WO2018232873A1 - 一种镍的选择性蚀刻液 - Google Patents

一种镍的选择性蚀刻液 Download PDF

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Publication number
WO2018232873A1
WO2018232873A1 PCT/CN2017/096577 CN2017096577W WO2018232873A1 WO 2018232873 A1 WO2018232873 A1 WO 2018232873A1 CN 2017096577 W CN2017096577 W CN 2017096577W WO 2018232873 A1 WO2018232873 A1 WO 2018232873A1
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parts
nickel
glycerin
selective etching
acid
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PCT/CN2017/096577
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English (en)
French (fr)
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韦荣群
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韦荣群
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Publication of WO2018232873A1 publication Critical patent/WO2018232873A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions

Definitions

  • the invention particularly relates to a selective etching solution for nickel.
  • Etching is a technique that removes the surface layer of a material by chemical reaction or physical impact. Etching using an etchant is a chemical etch. When the material contacts the etching solution, the surface layer of the material and the newly formed surface layer are continuously dissolved and corroded by the etching liquid, thereby forming a three-dimensional effect of unevenness or hollowing. In the process of manufacturing the electrode and the wiring of the flexible substrate, there is a process of forming a nickel film by electroplating, and the unnecessary nickel film portion can be peeled off via the etching liquid. Since the electrode and the wiring are often laminated by a plurality of metals, it is required to have no influence on a metal other than nickel (such as copper) when etching the nickel film.
  • a metal other than nickel such as copper
  • a selective etching solution for nickel is composed of the following raw materials by weight: 15-35 parts of ferrous sulfate, 5-20 parts of copper sulfate, 2-6 parts of sulfamic acid, 15-35 parts of adipic acid, silane coupling 6-9 parts of the crosslinking agent, 0.2-0.8 parts of potassium sulfide, 5-10 parts of hydrofluoric acid, 0.1-0.6 parts of benzylisoquinoline, 1-5 parts of glycerin, 0.1-0.8 parts of glycerin, and 150-350 parts of water.
  • the nickel selective etching solution is composed of the following raw materials by weight: 25 parts of ferrous sulfate, 12.5 parts of copper sulfate, 4 parts of sulfamic acid, 25 parts of adipic acid, and a silane coupling agent 7 A portion, 0.5 parts of potassium sulfide, 7.5 parts of hydrofluoric acid, 0.3 parts of benzylisoquinoline, 3 parts of glycerin, 0.4 parts of glycerin, and 250 parts of water.
  • the nickel selective etching solution is composed of the following raw materials by weight: 15 parts of ferrous sulfate, 5 parts of copper sulfate, 2 parts of sulfamic acid, 15 parts of adipic acid, and a silane coupling agent 6 A portion, 0.2 parts of potassium sulfide, 5 parts of hydrofluoric acid, 0.1 part of benzylisoquinoline, 1 part of glycerin, 0.1 part of glycerin, and 150 parts of water.
  • the nickel selective etching solution is composed of the following raw materials by weight: 35 parts of ferrous sulfate, 20 parts of copper sulfate, 6 parts of sulfamic acid, 35 parts of adipic acid, and a silane coupling agent 9 A portion, 0.8 parts of potassium sulfide, 10 parts of hydrofluoric acid, 0.6 parts of benzylisoquinoline, 5 parts of glycerin, 0.8 parts of glycerin, and 350 parts of water.
  • the above-mentioned nickel selective etching solution preparation method is characterized in that the components are uniformly mixed, sonicated at room temperature for 30 minutes, and then used after cooling.
  • the etching liquid provided by the invention can selectively etch nickel, has almost no corrosion to copper, has strong selectivity, and the surface of the etched copper plate is bright, no precipitation, smooth, and no side etching.
  • the nickel selective etching solution is composed of the following raw materials by weight: 25 parts of ferrous sulfate, 12.5 parts of copper sulfate, 4 parts of sulfamic acid, 25 parts of adipic acid, 7 parts of silane coupling agent, vulcanization 0.5 parts of potassium, 7.5 parts of hydrofluoric acid, 0.3 parts of benzylisoquinoline, 3 parts of glycerin, 0.4 parts of glycerin, and 250 parts of water.
  • the nickel selective etching solution is composed of the following raw materials by weight: 15 parts of ferrous sulfate, 5 parts of copper sulfate, 2 parts of sulfamic acid, 15 parts of adipic acid, 6 parts of a silane coupling agent, and vulcanization. 0.2 parts of potassium, 5 parts of hydrofluoric acid, 0.1 part of benzylisoquinoline, 1 part of glycerin, 0.1 part of glycerin, and 150 parts of water.
  • the nickel selective etching solution is composed of the following raw materials by weight: 35 parts of ferrous sulfate, 20 parts of copper sulfate, 6 parts of sulfamic acid, 35 parts of adipic acid, 9 parts of a silane coupling agent, and vulcanization.
  • the above-mentioned nickel selective etching solution preparation method is characterized in that the components are uniformly mixed, sonicated at room temperature for 30 minutes, and then used after cooling.
  • the etching liquid provided by the invention can selectively etch nickel, has almost no corrosion to copper, has strong selectivity, and the surface of the etched copper plate is bright, no precipitation, smooth, and no side etching.

