WO2019000893A1 - Pcb订单加投率预测方法和装置 - Google Patents

Pcb订单加投率预测方法和装置 Download PDF

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WO2019000893A1
WO2019000893A1 PCT/CN2017/120102 CN2017120102W WO2019000893A1 WO 2019000893 A1 WO2019000893 A1 WO 2019000893A1 CN 2017120102 W CN2017120102 W CN 2017120102W WO 2019000893 A1 WO2019000893 A1 WO 2019000893A1
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Prior art keywords
plate
circuit board
indicates
pcb order
board product
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PCT/CN2017/120102
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English (en)
French (fr)
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宫立军
张可
邱醒亚
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广州兴森快捷电路科技有限公司
深圳市兴森快捷电路科技股份有限公司
宜兴硅谷电子科技有限公司
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Publication of WO2019000893A1 publication Critical patent/WO2019000893A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/04—Forecasting or optimisation specially adapted for administrative or management purposes, e.g. linear programming or "cutting stock problem"
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/06—Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
    • G06Q10/063—Operations research, analysis or management
    • G06Q10/0631—Resource planning, allocation, distributing or scheduling for enterprises or organisations
    • G06Q10/06315—Needs-based resource requirements planning or analysis
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q30/00—Commerce
    • G06Q30/02—Marketing; Price estimation or determination; Fundraising
    • G06Q30/0201—Market modelling; Market analysis; Collecting market data
    • G06Q30/0202—Market predictions or forecasting for commercial activities
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q50/00—Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
    • G06Q50/04—Manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/30—Computing systems specially adapted for manufacturing

Definitions

  • the present invention relates to the field of PCB technology, and in particular, to a PCB order plus rate prediction method and apparatus.
  • PCB Printed Circuit Board, printed circuit board, also known as printed circuit board
  • PCB products have strong individuality, production parameters and process characteristics, and precision requirements. Higher characteristics. These characteristics lead to the easy occurrence of scrap in the PCB production process. Therefore, PCB companies generally make appropriate multiple investments when the PCB is being fed, that is, add investment to compensate for the losses caused by scrapping.
  • the PCB can't be processed directly according to the size of the finished board, and it needs to adopt the form of jigsaw.
  • the number of delivery divided by the number of production jigs is not an integer, it needs to adopt the rounding up method, which will also lead to the increase rate. Increase. These need to be considered when predicting the PCB order plus rate.
  • the rate of increase is mainly predicted by the production dispatchers based on the difficulty of assessing the PCB manufacturing experience.
  • This method has a large subjectivity, which is easy to lead to inaccurate prediction, and the prediction takes a long time.
  • an object of the present invention is to provide a PCB order plus rate prediction method and apparatus, a computer readable storage medium and a computer device, which can realize the prediction of the PCB order increase rate without manual intervention, and It can improve the efficiency and accuracy of PCB order plus rate prediction.
  • a method for predicting a PCB order increase rate which includes:
  • the circuit board product information includes: a number of layers, a plate plating time, a finished plate thickness, a minimum hole wall copper thickness, a through hole thickness to diameter ratio, and a total hole. Number, total number of processes, delivery quantity, historical yield, finished unit area, whether copper or nickel plating, whether hard gold plating, whether there is gold finger, whether there is negative plating, whether there is thin copper, whether it is photoelectric board Whether it is a high-frequency board, whether it is required to meet the IPCIII standard, whether the line width spacing is less than a preset threshold, the number of presses, and the number of panels.
  • the foregoing increase rate calculation model is:
  • R plus (((Roundup((Q delivery *(1-(k 1 *N layers +k 2 *T plate +k 3 *T F-plate +k 4 *S ct-hw +k 5 *R th- Dm +k 6 *N holes +k 7 *N t-processes -k 8 *Q delivery -k 9 *Y his +k 10 *A F-unit +k 11 *W plate1 +k 12 *W plate2 +k 13 *W chefs +k 14 *W n-plate +k 15 *W t-copper +k 16 *W p-panel +k 17 *W h-fq-board +k 18 *W IPCIII +k 19 *W L- Width +k 20 *N press )))/N spells ))*N spells )-Q delivery )/Q delivery
  • N layers represents the number of layers
  • T plate represents the number of plate plating
  • T F-plate represents the thickness of the finished plate
  • S ct-hw represents the minimum hole wall thickness
  • R th-dm represents the thickness of the through hole.
  • Diameter ratio N holes indicates the total number of holes
  • N t-processes indicates the total number of flows
  • Q delivery indicates the delivery quantity
  • Y his indicates the historical yield
  • a F-unit indicates the finished unit area
  • W plate1 indicates whether the copper or nickel is plated.
  • W plate2 indicates whether to plate hard gold
  • W chefs indicates whether there is gold finger
  • W n-plate indicates whether there is negative plating
  • W t-copper indicates whether there is thinned copper
  • W p-panel indicates whether it is photoelectric plate
  • W H-fq-board indicates whether it is a high frequency board
  • W IPCIII indicates whether it is required to reach the IPCIII standard
  • W L-width indicates whether the line width spacing is less than the preset threshold
  • N press indicates the number of presses
  • N spells indicates the number of panels.
  • Roundup means rounding up, k 1 , k 2 , k 3 , k 4 , k 5 , k 6 , k 7 , k 8 , k 9 , k 10 , k 11 , k 12 , k 13 , k 14 , k 15 , k 16 , k 17 , k 18 , k 19 and k 20 parameter term coefficients.
  • k 1 is 0.3347
  • k 2 is 0.5837
  • k 3 is 0.2654
  • k 4 is 0.0118
  • k 5 is 0.1757
  • k 6 is 0.00006001
  • k 7 is 0.04282
  • k 8 is 0.0002636
  • k 9 is 0.05532
  • k 10 is 42.07
  • k 11 is 2.377
  • k 12 is 0.828
  • k 13 is 0.6899
  • k 14 is 0.886
  • k 15 is 0.6842.
  • k 16 is 0.2591
  • k 17 is 0.3622
  • k 18 is 0.4906
  • k 19 is 0.4961
  • k 20 is 2.6278;
  • the value of W plate1 is 1, otherwise 0; when the circuit board product is plated with hard gold, the value of W plate2 is 1, otherwise 0; in the line
  • the value of W chefs is 1, otherwise it is 0; when the circuit board product has negative film plating, the value of W n-plate is 1, otherwise 0; in the circuit board product is reduced
  • the value of W t-copper is 1, otherwise 0; when the circuit board product is a photovoltaic board, the value of W p-panel is 1, otherwise 0; in the circuit board product is high frequency
  • the value of W h-fq-board is 1, otherwise it is 0; when the board product is required to meet the IPCIII standard, the value of W IPCIII is 1, otherwise 0; the line width of the product line is less than When the threshold is preset, the value of W L-width is 1, otherwise it is 0;
  • the preset threshold is 3.5 mils.
