WO2019033559A1 - 一种 oled 薄膜封装用掩膜板 - Google Patents

一种 oled 薄膜封装用掩膜板 Download PDF

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Publication number
WO2019033559A1
WO2019033559A1 PCT/CN2017/107992 CN2017107992W WO2019033559A1 WO 2019033559 A1 WO2019033559 A1 WO 2019033559A1 CN 2017107992 W CN2017107992 W CN 2017107992W WO 2019033559 A1 WO2019033559 A1 WO 2019033559A1
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Prior art keywords
mask
thin film
substrate
oled
film encapsulation
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PCT/CN2017/107992
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English (en)
French (fr)
Inventor
余威
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US15/579,852 priority Critical patent/US20190198821A1/en
Publication of WO2019033559A1 publication Critical patent/WO2019033559A1/zh
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Definitions

  • the present invention relates to a mask, and more particularly to a mask for OLED film packaging.
  • OLED displays are a new generation of displays through OLEDs
  • An organic thin film is formed on the substrate, wherein the organic thin film is wrapped between the cathode and the anode metal, and when the voltage is applied to the two electrodes, the organic thin film emits light.
  • OLED The display has self-illumination, fast response, wide viewing angle, color saturation and the like with respect to the liquid crystal display, including the realization of curved surface display.
  • a flexible plastic substrate can be used as a carrier, and then a film packaging process can be used to achieve a flexible winding.
  • OLED panel can be used as a carrier, and then a film packaging process can be used to achieve a flexible winding.
  • the OLED film package mainly adopts the structure of an inorganic layer and an organic layer, and the inorganic layer materials are commonly used as SiNx, SiOx, SiON Etc.; organic polymer is commonly used in organic layers.
  • the inorganic layer acts to block water oxygen; the organic layer mainly serves to eliminate stress between the two inorganic layers.
  • a mask is disposed, and an opening is formed on the mask. The area of the opening can be formed on the substrate, and the unopened area cannot be formed on the substrate.
  • the mask in the process of using the mask, in order to avoid the shadow effect, the mask is formed during film formation.
  • 302 is required to be in close contact with the substrate 301.
  • the mask 302 forms an opening 304, and the film encapsulating material is on the substrate 301 and the mask 302.
  • a continuous film 303 is formed at the intersection of the two; after the film formation is completed, as shown in FIG. 3b, the mask 310 needs to be raised to facilitate the pick-and-place operation of the substrate 311, and the continuous film 312 is due to the mask.
  • the rise of 310 is at the intersection of both the substrate 311 and the mask 310.
  • Area A 313 Cracking occurs, causing a large number of particles, and particles are an important factor in the success of film packaging. When the particles are long, the film package is often easy to fail.
  • the prior art OLED The mask for film encapsulation will form a continuous film of the substrate, the mask and the intersection of the two in the film encapsulation process. After the film is formed, when the mask rises, the continuous film will tear due to the rise of the mask. The rupture causes a large number of particles, which in turn affects the film encapsulation effect.
  • the invention provides an OLED
  • the mask for thin film encapsulation can prevent the continuous film between the substrate and the mask from being broken due to tearing when the mask is raised, thereby ensuring the film encapsulation effect.
  • the invention provides a mask for OLED film packaging, comprising:
  • the hollow portion including an opening for forming a thin film encapsulation layer on the substrate;
  • the masking portion is configured to cover the non-thin film packaging region of the substrate, a surface of the masking portion contacting the substrate is a first surface, and a surface of the masking portion away from the substrate is a second surface;
  • the masking portion located around the opening has a chamfered corner on at least a portion of the edge contacting the substrate, and an area of the first surface is smaller than an area of the second surface, A second surface covers the first surface.
  • the chamfer angle is a straight cut angle or a round cut angle.
  • a first cutting location is formed on the sidewall of the aperture edge and a second cutting location is formed on the first surface.
  • the chamfer angle is an equilateral right angle chamfer, and the distance between the first cutting position and the second cutting position is perpendicular to the vertical direction of the mask. 45 °.
  • the distance from the first cutting location to the substrate is at least 15-20 um.
  • the OLED A mask for film encapsulation is used to form a gap between the thin film encapsulation layer and the sidewall of the opening.