Abstract

一种镍的选择性蚀刻液，该蚀刻液通过如下重量份的原料组成：硫酸亚铁15-35份、硫酸铜5-20份、氨基磺酸2-6份、己二酸15-35份、硅烷偶联剂6-9份、硫化钾0.2-0.8份、氢氟酸5-10份、苄基异喹啉0.1-0.6份、甘油1-5份、甘油0.1-0.8份、水150-350份。该蚀刻液制备方法是将各成分混合均匀后室温下超声30min，冷却后即可使用。该蚀刻液可以选择性的对镍进行蚀刻，对铜几乎不腐蚀，选择性强，且经蚀刻后的铜板表面光亮，无沉淀，平整。

Description

一种镍的选择性蚀刻液 技术领域
本发明具体涉及一种镍的选择性蚀刻液。
背景技术
蚀刻是通过化学反应或物理撞击作用而移除材料表层的技术。使用蚀刻液进行蚀刻，是一种化学蚀刻。材料接触蚀刻液，材料表层和新生成的表层不断被蚀刻液溶解、腐蚀，从而形成凹凸或者镂空的立体效果。在可挠式基板的电极和配线的制造过程中，具有电镀形成镍膜的工艺，不需要的镍膜部分可以经由蚀刻液剥离开。由于电极和配线多由多种金属层叠而成，因此，在对镍膜进行蚀刻时，要求对除镍以外的金属(如铜等)没有影响。
发明内容
本发明的目的在于提供一种镍的选择性蚀刻液。
本发明通过下面技术方案实现：
一种镍的选择性蚀刻液，通过如下重量份的原料组成：硫酸亚铁15-35份、硫酸铜5-20份、氨基磺酸2-6份、己二酸15-35份、硅烷偶联剂6-9份、硫化钾0.2-0.8份、氢氟酸5-10份、苄基异喹啉0.1-0.6份、甘油1-5份、甘油0.1-0.8份、水150-350份。
优选地，所述的一种镍的选择性蚀刻液通过如下重量份的原料组成：硫酸亚铁25份、硫酸铜12.5份、氨基磺酸4份、己二酸25份、硅烷偶联剂7份、硫化钾0.5份、氢氟酸7.5份、苄基异喹啉0.3份、甘油3份、甘油0.4份、水250份。
优选地，所述的一种镍的选择性蚀刻液通过如下重量份的原料组成：硫酸亚铁15份、硫酸铜5份、氨基磺酸2份、己二酸15份、硅烷偶联剂6份、硫化钾0.2份、氢氟酸5份、苄基异喹啉0.1份、甘油1份、甘油0.1份、水150份。
优选地，所述的一种镍的选择性蚀刻液通过如下重量份的原料组成：硫酸亚铁35份、硫酸铜20份、氨基磺酸6份、己二酸35份、硅烷偶联剂9份、硫化钾0.8份、氢氟酸10份、苄基异喹啉0.6份、甘油5份、甘油0.8份、水350份。
上述的一种镍的选择性蚀刻液制备方法，将各成分混合均匀后室温下超声30min，冷却后即可使用。
本发明技术效果：
本发明提供的蚀刻液可以选择性的对镍进行蚀刻，对铜几乎不腐蚀，选择性强，且经蚀刻后的铜板表面光亮，无沉淀，平整，无侧蚀。
具体实施方式
下面结合实施例具体介绍本发明的实质性内容。
实施例1
所述的一种镍的选择性蚀刻液通过如下重量份的原料组成：硫酸亚铁25份、硫酸铜12.5份、氨基磺酸4份、己二酸25份、硅烷偶联剂7份、硫化钾0.5份、氢氟酸7.5份、苄基异喹啉0.3份、甘油3份、甘油0.4份、水250份。
实施例2
所述的一种镍的选择性蚀刻液通过如下重量份的原料组成：硫酸亚铁15份、硫酸铜5份、氨基磺酸2份、己二酸15份、硅烷偶联剂6份、硫化钾0.2份、氢氟酸5份、苄基异喹啉0.1份、甘油1份、甘油0.1份、水150份。
实施例3
所述的一种镍的选择性蚀刻液通过如下重量份的原料组成：硫酸亚铁35份、硫酸铜20份、氨基磺酸6份、己二酸35份、硅烷偶联剂9份、硫化钾0.8份、氢氟酸10份、苄基异喹啉0.6份、甘油5份、甘油0.8份、水350份。
上述的一种镍的选择性蚀刻液制备方法，将各成分混合均匀后室温下超声30min，冷却后即可使用。
本发明提供的蚀刻液可以选择性的对镍进行蚀刻，对铜几乎不腐蚀，选择性强，且经蚀刻后的铜板表面光亮，无沉淀，平整，无侧蚀。

