WO2019033841A1 - 一种导热不干胶、导热膜及其制备方法和应用 - Google Patents

一种导热不干胶、导热膜及其制备方法和应用 Download PDF

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WO2019033841A1
WO2019033841A1 PCT/CN2018/090829 CN2018090829W WO2019033841A1 WO 2019033841 A1 WO2019033841 A1 WO 2019033841A1 CN 2018090829 W CN2018090829 W CN 2018090829W WO 2019033841 A1 WO2019033841 A1 WO 2019033841A1
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parts
heat
adhesive
film
heat conduction
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PCT/CN2018/090829
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English (en)
French (fr)
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赖优萍
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苏州格优碳素新材料有限公司
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Definitions

  • the present application relates to the field of thermal conductive materials, and in particular, to a thermal conductive adhesive, a thermal conductive film, and a preparation method and application thereof.
  • the heat conduction effect of the product and the heat-dissipating heat-dissipating product, the adhesive that the user needs now is the desire to connect the electronic product and the heat-dissipating heat-dissipating material to quickly conduct heat, and at the same time, can quickly reduce the surface temperature of the electronic product, thereby protecting the electronic product and prolonging the life of the electronic product. material.
  • the application of this direction is to add alumina or ceramic powder to the self-adhesive formula to make a self-adhesive with a little heat conduction and heat dissipation effect.
  • the thermal conductivity of aluminum oxide or ceramic powder itself is not ideal, the thermal conductivity of the heat-dissipating heat-dissipating product is between 0.5 and 1.5. If you can develop a self-adhesive with good heat dissipation, the electronic products will be connected with the heat-dissipating heat-dissipating functional materials, which will lead the market in the market with huge demand.
  • One of the purposes of the present application is to provide a self-adhesive with good heat dissipation, and to connect an electronic product with a heat-dissipating heat-dissipating functional material to achieve good heat dissipation performance, effectively protect electronic products, and provide safety for high-speed operation of the CPU. Guarantee.
  • the embodiment of the present invention adopts the following technical solutions:
  • the present application provides a thermally conductive adhesive comprising the following parts by mass:
  • Graphite powder / or graphene powder 10 ⁇ 50 parts such as 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts, 22 parts, 25 , 28, 30, 32, 35, 38, 40, 42, 45, 48 or 50, etc.;
  • 10 to 50 parts of epoxy resin for example, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts, 22 parts, 25 parts, 28 parts , 30, 32, 35, 38, 40, 42, 45, 48 or 50, etc.;
  • nano-silica for example, 5 parts, 5.5 parts, 6 parts, 6.5 parts, 7 parts, 7.5 parts, 8 parts, 8.5 parts, 9 parts, 9.5, 10 parts, 12 parts, 15 parts, 18 parts 20, 22, 25, 28 or 30 parts, etc.
  • the thermally conductive adhesive comprises the following parts by mass:
  • the present application provides a heat conductive film comprising a graphite film and a heat conductive adhesive which are integrally laminated, and graphite powder and/or graphene powder are dispersed in the heat conductive adhesive.
  • the finished thermal conductive film is attached to the release film in the form of a roll film for storage.
  • the thermal conductive adhesive is the thermal conductive adhesive as described in the first aspect.
  • the thickness of the thermally conductive adhesive is 5 to 30 ⁇ m, for example, 5 ⁇ m, 6 ⁇ m, 7 ⁇ m, 8 ⁇ m, 9 ⁇ m, 10 ⁇ m, 12 ⁇ m, 15 ⁇ m, 18 ⁇ m, 20 ⁇ m, 22 ⁇ m, 25 ⁇ m, 28 ⁇ m or 30 ⁇ m, etc., preferably 5 to 10 ⁇ m.