  • the determining, by the CMP software server, the parameter that is determined by using the PCB order file The PCB order file is parsed to obtain the parameters of the PCB order.
  • a PCB order plus rate prediction apparatus including:
  • a file obtaining unit configured to obtain a PCB order file of a PCB order to be predicted by the increase rate
  • An information analyzing unit configured to determine, according to the PCB order file, a parameter of the PCB order, where the parameter includes circuit board product information of a circuit board product corresponding to the PCB order;
  • the addition rate prediction unit is configured to predict the increase rate of the PCB order according to the circuit board product information and a preset increase rate calculation model.
  • the circuit board product information includes: a number of layers, a plate plating times, a finished plate thickness, a minimum hole wall copper thickness, a through hole thickness to diameter ratio, Total number of holes, total number of processes, delivery quantity, historical yield, finished unit area, whether copper or nickel plating, whether hard gold plating, whether there is gold finger, whether there is negative plating, whether there is thin copper, whether it is Whether the photovoltaic panel, whether it is a high-frequency board, whether it is required to meet the IPCIII standard, whether the line width spacing is less than a preset threshold, the number of presses and the number of panels;
  • the foregoing calculation method of the increase rate is:
  • R plus (((Roundup((Q delivery *(1-(k 1 *N layers +k 2 *T plate +k 3 *T F-plate +k 4 *S ct-hw +k 5 *R th- Dm +k 6 *N holes +k 7 *N t-processes -k 8 *Q delivery -k 9 *Y his +k 10 *A F-unit +k 11 *W plate1 +k 12 *W plate2 +k 13 *W chefs +k 14 *W n-plate +k 15 *W t-copper +k 16 *W p-panel +k 17 *W h-fq-board +k 18 *W IPCIII +k 19 *W L- Width +k 20 *N press )))/N spells ))*N spells )-Q delivery )/Q delivery
  • N layers represents the number of layers
  • T plate represents the number of plate plating
  • T F-plate represents the thickness of the finished plate
  • S ct-hw represents the minimum hole wall thickness
  • R th-dm represents the thickness of the through hole.
  • Diameter ratio N holes indicates the total number of holes
  • N t-processes indicates the total number of flows
  • Q delivery indicates the delivery quantity
  • Y his indicates the historical yield
  • a F-unit indicates the finished unit area
  • W plate1 indicates whether the copper or nickel is plated.
  • W plate2 indicates whether to plate hard gold
  • W chefs indicates whether there is gold finger
  • W n-plate indicates whether there is negative plating
  • W t-copper indicates whether there is thinned copper
  • W p-panel indicates whether it is photoelectric plate
  • W H-fq-board indicates whether it is a high frequency board
  • W IPCIII indicates whether it is required to reach the IPCIII standard
  • W L-width indicates whether the line width spacing is less than the preset threshold
  • N press indicates the number of presses
  • N spells indicates the number of panels.
  • Roundup means rounding up, k 1 , k 2 , k 3 , k 4 , k 5 , k 6 , k 7 , k 8 , k 9 , k 10 , k 11 , k 12 , k 13 , k 14 , k 15 , k 16 , k 17 , k 18 , k 19 and k 20 parameter term coefficients.
  • k 1 is 0.3347
  • k 2 is 0.5837
  • k 3 is 0.2654
  • k 4 is 0.0118
  • k 5 is 0.1757
  • k 6 is 0.00006001
  • k 7 is 0.04282
  • k 8 is 0.0002636
  • k 9 is 0.05532
  • k 10 is 42.07
  • k 11 is 2.377
  • k 12 is 0.828
  • k 13 is 0.6899
  • k 14 is 0.886
  • k 15 is 0.6842.
  • k 16 is 0.2591
  • k 17 is 0.3622
  • k 18 is 0.4906
  • k 19 is 0.4961
  • k 20 is 2.6278;
  • the value of W plate1 is 1, otherwise 0; when the circuit board product is plated with hard gold, the value of W plate2 is 1, otherwise 0; in the line
  • the value of W chefs is 1, otherwise it is 0; when the circuit board product has negative film plating, the value of W n-plate is 1, otherwise 0; in the circuit board product is reduced
  • the value of W t-copper is 1, otherwise 0; when the circuit board product is a photovoltaic board, the value of W p-panel is 1, otherwise 0; in the circuit board product is high frequency
  • the value of W h-fq-board is 1, otherwise it is 0; when the board product is required to meet the IPCIII standard, the value of W IPCIII is 1, otherwise 0; the line width of the product line is less than When the threshold is preset, the value of W L-width is 1, otherwise it is 0;
  • the preset threshold is 3.5 mils.
  • a computer readable storage medium having stored thereon a computer program for performing the steps of the PCB order plus rate prediction method as described above when the program is executed by the processor.
  • a fourth aspect provides a computer device including a memory, a processor, and a computer program stored on the memory and operable on the processor, the processor executing the program to implement a PCB order increase rate prediction as described above The steps of the method.
  • the solution of the present invention described above which is a PCB order file for obtaining a PCB order to be predicted by the increase rate, and determining parameters of the PCB order according to the PCB order file, the parameter including the circuit board product corresponding to the PCB order
  • the circuit board product information predicts the increase rate of the PCB order according to the circuit board product information and the preset increase rate calculation model.
  • FIG. 1 is a schematic flowchart of an implementation process of a PCB order increase rate prediction method according to an embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a PCB order increase rate prediction apparatus according to an embodiment of the present invention.
  • the factors affecting PCB loading rate mainly include two aspects.
  • One aspect is the impact of the scrap rate.
  • certain scrapping conditions will inevitably occur.
  • the reasons for the product's unqualified scrapping include subjective factors and objective factors.
  • the subjective factors mainly refer to the unreasonable design process of the man-made, the mistakes caused by the operation, etc., which can generally trace the responsible person directly.
  • the objective factors are mainly due to the fact that the product requires a large number of processing parameters, complex processing characteristics, high process requirements, equipment processing capacity limitations and environmental uncertainty, which inevitably lead to a certain percentage of product scrapping during the manufacturing process.
  • the more complex the product and the higher the accuracy of the feature the higher the difficulty in making the other conditions are the same, and the higher the scrap rate caused by the objective reasons.
  • the difficulty of fabrication is usually described by the manufacturing parameters (product parameters) of the PCB. The closer to the capability boundary, the higher the difficulty. The boundary beyond the capability may lead to a rapid increase in the scrap rate.
  • the parameter range of one or several features processed in one process directly affects the scrap rate of the process. The more difficult the product is, the higher the scrap rate will be. In order to guarantee delivery, the increase rate will increase accordingly.
  • the rounding up method is needed to satisfy the customer's delivery quantity, which is equivalent to the disguised increase of the additional investment.
