WO2018236135A1 - Dispositif de nettoyage de masque et procédé de nettoyage de masque - Google Patents

Dispositif de nettoyage de masque et procédé de nettoyage de masque Download PDF

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Publication number
WO2018236135A1
WO2018236135A1 PCT/KR2018/006937 KR2018006937W WO2018236135A1 WO 2018236135 A1 WO2018236135 A1 WO 2018236135A1 KR 2018006937 W KR2018006937 W KR 2018006937W WO 2018236135 A1 WO2018236135 A1 WO 2018236135A1
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WO
WIPO (PCT)
Prior art keywords
mask
frame
energy
foreign matter
cleaning
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Application number
PCT/KR2018/006937
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English (en)
Korean (ko)
Inventor
박선순
이해룡
김영도
박남규
지성훈
김동훈
홍원의
박영일
Original Assignee
주식회사 다원시스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from KR1020170145587A external-priority patent/KR20180138110A/ko
Application filed by 주식회사 다원시스 filed Critical 주식회사 다원시스
Publication of WO2018236135A1 publication Critical patent/WO2018236135A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K99/00—Subject matter not provided for in other groups of this subclass

Definitions

  • the present invention relates to a cleaning apparatus and a mask cleaning method for a mask, and more particularly to a cleaning system and a mask cleaning method for cleaning a metal mask for an organic light emitting device and a mask, will be.
  • the organic light emitting display device has a high response speed, low power consumption, and self light emission, so there is no problem with the viewing angle, which is advantageous as a moving picture display medium regardless of the size of the device.
  • the organic layer used in the organic light emitting display device emits light by itself, it can be used in an OLED lighting device by applying an electric field to the upper and lower ends of the multi-layer organic film after the entire deposition.
  • OLED lighting is a point light source, while LED light is a point light source.
  • the formation of the organic thin film in the organic light emitting display device and OLED lighting manufacturing process can be broadly classified into a polymer type device using a wet process and a low molecular type device using a deposition process depending on the materials and processes used.
  • a polymer type device using a wet process a low molecular type device using a deposition process
  • the materials of the organic layers other than the light emitting layer are limited, and there is a need to form a structure for inkjet printing on the substrate.
  • a separate metal mask can be used.
  • Such a conventional metal mask for an organic light emitting device and a frame for supporting a mask could be easily contaminated by foreign matter (organic matter, etc.) on the surface.
  • this conventional wet cleaning method can not only cause environmental pollution through the cleaning liquid to be discarded, but also can reduce the life time of the mask by melting the surface of the metal mask in the cleaning liquid, And the cost is increased greatly, and the productivity is decreased.
  • the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide a method of cleaning a mask capable of cleaning with a relatively low energy, So that it is possible to sufficiently clean both the mask and the frame while preventing the deformation and damage of the mask, thereby improving the life of the mask, reducing the cleaning time and cost, thereby greatly improving the productivity,
  • a mask cleaning system and a mask cleaning method which are economical because they can recover foreign substances evaporated by light, are environmentally friendly because they do not generate waste, can be easily applied to existing mask recovery lines, The purpose is to provide.
  • these problems are exemplary and do not limit the scope of the present invention.
  • a cleaning apparatus for a mask comprising: a housing space for accommodating a mask therein; a vacuum environment is formed inside the housing to facilitate removal of foreign matter remaining in the mask A vacuum chamber; A first energy is applied to the mask accommodated in the vacuum chamber so that the foreign matter may be decomposed and separated from the mask by applying a first energy to the foreign matter remaining in the mask in the vacuum environment Device; And applying a second energy to the frame housed in the vacuum chamber so as to remove and separate the foreign matter from the frame by applying a second energy to the foreign matter remaining in the frame supporting the mask in the vacuum environment And a second energy application device.
  • the mask is a fine metal mask (M) for manufacturing an organic light emitting display
  • the first energy application device may include a first energy application device Or a cleaning light irradiating device for generating a first IPL (Intensity Pulse Light) by receiving a first pulsed wave power source having a first pulse application time from a control unit.
  • IPL Intensity Pulse Light
  • the second energy application device may be a plasma generating device installed so as to correspond to the frame so as to remove the foreign matter remaining in the frame by plasma energy.
  • a plasma generating apparatus including: a first electrode unit installed in a vacuum chamber corresponding to a frame to which a first power source is applied; And a second electrode portion that is electrically connected to the frame and to which a second power source is applied or grounded.
  • the first electrode portion or the second electrode portion may have a rectangular ring shape corresponding to the frame.
  • a plasma display apparatus comprising: a plasma display panel including a plasma display panel; And a fourth electrode part provided in the vacuum chamber so as to be spaced apart from the first electrode part by a plasma generating space so as to correspond to the frame.
  • the cleaning apparatus for the mask according to the present invention is characterized in that the cleaning apparatus for the mask is provided in the vacuum chamber, and the mask or the frame is moved to the first position corresponding to the first energy application device or to the second position corresponding to the second energy application device And a mask moving device capable of moving the mask to a predetermined position.
  • the apparatus for cleaning a mask according to the present invention may further comprise a band-pass filter which can be installed in an optical path of the cleaning light and allows light of a first wavelength band to pass therethrough, the first wavelength band being excellent in resolution of the first foreign matter.
