WO2018232806A1 - Oled显示面板及其制备方法、显示装置 - Google Patents

Oled显示面板及其制备方法、显示装置 Download PDF

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Publication number
WO2018232806A1
WO2018232806A1 PCT/CN2017/093248 CN2017093248W WO2018232806A1 WO 2018232806 A1 WO2018232806 A1 WO 2018232806A1 CN 2017093248 W CN2017093248 W CN 2017093248W WO 2018232806 A1 WO2018232806 A1 WO 2018232806A1
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Prior art keywords
pixel
sub
common layer
hole blocking
layer
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French (fr)
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杨杰
张明
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US15/575,992 priority Critical patent/US10651412B2/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/1201Manufacture or treatment
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/126Shielding, e.g. light-blocking means over the TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10Deposition of organic active material
    • H10K71/12Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing

Definitions

  • the present invention relates to the field of display technologies, and in particular, to an OLED display panel and a method for fabricating the same, and to a display device including the foregoing OLED display panel.
  • the OLED (Organic Electroluminescent Diode) display device has the characteristics of self-luminous, wide viewing angle, high luminous efficiency, low power consumption, fast response time, good low temperature characteristics, simple manufacturing process, low cost, and the like, and is widely used in the display field.
  • the core component of the OLED display device is an OLED display panel.
  • the structure of the OLED display panel generally includes: a TFT array substrate, an anode layer sequentially formed on the TFT substrate, a pixel defining layer, a first common layer, a light emitting layer, a second common layer, and Cathode layer.
  • the anode layer comprises a plurality of anodes arranged in an array, and the pixel defining layer comprises a plurality of pixel openings corresponding to the anodes one by one; the first common layer completely covers the pixel defining layer and the anode layer (continuously covering the entire surface in the structural layer)
  • the first common layer may include a plurality of sub-functional layers; the illuminating layer includes a plurality of illuminating units corresponding to the pixel openings, the illuminating unit is located in the pixel opening; and the second common layer completely covers the illuminating layer and the first common layer (in the The entire layer of the structural layer is covered by a continuous surface.
  • the first common layer may include a plurality of sub-functional layers; the cathode layer covers the second common layer.
  • OLED display panel The working principle of the OLED display panel is that under the action of the electric field between the anode and the cathode, holes are transmitted to the luminescent layer through the first common layer, electrons are transmitted to the luminescent layer through the second common layer, and holes and electrons are within the luminescent layer. Composite and then illuminate.
  • OLED display panels usually use a mixture of three primary colors of R, G, and B to achieve different color display effects. Therefore, one pixel of an OLED display panel usually includes three light-emitting units of R, G, and B, and each pixel has R, G, and B. The three lighting units can be individually controlled by the drive circuit.
  • the cathode layers of the three light-emitting units of R, G, and B are common, and the anodes are independent of each other.
  • individual driving of each of the light-emitting units can be achieved.
  • the resolution of the display panel is increased, the number of light-emitting units per unit area is also increasing, resulting in a decrease in the separation distance between the light-emitting units, and in addition, in order to improve display efficiency, the first common for transporting holes
  • the layer introduces many excellent transport materials. The distance between the light-emitting units is reduced and the first public In the case where the transmission performance of the common layer is continuously increased, the lateral current of the display panel also increases, resulting in crosstalk.
  • the first common layer of the adjacent light emitting units is in communication, when one of the light emitting units (target light emitting unit) is lit, a small amount of holes can pass through A common layer is injected into an adjacent light-emitting unit, and is combined with electrons in adjacent light-emitting units to emit light, thereby causing the light-emitting of the target light-emitting unit to be impure.
  • This light-emitting phenomenon is called leakage light emission, and a small amount of hole leakage
  • the current formed is called a leakage current.
  • the target light-emitting unit is illuminated at a low current, since the light emitted by the target light-emitting unit is also weak, the light leakage phenomenon is more obvious, thereby reducing the display quality of the OLED display panel.
  • the present invention provides an OLED display panel and a method for fabricating the same, which can effectively eliminate light leakage between adjacent two sub-pixels and improve display quality of the OLED display panel.
  • An OLED display panel includes a TFT array substrate and a plurality of anodes disposed on the TFT array substrate, wherein the TFT array substrate is provided with a pixel defining layer, and the pixel defining layer includes an exposed anode An opening portion and a spacing portion for spacing adjacent the two anodes, each opening portion corresponding to one sub-pixel region; wherein the pixel defining layer is sequentially provided with a first common layer for transporting holes, a second common layer and a cathode layer for transmitting electrons, wherein each of the first common layer and the second common layer is provided with a luminescent material corresponding to each sub-pixel region; wherein, above the spacer portion A hole blocking portion is provided, the hole blocking portion spacing the first common layers between adjacent two sub-pixel regions from each other.
