CN109112544A - 一种镍的选择性蚀刻液 - Google Patents
一种镍的选择性蚀刻液 Download PDFInfo
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- CN109112544A CN109112544A CN201710480425.0A CN201710480425A CN109112544A CN 109112544 A CN109112544 A CN 109112544A CN 201710480425 A CN201710480425 A CN 201710480425A CN 109112544 A CN109112544 A CN 109112544A
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- glycerol
- nickel
- etching liquid
- acid
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims abstract description 52
- 238000005530 etching Methods 0.000 title claims abstract description 26
- 229910052759 nickel Inorganic materials 0.000 title claims abstract description 26
- 239000007788 liquid Substances 0.000 title claims abstract description 21
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims abstract description 72
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims abstract description 24
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 12
- 235000011037 adipic acid Nutrition 0.000 claims abstract description 12
- 239000001361 adipic acid Substances 0.000 claims abstract description 12
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims abstract description 12
- 235000003891 ferrous sulphate Nutrition 0.000 claims abstract description 12
- 239000011790 ferrous sulphate Substances 0.000 claims abstract description 12
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 claims abstract description 12
- 229910000359 iron(II) sulfate Inorganic materials 0.000 claims abstract description 12
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 claims abstract description 12
- DPLVEEXVKBWGHE-UHFFFAOYSA-N potassium sulfide Chemical compound [S-2].[K+].[K+] DPLVEEXVKBWGHE-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000002994 raw material Substances 0.000 claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- IZTUINVRJSCOIR-UHFFFAOYSA-N benzylisoquinoline Chemical compound N=1C=CC2=CC=CC=C2C=1CC1=CC=CC=C1 IZTUINVRJSCOIR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims abstract description 4
- 239000004615 ingredient Substances 0.000 claims abstract description 4
- 238000002360 preparation method Methods 0.000 claims abstract description 4
- 238000002604 ultrasonography Methods 0.000 claims abstract description 4
- 239000000203 mixture Substances 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052802 copper Inorganic materials 0.000 abstract description 7
- 239000010949 copper Substances 0.000 abstract description 7
- 238000005282 brightening Methods 0.000 abstract description 3
- 230000003628 erosive effect Effects 0.000 abstract description 3
- 238000002156 mixing Methods 0.000 abstract description 3
- 230000001376 precipitating effect Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Abstract
本发明公开了一种镍的选择性蚀刻液,该蚀刻液通过如下重量份的原料组成:硫酸亚铁15‑35份、硫酸铜5‑20份、氨基磺酸2‑6份、己二酸15‑35份、硅烷偶联剂6‑9份、硫化钾0.2‑0.8份、氢氟酸5‑10份、苄基异喹啉0.1‑0.6份、甘油1‑5份、甘油0.1‑0.8份、水150‑350份。该蚀刻液制备方法,将各成分混合均匀后室温下超声30min,冷却后即可使用。本发明提供的蚀刻液可以选择性的对镍进行蚀刻,对铜几乎不腐蚀,选择性强,且经蚀刻后的铜板表面光亮,无沉淀,平整,无侧蚀,具有创造性。
Description
技术领域
本发明具体涉及一种镍的选择性蚀刻液。
背景技术
蚀刻是通过化学反应或物理撞击作用而移除材料表层的技术。使用蚀刻液进行蚀刻,是一种化学蚀刻。材料接触蚀刻液,材料表层和新生成的表层不断被蚀刻液溶解、腐蚀,从而形成凹凸或者镂空的立体效果。在可挠式基板的电极和配线的制造过程中,具有电镀形成镍膜的工艺,不需要的镍膜部分可以经由蚀刻液剥离开。由于电极和配线多由多种金属层叠而成,因此,在对镍膜进行蚀刻时,要求对除镍以外的金属(如铜等)没有影响。