  • the first energy application device is installed outside the vacuum chamber together with a first reflector that reflects light energy toward the vacuum chamber, and the second energy application device supplies plasma energy
  • a vacuum pump is installed in the vacuum chamber to form a vacuum environment, and the light energy generated from the first energy application device flows into the mask to irradiate the mask
  • a first transparent window through which the light energy is transmitted may be formed on one side.
  • the apparatus for cleaning a mask according to the present invention may further comprise a cleaning unit for cleaning the inside of the vacuum chamber or between the first transparent window and the mask so that the foreign matter can be trapped on the surface without contaminating the first transparent window, And a recovery panel.
  • the first energy application device is installed inside the vacuum chamber together with a second reflector that reflects light energy in the direction of the mask, and the second reflector is provided inside the vacuum chamber, A band-pass filter or a second transparent window for transmitting the cleaning light may be formed to protect the device.
  • the second energy application device may be an induction heating device provided so as to correspond to the frame so that the foreign matter remaining in the frame can be inductively heated and removed.
  • the second energy application device may be a Joule heating device for applying power to the frame or the circuit layer formed on the frame so that the foreign matter remaining on the frame may be heated by joule heating .
  • the second energy application device may be a laser heating device provided so as to correspond to the frame so that the foreign matter remaining in the frame can be removed by laser heating.
  • a preheating device installed in front of the second energy application device so as to preheat and remove the foreign matter remaining in the frame by a heater before applying the second energy .
  • a cleaning method for a mask including: a housing space for accommodating a mask therein; and a vacuum environment inside the housing for facilitating removal of foreign matter remaining on the mask
  • a frame cleaning step including: a housing space for accommodating a mask therein; and a vacuum environment inside the housing for facilitating removal of foreign matter remaining on the mask
  • the frame cleaning step may be performed simultaneously with the mask cleaning step.
  • a frame preheating step of preheating the frame with a heater before the mask cleaning step it is possible to further include a frame preheating step of preheating the frame with a heater before the mask cleaning step.
  • a cleaning method for a mask including: a housing space for accommodating a mask therein; and a vacuum environment inside the housing for facilitating removal of foreign matter remaining on the mask
  • a mask cleaning step of applying a first energy to the mask held in the vacuum chamber so that the foreign matter can be separated and removed from the mask by applying a first energy to the foreign matter remaining in the mask in the vacuum environment.
  • both the mask and the frame can be sufficiently cleaned, and the deformation and damage of the mask can be prevented.
  • the life of the mask can be improved and the cleaning time and cost can be reduced, Can be greatly improved, and it is possible to recover foreign matter evaporated by the cleaning light, which is economical, environmentally friendly because no waste is generated, and can be easily applied to a conventional mask recovery line, thereby reducing the installation cost .
  • the scope of the present invention is not limited by these effects.
  • FIG. 1 is a cross-sectional view conceptually showing a cleaning apparatus for a mask according to some embodiments of the present invention.
  • Fig. 2 is an enlarged cross-sectional view showing an example of a second energy applying device of the cleaning device of the mask of Fig. 1;
  • FIG. 3 is an enlarged cross-sectional view showing another example of the second energy application device of FIG. 2.
  • FIG. 3 is an enlarged cross-sectional view showing another example of the second energy application device of FIG. 2.
  • FIG. 4 is a cross-sectional view illustrating a frame cleaning mode of a cleaning apparatus for a mask according to some other embodiments of the present invention.
  • FIG. 5 is a cross-sectional view showing a mask cleaning mode of the cleaning apparatus of the mask of FIG.
  • FIG. 6 is a cross-sectional view conceptually showing a cleaning apparatus for a mask according to still another embodiment of the present invention.
  • FIG. 7 is a cross-sectional view conceptually showing a cleaning apparatus for a mask according to still another embodiment of the present invention.
  • FIG. 8 is a cross-sectional view showing an example of a second energy application device of a cleaning apparatus for a mask according to still another embodiment of the present invention.
  • FIG. 9 is a cross-sectional view showing another example of the second energy application device of the cleaning apparatus for the mask according to still another embodiment of the present invention.
  • FIG. 10 is a cross-sectional view showing another example of a second energy application device of a cleaning apparatus for a mask according to still another embodiment of the present invention.
  • FIG. 11 is a cross-sectional view illustrating a preheat mode of a cleaning apparatus for a mask in accordance with some further embodiments of the present invention.
  • FIG. 12 is a cross-sectional view showing a frame cleaning mode or a mask cleaning mode of the cleaning apparatus of the mask of Fig.
  • FIG. 13 is a flow chart illustrating a method of cleaning a mask in accordance with some embodiments of the present invention.
  • FIG. 14 is a flow chart illustrating a method of cleaning a mask according to some alternative embodiments of the present invention.
  • Figure 15 is a flow chart illustrating a method of cleaning a mask in accordance with some further embodiments of the present invention.
  • 16 is an exploded perspective view of a part showing an induction heating apparatus of a cleaning apparatus for a mask according to still another embodiment of the present invention.
  • Fig. 17 is a perspective view of parts assembly of the induction heating apparatus of the cleaning apparatus of the mask of Fig. 16; Fig.
  • FIG. 18 is a sectional view of the induction heating apparatus of the cleaning apparatus of the mask of Fig.
  • FIG. 19 is an exploded perspective view of a part showing an induction heating apparatus of a cleaning apparatus for a mask according to still another embodiment of the present invention.
