Classifications

• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
  • C23C14/50—Substrate holders
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
  • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
  • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
• • C—CHEMISTRY; METALLURGY
  • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
  • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
  • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
  • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
  • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
  • C23C14/568—Transferring the substrates through a series of coating stations
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
  • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
  • H01J37/32—Gas-filled discharge tubes
  • H01J37/32431—Constructional details of the reactor
  • H01J37/32733—Means for moving the material to be treated
  • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
  • H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
  • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
  • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
  • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
  • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
  • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
  • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
  • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Definitions

• Embodiments of the present disclosure relate to an apparatus for transportation of a carrier in a vacuum chamber, a system for the vacuum processing of a substrate, and a method for transportation of a carrier in a vacuum chamber.
• Embodiments of the present disclosure particularly relate to a vacuum system with a deposition apparatus and with a path switch assembly configured to move a carrier between a first transport path and a second transport path in a vacuum chamber. Specifically, methods for changing a track of a carrier in a vacuum chamber are described.
• Techniques for layer deposition on a substrate include, for example, sputter deposition, evaporation, and chemical vapor deposition (CVD).
• a sputter deposition process can be used to deposit a material layer on the substrate, such as a layer of an insulating material or a conductor material.
• An in-line processing system includes a plurality of subsequent processing modules, such as deposition modules and optionally further processing modules, e.g., cleaning modules and/or etching modules, wherein processing aspects are subsequently conducted in the processing modules, such that a plurality of substrates can continuously or quasi-continuously be processed in the in-line processing system.
• subsequent processing modules such as deposition modules and optionally further processing modules, e.g., cleaning modules and/or etching modules, wherein processing aspects are subsequently conducted in the processing modules, such that a plurality of substrates can continuously or quasi-continuously be processed in the in-line processing system.
• the substrate may be carried by a carrier, i.e. a carrying device for carrying the substrate.
• the carrier is typically transported through a vacuum system using a transport system.
• the transport system may be configured for conveying the carrier having the substrate positioned thereon along one or more transport paths. At least two transport paths can be provided next to each other in the vacuum system, e.g. a first transport path for transporting the carrier in a forward direction and a second transport path for transporting the carrier in a return direction opposite to the forward direction.
• the transportation system can have rollers or other supports configured to support and convey the carriers along the transport paths and/or from one transport path to another transport path (also referred to as a "path switch” or “track switch”).
• the friction between the carrier and a carrier support during the transport of the carrier can generate particles that may negatively affect the vacuum conditions inside the vacuum system.
• the particles can contaminate the layers deposited on the substrates, and a quality of the deposited layers can be reduced.
• an apparatus for transportation of a carrier in a vacuum chamber includes a first transport system configured to contactlessly transport the carrier along a first transport path in a transport direction.
• the apparatus further includes a path switch assembly including a carrier holding portion configured to mechanically contact the carrier for moving the carrier away from the first transport path in a path switch direction.
• an apparatus for transportation of a carrier in a vacuum chamber includes a first magnetic levitation system provided along a first transport path in a transport direction, and a path switch assembly including a carrier holding portion that is movable in a path switch direction and includes a carrier contacting portion.
• a system for vacuum processing of a substrate includes a vacuum chamber, an apparatus according to any of the embodiments described herein, and one or more processing tools arranged in the vacuum chamber and selected from the group consisting of deposition sources, evaporation sources, sputter sources, surface treatment tools, heating devices, cleaning devices, etching tools, and combinations thereof.
• the apparatus includes a first transport system configured to contactlessly transport the carrier along a first transport path in a transport direction, and a path switch assembly including a carrier holding portion configured to mechanically contact the carrier for moving the carrier away from the first transport path in a path switch direction.
• a method for transportation of a carrier in a vacuum chamber includes contactlessly transporting a carrier along a first transport path in a transport direction, bringing the carrier in contact with a carrier holding portion of a path switch assembly, and transferring the carrier held by the carrier holding portion away from the first transport path in a path switch direction transverse to the transport direction.
• Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner.
• embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus.
• FIG. 1 shows a schematic sectional view of an apparatus for transportation of a carrier according to embodiments described herein;
• FIG. 2 shows a schematic top view of a system including an apparatus for transportation of a carrier according to embodiments described herein;
• FIGS. 3A-C show a sequence of stages of a method for transporting a carrier with an apparatus according to embodiments described herein;
• FIG. 4 shows a schematic sectional view of an apparatus for transportation of a carrier according to embodiments described herein
• FIG. 5 shows a schematic sectional view of an apparatus for transportation of a carrier according to embodiments described herein;
• FIG. 6 shows a schematic sectional view of an apparatus for transportation of a carrier according to embodiments described herein;
• FIG. 7 shows a schematic sectional view of an apparatus for transportation of a carrier according to embodiments described herein;
• FIG. 8 shows a schematic sectional view of an apparatus for transportation of a carrier according to embodiments described herein
• FIGS. 9A-D show a sequence of stages of a method for transportation of a carrier with an apparatus according to embodiments described herein;
• FIG. 10 is a flow diagram for illustrating a method for transportation of a carrier according to embodiments described herein.
• a carrier can be used for carrying a substrate along a transport path in a vacuum chamber.
• the carrier may hold the substrate during transport and/or during the deposition of a coating material on the substrate in the vacuum chamber.
• the substrate can be held in an essentially vertical orientation at a substrate holding surface of the carrier, and the carrier which holds the substrate can be transported through the vacuum chamber.
• the "carrier" as used herein may be a substrate carrier configured to carry a substrate.
