WO2019019323A1 - 扬声器模组以及电子设备 - Google Patents

扬声器模组以及电子设备 Download PDF

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Publication number
WO2019019323A1
WO2019019323A1 PCT/CN2017/102696 CN2017102696W WO2019019323A1 WO 2019019323 A1 WO2019019323 A1 WO 2019019323A1 CN 2017102696 W CN2017102696 W CN 2017102696W WO 2019019323 A1 WO2019019323 A1 WO 2019019323A1
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Prior art keywords
cavity
resonant
resonant cavity
speaker module
module according
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PCT/CN2017/102696
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English (en)
French (fr)
Inventor
高远
李振军
陈钢
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Goertek Inc
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Goertek Inc
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers

Definitions

  • the present invention relates to the field of electroacoustic conversion technology, and more particularly to a speaker module and an electronic device.
  • a closed resonant cavity is usually provided on the module housing.
  • the resonant cavity is in communication with the front acoustic cavity.
  • the resonant cavity has a significant improvement over the speaker module FR.
  • the existing resonant cavity is a single cavity. Limited by the singularity of the natural frequency, the resonant cavity has a limited frequency width and cannot effectively absorb noise in a wider frequency band.
  • a speaker module includes a module housing and a sounding device, and a receiving cavity and a plurality of resonant cavities are disposed in the module housing, the sound generating device is disposed in the receiving cavity, and the sounding device will accommodate the sounding device
  • the cavity is divided into a front acoustic cavity and a rear acoustic cavity, and the front acoustic cavity communicates with the external space through the sound outlet; a plurality of the resonant cavity are connected in series, and one of the plurality of resonant cavities is in communication with the front acoustic cavity.
  • the plurality of resonant cavities include a first resonant cavity and a second resonant cavity, the first resonant cavity and the second resonant cavity being disposed adjacent to each other, in the first resonant cavity and the second resonant cavity
  • a first communication passage is disposed between the chambers, and the second communication passage is disposed between any one of the first resonant cavity and the second resonant cavity and the front acoustic cavity.
  • first resonant cavity and the second resonant cavity are disposed adjacent to the front acoustic cavity, and the first resonant cavity and the second resonant cavity are located at a side of the front acoustic cavity.
  • the module housing comprises an upper shell, a middle shell, a rear cover and a lower cover
  • the middle shell comprises a side wall and a receiving cavity hollowed out area surrounded by the side wall and a plurality of resonant cavities Hollow area
  • the upper cover is closed at an upper end of the receiving cavity hollowed out area and the plurality of resonant cavity hollowed out regions
  • the rear cover is closed at a lower end of the receiving cavity hollowed out area
  • the lower cover is closed to the plurality of A lower end of the cavity of the resonant cavity is formed to enclose the receiving cavity and the plurality of the resonant cavity.
  • At least one of the upper casing, the rear cover and the lower cover are coupled to the middle casing by ultrasonic welding.
  • the middle casing is integrally injection molded.
  • the resonant cavity is a separately disposed closed cavity, and the plurality of closed cavity are connected in series through the first communication channel.
  • the resonant cavity is a small cavity separated by a large cavity through a partition, and the plurality of small cavityes are connected in series through the first communication channel.
  • the front acoustic cavity is located at a side of the rear acoustic cavity.
  • an electronic device includes the speaker module provided by the present invention.
  • the resonant cavity of the speaker module is a single cavity. Limited by the singularity of the natural frequency, the resonant cavity has a limited frequency width and cannot effectively absorb noise in a wider frequency band. Therefore, the technical task to be achieved by the present invention or the technical problem to be solved is not thought of or expected by those skilled in the art, so the present invention is a new technical solution.
  • a plurality of resonant cavities are disposed in the module housing.
  • a plurality of resonant cavities are connected in series, and one of the resonant cavities is in communication with the front acoustic cavity.
  • the sound pressure incident on the speaker unit when the sound is emitted pushes the air in the first communication channel and compresses the gas in the innermost cavity, and at the same time increases the air pressure in the other cavity, thus forming a coupling Resonant system.
  • Multiple resonant cavities are connected in series to provide a wide-band murmur resonance band that absorbs noise from a wider frequency band. In this way, a plurality of resonant cavities connected in series can improve the sounding effect of the speaker module.
  • FIG. 1 is an exploded view of a speaker module in accordance with one embodiment of the present invention.
  • FIG. 2 is a schematic view showing the structure of a module case in which a lower cover and a rear cover are not provided, according to an embodiment of the present invention.
