WO2019010973A1 - 一种新型非金属体系的电磁屏蔽膜及其制备方法，柔性线路板 - Google Patents

一种新型非金属体系的电磁屏蔽膜及其制备方法，柔性线路板 Download PDF

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WO2019010973A1
WO2019010973A1 PCT/CN2018/075981 CN2018075981W WO2019010973A1 WO 2019010973 A1 WO2019010973 A1 WO 2019010973A1 CN 2018075981 W CN2018075981 W CN 2018075981W WO 2019010973 A1 WO2019010973 A1 WO 2019010973A1
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layer
electromagnetic shielding
metal
shielding film
protective film
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PCT/CN2018/075981
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English (en)
French (fr)
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闫勇
高小君
鲁云生
王俊
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苏州城邦达力材料科技有限公司
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Priority to KR2020187000026U priority Critical patent/KR20190000746U/ko
Publication of WO2019010973A1 publication Critical patent/WO2019010973A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the invention relates to the technical field of electromagnetic shielding material preparation, in particular to a novel non-metal system electromagnetic shielding film and a preparation method thereof, and a flexible circuit board.
  • electromagnetic shielding film materials are widely used on electronic communication products.
  • the mainstream electromagnetic shielding film used in flexible circuit boards on the market is an electromagnetic shielding film of a metal system, which has the characteristics of large resource consumption, high manufacturing cost, and insufficient performance.
  • the first object of the present invention is to provide a novel non-metallic system electromagnetic shielding film which has excellent flexibility, superior mechanical properties, good conduction shielding performance, and is ultra-thin, ultra-light, heat-resistant and weather-resistant. Such advantages can be a good substitute for the current metal system electromagnetic shielding film.
  • a second object of the present invention is to provide a method for preparing an electromagnetic shielding film of the above novel non-metal system, which has the advantages of simple and mature process and suitable for mass production.
  • a third object of the present invention is to provide a flexible wiring board comprising the electromagnetic shielding film of the above novel non-metal system, which has the advantages of excellent performance and low production cost.
  • a novel non-metallic system electromagnetic shielding film comprising a first protective film layer, an ink layer, a non-metal functional layer, a non-metal conductive adhesive layer and a second protective film layer, a first protective film layer, an ink layer and a non-metal layer
  • the functional layer, the non-metallic conductive adhesive layer and the second protective film layer are sequentially and fixedly connected.
  • the first protective film layer is one selected from the group consisting of a PET release film, a PP release film, a PBT release film, and a release paper.
  • the thickness of the first protective film layer is 25-100 ⁇ m; preferably, the thickness of the first protective film layer is 25-50 ⁇ m.
  • the second protective film layer is one selected from the group consisting of a PET release film, a PP release film, a PBT release film, and a release paper.
  • the thickness of the second protective film layer is 25-100 ⁇ m; preferably, the thickness of the second protective film layer is 25-50 ⁇ m.
  • the material of the ink layer is at least one selected from the group consisting of epoxy resin, polyacryl resin, modified rubber, phenol resin, polyester resin, and polyurethane resin.
  • the thickness of the ink layer is 5 to 50 ⁇ m; preferably, the thickness of the ink layer is 20 to 30 ⁇ m.
  • the material of the non-metallic conductive adhesive layer is at least one selected from the group consisting of epoxy resin, polyacryl resin, polyimide resin, modified rubber, phenolic resin, polyester resin, and polyurethane resin;
  • the non-metallic conductive powder is dispersed in the non-metal conductive adhesive layer; more preferably, the non-metal conductive powder is selected from one of conductive carbon black, carbon nanotubes and graphene.
  • the thickness of the non-metallic conductive adhesive layer is 5-20 ⁇ m.
  • the material of the non-metal functional layer is selected from one of a carbon body, a boride compound, and a conductive polymer compound.
  • the conductive polymer compound is selected from the group consisting of polyacetylene, polybutadiene, polyparaphenylene, polyparaphenylenevinylene, polythiophene, polythiophene derivatives, polyaniline, polyphenylene sulfide, and polyphenylene ether.