  • the graphite film has a thickness of 7 to 100 ⁇ m, for example, 7 ⁇ m, 10 ⁇ m, 12 ⁇ m, 15 ⁇ m, 18 ⁇ m, 20 ⁇ m, 22 ⁇ m, 25 ⁇ m, 28 ⁇ m, 30 ⁇ m, 32 ⁇ m, 35 ⁇ m, 38 ⁇ m, 40 ⁇ m, 45 ⁇ m, 50 ⁇ m, 55 ⁇ m, 60 ⁇ m. 65 ⁇ m, 70 ⁇ m, 75 ⁇ m, 80 ⁇ m, 85 ⁇ m, 90 ⁇ m, 95 ⁇ m or 100 ⁇ m, etc., preferably 12 to 40 ⁇ m.
  • the present application provides a method for preparing a thermally conductive film according to the second aspect, the method comprising the steps of:
  • the glue obtained in the step (1) is coated on a graphite film and dried to obtain the heat conductive film.
  • the thermally conductive adhesive obtained in the step (1) comprises the following parts by mass:
  • 20 to 40 parts of ethyl acetate for example, 20 parts, 22 parts, 25 parts, 28 parts, 30 parts, 31 parts, 32 parts, 33 parts, 34 parts, 35 parts, 36 parts, 37 parts, 38 parts, 39 parts Or 40 copies, etc.;
  • Ethyl acrylate 20-40 parts for example 20 parts, 22 parts, 25 parts, 28 parts, 30 parts, 31 parts, 32 parts, 33 parts, 34 parts, 35 parts, 36 parts, 37 parts, 38 parts, 39 parts Or 40 copies, etc.;
  • the thermally conductive adhesive obtained in the step (1) comprises the following parts by mass:
  • the drying temperature in the step (2) is 80 to 120 ° C, for example, 80 ° C, 85 ° C, 90 ° C, 91 ° C, 92 ° C, 93 ° C, 94 ° C, 95 ° C, 96 ° C, 97 ° C, 98 ° C, 99 ° C, 100 ° C, 102 ° C, 105 ° C, 108 ° C, 110 ° C, 112 ° C, 115 ° C, 118 ° C or 120 ° C, etc.
  • drying time is 10 ⁇ 20min, such as 10min, 11min, 12min, 13min, 14min, 15min, 16min, 17min, 18min, 19min or 20min.
  • the drying temperature in the step (2) is 90 to 100 ° C, and the drying time is 10 to 15 minutes.
  • the method for preparing the conductive film includes the following steps:
  • Dispersing graphite powder and/or graphene powder in a glue liquid of a self-adhesive to obtain a glue liquid of a heat-conductive adhesive includes the following parts by mass:
  • the glue obtained in the step (1) is coated on a graphite film and dried at 80 to 120 ° C for 10 to 20 minutes to obtain the heat conductive film.
  • the present application provides the use of the thermally conductive film according to the second aspect in an electronic product, a heat dissipating component of an LED device.
  • the embodiment of the present invention has at least the following beneficial effects:
  • the glue containing the graphite powder and/or the graphene powder and the graphite film are bonded together to produce a synergistic effect, and the heat conductive film of the embodiment of the present invention is in the Z axis as compared with the graphite film integrated with the self-adhesive in the related art.
  • the invention has better heat conduction performance, and the embodiment of the invention has better heat dissipation performance on the XYZ axis than the graphite-containing powder glue combined with other heat conductive substrates, and the X axis
  • the thermal conductivity on the Y and Z axes is above 1300W/MK, 1300W/MK and 50W/MK respectively;
  • the formulation of the heat-conductive adhesive in the embodiment of the invention makes the self-drying adhesive have better heat conduction and heat dissipation than the existing self-adhesive, and at the same time ensures a firm adhesive force with the heat-dissipating substrate.
  • a thermally conductive adhesive comprising the following parts by mass:
  • a heat conductive film comprising a 7 ⁇ m thick graphite film and a 5 ⁇ m thick thermal conductive adhesive.
  • the thermal conductive adhesive is the thermal conductive adhesive provided in the first embodiment.
  • a thermally conductive adhesive comprising the following parts by mass:
  • a heat conductive film comprising a 100 ⁇ m thick graphite film and a 30 ⁇ m thick heat conductive adhesive.
