WO2019014994A1 - 硬化膜及其制备方法、柔性amoled显示装置 - Google Patents

硬化膜及其制备方法、柔性amoled显示装置 Download PDF

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WO2019014994A1
WO2019014994A1 PCT/CN2017/097190 CN2017097190W WO2019014994A1 WO 2019014994 A1 WO2019014994 A1 WO 2019014994A1 CN 2017097190 W CN2017097190 W CN 2017097190W WO 2019014994 A1 WO2019014994 A1 WO 2019014994A1
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layer
micro
cured film
film layer
display device
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French (fr)
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吴嘉树
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B23/00—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose
    • B32B23/04—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose comprising such cellulosic plastic substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B23/00—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose
    • B32B23/20—Layered products comprising a layer of cellulosic plastic substances, i.e. substances obtained by chemical modification of cellulose, e.g. cellulose ethers, cellulose esters, viscose comprising esters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/558—Impact strength, toughness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/726—Permeability to liquids, absorption
    • B32B2307/7265—Non-permeable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/206—Organic displays, e.g. OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a cured film and a method for fabricating the same, and to a flexible AMOLED display device including the cured film.
  • Organic Light Emitting Diode has self-luminous characteristics, using a very thin organic material coating and a glass substrate. When a current passes, the organic material emits light, and the organic light emitting diode displays a large viewing angle of the screen. And can significantly save power, so the application of organic light-emitting diodes is now more and more extensive.
  • the driving method of the OLED is divided into a passive driving and an active driving, a Passive Matrix Organic Light Emitting Diode (PMOLED), and an Active Drive Organic Light Emitting Diode (AMOLED).
  • AMOLED Due to the large size of the PMOLED, in order to maintain the brightness of the entire panel, it is necessary to increase the brightness of each pixel to increase the operating current, thereby reducing the service life. Therefore, the current application, AMOLED is more and more popular. Compared with traditional liquid crystal panels, AMOLED has the characteristics of fast response, high contrast and wide viewing angle. In addition, AMOLED also has the characteristics of self-illumination, no need to use the backlight board, so it is lighter and thinner than the traditional liquid crystal panel, and the cost of the backlight module can be saved. The advantages of many aspects make it have a good application prospect.
  • the AMOLED display device generally includes a thin film transistor (TFT) array substrate, an organic light emitting structure layer disposed on the array substrate, and a protective cover plate disposed on the organic light emitting structure layer.
  • TFT thin film transistor
  • the organic light emitting structure layer comprises an anode, an organic light emitting layer and a cathode which are sequentially disposed on the array substrate
  • the protective cover plate generally uses tempered glass.
  • Flexible display is a major feature of AMOLED display devices, and the flexible and flexible display device can provide a disruptive user experience.
  • the substrate substrate in the TFT array substrate uses a flexible substrate
  • the protective cover plate uses a hardened film instead of the tempered glass to meet the bendable performance requirements of the product.
  • a hardened layer having a hardness characteristic is prepared to be formed.
  • the hardened film of such a structure can satisfy the bendable performance requirements of the product, but the impact resistance is poor, resulting in a decrease in the overall surface hardness of the flexible AMOLED display device and a reduction in product quality.
  • the present invention provides a cured film which is applied to a flexible AMOLED display device, which enhances the impact resistance of the product and improves the flexible display device while satisfying the bendable performance requirements of the product.
  • the overall surface hardness improves the quality of the product.
  • a cured film comprising a substrate film layer and a cured film layer on the substrate film layer, wherein a micro-stereo structure layer is disposed between the substrate film layer and the hardened film layer, the micro-stereo structure
  • the layer includes a plurality of microscopic structures.
  • the micro-stereo structure is a hollow or solid three-dimensional structure whose cross section is a polygon, a circle, an ellipse or an irregular figure.
  • the micro-stereo structure layer has a thickness of 1 to 5 ⁇ m.
  • the material of the micro-stereo structure layer is an optical resin.