  • a PCB order plus rate prediction method is provided. As shown in FIG. 1, the PCB order increase rate prediction method in this embodiment includes the following steps:
  • Step S101 Obtain a PCB order file of a PCB order to be subjected to the increase rate prediction
  • the PCB order file is a line graphic file that can be used to make a circuit board product.
  • Step S102 determining parameters of the PCB order according to the PCB order file, where the parameters include circuit board product information of the circuit board product corresponding to the PCB order;
  • the circuit board product information includes parameter values corresponding to respective parameter items of the circuit board product.
  • Step S103 predicting the increase rate of the PCB order according to the circuit board product information and a preset increase rate calculation model.
  • the prediction of the PCB order increase rate can be realized without manual intervention, which can save labor cost and improve the efficiency and accuracy of the prediction.
  • the parameter information of the parameter items included in the above-mentioned circuit board product information may be determined according to actual needs.
  • the product information of the circuit board includes the number of layers, the number of plate plating times, the thickness of the finished plate, the thickness of the minimum hole wall, the thickness ratio of the through holes, the total number of holes, the total number of processes, and the quantity of delivery.
  • circuit board product information in this embodiment take into account various factors that affect the PCB addition rate, and are comprehensive, and can improve the accuracy of prediction. It should be noted that the circuit board product information may also include only a part of the parameter items mentioned above.
  • Serial number Parameter item Parameter value 1 Number of layers 2 2 Plate plating times 1 3 Finished board thickness 1.6 4 Minimum hole wall copper thickness 20 5 Through hole thickness to diameter ratio 6 6 Total number of holes 21568 7 Total number of processes twenty three 8 quantity of delivery 150 9 Historical yield 94.17% 10 Finished unit area 0.005 11 Whether the picture is plated with copper, nickel and gold 1 12 Whether to plate hard gold 1 13 Is there a golden finger? 0 14 Is there a negative plating? 0
  • the above-mentioned increase rate calculation model is the following formula (1):
  • N layers represents the number of layers
  • T plate represents the number of plate plating
  • T F-plate represents the thickness of the finished plate
  • S ct-hw represents the minimum hole wall thickness
  • R th-dm represents the thickness of the through hole.
  • Diameter ratio N holes indicates the total number of holes
  • N t-processes indicates the total number of flows
  • Q delivery indicates the delivery quantity
  • Y his indicates the historical yield
  • a F-unit indicates the finished unit area
  • W plate1 indicates whether the copper or nickel is plated.
  • W plate2 indicates whether to plate hard gold
  • W chefs indicates whether there is gold finger
  • W n-plate indicates whether there is negative plating
  • W t-copper indicates whether there is thinned copper
  • W p-panel indicates whether it is photoelectric plate
  • W H-fq-board indicates whether it is a high frequency board
  • W IPCIII indicates whether it is required to reach the IPCIII standard
  • W L-width indicates whether the line width spacing is less than the preset threshold
  • N press indicates the number of presses
  • N spells indicates the number of panels.
  • Roundup means rounding up, k 1 , k 2 , k 3 , k 4 , k 5 , k 6 , k 7 , k 8 , k 9 , k 10 , k 11 , k 12 , k 13 , k 14 , k 15 , k 16 , k 17 , k 18 , k 19 and k 20 parameter term coefficients.
  • the preset threshold can be set according to actual needs.
  • the predetermined threshold is 3.5 mils and 1 mil is equal to 25.4 microns.
  • the loading rate calculation model in this embodiment considers various main influencing factors of the PCB loading rate, and based on the scheme of the embodiment, the prediction of the PCB order addition rate can significantly improve the forecasting rate. The accuracy.
  • the addition rate calculation model is not limited to the formula (1).
  • the addition rate calculation model may have different forms.
  • k 1 is 0.3347
  • k 2 is 0.5837
  • k 3 is 0.2654
  • k 4 is 0.0118
  • k 5 is 0.1757
  • k 6 Is 0.00006001
  • k 7 is 0.04282
  • k 8 is 0.0002636
  • k 9 is 0.05532
  • k 10 is 42.07
  • k 11 is 2.377
  • k 12 is 0.828
  • k 13 is 0.6899
  • k 14 is 0.886
  • k 15 is 0.6842
  • k 16 Is 0.2591
  • k 17 is 0.3622
  • k 18 is 0.4906
  • k 19 is 0.4961
  • k 20 is 2.6278;
  • the value of W plate1 is 1, otherwise 0; when the circuit board product is plated with hard gold, the value of W plate2 is 1, otherwise 0; in the line
  • the value of W chefs is 1, otherwise it is 0; when the circuit board product has negative film plating, the value of W n-plate is 1, otherwise 0; in the circuit board product is reduced
  • the value of W t-copper is 1, otherwise 0; when the circuit board product is a photovoltaic board, the value of W p-panel is 1, otherwise 0; in the circuit board product is high frequency
  • the value of W h-fq-board is 1, otherwise it is 0; when the board product is required to meet the IPCIII standard, the value of W IPCIII is 1, otherwise 0; the line width of the product line is less than When the threshold is preset, the value of W L-width is 1, otherwise it is 0;
  • the preset threshold is 3.5 mils.
  • the accuracy of the prediction can be further improved.
  • the units of the above-mentioned finished sheet thickness, minimum hole wall copper thickness, and finished unit area are respectively mm, micrometer, and square millimeter.
  • the step of determining the parameter of the PCB order according to the PCB order file may include: parsing the PCB order file by a CAM (computer Aided Manufacturing) software server, Obtain the parameters of the PCB order.
  • CAM computer Aided Manufacturing
  • the PCB order file may be sent to the CAM software server, and the parameters of the PCB order returned by the CAM software server after parsing the PCB order file are received.
  • the prediction efficiency can be further improved by adopting the scheme of the embodiment.
  • FIG. 2 is a schematic diagram showing the structure of a PCB order increase rate prediction apparatus according to an embodiment of the present invention.
  • the PCB order increase rate prediction apparatus of the present invention includes a file acquisition unit 201, an information analysis unit 202, and a spike ratio prediction unit 203, wherein:
  • a file obtaining unit 201 configured to acquire a PCB order file of a PCB order to be subjected to a rate increase prediction
  • the information analyzing unit 202 is configured to determine, according to the PCB order file, a parameter of the PCB order, where the parameter includes circuit board product information of the circuit board product corresponding to the PCB order;
  • the addition rate prediction unit 203 is configured to predict the increase rate of the PCB order according to the circuit board product information and the preset increase rate calculation model.
  • the circuit board product information includes: number of layers, plate plating times, finished plate thickness, minimum hole wall copper thickness, through hole thickness to diameter ratio, total number of holes, total number of processes, delivery quantity, Historical yield, finished unit area, whether it is plated with copper and nickel, whether it is plated with hard gold, whether there is gold finger, whether there is negative plating, whether there is thin copper, whether it is a photovoltaic board, whether it is a high frequency board, whether it is required to reach IPCIII standard, whether the line width spacing is less than the preset threshold, the number of presses and the number of panels;
  • the increase rate calculation model is the formula (1) as above.