• a carrier may be configured to carry and transport a different object, e.g. a mask or a shielding device.
• An apparatus for transportation of a carrier in a vacuum chamber can provide one, two or more transport paths, wherein the carrier can be moved or conveyed along the transport paths.
• a first transport path Tl may extend next to a second transport path T2, e.g., essentially parallel to the first transport path Tl.
• the first transport path Tl and/or the second transport path T2 may extend in a transport direction T which may be an essentially horizontal direction.
• the first transport path Tl and the second transport path T2 may be horizontally offset from each other in a path switch direction S.
• the distance between the first transport path Tl and the second transport path T2 in the path switch direction S may be 10 cm or more, particularly 20 cm or more, and/or 100 cm or less, particularly 50 cm or less.
• the apparatus 100 described herein can be a part of a vacuum processing system, such as an in-line processing system, such that a substrate can be continuously or quasi- continuously processed.
• the apparatus 100 may be configured to displace or move the carrier away from the first transport path Tl to at least one of the second transport path T2 and a processing position T3 in which the substrate can be processed.
• the apparatus can laterally displace the carrier from a first position on the first transport path Tl to a second position away from the first track in the path switch direction S.
• the path switch direction S may be transverse to the transport direction T, particularly essentially perpendicular to the transport direction T.
• a carrier is transported along the first transport path Tl in the transport direction T, moved away from the first transport path Tl in the path switch direction S to a processing position T3 where the substrate is processed, moved in the path switch direction S to the second transport path T2, and transported along the second transport path T2.
• the apparatus may include a transport system.
• the transport system may be configured for a contactless transport of the carrier along the first and/or second transport paths, e.g. using a magnetic force.
• the transport system may not use a mechanical force to transport the carrier. Instead, the transport system may magnetically push or pull the carrier towards a new position.
• the terms "contactless” and “contactlessly moving” as used throughout the present disclosure can be understood in the sense that the carrier is not moved using a mechanical contact between the carrier and the transport system, but is magnetically moved by a repulsive and/or an attractive magnetic force. There may be no mechanical contact between the apparatus and the carrier at all during the transportation along the first and/or second transport paths.
• the transport system may be a magnetic levitation system in some embodiments.
• the magnetic levitation system may include an upper track and a lower track, wherein the carrier may be transported in an essentially vertical orientation between the upper track and the lower track.
• the upper track may be arranged above the lower track.
• Magnets and/or drive units of the magnetic levitation system may be arranged at the upper track and/or at the lower track.
• active magnetic units configured to contactlessly hold the carrier below the upper track may be arranged at the upper track
• drive units e.g. linear motors, configured to move the carrier along the tracks may be arranged at the lower track.
• the contactless transport of the carrier is beneficial in that a reduced number of particles is generated due to a mechanical contact between the carrier and sections of the transport system, such as rollers, during the transport of the carrier. Accordingly, the vacuum conditions in the vacuum chamber are not negatively affected by the transport of the carrier. A purity of the layers deposited on the substrate can be improved, in particular since the particle generation is minimized or even avoided when using the transport system configured for a contactless transport.
• FIG. 1 is a schematic view of an apparatus 100 for transporting a carrier 10 in a vacuum chamber 101 according to embodiments described herein.
• the apparatus 100 can be a part of a vacuum processing system, for example, a sputter deposition system or an evaporation deposition system.
• the carrier 10 can be a substrate carrier configured to carry a substrate 11.
• the carrier 10 may include a chucking device, e.g., a magnetic chuck or an electrostatic chuck for attracting the substrate 11 toward a holding surface of the carrier 10.
• the carrier may be configured to carry a different object, e.g. a mask or a shield.
• the carrier 10 may be configured to hold the substrate 11 in an essentially vertical orientation.
• an angle between a main surface of the substrate 11 and the gravity vector is typically less than 20° during the transport of the carrier 10.
• the angle between the main surface of the substrate and the gravity vector may be from -10° to +10°, particularly from -1° to -5°, wherein negative angles are meant to designate downwardly facing substrates.
• the carrier may be configured to carry a large-area substrate, particularly a large- area substrate for display manufacturing.
• the substrate may have a surface area to be processed of 1 m 2 or more, particularly 5 m 2 or more, or even 10 m 2 or more.
• the carrier may have a substrate holding surface having a size of 1 m 2 or more, particularly 5 m 2 or more, or even 10 m 2 or more.
• the height of the carrier 10 may be 1 m or more, particularly 2 m or more, and/or a width of the carrier may be 1 m or more, particularly 2 m or more.
• the carrier 10 may be configured for carrying the substrate in an essentially vertical orientation.
• the apparatus 100 includes a first transport system 112 configured to contactlessly transport the carrier 10 along the first transport path Tl in the transport direction.
• the first transport system 112 may be a first magnetic levitation system configured for a contactless transport of the carrier along the first transport path Tl.
• the first transport system 112 includes a lower track section 121 and an upper track section 122.
• the carrier may be transported in a carrier transportation space between the lower track section 121 and the upper track section 122, particularly in an essentially vertical orientation.
• the upper track section 122 may be arranged essentially above the lower track section 121.
• Magnetic units of the first transport system 112 may be arranged at the lower track section 121 and/or at the upper track section 122.
• a plurality of actively controlled magnetic units may be arranged at the upper track section 122 for contactlessly holding the carrier 10 below the upper track section 122.
• the upper track section 122 may be part of an upper track configured as an upper guiding rail that extends along the first transport path Tl in the transport direction T.
• a gap between the upper track section 122 and the carrier may have a width of 5 mm or less, particularly about 2 mm.