  • the base film layer has a thickness of 10 to 250 ⁇ m, and the cured film layer has a thickness of 10 to 100 ⁇ m.
  • the present invention also provides a method for preparing a cured film as described above, comprising: providing a substrate film layer; applying a printing process or a photolithography process to form a microscopic structure layer on the substrate film layer, the micro
  • the three-dimensional structure layer includes a plurality of micro-stereoscopic structures; and a hardened film layer is formed on the micro-stereo structure layer.
  • Another aspect of the present invention provides a flexible AMOLED display device including a flexible TFT array substrate and an organic electroluminescent structural layer disposed on the flexible TFT array substrate, wherein the organic electroluminescent structural layer further A cured film as described above is provided.
  • the cured film provided by the embodiment of the present invention has a micro-stereo structure layer disposed between the substrate film layer and the cured film layer, and the micro-stereo structure layer is provided with a plurality of micro-stereoscopic structures, thereby
  • the micro-stereoscopic structure layer forms a pore between the base film layer and the hardened film layer, so that the cured film can maintain good bending performance, and the cured film is applied to the flexible AMOLED display device, and can fully satisfy the bendability of the product.
  • Claim when subjected to external pressure, the micro-stereo structure can distribute the pressure of the pressing layer under pressure to the various directions, which enhances the impact resistance of the product and improves the flexibility.
  • the overall surface hardness of the device improves the quality of the product.
  • FIG. 1 is a schematic structural diagram of a flexible AMOLED display device according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a cured film provided by an embodiment of the present invention.
  • 3a-3h are schematic structural views of a microscopic structure on a substrate film layer in an embodiment of the present invention.
  • the AMOLED display device includes an array substrate 1 and an organic electroluminescent structure layer 2 disposed on the array substrate 1.
  • the array substrate 1 is a thin film transistor (TFT) array substrate including a flexible substrate substrate and a thin film transistor formed on the flexible substrate.
  • the organic electroluminescent structure layer 2 includes a plurality of organic electroluminescent pixel structures including an anode 21, an organic light-emitting layer 22, and a cathode 23 which are sequentially disposed on the array substrate 1.
  • the organic electroluminescent structure layer 2 is provided with a cured film 3 for protecting the organic electroluminescent structure layer 2 and other components on the array substrate 1, the cured film 3 having a bendable The characteristics to meet the flexible performance requirements of flexible AMOLED display devices. Further, as shown in FIG. 1 , a package film layer 4 is disposed under the cured film 3 , and the package film layer 3 is used to encapsulate the organic electroluminescent structure layer 2 on the array substrate 1 . It plays the role of waterproof and dustproof.
  • This embodiment provides a cured film 3 which improves the overall surface hardness of the flexible display device while satisfying the bendable performance requirements of the product.
  • the cured film includes a base film layer 31 and a cured film layer 32 on the base film layer 31, and the base film layer 31 and the hardened film layer 32 are also provided with micro Three-dimensional structure layer 33, A plurality of micro-stereo structures 331 are included in the micro-stereoscopic structure layer 33.
  • the material of the base film layer 31 and the hardened film layer 32 may be a material applied to form a cured film which has been disclosed in the prior art, for example, the material of the base film layer is generally selected as a pair of materials.
  • Polymethyl methacrylate (PMMA) can also be used for ethylene phthalate (PET), cellulose triacetate (TAC) or polyimide (PI).
  • PET ethylene phthalate
  • TAC cellulose triacetate
  • PI polyimide
  • the material of the cured film layer is usually selected as a composition having photohardening characteristics.
  • micro-stereo structure layer 33 between the base film layer 31 and the cured film layer 32, a plurality of micro-stereoscopic structures 331 are disposed in the micro-stereo structure layer 33, and when subjected to external pressure, micro
  • the three-dimensional structure 331 can disperse and transmit the pressure pressed by the hardened film layer 32 in various directions, thereby enhancing the impact resistance of the product, thereby achieving the purpose of improving the overall surface hardness of the flexible display device, and improving the quality of the product.
  • the material of the micro-stereo structure layer 33 is an optical resin, and specifically, it may be selected as a UV resin.