  • the slit surrounds the periphery of the thin film encapsulation layer.
  • a gap is formed between the thin film encapsulation layer formed on the substrate corresponding to the open area and the thin film encapsulation material attached to the mask portion.
  • the mask comprises two or more of the hollow portions, and the hollow portion forms a corresponding one of the openings.
  • the invention also provides a mask for OLED film packaging, comprising:
  • the hollow portion including an opening for forming a thin film encapsulation layer on the substrate;
  • the masking portion is configured to cover the non-thin film packaging region of the substrate, a surface of the masking portion contacting the substrate is a first surface, and a surface of the masking portion away from the substrate is a second surface;
  • the masking portion located around the opening has a chamfered corner at least a portion of the edge on the side in contact with the substrate.
  • the chamfer angle is a straight cut angle or a round cut angle.
  • a first cutting location is formed on the sidewall of the aperture edge and a second cutting location is formed on the first surface.
  • the chamfer angle is an equilateral right angle chamfer, and the distance between the first cutting position and the second cutting position is perpendicular to the vertical direction of the mask. 45 °.
  • the distance from the first cutting location to the substrate is at least 15-20 um.
  • the OLED A mask for film encapsulation is used to form a gap between the thin film encapsulation layer and the sidewall of the opening.
  • the slit surrounds the periphery of the thin film encapsulation layer.
  • a gap is formed between the thin film encapsulation layer formed on the substrate corresponding to the open area and the thin film encapsulation material attached to the mask portion.
  • the mask comprises two or more of the hollow portions, and the hollow portion forms a corresponding one of the openings.
  • the beneficial effects of the present invention are: an OLED provided by the present invention compared to the existing mask for OLED film packaging.
  • a mask for a film encapsulation the mask is on a side in contact with the substrate, and at least a portion of the edge of the corresponding mask portion around the opening forms a chamfer angle to cause the film formed on the substrate to adhere to the mask and the mask
  • the film is disconnected, and a continuous film is formed between the substrate and the mask plate, so that when the mask rises, the generated continuous film is broken due to tearing, thereby ensuring the film encapsulation effect.
  • FIG. 1 is a cross-sectional view of a mask for OLED thin film packaging according to Embodiment 1 of the present invention
  • FIG. 2 is a cross-sectional view of a mask for OLED thin film packaging according to Embodiment 2 of the present invention.
  • 3a is a cross-sectional view of a mask for OLED thin film packaging in the prior art
  • FIG. 3b is a partial view of a mask for OLED thin film packaging in the prior art.
  • the invention solves the prior art OLED for the existing mask for OLED film packaging
  • the mask for film encapsulation forms a continuous film at the intersection of the substrate, the mask and the two, and is easily torn and ruptured during the rising process of the mask, thereby causing a large amount of particles to be generated, thereby causing technical problems of failure of the film package.
  • the embodiment of the invention can solve this drawback.
  • the mask for thin film encapsulation includes: a hollow portion including an opening 105 for forming a thin film encapsulation layer 103 on the substrate 101; a mask portion 102, the mask portion 102
  • the cover substrate 102 is in a non-film package region, and a surface of the mask portion 102 in contact with the substrate 101 is a first surface, and the mask portion 102 is away from the substrate 101.
  • One side is a second surface; wherein the mask portion 102 located around the opening 105 forms a straight cut angle at least a portion of the edge of the mask portion 102 on the side in contact with the substrate 101.
  • the first surface has an area smaller than the second surface, the second surface covers the first surface; the first surface is opposite and parallel to the second surface; Hole 105 a first cutting location 106 is formed on the sidewall of the edge, and a second cutting location 107 is formed on the first surface; the distance from the first cutting location 106 to the substrate 101 is at least 15 ⁇ 20um
  • the straight cut angle of the mask portion 102 is formed on the mask via the first cutting position 106 to the second cutting position 107.
  • the opening 105 surrounded by the masking portion 102 The upper end of the opening 105 is larger than the one end of the substrate 101, and the opposite end of the opening 105 is used to define the size of the thin film encapsulation layer 103.
  • the straight cut angle is an equilateral right angle cut corner
  • the first cutting position 106 and the second cutting position 107 The distance between them is 45 ° in the direction perpendicular to the mask.