• Active magnetic units and/or passive magnetic units of the first transport system 112 may be fixed at the upper track section 122.
• the lower track section 121 may be part of a lower track configured as a lower guiding rail that extends along the first transport path Tl in the transport direction T.
• a gap between the lower track section 121 and the carrier may have a width of 5 mm or less, particularly about 2 mm.
• Drive units of the first transport system configured to transport the carrier in the transport direction T may be fixed at the lower track section 121.
• the apparatus 100 further includes a path switch assembly 150.
• the path switch assembly 150 may be configured to move the carrier away from the first transport path Tl in a path switch direction S transverse to the transport direction T.
• the path switch assembly 150 may be configured to move the carrier from the first transport path Tl to the second transport path T2 in the path switch direction S.
• the path switch assembly 150 may be configured to move the carrier to a processing position T3 in which the carrier is processed, e.g. coated.
• the process position T3 may be horizontally offset from the first and second transport paths.
• a processing tool 105 may be arranged in the vacuum chamber 101 for processing the substrate 11 held by the carrier 10, e.g. when the carrier is arranged at the processing position T3.
• the processing tool 105 can be a deposition source configured to deposit a coating material on the substrate.
• the path switch assembly 150 includes a carrier holding portion 151 configured to mechanically contact the carrier 10 for moving the carrier away from the first transport path Tl in the path switch direction S.
• the carrier holding portion 151 comes into contact with the carrier and moves the carrier in the path switch direction S.
• the carrier is moved in the transport direction T without mechanical contact, particularly in a floating state between the upper track section 122 and the lower track section 121.
• the carrier holding portion 151 can push and/or pull the carrier in the path switch direction S while the carrier is in contact with the carrier holding portion 151.
• the carrier may be held at the carrier holding portion and/or supported on the carrier holding portion.
• the carrier holding portion 151 may transfer the carrier in the path switch direction S from the first transport path Tl toward the second transport path T2 and/or toward the processing position T3, and/or vice versa.
• the part of the carrier holding portion 151 that is brought in mechanical contact with the carrier for transferring the carrier in the path switch direction S may also be referred to herein as a "carrier contacting portion 153", i.e. a mount configured for a mechanical contact with the carrier for holding and/or supporting the carrier.
• Embodiments described herein are based on the finding that particle generation in the vacuum chamber may be reduced by providing a transport system that is configured for a contactless transport of the carrier in the transport direction T, particularly a magnetic levitation system.
• a transport system that is configured for a contactless transport of the carrier in the transport direction T, particularly a magnetic levitation system.
• mechanically contacting the carrier during a path switch movement may not lead to the generation of a considerable amount of particles. This is because a path switching distance between two transport paths in the path switch direction is typically a small distance. Accordingly, the carrier holding portion 151 may be kept in contact with the carrier during the path switch essentially without a sliding movement of the carrier holding portion 151 relative to the carrier. Particle generation can be kept low.
• the carrier holding portion 151 may contact a rear side of the carrier opposite a front side where the object to be processed is arranged.
• the carrier holding portion 151 may engage with a rear side surface of the carrier, whereas the object to be processed may be held at a front surface of the carrier. Particle generation in the area of the object to be processed can be kept low.
• a path switch assembly 150 configured for moving the carrier while being in contact with the carrier may be more cost-saving and space-saving as well as more energy efficient as compared to a path switch assembly 150 configured to contactlessly transfer the carrier in the path switch direction.
• the path switch assembly 150 may include a carrier holding portion 151 configured to contact and engage with a side surface 15 of the carrier.
• the side surface 15 of the carrier may be an essentially vertically oriented surface of the carrier.
• the carrier holding portion 151 may contact a rear side surface of the carrier, i.e. side surface opposite a front side surface where the object is held.
• the carrier holding portion 151 may be arranged on a side of the first transport path Tl opposite the side where the processing tool 105 is arranged. Accordingly, the carrier holding portion 151 can be moved toward the rear side surface of the carrier which faces away from the processing tool 105.
• the carrier holding portion 151 includes at least one mount configured to engage with the side surface 15 of the carrier 10, particularly with the rear side surface of the carrier.
• the mount may be configured to come into mechanical contact with a "floating" carrier, i.e. a carrier that is being contactlessly held by the first transport system 112.
• the carrier holding portion 151 may include a mount including a magnetic chuck or a mechanical mount configured to come into contact with a "floating" carrier for grabbing and holding the carrier.
• the magnetic levitation force of the first transport system 112 may first be switched off for placing the carrier on the lower track section 121, whereupon the carrier holding portion 151 may be brought in contact with a supported carrier.
• the carrier holding portion 151 may include a magnetic chuck for grabbing and holding the carrier.
• one or more magnets may be provided at one or more mounts of the carrier holding portion 151, wherein the one or more magnets may attract a magnetic counterpart provided at the carrier, such that the carrier is magnetically attracted to the magnetic chuck.
• the magnetic chuck includes an electropermanent magnetic chuck configured to switch between a chucking state and a releasing state by an electric pulse.
• the carrier holding portion 151 includes a mechanical mount for holding the carrier.
• the mechanical mount may be a carrier support for supporting the carrier or a hook for hanging the carrier to the carrier holding portion 151.
