WO2018232831A1 - Oled器件封装方法、结构、oled器件及显示屏 - Google Patents

Oled器件封装方法、结构、oled器件及显示屏 Download PDF

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WO2018232831A1
WO2018232831A1 PCT/CN2017/094551 CN2017094551W WO2018232831A1 WO 2018232831 A1 WO2018232831 A1 WO 2018232831A1 CN 2017094551 W CN2017094551 W CN 2017094551W WO 2018232831 A1 WO2018232831 A1 WO 2018232831A1
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layer
oled device
surface active
barrier
buffer
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French (fr)
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黄辉
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements

Definitions

  • the present invention relates to the field of display technologies, and in particular, to an OLED device packaging method, an OLED device package structure, an OLED device, and a display screen.
  • organic light-emitting diodes are also known as organic light-emitting diodes (OLEDs), such as low starting voltage, light and thin, self-illuminating, etc., more and more Extensive research is being used to develop lighting products as well as in the panel industry to meet the demands of low energy consumption, light and thin surface light sources.
  • the most common technology for thin film packaging is that the organic film and the inorganic film are alternately deposited on the surface of the OLED, and the package effect is achieved by stacking several layers.
  • a better buffering effect is obtained, and a buffer layer is usually formed by inkjet printing, but since there is a gap between the inkjet printing heads, this prolongs the time of film-forming packaging and increases the packaging cost.
  • An object of the present invention is to provide an OLED device packaging method and structure, and to improve film forming and packaging time and reduce cost.
  • the invention also provides an OLED device and a display screen.
  • the OLED device package structure of the present invention is used for packaging an organic light emitting diode layer, and the OLED device package structure comprises a base layer formed on the barrier layer of the base layer.
  • a composite layer is also laminated on the buffer layer.
  • the surface active layer material is one of a hydrophilic polymer active material, a polyhydric alcohol salt or an ether.
  • the surface active layer is formed by inkjet printing.
  • the composite layer comprises a first barrier layer and a first buffer layer laminated on the first barrier layer, or a plurality of first barrier layers and a first buffer layer spaced apart from each of the two first barrier layers, And the first first barrier layer of the multilayer first barrier layer is in contact with the buffer layer.
  • the OLED device packaging method of the present invention is for packaging an organic light emitting diode layer, and the method includes
  • the buffer strips corresponding to the plurality of strip bodies are placed, and then diffused to cover the substrate and cover the barrier layer to form a buffer layer.
  • the surface active layer has a thickness of less than 100 microns.
  • the surface active layer material is one of a hydrophilic polymer active material, a polyhydric alcohol salt or an ether.
  • the method further comprises heating the substrate to eliminate the surface active layer.
  • the OLED device of the present invention includes the OLED device package structure.
  • the display screen of the present invention includes the OLED device.
  • the OLED device packaging method of the present invention forms a surface active layer on the barrier layer before forming the buffer layer, and then sprays the buffer material, and the buffer material diffuses and spreads the entire barrier layer to form a buffer layer by chemical reaction between the surface active layer and the buffer material. , reducing the film formation time and achieving cost saving.
  • FIG. 1 is a schematic view of a package structure of an OLED device of the present invention.
  • FIG. 2 is a schematic view showing another mode of the OLED device package structure of the present invention.
  • FIG. 3 is a flow chart of a method of packaging an OLED device of the present invention.
  • FIG. 4 is a schematic view showing an OLED device packaging method for forming a surface active layer in China.
  • FIG. 5 is a schematic illustration of an OLED device of the present invention.
  • a preferred embodiment of the present invention provides an OLED device package structure 100 for packaging an organic light emitting diode layer.
  • the OLED device package structure 100 includes a base layer 10, a barrier layer 11 formed on the base layer 10, a surface active layer 12 disposed on the surface of the barrier layer 11, and a buffer layer 13 laminated on the surface active layer 12, and the buffer layer