发明内容
本发明的目的在于提供一种镍的选择性蚀刻液。
本发明通过下面技术方案实现:
一种镍的选择性蚀刻液,通过如下重量份的原料组成:硫酸亚铁15-35份、硫酸铜5-20份、氨基磺酸2-6份、己二酸15-35份、硅烷偶联剂6-9份、硫化钾0.2-0.8份、氢氟酸5-10份、苄基异喹啉0.1-0.6份、甘油1-5份、甘油0.1-0.8份、水150-350份。
优选地,所述的一种镍的选择性蚀刻液通过如下重量份的原料组成:硫酸亚铁25份、硫酸铜12.5份、氨基磺酸4份、己二酸25份、硅烷偶联剂7份、硫化钾0.5份、氢氟酸7.5份、苄基异喹啉0.3份、甘油3份、甘油0.4份、水250份。
优选地,所述的一种镍的选择性蚀刻液通过如下重量份的原料组成:硫酸亚铁15份、硫酸铜5份、氨基磺酸2份、己二酸15份、硅烷偶联剂6份、硫化钾0.2份、氢氟酸5份、苄基异喹啉0.1份、甘油1份、甘油0.1份、水150份。
优选地,所述的一种镍的选择性蚀刻液通过如下重量份的原料组成:硫酸亚铁35份、硫酸铜20份、氨基磺酸6份、己二酸35份、硅烷偶联剂9份、硫化钾0.8份、氢氟酸10份、苄基异喹啉0.6份、甘油5份、甘油0.8份、水350份。
上述的一种镍的选择性蚀刻液制备方法,将各成分混合均匀后室温下超声30min,冷却后即可使用。
本发明技术效果:
本发明提供的蚀刻液可以选择性的对镍进行蚀刻,对铜几乎不腐蚀,选择性强,且经蚀刻后的铜板表面光亮,无沉淀,平整,无侧蚀。
具体实施方式
下面结合实施例具体介绍本发明的实质性内容。
实施例1
所述的一种镍的选择性蚀刻液通过如下重量份的原料组成:硫酸亚铁25份、硫酸铜12.5份、氨基磺酸4份、己二酸25份、硅烷偶联剂7份、硫化钾0.5份、氢氟酸7.5份、苄基异喹啉0.3份、甘油3份、甘油0.4份、水250份。
实施例2
所述的一种镍的选择性蚀刻液通过如下重量份的原料组成:硫酸亚铁15份、硫酸铜5份、氨基磺酸2份、己二酸15份、硅烷偶联剂6份、硫化钾0.2份、氢氟酸5份、苄基异喹啉0.1份、甘油1份、甘油0.1份、水150份。
实施例3
所述的一种镍的选择性蚀刻液通过如下重量份的原料组成:硫酸亚铁35份、硫酸铜20份、氨基磺酸6份、己二酸35份、硅烷偶联剂9份、硫化钾0.8份、氢氟酸10份、苄基异喹啉0.6份、甘油5份、甘油0.8份、水350份。
上述的一种镍的选择性蚀刻液制备方法,将各成分混合均匀后室温下超声30min,冷却后即可使用。
本发明提供的蚀刻液可以选择性的对镍进行蚀刻,对铜几乎不腐蚀,选择性强,且经蚀刻后的铜板表面光亮,无沉淀,平整,无侧蚀。
Claims (5)
1.一种镍的选择性蚀刻液,其特征在于,通过如下重量份的原料组成:硫酸亚铁15-35份、硫酸铜5-20份、氨基磺酸2-6份、己二酸15-35份、硅烷偶联剂6-9份、硫化钾0.2-0.8份、氢氟酸5-10份、苄基异喹啉0.1-0.6份、甘油1-5份、甘油0.1-0.8份、水150-350份。
2.根据权利要求1所述的一种镍的选择性蚀刻液,其特征在于,通过如下重量份的原料组成:硫酸亚铁25份、硫酸铜12.5份、氨基磺酸4份、己二酸25份、硅烷偶联剂7份、硫化钾0.5份、氢氟酸7.5份、苄基异喹啉0.3份、甘油3份、甘油0.4份、水250份。
3.根据权利要求1所述的一种镍的选择性蚀刻液,其特征在于,通过如下重量份的原料组成:硫酸亚铁15份、硫酸铜5份、氨基磺酸2份、己二酸15份、硅烷偶联剂6份、硫化钾0.2份、氢氟酸5份、苄基异喹啉0.1份、甘油1份、甘油0.1份、水150份。
4.根据权利要求1所述的一种镍的选择性蚀刻液,其特征在于,通过如下重量份的原料组成:硫酸亚铁35份、硫酸铜20份、氨基磺酸6份、己二酸35份、硅烷偶联剂9份、硫化钾0.8份、氢氟酸10份、苄基异喹啉0.6份、甘油5份、甘油0.8份、水350份。
5.权利要求1-4任一所述的一种镍的选择性蚀刻液制备方法,其特征在于,将各成分混合均匀后室温下超声30min,冷却后即可使用。
Priority Applications (2)
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CN201710480425.0A CN109112544A (zh) | 2017-06-22 | 2017-06-22 | 一种镍的选择性蚀刻液 |
PCT/CN2017/096577 WO2018232873A1 (zh) | 2017-06-22 | 2017-08-09 | 一种镍的选择性蚀刻液 |
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CN201710480425.0A CN109112544A (zh) | 2017-06-22 | 2017-06-22 | 一种镍的选择性蚀刻液 |
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CN109112544A true CN109112544A (zh) | 2019-01-01 |
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CN201710480425.0A Withdrawn CN109112544A (zh) | 2017-06-22 | 2017-06-22 | 一种镍的选择性蚀刻液 |
Country Status (2)
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CN (1) | CN109112544A (zh) |
WO (1) | WO2018232873A1 (zh) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3535755B2 (ja) * | 1997-12-25 | 2004-06-07 | キヤノン株式会社 | エッチング方法 |
JP3970248B2 (ja) * | 1997-12-25 | 2007-09-05 | キヤノン株式会社 | エッチング方法 |
JP4019256B2 (ja) * | 2002-05-30 | 2007-12-12 | 三菱瓦斯化学株式会社 | ニッケルまたはニッケル合金の剥離液 |
CN102230178B (zh) * | 2011-04-29 | 2012-09-05 | 西安东旺精细化学有限公司 | 镍或镍/铜合金的蚀刻液组合物 |
CN104233302B (zh) * | 2014-09-15 | 2016-09-14 | 南通万德科技有限公司 | 一种蚀刻液及其应用 |
CN106702385B (zh) * | 2017-03-28 | 2018-09-28 | 江苏和达电子科技有限公司 | 一种镍或镍合金的选择性蚀刻液及其制备方法和应用 |
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2017
- 2017-06-22 CN CN201710480425.0A patent/CN109112544A/zh not_active Withdrawn
- 2017-08-09 WO PCT/CN2017/096577 patent/WO2018232873A1/zh active Application Filing
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