  • Fig. 20 is a part assembly perspective view of the induction heating apparatus of the cleaning apparatus of the mask of Fig. 19; Fig.
  • Fig. 21 is a sectional view of the induction heating apparatus of the cleaning apparatus of the mask of Fig. 20;
  • FIG. 22 is a cross-sectional view showing a frame cleaning mode of a cleaning apparatus for a mask according to still another embodiment of the present invention.
  • FIG. 23 is a cross-sectional view showing the mask cleaning mode of the cleaning apparatus of the mask of Fig.
  • FIG. 24 is a cross-sectional view showing a cleaning apparatus for a mask according to still another embodiment of the present invention.
  • 25 is a cross-sectional view showing a cleaning apparatus for a mask according to still another embodiment of the present invention.
  • Figs. 26-37 are cross-sectional views showing various examples of trays of a cleaning apparatus for a mask according to still another embodiment of the present invention. Fig.
  • Fig. 1 is a cross-sectional view conceptually showing a cleaning apparatus 100 of a mask according to some embodiments of the present invention.
  • Fig. 2 is a cross-sectional view of an example of a second energy applying apparatus E2 of the cleaning apparatus 100 of the mask of Fig. Fig.
  • a cleaning apparatus 100 of a mask includes a vacuum chamber 10, a first energy application device E1 and a second energy application device E2).
  • the vacuum chamber 10 has a receiving space for accommodating therein a mask M and a frame F for supporting the mask M, It may be a kind of box-like structure which can be sealed in which a vacuum environment is formed inside the mask M and a foreign matter 1 such as an organic substance or an inorganic substance remaining in the frame F is easily removed.
  • the vacuum chamber 10 may be provided with a vacuum pump P so that a vacuum environment can be formed therein.
  • the vacuum chamber 10 is not limited to the drawings.
  • various gates and doors may be formed to allow the mask M to enter and exit.
  • Various types of process chambers, buffer chambers, and load lock chambers can be connected.
  • the mask M and the frame F may be fine metal masks or open masks for manufacturing organic electroluminescence display devices.
  • the mask M and the frame F may be made of a metal mask made of an invar material used for depositing an organic material on a substrate for an organic light- Lt; / RTI >
  • the mask M and the frame F are fine metal masks
  • the mask M may be a metal plate or a metal thin film having a relatively thin thickness on which a fine pattern is formed
  • the frame F may be a framed frame of a relatively thick thickness that is adhered or welded to the rim portion of the mask M so that the mask M can be firmly fixed without being sagged.
  • a penetrating window may be formed on all or a part of the mask M, and the frame F may be integrally formed with the mask M Or may be a framed frame that is bonded to the mask (M).
  • the mask M being omitted or the frame F being thinned.
  • the mask M may be formed of a very thin sheet-like material, such as an organic material or a small amount of an inorganic substance, which is inevitably left on the surface after the deposition process, Lt; / RTI > At this time, a frame F in the form of a square ring capable of supporting the mask M can be installed so that the mask M can maintain sufficient strength and durability.
  • FIG. 1 illustrates a mask M having a square ring-shaped frame F, the mask M and the frame F are not limited to those shown in the drawings, and all of various types of frames can be applied.
  • the thickness of the frame F is generally several hundreds to several thousands of micrometers and is much thicker than several micrometers, which is the thickness of the mask M, the foreign matter 1 remaining on the frame F is removed It can take a lot more energy.
  • the thickness of the mask M is very thin, so that when the excessive energy is applied, the mask M may easily be thermally deformed, broken or burned.
  • the first energy application device E1 may apply a relatively low level of energy to clean the mask M, and the second energy application device E2 may relatively It is possible to clean the frame F by applying a high level of energy.
  • the first energy application device E1 may decompose the foreign matter 1 from the mask M by applying a first energy to the foreign matter 1 remaining in the mask M in the vacuum environment, And an energy generating device for applying a first energy to the mask M accommodated in the vacuum chamber 10 so as to be separated and removed.
  • the first energy application device E1 may apply a first energy to the first lamp LAMP1 to remove the foreign matter remaining in the mask M, And may be a cleaning light irradiating device 20 for generating a first IPL (Intensity Pulse Light) by receiving a first pulsed wave power source having an intensity V1 or a first pulse applying time T1 from a control unit.
  • IPL Intensity Pulse Light
  • the first IPL may include light in a wavelength band optimized according to the type of the foreign matter 1, and may include light in an ultraviolet ray region, for example.
  • the present invention is not limited to this, and may include light having a broad wavelength such as visible light and infrared light.
  • the first energy application device E1 may be configured to remove the foreign matter 1 such as the organic matter from the mask M by, for example, oxygen, a hydrogen atom, a molecule or an ion
  • the mask M (1) contained in the vacuum chamber 10 can be decomposed and separated into a first 1-1 material (1-1) and a 1-2 material (1-2) such as a carbon atom,
  • the cleaning liquid L can be irradiated to the cleaning liquid L.
  • a xenon flashlight may have a bandwidth of 200 to 1100 nm, and a band-pass filter or the like may be used to selectively use only light of a desired area.
  • the power applied to the xenon lamp may be either a continuous form power or a pulsed form power.
  • cleaning light L may be entirely irradiated over the entire area of the mask M, or may be irradiated in a scanning process while relatively moving the mask M in a line beam manner It is possible.