  • a thermally conductive adhesive comprising the following parts by mass:
  • a heat conductive film comprising a 12 ⁇ m thick graphite film and a 5 ⁇ m thick heat conductive adhesive.
  • a thermally conductive adhesive comprising the following parts by mass:
  • a heat conductive film comprising a 40 ⁇ m thick graphite film and a 10 ⁇ m thick heat conductive adhesive.
  • a thermally conductive adhesive comprising the following parts by mass:
  • a heat conductive film comprising a 25 ⁇ m thick graphite film and a thickness of 8 ⁇ m of the above heat conductive adhesive.
  • Embodiment 2 A method for preparing a thermally conductive film, the steps are as follows:
  • step 2) The glue obtained in the step 1) was coated on a graphite film and dried at 120 ° C for 10 minutes to obtain the heat conductive film.
  • Embodiment 3 A method for preparing a thermally conductive film, the steps are as follows:
  • step 2) The glue obtained in the step 1) was coated on a graphite film and dried at 80 ° C for 20 minutes to obtain the heat conductive film.
  • a preparation method of the thermally conductive film of Example 4 is as follows:
  • step 2) The glue obtained in the step 1) was coated on a graphite film and dried at 90 ° C for 15 minutes to obtain the heat conductive film.
  • a preparation method of the thermally conductive film of Example 5 is as follows:
  • step 2) The glue obtained in the step 1) was coated on a graphite film and dried at 100 ° C for 10 minutes to obtain the heat conductive film.
  • a preparation method of the thermally conductive film of Example 6 is as follows:
  • step 2) The glue obtained in the step 1) was coated on a graphite film and dried at 95 ° C for 12 minutes to obtain the heat conductive film.
  • Example 1 The only difference from Example 1 is that the graphite powder is omitted.
  • Example 1 The only difference from Example 1 is that the graphite powder is replaced by alumina.
  • Example 1 The only difference from Example 1 is that the graphite film is replaced with a PET film.