  • k 1 is 0.3347
  • k 2 is 0.5837
  • k 3 is 0.2654
  • k 4 is 0.0118
  • k 5 is 0.1757
  • k 6 is 0.00006001
  • k 7 is 0.04282
  • k 8 is 0.0002636
  • k 9 is 0.05532
  • k 10 is 42.07
  • k 11 is 2.377
  • k 12 is 0.828
  • k 13 is 0.6899
  • k 14 is 0.886
  • k 15 is 0.6842
  • k 16 is 0.2591
  • k 17 is 0.3622
  • k 18 is 0.4906
  • k 19 is 0.4961
  • k 20 is 2.6278;
  • the value of W plate1 is 1, otherwise 0; when the circuit board product is plated with hard gold, the value of W plate2 is 1, otherwise 0; in the line
  • the value of W chefs is 1, otherwise it is 0; when the circuit board product has negative film plating, the value of W n-plate is 1, otherwise 0; in the circuit board product is reduced
  • the value of W t-copper is 1, otherwise 0; when the circuit board product is a photovoltaic board, the value of W p-panel is 1, otherwise 0; in the circuit board product is high frequency
  • the value of W h-fq-board is 1, otherwise it is 0; when the board product is required to meet the IPCIII standard, the value of W IPCIII is 1, otherwise 0; the line width of the product line is less than When the threshold is preset, the value of W L-width is 1, otherwise it is 0;
  • the preset threshold is 3.5 mils.
  • the information analysis unit 202 may parse the PCB order file through the CAM software server to obtain parameters of the PCB order.
  • the description of the PCB order increase rate prediction apparatus provided by the embodiment of the present invention is similar to the description of the above PCB order increase rate prediction method, and has the beneficial effects of the above PCB order plus rate prediction method, in order to save space,
  • an embodiment further provides a computer readable storage medium having stored thereon a computer program that, when executed by the processor, implements the PCB order as described in any one of the above embodiments The steps of the addition rate prediction method.
  • an embodiment further provides a computer device including a memory, a processor, and a computer program stored on the memory and executable on the processor, the processor executing the The steps of the PCB order plus rate prediction method described in any of the above embodiments are implemented at the time of the program.
  • the computer device may be any terminal device including a mobile phone, a tablet computer, a PDA (Personal Digital Assistant), a POS (Point of Sales), an in-vehicle computer, a wearable device, and the like.
  • the program can be stored in a non-volatile computer readable storage.
  • the program may be stored in a storage medium of the computer system and executed by at least one processor in the computer system to implement a flow comprising an embodiment of the methods as described above.
  • the storage medium may be a magnetic disk, an optical disk, a read-only memory (ROM), or a random access memory (RAM).

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Abstract

一种PCB订单加投率预测方法和装置，其方法包括：获取待进行加投率预测的PCB订单的PCB订单文件（S101）；根据所述PCB订单文件确定所述PCB订单的参数，所述参数包括所述PCB订单对应的线路板产品的线路板产品信息（S102）；根据所述线路板产品信息以及预设的加投率计算模型预测所述PCB订单的加投率（S103）。采用上述方法和装置，无需人工干预就可以实现对PCB订单加投率的预测，还可以提升PCB订单加投率预测的效率和准确率。

Description

PCB订单加投率预测方法和装置 技术领域
本发明涉及PCB技术领域，特别是涉及一种PCB订单加投率预测方法和装置。
背景技术
PCB(Printed Circuit Board，印制电路板，又称印刷线路板)行业具有PCB板的客户来源多、订单随机性强的特点，且PCB产品具有个性化强、制作参数和工艺特征多、精度要求高等特点。这些特点导致PCB生产过程中容易出现报废，因此，PCB企业一般会在PCB投料时进行适当的多投，也即加投，用以弥补报废带来的损失。同时，PCB一般不能按照成品板大小直接加工，需要采用拼板的形式，而当交货数量除以生产拼板数不为整数时，需要采用向上取整的方式，这样也会导致加投率的增加。这些需要在预测PCB订单加投率时综合考虑。