• the carrier holding portion 151 may be configured to contact a side surface 15 of the carrier, a bottom surface of the carrier and/or a top surface of the carrier. In some embodiments, the carrier holding portion 151 engages with an upper portion of the carrier, with a center portion of the carrier and/or with a lower portion of the carrier. [0041] In the embodiment depicted in FIG. 1, the carrier holding portion 151 includes two, three or more mounts, wherein a first mount may be configured to contact an upper portion of the carrier, a second mount may be configured to contact a center portion of the carrier, and/or a third mount may be configured to contact a lower portion of the carrier. Accordingly, the carrier can be reliably and stably held at the carrier holding portion 151. Two, three or more magnetic mounts may be provided, wherein each magnetic mount may be connected to or integrally formed with a movable arm of the path switch assembly 150.
• the carrier holding portion 151 is movable in the path switch direction S for transferring the carrier 10 held by the carrier holding portion 151 in the path switch direction S.
• a drive device also referred to herein as a "cross drive” may be provided for moving the carrier holding portion 151 in the path switch direction S for transferring the carrier from the first transport path Tl to at least one of the second transport path T2 and the processing position T3.
• the drive device (not depicted in the figures) may be arranged outside the vacuum chamber 101, and the carrier holding portion 151 may extend through a wall of the vacuum chamber 101.
• the path switch assembly 150 including the drive device may be arranged inside the vacuum chamber 101.
• the drive device may be configured to move the carrier holding portion 151 in the path switch direction S by a distance of 10 cm or more, particularly 20 cm or more, from the first transport path Tl to the second transport path T2.
• a distance between the first transport path Tl and the second transport path T2 may be 25 cm or more and 100 cm or less.
• the apparatus further includes a second transport system 114 configured to contactlessly transport the carrier along the second transport path T2 horizontally offset from the first transport path Tl.
• the second transport system 114 may be a magnetic levitation system.
• the carrier holding portion 151 of the path switch assembly 150 may be movable in the path switch direction S for transferring the carrier from the first transport path Tl to at least one of the second transport path T2 and the processing position T3 horizontally offset from the first and second transport paths.
• the second transport system 114 may include a second lower track section 123 and a second upper track section 124, wherein the carrier can be contactlessly transported along the second transport path T2 between the second lower track section 123 and the second upper track section 124.
• a plurality of magnetic units of the second transport system 114 may be arranged at the second upper track section 124 and/or at the second lower track section 123, e.g. actively controlled magnetic bearings.
• FIG. 2 shows a schematic top view of a system 200 including an apparatus for transportation of a carrier according to embodiments described herein.
• the apparatus may be similar to or correspond to the apparatus 100 depicted in FIG. 1, such that reference can be made to the above explanations, which are not repeated here.
• the system 200 for vacuum processing of a substrate includes a vacuum chamber 101 and one or more processing tools 105 arranged in the vacuum chamber 101.
• the one or more processing tools may be selected from the group consisting of deposition sources, sputter sources, evaporation sources, surface treatment tools, heating devices, cleaning devices, etching tools, and combinations thereof.
• the system 200 includes an apparatus according to any of the embodiments described herein.
• a first transport path Tl and a second transport path T2 which is horizontally offset from the first transport path Tl extend at least partially through the vacuum chamber 101.
• a processing position T3 in which a substrate can be processed is provided horizontally offset from the first transport path Tl and the second transport path T2.
• a mask 12 is provided between the processing position T3 of the carrier 10 and the processing tool 105.
• the mask 12 may be, e.g., an edge exclusion mask or a fine metal mask.
• the mask 12 may prevent a portion of the substrate from being coated and/or the mask may have an opening pattern corresponding to a material pattern to be deposited on the substrate.
• the apparatus 100 includes a first transport system 112 for contactlessly transporting the carrier 10 along the first transport path Tl, a second transport system 114 for contactlessly transporting the carrier 10 along the second transport path T2, and a path switch assembly 150 configured to transfer the carrier 10 from the first transport path Tl to the second transport path T2 and/or to the processing position T3 in the path switch direction S.
• the path switch assembly 150 includes a carrier holding portion 151 configured to contact and hold the carrier 10.
• the carrier holding portion 151 is movable in the path switch direction S. As is schematically depicted in FIG. 2, when the carrier holding portion 151 moves in the path switch direction S, the carrier contacting portion 153 may push the carrier 10 in the path switch direction S, i.e. in an essentially horizontal direction, toward the second transport path T2.
• the transport paths may extend in the transport direction along several meters, e.g. through a plurality of vacuum chambers.
• the path switching distance may be a small distance of, e.g., 50 cm or less.
• FIGS. 3 A to 3C show subsequent stages of a method for transporting a carrier in a vacuum chamber 101 with an apparatus according to embodiments described herein.
• the apparatus may be similar to or correspond to the apparatus 100 depicted in FIG. 1, such that reference can be made to the above explanations, which are not repeated here.
• a carrier 10 carrying a substrate 11 may be contactlessly transported along a first transport path Tl in a transport direction T via a first transport system 112.
• the carrier may be stopped and contactlessly held by the first transport system 112 at a position where the path switch assembly 150 is arranged.
• a carrier holding portion 151 of the path switch assembly 150 may move in a path switch direction S toward the carrier 10, such that the carrier is contacted by a carrier contacting portion of the path switch assembly 150 and pushed in the path switch direction S toward the second transport path T2.
• the carrier holding portion 151 may include a mount, e.g. a magnetic mount, such that the carrier can be held at the carrier holding portion 151.
• the carrier holding portion 151 may contact a rear side surface of the carrier that faces away from the processing tool 105. Particle generation in the area of the substrate 11 can be reduced.
• the carrier holding portion 151 may be movable in the path switch direction S toward the carrier 10 and push the carrier away from the first transport path Tl toward the second transport path T2 and/or toward the processing position T3.