  • the mask needs to be with the substrate 101.
  • the thin film encapsulation layer 103 includes an inorganic film and an organic film.
  • the opening of the opening 105 away from the end of the substrate 101 has a function of defining the size of the thin film encapsulation layer 103, the opening is When the one end near the substrate 101 is larger than the opening at the other end, the area of the thin film encapsulation layer 103 formed on the substrate 101 is smaller than the opening 105 close to the substrate. An area of one end opening, a gap is formed between the thin film encapsulation layer 103 and the sidewall of the opening 105, and the slit surrounds the thin film encapsulation layer 103. All around.
  • the masking portion 102 is used to block the thin film encapsulation material in the non-packaged area, so that the surface of the masking portion 102 is adhered with a thin film encapsulation film 104, the opening
  • the corresponding masking portion 102 of the periphery of the substrate 102 has the straight cut angle on a side close to the substrate 101, and the distance between the first cutting position 106 and the substrate 101 is at least 15 ⁇ 20um.
  • the thickness of the inorganic film is generally between 0.5 and 1 um, and the thickness of the organic film is generally less than 10 um, so the thin film encapsulation film attached to the surface of the masking portion 102 is present.
  • a gap exists between the thin film encapsulation layer 103 formed on the substrate 101, and is in an off state at the straight cut angle.
  • the angle of the straight cut angle is not limited by the present invention.
  • the angle can be determined according to the thickness of the specific mask and the thickness of the thin film encapsulation layer, as long as the thin film encapsulation layer and the mask on the substrate and the mask are adhered to the mask.
  • the film encapsulation films are disconnected to form a gap.
  • the mask for thin film encapsulation includes: a hollow portion including an opening 205 for forming a thin film encapsulation layer 203 on the substrate 201; a mask portion 202, the mask portion 202
  • the mask 201 is a non-thin film package region, and a surface of the mask portion 202 that is in contact with the substrate 201 is a first surface, and the mask portion 202 is away from the substrate 201.
  • One side is a second surface; wherein the mask portion 202 located around the opening 205 forms a rounded corner at least a portion of the edge of the mask 201 on the side in contact with the substrate 201.
  • first surface has an area smaller than an area of the second surface, and the second surface covers the first surface.
  • a first cutting location 206 is formed on the edge sidewall and a second cutting location 207 is formed on the first surface.
  • the circular chamfer angle is a convex chamfer angle, and the first cutting position 206 and the second cutting position 207 The distance between them is 45 ° in the direction perpendicular to the mask.
  • the thin film encapsulation layer 203 is formed in a corresponding region, and the thin film encapsulation layer 203 includes an inorganic film and an organic film, and the opening of the opening 205 away from the end of the substrate 201 has a film encapsulation layer.
  • the effect of the size 203 is such that the thin film encapsulation layer 203 formed on the substrate 201 when the opening 205 is closer to the substrate 201 than the other end is larger than the other end opening.
  • the masking portion 202 is used to block the film encapsulation material in the non-packaged region, so that the mask portion 202 is adhered with a thin film encapsulation film 204.
  • the masking portion 202 around the opening 205 has the rounded corner on a side close to the substrate 201, and the distance from the first cutting position 206 to the substrate 201 is at least 15 ⁇ 20um, in the current thin film encapsulation, the thickness of the inorganic film is generally between 0.5 and 1 um, and the thickness of the organic film is generally ⁇ 10 um, so it is attached to the masking portion 202.
  • a gap is formed between the thin film encapsulation film 204 on the surface and the thin film encapsulation layer 203 formed on the substrate 201, and is in an off state at the chamfered corner.
  • the angle of the circular chamfer angle is not limited by the present invention.
  • the angle can be determined according to the thickness of the specific mask and the thickness of the thin film encapsulation layer.
  • the circular chamfer angle can also be a concave chamfer angle or other shapes, as long as the substrate is satisfied.
  • the upper thin film encapsulation layer and the mask and the thin film encapsulation film attached to the mask are disconnected to form a gap.