  • the non-metallic functional layer has a thickness of 2 to 25 ⁇ m; preferably, the non-metallic functional layer has a thickness of 5 to 15 ⁇ m.
  • a novel non-metallic system electromagnetic shielding film preparation method comprises the following steps:
  • the first protective film layer and the second protective film layer are bonded to the ink layer and the non-metal conductive adhesive layer, and wound up.
  • the ink layer is coated on one side of the non-metal functional layer, and then dried, and then coated on the other side of the non-metal functional layer with a non-metal conductive adhesive layer.
  • a flexible circuit board comprising the electromagnetic shielding film of the novel non-metallic system described above.
  • the electromagnetic shielding film of the novel non-metal system provided by the invention has excellent flexibility, superior mechanical properties, good conduction shielding performance, and has the advantages of ultra-thin, ultra-lightweight, heat-resistant and weather-resistant, etc. It is a good substitute for the current metal system electromagnetic shielding film.
  • the flexible circuit board provided by the present invention has the advantages of excellent performance and low cost.
  • FIG. 1 is a schematic structural view of an electromagnetic shielding film of a novel non-metal system provided by the present invention.
  • 1-first protective film layer 2-ink layer; 3-non-metal functional layer; 4-non-metal conductive adhesive layer; 5-second protective film layer.
  • Embodiments of the present invention provide a novel non-metallic system electromagnetic shielding film, including a first protective film layer 1, an ink layer 2, a non-metal functional layer 3, a non-metal conductive adhesive layer 4, and a second protective film layer 5.
  • the first protective film layer 1, the ink layer 2, the non-metal functional layer 3, the non-metal conductive adhesive layer 4, and the second protective film layer 5 are sequentially and fixedly connected.
  • the electromagnetic shielding film of the novel non-metal system provided by the invention has a five-layer ultra-thin structure, which has excellent flexibility, superior mechanical properties, good conduction shielding performance and ultra-thin. Ultra-lightweight, heat-resistant and weather-resistant, it can replace the current metal system electromagnetic shielding film.
  • the non-metal functional layer 3 is a main body shielding functional layer, which functions as a conductive, heat-dissipating, shielding and has an ultra-high mechanical strength, and can carry a bearing effect on the ink layer 2 and the non-metal conductive adhesive layer 4;
  • the material of the non-metal functional layer 3 is selected from the group consisting of carbon, boride, and conductive polymer compounds; more preferably, the conductive polymer compound is selected from the group consisting of polyacetylene, polybutadiene, and polyparaphenylene.
  • the non-metallic functional layer has a thickness of 2 to 25 ⁇ m; more preferably The non-metallic functional layer has a thickness of 5-15 ⁇ m; the carbon body is preferably one of carbon black, activated carbon, and graphite; and the boride is preferably one of boride carbon and silicon boride.
  • the ink layer 2 functions as an insulating layer; preferably, the ink layer 2 is at least one selected from the group consisting of epoxy resin, polyacrylic resin, modified rubber, phenolic resin, polyester resin, and polyurethane resin; more preferably The thickness of the ink layer 2 is 5 to 50 ⁇ m; further preferably, the thickness of the ink layer 2 is 20 to 30 ⁇ m.
  • the material of the non-metallic conductive adhesive layer 4 is at least one selected from the group consisting of epoxy resin, polyacryl resin, polyimide resin, modified rubber, phenolic resin, polyester resin, and polyurethane resin;
  • the non-metallic conductive powder is dispersed in the non-metallic conductive adhesive layer; more preferably, the non-metallic conductive powder is selected from one of conductive carbon black, carbon nanotubes, and graphene; further preferably, non- The metal conductive adhesive layer 4 has a thickness of 5-20 ⁇ m.
  • the first protective film layer 1 is selected from one of a PET release film, a PP release film, a PBT release film, and a release paper; preferably, the second protection The film layer 5 is selected from one of a PET release film, a PP release film, a PBT release film, and a release paper.
  • the substrate of the PET release film is PET or polyethylene terephthalate, which has good adsorption and fit.