  • the cleaning light irradiating device 20 includes a first reflector R1 for reflecting the cleaning light L in the direction of the vacuum chamber 10, As shown in FIG.
  • the cleaning light irradiating device 20 When the cleaning light irradiating device 20 is installed outside the vacuum chamber 10, the cleaning light irradiating device can be easily repaired, replaced, managed and operated, and various heat generated from the device can be easily discharged to the outside .
  • the vacuum chamber 10 is configured to transmit the cleaning light L to one side so that the cleaning light L of the cleaning light irradiation device 20 flows into the mask M, A first transparent window 11 may be formed.
  • the first transparent window 11 may be formed of various transparent materials such as quartz, glass, and sapphire, which can pass the cleaning light L while maintaining vacuum or airtightness in the vacuum chamber 10.
  • the first reflector R1 can minimize an optical loss by applying an IPL (Intense Pulse Light) reflector, that is, an advanced optical design and a skilled optical surface processing technique, It is possible to secure a uniform energy density of 10% or more, to secure a high energy density of 10 J / cm 2 or more, to obtain certification, to install in a narrow space, It is also possible to optimize the process environment according to the cleaning conditions.
  • IPL Intelligent Pulse Light
  • a first lamp LAMP1 may be applied to the cleaning light irradiating device 20 so that the foreign matter 1 remaining on the mask M can be removed.
  • the first lamp LAMP1 may include various lamps capable of generating light energy of various shapes and wavelengths capable of decomposing the foreign matter 1 such as a xenon lamp.
  • the second energy application device E2 may be configured to apply a second energy to the foreign matter 1 remaining in the frame F supporting the mask M in the vacuum environment, May be an energy generating device for applying a second energy to the frame F accommodated in the vacuum chamber 10 so that the foreign substance 1 can be separated and removed from the frame F by applying energy .
  • the second energy application device E2 may be configured to correspond to the frame F so as to remove the foreign matter 1 remaining in the frame F with plasma energy, And may be a plasma generating device 30 to be installed.
  • the plasma generator 30 includes a first electrode unit 31 installed in the vacuum chamber 10 to correspond to the frame F, to which a first power source is applied, And a second electrode portion 32 electrically connected to the frame F and to which a second power source is applied or grounded.
  • a plasma (PM) may be generated between the frame (F) in which a potential difference is formed due to the first electrode portion (31) and the second electrode portion (32)
  • the foreign substances 1 remaining in the frame F can be disassembled and removed.
  • the first electrode unit 31 or the second electrode unit 32 may be formed in a square shape corresponding to the frame F so as to correspond to the frame F formed in a square ring shape, Ring shape.
  • the first energy application device E1 can apply a relatively low level of light energy to clean the mask M
  • the second energy application device E2 can apply a relatively high level of plasma energy So that the frame F can be cleaned.
  • both of the mask M and the frame F are sufficiently cleaned, and at the same time, the deformation and damage of the mask M are prevented, and the life of the mask M can be improved, And it is economical because it can recover foreign materials evaporated by the cleaning light, and it is environmentally friendly because no waste is generated, and it can be easily applied to existing mask recovery line, so that the installation cost can be reduced have.
  • a cleaning apparatus 100 for a mask may be installed in an optical path of the cleaning light L, And a band-pass filter (FT1) for passing light of a first wavelength band with excellent resolution.
  • FT1 band-pass filter
  • the mask cleaning apparatus 100 can suppress the damage of the mask M by using the band-pass filter FT1 and reduce the foreign matter 1 at a high resolution wavelength Band light can be selectively used.
  • the band-pass filter FT1 is applied with a UV band-pass filter for selecting and passing only the wavelength of the ultraviolet band having a better resolution of the foreign matter 1 than the wavelength of the infrared band causing the thermal deformation of the mask M .
  • a UV band-pass filter for selecting and passing only the wavelength of the ultraviolet band having a better resolution of the foreign matter 1 than the wavelength of the infrared band causing the thermal deformation of the mask M .
  • wavelengths in a wide variety of bands can be selectively utilized.
  • the first band-pass filter FT1 passes light in the infrared band or near infrared band, which has excellent resolution for foreign substances for red electroluminescence, The cleaning efficiency can be improved.
  • the present invention is not limited to this, and various types of band-pass filters for passing light of various types can be applied.
  • the first energy application device E1 includes a first reflector R1 that reflects light energy toward the vacuum chamber 10, and a second reflector R1 that reflects light energy toward the vacuum chamber 10, And the second energy application device E2 is installed inside the vacuum chamber 10 so as to generate plasma energy and the vacuum chamber 10 forms a vacuum environment
  • the first energy application device E1 is provided with a vacuum pump P, and the first energy application device E1 supplies the light energy to the mask M, A window 11 may be formed.
  • FIG. 3 is an enlarged cross-sectional view showing another example of the second energy application device E2 of FIG. 2.
  • FIG. 3 is an enlarged cross-sectional view showing another example of the second energy application device E2 of FIG. 2.
  • the plasma generating device 30 may be disposed inside the vacuum chamber 10 so as to correspond to the frame F as another example of the second energy applying device E2 of FIG.
  • plasma may be generated between the third electrode unit 33 and the fourth electrode unit 34, and foreign substances 1 remaining in the frame F by the plasma PM may be generated, Can be decomposed and removed.