  • the invention also provides an OLED a mask for a thin film encapsulation, the mask comprising two or more of the hollow portions, and the hollow portion forming a corresponding opening for the OLED Forming a plurality of thin film encapsulation units on the substrate, wherein the mask plate corresponding to the periphery of the opening has a chamfered angle on a side in contact with the substrate; the chamfer angle is a straight cut angle or a round cut angle, or other shape.
  • the mask and the OLED One side of the substrate contact is a first surface, and the mask is away from the OLED One side of the substrate is a second surface; a first cutting position is formed on a sidewall of the opening edge, and a second cutting position is formed on the first surface corresponding to a circumference of the opening; wherein the first cutting Bit to the OLED
  • the distance between the substrate is at least 15-20 um, and the thin film encapsulation film attached to the surface of the mask portion and the OLED Forming a gap between the plurality of thin film encapsulating units formed on the substrate, in a disconnected state, and forming a surrounding of the thin film encapsulating unit between a thin film encapsulating unit and a sidewall of a corresponding one of the openings The gap.
  • the angle of the chamfer is not limited, and the angle can be determined according to the thickness of the specific mask and the thickness of the film encapsulation layer.
  • the OLED of the present invention is such that the film formed on the substrate is disconnected from the mask and the film attached to the mask, thereby avoiding the formation of a continuous film between the substrate and the mask, thereby avoiding the rise of the mask.
  • the resulting continuous film is ruptured by tearing to produce particles, thereby ensuring the film encapsulation effect.

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Abstract