  • FIG 3 is a comparison diagram of transmission loss of a speaker module and a speaker module of a single resonant cavity, in accordance with one embodiment of the present invention.
  • first resonant cavity 12: second resonant cavity; 13: middle case; 14: upper case; 15: back cover; 17: lower cover; 18: front acoustic cavity; 19: rear acoustic cavity; 20: spacer; : first communication channel; 22: second communication channel; 23: speaker unit; 24: magnetic conductive plate.
  • 1 is an exploded view of a speaker module in accordance with one embodiment of the present invention.
  • 2 is a schematic view showing the structure of a module case in which a lower cover and a rear cover are not provided, according to an embodiment of the present invention.
  • the speaker module includes a module housing and a sounding device.
  • a receiving cavity and a plurality of resonant cavities are disposed in the module housing.
  • the sounding device is disposed within the housing cavity. Sound device
  • the accommodating chamber is partitioned into a front acoustic chamber 18 and a rear acoustic chamber 19.
  • the front acoustic cavity 18 communicates with the external space through the sound outlet.
  • a plurality of resonant cavities are connected in series. One of the plurality of resonant cavities communicates with the front acoustic cavity 18 through the second communication passage 22.
  • the sounding device may be a moving iron speaker unit or a moving coil speaker unit. These two monomers are common knowledge in the art and will not be described in detail herein.
  • the resonant cavity is a closed cavity.
  • the series connection means that a plurality of resonant cavities are sequentially connected one by one.
  • a first communication passage 21 is formed between the resonant cavities. There is one and only one resonant cavity communicating with the front acoustic cavity 18 through the second communication passage 22.
  • the resonant cavity is a self-contained closed cavity.
  • a plurality of closed cavities are connected in series through the first communication passage 21.
  • the resonant cavity is a small cavity separated by a large cavity through the partition 20, and the plurality of small cavityes are connected in series through the first communication passage 21. This way, the fabrication of the resonant cavity is simplified, and the modular housing is compact.
  • the shape of the resonant cavity may be, but not limited to, a rectangular parallelepiped, a sphere, a cone, or the like, or may be a cavity having an irregular structure designed by a person skilled in the art according to the shape of the reserved space of the device to be mounted.
  • a plurality of resonant cavities are disposed in the module housing.
  • a plurality of resonant cavities are connected in series, and one of the resonant cavities is in communication with the front acoustic cavity 18.
  • the sound pressure incident by the speaker unit 23 at the time of sounding pushes the air in the first communication passage 21 and compresses the gas in the innermost cavity, and at the same time increases the air pressure in the other resonators, thus forming a Coupled resonant system.
  • Multiple resonant cavities are connected in series to provide a wide-band murmur resonance band that absorbs noise from a wider frequency band. In this way, a plurality of resonant cavities connected in series can improve the sounding effect of the speaker module.
  • Those skilled in the art can adjust the noise resonance frequency band of the resonant cavity by setting the number, shape and volume of the resonant cavity to adjust the muffling frequency band.
  • the module housing includes an upper case 14, a middle case 13, a rear cover 15, and a lower cover 17.
  • the middle casing 13 is a hollow structure.
  • the middle casing 13 includes a side wall and a receiving cavity hollowed out area surrounded by the side wall and a plurality of resonant cavity hollowed out areas.
  • the upper casing 14 covers the upper end of the accommodating cavity hollowing area and the plurality of resonant cavity hollowing areas
  • the rear cover 15 covers the lower end of the vacant space of the accommodating cavity
  • the lower cover 17 covers the lower end of the plurality of resonant cavity hollow areas to surround Forming a receiving cavity and a plurality of resonant cavities.
  • a second communication passage 22 for connecting one of the resonant cavity and the front acoustic cavity 18 is disposed on the side wall.
  • the speaker unit separates the receiving chamber into a front sound chamber 18 and a rear sound chamber 19.
  • the second communication passage 22 is in communication with the front acoustic chamber.
  • the upper case 14, the rear cover 15, and the lower cover 17 have a flat structure.
  • the back cover 15 is made of a metal material to reduce the thickness of the module case. Moreover, the metal material has good heat dissipation performance.
  • a magnetic conductive plate 24 is embedded in the rear cover 15.
  • the speaker unit 23 is fixed to the magnetic conductive plate 24, wherein the magnetic circuit system of the speaker unit 23 is close to the magnetic conductive plate 24.