  • PP is a polypropylene
  • the PP release film is a release film whose substrate is PP.
  • PBT is polybutylene terephthalate.
  • the PBT release film is a release film whose substrate is PBT.
  • the first protective film layer 1 has a thickness of 25-100 ⁇ m; preferably, the first protective film layer 1 has a thickness of 25-50 ⁇ m; more preferably, the second protective film layer 5 The thickness is 25-100 ⁇ m; further preferably, the thickness of the second protective film layer 5 is 25-50 ⁇ m; controlling the thickness of the first protective film layer 1 and/or the second protective film layer 5 can avoid affecting the flexibility of the shielding film Sex.
  • the invention also provides a preparation method of the electromagnetic shielding film of the above novel non-metal system, comprising the following steps:
  • the first protective film layer 1 and the second protective film layer 5 are bonded to the ink layer 2 and the non-metal conductive adhesive layer 4 to be wound up.
  • the ink layer 2 is coated on one side of the non-metallic functional layer 3, dried, and then coated on the other side of the non-metallic functional layer 3 with a non-metallic conductive adhesive layer 4, followed by drying.
  • the present invention also provides a flexible wiring board comprising the electromagnetic shielding film of the novel non-metallic system described above.
  • This embodiment provides a method for preparing an electromagnetic shielding film of a novel non-metal system, and the preparation steps are as follows:
  • This embodiment provides a method for preparing an electromagnetic shielding film of a novel non-metal system, and the preparation steps are as follows:
  • An ink layer 2 (polyacrylic resin) having a thickness of 50 ⁇ m is wound on one side of a non-metallic functional layer 3 (boride) having a thickness of 25 ⁇ m, and the ink layer 2 is cured by oven drying, in the non-metal functional layer 3
  • a non-metallic conductive adhesive layer 4 carbon nanotubes distributed in a phenolic resin having a thickness of 20 ⁇ m is coated and dried in an oven;
  • a first protective film 1 layer (PP release film) having a thickness of 100 ⁇ m and a second protective film layer 5 (PP release film) having a thickness of 100 ⁇ m are adhered to the ink layer 2 and the non-metal conductive adhesive layer 4, Get the volume.
  • This embodiment provides a method for preparing an electromagnetic shielding film of a novel non-metal system, and the preparation steps are as follows:
  • This embodiment provides a method for preparing an electromagnetic shielding film of a novel non-metal system, and the preparation steps are as follows:
  • This embodiment provides a method for preparing an electromagnetic shielding film of a novel non-metal system, and the preparation steps are as follows:
  • This embodiment provides a method for preparing an electromagnetic shielding film of a novel non-metal system, and the preparation steps are as follows:
  • This embodiment provides a method for preparing an electromagnetic shielding film of a novel non-metal system, and the preparation steps are as follows:
  • a first protective film 1 layer (PET release film) having a thickness of 50 ⁇ m and a second protective film layer 5 (release paper) having a thickness of 50 ⁇ m are attached to the ink layer 2 and the non-metal conductive adhesive layer 4, The volume is available.
  • the electromagnetic shielding films of the non-metal systems prepared in Examples 1-7 were subjected to quality inspection using the quality inspection standards shown in Table 1.
  • test results show that the test results of the electromagnetic shielding film of the non-metal system provided by the present application can reach the corresponding indexes, and the electromagnetic shielding film of the non-metal system in the embodiment of the present application completely does not use the metal material, thereby saving metal consumption. And has the advantage of green environmental protection.
  • the electromagnetic shielding film of the novel non-metal system provided by the invention has excellent flexibility, superior mechanical properties, good conduction shielding performance, and has the advantages of ultra-thin, ultra-lightweight, heat-resistance and weather resistance, and can be well substituted.
  • Current metal system electromagnetic shielding film The preparation method of the electromagnetic shielding film of the novel non-metal system is mature, simple and reliable, and is suitable for mass production.
  • the flexible circuit board having the electromagnetic shielding film of the above novel non-metal system saves metal consumption, has excellent performance and is low in cost.

