WO2019047337A1 - 一种双半基板间隙的校正器件及校正方法 - Google Patents

一种双半基板间隙的校正器件及校正方法 Download PDF

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Publication number
WO2019047337A1
WO2019047337A1 PCT/CN2017/106794 CN2017106794W WO2019047337A1 WO 2019047337 A1 WO2019047337 A1 WO 2019047337A1 CN 2017106794 W CN2017106794 W CN 2017106794W WO 2019047337 A1 WO2019047337 A1 WO 2019047337A1
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correction
arm
corrected
substrate
half substrate
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French (fr)
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赵俊豪
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • the present invention relates to the field of screen display technologies, and in particular, to a correction device and a correction method for a double-half substrate gap.
  • touch panels are produced in order to reduce investment and reduce production equipment, usually using a dual half-substrate (Dual Half Glass) structure.
  • AMOLED Active-Matrix Organic Light-Emitting Diode
  • the two common methods of the two-semi-substrate are: placing a fixed gap (Gap) in the middle of two separate semi-substrates (Half Glass), simultaneously picking and placing in the production process, and simultaneously forming, cleaning or measuring. Due to some factors during the pick-and-place process of the double-half substrate, the double-half substrate is deviated from the preset placement position. Therefore, in the double-sub-substrate production mode, it is not only necessary to align the substrate position around each half-substrate, but also to correct the gap between the two half-substrates. As shown in FIG.
  • the gap correction of the current two half substrates 11', 12' generally adopts the same pattern as the correction of the four sides, and sets a fixed correction range and position.
  • the correction device 2' When the substrate is placed, the correction device 2' is vertically raised. The substrate is calibrated and aligned under the movement of the moving track 3'. In this mode, the correction device 2' has a small correction range. If the substrate offset exceeds the correction range, the correction device 2' rises when the substrate is lifted. , resulting in abnormal conditions such as fragmentation.
  • the technical problem to be solved by the present invention is to provide a correction device and a correction method for the double-substrate gap, which can expand the correction range and avoid the occurrence of fragmentation abnormality.
  • the present invention provides a correction device for a double-half substrate gap, comprising: a moving track groove and a correction arm movably coupled to the moving track groove, the correction arm comprising:
  • a sensor disposed on the upper arm or the lower arm for detecting a position of the half substrate to be corrected
  • the correcting unit performs correct positioning on the half substrate to be corrected according to the position of the half substrate to be corrected detected by the sensor.
  • the sum of the length of the moving rail groove, the length of the horizontal arm, and the cross-sectional radius of the correction portion is the maximum correction distance of the correction device in the horizontal direction.
  • the detecting the position of the half substrate to be corrected by the sensor is specifically detecting the position of the edge of the half substrate to be corrected.
  • the senor is disposed at the center of the upper arm or at the outer surface of the upper arm.
  • correction arm is rotatably coupled to the moving rail groove, and the lower arm is a rotating shaft.
  • the correcting arm moves to one end of the moving track groove near the edge of the half substrate to be corrected, if the sensor detects that the edge of the half substrate to be corrected is at the length of the horizontal arm and If the sum of the cross-sectional radii of the correction portion is within the rotation range of the rotation radius, the correction arm is rotated to the edge of the half substrate to be corrected and then raised to perform correction positioning, otherwise the calibration range beyond the correction device is issued. Alert.
  • the invention also provides a method for correcting a correction device for a double-substrate gap, comprising:
  • the correction arm further comprising: a correction portion; an upper arm disposed below the correction portion, the upper arm including a bottom portion of the correction portion a vertical arm extending vertically downwardly from the center and a horizontal arm vertically connected to the vertical arm; a lower arm extending vertically downward from the end of the horizontal arm and connected to the moving rail slot ;
  • the detecting the position of the half substrate to be corrected by the sensor is specifically detecting the position of the edge of the half substrate to be corrected.
  • correction arm is rotatably coupled to the moving rail groove, and the lower arm is a rotating shaft.
  • the correction arm moves to one end of the moving track groove near the edge of the half substrate to be corrected, if the edge of the half substrate to be corrected is at the length of the horizontal arm and the cross section of the correction portion When the sum of the radii is within the range of rotation of the radius of rotation, the correction arm is rotated to the edge of the half-substrate to be corrected and then raised for correct positioning, otherwise an alarm exceeding the correction range of the correction device is issued.