  • the manufacture of the module housing becomes easy.
  • the upper case 14, the middle case 13, and the lower cover 17 are formed by injection molding of a TPU material.
  • the back cover 15 is made of a metal plate by press molding.
  • the middle case 13 is a hollow structure. In the case of integral injection molding, the mold does not need to use a slider, thereby reducing the difficulty of injection molding of the middle casing 13.
  • the mounting of the speaker unit 23 becomes easy.
  • the speaker unit 23 is mounted directly into the housing cavity hollow area.
  • the diaphragm of the speaker unit 23 is opposed to the upper case 14.
  • the space between the diaphragm and the upper casing 14 is at least a portion of the front acoustic chamber 18.
  • the magnetic circuit system of the speaker unit 23 is bonded and fixed to the magnetic conductive plate 24.
  • At least one of the upper casing 14, the rear cover 15, and the lower cover 17 is joined to the middle casing 13 by ultrasonic welding.
  • Ultrasonic welding has the characteristics of fast welding speed and firm connection.
  • the upper case 14, the middle case 13, and the lower cover 17 are TPU materials.
  • the upper case 14 is welded to the upper end of the middle case 13 by ultrasonic welding, and the lower cover 17 is welded to the lower end of the middle case 13.
  • the rear acoustic cavity 19 is located on the side of the front acoustic cavity 18. This can reduce the height of the module housing. It will be understood by those skilled in the art that the side portion refers to the side along the extended face of the front acoustic cavity.
  • a plurality of resonant cavities are arranged side by side.
  • One of the two resonant cavities at the ends is in communication with the front acoustic chamber 18.
  • the plurality of resonant cavities have a long strip structure as a whole. In this way, the overall width of the plurality of resonant cavities is reduced and The height makes the speaker module more compact.
  • a resonant cavity at the end is in communication with the front acoustic cavity 18, and the resonant cavity in the middle is in communication with the front acoustic cavity 18.
  • the plurality of resonant cavities of the speaker module include a first resonant cavity 11 and a second resonant cavity 12.
  • the first resonant cavity 11 and the second resonant cavity 12 are disposed adjacent to each other.
  • the first resonant cavity 11 or the second resonant cavity 12 is in communication with the front acoustic cavity 18.
  • a first communication passage 21 is provided between the first resonant cavity 11 and the second resonant cavity 12.
  • the adjacent arrangement means that the first resonant cavity 11 and the second resonant cavity 12 are juxtaposed and adjacent to each other.
  • the second resonant cavity 12 is in communication with the front acoustic cavity 18 through the second communication passage 22.
  • the sound pressure incident on the speaker unit 23 pushes the air in the first communication passage 21 and compresses the gas in the first resonant cavity 11, and at the same time increases the air pressure in the second resonant cavity 12. This forms a coupled resonant system.
  • FIG 3 is a comparison diagram of transmission loss of a speaker module and a speaker module of a single resonant cavity, in accordance with one embodiment of the present invention.
  • the transmission loss can reflect the frequency range in which the speaker module can eliminate noise.
  • a single resonant cavity can only form one resonant peak.
  • the two resonant cavities 11, 12 form a resonance peak at two frequencies, thereby being able to absorb noise of a wider frequency band.
  • the number of resonant peaks corresponds to the number of resonant cavities, and the number of resonant cavities can be set according to the bandwidth of the noise to absorb noise in a wider frequency band.
  • the first resonant cavity 11 and the second resonant cavity 12 are adjacent to the front acoustic cavity 18 and are located on the side of the front acoustic cavity 18.
  • the module housing is more compact and the module housing as a whole has a flat structure. In this way, the volume of the speaker module is reduced, and the development trend of thinning and miniaturization of the electronic device is followed.
  • an electronic device can be, but is not limited to, a mobile phone, a tablet computer, a smart watch, a game machine, a notebook computer, a walkie-talkie, a headset, and the like.
  • the electronic device includes the speaker module provided by the present invention.