• the mechanical pushing force exerted on the carrier in the path switch direction S by the carrier holding portion 151 may be stronger than a magnetic retention force exerted on the carrier in the path switch direction S by the first transport system 112, which may still act on the carrier.
• the carrier may be forcedly pushed away by the path switch assembly 150 from the first transport system 112 in the path switch direction S.
• the carrier may be transferred away from the first transport path Tl by being moved in a horizontal direction only, and not in a vertical direction.
• a vertical level of the upper and lower tracks of the first transport system 112 may essentially correspond to a vertical level of the second upper and lower tracks of the second transport system 114, such that a purely horizontal movement of the carrier may be suitable for switching paths.
• the path switch may also involve a movement of the carrier in an upward and/or downward direction.
• the carrier may be moved by the path switch assembly 150 in the path switch direction S across the second transport path T2 to the processing position T3.
• the substrate 11 can be processed by the processing tool 105.
• the carrier may be held at the path switch assembly 150.
• the carrier may optionally be held behind a mask 12, such that surface portions of the substrate 11 and/or of the carrier 10 that are to be excluded from deposition can be masked.
• the carrier 10 may be moved back to the second transport path T2 which may be arranged between the processing portion T3 and the first transport path.
• the carrier holding portion 151 may be retracted toward the first transport path Tl in the path switch direction S.
• the drive device of the path switch assembly 150 may be configured for moving the carrier holding portion 151 forth and back in the path switch direction S.
• the carrier 10 has been moved onto the second transport path T2.
• the carrier holding portion 151 may release the carrier 10 and move back toward the first transport path Tl, e.g. by deactivating a magnetic mount provided at the carrier holding portion.
• the carrier may be released directly into a floating state, being contactlessly held by the second transport system 114.
• the carrier may first be placed onto the second lower track section 123 of the second transport system 114, whereupon the second transport system 114 may be activated for lifting the carrier into a floating state.
• the carrier 10 may then be contactlessly transported by the second transport system 114 in the transport direction T, e.g. for returning toward an unloading chamber or for continuing toward a further processing module.
• FIG. 4 is a schematic sectional view of an apparatus 400 according to embodiments described herein.
• the apparatus 400 is similar to the apparatus 100 of FIG. 1, such that reference can be made to the above explanations, which are not repeated here.
• the carrier holding portion 151 of the path switch assembly 150 of the apparatus 400 is configured as a carrier support configured to support the carrier from below.
• the carrier holding portion 151 may include a support surface for supporting the carrier from below.
• the carrier 10 may be supported on the carrier holding portion 151 such that a bottom surface of the carrier 10 is placed on, and in contact with, the support surface of the carrier holding portion 151.
• the carrier holding portion 151 is movable in the path switch direction S together with the carrier supported thereon.
• the carrier 10 can be lowered onto the carrier holding portion 151 and subsequently be moved in the path switch direction S toward the second transport path T2 and/or toward a processing position (not shown in FIG. 4).
• FIG. 5 is a schematic sectional view of an apparatus 500 according to embodiments described herein.
• the apparatus 500 is similar to the apparatus 100 of FIG. 1, such that reference can be made to the above explanations, which are not repeated here.
• the carrier holding portion 151 of the path switch assembly 150 of the apparatus 500 is configured to contact a side surface of the carrier, particularly a rear side surface of the carrier facing away from the processing tool 105. Particle generation in the area of the substrate can be reduced.
• the carrier holding portion 151 may be configured to mechanically or magnetically engage with a lower portion of the carrier.
• a "lower portion" of the carrier may be understood as the lower half, particularly the bottom 20% of a vertically oriented carrier.
• the carrier holding portion 151 may be arranged at a second vertical level slightly above a first vertical level of the lower track section 121. A distance between the first vertical level and the second vertical level may be 2 cm or more and 50 cm or less, particularly 30 cm or less. Particle generation in the area of the substrate can be reduced, since particles tend to drop down to the floor.
• the carrier holding portion 151 may include a mount, particularly a magnetic or mechanical mount for holding the carrier.
• the carrier holding portion 151 is movable in the path switch direction S together with the carrier held thereon.
• FIG. 6 is a schematic sectional view of an apparatus 600 according to embodiments described herein.
• the apparatus 600 is similar to the apparatus 100 of FIG. 1, such that reference can be made to the above explanations, which are not repeated here.
• the carrier holding portion 151 of the path switch assembly 150 of the apparatus 600 is configured to contact a side surface of the carrier, particularly a rear side surface of the carrier facing away from the processing tool 105. Particle generation in the area of the substrate can be reduced.
• the carrier holding portion 151 may be configured to mechanically or magnetically engage with an upper portion of the carrier.
• An "upper portion" of the carrier may be understood as the upper half, particularly the top 20% of a vertically oriented carrier.
• the carrier holding portion 151 may be arranged at a second vertical level slightly below a first vertical level of the upper track section 122. A distance between the first vertical level and the second vertical level may be 2 cm or more and 50 cm or less, particularly 30 cm or less.
• the carrier holding portion 151 may be configured to contact and hold a center portion of the carrier (schematically depicted as a dashed line in FIG. 6).
• the carrier holding portion 151 may include two or more mounts provided at different vertical levels, e.g. at a vertical distance of 50 cm or more from each other. The risk of a tilting or of an accidental drop-off of the carrier from the path switch assembly can be reduced.
• the carrier holding portion 151 may include a mount, particularly a magnetic or mechanical mount for holding the carrier.
• the carrier holding portion 151 is movable in the path switch direction S together with the carrier held thereon.
• FIG. 7 is a schematic sectional view of an apparatus 700 according to embodiments described herein.