  • the invention also provides a method for correcting the gap of the double semi-substrate, comprising:
  • the correction arm further comprising: a correction portion; an upper arm disposed below the correction portion, the upper arm including a bottom portion of the correction portion a vertical arm extending vertically downwardly from the center and a horizontal arm vertically connected to the vertical arm; a lower arm extending vertically downward from the end of the horizontal arm and connected to the moving rail slot ;
  • the sum of the length of the moving rail groove, the length of the horizontal arm, and the cross-sectional radius of the correction portion is the maximum correction distance of the correction device in the horizontal direction.
  • the correcting arm moves to one end of the moving track groove near the edge of the half substrate to be corrected, if the sensor detects that the edge of the half substrate to be corrected is at the length of the horizontal arm and If the sum of the cross-sectional radii of the correction portion is within the rotation range of the rotation radius, the correction arm is rotated to the edge of the half substrate to be corrected and then raised to perform correction positioning, otherwise the calibration range beyond the correction device is issued. Alert.
  • An advantageous effect of the embodiment of the present invention is that by providing a vertical arm and a horizontal arm vertically connected thereto, the moving range of the correcting portion is extended in the horizontal direction, thereby avoiding an abnormal situation such as fragmentation due to limited distance. Further, the correction arm is designed to be rotatable about the lower arm, so that the correction device can obtain a larger correction range.
  • Figure 1 is a schematic view showing the correction of the double half glass gap in the prior art.
  • FIG. 2 is a schematic structural view of a correction device for a double-substrate gap according to an embodiment of the present invention.
  • FIG 3 is another schematic structural view of a correction device for a double-substrate gap according to an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of a double half substrate gap correction device correcting a double half substrate gap according to an embodiment of the present invention.
  • FIG. 5 is another schematic diagram of the correction device for double-substrate gap correction of the double-substrate gap according to the embodiment of the present invention.
  • Fig. 6 is a schematic view showing the range of rotation of the correcting arm in the first embodiment of the present invention.
  • FIG. 7 is a schematic flow chart of a method for correcting a double-substrate gap correction device according to Embodiment 2 of the present invention.
  • a first embodiment of the present invention provides a correction device for a double-substrate gap, comprising: a moving track groove 4 and a correction arm 2 movably coupled to the moving track groove 4.
  • the correction arm 2 further includes :
  • a sensor 3 disposed on the upper arm 21 or the lower arm 22 for detecting the position of the half substrate to be corrected
  • the correcting unit 20 performs correction positioning on the half substrate to be corrected according to the position of the half substrate to be corrected detected by the sensor 3.
  • This embodiment is designed by designing the upper arm 21 of the correcting device as an L-type vertical arm 211 and The vertically extending horizontal arm 212 corresponds to the range in which the correction portion 20 is moved in the horizontal direction (that is, the longitudinal direction of the horizontal arm 212).
  • the upper arm of the correcting device 2' is of type I (see FIG.
  • the correcting device of the embodiment 2 by providing the horizontal arm 212 and the vertical arm 211 vertically connected to the horizontal arm 212, the correction portion 20 connected to the top end of the vertical arm 211 forms a distance difference from the lower arm 22 in the horizontal direction (also That is, the length R) of the horizontal arm 212, such that the movable distance of the correcting portion 20 in the horizontal direction is expanded to the length of the moving rail groove 4 + the length R of the horizontal arm 212, and thus can be horizontally
  • the calibration range has been expanded.
  • the correction portion 20 is a cylinder having a cross-sectional radius set to r.
  • the maximum projection length of the correction device of the present embodiment on the horizontal plane is: the length G of the moving rail groove 4 + the length R of the horizontal arm 212 + the cross-sectional radius r of the correction portion 20, and the maximum projection length is
  • the maximum correction distance can be determined by selecting different lengths of the moving rail groove 4 and the length R of the horizontal arm 212 and the cross-sectional radius r of the correction portion 20.
  • the sensor 3 detects the position of the half substrate 11 to be corrected, specifically, the position of the edge 110 of the half substrate 11 to be corrected.
  • the sensor 3 may be disposed on the upper arm 21 or on the lower arm 22. This embodiment is described by taking the upper arm 21 as an example.