  • the orthographic projection of layer 13 on said barrier layer 11 coincides with the orthographic projection of surface active layer 12 on said barrier layer 11.
  • the material of the surface active layer 12 is one of a hydrophilic polymer active material, a polyhydric alcohol salt or an ether.
  • the surface of the surface active layer 12 is free of hydroxyl groups or H+, hydrogen bonds can be formed with the hydroxyl groups of the buffer layer 13 and H+, and it is possible to strengthen the binding ability. That is to say, after the buffer layer 13 is sprayed, the buffer material is diffused by the surface active layer 12 to form the buffer layer 13.
  • the surface active layer 12 will volatilize without affecting the package effect.
  • the surface active layer 12 is formed by inkjet printing.
  • a composite layer 14 is also laminated on the buffer layer 13.
  • the composite layer 14 includes A first barrier layer 141 and a first buffer layer 142 stacked on the first barrier layer 141.
  • the barrier layer 11 and the first barrier layer are made of an inorganic material.
  • the buffer layer 13 and the first buffer layer 142 are made of an organic material.
  • the composite layer 14 includes a plurality of first barrier layers 141 and a first buffer layer 142 spaced apart from each of the two first barrier layers 141, and the first first barrier of the plurality of first barrier layers 141 Layer 141 is in contact with the buffer layer 13.
  • different organic layer and inorganic layer alternately encapsulating film are deposited on the substrate to achieve effective barrier to water and oxygen and effective extension of folding and curling life.
  • an OLED device packaging method provided by the present invention is used for packaging an organic light emitting diode layer, and the method includes:
  • step S1 a base layer 10 covering the organic light emitting diode is provided and a barrier layer 11 is formed on the base layer 10; the barrier layer 11 is formed by vacuum deposition.
  • a surface active layer 12 composed of a plurality of strips 120 arranged in a matrix is formed on the surface of the barrier layer 11 by inkjet printing.
  • the surface active layer 12 has a thickness of less than 100 microns.
  • the material of the surface active layer 12 is one of a hydrophilic polymer active material, a polyhydric alcohol salt or an ether.
  • the surface activity is formed by a plurality of spaced intervals on the surface by inkjet printing.
  • step S3 a buffer strip 131 corresponding to the plurality of strips of the surface active layer is sprayed on the surface active layer 12.
  • the buffer strip 131 is formed by an inkjet printing method, specifically, the manner and path of formation of the surface active layer 12.
  • step S4 the buffer strips 131 corresponding to the plurality of strip-shaped bodies are left to stand, and then diffused to cover the substrate and cover the barrier layer to form the buffer layer 13.
  • the buffer layer after inkjet printing generally planarizes the buffer layer material into the device by means of static leveling to form a covering package, and the method forms a surface active layer on the barrier layer before forming the buffer layer 13. 12, then spraying the buffer material, through the chemical reaction of the surface active layer 12 and the buffer material, the buffer material diffuses and spreads the entire barrier layer to form the buffer layer 13, which reduces the film formation time and achieves the purpose of cost saving.
  • a composite layer 14 is formed on the buffer layer 13. Specifically, a first barrier layer is deposited on the barrier layer; and a first buffer layer is deposited on the first barrier layer.
  • the barrier layer 11 is made of an inorganic material, and is deposited on the base layer by using, but not limited to, a PECVD (Plasma Enhanced Chemical Vapor Deposition)-plasma enhanced chemical vapor deposition method, including but not limited to Al 2 O. 3.
  • PECVD Pullasma Enhanced Chemical Vapor Deposition
  • An inorganic material such as SiN x , TiO 2 or SiO x forms the barrier layer.
  • the buffer layer 13 is made of a polymer material, and deposition on the barrier layer includes, but not limited to, HMDSO (hexamethyldimethicone) polymer pp-HMDSO (Plasma Polymerized HMDSO), polyacrylate, poly A transparent polymer such as a carbonate or a polystyrene forms a stress layer to alleviate the stress of the barrier layer.
  • HMDSO hexamethyldimethicone
  • pp-HMDSO Pasma Polymerized HMDSO
  • polyacrylate polyacrylate
  • poly A transparent polymer such as a carbonate or a polystyrene forms a stress layer to alleviate the stress of the barrier layer.
  • the present invention provides an OLED device including the OLED device package structure 100 and the organic light emitting diode 200.
  • the OLED device adopts the above package structure, which can save packaging cost, and provides a display screen including the OLED device.