  • FIG. 4 is a cross-sectional view illustrating a frame cleaning mode of a cleaning apparatus 200 of a mask according to some other embodiments of the present invention
  • FIG. 5 is a cross-sectional view illustrating a mask cleaning mode of the cleaning apparatus 200 of the mask of FIG. 4 .
  • a cleaning apparatus 200 for a mask is provided in the vacuum chamber 10, and the mask M and the frame F ) To a second position corresponding to the first energy application device (E2) at a first position corresponding to the second energy application device (E2) .
  • the mask moving device 40 may be configured to move the mask M or the cleaning light L to irradiate the mask M with the cleaning light L generated in the cleaning light irradiation device,
  • various conveying devices, belt devices, roller devices, transfer robots, transfer lines, and conveyance lines that can move objects by using motors, linear motors, power transmission devices, hydraulic / pneumatic cylinders And the like can be applied.
  • the mask M and the frame F are moved in the first position by the second energy application device E2 to the frame F
  • the first energy application device E1 applies the mask M and the frame F at the second position in the mask cleaning mode as shown in Fig. It can be cleaned by the second order.
  • the frame cleaning mode is performed, and then the mask cleaning mode is performed, thereby minimizing the influence of the foreign matter (1) left on the frame (F) cleaning on the mask (M).
  • FIG. 6 is a cross-sectional view conceptually showing a cleaning apparatus 300 for a mask according to still another embodiment of the present invention.
  • the mask cleaning apparatus 300 is characterized in that the foreign matter 1 is trapped on the surface without contaminating the first transparent window 11 And a foreign matter collecting panel 12 installed inside the vacuum chamber 10 or between the first transparent window 11 and the mask M so as to be recovered.
  • the foreign material collecting panel 12 is provided with a cooling device so that the foreign substances 1 can be cold trapped while being condensed on a cold surface.
  • various types of trap devices can be applied.
  • FIG. 7 is a cross-sectional view conceptually showing a cleaning apparatus 400 for a mask according to still another embodiment of the present invention.
  • the first energy application device E1 of the cleaning apparatus 400 of the mask includes a second reflector (not shown) for reflecting light energy in the direction of the mask
  • the second reflector R2 is disposed inside the vacuum chamber 10 together with the first reflector R2 and the second reflector R2 so as to transmit the cleaning light L FT2 or a second transparent window 13 may be formed.
  • FIG 8 is a cross-sectional view showing an example of a second energy application device E2 of a cleaning device for a mask according to still another embodiment of the present invention.
  • the second energy application device E2 of the cleaning device for the mask according to still another embodiment of the present invention further comprises a second energy application device E2 for heating the foreign matter 1 remaining on the frame F, And an induction heating device 50 installed in correspondence with the frame F so as to be removed.
  • the induction heating apparatus 50 of FIG. 8 can control heating temperature and time more precisely, unlike plasma, but can be applied only when all or at least a part of the frame F is a material capable of induction heating have.
  • the first energy application device E1 can apply a relatively low level of light energy to clean the mask M
  • the second energy application device E2 can apply a relatively high level of induction heating Energy can be applied to clean the frame (F).
  • FIG. 9 is a cross-sectional view showing another example of a second energy application device E2 of a cleaning device for a mask according to still another embodiment of the present invention.
  • the second energy application device E2 of the cleaning device for the mask is configured to apply the foreign matter 1 remaining on the frame F to the joule heating (60) for applying power to the frame (F) or the circuit layer (C) formed on the frame (F) so that the frame (F) can be removed.
  • the joule heating apparatus 60 of FIG. 9 can control heating temperature and time more precisely, unlike plasma, but can be applied only when the whole or at least a part of the frame F is a material capable of resistance heating have.
  • the first energy application device E1 can apply a relatively low level of light energy to clean the mask M
  • the second energy application device E2 can apply a relatively high level of Joule heating Energy can be applied to clean the frame (F).
  • FIG. 10 is a sectional view showing still another example of a second energy application device E2 of a cleaning device for a mask according to still another embodiment of the present invention.
  • the second energy applying device E2 of the cleaning device for the mask according to still another embodiment of the present invention further comprises a second energy applying device E2 for heating the foreign matter 1 remaining on the frame F by laser heating And a laser heating device 70 installed in correspondence with the frame F so as to be removed.
  • the laser heating apparatus 70 of FIG. 10 can control heating temperature and time more precisely, unlike plasma.
  • the first energy application device E1 can clean the mask M by applying a relatively low level of light energy
  • the second energy application device E2 can apply a relatively high level of laser energy So that the frame F can be cleaned.
  • FIG. 11 is a cross-sectional view showing a preheat mode of a cleaning apparatus 500 of a mask according to some further embodiments of the present invention
  • Fig. 12 is a cross-sectional view showing a frame cleaning mode of the cleaning apparatus 500 of the mask of Fig. Fig.
  • a cleaning apparatus 500 for a mask may further include a cleaning unit (not shown) And a preliminary heating device 80 installed in front of the second energy application device E2 so that the foreign substance 1 can be preheated by the heater H and removed.
  • the heater H can be applied to various types of heaters.
  • the electrothermal type heater and the photothermal type heater but also the plasma heater described above, the induction heating heater, the Joule heating heater, All of the heaters can be applied.