  • the width of the hole blocking portion is not greater than the width of the top end of the spacer.
  • the thickness of the hole blocking portion is not less than the thickness of the first common layer.
  • the thickness of the hole blocking portion is greater than the thickness of the empty first common layer.
  • Each of the sub-pixel regions respectively corresponds to a red sub-pixel, a green sub-pixel or a blue sub-pixel, wherein the luminescent material in the red sub-pixel is a luminescent material that emits red light, and the luminescent material in the green sub-pixel In the luminescent material that emits green light, the luminescent material in the blue sub-pixel is a luminescent material that emits blue light.
  • the invention also provides a preparation method of an OLED display panel, comprising the steps of:
  • a cathode layer is deposited on the second common layer.
  • the step of preparing the hole blocking portion specifically comprises: disposing a hole blocking material solution; wherein the hole blocking material solution comprises a solvent and a hole blocking material dissolved in the solvent, the solvent is volatile And dissolving a solvent of the material of the first common layer; applying a printing process, printing the hole blocking material solution on the first common layer over a spacer corresponding to the pixel defining layer, The solvent in the hole blocking material solution dissolves the first common layer of the printing position; the curing process is applied to cure the printed hole blocking material solution, and the first is obtained above the spacer A hole blocking portion that is blocked by the common layer.
  • the hole blocking material solution is printed on the first common layer by an inkjet printing process, and the printed hole blocking material solution is cured by a high temperature baking process.
  • an OLED display panel and a method for fabricating the same are provided in the embodiment of the present invention.
  • a hole blocking portion is formed between two adjacent sub-pixel regions, and the hole blocking portion is adjacent.
  • the first common layer for transporting holes between the two sub-pixel regions is spaced apart from each other, avoiding holes leaking between adjacent two sub-pixel regions, and effectively eliminating light leakage between adjacent two sub-pixels Phenomenon, improve the display quality of OLED display panels.
  • FIG. 1 is a schematic structural diagram of an OLED display panel according to an embodiment of the present invention.
  • FIG. 2 is a schematic top plan view of a hole blocking portion in an embodiment of the present invention.
  • 3a-3h are exemplary illustrations of device structures prepared in various steps in a method of fabricating an OLED display panel according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a display device according to an embodiment of the present invention.
  • the OLED display panel includes a TFT array substrate 1 and a plurality of functional layers sequentially disposed on the TFT array substrate 1.
  • the functional layers include an anode layer ( Included in the array, a plurality of anodes 2), a pixel defining layer 3, a first common layer (HTL) 4 for transporting holes, and an immersion material layer (EMS, including one in FIG. 1) Corresponding to the luminescent material 5) located above each anode 2, the second common layer (ETL) 6 for transporting electrons, and the cathode layer 7.
  • the pixel defining layer 3 is disposed on the TFT array substrate 1 , and the pixel defining layer 3 includes an opening portion 31 exposing the anode 2 and an interval for spacing two adjacent anodes 2 .
  • the portion 32, each of the openings 31 corresponds to one sub-pixel region R, G, B.
  • the first common layer 4 generally includes a hole injection layer and a hole transport layer which are sequentially disposed in a direction gradually apart from the anode layer, and may further be provided with an electron blocking layer; the second common layer 6 Then, the electron injecting layer and the electron transporting layer are sequentially disposed in a direction gradually apart from the cathode layer 7, and a hole blocking layer may be further provided.
  • a hole blocking portion 8 is further disposed above the spacer portion 32 of the pixel defining layer 3, and the hole blocking portion 8 will be adjacent to two sub-pixels.
  • the first common layers 4 between the regions are spaced apart from one another.
  • the hole blocking portion 8 is formed by a Hole-blocking layer (HBL), which can prevent holes from passing through the region, that is, the hole blocking portion 8 will be adjacent to the two sub-pixels.
  • HBL Hole-blocking layer
  • the first common layers between the regions are spaced apart from each other, and holes are prevented from leaking between adjacent two sub-pixel regions, which can effectively eliminate the relationship between two adjacent sub-pixels. The light leakage phenomenon improves the display quality of the OLED display panel.
  • the width of the hole blocking portion 8 should not be greater than the width of the top end of the spacer portion 32.
  • the thickness of the hole blocking portion 8 should be not less than the thickness of the first common layer 4.
  • the thickness of the hole blocking portion 8 is greater than the thickness of the first common layer 4, that is, the top end of the hole blocking portion 8 is from the first common
  • the upper surface of layer 4 is convex.