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  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

提供一种OLED器件封装结构（100），用于封装有机发光二极管层，OLED器件封装结构（100）包括基层（10），形成于基层（10）的阻隔层（11），设于该阻隔层（11）表面的表面活性层（12）及层叠于该表面活性层（12）上的缓冲层（13），且缓冲层（13）在阻隔层（11）上的正投影与表面活性层（12）在该阻隔层（11）上的正投影正对重合，缓冲层（13）上还层叠有复合层（14）。还提供一种OLED器件及显示屏。

Description

OLED器件封装方法、结构、OLED器件及显示屏
本发明要求2017年6月20日递交的发明名称为“OLED器件封装方法、结构、OLED器件及显示屏”的申请号201710471250.7的在先申请优先权，上述在先申请的内容以引入的方式并入本文本中。
技术领域
本发明涉及显示技术领域，特别涉及一种OLED器件封装方法、OLED器件封装结构、OLED器件及显示屏。
背景技术
在目前照明和显示领域中，由于有机发光二极管又称为有机电激光显示(Organic Light-Emitting Diode，OLED)本身的特点，如低启动电压，轻薄，自发光等特点，越来越多的被广泛研究用于开发照明产品以及面板行业中，以达到低能耗，轻薄和面光源等需求。
其中OLED元件对水氧极度敏感的元件，在目前的OLED薄膜封装中，薄膜封装采用最普遍的技术就是聚合物有机薄膜和无机薄膜交替沉积在OLED表面，通过数层的叠加达到封装效果，为了得到较好的缓冲作用，通常会采用喷墨打印的方法形成缓冲层，但是因为喷墨打印喷头之间会有间隙，这就延长的成膜封装的时间，增加了封装成本。
发明内容
本发明的目的在于提供一种OLED器件封装方法及结构及，提高成膜封装时间，减小成本。
本发明还提供一种OLED器件及显示屏。
本发明所述OLED器件封装结构，用于封装有机发光二极管层，OLED器件封装结构包括基层，形成于基层的阻隔层，
设于所述阻隔层表面的表面活性层及层叠于所述表面活性层上的缓冲层，且所述缓冲层在所述阻隔层上的正投影与表面活性层在所述阻隔层上的正投 影正对重合，
所述缓冲层上还层叠有复合层。
其中，所述表面活性层材料为亲水性高分子活性材料、多元醇盐或者醚类中的一种。
其中，所述表面活性层通过喷墨打印方式形成。
其中，所述复合层包括一层第一阻隔层及层叠于所述第一阻隔层的第一缓冲层，或者多层第一阻隔层及间隔每两层第一阻隔层的第一缓冲层，且多层第一阻隔层的第一个第一阻隔层与所述缓冲层接触。
本发明所述OLED器件封装方法，用于封装有机发光二极管层，所述方法包括，
提供覆盖所述有机发光二极管的基层并在所述基层上形成一层阻隔层；
在所述阻隔层的表面通过喷墨打印方式形成呈矩阵排布的多个条形体组成的表面活性层；
在所述表面活性层上喷涂与所述表面活性层的多个条形体一一对应的缓冲条；
多个条形体一一对应的缓冲条静置后进行扩散铺满基板并覆盖阻隔层而形成缓冲层。
其中，所述表面活性层厚度在100微米以内。
其中，所述表面活性层材料为亲水性高分子活性材料、多元醇盐或者醚类中的一种。
其中，还包括，加热所述基板消除所述表面活性层。
本发明所述OLED器件，包括所述的OLED器件封装结构。
本发明所述显示屏，包括所述的OLED器件。
本发明所述OLED器件封装方法在形成缓冲层之前现在阻隔层上形成表面活性层，然后在喷涂缓冲材料，通过表面活性层与缓冲材料的化学反应使缓冲材料扩散铺满整个阻隔层形成缓冲层，减少了成膜时间，达到节省成本的目的。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明的OLED器件封装结构的示意图。
图2是本发明的OLED器件封装结构的另一种方式示意图。
图3是本发明的OLED器件封装方法流程图。
图4是OLED器件封装方法中国形成表面活性层的示意图。