一种OLED薄膜封装用掩膜板，包括镂空部，该镂空部包括用以形成薄膜封装层(103)的开孔(105)；掩盖部(102)，该掩盖部(102)用以掩盖基板(101)非薄膜封装区域，该掩盖部(102)与该基板(101)接触的一面为第一表面，该掩盖部(102)远离该基板(101)的一面为第二表面；位于该开孔(105)四周的该掩盖部(102)在与该基板(101)接触的一侧，其边缘至少一部分形成切角。

Description

一种 OLED 薄膜封装用掩膜板 技术领域
本发明涉及一种掩膜板，尤其涉及一种 OLED 薄膜封装用掩膜板。
背景技术
OLED 显示器是新一代的显示器，通过在 OLED 基板上制作有机薄膜，其中有机薄膜被包在阴极和阳极金属之间，给两电极加电压，则有机薄膜会发光。 OLED 显示器相对于液晶显示器有自发光，响应快，视角广，色彩饱和等许多优点，其中包括可实现曲面显示。如以可绕曲的塑胶基板等为载体，再配合薄膜封装制程，即可实现可绕曲的 OLED 面板。
目前 OLED 薄膜封装主要采用无机层和有机层叠层的结构，无机层材料常见如 SiNx ， SiOx ， SiON 等；有机层常用高分子聚合物。无机层起到阻隔水氧的作用；有机层主要为消除两层无机层间的应力等作用。薄膜封装过程中需配置掩膜板，掩膜板上有开孔，开孔的区域可成膜在基板上，未开孔的区域无法在基板上成膜。
如图 3a 所示，在使用掩膜板过程中，为了避免阴影效应 (shadow effect) ，成膜时掩膜板 302 需要与基板 301 紧密贴合，所述掩膜板 302 形成一开孔 304 ，薄膜封装材料就会在所述基板 301 、所述掩膜板 302 及两者交接处生成连续薄膜 303 ；成膜完成后，如图 3b 所示，掩膜板 310 需上升便于基板 311 的取放动作，此时连续薄膜 312 会因所述掩膜板 310 的上升，在所述基板 311 与所述掩膜板 310 的两者交接处 A 区 313 发生破裂，造成大量粒子，而粒子又是薄膜封装成败的重要因素，粒子多时，薄膜封装往往很容易失效。
综上所述，现有技术的 OLED 薄膜封装用掩膜板，在薄膜封装制程中会生成基板、掩膜板及两者交接处的连续薄膜，成膜完成后，掩膜板上升时，连续的薄膜会因掩膜板上升而撕扯破裂，从而造成大量粒子，进而影响薄膜封装效果。
 技术问题
本发明提供一种 OLED 薄膜封装用掩膜板，其能避免掩膜板上升时，基板与掩膜板之间的连续薄膜因撕扯破裂而产生粒子，进而保证薄膜封装效果。
技术解决方案
为解决上述问题，本发明提供的技术方案如下：
本发明提供一种 OLED 薄膜封装用掩膜板，包括：
镂空部，所述镂空部包括用以在基板上形成薄膜封装层的开孔；
掩盖部，所述掩盖部用以掩盖所述基板非薄膜封装区域，所述掩盖部与所述基板接触的一面为第一表面，所述掩盖部远离所述基板的一面为第二表面；
其中，位于所述开孔四周的所述掩盖部在与所述基板接触的一侧，其边缘至少一部分形成切角，且所述第一表面的面积小于所述第二表面的面积，所述第二表面覆盖所述第一表面。
根据本发明一优选实施例，所述切角为直切角或圆切角。
根据本发明一优选实施例，在所述开孔边缘侧壁上形成第一切割位，在所述第一表面上形成第二切割位。
根据本发明一优选实施例，所述切角为等边直角切角，所述第一切割位与所述第二切割位之间的距离，与所述掩膜板垂直方向所呈夹角为 45 °。
根据本发明一优选实施例，所述第一切割位到所述基板的距离至少为 15~20um 。
根据本发明一优选实施例，所述 OLED 薄膜封装用掩膜板用于使得所述薄膜封装层与所述开孔侧壁之间形成缝隙。
根据本发明一优选实施例，所述缝隙环绕所述薄膜封装层四周。
根据本发明一优选实施例，所述基板上对应所述开孔区域形成的所述薄膜封装层，与附着于所述掩盖部的薄膜封装材料之间存在间隙。
根据本发明一优选实施例，所述掩膜板包括两个及两个以上的所述镂空部，一所述镂空部形成相应的一所述开孔。
本发明还提供一种 OLED 薄膜封装用掩膜板，包括：
镂空部，所述镂空部包括用以在基板上形成薄膜封装层的开孔；
掩盖部，所述掩盖部用以掩盖所述基板非薄膜封装区域，所述掩盖部与所述基板接触的一面为第一表面，所述掩盖部远离所述基板的一面为第二表面；
其中，位于所述开孔四周的所述掩盖部在与所述基板接触的一侧，其边缘至少一部分形成切角。
根据本发明一优选实施例，所述切角为直切角或圆切角。
根据本发明一优选实施例，在所述开孔边缘侧壁上形成第一切割位，在所述第一表面上形成第二切割位。