  • 3a-3h are schematic structural views showing some embodiments of the micro-stereostructure layer 33 on the substrate film layer 31.
  • the micro-stereo structure 331 in the micro-stereo structure layer 33 may be a hollow three-dimensional structure having a quadrangular cross section as shown in FIG. 3a, or a solid three-dimensional structure having a quadrangular cross section as shown in FIG. 3b.
  • a hollow three-dimensional structure having a circular cross section or a solid three-dimensional structure having a circular cross section as shown in FIG. 3f; or a hollow three-dimensional structure having an elliptical cross section as shown in FIG. 3g; It is a solid three-dimensional structure having an elliptical cross section as shown in Fig. 3h.
  • the cross section when the cross section is a polygon, it may also be a triangle or other polygon; or the cross section of the microscopic structure 331 may also be a hollow or solid solid structure of some irregular patterns.
  • the thickness of the base film layer is preferably in the range of 10 to 250 ⁇ m; the thickness of the micro-stereo structure layer is preferably in the range of 1 to 5 ⁇ m; and the thickness of the cured film layer is preferably in the range of 10 to 100 ⁇ m.
  • Also provided in the embodiment is a method for preparing a cured film as described above, the method comprising the steps of:
  • the material of the substrate film layer is generally selected from polyethylene terephthalate (PET), cellulose triacetate (TAC) or polyimide (PI). Polymethyl methacrylate (PMMA) was used.
  • the micro-stereo structure layer forming the pattern drawing may be prepared by using a printing process or a photolithography process, and the micro-stereo structure layer includes a plurality of micro-stereo structures.
  • the printing process can be, for example, a screen printing process or an imprint process.
  • the hardened film layer can be obtained by a coating process or a chemical vapor deposition process.