Abstract

一种新型非金属体系的电磁屏蔽膜及其制备方法、包含该电磁屏蔽膜的柔性线路板。该新型非金属体系的电磁屏蔽膜包括第一保护膜层（1）、油墨层（2）、非金属功能层（3）、非金属导电胶黏层（4）和第二保护膜层（5），第一保护膜层（1）、油墨层（2）、非金属功能层（3）、非金属导电胶黏层（4）和第二保护膜层（5）顺次固定相连。所述新型非金属体系的电磁屏蔽膜具有极好的柔韧性、超强的机械性能、良好的导通屏蔽性能，能够很好地代替当前的金属体系电磁屏蔽膜。所述新型非金属体系的电磁屏蔽膜的制备方法采用常规的成熟技术，使得制造工艺简单易实现，便于在工业上推广应用。另外，还提供了采用上述新型非金属体系的电磁屏蔽膜的柔性线路板。

Description

一种新型非金属体系的电磁屏蔽膜及其制备方法，柔性线路板
本申请要求于2017年07月11日提交中国专利局的申请号为201720837419.1、名称为“一种新型非金属体系的电磁屏蔽膜及其产品”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及电磁屏蔽材料制备技术领域，具体而言，涉及一种新型非金属体系的电磁屏蔽膜及其制备方法，柔性线路板。
背景技术
随着智能手机、平板电脑等数字电子产品的发展以及技术的进步和社会需求，电子通讯产品线路上会大量地使用电磁屏蔽膜材料。
目前，市场上柔性线路板使用的主流电磁屏蔽膜为金属体系的电磁屏蔽膜，存在着资源消耗大，制造成本过高，性能不足等特点。
有鉴于此，特提出本发明。
发明内容
本发明的第一目的在于提供一种新型非金属体系的电磁屏蔽膜，其具有极好的柔韧性、超强的机械性能、良好的导通屏蔽性能，具有超薄、超轻巧、耐热耐候等优点，能够很好地代替当前的金属体系电磁屏蔽膜。
本发明的第二目的在于提供上述新型非金属体系的电磁屏蔽膜的制备方法，其具有工艺简单成熟，适合大规模生产的优点。
本发明的第三目的在于提供一种包含上述新型非金属体系的电磁屏蔽膜的柔性线路板，其具有性能优异，制备成本低的优点。
为了实现本发明的上述目的，特采用以下技术方案：
一种新型非金属体系的电磁屏蔽膜，包括第一保护膜层、油墨层、非金属功能层、非金属导电胶黏层和第二保护膜层，第一保护膜层、油墨层、非金属功能层、非金属导电胶黏层和第二保护膜层顺次固定相连。
进一步的，第一保护膜层选自于PET离型膜、PP离型膜、PBT离型膜、离型纸中的一种。
进一步的，第一保护膜层的厚度为25-100μm；优选的，第一保护膜层的厚度为25-50μm。
进一步的，第二保护膜层选自于PET离型膜、PP离型膜、PBT离型膜、离型纸中的一种。
进一步的，第二保护膜层的厚度为25-100μm；优选的，第二保护膜层的厚度为25-50μm。
进一步的，油墨层的材质选自于环氧树脂、聚丙烯酸树脂、改性橡胶、酚醛树脂、聚酯树脂、聚氨酯树脂组成的组合中的至少一种。
进一步的，油墨层的厚度为5-50μm；优选的，油墨层的厚度为20-30μm。
进一步的，非金属导电胶黏层的材质选自于环氧树脂、聚丙烯酸树脂、聚酰亚胺树脂、改性橡胶、酚醛树脂、聚酯树脂、聚氨酯树脂组成的组合中的至少一种；优选的，非金属导电胶黏层内分散有非金属导电粉体；更优选的，非金属导电粉体选自于导电炭黑、纳米碳管、石墨烯中的一种。
进一步的，非金属导电胶黏层的厚度为5-20μm。
进一步的，非金属功能层的材质选自于碳素体、硼化物、导电高分子化合物中的一种制备而成。
