WO2019010973A1 - Nouveau film de blindage électromagnétique de système non métallique et son procédé de préparation, et carte de circuit imprimé souple - Google Patents

Nouveau film de blindage électromagnétique de système non métallique et son procédé de préparation, et carte de circuit imprimé souple Download PDF

Info

Publication number
WO2019010973A1
WO2019010973A1 PCT/CN2018/075981 CN2018075981W WO2019010973A1 WO 2019010973 A1 WO2019010973 A1 WO 2019010973A1 CN 2018075981 W CN2018075981 W CN 2018075981W WO 2019010973 A1 WO2019010973 A1 WO 2019010973A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
electromagnetic shielding
metal
shielding film
protective film
Prior art date
Application number
PCT/CN2018/075981
Other languages
English (en)
Chinese (zh)
Inventor
闫勇
高小君
鲁云生
王俊
Original Assignee
苏州城邦达力材料科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 苏州城邦达力材料科技有限公司 filed Critical 苏州城邦达力材料科技有限公司
Priority to KR2020187000026U priority Critical patent/KR20190000746U/ko
Publication of WO2019010973A1 publication Critical patent/WO2019010973A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the invention relates to the technical field of electromagnetic shielding material preparation, in particular to a novel non-metal system electromagnetic shielding film and a preparation method thereof, and a flexible circuit board.
  • electromagnetic shielding film materials are widely used on electronic communication products.
  • the mainstream electromagnetic shielding film used in flexible circuit boards on the market is an electromagnetic shielding film of a metal system, which has the characteristics of large resource consumption, high manufacturing cost, and insufficient performance.
  • the first object of the present invention is to provide a novel non-metallic system electromagnetic shielding film which has excellent flexibility, superior mechanical properties, good conduction shielding performance, and is ultra-thin, ultra-light, heat-resistant and weather-resistant. Such advantages can be a good substitute for the current metal system electromagnetic shielding film.
  • a second object of the present invention is to provide a method for preparing an electromagnetic shielding film of the above novel non-metal system, which has the advantages of simple and mature process and suitable for mass production.
  • a third object of the present invention is to provide a flexible wiring board comprising the electromagnetic shielding film of the above novel non-metal system, which has the advantages of excellent performance and low production cost.
  • a novel non-metallic system electromagnetic shielding film comprising a first protective film layer, an ink layer, a non-metal functional layer, a non-metal conductive adhesive layer and a second protective film layer, a first protective film layer, an ink layer and a non-metal layer
  • the functional layer, the non-metallic conductive adhesive layer and the second protective film layer are sequentially and fixedly connected.
  • the first protective film layer is one selected from the group consisting of a PET release film, a PP release film, a PBT release film, and a release paper.
  • the thickness of the first protective film layer is 25-100 ⁇ m; preferably, the thickness of the first protective film layer is 25-50 ⁇ m.
  • the second protective film layer is one selected from the group consisting of a PET release film, a PP release film, a PBT release film, and a release paper.
  • the thickness of the second protective film layer is 25-100 ⁇ m; preferably, the thickness of the second protective film layer is 25-50 ⁇ m.
  • the material of the ink layer is at least one selected from the group consisting of epoxy resin, polyacryl resin, modified rubber, phenol resin, polyester resin, and polyurethane resin.
  • the thickness of the ink layer is 5 to 50 ⁇ m; preferably, the thickness of the ink layer is 20 to 30 ⁇ m.