  • the cured film provided by the embodiment of the present invention has a micro-stereoscopic structure layer disposed between the substrate film layer and the cured film layer, and the micro-stereo structure layer is provided with a plurality of micro-stereoscopic structures, thereby micro-stereoscopic
  • the structural layer forms a pore between the base film layer and the hardened film layer, so that the cured film can maintain good bending performance, and the cured film is applied to the flexible AMOLED display device, and can fully satisfy the bendability performance requirement of the product.
  • the micro-stereo structure can disperse the pressure of the pressing layer under pressure, and enhance the impact resistance of the product, improve the overall surface hardness of the flexible display device, and improve the quality of the product. .

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种硬化膜（3），包括基材膜层（31）以及位于基材膜层（31）上的硬化膜层（32），其中，所述基材膜层（31）和所述硬化膜层（32）之间设置有微立体结构层（33），所述微立体结构层（33）中包括多个微立体结构（331）。硬化膜（3）的制备方法包括步骤：提供基材膜层（31）；应用印刷工艺或光刻工艺，在所述基材膜层（31）上制备形成微立体结构层（33）；在所述微立体结构层（33）上制备形成硬化膜层（32）。一种包含硬化膜的柔性AMOLED显示装置。

Description

硬化膜及其制备方法、柔性AMOLED显示装置 技术领域
本发明涉及显示器技术领域，尤其涉及一种硬化膜及其制备方法，还涉及包含该硬化膜的柔性AMOLED显示装置。
背景技术
有机发光二极管(Organic Light Emitting Diode，OLED)具有自发光的特性，采用非常薄的有机材料涂层和玻璃基板，当电流通过时，有机材料就会发光，而且有机发光二极管显示屏幕可视角度大，并且能够显著节省电能，因此现在有机发光二极管的应用越来越广泛。OLED的驱动方式分为被动式驱动和主动式驱动，被动式驱动即无源驱动(Passive Matrix Organic Light Emitting Diode，PMOLED)，主动式驱动即有源驱动(Active Matrix Organic Light Emitting Diode，AMOLED)。因PMOLED的大尺寸化难度大，为维持整个面板的亮度，需提高每一像素的亮度而提高操作电流，因此减少使用寿命，所以目前的应用来看，AMOLED越来越受到人们的欢迎。AMOLED相比传统的液晶面板，具有反应速度快、对比度高、视角广等特点。另外AMOLED还具有自发光的特色，不需使用背光板，因此比传统的液晶面板更轻薄，还可以省去背光模块的成本。多方面的优势使其具有良好的应用前景。
AMOLED显示装置通常包括：薄膜晶体管(TFT)阵列基板、设于阵列基板上的有机发光结构层，设于有机发光结构层上的保护盖板。其中，所述有机发光结构层包括依次设置在阵列基板上的阳极、有机发光层和阴极，所述保护盖板通常使用钢化玻璃。
柔性显示是AMOLED显示装置的一大特色，可变型可弯曲的柔性显示装置能够给用户带来颠覆性的使用体验。柔性AMOLED显示装置中，TFT阵列基板中衬底基板采用柔性基板，而保护盖板则使用硬化膜代替钢化玻璃，以满足产品可弯曲的性能要求。
现有的应用于柔性AMOLED显示装置中的硬化膜，主要是在柔性基材上涂 覆一层具有硬度特性的硬化层制备形成。这种结构的硬化膜可以满足产品可弯曲的性能要求，但是抗冲击能力较差，导致柔性AMOLED显示装置整体表面硬度降低，降低产品的品质。
发明内容
鉴于现有技术存在的不足，本发明提供了一种硬化膜，其应用于柔性AMOLED显示装置中，在满足产品可弯曲的性能要求的同时，增强了产品的抗冲击能力，提高了柔性显示装置的整体表面硬度，提升了产品的品质。