进一步的，导电高分子化合物选自于聚乙炔、聚丁二炔、聚对苯撑、聚对苯撑乙烯、聚噻吩、聚噻吩衍生物、聚苯胺、聚苯硫醚、聚苯醚中的一种。
进一步的，非金属功能层的厚度为2-25μm；优选的，非金属功能层的厚度为5-15μm。
一种新型非金属体系的电磁屏蔽膜的制备方法，包括以下步骤：
在非金属功能层的两侧涂布油墨层、非金属导电胶黏层后干燥；
在油墨层和非金属导电胶黏层上贴合第一保护膜层和第二保护膜层，收卷。
进一步的，在非金属功能层的一侧涂布油墨层后干燥，随后在非金属功能层的另一侧涂布非金属导电胶黏层后干燥。
一种柔性线路板，其包含上述的新型非金属体系的电磁屏蔽膜。
与现有技术相比，本发明的有益效果为：
(1)本发明所提供的新型非金属体系的电磁屏蔽膜具有极好的柔韧性、超强的机械性能、良好的导通屏蔽性能，具有超薄、超轻巧、耐热耐候等优点，能够很好地代替了当前的金属体系电磁屏蔽膜。
(2)本发明所提供的新型非金属体系的电磁屏蔽膜的制备方法，采用的是工艺上常规的成熟技术，使得本发明的制造工艺简单易实现，便于在工业上推广应用。
(3)本发明所提供的柔性线路板具有性能优异、成本低廉的优点。
附图说明
为了更清楚地说明本发明具体实施方式或现有技术中的技术方案，下面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明所提供的新型非金属体系的电磁屏蔽膜结构示意图。
附图标记：
1-第一保护膜层；2-油墨层；3-非金属功能层；4-非金属导电胶黏层；5-第二保护膜层。
具体实施方式
下面将结合附图和具体实施方式对本发明的技术方案进行清楚、完整地描述，但是本领域技术人员将会理解，下列所描述的实施例是本发明一部分实施例，而不是全部的实施例，仅用于说明本发明，而不应视为限制本发明的范围。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。此外，术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性。实施例中未注明具体条件者，按照常规条件或制造商建议的条件进行。所用试剂或仪器未注明生产厂商者，均为可以通过市售购买获得的常规产品。
本发明具体实施方式提供了一种新型非金属体系的电磁屏蔽膜，包括第一保护膜层1、油墨层2、非金属功能层3、非金属导电胶黏层4和第二保护膜层5，第一保护膜层1、油墨层2、非金属功能层3、非金属导电胶黏层4和第二保护膜层5顺次固定相连。
参见图1所示，本发明所提供的新型非金属体系的电磁屏蔽膜具有五层超薄结构，其具有极好的柔韧性、超强的机械性能、良好的导通屏蔽性能，具有超薄、超轻巧、耐热耐候等优点，能够很好地代替当前的金属体系电磁屏蔽膜。
其中，非金属功能层3是主体屏蔽功能层，其起到导电、散热、屏蔽作用并具有超高的机械强度，能够对油墨层2和非金属导电胶黏层4起到承载作用；优选的，非金属功能层3的材质选自于碳素体、硼化物、导电高分子化合物中的一种；更优选的，导电高分子化合物选自于聚乙炔、聚丁二炔、聚对苯撑、聚对苯撑乙烯、聚噻吩、聚噻吩衍生物、聚苯胺、聚苯硫醚、聚苯醚中的一种；进一步优选的，非金属功能层的厚度为2-25μm；更进一步优选的，所述非金属功能层的厚度为5-15μm；碳素体优选采用炭黑、活性炭、石墨中的一种；硼化物优选采用硼化碳、硼化硅中的一种。
油墨层2起到绝缘的功能；优选的，油墨层2选自于环氧树脂、聚丙烯酸树脂、改性橡胶、酚醛树脂、聚酯树脂、聚氨酯树脂组成的组合中的至少一种；更优选的，油墨层2的厚度为5-50μm；进一步优选的，油墨层2的厚度为20-30μm。
