的像素电极和公共电极用于施加电场对液晶材料的旋转的程度进行控制从而进行显示操作。
例如，在本公开实施例的一个示例中，该显示面板可以为有机发光二极管(OLED)显示面板，其中，该显示面板的子像素区域中可以形成有机发光材料的叠层，每个子像素单元的像素电极作为阳极或阴极用于驱动有机发光材料发光以进行显示操作。
例如，在本公开实施例的一个示例中，该显示面板可以为电子纸显示面板，其中，在该显示面板的显示基板上可以形成有电子墨水层，每个子像素单元的像素电极作为用于施加驱动电子墨水中的带电微颗粒移动以进行显示操作的电压。
在本公开至少一个实施例中，显示面板还可以为手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件，也可以与其它功能器件例如主动笔、被动笔等相配合。
本公开至少一个实施例提供一种触控基板的制备方法，包括：提供衬底，该衬底包括触控区和位于触控区周围的引线区；在触控区的衬底上形成多个并列排布的第一电极条；以及在触控区的衬底上形成多个导电桥；其中，每个第一电极条包括多个间隔设置的第一子电极，每个第一电极条中任意相邻的两个第一子电极通过导电桥之一电连接，并且导电桥包括彼此直接连接的主体部和分支部，主体部的至少一端设置有至少两个分支部。分支部可以分散导电桥中产生的应力，在触控基板处于弯曲的状态下，避 免导电桥的局部区域因应力过大而断裂。
例如，在本公开至少一个实施例中，触控基板的制备方法还可以包括:在触控区的衬底上形成多个并列排布的第二电极条；其中，第二电极条和第一电极条同层且彼此交叉排布，每个第二电极条包括多个间隔设置的第二子电极以及连接相邻第二子电极的连接部，以及在垂直于衬底所在面的方向上，连接部与主体部部分重叠。第一电极条和第二电极条相互交叉设置以在交叉位置处形成互电容，通过检测每个电容的电容变化量，可以定位触点，从而实现触控基板的触摸功能。例如，第二电极层可以与第一电极层同层并且同层制备。
需要说明的是，在本公开至少一个实施例提供的触控基板的制备方法中，根据触控基板的不同设计结构以及实际工艺要求，触控基板的制备方法可以不同。下面，在本公开至少一个实施例的几个示例中，对触控基板的几个制备方法进行说明。
例如，在本公开至少一个实施例中，每个导电桥的主体部的至少一部分和所述分支部形成在不同层中。示例性的，以制备如图1C所示的触控基板为例，在本公开至少一个实施例的一个示例中，在触控区110的衬底100上形成多个导电桥500包括：在衬底100上沉积绝缘材料薄膜并对其进行构图工艺以形成包括多个子绝缘层410的绝缘层400；在形成有多个子绝缘层410的衬底100上沉积导电材料薄膜并对其进行构图工艺以形成导电桥500，形成的子绝缘层410与导电桥500一一对应设置，其中，导电桥500的制备材料的抗腐蚀性小于第一电极条200和第二电极条300的制备材料的抗腐蚀性。在由本公开的实施例的制备方法制备的触控基板中，对导电桥500的主体部510和分支部520的分布不做限制，例如，在垂直于衬底100所在面的方向上，主体部510在衬底100上的正投影至少部分位于子绝缘层410在衬底100上的正投影之内，分支部520在衬底100上的正投影位于子绝缘层410在衬底100上的正投影之外。
导电桥500的制备材料和第一电极条200、第二电极条300的制备材料不同，在构图工艺中，例如，可以选用可以腐蚀导电桥500但是不会对第一电极条200、第二电极条300造成腐蚀的腐蚀液；例如，第一电极条200和第二电极条300的制备材料对构图工艺中的腐蚀液的抗腐蚀性大于导电桥500的制备材料对构图工艺中的腐蚀液的抗腐蚀性。示例性的，对 构图工艺中的腐蚀液的制备材料可以为氧化铟锡(ITO)，ITO需要通过例如王水进行腐蚀，对于其他的腐蚀液抗腐蚀性能力较高，导电桥500的制备材料例如可以为铜(Cu)，铜材料可以通过三氯化铁等进行刻蚀。