为了达到上述的目的，本发明采用了如下的技术方案：
一种硬化膜，包括基材膜层以及位于基材膜层上的硬化膜层，其中，所述基材膜层和所述硬化膜层之间设置有微立体结构层，所述微立体结构层中包括多个微立体结构。
其中，所述微立体结构是截面为多边形、圆形、椭圆形或不规则图形的空心或实心的立体结构。
其中，所述微立体结构层的厚度为1～5μm。
其中，所述微立体结构层的材料为光学树脂。
其中，所述基材膜层的厚度为10～250μm，硬化膜层的厚度为10～100μm。
本发明还提供了如上所述的硬化膜的制备方法，其包括：提供基材膜层；应用印刷工艺或光刻工艺，在所述基材膜层上制备形成微立体结构层，所述微立体结构层中包括多个微立体结构；在所述微立体结构层上制备形成硬化膜层。
本发明的另一方面是提供一种柔性AMOLED显示装置，其包括柔性TFT阵列基板以及设置在所述柔性TFT阵列基板上的有机电致发光结构层，其中，所述有机电致发光结构层还设置有如上所述的硬化膜。
相比于现有技术，本发明实施例提供的硬化膜，通过在基材膜层和硬化膜层之间设置有微立体结构层，微立体结构层中设置有多个微立体结构，由此微立体结构层在基材膜层和硬化膜层之间形成孔隙状，使得该硬化膜能够保持良好的弯折性能，该硬化膜应用于柔性AMOLED显示装置中，完全可以满足产品可弯曲的性能要求。另外，在受到外部的压力时，微立体结构可以将硬化膜层下压的压力朝向各个方向分散传递，增强了产品的抗冲击能力，提高了柔性显 示装置的整体表面硬度，提升了产品的品质。
附图说明
图1是本发明实施例提供的柔性AMOLED显示装置的结构示意图；
图2是本发明实施例提供的硬化膜的结构示意图；
图3a-3h是本发明实施例中的位于基材膜层上的微立体结构的结构示意图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面结合附图对本发明的具体实施方式进行详细说明。这些优选实施方式的示例在附图中进行了例示。附图中所示和根据附图描述的本发明的实施方式仅仅是示例性的，并且本发明并不限于这些实施方式。
在此，还需要说明的是，为了避免因不必要的细节而模糊了本发明，在附图中仅仅示出了与根据本发明的方案密切相关的结构和/或处理步骤，而省略了与本发明关系不大的其他细节。
本实施例首先提供了一种柔性AMOLED显示装置，如图1所示，所述AMOLED显示装置包括阵列基板1和设置在所述阵列基板1上的有机电致发光结构层2。所述阵列基板1为薄膜晶体管(TFT)阵列基板，包括柔性衬底基板以及形成在柔性衬底基板的薄膜晶体管。所述有机电致发光结构层2中包含多个有机电致发光像素结构，其包括依次设置在所述阵列基板1上的阳极21、有机发光层22和阴极23。所述有机电致发光结构层2上设置有硬化膜3，所述硬化膜3用于保护有机电致发光结构层2以及位于阵列基板1上的其它组件，所述硬化膜3具有可弯折的特性，以满足柔性AMOLED显示装置可弯曲的性能要求。进一步地，如图1所示，位于所述硬化膜3下方还设置有封装薄膜层4，所述封装薄膜层3用于将所述有机电致发光结构层2封装在所述阵列基板1上，起到防水防尘的作用。
本实施例提供了一种硬化膜3，所述硬化膜3在满足产品可弯曲的性能要求的同时，还提高了柔性显示装置的整体表面硬度。
如图2所示，所述硬化膜包括基材膜层31以及位于基材膜层31上的硬化膜层32，所述基材膜层31和所述硬化膜层32之间还设置有微立体结构层33， 所述微立体结构层33中包括多个微立体结构331。其中，所述基材膜层31和所述硬化膜层32的材料可以使用现有技术中已经公开的应用于形成硬化膜的材料，例如，所述基材膜层的材料通常选择为聚对苯二甲酸乙二醇酯(PET)、三醋酸纤维素(TAC)或聚酰亚胺(PI)，也可以使用聚甲基丙烯酸甲酯(PMMA)。所述硬化膜层的材料通常选择为具有光硬化特性的组合物。
本实施例中，通过在基材膜层31和硬化膜层32之间设置有微立体结构层33，微立体结构层33中设置有多个微立体结构331，在受到外部的压力时，微立体结构331可以将硬化膜层32下压的压力朝向各个方向分散传递，增强了产品的抗冲击能力，由此达到提高柔性显示装置的整体表面硬度的目的，提升了产品的品质。
其中，所述微立体结构层33的材料为光学树脂，具体可以选择为UV树脂。其中，图3a-3h是示出了位于基材膜层31上的微立体结构层33的一些具体实施方式的结构示意图。具体地，所述微立体结构层33中的微立体结构331可以是如图3a所示的截面为四边形的空心的立体结构，也可以是如图3b所示的截面为四边形的实心的立体结构；也可以是如图3c所示的截面为五边形的空心的立体结构；也可以是如图3d所示的截面为五边形的实心的立体结构；也可以是如图3e所示的截面为圆形的空心的立体结构；也可以是如图3f所示的截面为圆形的实心的立体结构；也可以是如图3g所示的截面为椭圆形的空心的立体结构；也可以是如图3h所示的截面为椭圆形的实心的立体结构。当然，在另外的一些实施例中，截面为多边形时，还可以是三角形或者其他多边形；或者，所述微立体结构331的截面还可以是一些不规则图形的空心或实心的立体结构。