  • the sensor 3 is disposed at the center of the upper arm 211 of the upper arm 21 (as shown in FIG. 2) or on the outer surface of the upper arm 211 (as shown in FIG. 3). Show).
  • the sensor 3 detects the position of the edge 110 of the half substrate 11 to be corrected, the distance between the edge 110 of the half substrate 11 to be corrected and the position of the sensor 3 can be obtained.
  • the above distance can be converted into a projection distance on a horizontal plane, and the detection distance D is set.
  • the lower arm 22 is located in the middle of the moving rail groove 4, and the correcting portion 20 is located below the half substrate 11 to be corrected, and if the correcting arm 2 is raised, it will be pushed to the half substrate 11 to be corrected to cause fragmentation. Therefore, it is necessary to move the correcting portion 20 toward the edge 110 of the half substrate 11 to be corrected in the direction of the arrow shown in the figure, so that the correcting portion 20 is outside the edge 110, and then raise the half substrate 11 to be corrected to the correct position (see FIG. 4). In the dotted line box).
  • the correction portion 20 which is located farther from the edge 110 below the half substrate 11 to be corrected can also move the correction portion 20 by moving the correction arm 2 on the moving rail groove 4. Correct positioning is performed outside the edge 110, greatly expanding the reality. The example corrects the correction range of the device. Of course, if the correction portion 20 is still under the half substrate 11 to be corrected and cannot move outside the edge 110 by the foregoing movement, it indicates that the half substrate 11 to be corrected at this time has exceeded the maximum correction distance of the correction device, and an alarm will be issued. Avoid correcting the device and causing abnormal conditions such as fragmentation.
  • the correcting arm 2 of the correcting device of the present embodiment can rotate the lower arm 22 as an axis, so that the correcting device can obtain a larger correction range.
  • the correcting portion 20 is still below the half substrate 11 to be corrected even if the correction arm 2 is translated on the moving rail groove 4 by the foregoing, if it is raised, The fragment is generated by the substrate 11 to be corrected.
  • the correcting arm 2 can also rotate the lower arm 22 as an axis, it can be rotated from the position of the broken line as indicated by the arrow in the figure, so that the correcting portion 20 is brought close to the edge 110 of the half substrate 11 to be corrected, and then the half substrate 11 to be corrected is raised. The position is corrected for positioning.
  • the correcting arm 2 moves to the end of the moving track 4 near the edge 110 of the half substrate 11 to be corrected, if the sensor 3 detects that the edge 110 of the half substrate 11 to be corrected is in the horizontal branch
  • the sum of the length R of the arm 212 and the cross-sectional radius r of the correcting portion 20 is within the range of rotation of the radius of rotation, indicating that the correcting arm 2 can be normally raised for correction by correcting the rotation of the arm 2; conversely, if the half to be corrected
  • the edge 110 of the substrate 11 is outside the aforementioned range of rotation, indicating that it cannot be corrected by the rotation of the correction arm 2 (because if the correction device is raised at this time, it will be topped to the half substrate 11 to be corrected), beyond the correction device.
  • the correction range will also give an alarm.
  • the rotation range A of the correction arm 2 intersects the edge 110 of the half substrate 11 to be corrected, and the intersecting edge 110 is in the rotation range A. Therefore, the correction portion 20 can be rotated to the edge 110.
  • the correction is performed again, and the condition of the fragmentation to the half substrate 11 to be corrected does not occur.
  • the rotation range B of the correction arm 2 does not intersect with the other side edge 111 of the half substrate 11 to be corrected, the entire rotation range B is still in the range of the substrate 11 to be corrected, and the correction portion 20 cannot be rotated outside the edge 110 and then raised. Correction, once raised, will hit the half substrate 11 to be corrected and fragmentation will occur.
  • the edge 110 of the half substrate 11 to be corrected may be outside the rotation range, but at this time, by moving on the moving rail groove 4
  • the edge 110 moves the correction arm 2 (actually equivalent to pushing the rotation range toward the edge 110), and the edge 110 of the half substrate 11 to be corrected will be in the rotation range.
  • a second embodiment of the present invention provides a method for correcting a double-substrate gap correction device according to the first embodiment of the present invention.