  • the foreign matter 1 remaining in the frame F which is relatively thick and difficult to be heated, and which is difficult to decompose the foreign matter 1, is preliminarily ,
  • the mask M and the frame F are moved using the mask moving device 40 as shown in FIG. 12, and then the formal mask cleaning and the frame cleaning are performed simultaneously or sequentially The cleaning ability and efficiency can be further improved.
  • FIG. 13 is a flow chart illustrating a method of cleaning a mask in accordance with some embodiments of the present invention.
  • a cleaning method of a mask is characterized in that a receiving space is formed in which a mask M can be received, (S1) for receiving the mask (M) and a frame (F) for supporting the mask (M) with a vacuum chamber (10) in which a vacuum environment is formed to facilitate removal of the foreign matter );
  • the first energy is applied to the foreign matter 1 remaining in the mask M in the vacuum environment to decompose and separate the foreign matter 1 from the mask M,
  • FIG. 14 is a flow chart illustrating a method of cleaning a mask according to some alternative embodiments of the present invention.
  • the cleaning method of the mask according to some other embodiments of the present invention is characterized in that before the above-described mask cleaning step S2, the frame F is preheated by the heater H And a frame preliminary heating step (S4).
  • the frame cleaning step (S3) and the mask cleaning step (S2) may be performed at the same time.
  • Figure 15 is a flow chart illustrating a method of cleaning a mask in accordance with some further embodiments of the present invention.
  • the cleaning method of a mask is characterized in that a receiving space for accommodating a mask M is formed therein, A vacuum chamber receiving step S1 for receiving the mask M and the frame F supporting the mask M with a vacuum chamber 10 in which a vacuum environment is formed so as to facilitate removal of the foreign matter 1; ; The second energy is applied to the foreign matter 1 remaining in the frame F supporting the mask M in the vacuum environment so that the foreign matter 1 can be separated and removed from the frame F A frame cleaning step (S3) of applying a second energy to the frame (F) received in the vacuum chamber (10) so that the second energy is applied; And applying a first energy to the foreign matter (1) remaining in the mask (M) in the vacuum environment to decompose and separate the foreign matter (1) from the mask (M) (S2) for applying a first energy to the mask (M) accommodated in the mask (M).
  • the frame cleaning step (S3) is performed, and then the mask cleaning step (S2) is performed, which affects the mask (M) of the remaining foreign substances (1) Can be minimized.
  • Fig. 16 is an exploded perspective view showing the induction heating apparatus 51 of the cleaning apparatus 600 of the mask according to still another embodiment of the present invention
  • Fig. 17 is a perspective view of the induction heating apparatus of the cleaning apparatus of Fig. 16
  • Fig. 18 is a cross-sectional view of the induction heating apparatus of the cleaning apparatus of the mask of Fig. 17; Fig.
  • an induction heating apparatus 51 of a cleaning apparatus 600 for a mask is characterized in that the first energy application device E1 is a device An IPL irradiating device (21) for generating an IPL (Intensity Pulse Light) so as to remove the foreign matter (1) remaining on a mask (M), the second energy applying device (E2) And an induction heating device 51 installed to correspond to the frame F so that the foreign matter 1 remaining in the frame F can be removed by induction heating.
  • the first energy application device E1 is a device An IPL irradiating device (21) for generating an IPL (Intensity Pulse Light) so as to remove the foreign matter (1) remaining on a mask (M), the second energy applying device (E2)
  • an induction heating device 51 installed to correspond to the frame F so that the foreign matter 1 remaining in the frame F can be removed by induction heating.
  • the induction heating apparatus 51 includes an upper surface corresponding coil 52 corresponding to the upper surface Fa of the frame F and a lower surface corresponding to the upper surface corresponding to the upper surface Fa of the frame F.
  • An upper surface core 53 formed to surround an upper portion and a side portion of the upper surface corresponding coil 52 so that the induced electromotive force generated in the coil 52 can be concentrated in the direction of the upper surface Fa of the frame F .
  • the coil 52 is made of a conductive material through which a current flows so as to generate electromagnetic force for induction heating
  • the core 53 is made of silicon (Si) so as to concentrate the electromagnetic force for induction heating in the direction of the frame F
  • Si silicon
  • FIG. 19 is a fragmentary exploded perspective view showing an induction heating apparatus 51 of a cleaning apparatus 700 of a mask according to still another embodiment of the present invention
  • Fig. 21 is a sectional view of the induction heating apparatus 51 of the cleaning apparatus 700 of the mask of Fig. 20, and Fig.
  • an induction heating apparatus 51 of a cleaning apparatus 700 for a mask includes an inner inclined surface Fb of the frame F,
  • the upper surface of the inclined plane corresponding coil 54 and the side surfaces of the inclined surface corresponding coil 54 are arranged such that the induced electromotive force generated in the corresponding inclined surface corresponding coil 54 and the inclined surface corresponding coil 54 can be concentrated in the direction of the inclined surface Fb of the frame F.
  • an inclined surface core 55 that is formed in a shape that surrounds the surface of the substrate.
  • the upper surface core 53 and the inclined surface core 55 are used It is possible to concentrate the upper surface of the frame F in the direction of the slope and induce heating of the relatively thick frame F at a precise temperature instantaneously and efficiently while minimizing the influence of the sensitive mask M, It is possible to remove the foreign matter (1) remaining on the surface (F).