非金属导电胶黏层4的材质选自于环氧树脂、聚丙烯酸树脂、聚酰亚胺树脂、改性橡胶、酚醛树脂、聚酯树脂、聚氨酯树脂组成的组合中的至少一种；优选的，非金属导电胶黏层内分散有非金属导电粉体；更优选的，所述非金属导电粉体选自于导电炭黑、纳米碳管、石墨烯中的一种；进一步优选的，非金属导电胶黏层4的厚度为5-20μm。
本实用新型一种优选的具体实施方式中，第一保护膜层1选自于PET离型膜、PP离型膜、PBT离型膜和离型纸中的一种；优选的，第二保护膜层5选自于PET离型膜、PP离型膜、PBT离型膜和离型纸中的一种。
其中，PET离型膜的底材是PET即聚对苯二甲酸乙二醇酯，其具有很好的吸附性和贴合性。PP即聚丙烯，PP离型膜是一种底材为PP的离型膜。PBT即聚对苯二甲酸丁二醇酯。PBT离型膜是一种底材为PBT的离型膜。
本发明一种优选的具体实施方式中，第一保护膜层1的厚度为25-100μm；优选的，第一保护膜层1的厚度为25-50μm；更优选的，第二保护膜层5的厚度为25-100μm；进一步优选的，第二保护膜层5的厚度为25-50μm；控制第一保护膜层1和/或第二保护膜层5的厚度能够避免影响到屏蔽膜的柔韧性。
本发明还提供了上述新型非金属体系的电磁屏蔽膜的制备方法，包括以下步骤：
在非金属功能层3的两侧涂布油墨层2、非金属导电胶黏层4后干燥；
在油墨层2和非金属导电胶黏层4上贴合第一保护膜层1和第二保护膜层5，收卷。
优选的，在非金属功能层3的一侧涂布油墨层2后干燥，随后在非金属功能层3的另一侧涂布非金属导电胶黏层4后干燥。
本发明还提供了一种柔性线路板，其包含上述的新型非金属体系的电磁屏蔽膜。
实施例1
本实施例提供了一种新型非金属体系的电磁屏蔽膜的制备方法，其制备步骤如下：
(1)在2μm厚度的非金属功能层3(碳素体)的一侧涂布5μm厚度的油墨层2(环氧树脂)，经烘箱干燥使油墨层2固化，在非金属功能层3的另一侧涂布5μm厚度的非金属导电胶黏层4(环氧树脂内分布导电炭黑)，并入烘箱干燥；
(2)在油墨层2和非金属导电胶黏层4上贴合25μm厚度的第一保护膜1层(PET离型膜)和25μm厚度的第二保护膜层5(PET离型膜)，收卷即得。
实施例2
本实施例提供了一种新型非金属体系的电磁屏蔽膜的制备方法，其制备步骤如下：
(1)在25μm厚度的的非金属功能层3(硼化物)的一侧卷上50μm厚度的油墨层2(聚丙烯酸树脂)，经烘箱干燥使油墨层2固化，在非金属功能层3的另一侧涂布20μm厚度的非金属导电胶黏层4(酚醛树脂内分布纳米碳管)，并入烘箱干燥；
(2)在油墨层2和非金属导电胶黏层4上贴合100μm厚度的第一保护膜1层(PP离型膜)和100μm厚度的第二保护膜层5(PP离型膜)，收卷即得。
实施例3
本实施例提供了一种新型非金属体系的电磁屏蔽膜的制备方法，其制备步骤如下：
(1)在5μm厚度的非金属功能层3(硼化物)的一侧涂布20μm厚度的油墨层2(改性橡胶)，经烘箱干燥使油墨层2固化，在非金属功能层3的另一侧涂布10μm厚度的非金属导电胶黏层4(聚酰亚胺树脂内分布石墨烯)，并入烘箱干燥；
(2)在油墨层2和非金属导电胶黏层4上贴合25μm厚度的第一保护膜1层(PBT离型膜)和25μm厚度的第二保护膜层5(PBT离型膜)，收卷即得。
实施例4
本实施例提供了一种新型非金属体系的电磁屏蔽膜的制备方法，其制备步骤如下：