• the apparatus 700 is similar to the apparatus 100 of FIG. 1, such that reference can be made to the above explanations, which are not repeated here.
• the carrier holding portion 151 of the path switch assembly 150 of the apparatus 700 may be configured to engage with an inner surface of the carrier.
• An inner surface of the carrier may be understood as a recess, an opening, a groove, a depression or an indentation in the carrier, e.g. a recess in a rear side surface of the carrier. Particle generation in the area of the substrate can be reduced.
• the carrier holding portion 151 may include a mechanical mount, e.g. a hook, configured to engage with an inner surface of the carrier.
• the carrier may be hung to the hook.
• an additional mount may be provided, e.g. a further mechanical mount and/or a magnetic mount. The risk of a tilting or of an accidental dropoff of the carrier from the path switch assembly 150 can be reduced or avoided.
• the carrier holding portion 151 includes one, two or more arms with a respective mount at a distal end thereof.
• the arms may be movable in the path switch direction.
• a main extension direction of at least one arm may be an essentially horizontal direction (depicted in a continuous line in FIG. 7) and/or a main extension direction of at least one arm may be an essentially vertical direction (depicted in dashed lines in FIG. 7).
• the carrier holding portion 151 may contact a top surface of the carrier for holding the carrier and moving the carrier in the path switch direction S.
• FIG. 8 is a schematic sectional view of an apparatus 800 according to embodiments described herein.
• the apparatus 800 is similar to the apparatus 100 of FIG. 1, such that reference can be made to the above explanations, which are not repeated here.
• the carrier holding portion 151 may be movable in a vertical direction V.
• the carrier holding portion 151 may be movable both in the vertical direction V and in the path switch direction S.
• the path switch assembly 150 may be configured for moving the carrier both in the vertical direction and in the track switch direction S.
• the carrier holding portion 151 holding the carrier may first be moved in the vertical direction V, particularly in order to move the carrier away from the upper track section 122.
• the carrier holding portion 151 may then be moved in the path switch direction S, e.g. toward the second transport path T2 or the processing position T3.
• the first transport system 112 may include a lower track section 121, an upper track section 122, and an actuator 125 configured to modify a distance between the lower track section 121 and the upper track section 122 in the vertical direction V.
• an actuator 125 for moving the lower track section 121 away from the upper track section 122 may be provided.
• a path switching space may be enlarged.
• the path switch may be facilitated and an accidental contact between the carrier and the transport systems during the path switch can be avoided.
• the lower track section 121 has moved in a downward direction away from the carrier 10, while the carrier is held by the path switch assembly 150. Thereupon, the carrier holding portion 151 may move in a downward direction away from the upper track section 122, e.g. to a center region between the upper track section 122 and the lower track section 121. The carrier 10 can then be moved toward the second transport path T2 without a risk of hitting, e.g., magnetic side guides of the second transport system 114.
• the apparatus 800 includes an actuator 125 for increasing and/or decreasing the distance between the upper track section 122 and the lower track section 121.
• a smaller first distance may be suitable for contactlessly transporting the carrier between the lower track section 121 and the upper track section 122 in the transport direction T.
• moving the carrier away from the first transport path Tl in the path switch direction may be difficult, when the lower and upper track sections are provided at the smaller first distance.
• a larger second distance between the lower track section 121 and the upper track section 122 may be suitable for moving the carrier away from the first transport path Tl, i.e. to the second transport path T2 and/or to the processing position T3 in the path switch direction S.
• the smaller first distance between the lower track section 121 and the upper track section 122 may be 1 m or more, particularly 2 m or more.
• the smaller first distance may be slightly larger than a vertical dimension of the carrier, such that the carrier can be contactlessly transported between the lower track section and the upper track section.
• the larger second distance may be several millimeters or centimeters larger than the smaller first distance.
• a difference between the smaller first distance and the larger second distance may be 5 mm or more, 20 mm or more, 40 mm or more, or even 100 mm or more.
• the actuator 125 may configured for changing the distance between the lower track section and the upper track section by 5 mm or more, 20 mm or more, 40 mm or more, or even 100 mm or more.
• the actuator 125 may include a drive device, e.g. a motor, a hydraulic device or a pneumatic device for increasing the distance between the lower track section 121 and the upper track section 122.
• the actuator 125 may be configured to move the lower track section 121 away from the upper track section 122, e.g. in a vertical direction, and particularly in a downward direction, in order to increase the distance between the upper track section 122 and the lower track section 121.
• the actuator 125 may be configured to move the upper track section 122 away from the lower track section 121, e.g. in a vertical direction, particularly in an upward direction, in order to increase the distance between the upper track section 122 and the lower track section 121.
• the lower track section 121 may be movable in the downward direction by a distance of 20 mm or more, particularly 40 mm or more, more particularly 80 mm or more.
• the vertical space between the lower track section 121 and the upper track section 122 can be increased for facilitating the path switch movement.
• one single actuator (e.g. the actuator 125) may be provided for increasing and/or decreasing both the distance between the lower track section 121 and the upper track section 122 of the first transport system 112 and the distance between the second lower track section 123 and the second upper track section 124 of the second transport system 114.
• a first actuator may be provided for increasing and/or decreasing the distance between the lower track section 121 and the upper track section 122 of the first transport system 112
• a second actuator may be provided for increasing and/or decreasing the distance between the second lower track section 123 and the second upper track section 124 of the second transport system 114.
• a second lower track section 123 of the second transport system 114 may be movable in the vertical direction V, e.g. together with the lower track section 121 of the first transport system 112.