  • the electronic device has the characteristics of small noise and good sound effect.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

本发明公开了一种扬声器模组以及电子设备。该模组包括模组壳体和发声装置，在模组壳体内设置有容纳腔和多个共振腔，发声装置被设置在容纳腔内，发声装置将容纳腔分隔为前声腔和后声腔，前声腔通过出音口与外部空间连通；多个共振腔串联连通，多个共振腔中的一个与前声腔连通。多个共振腔串联在一起，能够提供一个宽频的杂音共振频段，这样能够吸收更宽频段的杂音。通过这种方式，串联连通的多个共振腔能够提高扬声器模组的发声效果。

Description

扬声器模组以及电子设备 技术领域
本发明涉及电声转换技术领域，更具体地，涉及一种扬声器模组以及电子设备。
背景技术
在现有的扬声器模组中，为了降低杂音，通常在模组壳体上设置密闭的共振腔。共振腔与前声腔连通。共振腔对扬声器模组FR有很明显的改善。
然而，现有的共振腔为单一的腔体。受限于固有频率的单一性，该共振腔调节频率宽度有限，不能有效的吸收更宽频段的杂音。
发明内容
本发明的一个目的是提供一种扬声器模组的新技术方案。
根据本发明的第一方面，提供了一种扬声器模组。该模组包括模组壳体和发声装置，在所述模组壳体内设置有容纳腔和多个共振腔，所述发声装置被设置在所述容纳腔内，所述发声装置将所述容纳腔分隔为前声腔和后声腔，所述前声腔通过出音口与外部空间连通；多个所述共振腔串联连通，多个所述共振腔中的一个与所述前声腔连通。
可选地，多个所述共振腔包括第一共振腔和第二共振腔，所述第一共振腔和所述第二共振腔比邻设置，在所述第一共振腔和所述第二共振腔之间设置有第一连通通道，在所述第一共振腔和所述第二共振腔中的任意一个与所述前声腔之间设置有所述第二连通通道。
可选地，所述第一共振腔和所述第二共振腔与所述前声腔比邻设置，并且所述第一共振腔和所述第二共振腔位于所述前声腔的侧部。
可选地，所述模组壳体包括上壳、中壳、后盖和下盖，所述中壳包括侧壁和由所述侧壁围合而成的容纳腔镂空区以及多个共振腔镂空区；所述 上壳盖合在所述容纳腔镂空区以及所述多个共振腔镂空区的上端，所述后盖盖合在所述容纳腔镂空区的下端，所述下盖盖合在所述多个共振腔镂空区的下端，以围合形成所述容纳腔以及多个所述共振腔。
可选地，所述上壳、所述后盖和所述下盖中的至少一个与所述中壳之间采用超声焊接连接在一起。
可选地，所述中壳是一体注塑成型的。
可选地，所述共振腔为独立设置的密闭腔体，多个所述密闭腔体通过所述第一连通通道串联连通。可选地，所述共振腔为由一个大腔体通过隔板隔离出的小腔体，多个所述小腔体通过所述第一连通通道串联连通。
可选地，所述前声腔位于所述后声腔的侧部。
根据本发明的另一个方面，提供了一种电子设备。该电子设备包括本发明提供的所述的扬声器模组。
本发明的发明人发现，在现有技术中，扬声器模组的共振腔为单一的腔体。受限于固有频率的单一性，该共振腔调节频率宽度有限，不能有效的吸收更宽频段的杂音。因此，本发明所要实现的技术任务或者所要解决的技术问题是本领域技术人员从未想到的或者没有预期到的，故本发明是一种新的技术方案。
在本发明实施例中，在模组壳体内设置有多个共振腔。多个共振腔串联连通，并且其中一个共振腔与前声腔连通。扬声器单体在发声时入射的声压推动第一连通通道内的空气运动，并压缩最内侧共振腔内的气体，与此同时，还增大了其他共振腔内的气压，这样组成一个耦合的谐振系统。多个共振腔串联在一起，能够提供一个宽频的杂音共振频段，这样能够吸收更宽频段的杂音。通过这种方式，串联连通的多个共振腔能够提高扬声器模组的发声效果。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实 施例，并且连同其说明一起用于解释本发明的原理。
图1是根据本发明的一个实施例的扬声器模组的分解图。
图2是根据本发明的一个实施例的未设置下盖和后盖的模组壳体的结构示意图。
图3是根据本发明的一个实施例的扬声器模组与单一共振腔的扬声器模组的传递损失的对比图。
附图标记说明：