例如，在本公开至少一个实施例中，每个导电桥的主体部的至少一部分和所述分支部形成在不同层中。示例性的，以制备如图1C所示的触控基板为例，在本公开至少一个实施例的一个示例中，在触控区110的衬底100上形成多个导电桥500包括：在衬底100上沉积绝缘材料薄膜并对其进行构图工艺以形成包括多个子绝缘层410的绝缘层400；提供第一掩模板，通过该第一掩模板在衬底100上沉积导电材料薄膜以形成多个导电桥500，形成的子绝缘层410与导电桥500一一对应设置。在由本公开的实施例的制备方法制备的触控基板中，对导电桥500的主体部510和分支部520的分布不做限制，例如，在垂直于衬底100所在面的方向上，主体部510在衬底100上的正投影至少部分位于子绝缘层410在衬底100上的正投影之内，分支部520在衬底100上的正投影位于子绝缘层410在衬底100上的正投影之外。
例如，在本公开至少一个实施例中，每个导电桥的主体部和分支部形成在同一层中。例如，以制备如图3A所示的触控基板为例，在本公开至少一个实施例的另一个示例中，在触控区110的衬底100上形成多个导电桥500包括：在形成有第一导电条200衬底100上沉积绝缘材料薄膜以形成绝缘层400，绝缘层400例如可以覆盖触控区的全部；对绝缘层400进行构图工艺以在绝缘层400中形成多个过孔420，过孔420暴露第一电极条200的第一子电极210的部分区域；在绝缘层400上沉积导电材料薄膜并对其进行构图工艺以形成多个导电桥500，导电桥500的分支部520通过过孔420与第一子电极210电连接。
例如，在本公开至少一个实施例中，每个导电桥的主体部和分支部形成在同一层中。例如，以制备如图3B所示的触控基板为例，在本公开至少一个实施例的另一个示例中，在触控区110的衬底100上形成多个导电桥500包括：在衬底100上沉积导电材料薄膜并对其进行构图工艺以形成多个导电桥500，在形成有导电桥500的衬底100上沉积绝缘材料薄膜以形成绝缘层400，绝缘层400例如可以覆盖触控区的全部；对绝缘层400进行构图工艺以在绝缘层400中形成多个过孔420，过孔420暴露导电桥 500的部分区域(例如导电桥500的分支部520的部分区域)；在绝缘层400上沉积导电材料薄膜并对其进行构图工艺以形成多个并列的第一电极条200(例如可以同步形成多个并列的第二电极条300)，并且第一电极条200的第一子电极210通过过孔420与导电桥500电连接。
由本公开至少一个实施例的制备方法制造的触控基板的结构，可以参考前述实施例(关于触控基板的实施例)中的相关内容，在此不做赘述。
下面，在本公开至少一个实施例中，对触控基板的制备方法进行说明，图6A～图6B、图7、图8A～图8B以及图9A～图9B为本公开一个实施例提供的一种触控基板的制备方法的过程图。例如图6A～图6B、图7、图8A～图8B以及图9A～图9B所示，以制备如图1C所示的触控基板为例，本公开至少一个实施例提供的触控基板的制备方法可以包括如下过程，其中，每个导电桥500的主体部510的至少一部分和分支部520设置在不同层。
图6B为图6A所示的A区域的截面图，如图6A和图6B所示，提供衬底100，在衬底100上沉积导电材料薄膜并对其进行构图工艺后形成多个并列的第一电极条200和多个第二电极条300，每个第一电极条200和每个第二电极条300相互交叉设置，并且衬底100包括触控区110和位于触控区110周围的引线区120，第一电极条200和第二电极条300形成衬底100的触控区中，每个第一电极条200包括多个间隔设置的第一子电极210，每个第二电极条300包括多个间隔设置的第二子电极310以及连接相邻第二子电极310的连接部320。
衬底的制备材料可以为透明或半透明的柔性材料。例如，衬底的制备材料可以为树脂类材料，包括聚酰亚胺、聚碳酸酯、聚丙烯酸酯、聚醚酰亚胺、聚醚砜、聚对苯二甲酸乙二醇酯和聚萘二甲酸乙二醇酯等中的一种或多种。
例如，在本公开至少一个实施例中，构图工艺可以包括干刻或者湿刻。例如构图工艺的过程可以包括：在需要被构图的结构层上涂覆光刻胶层，使用掩模板对光刻胶层进行曝光，对曝光的光刻胶层进行显影以得到光刻胶图案，使用光刻胶图案作为掩模对结构层进行蚀刻，然后可选地去除光刻胶图案。