传统方式中，加投率主要是由生产调度人员根据经验评定PCB制造的难易程度进行预测，这种方式存在较大的主观性，容易导致预测不准，且预测耗时较长。
发明内容
鉴于此，本发明的目的在于提供一种PCB订单加投率预测方法和装置、一种计算机可读存储介质以及一种计算机设备，无需人工干预就可以实现对PCB订单加投率的预测，且可以提升PCB订单加投率预测的效率和准确率。
第一方面，提供一种PCB订单加投率预测方法，其包括：
获取待进行加投率预测的PCB订单的PCB订单文件；
根据所述PCB订单文件确定所述PCB订单的参数，所述参数包括所述PCB订单对应的线路板产品的线路板产品信息；
根据所述线路板产品信息以及预设的加投率计算模型预测所述PCB订单的 加投率。
结合第一方面，在第一方面的一种可能实现方式中，上述的线路板产品信息包括：层数、板镀次数、成品板厚、最小孔壁铜厚、通孔厚径比、总孔数、总流程数、交货数量、历史良率、成品单元面积、是否图镀铜镍金、是否电镀硬金、是否有金手指、是否有负片电镀、是否有减薄铜、是否为光电板、是否为高频板、是否要求达到IPCIII标准、是否线宽间距小于预设门限值、压合次数和拼板数。
结合第一方面或上述某些可能的实现方式，在第一方面的一种可能实现方式中，上述的加投率计算模型为：
R plus＝(((Roundup((Q delivery*(1-(k 1*N layers+k 2*T plate+k 3*T F-plate+k 4*S ct-hw+k 5*R th-dm+k 6*N holes+k 7*N t-processes-k 8*Q delivery-k 9*Y his+k 10*A F-unit+k 11*W plate1+k 12*W plate2+k 13*W chefs+k 14*W n-plate+k 15*W t-copper+k 16*W p-panel+k 17*W h-fq-board+k 18*W IPCIII+k 19*W L-width+k 20*N press)))/N spells))*N spells)-Q delivery)/Q delivery
其中，R plus表示加投率，N layers表示层数，T plate表示板镀次数，T F-plate表示成品板厚，S ct-hw表示最小孔壁铜厚，R th-dm表示通孔厚径比，N holes表示总孔数，N t-processes表示总流程数，Q delivery表示交货数量，Y his表示历史良率，A F-unit表示成品单元面积，W plate1表示是否图镀铜镍金，W plate2表示是否电镀硬金，W chefs表示是否有金手指，W n-plate表示是否有负片电镀，W t-copper表示是否有减薄铜，W p-panel表示是否为光电板，W h-fq-board表示是否为高频板，W IPCIII表示是否要求达到IPCIII标准，W L-width表示是否线宽间距小于预设门限值，N press表示压合次数，N spells表示拼板数，Roundup表示向上取整，k 1、k 2、k 3、k 4、k 5、k 6、k 7、k 8、k 9、k 10、k 11、k 12、k 13、k 14、k 15、k 16、k 17、k 18、k 19和k 20参数项系数。
结合第一方面或上述某些可能的实现方式，在第一方面的一种可能实现方式中，k 1为0.3347，k 2为0.5837，k 3为0.2654，k 4为0.0118，k 5为0.1757，k 6为0.00006001，k 7为0.04282，k 8为0.0002636，k 9为0.05532，k 10为42.07，k 11为2.377，k 12为0.828，k 13为0.6899，k 14为0.886，k 15为0.6842，k 16为0.2591， k 17为0.3622，k 18为0.4906，k 19为0.4961，k 20为2.6278；
在所述线路板产品图镀铜镍金时，W plate1的值为1，否则为0；在所述线路板产品电镀硬金时，W plate2的值为1，否则为0；在所述线路板产品有金手指时，W chefs的值为1，否则为0；在所述线路板产品有负片电镀时，W n-plate的值为1，否则为0；在所述线路板产品有减薄铜时，W t-copper的值为1，否则为0；在所述线路板产品为光电板时，W p-panel的值为1，否则为0；在所述线路板产品为高频板时，W h-fq-board的值为1，否则为0；在要求所述线路板产品达到IPCIII标准时，W IPCIII的值为1，否则为0；在所述线路板产品线宽间距小于预设门限值时，W L-width的值为1，否则为0；
所述预设门限值为3.5毫英寸。
结合第一方面或上述某些可能的实现方式，在第一方面的一种可能实现方式中，上述的根据所述PCB订单文件确定所述PCB订单的参数包括：通过CAM软件服务端对所述PCB订单文件进行解析处理，获得所述PCB订单的参数。
第二方面，提供一种PCB订单加投率预测装置，其包括：
文件获取单元，用于获取待进行加投率预测的PCB订单的PCB订单文件；
信息分析单元，用于根据所述PCB订单文件确定所述PCB订单的参数，所述参数包括所述PCB订单对应的线路板产品的线路板产品信息；
加投率预测单元，用于根据所述线路板产品信息以及预设的加投率计算模型预测所述PCB订单的加投率。
结合第二方面，在第二方面的一种可能实现方式中，上述的所述线路板产品信息包括：层数、板镀次数、成品板厚、最小孔壁铜厚、通孔厚径比、总孔数、总流程数、交货数量、历史良率、成品单元面积、是否图镀铜镍金、是否电镀硬金、是否有金手指、是否有负片电镀、是否有减薄铜、是否为光电板、是否为高频板、是否要求达到IPCIII标准、是否线宽间距小于预设门限值、压合次数和拼板数；
结合第二方面，在第二方面的一种可能实现方式中，上述的加投率计算模型为：
R plus＝(((Roundup((Q delivery*(1-(k 1*N layers+k 2*T plate+k 3*T F-plate+k 4*S ct-hw+k 5*R th-dm+k 6*N holes+k 7*N t-processes-k 8*Q delivery-k 9*Y his+k 10*A F-unit+k 11*W plate1+k 12*W plate2+k 13*W chefs+k 14*W n-plate+k 15*W t-copper+k 16*W p-panel+k 17*W h-fq-board+k 18*W IPCIII+k 19*W L-width+k 20*N press)))/N spells))*N spells)-Q delivery)/Q delivery
其中，R plus表示加投率，N layers表示层数，T plate表示板镀次数，T F-plate表示成品板厚，S ct-hw表示最小孔壁铜厚，R th-dm表示通孔厚径比，N holes表示总孔数，N t-processes表示总流程数，Q delivery表示交货数量，Y his表示历史良率，A F-unit表示成品单元面积，W plate1表示是否图镀铜镍金，W plate2表示是否电镀硬金，W chefs表示是否有金手指，W n-plate表示是否有负片电镀，W t-copper表示是否有减薄铜，W p-panel表示是否为光电板，W h-fq-board表示是否为高频板，W IPCIII表示是否要求达到IPCIII标准，W L-width表示是否线宽间距小于预设门限值，N press表示压合次数，N spells表示拼板数，Roundup表示向上取整，k 1、k 2、k 3、k 4、k 5、k 6、k 7、k 8、k 9、k 10、k 11、k 12、k 13、k 14、k 15、k 16、k 17、k 18、k 19和k 20参数项系数。