  • each sub-pixel region corresponds to a red sub-pixel R, a green sub-pixel G, or a blue sub-pixel B, respectively, and the red sub-pixels R and green are sequentially arranged.
  • the sub-pixel G and the blue sub-pixel B constitute one pixel unit.
  • the luminescent material 5 in the red sub-pixel R is a luminescent material that emits red light
  • the luminescent material 5 in the green sub-pixel G is a luminescent material that emits green light
  • the blue sub-pixel B The luminescent material 5 is a luminescent material that emits blue light.
  • Each pixel unit is mixed with three primary colors of R, G, and B emitted by the red sub-pixel R, the green sub-pixel G, and the blue sub-pixel B to achieve different color display effects.
  • the luminescent material 5 mainly uses an electroluminescent material, which emits light under the condition of electro-excitation, usually a fluorescent material or a phosphorescent material.
  • a TFT array substrate 1 is provided and a plurality of anodes 2 distributed in an array are prepared on the TFT array substrate 1.
  • a pixel defining layer film 3a is prepared on the TFT array substrate 1.
  • the pixel defining layer film 3a continuously covers the TFT array substrate 1 and the plurality of anodes 2 on the TFT array substrate 1.
  • the pixel defining layer film 3a is prepared by using a non-conductive material, and may be a non-conductive organic material or an inorganic material.
  • the pixel defining layer film 3a is etched to form the pixel defining layer 3 having the opening portion 31 and the spacer portion 32 by applying an etching process.
  • an opening portion 31 is provided corresponding to each of the anodes 2, and the anode 2 is exposed from the opening portion 31; the spacer portion 32 is for spacing adjacent two of the anodes 2.
  • a first common layer 4 for transporting holes is deposited on the pixel defining layer 3 by applying an evaporation process.
  • the first common layer 4 is overlaid on the opening portion 31 and the spacer 32 of the pixel defining layer 3.
  • a hole blocking portion 8 is prepared above the spacer 32 of the pixel defining layer 3, and the first common layer 4 is partitioned at a portion corresponding to the upper portion of the spacer 32.
  • This step specifically includes:
  • the hole blocking material solution comprises a solvent and a hole blocking material dissolved in the solvent.
  • the hole blocking material solution should contain no water and will not react with the material of the first common layer 4 to produce water and oxygen.
  • the solvent is a solvent which is volatile and can dissolve the material of the first common layer 4, preferably tetrahydrofuran.
  • the thickness of the first common layer 4 is small, and the first common layer 4 can be dissolved and partitioned by only a small amount of solvent, and therefore, in the hole blocking material solution, the hole blocking material
  • the concentration can be formulated to be as large as possible.
  • the hole blocking material solution is preferably printed on the first common layer 4 by an inkjet printing process.
  • a luminescent material 5 is deposited on the first common layer 4 at a position corresponding to the opening portion 31 of the pixel defining layer 3 by applying an evaporation process.
  • the embodiment further provides a display device.
  • the display device includes a driving unit 200 and a display panel 100 .
  • the driving unit 200 provides a driving signal to the display panel 100 to enable the display panel. 100 display screen.
  • the display panel 100 adopts the OLED display panel provided by the above embodiments of the present invention.
  • the OLED display panel and the method for fabricating the same are provided in the OLED display panel, in which two adjacent sub-pixel regions have a hole blocking portion, and the hole blocking portion has two adjacent sub-pixels.
  • the first common layers between the regions for transporting holes are spaced apart from each other, avoiding holes in the phase
  • the two sub-pixel regions adjacent to each other leak, which can effectively eliminate the light leakage between the adjacent two sub-pixels and improve the display quality of the OLED display panel.