例如，在本公开至少一个实施例中，在如图6A和图6B所示的制备第一电极条200和第二电极条300的过程中，通过构图工艺可以使得第一子 电极210和第二子电极310的边缘形成为如图4所示的锯齿状，以获得消影效果。
例如，在本公开至少一个实施例中，在如图6A和图6B所示的制备第一电极条200和第二电极条300的过程中，对导电材料薄膜进行构图工艺以获得第一子电极210和第二子电极310的过程中，可以同步获得图5所示的填充电极700，从而保持触控基板透光率的均匀性。
如图7所示，在引线区120中的衬底100上形成第一信号线610和第二信号线620，并且第一信号线610与第一电极条200电连接，第二信号线620与第二信号线300电连接。需要说明的是，本公开的实施例对第一信号线610和第二信号线620的形成方式以及在整个制备工艺步骤中的排布顺序不做限制，只要信号线可以与其相对应的电极条连接即可。例如，在制备第一电极条200和第二电极条300的过程中，可以对导电材料薄膜进行构图工艺以同时形成第一电极条200、第二电极条300、第一信号线610和第二信号线620；例如，可以先形成第一信号线610和第二信号线620后再形成第一电极条200和第二电极条300，或者先形成第一电极条200和第二电极条300后再形成第一信号线610和第二信号线620。
在本公开至少一个实施例中，对第一信号线610和第二信号线620的制备材料不做限制。例如，第一信号线610和第二信号线620的制备材料可以为柔性良好的导电材料，例如铜、铝、银或金等金属或者金属合金等。
图8B为图8A所示的A区域的截面图，如图8A和图8B所示，在形成有第一电极条200和第二电极条300的衬底100上沉积绝缘材料薄膜并对其进行构图工艺以形成包括多个彼此间隔的子绝缘层410的绝缘层400，子绝缘层410形成在第一电极条200和第二电极条300相互交叉的位置，并且在Z轴的方向上，子绝缘层410与连接部320部分重叠。例如，在沿Y轴的方向上，子绝缘层410覆盖连接部320的全部。子绝缘层410的结构可以参考前述实施例(关于触控基板的实施例)中的相关说明，本公开的实施例在此不做赘述。
图9B为图9A所示的A区域的截面图，如图9A和图9B所示，提供第一掩模板800，然后透过第一掩模板800在形成有绝缘层400的衬底100上沉积导电材料以形成多个导电桥500。导电桥500包括主体部510和分支部520，主体部的至少一端设置有至少两个分支部520。例如，在Z轴 的方向上，主体部510在衬底100上的正投影至少部分位于子绝缘层410在衬底100上的正投影之内，分支部520在衬底100上的正投影至少部分位于子绝缘层410在衬底100上的正投影之外。例如，通过第一掩模板800形成导电桥500的方法可以包括磁控溅射等。导电桥500的结构可以参考前述实施例(关于触控基板的实施例)中的相关说明，本公开的实施例在此不做赘述。
需要说明的是，在本公开至少一个实施例提供的触控基板的制备方法中，对第一信号线和第二信号线的形成方式不做限制，可以参考前述实施例(例如图7所示的关于触控基板的制备方法的实施例)中的相关说明，本公开在此不做赘述。
本公开至少一个实施例提供一种触控基板及其制备方法、显示面板，并且可以具有以下至少一项有益效果：
(1)本公开至少一个实施例提供一种触控基板，触控基板中的导电桥设置为包括多个分支部的分支结构，在弯曲状态下，导电桥中的部分应力分摊至不同的分支部，防止因应力集中使得导电桥局部应力过大而发生断裂。
(2)在本公开至少一个实施例提供的触控基板中，导电桥的分支部可以增加导电桥和第一电极条之间的接触面积，增加导电桥和第一电极条之间连接的牢固性。
(3)在本公开至少一个实施例提供的触控基板中，导电桥的分支部可以增加导电桥的电流传输通道的截面积，降低导电桥的电阻。