• the actuator 125 may be configured for moving the lower track section 121 synchronously with the second lower track section 123 and/or independently of the second lower track section 123 in a downward direction and/or an upward direction.
• FIG. 9A to 9D show subsequent stages of a method of transporting a carrier in a vacuum chamber with an apparatus 900 according to embodiments described herein.
• the apparatus 900 may be similar to the apparatus 100 depicted in FIG. 1, such that reference can be made to the above explanations, which are not repeated here.
• the apparatus 900 includes a first transport system 112 for a contactless transport of a carrier 10 along the first transport path Tl in the transport direction, and a second transport system 114 for a contactless transport of the carrier 10 along the second transport path T2 horizontally offset from the first transport path Tl. Further, a path switch assembly 150 is provided for transferring the carrier 10 from the first transport path Tl to the second transport path T2 and/or to the processing position T3.
• the path switch assembly 150 may include a carrier holding portion 151 configured to hold and/or support the carrier, wherein the carrier holding portion 151 may be movable in the path switch direction S together with the carrier.
• the path switch assembly 150 is configured to move the carrier in the path switch direction S.
• the carrier holding portion 151 may include a support surface for supporting the carrier from below or a mechanical or magnetic mount for contacting a side surface of the carrier.
• the carrier holding portion 151 may be configured according to any of the embodiments described herein.
• the first transport system 112 includes a lower track section 121 which may be movable in a vertical direction V, and/or the second transport system 114 may include a second lower track section 123 which may be movable in the vertical direction V.
• the lower track section 121 and the second lower track section 123 may be arranged next to and parallel to each other, such that a carrier can be transferred between the lower track section 121 and the second lower track section 123 in the path switch direction S, particularly without changing the orientation of the carrier 10.
• the carrier may maintain an essentially vertical orientation aligned along the transport direction T.
• a carrier is contactlessly transported by the first transport system 112 along the first transport path Tl in the transport direction T.
• the carrier is stopped at a predetermined position where the path switch assembly 150 is arranged.
• the path switch assembly 150 further includes an upper holding device 154 configured to hold and/or stabilize an upper portion of the carrier 10.
• the upper holding device 154 may be movable in the path switch direction S.
• the upper holding device 154 may optionally also be movable in a vertical direction V.
• the upper holding device 154 may be configured to prevent a tilting movement of the carrier when the magnetic levitation is switched off.
• the upper holding device 154 is configured to contactlessly stabilize the upper portion of the carrier in order to prevent a tilting movement of the carrier.
• the upper holding device 154 may magnetically interact with the upper portion of the carrier for stabilizing the carrier in the track switch direction.
• the upper holding device 154 may be configured to contact an upper end portion of the carrier 10.
• the upper holding device 154 may include fingers or other holding devices configured to contact and grab the carrier from above.
• the upper holding device 154 may include spring mounted fingers configured to hold and/or stabilize the carrier when the magnetic levitation provided by the transport systems is switched off.
• the magnetic levitation force provided by the first transport system 112 may be reduced or switched off, such that the carrier 10 comes into mechanical contact with and is supported on the lower track section 121.
• the carrier can be smoothly placed on the lower track section 121 by gradually reducing the magnetic levitation force of the first magnetic levitation system. This is schematically depicted in FIG. 9B.
• the magnetic levitation is switched off, the upper portion of the carrier may be stabilized by the upper holding device 154.
• the lower track section 121 of the first transport system includes a carrier support and can be moved in a downward direction for lowering the carrier onto the carrier holding portion 151. Accordingly, the carrier can be placed on the carrier holding portion 151 of the path switch assembly 150 by lowering the carrier supported on the lower track section 121.
• the lower track section 121 can be moved in a downward direction away from the upper track section 122 such that the distance between the lower track section 121 and the upper track section 122 is increased.
• the carrier 10 supported on the lower track section 121 is lowered and placed on the carrier holding portion 151.
• Due to the downward movement of the carrier 10 supported on the lower track section 121 a distance between the carrier 10 and the upper track section 122 is increased.
• the carrier holding portion 151 with the carrier 10 supported thereon may be moved in the path switch direction S from the first transport path Tl to the second transport path T2 and/or to the processing position where the substrate may be processed (not depicted).
• the second transport system 114 provided along the second transport path T2 may include a second lower track section 123 that is movable in a vertical direction.
• the second lower track section 123 may be moved in an upward direction until the carrier comes into contact with the second lower track section 123 and is lifted up from the carrier holding portion 151 by the second lower track section 123.
• the second lower track section 123 may be moved in the upward direction from a level below the carrier holding portion 151 to a level above the carrier holding portion 151 (not depicted).
• the magnetic levitation of the second transport system 114 can then be switched on to contactlessly hold the carrier between the second lower track section 123 and the second upper track section 124.
• the carrier can then be contactlessly transported along the second transport path T2, e.g. in the transport direction T.
• the carrier holding portion 151 of the path switch assembly 150 can then be moved back toward the first transport path Tl in the path switch direction S, whereupon a path switch may be performed on a subsequent carrier.
• the upper holding device 154 may be configured to hold and/or stabilize an upper portion of the carrier 10 when a magnetic levitation force of the first and second magnetic levitation systems is reduced or switched off.
• An "upper portion of the carrier” may be understood as an upper part of a vertically oriented carrier, including the upper 50%, particularly as the upper 20% of the vertically oriented carrier.
• the upper holding device 154 may stabilize the upper end of the carrier.
• the upper holding device 154 may stabilize the carrier in the path switch direction S, e.g. by applying oppositely directed stabilization forces on two opposite sides of the carrier.
• the upper holding device 154 may include at least one magnet unit for exerting a repulsive magnetic force on the upper portion of the carrier.