  • the method includes:
  • the correction arm further comprising: a correction portion; an upper arm disposed below the correction portion, the upper arm including a bottom portion of the correction portion a vertical arm extending vertically downwardly from the center and a horizontal arm vertically connected to the vertical arm; a lower arm extending vertically downward from the end of the horizontal arm and connected to the moving rail slot ;
  • the detecting the position of the half substrate to be corrected by the sensor is specifically detecting the position of the edge of the half substrate to be corrected.
  • correction arm is rotatably coupled to the moving rail groove, and the lower arm is a rotating shaft.
  • the correction arm moves to one end of the moving track groove near the edge of the half substrate to be corrected, if the edge of the half substrate to be corrected is at the length of the horizontal arm and the cross section of the correction portion When the sum of the radii is within the range of rotation of the radius of rotation, the correction arm is rotated to the edge of the half-substrate to be corrected and then raised for correct positioning, otherwise an alarm exceeding the correction range of the correction device is issued.
  • the sum of the length of the moving rail groove, the length of the horizontal arm, and the cross-sectional radius of the correction portion is the maximum correction distance of the correction device in the horizontal direction.
  • the sensor is disposed in the center of the upper arm or on the outer surface of the upper arm.
  • the beneficial effects of the embodiment of the present invention are that the vertical arm and the horizontal arm connected perpendicularly thereto are disposed to extend the moving range of the correcting portion in the horizontal direction, thereby avoiding the occurrence of fragmentation due to the limited distance. And other abnormal conditions. Further, the correction arm is designed to be rotatable about the lower arm, so that the correction device can obtain a larger correction range.