结合第二方面或上述某些可能的实现方式，在第二方面的一种可能实现方式中，k 1为0.3347，k 2为0.5837，k 3为0.2654，k 4为0.0118，k 5为0.1757，k 6为0.00006001，k 7为0.04282，k 8为0.0002636，k 9为0.05532，k 10为42.07，k 11为2.377，k 12为0.828，k 13为0.6899，k 14为0.886，k 15为0.6842，k 16为0.2591，k 17为0.3622，k 18为0.4906，k 19为0.4961，k 20为2.6278；
在所述线路板产品图镀铜镍金时，W plate1的值为1，否则为0；在所述线路板产品电镀硬金时，W plate2的值为1，否则为0；在所述线路板产品有金手指时，W chefs的值为1，否则为0；在所述线路板产品有负片电镀时，W n-plate的值为1，否则为0；在所述线路板产品有减薄铜时，W t-copper的值为1，否则为0；在所述线路板产品为光电板时，W p-panel的值为1，否则为0；在所述线路板产品为高频板时，W h-fq-board的值为1，否则为0；在要求所述线路板产品达到IPCIII标准时，W IPCIII的值为1，否则为0；在所述线路板产品线宽间距小于预设门限值时，W L-width的值为1，否则为0；
所述预设门限值为3.5毫英寸。
第三方面，提供一种计算机可读存储介质，其上存储有计算机程序该程序被处理器执行时实现如上述的PCB订单加投率预测方法的步骤。
第四方面，提供一种计算机设备，包括存储器、处理器及存储在存储器上并可在处理器上运行的计算机程序，所述处理器执行所述程序时实现如上述的PCB订单加投率预测方法的步骤。
根据上述本发明的方案，其是获取待进行加投率预测的PCB订单的PCB订单文件，根据该PCB订单文件确定所述PCB订单的参数，该参数包括所述PCB订单对应的线路板产品的线路板产品信息，根据该线路板产品信息以及预设的加投率计算模型预测所述PCB订单的加投率。采用本发明方案，无需人工干预就可以实现对PCB订单加投率的预测，既可以节约人工成本，也可以提高预测的效率和准确率。
附图说明
图1为本发明实施例中的PCB订单加投率预测方法的实现流程示意图；
图2为本发明实施例中的PCB订单加投率预测装置的组成结构示意图。
具体实施方式
为使本发明的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本发明进行进一步的详细说明。应当理解，此处所描述的具体实施方式仅仅用以解释本发明，并不限定本发明的保护范围。
PCB加投率的影响因素主要包括两方面。一个方面是受报废率的影响，PCB加工过程中不可避免的会出现一定的报废情况，造成产品不合格报废的原因包括主观因素和客观因素。其中主观因素主要指人为的设计工艺的不合理、操作失误等带来的报废，这种一般可以直接追溯责任人。客观因素主要由于产品需要加工参数多、加工特征复杂、工艺要求高、设备加工能力限制以及环境的不 确定等导致加工制作过程中不可避免的出现一定比率的产品报废。显然，产品越复杂、特征精度要求越高，在其他条件相同的情况下制作难度越高，由客观原因导致的报废率也会越高。制作难度通常由PCB板的制造参数(产品参数)来描述，越接近能力边界，难度越高，超越能力边界可能会导致报废率的快速上升。同样，一个工序所加工的一个或几个特征的参数取值范围直接影响该工序的报废率。产品的难度越大，报废率就会越高，为了保障交付，加投率也会相应的提高。另一方面是受拼板的影响，当交货数量除以生产拼板数不为整数时，需要采用向上取整的方式以满足客户交货数量，这样相当于变相的也增加了加投。
在其中一个实施例中，提供一种PCB订单加投率预测方法。如图1所示，本实施例中的PCB订单加投率预测方法包括如下步骤：
步骤S101：获取待进行加投率预测的PCB订单的PCB订单文件；
这里，所述PCB订单文件为能用于制作出线路板产品的线路图形文件。
步骤S102：根据所述PCB订单文件确定所述PCB订单的参数，所述参数包括所述PCB订单对应的线路板产品的线路板产品信息；
这里，所述线路板产品信息包括所述线路板产品的各个参数项对应的参数值。
步骤S103：根据所述线路板产品信息以及预设的加投率计算模型预测所述PCB订单的加投率。
据此，根据上述本实施例的方案，其是在获取待进行加投率预测的PCB订单的PCB订单文件后，根据该PCB订单文件确定所述PCB订单对应的线路板产品的线路板产品信息，根据该线路板产品信息以及预设的加投率计算模型预测所述PCB订单的加投率。采用本实施例方案，无需人工干预就可以实现对PCB订单加投率的预测，既可以节约人工成本，也可以提高预测的效率和准确率。
上述的线路板产品信息具体包括哪些参数项的参数值可以根据实际需要确定。在一个较佳的实施例中，上述的线路板产品信息包括层数、板镀次数、成品板厚、最小孔壁铜厚、通孔厚径比、总孔数、总流程数、交货数量、历史良 率、成品单元面积、是否图镀铜镍金、是否电镀硬金、是否有金手指、是否有负片电镀、是否有减薄铜、是否为光电板、是否为高频板、是否要求达到IPCIII标准、是否线宽间距小于预设门限值、压合次数和拼板数。本实施例中的线路板产品信息所包括的参数项考虑到了对PCB加投率产生影响的各个因素，较为全面，可以提升预测的准确率。需要说明的是，线路板产品信息也可以只包括上述的一部分的参数项。
例如某PCB订单的参数如表1所示：
表1 PCB订单的参数
序号 参数项 参数值
1 层数 2
2 板镀次数 1
3 成品板厚 1.6
4 最小孔壁铜厚 20
5 通孔厚径比 6
6 总孔数 21568
7 总流程数 23
8 交货数量 150
9 历史良率 94.17％
10 成品单元面积 0.005
11 是否图镀铜镍金 1
12 是否电镀硬金 1
13 是否有金手指 0
14 是否有负片电镀 0
15 是否有减薄铜 0
16 是否光电板 0
17 是否高频板 0
18 是否IPCIII标准 0
19 是否线宽间距小于3.5 0
20 压合次数 0
21 拼板数 7
在一个较佳的实施例中，上述的加投率计算模型为如下的公式(1)：
Figure PCTCN2017120102-appb-000001
其中，R plus表示加投率，N layers表示层数，T plate表示板镀次数，T F-plate表示成品板厚，S ct-hw表示最小孔壁铜厚，R th-dm表示通孔厚径比，N holes表示总孔数，N t-processes表示总流程数，Q delivery表示交货数量，Y his表示历史良率，A F-unit表示成品单元面积，W plate1表示是否图镀铜镍金，W plate2表示是否电镀硬金，W chefs表示是否有金手指，W n-plate表示是否有负片电镀，W t-copper表示是否有减薄铜，W p-panel表示是否为光电板，W h-fq-board表示是否为高频板，W IPCIII表示是否要求达到IPCIII标准，W L-width表示是否线宽间距小于预设门限值，N press表示压合次数，N spells表示拼板数，Roundup表示向上取整，k 1、k 2、k 3、k 4、k 5、k 6、k 7、k 8、k 9、k 10、k 11、k 12、k 13、k 14、k 15、k 16、k 17、k 18、k 19和k 20参数项系数。
其中，预设门限值可以根据实际需要设定。较佳地，所述预设门限值为3.5毫英寸，1毫英寸等于25.4微米。
需要说明的是，本实施例中的加投率计算模型考虑了PCB加投率的各种主 要影响因素，基于本实施例的方案进行PCB订单加投率的预测，可以明显提升加投率预测的准确性。但需要说明的是，加投率计算模型也不仅限于公式(1)，例如，在线路板产品信息所包括的参数项不同时，加投率计算模型也可以有不同的形式。