• the upper holding device 154 includes a first magnet unit 302 for exerting repulsive magnetic force on the upper portion of the carrier 10 from a first side and a second magnet unit 304 for exerting a repulsive magnetic force on the upper portion of the carrier 10 from a second side opposite the first side. This is schematically depicted in FIG. 9B.
• Magnetic counter-units may be fixed to the upper part of the carrier 10 such as to magnetically interact with the first magnet unit 302 and the second magnet unit 304, respectively.
• the first magnet unit 302 of the upper holding device 154 may exert a repulsive magnetic force on a first magnetic counter-unit fixed to a first side of the carrier
• the second magnet unit 304 of the upper holding device 154 may exert a repulsive magnetic force on a second magnetic counter-unit fixed to a second side of the carrier opposite the first side.
• the carrier may be contactlessly stabilized in a center area between the first magnet unit 302 and the second magnet unit 304.
• the upper holding device 154 may be movable in the path switch direction S together with and synchronously with the carrier holding portion 151, e.g. for transferring the carrier between the transport paths.
• the upper holding device 154 may include a first arm 311 and a second arm 312, wherein the first arm 311 may be movable independently from the second arm 312 in the path switch direction S.
• a first side stabilization unit such as the first magnet unit 302 may be fixed to the first arm 311, and a second side stabilization unit such as the second magnet unit 304 may be fixed to the second arm 312.
• the first arm 311 Before switching off the magnetic levitation, the first arm 311 may be moved toward the carrier from a first side, and the second arm 312 may be moved toward the carrier from the second side, in order to stabilize the carrier between the first arm 311 and the second arm 312.
• the upper holding device 154 may be movable in the path switch direction S such that the upper part of the carrier can be contactlessly held and stabilized during a path switch of the carrier.
• the upper holding device 154 is movable in the path switch direction S, but not in the vertical direction V. In other embodiments, the upper holding device 154 is movable in the path switch direction S and in the vertical direction V.
• the upper holding device 154 may be configured to provide a side stabilization of the carrier during a vertical movement of the carrier with respect to the upper holding device 154.
• the upper holding device 154 may provide a side stabilization to the carrier arranged at a first vertical position relative to the upper holding device 154 (shown in FIG. 9B) and at a second vertical position relative to the upper holding device 154 (shown in FIG. 9C).
• the first vertical position and the second vertical position may be vertically offset from each other by a distance of, e.g., 30 mm or more, particularly 50 mm or more.
• the upper holding device may provide a side stabilization for the carrier provided at a first vertical level and at a second vertical level, without vertically moving the upper holding device.
• At least one magnet unit of the upper holding device 154 and/or at least one magnetic counter-unit provided at the carrier 10 may have a vertical dimension of 30 mm or more, particularly 40 mm or more, more particularly 50 mm or more.
• the at least one magnet unit may magnetically interact with the at least one magnetic counter-unit of the carrier, when the magnetic counter-unit is vertically shifted with respect to the magnet unit, e.g. by a distance of 30 mm or more.
• FIG. 10 is a flow diagram illustrating a first method according to embodiments described herein.
• a carrier 10 is contactlessly transported along a first transport path Tl in a transport direction T, particularly between a lower track section 121 and an upper track section 122 of a first transport system 112.
• the carrier may be contactlessly transported by a magnetic levitation system between the lower track section and the upper track section.
• the carrier is brought into contact with a carrier holding portion 151 of a path switch assembly, e.g. by supporting the carrier on the carrier holding portion or by hanging or mounting the carrier to the carrier holding portion 151 in another way.
• the carrier held by the carrier holding portion is transferred away from the first transport path Tl in a path switch direction S transverse to the transport direction T, particularly essentially perpendicular to the transport direction T.
• the carrier may be pushed or pulled in the path switch direction by the carrier holding portion.
• the path switch of the carrier may include lowering the carrier onto the carrier holding portion 151, moving the carrier in the path switch direction S, and lifting the carrier from the carrier holding portion 151.
• the carrier may be placed on a lower track section 121 of the first transport system 112, particularly by reducing or switching off a magnetic levitation force provided by the first transport system.
• the lower track section 121 with the carrier supported thereon may then be moved in a downward direction.
• An actuator may be provided for moving the lower track section 121 in the vertical direction, particularly away from an upper track section 122 of the first transport system. Accordingly, a distance between the lower track section 121 and the upper track section 122 can be increased via the actuator.
• the carrier can be lowered onto the carrier holding portion 151 of the path switch assembly 150, which moves the carrier supported thereon in the path switch direction S.
• a drive device particularly a cross drive, may be provided for moving the carrier holding portion 151 in the path switch direction S.
• a second lower track section 123 of a second transport system 114 provided along the second transport path T2 may be moved in an upward direction.
• the second lower track section 123 may be moved in the upward direction until the carrier is lifted up from the carrier holding portion 151 and is arranged at a predetermined level above the carrier holding portion 151.
• the second lower track section 123 may be moved toward a second upper track section of the second transport system. The distance between the second lower track section and the second lower track section can be reduced accordingly for enabling a contactless transport of the carrier by the second transport system 114.
• the carrier can then be contactlessly transported along the second transport path T2 with the second transport system 114.

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• 2017
  • 2017-08-25 JP JP2018538600A patent/JP2019532485A/ja active Pending
  • 2017-08-25 WO PCT/EP2017/071448 patent/WO2019037872A1/en active Application Filing
  • 2017-08-25 KR KR1020187024099A patent/KR20190087985A/ko not_active Application Discontinuation
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