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Abstract

一种双半基板间隙的校正器件，包括：移动轨槽（4）和可移动地连接在所述移动轨槽（4）上的校正臂（2），所述校正臂（2）进一步包括：校正部（20）；设置在所述校正部（20）下方的上臂（21），所述上臂（21）包括自所述校正部（20）底部中央竖直向下延伸的竖直支臂（211）和与所述竖直支臂（211）垂直相连的水平支臂（212）；自所述水平支臂（212）末端竖直向下延伸并与所述移动轨槽（4）相连接的下臂（22）；设置在所述上臂（21）或所述下臂（22）上的传感器，用于侦测待校正半基板（11）的位置；所述校正部（20）根据所述传感器侦测的待校正半基板（11）的位置，对待校正半基板（11）进行校正定位。通过设置竖直支臂（211）和与其垂直相连的水平支臂（212），在水平方向延展了校正部（20）的移动范围，避免出现因距离受限而导致发生破片等异常状况。

Description

一种双半基板间隙的校正器件及校正方法
本申请要求于2017年9月8日提交中国专利局、申请号为201710805146.7、发明名称为“一种双半基板间隙的校正器件及校正方法”的中国专利申请的优先权，上述专利的全部内容通过引用结合在本申请中。
技术领域
本发明涉及屏幕显示技术领域，尤其涉及一种双半基板间隙的校正器件及校正方法。
背景技术
在最新的有源矩阵有机发光二极管AMOLED(Active-Matrix Organic Light-Emitting Diode)制程中，触控面板生产时为降低投资，减少生产设备，通常采用双半基板(Dual Half Glass)结构进行生产。
双半基板目前比较常见的方法为：将两个各自独立的半基板(Half Glass)放置时中间预留固定间隙(Gap)，生产过程中同时取放，并同时成膜，清洗或量测，在双半基板取放过程中因某种因素影响，会使得双半基板偏离预设放片位置。因此，在双半基板生产模式下，不仅需要每个半基板四周对基板位置进行校正(Alignment)，在两个半基板中间也需对其间隙进行校正对位。如图1所示，当前两个半基板11′、12′的间隙校正一般采用同四周的校正相同样式，设定固定的校正范围和位置，当基板放置完成后，校正器件2′竖直升起，在移动轨槽3′带动下对基板进行校正对位，此种模式下校正器件2′校正范围较小，如果基板偏移超出校正范围后会造成校正器件2′升起时顶起基板，导致破片等异常状况。
发明内容
本发明所要解决的技术问题在于，提供一种双半基板间隙的校正器件及校正方法，能够扩大校正范围，避免破片异常状况发生。
为了解决上述技术问题，本发明提供一种双半基板间隙的校正器件，包括：移动轨槽和可移动地连接在所述移动轨槽上的校正臂，所述校正臂包括：
校正部；
设置在所述校正部下方的上臂，所述上臂包括自所述校正部底部中央竖直向下延伸的竖直支臂和与所述竖直支臂垂直相连的水平支臂；
自所述水平支臂末端竖直向下延伸并与所述移动轨槽相连接的下臂；
设置在所述上臂或所述下臂上的传感器，用于侦测待校正半基板的位置；
所述校正部根据所述传感器侦测的待校正半基板的位置，对待校正半基板进行校正定位。
其中，所述移动轨槽的长度、所述水平支臂的长度以及所述校正部的横截面半径之和为所述校正器件在水平方向上的最大校正距离。
其中，所述传感器侦测待校正半基板的位置具体是侦测待校正半基板的边缘的位置。
其中，所述传感器设置在所述上支臂内部中央，或者设置在所述上支臂外表面。
其中，所述校正臂可旋转地连接在所述移动轨槽上，所述下臂为旋转轴。
其中，当所述校正臂移动到所述移动轨槽上靠近待校正半基板的边缘的一端时，如果所述传感器侦测到待校正半基板的边缘处于以所述水平支臂的长度及所述校正部的横截面半径之和为旋转半径的旋转范围内，则使所述校正臂旋转至待校正半基板的边缘之外再升起进行校正定位，否则发出超出所述校正器件的校正范围的警报。
本发明还提供一种双半基板间隙的校正器件的校正方法，包括：
提供移动轨槽以及可移动地连接在所述移动轨槽上的校正臂，所述校正臂进一步包括：校正部；设置在所述校正部下方的上臂，所述上臂包括自所述校正部底部中央竖直向下延伸的竖直支臂和与所述竖直支臂垂直相连的水平支臂；自所述水平支臂末端竖直向下延伸并与所述移动轨槽相连接的下臂；