  • the material of the non-metallic conductive adhesive layer is at least one selected from the group consisting of epoxy resin, polyacryl resin, polyimide resin, modified rubber, phenolic resin, polyester resin, and polyurethane resin;
  • the non-metallic conductive powder is dispersed in the non-metal conductive adhesive layer; more preferably, the non-metal conductive powder is selected from one of conductive carbon black, carbon nanotubes and graphene.
  • the thickness of the non-metallic conductive adhesive layer is 5-20 ⁇ m.
  • the material of the non-metal functional layer is selected from one of a carbon body, a boride compound, and a conductive polymer compound.
  • the conductive polymer compound is selected from the group consisting of polyacetylene, polybutadiene, polyparaphenylene, polyparaphenylenevinylene, polythiophene, polythiophene derivatives, polyaniline, polyphenylene sulfide, and polyphenylene ether.
  • the non-metallic functional layer has a thickness of 2 to 25 ⁇ m; preferably, the non-metallic functional layer has a thickness of 5 to 15 ⁇ m.
  • a novel non-metallic system electromagnetic shielding film preparation method comprises the following steps:
  • the first protective film layer and the second protective film layer are bonded to the ink layer and the non-metal conductive adhesive layer, and wound up.
  • the ink layer is coated on one side of the non-metal functional layer, and then dried, and then coated on the other side of the non-metal functional layer with a non-metal conductive adhesive layer.
  • a flexible circuit board comprising the electromagnetic shielding film of the novel non-metallic system described above.
  • the electromagnetic shielding film of the novel non-metal system provided by the invention has excellent flexibility, superior mechanical properties, good conduction shielding performance, and has the advantages of ultra-thin, ultra-lightweight, heat-resistant and weather-resistant, etc. It is a good substitute for the current metal system electromagnetic shielding film.
  • the flexible circuit board provided by the present invention has the advantages of excellent performance and low cost.
  • FIG. 1 is a schematic structural view of an electromagnetic shielding film of a novel non-metal system provided by the present invention.
  • 1-first protective film layer 2-ink layer; 3-non-metal functional layer; 4-non-metal conductive adhesive layer; 5-second protective film layer.
  • Embodiments of the present invention provide a novel non-metallic system electromagnetic shielding film, including a first protective film layer 1, an ink layer 2, a non-metal functional layer 3, a non-metal conductive adhesive layer 4, and a second protective film layer 5.
  • the first protective film layer 1, the ink layer 2, the non-metal functional layer 3, the non-metal conductive adhesive layer 4, and the second protective film layer 5 are sequentially and fixedly connected.
  • the electromagnetic shielding film of the novel non-metal system provided by the invention has a five-layer ultra-thin structure, which has excellent flexibility, superior mechanical properties, good conduction shielding performance and ultra-thin. Ultra-lightweight, heat-resistant and weather-resistant, it can replace the current metal system electromagnetic shielding film.
  • the non-metal functional layer 3 is a main body shielding functional layer, which functions as a conductive, heat-dissipating, shielding and has an ultra-high mechanical strength, and can carry a bearing effect on the ink layer 2 and the non-metal conductive adhesive layer 4;
  • the material of the non-metal functional layer 3 is selected from the group consisting of carbon, boride, and conductive polymer compounds; more preferably, the conductive polymer compound is selected from the group consisting of polyacetylene, polybutadiene, and polyparaphenylene.
  • the non-metallic functional layer has a thickness of 2 to 25 ⁇ m; more preferably The non-metallic functional layer has a thickness of 5-15 ⁇ m; the carbon body is preferably one of carbon black, activated carbon, and graphite; and the boride is preferably one of boride carbon and silicon boride.