图5是本发明所述的OLED器件的示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1，本发明佳实施方式提供一种OLED器件封装结构100，用于封装有机发光二极管层。OLED器件封装结构100包括基层10，形成于基层10的阻隔层11，设于所述阻隔层11表面的表面活性层12及层叠于所述表面活性层12上的缓冲层13，且所述缓冲层13在所述阻隔层11上的正投影与表面活性层12在所述阻隔层11上的正投影正对重合。本实施例中，所述表面活性层12材料为亲水性高分子活性材料、多元醇盐或者醚类中的一种。只要表面活性层12材料存在游离的羟基或者H+，可与缓冲层13的羟基和H+形成氢键，加强结合能力就是可以的。也就是说在缓冲层13喷涂后通过表面活性层12结合使缓冲材料扩散形成缓冲层13。
如果在OLED器件封装结构制造过程中，通过加热提高OLED器件封装结构的温度，或者在使用OLED器件时有足够的温度，那么表面活性层12就会挥发，不会影响封装的效果。本实施例中，所述表面活性层12通过喷墨打印方式形成。
所述缓冲层13上还层叠有复合层14。本实施例中，所述复合层14包括 一层第一阻隔层141及层叠于所述第一阻隔层141的第一缓冲层142。所述阻隔层11、第一阻隔层为无机材料制成。缓冲层13及第一缓冲层142位有机材料制成。
请参阅图2，所述复合层14包括多层第一阻隔层141及间隔每两层第一阻隔层141的第一缓冲层142，且多层第一阻隔层141的第一个第一阻隔层141与所述缓冲层13接触。根据实际需要在基层上来沉积不同的有机层和无机层交替结构的封装层薄膜来实现对水氧的有效阻隔和对折叠和卷曲寿命的有效延长。
请参阅图3，本发明提供的OLED器件封装方法，用于封装有机发光二极管层，所述方法包括：
请结合图1，步骤S1，提供覆盖所述有机发光二极管的基层10并在所述基层10上形成一层阻隔层11；阻隔层11通过真空沉积方式形成。
参阅图4，步骤S2，在所述阻隔层11的表面通过喷墨打印方式形成呈矩阵排布的多个条形体120组成的表面活性层12。其中，所述表面活性层12厚度在100微米以内。所述表面活性层12材料为亲水性高分子活性材料、多元醇盐或者醚类中的一种。具体的，表面活性通过喷墨打印方式在表面上形成多个间隔均匀排列的
步骤S3，在所述表面活性层12上喷涂与所述表面活性层的多个条形体一一对应的缓冲条131。所述缓冲条131使通过喷墨打印方式形成，确切的说与所述表面活性层12形成方式及路径完全相同。
步骤S4，多个条形体一一对应的缓冲条131静置后进行扩散铺满基板并覆盖阻隔层而形成缓冲层13。
喷墨打印之后的缓冲层，一般是通过静止流平的方式使缓冲层材料完全平铺到器件中，形成覆盖封装的目的，而本方法在形成缓冲层13之前现在阻隔层上形成表面活性层12，然后在喷涂缓冲材料，通过表面活性层12与缓冲材料的化学反应使缓冲材料扩散铺满整个阻隔层形成缓冲层13，减少了成膜时间，达到节省成本的目的。
还包括，步骤S5，在所述缓冲层13上形成复合层14。具体包括，在所述阻隔层上沉积一层第一阻隔层；在第一阻隔层上沉积形成第一缓冲层。
本实施例中，所述阻隔层11为无机材料制成，利用包括但不限于PECVD(Plasma Enhanced Chemical Vapor Deposition)--等离子体增强化学气相沉积法方法在基层上沉积包括但不限于Al2O3、SiNx、TiO2、SiOx等无机材料形成所述阻隔层。
其中，所述缓冲层13为聚合物材料制成，在阻隔层上沉积包括但不限于HMDSO(六甲基二甲硅醚)聚合体pp-HMDSO(Plasma Polymerized HMDSO)、聚丙烯酸酯类、聚碳酸脂类、聚苯乙烯类等透明聚合物形成应力层来缓解阻隔层的应力。
请参阅图5，本发明提供一种OLED器件，其包括所述的OLED器件封装结构100及有机发光二极管200。OLED器件采用上述封装结构，可以节省封装成本，本发明提供一种显示屏，包括所述的OLED器件。
以上所揭露的仅为本发明较佳实施例而已，当然不能以此来限定本发明之权利范围，本领域普通技术人员可以理解实现上述实施例的全部或部分流程，并依本发明权利要求所作的等同变化，仍属于发明所涵盖的范围。