在所述上臂或所述下臂上设置用于侦测待校正半基板的位置传感器；
根据所述传感器侦测的待校正半基板的位置，使所述校正部对待校正半基板进行校正定位。
其中，所述传感器侦测待校正半基板的位置具体是侦测待校正半基板的边缘的位置。
其中，所述校正臂可旋转地连接在所述移动轨槽上，所述下臂为旋转轴。
其中，当所述校正臂移动到所述移动轨槽上靠近待校正半基板的边缘的一端时，如果待校正半基板的边缘处于以所述水平支臂的长度及所述校正部的横截面半径之和为旋转半径的旋转范围内，则使所述校正臂旋转至待校正半基板的边缘之外再升起进行校正定位，否则发出超出所述校正器件的校正范围的警报。
本发明还提供一种双半基板间隙的校正方法，包括：
提供移动轨槽以及可移动地连接在所述移动轨槽上的校正臂，所述校正臂进一步包括：校正部；设置在所述校正部下方的上臂，所述上臂包括自所述校正部底部中央竖直向下延伸的竖直支臂和与所述竖直支臂垂直相连的水平支臂；自所述水平支臂末端竖直向下延伸并与所述移动轨槽相连接的下臂；
在所述上臂或所述下臂上设置用于侦测待校正半基板的位置传感器；
根据所述传感器侦测的待校正半基板的位置，使所述校正部对待校正半基板进行校正定位；
其中，所述移动轨槽的长度、所述水平支臂的长度以及所述校正部的横截面半径之和为所述校正器件在水平方向上的最大校正距离。
其中，当所述校正臂移动到所述移动轨槽上靠近待校正半基板的边缘的一端时，如果所述传感器侦测到待校正半基板的边缘处于以所述水平支臂的长度及所述校正部的横截面半径之和为旋转半径的旋转范围内，则使所述校正臂旋转至待校正半基板的边缘之外再升起进行校正定位，否则发出超出所述校正器件的校正范围的警报。
本发明实施例的有益效果在于：通过设置竖直支臂和与其垂直相连的水平支臂，在水平方向延展了校正部的移动范围，避免出现因距离受限而导致发生破片等异常状况。进一步地将校正臂设计为可下臂为轴旋转，使校正器件可以获得更大的校正范围。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是现有技术中双半玻璃间隙的校正示意图。
图2是本发明实施例一一种双半基板间隙的校正器件的结构示意图。
图3是本发明实施例一一种双半基板间隙的校正器件的另一结构示意图。
图4是本发明实施例一一种双半基板间隙的校正器件校正双半基板间隙的示意图。
图5是本发明实施例一一种双半基板间隙的校正器件校正双半基板间隙的另一示意图。
图6是本发明实施例一中校正臂的旋转范围示意图。
图7是本发明实施例二一种双半基板间隙的校正器件的校正方法的流程示意图。
具体实施方式
以下各实施例的说明是参考附图，用以示例本发明可以用以实施的特定实施例。
请参照图2所示，本发明实施例一提供一种双半基板间隙的校正器件，包括：移动轨槽4和可移动地连接在移动轨槽4上的校正臂2，校正臂2进一步包括：
校正部20；
设置在校正部20下方的上臂21，上臂21包括自校正部20底部中央竖直向下延伸的竖直支臂211和与竖直支臂211垂直相连的水平支臂212；
自水平支臂212末端竖直向下延伸并与移动轨槽4相连接的下臂22；
设置在上臂21或下臂22上的传感器3，用于侦测待校正半基板的位置；
所述校正部20根据所述传感器3侦测的待校正半基板的位置，对待校正半基板进行校正定位。
本实施例通过将校正器件的上臂21设计为L型——竖直支臂211和与 其垂直相连的水平支臂212，相当于在水平方向(也即水平支臂212的长度方向)上延展了校正部20的移动范围。现有技术中，校正器件2′的上臂是I型(参见图1)，其在水平方向上的移动距离受限于与之相连的移动轨槽3′的长度；而本实施例的校正器件2中，通过设置水平支臂212和与水平支臂212垂直相连的竖直支臂211，使得连接在竖直支臂211顶端的校正部20在水平方向上与下臂22形成距离差(也即水平支臂212的长度R)，这样，校正部20的在水平方向上的可移动距离就被拓展为移动轨槽4的长度+水平支臂212的长度R，因此可以在水平方向上的校正范围就被扩大了。
本实施例中，校正部20为圆柱体，其横截面半径设为r。如图3所示，本实施例的校正器件在水平面上的最大投影长度为：移动轨槽4的长度G+水平支臂212的长度R+校正部20的横截面半径r，该最大投影长度即为本实施例的校正器件在水平方向上的最大校正距离A，即A＝G+R+r。可通过选择不同的移动轨槽4长度和水平支臂212长度R及校正部20横截面半径r来确定最大校正距离。