根据本发明一优选实施例，所述切角为等边直角切角，所述第一切割位与所述第二切割位之间的距离，与所述掩膜板垂直方向所呈夹角为 45 °。
根据本发明一优选实施例，所述第一切割位到所述基板的距离至少为 15~20um 。
根据本发明一优选实施例，所述 OLED 薄膜封装用掩膜板用于使得所述薄膜封装层与所述开孔侧壁之间形成缝隙。
根据本发明一优选实施例，所述缝隙环绕所述薄膜封装层四周。
根据本发明一优选实施例，所述基板上对应所述开孔区域形成的所述薄膜封装层，与附着于所述掩盖部的薄膜封装材料之间存在间隙。
根据本发明一优选实施例，所述掩膜板包括两个及两个以上的所述镂空部，一所述镂空部形成相应的一所述开孔。
 有益效果
本发明的有益效果为：相较于现有的 OLED 薄膜封装用掩膜板，本发明所提供的一种 OLED 薄膜封装用掩膜板，该掩膜板在与基板接触的一侧，开孔四周相应的掩盖部的边缘至少一部分形成切角，使基板上生成的薄膜与掩膜板以及掩膜板上附着的薄膜呈断开状态，避免基板与掩膜板之间生成连续薄膜，从而避免掩膜板上升时，生成的连续薄膜因撕扯破裂而产生粒子，进而保证了薄膜封装效果。
附图说明
为了更清楚地说明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单介绍，显而易见地，下面描述中的附图仅仅是发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图 1 为本发明实施例一提供的 OLED 薄膜封装用掩膜板剖视图；
图 2 为本发明实施例二提供的 OLED 薄膜封装用掩膜板剖视图；
图 3a 为现有技术中 OLED 薄膜封装用掩膜板剖视图；
图 3b 为现有技术中 OLED 薄膜封装用掩膜板局部图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图示，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如 [ 上 ] 、 [ 下 ] 、 [ 前 ] 、 [ 后 ] 、 [ 左 ] 、 [ 右 ] 、 [ 内 ] 、 [ 外 ] 、 [ 侧面 ] 等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。在图中，结构相似的单元是用以相同标号表示。
本发明针对现有的 OLED 薄膜封装用掩膜板，解决了现有技术的 OLED 薄膜封装用掩膜板，在基板、掩膜板及两者交接处的生成连续薄膜，在掩膜板上升过程中容易撕扯破裂，从而造成大量粒子产生，进而引起薄膜封装失效的技术问题，本发明实施例能够解决该缺陷。
如图 1 所示，本发明实施例一提供的 OLED 薄膜封装用掩膜板剖视图，本发明提供的 OLED 薄膜封装用掩膜板，包括：镂空部，所述镂空部包括用以在基板 101 上形成薄膜封装层 103 的开孔 105 ；掩盖部 102 ，所述掩盖部 102 用以掩盖所述基板 101 非薄膜封装区域，所述掩盖部 102 与所述基板 101 接触的一面为第一表面，所述掩盖部 102 远离所述基板 101 的一面为第二表面；其中，位于所述开孔 105 四周的所述掩盖部 102 在与所述基板 101 接触的一侧，其边缘至少一部分形成直切角。
其中，所述第一表面的面积小于所述第二表面的面积，所述第二表面覆盖所述第一表面；所述第一表面与所述第二表面相对且平行设置；在所述开孔 105 边缘的侧壁上形成第一切割位 106 ，在所述第一表面上形成第二切割位 107 ；所述第一切割位 106 到所述基板 101 的距离至少为 15~20um ，经由所述第一切割位 106 至所述第二切割位 107 在所述掩膜板上形成所述掩盖部 102 的所述直切角。由所述掩盖部 102 围成的所述开孔 105 为上小下大结构，其中，所述开孔 105 靠近所述基板 101 的一端较大，所述开孔 105 的相对另一端用以限定所述薄膜封装层 103 的大小。