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  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

一种OLED显示面板,包括TFT阵列基板(1)以及阵列设置在该TFT阵列基板(1)上的多个阳极(2),TFT阵列基板(1)上设置有像素定义层(3),像素定义层(3)包括暴露出阳极(2)的开口部(31)和用于间隔相邻两个阳极(2)的间隔部(32),每一开口部(31)对应于一个子像素区域(R、G、B);其中,像素定义层(3)上依次设置有用于传输空穴的第一公共层(4)、用于传输电子的第二公共层(6)和阴极层(7),第一公共层(4)和第二公共层(6)之间、对应于每一子像素区域(R、G、B)分别设置有发光材料(5);其中,间隔部(32)的上方还设置有空穴阻挡部(8),空穴阻挡部(8)将相邻的两个子像素区域(R、G、B)之间的第一公共层(4)相互间隔。

Description

OLED显示面板及其制备方法、显示装置 技术领域
本发明涉及显示器技术领域,尤其涉及一种OLED显示面板及其制备方法,还涉及包含前述OLED显示面板的显示装置。
背景技术
OLED(有机电致发光二极管)显示装置具有自发光、广视角、发光效率高、功耗低、响应时间快、低温特性好、制造工艺简单、成本低等特性,在显示领域得到广泛的应用。
OLED显示装置的核心部件是OLED显示面板,OLED显示面板的结构通常包括:TFT阵列基板以及依次制作于TFT基板上的阳极层、像素定义层、第一公共层、发光层、第二公共层以及阴极层。阳极层包括多个阵列排布的阳极,像素定义层包含多个与阳极一一对应的像素开口;第一公共层将像素定义层和阳极层完全覆盖(在结构层内连续一整面覆盖),第一公共层可以包含多个子功能层;发光层包含多个与像素开口一一对应的发光单元,发光单元位于像素开口内;第二公共层将发光层和第一公共层完全覆盖(在结构层内连续一整面覆盖),第一公共层可以包含多个子功能层;阴极层覆盖于第二公共层之上。
OLED显示面板的工作原理是在阳极和阴极之间电场的作用下,空穴通过第一公共层传输到发光层,电子通过第二公共层传输到发光层,空穴和电子在发光层之内复合进而发光。OLED显示面板通常是由R、G、B三原色的混合来实现不同色彩的显示效果,因此OLED显示面板的一个像素通常包含R、G、B三个发光单元,每一个像素的R、G、B三个发光单元能够通过驱动电路单独控制。具体地,R、G、B三个发光单元的阴极层是共用的,阳极则是相互独立的,通过控制每一发光单元对应的阳极,可以实现每一发光单元的单独驱动。
随着显示面板分辨率的提高,单位面积内发光单元的个数也在不断增加,导致发光单元之间的间隔距离不断减小,另外,为了提高显示效率,用于传输空穴的第一公共层引入了很多优异的传输材料。在发光单元间距减小而第一公 共层的传输性能不断提升的情况下,显示面板的横向电流也增大,导致串扰。具体地,如上所述的现有的OLED显示面板的结构中,由于相邻的发光单元的第一公共层连通,当点亮其中一个发光单元(目标发光单元)时,少量空穴可以通过第一公共层注入到相邻的发光单元中,在相邻的发光单元中与电子复合进而发光,由此导致目标发光单元的发光不纯,这种发光现象称为泄露发光现象,少量空穴泄漏形成的电流叫泄露电流。尤其是在低电流下点亮目标发光单元时,由于目标发光单元发出的光也较弱,此时漏光现象的表现比较明显,由此降低了OLED显示面板的显示品质。
发明内容
鉴于现有技术存在的不足,本发明提供了一种OLED显示面板及其制备方法,该OLED显示面板可以有效地消除相邻两个子像素之间的漏光现象,提高OLED显示面板的显示品质。
为了达到上述的目的,本发明采用了如下的技术方案:
一种OLED显示面板,包括TFT阵列基板以及阵列设置在该TFT阵列基板上的多个阳极,其中,所述TFT阵列基板上设置有像素定义层,所述像素定义层包括暴露出所述阳极的开口部和用于间隔相邻两个所述阳极的间隔部,每一开口部对应于一个子像素区域;其中,所述像素定义层上依次设置有用于传输空穴的第一公共层、用于传输电子的第二公共层和阴极层,所述第一公共层和所述第二公共层之间、对应于每一子像素区域分别设置有发光材料;其中,所述间隔部的上方还设置有空穴阻挡部,所述空穴阻挡部将相邻的两个子像素区域之间的第一公共层相互间隔。
其中,所述空穴阻挡部的宽度不大于所述间隔部顶端的宽度。
其中,所述空穴阻挡部的厚度不小于所述第一公共层的厚度。
其中,所述空穴阻挡部的厚度大于所述空第一公共层的厚度。
其中,每一子像素区域分别对应于红色子像素、绿色子像素或蓝色子像素,所述红色子像素中的发光材料为可发出红色光的发光材料,所述绿色子像素中的发光材料为可发出绿色光的发光材料,所述蓝色子像素中的发光材料为可发出蓝色光的发光材料。