请再参照图4所示，传感器3侦测待校正半基板11的位置具体是侦测待校正半基板11的边缘110的位置。传感器3可以设置在上臂21上，也可以设置在下臂22上。本实施例以设置在上臂21为例进行说明，例如，传感器3设置在上臂21的上支臂211内部中央(如图2所示)，或者设置在上支臂211外表面(如图3所示)。传感器3侦测到待校正半基板11的边缘110的位置时可获得待校正半基板11的边缘110到传感器3位置之间的距离。当然，由于传感器3与校正半基板11并不处于同一平面，并且为了便于比较，上述距离可转换为在水平面上的投影距离，设为侦测距离D。此时下臂22位于移动轨槽4的中部，而校正部20处于待校正半基板11的下方，如果校正臂2升起将会顶到待校正半基板11而发生破片。因此需要使校正部20按图示箭头方向朝向待校正半基板11的边缘110移动，使校正部20处于边缘110之外，然后再升起将待校正半基板11校正到正确位置(如图4中虚线框所示)。由于有水平支臂212的延展，使得过往处于待校正半基板11下方离边缘110较远处的校正部20，也可以通过将校正臂2在移动轨槽4上的移动，使校正部20移动到边缘110之外来进行校正定位，大大扩展了本实 施例校正器件的校正范围。当然，如果通过前述移动，校正部20仍然处于待校正半基板11下方而无法移动到边缘110之外，则表明此时的待校正半基板11已超出校正器件的最大校正距离，将发出警报，避免校正器件升起导致破片等异常状况。
进一步地，为了增强本实施例校正器件的实用性，本实施例校正器件的校正臂2可以下臂22为轴旋转，这样校正器件可以获得更大的校正范围。如图5所示，当校正器件位于图中虚线位置时，即使通过前述将校正臂2在移动轨槽4上的平移，校正部20仍然处于待校正半基板11的下方，如果升起则会顶到待校正基板11，发生破片。而如果校正臂2还能以下臂22为轴旋转，则可按图中箭头所示从虚线位置旋转出来，使校正部20靠近待校正半基板11的边缘110，然后升起对待校正半基板11的位置进行校正定位。作为一项可以遵照的原则，当校正臂2移动到移动轨槽4上靠近待校正半基板11的边缘110的一端时，如果传感器3侦测到待校正半基板11的边缘110处于以水平支臂212的长度R及校正部20的横截面半径r之和为旋转半径的旋转范围内，则表明通过校正臂2的旋转，可以使校正臂2正常升起进行校正；反之，如果待校正半基板11的边缘110处于前述旋转范围外，表明通过校正臂2的旋转仍然无法对其进行校正(因为此时如果升起校正器件，则将会顶到待校正半基板11)，超出了校正器件的校正范围，同样会发出警报。请结合图6所示，图中校正臂2的旋转范围A与待校正半基板11的边缘110相交，相交的那段边缘110处于旋转范围A内，因此，校正部20即可旋转到边缘110之外再升起进行校正，不会发生顶到待校正半基板11而破片的状况。校正臂2的旋转范围B与待校正半基板11的另一侧边缘111没有相交，整个旋转范围B仍处于待校正基板11的范围内，校正部20无法旋转到边缘110之外再升起进行校正，一旦升起就会顶到待校正半基板11而发生破片。
对于校正臂2未处于移动轨槽4的端部，如果此时旋转校正臂2，待校正半基板11的边缘110有可能处于旋转范围之外，但是，此时通过在移动轨槽4上朝向边缘110移动校正臂2(实际上相当于把旋转范围向边缘110推近)，则待校正半基板11的边缘110将会处于旋转范围内，
相应于本发明实施例一，本发明实施例二提供一种如本发明实施例一所述的双半基板间隙的校正器件的校正方法，请参照图7所示，包括：
提供移动轨槽以及可移动地连接在所述移动轨槽上的校正臂，所述校正臂进一步包括：校正部；设置在所述校正部下方的上臂，所述上臂包括自所述校正部底部中央竖直向下延伸的竖直支臂和与所述竖直支臂垂直相连的水平支臂；自所述水平支臂末端竖直向下延伸并与所述移动轨槽相连接的下臂；
在所述上臂或所述下臂上设置用于侦测待校正半基板的位置传感器；
根据所述传感器侦测的待校正半基板的位置，使所述校正部对待校正半基板进行校正定位。
其中，所述传感器侦测待校正半基板的位置具体是侦测待校正半基板的边缘的位置。
其中，所述校正臂可旋转地连接在所述移动轨槽上，所述下臂为旋转轴。
其中，当所述校正臂移动到所述移动轨槽上靠近待校正半基板的边缘的一端时，如果待校正半基板的边缘处于以所述水平支臂的长度及所述校正部的横截面半径之和为旋转半径的旋转范围内，则使所述校正臂旋转至待校正半基板的边缘之外再升起进行校正定位，否则发出超出所述校正器件的校正范围的警报。
此外，相应地，所述移动轨槽的长度、所述水平支臂的长度以及所述校正部的横截面半径之和为所述校正器件在水平方向上的最大校正距离。所述传感器设置在所述上支臂内部中央，或者设置在所述上支臂外表面。