Claims (13)

  1. 一种OLED器件封装结构，用于封装有机发光二极管层，其中，OLED器件封装结构包括基层，形成于基层的阻隔层，
    设于所述阻隔层表面的表面活性层及层叠于所述表面活性层上的缓冲层，且所述缓冲层在所述阻隔层上的正投影与表面活性层在所述阻隔层上的正投影正对重合，
    所述缓冲层上还层叠有复合层。
  2. 如权利要求1所述的OLED器件封装结构，其中，所述表面活性层材料为亲水性高分子活性材料、多元醇盐或者醚类中的一种。
  3. 如权利要求2所述的OLED器件封装结构，其中，所述表面活性层通过喷墨打印方式形成。
  4. 如权利要求1所述的OLED器件封装结构，其中，所述复合层包括一层第一阻隔层及层叠于所述第一阻隔层的第一缓冲层，或者多层第一阻隔层及间隔每两层第一阻隔层的第一缓冲层，且多层第一阻隔层的第一个第一阻隔层与所述缓冲层接触。
  5. 一种OLED器件封装方法，用于封装有机发光二极管层，其中，所述方法包括，
    提供覆盖所述有机发光二极管的基层并在所述基层上形成一层阻隔层；
    在所述阻隔层的表面通过喷墨打印方式形成呈矩阵排布的多个条形体组成的表面活性层；
    在所述表面活性层上喷涂与所述表面活性层的多个条形体一一对应的缓冲条；
    多个条形体一一对应的缓冲条静置后进行扩散铺满基板并覆盖阻隔层而形成缓冲层。
  6. 如权利要求5所述的OLED器件封装方法，其中，所述表面活性层厚度在100微米以内。
  7. 如权利要求5项所述的OLED器件封装方法，其中，所述表面活性层材料为亲水性高分子活性材料、多元醇盐或者醚类中的一种。
  8. 如权利要求5所述的OLED器件封装方法，其中，还包括，加热所述基板消除所述表面活性层。
  9. 一种OLED器件，其中，包括OLED器件封装结构，所述OLED器件封装结构，用于封装有机发光二极管层，其中，OLED器件封装结构包括基层，形成于基层的阻隔层，
    设于所述阻隔层表面的表面活性层及层叠于所述表面活性层上的缓冲层，且所述缓冲层在所述阻隔层上的正投影与表面活性层在所述阻隔层上的正投影正对重合，
    所述缓冲层上还层叠有复合层。
  10. 如权利要求9所述的OLED器件，其中，所述表面活性层材料为亲水性高分子活性材料、多元醇盐或者醚类中的一种。
  11. 如权利要求10所述的OLED器件，其中，所述表面活性层通过喷墨打印方式形成。
  12. 如权利要求9所述的OLED器件，其中，所述复合层包括一层第一阻隔层及层叠于所述第一阻隔层的第一缓冲层，或者多层第一阻隔层及间隔每两层第一阻隔层的第一缓冲层，且多层第一阻隔层的第一个第一阻隔层与所述缓冲层接触。
  13. 一种显示屏，其中，包括权利要求9所述的OLED器件。
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