(1)在15μm厚度的非金属功能层3(导电高分子化合物聚乙炔)的一侧涂布30μm厚度的油墨层2(改性橡胶)，经烘箱干燥使油墨层2固化，在非金属功能层3的另一侧涂布20μm厚度的非金属导电胶黏层4(聚酰亚胺树脂内分布石墨烯)，并入烘箱干燥；
(2)在油墨层2和非金属导电胶黏层4上贴合50μm厚度的第一保护膜1层(离型纸)和50μm厚度的第二保护膜层5(离型纸)，收卷即得。
实施例5
本实施例提供了一种新型非金属体系的电磁屏蔽膜的制备方法，其制备步骤如下：
(1)在10μm厚度的非金属功能层3(导电高分子化合物聚对苯撑乙烯)的一侧涂布40μm厚度的油墨层2(聚酯树脂)，经烘箱干燥使油墨层2固化，在非金属功能层3的另一侧涂布15μm厚度的非金属导电胶黏层4(聚氨酯树脂内分布导电炭黑)，并入烘箱干燥；
(2)在油墨层2和非金属导电胶黏层4上贴合30μm厚度的第一保护膜1层(PET离型膜)和30μm厚度的第二保护膜层5(PP离型膜)，收卷即得。
实施例6
本实施例提供了一种新型非金属体系的电磁屏蔽膜的制备方法，其制备步骤如下：
(1)在20μm厚度的非金属功能层3(导电高分子化合物聚苯硫醚)的一侧涂布25μm厚度的油墨层2(酚醛树脂)，经烘箱干燥使油墨层2固化，在非金属功能层3的另一侧涂布5μm厚度的非金属导电胶黏层4(聚丙烯酸树脂内分布导电炭黑)，并入烘箱干燥；
(2)在油墨层2和非金属导电胶黏层4上贴合30μm厚度的第一保护膜1层(PBT离 型膜)和60μm厚度的第二保护膜层5(PET离型膜)，收卷即得。
实施例7
本实施例提供了一种新型非金属体系的电磁屏蔽膜的制备方法，其制备步骤如下：
(1)在15μm厚度的非金属功能层3(导电高分子化合物聚噻吩)的一侧涂布20μm厚度的油墨层2(环氧树脂和聚氨酯树脂按2：1的质量比混合)，经烘箱干燥使油墨层2固化，在非金属功能层3的另一侧涂布10μm厚度的非金属导电胶黏层4(环氧树脂内分布纳米碳管)，并入烘箱干燥；
(2)在油墨层2和非金属导电胶黏层4上贴合50μm厚度的第一保护膜1层(PET离型膜)和50μm厚度的第二保护膜层5(离型纸)，收卷即得。
实验例  产品性能检测
对实施例1-7所制备的非金属体系的电磁屏蔽膜采用表1所示的质量检测标准进行质量检测。
表1质量检测标准
Figure PCTCN2018075981-appb-000001
Figure PCTCN2018075981-appb-000002
检测结果表明，本申请所提供的非金属体系的电磁屏蔽膜各项测试结果均可达到对应指标，且本申请实施例中非金属体系的电磁屏蔽膜完全没有使用金属材料，节约了金属的消耗，且具有绿色环保的优点。
尽管已用具体实施例来说明和描述了本发明，然而应意识到，以上各实施例仅用以说明本发明的技术方案，而非对其限制；本领域的普通技术人员应当理解：在不背离本发明的精神和范围的情况下，可以对前述各实施例所记载的技术方案进行修改，或者对其中部分或者全部技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本发明各实施例技术方案的范围；因此，这意味着在所附权利要求中包括属于本发明范围内的所有这些替换和修改。
工业实用性
本发明提供的新型非金属体系的电磁屏蔽膜有极好的柔韧性、超强的机械性能、良好的导通屏蔽性能，具有超薄、超轻巧、耐热耐候等优点，能够很好地代替当前的金属体系电磁屏蔽膜。该新型非金属体系的电磁屏蔽膜的制备方法成熟简单可靠，适合大规模生产。具有上述新型非金属体系的电磁屏蔽膜的柔性线路板节约了金属的消耗，性能优异且成本低廉。