  • the laser thermal conductivity test method was used to test the thermal conductivity of the X, Y, and Z axes of the respective examples and the comparative thermally conductive film. The results are summarized in Table 1.
  • Comparative example 1 600 550 0.5 Comparative example 2 900 800 10 Comparative example 3 50 50 30
  • the glue containing the graphite powder and/or the graphene powder and the graphite film are bonded together to produce a synergistic effect, compared with the graphite film integrated with the related art in the related art, the present invention
  • the thermally conductive film of the embodiment has superior thermal conductivity on the Z-axis, and the embodiment of the present invention has thermal conductivity uniformity between graphite materials on the XYZ axis compared to graphite-containing powder glue composited with other thermally conductive substrates. Better heat dissipation.

Abstract

本申请涉及一种导热不干胶、导热膜及其制备方法和应用。所述导热不干胶包括如下质量份数的组分：石墨粉/或石墨烯粉10～50份；环氧树脂10～50份；纳米二氧化硅5～30份。导热不干胶的配方使得不干胶相较于现有不干胶而言具有明显更优的导热散热性的同时保证其与散热基体牢固的粘结力。含有石墨粉和/或石墨烯粉的胶水和石墨膜粘连在一起产生协同作用，相较于与相关技术中导热膜在XYZ轴上具有更优的散热性能。

Description

一种导热不干胶、导热膜及其制备方法和应用 技术领域
本申请涉及导热材料技术领域，尤其涉及一种导热不干胶、导热膜及其制备方法和应用。
背景技术
随着电子产品的发展，用于对电子产品高性能要求，对各项电子产品零件的功率要求也越来越高。固基本上很多电子产品上需要贴合导热散热材料，从而降低电子产品的表现问题，现有的铁和导热散热产品的不干胶基本上是不具备导热散热功能，这样就无形中降低了电子产品和导热散热产品导热散热效果，用户现在需要的不干胶是希望连接电子产品和导热散热材料能快速传导热量，同时又能快速降低电子产品表面温度，从而保护电子产品，延长电子产品寿命的材料。
国内外市场上对此方向的应用是在不干胶配方中添加氧化铝或者陶瓷粉，做出具有一点导热散热效果的不干胶。因为氧化铝或者陶瓷粉本身的导热散热效果就不是很理想，从而导致做出来的导热散热产品的导热系数在0.5～1.5之间。如果能够开发一种散热性良好的不干胶，电子产品与导热散热功能材料连接起来，将在拥有巨大需要的市场中占领先机。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本申请的目的之一在于提供一种散热性良好的不干胶，将电子产品与导热散热功能材料连接起来，实现各向散热性良好的效果，有效保护电子产品，为 CPU高速化运行提供安全保障。
为达此目的，本发明实施例采用如下技术方案：
第一方面，本申请提供了一种导热不干胶，所述导热不干胶包括如下质量份数的组分：
石墨粉/或石墨烯粉    10～50份，例如10份、11份、12份、13份、14份、15份、16份、17份、18份、19份、20份、22份、25份、28份、30份、32份、35份、38份、40份、42份、45份、48份或50份等；
环氧树脂            10～50份，例如10份、11份、12份、13份、14份、15份、16份、17份、18份、19份、20份、22份、25份、28份、30份、32份、35份、38份、40份、42份、45份、48份或50份等；
纳米二氧化硅        5～30份，例如5份、5.5份、6份、6.5份、7份、7.5份、8份、8.5份、9份、9.5、10份、12份、15份、18份、20份、22份、25份、28份或30份等。
优选地，所述导热不干胶包括如下质量份数的组分：
石墨粉和/或石墨烯粉 30～40份；
环氧树脂            30～40份；