本发明还提供了一种OLED显示面板的制备方法,其包括步骤:
提供一TFT阵列基板并在该TFT阵列基板上制备阵列分布的多个阳极;
在所述TFT阵列基板上制备像素定义层薄膜,将所述像素定义层薄膜刻蚀形成具有开口部和间隔部的像素定义层;
在所述像素定义层上沉积形成用于传输空穴的第一公共层;
在所述像素定义层的间隔部的上方制备空穴阻挡部,将所述第一公共层在对应于所述间隔部上方的部分隔断;
在所述第一公共层上、对应于所述像素定义层的开口部的位置沉积形成发光材料;
在所述第一公共层上沉积形成用于传输电子的第二公共层,所述第二公共层覆盖所述发光材料和所述第一公共层;
在所述第二公共层上沉积形成阴极层。
其中,制备所述空穴阻挡部的步骤具体包括:配置空穴阻挡材料溶液;其中,所述空穴阻挡材料溶液包括溶剂和溶解于该溶剂中的空穴阻挡材料,所述溶剂为可挥发且可溶解所述第一公共层的材料的溶剂;应用打印工艺,在对应于所述像素定义层的间隔部的上方,将所述空穴阻挡材料溶液打印在所述第一公共层上,所述空穴阻挡材料溶液中的溶剂将打印位置的第一公共层溶解隔断;应用固化工艺,将打印完成的空穴阻挡材料溶液进行固化,在所述间隔部的上方获得将所述第一公共层隔断的空穴阻挡部。
其中,应用喷墨打印工艺将所述空穴阻挡材料溶液打印在所述第一公共层上,应用高温烘烤工艺对打印完成的空穴阻挡材料溶液进行固化。
相比于现有技术,本发明实施例提供的OLED显示面板及其制备方法,该OLED显示面板中,相邻的两个子像素区域之间具有空穴阻挡部,空穴阻挡部将相邻的两个子像素区域之间的用于传输空穴的第一公共层相互间隔,避免了空穴在相邻的两个子像素区域之间相互泄漏,可以有效地消除相邻两个子像素之间的漏光现象,提高OLED显示面板的显示品质。
附图说明
图1是本发明实施例提供的OLED显示面板的结构示意图;
图2是本发明实施例中空穴阻挡部的俯视结构示意图;
图3a-3h是本发明实施例提供的OLED显示面板的制备方法中,各个步骤制备得到的器件结构的示例性图示;
图4是本发明实施例提供的显示装置的结构示意图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚,下面结合附图对本发明的具体实施方式进行详细说明。这些优选实施方式的示例在附图中进行了例示。附图中所示和根据附图描述的本发明的实施方式仅仅是示例性的,并且本发明并不限于这些实施方式。
在此,还需要说明的是,为了避免因不必要的细节而模糊了本发明,在附图中仅仅示出了与根据本发明的方案密切相关的结构和/或处理步骤,而省略了与本发明关系不大的其他细节。
本实施例首先提供了一种OLED显示面板,如图1所示,所述OLED显示面板包括TFT阵列基板1以及依次设置在TFT阵列基板1上的多个功能层,这些功能层包括阳极层(包括阵列设置的多个阳极2)、像素定义层3、用于传输空穴的第一公共层(Hole Transport Layer,HTL)4、发光材料层(Emissive Layer,EML,如图1中包括一一对应位于每一个阳极2上方发光材料5)、用于传输电子的第二公共层(Electron Transport Layer,ETL)6以及阴极层7。其中,所述像素定义层3覆设在所述TFT阵列基板1上,所述像素定义层3包括暴露出所述阳极2的开口部31和用于间隔相邻两个所述阳极2的间隔部32,每一所述开口部31对应于一个子像素区域R、G、B。其中,所述第一公共层4通常包括按照逐渐远离所述阳极层的方向依次设置的空穴注入层和空穴传输层,还可以进一步地设置有电子阻挡层;所述第二公共层6则通常包括按照逐渐远离所述阴极层7的方向依次设置的电子注入层和电子传输层,还可以进一步地设置有空穴阻挡层。
其中,参阅图1和图2,本实施例中,在所述像素定义层3的间隔部32的上方还设置有空穴阻挡部8,所述空穴阻挡部8将相邻的两个子像素区域之间的第一公共层4相互间隔。具体地,所述空穴阻挡部8是由空穴阻挡材(Hole-blocking layer,HBL)制备形成,其可以阻止空穴穿越该区域,即,空穴阻挡部8将相邻的两个子像素区域之间的第一公共层相互间隔,避免了空穴在相邻的两个子像素区域之间相互泄漏,可以有效地消除相邻两个子像素之间 的漏光现象,提高OLED显示面板的显示品质。
其中,参阅图1,所述空穴阻挡部8的宽度应当不大于所述间隔部32顶端的宽度。所述空穴阻挡部8的厚度应当不小于所述第一公共层4的厚度。在优选的技术方案中,如图1所示,所述空穴阻挡部8的厚度大于所述第一公共层4的厚度,即,所述空穴阻挡部8的顶端从所述第一公共层4的上表面凸起。