  • the ink layer 2 functions as an insulating layer; preferably, the ink layer 2 is at least one selected from the group consisting of epoxy resin, polyacrylic resin, modified rubber, phenolic resin, polyester resin, and polyurethane resin; more preferably The thickness of the ink layer 2 is 5 to 50 ⁇ m; further preferably, the thickness of the ink layer 2 is 20 to 30 ⁇ m.
  • the material of the non-metallic conductive adhesive layer 4 is at least one selected from the group consisting of epoxy resin, polyacryl resin, polyimide resin, modified rubber, phenolic resin, polyester resin, and polyurethane resin;
  • the non-metallic conductive powder is dispersed in the non-metallic conductive adhesive layer; more preferably, the non-metallic conductive powder is selected from one of conductive carbon black, carbon nanotubes, and graphene; further preferably, non- The metal conductive adhesive layer 4 has a thickness of 5-20 ⁇ m.
  • the first protective film layer 1 is selected from one of a PET release film, a PP release film, a PBT release film, and a release paper; preferably, the second protection The film layer 5 is selected from one of a PET release film, a PP release film, a PBT release film, and a release paper.
  • the substrate of the PET release film is PET or polyethylene terephthalate, which has good adsorption and fit.
  • PP is a polypropylene
  • the PP release film is a release film whose substrate is PP.
  • PBT is polybutylene terephthalate.
  • the PBT release film is a release film whose substrate is PBT.
  • the first protective film layer 1 has a thickness of 25-100 ⁇ m; preferably, the first protective film layer 1 has a thickness of 25-50 ⁇ m; more preferably, the second protective film layer 5 The thickness is 25-100 ⁇ m; further preferably, the thickness of the second protective film layer 5 is 25-50 ⁇ m; controlling the thickness of the first protective film layer 1 and/or the second protective film layer 5 can avoid affecting the flexibility of the shielding film Sex.
  • the invention also provides a preparation method of the electromagnetic shielding film of the above novel non-metal system, comprising the following steps:
  • the first protective film layer 1 and the second protective film layer 5 are bonded to the ink layer 2 and the non-metal conductive adhesive layer 4 to be wound up.
  • the ink layer 2 is coated on one side of the non-metallic functional layer 3, dried, and then coated on the other side of the non-metallic functional layer 3 with a non-metallic conductive adhesive layer 4, followed by drying.
  • the present invention also provides a flexible wiring board comprising the electromagnetic shielding film of the novel non-metallic system described above.
  • This embodiment provides a method for preparing an electromagnetic shielding film of a novel non-metal system, and the preparation steps are as follows:
  • This embodiment provides a method for preparing an electromagnetic shielding film of a novel non-metal system, and the preparation steps are as follows:
  • An ink layer 2 (polyacrylic resin) having a thickness of 50 ⁇ m is wound on one side of a non-metallic functional layer 3 (boride) having a thickness of 25 ⁇ m, and the ink layer 2 is cured by oven drying, in the non-metal functional layer 3
  • a non-metallic conductive adhesive layer 4 carbon nanotubes distributed in a phenolic resin having a thickness of 20 ⁇ m is coated and dried in an oven;
  • a first protective film 1 layer (PP release film) having a thickness of 100 ⁇ m and a second protective film layer 5 (PP release film) having a thickness of 100 ⁇ m are adhered to the ink layer 2 and the non-metal conductive adhesive layer 4, Get the volume.
  • This embodiment provides a method for preparing an electromagnetic shielding film of a novel non-metal system, and the preparation steps are as follows:
  • This embodiment provides a method for preparing an electromagnetic shielding film of a novel non-metal system, and the preparation steps are as follows:
  • This embodiment provides a method for preparing an electromagnetic shielding film of a novel non-metal system, and the preparation steps are as follows:
  • This embodiment provides a method for preparing an electromagnetic shielding film of a novel non-metal system, and the preparation steps are as follows:
  • This embodiment provides a method for preparing an electromagnetic shielding film of a novel non-metal system, and the preparation steps are as follows:
  • a first protective film 1 layer (PET release film) having a thickness of 50 ⁇ m and a second protective film layer 5 (release paper) having a thickness of 50 ⁇ m are attached to the ink layer 2 and the non-metal conductive adhesive layer 4, The volume is available.
  • the electromagnetic shielding films of the non-metal systems prepared in Examples 1-7 were subjected to quality inspection using the quality inspection standards shown in Table 1.
  • test results show that the test results of the electromagnetic shielding film of the non-metal system provided by the present application can reach the corresponding indexes, and the electromagnetic shielding film of the non-metal system in the embodiment of the present application completely does not use the metal material, thereby saving metal consumption. And has the advantage of green environmental protection.
  • the electromagnetic shielding film of the novel non-metal system provided by the invention has excellent flexibility, superior mechanical properties, good conduction shielding performance, and has the advantages of ultra-thin, ultra-lightweight, heat-resistance and weather resistance, and can be well substituted.
  • Current metal system electromagnetic shielding film The preparation method of the electromagnetic shielding film of the novel non-metal system is mature, simple and reliable, and is suitable for mass production.
  • the flexible circuit board having the electromagnetic shielding film of the above novel non-metal system saves metal consumption, has excellent performance and is low in cost.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne un nouveau film de blindage électromagnétique de système non métallique et son procédé de préparation, et une carte de circuit imprimé souple comprenant le film de blindage électromagnétique. Le nouveau film de blindage électromagnétique de système non métallique comprend une première couche de film de protection (1), une couche d'encre d'impression (2), une couche fonctionnelle non métallique (3), une couche adhésive conductrice non métallique (4), et une seconde couche de film de protection (5) ; la première couche de film de protection (1), la couche d'encre d'impression (2), la couche fonctionnelle non métallique (3), la couche adhésive conductrice non métallique (4) et la seconde couche de film de protection (5) sont reliées de manière fixe en séquence. Le nouveau film de blindage électromagnétique de système non métallique présente une excellente souplesse, une performance mécanique très élevée et de bonnes performances de conduction et de blindage, et remplace bien le film de blindage électromagnétique de système métallique actuel. Le procédé de préparation du nouveau film de blindage électromagnétique de système non métallique adopte une technologie normale et mature, de telle sorte que le processus de fabrication est simple, facile à mettre en œuvre et pratique à populariser et à appliquer dans l'industrie. De plus, l'invention concerne également la carte de circuit imprimé souple utilisant le nouveau film de blindage électromagnétique de système non métallique.
PCT/CN2018/075981 2017-07-11 2018-02-09 Nouveau film de blindage électromagnétique de système non métallique et son procédé de préparation, et carte de circuit imprimé souple WO2019010973A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2020187000026U KR20190000746U (ko) 2017-07-11 2018-02-09 신형 비금속계 전자파 차폐막 및 플랙시블 회로기판