在其中一个较佳的实施例中，在加投率计算模型采用公式(1)时，k 1为0.3347，k 2为0.5837，k 3为0.2654，k 4为0.0118，k 5为0.1757，k 6为0.00006001，k 7为0.04282，k 8为0.0002636，k 9为0.05532，k 10为42.07，k 11为2.377，k 12为0.828，k 13为0.6899，k 14为0.886，k 15为0.6842，k 16为0.2591，k 17为0.3622，k 18为0.4906，k 19为0.4961，k 20为2.6278；
在所述线路板产品图镀铜镍金时，W plate1的值为1，否则为0；在所述线路板产品电镀硬金时，W plate2的值为1，否则为0；在所述线路板产品有金手指时，W chefs的值为1，否则为0；在所述线路板产品有负片电镀时，W n-plate的值为1，否则为0；在所述线路板产品有减薄铜时，W t-copper的值为1，否则为0；在所述线路板产品为光电板时，W p-panel的值为1，否则为0；在所述线路板产品为高频板时，W h-fq-board的值为1，否则为0；在要求所述线路板产品达到IPCIII标准时，W IPCIII的值为1，否则为0；在所述线路板产品线宽间距小于预设门限值时，W L-width的值为1，否则为0；
所述预设门限值为3.5毫英寸。
采用本实施例的方案，可以进一步提升预测的准确率。
此外，上述的成品板厚、最小孔壁铜厚和成品单元面积的单位分别是毫米、微米和平方毫米。
在其中一个实施例中，上述根据所述PCB订单文件确定所述PCB订单的参数的步骤可以包括：通过CAM(computer Aided Manufacturing，计算机辅助制造)软件服务端对所述PCB订单文件进行解析处理，获得所述PCB订单的参数。
具体地，可以将所述PCB订单文件发送给CAM软件服务端，接收CAM软件服务端对所述PCB订单文件进行解析处理后返回的所述PCB订单的参数。
由于CAM软件服务端可以基于PCB订单文件快速解析出PCB订单的参数， 因此，采用本实施例方案，可以进一步提升预测效率。
根据上述实施例中的PCB订单加投率预测方法，本发明还提供一种PCB订单加投率预测装置。图2中示出了本发明实施例的PCB订单加投率预测装置的组成结构示意图。如图2所示，本发明的PCB订单加投率预测装置包括文件获取单元201、信息分析单元202和加投率预测单元203，其中：
文件获取单元201，用于获取待进行加投率预测的PCB订单的PCB订单文件；
信息分析单元202，用于根据所述PCB订单文件确定所述PCB订单的参数，所述参数包括所述PCB订单对应的线路板产品的线路板产品信息；
加投率预测单元203，用于根据所述线路板产品信息以及预设的加投率计算模型预测所述PCB订单的加投率。
在其中一个实施例中，所述线路板产品信息包括：层数、板镀次数、成品板厚、最小孔壁铜厚、通孔厚径比、总孔数、总流程数、交货数量、历史良率、成品单元面积、是否图镀铜镍金、是否电镀硬金、是否有金手指、是否有负片电镀、是否有减薄铜、是否为光电板、是否为高频板、是否要求达到IPCIII标准、是否线宽间距小于预设门限值、压合次数和拼板数；
在其中一个实施例中，所述加投率计算模型为如上的公式(1)。
在其中一个实施例中，k 1为0.3347，k 2为0.5837，k 3为0.2654，k 4为0.0118，k 5为0.1757，k 6为0.00006001，k 7为0.04282，k 8为0.0002636，k 9为0.05532，k 10为42.07，k 11为2.377，k 12为0.828，k 13为0.6899，k 14为0.886，k 15为0.6842，k 16为0.2591，k 17为0.3622，k 18为0.4906，k 19为0.4961，k 20为2.6278；
在所述线路板产品图镀铜镍金时，W plate1的值为1，否则为0；在所述线路板产品电镀硬金时，W plate2的值为1，否则为0；在所述线路板产品有金手指时，W chefs的值为1，否则为0；在所述线路板产品有负片电镀时，W n-plate的值为1，否则为0；在所述线路板产品有减薄铜时，W t-copper的值为1，否则为0；在所述线路板产品为光电板时，W p-panel的值为1，否则为0；在所述线路板产品为高频板时，W h-fq-board的值为1，否则为0；在要求所述线路板产品达到IPCIII标准时，W IPCIII的值为 1，否则为0；在所述线路板产品线宽间距小于预设门限值时，W L-width的值为1，否则为0；
所述预设门限值为3.5毫英寸。
在其中一个实施例中，信息分析单元202可以通过CAM软件服务端对所述PCB订单文件进行解析处理，获得所述PCB订单的参数。
本发明实施例提供的PCB订单加投率预测装置的描述，与上述PCB订单加投率预测方法的描述是类似的，并且具有上述PCB订单加投率预测方法的有益效果，为节约篇幅，不再赘述；因此，以上对本发明实施例提供的PCB订单加投率预测装置中未披露的技术细节，请参照上述提供的PCB订单加投率预测方法的描述。
基于如上所述的实施例，一个实施例中还提供一种计算机可读存储介质，其上存储有计算机程序，该计算机程序被处理器执行时实现如上任意一个实施例中的所述的PCB订单加投率预测方法的步骤。
基于如上所述的实施例，一个实施例中还提供一种计算机设备，该计算机设备包括存储器、处理器及存储在存储器上并可在处理器上运行的计算机程序，所述处理器执行所述程序时实现如上任意一个实施例中的所述的PCB订单加投率预测方法的步骤。该计算机设备可以为包括手机、平板电脑、PDA(Personal Digital Assistant，个人数字助理)、POS(Point of Sales，销售终端)、车载电脑、穿戴式设备等任意终端设备。
本领域普通技术人员可以理解实现上述实施例方法中的全部或部分流程，是可以通过计算机程序来指令相关的硬件来完成，所述的程序可存储于一非易失性的计算机可读取存储介质中，如本发明实施例中，该程序可存储于计算机系统的存储介质中，并被该计算机系统中的至少一个处理器执行，以实现包括如上述各方法的实施例的流程。其中，所述的存储介质可为磁碟、光盘、只读存储记忆体(Read-Only Memory，ROM)或随机存储记忆体(Random Access Memory，RAM)等。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (10)

  1. 一种PCB订单加投率预测方法，其特征在于，包括：
    获取待进行加投率预测的PCB订单的PCB订单文件；
    根据所述PCB订单文件确定所述PCB订单的参数，所述参数包括所述PCB订单对应的线路板产品的线路板产品信息；
    根据所述线路板产品信息以及预设的加投率计算模型预测所述PCB订单的加投率。
  2. 根据权利要求1所述的PCB订单加投率预测方法，其特征在于，所述线路板产品信息包括：层数、板镀次数、成品板厚、最小孔壁铜厚、通孔厚径比、总孔数、总流程数、交货数量、历史良率、成品单元面积、是否图镀铜镍金、是否电镀硬金、是否有金手指、是否有负片电镀、是否有减薄铜、是否为光电板、是否为高频板、是否要求达到IPCIII标准、是否线宽间距小于预设门限值、压合次数和拼板数。
  3. 根据权利要求2所述的PCB订单加投率预设方法，其特征在于，所述加投率计算模型为：
    R plus＝(((Roundup((Q delivery*(1-(k 1*N layers+k 2*T plate+k 3*T F-plate+k 4*S ct-hw
    +k 5*R th-dm+k 6*N holes+k 7*N t-processes-k 8*Q delivery-k 9*Y his+k 10*A F-unit
    +k 11*W plate1+k 12*W plate2+k 13*W chefs+k 14*W n-plate+k 15*W t-copper
    +k 16*W p-panel+k 17*W h-fq-board+k 18*W IPCIII+k 19*W L-width