具体地,在所述OLED显示面板中,如图1所示,每一子像素区域分别对应于红色子像素R、绿色子像素G或蓝色子像素B,依次排列的红色子像素R、绿色子像素G和蓝色子像素B构成一个像素单元。其中,所述红色子像素R中的发光材料5为可发出红色光的发光材料,所述绿色子像素G中的发光材料5为可发出绿色光的发光材料,所述蓝色子像素B中的发光材料5为可发出蓝色光的发光材料。每个像素单元由红色子像素R、绿色子像素G和蓝色子像素B发出的R、G、B三原色的混合来实现不同色彩的显示效果。
其中,所述发光材料5主要采用电致发光材料,其在电致激发的条件下发光,通常是荧光材料或磷光材料。
下面参照图3a至图3h进一步说明如上所述的OLED显示面板的制备方法,该方法包括步骤:
S1、参阅图3a,提供一TFT阵列基板1并在该TFT阵列基板1上制备阵列分布的多个阳极2。
S2、参阅图3b,在所述TFT阵列基板1上制备像素定义层薄膜3a。所述像素定义层薄膜3a连续地覆盖TFT阵列基板1以及TFT阵列基板1上的多个阳极2。所述像素定义层薄膜3a采用不导电材料制备获得,可以是不导电的有机材料或无机材料。
S3、参阅图3c,应用刻蚀工艺,将所述像素定义层薄膜3a刻蚀形成具有开口部31和间隔部32的像素定义层3。其中,对应于每一个阳极2设置有一个开口部31,所述阳极2从所述开口部31暴露出;所述间隔部32用于间隔相邻两个所述阳极2。
S4、参阅图3d,应用蒸镀工艺,在所述像素定义层3上沉积形成用于传输空穴的第一公共层4。所述第一公共层4覆盖在像素定义层3开口部31和间隔部32之上。
S5、参阅图3e,在所述像素定义层3的间隔部32的上方制备空穴阻挡部8,将所述第一公共层4在对应于所述间隔部32上方的部分隔断。该步骤具体包括:
S51、配制空穴阻挡材料溶液。其中,所述空穴阻挡材料溶液包括溶剂和溶解于该溶剂中的空穴阻挡材料。优选的是,所述空穴阻挡材料溶液应当不含有水,并且不会与第一公共层4的材料反应产生水和氧气。其中,所述溶剂为可挥发且可溶解所述第一公共层4的材料的溶剂,优选使用四氢呋喃。通常地,所述第一公共层4的厚度是较小的,只需要少量的溶剂就可以将第一公共层4溶解隔断,因此,在所述空穴阻挡材料溶液中,空穴阻挡材料的浓度可以配制为尽可能的大。
S52、应用打印工艺,在对应于所述像素定义层3的间隔部32的上方,将所述空穴阻挡材料溶液打印在所述第一公共层4上,所述空穴阻挡材料溶液中的溶剂将打印位置的第一公共层4溶解隔断。其中,优选应用喷墨打印工艺将所述空穴阻挡材料溶液打印在所述第一公共层4上。
S53、应用固化工艺,将打印完成的空穴阻挡材料溶液进行固化,在所述间隔部32的上方获得将所述第一公共层4隔断的空穴阻挡部8。其中,优选应用高温烘烤工艺对打印完成的空穴阻挡材料溶液进行固化。
S6、参阅图3f,应用蒸镀工艺,在所述第一公共层4上、对应于所述像素定义层3的开口部31的位置沉积形成发光材料5。
S7、参阅图3g,应用蒸镀工艺,在所述第一公共层4上沉积形成用于传输电子的第二公共层6,所述第二公共层6覆盖所述发光材料5和所述第一公共层4。
S8、参阅图3h,应用蒸镀工艺,在所述第二公共层6上沉积形成阴极层7,最终获得所述的OLED显示面板。
本实施例还提供了一种显示装置,如图4所示,所述显示装置包括驱动单元200和显示面板100,所述驱动单元200向所述显示面板100提供驱动信号以使所述显示面板100显示画面。其中,所述显示面板100采用了本发明如上实施例所提供的OLED显示面板。
综上所述,如上实施例提供的OLED显示面板及其制备方法,该OLED显示面板中,相邻的两个子像素区域之间具有空穴阻挡部,空穴阻挡部将相邻的两个子像素区域之间的用于传输空穴的第一公共层相互间隔,避免了空穴在相 邻的两个子像素区域之间相互泄漏,可以有效地消除相邻两个子像素之间的漏光现象,提高OLED显示面板的显示品质。
需要说明的是,在本文中,诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来,而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
以上所述仅是本申请的具体实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本申请原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本申请的保护范围。

Claims (17)