优选的所述直切角为等边直角切角，所述第一切割位 106 与所述第二切割位 107 之间的距离，与所述掩膜板垂直方向所呈夹角为 45 °。所述 OLED 薄膜封装时，为了避免阴影效应，所述掩膜板需要与所述基板 101 紧密贴合，进行薄膜封装制程，薄膜封装材料通过所述开孔 105 ，在所述开孔 105 对应的所述基板 101 相应区域形成所述薄膜封装层 103 ，所述薄膜封装层 103 包括无机膜与有机膜，由于所述开孔 105 远离所述基板 101 一端的开口具有限定所述薄膜封装层 103 大小的作用，所以在所述开孔 105 靠近所述基板 101 的一端比相对另一端开口较大时，在所述基板 101 上生成的所述薄膜封装层 103 的面积小于所述开孔 105 靠近所述基板 101 一端开口的面积，所述薄膜封装层 103 与所述开孔 105 侧壁之间形成缝隙，且所述缝隙环绕所述薄膜封装层 103 四周。在所述薄膜封装制程中，所述掩盖部 102 在所述非封装区域用以遮挡所述薄膜封装材料，因此所述掩盖部 102 表面会附着有薄膜封装膜 104 ，所述开孔 105 四周相应的所述掩盖部 102 在靠近所述基板 101 一侧存在所述直切角，所述第一切割位 106 到所述基板 101 的距离至少为 15~20um ，而目前薄膜封装中，所述无机膜厚度一般在 0.5~1um 之间，所述有机膜厚度一般 <10um ，所以附着于所述掩盖部 102 表面的所述薄膜封装膜 104 ，与所述基板 101 上形成的所述薄膜封装层 103 之间存在间隙，在所述直切角处呈断开状态。
本发明对所述直切角的角度不做限定，角度可根据具体掩膜板厚度以及薄膜封装层厚度来确定，只要满足基板上的薄膜封装层与掩膜板以及附着于掩膜板上的薄膜封装膜之间断开，形成间隙即可。
如图 2 所示，本发明实施例二提供的 OLED 薄膜封装用掩膜板剖视图，本发明提供的 OLED 薄膜封装用掩膜板，包括：镂空部，所述镂空部包括用以在基板 201 上形成薄膜封装层 203 的开孔 205 ；掩盖部 202 ，所述掩盖部 202 用以掩盖所述基板 201 非薄膜封装区域，所述掩盖部 202 与所述基板 201 接触的一面为第一表面，所述掩盖部 202 远离所述基板 201 的一面为第二表面；其中，位于所述开孔 205 四周的所述掩盖部 202 在与所述基板 201 接触的一侧，其边缘至少一部分形成圆切角。
其中，所述第一表面的面积小于所述第二表面的面积，所述第二表面覆盖所述第一表面。 在所述开孔 205 边缘侧壁上形成第一切割位 206 ，在所述第一表面上形成第二切割位 207 。所述圆切角为凸圆切角，所述第一切割位 206 与所述第二切割位 207 之间的距离，与所述掩膜板垂直方向所呈夹角为 45 °。进行薄膜封装制程，薄膜封装材料通过所述开孔 205 ，在所述开孔 205 对应的所述基板 201 相应区域形成所述薄膜封装层 203 ，所述薄膜封装层 203 包括无机膜与有机膜，由于所述开孔 205 远离所述基板 201 一端的开口具有限定所述薄膜封装层 203 大小的作用，所以在所述开孔 205 靠近所述基板 201 的一端比相对另一端开口较大时，在所述基板 201 上生成的所述薄膜封装层 203 的面积，小于所述开孔 205 靠近所述基板 201 一端开口的面积，所述薄膜封装层 203 与所述开孔 205 侧壁之间形成缝隙，且所述缝隙环绕所述薄膜封装层 203 四周。在所述薄膜封装制程中，所述掩盖部 202 在所述非封装区域用以遮挡所述薄膜封装材料，因此所述掩盖部 202 表面会附着有薄膜封装膜 204 ，所述开孔 205 四周相应的所述掩盖部 202 在靠近所述基板 201 一侧存在所述圆切角，所述第一切割位 206 到所述基板 201 的距离至少为 15~20um ，而目前薄膜封装中，所述无机膜厚度一般在 0.5~1um 之间，所述有机膜厚度一般 <10um ，所以附着于所述掩盖部 202 表面的所述薄膜封装膜 204 ，与所述基板 201 上形成的所述薄膜封装层 203 之间存在间隙，在所述圆切角处呈断开状态。
本发明对所述圆切角的角度不做限定，角度可根据具体掩膜板厚度以及薄膜封装层厚度来确定，所述圆切角还可以为凹圆切角，或者其他形状，只要满足基板上的薄膜封装层与掩膜板以及附着于掩膜板上的薄膜封装膜之间断开，形成间隙即可。
本发明还提供一种 OLED 薄膜封装用掩膜板，所述掩膜板包括两个及两个以上的所述镂空部，一所述镂空部形成相应的一开孔，用以在 OLED 基板上形成多个薄膜封装单元，所述开孔四周对应的所述掩膜板在与所述基板接触的一侧，形成切角；所述切角为直切角或圆切角，或者其他形状。所述掩膜板与所述 OLED 基板接触的一面为第一表面，所述掩膜板远离所述 OLED 基板的一面为第二表面；一所述开孔边缘侧壁上形成第一切割位，一所述开孔四周对应的所述第一表面上形成第二切割位；其中，所述第一切割位到所述 OLED 基板的距离至少为 15~20um ，附着于所述掩盖部表面的薄膜封装膜与所述 OLED 基板上形成的多个所述薄膜封装单元之间存在间隙，呈断开状态，且一所述薄膜封装单元与相应的一所述开孔四周的侧壁之间，形成围绕所述薄膜封装单元的缝隙。对所述切角的角度不做限定，角度可根据具体掩膜板厚度以及薄膜封装层厚度来确定。