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201720837419.1 2017-07-11
CN201720837419.1U CN207040147U (zh) 2017-07-11 2017-07-11 一种新型非金属体系的电磁屏蔽膜及其产品

Publications (1)

Publication Number Publication Date
WO2019010973A1 true WO2019010973A1 (fr) 2019-01-17

Family

ID=61467185

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2018/075981 WO2019010973A1 (fr) 2017-07-11 2018-02-09 Nouveau film de blindage électromagnétique de système non métallique et son procédé de préparation, et carte de circuit imprimé souple

Country Status (3)

Country Link
KR (1) KR20190000746U (fr)
CN (1) CN207040147U (fr)
WO (1) WO2019010973A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109694664A (zh) * 2019-01-25 2019-04-30 苏州佳值电子工业有限公司 局部导电多功能吸光胶带

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107135641A (zh) * 2017-07-11 2017-09-05 苏州城邦达力材料科技有限公司 一种新型非金属体系的电磁屏蔽膜及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080053512A1 (en) * 2006-08-30 2008-03-06 Koji Kawashima Back sheet for photovoltaic modules and photovoltaic module using the same
CN101765357A (zh) * 2008-11-07 2010-06-30 南通芯迎设计服务有限公司 一种电磁屏蔽外壳
CN104507301A (zh) * 2014-12-16 2015-04-08 苏州城邦达力材料科技有限公司 一种带有金属镀层的电磁屏蔽膜及其制造工艺
CN105479830A (zh) * 2006-11-06 2016-04-13 赫克塞尔合成有限公司 改进的复合材料
CN205430758U (zh) * 2015-12-18 2016-08-03 苏州城邦达力材料科技有限公司 适用于高频信号的电磁屏蔽膜
CN107135641A (zh) * 2017-07-11 2017-09-05 苏州城邦达力材料科技有限公司 一种新型非金属体系的电磁屏蔽膜及其制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080053512A1 (en) * 2006-08-30 2008-03-06 Koji Kawashima Back sheet for photovoltaic modules and photovoltaic module using the same
CN105479830A (zh) * 2006-11-06 2016-04-13 赫克塞尔合成有限公司 改进的复合材料
CN101765357A (zh) * 2008-11-07 2010-06-30 南通芯迎设计服务有限公司 一种电磁屏蔽外壳
CN104507301A (zh) * 2014-12-16 2015-04-08 苏州城邦达力材料科技有限公司 一种带有金属镀层的电磁屏蔽膜及其制造工艺
CN205430758U (zh) * 2015-12-18 2016-08-03 苏州城邦达力材料科技有限公司 适用于高频信号的电磁屏蔽膜
CN107135641A (zh) * 2017-07-11 2017-09-05 苏州城邦达力材料科技有限公司 一种新型非金属体系的电磁屏蔽膜及其制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109694664A (zh) * 2019-01-25 2019-04-30 苏州佳值电子工业有限公司 局部导电多功能吸光胶带

Also Published As

Publication number Publication date
KR20190000746U (ko) 2019-03-22
CN207040147U (zh) 2018-02-23

Similar Documents

Publication Publication Date Title
TWI468084B (zh) Electromagnetic wave shielding material for FPC
KR102058747B1 (ko) 도전성 접착제층 및 fpc용 전자파 쉴드재
US11019758B2 (en) Electromagnetic shielding film and preparation method therefor
KR101359474B1 (ko) Fpc용 전자파 쉴드재
CN104507301A (zh) 一种带有金属镀层的电磁屏蔽膜及其制造工艺
CN109852274B (zh) 一种石墨烯导热胶膜及其制备工艺
WO2021004177A1 (fr) Film de protection ayant une structure métallique multicouche
TWM555982U (zh) 高遮蔽性ｅｍｉ屏蔽膜
CN110505753A (zh) 一种应用于高频高速柔性线路板的cop材料及其制备方法和应用
WO2019010973A1 (fr) Nouveau film de blindage électromagnétique de système non métallique et son procédé de préparation, et carte de circuit imprimé souple
CN105491786A (zh) 适用于高频信号的电磁屏蔽膜及其制造工艺
CN204259357U (zh) 一种带有金属镀层的电磁屏蔽膜
CN111607335A (zh) 一种电磁屏蔽胶带
CN205430758U (zh) 适用于高频信号的电磁屏蔽膜
JP5993485B2 (ja) Ｆｐｃ用電磁波シールド材を備えたｆｐｃ
JP2015179849A5 (ja) Ｆｐｃ用電磁波シールド材を備えたｆｐｃ
CN205546176U (zh) 一种石墨烯散热型屏蔽膜
CN208562206U (zh) 一种电磁屏蔽胶带
CN204616270U (zh) 一种高效能低成本电磁屏蔽膜
CN109642126B (zh) 压敏胶带、其制造方法及包括其的电子设备
CN107135641A (zh) 一种新型非金属体系的电磁屏蔽膜及其制备方法
JP2019053967A (ja) 粘着シートおよびその製造方法
TW201819183A (zh) 電磁波遮蔽材
CN108624249A (zh) 一种单层铝塑复合膜导电胶带
CN104010436A (zh) 一种具有电磁屏蔽效果的柔性覆金属基板及制造工艺

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 20187000026

Country of ref document: KR

Kind code of ref document: U

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18832440

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18832440

Country of ref document: EP

Kind code of ref document: A1