Claims (15)

  1. 一种新型非金属体系的电磁屏蔽膜，其特征在于，包括第一保护膜层、油墨层、非金属功能层、非金属导电胶黏层和第二保护膜层，所述第一保护膜层、油墨层、非金属功能层、非金属导电胶黏层和第二保护膜层顺次固定相连。
  2. 根据权利要求1所述的新型非金属体系的电磁屏蔽膜，其特征在于，所述第一保护膜层选自于PET离型膜、PP离型膜、PBT离型膜、离型纸中的一种。
  3. 根据权利要求1或2所述的新型非金属体系的电磁屏蔽膜，其特征在于，所述第一保护膜层的厚度为25-100μm；优选的，所述第一保护膜层的厚度为25-50μm。
  4. 根据权利要求1-3中任一项所述的新型非金属体系的电磁屏蔽膜，其特征在于，所述第二保护膜层选自于PET离型膜、PP离型膜、PBT离型膜、离型纸中的一种。
  5. 根据权利要求1-4中任一项所述的新型非金属体系的电磁屏蔽膜，其特征在于，所述第二保护膜层的厚度为25-100μm；优选的，所述第二保护膜层的厚度为25-50μm。
  6. 根据权利要求1-5中任一项所述的新型非金属体系的电磁屏蔽膜，其特征在于，所述油墨层的材质选自于环氧树脂、聚丙烯酸树脂、改性橡胶、酚醛树脂、聚酯树脂、聚氨酯树脂组成的组合中的至少一种。
  7. 根据权利要求1-6中任一项所述的新型非金属体系的电磁屏蔽膜，其特征在于，所述油墨层的厚度为5-50μm；优选的，所述油墨层的厚度为20-30μm。
  8. 根据权利要求1-7中任一项所述的新型非金属体系的电磁屏蔽膜，其特征在于，所述非金属导电胶黏层的材质选自于环氧树脂、聚丙烯酸树脂、聚酰亚胺树脂、改性橡胶、酚醛树脂、聚酯树脂、聚氨酯树脂组成的组合中的至少一种；优选的，所述非金属导电胶黏层内分散有非金属导电粉体；更优选的，所述非金属导电粉体选自于导电炭黑、纳米碳管、石墨烯中的一种。
  9. 根据权利要求1-8中任一项所述的新型非金属体系的电磁屏蔽膜，其特征在于，所述非金属导电胶黏层的厚度为5-20μm。
  10. 根据权利要求1-9中任一项所述的新型非金属体系的电磁屏蔽膜，其特征在于，所述非金属功能层的材质选自于碳素体、硼化物、导电高分子化合物中的一种。
  11. 根据权利要求10所述的新型非金属体系的电磁屏蔽膜，其特征在于，所述导电高分子化合物选自于聚乙炔、聚丁二炔、聚对苯撑、聚对苯撑乙烯、聚噻吩、聚噻吩衍生物、聚苯胺、聚苯硫醚、聚苯醚中的一种。
  12. 根据权利要求1-11中任一项所述的新型非金属体系的电磁屏蔽膜，其特征在于，所述非金属功能层的厚度为2-25μm；优选的，所述非金属功能层的厚度为5-15μm。
  13. 一种新型非金属体系的电磁屏蔽膜的制备方法，其特征在于：包括以下步骤：
    在非金属功能层的两侧涂布油墨层、非金属导电胶黏层后干燥；
    在所述油墨层和所述非金属导电胶黏层上贴合第一保护膜层和第二保护膜层，收卷。
  14. 根据权利要求13所述的新型非金属体系的电磁屏蔽膜的制备方法，其特征在于：在所述非金属功能层的一侧涂布所述油墨层后干燥，随后在所述非金属功能层的另一侧涂布所述非金属导电胶黏层后干燥。
  15. 一种柔性线路板，其特征在于，其包含权利要求1-12中任一项所述的新型非金属体系的电磁屏蔽膜。
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