  • Fig. 22 is a cross-sectional view showing a frame cleaning mode of the cleaning apparatus 800 of the mask according to still another embodiment of the present invention
  • Fig. 23 is a sectional view showing the mask cleaning mode of the cleaning apparatus 800 of the mask of Fig. to be.
  • the vacuum chamber 10 of the cleaning apparatus 800 of the mask is configured such that the frame F is heated in a first position .
  • the induction heating apparatus (51) is installed in front of the mask moving apparatus (40) so that the mask (M) can be irradiated with IPL at the second position, and the IPL irradiating apparatus (21) Can be installed.
  • the frame F in the frame cleaning mode, can be induction heated in the first position, and then, in the mask cleaning mode, as shown in Fig. 23, (40) so that the mask (M) can be IPL irradiated at the second position.
  • FIG. 24 is a cross-sectional view showing a cleaning apparatus 900 of a mask according to still another embodiment of the present invention.
  • the vacuum chamber 10 of the cleaning apparatus 900 of the mask is characterized in that the frame F and the mask M are arranged in a first position
  • the IPL irradiating device 21 may be installed inside the induction heating device 51 so that the frame F is induction heated and the mask M is irradiated with IPL.
  • the frame M can be IPL irradiated while the frame F is induction heated at the first position.
  • 25 is a cross-sectional view showing a cleaning apparatus 1000 for a mask according to still another embodiment of the present invention.
  • a first energy application device E1 of a cleaning apparatus 1000 for a mask may be configured such that the foreign matter 1 remaining on the mask M And the second energy application device E2 is configured to apply the foreign matter 1 remaining on the frame F to the first induction heating device 51-1, And a second induction heating apparatus 51-2 provided so as to correspond to the frame F so as to be able to be removed by induction heating.
  • the frame F and the mask M can be individually inductively heated by using two induction heating apparatuses.
  • the frame F which is relatively thick and strong, And a weak induction magnetic field may be formed in the mask M having a relatively thin and thin material.
  • Figs. 26-37 are cross-sectional views showing various examples of a tray 90 of a cleaning apparatus for a mask according to still another embodiment of the present invention.
  • a cleaning apparatus for a mask includes a tray 90 for supporting a lower surface of the frame F, and a first lamp LAMP1 (91) provided above the tray (90) so that the foreign substance (1) separated from the frame (F) and the mask (M) can be trapped on the surface by the first foreign substance collecting panel .
  • the mask M and the frame F can be moved while being supported by a separate tray 90, and the foreign substances evaporated during cleaning can be collected in the first foreign material collecting panel 91 and recovered .
  • a tray 90 of a cleaning apparatus for a mask is mounted on the frame F by a second lamp LAMP2 installed above, And a second foreign material collecting panel 92 may be installed on the lower portion of the tray 90 so that the foreign matter separated from the mask M may be trapped on the surface and recovered.
  • the mask M and the frame F can be moved while being supported by a separate tray 90, and foreign matter evaporated during cleaning can be transferred to the first foreign matter collecting panel 91 and the second foreign matter And can be collected in the recovery panel 92 and recovered.
  • At least one magnetic body MG may be provided between the foreign matter collecting panel 91 and the tray 90.
  • the frame F, the tray 90, the first foreign material collecting panel 91, and the tray 90 can be firmly fixed temporarily using the magnetic force of the magnetic body MG.
  • the tray 90 may include an upper tray 90-1 and a lower tray 90-2 which is engaged with the upper tray 90-1.
  • At least one magnetic body MG (1) is interposed between the upper tray 90-1 and the lower tray 90-2 so as to temporarily fix the upper tray 90-1 and the lower tray 90-2, Can be installed.
  • the upper tray 90-1 and the lower tray 90-2 can be firmly fixed temporarily using the magnetic force of the magnetic body MG.
  • the upper tray 90-1 and the lower tray 90-2 can be temporarily fixed so that the upper tray 90-1 and the lower tray 90-2 can temporarily be fixed instead of the above-described magnetic body MG, -1) and a clamp CL may be installed on the lower tray 90-2.
  • the upper tray 90-1 and the lower tray 90-2 can be firmly and temporarily fixed using the clamp CL.
  • the tray 90 may be mounted on the upper tray 90-1 so that the first foreign material collecting panel 91 does not fall down even if the tray 90 is inverted,
  • a swing type clamp SC may be installed in the upper tray 90-1 so as to temporarily fix the lower tray 91.
  • the swing type clamp SC is provided with a rotating rod or a swinging finger protruding in the bottom direction of the first foreign material collecting panel 91 at the end of the rotating shaft.
  • various types of pivoting members are applied .
  • a thermal diffusion plate 93 is provided between the tray 90 and the frame F to generate heat in the frame F and the mask M during cleaning, Thermal stress can be minimized by rapidly discharging the heat energy to the outside.
  • the first foreign material collecting panel 91 is formed such that a portion A1 corresponding to the frame F is formed with a first thickness T1, and the mask M may be formed with a second thickness T2 that is thicker than the first thickness T1 so that the strength of the cleaning light irradiated on the frame F can be made relatively strong, M can be relatively weakened.