(4)在本公开至少一个实施例提供的触控基板中，绝缘层的面向导电桥的表面的与导电桥接触的边缘设计为弧形，可以改善该边缘处的导电桥的应力分布，防止局部应力过大导致导电桥断裂。
对于本公开，还有以下几点需要说明：
(1)本公开实施例附图只涉及到与本公开实施例涉及到的结构，其他结构可参考通常设计。
(2)为了清晰起见，在用于描述本公开的实施例的附图中，层或区域的厚度被放大或缩小，即这些附图并非按照实际的比例绘制。
(3)在不冲突的情况下，本公开的实施例及实施例中的特征可以相互组合以得到新的实施例。
以上，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，本公开的保护范围应以权利要求的保护范围为准。

Claims (21)

  1. 一种触控基板，包括：
    衬底，包括触控区和位于所述触控区周围的引线区；
    多个第一电极条，并列设置于所述触控区的所述衬底上，每个所述第一电极条包括多个间隔设置的第一子电极；以及
    多个导电桥，设置于所述触控区的所述衬底上，每个所述第一电极条中任意相邻的两个所述第一子电极通过所述导电桥之一电连接；
    其中，每个所述导电桥包括彼此直接连接的主体部和分支部，所述主体部的至少一端设置有至少两个所述分支部。
  2. 根据权利要求1所述的触控基板，还包括：
    多个第二电极条，并列设置于所述触控区的所述衬底上，所述第二电极条和所述第一电极条同层设置，并且所述第一电极条所在的延伸线与所述第二电极条所在的延伸线彼此交叉，每个所述第二电极条包括多个间隔设置的第二子电极以及连接相邻所述第二子电极的连接部；
    其中，在垂直于所述衬底所在面的方向上，所述连接部与所述导电桥的所述主体部的至少一部分重叠。
  3. 根据权利要求2所述的触控基板，其中，
    每个所述导电桥的所述主体部的至少一部分和所述分支部设置在不同层中，在垂直于衬底所在面的方向上，每个所述分支部和与其部分重叠的所述第一子电极直接接触而电连接。
  4. 根据权利要求3所述的触控基板，其中，
    每个所述分支部的整体接触对应的所述第一子电极。
  5. 根据权利要求2-4中任一项所述的触控基板，还包括：
    绝缘层，设置在所述多个第二电极条的所述连接部和所述多个导电桥之间；
    其中，所述绝缘层包括多个彼此间隔的子绝缘层，所述子绝缘层与所述导电桥一一对应设置，并且
    所述主体部在所述衬底上的正投影的至少部分位于所述子绝缘层在所述衬底上的正投影之内，所述分支部在所述衬底上的正投影位于所述子绝缘层在所述衬底上的正投影之外。
  6. 根据权利要求5所述的触控基板，其中，
    所述子绝缘层的与所述衬底所在面平行且远离所述连接部的表面的与所述导电桥接触的边缘为弧形。
  7. 根据权利要求6所述的触控基板，其中，
    在平行于所述衬底所在面的平面中，所述子绝缘层的平面形状为圆形或者椭圆形。
  8. 根据权利要求2所述的触控基板，其中，
    每个所述导电桥的所述主体部和所述分支部设置在同一层中。
  9. 根据权利要求8的触控基板，还包括：
    绝缘层，设置在所述多个第二电极条的所述连接部和所述多个导电桥之间，所述绝缘层中设置有过孔；
    其中，所述第一子电极与所述导电桥通过所述过孔电连接。
  10. 根据权利要求1-9中任一项所述的触控基板，其中，
    在平行于所述衬底所在面的平面中，每个所述分支部的边缘为弧形。
  11. 根据权利要求1-10中任一项所述的触控基板，其中，
    在所述主体部的同一端，相邻两个分支部之间的夹角为30度～60度。
  12. 根据权利要求1-11中任一项所述的触控基板，其中，
    在所述主体部的同一端，至少两个所述分支部关于所述主体部的延伸线轴对称设置。
  13. 根据权利要求1-12中任一项所述的触控基板，其中，
    所述主体部包括并列间隔设置的至少两个导电条，每个所述导电条的一端设置有至少一个所述分支部。
  14. 根据权利要求1-13中任一项所述的触控基板，其中，