    +k 20*N press)))/N spells))*N spells)-Q delivery)/Q delivery
    其中，R plus表示加投率，N layers表示层数，T plate表示板镀次数，T F-plate表示成品板厚，S ct-hw表示最小孔壁铜厚，R th-dm表示通孔厚径比，N holes表示总孔数，N t-processes表示总流程数，Q delivery表示交货数量，Y his表示历史良率，A F-unit表示成品单元面积，W plate1表示是否图镀铜镍金，W plate2表示是否电镀硬金，W chefs表示是否有金手指，W n-plate表示是否有负片电镀，W t-copper表示是否有减薄铜，W p-panel表示是否为光电板，W h-fq-board表示是否为高频板，W IPCIII表示是否要求达到IPCIII标准，W L-width表示是否线宽间距小于预设门限值，N press表示压合次数，N spells表示拼板数， Roundup表示向上取整，k 1、k 2、k 3、k 4、k 5、k 6、k 7、k 8、k 9、k 10、k 11、k 12、k 13、k 14、k 15、k 16、k 17、k 18、k 19和k 20参数项系数。
  4. 根据权利要求3所述的PCB订单加投率预设方法，其特征在于：
    k 1为0.3347，k 2为0.5837，k 3为0.2654，k 4为0.0118，k 5为0.1757，k 6为0.00006001，k 7为0.04282，k 8为0.0002636，k 9为0.05532，k 10为42.07，k 11为2.377，k 12为0.828，k 13为0.6899，k 14为0.886，k 15为0.6842，k 16为0.2591，k 17为0.3622，k 18为0.4906，k 19为0.4961，k 20为2.6278；
    在所述线路板产品图镀铜镍金时，W plate1的值为1，否则为0；在所述线路板产品电镀硬金时，W plate2的值为1，否则为0；在所述线路板产品有金手指时，W chefs的值为1，否则为0；在所述线路板产品有负片电镀时，W n-plate的值为1，否则为0；在所述线路板产品有减薄铜时，W t-copper的值为1，否则为0；在所述线路板产品为光电板时，W p-panel的值为1，否则为0；在所述线路板产品为高频板时，W h-fq-board的值为1，否则为0；在要求所述线路板产品达到IPCIII标准时，W IPCIII的值为1，否则为0；在所述线路板产品线宽间距小于预设门限值时，W L-width的值为1，否则为0；
    所述预设门限值为3.5毫英寸。
  5. 根据权利要求1至4之一所述的PCB订单加投率预设方法，其特征在于，所述根据所述PCB订单文件确定所述PCB订单的参数包括：通过CAM软件服务端对所述PCB订单文件进行解析处理，获得所述PCB订单的参数。
  6. 一种PCB订单加投率预测装置，其特征在于，包括：
    文件获取单元，用于获取待进行加投率预测的PCB订单的PCB订单文件；
    信息分析单元，用于根据所述PCB订单文件确定所述PCB订单的参数，所述参数包括所述PCB订单对应的线路板产品的线路板产品信息；
    加投率预测单元，用于根据所述线路板产品信息以及预设的加投率计算模型预测所述PCB订单的加投率。
  7. 根据权利要求6所述的PCB订单加投率预测装置，其特征在于：
    所述线路板产品信息包括：层数、板镀次数、成品板厚、最小孔壁铜厚、 通孔厚径比、总孔数、总流程数、交货数量、历史良率、成品单元面积、是否图镀铜镍金、是否电镀硬金、是否有金手指、是否有负片电镀、是否有减薄铜、是否为光电板、是否为高频板、是否要求达到IPCIII标准、是否线宽间距小于预设门限值、压合次数和拼板数；
    所述加投率计算模型为：
    R plus＝(((Roundup((Q delivery*(1-(k 1*N layers+k 2*T plate+k 3*T F-plate+k 4*S ct-hw
    +k 5*R th-dm+k 6*N holes+k 7*N t-processes-k 8*Q delivery-k 9*Y his+k 10*A F-unit
    +k 11*W plate1+k 12*W plate2+k 13*W chefs+k 14*W n-plate+k 15*W t-copper
    +k 16*W p-panel+k 17*W h-fq-board+k 18*W IPCIII+k 19*W L-width
    +k 20*N press)))/N spells))*N spells)-Q delivery)/Q delivery
    其中，R plus表示加投率，N layers表示层数，T plate表示板镀次数，T F-plate表示成品板厚，S ct-hw表示最小孔壁铜厚，R th-dm表示通孔厚径比，N holes表示总孔数，N t-processes表示总流程数，Q delivery表示交货数量，Y his表示历史良率，A F-unit表示成品单元面积，W plate1表示是否图镀铜镍金，W plate2表示是否电镀硬金，W chefs表示是否有金手指，W n-plate表示是否有负片电镀，W t-copper表示是否有减薄铜，W p-panel表示是否为光电板，W h-fq-board表示是否为高频板，W IPCIII表示是否要求达到IPCIII标准，W L-width表示是否线宽间距小于预设门限值，N press表示压合次数，N spells表示拼板数，Roundup表示向上取整，k 1、k 2、k 3、k 4、k 5、k 6、k 7、k 8、k 9、k 10、k 11、k 12、k 13、k 14、k 15、k 16、k 17、k 18、k 19和k 20参数项系数。
  8. 根据权利要求7所述的PCB订单加投率预设装置，其特征在于：
    k 1为0.3347，k 2为0.5837，k 3为0.2654，k 4为0.0118，k 5为0.1757，k 6为0.00006001，k 7为0.04282，k 8为0.0002636，k 9为0.05532，k 10为42.07，k 11为2.377，k 12为0.828，k 13为0.6899，k 14为0.886，k 15为0.6842，k 16为0.2591，k 17为0.3622，k 18为0.4906，k 19为0.4961，k 20为2.6278；
    在所述线路板产品图镀铜镍金时，W plate1的值为1，否则为0；在所述线路板产品电镀硬金时，W plate2的值为1，否则为0；在所述线路板产品有金手指时，W chefs的值为1，否则为0；在所述线路板产品有负片电镀时，W n-plate的值为1，否则为 0；在所述线路板产品有减薄铜时，W t-copper的值为1，否则为0；在所述线路板产品为光电板时，W p-panel的值为1，否则为0；在所述线路板产品为高频板时，W h-fq-board的值为1，否则为0；在要求所述线路板产品达到IPCIII标准时，W IPCIII的值为1，否则为0；在所述线路板产品线宽间距小于预设门限值时，W L-width的值为1，否则为0；
    所述预设门限值为3.5毫英寸。
  9. 一种计算机可读存储介质，其上存储有计算机程序，其特征在于，该程序被处理器执行时实现如权利要求1-5之一所述的PCB订单加投率预测方法的步骤。
  10. 一种计算机设备，包括存储器、处理器及存储在存储器上并可在处理器上运行的计算机程序，其特征在于，所述处理器执行所述程序时实现如权利要求1-5之一所述的PCB订单加投率预测方法的步骤。
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