11：第一共振腔；12：第二共振腔；13：中壳；14：上壳；15：后盖；17：下盖；18：前声腔；19：后声腔；20：隔板；21：第一连通通道；22：第二连通通道；23：扬声器单体；24：导磁板。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
图1是根据本发明的一个实施例的扬声器模组的分解图。图2是根据本发明的一个实施例的未设置下盖和后盖的模组壳体的结构示意图。
如图1-2所示，该扬声器模组包括模组壳体和发声装置。在模组壳体内设置有容纳腔和多个共振腔。发声装置被设置在容纳腔内。发声装置将 容纳腔分隔为前声腔18和后声腔19。前声腔18通过出音口与外部空间连通。
多个共振腔串联连通。多个共振腔中的一个通过第二连通通道22与前声腔18连通。
发声装置可以是动铁式扬声器单体或者动圈式扬声器单体。这两种单体为本领域的公知常识，在此不做详细说明。
共振腔为密闭的腔体。串联连通是指多个共振腔逐个顺次连通。在共振腔之间形成第一连通通道21。有且仅有一个共振腔通过第二连通通道22与前声腔18连通。
共振腔是独立设置的密闭腔体。多个密闭腔体通过第一连通通道21串联连通。
也可以是，共振腔为由一个大腔体通过隔板20隔离出的小腔体，多个小腔体通过第一连通通道21串联连通。这种方式使共振腔的制作变得简单，并且模组壳体的结构紧凑。
共振腔形状可以是但不局限于长方体、球体、锥体等，也可以是本领域技术人员根据待安装设备预留空间的形状设计出的具有不规则结构的腔体。
在本发明实施例中，在模组壳体内设置有多个共振腔。多个共振腔串联连通，并且其中一个共振腔与前声腔18连通。扬声器单体23在发声时入射的声压推动第一连通通道21内的空气运动，并压缩最内侧共振腔内的气体，与此同时，还增大了其他共振腔内的气压，这样组成一个耦合的谐振系统。多个共振腔串联在一起，能够提供一个宽频的杂音共振频段，这样能够吸收更宽频段的杂音。通过这种方式，串联连通的多个共振腔能够提高扬声器模组的发声效果。
本领域技术人员可以通过设置共振腔的数量、形状以及容积来调节共振腔的杂音共振频段，以调节消声频带。
在一个例子中，如图1-2所示，模组壳体包括上壳14、中壳13、后盖15和下盖17。中壳13为镂空结构。中壳13包括侧壁和由侧壁围合而成的容纳腔镂空区以及多个共振腔镂空区。
上壳14盖合在容纳腔镂空区以及多个共振腔镂空区的上端，后盖15盖合在容纳腔镂空区的下端，下盖17盖合在多个共振腔镂空区的下端，以围合形成容纳腔以及多个共振腔。
在侧壁上设置有用于连通一个共振腔与前声腔18的第二连通通道22。
需要说明的是，上、下方向平行于扬声器单体23的振膜的振动方向。扬声器单体将容纳腔分隔为前声腔18和后声腔19。第二连通通道22与前声腔连通。
例如，上壳14、后盖15和下盖17均呈扁平结构。后盖15由金属材料制作而成，以减少模组壳体的厚度。并且，金属材料的散热性能良好。在后盖15上嵌设有导磁板24。扬声器单体23被固定在导磁板24上，其中，扬声器单体23的磁路系统靠近导磁板24。
通过这种方式，模组壳体的制作变得容易。例如，上壳14、中壳13、下盖17由TPU材料采用注塑成型的方式进行制作。后盖15由金属板材通过冲压成型的方式进行制作。
此外，中壳13为镂空的结构。在一体注塑成型时，模具不需要采用滑块，从而降低了中壳13的注塑难度。
此外，扬声器单体23的安装变得容易。例如，扬声器单体23被直接安装到容纳腔镂空区中。扬声器单体23的振膜与上壳14相对。振膜与上壳14之间的空间为前声腔18的至少一部分。扬声器单体23的磁路系统被粘结固定在导磁板24上。
可选地，上壳14、后盖15和下盖17中的至少一个与中壳13之间采用超声焊接连接在一起。超声焊接具有焊接速度快，连接牢固的特点。例如，上壳14、中壳13和下盖17为TPU材料。采用超声焊接将上壳14焊接到中壳13的上端，下盖17焊接到中壳13的下端。
可选地，后声腔19位于前声腔18的侧部。这样能够降低模组壳体的高度。本领域技术人员应当理解的是，侧部是指沿前声腔的延伸面的侧部。
优选地，多个共振腔并列设置。位于端部的两个共振腔中的一个与前声腔18连通。
多个共振腔整体呈长条结构。这样，减小了多个共振腔整体的宽度和 高度，使得扬声器模组更加紧凑。