纳米二氧化硅        20～30份。
第二方面，本申请提供一种导热膜，所述导热膜包括贴合为一体的石墨膜和导热不干胶，所述导热不干胶中分散有石墨粉和/或石墨烯粉。批量生产时，成品的导热膜以卷膜形式附在离型膜上储存备用。
优选地，所述导热不干胶为如第一方面所述的导热不干胶。
所述导热不干胶的厚度为5～30μm，例如5μm、6μm、7μm、8μm、9μm、10μm、12μm、15μm、18μm、20μm、22μm、25μm、28μm或30μm等，优选 5～10μm。
优选地，所述石墨膜的厚度为7～100μm，例如7μm、10μm、12μm、15μm、18μm、20μm、22μm、25μm、28μm、30μm、32μm、35μm、38μm、40μm、45μm、50μm、55μm、60μm、65μm、70μm、75μm、80μm、85μm、90μm、95μm或100μm等，优选12～40μm。
第三方面，本申请提供如第二方面所述导热膜的制备方法，所述制备方法包括如下步骤：
(1)将石墨粉和/或石墨烯粉分散于不干胶的胶液中，得到导热不干胶的胶液；
(2)将步骤(1)所得胶液涂布在石墨膜上，烘干，得到所述导热膜。
优选地，步骤(1)所得导热不干胶的胶液包括如下质量份数的组分：
石墨粉/或石墨烯粉   10～50份；
环氧树脂            10～50份；
纳米二氧化硅        5～30份；
乙酸乙酯            20～40份，例如20份、22份、25份、28份、30份、31份、32份、33份、34份、35份、36份、37份、38份、39份或40份等；
丙烯酸乙酯          20～40份，例如20份、22份、25份、28份、30份、31份、32份、33份、34份、35份、36份、37份、38份、39份或40份等；
进一步优选地，步骤(1)所得导热不干胶的胶液包括如下质量份数的组分：
Figure PCTCN2018090829-appb-000001
Figure PCTCN2018090829-appb-000002
优选地，步骤(2)所述烘干的温度为80～120℃，例如80℃、85℃、90℃、91℃、92℃、93℃、94℃、95℃、96℃、97℃、98℃、99℃、100℃、102℃、105℃、108℃、110℃、112℃、115℃、118℃或120℃等，烘干的时间为10～20min，例如10min、11min、12min、13min、14min、15min、16min、17min、18min、19min或20min等。
优选地，步骤(2)所述烘干的温度为90～100℃，烘干的时间为10～15min。
作为本发明实施例优选的技术方案，所述导电膜的制备方法包括如下步骤：
(1)将石墨粉和/或石墨烯粉分散于不干胶的胶液中，得到导热不干胶的胶液；所得导热不干胶的胶液包括如下质量份数的组分：
Figure PCTCN2018090829-appb-000003
(2)将步骤(1)所得胶液涂布在石墨膜上，80～120℃烘干10～20min，得到所述导热膜。
第四方面，本申请提供了如第二方面所述导热膜在电子产品、LED装置的散热部件中的应用。
与相关技术相比，本发明实施例至少具有如下有益效果：
(1)含有石墨粉和/或石墨烯粉的胶水和石墨膜粘连在一起产生协同作用，相较于与相关技术中不干胶一体化的石墨膜，本发明实施例的导热膜在Z轴上具有更优的热传导性能，相较于与其他导热基质复合的含石墨粉胶水，本发明 实施例在利用石墨材料之间的导热一致性，在XYZ轴上具有更优的散热性能，X轴、Y、Z轴上的导热系数分别在1300W/MK、1300W/MK、50W/MK以上；
(2)本发明实施例中导热不干胶的配方使得不干胶相较于现有不干胶而言具有明显更优的导热散热性的同时保证其与散热基体牢固的粘结力。
具体实施方式
下面通过具体实施方式来进一步说明本发明实施例的技术方案。但下述的实例仅仅是本发明实施例的简易例子，并不代表或限制本申请的权利保护范围，本申请的保护范围以权利要求书为准。
实施例1
一种导热不干胶，包括如下质量份数的组分：
石墨粉             50份；
环氧树脂           50份；
纳米二氧化硅       5份。
实施例2
一种导热膜，由贴合为一体的厚7μm的石墨膜和厚5μm的导热不干胶构成。其中，导热不干胶为实施例1提供的导热不干胶。
实施例3
一种导热不干胶，包括如下质量份数的组分：
石墨烯粉           10份；
环氧树脂           10份；
纳米二氧化硅       30份。
一种导热膜，由贴合为一体的厚100μm的石墨膜和厚30μm的上述导热不干胶构成。
实施例4
一种导热不干胶，包括如下质量份数的组分：
石墨粉             30份；
环氧树脂           40份；
纳米二氧化硅       20份。
一种导热膜，由贴合为一体的厚12μm的石墨膜和厚5μm的上述导热不干胶构成。
实施例5
一种导热不干胶，包括如下质量份数的组分：