  1. 一种OLED显示面板,包括TFT阵列基板以及阵列设置在该TFT阵列基板上的多个阳极,其中,所述TFT阵列基板上设置有像素定义层,所述像素定义层包括暴露出所述阳极的开口部和用于间隔相邻两个所述阳极的间隔部,每一所述开口部对应于一个子像素区域;其中,所述像素定义层上依次设置有用于传输空穴的第一公共层、用于传输电子的第二公共层和阴极层,所述第一公共层和所述第二公共层之间、对应于每一子像素区域分别设置有发光材料;其中,所述间隔部的上方还设置有空穴阻挡部,所述空穴阻挡部将相邻的两个子像素区域之间的第一公共层相互间隔。
  2. 根据权利要求1所述的OLED显示面板,其中,所述空穴阻挡部的宽度不大于所述间隔部顶端的宽度。
  3. 根据权利要求1所述的OLED显示面板,其中,所述空穴阻挡部的厚度不小于所述第一公共层的厚度。
  4. 根据权利要求1所述的OLED显示面板,其中,所述空穴阻挡部的厚度大于所述第一公共层的厚度。
  5. 根据权利要求1所述的OLED显示面板,其中,每一子像素区域分别对应于红色子像素、绿色子像素或蓝色子像素,所述红色子像素中的发光材料为可发出红色光的发光材料,所述绿色子像素中的发光材料为可发出绿色光的发光材料,所述蓝色子像素中的发光材料为可发出蓝色光的发光材料。
  6. 一种OLED显示面板的制备方法,其中,包括步骤:
    提供一TFT阵列基板并在该TFT阵列基板上制备阵列分布的多个阳极;
    在所述TFT阵列基板上制备像素定义层薄膜,将所述像素定义层薄膜刻蚀形成具有开口部和间隔部的像素定义层;
    在所述像素定义层上沉积形成用于传输空穴的第一公共层;
    在所述像素定义层的间隔部的上方制备空穴阻挡部,将所述第一公共层在对应于所述间隔部上方的部分隔断;
    在所述第一公共层上、对应于所述像素定义层的开口部的位置沉积形成发 光材料;
    在所述第一公共层上沉积形成用于传输电子的第二公共层,所述第二公共层覆盖所述发光材料和所述第一公共层;
    在所述第二公共层上沉积形成阴极层。
  7. 根据权利要求6所述的OLED显示面板的制备方法,其中,制备所述空穴阻挡部的步骤具体包括:
    配制空穴阻挡材料溶液;其中,所述空穴阻挡材料溶液包括溶剂和溶解于该溶剂中的空穴阻挡材料,所述溶剂为可挥发且可溶解所述第一公共层的材料的溶剂;
    应用打印工艺,在对应于所述像素定义层的间隔部的上方,将所述空穴阻挡材料溶液打印在所述第一公共层上,所述空穴阻挡材料溶液中的溶剂将打印位置的第一公共层溶解隔断;
    应用固化工艺,将打印完成的空穴阻挡材料溶液进行固化,在所述间隔部的上方获得将所述第一公共层隔断的空穴阻挡部。
  8. 根据权利要求7所述的OLED显示面板的制备方法,其中,应用喷墨打印工艺将所述空穴阻挡材料溶液打印在所述第一公共层上,应用高温烘烤工艺对打印完成的空穴阻挡材料溶液进行固化。
  9. 根据权利要求7所述的OLED显示面板的制备方法,其中,所述空穴阻挡部的宽度不大于所述间隔部顶端的宽度。
  10. 根据权利要求7所述的OLED显示面板的制备方法,其中,所述空穴阻挡部的厚度不小于所述第一公共层的厚度。
  11. 根据权利要求7所述的OLED显示面板的制备方法,其中,所述空穴阻挡部的厚度大于所述第一公共层的厚度。
  12. 根据权利要求7所述的OLED显示面板的制备方法,其中,每一所述开口部对应于一个子像素区域,每一子像素区域分别设置为红色子像素、绿色子像素或蓝色子像素,所述红色子像素中的发光材料为可发出红色光的发光材料,所述绿色子像素中的发光材料为可发出绿色光的发光材料,所述蓝色子像素中的发光材料为可发出蓝色光的发光材料。
  13. 一种显示装置,其包括驱动单元和OLED显示面板,所述驱动单元向所述OLED显示面板提供驱动信号以使所述OLED显示面板显示画面,其中,所述OLED显示面板包括TFT阵列基板以及阵列设置在该TFT阵列基板上的多个阳极,所述TFT阵列基板上设置有像素定义层,所述像素定义层包括暴露出所述阳极的开口部和用于间隔相邻两个所述阳极的间隔部,每一所述开口部对应于一个子像素区域;其中,所述像素定义层上依次设置有用于传输空穴的第一公共层、用于传输电子的第二公共层和阴极层,所述第一公共层和所述第二公共层之间、对应于每一子像素区域分别设置有发光材料;其中,所述间隔部的上方还设置有空穴阻挡部,所述空穴阻挡部将相邻的两个子像素区域之间的第一公共层相互间隔。
  14. 根据权利要求13所述的显示装置,其中,所述空穴阻挡部的宽度不大于所述间隔部顶端的宽度。
  15. 根据权利要求13所述的显示装置,其中,所述空穴阻挡部的厚度不小于所述第一公共层的厚度。
  16. 根据权利要求13所述的显示装置,其中,所述空穴阻挡部的厚度大于所述第一公共层的厚度。