    所述导电桥设置于所述第一电极条靠近所述衬底的一侧；或者
    所述导电桥设置于所述第一电极条的远离所述衬底的一侧。
  15. 一种显示面板，包括权利要求1-14中任一项所述的触控基板。
  16. 一种触控基板的制备方法，包括：
    提供衬底，该衬底包括触控区和位于所述触控区周围的引线区；
    在所述触控区的所述衬底上形成多个并列排布的第一电极条；以及
    在所述触控区的所述衬底上形成多个导电桥；
    其中，每个所述第一电极条包括多个间隔设置的第一子电极，每个所 述第一电极条中任意相邻的两个所述第一子电极通过所述导电桥之一电连接，并且所述导电桥包括彼此直接连接的主体部和分支部，所述主体部的至少一端设置有至少两个所述分支部。
  17. 根据权利要求16所述的制备方法，还包括：
    在所述触控区的所述衬底上形成多个并列排布的第二电极条；
    其中，所述第二电极条和所述第一电极条同层且彼此交叉排布，每个所述第二电极条包括多个间隔设置的第二子电极以及连接相邻所述第二子电极的连接部，以及在垂直于所述衬底所在面的方向上，所述连接部与所述主体部部分重叠。
  18. 根据权利要求17所述的制备方法，其中，每个所述导电桥的主体部的至少一部分和所述分支部设置在不同层中，在所述触控区的所述衬底上形成多个导电桥包括：
    在所述衬底上沉积绝缘材料薄膜并对其进行构图工艺以形成包括多个子绝缘层的绝缘层；以及
    在形成有所述绝缘层的所述衬底上沉积导电材料薄膜并对其进行构图工艺以形成所述导电桥，所述子绝缘层与所述导电桥一一对应设置；
    其中，所述导电桥的制备材料的抗腐蚀性小于所述第二电极条和所述第一电极条的制备材料的抗腐蚀性，以及在垂直于所述衬底所在面的方向上，所述主体部在所述衬底上的正投影至少部分位于所述子绝缘层在所述衬底上的正投影之内，所述分支部在所述衬底上的正投影位于所述子绝缘层在所述衬底上的正投影之外。
  19. 根据权利要求17所述的制备方法，其中，每个所述导电桥的主体部的至少一部分和所述分支部设置在不同层中，在所述触控区的所述衬底上形成多个导电桥包括：
    在所述衬底上沉积绝缘材料薄膜并对其进行构图工艺以形成包括多个子绝缘层的绝缘层；以及
    提供第一掩模板，通过所述第一掩模板在所述衬底上沉积导电材料以形成多个所述导电桥，所述子绝缘层与所述导电桥一一对应设置；
    其中，在垂直于所述衬底所在面的方向上，所述主体部在所述衬底上的正投影至少部分位于所述子绝缘层在所述衬底上的正投影之内，所述分支部在所述衬底上的正投影位于所述子绝缘层在所述衬底上的正投影之 外。
  20. 根据权利要求17所述的制备方法，其中，每个所述导电桥的主体部和分支部设置在同一层中，在所述触控区的所述衬底上形成多个导电桥包括：
    在形成有所述多个第一电极条的所述衬底上沉积绝缘材料薄膜以形成绝缘层；
    对所述绝缘层进行构图工艺以在所述绝缘层中形成过孔，所述过孔暴露所述第一子电极的部分区域；以及
    在所述绝缘层上沉积导电材料薄膜并对其进行构图工艺以形成所述导电桥，所述导电桥的所述分支部通过所述过孔与所述第一子电极电连接。
  21. 根据权利要求17所述的制备方法，其中，每个所述导电桥的主体部和分支部设置在同一层中，在所述触控区的所述衬底上形成多个导电桥包括：
    在所述衬底上沉积导电材料薄膜并对其进行构图工艺以形成所述导电桥；
    在形成有所述导电桥的所述衬底上沉积绝缘材料薄膜以形成绝缘层；
    对所述绝缘层进行构图工艺以在所述绝缘层中形成过孔，所述过孔暴露所述导电桥的部分区域；
    其中，在所述触控区的所述衬底上形成多个并列排布的第一电极条包括：
    在所述绝缘层上沉积导电材料薄膜并对其进行构图工艺以形成所述多个第一电极条，任意相邻的两个所述第一子电极通过所述过孔与所述导电桥电连接。
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