石墨烯粉           40份；
环氧树脂           30份；
纳米二氧化硅       30份。
一种导热膜，由贴合为一体的厚40μm的石墨膜和厚10μm的上述导热不干胶构成。
实施例6
一种导热不干胶，包括如下质量份数的组分：
石墨粉             35份；
环氧树脂           35份；
纳米二氧化硅       25份。
一种导热膜，由贴合为一体的厚25μm的石墨膜和厚8μm的上述导热不干胶构成。
实施例7
实施例2导热膜的一种制备方法，步骤如下：
1)将石墨粉和/或石墨烯粉分散于不干胶的胶液中，得到导热不干胶的胶液，包括如下质量份数的组分：
Figure PCTCN2018090829-appb-000004
2)将步骤1)所得胶液涂布在石墨膜上，120℃烘干10min，得到所述导热膜。
实施例8
实施例3导热膜的一种制备方法，步骤如下：
1)将石墨粉和/或石墨烯粉分散于不干胶的胶液中，得到导热不干胶的胶液，包括如下质量份数的组分：
Figure PCTCN2018090829-appb-000005
2)将步骤1)所得胶液涂布在石墨膜上，80℃烘干20min，得到所述导热膜。
实施例9
实施例4导热膜的一种制备方法，步骤如下：
1)将石墨粉和/或石墨烯粉分散于不干胶的胶液中，得到导热不干胶的胶 液，包括如下质量份数的组分：
Figure PCTCN2018090829-appb-000006
2)将步骤1)所得胶液涂布在石墨膜上，90℃烘干15min，得到所述导热膜。
实施例10
实施例5导热膜的一种制备方法，步骤如下：
1)将石墨粉和/或石墨烯粉分散于不干胶的胶液中，得到导热不干胶的胶液，包括如下质量份数的组分：
Figure PCTCN2018090829-appb-000007
2)将步骤1)所得胶液涂布在石墨膜上，100℃烘干10min，得到所述导热膜。
实施例11
实施例6导热膜的一种制备方法，步骤如下：
1)将石墨粉和/或石墨烯粉分散于不干胶的胶液中，得到导热不干胶的胶液，包括如下质量份数的组分：
Figure PCTCN2018090829-appb-000008
2)将步骤1)所得胶液涂布在石墨膜上，95℃烘干12min，得到所述导热膜。
对比例1
与实施例1的区别仅在于：省去石墨粉。
对比例2
与实施例1的区别仅在于：将石墨粉替换为氧化铝。
对比例3
与实施例1的区别仅在于：将石墨膜替换为PET膜。
激光导热测试方法测试各实施例与对比例导热膜在X、Y、Z轴的导热系数。结果整理于表1。
表1
导热膜 X轴导热系数(W/MK) Y轴导热系数(W/MK) Z轴导热系数(W/MK)
实施例2 1300 1500 50
实施例3 1500 1300 50
实施例4 1700 1700 60
实施例5 1900 1900 60
实施例6 2000 2000 70
对比例1 600 550 0.5
对比例2 900 800 10
对比例3 50 50 30
从表1可以看出，本发明实施例含有石墨粉和/或石墨烯粉的胶水和石墨膜粘连在一起产生协同作用，相较于与相关技术中不干胶一体化的石墨膜，本发明实施例的导热膜在Z轴上具有更优的热传导性能，相较于与其他导热基质复合的含石墨粉胶水，本发明实施例在利用石墨材料之间的导热一致性，在XYZ轴上具有更优的散热性能。
申请人声明，本申请通过上述实施例来说明本申请的详细工艺设备和工艺流程，但本申请并不局限于上述详细工艺设备和工艺流程，即不意味着本申请必须依赖上述详细工艺设备和工艺流程才能实施。所属技术领域的技术人员应该明了，对本发明实施例的任何改进，对本发明产品各原料的等效替换及辅助成分的添加、具体方式的选择等，均落在本申请的保护范围和公开范围之内。

Claims (10)

  1. 一种导热不干胶，其中所述导热不干胶包括如下质量份数的组分：
    石墨粉/或石墨烯粉      10～50份；
    环氧树脂               10～50份；
    纳米二氧化硅           5～30份。
  2. 如权利要求1所述的导热不干胶，其中，所述导热不干胶包括如下质量份数的组分：
    石墨粉和/或石墨烯粉     30～40份；
    环氧树脂                30～40份；
    纳米二氧化硅            20～30份。
  3. 一种导热膜，其中，所述导热膜包括贴合为一体的石墨膜和导热不干胶，所述导热不干胶中分散有石墨粉和/或石墨烯粉。
  4. 如权利要求3所述的导热膜，其中，所述导热不干胶为如权利要求1或2所述的导热不干胶。
  5. 如权利要求3或4所述的导热膜，其中，所述导热不干胶的厚度为5～30μm，优选5～10μm；
    优选地，所述石墨膜的厚度为7～100μm，优选12～40μm。
  6. 如权利要求3～5任一项所述导热膜的制备方法，其中，所述制备方法包括如下步骤：
    (1)将石墨粉和/或石墨烯粉分散于不干胶的胶液中，得到导热不干胶的胶液；