  • the first foreign material collecting panel 91 may be formed by coating a light amount correction film 94 having a low light transmittance on the portion A2 corresponding to the mask M Or the first foreign material collecting panel 91 is formed with a first film 95 having a high light transmittance at a portion A1 corresponding to the frame F and the first film 95 corresponding to the mask M
  • the intensity of the cleaning light irradiated on the frame F can be made relatively strong and the intensity of the cleaning light irradiated on the mask M can be increased It can be relatively weak.
  • the first foreign material collecting panel 91 is formed with a first pattern 96 having a high light transmittance at a portion A1 corresponding to the frame F (see FIG. 35)
  • a second pattern 98 having a low light transmittance may be formed at a portion corresponding to the mask M.
  • the intensity of the cleaning light irradiated on the frame F can be made relatively strong, and the intensity of the cleaning light irradiated on the mask M can be relatively weakened.
  • the first foreign material collecting panel 91 includes a substrate 91-1 made of a quartz material and a foreign matter recovering film 91 formed on the substrate 91-1 -2).
  • the contamination of the substrate 91-1 can be prevented and used semi-permanently, and the contaminated foreign matter recovery film 91-2 can be used after being repeatedly used and then replaced with a new one.
  • the first foreign material collecting panel 91 is a form in which the above-described substrate 91-1 is omitted, and the foreign substance collecting panel
  • This foreign matter recovery film 99 may be used after being repeatedly used, and then removed and replaced with a new one.
  • both the mask and the frame can be sufficiently cleaned, and the deformation and damage of the mask can be prevented.
  • the life of the mask can be improved and the cleaning time and cost can be reduced, Can be greatly improved, and the evaporated foreign substance can be recovered by the cleaning light.
  • it is economical, the waste is not generated and is environmentally friendly, and it can be easily applied to the conventional mask recovery line.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Cleaning In General (AREA)

Abstract

La présente invention concerne un système de nettoyage de masque et un procédé de nettoyage de masque qui peuvent éliminer des substances étrangères restant sur la surface d'un masque métallique pour un dispositif électroluminescent organique et peuvent comprendre : une chambre à vide dans laquelle un environnement sous vide est formé; un premier dispositif d'application d'énergie pour appliquer une première énergie aux substances étrangères restant sur le masque dans l'environnement sous vide, de façon à dissoudre et séparer les substances étrangères du masque, de sorte à les éliminer; et un second dispositif d'application d'énergie pour appliquer une seconde énergie à des substances étrangères restant sur un cadre supportant le masque dans l'environnement sous vide, de façon à dissoudre et séparer les substances étrangères du cadre, de sorte à les éliminer.
PCT/KR2018/006937 2017-06-20 2018-06-20 Dispositif de nettoyage de masque et procédé de nettoyage de masque WO2018236135A1 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR20170078073 2017-06-20
KR10-2017-0078073 2017-06-20
KR10-2017-0145587 2017-11-02
KR1020170145587A KR20180138110A (ko) 2017-06-20 2017-11-02 마스크의 세정 장치 및 마스크 세정 방법
KR10-2018-0069694 2018-06-18
KR1020180069694A KR102113564B1 (ko) 2017-06-20 2018-06-18 마스크의 세정 장치 및 마스크 세정 방법

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WO2018236135A1 true WO2018236135A1 (fr) 2018-12-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020239193A1 (fr) * 2019-05-24 2020-12-03 Applied Materials, Inc. Appareil de traitement thermique, système de traitement de substrat et procédé de traitement d'un substrat

Citations (5)

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Publication number Priority date Publication date Assignee Title
US5413664A (en) * 1990-05-09 1995-05-09 Canon Kabushiki Kaisha Apparatus for preparing a semiconductor device, photo treatment apparatus, pattern forming apparatus and fabrication apparatus
KR20090002784A (ko) * 2007-07-04 2009-01-09 주식회사 아이엠티 건식세정장치 및 방법
KR20100101537A (ko) * 2009-03-09 2010-09-17 가부시키가이샤 히다치 하이테크놀로지즈 마스크부재의 클리닝장치 및 클리닝방법 및 유기 ｅｌ 디스플레이
KR20150105814A (ko) * 2014-03-10 2015-09-18 주식회사 코디에스 마스크 세정 장치 및 마스크 세정 방법
KR20150121473A (ko) * 2014-04-21 2015-10-29 주식회사 케이씨텍 분사부 및 이를 구비하는 기판 세정장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5413664A (en) * 1990-05-09 1995-05-09 Canon Kabushiki Kaisha Apparatus for preparing a semiconductor device, photo treatment apparatus, pattern forming apparatus and fabrication apparatus
KR20090002784A (ko) * 2007-07-04 2009-01-09 주식회사 아이엠티 건식세정장치 및 방법
KR20100101537A (ko) * 2009-03-09 2010-09-17 가부시키가이샤 히다치 하이테크놀로지즈 마스크부재의 클리닝장치 및 클리닝방법 및 유기 ｅｌ 디스플레이
KR20150105814A (ko) * 2014-03-10 2015-09-18 주식회사 코디에스 마스크 세정 장치 및 마스크 세정 방법
KR20150121473A (ko) * 2014-04-21 2015-10-29 주식회사 케이씨텍 분사부 및 이를 구비하는 기판 세정장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020239193A1 (fr) * 2019-05-24 2020-12-03 Applied Materials, Inc. Appareil de traitement thermique, système de traitement de substrat et procédé de traitement d'un substrat

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