此外，位于端部的一个共振腔与前声腔18连通，相对于中部的共振腔与前声腔18连通，这种方式使得谐振系统的耦合作用能更充分的发挥，进一步拓宽了杂音共振频段。
在一个例子中，扬声器模组的多个共振腔包括第一共振腔11和第二共振腔12。第一共振腔11和第二共振腔12比邻设置。第一共振腔11或第二共振腔12与前声腔18连通。在第一共振腔11和第二共振腔12之间设置有第一连通通道21。
例如，如图2所示，比邻设置是指第一共振腔11与第二共振腔12并列且相邻设置。第二共振腔12通过第二连通通道22与前声腔18连通。在工作时，扬声器单体23入射的声压推动第一连通通道21内的空气运动，并压缩第一共振腔11内的气体，与此同时，还增大了第二共振腔12内的气压，这样组成一个耦合的谐振系统。
图3是根据本发明的一个实施例的扬声器模组与单一共振腔的扬声器模组的传递损失的对比图。
传递损失能够反应扬声器模组能消除杂音的频率范围。
如图3中的虚线所示，单一的共振腔仅能形成一个谐振峰。如图3中的实线所示，两个共振腔11,12在两个频率形成谐振峰，从而能够吸收更宽频段的杂音。
谐振峰的数量与共振腔的数量相对应，可以根据杂音的频宽范围设置共振腔的数量，以吸收更宽频段的杂音。
在一个例子中，如图2所示，第一共振腔11和第二共振腔12与前声腔18相邻，并且位于前声腔18的侧部。通过这种方式，模组壳体更加紧凑，并且模组壳体整体呈扁平结构。这样，减小了扬声器模组的体积，顺应了电子设备轻薄化、小型化的发展趋势。
根据本发明的另一个实施例，提供了一种电子设备。电子设备可以是但不局限于手机、平板电脑、智能手表、游戏机、笔记本电脑、对讲机、耳机等。该电子设备包括本发明提供的扬声器模组。
该电子设备具有杂音小，声音效果好的特点。
虽然已经通过例子对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (10)

  1. 一种扬声器模组，其特征在于，包括模组壳体和发声装置，在所述模组壳体内设置有容纳腔和多个共振腔，所述发声装置被设置在所述容纳腔内，所述发声装置将所述容纳腔分隔为前声腔和后声腔，所述前声腔通过出音口与外部空间连通；
    多个所述共振腔串联连通，多个所述共振腔中的一个与所述前声腔连通。
  2. 根据权利要求1所述的扬声器模组，其特征在于，多个所述共振腔包括第一共振腔和第二共振腔，所述第一共振腔和所述第二共振腔比邻设置，在所述第一共振腔和所述第二共振腔之间设置有第一连通通道，在所述第一共振腔和所述第二共振腔中的任意一个与所述前声腔之间设置有第二连通通道。
  3. 根据权利要求1或2所述的扬声器模组，其特征在于，所述第一共振腔和所述第二共振腔与所述前声腔比邻设置，并且所述第一共振腔和所述第二共振腔位于所述前声腔的侧部。
  4. 根据权利要求1-3中的任意一项所述的扬声器模组，其特征在于，所述模组壳体包括上壳、中壳、后盖和下盖，所述中壳包括侧壁和由所述侧壁围合而成的容纳腔镂空区以及多个共振腔镂空区；
    所述上壳盖合在所述容纳腔镂空区以及所述多个共振腔镂空区的上端，所述后盖盖合在所述容纳腔镂空区的下端，所述下盖盖合在所述多个共振腔镂空区的下端，以围合形成所述容纳腔以及多个所述共振腔。
  5. 根据权利要求1-4中的任意一项所述的扬声器模组，其特征在于，所述上壳、所述后盖和所述下盖中的至少一个与所述中壳之间采用超声焊接连接在一起。
  6. 根据权利要求1-5中的任意一项所述的扬声器模组，其特征在于，所述中壳是一体注塑成型的。
  7. 根据权利要求1-6中的任意一项所述的扬声器模组，其特征在于，所述共振腔为独立设置的密闭腔体，多个所述密闭腔体通过所述第一连通通道串联连通。
  8. 根据权利要求1-7中的任意一项所述的扬声器模组，其特征在于，所述共振腔为由一个大腔体通过隔板隔离出的小腔体，多个所述小腔体通过所述第一连通通道串联连通。
  9. 根据权利要求1-8中的任意一项所述的扬声器模组，其特征在于，所述前声腔位于所述后声腔的侧部。
  10. 一种电子设备，其特征在于，包括如权利要求1-9中的任意一项所述的扬声器模组。
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