相比较现有技术，本发明的 OLED 薄膜封装用掩膜板，使基板上生成的薄膜与掩膜板以及掩膜板上附着的薄膜呈断开状态，避免基板与掩膜板之间生成连续薄膜，从而避免掩膜板上升时，生成的连续薄膜因撕扯破裂而产生粒子，进而保证了薄膜封装效果。
综上所述，虽然本发明已以优选实施例揭露如上，但上述优选实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。

Claims (18)

  1. 一种 OLED 薄膜封装用掩膜板，其包括：
    镂空部，所述镂空部包括用以在基板上形成薄膜封装层的开孔；
    掩盖部，所述掩盖部用以掩盖所述基板非薄膜封装区域，所述掩盖部与所述基板接触的一面为第一表面，所述掩盖部远离所述基板的一面为第二表面；
    其中，位于所述开孔四周的所述掩盖部在与所述基板接触的一侧，其边缘至少一部分形成切角，且所述第一表面的面积小于所述第二表面的面积，所述第二表面覆盖所述第一表面。
  2. 根据权利要求 1 所述的 OLED 薄膜封装用掩膜板，其中，所述切角为直切角或圆切角。
  3. 根据权利要求 2 所述的 OLED 薄膜封装用掩膜板，其中，在所述开孔边缘侧壁上形成第一切割位，在所述第一表面上形成第二切割位。
  4. 根据权利要求 3 所述的 OLED 薄膜封装用掩膜板，其中，所述切角为等边直角切角，所述第一切割位与所述第二切割位之间的距离，与所述掩膜板垂直方向所呈夹角为 45 °。
  5. 根据权利要求 3 所述的 OLED 薄膜封装用掩膜板，其中，所述第一切割位到所述基板的距离至少为 15~20um 。
  6. 根据权利要求 2 所述的 OLED 薄膜封装用掩膜板，其中，所述 OLED 薄膜封装用掩膜板用于使得所述薄膜封装层与所述开孔侧壁之间形成缝隙。
  7. 根据权利要求 6 所述的 OLED 薄膜封装用掩膜板，其中，所述缝隙环绕所述薄膜封装层四周。
  8. 根据权利要求 6 所述的 OLED 薄膜封装用掩膜板，其中，所述基板上对应所述开孔区域形成的所述薄膜封装层，与附着于所述掩盖部的薄膜封装材料之间存在间隙。
  9. 根据权利要求 1 所述的 OLED 薄膜封装用掩膜板，其中，所述掩膜板包括两个及两个以上的所述镂空部，一所述镂空部形成相应的一所述开孔。
  10. 一种 OLED 薄膜封装用掩膜板，其包括：
    镂空部，所述镂空部包括用以在基板上形成薄膜封装层的开孔；
    掩盖部，所述掩盖部用以掩盖所述基板非薄膜封装区域，所述掩盖部与所述基板接触的一面为第一表面，所述掩盖部远离所述基板的一面为第二表面；
    其中，位于所述开孔四周的所述掩盖部在与所述基板接触的一侧，其边缘至少一部分形成切角。
  11. 根据权利要求 10 所述的 OLED 薄膜封装用掩膜板，其中，所述切角为直切角或圆切角。
  12. 根据权利要求 11 所述的 OLED 薄膜封装用掩膜板，其中，在所述开孔边缘侧壁上形成第一切割位，在所述第一表面上形成第二切割位。
  13. 根据权利要求 12 所述的 OLED 薄膜封装用掩膜板，其中，所述切角为等边直角切角，所述第一切割位与所述第二切割位之间的距离，与所述掩膜板垂直方向所呈夹角为 45 °。
  14. 根据权利要求 12 所述的 OLED 薄膜封装用掩膜板，其中，所述第一切割位到所述基板的距离至少为 15~20um 。
  15. 根据权利要求 11 所述的 OLED 薄膜封装用掩膜板，其中，所述 OLED 薄膜封装用掩膜板用于使得所述薄膜封装层与所述开孔侧壁之间形成缝隙。
  16. 根据权利要求 15 所述的 OLED 薄膜封装用掩膜板，其中，所述缝隙环绕所述薄膜封装层四周。
  17. 根据权利要求 15 所述的 OLED 薄膜封装用掩膜板，其中，所述基板上对应所述开孔区域形成的所述薄膜封装层，与附着于所述掩盖部的薄膜封装材料之间存在间隙。
  18. 根据权利要求 10 所述的 OLED 薄膜封装用掩膜板，其中，所述掩膜板包括两个及两个以上的所述镂空部，一所述镂空部形成相应的一所述开孔。
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