其中，所述基材膜层的厚度优选的范围是10～250μm；所述微立体结构层的厚度优选的范围是1～5μm；所述硬化膜层的厚度优选的范围是10～100μm。
本实施例中还提供了如上所述的硬化膜的制备方法，该方法包括步骤：
S1、提供基材膜层。具体地，如前所述，所述基材膜层的材料通常选择为聚对苯二甲酸乙二醇酯(PET)、三醋酸纤维素(TAC)或聚酰亚胺(PI)，也可以使用聚甲基丙烯酸甲酯(PMMA)。
S2、在所述基材膜层上制备形成微立体结构层。具体地，可以应用印刷工艺或光刻工艺制备形成图案画的微立体结构层，所述微立体结构层中包括多个微立体结构。其中，印刷工艺例如可以是丝网印刷工艺或者是压印工艺。
S3、在所述微立体结构层上制备形成硬化膜层。具体地，可以通过涂覆工艺或者是化学气相沉积工艺制备获得硬化膜层。
综上所述，本发明实施例提供的硬化膜，通过在基材膜层和硬化膜层之间设置有微立体结构层，微立体结构层中设置有多个微立体结构，由此微立体结构层在基材膜层和硬化膜层之间形成孔隙状，使得该硬化膜能够保持良好的弯折性能，该硬化膜应用于柔性AMOLED显示装置中，完全可以满足产品可弯曲的性能要求。另外，在受到外部的压力时，微立体结构可以将硬化膜层下压的压力朝向各个方向分散传递，增强了产品的抗冲击能力，提高了柔性显示装置的整体表面硬度，提升了产品的品质。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
以上所述仅是本申请的具体实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (18)

  1. 一种硬化膜，包括基材膜层以及位于基材膜层上的硬化膜层，其中，所述基材膜层和所述硬化膜层之间设置有微立体结构层，所述微立体结构层中包括多个微立体结构。
  2. 根据权利要求1所述的硬化膜，其中，所述微立体结构是截面为多边形、圆形、椭圆形或不规则图形的空心的立体结构。
  3. 根据权利要求1所述的硬化膜，其中，所述微立体结构是截面为多边形、圆形、椭圆形或不规则图形的实心的立体结构。
  4. 根据权利要求1所述的硬化膜，其中，所述微立体结构层的厚度为1～5μm。
  5. 根据权利要求1所述的硬化膜，其中，所述微立体结构层的材料为光学树脂。
  6. 根据权利要求1所述的硬化膜，其中，所述基材膜层的厚度为10～250μm，所述硬化膜层的厚度为10～100μm。
  7. 一种硬化膜的制备方法，其中，包括：
    提供基材膜层；
    应用印刷工艺或光刻工艺，在所述基材膜层上制备形成微立体结构层，所述微立体结构层中包括多个微立体结构；
    在所述微立体结构层上制备形成硬化膜层。
  8. 根据权利要求7所述的硬化膜的制备方法，其中，所述微立体结构是截面为多边形、圆形、椭圆形或不规则图形的空心的立体结构。
  9. 根据权利要求7所述的硬化膜的制备方法，其中，所述微立体结构是截面为多边形、圆形、椭圆形或不规则图形的实心的立体结构。
  10. 根据权利要求7所述的硬化膜的制备方法，其中，所述微立体结构层的厚度为1～5μm。
  11. 根据权利要求7所述的硬化膜的制备方法，其中，所述基材膜层的厚 度为10～250μm，所述硬化膜层的厚度为10～100μm。
  12. 根据权利要求7所述的硬化膜的制备方法，其中，所述微立体结构层的材料为光学树脂。
  13. 一种柔性AMOLED显示装置，包括柔性TFT阵列基板以及设置在所述柔性TFT阵列基板上的有机电致发光结构层，所述有机电致发光结构层上还设置有硬化膜，其中，所述硬化膜包括基材膜层以及位于基材膜层上的硬化膜层，所述基材膜层和所述硬化膜层之间设置有微立体结构层，所述微立体结构层中包括多个微立体结构。
  14. 根据权利要求13所述的柔性AMOLED显示装置，其中，所述微立体结构是截面为多边形、圆形、椭圆形或不规则图形的空心的立体结构。
  15. 根据权利要求13所述的柔性AMOLED显示装置，其中，所述微立体结构是截面为多边形、圆形、椭圆形或不规则图形的实心的立体结构。
  16. 根据权利要求13所述的柔性AMOLED显示装置，其中，所述微立体结构层的厚度为1～5μm。
  17. 根据权利要求13所述的柔性AMOLED显示装置，其中，所述微立体结构层的材料为光学树脂。
  18. 根据权利要求13所述的柔性AMOLED显示装置，其中，所述基材膜层的厚度为10～250μm，所述硬化膜层的厚度为10～100μm。
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