通过上述说明可知，本发明实施例的有益效果在于：通过设置竖直支臂和与其垂直相连的水平支臂，在水平方向延展了校正部的移动范围，避免出现因距离受限而导致发生破片等异常状况。进一步地将校正臂设计为可下臂为轴旋转，使校正器件可以获得更大的校正范围。
以上所揭露的仅为本发明较佳实施例而已，当然不能以此来限定本发明之权利范围，因此依本发明权利要求所作的等同变化，仍属本发明所涵盖的范围。

Claims (12)

  1. 一种双半基板间隙的校正器件，其中，包括：移动轨槽和可移动地连接在所述移动轨槽上的校正臂，所述校正臂包括：
    校正部；
    设置在所述校正部下方的上臂，所述上臂包括自所述校正部底部中央竖直向下延伸的竖直支臂和与所述竖直支臂垂直相连的水平支臂；
    自所述水平支臂末端竖直向下延伸并与所述移动轨槽相连接的下臂；
    设置在所述上臂或所述下臂上的传感器，用于侦测待校正半基板的位置；
    所述校正部根据所述传感器侦测的待校正半基板的位置，对待校正半基板进行校正定位。
  2. 根据权利要求1所述的校正器件，其中，所述移动轨槽的长度、所述水平支臂的长度以及所述校正部的横截面半径之和为所述校正器件在水平方向上的最大校正距离。
  3. 根据权利要求1所述的校正器件，其中，所述传感器侦测待校正半基板的位置具体是侦测待校正半基板的边缘的位置。
  4. 根据权利要求3所述的校正器件，其中，所述传感器设置在所述上支臂内部中央，或者设置在所述上支臂外表面。
  5. 根据权利要求1所述的校正器件，其中，所述校正臂可旋转地连接在所述移动轨槽上，所述下臂为旋转轴。
  6. 根据权利要求5所述的校正器件，其中，当所述校正臂移动到所述移动轨槽上靠近待校正半基板的边缘的一端时，如果所述传感器侦测到待校正半基板的边缘处于以所述水平支臂的长度及所述校正部的横截面半径之和为旋转半径的旋转范围内，则使所述校正臂旋转至待校正半基板的边缘之外再升起进行校正定位，否则发出超出所述校正器件的校正范围的警报。
  7. 一种双半基板间隙的校正器件的校正方法，包括：
    提供移动轨槽以及可移动地连接在所述移动轨槽上的校正臂，所述校正臂进一步包括：校正部；设置在所述校正部下方的上臂，所述上臂包括自所述校正部底部中央竖直向下延伸的竖直支臂和与所述竖直支臂垂直相连的 水平支臂；自所述水平支臂末端竖直向下延伸并与所述移动轨槽相连接的下臂；
    在所述上臂或所述下臂上设置用于侦测待校正半基板的位置传感器；
    根据所述传感器侦测的待校正半基板的位置，使所述校正部对待校正半基板进行校正定位。
  8. 根据权利要求7所述的校正方法，其中，所述传感器侦测待校正半基板的位置具体是侦测待校正半基板的边缘的位置。
  9. 根据权利要求7所述的校正方法，其中，所述校正臂可旋转地连接在所述移动轨槽上，所述下臂为旋转轴。
  10. 根据权利要求9所述的校正方法，其中，当所述校正臂移动到所述移动轨槽上靠近待校正半基板的边缘的一端时，如果待校正半基板的边缘处于以所述水平支臂的长度及所述校正部的横截面半径之和为旋转半径的旋转范围内，则使所述校正臂旋转至待校正半基板的边缘之外再升起进行校正定位，否则发出超出所述校正器件的校正范围的警报。
  11. 一种双半基板间隙的校正方法，包括：
    提供移动轨槽以及可移动地连接在所述移动轨槽上的校正臂，所述校正臂进一步包括：校正部；设置在所述校正部下方的上臂，所述上臂包括自所述校正部底部中央竖直向下延伸的竖直支臂和与所述竖直支臂垂直相连的水平支臂；自所述水平支臂末端竖直向下延伸并与所述移动轨槽相连接的下臂；
    在所述上臂或所述下臂上设置用于侦测待校正半基板的位置传感器；
    根据所述传感器侦测的待校正半基板的位置，使所述校正部对待校正半基板进行校正定位；
    其中，所述移动轨槽的长度、所述水平支臂的长度以及所述校正部的横截面半径之和为所述校正器件在水平方向上的最大校正距离。
  12. 根据权利要求11所述的校正方法，其中，当所述校正臂移动到所述移动轨槽上靠近待校正半基板的边缘的一端时，如果所述传感器侦测到待校正半基板的边缘处于以所述水平支臂的长度及所述校正部的横截面半径之和为旋转半径的旋转范围内，则使所述校正臂旋转至待校正半基板的边缘 之外再升起进行校正定位，否则发出超出所述校正器件的校正范围的警报。
PCT/CN2017/106794 2017-09-08 2017-10-19 一种双半基板间隙的校正器件及校正方法 Ceased WO2019047337A1 (zh)

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