  17. 根据权利要求13所述的显示装置,其中,每一子像素区域分别对应于红色子像素、绿色子像素或蓝色子像素,所述红色子像素中的发光材料为可发出红色光的发光材料,所述绿色子像素中的发光材料为可发出绿色光的发光材料,所述蓝色子像素中的发光材料为可发出蓝色光的发光材料。
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CN115440909B (zh) * 2022-10-17 2025-09-26 上海和辉光电股份有限公司 一种oled器件及其制备方法
CN117560947A (zh) * 2023-12-26 2024-02-13 京东方科技集团股份有限公司 显示面板及其制备方法、显示装置
CN118785749A (zh) * 2024-06-21 2024-10-15 惠科股份有限公司 一种显示装置及其显示面板

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101064335A (zh) * 2006-04-28 2007-10-31 三星Sdi株式会社 有机电致发光器件及其制造方法
WO2015141142A1 (ja) * 2014-03-20 2015-09-24 株式会社Joled 有機el表示パネル、それを備えた表示装置および有機el表示パネルの製造方法
CN105679801A (zh) * 2016-02-02 2016-06-15 昆山国显光电有限公司 Oled显示面板及其制作方法
CN105895664A (zh) * 2016-05-31 2016-08-24 上海天马有机发光显示技术有限公司 一种显示面板、制作方法以及电子设备
CN106876331A (zh) * 2017-03-03 2017-06-20 武汉华星光电技术有限公司 Oled显示面板及其制备方法、显示装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100448021C (zh) * 2007-08-13 2008-12-31 京东方科技集团股份有限公司 电致发光显示器件及其制造方法
JP2010153284A (ja) * 2008-12-26 2010-07-08 Hitachi Displays Ltd 有機発光表示装置
CN106356469A (zh) * 2016-09-05 2017-01-25 Tcl集团股份有限公司 一种3d打印反置结构的量子点发光二极管及制备方法
CN106374046A (zh) * 2016-09-12 2017-02-01 Tcl集团股份有限公司 一种正置结构的量子点发光二极管及制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101064335A (zh) * 2006-04-28 2007-10-31 三星Sdi株式会社 有机电致发光器件及其制造方法
WO2015141142A1 (ja) * 2014-03-20 2015-09-24 株式会社Joled 有機el表示パネル、それを備えた表示装置および有機el表示パネルの製造方法
CN105679801A (zh) * 2016-02-02 2016-06-15 昆山国显光电有限公司 Oled显示面板及其制作方法
CN105895664A (zh) * 2016-05-31 2016-08-24 上海天马有机发光显示技术有限公司 一种显示面板、制作方法以及电子设备
CN106876331A (zh) * 2017-03-03 2017-06-20 武汉华星光电技术有限公司 Oled显示面板及其制备方法、显示装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117177634A (zh) * 2022-05-23 2023-12-05 安徽熙泰智能科技有限公司 硅基Micro OLED微显示器件像素定义层制备方法
CN115241244A (zh) * 2022-06-23 2022-10-25 京东方科技集团股份有限公司 一种显示基板、显示装置及显示基板的制造方法
CN115172635A (zh) * 2022-08-29 2022-10-11 云谷(固安)科技有限公司 显示面板及其制备方法和显示装置
CN115394939A (zh) * 2022-09-06 2022-11-25 上海天马微电子有限公司 一种显示面板和显示装置
CN119907464A (zh) * 2025-01-17 2025-04-29 武汉华星光电技术有限公司 显示面板及显示装置

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