    (2)将步骤(1)所得胶液涂布在石墨膜上，烘干，得到所述导热膜。
  7. 如权利要求6所述的制备方法，其中，步骤(1)所得导热不干胶的胶液包括如下质量份数的组分：
    Figure PCTCN2018090829-appb-100001
    优选地，步骤(1)所得导热不干胶的胶液包括如下质量份数的组分：
    Figure PCTCN2018090829-appb-100002
  8. 如权利要求6或7所述的制备方法，其中，步骤(2)所述烘干的温度为80～120℃，烘干的时间为10～20min；
    优选地，步骤(2)所述烘干的温度为90～100℃，烘干的时间为10～15min。
  9. 如权利要求6～8任一项所述的制备方法，其中，所述制备方法包括如下步骤：
    (1)将石墨粉和/或石墨烯粉分散于不干胶的胶液中，得到导热不干胶的胶液；所得导热不干胶的胶液包括如下质量份数的组分：
    Figure PCTCN2018090829-appb-100003
    (2)将步骤(1)所得胶液涂布在石墨膜上，80～120℃烘干10～20min，得到所述导热膜。
  10. 如权利要求3～5任一项所述导热膜在电子产品、LED装置的散热部件中的应用。
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CN109233714A (zh) * 2018-08-29 2019-01-18 佛山皖和新能源科技有限公司 一种导热填充胶
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102433098A (zh) * 2011-09-19 2012-05-02 常州合润新材料科技有限公司 一种填充石墨烯各向同性高性能导热胶粘剂及制备方法
CN102757736A (zh) * 2011-04-29 2012-10-31 苏州沛德导热材料有限公司 一种石墨导热胶带及其生产工艺
CN104673122A (zh) * 2013-12-03 2015-06-03 凯尔凯德新材料科技泰州有限公司 一种高导热率的导热胶膜及其制作方法
CN105315943A (zh) * 2015-11-24 2016-02-10 苏州盖德精细材料有限公司 一种高导热环氧树脂导电胶及其制备方法
CN105925053A (zh) * 2016-03-09 2016-09-07 吴立刚 导热压敏不干胶油墨
CN107502254A (zh) * 2017-08-14 2017-12-22 苏州格优碳素新材料有限公司 一种导热不干胶、导热膜及其制备方法和应用

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5185582B2 (ja) * 2007-09-11 2013-04-17 日本バルカー工業株式会社 熱伝導性シート
CN104559881A (zh) * 2013-10-25 2015-04-29 上海联浪新材料科技有限公司 一种纳米结构光热双固化透明导热环氧胶及其制备方法
CN104371623A (zh) * 2014-11-13 2015-02-25 无锡中洁能源技术有限公司 一种导热导电胶剂及其制备方法
CN105514065B (zh) * 2015-12-29 2017-12-15 东莞市莞信企业管理咨询有限公司 一种导热胶/石墨烯复合多层散热膜的制备方法
CN106147665A (zh) * 2016-07-01 2016-11-23 深圳市烯世传奇科技有限公司 一种基于石墨烯粉体的耐久性导热胶及其制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102757736A (zh) * 2011-04-29 2012-10-31 苏州沛德导热材料有限公司 一种石墨导热胶带及其生产工艺
CN102433098A (zh) * 2011-09-19 2012-05-02 常州合润新材料科技有限公司 一种填充石墨烯各向同性高性能导热胶粘剂及制备方法
CN104673122A (zh) * 2013-12-03 2015-06-03 凯尔凯德新材料科技泰州有限公司 一种高导热率的导热胶膜及其制作方法
CN105315943A (zh) * 2015-11-24 2016-02-10 苏州盖德精细材料有限公司 一种高导热环氧树脂导电胶及其制备方法
CN105925053A (zh) * 2016-03-09 2016-09-07 吴立刚 导热压敏不干胶油墨
CN107502254A (zh) * 2017-08-14 2017-12-22 苏州格优碳素新材料有限公司 一种导热不干胶、导热膜及其制备方法和应用

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