Claims (5)

  1. 一种镍的选择性蚀刻液，其特征在于，通过如下重量份的原料组成：硫酸亚铁15-35份、硫酸铜5-20份、氨基磺酸2-6份、己二酸15-35份、硅烷偶联剂6-9份、硫化钾0.2-0.8份、氢氟酸5-10份、苄基异喹啉0.1-0.6份、甘油1-5份、甘油0.1-0.8份、水150-350份。
  2. 根据权利要求1所述的一种镍的选择性蚀刻液，其特征在于，通过如下重量份的原料组成：硫酸亚铁25份、硫酸铜12.5份、氨基磺酸4份、己二酸25份、硅烷偶联剂7份、硫化钾0.5份、氢氟酸7.5份、苄基异喹啉0.3份、甘油3份、甘油0.4份、水250份。
  3. 根据权利要求1所述的一种镍的选择性蚀刻液，其特征在于，通过如下重量份的原料组成：硫酸亚铁15份、硫酸铜5份、氨基磺酸2份、己二酸15份、硅烷偶联剂6份、硫化钾0.2份、氢氟酸5份、苄基异喹啉0.1份、甘油1份、甘油0.1份、水150份。
  4. 根据权利要求1所述的一种镍的选择性蚀刻液，其特征在于，通过如下重量份的原料组成：硫酸亚铁35份、硫酸铜20份、氨基磺酸6份、己二酸35份、硅烷偶联剂9份、硫化钾0.8份、氢氟酸10份、苄基异喹啉0.6份、甘油5份、甘油0.8份、水350份。
  5. 权利要求1-4任一所述的一种镍的选择性蚀刻液制备方法，其特征在于，将各成分混合均匀后室温下超声30min，冷却后即可使用。
PCT/CN2017/096577 2017-06-22 2017-08-09 一种镍的选择性蚀刻液 WO2018232873A1 (zh)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000104183A (ja) * 1997-12-25 2000-04-11 Canon Inc エッチング方法
CN1461822A (zh) * 2002-05-30 2003-12-17 三菱瓦斯化学株式会社 镍或镍合金的剥离液
JP2004134818A (ja) * 1997-12-25 2004-04-30 Canon Inc エッチング方法
CN102230178A (zh) * 2011-04-29 2011-11-02 西安东旺精细化学有限公司 镍或镍/铜合金的蚀刻液组合物
CN104233302A (zh) * 2014-09-15 2014-12-24 南通万德科技有限公司 一种蚀刻液及其应用
CN106702385A (zh) * 2017-03-28 2017-05-24 江苏和达电子科技有限公司 一种镍或镍合金的选择性蚀刻液及其制备方法和应用

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000104183A (ja) * 1997-12-25 2000-04-11 Canon Inc エッチング方法
JP2004134818A (ja) * 1997-12-25 2004-04-30 Canon Inc エッチング方法
CN1461822A (zh) * 2002-05-30 2003-12-17 三菱瓦斯化学株式会社 镍或镍合金的剥离液
CN102230178A (zh) * 2011-04-29 2011-11-02 西安东旺精细化学有限公司 镍或镍/铜合金的蚀刻液组合物
CN104233302A (zh) * 2014-09-15 2014-12-24 南通万德科技有限公司 一种蚀刻液及其应用
CN106702385A (zh) * 2017-03-28 2017-05-24 江苏和达电子科技有限公司 一种镍或镍合金的选择性蚀刻液及其制备方法和应用

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